200942120 九、發明說明 【發明所屬之技術領域】 本發明’係有關於多層可撓印刷配線板及其製造方 法，特別是有關於在纜線部中具有遮蔽層的多層可撓印刷 配線板之構造及其製造方法。 【先前技術】 ❹ 近年來’電子機器之小型化以及高功能化係日益進 步，因此，對於印刷配線板之高密度化的要求係提高。於 此，係藉由將印刷配線板從單面型而提昇爲兩面型或是3 層型以上之多層印刷配線板，而謀求印刷配線板之高密度 化。 作爲其中一環，以行動電話等之小型電子機器爲中 心，係廣泛的普及有：將安裝各種電子構件之多層印刷配 線板或是硬質印刷配線板之間藉由連接器等來作連接之另 ❹ 外的可撓配線板，或是具備有將可撓性扁平電纜（flat cable )—體化了的可撓性纜線部之多層可撓印刷配線 板。 特別是，在用於數位視訊攝像機者之中’係被要求有 3層乃至4層以上之多層可撓印刷配線板。又’使用於行 動電話中之多層可撓印刷配線板的纜線部’由於係成爲樞 紐彎折部，因此，在外形上之限制係爲大。 並且，樞紐彎折部係被要求有高彎折信賴性’並被要 求有就算是進行數十萬次之彎折亦能使電性特性之變化維 -4- 200942120 持在規格內。而，小型、薄型且高功能之行動電話的纜 線，其訊號線之根數亦係增加，僅靠單層之纜線，係無法 作對應，且亦被要求有從內層、外層之複數層的拉出，故 而，針對6層多層可撓印刷配線板，係有如同在專利文獻 1中所記載者。 除此之外，在多層可撓印刷配線板中，亦有著薄型化 之要求。此係因爲，伴隨著行動電話、數位視訊攝像機等 φ 之小型電子機器的高功能化，各構件尺寸之小型化係成爲 必要，故而，除了對於將此些作搭載之基板而亦能將功能 作維持之外，薄型化係成爲必要。作爲製造薄型之多層可 撓印刷配線板的方法，係存在有專利文獻2中所記載之方 法。 該方法，係藉由將成爲內層之纜線部的可撓印刷配線 板的覆蓋薄膜與外層之可撓性絕緣基底材作共用，而能夠 製造薄型之4層可撓印刷配線板。但是，由於外層纜線之 〇 形成係爲困難，因此係並未能夠達到解決上述問題的地 步。 又，如同於專利文獻3中亦有所記載一般，亦週知 有：在彎折纜線中，藉由未附加有電鏟之銅箔單層而單面 構成之纜線，在彎折時之導體的變形係爲少，而作爲彎折 特性係爲良好。在此點上，身爲多層型之專利文獻1以及 2所記載者係爲不適當。 進而，在行動電話之纜線等處，爲了同時達成彎折特 性與雜訊耐性，亦有必要在纜線之外側處形成銀糊或是銀 -5- 200942120 薄膜之類的遮蔽層。於此點上，專利文獻1以及2亦並非 爲適當。 由於上述原因，係期望一種能夠低價且安定地製造具 備著具有可進行從內、外層之複數層的拉出之彎折特性的 纜線部之薄型的多層可撓印刷配線板之方法的出現。 圖8，係爲展示先前技術之3層可撓印刷配線板之重 要部分構成的剖面圖（參考專利文獻1 )。此配線板，係 Q 爲具備有可進行從包含有具備遮蔽層之第2層以及第3層 之複數層的拉出之纜線部者。 首先，此係爲在聚醯亞胺等之可撓性絕緣基底材101 上貼合覆蓋層，而構成纜線部者。亦即是，對於在兩面上 具備有電路圖案之可撓性印刷配線板1 02的成爲纜線部之 層，貼合於聚醯亞胺薄膜等之絕緣薄膜103上具有接著材 104之所謂的覆蓋層105，而作爲第2層之纜線部106。 同樣的，在聚醯亞胺等之可撓性絕緣基底材107上， 〇 對於在單面上具備有包含第3層之纜線部的電路圖案之可 撓性印刷配線板1 〇 8的成爲纜線部之層，貼合覆蓋層 111，而作爲第3層之纜線部112。 此第2層之纜線106與第3層之纜線112，係藉由預 先被作了脫模之接著材113而被貼合。進而，從各個的可 撓性絕緣基底材之外側起，而在第1層側形成遮蔽層 114、在第3層側形成遮蔽層115，而作爲具備有遮蔽層 之纜線部。 關於層間之連接，由於不在第3層之相當於纜線部的 -6 - 200942120 場所附加電鍍一事係爲必要，因此，係可以僅對 部附加電鍍’亦即是進行所謂扣孔電鍍（b u 11 ο η 或是僅在層間導通用孔之開口面側進行面電鍍， 採用單面電鍍（於此情況，係僅對第1層進行電 在貫通全部層之通孔或是將近接之層作連接的肓 等中作選擇。於此，係選擇了貫通通孔116與扣 組合。 〇 [專利文獻1]日本特公平2-55958號公報 [專利文獻2]日本特開平5-90757號公報 [專利文獻3]日本特開平7-3 1 2469號公報 【發明內容】 [發明所欲解決之課題] 在此種先前技術之構造中，由於多層部117 爲複雜且爲厚，因此，係無法對上述之薄型化的 〇 應。故而，多層部與纜線部間之階段差係爲大， 蔽層時，在薄型之遮蔽薄膜等處，會有產生塡充 題。又，遮蔽之電性連接點118，係僅能在單 得，當如同前述一般之塡充不良的情況時，會有 時所產生之膨脹而在密著性上發生問題情況。 特別是，在近年之使用有無鉛銲錫的構件安 銲工程中，由於峰値溫度係爲高，因此，會有由 程時之熱而造成膨脹或是剝離的情況。再加上， 孔或是盲通孔時之穿孔導通用孔之時，在導通用 層間連接 plating ) 或是亦可 鍍），並 通孔連接 孔電鍍之 之構造係 要求作對 在形成遮 不良的問 面上作取 由於加熱 裝時之回 於回銲工 在形成通 孔內會堆 200942120 積有多數的各層之材料的切削粉末或是污跡（smear )等 的異物，而由於用以將該些除去之去污跡處理工程係會成 爲繁雜，因此亦有著去污跡處理之不足所導致的電性連接 不良等之虞。又，由於構成材料係變多，因此，亦有著材 料成本變高的問題。 本發明，係爲考慮上述之點而進行者，其目的，係在 於提供一種：具有安定之遮蔽連接點的多層可撓印刷配線 © 板，以及將此配線板低價且安定地製造之方法。 [用以解決課題之手段] 爲了達成上述目的，在本申請案中，係提供下述之各 發明。 若藉由第1發明，則在一種一體化地被形成有至少各 一個的纜線部與構件安裝部，且在前述纜線部之中的至少 一個處具備有遮蔽層之多層可撓印刷配線板中，係具備有 G 以下特徵：在成爲與具備有前述遮蔽層之前述纜線部之間 的邊界之前述構件安裝部的端面處，至少從2層以上之配 線層來對於前述遮蔽層形成有電性連接點。 又，若藉由第2發明，則在一種具備被形成有遮蔽層 之纜線部的多層可撓印刷配線板之製造方法中，其特徵 爲，具備有：準備於兩面處具有導電層之兩面可撓性基板 以及於單面處具有導電層之單面可撓性基板之工程；和在 前述兩面可撓性基板之其中一方的導電層處設置用以形成 將前述兩面之導電層間作連接之導通用孔的遮罩孔，同 -8- 200942120 時，在另外一方之導電層處形成成爲與前述遮蔽層間之電 性連接點的電路圖案之工程；和挾持著被配置在前述電路 圖案之內層側的接著材而將前述兩面可撓性基板與前述單 面可撓性基板作層積並形成多層電路之工程；和使用前述 遮罩孔而從前述兩面可撓性基板之其中一面起來施加前述 多層電路之開孔加工，而形成前述導通用孔之工程；和將 前述電路圖案之端部處的前述兩面可撓性基板之絕緣基底 0 材的一部份除去，而使前述電路圖案露出之工程；和對於 前述導通用孔以及前述電路圖案，在前述導通用孔之開口 面施加電鏟以形成通孔，同時，在前述電路圖案之端部處 形成與前述遮蔽層之間的電性連接點之工程；和以覆蓋至 少包含有前述連接點之前述電路圖案的方式而形成前述遮 蔽層之工程。 進而，若藉由第3發明，則在一種具備被形成有遮蔽 層之纜線部的多層可撓印刷配線板之製造方法中，其特徵 〇 爲，具備有：準備2枚之單面可撓性基板（A’B)之工 程；和在前述單面可撓性基板之其中一方（A)的導電層 處，設置用以形成導通用孔的遮罩孔，同時，形成成爲與 前述遮蔽層間之電性連接點的電路圖案之工程；和藉由將 前述單面可撓性基板之其中一方（A)的前述電路圖案與 前述單面可撓性基板之另外一方（B)的導電層之相反面 作接著，而將前述2枚之可撓性基板作層積而形成多層電 路之工程；和在前述單面可撓性基板之其中一方（A)的 絕緣基底材上的前述遮罩孔之投影位置處，形成較前述遮 -9- 200942120 罩孔爲更大直徑之孔，並對於前述單面可撓性基板之另外 一方（B)的絕緣基底材，使用前述遮罩孔來從前述單面 可撓性基板之其中一方（A)的導電層之相反面起施加前 述多層電路之開孔加工，而形成前述導通用孔之工程；和 將成爲前述連接點之電路圖案上的前述單面可撓性基板之 其中一方（A)的絕緣基底材之一部份除去，而在前述電 路圖案之端部處使成爲前述連接點之圖案露出之工程；和 φ 對於前述導通用孔以及成爲前述連接點之電路圖案，在前 述導通用孔之開口面施加電鍍以形成通孔，同時，在前述 纜線之端部處形成前述連接點之工程；和在至少成爲前述 連接點之圖案上，形成遮蔽層之工程。 [發明之效果] 藉由此些之特徵，本發明係可得到下述一般之效果。 若藉由本發明之多層可撓印刷配線板，則由於通孔開 ❹ 口面之纜線部端面的階段差係爲少，且不僅是表層，而在 內層處亦設置有成爲遮蔽之電性連接點的圖案，因此，就 算是薄型之遮蔽薄膜，亦不會產生塡充不良，同時，在電 性之連接信賴性上亦爲優良。 又，若藉由本發明之多層可撓印刷配線板之製造方 法，則在用以形成通孔或是盲通孔之導通用孔的穿孔時， 在導通用孔內之各層的材料切削粉或是污跡等之異物的產 生量亦爲少’且用以將該些除去之去污跡處理工程係成爲 能夠以相對上較爲緩和之條件來作處理，而能夠確保更多 -10- 200942120 之在去污跡工程上的處理空間。又’由於構成材料係變 少，因此，亦能夠謀求材料成本之降低。 進而，若藉由本發明之多層可撓印刷配線板之製造方 法，則藉由將通孔開口面之導體層（第1層）藉由半加成 法來形成，成爲能夠形成更細微且高精細度之配線。又， 此時，由於第3層側之導體層係藉由蝕刻來進行電路形 成，因此，亦具備有可適用彎折性爲優良之壓延銅箔的特 〇 徵。 其結果，係能夠提供一種低價且安定地製造具備有纜 線部且被形成有可進行從內、外層之複數層的拉出之遮蔽 層的可撓印刷配線板之方法。 【實施方式】 以下，參考所添附之圖面，而對本發明之實施形態作 說明。 ❹ (配線板之實施例） 圖1’係爲展示本發明之3層可撓印刷配線板之構造 的剖面圖。在此配線板中，係在聚醯亞胺等之可撓性絕緣 基底材1上貼合覆蓋層5，而構成第2層之纜線部6。因 此’對於在兩面上具備有包含第2層之纜線部的電路圖案 之可撓性印刷配線板2的成爲纜線部之層，而形成於聚醯 亞胺薄膜等之絕緣薄膜3上具有接著材4之覆蓋層5。 同樣的’在聚醯亞胺等之可撓性絕緣基底材7上貼合 -11 - 200942120 覆蓋層11，而作爲第3層之纜線部12。因此，對於在單 面上具備有包含第3層之纜線部的電路圖案之可撓性印刷 配線板8的成爲纜線部之層，而於聚醯亞胺薄膜等之絕緣 薄膜9上接合具有接著材1〇之覆蓋層11，並形成第3層 之纜線部1 2。 此配線板，係具備有可進行從在作爲第1層之導電層 6’處而被層積形成之相當於第2層及第3層的導電層之2 〇 層拉出的纜線部。於此纜線部處，係被設置有遮蔽層。 在形成第2層纜線之配線層時，形成於後而進行與遮 蔽之間的連接之連接點6b。此第2層之纜線6與第3層 之纜線12，係藉由預先被作了脫模之接著材13而被貼 合。與遮蔽之間的連接點6b，係在進行用以作層間連接 之電鍍之前，藉由雷射加工等而使其露出，而後，藉由進 行電鍍而得到電性連接。 關於層間之連接，在相當於第3層之纜線部的場所處 〇 附加電鍍一事係爲必須。但是，亦可在採用了扣孔電鍍或 是單面電鍍（於此情況，係僅對第1層進行電鍍）後，進 行貫通全層之通孔連接或是將近接之層作連接的盲通孔連 接。 於此，係選擇了貫通通孔1 4與扣孔電鍍之組合。在 階段差爲大的第1層面處，係如圖1所示一般，可藉由將 在被形成有遮蔽層之階段差部的第3層纜線之第1層側的 面處所析出之電鍍被膜以包含有遮蔽層之連接點6b的形 狀來殘留，而將階段差縮小。藉由此，能夠確實地進行電 -12- 200942120 性連接，並且能夠縮小階段差之大小，並成爲不會產生遮 蔽層形成時之塡充不良。 〇 進而，從各可撓性絕緣基底材之外側起，而在第1層 側形成遮蔽層1 5、在第3層側形成遮蔽層1 6，而形成具 備有遮蔽層之纜線部。第3層纜線之第1層側的面之遮蔽 的連接點17，係如圖示一般而被形成於第1層以及第2 層處，且階段差亦獲得了減低，因此，能夠謀求電性特性 之提升，並成爲不會產生遮蔽層形成時之塡充不良。200942120 IX. OBJECT OF THE INVENTION [Technical Field] The present invention relates to a multilayer flexible printed wiring board and a method of manufacturing the same, and more particularly to a structure of a multilayer flexible printed wiring board having a shielding layer in a cable portion And its manufacturing method. [Prior Art] In recent years, the miniaturization and high functionality of electronic devices have been progressing. Therefore, the demand for higher density of printed wiring boards has increased. In this case, the printed wiring board is upgraded from a single-sided type to a two-sided type or a three-layer type or more multilayer printed wiring board, thereby achieving a higher density of the printed wiring board. As a part of the small-sized electronic equipment such as a mobile phone, there is a wide spread: a multilayer printed wiring board in which various electronic components are mounted, or a hard printed wiring board is connected by a connector or the like. A flexible printed wiring board or a multilayer flexible printed wiring board having a flexible cable portion in which a flexible flat cable is formed. In particular, among those used in digital video cameras, it is required to have three or more layers of flexible printed wiring boards. Further, since the cable portion of the multilayer flexible printed wiring board used in the mobile phone is a pivotal portion, the restriction on the outer shape is large. Moreover, the pivoting portion of the pivot is required to have high bending reliability' and it is required that even if the bending is performed for hundreds of thousands of times, the change in electrical characteristics can be maintained within the specification. However, the number of signal lines of small, thin and highly functional mobile phones is also increased. It is not possible to make a single cable. It is also required to have multiple layers from the inner and outer layers. Since the layer