TW201005057A - Adhesive composition, adhesive film and dicing die-attach film - Google Patents

Abstract

This invention provides an adhesive composition that can produce an adhesive cured layer with low elastic modulus and low water absorption rate, and has excellent performance that may fill the recess region on the substrate without remaining voids (embedding performance), and also provides an adhesive film using the composition, and a dicing die-attach film using the composition. Particularly, this invention provides an adhesive composition, containing: (A) a (meta)acrylate based resin, having weight average molecular weight of 10,000 to 1,500,000 on a polystyrene conversion, and having functional groups reactive to one of or both of the following components (B) and c; (B) a compound having the structure of organic polysiloxane and having phenolic hydroxyl groups or epoxy groups; and c a curing catalyst and/or curing agent; an adhesive film, having a substrate and a layer disposed on the substrate and composed of the aforementioned composition; a dicing film, having substrate and a binding layer disposed on the substrate; and a dicing die-attach film, having a dicing film that has the substrate and the binding layer disposed on the substrate, and a layer disposed on the binding layer of the dicing film and composed of the aforementioned composition.

Description

201005057 VI. Description of the Invention: [Technical Field] The present invention relates to a composition suitable for use in attaching a semiconductor wafer to a substrate, in particular, a phenolic hydroxyl group or epoxy group A compound containing an organic polyoxane structure can produce a low modulus of elasticity and a low water absorption adhesive layer without causing voids (Φ void ) The adhesive composition capable of bonding the semiconductor wafer to the substrate, and the adhesive film and the dicing die attached film using the adhesive composition. [Prior Art] A semiconductor device is formed by (i) cutting a large-diameter 矽 wafer on which an IC (Intergrated Circuit) circuit is formed into a semiconductor wafer during dicing, and using a hardenable liquid. The die (bonding agent) heat-bonds the wafer to a lead frame and mounts it, (iii) after wire bonding between the electrodes, (iv) The improvement of the handling process and the protection of the external environment, and the manufacturer of the seal. In the sealed form, there are air-tight sealing such as metal sealing or ceramic sealing, and non air-tight sealing using a resin. At present, the latter method, particularly the transfer mould method using a resin, is excellent in mass productivity and low in cost, and is generally most widely used. -5-201005057 However, due to the above-mentioned liquid adhesive, it is easy to cause the occurrence of the tilt of the wafer due to the overflow of the wafer end or the uneven thickness, and the use of the tilt of the wafer is poor. The adhesive layer is placed on a die bonding film on the film. The adhesive transferred to the lead frame is hardened after the fixing process and exposed to hot gas during wire bonding, resin sealing, and the like. The semiconductor device is a package structure (CSP) structure of the same size as a wafer, a package structure of a wafer (a laminated CSP, a SiP (system component)), etc., which is formed as a compact year by year. The heat stress resistance and water absorption resistance required for such an adhesive have become very high. On the other hand, in the substrate, there is a concavo-convex portion caused by a circuit element such as a wiring, and when the substrate is subjected to thermo compression bonding of the semiconductor wafer, for example, as a subsequent material of the wafer. When the film, that is, when the wafer and the film are not completely immersed in the recess, the portion which is not buried is left as a void, and the void will expand in the heating of the crucible in the reflow furnace. Therefore, it is possible to damage the adhesive layer and affect the reliability of the semiconductor device. In particular, in recent years, it has been demanded to have anti-reflow properties at a high temperature (265 ° C) corresponding to lead-free solder, and it has been emphasized that importance of preventing the formation of voids is emphasized. Hereinafter, the performance of burying the concave portion on the substrate so as not to leave a void is simply referred to as "bury in performance". In order to solve the above problem, it is conceivable to heat-bond the semiconductor wafer to the substrate by using a recessed portion existing on the substrate after the molten wafer and the film invade the substrate, using a wafer with a low -6-201005057 melt viscosity. On the 'by the way to avoid the formation of voids, but still can not completely eliminate the formation of voids' and because of the long time for hot pressure bonding, or the need for high pressure and force, there will be problems of adverse effects on productivity. Furthermore, there is also a wafer followed by a film which is largely exposed from the wafer end, so that there is a problem of contamination of the electrode. As another method for solving the above problems, since the mold using the sealing resin φ is subjected to high temperature and high pressure, the remaining voids are heated and compressed in the resin sealing process to make the volume of the voids small. Then, it is absorbed in the wafer followed by the film, or in a state in which the volume of the reduced void is maintained, and the method of removing the void by the heat-hardening of the wafer followed by the film is performed. This method is advantageous in terms of manufacturing because no special process is required. On the one hand, the above-mentioned adhesive agent for the subsequent use of the wafer is specifically developed, and a material containing a plastic resin, an epoxy resin, a hard oxidizing agent, and a catalyst is developed (for example, Patent Document 1) To 5). However, these subsequent materials are excellent in adhesion, but the elastic modulus and water absorption of the cured product are relatively high. Moreover, the adhesive film using the adhesive material is fast due to the hardening reaction, such as the above method for removing the voids in the resin sealing process, and is increased by the heating of the wire bonding process before the resin sealing process. The rising speed of the melt viscosity of the large film makes it difficult to remove the void during the resin sealing process. That is, as a result of the increase in the melt viscosity, the volume of the voids cannot be sufficiently reduced, and it is difficult to absorb the voids in the resin. Such a conventional adhesive is difficult to fully bury the concave portion on the substrate -7-4 201005057, and it is necessary to improve the embedding performance. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document 5] Japanese Patent Laid-Open Publication No. 2000-154861. SUMMARY OF THE INVENTION [The present invention provides a low elasticity. An adhesive composition layer having a modulus and a low water absorption rate, and an adhesive composition excellent in embedding property, and an adhesive film using the adhesive composition and a cut/adhesive film. [Means for Solving the Problem] The present inventors have found that the above object can be attained by an adhesive composition containing a compound having a phenolic hydroxyl group or an epoxy group-containing compound having a specific organic polyoxyalkylene structure. The facts. That is, the first aspect of the present invention provides an adhesive composition characterized by containing (A) polystyrene-equivalent weight average molecular weight of 10, 〇〇〇 to 1,500, 〇〇〇, and (M)acrylic resin containing a functional group reactive with one or both of the following components (B) and (C), (B) The following general formula (1): -8 - 201005057 】

