TW201009994A - Substrate aligning apparatus, substrate aligning method and method for manufacturing multilayer semiconductor - Google Patents

Abstract

A substrate aligning apparatus is provided with: a first stage which shifts in the surface direction of a substrate while holding one of a pair of substrates facing each other; a second stage which holds the other substrate of the pair of substrates; a first microscope which observes an alignment mark of the substrate held by the second stage; a second microscope which observes an alignment mark of the substrate held by the first stage; a calibration indicator observed from both the first microscope and the second microscope; and an alignment control section which aligns the pair of substrates, based on the relative positions of the first microscope and the second microscope obtained by observing the calibration indicator by the first microscope and the second microscope, first positional information which indicates the position of the alignment mark observed by the second microscope, and second positional information which indicates the position of the alignment mark observed by the first microscope.

Description

1. The special application 2008-221265 application date is August 28, 2008. 2. The special application 2008-256804 application date 2008 January 1st to 201009994 6. Description of the invention: [Technical field to which the invention pertains] Application of the substrate alignment method and the method for manufacturing a laminated semiconductor. For the purpose of acknowledging the priority of the ":" case, the country's reference to the application is referred to as a part of the present application. [Prior Art] There is a laminated semiconductor device. 'The system will be laminated on the base of each piece (see patent documents -, 2). In the manufacturing process of the germanium-type semiconductor device, there is a stage in which a pair of substrates held in parallel for one stack are observed by a plurality of microscopes, and simultaneously aligned and attached (refer to Patent Line 3). ). In addition, there are other methods and devices for mutually aligning the stacked substrates (refer to Patent Document 4 [Prior Art Document] [Patent Document] Patent Document 1: Japanese Patent Laid-Open No. 11-261000 Patent Document 2: Japanese Laid-Open Patent Publication No. 2007-403225, the entire disclosure of which is incorporated herein by reference. The line width of the upper element is as high as the degree of accuracy. Therefore, for the microscope for positional alignment, not only the optical resolution but also the position of the microscope itself is required to have high precision. Here, the method described in Patent Document 1 The two reference marks formed on the substrate are respectively formed, whereby the position alignment of the substrate is reduced, but the positional accuracy of the circuit on the substrate is not in the case of the substrate on which the circuit is formed by heat treatment or the like. Even if the position is aligned with high precision on a specific two points on the substrate, there are cases where the substrate is used. In addition, in the aspect of the present invention, in the aspect of the present invention, a method for manufacturing a substrate alignment method and a stacked semiconductor which can solve the above problems is provided. A combination of the features described in the independent items in the range _ 1 stipulates a more advantageous specific example of the present invention. The device provides a substrate alignment with the first stage, which will be mutually facing each other. One of the corrections C moves toward the surface of the substrate at the same time, and the second: the substrate held by the second stage is: "Microscope, and the surface of the substrate of the first stage is held by the microscope; Display: calibration calibration; and position alignment control mirror and microscope and the relative position of the second microscope to describe the first appearance - position information and 4 201009994 position alignment, which The second microscopic observation of the private position of the two positions of the 吒M屮-· 扪 扪 早 早 早 早 早 早 早 早 早 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( Pre-installed f; 'for formation a plurality of alignment marks that are aligned with each other at the base j; one of the substrates; a drive unit for the two carriers; and a third portion: a control unit that controls the driving of the drive unit, The substrate is aligned, and the driving portion is driven according to the position of the alignment mark of the two substrates, which is detected by the detecting portion, so that the positional deviation of the corresponding reference mark between the two substrates is determined. The control unit is configured to move the pair of stages to drive the driving unit to maintain three or more of the alignments of the two substrates of the pair of stages. The position of the mark is detected by the detecting unit. In another aspect of the present invention, a method of manufacturing a stacked type semiconductor device including the above-described substrate alignment device and a substrate alignment device A bonding device in which a pair of aligned substrates are pressed and joined. According to another aspect of the present invention, a method for aligning a substrate includes: a first holding stage of holding a pair of substrates facing each other in a direction of moving toward a surface of the substrate; 201009994 In the hold phase, the aforementioned - oblique 14c * σ table; calibration phase, _ "the other side of the substrate is held in the second inspection, for the aforementioned: first microscope and second microscope.", microscope And detecting the phase hanging position of the second microscope, wherein the first detecting stage observes the position of the substrate held by the first stage to the alignment mark _ detecting the first information of the fingerprint detection; the second foregoing - a microscope to observe and maintain the aforementioned alignment mark for detecting the alignment mark ^ 摅 - μΐϊ; and a position alignment stage, the root-plate η information and the second position information are different for the position of the substrate In another aspect of the present invention, there is provided a first measurement stage of a substrate alignment side, wherein each of the substrates is supported and supported, and one of the substrates is moved. The substrate of the stage is extended, and between the pair of microscopes, the 5 liter substrate is observed by one of the pair of microscopes, thereby measuring the alignment of the three or more phases formed on the substrate. The relative position of the micro-twist; the second measuring stage moves the other of the pair of stages, and the substrate held on the stage protrudes between the pair of microscopes, and the other side of the pair of microscopes observes a substrate, thereby measuring a relative position of the three or more alignment marks formed on the substrate relative to the microscope of the other; and a positioning stage, according to the foregoing alignment mark relative to the pair, the aforementioned relative of the micromirror Positioning to move the pair of stages so that the positional deviation of the corresponding alignment marks between the pair of substrates is minimized as a whole. 6 201009994 Further, the summary of the above invention does not enumerate all the necessary features of the present invention. Features and sub-combinations of these characteristic groups can also be invented. [Embodiment] Hereinafter, the (a) aspect of the present invention will be described through the embodiments of the invention. The embodiment does not limit the invention of the scope of the patent application. In addition, all of the features described in the embodiments are essential to the solution of the invention. The first figure shows the overall construction of the laminated substrate manufacturing system 100. The laminated substrate manufacturing system 100 includes a normal temperature portion 102 and a high temperature portion 2〇2 which are formed inside a common housing 101. The normal temperature portion 102 faces the outside of the casing 101, and a plurality of substrates 1 The control tray 12 includes a calibration control unit 122 and a position alignment control unit 124. The control unit 12 also controls the overall operation of the multilayer substrate manufacturing system 100. The control panel 120 performs the laminated substrate manufacturing system 1 In the case of power supply, various settings, etc., there are operations that the user operates from the outside. The substrate cassettes 11U12, 113 accommodate a substrate (10) to be bonded to the laminated substrate manufacturing system 100, or a substrate 180 to be bonded to the laminated substrate manufacturing system. Further, the substrate cassette 111112113 is detachably mounted to the housing ιοί. Thereby, a plurality of substrates 18 can be loaded in a batch on the laminated substrate manufacturing system 1GG. Further, the substrate 180 which has been bonded in the laminated board manufacturing system can be collectively recovered. Further, the soil has a 1G2 towel at a normal temperature portion, and a pre-aligned 7 201009994 device 130, an alignment portion 300, a substrate holder 160, and a pair of mechanical arms 171 and 172 are provided inside the casing (9). The inside of the casing 101 is temperature-controlled, and the ambient temperature of the environment in which the laminated substrate manufacturing system 100 is placed is maintained and set at a predetermined temperature. Since the alignment portion 300 is highly accurate, the adjustment range is narrow. Therefore, the pre-aligner 130 temporarily aligns the positions of the respective substrates 180 such that the substrate 180 falls within the narrow adjustment range. Thereby, the positioning of the alignment portion can be surely performed. The alignment unit 300 includes an uploading stage unit 31 and a downloading unit unit 320 that face each other, and a pair of measuring units 33 that are arranged orthogonally to each other. In the alignment portion 300', the loading table portion 31 and the download table portion 320 respectively transport the substrate 180 or the substrate holder holder 190 holding the substrate 18''. The measuring unit 330 measures the position of the moving stage unit 310 or the download stage unit 320 in the direction of the surface of the substrate 180. Further, a heat insulating wall 142 and a shutter 144 are provided around the alignment portion 300. The space surrounded by the heat insulating wall 142 and the shielding plate 144 communicates with the air conditioner or the like and is subjected to temperature management, thereby maintaining the alignment accuracy of the alignment portion 3A. At the alignment portion 3, the pair of substrates 18 are aligned with each other. The detailed structure and operation of the alignment unit 3 will be described later with reference to the fourth embodiment. The substrate mount 160 accommodates a plurality of substrate holders 19 and allows these containers to stand by. The substrate holder 190 holds the substrate 18 一次 one at a time, making handling of the substrate 180 easy. The substrate 180 is held by the substrate holder 19, for example, by electrostatic adsorption. Further, the substrate mount 16A includes a substrate detaching portion. The substrate detaching portion takes out the substrate 18 被 sandwiched by the substrate holder 119 from the substrate holder 190' which has been transferred from the pressing portion 24 to be described later. Also. The substrate 180 for mounting on the multilayer substrate manufacturing system 100 may be formed by forming a device, a circuit, or a die 4 on the substrate, in addition to a single wafer, a compound semiconductor wafer, or a glass substrate. The substrate. Further, there are cases where the loaded substrate 180 is a laminated substrate formed by laminating a plurality of wafers.