is pulled out, the six-layer multilayer flexible printed wiring board is as described in Patent Document 1. In addition, in the multilayer flexible printed wiring board, there is also a demand for thinning. This is because the miniaturization of the size of each component is necessary for the high functionality of a small electronic device such as a mobile phone or a digital video camera. Therefore, it is possible to perform functions in addition to the substrates on which these devices are mounted. In addition to maintenance, a thinning system is necessary. The method described in Patent Document 2 is a method for producing a thin multilayer flexible printed wiring board. In this method, a thin four-layer flexible printed wiring board can be manufactured by sharing a cover film of a flexible printed wiring board which is a cable portion of the inner layer with a flexible insulating base material of the outer layer. However, since the formation of the outer cable is difficult, it has not been possible to solve the above problem. Further, as described in Patent Document 3, it is also known that, in a bent cable, a cable which is formed by a single layer of a copper foil without a shovel is attached, and is bent at the time of bending The deformation of the conductor is small, and the bending property is good. In this regard, those described in the multi-layered patent documents 1 and 2 are not appropriate. Further, in order to achieve the bending characteristics and the noise resistance at the time of the cable of the mobile phone, it is necessary to form a shielding layer such as a silver paste or a silver-5-200942120 film on the outer side of the cable. In this regard, Patent Documents 1 and 2 are also not appropriate. For the above reasons, there has been a demand for a method of manufacturing a thin multi-layer flexible printed wiring board having a cable portion having a bending property capable of performing drawing of a plurality of layers from the inner and outer layers at low cost and in a stable manner. . Fig. 8 is a cross-sectional view showing the construction of a principal part of a three-layer flexible printed wiring board of the prior art (refer to Patent Document 1). The wiring board Q is provided with a cable portion that can be pulled out from a plurality of layers including the second layer and the third layer having the shielding layer. First, this is a structure in which a cover layer is bonded to a flexible insulating base material 101 such as polyimide or the like to form a cable portion. In other words, the layer of the flexible printed wiring board 102 having the circuit pattern on both sides is bonded to the insulating film 103 of the polyimide film or the like and has the so-called material of the bonding material 104. The layer 105 is covered as the cable portion 106 of the second layer. In the same manner, in the flexible insulating base material 107 such as polyimide, the flexible printed wiring board 1 〇 8 having the circuit pattern including the cable portion of the third layer on one surface is formed. The layer of the cable portion is bonded to the cover layer 111 and serves as the cable portion 112 of the third layer. The cable of the second layer 106 and the cable 112 of the third layer are bonded by a backing material 113 which has been previously demolded. Further, from the outside of each of the flexible insulating base materials, the shielding layer 114 is formed on the first layer side, and the shielding layer 115 is formed on the third layer side as a cable portion having the shielding layer. Regarding the connection between the layers, since it is not necessary to add plating to the -6 - 200942120 site corresponding to the cable portion of the third layer, it is possible to add plating only to the portion, that is, to perform so-called buttonhole plating (bu 11 ο η or surface plating only on the open side of the interlayer common hole, using single-sided plating (in this case, only the first layer is electrically connected to the through hole of all layers or the adjacent layer is connected)肓 5 116 116 116 116 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利[Problem to be Solved by the Invention] In the structure of the prior art, since the multilayer portion 117 is complicated and thick, it is impossible to Therefore, the step difference between the multilayer portion and the cable portion is large, and when the layer is covered, there is a problem in the thin mask film, etc. Further, the electrical connection point of the shield is generated. 118, can only be obtained in a single, as before In general, when the charging is poor, there is a case where the expansion occurs and there is a problem in the adhesion. In particular, in the component welding process using lead-free solder in recent years, the peak temperature is high. Therefore, there may be cases of expansion or peeling caused by the heat of the process. In addition, when the hole is a hole or a through hole, the hole is connected to the common hole, and the plating is connected between the common layers or may be plated. ), and the structure of the through-hole connection hole plating is required to be made on the surface of the formation of the poorly formed surface due to the heating of the returning welder in the formation of the through hole, which will pile up the material of the majority of the layers of the 200942120. A foreign matter such as a powder or a smear, and the decontamination treatment engineering system for removing the smear is complicated, and therefore has a poor electrical connection due to insufficient smear treatment. . Further, since the number of constituent materials is increased, there is also a problem that the material cost becomes high. The present invention has been made in view of the above points, and an object thereof is to provide a multilayer flexible printed wiring, a board having a stable shielding connection point, and a method of manufacturing the wiring board at low cost and in a stable manner. [Means for Solving the Problem] In order to achieve the above object, in the present application, the following inventions are provided. According to the first aspect of the invention, at least one of the cable portion and the component mounting portion are integrally formed, and at least one of the cable portions is provided with a multilayer flexible printed wiring having a shielding layer. In the plate, the end surface of the member mounting portion that is a boundary between the cable portion having the shielding layer and at least two or more wiring layers is formed on the shielding layer. There are electrical connection points. According to a second aspect of the invention, in a method of manufacturing a multilayer flexible printed wiring board including a cable portion in which a shielding layer is formed, the method includes: preparing two sides having a conductive layer on both sides a flexible substrate and a single-sided flexible substrate having a conductive layer on one side; and a conductive layer on one of the two-sided flexible substrates for forming a connection between the conductive layers