J14twf.doc/d 201006328 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種電路的製作方法，且 於一種立體線路的製作方法。 、】疋有關 【先前技術】 ^著電子技術的日新料，以及高科技電子 =出新，，輕、薄、短、小的趨勢 些電子元件彼此電性連接，並將線路板配置於 保祕路板及電子i件H電子產品的外型受限於 路板的形狀錢大小，而使電子產品的外财近似板狀 而少有其他的立體形狀。 參 因而’為了直接形成如線路板上的訊號線於立體元件 上，以取代習知的線路板，立體模塑互連裝置 Interconnect Device，ΜΠ))的概念孕育而生，其整合電子 與機械的功能於一立體元件上，改變了長期以來對=「平 面」印刷電路板的印象。MID技術能節省機殼内部的空 間’並使電子產品更微型化。 σ & 美國專利公開第2007/0247822號揭露一種印刷電路 結構及其方法，其以雷射對特殊成份的非導電複合高分子 材料（non-conductive aluminum nitride contained in high-molecular material)進行加工，再經由浸泡以進行金 屬化處理。但是，此種特殊材料的成本高，無法廣泛使用， 5J14twf.doc/d 201006328 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method of fabricating a circuit, and to a method of fabricating a three-dimensional line. 】About [previous technology] ^New technology for electronic technology, and high-tech electronics = new, light, thin, short, small trend, some electronic components are electrically connected to each other, and the circuit board is placed in the secret The appearance of the road board and the electronic component H electronic product is limited by the shape and size of the road board, and the external wealth of the electronic product is approximately plate-shaped and has few other three-dimensional shapes. The concept of "in order to directly form a signal line on a circuit board on a three-dimensional element to replace a conventional circuit board (Interconnect Device, ΜΠ)), which integrates electronic and mechanical The function on a three-dimensional component has changed the long-term impression of a "flat" printed circuit board. MID technology saves space inside the enclosure and makes electronic products more miniaturized. U.S. Patent Publication No. 2007/0247822 discloses a printed circuit structure and method thereof for processing a non-conductive aluminum nitride contained in high-molecular material by laser. It is then immersed for metallization. However, such special materials are costly and cannot be widely used, 5
201006328— ΐ且必财⑽七奴隸下製作線路圖 !。無法有效在凹凸面上製作微細線路，仍有待進—步黑 【發明内容】 線路作方法，其可形成立體 製作方法如下所述首::征在此提出-種立體線路的 絕緣結構具有至少=面=;立=構’且立體 組成薄膜，以全面覆*凹：面接=於凹凸面上形成-自 二、 復皿凸面。然後，於自組成薄膜卜报 -催化薄膜。之後’圖案化自組成薄臈與催化薄膜： 後，=化學沉積法在催化薄膜上形成—立體線路結構。、、、 在本發明之-實施例中，立體絕緣結構為一殼體、轴 7、支樓柱、滾輪、球體、失具、按鍵或燈且。 ^本發明之-實施例中，立體絕緣結構為 ▼、手環或塑膠墊片。 在本發明之-實施例中，立體絕緣結構的㈣包㈣ 膠或陶瓷。 在本發明之-實施例中，圖案化自組成薄膜與催化薄 膜的方法包括雷射燒蝕。 在本發明之-實施例中，圖案化自組成薄膜與催化薄 骐的方法包括以微影製程法去除。 ^在本發明之一實施例中，形成自組成薄膜的方法包括 浸泡法、喷灑或沉積。 6 201006328 —14twf.doc/d 在本發明之一實施例中 括射出成型。 立體絕緣結構的形成方法包 為具體描述本發明之内容，在此提出 =方法如下所述。首先’提供一立體絕緣結構= 絕緣結構具有至少一凹凸面。接著， 薄膜，T部分凹凸面:然後面==201006328— ΐ和必财(10) Seven slaves to make a road map! It is impossible to effectively make fine lines on the uneven surface, and it still needs to be advanced. [Inventive content] The line is a method for forming a three-dimensional manufacturing method as follows:: The insulation structure of the three-dimensional line is proposed to have at least = Face =; vertical = structure 'and three-dimensional composition of the film, to fully cover the * concave: face joint = formed on the concave and convex surface - from two, the convex surface of the dish. Then, the self-assembled film is reported as a catalytic film. After that, the