(1) wherein R is a mutually independent hydrogen atom or an unsubstituted or substituted carbon atom having 1 to 4 Å of an aliphatic monovalent hydrocarbon group, X is a hydrogen atom or a shrinkage # glyceryl group, and Z is an organic polyoxyl The divalent organic group of the alkane structure, and m is a number of 1 or more. 〕 indicates a compound containing an organic polyoxane structure, and (C) a hardening catalyst and/or a hardener. According to a second aspect of the present invention, there is provided a film comprising: a substrate; and a layer formed of the above-mentioned adhesive composition provided on the substrate. According to a third aspect of the present invention, a dicing-bonding film is provided, comprising: a dicing film having a substrate and an adhesive layer disposed thereon, and a dicing film disposed on the dicing film A layer formed on the adhesive layer of the film by the above-described adhesive composition. [Effects of the Invention] The adhesive composition of the present invention has a melt viscosity which is caused by heating during the wire bonding process, and has a melt viscosity which can sufficiently disappear the void during the resin sealing process. The voids can be removed in an easy and sufficient manner so as to have excellent embedding properties. Further, the adhesive composition -9-201005057 can be obtained by heat hardening to have a high adhesion force to various substrates, and an adhesive cured layer having a low modulus of elasticity and a low water absorption can be obtained. Therefore, the "adhesive composition" is useful for manufacturing a highly reliable semiconductor device. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. [(A) component] The component (A) is a polystyrene-reduced weight average molecular weight (Mw) of 10,000 to 1,500,000, and contains one or both of the following (B) components (C). A functional (meth)acrylic resin. In the present specification, '(meth)acrylic resin refers to a polymerization of a monomer unit derived from a (meth)acrylic monomer derived from acrylic acid, an acrylic acid derivative, methacrylic acid, and a methacrylic acid derivative. The meaning of things. The component (A) may be used singly or in combination of two or more. When it is used in combination of two or more groups, the component (A) may be a mixture of a (meth)acrylic resin containing the above functional group and a (meth)acrylic resin not containing the above functional group. The component (A) may, for example, be a single polymer or copolymer belonging to the above (meth)acrylic monomer or a copolymer of the (meth)acrylic monomer and another monomer, and polystyrene. The converted weight average molecular weight is 10,000 to 1,5 Å, and is a polymer containing a functional group reactive with one or both of the following components (B) and (C). In the copolymer of (methyl-10-201005057) acrylic monomer and another monomer, the content derived from the monomer unit is 5 to 50 mol% based on the total monomer in the component (A), Good for 1 to 30 moles. In the copolymer of the olefinic monomer and the other monomer, one type of these monomers may be used alone or in combination of two or more. The acrylic acid derivative may, for example, be an alkyl acrylate such as ethyl acrylate, butyl acrylate, isobutyl acrylate, acryl acrylate or lauryl acrylate; or a hydroxyalkyl group such as hydroxypropyl hydroxyacrylate. Ester; acrylate of benzyl acrylate group; propylimine acrylate TO-14 92 such as decylamine dimethacrylate (trade name, yttrium amide group containing yttrium imino group; glycidyl acrylate) The methacrylic acid derivative may, for example, be methyl ester, ethyl methacrylate, butyl methacrylate, methyl φ ester, 2-ethylhexyl methacrylate or methacrylic acid laurel. Alkyl acrylate; hydroxyethyl methacrylate, methacrylic acid hydroxyalkyl methacrylate; hydrocarbyl methacrylate such as benzyl methacrylate; decylamine such as dimethyl methacrylamide; An anthracene group-containing ester such as quinone imine methacrylate; an epoxy group-containing formamidine such as glycidyl methacrylate; and the other monomer described above may, for example, be acrylonitrile or a diene. Allyl Derivatives (allyl alcohol, allyl acetate, other monomer units, preferably (methyl) propyl, each containing methyl ester, propylene 2-ethylhexyl ester ethyl ester, propylene, etc. Aromatic-containing methacrylic methacrylic acrylate such as hydroxypropyl methyl hydroxypropyl group, such as an epoxy group-containing butyl acrylate or the like, such as phthalic acid, etc. Benzene-11 - 201005057 base ether, allyl benzyl ether, allyl benzoic acid, etc.). In the preferred embodiment of the present invention, the '(A) component' is contained in the following formula: [Chemical 2]

A copolymer of monomer units represented by CN. Such a copolymer ' can be produced by using acrylonitrile as the other monomer described above. The functional group ' in the component (A) is preferably an epoxy group, a carboxyl group, or a combination thereof from the viewpoint of the subsequent adhesion of the obtained cured layer of the adhesive. The functional group in the component (A), for example, is at least a part of a monomer used as a raw material of the component (A), and a monomer containing the functional group is used to carry out the synthesis of the component (A). It can be introduced into the component (A). The monomer having such a functional group may, for example, be acrylic acid, methacrylic acid, an epoxy group-containing acrylic acid derivative (for example, 'glycidyl acrylate), or an epoxy group-containing methacrylic acid derivative (for example). , glycidyl methacrylate), these monomers may be used alone or in combination of two or more. The content of the functional group in the component (A) is preferably from 0.002 to 0.1 mol, more preferably from 0.005 to 0.05 mol per 1 g of the component (A). If the content is within this range, a composition having sufficient embedding and energy and a layer of an adhesive having sufficient adhesion can be easily obtained. The polystyrene-equivalent weight average molecular weight of the component (A) is from 10,000 to 1,500,000, preferably from 50,000 to 1,500,000, preferably from 10,000,000 to ι, οοο, οοο. If the molecular weight is above 10,000 to 050 201005057, the adhesion and strength of the resulting cured layer of the adhesive may be lowered. When the molecular weight is 1,500,000 or more, the viscosity of the resulting composition may be too high and the handleability may be poor.

Further, the (meth)acrylic resin of the component (A) has a glass transition temperature (Tg) measured by thermomechanical analysis (TMA), preferably -40 ° C to 100 ° C, more preferably The component (B) which is -10 to 70 ° C Φ [(B) component] (B) is a compound having a structure of a polyorganosiloxane represented by the above general formula (1). The component (B) may be used alone or in combination of two or more. In the composition of the present invention, since the component (B) is contained, a cured layer having a low modulus of elasticity and a low water absorption can be obtained. When X in the above general formula (1) is a hydrogen atom, (B) The phenolic hydroxyl group in the φ group is compared with the phenolic hydroxyl group in the usual phenolic compound, and the reactivity with the epoxy group is suppressed. On the other hand, when X is a glycidyl group in the above general formula (1), the epoxy group in the component (B) is compared with the epoxy group in the usual epoxy compound, and is a phenolic hydroxyl group. Responsiveness is suppressed. Therefore, if the component (B) is used as a result of the composition of the present invention, good embedding performance can be achieved. In the above general formula (1), R! is a mutually independent hydrogen atom or an unsubstituted or substituted aliphatic monovalent hydrocarbon group having 1 to 4 carbon atoms, preferably 1 to 2 carbon atoms. The aliphatic monovalent hydrocarbon group may, for example, be an alkyl group of methyl, ethyl-13-201005057, propyl, isopropyl, butyl, isobutyl, t-butyl or t-butyl; A part or all of the hydrogen atom to which the carbon atom of the group is bonded is a group substituted with a halogen atom such as a fluorine atom, a bromine atom or a chlorine atom, for example, a chloromethyl group, a bromoethyl group, or a 3,3 group. A halogen-substituted alkyl group such as 3-trifluoropropyl or the like. Among these, a hydrogen atom and a methyl group are particularly preferred.

