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TW201001141A - Wind guiding structure - Google Patents

Wind guiding structure Download PDF

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Publication number
TW201001141A
TW201001141A TW097123809A TW97123809A TW201001141A TW 201001141 A TW201001141 A TW 201001141A TW 097123809 A TW097123809 A TW 097123809A TW 97123809 A TW97123809 A TW 97123809A TW 201001141 A TW201001141 A TW 201001141A
Authority
TW
Taiwan
Prior art keywords
memory
fins
deformation element
guiding structure
memory deformation
Prior art date
Application number
TW097123809A
Other languages
Chinese (zh)
Inventor
Cheng-Lung Chen
Original Assignee
Micro Star Int Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro Star Int Co Ltd filed Critical Micro Star Int Co Ltd
Priority to TW097123809A priority Critical patent/TW201001141A/en
Priority to US12/237,567 priority patent/US20090321047A1/en
Priority to DE202008013129U priority patent/DE202008013129U1/en
Priority to JP2008006962U priority patent/JP3147142U/en
Publication of TW201001141A publication Critical patent/TW201001141A/en

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Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00Fins
    • F28F2215/14Fins in the form of movable or loose fins
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/04Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes comprising shape memory alloys or bimetallic elements

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A wind guiding structure comprises a plurality of swinging fins, an actuation element connected to each fin and a shape-memorized element. The shape-memorized element is connected to the outmost fin and capable of maintaining the fins at a normal angle at ambient temperature. When heated, the shape-memorized element can push the fins, such that the actuation element brings each fin to rotate to a working angle, thereby allowing the change of gas exhaust direction according to the temperature effect.

Description

201001141 •九、發明說明: 【發明所屬之技術領域】 本發明係有關於—種導風 溫度變化而改變出風方向之導風結^別疋關於—種利月 【先前技術】 各種電子裝置因運作產生熱 正常運作,散熱設計為電子裝置^ _”子裝置的 ^ V, · 重要的課題。如以簦刑 电月尚為例,夕數筆記型電腦的散埶讲 ^ 有耑埶屜戶二士 ’、、、σ又。十鉍在主機内部設置 有放熱風扇,而在主機的頂面或底面且 在主機的側邊會設置出風口,去又 至口,亚 扇會自入風口處吸入外界之合運作時,散熱風 源(如中央處理經與筆記型電腦的熱 出風口吹出。 放…、風扇再將熱空氣從 為了防止異物自入風口或出風 部,入風Ο彳山π ^ 聿5己型電腦内 夕風口或出風口都會設置複數片固定的 Η 夕疋與主機殼面相垂直吏 而4片 嗖面相千古 使出風口所吹出之風向即盘主機 成面相垂直,如筆記型電腦的出風U 。主機 邊,而使用者的手需放在箦卞刑$ I在主機的侧 J于而孜在葦圮型電腦對應屮 ㈣作滑鼠),如此一來從出風口所吹出, 人至,用者的手,將造成使用者的不舒適。孔、直接 ^為了解決上述的問題,將筆記 於主機的後端即可避免熱空氣吹至使用者的手= 201001141 筆記型電腦受限於 ^ 風口設置於主機…貝、關係’目前市面筆記型電腦將出 商設計有可調當多數,或有筆記型電腦礙 露了一種筆記型電㈣6229701號專利案即揭 散熱片係以可絲動 $ 口政熱片構造’ 701案所揭露之 用土的^ 關係設置於出風口處,盆可以葬由蚀 用4的控制將散熱片貼^ U以猎由使 角度,然而70〗安"出風〇,或是使散熱片開啟— 雜。 *的散熱片的調整方式在結構上相當複 【發明内容】 現有筆記型電腦出口 ^ 所吹出的熱空氣係 ^s設置係為固定,而使得 出風口的散熱片係採用吹出,或有筆記型電腦 當複雜,皆仍非筆記 1 °又冲,然而其結構上仍相 此,本發明在於提#—種^出風口之最㈣計。有鎧於 ί.. 溫變鰭片結構。 根據溫度效應而改變排氣方向的 根據本發明所揭露導 電子裝置之機殼上具有應用於—電子裝置, 數片鰭片、一掣動構 二中導風結構包括有複 之關係設置於機殼的出風口 f =件°籍片係以可旋轉 片,使得每一片鰭另、—处,而掣動構件連接每一片鰭 固定於電子裝置,而另的旋轉。記億變形元件一端 複數個轉片盆中之 4接擎動構件或是直接連接 (取外側),以於受熱變形時拉動所有 201001141 的鰭片-併地擺動。記憶變形元件常 持於一常態角度,記憶變形元件因電子裝置内4 = 熱能而受熱變形,進而拉動鰭片擺動, :每,片-併地擺動至-工作角度,即可改; 出氣流的方向。 又印風口排 根據本發明所揭露導風結構,當所設置的電子 時,記憶變形元件將受熱而伸展變形,即 擺動至一工作角度,使複數片籍片可 t據電子裝置運作的溫度效應而改變排氣方向,而成為 種應用於電子裝置之導風結構最佳設計。 ,、’、 詳細明的特徵與實作,兹配合圖示作最佳實施例 【實施方式】 上I艮據本發明所揭露之導風結構係應用於電子裝置 :中电子1置係指如桌上型電腦、伺服器、筆記型電 月®寻於運作自g 入 雕总A乍狀先、下會產生熱能之電子裝置,而在以下之具 版’:例:將以筆記型電腦作為本發明之最佳實施例。 ^ 第1圖」所示,根據本發明所揭露之導風結構, 其係應用於—昝4丨 筆5己型電腦上。筆記型電腦設有一主機 10 ’主機10内邱1ό ^具有一散熱風扇11,並且於主機10的 侧邊上設有—4 子應於散熱風扇11的出風口 12。 進一步表Γ穿。λ " 卑2 A、圖」所示,圖中所示係為本 201001141 構,】^例’根據本發明第—實施例所揭露之導風結 形元件\括有*數片13、—掣動構件14及—記憶變 與底端八^ 13係為―片狀體,而且韓片13的頂端 1 1 W對轉轴131 °出風口 12内壁面的丁頁端 套=Γ有複數個套孔121,其中籍片13以轉轴⑶ ,M i 口 12的套孔121,使鰭片13可於出風口 17 132 ^變角度1片13之長邊的—側妓有—連接部 構件14料—長條狀桿體,於掣動構件14上 二t —片鰭片13的複數個套圈141,並使每- '‘··曰13的連接部132擺動於每個套圈141,以串連每 一片鰭片13,使每—片m ¥連母 變角度。 母片,.、“ 13可以-併地連動旋轉而改 ^憶變形元件15可呈螺旋狀㈣順其他可能之形 狀’如不規則線狀、長條狀、板片狀· 例中係以呈螺旋狀為I ’ ’ 貫施 端固定地設置於出風變形元件15 — 上,奸筆内壁面的側邊(就是電子裝置 广广曰⑸型電腦之主機10),另一端則連接於 :如圖示中外側的…)。在本發明中,記憶變= :?接軸片13其中之一,或者是連接於擎二 ::4:都能夠順利拉動所有鰭…併地擺動‘ 變形元件15受:;關係,其目的在於當記憶 又’、、、文开/日^可拉動所有的鰭片13一併地擺 201001141 動,所以兩種實施態樣皆能夠讓本發明據以實施,而以下 之内谷僅以§己憶變形元件15直接連接於鰭片13為例。 記憶變形it件15可由鎳_鈦形狀記憶合金所製成,或 是由銅_鋅-鋁形狀記憶合金、銅_鎳_鋁形狀記憶合金等所 製成,其可以根據溫度產生形變效果。在常溫狀態下,呓 憶變形元件15具有-伸展變形狀態,在受熱狀態下,^ L义开/元件15具有-收縮復原狀態。藉由記憶變形元件 15的形變效果’在常溫狀態下(如散熱風扇”未作動 時)’各I耆片13維持在—食能& # , ^ 吊心角度,而在受熱狀態下(如 散熱風扇11作動後),因記恃 。丨心又Φ 7L件產生形變而收 縮’即拉動鰭片13而使鍵片n , 則更."旧片13擺動,並透過掣動構件 V勁各鰭片13 —併的擺動至一工作角度。 請—併參閱「第3A、闰 ^ -t夕遨nu* 圖」所不,根據本發明所揭 ^寺風'、、口構,其中複數片鰭片u 詈於屮龆π ^ 知以可方疋轉之關係設 且龙出風口 12,而掣動構件14 變形元件15 一踹诖盐认山 安谷,"、曰片】3,亚且記憶 ” 接於出風口 12的侧邊,另一端則、鱼拉 於表外御丨的錢 y 1, ~則連接 取广側的麵# ]3。