of the two sides The mask hole of the common hole, when the same as -8-200942120, forms a circuit pattern which becomes an electrical connection point with the shielding layer at the other conductive layer; and is disposed inside the circuit pattern a layer-side adhesive material for laminating the double-sided flexible substrate and the single-sided flexible substrate to form a multilayer circuit; and applying the mask hole from one side of the two-sided flexible substrate The hole forming process of the multilayer circuit to form the conductive hole; and the insulating substrate 0 of the double-sided flexible substrate at the end of the circuit pattern And removing the circuit pattern to expose the circuit pattern; and applying a power shovel to the opening surface of the conductive hole to form the through hole for the conductive hole and the circuit pattern, and forming at the end of the circuit pattern a process of electrically connecting the point to the shielding layer; and a process of forming the shielding layer in such a manner as to cover the circuit pattern including at least the connection point. Further, according to the third aspect of the invention, in the method of manufacturing a multilayer flexible printed wiring board including the cable portion in which the shielding layer is formed, the method includes: preparing two single-sided flexible portions Engineering of the substrate (A'B); and at the conductive layer of one of the single-sided flexible substrates (A), a mask hole for forming a conductive hole is formed, and is formed between the shielding layer and the shielding layer And a circuit pattern of the electrical connection point; and the conductive layer of the other one of the one-sided flexible substrate (B) and the conductive layer of the one of the single-sided flexible substrates (A) The opposite surface is formed by laminating the two flexible substrates to form a multilayer circuit; and the mask hole on the insulating base material of one of the single-sided flexible substrates (A) At the projection position, a hole having a larger diameter than the cover hole of the cover layer -9-200942120 is formed, and for the insulating base material of the other one (B) of the single-sided flexible substrate, the aforementioned mask hole is used to One of the single-sided flexible substrates The opposite side of the conductive layer of A) is subjected to the opening process of the multilayer circuit to form the conductive hole; and one of the single-sided flexible substrates on the circuit pattern to be the connection point (A) a part of the insulating base material is removed, and at the end of the circuit pattern, a pattern that exposes the connection point is exposed; and φ is applied to the conductive hole and the circuit pattern that becomes the connection point. Electroplating is applied to the opening face of the universal hole to form a through hole, and at the same time, the connection point is formed at the end portion of the cable; and the shielding layer is formed on the pattern at least the connection point. [Effect of the Invention] With the above features, the present invention can attain the following general effects. According to the multilayer flexible printed wiring board of the present invention, since the step of the end face of the cable portion of the through hole opening is small, and not only the surface layer, but also the electrical property of the shield is provided at the inner layer. Since the pattern of the connection points is such that even a thin masking film does not cause squeezing defects, it is also excellent in electrical connection reliability. Moreover, according to the manufacturing method of the multilayer flexible printed wiring board of the present invention, when the perforation for forming the through hole or the through hole of the blind via hole, the material cutting powder of each layer in the common hole is The amount of foreign matter generated by stains and the like is also small, and the decontamination processing engineering system for removing the stains can be handled under relatively mild conditions, thereby ensuring more -10-200942120 The processing space on the decontamination project. Further, since the constituent materials are reduced, it is also possible to reduce the material cost. Further, according to the method for producing a multilayer flexible printed wiring board of the present invention, the conductor layer (first layer) of the opening surface of the through hole is formed by a semi-additive method, so that finer and finer ones can be formed. Wiring of the degree. Further, in this case, since the conductor layer on the third layer side is formed by etching by a circuit, it is also possible to provide a feature of a rolled copper foil which is excellent in bending property. As a result, it is possible to provide a method of manufacturing a flexible printed wiring board having a cable portion and having a shielding layer capable of drawing a plurality of layers from the inner and outer layers at a low cost and stably. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the attached drawings. ❹ (Example of wiring board) Fig. 1' is a cross-sectional view showing the structure of a three-layer flexible printed wiring board of the present invention. In the wiring board, the cover layer 5 is bonded to the flexible insulating base material 1 such as polyimide, and the cable portion 6 of the second layer is formed. Therefore, it is formed on the insulating film 3 of a polyimide film or the like which is a layer of a flexible printed wiring board 2 having a circuit pattern including a second-layer cable portion on both sides. Next, the cover layer 5 of the material 4. Similarly, the cover layer 11 is bonded to the flexible insulating base material 7 such as polyimide or the like, and serves as the cable portion 12 of the third layer. Therefore, the layer of the flexible printed wiring board 8 including the circuit pattern of the third-layer cable portion on one surface is bonded to the insulating film 9 such as a polyimide film. The cover layer 11 having the adhesive material 1 is formed, and the cable portion 12 of the third layer is formed. This wiring board is provided with a cable portion which can be pulled out from a 2 〇 layer of a conductive layer corresponding to the second layer and the third layer which is formed by laminating the conductive layer 6' as the first layer. At the cable portion, a shielding layer is provided. When the wiring layer of the second layer cable is formed, the connection point 6b which is connected to the mask is formed later. The cable 2 of the second layer and the cable 12 of the third layer are bonded by a backing material 13 which has been demolded in advance. The connection point 6b between the shield and the shield is exposed by laser processing or the like before being subjected to plating for interlayer connection, and then electrically connected by plating. Regarding the connection between the layers, it is necessary to attach plating to the place corresponding to the cable portion of the third layer. However, it is also