200951028 九、發明說明： 【發明所屬之技術領域】 本發明涉及真空技術領域，尤其涉及一種真空器件的 •封接裝置以及採用該封接裝置封接真空器件的方法。 *【先前技術】 真空技術於真空電子器件的製造中起著重要的作用， 真空問題越來越引起人們的關注（請參見，Vacuum problems of miniaturization of vacuum electronic component: a new 〇 generation of compact photomultipliers, Vacuum V64, P15-31 (2002))。真空器件的封接品質對器件的使用壽命具有重要 的影響。 請參閱圖1，先前技術提供一種真空器件的封接裝置2〇 以及採用該真空器件的封接裝置20對真空器件進行封接的 方法。該真空器件的封接裝置20包括一真空室202 ; —前容 置室204與後容置室206分別通過第一閘門208與第二閘門 210與該真空室202兩端相連通；一抽真空系統214分別與該 〇前容置室204與後容置室206以及真空室202相連通；至少一 運輸裝置212設置於該真空室202内，該運輸裝置212可於前 容置室204與後容置室206以及真空室2〇2之間運動；一聚光 封口裝置216設置於該真空室202外，該聚光封口震置216可 通過透光孔218對真空室202内的預封接器件22〇的排氣管 222進行加熱封接。 採用上述真空器件的封接裝置2〇對預封接器件22〇進 行封接的方法具體包括以下步驟：提供至少一預封接5|件 220 ’該預封接器件220包括一排氣管222 ;將該至少一預封 200951028 接器件220置於前容置室204内的運輸裝置212上，對前容置 室204抽真空，使前容置室204與真空室202的真空度相同； 打開第一閘門208使載有預封接器件220的運輸裝置212進 -入真空室202後關閉第一閘門208 ;對真空室202抽真空一段 -時間後，使預封接器件220逐個從聚光封口裝置216下方通 過，通過聚光封口裝置216照射排氣管222，對預封接器件 220進行逐個封接；對後容置室206抽真空，使後容置室206 與真空室202的真空度相同；打開第二閘門210，使封接後 〇的預封接器件220進入後容置室206後關閉第二閘門210;將 封接後的預封接器件220從後容置室206取出。重複上述步 驟，可實現對複數個預封接器件220的連續封接。 然而，採用上述裝置及方法對真空器件進行封接具有 以下不足··第一，需要於預封接器件220上預先設置一排氣 管222，並將該排氣管222與預封接器件220封接，故，工藝 .較為複雜，成本也較高。第二，採用排氣管222排氣封接， 於封裝好的真空器件上就會留下一突起的尾巴狀排氣管， Ο這對真空器件的安全性和穩定性帶來威脅。第三，排氣管 222於加熱時放出的氣體會進入預封接器件220内，從而影 響真空器件的真空度。另，上述真空器件的封接裝置需要 專門的聚光封口裝置，製備成本高。 有鑒於此，確有必要提供一種真空器件的封接裝置以 及封接方法，該封接裝置無需專門的聚光封口裝置，且該 封接方法可降低製備成本，獲得高真空度，且沒有安全隱 患的真空器件。 【發明内容】 200951028 一種真空器件的封接裝置，其包括：一真空室；一前 容置室與一後容置室，且該前容置室與後容置室分別通過 一第一閘門與一第二閘門與該真空室兩端相連通；一抽真 空系統分別與該前容置室、後容置室以及真空室相連通； .至少一運輸裝置，可于前容置室、真空室以及後容置室之 間運動，其中，該真空器件的封接裝置進一步包括：一低 熔點玻璃粉熔爐設置於所述真空室上方，該低熔點玻璃粉 熔爐通過一輸入管道與真空室相連通，所述低熔點玻璃粉 熔爐上设有一控制部件，一第一加熱裝置設置於輪入管道 與第二閘門之間的真空室内壁上。 一種真空器件的封接方法，其包括以下步驟：將一定 量的低溶點玻璃粉料置入所述低溶點玻璃粉溶爐内，並董子 低熔點玻璃粉熔爐進行抽真空密封，然後將該低熔點玻螭 粉料加熱至熔融態；提供至少一預封接器件，所述預封接 器件包括一殼體以及一排氣孔；將該至少一預封接器件置 ◎於前容置室内的運輸裝置上，並通過該抽真空系統對前容 置室進行抽真空；使該至少一預封接器件進入真空室，通 過輸入管道的下方，在每個預封接器件的排氣孔上設置一 定量的炼融態的低熔點玻璃粉料，從而對預封接器件的排 氣孔進行逐個封接，而後凝固熔融態的低熔點玻璃粉料； 對後容置室進行抽真空，並使該預封接器件進入後容置 室’且通過後容置室將該預封接器件取出。 與先前技術相比較，本技術方案提供的真空器件的封 接裝置及封接方法具有以下優點：第一，無需在預封接器 11 200951028 件上預先設置一排氣管，後續也無需一將該排氣管與預封 接器件封接的步驟，使製備工藝簡化，製備成本降低。第 二，製備得到的真空器件沒有突起的尾巴狀排氣管，提高 * 了真空器件的安全性和穩定性。第三，無需排氣管，避免 ‘了加熱軟化排氣管時放出的氣體進入預封接器件内，提高 了真空器件的真空度。第四，該真空器件的封接裝置無需 專門的聚光封口裝置，使製備成本降低。 0【實施方式】 以下將結合附圖詳細說明本技術方案的真空器件的封 接裝置以及真空器件的封接方法。 請參閱圖2,本技術方案實施例提供一種真空器件的 封接裝置30。該真空器件的封接裝置30包括：一真空室 302; —前容置室304與後容置室306分別通過第一閘門 312與第二閘門314與該真空室302兩端相連通；一抽真 空系統308分別與該前容置室304、後容置室306以及真 0空室302相連通；至少一運輸裝置310,可于前容置室304、 真空室302以及後容置室306之間運動；一可控溫的第一 加熱裝置336設置於真空室302内；一低熔點玻璃粉熔爐 316設置於所述真空室302上方，該低熔點玻璃粉熔爐316 通過一輸入管道334與真空室302相連通。 所述真空室302與前容置室304以及後容置室306的 容積不限，可根據實際情況設計。其中，真空室302用來 對預封接器件330進行烘烤、排氣和封接。前容置室304 用來對預封接器件330進行預抽真空，以確保真空室302 12 200951028 内具有較高真空度。後容置室306用來對預封接器件330 進行降溫。且，通過後容置室306可將封接好的電子器件 取出，而不會影響真空室302内的正常工作。 所述抽真空系統308為一機械栗配合一分子泵，或為 •一機械系配合一冷凝泵。其中，機械栗用來抽低真空，分 子泵或冷凝泵用來抽高真空。 所述運輸裝置310為一托架或其他運輸裝置。該運輸 裝置310可連續地運輸複數個預封接器件330，且每次可 U運輸複數個預封接器件330。 所述低熔點玻璃粉熔爐316設置於真空室302上方， 用來裝載和加熱低熔點玻璃粉料340。該低熔點玻璃粉熔 爐316與上述抽真空系統308相連通（圖中未顯示）。該低 熔點玻璃粉熔爐316在裝滿低熔點玻璃粉料340後可通過 進行抽真空密封。該低熔點玻璃粉熔爐316的底部通過一 輸入管道334與真空室302相連通，且該輸入管道334延 0伸至真空室302内。在輸入管道334位於真空室302内部 的一端形成有一喷嘴322。 該低熔點玻璃粉熔爐316上設有一控制部件，該控制 部件可為一進氣口 318與一抽氣口 320位於該低熔點玻璃 粉熔爐316的頂部，且該進氣口 318與抽氣口 320上分別 設置有一第一閥門342與一第二閥門344。通過該控制部 件可將一定量的熔融態的低熔點玻璃粉料3 4 0設置于預封 接器件330的排氣孔338上。具體實現過程為：當打開第 一閥門342，通過進氣口 318向低熔點玻璃粉熔爐316内 13 200951028 充惰性氣體，從而使得一定量的低熔點玻璃粉料340在氣 壓下通過輸入管道334及其喷嘴322滴到預封接器件330 的排氣孔338。然後，關閉第一閥門342，同時打開第二閥 ’門344，通過抽氣口 320抽真空，從而使低熔點玻璃粉料 340停止滴出。 所述可控溫的第一加熱裝置336設置於真空室302的 内壁，且位於輸入管道334與第二閘門314之間靠近輸入 0管道334的位置。通過該可控溫的第一加熱裝置336可對 輸入管道334進行加熱，使其溫度與低熔點玻璃粉料340 的熔融態溫度相同，從而確保熔融態的低熔點玻璃粉料 340可通過輸入管道334進入真空室302。進一步，本實施 例中，還可在真空室302的内壁，第一閘門312與輸入管 道334之間設置一可控溫的第二加熱裝置346，用來對預 封接器件330進行烘烤排氣。所述第一加熱裝置336與第 二加熱裝置346可為電熱絲、紅外照射器或鐳射照射器等。 0 可以理解，通過所述可控溫的所述可控溫的第一加熱 裝置336與第二加熱裝置346可使真空室302在使用時， 從第一閘門312到第二閘門314之間分別形成一第一溫度 梯度空間324、一第二溫度梯度空間326和一第三溫度梯 度空間328。其中，第二加熱裝置346對應於位於第一閘 門312與輸入管道334之間的第一溫度梯度空間324，第 一加熱裝置336對應於位於輸入管道334附近的第二溫度 梯度空間326，第三温度梯度空間328位於第二溫度梯度 空間326與第二閘門314之間。 