於常溫狀態下 開始運作,# 「聿5己型黾腦並未 乍忑^交形兀件15保持於伸 各鰭片13維持在一當能$ # T展又形狀怨,而使201001141 • Nine, invention description: [Technical field to which the invention pertains] The present invention relates to a wind guide that changes the direction of the wind as a guide air temperature change, and is related to the type of profit. [Prior Art] Various electronic devices The operation generates heat and normal operation, and the heat dissipation is designed as an electronic device ^ _" sub-device ^ V, · An important subject. For example, the shackle of the computer is used as an example. The two men's, , and σ. Tens are equipped with a heat-dissipating fan inside the main unit, and the air outlet is set on the top or bottom of the main unit and on the side of the main unit, and goes to the mouth. The sub-fan will be at the air inlet. When inhaling the outside world, the heat source (such as the central processing unit and the hot air outlet of the notebook computer blows out. Put the fan, and then the hot air from the air inlet or outlet to prevent foreign matter from entering the wind. The π ^ 聿5 type computer has a set of fixed Η 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋Notebook type The brain's airflow U. The host side, while the user's hand needs to be placed on the side of the host, while the I is on the side of the host computer (屮) for the mouse, so that it comes from the air outlet Blowing out, the person, the user's hand, will cause the user's discomfort. Hole, direct ^ In order to solve the above problems, the notes can be placed at the back end of the host to avoid hot air blowing to the user's hand = 201001141 The computer is limited to ^ The air outlet is set on the host...Bei, the relationship 'The current market notebook computer will have a design that can be adjusted as a majority, or a notebook computer obscures a notebook type (4) Patent No. 62297701 The relationship between the soil and the soil exposed by the 701 case can be set at the air outlet, and the basin can be buried by the eclipse with the control of 4 to slap the heat sink to the angle of the hunting, however 70 Ann " venting, or make the heat sink open - miscellaneous. * The heat sink adjustment method is quite complex in structure. [Invention content] The hot air system of the existing notebook computer exit ^ is set to be fixed. , and the heat sink of the air outlet is adopted. Blowing out, or having a notebook computer when it is complicated, it is still not a note of 1 ° and rushing, but its structure is still the same, the present invention is to mention the most (four) meter of the type of air outlet. Fin structure. The casing of the conductive sub-assembly according to the present invention has an application-electronic device, a plurality of fins, and a turbulent structure. The relationship is set in the air outlet of the casing f = the piece is rotated to make the fins, and the fins are connected to each of the fins to be fixed to the electronic device, and the other is rotated. One end of the component is connected to the four moving parts of the rotating bowl or directly connected (take the outside) to pull all the 201001141 fins and oscillate when heated. The memory deformation element is always held at a normal angle, and the memory deformation element is thermally deformed by 4 = thermal energy in the electronic device, thereby pulling the fin to swing, and each piece can be oscillated to - working angle, and can be changed; direction. According to the air guiding structure disclosed in the present invention, when the electrons are disposed, the memory deformation element will be heated and stretched and deformed, that is, swung to a working angle, so that the plurality of pieces can be operated according to the temperature effect of the electronic device. The direction of the exhaust is changed, and it becomes the best design for the wind guiding structure applied to the electronic device. , , and detailed descriptions and implementations, the best embodiment is shown in conjunction with the drawings. [Embodiment] The wind guiding structure disclosed in the present invention is applied to an electronic device: The desktop computer, the server, the notebook type, and the electronic version of the notebook are used to operate the electronic device that generates heat in the first and second versions. In the following version: The preferred embodiment of the invention. ^ Fig. 1 shows an air guiding structure according to the present invention, which is applied to a computer of the type 5 pen type. The notebook computer is provided with a main unit 10' main unit 10, and has a cooling fan 11, and a side portion of the main unit 10 is provided with an air outlet 12 of the cooling fan 11. Further expressions are worn. λ " 卑 2 A, Figure", shown in the figure is 201001141 structure, the example of the wind deflecting element disclosed in the first embodiment of the present invention \ includes * several pieces 13, The swaying member 14 and the memory change and the bottom end 八 13 are "sheet-like bodies", and the top end of the Korean piece 13 is 1 1 W against the rotating shaft 131 ° The inner end surface of the air outlet 12 has a plurality of end sleeves The hole 121 has a hole 13 of the rotating shaft (3) and the M i port 12, so that the fin 13 can be at the side of the air outlet 17 132. 