possible to use a buttonhole plating or a single-sided plating (in this case, only plating the first layer), or a through-hole connection through the full layer or a blind connection for the adjacent layer. Hole connection. Here, a combination of the through-holes 14 and the buttonhole plating is selected. In the first layer where the phase difference is large, as shown in FIG. 1, it is possible to deposit the plating on the surface of the first layer side of the third layer cable which is formed at the stage of the shielding layer. The film remains in the shape of the connection point 6b including the shielding layer, and the phase difference is reduced. As a result, it is possible to reliably perform the electrical connection of the electric -12-200942120, and it is possible to reduce the size of the step difference and to cause a malfunction in the case where the formation of the shielding layer is not caused. Further, from the outer side of each of the flexible insulating base materials, the shielding layer 15 is formed on the first layer side, and the shielding layer 16 is formed on the third layer side to form a cable portion having the shielding layer. The connection point 17 for shielding the surface of the first layer side of the third layer cable is formed in the first layer and the second layer as shown in the figure, and the phase difference is also reduced, so that electricity can be obtained. The improvement of the sexual properties is such that it does not cause poor filling when the shielding layer is formed.
Nly 1Λ 例 施 實 之 法 方 造 製 圖2A乃至圖2C，係爲展示本發明之製造方法的實施 例1之剖面工程圖。此配線板，係具備有可進行從在作爲 第1層之導電層22處而被層積形成之相當於第2層及第 3層的導電層2 3、2 7之2層拉出的纜線部。於此纜線部 處，係被設置有遮蔽層。 首先，如圖2A(1)中所示一般，在兩面貼銅層積板 上形成正形遮罩、以及電路圖案還有與遮蔽層之間的連接 用圖案。亦即是，對於兩面貼銅層積板24，在兩面貼銅 層積板24之銅箔22、23處，將兩面之電路圖案等藉由感 光蝕刻手法（Photofabrication)來形成雷射加工時之正形 遮罩22a、23a，並在銅箔23處形成內層電路圖案23b， 並形成於後成爲與遮蔽層之間的連接點之第2層的圖案 23c ° 兩面貼銅層積板4，係在聚醯亞胺等之可撓性絕緣基 -13- 200942120 底材21 (於此，係爲厚度12·5μπι之聚醯亞胺）的兩面 處，具備有厚度爲12μιη之銅箔22以及23°形成正形遮 罩22a、23a以及電路圖案23b、圖案23c的感光蝕刻手 法，係爲由光阻層之形成、曝光、顯影、蝕刻、光阻層剝 離等之一連串的工程所致者。 此時之兩面的對位，由於係對於平坦之材料來進行’ 因此不會被材料之伸縮所影響，而能容易地確保位置之精 0 確度。因應於必要，亦可使用能夠進行高精確度之對位的 曝光機。又，因應於必要，而進行用以使其與層積接著材 間之密著性提昇的粗化處理。藉由到此爲止之工程，而得 到3層可撓印刷配線板之第1層及第2層之電路基材 25 ° 而後，準備在聚醯亞胺等之可撓性絕緣基底材26 (於此，係爲厚度12.5μηι之聚醯亞胺）的單面處被設置 有銅箔27 (厚度12 μιη)的單面貼銅層積板28，並在此單 〇 面貼銅層積板8處，因應於必要而將電路基材29以及接 著材30作對位並作層積。接著材30，係以與電路基材29 作層積的方式而預先被作脫模。 接下來，如圖2Α(2)中所示一般，將兩面之電路基 材25與單面之電路基材29作對位，並挾持接著材30, 而藉由真空衝壓等來作層積。在到此爲止的工程中，係得 到3層之多層電路基材3丨。作爲接著材3 〇，係以低流動 型之黏合薄片等的流出爲少者爲理想，且由於其係於之後 亦有必要作爲纜線部之接著材而起作用，因此，可撓性係 -14- 200942120 爲必須。接著材30之厚度，係可選擇10〜15μιη左右 者。 接下來，如圖2Β (3)所示一般，使用正形遮罩 22a、23a來進行雷射加工，並形成將3層作連接之導通 用孔32，同時，使成爲之後之遮蔽的連接點之第2層的 圖案23c露出。 在使圖案23c露出時，係對可撓性絕緣基底材21選 ❹ 擇性地作雷射加工，以盡量不對可撓性絕緣基底材26進 行加工的方式，可撓性絕緣基底材2 1之進行加工的場所 處係將銅箔22除去。 進而，將雷射之光束口徑縮細，並藉由使用光束之有 效區域的最外部來進行雷射加工，而對可撓性絕緣基底材 2 1作選擇性的雷射加工，而能夠盡量不對可撓性絕緣基 底材26賦予損傷地來使第2層之圖案23c露出。在雷射 加工中，係可選擇UV-YAG雷射、二氧化碳雷射、準分 φ 子雷射等。 作爲加工形狀，例如如圖2 B ( 4 )中所示一般，藉由 將可撓性絕緣基底材1以及接著材10加工成半圓與平面 交互反覆、亦即是加工成所謂的波形剖面形狀，而能夠使 之後所形成之電鑛被膜的接觸面積增加，且能夠提升遮蔽 連接點之信賴性。 如圖2B(5)所示一般，對具備有導通用孔32之多 層電路基材33進行導電化處理，並進行1〇〜20μιη左右 之電解電鑛而取得層間導通，但是，於此，係進行了不在 -15- 200942120 第3層附加電鍍之單面電鏟。 在第3層側之銅箔面處形成電鍍遮罩，並在第1 選擇性的形成電鍍被膜，而後，藉由將電鍍遮罩剝 去，而得到被電鍍後的多層電路基材34。從導通用3 而形成階段通孔35，又，從第2層之圖案23c而形 遮蔽層之間的連接點36，在第3層纜線之第1層側 處，雖然亦會產生電鍍析出，但是，此係在之後的表 Q 電路圖案形成時，被作蝕刻除去。 接下來，如圖2C(6)中所示一般，將附加有電 第1層面與未附加有電鍍之第3層面，藉由感光蝕刻 而同時進行蝕刻處理，而形成電路圖案38以及39。 在階段差爲大的第1層面處，係藉由將圖中一般 被形成有遮蔽層之階段差部的第3層纜線之第1層側 處所析出之電鍍被膜，從第2層之圖案33c起而以包 與遮蔽層間之連接點的形狀來殘留，而將階段差縮小 〇 此，係進行電性連接，並謀求階段差之減低，伴隨著 之厚度的變薄，在形成遮蔽層時之塡充不良係成爲不 生。 在身爲階段通孔3 5之開口面的第1層面處，係 確保蓋孔（tenting)性，而以適用具備有20μιη以上 度的乾薄膜光阻爲理想。在不需要對蓋孔性作考慮之 爲薄的第3層面處，係可適用1 〇μηι以下之厚度的細 案形成用之乾薄膜光阻。其他，在使用液狀光阻的情 時’由於係沒有必要對階段通孔3 5之蓋孔性作考慮 層處 離除 L 3 2 成與 的面 層之 鍍之 手法 之在 的面 含有 。因 材料 會發 爲了 之厚 銅箔 微圖 況等 ，因 -16- 200942120 此，在第1層面處與第3層面處所形成之光阻層係可爲相 同的厚度。 接下來，如圖2C(7)所示一般，在第1層面處形成 防銲光阻（solder resist )層40，並在第3層面處，形成 在聚醯亞胺薄膜等之絕緣薄膜41上具備有接著材42、並 貼合有覆蓋層43、且進而設置有特定之開口的糊•薄膜 等的遮蔽層44。 H 於圖2C (6)中所示之階段差爲大的第1層面處，由 於係藉由與遮蔽層間之連接點而能夠減低階段差，因此， 在遮蔽層形成時之塡充不良係成爲不會發生。進而，藉由 使遮蔽層與電路圖案間之電性的連接面積增加，而亦提升 遮蔽層與電路圖案間之連接信賴性。在電路圖案之厚度僅 有階段差之第3層面處，在遮蔽層之塡充性以及遮蔽層與 電路圖案間之連接信賴性上，係不會有問題。 在此工程之前後，因應於需要，藉由在基板之表面施 〇 加銲錫電鍍、鎳電鍍、金電鍍等之表面處理，並進行外形 加工，而得到具備有可進行從具有遮蔽層之第2層及第3 層之2層拉出的纜線部之3層可撓印刷配線板45。 又，如圖2C(8)所示一般，藉由將遮蔽連接點36 延長，而亦能夠形成在第3層纜線之第1層面側的平坦之 場所處。於此情況，在露出之遮蔽連接點36之上，爲了 氧化防止等之目的，係以施加無電解鎳金電鍍等爲理想。 圖3，係爲展示圖2(5)中之單面電鍍的手法者，將 具備有導通用孔32之多層電路基材33以2枚作爲1組， -17- 200942120 並將電路基材33彼此之間隔G設定爲15mm以下之特定 的間隔，而進行電解銅電鍍。藉由此，對於相互之第3 層，係分別成爲遮蔽板，而能夠從相互之第1層側而將電 鍍被膜選擇性的析出。 若是基材3 3彼此之間隔爲較5mm更近，則由於基材 33係具有可撓性，因此，在電鍍中，會接觸成對之基 板，而使第3層側之液的更新變爲困難，並有成爲不會被 n 進行充分之水洗等之虞。 另一方面，當基材33彼此之間隔係爲較15mm更遠 的情況時，相互之遮蔽效果係變弱，在第3層之特別是基 材的周圍邊緣部處，電鍍會析出，而有對於纜線面亦產生 電鍍析出之虞。 圖4(a) 、( b)，係爲作更詳細之展示者，如圖4 (a)中所示一般，將電路基材33之周圍作鉗夾，並安裝 於電鍍架37上。若是對此而從A-A’剖面方向視之，則如 〇 圖4(b)中所示一般，在1個的電鍍架37處，係被安裝 有2枚的電路基材33* 當將此電鍍架37側作爲電解銅電鍍時之陰極，並在 電鍍層之兩側處配置陽極的情況時，電銨架係以位置於1 組之陽極的略中央處爲理想。藉由此，在2枚之電路基材 33的第1層處’係析出有略相等之厚度的銅電鍍被膜。 (製造方法之實施例2) 圖5 A以及圖5 B，係爲展示本發明之3層可撓印刷配 -18 - 200942120 線板製造方法的實施例2之剖面工程圖。此配線 備有可進行從相當於第2層及第3層的導電層之 的纜線部，在此纜線部處，係被設置有遮蔽層。 層之導電層，係於後被形成。 首先，如同圖5A(1)中所示一般，在單面 板53之銅箔52處，形成雷射加工時之正形遮3 層電路圖案52b、以及成爲之後的遮蔽之連接點 Q 之圖案52c。 此係經由對於在聚醯亞胺等之可撓性絕緣3 (於此，係爲厚度12_5μηι之聚醯亞胺）的單面 有厚度12 μιη之銅箔52的單面貼銅層積板53, 之電路圖案等藉由感光蝕刻手法而作形成的一連 來進行。 因應於必要，而進行用以使其與層積接著材 性提昇的粗化處理。藉由到此爲止之工程，而得 〇 3層可撓印刷配線板之第2層的內層電路圖案之 54 (第1層係於後再形成）。 而後，對於在聚醯亞胺等之可撓性絕緣3 (於此，係爲厚度12·5μιη之聚醯亞胺）的單面 了厚度12 μιη之銅箔27的單面貼銅層積板28, 要，而進行對將對位用之導引具等作了脫模後之 29、以及用以層積電路基材29之預先作了脫模 3 0間的對位，並作層積。 接下來，如圖5Α (2)中所示一般，挾持 板，係具 2層拉出 作爲第1 貼銅層積 I 52a ' 內 的第2層 S底材51 處被設置 而將單面 串之工程 間之密著 到形成了 電路基材 5底材26 處被形成 因應於必 電路基材 的接著材 著接著材 -19- 200942120 30，而將形成了第2層之內層電路圖案的 單面之電路基材29，藉由真空衝壓等來 此爲止的工程，而得到於3層中具備有2 層電路基材55。 作爲接著材3 0，係以低流動型之黏 爲少者爲理想，且由於其係於之後亦有必 接著材而起作用，因此，可撓性係爲必須 ❿ 厚度，係選擇10〜15μιη左右者。 接下來，如圖5Α(3)所示一般，使 之可撓性絕緣基底材51直接作雷射加工 罩5 2 a，來對位置於正形遮罩之開口面處 及可撓性絕緣基底材26進行雷射加工，： 連接之導通用孔56，同時，使成爲之後 之第2層的圖案52c露出。 在使圖案52c露出時，係僅對可撓ΐ 〇 進行雷射加工。由於係有必要盡量不對可 26進行加工，因此，藉由將雷射之光束 案5 2c作爲金屬遮罩而進行雷射加工，來 底材51作選擇性的雷射加工，並使第2 出。在雷射加工中，係可選擇UV-YAG 雷射、準分子雷射等。 如圖5B(4)所示一般，對具備有導 層電路基材57進行導電化處理，並進行 之電解電鍍而取得層間導通，但是，於此 f電路基材54與 作層積。藉由到 層的導體層之多 合薄片等的流出 要作爲纜線部之 。接著材 30之 用在聚醯亞胺等 所形成的正形遮 的接著材3 0以 拉形成將3層作 之遮蔽的連接點 fe絕緣基底材51 撓性絕緣基底材 口徑縮細且將圖 對可撓性絕緣基 層之圖案52c露 雷射、二氧化碳 通用孔5 6之多 10〜20μιη左右 ，不在第3層附 -20- 200942120 加電鍍之單面電鍍係爲必要。故而，在第3層側之銅箔面 處形成電鍍遮罩，並在第1層側處選擇性的形成電鍍被 膜，而後，藉由將電鍍遮罩剝離除去，而得到被電鍍後的 多層電路基材58。 從導通用孔5 6而形成階段通孔5 9，並從第2層之圖 案53c而形成遮蔽層之連接點60，在第3層纜線之第1 層側的面處，雖然亦會產生電鍍析出，但是，此係在之後 φ 的表層之電路圖案形成時，被作蝕刻除去。 接下來，如圖5B (5)中所示一般，將藉由電鏟所形 成之第1層面與未附加有電鍍之第3層面，藉由感光蝕刻 手法而同時進行鈾刻處理，而形成電路圖案61以及39。 此時，在身爲階段通孔59之開口面的第1層面處， 係爲了確保蓋孔性，而以適用具備有20 μιη以上之厚度的 乾薄膜光阻爲理想。在不需要對蓋孔性作考慮之銅箔爲薄 的第3層面處，係可適用ΙΟμιη以下之厚度之細微圖案形 φ 成用之乾薄膜光阻。其他，在使用液狀光阻的情況等時， 由於係沒有必要對階段通孔59之蓋孔性作考慮，因此’ 在第1層面處與第3層面處所形成之光阻層係可爲相同的 厚度。 接下來，在第1層面處形成防銲光阻層40’並在第3 層面處貼合有在聚醯亞胺薄膜等之絕緣薄膜41上具備有 接著材42之覆蓋層43，另外亦形成設置有特定之開口的 糊•薄膜等的遮蔽層44。 在階段差爲大的第1層面處，由於係藉由遮蔽層連接 -21 - 200942120 點而能夠減低階段差，因此，在遮蔽層形成時之塡充不良 係成爲不會發生。進而，藉由使遮蔽層與電路圖案間之電 性的連接面積增加，而亦提升遮蔽層與電路圖案間之連接 信賴性。在電路圖案之厚度僅有階段差之第3層面處，在 遮蔽層之塡充性以及遮蔽層與電路圖案間之連接信賴性 上，係不會有問題。 在此工程之前後，因應於需要，藉由在基板之表面施 Q 加銲錫電鍍、鎳電鍍、金電鍍等之表面處理，並進行外形 加工，而得到可進行從具有遮蔽層之第2層及第3層之2 層拉出的具備有纜線部之3層可撓印刷配線板62。 如此這般，由於通孔開口面之導體層亦成爲僅有電鍍 層，而能夠形成爲薄，因此，相較於實施例1，係成爲可 進行細微之配線形成。 (實施例3 ) 〇 圖6，係爲展示本發明之配線板的製造方法之實施例 3的剖面工程圖。此配線板，係爲可進行從包含有具備遮 蔽層之第2層以及第3層的2層拉出者，直到圖2B (3) 爲止的工程，係與實施例1爲相同。 如圖5A(1)所示一般，對具備有導通用孔56之多 層電路基材57進行導電化處理，並進行1〇〜20μπι左右 之電解電鍍而取得層間導通，但是，於此，不在第3層附 加電鍍之單面電鍍係爲必要。 