14 200951028 本實施例中’溫度梯度空間的劃分以圖2中虛線為 准。所述第一溫度梯度空間324為中溫區，用來對預封接 •器件33〇進行烘烤排氣。第二溫度梯度空間Μ6為高溫區， 以確保熔融態的低熔點玻璃粉料34〇可通過輸入管道334 •進入真空室302。第三溫度梯度” 328為低溫使滴 在預封接器件330的排氣孔338上的熔融態的低溶點玻璃 粉料凝固，將預封接器件330的排氣孔338封接。其中， 第二溫度梯度空間326的溫度應與低熔點玻璃粉料34〇的 U熔融態溫度相同。 所述第一溫度梯度空間324,第二溫度梯度空間326 以及第三溫度梯度空間328的溫度範圍與所選低熔點玻璃 粉的軟化溫度有關。本實施例中，低溶點玻璃粉的軟化溫 度為300°C。所述第一溫度梯度空間324的溫度範圍為 200〜300°C，第二溫度梯度空間326的溫度範圍為3〇〇〜35〇 °C，第三溫度梯度空間328的溫度範圍為5〇〜2〇(Γ(：。 〇 本實施例提供的真空器件的封接裝置30,通過真空室 3〇2内的溫度梯度分佈實現對預封接器件33〇的烘烤排氣 和封接，無需專門的聚光封口裝置，使製備成本降低。 請參閱圖2及圖3，本技術方案實施例進—步提供一 種採用上述真空器件的封接裝置30封接真空器件的方 法’其具體包括以下步驟： 步驟一’將一定量的低熔點玻璃粉料34〇置入所述低 熔點玻璃粉烙爐316内，並對低熔點玻璃粉溶爐316進行 抽真空密封，然後將該低熔點玻璃粉料340加熱至熔融態。 15 200951028 所述低熔點玻璃粉料340可為任何的低熔點玻璃粉 料。在對該低熔點玻璃粉料340加熱的過程中，會有大量 的氣體排出，故，在加熱的過程中還需要進一步抽真空。 本技術放案中，由於在低熔點玻璃粉溶爐316内將低 '熔點玻璃粉料340加熱至熔融態的過程中將低熔點玻璃粉 料340内的氣體排出，故，可防止後續步驟的封接過程中， 由於低熔點玻璃粉料340排氣而導致真空器件器件的内部 0真空度的下降。 步驟二，提供至少一預封接器件330，所述預封接器 件330包括一殼體332以及一排氣孔338。 所述預封接器件330的殼體332材料可選擇為玻璃、 金屬等任意可通過低熔點玻璃粉料340封接的材料。所述 預封接器件330的大小根據實際情況選擇。 本實施例中的預封接器件330為一真空電子器件。殼 體332為玻璃，殼體332上開有一排氣孔338。該預封接 0器件330還進一步包括置於該殼體332内的其他電子元件 (圖中未顯示）。該排氣孔338的孔徑優選為2~10毫米。 可以理解，排氣孔338的孔徑不宜太小或太大。孔徑太小 不利於快速排氣，但孔徑太大會影響封接後的穩固性。 可以理解，所述預封接器件330不限於真空電子器 件，任何需進行永久性封裝的器件均可。 步驟三，將該預封接器件330置於前容置室304内的 運輸裝置310上，並通過抽真空系統308對前容置室304 進行抽真空。 16 200951028 首先，將預封接器件330按照預定順序排列於運輸裝 置310上，且要確保預封接器件330的排氣孔338向上。 然後，關閉前容置室304，並對前容置室304進行抽 •真空。 • 可以理解，本實施例中，可僅用機械泵對前容置室304 抽低真空，也可先用機械泵對前容置室304抽低真空，再 用分子泵或冷凝泵對前容置室304抽高真空，使前容置室 0 304與真空室302的真空度相同。 步驟四，使該預封接器件330進入真空室302，並對 該預封接器件330進行逐個封接。 首先，打開第一閘門312，使裝有預封接器件330的 運輸裝置310進入真空室302後，關閉第一閘門312。 可以理解，預封接器件330進入真空室302後，需要 進一步對真空室302進行抽高真空，以確保預封接器件330 可有較高的真空度。尤其步驟三中沒有對前容置室304抽 0高真空的情況下，該進一步對真空室302進行抽高真空的 步驟更為必要。 其次，使裝有預封接器件330的運輸裝置310通過第 一溫度梯度空間324。 於此過程中完成對預封接器件330的烘烤排氣。為將 預封接器件330内的氣體儘量排除，該裝有預封接器件330 的運輸裝置310可於第一溫度梯度空間324停留一段時間。 再次，使裝有預封接器件330的運輸裝置310通過第 二溫度梯度空間326。 17 200951028 排氣結束後使預封接器件330逐個通過輸入管道334 的喷嘴322的下方。當預封接器件330的排氣孔338到達 •輸入&道334的噴嘴322的下方時，打開第一閥門342， 通過進氣口 318向低熔點玻璃粉溶爐316内充惰性氣體， ^而使得-定量的低溶點玻璃粉料鳩於氣壓下通過輸入 s道334及其喷嘴322滴到預封接器件33〇的排氣孔338, 並將排氣孔338封住。然後，關閉第—㈣342，同時打 開第二閥門344,通過抽氣口 32〇抽真空，從而使低溶點 W玻璃粉料340停止滴出。 最後’使裝有預封接器件33〇的運輸裝置31〇通過第 三溫度梯度空間328。 此過程中’由於第三溫度梯度空間328為低溫區，故， 位於排氣孔338上熔融態的低熔點玻璃粉料開始凝固，完 成封接。 所述第一溫度梯度空間324,第二溫度梯度空間326 ◎以及第三溫度梯度空間328的溫度範圍與所選低熔點玻璃 粉的軟化溫度有關。本實施例中，低熔點玻璃粉的軟化溫 度為300°C。所述第一溫度梯度空間324的溫度範圍為 200〜300°C，第二溫度梯度空間326的溫度範圍為300〜350 °C，第三溫度梯度空間328的溫度範圍為50〜2〇(TC。 步驟五：對後容置室306進行抽真空，並使該至少一 預封接器件330進入後容置室306，且通過後容置室306 將該預封接器件330取出。 對後容置室306進行抽真空的過程與對前容置室3〇4 18 200951028 進行抽真空的步驟相同。當後容置室306的真空度與真空 室302内的真空度相同時，打開第二閘門314。使裝有預 封接器件330的運輸裝置310進入後容置室3〇6後，關閉 第二閘門314。然後，向後容置室遍通入氣體，當氣體 的壓強達到大氣壓強後，將封接好的真空器件取出:、 Ο 進一步，本實施例在將封接好的真空器件取出前，還 包括-對封接好的真空器件進行冷卻的步驟。冷 然冷卻，也可為水冷或風冷。 > 本技術方案提供的真空器件的封接方法具有以下優 點：第一，無需在預封接器件上預先設置一排氣管，以及 將該排氣管與預封接器件封接的步驟，使製備工藝簡化。 第二，採用無排氣管封接，使得製備的真空器件沒有突起 的尾巴狀排氣管，提高了真空器件的安全性和穩定性。第 二’無需專門的聚光封口裝置’使製備成本降低。 Λ提出=ΐ，Γ二確已符合發明專利之要件，遂依法 0 ^出專利h。惟’以上所述者僅為本發明之 =:==請專利範圍。舉凡熟悉本案技藝 所作之等效修飾或變化，皆應涵 【圖式簡單說明】 圖。圖1減前技術的真以件_接裝㈣結構示意 圖。圖2為本技術方案的真空器件的封接襄置的結構示意 19 200951028 圖3為採用本技術方案的真空器件的封接裝置封接真200951028 IX. Description of the Invention: [Technical Field] The present invention relates to the field of vacuum technology, and more particularly to a sealing device for a vacuum device and a method for sealing a vacuum device using the sealing device. * [Prior Art] Vacuum technology plays an important role in the manufacture of vacuum electronic devices, and vacuum problems are attracting more and more attention (see, Vacuum problems of miniaturization of vacuum electronic component: a new 〇generation of compact photomultipliers, Vacuum V64, P15-31 (2002)). The sealing quality of vacuum devices has a significant impact on the life of the device. Referring to Fig. 1, the prior art provides a sealing device 2 of a vacuum device and a sealing device 20 using the vacuum device for sealing a vacuum device. The sealing device 20 of the