14-long strip-shaped rod body, on the turbulating member 14, a plurality of ferrules 141 of the fins 13 are splayed, and the connecting portion 132 of each of the '' · 曰 13 is swung to each ferrule 141 In order to connect each of the fins 13 in series, so that each piece of m ¥ has a female angle. The mother piece, . . . "13 can - and rotate in conjunction with the change of the deformation element 15 can be spiral (four) along other possible shapes 'such as irregular line, strip, plate shape · in the case The spiral shape is fixed to the wind deflecting element 15 on the side of the wind, and the side of the inner wall of the pen (the main unit 10 of the electronic device (5) type computer) is connected to the other end: In the present invention, in the present invention, the memory change = : ? one of the shaft pieces 13 or the connection to the engine 2:: 4: can smoothly pull all the fins ... and swing the 'deformation element 15 The relationship between: and the purpose is that when the memory is ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The following inner valley is only exemplified by the fact that the morphing deformation element 15 is directly connected to the fin 13. The memory deformation piece 15 can be made of a nickel-titanium shape memory alloy, or a copper-zinc-aluminum shape memory alloy, copper. _ Nickel_aluminum shape memory alloy, etc., which can produce a deformation effect according to temperature. Next, the 变形 变形 deformation element 15 has a - stretched deformation state, and in the heated state, the yoke/element 15 has a - contraction recovery state. By the memory deformation element 15 deformation effect 'at a normal temperature state (such as a cooling fan) When not actuated, 'each I 13 13 is maintained at the angle of the hanging energy &# , ^, and in the heated state (such as after the cooling fan 11 is activated), due to the 恃. The heart and the Φ 7L pieces are deformed and contracted', that is, the fins 13 are pulled to make the key sheet n, and the old piece 13 is swung, and the respective fins 13 are swung to the same by the swaying member V. angle. Please--see "3A, 闰^-t 遨 遨 nu* diagram", according to the invention, the temple wind ', and the mouth structure, in which a plurality of fins u 詈 屮龆 π ^ know The relationship between the square and the turn is set and the dragon outlet 12, while the swaying member 14 deforms the element 15 and the salt recognizes the mountain Angu, ", the piece] 3, and the memory is connected to the side of the air outlet 12, At the other end, the fish is pulled out of the watch, and the money y 1, ~ is connected to the side of the wide side # ] 3. It starts to operate under normal temperature conditions, # 聿5 黾 黾 黾 乍忑 交 交 交The cymbal 15 is held in the extension of each fin 13 to maintain a shape and a resentment

Win Trrm:^ 吊心角度係使各鰭片】3 凤12王垂直(yr第飞 運作時,散埶屜戶110日 」)田棄圮型一電腦開始 放熱風扇】]開始自外界吸入;人介々 與筆記型電腦熱源(圖中 7 H使冷空氣 未不)進仃熱交換後,將熱交換後 20100114] 之熱空氣朝出風口 I9呤ψ ^ ^ ^Win Trrm: ^ Hanging angle makes the fins 3 phoenix 12 king vertical (when yr first flight operation, the bulk of the households 110 days)) Tian 圮 圮 type a computer began to radiate the fan]] began to inhale from the outside; After the heat exchange between the media and the notebook computer (7 H makes the cold air not in the picture), the hot air after the heat exchange is 20100114] toward the air outlet I9呤ψ ^ ^ ^

-人出。熱空氣持續的與記憶變形元 件]:)接觸,使記憶變 A y 件】)處於受熱狀態,當記憶變 形元件15之溫度到達轉 〜 時,記憶變形元件15產ρΓ empera她) 產生形變而收縮至收縮復原狀態, 即由記憶變形元# Μ & & 動,,、、曰片13而使鰭片13擺動,並 透過掣動構件14帶動各雜H u /、,α η「μ 勤各鰭片13-併的擺動至一工作角度 (如「第3B圖」)。 F月度 在體應用上,筆記型電腦剛始 到達轉變溫度,埶空氣^… 适❹-度尚未 向葦記型電腦的侧邊排出。當 乃疋朝 空氣田章。己型4持績運作而使熱 _ 一但溫度到達轉變溫度,各韓片即 動至工作角度。工作角 月13擺 使熱空氣經過出風口 12的 :·的斜後方, 後方排出,如使用者的以 ㈣記型電腦的斜 鼠,排出之敎pS於筆記型電腦的侧邊操作滑 不二!I?不會直接地吹拂到使用者的手,所以 不'口排出之熱空氣對使用者造成不舒適。 w月再參閱「第2A、2B圖與厂第·^ Δ 轉軸131設置於鍵片η 圖」所示。 且々' -a方i 3上的不同付罟步 片13的旋轉貞声右跖且處,將會使得各鰭 ]疋柃角度有所不同。最外侧之鰭 線L,其中等分線 /、有—寺分 之長侧等分於^片13中線,將鰭片!3 长側寻刀為長度相同的兩部分。 元件15在相同變妒互 $月中,纪憶變形 4里下可拉動籍片Μ擺動之角度,係與 J0 201001141 套孔121及轉軸131相對於記憶變形元件15之距離成反 比。也就是說,若轉軸131設置的位置與記憶變形元件 15和鰭片13連接處越接近,記憶變形元件15在相同變 形量下所能拉動鰭片13旋轉的角度越大。在第一實施例 中,記憶變形元件15連接鰭片13處至轉軸131之距離大 致寺於記憶變形兀件15連接鰭片13處至等分線L之距 離,即轉轴131設在等分線l上。 t ㈣「第4圖」所示,目中所示係為本發明第二實 施例,根據本發明第二實施例所揭露之導風結構,其中於 筆記型電腦之散熱元件或是散熱器(圖中未示,例如熱導 管、散熱墊、散熱鰭片組等)與記憶變形元件丨5之間ΐ設 置-熱傳導件16。其中,本發明第一實施例係、由散減 扇^朝記憶變形元件15吹拂熱空氣,而本發明第二實施 例是直接將散熱元件或散熱器之熱能直接傳導至記憶變 ί.,形7°件15 ’使記憶變形元件15能夠實際反應筆記型電腦 的運作狀態而即時地改變各鰭片13旋轉至工作角^。 閱第5A、5B圖」所示,圖中所示係為本發明 第二貫施例,根據本發明第三實施例所揭露之導風結構, 其中於出風口 12設置記憶變形元件15的另一側内壁,設 置有—復位元件17。復位元件17 -端固定於出風::又2 内土面的側迨,另一端則連接於所對應最外側的鰭片 13 ’即相對於記憶變形元# 15白勺另一側最外側之鰭片 201001141 ]0 °彳是位元件17 / 係維持於一壓靖二不侷限於-拉伸彈簧,係常態下 變形狀態。;=形::!Γ記憶變形元件15的伸展 元件π則呈拉伸狀態,使復位元狀態,復位 止運作時,協助記憶變形元件15回^=,型電腦停 而使各餘片】3卜 仅至收縮復原狀態, 止师士 ㈣至常態角度。因此,當筆記型電腦停 T C憶變形元件15溫度逐漸下降至轉變= 元件長溫狀態下拉動籍片13,使記憶變形 ! 灰奴至伸展變形狀態, 片η拉回維持在常態角度。㉙由手動構件μ將各鰭 η請參閱「第6圖」所示,圖中所㈣為本發明第四· 二二根據本發明第四實施例所揭露之導風結構, 側.真::三實施例之記憶變形元件15係設置於出風口 12 =出一’且記憶變形元件,的變形方J 12王垂直’而本發明的第四實施例係可因筆—己 ^腦内部空間的配置關係而將記憶變形元件15設置^ 筆元型電腦的内部,並且將記憶變形元 ^ 設,口 U呈平行。因此將可使記憶變牛方;; 的鳊直接固定於散熱元件或散熱器(圖中未示)上,另— 端則是固定於最外側鰭片13的拉桿133上,而拉動 片13旋轉。 ”’、曰 請參閱「第7Α、7Β、8圖」所示,圖中所示 12 201001141 發明第五實施例,根據本發明第五每 構,其結構於前述第一實施例大 歹1所知路之導風結 例相異處加以說明。在第五實施合以下僅對兩實施 軸1—設置二=形轉 =於弟-實施例),即記憶變形元件15連接W 目 轉侧之麟小於記憶變形元件15連接,鰭片η處至等 之距離。因此,記憶變形元件15在相同變形量下 :拉動則13旋轉較大的角度(相對於第一實施例)。, 二=不改嶋131的位置,而將記憶變形元; :二…2内部’同樣能使記憶變形元件15在相 ㈣置下可拉動韓片13旋轉較大的角度。