Among the pair of robot arms 171, 172, the robot arm 171 disposed on the side close to the substrate cassettes 112, 113 carries the substrate between the substrate cassettes 111, 112, 113, the pre-aligner 130, and the alignment portion 300. 18〇. In addition, the machine = cook 171 also has a machine that flips one of the substrates to be joined. Thereby, the surfaces on which the circuit, the element, the terminal, and the like are formed on the substrate 18 can be joined to each other. The robot arm 172 disposed on the side farther from the substrate cassettes 1U, 112, 113 transports the substrate 18 and the substrate holder 19 between the alignment portion 300, the substrate holder 160, and the air lock (air = ck) 220. . Further, the mechanical 155 also carries the substrate holder 190 into and out of the substrate holder 16''. The temperature portion 202 has a heat insulating wall 210, an air brake 220, a robot arm 230, and a plurality of pressurizing portions 240. The heat insulating wall 210 surrounds the high temperature portion 2〇2 to maintain the high internal temperature of the high temperature portion 202 and block the heat radiation from the high temperature portion 2〇2 to the outside. Thereby, the heat-affected normal temperature portion 102 of the high temperature portion 202 can be suppressed. The robot arm 230 transports the substrate 180 and the substrate holder 190 between any of the pressurizing units 240 and the air brake 22b. The air brake 220 has shielding shutters 222 and 224 that open and close alternately on the side of the normal temperature portion 1〇2 and the high temperature portion 202 side. When the substrate 180 and the substrate holder 190 are carried into the high temperature portion 9 201009994 202 from the normal temperature portion 1〇2, first, the shielding plate 222 on the side of the normal temperature portion 1〇2 is opened, and the mechanical arm 172 carries the substrate 180 and the substrate holder 190 into the air lock 22〇. Next, the shutter 222 on the side of the normal temperature portion 102 is closed, and the shutter 224 on the side of the high temperature portion 2 is opened. Next, the robot arm 230 carries out the substrate 180 and the substrate holder 190 from the air brake 220, and loads it into either of the pressurizing portions 24A. The pressurizing portion 24 is pressed between the heat of the substrate 180 that has been loaded into the pressurizing portion 24A while being sandwiched by the substrate holder 190. The substrate 18 is thereby permanently joined. When the substrate 180 and the substrate holder 19 are carried out from the high temperature portion 202 to the normal temperature portion 102, the above-described series of operations are performed in reverse order. By the series of operations, the substrate 18A and the substrate holder 19 can be carried in or carried out of the high temperature portion 202 before the internal atmosphere of the high temperature portion 2〇2 leaks to the normal temperature portion 102 side. In the plurality of regions in the multilayer substrate manufacturing system 10, the substrate holder 190 is transported to the robot arms 172, 230, the loading table portion 310, and the download table portion 32 in a state where the substrate 18 is held. When the substrate holder 190 holding the substrate 180 is transported, the robot arms 172, 230 hold and hold the substrate holder 19 by vacuum suction, electrostatic adsorption or the like. The second a diagram, the second b diagram, the second c diagram, the second diagram, and the second diagram are diagrams showing changes in the state of the substrate 1 go of the multilayer substrate manufacturing system 1 . As shown in Fig. 2a, when the multilayer substrate manufacturing system 100 is initially operated, the substrates 180 are individually housed in, for example, any of the substrate cassettes 111, 112. Further, the substrate holders 19 are also individually housed in the substrate holder 160. The laminated substrate manufacturing system 100 starts operation, and the substrate 丨8〇 is moved by the robot arm 171 to the next time, and the pre-aligner 130 is pre-aligned and then mounted on the substrate holder 19. Thus, the substrate 18G They are held by the substrate holder 190, respectively. Next, as shown in Fig. 2b, it is prepared to hold the substrate holder 190 one of the substrates 18'', and as shown in the second e-figure, the substrate 18 is mounted on the alignment portion 3''. The substrate 180 and the substrate holder 19 which have been aligned in the alignment portion 3 are formed by a plurality of fasteners 192 embedded in the grooves 191 formed on the side faces of the substrate holder 190 as shown in the second diagram. Link to maintain the status of the positioning. The connected substrate 180 and the substrate holder 190 are integrally transferred and loaded into the pressurizing portion 240. The pressing portion 240 is heated and pressurized, and the substrate 18 is joined to each other for a long time to form a laminated substrate. Then, the substrate 18A and the substrate holder 190 are carried out from the pressurizing portion 240, and are separated from the substrate detaching portion of the substrate holder 16. The substrate 180 that has been taken out from the substrate holder 190 is housed in, for example, the substrate cassette 113 by the mechanical arms 172, 171, the loading stage portion 31, and the download stage portion 32A. The substrate holder 19 of the substrate 18 to be taken out is placed back on the substrate holder 160 for standby. The third drawing shows a schematic plan view of the shape of the substrate 18 as a laminated substrate material. As shown in the figure, a plurality of element regions 186 are formed on the substrate 180 and alignment marks 184 are disposed in the vicinity of the respective element regions 186. Further, the substrate 180 has a notch 182 formed at a specific portion of the edge portion. The notch 182 is disposed to correspond to the crystal orientation of the substrate 180 and the like, and as a whole, exhibits the physical properties of the substantially circular substrate 18 and the anisotropy of the arrangement. 201009994 The alignment mark 184 is used as an index when the element region 186 is formed on the substrate 180. Therefore, the position of the alignment mark 184 is closely related to the position of the element region 186 displaced by the deformation of the substrate 180 or the like. Therefore, when the substrate 180 is laminated, the alignment mark 184 is used as an index of positional alignment, whereby the strain generated by each of the substrates 180 can be effectively compensated. Further, although the element region 186 and the alignment mark 184 are drawn large in the drawing, the number of the element regions 186 formed on the large substrate 180 such as 3 mm is several hundred or more. Further, in accordance with the element region 186, the number of the alignment marks 184 disposed on the substrate 18A is also increased. Further, the alignment mark 184 may be replaced with a wiring, a bump, a seribe line or the like formed on the substrate 180. The fourth figure shows a schematic cross-sectional view of the configuration of the alignment portion 300. The alignment unit 300 includes an uploading unit 310 and a downloading unit 320 disposed inside the frame 301. Further, in the fourth figure, the measurement unit 330 of one side is also seen. The measuring unit 330 includes interferometers 332, 334 that are highly different in height. The frame body 301 includes a top plate 3〇2 and a bottom plate 306 which are parallel to each other and horizontal, and a plurality of pillars 304 which join the top plate 302 and the bottom plate 306. The top plate 302, the pillars 3〇4, and the bottom plate 3〇6 are each formed of a highly rigid material, and deformation is not caused even when the reaction force of the action of the internal mechanism is effective. The loading stage 310 includes a driving unit 350, a sub-stage 314, a spacer 311, and a main stage 312 which are suspended from the lower surface of the top plate 3〇2 in this order. Time 12 201009994 The stage 314 suspends the upper mirror 316 and the upper microscope 318. The main 312 holds and holds the substrate holder 19 of the substrate 180. The drive unit 350 includes a χ drive unit 351 and a 驱 drive unit 352 that move the sub stage 314 in the X direction and the γ direction indicated by arrows in the figure. Further, the submount 314 is integrally coupled to the main stage 312 through the spacer 311. Thereby, the upper mirror 316 and the upper microscope 318 are maintained at a certain position relative to the substrate 18 held by the main stage 312 while moving in the X direction and the γ direction with the substrate 180. The download stage 320 includes a drive unit 340, a sub-stage 324, and a main stage 322 that are mounted on the bottom plate 306. The lower mirror 326 and the lower microscope 328 are mounted on the submount 324. The main stage 322 holds and holds the substrate holder 190 holding the substrate 180. Further, at the download stage 320, the lower microscope 328 is attached to the submount 324 via the vertical actuator 329. In this manner, the lower microscope 328 is only vertically moved up and down relative to the secondary stage 324. Further, a reference mark 321 is also mounted on the main stage 322. The drive unit 340 includes an X drive unit 341, a Υ drive unit 342, and a ζ drive unit 348 that move the sub stage 324 to the X direction, the γ direction, and the Ζ direction indicated by the arrows in the figure. Further, a zero drive portion 344 for rotating the submount 324 in the horizontal plane and a zero drive portion 346 for swinging the submount 324 are included. Further, the crucible driving unit 348 is disposed between the submount 324 and the main stage 322, and has a function corresponding to the spacer 311 of the loading unit 310. The submount 324 is integrally coupled by the crucible driving portion 348 and the main stage 322. In this way, the lower mirror 326 and the lower microscope 328 13 201009994 maintain a certain relative position with respect to the substrate 180 held by the main stage 322 while rotating and rocking with the substrate 180, and to the X direction, the γ direction, and the Z. Move in direction. The measuring unit 330 includes a pair of interferometers 332, 334. The one-side 332 is disposed at the same height as the mirror 316 of the loading stage 310. Thereby, the interferometer 332 uses the mirror 316 to correctly measure the position of the sub-stage 314 in the X direction. Further, the measuring portion 330 which does not appear in this figure also has the same configuration to measure the position of the Y-direction of the sub-stage 314. Further, the other interferometer 334 is disposed at the same height as the mirror 326 of the download stage 32A. Thereby, the interferometer 334 correctly measures the position of the sub-stage 324 in the X direction using the mirror 326. The measuring portion 330 which does not appear in the figure also has the same configuration, and the position of the sub-stage 324 in the Y direction is measured. The fifth diagram shows a state in which the loading stage unit 310 and the download stage unit are moved to the position where the reference mark 321 is viewed from the upper microscope 318, and is drawn in the vicinity of the reference mark 321 . As shown in the figure, the uploading table portion 310 and the downloading table portion 320 can be appropriately moved, whereby the reference target 321 can enter the field of view of the upper microscope 318. Further, the reference mark 321 is disposed directly above the lower microscope 328 and is formed on the through hole 323 of the main stage 322. As a result, the fiducial marker 321 also enters the field of view of the lower microscope 328. Further, the height of the reference mark 321 is adjusted to be the same height as the surface of the substrate 180 mounted on the main stage 322 of the lower stage portion 320. Further, in the state shown in the fifth figure, the lower microscope 328 has been lowered by the boring 201009994 329'. The focus is on the reference mark 32, and the microscope is mounted on the substrate 180 of the download stage 320 as seen later. . ^ In the above state, the microscope 318 and the lower microscope 328 are in a state of being aligned with the same reference numerals 321 . The sixth drawing is a cross-sectional view showing the structure of the above-described reference mark 321 . The quasi-marker 321 includes a support frame 421, a transparent substrate 422, and an opaque film 423.