vacuum device comprises a vacuum chamber 202; the front receiving chamber 204 and the rear receiving chamber 206 are respectively connected to the two ends of the vacuum chamber 202 through the first gate 208 and the second gate 210; The system 214 is in communication with the front accommodating chamber 204 and the rear accommodating chamber 206 and the vacuum chamber 202; at least one transport device 212 is disposed in the vacuum chamber 202, and the transport device 212 can be disposed in the front accommodating chamber 204 and The accommodating chamber 206 and the vacuum chamber 2〇2 are moved; a concentrating sealing device 216 is disposed outside the vacuum chamber 202, and the concentrating sealing device 216 can pre-sealed the vacuum chamber 202 through the transparent hole 218. The exhaust pipe 222 of the device 22 is heat sealed. The method for sealing the pre-sealing device 22 by using the sealing device 2 of the vacuum device specifically includes the following steps: providing at least one pre-sealing 5|220" The pre-sealing device 220 includes an exhaust pipe 222 The at least one pre-sealed 200951028 device 220 is placed on the transport device 212 in the front accommodating chamber 204, and the front accommodating chamber 204 is evacuated to make the front accommodating chamber 204 and the vacuum chamber 202 have the same degree of vacuum; The first gate 208 closes the first gate 208 after the transport device 212 carrying the pre-sealing device 220 enters the vacuum chamber 202; after vacuuming the vacuum chamber 202 for a period of time, the pre-sealing device 220 is condensed one by one. The sealing device 216 passes underneath, and the exhaust pipe 222 is irradiated by the concentrating sealing device 216 to seal the pre-sealing device 220 one by one; the vacuum is applied to the rear accommodating chamber 206 to make the vacuum of the rear accommodating chamber 206 and the vacuum chamber 202 The second gate 210 is opened to close the second gate 210 after the sealed pre-sealing device 220 enters the rear housing chamber 206; the sealed pre-sealing device 220 is taken out from the rear housing chamber 206 . By repeating the above steps, a continuous sealing of the plurality of pre-sealing devices 220 can be achieved. However, the sealing of the vacuum device by the above device and method has the following disadvantages. First, an exhaust pipe 222 is required to be pre-sealed on the pre-sealing device 220, and the exhaust pipe 222 and the pre-sealing device 220 are disposed. Sealing, therefore, the process is more complicated and the cost is higher. Second, the exhaust pipe 222 is used to seal the exhaust, leaving a protruding tail-shaped exhaust pipe on the packaged vacuum device, which poses a threat to the safety and stability of the vacuum device. Third, the gas evolved by the exhaust pipe 222 upon heating enters the pre-sealing device 220, thereby affecting the vacuum of the vacuum device. In addition, the sealing device of the above vacuum device requires a special concentrating sealing device, and the preparation cost is high. In view of the above, it is indeed necessary to provide a sealing device for a vacuum device and a sealing method, which does not require a special concentrating sealing device, and the sealing method can reduce the manufacturing cost, obtain a high vacuum, and is not safe. Hidden vacuum devices. SUMMARY OF THE INVENTION 200951028 A sealing device for a vacuum device, comprising: a vacuum chamber; a front housing chamber and a rear housing chamber, and the front housing chamber and the rear housing chamber respectively pass through a first gate a second gate is connected to both ends of the vacuum chamber; a vacuum system is respectively connected with the front housing chamber, the rear housing chamber and the vacuum chamber; at least