此時，第1層側’係形成用以進行半加成法所致之電 -22- 200942120 路形成的電鍍光阻71，而在第3層側之銅箔面處，亦形 成成爲蝕刻光阻之光阻層72，並將第1層以及第3層同 時作曝光。 圖5A中，符號72a，係代表曝光後之影像圖案，並 藉由於後進行顯影，而成爲飩刻光阻圖案。而後，僅對於 第3層側，而在進行至曝光步驟爲止的飩刻光阻72上， 進而形成微黏著薄膜等之電鍍遮罩73，並進行顯影。 φ 經由此，而形成電鍍光阻71，並通過導電化處理被 膜，而進行電解電鍍，而僅在第1層側形成電鍍圖案 74。此時，係亦被形成有遮蔽連接點60。而後，將第1 層側之電鍍光阻71除去，並進而將導電化處理膜作蝕刻 除去。 接下來，圖5A ( 2 )，係爲沿著圖5A ( 1 )之A-A’ 線的剖面圖。此係爲將第3層側之蝕刻光阻72，形成於 較基板之外形而更靠內側數mm左右處，並以包含有露出 〇 了數mm之基板75上的方式而在第3層側之基板全面形 成了電鍍遮罩73者。 接下來，圖5A(3)，係將藉由電鍍所形成之第1層 面，以微黏著薄膜等來作保護，並將未附加有電鍍之第3 層面，藉由感光蝕刻手法所致之蝕刻處理而形成電路圖案 39 ° 由於係將第1層面與第3層面同時曝光，因此，能夠 確保高位置精確度。在銅箔爲薄的第3層面處，係可適用 10 μη!以下之厚度之細微圖案形成用之乾薄膜光阻。 -23- 200942120 其後之工程，係藉由經過與圖2相同之工程，而得到 具備有從第1層起直到第3層爲止均具有細微配線，且可 進行從具有遮蔽層之第2層及第3層之2層拉出的具有纜 線部之3層可撓印刷配線板76。 如此這般，藉由將通孔開口面之導體層（第1層）藉 由半加成法來形成，成爲能夠形成較實施例2爲更細微且 高精細度之配線。又，此時，由於第3層側之導體層係藉 φ 由蝕刻來進行電路形成，因此，係可適用彎折性爲優良之 壓延銅箱。 【圖式簡單說明】 [圖1]圖1，係爲本發明之具有遮蔽層的3層可撓印 刷配線板之構造的槪念性剖面構成圖。 [圖2 A]展示本發明之實施例1的3層可撓印刷配線 板之一部份製造工程的槪念性剖面構成圖。 〇 [圖2 B ]展示本發明之實施例1的3層可撓印刷配線 板之一部份製造工程的包含有立體圖之槪念性剖面構成 圖。 [圖2C]展示本發明之實施例1的3層可撓印刷配線 板之一部份製造工程的槪念性剖面構成圖。 [圖3 ]展示本發明之實施例1的3層可撓印刷配線板 之構造的槪念性剖面構成圖。 [圖4]展示本發明之實施例1的3層可撓印刷配線板 之構造的槪念性剖面構成圖。 -24- 200942120 [圖5A]展示本發明之實施例2的3層可撓印刷配線 板之一部份製造工程的槪念性剖面構成圖。 [圖5 B ]展示本發明之實施例2的3層可撓印刷配線 板之一部份製造工程的槪念性剖面構成圖。 [圖6]展示本發明之實施例3的3層可撓印刷配線板 之構造的槪念性剖面構成圖。 [圖7]圖7(a) 、（b)，係爲展示圖6所致之處理 φ 後的電鍍圖案之狀態的平面圖、以及沿著該A-A，線之剖 面圖。 [圖8]先前技術之3層可撓印刷配線板之構造的槪念 性剖面構成圖。 【主要元件符號說明】 1 :可撓性絕緣基底材 2 :兩面可撓性印刷配線板 ® 3 :絕緣薄膜 4 :接著劑 5 :覆蓋層 6 :第2層之纜線部 7 :可撓性絕緣基底材 8 :單面可撓性印刷配線板 9 :絕緣薄膜 I 〇 :接著劑 II :覆蓋層 -25- 200942120 1 2 :第3層之纜線部 13 :接著材 14、1 5 :遮蔽層 1 6 :通孔 1 7 :與遮蔽層間之電性連接點 2 1 :可撓性絕緣基底材 22 :銅箔 22a、2 3a-正形遮罩(conformal mask) 23 :銅箔 23b :電路圖案 23c:成爲遮蔽之連接點的第2層之圖案 24:兩面貼銅層積板 25:第1層以及第2層之電路基材 26 :可撓性絕緣基底材 27 :銅箔 〇 28:單面貼銅層積板 29:第3層之電路基材 3 0 :接著材 31: 3層之多層電路基材 3 2 :導通用孔 33:具備有導通用孔之多層電路基材 34:被電鍍後之多層電路基材 3 5 :階段差通孔 3 6 :遮蔽連接點 -26- 200942120 37 :電鍍架 38:第1層之外層電路圖案 39:第3層之外層電路圖案 4 0 :防銲劑 4 1 :絕緣薄膜 42 :接著材 4 3 :覆蓋層 0 44 :遮蔽層 45 :本發明所致之3層可撓印刷配線板 5 1 :可撓性絕緣基底材 52 :銅箔 5 2 a :正形遮罩 52b :電路圖案 5 2c :成爲遮蔽之連接點的第2層之圖案 5 3 :單面貼銅層積板 © 54:第2層電路基材 55: 3層之多層電路基材 5 6 :導通用孔 57:具備有導通用孔之多層電路基材 5 8 :被電鍍後之多層電路基材 5 9 :階段差通孔 6 0 :遮蔽連接點 61:第1層之外層電路圖案 62 :本發明所致之3層可撓印刷配線板 -27- 200942120 7 1 :抗電鍍劑 72 :抗蝕劑 72a:在抗蝕劑上之曝光影像圖案 7 3 :電鍍遮罩 7 4 :電鍍圖案 75 :第3層側基板面 76 :本發明所致之3層可撓印刷配線板 Q 1 01 :可撓性絕緣基底材 1 02 :兩面可撓性印刷配線板 103 :絕緣薄膜 104 :接著劑 1 〇 5 :覆蓋層 106 :第2層之纜線部 1 〇 7 :可撓性絕緣基底材 108 :單面可撓性印刷配線板 〇 109 :絕緣薄膜 1 1 0 :接著劑 111 :覆蓋層 1 1 2 :第3層之纜線部 1 13 :接著材 1 14、1 15 :遮蔽層 1 1 6 :通孔 1 1 7 :多層部 1 1 8 :與遮蔽層間之電性連接點 -28-Fig. 2A to Fig. 2C are cross-sectional views showing a first embodiment of the manufacturing method of the present invention. The wiring board is provided with a cable that can be pulled out from two layers of the conductive layers 2 3 and 27 corresponding to the second layer and the third layer which are formed by laminating the conductive layer 22 as the first layer. Line department. At the cable portion, a shielding layer is provided. First, as shown in Fig. 2A (1), a regular mask is formed on the double-sided copper laminated board, and a circuit pattern and a pattern for connection with the shielding layer are formed. In other words, in the copper-clad laminates 24 on both sides of the copper-clad laminate 24, the circuit patterns on both sides of the copper-clad laminate 24 are subjected to laser processing by photo-sensing (Photofabrication). The positive-shaped masks 22a and 23a are formed with the inner layer circuit pattern 23b at the copper foil 23, and the second layer pattern 23c is formed on the second layer which is a connection point with the shielding layer. A copper foil 22 having a thickness of 12 μm is provided on both sides of a flexible insulating substrate 13-200942120 substrate 21 (here, a polyimide having a thickness of 12·5 μm). The photosensitive etching method of forming the positive masks 22a and 23a, the circuit patterns 23b, and the patterns 23c at 23° is caused by a series of processes such as formation of a photoresist layer, exposure, development, etching, and peeling of a photoresist layer. Since the alignment of the two faces at this time is performed for the flat material, it is not affected by the expansion and contraction of the material, and the accuracy of the position can be easily ensured. An exposure machine capable of high-precision alignment can also be used as necessary. Further, in order to perform the roughening treatment for improving the adhesion between the laminate and the laminate, it is necessary. By the work up to this point, the circuit substrate of the first layer and the second layer of the three-layer flexible printed wiring board is obtained at 25°, and then the flexible insulating base material 26 such as polyimide or the like is prepared. Here, it is a single-sided copper-clad laminate 28 provided with a copper foil 27 (thickness 12 μm) on one side of a polyimide having a thickness of 12.5 μm, and a copper-clad laminate 8 is laminated thereon. At this point, the circuit substrate 29 and the bonding material 30 are aligned and laminated as necessary. The material 30 is previously released from the circuit substrate 29 by lamination. Next, as shown in Fig. 2 (2), the circuit substrates 25 on both sides are aligned with the circuit substrate 29 of one side, and the bonding material 30 is held, and lamination is performed by vacuum stamping or the like. In the engineering up to this point, a multilayer circuit substrate of three layers was obtained. As the adhesive material 3, it is preferable that the flow of the low-flow type adhesive sheet or the like is small, and since it is necessary to function as a backing material of the cable portion after the attachment, the flexibility is - 14- 200942120 is a must. Next, the thickness of the material 30 can be selected from about 10 to 15 μm. Next, as shown in Fig. 2 (3), generally, the positive masks 22a, 23a are used for laser processing, and the common holes 32 for connecting the three layers are formed, and at the same time, the connection points for the subsequent shadowing are formed. The pattern 23c of the second layer is exposed. When the pattern 23c is exposed, the flexible insulating base material 21 is selectively subjected to laser processing so that the flexible insulating base material 26 is not processed as much as possible, and the flexible insulating base material 2 1 is used. The copper foil 22 is removed at the place where the processing is performed. Further, the laser beam diameter is reduced, and laser processing is performed by using the outermost portion of the effective area of the light beam, and the flexible insulating base material 21 is selectively laser-processed, and can be minimized. The flexible insulating base material 26 is exposed to damage to expose the pattern 23c of the second layer. In laser processing, UV-YAG laser, carbon dioxide laser, and quasi-divided φ laser can be selected. As a processed shape, for example, as shown in FIG. 2B (4), the flexible insulating base material 1 and the backing material 10 are processed into a semicircle which is inversely overlapped with a plane, that is, processed into a so-called waveform cross-sectional shape. Further, the contact area of the electrodeposited film formed later