In the above general formula (1), Z is a divalent organic group having an organic polyoxane structure, and may be a linear chain or a branched chain or may have a cyclic structure. For Z, it can be exemplified that the following general formula (3) can be used: [Chemical 3] r2 Si-I R3

Si-〇-f-Si-〇V R3 R5 (3) [wherein, R2, R3, R4 and r5 are each an unsubstituted or substituted carbon atom having from 1 to 8 which does not contain an aliphatic unsaturated bond. A valence hydroxyl group, and η is a number from 0 to 50. 〕 indicates the structure of the organic polyoxane. In the above formula (3), R2, R3, R4 and R5 are each an unsubstituted or substituted unsubstituted or substituted monovalent hydroxy group having 1 to 8 carbon atoms, preferably 1 to 6 carbon atoms, which does not contain an aliphatic unsaturated bond. R2, R3, R4 and R5 may, for example, be methyl, ethyl, propyl, isopropyl, butyl, isobutyl, t-butyl, tert-butyl, hexyl or 2-ethyl. An alkyl group such as a hexyl group or an octyl group; a cycloalkyl group such as a cyclopentyl group or a cyclohexyl group; an aryl group such as a phenyl group, a tolyl group or a xylyl group; an aralkyl group such as a benzyl group or a phenethyl group; A part or all of the hydrogen atom to which the carbon atom of the group is bonded to -14,050,057 is a group substituted with a halogen atom such as a fluorine atom, a bromine atom or a chlorine atom, for example, 'chloromethyl group, bromoethyl group, 3'. A halogen-substituted alkyl group such as 3,3-trifluoropropyl or the like is preferable, and among them, a methyl group and a phenyl group are preferred. In the above general formula (3), 'η is a number from 0 to 50, preferably from 〇 to 20. In the above general formula (1), m is a number of 1 or more, preferably 1 to 200, more preferably 1 to 50, still more preferably 1 to 20. In a preferred embodiment of the present invention, the component (B) is in the above formula (1), and Z is a compound of the diorganopolysiloxane structure represented by the above formula (3). Such a compound is, for example, an allyl group-containing compound represented by the following general formula (4) and a polyorganohydrogen dioxane gas represented by the following general formula (5) in a platinum group metal catalyst. It can be produced by carrying out a hydroformylation reaction in the presence of a hydroformyl group. The allyl group-containing compound represented by the following general formula (4), the polyorganohydrogen dioxane gas represented by the following general formula (5), and the platinum group metal catalyst may each be used alone. It is also possible to combine two or more types. Further, a compound having two alkenyl groups other than the following general formula (4), for example, 1,5-hexadiene, ethylene glycol diallyl ether, butanediol diallyl, may also be used. Ether, diallyl benzene, 2,2-bis(4-allyloxyphenyl)propane, and the like. -15- 201005057

(4) [wherein R1 and X are the same as described above. 〕

【化5】

Rs

?2 丨4

H-Si-0-f-Si-O R3 (5) wherein R2, R3, R4, R5 and η are the same as defined above. The above hydroformylation addition reaction may be carried out in the absence of a solvent or in the presence of a solvent such as toluene. The reaction temperature is usually from 50 to 150 °C. In the above reaction, the amount of the allyl group-containing compound represented by the above formula (4) is 1 mol of the polyorganohydrogen dioxane shown in the above general formula (5), preferably 1 to 2 moles. The platinum metal-based catalyst can be used as a conventional one, and specific examples thereof include carbon powder containing platinum metal, platinum black, chlorinated second lead, uranium chloride, and chlorine. a reaction product of a phosphoric acid with a monohydric alcohol, a complex of a chloroplatinic acid and an alkene, a platinum (Pt) catalyst such as platinum acetoacetate; a palladium (Pd) catalyst; ) is a catalyst. The amount of the uranium metal-based catalyst added may be an effective amount which can promote the above-mentioned addition reaction. -1605005057 [(c) component] 'c) The hardening catalyst and/or hardener of the component (c) The ingredients blended by the hardening of matter. When X in the general formula (1) is a hydrogen atom as described in (B), since the epoxy group is present, the component (C) may also be φ), but (cl) epoxy resin and C2) Epoxy resin is very suitable for use. Further, as the component (B) and X in the _) is a glycidyl group, the (C3) ring is suitably used because of the (B) aldehyde group. Further, the component (c2) can also be used. • ( c 1 ) The epoxy resin of the epoxy resin (cl) component is preferably one φ having two epoxy groups. The (cl) component may be used alone or in combination of two or more. Epoxy resin of (cl) component: bis(4-hydroxyphenyl)methane, 2,2'-bis(4-glycidyl halide diglycidyl ether) and these polycondensate epoxy resins , bisphenol A type epoxy resin, etc.): dibutyl: vinyl cyclohexene dioxide; ether of 1,2-dihydroxybenzene, diglycidyl 2,3-ring of resorcinol Oxypropoxy)benzene, 4,4'-bis(2,3-epoxypropyl ether, 1,4-bis(2,3-epoxypropoxy)cyclohexene, etc. In the above (B) component, it will not be described later (the combination of the c3 catalysts is described in the general formula (there is no use of at least one type of the phenolic oxygen resin hardener molecule in one point, and may be exemplified) Propane or its (so-called bisphenol F ene diepoxide diglycidyl; ether, 1,4-bis(oxy)diphenyl diglycidyl-17- 201005057 ether; bis (3,4-epoxy) -6-Methylcyclohexylmethyl) adipate; polyglycidyl ether obtained by condensing a polyhydric phenol or a polyhydric alcohol with epichlorohydrin; a varnish-type phenolic resin such as a novolak or a cresol varnish Or halogenated varnish An epoxy varnish obtained by condensing a phenolic resin with epichlorohydrin (also, a varnish-type epoxy resin such as a novolac type epoxy resin or a cresol varnish type epoxy resin); a ring epoxidized by an oxidation method Oxidized polyolefin or epoxidized polybutadiene; epoxy resin containing naphthalene ring; bisphenol type epoxy resin; ^ phenolic aralkyl type epoxy resin; diphenyl aralkyl type epoxy resin; A diene type epoxy resin, etc. Further, a polyfluorene-modified epoxy resin may be used. Further, from the viewpoint of pressure-bonding of the resulting adhesive composition at a lower temperature and a lower pressure, a softening temperature is preferred. The epoxy resin below 100 ° C may also be a liquid epoxy resin. The softening temperature can be measured, for example, according to the ring and ball test (JIS K 723 4 ). In addition to the epoxy resin having at least two epoxy groups in the above one molecule, a mono epoxy compound may be used. For the epoxy compound, phenyl epoxy B may be exemplified. Alkane @, cyclohexene oxide, propylene oxide, methyl glycidyl ether, ethyl shrinkage Water glyceryl ether, phenyl glycidyl ether, allyl glycidyl ether, octylene oxide, epoxy dodecane, etc. Among them, bisphenol A type epoxy resin, cresol varnish type epoxy resin is preferable. Resin or a combination thereof • ( c2 ) Epoxy resin hardening catalyst (c2 ) component of epoxy resin hardening catalyst type is not specially controlled 1 -18- 201005057, and can be used by well-known. (c2) 'These may be used alone or in combination of two or more. The component (c2) may be exemplified by a phosphorus-based catalyst or an amine-based catalyst. The phosphorus-based catalyst may, for example, be triphenylphosphine, triphenylsulfate triphenyl borate or tetraphenylphosphinium tetraphenyl borate, or a compound represented by the following general formula. 【化6】