pattern is self-assembled into a thin film and a catalytic film: After that, the chemical deposition method forms a three-dimensional line structure on the catalytic film. In the embodiment of the present invention, the three-dimensional insulating structure is a casing, a shaft 7, a column, a roller, a sphere, a buckle, a button or a lamp. In the embodiment of the invention, the three-dimensional insulating structure is a ▼, a bracelet or a plastic spacer. In the embodiment of the invention, the (four) package (iv) of the three-dimensional insulating structure is made of glue or ceramic. In an embodiment of the invention, the method of patterning the self-assembling film from the catalytic film comprises laser ablation. In an embodiment of the invention, the method of patterning the self-assembling film and the catalytic thin film comprises removing by a lithography process. In one embodiment of the invention, the method of forming the self-assembling film comprises soaking, spraying or depositing. 6 201006328 — 14 twf.doc/d In one embodiment of the invention, injection molding is included. The method of forming a three-dimensional insulating structure is specifically described in the context of the present invention, and the method is proposed as follows. First, a three-dimensional insulating structure is provided = the insulating structure has at least one uneven surface. Next, the film, T part of the concave and convex surface: then face ==
圖 薄膜。之後，以化學沉積法 在圖案化催化薄膜上形成一立體線路結構。 承 發明之—實施例中，立體絕緣結構為-殼體、轴 支撐柱、滾輪、球體、爽具、按鍵或燈且。 帶 f本發明之—實關中，立舰緣結構為-織物、錶 手環或塑膠墊片。 膠或=發明之—實施例中，立體絕緣結構的材質包括塑Figure Film. Thereafter, a three-dimensional line structure is formed on the patterned catalytic film by chemical deposition. In the embodiment, the three-dimensional insulating structure is a housing, a shaft support column, a roller, a ball, a cool, a button or a lamp. With the invention of the present invention, the ship's edge structure is - fabric, watch bracelet or plastic gasket. Glue or = invention - in the embodiment, the material of the three-dimensional insulation structure comprises plastic
在本發明之一實施例中 法包括噴印。 在本發明之一實施例中 括射出成型。 在本發明之一實施例中 包括喷印。 形成圖案化自組成薄膜的方 立體絕緣結構的形成方法包 形成圖案化催化薄膜的方法 t發明提tij —種立體線路的製作方法如下所述。首 ^，提供二立體絕緣結構，且立體絕緣結構具有至少—凹 2。接著於凹凸面上形成—自組成薄膜，以全面覆蓋 面。然後，於自組成薄膜上形成一催化薄膜。之後， 7 ^14twf.d〇c/d 201006328 於催化溥膜上形成—導電層。〜 案化阻鑛層，其具有至少 者’於―電層上形成一圖 後’於導電層之暴露於;口::;暴、^^^ 鍍層下的導電層、催/匕鍍層以及位於圖案化阻 化導電層、一圖案化催化薄膜膜，以形成-圖案 在本發明之-實施例中，、；：=:自組成薄膜。 ❹ 沉積法。 $成導電層的方法包括化學 承 具 帶 膠 中’立體絕緣結構為-殼體、轴 日日片封裝體、支撐柱、滾輪'球體、夾具、按鍵或燈 中’立體絕緣結構的材質包括塑 括射ίΐΓ之—實施财，謂絕緣結_形成方法包 ㈣2所述，本發明可在立體絕緣結構的凹凸面上形成 體線路結構’而不需形成在習知的線路板上。因此，本 發明可在各種絕緣浦上形成立斷路結構，例如可直接 在殼體上形成立體線路結構。如此一來，將可使電子產品 的外型不再於線路板騎彡狀紐積進岐電子產^ 的外型設計的自由度大幅提昇，並使電子產品的體積減少:。 為讓本發明之上述和其他目的、特徵和優點能更明顯 8 _iul4twf.doc/d 201006328 易懂’下文特舉實施例’並配合所附圖式，作詳細說明如 下。 【實施方式】 圖1Α〜圖1D為本發明一實施例之立體線路的製程剖 面示意圖。 Φ ❹ 首先，請參照圖1Α，提供一立體絕緣結構11()作為 之後形成的立體線路結構的基材，且立體絕緣結構n〇具 有一凹凸面112。值得注意的是，本實施例之凹凸面112 疋泛4日所有非平坦的表面（uneven surface )，例如弧面、 具有顆粒或凸起的表面、具有凹槽的表面或前述之組合、 或其他非平坦表面。 习於本實施例中，立體絕緣結構110的材質例如是塑 膠、陶瓷或是其他適合的絕緣材料，而立體絕緣結構110 可為设體、軸承、支雜、滚輪、球體、夾具、按鍵或燈 具等不易撓曲的物體。當立體絕緣結構110為塑膠類的製 =方或按鍵等，立體絕緣結構110例如以射出成 於其他實施例中，立體絕緣結構110的材質例如是棉 線、尼難或是其他適合的騎所組成的織物，而 體絕緣結構U0可為紐、錶帶或手縣可撓曲的物體。 