can be increased, and the reliability of the shield connection point can be improved. As shown in FIG. 2B (5), the multilayer circuit substrate 33 including the conductive hole 32 is electrically conductively treated, and electrolytic electrowinning of about 1 to 20 μm is performed to obtain interlayer conduction. However, here, A single-sided electric shovel with no additional plating on the third floor of -15-200942120 was carried out. A plating mask is formed on the copper foil side of the third layer side, and a plating film is selectively formed on the first layer, and then the plating mask is peeled off to obtain a multilayered circuit substrate 34 to be plated. The stage through hole 35 is formed from the general guide 3, and the connection point 36 between the shielding layers is formed from the pattern 23c of the second layer, and plating deposition occurs even at the first layer side of the third layer cable. However, this is removed by etching when the subsequent Q circuit pattern is formed. Next, as shown in Fig. 2C (6), in general, the first layer and the third layer to which the plating is not applied are added, and the etching process is simultaneously performed by photolithography to form the circuit patterns 38 and 39. In the first layer where the phase difference is large, the plating film deposited from the first layer side of the third layer cable in which the step portion of the shielding layer is generally formed in the figure is patterned from the second layer. 33c, and the shape of the connection point between the package and the shielding layer remains, and the phase difference is reduced, and the electrical connection is made, and the step difference is reduced, and the thickness is thinned, and when the shielding layer is formed, The ill-filled system is not born. At the first level which is the opening face of the stage through hole 35, it is preferable to ensure the tenting property, and it is preferable to use a dry film resist having a degree of 20 μm or more. A dry film photoresist for forming a thin film having a thickness of 1 〇μηι or less can be applied to the third layer which is thinner in consideration of the cap hole property. In addition, in the case of using a liquid photoresist, it is not necessary to consider the cover hole of the stage through hole 35, and the surface of the layer is separated from the surface of the layer formed by the L3 2 . Since the material may be thick, such as copper foil micro-patterns, the photoresist layer formed at the first level and the third layer may have the same thickness as -16- 200942120. Next, as shown in Fig. 2C (7), a solder resist layer 40 is formed at the first layer, and is formed on the insulating film 41 of the polyimide film or the like at the third layer. A shielding layer 44 having a backing material 42 and a cover layer 43 and a paste or film having a specific opening is further provided. H is at the first level where the phase difference shown in FIG. 2C (6) is large, and since the phase difference can be reduced by the connection point with the shielding layer, the defective portion is formed when the shielding layer is formed. will not happen. Further, by increasing the electrical connection area between the shielding layer and the circuit pattern, the connection reliability between the shielding layer and the circuit pattern is also improved. At the third level where the thickness of the circuit pattern is only stepped, there is no problem in the reliability of the shielding layer and the reliability of the connection between the shielding layer and the circuit pattern. After the work, the surface treatment of solder plating, nickel plating, gold plating, etc., and surface processing are performed on the surface of the substrate, and the second layer having the shielding layer is provided. A three-layer flexible printed wiring board 45 of the cable portion of the layer and the third layer of the third layer. Further, as shown in Fig. 2C (8), by generally extending the shield connection point 36, it is possible to form a flat place on the first layer side of the third layer cable. In this case, it is preferable to apply electroless nickel gold plating or the like for the purpose of preventing oxidation or the like on the exposed shield connection point 36. 3 is a view showing a single-sided plating method in FIG. 2 (5), and a multilayer circuit substrate 33 having a conductive hole 32 is used as a set of two, -17-200942120, and the circuit substrate 33 is provided. Electrolytic copper plating is performed at a specific interval in which the distance G between them is set to 15 mm or less. As a result, the third layer of each other is a shielding plate, and the plating film can be selectively deposited from the first layer side of each other. If the distance between the base materials 3 3 is closer than 5 mm, since the base material 33 is flexible, in the plating, the paired substrates are contacted, and the liquid on the third layer side is changed. Difficulties, and there are rumors that you will not be fully washed by n. On the other hand, when the distance between the substrates 33 is further than 15 mm, the mutual shielding effect is weakened, and at the peripheral edge portion of the third layer, particularly the substrate, plating is precipitated, and Electroplating precipitation is also produced for the cable surface. 4(a) and 4(b) are shown in more detail. As shown in Fig. 4(a), the periphery of the circuit substrate 33 is clamped and mounted on the plating frame 37. If this is viewed from the A-A' cross-sectional direction, as shown in Fig. 4(b), two circuit substrates 33* are mounted on one plating rack 37. When the side of the plating frame 37 is used as a cathode for electrolytic copper plating and an anode is disposed at both sides of the plating layer, it is preferable that the electrochemical ammonium frame is located at a slightly center of the anode of the group. As a result, a copper plating film having a slightly equal thickness is deposited on the first layer of the two circuit substrates 33. (Embodiment 2 of the manufacturing method) Figs. 5A and 5B are cross-sectional views showing a second embodiment of the method for producing a three-layer flexible printing -18 - 200942120 wire plate of the present invention. This wiring is provided with a cable portion which can be made from a conductive layer corresponding to the second layer and the third layer, and a shielding layer is provided in the cable portion. The conductive layer of the layer is formed afterwards. First, as shown in Fig. 5A (1), at the copper foil 52 of the single panel 53, a positive-shaped three-layer circuit pattern 52b at the time of laser processing and a pattern 52c of a connection point Q which becomes a subsequent mask are formed. . This is a single-sided copper-clad laminate 53 having a copper foil 52 having a thickness of 12 μm on one side of a flexible insulating 3 (here, a polyimide having a thickness of 12_5 μηι) on a polyimide or the like. The circuit pattern and the like are formed by a photosensitive etching process. The roughening treatment is carried