(wherein R is an independent hydrogen atom; a halogen atom such as a fluorine atom, a bromine atom, a chlorine atom or an iodine atom; an unsubstituted or substituted one-membered hydroxyl group having 1 to 8 carbon atoms; or a carbon number of 1 to The alkoxy groups of 8 may be all the same, may be partially the same, or may be different.) The above monohydric hydrocarbon group may, for example, be the same alkyl group or ring as those exemplified for the above R2 to R5. An alkyl group and an aryl group; an alkenyl group such as a vinyl group or an allyl group; an alkynyl group; a propynyl group; a part or all of a hydrogen atom to which a carbon atom of the group is bonded is a fluorine atom, A group substituted with a halogen atom or the like, such as a bromine atom or a chlorine atom, for example, a halogen-substituted alkyl group such as a chloromethyl group, a trifluoromethyl group, a bromoethyl group or a 3,3,3-trifluoropropyl group. The alkoxy group may, for example, be an alkoxy group such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group or a butoxy group. The amine-based catalyst may, for example, be 2-methylimidazole, 2-ethyl-4-methyl-19-201005057 imidazole, 1-cyanoethyl-2-methylimidazole or 2-phenyl-4. An imidazole derivative such as 5-dimethylol imidazole or the like. Preference is given to using 2-phenyl-4,5-dimethylolimidazole. • (c3) The epoxy resin hardener of the epoxy resin hardener (c3) component is not particularly limited, and various conventionally known ones can be used. The component (c3) may be used singly or in combination of two or more kinds depending on the curing property. The epoxy resin hardener of the component (c3) may, for example, be an aliphatic amine such as diethylenetriamine, triethylamine or diethylaminopropylamine; or an N-amino group. Ethyl piperazine, bis(4-amino-3-methylcyclohexyl)methane, menthan diamine, 3,9-bis(3-aminopropyl)-2,4,8,10 An alicyclic amine such as tetraoxaspiro(5,5)undecane; an exophenylene diamine, a paraphenylene diamine, a 1,2-diamine benzene, a 4,4-diamino group Phenylmethane, 2,2-bis(4-aminophenyl)propane, bis(4-(4-aminophenoxy)phenyl)anthracene, bis(4-(3-aminophenoxy)phenyl)砺, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl ruthenium, 3,3'-diamine Diphenyl hydrazine, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 4,4'-bis(4-aminophenoxy)biphenyl, 2 , 6-dialkylpyridine, bis(3-aminophenyl)diethyldecane, 4,4'-diaminodiphenyldiethyldecane, benzidine, 3,3'-dichloro Benzidine, 3,3'-dimethoxybenzidine, 4,4'-diaminodi Ketone, anthracene, fluorene-bis(4-aminophenyl)-n-butylamine, hydrazine, hydrazine-bis(4-aminophenyl)methylamine, 1,5-diaminonaphthalene, 3,3' - dimethyl-4,4'-diaminobiphenyl, 4-aminophenyl-3-aminobenzoate, anthracene, fluorene-bis(4-aminophenyl)aniline, double (p--) 3-amino group -20- 201005057 tributylphenyl)ether, p-bis-2-(2-methyl-4-aminepentyl)benzene, p-bis(1,1-dimethyl-5-amine Pentyl)benzene, (1,3-bis(4-aminophenoxy)benzene, m-xylylenediamine, p-xylylenediamine, 4,4'-diaminobis'phenyl ether phosphine oxide An aromatic amine such as 4,4'-diaminodiphenyl N-methylamine or 4,4'-diaminodiphenyl N-phenylamine; epoxy resin-diethylidene 'Modified aliphatic polyamines such as amine adducts, amine-ethylene oxide adducts, cyanoethylated polyamines, etc.; bisphenol A, trimethylol allyl hydroxyphenol, low 0 degree of polymerization Resin varnish resin, epoxidized or butylated phenolic resin or Super BeckcitelOOl (made by Japan's Lacey Chemical Industry Co., Ltd.), Hitanol 4010 (made by Hitachi, Ltd.), Scado form L. 9 (Netherlands) Sc A phenolic phenolic resin containing at least two phenolic hydroxyl groups in a molecule such as a novolac varnish known by the trade name of meth., Ltd., Methylon 75108 (manufactured by General Electric Co., Ltd.), etc.; Beckamine P. 138 (Japan Laisy Hough) Carbon resin such as melamine, aniline resin, etc., known as the special chemical industry (share) system, Meilan (manufactured by Hitachi, Ltd.), U-Van 10R (made by Toyo Kogyo Co., Ltd.), etc. a resin; a polysulfide resin having at least two mercapto groups in a molecule such as a polythioether resin represented by the formula: HS(C2H4OCH2OC2H4SS)lC2H4OCH2OC2H4SH (wherein an integer of L = 1 to 10); anhydrous citric acid, anhydrous An organic acid such as hexahydrophthalic acid, anhydrous tetrahydrofurfuric acid, anhydrous pyromellitic acid, methyl nadic acid, dodecyl anhydrous succinic acid, anhydrous chlorendic acid or an anhydride thereof (anhydride): Didicyandiamide and the like. Among these, a phenolic resin (particularly, a novolak resin) and dicyandiamide are imparted to the obtained composition by a good molding workability of good-21 - 201005057, and the obtained hardened layer is imparted. It is preferred to be excellent in moisture resistance, non-toxic, and relatively inexpensive. [Component (D)] ^ In order to reduce the modulus of elasticity, water absorption, and coefficient of linear expansion of the obtained cured layer of the adhesive, the composition of the present invention is prepared as a component of the component (D) as an optional component. The chelating agent of the component (D) is not particularly limited, and a well-known person can be used. The component (D) may be used alone or in combination of two or more. The average particle diameter of the component (D) is preferably 1 〇 " m or less (for example, 0.1 to 10//m), more preferably 5 νηη or less (for example, 0.5 to 5//m).

