TW201008855A - Wafer positioning system - Google Patents

Abstract

The invention provides for a wafer positioning assembly for an assembler for assembling printhead integrated circuits on a carrier. The assembler includes an enclosure with a support assembly for operatively supporting a wafer with dies thereon, a die picking assembly for picking dice from said wafer, a die placement assembly for placing the dies onto the carrier, a die conveyance mechanism operatively conveying the dies from the die picking and placement assemblies, an a control system controlling the assembler. The wafer positioning assembly, in turn, includes a displacement assembly having a base plate with first and second stages mounted thereon, and a wafer support plate assembly rotatably mounted on the second stage. The support plate assembly is configured to receive the wafer and has a motor under control of the control system to rotate the support plate assembly underneath the die picking assembly.

Description

201008855 IX. Description of the Invention [Technical Field of the Invention] The present invention generally relates to a combination of print head integrated circuit components. In particular, the present invention provides a combiner and associated method for combining a printhead integrated circuit on a carrier. [Prior Art] Page width printers containing microelectromechanical components typically have a print head integrated circuit that includes a ruthenium base having a plurality of densely arranged microelectromechanical nozzle configurations. Each nozzle configuration is responsible for emitting a stream of ink droplets. In order for this printer to accurately print and maintain quality, it is important to test the print head integrated circuit. This is especially important during the design and development of such integrated circuits. Testing such integrated circuits generally requires some form of platform or carrier. SUMMARY OF THE INVENTION According to a first aspect of the present invention, a combiner for combining a printhead die on a carrier is provided. The combiner includes: a support combination; a wafer positioning assembly disposed on the support assembly And configured to hold and position the wafer, the wafer containing the print head die selected from the wafer; a die selection combination disposed on the support combination and configured to select from the wafer in advance a selected print head die; a die arrangement combination disposed on the support assembly and configured to receive -5 - 201008855 the preselected print head die and to place the die on the carrier; a die transport mechanism disposed on the support assembly and configured to select and transport the die from the die to the die arrangement combination; and a control system operatively engaging the wafer location, die selection, crystal The grain arrangement and the grain transfer combination are used to control the operation thereof. The support assembly can include an optical table and a block mount positioned on the optical table, the wafer positioning assembly being located on the block mount, and the support configured to support the die selection assembly Above the wafer positioning combination. The wafer positioning assembly may include a base member mounted on the block and first and second stages mounted on the base member, the first table being interposed between the base member and the second stage and Comparing the base member along the first linear axis, the second stage is displaceable relative to the first stage along a second linear axis orthogonal to the first linear axis, and the wafer support assembly is located On the second stage, the wafer support assembly is configured to support the wafer by rotating about a rotational axis that is orthogonal to both the first and second linear axes. The die selection combination includes a carrier assembly that is fastened in combination with the support and that is positionally movable toward or away from the wafer in combination with the support assembly, on the carrier assembly and configured to be the carrier The combination engages the preselected die in the lowered position and releases the die selection and lift head of the preselected die when the carrier is combined in the raised position. The die transport mechanism can include an elevated combination of elevated members positioned across the support assembly and configured to receive and support the predetermined predetermined die mounted on the elevated member and compared A shuttle combination in which the elevated member receives a displacement between the receiving position of the die released by the die selection combination and a transport position in which the -6-201008855 die is transported to the arrangement. According to a second aspect of the present invention, there is provided a transport apparatus for transporting a component of an integrated circuit from a receiving location to a delivery location in an integrated circuit combination machine, the transport apparatus comprising: a support structure defining a transport path between the locations a component carrier defining a receiving 组态 configured to receive the integrated circuit > a retention mechanism disposed on the component carrier to maintain the component of the integrated circuit in the receiving region in position, operable Maintaining a mechanism to release the member at the delivery position; and a displacement mechanism engaging the member carrier to displace the member carrier along the transport path. The support structure can include a support arm extending between the receiving and delivery positions, the transport path being linear, the displacement mechanism including a linear motor disposed on the support arm. The component carrier can include a shuttle plate defined by a vacuum plate disposed on the shuttle plate, the retention mechanism including a gel block that holds the member of the integrated circuit. The component carrier can include a vacuum tube configured to fluidly communicate with the vacuum plate, the vacuum tube configured to fluidly communicate with the vacuum pump, the vacuum pump can be operated to draw air through an aperture defined in the vacuum plate to operatively maintain the integrated circuit The member to the vacuum plate. The displacement mechanism can include a linear motor disposed on the support structure, -7-201008855 The linear motor is configured to displace the component carrier along the transport path. According to a third aspect of the present invention, a die picker for selecting a printhead integrated circuit from a wafer is provided, the picker comprising: a wafer platform having a displacement actuator for receiving the wafer with displacement operability The platform; a picker head having a vacuum mechanism to lift the die of the circuit from the wafer; & an alignment sensor configured to detect the position of the die on the wafer; and control Configuring a communication with the displacement actuator control signal, the selector head and the sensor assisting alignment of the wafer with the picker head, and selecting the die from the wafer for transport by the head To transportation equipment. The displacement actuator can include two piezoelectric motor stages attached to the platform to move the platform in a plane below the picker head. The displacement actuator can include a rotary shaft motor configured to rotate the wafer 10 platform below the picker head. The wafer platform can include a heater plate configured to heat the wafer to soften the die to the wafer, with a vacuum plate holding the wafer to the platform. The alignment sensor can include a camera having a lens adapter and a beak to focus on identifying an index on the wafer to assist the controller in aligning the picker head with the die. The controller can operatively perform a set of instructions to align the wafer with the picker head based on a predetermined wafer base map. The picker head can include a heater element to heat the die prior to lifting the die from the wafer to hold the die to the paste of the wafer in a soft -8-201008855. According to a fourth aspect of the present invention, there is provided a die arrangement for arranging an integrated circuit die on a carrier, the combination comprising: a support platform having a clamping mechanism configured to clamp the carrier to the platform At least one camera operatively directed to the platform to detect an alignment mark on the carrier; an arranging device having a vacuum mechanism to extract the die from a supply mechanism, the arrangement having an actuator Having the die and the carrier and arranging the die thereon in alignment, and heating the die prior to being disposed on the carrier; and a controller operatively controlling the clamping mechanism, the The camera and the arrangement are arranged to assist in the proper placement of the die on the carrier. Preferably, the integrated circuit die is an ink jet print head die. The camera can include a camera module that is linked to the prism by an adapter tube to focus the camera on the test bed. The support platform can include a self-leveling platform that is pneumatically operated by the controller. The actuators of the arranging device may include three stepper motors each independently responsible for vertical, horizontal and angular alignment of the die with the test bed. The actuators of the arranging device can include a linear translation stage that moves the dies in a vertical direction to position the dies on the test bed. The arranging device can include a hot gas blower to direct hot gases to the die prior to arranging the die on the test bed. The arranging device can include an illumination configuration to illuminate the test bed to assist the camera in detecting the -9-201008855 alignment marks. According to a fifth aspect of the present invention, a method of attaching an integrated circuit die to a carrier is provided, the method comprising: scanning a wafer having a circuit die thereon to delimit individual dies; A substrate map is aligned with the die picker head and the die on the wafer; the die is removed from the wafer by the die picker head; transporting the die to an arrangement station for operative positioning of the carrier Aligning the die with the carrier; and thermally adding the die to the carrier. Preferably, the integrated circuit die is an ink jet print head die. Preferably, the scanning step includes scanning the wafer in a camera configuration to identify a landmark mark on the wafer. Preferably, the step of removing the die comprises heating the wafer and applying a vacuum to individual dies that are to be removed by the die picker. Preferably, the step of transporting the die comprises storing the die on a shuttle combination of the combiner, the shuttle combination being displaceable between a receiving position of the receiving die and a delivery position of the delivery die to the arrangement. Preferably, the step of aligning the die comprises scanning the die and the carrier in a camera configuration to identify a base mark on both the die and the carrier, and displacing the crystal relative to the carrier The particles are up to the base marks on the die in a predetermined position relative to the base marks of the carrier. Preferably, the step of distinguishing the base marks comprises inspecting the carrier with a camera having a focusing lens to discriminate the micro holes -10- 201008855 in the surface of the carrier, the apertures being identified as the base labels mark. Preferably, the individual steps are performed by a controller of the combiner having a wafer positioning combination, a die selection combination, a die transfer mechanism, and a die arrangement combination to include one included in the software product. The group instructions implement such steps. According to a sixth aspect of the present invention, there is provided a wafer positioning assembly of a combiner for combining an integrated circuit die on a carrier, the combiner having a support assembly comprising an operative support wafer having a die thereon An enclosure, a combination of crystal grains from which the crystal grains are selected, a combination of grain arrangements for arranging the crystal grains on the carrier, and a crystal transport of the crystal grains from the crystal grains selected and arranged in combination Mechanism and control system for controlling the combiner, the wafer positioning assembly comprising: a layout combination having a bottom plate on which the first and second stages are mounted; and a wafer support plate rotatably mounted on the second The support plate assembly is configured to receive the wafer and has a motor under control of the control system to rotate the support plate assembly below the die selection combination. Preferably, the integrated circuit die is an ink jet print head die. Preferably, the first stage is interposed between the bottom plate and the second stage, and the first stage is slidably mounted on the bottom plate along a first axis, the second stage being along the first axis A second shaft is slidably mounted on the first stage. Preferably, the combination has a first piezoelectric motor interconnecting the bottom plate and the first stage, the first motor displacing the first stage along the first axis under the control of the control system. -11 - 201008855 Preferably, the combination has a second piezoelectric motor interconnecting the first stage and the second stage, the second motor displacing the second along the second axis under the control of the control system station. Preferably, the wafer support plate assembly includes a bearing table rotatably mounted to the second stage, the wafer support plate assembly having a bearing holder sandwiched between the second stage and the bearing table to ensure the crystal The circular support plate combines smooth rotation on the second stage. Preferably, the wafer support plate assembly includes a rotating pin having a compression