one transportation device is disposed in the front housing chamber and the vacuum chamber And the movement between the rear accommodating chambers, wherein the sealing device of the vacuum device further comprises: a low-melting glass frit furnace disposed above the vacuum chamber, the low-melting glass frit melting furnace is connected to the vacuum chamber through an input pipe The low-melting glass frit melting furnace is provided with a control component, and a first heating device is disposed on the vacuum chamber wall between the wheel-in pipe and the second gate. A sealing method for a vacuum device, comprising the steps of: placing a certain amount of low-melting point glass powder into the low-melting point glass powder melting furnace, and vacuum-sealing the Dongzi low-melting glass powder furnace, and then vacuum sealing Heating the low-melting glass matte powder to a molten state; providing at least one pre-sealing device, the pre-sealing device comprising a casing and a venting hole; placing the at least one pre-sealing device in the front Locating the transportation device in the room, and evacuating the front accommodating chamber through the vacuuming system; allowing the at least one pre-sealing device to enter the vacuum chamber, passing the exhaust pipe under each of the pre-sealed devices A certain amount of smelting low-melting glass powder is disposed on the hole, thereby sealing the vent holes of the pre-sealing device one by one, and then solidifying the molten low-melting glass powder; and vacuuming the rear accommodating chamber And allowing the pre-sealing device to enter the rear accommodating chamber' and withdraw the pre-sealing device through the rear accommodating chamber. Compared with the prior art, the sealing device and the sealing method of the vacuum device provided by the technical solution have the following advantages: First, there is no need to pre-set an exhaust pipe on the pre-sealing device 11 200951028, and there is no need to The step of sealing the exhaust pipe and the pre-sealing device simplifies the preparation process and reduces the manufacturing cost. Second, the prepared vacuum device has no protruding tail-shaped exhaust pipe, which improves the safety and stability of the vacuum device. Third, there is no need for an exhaust pipe to avoid the gas that is released when the heating and softening of the exhaust pipe enters the pre-sealing device, thereby increasing the vacuum of the vacuum device. Fourth, the sealing device of the vacuum device does not require a special concentrating sealing device, which reduces the manufacturing cost. [Embodiment] Hereinafter, a sealing device for a vacuum device and a sealing method for a vacuum device according to the present invention will be described in detail with reference to the accompanying drawings. Referring to FIG. 2, an embodiment of the present technical solution provides a sealing device 30 for a vacuum device. The sealing device 30 of the vacuum device comprises: a vacuum chamber 302; the front receiving chamber 304 and the rear receiving chamber 306 are respectively connected to the two ends of the vacuum chamber 302 through the first gate 312 and the second gate 314; The vacuum system 308 is in communication with the front accommodating chamber 304, the rear accommodating chamber 306, and the true vacant chamber 302; at least one transport device 310 is disposed in the front accommodating chamber 304, the vacuum chamber 302, and the rear accommodating chamber 306. Inter-movement; a temperature-controlled first heating device 336 is disposed in the vacuum chamber 302; a low-melting glass frit furnace 316 is disposed above the vacuum chamber 302, and the low-melting glass frit furnace 316 passes through an input pipe 334 and a vacuum Chambers 302 are in communication. The volume