More specifically, it can be formed as a transparent substrate 422 using a glass substrate or the like. The opaque film 423 may be, for example, a metal film or the like. The opaque film 423 is thinned' whereby the observed position does not shift even in the case of observation from the upper microscope 318 or from the lower microscope 328. Further, a structure in which the substrate 422 is attached to the main stage 322 through the support frame 421 can be used, whereby the effective height of the reference mark '321 can be finely adjusted. Further, the reference mark 321 has a transparent region in which the transparent substrate 422 is exposed. Thereby, the alignment mark 184 or the like located on the opposite side can be observed by penetrating the reference mark 321 , but in this connection, the tenth figure will be described later. The seventh figure shows a cross-sectional view of other configurations of the reference mark 321 . This fiducial mark 321 is formed by an opaque substrate 425 having a knife edge 427. The blade-shaped portion 427 is formed by the opposite of the line connecting the upper micromirror 318 and the lower microscope 328. Such an opaque substrate 425 can be fabricated, for example, using dry etching to process a wafer. The end of the blade portion 427 is very thin, 15 201009994 so even when viewed from the upper microscope 318, or viewed from the lower microscope 328, the position of the observation is not offset. Further, the inner side of the blade-shaped portion 427 is penetrated, and the lower microscope 328 can also observe the opposite side of the reference target 321 . The eighth diagram is a flow chart showing the procedure for aligning the substrate 180 using the alignment portion described above. First, as shown in the fourth figure, the uploading unit 310 and the downloading unit 32 are shifted to different positions, and the lower stage of the main stage 312 of the loading unit 310 and the main stage 322 of the downloading unit 320 are placed. The upper portions are respectively opened, and the main stages 312, 322 are respectively loaded with the substrate 18 held by the substrate holder 19 (step sl1). Next, the substrate 18 is observed by a microscope or the like which is not shown, and the 0 driving unit 346 of the download stage 320 is operated to make the pair of substrates 180 parallel (step S102). Hereinafter, the substrate 18A is aligned only in the x-direction and the gamma direction. Next, as shown in the fourth and fifth figures, the reference mark 321 is simultaneously observed by the lower microscope 328 and the upper microscope 318, whereby the relative positions of the lower microscope 328 and the upper microscope 318 are found (step sl3). In this state, the calibration control unit 丨22 measures the position of the uploading unit 31〇 and the downloading unit 320, and initializes the interferometers 332, 334 with the measurement 値 as the initial ( (step S104). + Next, the loading stage unit 310 and the download stage unit 320 are operated, and the upper microscope 318 detects two or more alignment marks 184 held by the substrate 18 of the download stage 32A by the lower microscope 328. For the alignment of the three or more substrates 180 held in the download stage 32"" § 184 is detected (step si 〇 5) 201009994 ninth figure is compared with the fourth figure green to perform the aligning step of step S1 〇 5 In the state of 300, as shown in the figure, the driving unit 350 of the loading table unit 31 and the driving unit 340 of the downloading unit 320 can be operated to respectively move the surface of the substrate 180 held by the downloading unit 320 into the surface. The field of view of the microscope 318 causes the surface of the substrate held by the loading stage 31 to enter the field of view of the lower microscope 328. The tenth drawing shows an enlarged view of the vicinity of the microscope 328 in the state shown in the ninth figure. As shown, the vertical actuating piano 329 has been actuated 'by thereby moving the focus of the lower microscope 328 to the surface of the substrate 180 secured to the loading stage 310. Thereby, the lower microscope 328 can be held by the reference mark 321 Based on the uploading section 31 The surface of 180 is precisely observed. In addition to the upper microscope 318 and the lower microscope 328, the alignment unit 300 has a low-magnification microscope for observing the wide range of the surface of the substrate 18, but the low-magnification microscope has been omitted. The resolution of the low-magnification microscope does not reach the alignment accuracy of the substrate 18〇, but the position of the alignment mark 184 and the element region 186 on the substrate 180 can be recognized. Since it is used together with such a low-magnification microscope, The microscope 318 and the lower microscope 328 can efficiently detect the alignment mark 184. Returning to the procedure shown in the eighth figure, after the upper microscope 318 and the lower microscope 328 detect the alignment mark 184 of the substrate 18 facing the substrate 'Measure the position of the main stage 3°i2 at the time with the interferometers 332, 334' to thereby know the relative position of the solution mark 184 with respect to the aforementioned initial flaw. The relative position of the detected alignment mark 184 is stored at 17.

201009994 The position alignment control unit 124 (step S106). For example, when the positional information of the three or more alignment marks 184 is obtained for each of the pair of substrates 18, the position alignment control unit 124 can calculate the positional alignment of the substrate 180 based on the position information. The drive unit 34 〇, 35 〇 the amount of operation (step si 〇 7). That is, the substrate 18 to be bonded is subjected to a lot of processing and processing to form components and the like. Therefore, the substrate 18 is deformed in various ways. In addition, the distribution of deformation on one of the substrates 18 is not uniform. Therefore, when the substrate 180 is aligned, even if the positions of the specific alignment marks 184 corresponding to the pair of substrates 18 are aligned, the positional deviation of the other portions of the substrate 180 may be large. However, the processing of the following is performed for the relative position information of each of the three or more alignment marks 184 corresponding to each other between the pair of substrates 18'. Thereby, the alignment marks 184 which are integrally formed on the substrate 180 can be made. The degree of positional offset is limited to a minimum. The alignment method will be described below. In the case of a pair of wafers, the amount of parallel movement (Tx, Ty) and the amount of rotation to be rotated by 0 in one side with respect to the other side are different in the following manner. The positional coordinates (Axi, Ayi) of the alignment mark measured relative to the reference coordinate system have the following relationship with the transformed position coordinates (Mxi, Myi). In addition, "丨" indicates the number of the alignment mark. [Number one]

Cos^ sin^Y sin ^ cos Θ

201009994 Next, the position of one of the substrates 18 〇 relative to the reference coordinate system is regarded as (Dxi, Dyi) 'the minimum function F is the following function: ', and the amount of movement of the other substrate 180 is determined (Τχ, Ty And the amount of rotation [number two] ❹, (, exhaust) = Σ ((Κ) 2 - mJ} Figure 11 shows the operation below the alignment unit 300. As shown in the figure, the position alignment control unit 124 Based on the initial 値 of the relative positions of the upper microscope 318 and the lower microscope 328, the driving units 340 and 350 are operated in accordance with the calculated movement amount (Tx' Ty) and the rotation amount θ, whereby the pair of substrates 180 can be positionally aligned. In addition, in order to further improve the positional alignment accuracy, a plurality of reference marks 321 may be provided, and the phase of aligning the relative positions of the upper microscopes φ 318, 328 may be performed a plurality of times (step S104). When the operation unit 310 or the download station unit 32 performs a large operation, when the operation direction is switched to the X direction or the Y direction, the step from the stage 104 may be repeatedly performed. The eleventh diagram illustrates the alignment unit 300. The second action, as shown in the figure, The Z driving unit 348 is operated such that the substrates 180 aligned in the X direction and the Y direction are joined to each other. That is, the main stage 322 of the download stage 320 is raised to abut the pair of substrates 180. 'Furthermore' adds the driving force of the z driving unit 348, whereby the substrate 180 can be bonded at the time of 201009994 (step S1〇9). 18 0 ί ΓΓίίίL The position of the pair of substrates is aligned with the position === The alignment unit 3〇° conveys==.: and the buckle _ _, the material is aligned by the substrate holder 190 and the fastener 192.