spring surrounding the pin, the compression spring providing damping of vertical movement of the wafer support plate combination on the second stage. Preferably, the heater plate is mounted on the bearing table with a spacer to provide thermal isolation between the heater plate and the bearing table to which the vacuum plate is mounted and secured thereto. Preferably, the vacuum plate and the heater plate define a plurality of vacuum apertures, and the vacuum tubes are connected to a lower side of the heater board in fluid communication with the vacuum tubes, the tubes being connected to the vacuum manifold, The vacuum manifold is coupled to a vacuum pump of the combiner that operates to hold the wafer to the wafer. Preferably, the heater is interposed between the vacuum plate and the heater plate, and the heater is connected to the hot gas supply of the combiner to enable the heater plate to heat the wafer. Preferably, the stepper motor is mounted on the second stage, and the power screw of the stepper motor combination extends from the stepper motor to tangentially engage the wafer support plate assembly. Preferably, the working end of the power screw is secured to the connector arm extending from the bearing table such that the extension and contraction of the power supply screw causes the wafer support plate assembly to rotate counterclockwise and clockwise, respectively. According to a seventh aspect of the present invention, there is provided a die selection and lift head for a combiner for combining an integrated circuit die on a carrier, the combiner having a wafer having an operative support having a die thereon Supporting the combined enclosure, selecting a combination of crystal grains from the wafer, arranging a combination of grain arrangements on the carrier, and operatively transporting the die from the die selection and arrangement a die transport mechanism and a control system for controlling the combiner, the die selection and lifting head comprising: a first translation stage mounted on the die selection combination, the first translation stage being combinable relative to the support combination a vertical axis operative displacement; a second translation stage mounted on the first translation stage, the second translation stage being operatively displaceable along a horizontal axis relative to the support combination; and a die picker head mounted on the On the second translation stage, the picker head defines a vacuum chamber and a die contact surface having a vacuum aperture for fluid communication with the vacuum chamber. Preferably, the integrated circuit die is an ink jet print head die. Preferably, the first translation stage includes a stepper motor under control of the control system, the motor having a linear encoder to provide position feedback to the control system. Preferably, the linear encoder is disposed adjacent to the scale band of the die selection combination to assist the linear encoder in generating the position feedback. Preferably, the second translation stage includes a pair of micro-13-201008855 meters of drivers fixed to the first stage to displace the picker head along the horizontal axis, the drives being under the control of the control system . Preferably, the die picker head includes a pair of sealing strips disposed on individual sides of the vacuum apertures on the die contact surface to assist in contact of the lifted die with the die The creation of a vacuum between them. Preferably, the die selection and lifting head has a vacuum tube fixed to the vacuum body, the tube being connected to a vacuum pump, the vacuum port being configured under the control of the control system to be in contact with the die when the contact surface touches the die A vacuum is created in the chamber. Preferably, the heater is disposed in the vacuum body and connected to the hot gas supply to heat the die contact surface, and the thermocouple is coupled to the contact surface to sense the temperature thereof and notify the sensed temperature to The control system. According to an eighth aspect of the present invention, there is provided a arrangement head for combining a die arrangement of a combiner circuit die on a carrier, the combiner having a wafer having an operative support having a die thereon The combination of the support assembly, the combination of the crystal grains from the wafer, the combination of the crystal grains arranged on the carrier, the selection and the operative operation of the die a die transport mechanism of the die and a control system for controlling the combiner, the arrangement head comprising: a first translation stage mounted on the die arrangement, the first translation stage being combinable along a layout relative to the die a first axis operative displacement; a second translation stage mounted on the first translation stage, the second translation stage being displaceable orthogonally to the first stage; a third translation stage mounted on the second stage The third stage is displaced at right angles to the first and second stages; and the-14-201008855 die placement head is mounted on the third translation stage to adjust the shape and size of the arrangement head for operative reception Crystal from the grain transport mechanism And the die is disposed on the carrier. Preferably, the integrated circuit die is an ink jet print head die. Preferably, the arrangement head has an angle motor mounted through the third stage in contact with the die placement head such that actuation of the angular motor by the control system causes the die placement head to surround the second stage The translational pivot angle is pivoted. Preferably, the arrangement head has an angular motion spring secured to the third stage, the spring being configured to bias the positioner against angular motion provided by the angle motor. Preferably, the arrangement head has a head mounting block assembly that includes a mounting plate that is secured to the upright portion of the frame of the die arrangement combination via the mounting plate. Preferably, the arrangement head has a first stepper motor fixed to the block combination via a bracket assembly, the first stepper motor having a push rod operatively engaging the first stage for An axis is associated with the block combination to drive the first station. Preferably, the arrangement head has a second stepper motor fixed to the first stage via a bracket assembly, the push bracket is fixed to the second stage and the second stage motor is engaged via a compression spring a pusher, the linear encoder being mounted on the first stage, wherein the scale band is secured to the second stage, the scale band being read by the linear encoder to provide feedback to the control along the position of the second axis system. Preferably, the arrangement head has a pair of third micro-drives mounted on the second stage and engaging the third stage to provide adjustment of the third stage, the micro-drives in the control system Under the control. Preferably, the die arranging head defines an aperture for fluid communication with the vacuum tube, the vacuum tube being coupled to the vacuum pump of the combiner, the shape and size of the aperture being adjusted to receive dies from the wafer, by which the vacuum pump will The die is operatively held in the aperture. According to a tenth aspect of the present invention, there is provided a clamp combination of a combiner for combining a printhead integrated circuit on a carrier, the combiner having a support assembly comprising an operative support wafer having a die thereon a closed body, a combination of crystal grains from which the crystal grains are selected, a combination of grain arrangements for arranging the crystal grains on the carrier, and operatively transporting the crystal grains of the crystal grains from the plurality of crystal grains a transport mechanism and a control system for controlling the combiner, the clamp combination comprising: a long profile, the clamp being specifically shaped and configured to be received by the die arrangement; a pair of elongated retaining plates mounted thereon The insert is adapted to be shaped and sized to be specifically received by the clip under the plates, the insert operatively receiving the carrier; and a diaphragm positioned in the clip, the diaphragm being pneumatically controllable The displacement operatively urges the insert against the retaining plates. The insert may include a plurality of positioning tabs that complement the associated apertures defined in the carrier to ensure proper positioning of the carrier. The insert is slidably received in the clip body, the clip specifically includes a plug stop at one end thereof, a proximity switch is mounted on the stop and configured - 16 - 201008855 when the insert arrives at the stop Signal to the control system. The plates are mountable on the clip to define an access gap of sufficient width to allow the printhead integrated circuit to be positioned over the carrier through the gap. The clip may specifically include a pneumatic control fitting and define a pneumatic control chamber to assist in the pneumatic actuation of the diaphragm of the pneumatic control system via the combiner. The clamp assembly can include a handle secured to the insert to assist in maneuvering the carrier into a position between the clamp plates. According to a tenth embodiment of the present invention, there is provided a software product for execution by a processor, the software product having instructions configured to cause the processor to perform the steps of the above method. According to an eleventh embodiment of the present invention, there is provided a computer readable medium operatively storing a software product executed by a processor, the software product having instructions configured to cause the processor to perform the steps of the above method. [Embodiment] The aspect of the present invention will be discussed with reference to specific embodiments of the present invention. References to "embodiments" or "an embodiment" are made by way of limitation and not limitation. Accordingly, references to specific features that appear in an embodiment do not exclude those features in other embodiments. The following description is intended to assist those skilled in the art to understand the invention. Therefore, features not commonly found in the art are not described in detail, as those skilled in the art can readily understand these features. -17- 201008855 OBJECTS Broadly speaking, the present invention relates to a combination of print head integrated circuits on a test bed or carrier. The combination typically involves removing the die from the wafer and placing the die on the carrier or test bed with high accuracy. The print head integrated circuit includes a series of print head integrated circuits (1C) having a plurality of micro-electromechanical nozzle configurations for injecting ink droplets onto the print surface. I C defines a number of tiny ink inlets that are directed to individual nozzles, _ these inlets are configured to fluidly communicate with the ink distribution. The ink distribution combination fluid is responsible for feeding the ink to 1C. Figure 1 shows an example of a wafer 6. As shown, wafer 6 includes a plurality of print heads 1C or die 8 thereon. Wafer 6 is a product of etching and lithography procedures for various 1C fabrication of medium and long pieces. To test the printhead IC, each IC is mounted to a carrier that defines a number of winding ink paths to form such an ink distribution combination. The ink path terminates in the surface of the carrier with a tiny ink outlet. In the case of the IC's ink inlet φ and the small size of the ink outlet, it is important that the I C be accurately and accurately aligned with the carrier. The present invention provides a combiner and associated equipment and techniques for accurately securing a 1C to a carrier. Carrier 10 Figure 2 shows an embodiment of this carrier. It will be understood that the carrier, test bed, base assembly, carrier sub-combination, liquid crystal polymer (L C P ) combination or platform sub-structure 1 reference herein are referred to the same elements indicated by reference numeral 1 。. Vehicle 1 〇 is generally two liquid crystal polymer • 18- 201008855 (LCP) micro mold and lib combination. The micro-mold n defines a plurality of discrete winding ink paths 'to transport ink from an ink tank (not shown) to a print head integrated circuit (not shown). Therefore, the vehicle or test bed 1 is used to test the operation of the prototype of such a print head integrated circuit (1C) before mass production 1C. Under the premise of the operation of these print heads ic, it is generally necessary to establish a seal between the winding ink path defined in the carrier 10 and the fluid inlet of 1C. Accordingly, the inventors have discovered that by laminating the carrier 10' with the laminated film 12, this fluid tight seal can be established between the carriers 10 and 1c when the IC is secured to the carrier 10. This assists in the fluid tight supply of ink to the print head 1C. The ink path through the carrier typically terminates in the surface of the carrier 10 with a standard aperture or "base" 14 as shown in Figure 1. Therefore, it is necessary to arrange 1C on the carrier 1 without blocking or blocking these bases 14, otherwise the ink will not flow through the carrier 10 to the print head 1 C. An example of a carrier 10 having a laminate 14 is not shown in FIG. It is clear that the base 12 φ is not blocked to ensure proper ink supply. The carrier 10 also defines two position openings 1 3 at its respective opposite ends, as shown. The purpose of the position opening 13 is to accurately fix and align the carrier 10 before the 1C is placed on the carrier. The carrier base 15 is also included to aid in the alignment of the carrier 10 prior to attachment of the 1C to the carrier 10. Summary of the Combiner In Fig. 3, an embodiment of a printhead assembly