out to make it possible to laminate the laminate with the material, as necessary. By the end of the process, the inner layer circuit pattern 54 of the second layer of the three-layer flexible printed wiring board is obtained (the first layer is formed later). Then, a single-sided copper-clad laminate having a copper foil 27 having a thickness of 12 μm on one side of a flexible insulating 3 (here, a polyimide having a thickness of 12·5 μm) 28, if the mold is used for the alignment of the guides and the like, and the pre-release of the laminated circuit substrate 29 is performed, and the layer is laminated. . Next, as shown in Fig. 5 (2), the holding plate and the two layers of the tie are set as the second layer S substrate 51 in the first copper laminate I 52a ', and the one-sided string is set. The adhesion between the engineering rooms and the substrate 26 formed on the circuit substrate 5 is formed in accordance with the bonding material of the substrate substrate -19-200942120 30, and the inner layer circuit pattern of the second layer is formed. The single-sided circuit substrate 29 is provided with a two-layer circuit substrate 55 in three layers by vacuum stamping or the like. As the adhesive material 30, it is preferable that the low-flow type has a small amount of adhesion, and since it is also required to be attached to the material after the tie, the flexibility is required to be ❿ thickness, and 10 to 15 μm is selected. The left and right. Next, as shown in FIG. 5 (3), the flexible insulating base material 51 is directly used as a laser processing cover 52 2 a to position the opening surface of the positive mask and the flexible insulating base. The material 26 is subjected to laser processing, and the conductive hole 56 is connected, and the pattern 52c which becomes the second layer is exposed. When the pattern 52c is exposed, only the flexible 〇 is laser processed. Since it is necessary to process the 260 as much as possible, the laser processing is performed by using the laser beam case 52c as a metal mask, and the substrate 51 is selectively laser-processed and the second output is performed. . In laser processing, UV-YAG lasers, excimer lasers, etc. can be selected. As shown in Fig. 5B (4), the conductive layer substrate 57 is subjected to a conductive treatment and electrolytic plating is performed to obtain interlayer conduction. However, the f circuit substrate 54 is laminated. The outflow of a plurality of sheets or the like of the conductor layer to the layer is used as the cable portion. Next, the material 30 is used to form a positively-shielded backing material 30 formed by polyimine or the like to form a joint point of the three layers of the insulating base material 51. The flexible insulating base material is reduced in diameter and will be drawn. The pattern 52c of the flexible insulating base layer is exposed to a laser, and the carbon dioxide common hole 5 is about 10 to 20 μm, which is not necessary for the single layer plating of the third layer attached -20-200942120. Therefore, a plating mask is formed on the copper foil surface of the third layer side, and a plating film is selectively formed on the side of the first layer, and then the plating mask is peeled off to obtain a multilayer circuit after plating. Substrate 58. A phase through hole 5 9 is formed from the conductive hole 56, and a connection point 60 of the shielding layer is formed from the pattern 53c of the second layer, although the surface of the layer 1 side of the layer 3 cable is also generated. Electroplating is deposited, but this is removed by etching when the circuit pattern of the surface layer of φ is formed. Next, as shown in FIG. 5B (5), the first layer formed by the shovel and the third layer not plated are additionally subjected to lithography by a photosensitive etching method to form a circuit. Patterns 61 and 39. In this case, it is preferable to use a dry film resist having a thickness of 20 μm or more in order to secure the cap hole property on the first layer which is the opening surface of the stepped through hole 59. In the third layer in which the copper foil which does not require the cover hole property is thin, it is possible to apply a dry film photoresist for the fine pattern shape of the thickness of ΙΟμηη or less. In the case of using a liquid photoresist or the like, since it is not necessary to consider the cover hole property of the stage through hole 59, the photoresist layer formed at the first level and the third layer may be the same. thickness of. Next, a solder resist photoresist layer 40' is formed on the first layer, and a cover layer 43 provided with a bonding material 42 on the insulating film 41 of a polyimide film or the like is bonded to the third layer, and is also formed. A shielding layer 44 such as a paste or a film having a specific opening is provided. At the first level where the phase difference is large, since the phase difference can be reduced by connecting the -21 - 200942120 points by the shielding layer, the defective charging at the time of forming the shielding layer does not occur. Further, by increasing the electrical connection area between the shielding layer and the circuit pattern, the connection reliability between the shielding layer and the circuit pattern is also improved. At the third level where the thickness of the circuit pattern is only stepped, there is no problem in the reliability of the shielding layer and the reliability of the connection between the shielding layer and the circuit pattern. After the work, the second layer with the shielding layer can be obtained by applying a surface treatment such as solder plating, nickel plating or gold plating on the surface of the substrate, and performing the outer shape processing. A three-layer flexible printed wiring board 62 having a cable portion pulled out from the second layer of the third layer. In this manner, since the conductor layer of the opening surface of the through hole is formed to be thin only by plating, it is possible to form fine wiring as compared with the first embodiment. (Embodiment 3) Fig. 6 is a cross-sectional view showing a third embodiment of a method of manufacturing a wiring board of the present invention. This wiring board is the same as that of the first embodiment except that the two-layer pull-out including the second layer and the third layer having the shielding layer can be performed up to the drawing of Fig. 2B (3). As shown in FIG. 5A (1), the multilayer circuit substrate 57 including the conductive hole 56 is electrically conductively treated, and electrolytic plating is performed at about 1 to 20 μm to obtain interlayer conduction. However, this is not the case. One-sided plating of three layers of additional plating is necessary. At this time, the first layer side is formed with a plating resist 71 for forming the electric-22-200942120 path by the semi-additive method, and is formed as an etching light at the copper foil surface of the third layer side. The photoresist layer 72 is blocked, and the first layer and the third layer are simultaneously exposed. In Fig. 5A, reference numeral 