. If the average particle diameter is 1 〇 #m or more, the smoothness of the surface of the film of the present invention may be impaired. Further, the maximum particle diameter of the component (D) is preferably 20 #m or less, more preferably 10/zm or less. Here, in the present specification, "average particle diameter" means an average particle Q diameter corresponding to a volume basis of 50% of the cumulative distribution obtained by the particle size distribution measuring apparatus using the laser light diffraction method. Further, the "maximum particle diameter" means the maximum 粒径 of the particle diameter in the measured cumulative distribution when the average particle diameter is determined as described above. The component (D) may, for example, be an inorganic ruthenium agent such as cerium oxide micropowder, conductive metal particles such as alumina, titania, carbon black or silver particles; or an organic ruthenium such as polyfluorene oxide particles. Filling. Among these, cerium oxide fine powder and polyoxynized fine particles are preferred. Hereinafter, the cerium oxide fine powder and the polyoxynium oxide fine particles will be described in detail. -22- 201005057 • cerium oxide micropowder The cerium oxide micropowder is not particularly limited and can be used by a well-known person. The cerium oxide micropowder may be used singly or in combination of two or more. The average particle size and maximum particle size of the cerium oxide micropowder are the same as those generally described for the component (D). The cerium oxide fine powder ' is preferably an organic 矽 φ compound such as an organic alkoxy decane, an organic chloro decane, an organic decane, or a low molecular weight siloxane, from the viewpoint of fluidity of the obtained composition. Wait for the surface treatment. The cerium oxide fine powder may, for example, be a reinforcing silica crystal such as fumed silica or subsidence silica: crystallinity of quartz or the like (crystalized silica) ). Specifically, it can be exemplified by Aerosil R972, R974, and R976 manufactured by Japan Gasol Co., Ltd.; SE-2050, SC-2050, SE-10050, and SO-E1 manufactured by Adma Technology Co., Ltd. S0-C1, S0-E2 'SO-C2, SO-E3, SO-C3, SO-E5, S0-C5; Shin-Etsu Chemical Co., Ltd. Musil 120A, Musil 130A, etc., manufactured by Industrial Co., Ltd. • Polyoxynene fine particles The polyoxygenated fine particles are not particularly limited, and may be a known one, and examples thereof include polyoxyxylene rubber fine particles and cerium resin fine particles. The polysiloxane particles may be used singly or in combination of two or more. As the component (D), only polyfluorene oxide particles can be used, but from the viewpoint of more effectively reducing the elastic modulus and water absorption of the obtained cured layer, it is preferred to combine the polyoxynized particles with the above-mentioned ceria particles. use. The average particle size of the polysiloxane particles and the maximum particle size of -23-201005057 are the same as those generally described for the component (D). It is preferably a composite silicone rubber particle. The composite polyoxyxene rubber particles are particles of a fine body of a polyorganosilsesquioxane resin which is formed by a polymerization reaction on the surface of at least a part of the surface of the polyoxy rubber particles. The composite polyxylene rubber fine particles can be produced, for example, by the method described in Japanese Laid-Open Patent Publication No. Hei 7-1968-15. That is, in the aqueous dispersion of spherical polyoxynene rubber particles having an average particle diameter of 0.1 to 10 //m, the alkaline substance _ itself or an alkaline aqueous solution thereof and the organic trialkoxide are added, and are spherical. The organotrialkoxydecane is hydrolyzed and polymerized on the surface of the polyoxyxene rubber particles, and then 'dried to obtain composite polyoxyxene rubber particles. The content of the polyorganopose sesquioxane resin is 100 parts by mass of the spherical polyoxyxene rubber particles.