machine or combiner 16 in accordance with an embodiment of the present invention is shown. Physically, the print head combiner -19 - 201008855 includes a support assembly or structure 24 defining a main enclosure 25' having a support frame 27 and side louvers 29 as shown. The side panels 29 are typically transparent to allow the operator of the combiner 16 to see the operation inside. The front panel 3 2 ' is shown and the internal components visible through it are shown as shown. The internal components of the combiner 16 include a die selection combination or die picker 18. A wafer positioning assembly 17 according to an embodiment of the present invention, a transport device or a die transport mechanism in accordance with an embodiment of the present invention 20. A die arrangement 22 in accordance with an embodiment of the present invention. The support structure includes a self-leveling optical table 26 supported by a support frame 27 in the enclosure 25. The die selection assembly 18 is mounted on the optical table 26 and is detailed below. The die selection combination 18 is configured to select the die from the wafer 6 loaded into the enclosure 25. The panels of the enclosure are typically slidable to assist in the loading of the wafer 6 and the carrier 10. The die arrangement 22 is also mounted on the optical table 26 and is detailed below. The die arrangement combination 22 is configured to place the die 8 on the carrier 10. A grain transport mechanism or shuttle transport assembly 20 is interposed between the die selection assembly 18 and the die arrangement combination 22. The grain transport mechanism 20 includes a via beam 1 14 which will be described in detail later. The die transport mechanism 20 is configured to receive the die from the die selection combination 18 and transport the die to the die arrangement combination 22. The die transfer mechanism 20 includes a transport or shuttle overhead 28 mounted on an optical table 26. The elevated frame 28 extends from the die selection combination 18 to the die arrangement combination 22. The touch panel PC 34 is mounted on the frame of the casing 24 and is set to be accessible by an operator. The control panel 36 is also mounted on a frame that can be accessed by the operator. The optical beacon 3 5 is also mounted on the enclosure 24 to indicate the operational status of the combiner 1 6 -20- 201008855. The touchpad PC 34, together with the control panel 36, forms an operator interface whereby the operator can monitor and control the operation of the combiner 16. However, it will be appreciated that most of the functions of the combiner can be monitored and controlled by the controller or control system, as will be described later, including a programmable logic controller (PLC) 38. The operator interface allows the operator to start and stop the combiner 16 with additional low order control. The ion bar 40 is positioned in the enclosure 24, along with a high efficiency particulate air (HEPA) fan/filter configuration 42 to achieve the proper environment in the enclosure. The electrical enclosure 44 is mounted to the support frame and encloses the various electrical components for operation of the printhead assembly machine 16, as will be described hereinafter. The housing 24 also includes a pneumatic enclosure 46 that encloses various pneumatic components for operation of the printhead assembly machine 16. Grain Selection Combination 18 Referring to Figure 4, the purpose of the die selection combination 18 is to select the die from the wafer 6 according to a predetermined picklist, the wafer 6 is operatively fixed to the wafer support plate assembly 63, and the die is lifted. In contrast to the arrangement in the shuttle transport combination 20, the die selection combination 18 includes a block mount 50 in the form of a granite block mounted on the optical table 26. Block 50 is typically rectangular as shown. The wafer positioning assembly 48 is mounted on block 50. The wafer support plate assembly 63 allows the wafer to be held in position by vacuum. The heater board 71 is used to heat the wafer 6' via the thermocouple 79 under the control of the PLC 38 to loosen the adhesive holding the die or Ic 8 to the wafer, so that the -21 - 201008855 die selection and lifting head 78 can select a die from wafer 6. A pick overhead 80 is also installed on the block 50. As shown, the overhead frame 80 includes one of the opposite corners of the block 50 mounted on the opposite side of the elevated column 81. The overhead 80 spans the wafer positioning assembly 18 and supports the die selection and lift heads 78 with appropriate brackets. Head 76 includes a pair of spaced apart wafer camera and optical assemblies 82. The combination 82 is coupled to a PC 34 that is configured to receive image data representative of the wafer 6 and control movement of the wafer support plate assembly 63 to align the succeeding die 8 with the head 78. It also includes a wafer line reader 100. The individual combinations will be detailed below. Wafer Positioning Assembly 48 The wafer positioning assembly 48, shown in detail in FIG. 5, includes a bottom member or plate 52 mounted on the block 50. The displacement assembly 54 is mounted on the base plate 52. The displacement assembly 54 includes two stages 56 and 58 with the first stage 56 interposed between the bottom plate 52 and the second stage 58. The first table 56 is displaced relative to the base member 52 along the first or U axis. The first piezoelectric motor 60 interconnects the bottom plate 52 with the first stage 56. Therefore, the first piezoelectric motor 60 is displaced relative to the bottom plate 52 by the first and second stages along the V axis. The second piezoelectric motor 62 interconnects the bottom plate 52 with the first stage 56. Therefore, the second piezoelectric stirrup 62 is displaced relative to the first stage 56 along the U-axis by the second stage 58. Piezoelectric motors 60 and 62 are coupled to PLC 36 and have suitable controllers as described below to control the operation of the piezoelectric motor. The PLC 36 and its operation will be detailed later. -22- 201008855 Wafer Support Plate Combination 63 The wafer support plate assembly 63 is rotatably mounted on the second stage 58. The wafer support plate assembly 63 has a bearing table 69 (Fig. 6) that is rotatably mounted on the bottom plate 64 above the second stage 58. The wafer support plate assembly 63 includes a bearing retainer 65 sandwiched between the plate 64 and the bearing table 69 to ensure smooth rotation of the wafer support plate assembly 63. The wafer support plate assembly 63 includes a rotating pin 67 having a compression spring 61 around which the wafer support plate assembly 63 can be rotated. The compression spring 61 provides damping of the vertical movement of the wafer support plate assembly 63. The heater board 71 is mounted on the bearing table 69 with a spacer 75 for thermal isolation (Fig. 7). The bearing table 69 is mounted on the bottom plate 64. The vacuum plate 76 is mounted and fixed to the heater board 71. Both the vacuum plate and the heater plate define a plurality of vacuum apertures 59. A plurality of vacuum tubes 57 are connected to the underside of the heater plate 7 1 that is in fluid communication with the vacuum aperture 5 9 as shown. The tube 57 is connected to a vacuum manifold 55 which is connected to a vacuum pump 472 housed in the air control enclosure 46 as will be described later. Supply tube 77 connects vacuum pump 472 to manifold 55 as shown. The operation of the vacuum pump 472 is controlled such that when the wafer is positioned on the vacuum plate 76, the wafer can be held in position by the vacuum created by the vacuum pump 472. The heater crucible 74 is interposed between the vacuum panel 76 and the heater board 71. The heater crucible 74 is coupled to the hot gas supply such that in use the heater plate 71 can heat the wafer 6 to release the adhesive holding the die or 1C 8 to the wafer 6. The thermocouple 79 is connected to the heater board 7 1 and operatively connected to a PLC 3 8 (described later) having a controller -23-201008855 to control the heater board via the heater 匣 74 using a PLC 3 8 having a controller 7 1 temperature. The stepper motor assembly 66 is mounted on the second stage 58. The power screw 68 of the stepper motor combination 66 extends from the stepper motor assembly and engages the wafer support plate assembly 63 in a tangential manner. In particular, and as seen in Figure 7, the connector arm 83 is secured to the heater plate 71 and extends radially therefrom. The working end of the power screw 68 is secured to the connector arm 83 such that the elongation I and contraction of the power screw 68 causes the wafer support plate assembly 63 在 in the illustrated embodiment to rotate counterclockwise and clockwise, respectively. The power screw 66 passes through the screw plate 70 extending from the second stage 58. The spring 72 is fixed between the screw plate 70 and the connector arm 83. Therefore, the wafer support plate assembly 63 can be rotated in one direction under the operation of the power supply screw 68' and rotated in the opposite direction by the action of the spring. The stepper motor assembly 66 is also coupled to a PLC 38 having a suitable controller to control the operation of the stepper motor assembly 66. The electrical box 85 assists in the individual electrical connection of the PLC 38 and the components of the controller described below. e Die Selection and Lifting Head 78 The die selection and lifting head 78 is shown in more detail in Figures 8-11. The die selection and lift head 78 includes a mount 89 that is secured to the bracket 87 and is displaced along the Z axis (operability perpendicular) relative to the bracket 87. The mount 8 9 and the bracket 87 are configured such that the displacement of the mount 8 9 and the bracket 87 is linear, and the mount 89 defines a linear translation stage 92. The linear encoder 94 provides the desired position Z-axis feedback 値' which is facilitated by the scale band 103 to the PLC 38 (Fig. 1). Also included is a vertical stepper motor 96 that is affixed to the bracket 87 and engages the -24-201008855 mount 89 for use with linear coding under the control of the PLC 38! The position feedback 位移 shifts the die picker head along the Z axis. The picker head plate 97 is attached to the mount 89. The picker head plates 97 and 89 are configured such that the picker head plate 97 is displaced along the (operability vertical) relative to the mount 89. The drive bracket 99 is fixed to the mount 89. The micro-drive 98 is secured to the bracket 99 and engages the picker head plate 97 with the X-axis displacement picker head plate 97. The drive 98 is connected to the PLC: The picker head plate 97 is displaced under the control of the PLC 38. Therefore, the picker head plate 97 can be adjusted in two degrees by the stepper motor 96 and the micro-driver 98 under the control of 38. The die picker head 9 1 (shown in more detail in Figure 1) is affixed to the picker head plate 97 via the frame 101 and has a true 84 defining the vacuum chamber. The vacuum body 84 has a die contact surface 86 configured to contact the die that lifts the wafer 6 on the blank plate 76. The die contact surface 86 defines a vacuum aperture 91 that is in fluid communication with the vacuum chamber of the vacuum body 84. The sealing strips 93 are disposed on individual sides of the vacuum aperture array 9 1 to contact the die and die contact surfaces. 86 auxiliary vacuum generation. The vacuum tube 88 is affixed to the vacuum body 84 and connected to the vacuum pump, and under the control of 38, the contact surface 86 is evacuated indoors when it contacts the die. A heater crucible 90 is disposed in the vacuum body 84 and connected to the hot gas to heat the surface 86. Thermocouple 95 is coupled to surface 86 to sense it and communicate the sensed temperature to the controller (described in more detail later). The controller states a valve to control the supply of hot gas to the 匣90 to produce sufficient to assist in the separation of the die from the wafer on the vacuum plate 76. I 94 Seat X-axis pair with a set of free free-standing bodies along i8 - the PLC to be picked up is the true temperature of the set of heat - 25 - 201008855 Camera and optical combination 82 Figure 12 shows the camera An embodiment of the optical combination 82. In this embodiment, the camera assembly 82 is mounted on a camera holder 85 that is attached to the overhead frame 80 (Fig. 4). As can be seen from Fig. 12, each camera assembly 82 includes a camera 1〇2. A suitable camera is an IEEE1 3 94 SXGA+ C-seat camera (AVTF-131B) with a megapixel Sony 2/3" progressive CCD array manufactured by Allied Vision. The camera 102 is mounted on The end of the adapter tube 104 has a 2X permeable adapter. The body tube 106 is mounted on the adapter tube 104. The body tube 106 has the form of a T-piece and contains an LED combination 1 with a cooling heat sink 11 1 08 to illuminate the wafer 6. The camera assembly 82 also includes a prism 1 12 that is coupled to one end of the body tube 1 。 6. The camera assembly 8 2 is configured to produce an image of the portion of the wafer 3 that the PLC 3 8 produces. Connected to the touchpad PC 34, the image can be displayed on the screen of the PC 34 (described in detail later). The PC 34 is programmed to identify the wafer base mark and thus assist in the positioning of the picker head 78 according to the wafer map. This allows the software control combiner 16 to identify and select individual dies on the wafer 6 using the wafer map. Wafer scribe reader 1 〇〇 wafer scribe reader 1 第 (Fig. 4 ) Also mounted on the overhead 80. Wafer line reader 1 〇〇 configured to use optical symbol recognition Reading mounted on the wafer support plate assembly 63 of wafers on a discrimination code of 6. Position and for lifting the wafer discrimination code of grains with a suitable grain 8 is lifted from the wafer -26-