Further, in the above example, the structure is that the loading table portion and the downloading portion 320 each have driving portions 350, 340 for moving the main stages 312, 322: in this case, it is also preferable that the driving unit Γ 50, 34 | The amount of movement of both the uploading station unit 310 and the downloading station unit 320 is made equal. Thereby, the consumption of components can be equalized, thereby extending the life of the machine. Further, the driving unit 350 of any of the loading stage unit 310 and the download stage unit 32 (for example, the loading stage unit 310) can be omitted, and the alignment of the substrate 180 can be performed even in a state where the main stage 312 is fixed. Further, for example, it may be of a configuration in which the γ driving unit 352 of the loading table unit 31 is omitted, and the positioning unit 310 is specifically aligned with respect to the X direction. The downloading unit 320 is specifically aligned with respect to the Υ direction. However, the main stages 312, 322 of both sides can be moved, thereby reducing the movement time of the required amount of movement to half. Therefore, the drive units 350 and 340 can be provided on both the uploading unit 310 and the downloading unit 320, thereby increasing the throughput of the aligning unit 300. Further, the configuration made in the above example is a fixed reference mark 321, which raises and lowers the lower microscope 328. However, the configuration can be varied, for example, by fixing the microscope 328 and optically changing the focal length, or by entering or exiting the fiducial marker into or out of the field of view of the microscope 318 or the lower microscope 328. Further, it is also possible to adopt a configuration in which an operation of measuring the alignment marks 184 of the respective substrates 180 and performing a position alignment operation on the pair of substrates 180 are performed by using other devices. The thirteenth drawing shows a perspective view of the alignment portion 3〇〇 having other configurations. The alignment unit 300 has a measuring unit 360 that is attached to the bottom plate 3〇3, a pair of microscope units 370, and a joint unit 380. Further, the robot arm 390 is disposed between the weir detecting portion 360 and the joint portion 380, and the drawing is prevented from being complicated. The robot arm 390 is omitted in the thirteenth drawing (see Fig. 14). The measuring unit 360 is formed inside the rectangular frame which is formed by a pair of struts 361 standing upright from the bottom plate 303 and a horizontal guiding portion 363 by joining the upper end and the lower end of the struts 361, respectively. The guide portions 363 each suspend or support the X drive portion 362, the Z drive portion 364, and the main stages 312, 322, respectively. In the measuring unit 360, the X driving unit 362 individually moves the z driving unit 364, the main stages 312 and 322, and the substrate holder 190 and the substrate 180' mounted on the main stages 312 and 322 along the guiding unit 363. Further, the Z driving unit 364 vertically raises and lowers the main stage 312, 322 and the substrate holder 190 and the substrate 180 mounted on the main stages 312 and 322. The substrate holder 190 holding the substrate ι8〇 is mounted on the main stage 312, 322, respectively. The substrates 180 each have a pair of alignment marks 184. Furthermore, the reference mark 321 is also mounted on the main stage 322 of one of the units. 21 201009994 The reference mark, 321 111 is fixed and held in the substrate holder 19. Substrate 18. The same height of the surface. Since the main stage 322 has a through hole penetrating in the thickness direction below the reference mark 321, the reference mark 321 can be viewed from above the main stage 322 or from below. Further, the reference mark 321 can adopt any of the configurations shown in the sixth figure and the seventh figure. A pair of microscope units 370 are disposed on both sides of the measuring unit 36A. The microscope assembly 370 has a gamma drive unit 372, a post 374, and microscopes 376, 378, respectively. The Y drive unit 372 moves the stay 374 in the direction in which the guide portion 363 of the measurement unit 360 extends. The struts 374 each support a pair of microscopes 376, 378. That is, a pair of microscopes 376, 378 are fixed to the inside of the notch formed in the middle of the support 374, and face each other up and down. The focal point F of the microscope ^ 376, 378 is located at a common point between the microscopes 376, 378. On the other hand, the joint portion 380 includes an X drive portion 381, a Y drive portion 382, (9 drive portion 384, Z drive portion 388, and a pair of flat plates 389 and one) which are all disposed inside the frame 383 in the stacking direction. The main stage 312, 322. The main stage 312, 322 is each loaded with the substrate holder 190 holding the substrate 180. The X driving portion 381 and the Y driving portion 382 drive the main stage 312, 322 in the X direction or the Y direction indicated by an arrow in the figure. The drive unit 388 can move the main stage 322 by moving the main stage 312 in the Z-axis direction. The joint unit 380 can make the X drive unit 381, the Y drive unit 382, and the cymbal. The driving unit 384 operates to move the substrate 22 201009994 180 mounted on the main stage 322 in any direction to position the substrate 180 mounted on the main stage. Further, the z driving unit 388 can be made. [Operation] Thereby, the pair of substrates 180 aligned with each other are abutted and joined to each other. Fig. 14 is a plan view of the alignment portion 3〇〇 shown in Fig. 13. As shown in the figure, the alignment portion 3 Further, a robot arm 390 is provided between the measuring unit 36A and the joint portion 38A. The arm 390 has a further portion 392 and an arm portion 394. The fork portion 392 holds and holds the substrate holder 190 holding the substrate 180. The arm portion 394 moves the further portion 392 holding the substrate holder 190 in an arbitrary direction. In the 390, the substrate ι8 and the substrate holder 190', which are measured in the measurement unit 36, are transferred from the main stages 312 and 322 of the measuring unit 360 to the main stages 312 and 322 of the bonding unit 380. For the layout, the robot arm 172 may be used to carry the substrate 18A and the substrate holder 190 into or out of the alignment portion 3A. In this case, the robot arm 390 of the alignment portion 3A may be omitted. Φth fifteenth ath, fifteenth bth diagram, fifteenth cth diagram and fifteenth diagram are for explaining the operation of the measuring unit 360 having the alignment unit 3〇〇 having the above-described structure. In addition, the alignment portion 300 further includes a pair of mirrors 367 which are hidden in the pair of the pillars 361 in the thirteenth and fourteenth diagrams, and the pair of mirrors 366, 368 and the interferometers 366, 368 are oppositely disposed on the side surfaces of the main stages 312, 322. The role of these interferometers 366, 368 and mirror 367 will be described later. First, as shown in Fig. 15a, the X driving unit 362 is caused to operate, respectively. The main stage 312, 322 is moved to a position close to the mutually different pillars 361 23 201009994. Therefore, the underside of the main stage 312 and the main stage The upper surface of the 322 is open. In this state, the substrate holders 190 holding the substrate 180 are respectively loaded on the main stages 312, 322. Next, as shown in Fig. 15b, under the control of the calibration control unit 122, the lower side is made The Z drive unit 364 of the main stage 322 operates to raise the main stage 322. Therefore, the reference mark loaded on the main stage 322 will be as high as the focus F of the microscopes 376, 378. Next, the X driving unit 362 is operated to move the main stage 322 to the position where the reference mark 321 enters the field of view of the microscopes 376, 378. In this state, a pair of microscopes 376, 378 can be used to observe the common reference mark 321 ', whereby the calibration control portion 122 precisely detects the positions of the pair of microscopes 376, 378. Further, although the microscopes 376 and 378 are respectively fixed to the stay 374, the position of the stay 374 may be changed due to environmental conditions such as temperature, inclination of the stay 374 due to tolerance of the γ drive unit 372, and the like. However, as described above, the common reference mark 321 can be observed before the position of the alignment mark 184 is measured, thereby grasping the positional relationship of the microscopes 376, 378. Next, as shown in Fig. 15c, the X driving unit 362 is further operated to move the main stage 322 so that the alignment mark 184 of the substrate 180 enters the field of view of the upper microscope 376. Further, the reference mark 321 is located at the same height as the surface of the substrate 180, so that the surface of the substrate 180 passes through the focal plane of the upper microscope 376. In addition, during movement of the main stage 322, the mirror 367 and one of the interferometers 368 are used to properly measure the movement of the main stage 322 24 201009994. Thereby, the position of the alignment mark 184 of the substrate 180 can be measured based on the position of the microscope gw constituted by the reference mark 321 . The position information of the measured alignment mark 184 is stored in the position alignment unit 124. Next, as shown in Fig. 15d, the lower main stage 322 is returned to the original position while the upper main stage 312 is moved. That is, the Z driving unit 364 is first operated to move the surface of the substrate "o to the same height as the focus F of the microscopes 376, 378. Next, the X driving portion 362 is operated to cause the substrate 18 to be twisted on a pair of 376, 378. Move between. • At this time, the mirror 367 and the interferometer 366 provided on the upper side of the main stage 312 can be used to accurately measure the amount of movement of the main stage 312. Therefore, the lower side can be used. The position of the 184 is observed by the microscope 378. The position of the measured alignment mark 184 is stored in the position alignment control unit 124.