It is preferably from 1 to 500 parts by mass, more preferably from 2 to 100 parts by mass. If the content is at most the above lower limit ,, the dispersibility of the composite polyxylene oxide fine particles in the resulting adhesive composition is deteriorated, and the resulting adhesive film may become uneven in composition. On the other hand, when the content is more than the above upper limit 値, the elastic modulus of the cured layer obtained by the shellfish j Q may be increased. For the composite polyoxyxene rubber particles, for example, KMP-600, KMP-605, X-52-7030, etc. manufactured by Shin-Etsu Chemical Co., Ltd. can be used. [Other components] Further, in the composition of the present invention, in addition to the components (A) to (C), if necessary, other components (D) may be blended as other components within a range not inhibiting the object of the present invention. Various additives. The additive may be -24-201005057, a wettability improver, an antioxidant, a heat stabilizer or the like. * [Preparation of Composition] The adhesive composition of the present invention is prepared by mixing the components (A) to (C) and, if necessary, the component (D) and other components, using a mixer or the like. It can be modulated. The blending amount of the components (A) to (D) φ is as follows. First, a case where the compound of the above formula (1) in which the X of the general formula (1) is a hydrogen atom and which has a structure of a polyorganosiloxane is used will be described. In this case, the total amount of the component (B) and the component (c 1 ) is preferably 100 parts by mass to 100 parts by mass, more preferably 20 to 150 parts by mass, per 100 parts by mass of the component (A). The compounding amount of the component (cl) is a component (B), preferably 5 to 70% by mass, more preferably 10 to 50% by mass. The amount of the epoxy resin curing catalyst of the component (c2) may be an effective amount of φ as a catalyst, and is usually 0.005 to 10% by mass, particularly 0.01 to 5% by mass, to the adhesive composition of the present invention. . When the component (C3) is used, the amount of the compound may be the same as that described later as the case where X in the above general formula (1) is a glycidyl group. Next, a compound containing the organopolyoxyalkylene structure in which X in the above general formula (1) is a glycidyl group as the component (B) will be described. In this case, the total amount of the component (B) and the component (C3) is preferably 10 to 200 parts by mass, more preferably 20 to 150 parts by mass, per 100 parts by mass of the component (A). The compounding amount of the component (c3) is (B) component -25 to 201005057, preferably 1 to 80% by mass, more preferably 3 to 60% by mass, particularly preferably 1 to 10% by mass. Further, when the epoxy resin curing agent of the component (c2) is blended in the composition of the present embodiment, the amount is preferably 0.005 to 10% by mass, particularly preferably 0.01 to 5, for the composition. quality%. The compounding amount of the component (D) is preferably from 5 to 80% by mass, particularly preferably from 10 to 60% by mass, based on the adhesive composition of the present invention. If the blending amount is 5% by mass or less, the water absorption ratio and/or the coefficient of linear expansion of the obtained cured layer of the adhesive may be difficult to reduce. If the blending amount is more than 80% by mass, the elastic modulus of the resulting cured layer of the adhesive may increase. In particular, when the polyoxynene fine particles are blended as the component (D), the blending amount is preferably from 5 to 30% by mass, more preferably from 1 to 20% by mass, based on the adhesive composition of the present invention. If the amount is within this range, the elastic modulus, water absorption, and/or coefficient of linear expansion of the resulting adhesive layer may be difficult to increase, and strength may be difficult to reduce. Further, in the composition of the present invention, the molar ratio of the total epoxy group present in the composition to the total functional group (for example, a hydroxyl group, a carboxyl group, a fluorenyl group, an amine group, etc.) which will react with the epoxy group The oxime of (all-functional group reactive with an epoxy group) / (all-epoxy group) is preferably 〇5 to 1.5, particularly preferably 0.8 to 1.2. In the composition of the present invention, the hydroxyl group is, for example, the component (B) in the case where X in the above general formula (1) is a hydrogen atom, and the (c3) component in the case of a phenol resin, and the like. And contain. The carboxyl group is, for example, contained in the component (A) when the functional group is a carboxyl group. The epoxy group is, for example, a component (A) in the case where the functional group is an epoxy group, and the component (B) in the case where X in the above general formula (1) is a glycidyl group, and (cl) is -26-201005057 It is contained in the epoxy resin or the like. [Use of the composition] The adhesive of the present invention can be used, for example, as a target. The object to be observed may, for example, be a wafer or an LED wafer. The substrate may, for example, be a BTC butadiene resin substrate. φ For example, the adhesive composition of the present invention is applied onto a substrate in a suitable concentration and dried, and then the surface of the substrate on which the composition of the adhesive is applied is cured, and the adhesive is cured. The object can be attached to the substrate. In the past, for example, toluene, cyclohexanone, and N. methylpyrrolidone (aprotic polar solvent) may be exemplified at room temperature to 200 ° C, particularly preferably 80 to 150 ° C. Preferably, it is 3 to 10 minutes. The pressure is 0.013 MPa, mega pascal, and the best is 0.1 to 2 MPa. Heat-hardening, at 100 to 200 ° C, particularly preferably at a temperature of ° C for 30 minutes to 5 hours, particularly preferably 1 to again, may also be provided with a substrate, and is provided in the invention A layer formed of the adhesive composition (hereinafter, simply referred to as a "tackifier composition layer") is then attached to the substrate. For example, the product layer may be peeled off from the adhesive film, and the adhesive agent may be pressure-bonded between the substrate and the substrate, and heated to a substrate (light emitting diode) substrate. The drying in which the solvent is dissolved in the coating composition and the solvent is heated, NMP) or the like is carried out at a pressure of from 1 minute to 1 g at 10 MPa c for 120 to 185 hours. The film is composed of a film of the present composition, and the adhesive composition layer is interposed to carry out the -27-201005057. The object is attached to the substrate. The conditions of pressure bonding and heat hardening are the same as those described above. The above-mentioned adhesive film can be obtained by dissolving the adhesive composition of the present invention in a solvent at a suitable concentration in the same manner as described above and applying it to a substrate to dry it to form an adhesive composition layer. Examples of the solvent and drying conditions are the same as those described above. The film thickness of the subsequent composition layer is not particularly limited, and may be selected according to the purpose, and is preferably from 10 to 100 / / m, particularly preferably from 15 to 50 / / m. The substrate, which is usually in the form of a film, can be used, for example, as a polyethylene film, a polypropylene film, a polyester film, a polyamide film, a polyimide film, a polyimide film, or a polyether. A substrate such as an amine film, a polytetrafluoroethylene film, paper, a metal foil, or the like, or the substrate which has been subjected to mold release treatment, is particularly preferably a substrate which has been subjected to mold release treatment. The thickness of the aforementioned substrate is preferably 5 to 200 / zm, more preferably 10 to 100 ji m. The adhesive composition of the present invention can be used as the cut/adhesive film of the present invention. That is, the dicing die-bonding film of the present invention is provided with a dicing film having a substrate and an adhesive layer disposed thereon, and a pressure-sensitive adhesive layer provided on the dicing film. A layer formed from the composition of the adhesive of the present invention. The base material is usually in the form of a film. For example, polyethylene, polypropylene, polyvinyl chloride, and the like may be used. The thickness of the aforementioned substrate is preferably from 50 to 200 / / m, more preferably from 70 to 150 / zm. The adhesive which can form the above-mentioned adhesive layer may, for example, be an acrylic adhesive, a rubber adhesive, a polyurethane adhesive, or a polyoxynene adhesive. The thickness of the aforementioned adhesive layer -28 - 201005057 ' is preferably from 1 to 20 μm, more preferably from 5 to 10 #m. The dicing paste-bonding film of the present invention can be produced, for example, by laminating a layer of the adhesive composition 'layer' in the adhesive film of the present invention on the adhesive layer of the dicing film. Further, the adhesive composition of the present invention may be obtained by dissolving in an appropriate concentration in the same manner as the above, and applying it to a binder layer of the dicing film, followed by drying to form an adhesive composition layer. . The solvent, the drying conditions, and the film thickness of the adhesive composition layer are the same as those described above. For the dicing film, for example, a pressure-sensitive dicing film or an ultraviolet curing dicing film can be used. The adhesive composition of the present invention is manufactured not only in the manufacture of electronic parts such as semiconductor devices, but also in the manufacture of various products including the subsequent processes, for example, LED (Light Emitting Diode) parts, sensors, and liquid crystal parts. It can also be used in manufacturing. [Embodiment] [Embodiment] Hereinafter, the present invention will be specifically described by way of examples and comparative examples, but the present invention is not limited by the following examples. [Preparation of the composition of the adhesive agent] The following components (A) to (D) are fed to the mixer of the rotation/revolution type according to the blending amount (parts by mass) shown in Table 1 or Table 2 (New Machine Company) (manufacturing system), adding methyl ethyl ketone or cyclohexanone and mixing -29-201005057 in such a manner that the total concentration of the components (A) to (D) can be 20% by mass to prepare an adhesive composition . (A) The (meth)acrylic resin (A) component is prepared by dissolving 40 parts by mass of each of the following resins in a resin solution obtained by dissolving 60 parts by mass of cyclohexanone. Here, the blending amount of the component (A) shown in Table 1 or Table 2 is not the blending amount of the resin solution, but is converted into the amount of the resin itself. • Acrylic resin A: SG-P3, epoxy functional group amount: 0.021 mol/100 g, Tg (glass transition temperature) 12°C, MW (weight average molecular weight): 850,000, manufactured by Nagase Chemical Technology Co., Ltd. • Acrylic resin B: SG-708-6, epoxy functional group amount 0.016 mol/100g, Tg4°C, Mw700,000, manufactured by Nagase Chemical Technology Co., Ltd. (B) Compound containing organohavonane structure • Compound A (average structural formula) 【化7】

Gh3 gh3 (ch2>3-a-ο-ά-(CH2>3 ch3 ch3 (where X is glycidyl group and m = 5) • Compound B (average structural formula) -30- 201005057

【化8】

(wherein X is a glycidyl group, on the average, p is 7, q is 3, and η is 7.76.) • Compound C (average structural formula) [Chemical 9] H-2C=CHCH2

(wherein m is 5) • Compound D (average structural formula, weight average molecular weight [polystyrene conversion] = 4,600) -31 - 201005057 [Chemical 1 ο]