另外,也可 ^「第8圖」所示將籍片13之轉車由⑶和套孔121設 直在距離記憶變形元5鲈、土 連接鰭…至==即記憶變形元件15 連接鯖心處至^記憶變形元件15 — 、c 離,^屬於本發明所揭露 之乾臂。 請參閱「第9圖」所示,係為本發明第六實施例,根 發明第六實施例所揭露之導風結構,其結構於前述第 η]大致相同,以下僅對兩實施例相異處加以說明。 在弟六實施例中’記憶變形元件15-端岐地設置於出 、内土面的侧邊,而另一端則直接連接於掣動構件 相對於削述第—實施例’本實施例之記憶變形元件 13 201001141 i5係直接拉動掣動構件而藉由掣動 “ 錯片併地擺動。 再件μ v動所有 明麥閱「第10Α、10Β圖」所示,係為本發明第七丧 施例,根據本發明第六實施例所揭露 Μ 私,,+·穿6 守風結構’其結構 =二:施例大致相同’以下僅對兩實施例相異處加 说月。在弟七貫施例中,記憶變形元件15 狀之金屬材質所結合而成,其中二種金屬材質且有== 熱膨服係數。記憶變形元件15一端固定地設置= u内壁面的侧邊’而另一端則可活動地連接於韓片η 上:例己憶變形元件15以-凸柱⑸插設於韓片13 之¥引才干134。所以,當記憶變形元件15受孰後敎 ,脹係數的差異,兩種金屬材質的膨脹程度不同,使記憶 文开yTL件15 %熱後會朝低_脹絲之金屬材質一端織 曲變形,進而拉動鰭片13擺動,在透過掣動構件㈣: 母各鰭片13—併地擺動,使各鰭片13擺動至工作角产。 本實施例同樣能夠反應溫度而改變出風之風向,且在溫产 回到常溫後’記憶變形元件15會自己歸位,使 又 回到常態角度。 、雖然本發明以前述之較佳實_揭露如上,然其並非 用以限^本發明,任何熟f相關技#者,在不脫離本發明 之精神和範圍内,當可作些許之更動與㈣,因此本發明 之專利保護範圍彡|視本說”所社申請專利範圍所界 201001141 定者為準。 【圖式簡單說明】 鵰 結構係為本發明第-實施例之應用於筆記型電 弟2A圖,传发士々 第叫俜=明第一實施例之結構示意圖,· "為本發明第-實施例之作動示意圖; & 4 圖,係為本發明第一實施例之使用示意圖. :圖,係為本發明第二實施例之結構示意圖; ΐ Λ5 Β圖、’係為本發明第三實施例之使用示意圖; μ θ ’係為本發明第四實施例示意圖丨 =7Α、7Β圖、,係為本發明第五實施例之使用示意圖; &圖知、為本發明第五實施例之使用示意圖; #圖係、為本發明第六實施例之使用示意圖;及 圖。 〇Β圖,係為本發明第七實施例之使用示意 【主要元件符號說明】 主機 散熱風扇 出風D 套孔 鰭片 轉轴 10 11 12 121 13 15 131 201001141 132 連接部 133 拉桿 134 導引桿 14 掣動構件 141 套圈 15 記憶變形元件 151 凸柱 16 熱傳導件 17 復位元件- People out. The hot air continues to contact with the memory deformation element]:), so that the memory becomes A y piece]) is in a heated state, when the temperature of the memory deformation element 15 reaches the turn ~, the memory deformation element 15 produces Γ emp empera her) produces deformation and shrinks In the contraction recovery state, the fins 13 are swung by the memory deformation elements # Μ &&&&, and the cymbal 13 is oscillated, and the various components H u /, α η "μ 勤Each of the fins 13 - is swung to a working angle (such as "3B"). F monthly In the body application, the notebook computer has just reached the transition temperature, 埶 air ^... ❹ - degree has not been discharged to the side of the notebook computer. When Nai dynasty, the air field chapter. The performance of the model 4 is maintained and the heat is reached. Once the temperature reaches the transition temperature, the Korean films move to the working angle. Working angle month 13 puts hot air through the air outlet 12: · obliquely rearward, rear discharge, such as the user's (4) type of computer mouse, the discharge pS on the side of the notebook computer operation slippery !I? Does not directly blow the user's hand, so the hot air that is not discharged is uncomfortable to the user. In the month of w, refer to "The 2A, 2B, and the factory. ^ Δ The rotation axis 131 is set to the key η diagram". And the different rotations of the 罟'-a square i 3 are squeaked to the right and will cause the fins to have different angles. The outermost fin line L, in which the bisector /, has the long side of the temple, is equally divided into the middle line of the slice 13, and the fins! 3 Long side seeks are two parts of the same length. In the same change, the element 15 can pull the angle of the piece oscillating in the same period of time, which is inversely proportional to the distance between the J0 201001141 socket 121 and the rotating shaft 131 with respect to the memory deformation element 15. That is, if the position where the rotary shaft 131 is disposed is closer to the junction of the memory deformation element 15 and the fin 13, the angle at which the memory deformation element 15 can pull the fin 13 to rotate at the same deformation amount is larger. In the first embodiment, the memory deformation element 15 is connected to the distance from the fin 13 to the rotating shaft 131. The distance between the memory deformation member 15 and the fin 13 is connected to the bisector L, that is, the rotating shaft 131 is set in equal parts. Line l. t (4) "Fig. 4", which is a second embodiment of the present invention, the air guiding structure disclosed in the second embodiment of the present invention, wherein the heat dissipating component or the heat sink of the notebook computer ( A heat conducting member 16 is disposed between the memory deformation member 丨 5 (not shown), for example, a heat pipe, a heat dissipating pad, a heat dissipating fin group, and the like. In the first embodiment of the present invention, the hot air is blown from the dissipation fan to the memory deformation element 15, and the second embodiment of the present invention directly transmits the heat energy of the heat dissipation component or the heat sink to the memory. The 7° piece 15' enables the memory deformation element 15 to actually change the operating state of the notebook computer to instantly change the rotation of each fin 13 to the working angle ^. 5A, 5B, which is a second embodiment of the present invention, the air guiding structure according to the third embodiment of the present invention, wherein the air outlet 12 is provided with the memory deformation element 15 The inner wall of one side is provided with a reset element 17. The restoring element 17 - end is fixed to the outlet side: the side of the inner surface of the inner surface is: 2, and the other end is connected to the outermost fin 13 ', that is, the outermost side of the other side of the memory deformation element # 15 Fin 201001141 ] 0 ° 彳 is the position component 17 / is maintained in a pressure two, not limited to - tension spring, is in a normal state of deformation. ;=形::!