of the vacuum chamber 302 and the front accommodating chamber 304 and the rear accommodating chamber 306 is not limited and can be designed according to actual conditions. The vacuum chamber 302 is used to bake, vent, and seal the pre-sealing device 330. The front housing chamber 304 is used to pre-vacuate the pre-sealing device 330 to ensure a higher vacuum within the vacuum chamber 302 12 200951028. The rear housing chamber 306 is used to cool the pre-sealing device 330. Moreover, the sealed electronic device can be taken out through the rear accommodating chamber 306 without affecting the normal operation in the vacuum chamber 302. The vacuuming system 308 is a mechanical pump with a molecular pump, or a mechanical system with a condensing pump. Among them, the mechanical pump is used to pump low vacuum, and the molecular pump or condensate pump is used to pump high vacuum. The transport device 310 is a carrier or other transport device. The transport device 310 can continuously transport a plurality of pre-sealed devices 330 and can transport a plurality of pre-sealed devices 330 each time. The low-melting glass frit furnace 316 is disposed above the vacuum chamber 302 for loading and heating the low-melting glass frit 340. The low melting glass frit furnace 316 is in communication with the vacuuming system 308 described above (not shown). The low-melting glass frit furnace 316 can be vacuum-sealed after filling the low-melting glass frit 340. The bottom of the low melting glass frit furnace 316 is in communication with the vacuum chamber 302 via an input conduit 334 and extends into the vacuum chamber 302. A nozzle 322 is formed at one end of the input pipe 334 located inside the vacuum chamber 302. The low-melting glass frit 316 is provided with a control component. The control component can be an air inlet 318 and a suction port 320 at the top of the low-melting glass frit 316, and the air inlet 318 and the air inlet 320 are A first valve 342 and a second valve 344 are respectively disposed. A certain amount of the molten low-melting glass frit 3404 is placed on the exhaust hole 338 of the pre-sealing device 330 by the control member. The specific implementation process is: when the first valve 342 is opened, the inert gas is filled into the low-melting glass frit furnace 316 through the air inlet 318, so that a certain amount of the low-melting glass powder 340 passes through the input pipe 334 under air pressure. Its nozzle 322 drops to the venting opening 338 of the pre-sealing device 330. Then, the first valve 342 is closed while the second valve 'door 344 is opened, and a vacuum is applied through the suction port 320, so that the low-melting glass frit 340 is stopped from dripping. The temperature-controllable first heating device 336 is disposed on the inner wall of the vacuum chamber 302 and is located between the input pipe 334 and the second gate 314 near the input 0 pipe 334. The input conduit 334 can be heated by the temperature-controllable first heating device 336 to have the same temperature as the molten state of the low-melting glass frit 340, thereby ensuring that the molten low-melting glass powder 340 can pass through the input conduit. 334 enters vacuum chamber 302. Further, in this embodiment, a second temperature control device 346 can be disposed between the first gate 312 and the input pipe 334 on the inner wall of the vacuum chamber 302 for baking the pre-sealing device 330. gas. The first heating device 336 and the second heating device 346 may be a heating wire, an infrared illuminator or a laser illuminator or the like. 0 It can be understood that the temperature-controlled first heating device 336 and the second heating device 346 can control the vacuum chamber 302 from the first gate 312 to the second gate 314 when in use. A first temperature gradient space 324, a second temperature gradient space 326, and a third temperature gradient space 328 are formed. Wherein, the second heating device 346 corresponds to the first temperature gradient space 324 between the first gate 312 and the input pipe 334, the first heating device 336 corresponds to the second temperature gradient space 326 located near the input pipe 334, and the third The temperature gradient space 328 is located between the second temperature gradient space 326 and the second gate 314. 