(In the formula, ρ is 7.54, q is 1_〇, η is 7.4) (C) Hardening catalyst and/or hardener (c 1 ) Epoxy resin • Epoxy resin 1: RE-310S, Flow epoxy resin, manufactured by Nippon Kayaku Co., Ltd. • Epoxy resin 2 : EOCN-1 020, manufactured by Nippon Kayaku Co., Ltd. • Epoxy resin 3 : jER-1 002, Japan Epoxy Resin Co., Ltd. (c2) Epoxy Resin hardening catalyst • 2?1^(2-phenyl-4,5-dihydroxymethylimidazole): manufactured by Shikoku Chemicals Co., Ltd. (c3) Epoxy resin hardener • Dicyanamide: Japanese epoxy resin Co., Ltd. • KA-1160: Novolac resin, manufactured by Dainippon Ink Chemical Co., Ltd. • MEH-7800: phenolic resin, manufactured by Minghe Chemical Industry Co., Ltd. -32- 201005057 (D) 塡 剂. 二 矽 矽 :: SE-2050, Spherical cerium oxide, average particle size 0.5//m, manufactured by Adelma Technologies Co., Ltd. • Composite polyoxyn oxy rubber particles: X- 5 2-703 0, average particle size 〇.7 //m, Shin-Etsu Chemical Industry Co., Ltd. [Preparation of film] Next, each of the adhesive compositions was applied onto a PET (ethylene terephthalate) film having a thickness of 50/zm coated with a fluorine-containing polyfluorinated release agent. Heat drying at 110 °C 10 Bell, to produce thickness comprising about 25 / zm adhesive composition layer of the film followed. [Test] The following test was carried out for each of the obtained films. The results are shown in Table 1 or Table 2. Young's modulus A layer of the adhesive composition remaining from the film-peeled PET film was superposed by 8 sheets of 'thermal lamination at 90 C' and heated at 175 C for 2 hours to harden it. Cut a film of 40mmxl0mm x200 #m and use it as a test piece, using a dynamic visco elasticity measuring device, according to the tension mode, and the distance between the chucks is 10 mm, and the temperature is measured _ 8 〇 °C to The Young's modulus is measured at 3 0 0 ° C and at a measurement frequency of 1 Η z (Hz). -33- 201005057 (2) The water absorption rate is overlapped by 8 layers of the adhesive composition layer remaining from the PET film after the film is peeled off, and after heat lamination at 90 ° C, heat treatment is performed at 175 ° C for 4 hours so that It is dry and hardened. A test piece of a shape of 50 mm x 50 mm x 200 / / m was cut and immersed in water. After 168 hours, the test piece was taken out from the water to wipe the adhered water on the surface to measure the weight (W) of the test piece. Then, after drying the test piece at 120 ° C for 4 hours, the weight (Wo ) was measured. The water absorption rate is calculated according to the following formula. Water absorption rate (%) = [(W-Wo) / W]xl 3 (3) Initial adhesion The wafer of thickness 450#m was diced into a 2mm x 2mm wafer, and in this way On the back side of the cut wafer, the adhesive film was heat-pressed at 100 ° C in such a manner as to contact the adhesive composition layer. Next, the subsequent film is cut into the same shape as the wafer to take out the wafer with the subsequent film. From this, the PET film was peeled off to obtain a tantalum wafer with an adhesive composition layer. Then, it is placed on a BT substrate or a ruthenium substrate of a 10 mm x 10 mm thick film coated with a resist AUS 303 (manufactured by U-Tech Co., Ltd.) so as to be in contact with the surface on which the adhesive composition layer is adhered. The resulting tantalum wafer with the adhesive composition layer was subjected to hot press bonding for 2 seconds at 170 ° C and 0.1 MPa to be fixed. The substrate on which the tantalum wafer was fixed in this manner was heated at 1, 75 °C for 4 hours to harden the adhesive composition layer to prepare a test piece (following the test piece). Using the test piece, a bonding tester (b〇nd tester) (manufactured by DAGE, 4000 PXY) was used to measure the shearing force between the layer of the cured adhesive 201005057 and the substrate at 260 °C. ) (4) Adhesion after high temperature and high humidity The test piece of the above (2) was held under the strip of 85 ° C / 60% RH (relative humidity) for 168 hours, followed by reflow at 260 ° C. After reflowing the furnace three times, the shearing force was measured at 260 ° C in the same manner as in the above (3). (5) Embedding performance The surface of one side of the tantalum wafer having a diameter of 8 Å and a thickness of 75 was subjected to thermal compression bonding of the film at 70 ° C in such a manner as to be in contact with the composition layer of the adhesive. The pressure sensitive dicing film is applied to the adhesive layer of the pressure sensitive dicing film in the form of an adhesive composition layer of the wafer with the adhesive composition layer obtained by peeling off the PET film by the thermocompression bonding film. Attach it. This wafer was cut into a 9 mm square germanium wafer according to the following cutting conditions. Then, the 9 mm square ytterbium wafer obtained in this manner was peeled off from the adhesive layer of the pressure-sensitive dicing film in a state in which the adhesive composition layer was attached to the back surface. This wafer was subjected to a wafer bonding device (BESTEM-D02-TypeC) manufactured by NEC (Nippon Electric) Co., Ltd., and 50 mm x 50 mm x having a stripe type circuit pattern of 5 to 15 " A resin substrate having a thickness of 250 // m (a BT substrate coated with a resist AUS3 03) is placed in such a manner as to be in contact with the composition layer of the adhesive, and is subjected to hot press bonding at 130 ° C and 0.1 MPa for 1 second. bell. When the first figure (the diagram showing the arrangement of the germanium wafer in the embedding performance test) is specifically described, a square-shaped germanium wafer 1 of 1-35-201005057 9 mm is formed on a square of 50 mm on one side. On the resin substrate 2, 16 sheets were arranged in four rows and four columns at intervals of 3 mm, and the interval between the outermost wafer 1 and the outer edge of the resin substrate 2 was set to 2.5 mm. The resin substrate to which the tantalum wafer was thermally pressed in this manner was heated at 170 ° C for 30 minutes at a heating temperature in the wire bonding process, and then a mold (mouid material) KMC2 was used from the resin substrate at a thickness of 600 μm. 5 00VA-T1 (manufactured by Shin-Etsu Chemical Co., Ltd.) was subjected to resin sealing (175 ° C, sealing pressure 6.9 MPa, 90 seconds), and the molding material was heat-hardened at 1 75 ° C for 4 hours. The interface between the adhesive cured layer and the resin substrate was observed using an ultrasonic image measuring device to check for the presence or absence of voids. Further, the presence or absence of voids was examined in the same manner as described above except that the heating time at 170 ° C corresponding to the heating temperature in the wire bonding was changed from 30 minutes to 90 minutes. If the presence of voids is not observed, then it is evaluated that the embedding performance is sufficient. On the other hand, if it is observed that there is a gap, then it is evaluated that the embedding performance is not enough. In Tables 1 and 2, "〇" indicates that the embedding performance is sufficient, and "X" indicates that the embedding performance is insufficient. Cutting conditions: Cutting device: cutter (dicer) DAD341 (made by TEXAS) Cutting method: cutting into single cut (dicing blade): Z1 : NBC-ZH 104F 27HEEE (Xi Shi Co., Ltd. -36- 201005057 Cutting blade rotation number: 40,000 rpm (6) Package reliability will be in the above (5) resin-sealed 矽E total of 16 pieces at 85 °C / 60% RH After three times of reflow furnace at 260 °C, the use of 3 "none" to observe the peeling between the crucible wafer and the substrate indicates that none of the 16 packages were observed to be stripped; at least one of the 16 packages was observed to have stripped wafers. The obtained group was kept for 168 hours, and then the ultrasonic image measuring device was ill. In Tables 1 and 2, the presence and the presence of "there" were separated.