Γ The stretching element π of the memory deformation element 15 is in a stretched state, so that the reset element state, when the reset operation is stopped, assists the memory deformation element 15 to return to the ^=, and the computer stops to make the remaining slices] Bu only to the state of contraction and recovery, stop the division (four) to the normal angle. Therefore, when the notebook computer stops T C, the temperature of the deforming element 15 gradually drops to the transition = the long-temperature state of the component pulls down the piece 13 to make the memory deform! The gray slave is stretched and deformed, and the piece η is pulled back to maintain the normal angle. 29, the respective fins η are shown in the "figure 6" by the manual member μ, and (4) in the figure is the fourth embodiment of the present invention. The wind guiding structure according to the fourth embodiment of the present invention, side: true:: The memory deformation element 15 of the third embodiment is disposed at the air outlet 12 = a 'and the memory deformation element, the deformation side J 12 king vertical' and the fourth embodiment of the present invention can be caused by the internal space of the pen The relationship is configured to set the memory deformation element 15 to the inside of the pen-type computer, and the memory deformation element is set, and the mouth U is parallel. Therefore, the memory can be made to be fixed to the heat dissipating member or the heat sink (not shown), and the other end is fixed to the pull rod 133 of the outermost fin 13 while the pulling piece 13 is rotated. . ” ” 曰 「 第 第 第 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 2010 The difference between the guiding directions of the knowing roads is explained. In the fifth embodiment, only the two embodiments of the shaft 1 - the setting of the second embodiment of the shaft 1 - the embodiment of the memory deformation element 15 are connected to the side of the W-turning side, and the fins are connected to the memory deformation element 15 . Wait a distance. Therefore, the memory deformation element 15 is at the same amount of deformation: 13 is rotated by a larger angle (relative to the first embodiment). , 2 = does not change the position of 嶋 131, but will memorize the deformation element; : 2 ... 2 internal ′ also enables the memory deformation element 15 to be placed in phase (4) to pull the Korean film 13 to rotate a larger angle. In addition, as shown in the "Fig. 8", the transfer of the tablet 13 is set by the (3) and the sleeve hole 121 at a distance from the memory deformation element 5, the soil connection fin ... to == the memory deformation element 15 is connected to the center of the heart. The memory deformation elements 15 - , c are separated from the dry arms disclosed in the present invention. Please refer to FIG. 9 for a sixth embodiment of the present invention. The air guiding structure disclosed in the sixth embodiment of the present invention has substantially the same structure as the foregoing η], and the following only differs between the two embodiments. Explain it. In the sixth embodiment, the 'memory deformation element 15 is disposed at the side of the inner and inner soil surfaces, and the other end is directly connected to the memory of the swaying member relative to the description of the embodiment. The deformation element 13 201001141 i5 directly pulls the swaying member and swayes by swaying the erroneous piece. The other part is the seventh mourning of the invention. For example, according to the sixth embodiment of the present invention, the +-wearing 6 wind-keeping structure 'its structure=two: the embodiment is substantially the same' is merely added to the difference between the two embodiments. In the seven-seventh embodiment, the memory deformation element is made of a combination of 15 metal materials, of which two metal materials have a == thermal expansion coefficient. The memory deforming element 15 is fixedly disposed at one end of the side wall of the inner wall surface of the u-th wall and the other end is movably connected to the south piece η: an example of the deformation element 15 is inserted into the Korean piece 13 by the - stud (5) Talent 134. Therefore, when the memory deformation element 15 is subjected to 孰, the difference of the expansion coefficient, the degree of expansion of the two metal materials is different, so that the memory of the yTL member is 15% hot and then twisted and deformed toward the end of the metal material of the low _ bulging wire. Further, the fin 13 is pulled to swing, and the swaying member (4): the female fins 13 are oscillated in parallel, and the fins 13 are swung to the working angle. In this embodiment, the wind direction can be changed in response to the temperature, and after the warmth returns to the normal temperature, the memory deformation element 15 will return to its original position, so that it returns to the normal angle. The present invention is not limited to the present invention, and may be modified in some ways without departing from the spirit and scope of the present invention. (4) Therefore, the scope of patent protection of the present invention is determined by the scope of the patent application scope of 201001141. [Simplified illustration] The engraving structure is applied to the notebook type according to the first embodiment of the present invention. 