薄膜：，’二圖*=:面112上形成，成 的方法包m 且形成自組成薄膜120 二垃紐括/叉泡法、噴灑、沉積或是其他適於使凹凸面全 接觸到自組成薄媒12G的鑛液的方法。 9 201006328 „14twf,oc/d 當以浸泡法形成自組成薄膜120時，詳細的形成方法 可為如下所述。首先進行步驟i，先將立體絕緣結構ιι〇 次泡於陰離子型聚合電解質溶液中，此陰離子型聚合電解 質溶液例如是10毫莫耳濃度（M)之聚丙烯酸(p〇ly(；acrylic acid)，PAA)。然後進行步驟2,以去離子水清洗立體絕 緣結構110。之後進行步驟3，將立體絕緣結構11〇浸泡於 • 雜子㈣合電解質驗，此陽離子型聚合電解質溶液例 魯 b是1G毫莫耳濃度（M)之聚㈣胺氯化氫（⑽y (allylamine hydrochloride) ’ PAH)。然後進行步驟 4， 再次將立體絕緣結構110浸泡於陰離子型聚合電解質溶液 中。 Ή 本實施例可藉由前述步驟i至步驟4來形成自組成薄 膜120，以達到對立體絕緣結構11〇的凹凸面112進行表 破質處理的功效。並且’可針對不陳f的立體絕緣結 . 構110而選用不同的陰離子型聚合電解質溶液與陽離子型 聚合電解質溶液。 ⑩ 繼續參照圖1B’於自組成薄膜12()上形成一催化薄 膜130，且形成催化薄膜13〇的方法包括浸泡法、喷麗、 沉積或是其他絲使自域薄膜12G麵接觸到催化薄膜 130的鐘液的方法。於本實施例中，催化薄膜13〇的鑛液 包括四氯把酸麟液⑽抑㈤或四氨二氯化免溶液⑽ (NH3) 4C12)或其他適合的麵溶液，並骑催化薄膜 130的鏟财之溶_發之後可析岐等金屬催化劑。、 之後’喷參照圖1C，圖案化自組成薄膜12〇與催化 201006328。— 薄膜130,以形成圖案化自組成薄膜咖與圖案化催化 膜130a’而圖案化自組成薄膜12〇與催化薄膜13〇的方法 可以是雷射燒飯。此外，圖案化自組成薄膜⑽與催化薄 膜130的方法還可以是以微影製程方式去除。然後，請參 照圖1D’以化學沉積法在圖案化催化薄膜丨術上形成二 立體線路結構140，而化學沉積法例如是化學銅沉積法。 值得注意的是，相較於習知技術只能在線路板上或平 ❿ 坦的表面上形成線路，本實施例的立體線路結構140可形 成在立體絕緣結構11〇的凹凸面112上，而不受限於習知 的線路板。因此’本實施例可在各種絕緣物體上形成立體 線路結構，例如可直接在殼體上形成立體線路結構。如此 來’將可使電子產品的外型不再受限於線路板的形狀與 體積’進而使電子產品的外型設計的自由度大幅提昇，並 • 使電子產品更微型化。又或者是，在電子產品中，可將一 部分的祕形成在轉板上，部分崎路形成在立 ϋ絕緣結構（如電子產品的外殼）上，如此一來可降低線 ❹ 路板的面積，進而降低電子產品的體積。 一圖2Α〜圖2C為本發明一實施例之立體線路的製程剖 面示意圖。 首先，請參照圖2Α，提供一立體絕緣結構210作為 之後形成的立體線路結構的基材，且立體絕緣結構21〇具 f 一凹凸面212。值得注意的是，本實施例之凹凸面212 疋乏4日所有非平坦的表面（unevensurface) ’例如弧面、 具有顆粒或凸起的表面、具有凹槽的表面或前述之組合、 11 201006328 ,u!4twf.doc/d 350。 之後’請參照® 3D ’移除圖案化阻鍍層34〇以及位 於圖案化阻鐘層340下的導電層33〇、催化薄膜32〇與自 組成薄膜310’以形成一圖案化導電層3施、圖案化催化 薄膜320a與圖案化自組成薄膜31〇a。 綜上所述，本發明可在立體絕緣結構的凹凸面上形成 • 立體線路結構’而不需形成在習知的線路板上。因此，本 ❿ 剌可在各_賴體上軸謂鱗結構，例如可直接 在喊體上形成立體線路結構。如此一來，將可使電子產品 的外型不再受限於線路板的形狀與體積，進而使電子產品 的外型設計的自由度大幅提昇，並使電子產品更微型化。 又或者是，在製造電子產品時，將一部分的線路形成在線 路板上，而另一部分的線路形成在立體絕緣結構（如電子 . 產品的外殼）上，如此可降低線路板的面積，進而使電子 產品更微型化。 雖然本發明已以實施例揭露如上，然其並非用以限定 9 树明’任⑽屬躺巾具有通f知識者，衫脫離本發 明之精神和範圍内，當可作些許之更動與潤飾，因此本^ 明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1A〜圖1D為本發明一實施例之立體線路的製程剖 面示意圖。 圖2A〜圖2C為本發明一實施例之立體線路的製程剖 面示意圖。 13 13 i〇I4twf.doc/d 201006328 或其他非平坦表面。有關立體絕緣結構2i〇的材質及用途 與上述實施例相同，在此不再贅述。 、接著，請參照圖2B，於凹凸面上形成一圖案化自組 成薄膜220 ’以覆蓋部分凹凸面212。在本實施例中，可以 直接用喷印的方式形成圖案化自組成薄膜㈣。然後，於 圖案化自組成薄膜220上形成一圖案化催化薄膜23〇 ,而 • *，圖案化催化薄膜23。的方法例如是噴印，且圖案化催 ❿ 化/專膜230的材質包括鹽類。之後，言青參照圖2C，以化學 /儿積法在圖案化催化薄膜Mo上形成一立體線路結構24〇。 一圖3A〜圖3D為本發明一實施例之立體線路的製程剖 面示意圖。 /首先，請參照圖3A，提供一立體絕緣結構210作為 之後形成的立體線路結構的基材，且立體絕緣結構210具 • 有一凹凸面212。接著，請參照圖3B，於凹凸面上形成一 自組成薄膜31〇 ’其全面覆蓋凹凸面212。然後，於自組成 薄膜310上形成一催化薄膜32〇。之後，在催化薄膜32〇 β 上开/成導電層330。开)成導電層330的方法包括化學沉 積法，或是其他適合的形成方法，其中化學沉積法例如是 化學鋼沉積法。 接著，請參照圖3C，在導電層330上形成一圖案化 阻鍍層340，其具有一開口 342以暴露出部分的導電層 330。然後，在導電層330之暴露於開口 342外的部分上以 電鍍法形成一立體線路結構350。值得注意的是，相較於 客知技術’本實施例可以電鍍法快速地形成立體線路結構 12 201006328 )14twf.doc/d 圖3A〜圖3D為本發明一實施例之立體線路的製程剖 面示意圖。 【主要元件符號說明】 110、210 :立體絕緣結構 112、212 :凹凸面 120、220a、310 :自組成薄膜 120a、220、310a :圖案化自組成薄膜 130、320:催化薄膜 130a、230、320a :圖案化催化薄膜 140、240、350 :立體線路結構 330 :導電層 330a :圖案化導電層 340 :圖案化阻鍍層 342 :開口In one embodiment of the invention the method includes printing. In one embodiment of the invention, injection molding is included. In one embodiment of the invention, printing is included. A method of forming a patterned three-dimensional insulating structure of a patterned self-assembled film comprises forming a patterned catalytic