-37- 201005057 [Table 1] Example Comparative Example 1 2 3 4 5 1 2 Next film El E2 E3 E4 E5 Cl C2 (8) Acrylic resin A 59.5 39 35 25 59.5 39 Acrylic resin B 59.5 (B) Compound A 24.23 9.45 Compound B 24.23 19.27 23.75 Compound C Compound D (cl) RE-310S 24.23 15.46 EOCN-1020 iER-1002 (c2) 2PHZ 0.065 0.025 0.065 (c3) Dicyanoguanamine 1.27 1.27 1.25 1.27 KA-1160 6.665 MEH-7800 6.325 10.475 (D) cerium oxide micropowder SE2050 15 15 15 40 50 15 15 composite polyoxyxene rubber particles X-52-7030 20 10 20 Next film characteristics Young's modulus (MPa) 450 260 175 670 750 780 360 Water absorption (%) 0.4 0.4 0.3 0.3 0.3 0.8 0.7 Subsequent (MPa) 初期 Initial stage of the substrate 3.7 3.6 3.4 4.1 4.4 3.9 3.7 After humidification 3.5 3.5 3.2 3.8 4.1 3.3 3.2 Subsequent (MPa) Initial BT substrate 3.6 3.4 3.4 4.2 4.2 3.9 3.6 After humidification 3.5 3.4 3.4 4.1 4.1 3.1 3.0 Buried performance 17 (TC/30min 〇〇〇〇〇 XX 170〇C/90min 〇〇〇〇〇 XX package reliability to j\w sister yiw Μ no Μ /»\Ν 有有201005057 [Table 2] Example Comparative Example 6 7 8 9 3 4 Next film E6 E7 E8 Ε9 C3 C4 (8) Acrylic resin A 59.5 42 35 59.5 35 Acrylic resin B 59.5 (B) Compound A Compound B Compound C 8.35 8.35 Compound D 13.3 8.65 (cl) RE-310S 6.35 9.19 EOCN-1020 8.23 8.23 10.63 9.98 jER-1002 8.23 8.23 9.98 (c2) 2PHZ 0.085 0.085 0.07 0.05 0.085 0.05 (c3) Cyanide amide KA-1160 5.46 5.76 MEH-7800 (D) cerium oxide micropowder SE2050 15 15 10 50 15 50 composite polyoxyn oxide particles X-52-7030 20 Next film characteristics Young's modulus (MPa) 220 150 120 1200 650 2100 Water absorption (%) 0.3 0.4 0.3 0.3 0.8 0.7 Subsequent (MPa) 初期 Initial stage of the substrate 4.6 3.8 3.1 5.3 4.4 5.2 After humidification 4.4 4.1 3.0 5.5 4.2 5.0 Subsequent (MPa) Initial BT substrate 4.8 3.8 3.2 5.3 4.7 5.3 After humidification 4.7 3.9 3.0 5.1 4.5 5.0 Buried performance 170〇C/30min 〇〇〇〇XX 170〇C/90min 〇〇〇〇XX Package reliability te Sister J \\s Μ j \\\ Μ J V \Ν 有 有 -39- 201005057 The compositions of Examples 1 to 5 contain the compound A or B having a glycidyl group. When comparing Examples 1 to 5 with Comparative Examples 1 and 2, it is understood that the compositions of Examples 1 to 5 are excellent in embedding performance, and the cured layer obtained from the compositions has a low Young's modulus. Low water absorption and excellent package reliability. The compositions of Examples 6 to 9 contained a compound C or D having a phenolic hydroxyl group. When comparing Examples 6 to 9 with Comparative Examples 3 and 4, it is understood that the compositions of Examples 6 to 9 are excellent in embedding performance, and the cured layer obtained from the compositions has a low Young's modulus. Low water absorption and excellent package reliability. [Industrial Applicability] The adhesive composition of the present invention is excellent in embedding performance, and the adhesive cured layer obtained from the adhesive composition is excellent in adhesion, low elastic modulus, and low water absorption. By. Therefore, the adhesive composition is useful for producing a bonding film for a semiconductor device having high reliability and a composition layer for an adhesive in a film. [Simple diagram of the drawing] Fig. 1 is a diagram showing the configuration of the wafer during the embedding performance test [Description of main components] 1 : 矽 wafer 2 : resin substrate -40-

Claims (1)

201005057 VII. Patent application scope: 1. An adhesive composition characterized by containing (A) polystyrene-converted weight average molecular weight of 1 〇, 000 to 1,500 〇〇〇, and containing the following The (meth)acrylic resin having one or both of the components (B) and (C) having a reactive functional group, and (B) the following general formula (1): Wherein 'R! is a mutually independent hydrogen atom or an unsubstituted or substituted aliphatic monovalent hydrocarbon group having 1 to 4 carbon atoms, X is a hydrogen atom or a glycidyl group, and Z is a structure containing an organic polyoxyalkylene. A divalent organic group, and m is a number of 1 or more, ® represents a compound having an organic polyoxane structure, and (C) a hardening catalyst and/or a hardener. 2. The adhesive composition of claim 1, wherein X is a hydrogen atom, and (C) is a combination of (cl) epoxy resin and (c2) epoxy resin hardening catalyst. 3. The adhesive composition of claim 2, wherein the epoxy resin of the (cl) component is a bismuth A type epoxy resin, a nail varnish type epoxy resin or a combination thereof. 4. The adhesive composition of claim 1, wherein X is a glycidyl group and (C) is a (c3) epoxy resin hardener. 5. An adhesive composition according to item 4 of the patent application, which further comprises an epoxy resin hardening catalyst of the component (c2). 6. The adhesive composition according to any one of claims 1 to 5, wherein in the above general formula (1), Z is the following general formula (3): '[Chemical 2] ^ $ r2 R3 r5 r3 (3) wherein R 2 , R 3 , R 4 and R 5 are each an unsubstituted or substituted monovalent hydroxy group having 1 to 8 carbon atoms which does not contain an aliphatic unsaturated bond, and η is 0 to 50], indicating the structure of the organic polyoxane.接着 7. The adhesive composition according to any one of claims 1 to 5, wherein the component (A) contains a monomer having the following formula: [Chemical Formula 3] 屮-扦 CN. 8. The adhesive composition according to any one of claims 1 to 5 wherein the functional group in the component (A) is an epoxy group, a carboxyl group, -42 - 201005057 or a combination thereof. The adhesive composition according to any one of claims 1 to 5, wherein the adhesive composition further contains (D) a hydrazine agent in an amount of 5 to 80% by mass. 10. The adhesive composition of claim 9, wherein the component (D) is cerium oxide micropowder, polyfluorene oxide microparticles or a combination thereof. An adhesive film comprising: a substrate; and a layer formed of the adhesive composition of any one of claims 1 to 10 which is provided on the substrate. 12. A cutting/adhesive film comprising: a dicing film having a substrate and an adhesive layer disposed thereon, and a patent application provided on the adhesive layer of the dicing film A layer formed by the adhesive composition of any one of items 1 to 10. Ο -43-