The XY driving unit 382 and the 0 driving unit 384 are operated in response to an instruction from the alignment control unit 124, and the pair of substrates 180 are aligned with respect to 2010X and 25201009994, and the positions of the corresponding alignment marks 184 are aligned. . Further, the Z driving unit 388 is simultaneously operated to bring the pair of substrates 180 into contact with each other to apply a high pressure, thereby joining the pair of substrates 180. Further, the alignment unit 300 of this aspect includes the measurement unit 360 and the bonding unit 380', respectively, for individually performing position measurement of the alignment mark 184 and bonding of the substrate 180. With such a configuration, the X driving unit 362 and the Z driving unit 364 can be miniaturized in the measuring unit 360, and the moving range of the microscopes 376 and 378 can be enlarged. Further, at the joint portion 38, it is possible to perform correct alignment using the large member having the south strength and bonding of the substrate 180 by the south pressure. However, if the strength of the member can be ensured, the γ drive unit 382, the Θ drive unit 384, and the like can be added to the structure of the measuring unit 360, and alignment and joining can be performed. Fig. 16 is a schematic plan view showing the entire structure of another laminated substrate manufacturing apparatus 6'. The multilayer substrate manufacturing apparatus 6A includes a wafer stocker 610, a wafer pre-alignment apparatus 622, a wafer holder pre-alignment apparatus 624, a main control unit 630, a wafer holder 640, and a pressurizing apparatus 650. The cooling device 660, the wafer loader 672, the wafer holder 676, and the alignment device 700 are separated. Each device is described below individually. The wafer stocker 610 includes a wafer stocker 614, 616 for accommodating a plurality of substrates 180 to be bonded, and a stacked substrate stocker 612 for accommodating a plurality of bonded substrates 180. The stacked substrate hopper 612 and the wafer stockers 614 and 616 are detachably mounted to face the outside of the laminated substrate manufacturing apparatus 600. Thereby, the substrate 180 can be loaded on the laminated base 26 201009994 plate manufacturing apparatus 600, and the bonded substrate 180 can be recovered. The wafer stockers 614, 616 are loaded with the same type of substrate 180, and in some cases, substrates 180 of different types. Wafer pre-alignment device 622 performs less accurate but rapid pre-alignment on substrate 180 that has been removed from wafer stores 614, 616. Thereby, in the case where the position alignment device 700 described later is loaded with the substrate 180, it is possible to avoid a large shift in the position of the substrate 180. In addition, the operating time of the position aligning device 700 can be shortened. The wafer holder 640 is disposed inside the multilayer substrate manufacturing apparatus 600 to accommodate a plurality of substrate holders 190. The substrate holder 190 adsorbs the support substrate 180. Further, the substrate holder 19 is used repeatedly inside the multilayer substrate manufacturing apparatus 6A except for the maintenance period which is performed in a predetermined cycle. Further, in some cases, when a single-size substrate holder 19 is used for 'all substrates 180', different substrate holders 19 are used depending on the type of the substrate 180. The wafer holder pre-alignment device 624 is disposed adjacent to the wafer holder stock 64 〇. The wafer holder pre-alignment device Q4 places the substrate holder 19 at a set position, whereby the mounting position of the substrate 18A with respect to the substrate holder 19 is substantially constant. Thereby, the working time of the position aligning device 700 can be shortened. The position alignment device 700 performs high-precision alignment with each other on the pair of substrates 18G held by the substrate holder 19, and then bonds the two together. The high precision referred to herein means the accuracy which is ensured in the case where the substrate (10) = several pieces of force σ are laminated, and in some cases, the submicron level. 27 201009994 just ===, the position alignment of the household 1 says that the position of the two is the same on the pair of substrates, and the connection between the two is made to one 18 〇Γ, ϋ - The substrate of the square is placed at 700 获得 to obtain an effective electrical connection. The position alignment device and the operation will be disposed in the vicinity of the position alignment device 7〇〇 with reference to the pattern of the seventeenth figure, and the position alignment device is employed for positioning and pasting. After the bonding, 80 is pressurized, and the substrate (10) is permanently joined to form a laminated soil plate. Therefore, there are cases where the bonded substrate 180 is heated while being heated. The separation cooling device 660 is disposed adjacent to the pressing device 65A. The separation portion is placed 660 to cool the substrate i 19 and the bonded substrate 18, and the substrate holder 19 is removed from the bonded substrate 18A. The bonded substrate 180 is housed in the stacked substrate storage unit 612 as a laminated substrate. The cooled substrate holder 190 is returned to the wafer holder 640 for alignment and bonding of the next substrate 180. The wafer loader 672 is a multi-joint robot, and can also have six degrees of freedom sinking, 2, 0, and 6»丫, (92) arms. In addition, wafer loader 672 moves along rail 674 in the direction indicated by arrow X in the figure. The wafer loader 672 can be loaded with the substrate 180 or the substrate 180 bonded to the laminated substrate. However, it is not possible to transport the substrate holder 19 having a mass much larger than the substrate 180 or much larger than the laminated substrate. Therefore, the wafer loader 672 primarily transports the substrate 180 between the wafer stocker 610 and the wafer pre-alignment device 622. 28 201009994 Wafer mount 676 is also a multi-joint robot. It can also have an arm with six degrees of freedom (again, 丫, 2,0\, 0丫, <9 2). In addition, the wafer holder 676 is moved substantially along the rail 678 in the direction indicated by the arrow Y in the figure. The wafer holder 676 can withstand the transfer load of the substrate holder 190 and can also transport the substrate 180 separately. Therefore, the substrate holder 190 is transferred between the wafer holder 640 and the wafer holder pre-alignment device 624, or between the separation cooling device 660 and the wafer holder 640. Between the pre-alignment device 624 to the alignment device 7A, between the alignment device 7 to the press device 650, or between the press device 650 and the split cooling device 660 The substrate holder 9 and the substrate 180 are transferred. Further, in some cases, the laminated wafer is transferred from the separation cooling device 660 to at least a part of the stacked substrate storage unit 612. The main control device 630 controls the above-described laminated substrate manufacturing apparatus: the operation of the entire body: that is, the main control unit 63 and the wafer loader b, the wafer mounter 676, the wafer pre-alignment device 622, and the crystal The individual control devices such as the circle 624 perform signal reception to control the integration of the laminated substrate manufacturing apparatus. In addition, 'will accept and handle the operation of Bu. Furthermore, the main control is followed by the pericardium „[5' The position alignment control unit controls the position alignment operation to be performed. The π device 700 shows the position alignment device 7 〇〇 circle. Position alignment The device 700 includes a base 71, a:: 29 201009994 720, 760, a tilt drive unit 730, a download station 740, an uploading stage 750, and a frame 770, and a pair of microscope assemblies 81A, 82A. The base 710 is horizontally fixed to The inside of the laminated substrate manufacturing apparatus 6 is disposed. The in-plane driving unit 72A, the tilt driving unit 730, and the downloading station 740 are sequentially stacked on the base 710.