The control software of 201008855 is related. Wafer line reader 100 is operatively coupled to PC 34. 34 to produce a visible image of the wafer identification code. In addition, the PC is programmed with a graphical user interface (GUI). Therefore, if the scribing reader has difficulty in facsimile identification, the operator can manually input the code using the GUI. It can be seen in Fig. 13 that the more recent reader 100 of the wafer scribing reader 100 includes a machine i mounted to the overhead 80 with a bracket 109. The housing 107 is configured to support a camera having a video lens 1 1 3 1 1 Π 1 is connected to the PC 34, so that the PC 34 can generate a wafer identification code white> The casing 107 also includes a light source 115 to illuminate the wafer 61 in a use. Shuttle Transport Equipment/Grain Transfer Mechanism 20 A transport equipment/die transport mechanism 20 in accordance with one embodiment of the present invention is shown in Figures 14 and 15. The shuttle transport assembly 20 sets of picking and lifting heads 78 receive the dies and transport them to the grain arrangement set as described below. The shuttle transport device includes an overhead beam 114. The elevated beam 114 is mounted on one of the pair of elevated columns 116 on the optical table 26. A shuttle or slide f is mounted on the beam 114 and moves along the beam 114. A linear motor 1203⁄4 1 1 4 is mounted to drive the shuttle 1 1 8 to and fro along the beam. A pair of relative & off configurations 117 are disposed on the elevated beam 114 and connected to the excess movement of the PLC stop shuttle 1 1 8 . The linear motor 1 20 also programs the PC 34 via 3 to produce a read/write detail. S 1 07 ° 1. Camera J image. L read the shuttle of the crystal J! into the selection 22, including: An: 1 1 8 An: installed in the beam f limit open 38 to control the control of the -27- 201008855 and is controlled by the PLC 38, such as It will be described later. Figure 15 shows the shuttle or slider 118 in more detail. The shuttle 118 includes a sliding plate 122 that is secured to the die plate 126. The vacuum panel 124 is secured to the pellet plate 126 and extends orthogonally from the sliding plate 122. Vacuum plate 124 defines a plurality of apertures 128 that are operatively open upwardly. The vacuum tube 130 is mounted on the shuttle 118 and is coupled to the lower operative portion of the vacuum plate 124 and the vacuum pump (shown) to create the appropriate vacuum when the die is positioned on the vacuum plate 124. A colloid block 132 is also disposed on the die plate 126. The colloid block 132 is used to provide a storage area' the picker head 78 is programmed to place other dies there for sampling. The colloidal block 132 can be removed from the die plate 126 once stored. The elevated beam 114 is disposed on the support assembly 26 such that upon lifting the die from the wafer, the shuttle member 1 18 can be moved from a position at which the vacuum plate 1 24 can receive the pellets from the picker head 78. The provision of the elevated beam 1 1 4 allows the shuttle 118 to be moved to a position where the die can be lifted from the vacuum plate 124 by a die arrangement 22 as will be described later. Grain Arrangement Combination 22 The grain arrangement combination 22 (Fig. 16) is configured to receive grains from the shuttle 1 18 and to arrange and bond them on a liquid crystal polymer (LCP) carrier or sub-assembly 10 In the position, the carrier is sandwiched by a clamp combination described later. The die arrangement assembly 22 includes a frame 138 mounted on a support platform or optical table 126 of the combiner 16. In one embodiment of the invention, frame -28-201008855 138 is granite. Frame 138 has a bed portion 140 and an upright portion 134 as shown. A spacer 136 is disposed on the bed portion 140. The cross rolling combination 142 is mounted on the spacer 136. The rolling combination 1 42 is configured to roll between a loading position (shown in Fig. 16) in which the carrier 10 is loaded and an arrangement position (shown in Fig. 17) in which the crystal grains are arranged on the carrier 10. The jig plate 144 is mounted on the cross rolling combination 142 and is displaceable along the X axis indicated by the arrow shown in Fig. 16. A carrier clamp or clamp assembly 146 (described below) is mounted on the fixture plate 142 to position the LCP carrier 10 clip for grain bonding. The die arrangement assembly 22 includes a carrier loading door 32 that is disposed on the bed portion 140 and mounted to the receiving frame 24 (FIG. 3) of the combiner 16 via the bracket 121 to allow the carrier 10 to be loaded into the clamp 146. in. The placement head assembly 160 is mounted on the mounting plate 162 as shown. Mounting plate 162 is secured to upright portion 134. The arrangement head combination 160 is configured to lift the die from the shuttle 1 18 and position it on the carrier 10. The die arrangement 22 also includes an air heating gas combination 1 64 (described later) to assist the bonding of the die to the carrier 10 held in the clamp 146. The placement head assembly 160 includes a placement head 168 and an arrangement camera and associated optics 16 6 . Layout Header 168 Figures 18 and 19 show a closer view of the placement head 168. The placement head 168 includes a placement head mounting block combination 123. The placement head mounting block combination 123 is secured to the upright portion 134 of the frame 138 via a mounting plate 162. The Z-axis stage 125 is mounted on the block combination 123 and is limited to the Z-axis displacement along the -29-201008855. For this purpose, the Z-axis stepper motor 182 is secured to the block combination 123 via the carrier assembly 133. The Z-axis stepper motor 182 has a push rod 135 that operatively engages the Z-axis table 125 to urge the Z-axis table 125 along the Z-axis with respect to the block combination 123. The Z-axis stepper motor 1 8 2 is operated under the control of the PLC 38 via a suitable controller. The Y-axis stage 127 is mounted on the Z-axis stage 125 and is limited to be displaced along the Y-axis (i.e., operatively vertical). For this purpose, the Y-axis stepper motor 180 is fixed to the Z-axis table 125 via the bracket assembly 137. The push bracket 139 is fixed to the Y-axis table 127 and engages the push rod 141 of the Z-axis table 125 via the compression spring 143. A linear encoder 145 is mounted on the Z-axis stage 125 as shown. Scale tape 147 is secured to gamma stage 127 and will be read by linear encoder 145, which is coupled to PLC 38 to provide position feedback along the gamma axis. The X-axis table 129 is mounted on the Y-axis table 127 and is limited to being displaced along the X-axis. For this purpose, the adjustment block 149 is fixed to the Y-axis table 127. A pair of X-axis micro-drivers 176 are secured to the adjustment block 149 and engage the X-axis table 129 to provide adjustment of the X-axis table 129 along the X-axis relative to the Y-axis table 127. The X-axis micro-drive 176 is coupled to the PLC 38 via a suitable controller to control the degree of adjustment of the X-axis stage 129. The connector block 151 is fixed to the X-axis stage 129. The elastic device 172 (which may be a T-type elastic device) is then connected to the connector block 151. The appliance 172 defines a recess that receives the die arranging head 17 , such that the die arranging head 170 extends from the appliance 172 portion. Portions of the die arranging head 170 from the appliance 延伸 72 extend so that a portion of the head 170 can be received between the retaining plates 150 of the jig -30-201008855 146 as described below. Under the fluid control, the smoothing 152 positive-film thin-film die arranging head 170 of the heated air-energizing head connector region 1 of the granules of the real, PLC 76 is ceramic and defined with the vacuum tube 186. The aperture 153 of the AC. The vacuum tube 186 is connected to a vacuum pump at the PLC 38. The shape and size of the die placer head 170 is adjusted to receive the die with the wafer 6 operatively held on the empty plate 76. At that time 3, via a suitable controller, operation is performed to remove the vacuum applied to the vacuum panel and a vacuum is applied to the dispenser head 170 via tube 186 to secure the A permeable head 170.空气 The air heater tube 155 is connected to the hot air supply nozzle 600 of the air heater combination 164 valve combination 602 (Fig. 20). The heat pipe 1 5 5 is coupled to the die distributor head 170 to heat the die cloth '170 such that the die can be bonded to the laminate film 12 of the carrier 10. The angle motor 161 is also mounted and fixed to the block 151 via the X-axis table 129. The diagonal motor 16 is moved by the PLC 38 via a suitable controller to cause the die arranging head 170 to pivot about the Y-axis. An angular movement spring 131 is also provided to the X-axis table 129, as shown, offsetting the angular movement of the arranging device 170 by the drive of the inverse 161 to ensure its operation. Thus, the programmable PLC 38 allows the head 170 to be positioned against the stack 12 and heated to bond the die to the laminated film 12 when the insert of the clamp 146 is properly positioned in the clamp 146. Air Heater Combination 164 The air heater assembly 164 is mounted on the cross rolling assembly 142 to direct the heated air to the carrier ι held in the fixture 146 at 201008855. This assists in the bonding of the die to the thermoset laminate film 12 on the carrier 10. The air heater combination 164 is shown in more detail in Figure 20. The air heater assembly 164 includes a heater mounting plate 604 (Fig. 20). The air treatment heater 6 06 is mounted on the mounting plate 604. Air treatment heater 606 receives an electrical power supply from electrical box 614 at 608 (Fig. 16). The air treatment heater 606 is elongated with a cold air supply 610 at one end, as shown. A heater valve assembly 602 is mounted on the opposite end of the cold air supply 610 on the air treatment heater 606. The thermocouple 612 is disposed in the heater valve assembly 602 to provide a signal to the PLC 3 8 to assist in the control of the heater valve combination 602 through the electrical box 614 (Fig. 16). Hot air supply nozzle 600 and hot air steering tube 616 are coupled to heater valve assembly 602. A pneumatic actuator 618 is mounted on the heater mounting plate 604 to control operation of the heater valve assembly 602 via the connecting rod 620. The pneumatic actuator 6 1 8 is operatively coupled to p l C 3 8 via a suitable controller to control the exit of hot air from the heater valve assembly 602 as follows. Arranging the camera and optics assembly 166 arranging the camera and optics assembly 166 causes the PC 34 to position the pre-alignment head 170 above the carrier 10. The camera and optics assembly 166 is mounted on a camera and optics combination bracket 622 (Fig. 16) that is secured to the mounting plate 162 on the upright portion 134 of the granite frame 138. The combination of the camera and optics 166 and the wafer camera shown in Figures 32-201008855 is similar to the optics 82 described above. Therefore, the same reference numerals are used to refer to the components of the combination 1 66. Each camera 1〇2 is connected to the touchpad PC 34 so that the image of the fixture 146 and portions of the vehicle 10 can be displayed to the operator. The touch panel PC 34 is programmed to communicate with the PLC 38 as soon as the PC 34 discriminates the ink outlet 14 in the laminate film. The discrimination of the ink outlet 14 allows the PC 34 to control the PLC 38 so that the carrier base 15 (Fig. 2) and the ink outlet 14 serve as the arrangement basis. Therefore, the PC 34 can judge the correct arrangement of the crystal grains of the laminated film 12 to be bonded to the carrier 10 as described above. Each of the dies 8 typically has a base at each end thereof and can be imaged by the camera 102. Since a pair of cameras 102 are used to "see" the base, the PC 34 can determine the coordinates of the individual bases relative to one another. This allows adjustment of the head 170 to ensure that individual dies are placed on the carrier 10 in alignment with each other. Clamp Combinations Figures 21 and 22 show the clamp assembly 146 in more detail. Air-controlled operation of the base clamp 146. It includes an elongate clip 148 in which the carrier 10 can be received. In particular, the insert 152 can be housed in the clip 148. The carrier 10 is mounted on an insert 152 having a position concealed 157 to ensure proper positioning of the insert 152. Clamp assembly 146 includes an insert stop 156 at the end of clip 148. The proximity switch 159 is mounted on the stop 156 to generate a signal receivable by the PLC 38 when the insert 152 reaches the stop 156. The clamp assembly 146 includes a pair of elongate-33-201008855 holding plates 150' mounted on the clip body 148 and defining an access spacing 624 having a sufficient width to stack the head-integral circuits 8 in the carrier 10. The positioning diaphragm 625 on the layer film 12 is positioned in the clip body 148 and is configured such that the film 625 and the insert 152 are displaced by the air supplied through the air duct toward the retaining plate 150 or away from the retaining plate 150. When the insert 148 is specifically received, the diaphragm 62 5 can be actuated to urge the carrier 10 against the retaining plate 150, which provides the space required to position the integrated circuit. Therefore, under the control of 38, when the insert 152 is inserted into the clip 148, the controllable fitting 158 provides air supply to the diaphragm 155 to drive the carrier 1 〇 air control panel 150, so that the integrated body The carrier 1 is positioned during the arrangement of the circuit 8. A handle or knob 154 is secured to the insert 152 to assist in maneuvering the carrier 10 between the clamp plates 150 prior to the clamp 10. Procedure Generally, the procedure performed by the combiner 16 can be summarized as follows: • Scan the serial number of the carrier 10 mounted on the insert 152 and load it into the jig 146 as described above so that it is defined by the laminated film 12. The attachment surface is substantially flat. • The carrier 10, along with the insert 152, moves to the camera and optical 166, along with the PC 34, for positioning the base position on the surface of the carrier to provide the first die 8 to be disposed on the surface of the carrier. Reference: • Scan the wafer 6 and load it into the vacuum and heater board combination 76. The combiner 16 judges the laminated film 1 attached to the carrier 1 using the input command file or the wafer associated with the wafer 6. The actual grain size of 2 allows 〇626. Between the 152, the PLC is held by the gas against the carrier. on. Tulai, and -34- 201008855 its location. • Once the die 8' is released from the wafer 6, it is placed, aligned and attached to the laminate film. This will be referred to by reference. • Once the die 8 is aligned, lower it to the temperature set with the stack f. The contact with the laminated film 12 is heated for a length of time to attach the die 8 to the laminated film. These steps are performed by various components of the monitoring of the PC 34 of the various controllers. * To describe how the above components perform the high-order data flow diagrams shown in these 23 figures. Figure 23 is a diagram of a ram and system for controlling a printhead combination machine or combiner 16 on a combination of displays in accordance with an embodiment of the present invention. In this embodiment, the system includes a manufacturing execution system (MES) server 63 4 with a reference symbol 63 0 that executes the print head combination software for the combiner 16. MES server 63 2 and industrial computer 634 system. In this embodiment, the MES server 63 2 maps and operates the instructions to the PLC 3 8 of the combiner 16. Effect on the PC 34) Ethernet transport via PLC 38 to the die placement member Describes how the Dysay film 12 is in contact and is applied to the segment, which is typically a thermoset thin by PLC 38 The control step needs to first show the method of the root print integrated circuit for carrying operation or the program number 630 with reference to the figure shown in the figure. The system 63 2 and the Industrial Computer Machine (PAM) application are collectively referred to as the remote monitoring system for the above-mentioned wafer industrial computer 63 4 (the module receives the data. This -35-201008855 data typically includes the above individual actuators or The position of the drive or the axis coordinates, work response, program variables or the like. In addition, 'PLC 3 8 also sends the state machine to the industrial computer 634 to perform' as shown. The data sent by the PLC 38 to the computer 63 4 may include The number of crystal grains consumed by the wafer 6, the order of the crystal grains, the identification code of each wafer scan, the position of the die and the carrier base, the start and stop cycle time, the operator's identity, the carrier bar code, and the components used. The state of the computer 63 4 and the MES server 63 2 exchanges instructions and information about the operation of the combiner 16, typically via TCP-IP. The MES server 63 2 supplies instructions on the loaded wafer. Which die will be loaded with information on the wafer map, program parameters, etc. on the carrier to the PLC 38. As shown, the PLC 38 is configured to define a number of control combiners 16 via appropriate software instructions. The state machine required for operation. This PLC 38 defines an arrangement state machine 63 that controls the operation of the die arrangement combination 22, a transport state machine 63 8 that controls the shuttle delivery assembly 20, and a selection state machine 640 that controls the die selection combination 18. The PLC 38 also defines a motion control state machine array 644' that is responsible for controlling the associated actuators and actuators that are represented by different components and unified at 637. A supervisory state machine 642 that is responsible for the operational safety and supervision of the combiner 16 is also shown.