14 200951028 The division of the 'temperature gradient space' in this embodiment is based on the broken line in Fig. 2. The first temperature gradient space 324 is a medium temperature zone for baking and pre-sealing the device 33〇. The second temperature gradient space Μ6 is a high temperature zone to ensure that the molten low-melting glass frit 34〇 can enter the vacuum chamber 302 through the inlet conduit 334. The third temperature gradient 328 is a low temperature to solidify the molten low-melting point glass powder which is dropped on the vent hole 338 of the pre-sealing device 330, and the vent hole 338 of the pre-sealing device 330 is sealed. The temperature of the second temperature gradient space 326 should be the same as the U-melt temperature of the low-melting glass frit 34. The temperature ranges of the first temperature gradient space 324, the second temperature gradient space 326, and the third temperature gradient space 328 are The softening temperature of the selected low-melting glass frit is related. In this embodiment, the softening temperature of the low-melting point glass powder is 300° C. The temperature of the first temperature gradient space 324 ranges from 200 to 300° C., the second temperature The temperature of the gradient space 326 ranges from 3 〇〇 to 35 〇 ° C, and the temperature of the third temperature gradient space 328 ranges from 5 〇 to 2 〇 (Γ (: 封. The sealing device 30 of the vacuum device provided by the embodiment) The baking and venting and sealing of the pre-sealing device 33〇 are realized by the temperature gradient distribution in the vacuum chamber 3〇2, and no special concentrating sealing device is required, which reduces the preparation cost. Please refer to FIG. 2 and FIG. Technical solution embodiment provides a method for further adoption The method for sealing the vacuum device by the sealing device 30 of the vacuum device comprises the following steps: Step 1 'put a certain amount of low-melting glass frit 34 into the low-melting glass frit 316, and The low-melting glass frit furnace 316 is vacuum-sealed, and then the low-melting glass frit 340 is heated to a molten state. 15 200951028 The low-melting glass frit 340 may be any low-melting glass frit. During the heating of the melting point glass powder 340, a large amount of gas is discharged, so further vacuuming is required during the heating process. In the present technology, since the low melting point in the low melting point glass frit furnace 316 will be lowered. When the glass powder 340 is heated to the molten state, the gas in the low-melting glass powder 340 is discharged, so that the sealing process of the subsequent step can be prevented, and the vacuum device device is caused by the exhaust of the low-melting glass powder 340. The internal 0 vacuum is lowered. Step 2, at least one pre-sealing device 330 is provided, the pre-sealing device 330 includes a housing 332 and a venting opening 338. The housing 3 of the pre-sealing device 330 The material of 32 can be selected from any material which can be sealed by low-melting glass powder 340 such as glass, metal, etc. The size of the pre-sealing device 330 is selected according to the actual situation. The pre-sealing device 330 in this embodiment is a vacuum. The housing 332 is glass, and the housing 332 has a