The in-plane driving unit 720 includes a rotation driving unit 722, an X-direction driving unit 724, and a γ-direction driving unit 726 which are stacked one on another. Thereby, the in-plane driving unit 720 can rotate the attached tilt driving unit 730 in a horizontal plane parallel to the base 71, and move in a two-dimensional manner in the horizontal direction. The tilt drive 730 includes a pair of flat plates 732, 736 and three vertical actuations $734 sandwiched between the flat plates 732, 736. Thereby, the in-plane driving portion 720 compensates for the tilt of the upper flat plate 73 with respect to the horizontal plane. The stage 740 has a horizontal actuator (not shown) and is vertically actuated to shift the download stage 740 relative to the tilt drive portion 73 in the vertical and horizontal directions and also in the horizontal direction (Χ direction). The pull-up download stage 740 is held on the substrate 18 of the substrate holder 190. This 'download stage 74G can project the mounted substrate (10) toward the lower side of the microscopes 818, 828 which will be described later. The skeleton 770 has a horizontal portion 1 separated from the base 71 (), and the in-plane driving portions 760 and I are sequentially suspended below the horizontal portion of the it?. The in-plane driving unit 76 includes the x-direction driving unit 764 and the Y-direction driving unit %. The in-plane driving unit 鸠 rotates the horizontal movement in the horizontal plane 30 201009994 in parallel with the base. . The upload σ 750 has an unpainted horizontal actuator and a vertical actuator. The loading stage 750 advances and retreats in the vertical direction (ζ direction) and the horizontal direction (X direction) with respect to the in-plane driving unit 760. Further, the loading stage 75 保持 holds the substrate 180 held on the substrate holder 19 下面 underneath. Thereby, the loading stage 750 can project the mounted substrate 18 to the upper side of the microscopes 816, 826 which will be described later. The microscope assembly 810 has a linear drive portion 812, a post 814, and a pair of microscopes 816, 818. The linear drive unit 812 carries the support 814 in the horizontal direction (γ direction) forward and backward on the base 710. Here, the advance and retreat directions of the downloading station 7^1 and the loading table 750, and the advance and retreat of the pillar 814 are the parent forks. Therefore, the stay 814 moves forward and backward with respect to the side where the extended downloading station mo and the loading table 750 are moved forward and backward. The standing pillar 814 has a notch portion 811 in the middle of the height direction. The notch 邛 811 has a rectangular shape, and is fixed to the microscope 816, 818 facing each other on the upper side and the lower side of the inner side. Thereby, the substrate 180 loaded on the downloading station 740 or the loading table 750 can be observed by either of the pair of microscopes 816, 818 when the downloading station 74 or the loading station 75 is extended. Further, the position aligning device 700 is provided with a microscope assembly 82A including another set of microscopes, 828. The microscope assembly 82A has a straight line, a moving portion 822, a post 824, and a pair of microscopes 826, 828. The linear drive: P 822 carries the advance and retreat of the strut 82 in the horizontal direction on the base 71〇. The advancement and retreat directions of the microscope assembly 81A, 82() intersect with the advance and retreat directions of the download station 740 and the loading table 750. Thereby, a pair of microscopes 8i6 8i8 31 201009994 and microscopes 826, 828 are moved between the observation position and the avoidance position, wherein in the observation position, the alignment mark 184 of the substrate 180 which has been extended by the download stage 740 or the loading stage 750 Falling into the field of view, the alignment marks 184 of the substrate 180 that have been extended by the download station 740 or the uploading station 750 are not in view. The pillar 824 has a notch portion 821 in the middle of the height direction. The notch portion 821 has a rectangular shape 'fixed against the microscope 826, 828 facing each other on the upper side and the lower side of the inner side. Thereby, the substrate 180 loaded on the downloading station 740 or the loading table 750 can be observed by either of the pair of microscopes 816, 818 when the downloading station 740 or the loading station 750 has been extended. In addition, the focus of one of the microscope components 810, 820 on the microscopes 816, 818, 826, 828 is in a mutually shared position. Therefore, when the surface of the substrate 180 is observed by the microscopes 816, 818, the lower stage 740 or the loading stage 750 is displaced in the Z direction, and the surface of the substrate 180 is adjusted to be at a common focus position. Further, the position aligning device 700 is additionally provided with a low magnification microscope (not shown). The low magnification microscope observes the entire surface of the substrate 18 which has protruded toward the microscope assembly 810, 820. The resolution of the low magnification microscope does not reach the alignment accuracy of the substrate 180, but the approximate position of the alignment mark 184 and the element region 186 on the substrate 18 is recognized. In combination with such a low magnification microscope, it is possible to easily grasp the positional correction of the substrate 180 when the alignment mark 184 to be observed is not in the field of view of the microscope 816, 818, 826, 828. In addition, in each of the microscope assemblies 810, 820, one of the opposing pairs of microscopes 816, 818 (microscopes 826, 828) pre-measures the deviation of the relative position 32 201009994 from each other and records. Therefore, the relationship between the position of the object observed by the lower microscopes 816, 820 and the position of the object observed by the upper microscopes 826, 826 can be accurately obtained from the positional relationship of the microscopes 816, 818, 826, 828. Fig. 18 is a perspective view showing one of the actions of the position aligning device 7. As shown in the figure, a pair of microscope assemblies 81A, 820 are driven by linear drive portions 812, 822 to move symmetrically with each other. By this, you can

The spacing of the struts 814, 824 is varied to change the area observed by the microscopes 816, 818, 826, 828. Fig. 19 is a perspective view showing another operation of the position aligning device 7. As shown in the figure, the downloading station 74 can be extended from the in-plane driving portion 72 and the tilt driving portion 730 in the X direction, thereby extending the downloading station 74 to the microscopes 816, 818 of the microscope assembly 810 and Micro ΐΐΓ, between the microscope 826'828. Thereby, the substrate 190 is held on the substrate 180 τ above the download station 740, and the substrate 190 is driven by the in-plane drive. Thereby, the substrate 740 can be viewed by the microscope 818, 828 to rotate or horizontally move the download stage 740.觐Single soil 2: The figure shows a different perspective view of the position alignment device 700. As shown in the figure, the boat avoidance D 74〇 above the ## 730 has been retracted to the tilt drive

The square 6 and the mountain 750 extend from the in-plane driving portion 760 toward the X direction. In this way, the microscope 816, 818 between the top and the bottom of the microscope is extended to the microscope assembly 13 and the microscope assembly 820 of the microscope assembly 820 201009994 = ^ 828. Therefore, the substrate 180 that is held under the loading table 75A through the substrate holder 19 can be held by the microscopes 816, 826 having the upward field of view in the respective microscope assemblies 810, 820. Further, the loading table 750 is supported by an in-plane drive 760 suspended from the skeleton 770. Thereby, the base 180 can be observed by the microscopes 816, 826 while the loading table 750 is rotated or moved horizontally. The tens of the drawings show the recording of the program in which the alignment device 700 is aligned with the substrate 180. After the wafer holder pre-alignment device 624 has been held on the substrate 18 of the substrate holder 190, it is first loaded into the loading table in the position alignment device 700 (step S201). Further, the wafer stage pre-alignment device 624 is next held on the substrate 18 of the substrate holder 19, and the alignment device 7 is loaded on the download stage 74 (step S2〇2). The holding of the substrate 18 by the substrate holder 190 is performed, for example, by electrostatic adsorption. Further, the loading table 75A and the download table 74A are held by the substrate holder 190 by, for example, vacuum suction. However, the present invention is not limited to these methods, and the substrate 18 and the substrate holder 190 and the loading table 750 or the download table 740 may be integrated with each other, and may be fixed by any method in which the alignment operation is not performed in the following position alignment operation. Next, the tilting driving portion 73 is used to make the substrate 180 held on the loading stage 75A and the substrate 18 held on the downloading table parallel to each other (step S203). Thereby, the positional alignment of the pair of substrates 18 below can be limited to the horizontal plane based on the in-plane driving portions 720, 760. Next, the microscope assembly 81A, 82A is fixed (step S2〇4). At this time, the interval between the pillars 814, 824 is adjusted by the linear driving portion 812, and the micro-mirror assemblies 810, 820 are fixed to positions at which three or more alignment marks 184 of the substrate 180 can be observed. Thereafter, the microscope assemblies 810, 820 are fixed and not moved until the bonding of the pair of substrates 180 is completed. Next, as shown in Fig. 19, the download station 740 is extended between the microscopes 816, 818 and between the microscopes 826, 828, and the substrate 180 loaded on the download station 740 is observed by the downward microscope 818, 828.