2A, the transmission of the gentry is called 俜 = the schematic diagram of the first embodiment, · " is a schematic diagram of the operation of the first embodiment of the present invention; & 4 figure is used for the first embodiment of the present invention Fig.: Fig. is a schematic view showing the structure of a second embodiment of the present invention; ΐ Β 5 Β, ' is a schematic diagram of the use of the third embodiment of the present invention; μ θ ' is a schematic diagram of the fourth embodiment of the present invention 丨=7Α FIG. 7 is a schematic view showing the use of the fifth embodiment of the present invention; and FIG. 3 is a schematic view showing the use of the fifth embodiment of the present invention; FIG. The map is the first invention of the present invention. Explanation of the use of the embodiment [Description of main component symbols] Main unit cooling fan outlet D Set hole fin shaft 10 11 12 121 13 15 131 201001141 132 Connecting part 133 Pull rod 134 Guide rod 14 Tilting member 141 Ferrule 15 Memory deformation Element 151 stud 16 heat conductor 17 reset element

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Claims (1)

201001141 十申味專利範園: 】-一種導風結構, 括有: |、電子裝置之—出風口上,其包 複數片鰭片,号Γ 出風口;及 以專,片係以可旋轉之闕係設置於該 一記憶變形元件,# 子裝置,另山 該3己隐交形元件一端固定於該 衣置另一端連接於守望餘 电 元件受埶銳$ ; & 、w…、、s片"中之一,該記憶變形 丨卞又熟踅形而拉動該等銼 u 2. 如申請專利範圍第〗項::二併地擺動。 Μ μ 、 ^ 泠風結構,其中更包含有 手動構件’該望#yr a4l ^ -I.* 構件;接於該等鰭片,以由該掣動 攝件γ動该等鰭片—併地擺動。 勒 3. 如申請專利範圍第 上八以 弟項所述之導風結構,其中各該結片 上分別設置有_連接# 谷—片 接邻$動構件上设置有對應該連 接口P之设數個套圈,各該 ^ 該套圈,使=連接部分別樞接於各 從及寻鰭片可—併地旋轉。 4,如申凊專利範圍第丨項 —庐办„μ 風結構,其中更包括有 立導其一端設置於該出風口内壁面侧邊 柒連接於相對該記憶變形元 μ ^ 十为側瑕外側之該鲑 以及記:變形元件具有-常溫狀態下的伸展變形狀; 受熱狀態下的收縮復原狀態,使該複數片縛片維 常態角度及擺動至-工作角度,而該復位元件於 ,吊溫狀態將該記憶變形元件恢復至該伸展變形狀能; 17 201001141 ^申请專利範圍第丨賴述之導風結構,其巾該出風口 内壁面之«與底端分㈣有複數個套孔,各韻片之 :端與底端分別設置有―對轉軸,該等以以該等轉軸 套入於該套孔而擺動。 6·如^專利範圍第5項所述之導風結構,其中該籍片具 有—等分線,該記憶變形^件連接該⑸處至該轉轴之 距離小於該記憶變形元件連接該籍片處至 距離。 7·如申請專利範圍第5項所述之導風 有=分線,該記憶變形Μ連接該鰭片處 距離等於该記憶變形元件連接該鰭片處至該等分線之 距離。 、、 8·^請專利範㈣5項所述之導風結構,其中該韓片具 有一等分線,該記憶變形元件連接該鰭片處至該轉軸之 距離大於該記憶變形元件連接該鰭片處至該 距離。 卞刀备Κ 9:申請專利範圍第丨項所述之導風結構,其更包括有一 …傳導件,該熱傳導件兩端分別連接於該記憶變形 與該電子裝置之一散熱器。 申請專利範圍第1項所述之導風結構,其中該韓片 3有拉杯,该纪憶變形元件一端連接於該拉桿, —端固定於該電子裝置之一散熱元件。 ]8 201001141 11.一種導風結構,設置於 電子裴 包括有·· 1置之一出風口上,其 複數片鰭片,該等鰭片係以 出風口; 可旋轉之關係設置於該 一掣動構件,連接該等鰭片,·及 一記憶變形元件,該記憶 子裝置,另-端連接於該掣動構件兀件―端固定於該電 熱變形而㈣拉動該掣動構件=由該記憶變形元件受 等鰭片-併地擺動。 从由該掣動構件帶動該 12·如申料利範圍第u 片上分别机$V風結構,其中各該鰭 刀別叹且有一連接部,該掣動 連接部之複數個套圈,各該鰭片之:置有對應該 各該套圈,使該等鰭片可-併地擺動^ ”別樞接於 ^如申請專利範圍第n項所述之㈣ 有:復位元件,其一端設置於該出風口内壁面= =接於相對該記憶變形元件另—侧最外側你 ,该記憶變形元件具有一常溫狀態下的伸展 :: 受餘態下的收縮復原狀態,使該複數片轉片、= 才寸在—常態角度及擺動至一工作角度, _ '准 :::狀態將該記憶變形元件恢復至該伸; = 於 14·如申請專利範圍第η項所述之導風結構,其中^、 口内壁面之頂端與底端分別設有複數個套孔^各 19 201001141 心項磲興底端分別 軸套入於該套孔而擺動。 15·如申請專利範圍第11項所述之導風結構,其更包括有 一熱傳導件,該熱傳導件兩端分別連接於該記憶 件與該電子裝置之一散熱器。 二::請專利範圍第u項所述之導風結構 已各有一拉桿,該記憶變形元件〜 ’、〜、、、日片 —端連接於該電子裝置之―散熱元件^接於該技桿。另 20201001141 Ten Shenwei Patent Fanyuan: 】-A wind guiding structure, including: |, electronic device - on the air outlet, which covers a plurality of fins, No. Γ outlet; and special, film to rotate The lanthanoid system is disposed on the memory deformation component, the # sub-device, and the other side of the 3 self-concealed component is fixed at the other end of the garment and connected to the watchkeeping residual component to receive the sharp $; &, w..., s In one of the films, the memory is deformed and cooked to pull the 锉u. 2. For example, the scope of the patent application:: swinging in parallel. Μ μ , ^ hurricane structure, which further includes a manual member 'the #yr a4l ^ -I.* member; is connected to the fins to move the fins by the yoke γ - swing.勒3. The air guiding structure according to the eighth paragraph of the patent application scope, wherein each of the splicing sheets is provided with _connecting #谷-片接邻$, the moving member is provided with the corresponding number of connecting ports P a ferrule, each of the ferrules, such that the = connecting portion is pivotally connected to each of the slave and fins to be rotatable. 