film. The method for fabricating a stereoscopic line is as follows. First, a two-dimensional insulating structure is provided, and the three-dimensional insulating structure has at least a concave 2. Then, a self-forming film is formed on the uneven surface to cover the entire surface. Then, a catalytic film is formed on the self-assembled film. Thereafter, 7 ^ 14 twf.d 〇 c / d 201006328 forms a conductive layer on the catalytic ruthenium film. ~ The case of the barrier layer, which has at least the 'formation on the electric layer' after exposure to the conductive layer; the mouth::; the storm, ^^^ the conductive layer under the coating, the ruthenium / ruthenium coating and located The patterned resistive conductive layer and a patterned catalytic thin film are formed to form a pattern in the embodiment of the present invention, ::=: self-assembled film.沉积 Deposition method. The method of forming the conductive layer includes the chemical bearing with the rubber in the 'stereo insulation structure--shell, the shaft and the solar package, the support column, the roller' sphere, the fixture, the button or the lamp. The material of the three-dimensional insulation structure includes plastic According to the invention, the invention can be formed on the uneven surface of the three-dimensional insulating structure without forming a conventional wiring board. Therefore, the present invention can form a vertical breaking structure on various insulating grooves, for example, a three-dimensional wiring structure can be formed directly on the casing. As a result, the electronic product's appearance will no longer be greatly increased in the design of the circuit board, and the electronic product will be reduced in size: The above and other objects, features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] FIG. 1A to FIG. 1D are schematic cross-sectional views showing a process of a three-dimensional line according to an embodiment of the present invention. Φ ❹ First, referring to Fig. 1A, a three-dimensional insulating structure 11 () is provided as a substrate of a three-dimensional line structure formed later, and the three-dimensional insulating structure n has an uneven surface 112. It should be noted that the uneven surface 112 of the present embodiment has all the uneven surfaces of 4 days, such as a curved surface, a surface having particles or protrusions, a surface having a groove or a combination thereof, or the like. Non-flat surface. In the present embodiment, the material of the three-dimensional insulating structure 110 is, for example, plastic, ceramic or other suitable insulating material, and the three-dimensional insulating structure 110 can be a body, a bearing, a branch, a roller, a sphere, a clamp, a button or a lamp. Such as objects that are not easily deflected. The three-dimensional insulating structure 110 is made of a plastic type, such as a square or a button, and the three-dimensional insulating structure 110 is formed, for example, in other embodiments. The material of the three-dimensional insulating structure 110 is, for example, a cotton thread, a nylon or a suitable riding frame. The fabric, and the body insulation structure U0 can be a flexible object of the button, the strap or the hand county. Film: ''Fig.