Figure 24 shows a control combiner 1 executed by various components under the control of pC 34, PLC 38, operator and/or remote monitoring system (rms, indicated at 408) as described above, in accordance with an embodiment of the present invention. A general flow chart of the method or procedure of 6. As mentioned above, r M S 4 0 8 includes MES 632 and industrial computer 634. It is understood that the steps are automatically performed by PC-36-201008855 34, PLC 38 and RMS 408, while others require input from the operator. References to the reference symbols representing a particular method step are meant to refer to the individual blocks indicated by such reference numerals in the drawings. Therefore, the methods included in the present invention are not limited or subject to the specific method steps referred to in this manner. Those skilled in the art will appreciate that there may be other methods underlying the present invention that may exclude some or include additional steps. The general steps of combiner 16 having a die selection combination 18, a die transport mechanism 20, and a die arrangement combination 22 are shown. The remote monitoring system 408 is configured to signal communication with the PLC 38, as described above, and allows the remote to monitor and control the operational status of the combiner 16. The RMS 408 is also capable of tracking the carrier and wafer and which carrier the die will be placed on. RMS is an integrated position for quality and assurance control of the combination of vehicles. As shown, the program includes a wafer loading phase 3 98, a carrier loading phase 4 12, a die attach phase 424, and a processed carrier removal phase 43 6 . Wafer loading stage 398 has wafer removal from a clean cartridge that stores the wafer (block 400), loading the wafer into combiner 16 (block 402), and PLC 38 reading the wafer barcode (block) 404) steps. In the illustrated embodiment, a crystal map (block 406) is retrieved from remote monitoring system 408 by PLC 38, as described above. This wafer map typically provides the location and selection order of 1C on wafer 6. The wafer 6 is then placed on the wafer heating and vacuum panel 76. The carrier loading phase 412 has the step of removing the carrier 10 from the tray (block 414), after which the bar code of the carrier 10 is scanned by the PLC 38 and sent from -37 to 201008855 to the remote monitoring system 408. In the illustrated embodiment, a J-loaded polymer (LCP) substrate is constructed, such as in some of the blocks, whether the monitoring system 408 has the quality of the pass previously performed thereon prior to commanding the PLC to combine the die thereon. The control tool passes this test (block 408) and has sufficient quality to cover the protective liner (block 420) of the overlay 14 and will be in the carrier 16 (block 422). The die attach procedure 424 is followed by a combiner initialization 426) and the wafer is scanned to determine the location of the die based on the base map from the remote monitoring system (block 428). The die is selected (block 430) and transported to the layout combination 22, which will be bonded to the carrier (block 432). Repeated selection and deployment of the vehicle includes the required number of 曰1 434 specified by the wafer map. The processed carrier removal stage 43 6 includes scanning the completed carrier with 1C (block 438) and reporting it to the remote monitoring system at block 440. The carrier 10 is then moved to the unloader block 442) where the operator can remove the test vehicle 1 从 (block 444) from the combiner 16. The printhead 10 is then placed in the tray (block 446). Figure 25 shows the specific steps performed by the die selection combination 18 during operation from the wafer 6. The method typically mounts the wafer 6 to the combiner 16 as shown in block 200 on the wafer location combiner 48 as described above. I 1 0 is shown by the liquid crystal. Remote, check the vehicle test. If the operator moves the load to the group (the wafer of block 4〇8 is then placed from the wafer at the step until the grain is formed) (the block defines the print head to send the quality report position (area: 10 The completed carrier is selected by the operator at the beginning of the die. Wafer 6 is set to -38 - 201008855 Combiner 16 is initialized (block 202) and is read 100 using a scribe line to scan the wafer under the control of PLC 38. Barcode (Block 204) An unsuccessful scan of the PLC 38 configured as a bar code (determined in decision block 206) causes the PLC 38 to unlock the wafer loading gate (zone 2〇8) of the combiner 16 so that the operator can move In addition to and/or repositioning the wafer on the combiner (block 2 1 0). The PC 34 is configured to control the wafer camera and optics to check the starting point or reference mark on the wafer (block 2 1 2 ), which is the reference point of the wafer substrate map used by the PLC 38 to define individual dies on the wafer 6. Once the camera and optics 82 have been focused at 214, the PLC 38 checks the stage 92 and the driver. The die picker 8 1 and the heater (block 216) at the position of 98. If the die picker 81 fails the check, the combiner 16 Initialize and may issue a warning to the operator. If the die picker 8 1 has passed the check, lift it up (block 218) and move to the reference point locked by the map (block 220) «PLC 38 uses camera and optics The device finds the reference point on the wafer 6 (block 222). If the PLC cannot locate the test site, the wafer loading gate is unlocked, allowing access to the wafer 6. The optical member 82 inspects the wafer (block 224) and is The mapping request will select the coordinates of the die (block 226). Failure of either of these two steps will unlock the wafer access door as shown. If provided, the die picker 8 1 Moving to the correct position (block 228), the coordinates are requested again. Once the die picker 8 is in place, the selection table 86 (block 230) is lowered and in contact with the die and heated by the heater 90 (block 232) ) 'To loosen and hold the die to the adhesive of the wafer 6. Next, the block 16 82 is set to 90. The key is 82. The reference surface is set by -39- 201008855. Vacuum gripping the die (block 234) 'as described above, and raising the die picker (block 238) The die is removed from the wafer 6. The die selection combination 18 then waits for the die transfer mechanism 20 (block 240) to be positioned, then lowers the die onto the shuttle η 8 (block 242) and by removing the vacuum To release the die (block 244). If additional die must be selected from the wafer 'raise the die picker again (® block 246) and repeat the procedure' as shown. If the map does not need to select additional The die 'die picker returns to the waiting position to load a new wafer into the combiner 16 (block 250). Figure 26 shows an embodiment of a method performed by the die transport mechanism 20. Similar to the above-described die selection combination, the program is initially initialized by mechanism 20 (block 260). The shuttle 1 18 waits until the die picker 8 1 (block 2 62 ) until the picker moves to a position above the shuttle 1 18 (block 2 64 ). Once the die picker 8 1 is in place, the vacuum plate on the shuttle 1 18 receives the die and grips the die by creating a vacuum (block 266). The shuttle 118 waits for the picker head to rise (block 268), after which it is transported along the overhead beam 114 to the die arrangement 22 (block 270). The placement head assembly 160 includes a die arranger 170. The shuttle member 18 waits for the arranging device 170 to be in place (blocks 272 and 274), after which the vacuum plate releases the grasped die (block 276) and remains in place (block 278) so that the picker 170 can Provoke. When the picker 170 removes the die, the shuttle moves back to the die selection combination 18 to repeat the process (block 2 800). Figure 27 shows an example of one of the -40-201008855 method steps of the work performed by the die arrangement 22 . The program begins with a combination 2 2 initialization (block 3 00 ), after which the carrier 10 is loaded into the fixture 146 through the carrier loading gate 119 and clamped in the fixture 146 (block 304). The carrier 10 is then moved by the cross-roller 142 at block 306 to the reference position. Aligning the camera and optics 166 scans the base index 15 of the carrier 10 to align the grains thereon. If the base mark is not found (decision block 308), station 142 moves carrier 1 to the unloading position (block 3 1 2). If the base mark is not found, the stage 1 4 2 moves the carrier 1 to the arrangement position (block 314) where the arrangement 160 can place the die on the carrier 10. The placement head 168 waits for the shuttle 1 1 8 to deliver the granules selected from the wafer, as described above (block 314). Once the shuttle is in place, lower the placement head 1 6 8 (block 3 16). If the die is properly positioned (decision block 318), the die arranger 170 (block 320) is lowered to grasp the die (block 3 22 ). Otherwise, the arrangement combination 160 is moved back to the arrangement position. Once the die has been gripped, the die arranger 170 is raised (block 324) and the shuttle shuttle 1 1 8 is inspected for clean plucking (block 326) and moved back to the die selection combination 18 ( Block 3 2 8). The die arranger is moved to a position above the carrier 10 (block 3 3 0 ) and the gripped die and carrier (block 3 3 2 ) are aligned with the optical member 160 via a camera. The die arranger 170 is lowered at 3 3 6 . The die placer head 170 then places the die on the carrier 1 through the spacing 159 of the clamp 146. The air heater assembly 164 heats the die and carrier to hold the die to the thermoset stack 14 (block 3 3 8 ), after which the die is cooled (block 3 4 〇 ). Arranging the camera and optics 166 before raising the placement head 168 (block 344) and moving to the next die arrangement -41 - 201008855 then allows the PC 34 to inspect the placement of the die on the carrier (block 342). Once the head 168 is removed (block 3 46), the PLC 38 can check the final position of the die (block 348) and move the carrier 10 to the unloading position (block 3 5 0 ), where another load is loaded With the front (block 3 54 ), the operator can release the carrier (block 352) and remove it from the housing 24 of the combiner 16. Operator Interface Figure 28 shows schematically the left part of the combiner 16 of Figure 3, showing the operator interface in more detail. The interface includes a touch panel PC 34 and a control button table 36. Warning beacon 464 (symbol 35 in Fig. 3) and emergency stop buttons 460 and 462 are also displayed. Button 460 is the operator emergency stop button, and button 46 2 is the maintenance emergency stop button. The carrier loading door 119 is disposed on the front plate 461 of the enclosure 24 of the combiner 16, as shown. The granite frame 138 of the die arrangement 22 and the clamp plate 144 and clamp 146 are visible through the load-bearing door 1 1 9 . Electrical Member Fig. 29 shows the electrical enclosure behind the combiner 16 in the open state (Fig. 3). The control system of the combiner includes a PLC 38, which is a Mitsubishi® FX3U-64M PLC unit 645, having a FX2N-2LC temperature control block 646 in the form of a module, an FX3U-ENET Ethernet interface module 647 and FX0N-3A analog I/O special function block or module 64 8 and FX2N-3 2 CAN controller area network (CAN) serial bus -42 - 201008855 block 649 expansion block. The PLC 38 is connected to the PC 34 by the Ethernet switch 650 shown in Fig. 32. The PLC 38 receives programming instructions from the PC 34 such that the plc 38 can control the operation of the die selection combination 18, the transport mechanism 20, and the die placement combination 22. A lighting controller 470 (Fig. 29) is included to control the LED adapters 〇8 of the camera and optics 82 and 166. Controller 470 is a soft-proof (Gradasoft) PP610 lighting controller. And includes a vacuum pump 472 for providing various vacuums required for the wafer and die of the associated component of the associated assembly 16. The vacuum pump 472 is a Busch dry running rotary vane type pump. It will be appreciated that the various components are coupled together via electrical and/or pneumatic connections (blocks 420) housed in line 471. Rail 473 provides a mounting location for the different components housed in enclosure 44. Thus, the physical connections between the components are schematically indicated, as will be appreciated by those skilled in the art. The motor shaft controller, indicated by symbol 474, is coupled to PLC 3 8 to assist in controlling the different motors and drives of the components of combiner 16. A detailed description of this motor control is provided below. Power supply 476 is configured to provide a 1 60 volt DC supply to operate vacuum pump 472. Power supply 496 is configured to provide 5, 9, 15 and 24 volt power supplies to the combined relay and motor contactors. Relay 478 and fuse 480 are provided to the connection and protection of electrical components powered by power supply 476, while relay 492 and fuse 494 provide -43-201008855 to the connection and protection of electrical components powered by power supply 496. . Relay 482 provides a connection of the heater elements of combiner 16. It can be appreciated that different relays allow the PLC 38 to activate and deactivate individual components. A 48 volt power supply 484 and an Ethernet switch 486 (shown as 650 in Fig. 32) are shown. Circuit breaker 488 provides component over