72a denotes an image pattern after exposure, and is developed as a patterned photoresist pattern by post-development. Then, on the third layer side, on the etching resist 72 up to the exposure step, a plating mask 73 such as a micro-adhesive film is formed and developed. Thus, the plating resist 71 is formed, and the film is formed by conducting the electroconductive treatment, and electrolytic plating is performed, and the plating pattern 74 is formed only on the first layer side. At this time, the system is also formed with a shadow connection point 60. Then, the plating resist 71 on the first layer side is removed, and the conductive film is further removed by etching. Next, Fig. 5A (2) is a cross-sectional view taken along line A-A' of Fig. 5A (1). In this case, the etching resistor 72 on the third layer side is formed on the outer side of the substrate and is about several mm on the inner side, and is on the third layer side so as to include the substrate 75 exposed to a few mm. The substrate is fully formed with a plating mask 73. Next, FIG. 5A(3) protects the first layer formed by electroplating with a micro-adhesive film or the like, and the third layer which is not plated, and is etched by a photosensitive etching method. Processing to form a circuit pattern 39 ° Since the first layer and the third layer are simultaneously exposed, high positional accuracy can be ensured. In the third layer where the copper foil is thin, it is possible to apply a dry film resist for forming a fine pattern of a thickness of 10 μη! or less. -23- 200942120 The subsequent work is carried out in the same way as in Fig. 2, and it is possible to have fine wiring from the first layer to the third layer, and to perform the second layer from the shielding layer. And a three-layer flexible printed wiring board 76 having a cable portion pulled out from the second layer of the third layer. In this manner, by forming the conductor layer (first layer) of the opening surface of the via hole by the semi-additive method, it is possible to form a wiring which is finer and more finer than that of the second embodiment. Further, in this case, since the conductor layer on the third layer side is formed by etching by φ, a rolled copper box excellent in bending property can be applied. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a conceptual cross-sectional view showing the structure of a three-layer flexible printed wiring board having a shielding layer of the present invention. Fig. 2A is a view showing a sacred cross-sectional configuration of a part manufacturing process of a three-layer flexible printed wiring board according to Embodiment 1 of the present invention. [Fig. 2B] Fig. 2B is a view showing a commemorative cross-sectional configuration of a part of a manufacturing process of a three-layer flexible printed wiring board according to Embodiment 1 of the present invention. Fig. 2C is a view showing a sacred cross-sectional configuration of a part manufacturing process of the three-layer flexible printed wiring board according to the first embodiment of the present invention. [Fig. 3] Fig. 3 is a perspective view showing a structure of a three-layer flexible printed wiring board according to a first embodiment of the present invention. Fig. 4 is a schematic cross-sectional structural view showing the structure of a three-layer flexible printed wiring board according to a first embodiment of the present invention. -24- 200942120 [Fig. 5A] Fig. 5A is a view showing a sacred cross-sectional configuration of a part manufacturing process of a three-layer flexible printed wiring board according to a second embodiment of the present invention. Fig. 5B is a view showing a sacred cross-sectional configuration of a part manufacturing process of a three-layer flexible printed wiring board according to a second embodiment of the present invention. Fig. 6 is a schematic cross-sectional structural view showing the structure of a three-layer flexible printed wiring board according to a third embodiment of the present invention. Fig. 7 (a) and (b) are plan views showing a state of a plating pattern after the processing φ by Fig. 6, and a cross-sectional view taken along line A-A. Fig. 8 is a schematic cross-sectional structural view showing the structure of a prior art three-layer flexible printed wiring board. [Description of main component symbols] 1 : Flexible insulating base material 2 : Double-sided flexible printed wiring board ® 3 : Insulating film 4 : Adhesive 5 : Cover layer 6 : Cable layer 7 of the second layer : Flexibility Insulating base material 8 : Single-sided flexible printed wiring board 9 : Insulating film I 〇: Adhesive II : Cover layer -25 - 200942120 1 2 : Cable layer portion 3 of the third layer: Substrate 14, 15: Masking Layer 1 6 : Through hole 1 7 : Electrical connection point with shielding layer 2 1 : Flexible insulating base material 22 : Copper foil 22a, 2 3a - Conformal mask 23 : Copper foil 23b : Circuit Pattern 23c: Pattern 24 of the second layer to be the connection point of the shield: Two-sided copper-clad laminate 25: Circuit substrate 26 of the first layer and the second layer: Flexible insulating base material 27: Copper foil 28: Single-sided copper-clad laminate 29: third-layer circuit substrate 30: adhesive material 31: 3-layer multilayer circuit substrate 3 2: conductive hole 33: multilayer circuit substrate 34 having a conductive hole: Multi-layer circuit substrate after plating 3 5 : Stage difference via 3 6 : Shield connection point -26- 200942120 37 : Plating frame 38: 1st layer outer layer circuit pattern 39: 3rd layer outer layer circuit pattern 4 0 : Flux 4 1 : Insulating film 42 : Substrate 4 3 : Cover layer 0 44 : Masking layer 45 : 3 layers of flexible printed wiring board 5 1 : Flexible insulating base material 52 : Copper foil 5 2 a : Positive mask 52b : Circuit pattern 5 2c : Pattern of the second layer which becomes the connection point of the shield 5 3 : Single-sided copper laminated board © 54: 2nd layer circuit substrate 55: 3 layers of multilayer circuit base Material 5 6 : Conductive hole 57 : Multi-layer circuit substrate with conductive hole 5 8 : Multi-layer circuit substrate after plating 5 9 : Stage difference through hole 6 0 : Shadow connection point 61 : 1st layer outer layer Circuit pattern 62: 3-layer flexible printed wiring board 277-200942120 7 1 : Anti-electroplating agent 72: Resist 72a: Exposure image pattern on resist 7 3 : Plating mask 7 4 : plating pattern 75 : third layer side substrate surface 76 : three-layer flexible printed wiring board Q 1 01 according to the present invention: flexible insulating base material 1 02 : double-sided flexible printed wiring board 103 : insulating film 104 : adhesive 1 〇 5 : cover layer 106 : second layer cable portion 1 〇 7 : flexible insulating base material 108 : single-sided flexible printed wiring board 〇 109 : insulating film 1 1 0 : Primer 111: cover layer 1 1 2 : third layer cable portion 1 13 : back material 1 14 , 1 15 : shielding layer 1 1 6 : through hole 1 1 7 : multilayer portion 1 1 8 : between the shielding layer Electrical connection point -28-