venting opening 338. The pre-sealing 0 device 330 further includes other electronic components (not shown) disposed within the housing 332. The pore diameter of the pores 338 is preferably 2 to 10 mm. It is understood that the pore diameter of the vent hole 338 is not too small or too large. The pore size is too small to facilitate rapid venting, but the pore size is too large to affect the stability after sealing. It is understood that the pre-sealing device 330 is not limited to vacuum electronics, and any device that requires permanent packaging may be used. In step three, the pre-sealing device 330 is placed on the transport device 310 in the front accommodating chamber 304, and the front accommodating chamber 304 is evacuated by the vacuuming system 308. 16 200951028 First, the pre-sealing devices 330 are arranged on the transport device 310 in a predetermined order, and it is ensured that the vent holes 338 of the pre-sealing device 330 are upward. Then, the front accommodating chamber 304 is closed, and the front accommodating chamber 304 is evacuated. • It can be understood that, in this embodiment, the front housing chamber 304 can be pumped with a low vacuum only by a mechanical pump, or the front housing chamber 304 can be vacuumed with a mechanical pump, and then the molecular pump or the condensing pump can be used for the front volume. The chamber 304 draws a high vacuum so that the vacuum of the front housing chamber 0 304 and the vacuum chamber 302 are the same. In step four, the pre-sealing device 330 enters the vacuum chamber 302, and the pre-sealing device 330 is sealed one by one. First, the first gate 312 is opened, and after the transport device 310 equipped with the pre-sealing device 330 enters the vacuum chamber 302, the first gate 312 is closed. It can be understood that after the pre-sealing device 330 enters the vacuum chamber 302, the vacuum chamber 302 needs to be further evacuated to ensure that the pre-sealing device 330 can have a higher degree of vacuum. In particular, in the case where the high vacuum is not applied to the front housing chamber 304 in the third step, the step of further evacuating the vacuum chamber 302 is more necessary. Next, the transport device 310 incorporating the pre-sealed device 330 is passed through the first temperature gradient space 324. The baking venting of the pre-sealing device 330 is completed during this process. To minimize the gas within the pre-sealing device 330, the transport device 310 incorporating the pre-sealing device 330 can remain in the first temperature gradient space 324 for a period of time. Again, the transport device 310 incorporating the pre-sealed device 330 is passed through the second temperature gradient space 326. 17 200951028 After the end of the exhaust, the pre-sealing device 330 is passed one by one through the nozzle 322 of the input pipe 334. When the venting opening 338 of the pre-sealing device 330 reaches below the nozzle 322 of the input & 334, the first valve 342 is opened, and the low-melting glass frit furnace 316 is filled with an inert gas through the inlet 318, ^ On the other hand, the -quantized low-melting point glass powder is dropped under pressure into the vent hole 338 of the pre-sealing device 33 through the input s 334 and its nozzle 322, and the vent 338 is sealed. Then, the - (four) 342 is closed, and the second valve 344 is opened, and the vacuum is sucked through the suction port 32, so that the low-melting point glass frit 340 is stopped from dripping. Finally, the transport device 31 equipped with the pre-sealing device 33A is passed through the third temperature gradient space 328. In this process, since the third temperature gradient space 328 is a low temperature region, the low-melting glass powder located in the molten state on the vent hole 338 starts to