Current protection. Motor contactor 490 is coupled to controller 474 to allow PLC 38 to control the various motors of the combiner. The safety mute controller 498 and the door open_off controller 5 00 are disabled by the door if the door is loaded, such as the carrier loading door 19, when the combiner 16p is activated, to disable the combiner to provide security. The pneumatically controlled closure 5〇1 forms part of the pneumatically controlled closure 46 of the combiner 16 (Fig. 3). ' Motor Controller Figure 3 1 provides a schematic representation of the motor control work performed by PLC 3 8. As described above, the PLC receives the wafer map and associated p operational parameters from a remote monitoring system (or pC 34) having an MES server 632 and an industrial computer 634. The various motors and drives described above are controlled by the PLC 38 via individual motor shaft controllers that are collectively indicated by reference numeral 474. As described above, the placement head 168 includes actuators 161, 176, 180, and 182. The inventors have found that an Akribis linear motor 18 8 with an Elmo driver 474.1 is suitable for this application. Similarly, a Zaber 2 step pacer motor 176' having a Copley drive 474.2 is used along with a Zaber 2nd step motor 182 having a Copley drive 474.4. The angle motor 161 is also a Zaber 2 step stepper motor with a Copley drive 474.3. The -44 - 201008855 die transport mechanism or shuttle transport mechanism 20 includes a linear motor 丨2〇, which is an Akribis AC servo motor with an Elmo drive 474.5. Similarly, die selection assembly 18 includes actuators 66, 96, 62 and 60' as described above. Wafer positioning assembly 48 has two stages that are actuated by nano-motion piezoelectric track-type motors 60 and 62 having nanomotion drivers 474·8. Wafer rotary motor 66 is a Zaber 2 step pacer motor with Copley drive 474.6, and picker head vertical motor 96 is a Zaber 2 step pacer motor with Copley drive 474.7. It should be understood that all of the drivers 474 provide position feedback information for the drive to the PLC 38. Air Control Enclosure 46 Figure 30 shows the air control enclosure 501 (portion of enclosure 46 in Fig. 3) of the combiner 16 in the open state, showing the air control components used in the embodiment of the combiner . The SMC AF40 Series Air Filter 5 04 is used immediately after the main shut-off valve 5〇2 filters the impurities from the air supply. The filter 504 has a floating automatic discharge system. The combiner 16 also includes an SMC AFM series mist separator 530 to filter particles from the supply, and then an SMC AFD series micro-mist separator 532 to filter smaller particles that may pass through the separator 530. A SMC® series mist separator 514 is included to absorb fine oil particles from the gas control system of the combiner 16. The direct exhaust body filter 518 is included from the SMC SF series to remove any remaining particles from the air control supply. Filter 518 includes a PTFE thin -45-201008855 membrane. A high purity valve 520 that operates various gas control components, and a membrane air dryer 534 are included to remove moisture. Pressure regulators 506, 510, 512, and 526 are used to regulate the pressure in various gas control systems. Isolation valves 502 and 528 are used to isolate individual gas control circuits from each other. The air control system is controlled by a PLC 38 using a solenoid valve 524 having a fluid sensor 516 that communicates fluid information to the PLC 38. Safety The controller or PLC 38 includes a number of safety features that protect the combiner 16, the carrier and wafer 6 from damage and that are not injured by the operator. Therefore, the PLC 3 8 is configured to monitor the operational state of the combiner 16 by the various components described above. If a potentially dangerous situation is detected, the PLC 3 8 is configured to disable the combiner 16. Hazardous conditions may include unintended electrical fluctuations, pressure fluctuations, unintended operational parameters, and PLC 38 senses foreign objects in the vicinity of moving objects of combiner 16 and the like. Figures 32 through 37 show circuit diagrams of interconnections between some of the above described electrical components. It will be appreciated that the circuit diagram is depicted in a manner that only indicates some of the connections. The circuit diagram is intended to assist those skilled in the art in explaining the interconnections between the components, rather than providing an exhaustive circuit description. In the circuit diagram, like reference characters indicate similar connections unless otherwise indicated. The primary safety relay 668 is shown in Fig. 35 (indicated by reference numeral 492 in Fig. 29). Relay 668 is an Omron G9SA-32 T safety relay unit' and is coupled to emergency stop buttons 460 and 462 as shown. Relay 668 also has a -46-201008855 link to PLC 38 at 666 as shown. Figure 36 shows the other components of the safety system of the combiner. The mute controller 4 9 8 is connected to the door switch controller 500, as shown, to the door safety switch 6 70. The door switch controller 500 is configured to communicate with the magnetic door switches 672, 674, and 676 as shown. If the door panel of any combiner is open during operation, the safety system automatically deactivates the combiner to prevent injury and/or damage. Computer Control Figure 3 2 shows the control system, which depicts a function of the P C 3 4 Control Combiner 16 optical component. As can be seen, the camera 1 1 1 and the arrangement phase '1 16 are connected directly to the PC 34 with a live wire connection 652. As described above, the PC 34 state controls the operations of the cameras Π1 and 161. Wafer line reader 100 is also connected to 34' as shown by a suitable USB link. The PC 34 has an RS232 communication port 654 whereby communication with the φ pair LED illumination controller 470 (Fig. 33). Figure 33 shows the lighting controller 470 in more detail. Illumination control 470.1 is configured to control LED 660 for picker head 78 to aid in the detection of phase 1 1 1 . The controller 4 7 0 · 1 is also configured to control the placement of the head 170 with an LED 662 to assist in the detection of the camera 166. The lighting controller 470.2 is configured to control the L E D 6 6 4 for side lighting of the head 170. Figure 32 also shows the connection between the PC 34 and the Ethernet switch 486. Switch 486 is connected to PLC 38 at 664 and to 666 to B network. Door and closing operation