The mark 184 is aligned (step S205). At this time, the specific alignment mark 184 to be observed can be easily selected from the plurality of alignment marks 184 formed on the substrate 18 by referring to the image of the substrate 180 as seen by the aforementioned low magnification microscope. From the twenty-second to twenty-seventh drawings, a schematic view of the state in which the alignment mark 184 is observed by a microscope is shown. As shown in the twenty-second figure, if the position of the microscope assembly 81〇, 820 is appropriate, In the case where the download station 74 has been extended in the x direction, the alignment mark 184 is observed by 18, 828. Thereby, the position of the fixed microscope 81 (10) is determined. Relative to the display μ, β is different and redundantly aligned with the target S206). The relative position information of the microscope 818, 828 (step, in addition, the drive of the in-plane drive unit θ drive unit 720 itself moves:: can be based on The in-plane may be measured by a linear encoder or the like for controlling the in-plane, the driving amount, and the like. The inner driving unit 720 provided in the second embodiment may also be an interferometer independent of the surface sag. Waiting for the amount of movement of the download station 74〇35 201009994. Next, as shown in the twenty-third figure, moving the download station 740 can observe the position of the other alignment marks 184 of the substrate 18 by the microscope 818, 828, according to the surface The driving amount of the inner driving unit 72〇 is recorded The position of the lower alignment mark 184 relative to the microscope 818, 828 is secondary. In addition, as shown in the twenty-fourth figure, in some cases, the substrate 18 has been rotated by a rotation angle α in the plane including the substrate 18〇. In such a case, as shown in Fig. 25, in order to observe a set of alignment marks 184 by the microscopes 818, 828, the download stage 740 is rotated (a) by the in-plane driving portion 72A. In this case as well, the rotation angle α of the substrate ι80 can be recorded in accordance with the driving amount of the in-plane driving unit 720. Further, as shown in the twenty-sixth and twenty-seventh drawings, three microscopes 818 are used to observe three. The above alignment mark 184 is used to record the relative position information of the substrate 180 held by the download stage 74A with the position of the microscope 818 as a reference. φ Next, the download stage 740 is moved away from the field of view of the microscope 818, 828, and retracted to the tilt drive unit. Above the 730, as shown in the twentieth diagram, the loading station 750 is extended between the microscopes 816, 818 and between the microscopes 826, 828, and the substrate 180 held under the loading table 750 is observed by the upward microscope 816, 826. Alignment mark 184 (step 5207). Then, the relative position information of the plurality of alignment marks 184 is recorded in the same manner as the substrate 180 held at the download station 740 (step 5208). Thus, the position of the fixed microscope 818 is used. Reference Record, 36 201009994 The relative positional information of the three or more alignment marks 184 of the substrate 180 loaded on the download station 740, and the relative position information of the upper alignment marks 184 of the substrate held by the loading table 75A. The position alignment information is calculated based on the interlocking vertical information, which is an offset that should be compensated for when the pair of substrates 18 are aligned (step S209). That is, as described above, the substrate 18 to be bonded is processed and processed to form an element or the like. Therefore, various strains are generated on the substrate 180. In addition, the strain distribution on one of the substrates 18 is not uniform. Therefore, in the case where the substrate 180 is aligned, sometimes the positional deviation of a part of the substrate 18 is increased even if the positions of the specific alignment marks 184 corresponding to the pair of substrates 180 are made uniform. However, the following processing is performed on the relative position information of each of the three or more alignment marks 184 corresponding to each other with respect to the pair of substrates 18, thereby thereby shifting the position of the alignment mark 184 of the substrate 180 as a whole. Limited to a minimum. In this manner, when the pair of substrates 180 are aligned, the position of the substrate 180 and the rotation of the surface are measured for each of the three or more alignment marks 184 with reference to the position of one of the microscope units 81. The relative position information is used to calculate the positional alignment information of the corresponding alignment mark 184 between the substrates 180 based on the relative position information to minimize the overall position. The position alignment can be performed between the downloading station 740 and the loading table 75A in accordance with the position alignment information, whereby the pair of substrates 180 can be accurately positioned to the position 37 201009994. The one of the downloading station 740 and the loading station 750 can be aligned with the other side according to the positional alignment information calculated as described above, thereby performing alignment and aligning the pair of substrates 18 to each other. The offset becomes minimal in the whole. Therefore, in a state where the substrate 18 is positioned, for example, the downloading stage 740 is raised toward the loading table 75, and the pair of substrates 180 are bonded together (step S210).

Further, in order to maintain the state in which the substrate 180 is aligned, as shown in the second d, the substrate holder 19 is joined by the fastener 192 (step S21l). Since the substrate holder 19A and the substrate 180, which are ensured in such a state of being aligned, can be easily transported while being held in this state, they can be carried out from the position alignment device 700 and transported to the pressurizing device (step S212). The actual alignment accuracy of the stacked substrate 180 can be improved as described above. Further, in the case where the λ drain 1 (10) is relatively close to each other, the alignment mark 184 formed on the surface of the substrate 180 is sometimes observed. Therefore, I set the reference mark in the area which is easy to observe even in the direction in which the substrate 180 is opposed to the substrate holder do, the downloading device 4, or the loading table 750, which are integrally moved with the substrate 18, and observe the reference mark downloading. The stage 74G or the loading stage 75Q maintains the same accuracy as the alignment mark 184. In this case, it is required to measure the relative position of the mark 184 and the reference mark. In the embodiment of Figs. 16 to 27, the = stage r moves in the direction of χ γ, but the second is not limited thereto. In other cases, when the alignment mark 184 is arranged on a straight line along the radial direction of the 38 201009994 substrate 180, the download stage 740 and the loading stage 75 may be linearly moved along the alignment mark 184. In particular, the substrate 180 can be disposed on the download stage 740 and the uploading stage 750, and the alignment direction of the alignment marks 184 is the same as the moving direction of the download stage 740 and the loading stage 750 toward the microscope, thereby being mounted on the microscope toward the microscope. The alignment mark 184 is detected simultaneously with the movement of the 740 and the loading stage 75 。. Further, in the above description, the laminated substrate manufacturing apparatus 600 has been described as an example, but the alignment apparatus 7 and method of the present invention can also be utilized in an exposure apparatus for lithography in the manufacturing process of a semiconductor device. The substrate is exposed to a pattern such as a substrate and a reticle. In the embodiment shown in the first to the twenty-seventh embodiments, the microscope that is held by the substrate 18 such as the loading table unit 31 is placed on the opposite download station unit 320 and the like, and is held in the download. A microscope for observing the substrate 180 such as the stage portion 320 is disposed on the opposite loading table portion 310 or the like. However, the configuration of the microscope is not limited to this. A microscope for observing the substrate 180 held by the loading stage unit 310 or the like is disposed on the same loading stage unit 310 or the like, and the microscope held by the substrate 18 such as the download stage unit 320 is placed in the same download. Taiwan department 320 and so on. In this case, the lens of the microscope disposed in the loading stage unit 31 is disposed so as to face upward, and the lens of the microscope disposed in the download stage 320 is disposed to face downward. The present invention has been described above using the embodiments, but the technical scope of the present invention is not limited to the scope of the invention described in the above-mentioned embodiment. It will be apparent to those skilled in the art that various changes and modifications can be made in the embodiments described above. The form in which the change or the modification is applied is also included in the technical scope of the present invention, and it is clear from the description of the scope of the patent application. The execution sequence of the actions, procedures, procedures, and stages of the devices, systems, programs, and methods in the scope of the patent application, the descriptions, and the drawings are not specifically stated as "before", "before", etc. Note that as long as the post-processing output is not used for post-processing, it can be implemented in any order. The operation procedures in the scope of application, the description, and the drawings are described as "first" and "second" for convenience, but they are not necessarily implemented in this order. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing shows a schematic plan view of the structure of a laminated substrate manufacturing system 100. The second a diagram schematically shows the state change of the substrate 180. The second b diagram schematically shows the state change of the substrate 180. The second c diagram schematically shows the state change of the substrate 180. The second d diagram schematically shows the state change of the substrate 180. The second e diagram schematically shows the state change of the substrate 180. The third diagram schematically illustrates the form of the alignment mark 184. The fourth drawing schematically shows a cross-sectional view of the configuration of the alignment portion 300. The fifth drawing is a partially enlarged view of the alignment portion 300 shown in the fourth figure. The sixth drawing shows a cross-sectional view of the configuration of the reference mark 321 . 201009994 A cross-sectional view of other structures of the standard 321 . Flow chart of the alignment procedure of the alignment section. The ninth figure shows the action of the alignment unit 3〇〇 with reference to the fourth figure. The tenth figure of the larger drawing is a partial placement of the alignment portion shown in the ninth diagram. f = the figure shows the next action of the alignment unit 300. The tenth figure shows the next action of the alignment unit 3〇〇. A perspective view showing the configuration of the other alignment portion 300. The fourteenth view is a plan view of the alignment portion 300. Figure 5 is a side view showing the action of the alignment portion 3 (10). The fifteenth bth diagram is a side view of other actions of the green alignment portion 3〇〇. The fifteenth Cth diagram shows the side view of the other portion of the alignment portion 3〇〇. Side view of other actions. Fig. 16 is a plan view schematically showing the entire structure of another laminated substrate. 1 is a perspective view showing one of the operations of the position aligning device 700. Fig. 17 is a perspective view showing the configuration of the position aligning device 700. Fig. 19 is a perspective view showing other operations of the position aligning device 700. Figure 20 is a perspective view showing other actions of the position aligning device 700. 41 201009994 The twenty-first figure is a flow chart of the position alignment procedure of the substrate 180. The twenty-second diagram schematically shows the observation of the alignment mark 184. The twenty-third diagram schematically shows the observation of the alignment mark 184. The twenty-fourth diagram schematically shows the observation of the alignment mark 184. The twenty-fifth diagram schematically shows the observation of the alignment mark 184. The twenty-sixth diagram schematically shows the observation of the alignment mark 184. The twenty-seventh diagram schematically shows the observation of the alignment mark 184.