solidify and is sealed. The temperature ranges of the first temperature gradient space 324, the second temperature gradient space 326, and the third temperature gradient space 328 are related to the softening temperature of the selected low-melting glass frit. In the present embodiment, the softening temperature of the low-melting glass frit is 300 °C. The temperature range of the first temperature gradient space 324 is 200 to 300 ° C, the temperature range of the second temperature gradient space 326 is 300 to 350 ° C, and the temperature range of the third temperature gradient space 328 is 50 to 2 〇 (TC). Step 5: Vacuuming the rear accommodating chamber 306, and the at least one pre-sealing device 330 enters the rear accommodating chamber 306, and the pre-sealing device 330 is taken out through the rear accommodating chamber 306. The process of evacuating the chamber 306 is the same as the step of evacuating the front housing chamber 3〇4 18 200951028. When the vacuum degree of the rear housing chamber 306 is the same as the vacuum degree in the vacuum chamber 302, the second gate is opened. 314. After the transport device 310 equipped with the pre-sealing device 330 enters the rear accommodating chamber 3〇6, the second gate 314 is closed. Then, the gas is introduced into the rear accommodating chamber, and when the pressure of the gas reaches atmospheric pressure, The sealed vacuum device is taken out: Ο Further, before the removal of the sealed vacuum device, the embodiment further includes a step of cooling the sealed vacuum device. Cooling or water cooling may be used. Or air-cooled. > Vacuum provided by this technical solution The sealing method of the piece has the following advantages: first, there is no need to pre-set an exhaust pipe on the pre-sealing device, and the step of sealing the exhaust pipe with the pre-sealing device, so that the preparation process is simplified. The use of a non-exhaust pipe seal allows the prepared vacuum device to have no protruding tail-shaped exhaust pipe, which improves the safety and stability of the vacuum device. The second 'no need for a special concentrating sealing device' reduces the manufacturing cost. Raise = ΐ, Γ 二 has indeed met the requirements of the invention patent, 遂 ^ ^ 专利 专利 专利 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 = = = = = = = = = Or change, all should be [simplified description of the diagram] Figure 1. Figure 1 is a schematic diagram of the structure of the pre-reduction technology. Figure 2 is a schematic diagram of the structure of the sealing device of the vacuum device of the present invention. 3 is sealing the sealing device of the vacuum device using the technical solution
空器件的流程圖。 【主要元件符號說明】 真空器件的封接裝置 20, 30 真空室 202, 302 前容置室 204, 304 後容置室 206, 306 第一閘門 208, 312 第二閘門 210, 314 運輸裝置 212, 310 抽真空系統 214, 308 聚光封口裝置 216 過透光孔 218 預封接器件 220, 330 排氣管 222 低熔點玻璃粉熔爐 316 進氣口 318 抽氣口 320 喷嘴 322 第一溫度梯度空間 324 第二溫度梯度空間 326 第三溫度梯度空間 328 殼體 332 輸入管道 334 200951028 第一加熱裝置 336 排氣孔 338 低熔點玻璃粉料 340 第一閥門 342 第二閥門 344 第二加熱裝置 346Flow chart of empty devices. [Description of main components] Vacuum device sealing device 20, 30 Vacuum chamber 202, 302 Front housing chamber 204, 304 Rear housing chamber 206, 306 First gate 208, 312 Second gate 210, 314 Transport device 212, 310 vacuum system 214, 308 concentrating sealing device 216 through light transmission hole 218 pre-sealing device 220, 330 exhaust pipe 222 low melting point glass powder furnace 316 air inlet 318 suction port 320 nozzle 322 first temperature gradient space 324 Second temperature gradient space 326 Third temperature gradient space 328 Housing 332 Input pipe 334 200951028 First heating device 336 Vent hole 338 Low melting point glass powder 340 First valve 342 Second valve 344 Second heating device 346
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