*=: Formed on the surface 112, formed into a method of forming m and forming a self-assembled film 120. The method of spraying, depositing or depositing is suitable for making the concave-convex surface fully contact to self-composition. A method of thinner 12G ore. 9 201006328 „14twf, oc/d When forming the self-assembled film 120 by the immersion method, the detailed formation method can be as follows. First, step i is performed, and the steric insulating structure is first immersed in the anionic polyelectrolyte solution. The anionic polyelectrolyte solution is, for example, polyacrylic acid (PAA) at a concentration of 10 millimolar (M). Then, step 2 is performed to clean the three-dimensional insulating structure 110 with deionized water. Step 3, immersing the three-dimensional insulating structure 11〇 in the dop (4) electrolyte test, the cationic polyelectrolyte solution is a 1G millimolar concentration (M) poly(tetra)amine hydrogen chloride ((10)y (allylamine hydrochloride) PAH Then, in step 4, the three-dimensional insulating structure 110 is again immersed in the anionic polyelectrolyte solution. Ή In this embodiment, the self-assembled film 120 can be formed by the foregoing steps i to 4 to achieve the three-dimensional insulating structure 11〇. The uneven surface 112 performs the effect of the surface breaking treatment, and 'the different anionic polyelectrolyte solution and the yang can be selected for the stereoscopic insulating structure without the f. The ionic polyelectrolyte solution. 10 Continue to form a catalytic film 130 on the self-assembled film 12() with reference to FIG. 1B', and the method for forming the catalytic film 13〇 includes a soaking method, a spray, a deposition or other filament-forming film. The method in which the 12G surface is in contact with the clock liquid of the catalytic film 130. In the present embodiment, the mineral liquid of the catalytic film 13〇 includes tetrachloric acid lining liquid (10) (5) or tetraammine dichlorination free solution (10) (NH3) 4C12) Or other suitable surface solution, and riding the catalyst film 130 to dissolve the metal catalyst after the dissolution of the film, and then 'spraying with reference to FIG. 1C, patterning the self-assembled film 12〇 and the catalyst 201006328.—the film 130, The method of patterning the self-assembling film and patterned catalyst film 130a' to form the self-assembling film 12A and the catalytic film 13A may be laser cooking. In addition, the patterned self-forming film (10) and the catalytic film 130 are patterned. The method may also be removed by a lithography process. Then, referring to FIG. 1D', a two-dimensional line structure 140 is formed on the patterned catalytic thin film by chemical deposition, and the chemical deposition method is, for example, chemical copper deposition. It should be noted that the three-dimensional circuit structure 140 of the present embodiment can be formed on the concave-convex surface 112 of the three-dimensional insulating structure 