[Description of main component symbols] 100 laminated substrate manufacturing system 101 housing 102 normal temperature section

190 substrate holder 191 groove 192 fastener 202 high temperature portion 220 damper 240 pressurizing portion 300 aligning portion 301 frame 302 top plate 303 bottom plate 304, 374 rib 306 bottom plate 310 loading table portion 311 spacer 312, 322 main stage 314, 324 sub-stage 111, 112, 113 substrate Cassette 120 control panel 122 calibration control portion 124 alignment control portion 130 pre-aligner 142, 210 thermal insulation wall 144, 222, 224 shielding plate 160 substrate holder 171, 172, 230, 390 robot arm 180 substrate 182 notch 184 alignment mark 186 element area 42 201009994

316, 326, 367 mirror 318, 328, 376, 378 microscope 320 download stage 321 reference mark 323 through hole 329 vertical actuator 330 measuring unit 332, 334, 366, 368 interferometer 340.350 drive unit 341.351 X drive unit 362.381 X drive unit 342.352 Y drive unit 372.382 Y drive unit 344, 384 (9 drive unit 346 0 drive unit 348, 364, 388Z drive unit 360 measurement unit 361 support 363 guide unit 370 microscope unit 380 joint portion 383 frame 389 plate 392 fork portion 394 arm portion 421 support frame 422 transparent substrate 423 opaque film 425 opaque substrate 427 blade-shaped portion 600 cascading Substrate manufacturing device 610 wafer storage 614 wafer storage device 616 wafer storage device 612 laminated substrate storage device 622 wafer pre-alignment device 624 wafer holder pre-alignment device 630 main control device 640 wafer holder storage device 650 Pressure device 660 separation cooling device 672 wafer loader 674 rail 678 rail 676 wafer holder 70 alignment device 710 base 720 in-plane driver 760 in-plane driver 722 rotary driver 43 201009994 762 rotary drive 820 microscope assembly 724 X-square Drive unit 811 notch portion 764 X direction drive unit 821 notch portion 726 Y direction drive unit 812 linear drive unit 766 Y direction drive unit 822 linear drive unit 730 tilt drive unit 814 support 732, 736 plate 824 support 734 vertical actuator 816 microscope 740 Download 818 Microscope 750 Uploading Station 826 Microscope 770 Skeleton 828 Microscope 810 Microscope Component Like 44

Claims (1)

201009994 Seven patent application scope: 1. A substrate position aligning device, comprising: a first stage, which holds one of the substrates facing each other and moves toward the surface of the substrate; μ second stage, the foregoing The other of the pair of substrates is protected by a first microscope, and the alignment marks are observed for the second stage; the second microscope of Α is observed for the first stage alignment mark; The calibration mark of the storm board is a calibration mark observed from the first microscope and the mirror; and a microscopic position alignment control unit, according to the first microscope and the display, the relative position of the mirror, the first position information and The second position=2 is the positional alignment of the substrate, wherein the relative position is obtained by observing the target mark by the first microscope and the second microscope, and the first position is the second mirror; The alignment mark is placed to be pulled out f. The position of the alignment mark observed by the first microscope is described, and 2. The beauty of the first aspect of the patent application is set. The calibrated slab is positioned with the I-position' more equipped with the & control unit by the aforementioned: Micro! To observe the aforementioned calibration mark, thereby calibrating $: ίίί=(4) position 'the aforementioned base' and the calibration statement obtained by the calibration control unit-to-substrate: 45 201009994 by alignment as observed by the second microscope as described The second position information indicates that the position of the quasi-marker is indicated by the first display position. The performance mirror observes the pair 3. If the patent application foot 2 is the substrate level mark and the aforementioned first Daitai is inscribed ^ ^Thousands of stipulations on the state of the above-mentioned stage - the state of the stage is stopped by the former: the first == Check the aforementioned calibration criteria, whereby the relative position of the microscope and the second microscope is 疋 4. As claimed in the third paragraph of the patent application. - a microscope and the aforementioned first stage alignment device 'the aforementioned fifth. The positional alignment control section of the third or fourth aspect of the patent application is such that the preceding first material is held at 6 before the front of the front side of the device. In the range of 2nd to 5th, the calibration control unit is in front of the substrate, and after the substrate position is aligned, the second step is as described in the second aspect of the invention. After the foregoing: the micromirror changes the direction of movement = two: 8 · As in the device of claims 1 to 7, the substrate of the calibration labeling item is aligned with the opaque film of the bright substrate. The substrate of the month and the substrate positional alignment 46 201009994 attached to the above-mentioned item in the first to eighth items of the patent application scope, wherein the calibration mark is formed on the intersection of a pair of faces, and the intersection of the pair of faces is The connecting lines of the first microscope and the second microscope respectively intersect each other and have mutually different inclinations. 10. The substrate position alignment device according to any one of claims 1 to 9, further comprising an interferometer for detecting the positions of the first stage and the second stage, respectively. 11. The substrate alignment device according to any one of claims 1 to 10, further comprising a vertical driving unit that causes the first stage and the second stage to The one of the first stage and the second stage is moved in a direction in which the substrate abuts or separates. 12. The substrate position alignment device according to any one of claims 1 to 11, wherein the first microscope and the second microscope are fixed to each other. The substrate alignment device according to any one of claims 1 to 12, wherein the position alignment control unit changes one of the pair of substrates from the first stage to the third stage, And changing the other of the pair of substrates from the second stage to the fourth stage, moving any of the third stage and the fourth stage, and performing positional alignment on the pair of substrates quasi. The substrate alignment device according to any one of claims 1 to 13, wherein the first microscope and the second microscope are respectively held on one of the first stage and the second stage Three or more alignment marks are observed. 15. A substrate alignment device, comprising: 47 201009994, 毎 slave, called.卩 'Detecting a plurality of alignment marks formed on the mutually aligned 徊-徊 ; ; ; ; ; ; ; ; 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个 个The control unit that controls the driving of the driving unit is configured to detect the positional alignment of the two-two-substrate substrate in accordance with the “St driving unit of the detecting unit” so as to correspond to the positional deviation between the two substrates. In general, it is the smallest; the driving section drives the driving unit to move the pair of stages, so that the position of the alignment mark is more than ❹; Fan _ 15 has, in the face of the state, the second assembly will fix the microscope, just a pair of stages are individually held to face each other two pairs of substrates' to extend the substrate to the aforementioned pair The field of view of the microscope is simultaneously moved to the direction of the surface of the substrate to be held. 17. The substrate position alignment device of claim 16 is configured such that one of the pair of stages moves by one of the aforementioned one micromirrors to observe twelve pairs of substrates located between the pair of microscopes. One, thereby measuring the relative arrangement of the two or more alignment marks formed on the one side with respect to the one of the microscopes, and moving the other of the pair of stages to the other of the microscope - The square observation is located in the foregoing - the other side of the 48 201009994 plate between the microscopes 'by this' measures the relative position of the two or more aligned micromirrors formed on the other soil plate, ^ The cake is - in addition, according to the pair of substrates just described - the movement of the stage: the phase of the mirror 4 = φ, the position of the substrate with more than two sets or 17 items is compared with 19 The cabinet narrates a pair of microscopes. Yirujia kiss patent range aligning device, moving between the positions of the substrate of any one of the above, wherein the micromirror is aligned with the substrate at the observation position and the avoidance position;;, check, 'from the aforementioned pair of stages Extending the aforementioned - the platform is extended into the field of view 'in the dodge position, from the wild. The aforementioned alignment mark of the substrate may not be viewed as shown in Fig. 2. For example, the position of the substrate in any of the above-mentioned items is the position of the substrate of the item - the substrate of the substrate: The aforementioned movement of the table to fix the position:; two or more alignment marks are observed. ~ Viewing the microscope - If you apply for the patent Fan Yuan 苐 alignment device, the above-mentioned control of the gold to any of the 18 items of the base of the platform and the observation of the -i stage At the same time, the reference mark of the former fan is moved integrally. In the alignment device, the substrate position 3 is rotated in the plane of the substrate 49 201009994 of the cutting table. A method of manufacturing a stacked type semiconductor device comprising: the substrate position aligning device of any one of the items of the first to twenty-secondth aspects of the invention, and the positional alignment position on the substrate A bonding device that performs pressure bonding on the aligned pair of substrates. 24. A substrate position alignment method comprising: a first holding stage in which a one of a pair of substrates facing each other is held in a first stage moving toward a surface of the substrate; The other of the pair of substrates is held on the second stage; in the first stage, the first microscope and the second microscope are used for observation 1 to detect the relative positions of the first microscope and the second microscope; The stage 'observing the alignment mark of the substrate holding the first stage by the foregoing second microscope, and detecting the first position information indicating the position of the alignment ruthenium; _ second detection stage, borrowing Observing, by the first microscope, an alignment mark of the substrate holding the second stage, detecting second position information indicating a position of the alignment mark; and performing a second position alignment stage according to the first position information and The difference in the second position information is used to position the pair of substrates. 25. A method for aligning the substrate, comprising: a first-measurement stage _ Each of the substrates is moved by a pair of σ sides of the branch, and the substrate held on the stage protrudes between the pair of microscopes of 50 201009994, and the substrate is observed by one of the pair of microscopes, whereby the measurement is formed on the substrate a relative position of the three or more alignment marks of the substrate with respect to the one of the microscopes; in the second measurement stage, moving the other of the pair of stages to extend the substrate held on the stage to the pair of microscopes Between the other pair of microscopes, the substrate is observed, thereby measuring the relative positions of the three or more alignment marks formed on the substrate relative to the other microscope; and the alignment stage, according to the foregoing The alignment marks move the pair of stages relative to the relative positions of the pair of microscopes such that the positional deviation of the alignment marks corresponding between the pair of substrates is minimized as a whole.