4, such as the scope of the patent scope of the application - „ „ μ wind structure, which further includes a vertical guide, one end of which is disposed at the side of the inner wall of the air outlet, and is connected to the outer side of the memory deformation element μ ^ ten And the deformation element has a stretched shape at a normal temperature state; a contraction recovery state in a heated state causes the plurality of pieces to maintain a normal angle and swing to a working angle, and the reset element is at a temperature The state restores the memory deformation element to the extended deformation shape energy; 17 201001141 ^The scope of the patent application 丨 丨 之 导 导 , , , , , , 该 该 该 该 该 该 该 该 内 内 内 内 内 内 内 内 内 内 内 内 内 内 内 内 内 内 内 内 内 内 内 内The rhyme piece: the end and the bottom end are respectively provided with a "rotating shaft", and the swinging shaft is inserted into the sleeve hole to swing. 6 · The air guiding structure according to item 5 of the patent scope, wherein the The sheet has a bisector, and the memory deformation member connects the distance from the (5) to the rotating shaft to be smaller than the distance from the memory deformation element to the piece. 7 · The guiding wind as described in claim 5 = split line, the memory changes The distance between the fins and the fins is equal to the distance from the fins to the bisector of the memory deformation element. The air guiding structure described in the fifth paragraph of the patent specification (4), wherein the Korean film has an equal division a wire, the memory deformation element connecting the fin to the rotating shaft is greater than the distance from the memory deformation element connecting the fin to the distance. The utility model 9: the wind guiding structure according to the scope of the patent application, Further comprising: a conductive member, the two ends of the heat conducting member are respectively connected to the memory deformation and the heat sink of the electronic device. The air guiding structure according to claim 1, wherein the Korean piece 3 has a pulling cup, One end of the Jiyi deformation element is connected to the pull rod, and the end is fixed to one of the heat dissipating components of the electronic device. ] 8 201001141 11. An air guiding structure is disposed on an air outlet including one of the air outlets of the electronic device. a fin, the fins are connected to the air outlet; the rotating member is disposed on the swaying member, and the fins are connected, and a memory deformation device is connected to the 另Structure The armor-end is fixed to the electrothermal deformation and (4) the tilting member is pulled = the fin is oscillated by the memory deforming element - and the swing is driven by the tilting member. The machine has a $V wind structure, wherein each of the fin knives does not sigh and has a connecting portion, and the plurality of ferrules of the swaying connecting portion, each of the fins is disposed corresponding to each of the ferrules, so that the fins can be - Swinging in parallel ^ "Do not pivotally connect to ^ as described in item n of the patent application scope. (4) There is a reset element, one end of which is disposed on the inner wall surface of the air outlet = = is connected to the outermost side of the other side of the memory deformation element You, the memory deformation element has a stretch at normal temperature:: subject to the contraction recovery state in the residual state, so that the plurality of pieces are rotated, = only in the normal angle and swing to a working angle, _ 'quasi:: : The state restores the memory deformation element to the extension; = 14 · The air guiding structure according to item n of the patent application scope, wherein the top end and the bottom end of the inner wall surface are respectively provided with a plurality of sets of holes respectively 19 201001141 The bottom end of the heart project is placed in the hole and the pendulum . The air guiding structure of claim 11, further comprising a heat conducting member, the heat conducting member being respectively connected to the memory member and one of the heat sinks of the electronic device. 2: The air guiding structure described in item u of the patent scope has a tie rod, and the heat dissipating component of the memory deformation element ~ ', ~, , , and the film is connected to the electronic device . Another 20
TW097123809A 2008-06-25 2008-06-25 Wind guiding structure TW201001141A (en)

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TW097123809A TW201001141A (en) 2008-06-25 2008-06-25 Wind guiding structure
US12/237,567 US20090321047A1 (en) 2008-06-25 2008-09-25 Air guiding structure
DE202008013129U DE202008013129U1 (en) 2008-06-25 2008-10-02 An air guide
JP2008006962U JP3147142U (en) 2008-06-25 2008-10-03 Air guide structure

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Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM351385U (en) * 2008-08-25 2009-02-21 Wistron Corp Adjustable ventilation apparatus for computer enclosure and assembly for computer enclosure and adjustable ventilation apparatus
TWI424805B (en) * 2008-10-15 2014-01-21 Micro Star Int Co Ltd Venting device
CN201479534U (en) * 2009-05-13 2010-05-19 鸿富锦精密工业(深圳)有限公司 heat sink
CN101968670A (en) * 2009-07-27 2011-02-09 鸿富锦精密工业(深圳)有限公司 All-in-one computer
TWI391813B (en) * 2009-12-08 2013-04-01 Wistron Corp Heat-dissipating hole mechanism capable of adjusting airflow rate and portable computer device thereof
