TW201002836A - Producing method of graphite capillary structure of high porosity - Google Patents

Abstract

The present invention relates to a producing method of graphite capillary structure of high porosity, especially a capillary structure of high porosity graphite constituted by quickly forming a basic micro-structure by electroplating (or a precision electrochemical) on a substrate and then sputtering the graphite sputtering on the basic micro-structure to form a graphite capillary structure of high porosity, containing a preparation process, an electroplating (or precision electrochemical) process, a PVD sputtering process, and a finishing process. First, producing a container material and a cover material which are able to compose a hollow sealed space, and covering the part which doesn't need the basic micro-structure with insulating materials so as to connecting it with the negative electrode of the power, and connecting the cover material with positive electrode of the power, and then put them together into an electrolyte solution in an electroplating reaction tank, and then coating a basic micro-structure on the surface of the container material and the cover material, and sputtering graphite on the basic micro-structure of the cover material by PVD sputtering process to form a graphite-based capillary structure, finally, composing the container material having graphite capillary structure of high porosity and the cover material to be an airtight container, and vacuuming the interior and injecting working fluids quickly. The method of the present invention is able to apply to formation of capillary structure of heat dissipation devices( such as vapor chambers), and the process of electronic components packaging, and may fulfill multiple advantages of low-temperature process, simple steps, easy processing, fast, and low cost.

Description

201002836 VI. Description of the invention: [Technical field of invention] It is used in the field of electric energy and graphite physical vapor deposition, soaking plate and heat device, and can innovate by low temperature shank and porosity graphite capillary structure system By. / ° ° [Previous technology] According to the demand for high-performance (such as electricity, power (such as LED, LCD TV, plasma TV, etc.)), the demand for high-performance electronic devices is also high. It came into being. /, u..., β曰 "=" is a heat-dissipating technology with high thermal conductivity, ultra-quiet, simple structure and versatility. Its principle is based on closed cavity and flow; its operation system utilizes hot and cold end. The fullness of the helium gas flows to the cold end, so that the liquid at the hot end continues for one time and the heat is condensed to achieve rapid heat transfer. The capillary structure layer of the inner wall of the above-mentioned working body is recirculated to the evaporation section, and reaches the circle of ^= by the circle to reach the regret. The component identification increases, "return, =====================================================================================================

The technical problems that CJ wants to solve: At present, (4) "Fresh" and "Homogeneous Hot Plate" - Groove: The inner surface is shaped like a lang-direction _ has its limitation. The pore size is the same 'but its porosity cannot be improved. Although thin type = scattered = two, sintering: the copper powder or copper mesh is sintered at a high temperature to form a capillary structure. The heat dissipation effect is good, but due to the pore size of the high temperature heat, the finished product is good (2) i method effectively controls the dominant heat transfer, diffusion bonding: the copper plate and the steel powder or copper fiber 201002836 mesh are diffused and joined. Increased The strength of the substrate after high temperature heat is reduced, and it is not easy to make the material cost foaming. It belongs to: the foamed metal is a capillary structure, and the metal is difficult to control the size and process. And the second ί copper set pre-layed capillary structure: its process is complex, and σ is poor, resulting in poor heat dissipation. Column ίίίf ^ generates a carbon nanotube array on the substrate, in a carbon nanotube array. The heat dissipation effect is good, but it must be heated to a high temperature to soften the substrate. Mussels: This is the method of making electromagnets to make metal microstructures. It is expensive and has a uniform and fine capillary structure, but its manufacturing cost.

Etcht semi-1^_sex ion side method (kive Ιοη 毛二i丰Sr out of capillary structure··This method is strong in manufacturing] but the materials used are limited by the semiconductor process, and the processes described above have their own Disadvantages and limitations, if the purpose of the invention is to achieve the main purpose of the invention, the high-porosity capillary structure is directly formed on the surface of the high-porosity substrate, which is capable of achieving a high-porosity type, low thermal resistance coefficient, High heat dissipation power, combined with low cost of construction, equipment and processing, and reduced technical means of manufacturing stable solutions: Money transfer progress.

6 o'clock, f the above purpose 'The present invention is prepared in advance and can be composed - the middle part of the R part is covered with an insulating material and the m negative electrode structure is filled in the - electric clock reaction tank to fill the electrolyte, the surface of the substrate Quickly plated with a layer of basic micro-structured body: the substrate and the cover are separated, and the process is performed on the cover material of the 201002836 cover plate by means of electrochemical method; then the pVD rides the special product in the TM In the money reaction tank, the graphite crucible is plated on the base microstructure of the previous cover to form a graphite-based capillary, a container substrate of a porosity graphite capillary structure and a lid-closed container, and is drawn inside thereof. Vacuum and inject the working fluid; wherein: the material is combined with the heat-dissipating piece to form a high-porosity graphite-capillary structure, which can avoid the structure of the structure and avoid the length of the capillary work due to the high temperature. _ Current magnitude and time [Embodiment] The following is a detailed description of the structure of the present invention and the functional benefits achieved by the present invention; ^1(10) shows the present invention Manufacturing process block diagram, 1 contains The pre-forming preparation-conducting (copper) can be combined with the 1 (4) container substrate 11 and the cover substrate 12, and the handle substrate 12 in the basin can be previously bonded to the heat dissipation fins 12A. . Eight-plate ίο's dense electrochemical) reaction procedure: in conjunction with the second figure, the closed capacitor is cried to the negative electrode 32 of the source 30, and the power supply 3 〇 positive 31 is connected to a Lai 40 reel; the axis _ 卩Rong ^ Cai type, ★ heart H is not in the picture; and the relative Wei reaction program is stacked on a line ^^=i=(TM, PEMM side) in the cover plate 201002836 m ^ Mine program (Spattering): A PVD physical vapor deposition method, 2 ^ TM _reaction tank 4G' with high-energy particles hitting the molecules or atoms in the leather stalks i Tian f'mei (graphite) 50 is now hit: Yang == tree (graphite) 50 is a cathode (negative electrode 32), and is a cover substrate 12; 1}, Ar (argon) at a voltage of 10 minus 2 Torr (vacuum), an Ar near the cathode (argon) gas becomes red + after ionization, and second, graphite molecules or atoms that are struck by red + ions hit the cover = SS; nf on the 6-figure, stone _ in the previous cover l micro = f (four) generated ϋΐ - i height base micro-junction - branching 丨 23 as shown in the figure arrow frequency - layer high hole material μ Maosui pith 122, as shown in Figure 8 Ilf as shown in Figure 8, will produce high porosity graphite Capillary structure substrate 11 The cover plate substrate 12 are combined into a package - a sealed 4 m, m 'and the internal space of the hole in the high density material is graphite 1G capillary structure 121 constituted 6G evacuated and the working fluid injection.