The state of the unit PC is too -47- 201008855 Figure 34 shows the control system of the combiner, including the PLC 38, which is the Mitsubishi FX3U-64M PLC unit 645, with the module form of the FX2N-2LC temperature control block 646 , FX3U-ENET Ethernet interface module 64 7 and FX0N-3A analog I/O special function block or module 648 and FX2N-32CAN controller area network (CAN) sequence bus block block 649 expansion area Piece. Figure 37 shows the interconnection between the temperature control module 646 of the PLC 38 and the individual heaters and thermocouples used to regulate and control the wafer 6, the air heater combination 164, and the heater 匣90 of the lift head 78. . As shown, a temperature module 646 is responsible for controlling the heater 匣 684 for the die picker head 78 via the relay 682 and the thermocouple 686. Similarly, temperature 匣 690 of wafer support 63 is heated via relay 680 and thermocouple 688 to provide temperature feedback. The second temperature module 646 is responsible for controlling the heater 匣 698 for the die placement head via the relay 692 and the thermocouple 694. Those skilled in the art will appreciate that the above-described embodiments may include various modifications that are still within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Preferred features, embodiments, and variations of the present invention will become apparent from the Detailed Description of the Detailed Description of the <RTIgt; The detailed description should not limit the scope of the inventive content of the invention in any way. For a detailed description, reference will be made to the following figures: Figure 1 shows an example of a wafer defining a complex integrated circuit (1C) or a die; -48- 201008855 Figure 2 shows the placement of a printed head integrated circuit thereon (IC) a perspective view of a carrier or test bed; Figure 3 shows a perspective view of an embodiment of a combiner that combines ic on a carrier, and Figure 4 shows a selection of lC from a wafer according to an embodiment of the present invention. A perspective view of a die selection combination or a die picker; FIG. 5 shows a wafer positioning combination of the picker of FIG. 4 according to an embodiment of the present invention; and FIG. 6 shows a crystal shown in FIG. Side cross-sectional view of the circular positioning combination; FIG. 7 is a side view showing the wafer positioning combination shown in FIG. 5; FIG. 8 is a view showing the crystal selecting and lifting head of FIG. 4 according to an embodiment of the present invention. Perspective view; Figure 9 shows a further perspective view of the die selection and lifting head shown in Figure 8; Figure 10 shows a further perspective view of the die selection and lifting head shown in Figure 8, The figure shows the selection of the "A" in Figure 10 and the lifter's die picker A portion of the enlarged view; FIG. 1 2 shows an embodiment of the camera configuration of the die selection combination of FIG. 4; and FIG. 3 shows a perspective view of the wafer scribe reader of the die selection combination of FIG. Figure 14 is a perspective view showing a transport apparatus of a die transport combination having a combiner of -49-201008855 in Fig. 3 according to an embodiment of the present invention; and Fig. 15 is a view showing a die transport combination of Fig. 14; a closer view of the component carrier or shuttle; FIG. 16 shows a die arrangement of the die combiner of FIG. 3 in accordance with an embodiment of the present invention, the arrangement being in the carrier loading position; The figure shows a grain arrangement_combination of Fig. 16 in a grain arrangement position; Fig. 18 shows a perspective view of a die arrangement head of a die arrangement of Fig. 6 according to an embodiment of the present invention; Figure 19 shows a 'further perspective view of the die placement head of the die arrangement of Figure 16. Figure 20 shows the air heater combination of the die arrangement of Figure 16 according to an embodiment of the present invention. Figure 21 shows the second image used to locate the combiner A perspective view of the clamp mechanism of the test bed or _ carrier; Figure 22 shows a side cross-sectional view of the clamp mechanism of Figure 21; and Figure 23 shows a schematic diagram of the high-order data flow of the combiner used to control Figure 3. Figure 24 shows a diagram of the high-order method steps for combining the printhead circuit on the carrier of Figure 2 using the combiner of Figure 3; Figure 25 shows the block representing the method steps for selecting the die from the wafer; Figure 26 shows a block diagram representing the method steps for transporting the grain between -50-201008855 in the combination of die selection and die arrangement; Figure 27 shows the carrier on the carrier in Figure 2 Block diagram of the method steps; Figure 28 shows an embodiment of the operator interface of the combiner of Figure 3; Figure 29 shows the electrical enclosure of the combiner showing the internal electrical components in the open position; Figure 30 shows the air-controlled enclosure of the combiner showing the air control member in the open position; Figure 31 shows a schematic diagram depicting the interaction of the electrical components for motor control of the combiner of Figure 3; Figure 32 shows the combiner Touch circuit board pc and optical component circuit Figure 33 shows the circuit diagram of the LED controller of the combiner; Figure 34 shows the circuit diagram of the arrangement of the main controller of the combiner; Figure 35 shows the circuit diagram of the main safety relay of the combiner; Figure 36 shows the combination The circuit of one embodiment of the safety system and the circuit diagram of the temperature control circuit of the combiner shown in FIGS. 3A and 7B [main component symbol description] 6: wafer 8: print head 1C or die -51 - 201008855 1 0 : carrier 1 1 , 1 1 a, 1 1 b : micro mold 12 : laminated film 1 3 : position opening 14 : base 15 : carrier base