US10041745B2 (en) 2010-05-04 2018-08-07 Fractal Heatsink Technologies LLC Fractal heat transfer device
US10852069B2 (en) 2010-05-04 2020-12-01 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a fractal heat sink
US9228785B2 (en) 2010-05-04 2016-01-05 Alexander Poltorak Fractal heat transfer device
JP5919568B2 (en) * 2011-07-25 2016-05-18 パナソニックIpマネジメント株式会社 Electronics
JP5927539B2 (en) * 2011-07-25 2016-06-01 パナソニックIpマネジメント株式会社 Electronics
KR20150014939A (en) * 2012-04-26 2015-02-09 엔이씨 플랫폼즈 가부시키가이샤 Air-cooled case
JP2014085973A (en) * 2012-10-25 2014-05-12 Nec Personal Computers Ltd Heat dissipation device and portable information equipment
TW201443624A (en) * 2013-05-09 2014-11-16 宏碁股份有限公司 Heat dissipation structure and electronic device using the same
US20140360699A1 (en) * 2013-06-07 2014-12-11 Mide Technology Corporation Variable geometry heat sink assembly
TWI496532B (en) * 2013-07-02 2015-08-11 緯創資通股份有限公司 Portable electronic module and heat dissipation mechanism thereof
JP6165560B2 (en) * 2013-08-30 2017-07-19 株式会社東芝 Electronics
US11009301B2 (en) 2014-06-27 2021-05-18 Delta Electronics, Inc. Heat dissipating fin assembly
TWI526626B (en) * 2014-06-27 2016-03-21 台達電子工業股份有限公司 Heat dissipating device
JP6678302B2 (en) * 2015-07-24 2020-04-08 パナソニックIpマネジメント株式会社 Temperature control unit, temperature control system, vehicle
WO2018013668A1 (en) 2016-07-12 2018-01-18 Alexander Poltorak System and method for maintaining efficiency of a heat sink
CN107168492B (en) * 2017-03-29 2021-10-22 联想(北京)有限公司 Information processing method and electronic equipment
CN111433549A (en) 2017-07-17 2020-07-17 分形散热器技术有限责任公司 Multi-fractal heat sink system and method
TWI659293B (en) * 2018-03-06 2019-05-11 和碩聯合科技股份有限公司 Linking blade structure and folding electronic device with the same
TWI658769B (en) * 2018-08-16 2019-05-01 緯創資通股份有限公司 Apparatus case with a rotatable airflow-blocking part and server therewith
CN110850948B (en) * 2019-12-05 2024-06-14 合肥联宝信息技术有限公司 Heat abstractor and electronic equipment
CN111343811B (en) * 2020-03-05 2021-02-23 武汉华星光电半导体显示技术有限公司 Heat dissipation system and shell of foldable mobile terminal and foldable mobile terminal
CN116772623A (en) * 2021-04-07 2023-09-19 朱艺娜 Energy-saving plate-fin heat exchanger
CN113258247B (en) * 2021-04-25 2023-09-19 南京奥莱科技有限公司 Wireless broadband ad hoc network communication system
CN113587263B (en) * 2021-06-25 2023-12-26 青岛海信日立空调系统有限公司 Heat dissipation device of air conditioner outdoor unit driver and control method
CN113675500B (en) * 2021-08-04 2023-06-06 深圳索瑞德电子有限公司 Lithium iron battery UPS system and its control method
CN119231352B (en) * 2024-12-03 2025-03-14 铭祺电气有限公司 Ring main unit and heat dissipation device thereof

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2143028B (en) * 1983-07-01 1986-11-19 Matsushita Electric Industrial Co Ltd Discharge direction control device for air conditioner
US4635610A (en) * 1985-04-17 1987-01-13 Sharp Kabushiki Kaisha Hot air circulating oven range using shape memory alloy
US4699314A (en) * 1986-12-17 1987-10-13 Carrier Corporation Actuator for a heating/cooling diffuser
FI92372C (en) * 1992-08-12 1998-02-10 Kvaerner Masa Yards Oy Fire damper device
ES2161386T3 (en) * 1993-03-05 2001-12-01 Mitsubishi Electric Corp AIR ADDRESS ADJUSTMENT APPLIANCE IN A CONDITIONED AIR EQUIPMENT.
CN1129829C (en) * 1999-07-26 2003-12-03 仁宝电脑工业股份有限公司 Expandable portable type computer heat radiating device
JP3302350B2 (en) * 2000-06-29 2002-07-15 株式会社東芝 Electronics
IT1320693B1 (en) * 2000-10-06 2003-12-10 Fiat Ricerche DEVICE FOR THE ADJUSTMENT OF AN AIR FLOW IN A DUCT, WITH AN INTEGRATED MEMORY ACTUATOR, ESPECIALLY FOR SYSTEMS
CA2469584C (en) * 2001-12-12 2010-04-27 R.A.D. Innovations Inc. System for controlling distribution of air to different zones in a forced air delivery system
US7031154B2 (en) * 2003-04-30 2006-04-18 Hewlett-Packard Development Company, L.P. Louvered rack
US6945867B2 (en) * 2003-08-19 2005-09-20 Chan-Woo Park Movable grating control
US7498926B2 (en) * 2006-05-01 2009-03-03 Gm Global Technology Operations, Inc. Reversibly opening and closing a grille using active materials
US7866737B2 (en) * 2007-01-31 2011-01-11 Gm Global Technology Operations, Inc. Active material actuated louver system
EP2149465B1 (en) * 2008-07-31 2010-09-15 C.R.F. Società Consortile per Azioni Motor-vehicle dashboard with main central portion having no outflow apertures for the ventilation air
TWI424805B (en) * 2008-10-15 2014-01-21 Micro Star Int Co Ltd Venting device
US8414366B2 (en) * 2008-10-20 2013-04-09 GM Global Technology Operations LLC Active material enabled pressure release valves and methods of use
US8302714B2 (en) * 2010-02-19 2012-11-06 GM Global Technology Operations LLC Impact and damage resistant front end airflow control device
US8876579B2 (en) * 2011-01-14 2014-11-04 GM Global Technology Operations LLC Shape memory alloy actuated HVAC outlet airflow baffle controllers
US8807166B2 (en) * 2011-06-03 2014-08-19 GM Global Technology Operations LLC Active aero shutters

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