The microstructure of the U, dendritic or fine structure may be a point-like, fibrous pure gold embodiment, and the conductive substrate may include copper, sulphur, nickel, iron, etc., as in the case of: or via a conductive surface. The material is not limited to solid gold. According to the embodiment of the present invention, the material may be copper, nickel, pure metal or metal. === The heat sink fin may be copper, and the pure electrolyte solution for recording, iron, etc. may be copper sulfate aqueous solution or other. Often in accordance with the present invention, Guan Guancheng, _ riding shot for ^ ink, material oxidation hair 201002836 has a higher hydrophilicity, and has a more thermal conductivity than silver, L iron, even higher than pure copper.戮More The structure of the high-porosity graphite capillary structure can be adjusted by the size and length of the motor to produce the desired structure. As described above, the "high-porosity graphite capillary structure of the substrate" on the substrate or the electronic component is formed in a high-intensity manner, and is also novel. The provisions of the Patent Law, 爰ίί 恳 审查 审查 审查 惠 惠 惠 惠 。 。 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第The invention is based on the thief of the present invention. The figure shows the base structure formed on the container substrate and the cover substrate.

Cj Figure 5 This is the reaction tank of the PVD physical vapor deposition method. Fig. 6 is a view showing the pore-cutting graphite capillary structure on the base microstructure of the previous cover substrate. Schematic diagram of the second truss branch. (4) is a schematic plan view of the packaging of the container substrate and the cover substrate of the present invention, and 10: a manufacturing turn block diagram of the present invention. [Description of main component symbols] n0r; i2T^L u····Container substrate 111—Basic microstructure 201002836 112, 122....High-porosity graphite capillary structure 12..... Cover substrate 12A ....Fixed fins 123...Basic microstructure support column 20... Insulation material 21.·.·Insulation master 30....Power 31....Positive 32.. .. Negative electrode 40....plating reaction tank 40' .... PVD sputtering reaction tank 50.. .. target (graphite) 60....internal space

Claims (1)

201002836 VII. Patent application scope: The manufacturing method of Li type graphite capillary structure is a cereal substrate and a cover substrate including the following procedures. If a non-conductive material surface is previously subjected to a conductive plating (or precision electrochemical) reaction procedure : Set the US === filling the electrolyte, the S _ part of the closed container is first covered with insulating material, and the wire is deposited by the vapor deposition method on the PV_reaction ί ΐϊ ΐϊ ΐϊ ΐϊ ΐϊ Graphite-based edge 'covers a support column support column, · a required - gap rate capillary structure # k inί to produce a container with a local porosity graphite capillary structure substrate = substrate group ° domain into - airtight The container, while vacuuming it and injecting it into the high-porosity graphite capillary structure described in item 1 of the range: liquid. The solution can be a copper sulphate aqueous solution (other commonly used in combination with dry materials, soil, / ί 请 ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί Pure metal or alloy such as nickel or aluminum. i 4.= Please use the method of making high-porosity-graphite capillary structure as described in the scope of the patent, and the medium-sized heat-dissipating fins may be copper, aluminum, nickel, iron, etc. Pure metal or alloy. I. The method for producing a high-porosity graphite capillary structure according to item 1, wherein the substrate can be bonded to the heat dissipating fin in advance. 6. As described in claim 1 High porosity graphite capillary structure f 201002836 Method 7, i Li electrical substrate can be steel, Ming, nickel, iron and other pure metals or human gold. Manufacturing method, its high porosity graphite capillary structure Materials such as components or materials that are processed by the material such as wafer or electroformed method 8.= High porosity graphite wool (4) Cover-support column shape is formed on the porosity of the graphite capillary structure, and the coverage graphite capillary _ Further _ into - the required height of the high porosity 9. = Please refer to the high hole U ' described in the scope of the patent scope] The frequency material of the WD frequency program can be graphite, material = ▲ 10 · as claimed in the patent scope, 2, 3, 4, 5, 6 ίί2 ΐΐ capillary structure manufacturing method, wherein the formed graphite hair Hi body formation is. ·, fibrous, dendritic, combined: 10