1 6 : Print head combination machine or combiner 1 7 : wafer positioning assembly 18: die selection combination or die picker 20: transport equipment or die transport mechanism 22: die placement combination 2 4 : support combination Or Structure 26: From Horizontal Optical Table 27: Support Frame 29: Side Window 28: Elevated 32 = Vehicle Loading Door 3 5: Optical Beacon 3 6: Control Board 38: Programmable Logic Controller (PLC) 40: Ion Bar 42: Fan/Filter Configuration 44: Electrical Enclosure 46: Air Control Enclosure - 52- 201008855

34 : PC 4 8 : Wafer positioning assembly 50 : Block mounting member 52 : Base plate 54 : Displacement combination 5 5 : Vacuum manifold 56 : First stage 57 : Vacuum tube 58 : Second stage 5 9 : Vacuum aperture 60 : First piezoelectric motor 6 1 : compression spring 62 : second piezoelectric motor 63 : wafer support plate assembly 65 : bearing holder 66 : step motor combination 67 : rotary pin 68 : power supply screw 69 : bearing table 7 0 : Screw plate 7 1 : Heater plate 72 : Spring 7 4 : Heater 匣 75 : Spacer - 53 - 201008855 76 : Vacuum plate 7 7 : Supply pipe 78 : Die selection and lifting head 7 9 : Thermocouple 80 : Elevated 8 1 : Elevated column 82 : Wafer camera and optical group 83 : Connector arm 8 5 : Electric box 87 : Bracket 89 : Rack 91 : Die picker head 9 1 : Vacuum aperture column 9 2 : Linear translation stage 94: linear encoder 96: vertical step motor 97: pick head plate 98 = micro driver 99: drive bay 1 〇〇: wafer scribing reader 101: bracket 1 〇 3: scale strip 84: vacuum body 8 6 : Grain contact surface -54- 201008855 9 3 : Sealing strip 88 : Vacuum tube 9 〇: Heater 匣 9 5 : Thermocouple 1 1 4 : Elevated beam 102 : Camera 104 : Adapter tube 1 0 6: body tube

107 : Enclosure 108 : LED combination 1 09 : Bracket 1 1 〇: Cooling radiator 1 1 1 : Camera 1 1 3 : Video lens 1 1 5 : Light source 1 1 6 : Elevated column 1 1 8 : Shuttle or carrier 1 1 7 : Limit switch configuration 1 1 9 : Carrier loading door 120 : Linear motor 121 : Bracket 122 : Sliding plate 1 2 3 : Place head mounting block group 124 : Vacuum plate -55 201008855

125 : Z-axis table 1 2 6 : Die plate 1 27 : Y-axis table 1 2 8 : Aperture 129 : X-axis table 1 30 : Vacuum tube 1 3 1 : Angle-moving spring 132 : Colloid block 1 3 3 : Bracket combination 1 3 4 : Upright portion 135 : Push rod 1 3 6 : Spacer 1 3 7 : Bracket combination 1 3 8 : Frame 139 : Push bracket 1 4 0 : Bed portion 141 : Push rod 142 : Cross rolling combination 143 : Compression spring 144: Fixture plate 1 4 5 : Linear encoder 146 : Carrier clamp or clamp combination 1 4 7 : Scale belt 1 49 : Adjustment block -56- 201008855 148 : Clip specific 1 50 : Holding plate 151 : Connection Block 1 5 2 : Insert 1 5 3 : Aperture 1 5 4 : Handle or Knob 1 5 5 : Air Heater Tube

1 5 5 : Diaphragm 1 5 6 : Insert stopper 1 5 7 : Position dark 1 5 8 : Air control fitting 1 5 9 : Proximity switch 160 : Place head combination 1 6 1 : Angle motor 162 : Mounting plate 164 : Air Heating gas combination 166: placing the camera and associated optics 1 6 8 : placing head 170 : die placement head 172 : elastic device 176 : X-axis micro-drive 1 8 0 : Y-axis step motor 1 8 2 : Z-axis step Step motor 1 86 : vacuum tube - 57 - 201008855 408 : remote monitoring system 460, 462 : emergency stop button 461 : front panel 4 64 · warning beacon 472 : vacuum pump 470, 470.1, 470.2 : lighting controller 471 : line 472 : Vacuum pump 473: Rails 476, 4 84, 496: Power supply 478, 482, 492: Relay '480, 4 9 4: fuse 48 6 : Ethernet switch 48 8 : Circuit breaker 490 : Motor contactor * 49 8 : ❹ Safety mute controller 5 0 0 : Door switch controller 50 1: Air control enclosure 5 02 : Main shut-off valve 5 02, 5 2 8 : Isolation valve 5 04 : Air filter 5 0 6, 510 , 512, 526: Pressure Regulator 5 16: Fluid Sensor 5 18: Direct Exhaust Filter - 58 - 201008855 520 : High purity valve 5 2 4 : Solenoid valve 53 0, 514 : mist separator 532 : micro mist separator 534 : film air dryer 600 : hot air supply nozzle 602 : heater valve combination 604 : Heater mounting plate 606 : Air treatment heater 6 1 0 : Cold air supply 6 1 2 : Thermocouple 6 1 4 : Electric box 616: Hot air steering tube 6 1 8 : Air control actuator 6 2 0 : Connecting rod 622: camera and optics combination bracket 6 2 4 : access interval 625 : diaphragm 626 : air duct 6 3 0 : system 63 2 : manufacturing execution system (MES ) server 63 4 : industrial computer 63 6 : placing State machine 63 8 : Transport state machine 59 - 201008855 640 : Select state machine 642 : Supervised state machine 644 : Motion control state machine array 645 : PLC unit 646 : Temperature control block 647 : Ethernet interface module 648 : Analogy I/O Special Function Block or Module 649: Controller Area Network (CAN) Sequence Bus Block Block 650: Ethernet Switch 6 5 2: FireWire Link 654: RS232 Communication埠

660, 662, 664 : LED 668 : main safety relay 6 7 0 : door safety switch 672 , 674 , 676 : magnetic door switch 682 , 680 , 692 : relay 684 , 6 98 : heater 匣 686 , 688 , 694 : thermoelectric Coupling 6 9 0 : temperature 匣-60-

Claims (1)

201008855 X. Patent Application No. 1. A wafer positioning assembly of a combiner that combines integrated circuit chips on a carrier having a closed assembly comprising a support assembly operatively supporting a wafer having a die thereon Body, selecting a combination of crystal grains from the wafer, arranging a crystal grain arrangement combination of the crystal grains on the carrier, selecting and arranging a grain transport mechanism for transporting the crystal grains from the crystal grains And a control system for controlling the combiner, the wafer positioning assembly comprising: a layout combination having a bottom plate on which the first and second stages are mounted; and a wafer support plate assembly, the rotary mounting on the second The support plate assembly is configured to receive the wafer and has a motor under control of the control system to rotate the support plate assembly below the die selection combination. 2. The wafer positioning assembly of claim 1, wherein the integrated circuit die is an ink jet print head die. 3. The wafer positioning assembly of claim 1, wherein the first stage is interposed between the bottom plate and the second stage, and the first stage is slidably mounted on the bottom plate along the first axis, The second stage is slidably mounted on the first stage along a second axis orthogonal to the first axis. 4. The wafer positioning assembly of claim 3, having a first piezoelectric motor interconnecting the bottom plate and the first stage, the first motor being displaced along the first axis under the control of the control system The first one. 5. The wafer positioning assembly of claim 3, having a second piezoelectric motor interconnecting the first stage and the second stage, the second motor being along the second under the control of the control system The shaft is displaced by the second stage. -61 - 201008855 6. The wafer positioning assembly of claim 1, wherein the wafer support plate assembly comprises a bearing table that is rotatably mounted to the second stage, the wafer support plate assembly having the same a bearing holder between the two bearing tables to ensure a smooth rotation of the wafer support plate on the second stage. 7. The wafer positioning assembly of claim 6 wherein the wafer The support plate assembly includes a rotating pin having a compression spring surrounding the pin that provides damping of the vertical movement of the wafer support plate combination on the second table. 8. The wafer positioning assembly of claim 6, wherein the heater board is mounted on the bearing table, having a spacer to provide thermal isolation between the heater board and the bearing table, the vacuum board being mounted on The heater board is secured to it. 9. The wafer positioning assembly of claim 8 wherein the vacuum plate and the heater plate define a plurality of vacuum apertures, and the vacuum tubes are connected to the heater plate in fluid communication with the vacuum apertures. On the side, the tubes are connected to a vacuum manifold that is connected to a vacuum pump of the combiner that operates to hold the wafer to the vacuum plate. 10. The wafer positioning assembly of claim 8 wherein a heater plug is interposed between the empty plate and the heater plate, the heater being connected to the hot gas supply of the combiner such that The heater board is capable of heating the wafer. 1 1. The wafer positioning assembly of claim 1 wherein the stepper motor combination is mounted on the second stage, the step motor combination of electricity - 62 - 201008855 source screw from the step motor The wafer support plate assembly is extended and tangentially engaged. 12. The wafer positioning assembly of claim 11, wherein the working end of the power screw is fixed to a connector arm extending from the bearing table such that elongation and contraction of the power screw causes the wafer support plate The combination is rotated counterclockwise and clockwise, respectively. -63-