11〇, compared with the prior art, which can only form a circuit on the surface of the circuit board or the flat surface. However, it is not limited to the conventional circuit board. Therefore, the present embodiment can form a three-dimensional line structure on various insulating objects, for example, a three-dimensional line structure can be directly formed on the casing. Thus, the appearance of the electronic product can be made. No longer limited by the shape and volume of the board', the degree of freedom in the design of electronic products is greatly increased, and electronic products are further miniaturized. Or, in the electronic product, a part of the secret may be formed on the rotating plate, and a part of the rugged road is formed on the vertical insulating structure (such as the outer casing of the electronic product), thereby reducing the area of the wiring board, In turn, the volume of electronic products is reduced. 2A to 2C are schematic cross-sectional views showing a process of a three-dimensional line according to an embodiment of the present invention. First, referring to FIG. 2A, a three-dimensional insulating structure 210 is provided as a substrate of a three-dimensional line structure formed later, and the three-dimensional insulating structure 21 has a concave-convex surface 212. It should be noted that the uneven surface 212 of the present embodiment lacks all the uneven surfaces of the 4th day, such as a curved surface, a surface having particles or protrusions, a surface having a groove, or a combination thereof, 11 201006328, u!4twf.doc/d 350. Then, please refer to ® 3D to remove the patterned resist layer 34 and the conductive layer 33 位于 under the patterned bell layer 340, the catalytic film 32 〇 and the self-assembled film 310 ′ to form a patterned conductive layer 3 . The patterned catalytic film 320a and the patterned self-assembled film 31〇a. As described above, the present invention can form a three-dimensional wiring structure on the uneven surface of the three-dimensional insulating structure without being formed on a conventional wiring board. Therefore, the ❿ 剌 can be a scale structure on each axis, for example, a stereo line structure can be formed directly on the body. As a result, the appearance of the electronic product is no longer limited by the shape and volume of the circuit board, thereby greatly increasing the freedom of designing the electronic product and making the electronic product more miniaturized. Or, in the manufacture of the electronic product, a part of the circuit is formed on the circuit board, and another part of the circuit is formed on the three-dimensional insulating structure (such as the outer casing of the electronic product), thereby reducing the area of the circuit board, thereby Electronic products are more miniaturized. Although the present invention has been disclosed above by way of example, it is not intended to limit the knowledge of the subject matter of the present invention, and the present invention may be modified and retouched. Therefore, the scope of protection of this invention is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to FIG. 1D are schematic cross-sectional views showing a process of a three-dimensional line according to an embodiment of the present invention. 