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TW201008960A - Epoxy resin composition, the cured article thereof, light-semiconductor sealing material, and light-semiconductor device - Google Patents

Epoxy resin composition, the cured article thereof, light-semiconductor sealing material, and light-semiconductor device Download PDF

Info

Publication number
TW201008960A
TW201008960A TW098124026A TW98124026A TW201008960A TW 201008960 A TW201008960 A TW 201008960A TW 098124026 A TW098124026 A TW 098124026A TW 98124026 A TW98124026 A TW 98124026A TW 201008960 A TW201008960 A TW 201008960A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
aliphatic
resin composition
acid
mass
Prior art date
Application number
TW098124026A
Other languages
English (en)
Chinese (zh)
Inventor
Atsuko Kobayashi
Ichirou Ogura
Original Assignee
Dainippon Ink & Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink & Chemicals filed Critical Dainippon Ink & Chemicals
Publication of TW201008960A publication Critical patent/TW201008960A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H10W74/47—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW098124026A 2008-07-18 2009-07-16 Epoxy resin composition, the cured article thereof, light-semiconductor sealing material, and light-semiconductor device TW201008960A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008187108 2008-07-18

Publications (1)

Publication Number Publication Date
TW201008960A true TW201008960A (en) 2010-03-01

Family

ID=41550267

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098124026A TW201008960A (en) 2008-07-18 2009-07-16 Epoxy resin composition, the cured article thereof, light-semiconductor sealing material, and light-semiconductor device

Country Status (3)

Country Link
JP (1) JP4678560B2 (ja)
TW (1) TW201008960A (ja)
WO (1) WO2010007859A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526511B2 (ja) * 2008-09-04 2014-06-18 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、硬化物の製造方法、光半導体封止用樹脂組成物、及び光半導体装置
JP5625248B2 (ja) * 2009-03-19 2014-11-19 日立化成株式会社 樹脂ペースト組成物及び半導体装置
JP5609040B2 (ja) * 2009-08-18 2014-10-22 Dic株式会社 繊維強化複合材料用樹脂組成物、その硬化物、繊維強化複合材料、繊維強化樹脂成形品、及びその製造方法
JP2013100562A (ja) * 2013-03-07 2013-05-23 Dic Corp 繊維強化複合材料用樹脂組成物、その硬化物、繊維強化複合材料、繊維強化樹脂成形品、及びその製造方法
JP6865614B2 (ja) * 2017-03-28 2021-04-28 株式会社Adeka 硬化性組成物
SG11201908910VA (en) * 2017-03-31 2019-11-28 Hitachi Chemical Co Ltd Epoxy resin composition, curable resin composition and electronic component device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236128B2 (ja) * 1983-12-14 1990-08-15 Toyo Boseki Teishushukuseikokagatajushisoseibutsu
JPS6146054A (ja) * 1984-08-10 1986-03-06 Toyobo Co Ltd 封止ｉｃモジユ−ルまたは素子
JPS6147727A (ja) * 1984-10-29 1986-03-08 Toyobo Co Ltd 硬化型樹脂組成物
JPS62184018A (ja) * 1986-02-08 1987-08-12 Toyobo Co Ltd 難燃性硬化型樹脂組成物
JP2897272B2 (ja) * 1989-08-25 1999-05-31 東洋紡績株式会社 電子部品封止用硬化型樹脂組成物
JPH03122646A (ja) * 1989-10-05 1991-05-24 Fuji Photo Film Co Ltd 光重合性化合物の合成方法、及び液状感光性樹脂組成物
JPH0728043A (ja) * 1993-05-12 1995-01-31 Nitto Denko Corp 液晶表示素子用透明樹脂基板
JP2004085984A (ja) * 2002-08-28 2004-03-18 Japan U-Pica Co Ltd 光硬化性組成物及び感光性熱硬化性樹脂組成物並びにその硬化物
JP2005120357A (ja) * 2003-09-22 2005-05-12 Japan Epoxy Resin Kk 脂環式エポキシ樹脂、その製造方法、その組成物、エポキシ樹脂硬化体、およびその用途
JP2005307123A (ja) * 2004-04-26 2005-11-04 Mitsubishi Rayon Co Ltd 硬化性組成物、硬化物品、および物品

Also Published As

Publication number Publication date
WO2010007859A1 (ja) 2010-01-21
JP4678560B2 (ja) 2011-04-27
JPWO2010007859A1 (ja) 2012-01-05

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