2A to 2C are schematic cross-sectional views showing a process of a three-dimensional line according to an embodiment of the present invention. 13 13 i〇I4twf.doc/d 201006328 or other non-flat surface. The material and use of the three-dimensional insulating structure 2i are the same as those of the above embodiment, and will not be described herein. Next, referring to Fig. 2B, a patterned self-assembled film 220' is formed on the uneven surface to cover the partial uneven surface 212. In this embodiment, the patterned self-assembled film (4) can be formed directly by printing. Then, a patterned catalytic film 23 is formed on the patterned self-forming film 220, and the patterned catalytic film 23 is patterned. The method is, for example, printing, and the material of the patterned tempering/specific film 230 includes salts. Thereafter, referring to Fig. 2C, a three-dimensional line structure 24 is formed on the patterned catalytic film Mo by a chemical/integral method. 3A to 3D are schematic cross-sectional views showing a process of a three-dimensional line according to an embodiment of the present invention. / First, referring to FIG. 3A, a three-dimensional insulating structure 210 is provided as a substrate of a three-dimensional wiring structure formed later, and the three-dimensional insulating structure 210 has a concave-convex surface 212. Next, referring to Fig. 3B, a self-assembling film 31'' is formed on the uneven surface to cover the uneven surface 212 in its entirety. Then, a catalytic film 32 is formed on the self-made film 310. Thereafter, the conductive layer 330 is opened/formed on the catalytic film 32〇β. The method of forming the conductive layer 330 includes a chemical deposition method or other suitable formation method, wherein the chemical deposition method is, for example, a chemical steel deposition method. Next, referring to FIG. 3C, a patterned resist layer 340 is formed on the conductive layer 330, and has an opening 342 to expose a portion of the conductive layer 330. Then, a three-dimensional wiring structure 350 is formed by electroplating on a portion of the conductive layer 330 exposed to the outside of the opening 342. It is to be noted that, in comparison with the prior art, the present embodiment can form a three-dimensional line structure rapidly by electroplating. 12 201006328) 14 twf.doc/d FIG. 3A to FIG. 3D are schematic cross-sectional views showing a process of a three-dimensional line according to an embodiment of the present invention. . [Description of main component symbols] 110, 210: three-dimensional insulating structures 112, 212: concave-convex surfaces 120, 220a, 310: self-assembled films 120a, 220, 310a: patterned self-assembled films 130, 320: catalytic films 130a, 230, 320a : patterned catalytic film 140, 240, 350: three-dimensional line structure 330: conductive layer 330a: patterned conductive layer 340: patterned resist layer 342: opening
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