200949377 九、發明說明： 【發明所屬之技術領域】 本發明關於一種背光模、纟且；特別是，關於一種以led 作為光源之背光模組。 【先前技術】 一液晶顯示裝置具有高晝質、體積小、低驅動電壓、低 消耗功率等優點，使得液晶顯示裝置廣泛應用於現今的可 攜式資訊產品，例如行動電話、筆記型電腦、個人數位助 理等等。 版來說，液晶顯示裝置可分為液晶面板^janel)以及 背光(backlight)模組兩個主要部分。其中背光模組乃提供一 平面光，並使其均勻地照射在液晶面板上，而產生均勻的 影像。 背光模組可再分為光源以及導光板兩個部分。習知背 光模組的光源可使用冷陰極燈管（c〇ld cathode fluorescent lamp、CCFL)或是發光二極體（LED)。後者一般多用於 行動通訊裝置，或是個人資訊裝置等小型設備上，但由於 發光二極體體積小以及消耗功率低，其應用愈來愈普及， 目前市面上也已經出現利用LED作為背光源之液晶電視。 在習知LED背光模組的製作過程中，乃是使用焊錫 200949377 將LED焊接在軟性電路板(FPC)之上。而在大量生產時， 乃使用表面黏著技術(SMT)，表面黏著技術—般會利用锡 爐加熱熔化焊錫，而錫爐的高溫將不可避免地對LED造 成損害，導致亮度下降’以及使用壽命減短。 Ο200949377 IX. Description of the Invention: [Technical Field] The present invention relates to a backlight module, and in particular to a backlight module using LED as a light source. [Prior Art] A liquid crystal display device has advantages of high quality, small size, low driving voltage, low power consumption, etc., and the liquid crystal display device is widely used in today's portable information products, such as mobile phones, notebook computers, and individuals. Digital assistant and so on. For the version, the liquid crystal display device can be divided into two main parts: a liquid crystal panel (^) and a backlight module. The backlight module provides a planar light and uniformly illuminates the liquid crystal panel to produce a uniform image. The backlight module can be further divided into a light source and a light guide plate. The light source of the conventional backlight module can use a cold cathode fluorescent lamp (CCFL) or a light emitting diode (LED). The latter is generally used in mobile communication devices or small devices such as personal information devices. However, due to the small size and low power consumption of the LEDs, their applications are becoming more and more popular. Currently, LEDs have been used as backlights on the market. LCD TV. In the manufacturing process of the conventional LED backlight module, the solder is soldered on a flexible circuit board (FPC) using solder 200949377. In mass production, surface adhesion technology (SMT) is used. Surface adhesion technology generally uses a tin furnace to heat and melt the solder. The high temperature of the tin furnace will inevitably cause damage to the LED, resulting in a decrease in brightness' and a decrease in service life. short. Ο
因此，有必要提供一種新的背光模組，其中採用一種 簡單、容易實_方式將背光模財之LED歡地固定， 並提供良好地電性接觸。特別是，LED不會受到高溫的損 【發明内容】 有鑑於先前技藝之缺失，本發明提供一種背光模組， 其中採用-種鮮、料實技·中之咖 穩定地固定，並提供良好地雜是在本發 採用金屬彈片來取代習知的利用焊錫的 =式’因此可避免習知技術中，高溫錫爐所導致之不 ，本^背光模組的實施例中，f光模組包含 ¥光板、發光元件以及導電元件 里、 以及第二容置部，其中第一容置二;亡置部 有一開口 ’使第一容置部與第二容置二：置=幵錢 第一容錢係設置於 、有入先面，而入光面朝向於 6 200949377 一中發心在溝槽 接，並形成電性導通 ¥電部係與發光元件抵 而根據本發明另一實施例，择伞指彡n — a 板、發光元件以及料包含框架、導光 第二容置部，射第—容置部置部以及 與開二二容置部相通’而於第二容置部 容置部有赌。導紐触置於第一 且導先板具有一入光面，而入 :光Ξ光元:係設置於第二容置部内，且發光元件具有: =面’而發光面朝向於開口。導電元件係具有 成電以發光元件中與發光面相鄰之-底部抵接，:形 鲁 開口。發光元件係設置於第 .容置部内，且發光元件具有 明^^下之紐實關之魏魏合_酬，本發 之目的、特徵與優點將更為清楚。 ' 【實施方式】 圖。本發明背光模組101之一實施例之爆炸 相/ 使用於’但不限於，行動電話、數位 二Π?Α)、筆記型電腦、桌上㈣腦、電視、 ‘、。。航工用顯不器、全球定位系統(GPS)或可攜 200949377 式DVD播放機等液晶顯示裝置。值得一提的是，本說明 曰中之圖式乃是為了解釋本發明，圖式中之比例與尺寸以 及各7G件之間的相對位置，僅供參考，不應用來限制本 明。 如圖1A所示，背光模組101包含導光板103與發光 元件105。發光元件1〇5供產生光，入射至導光板1〇"3， ® ㈣於此部分之細節將敘述於後。較佳地，發光元件105可 為發光二極體(LED)，並不限為紅光(R)、綠光(G)、藍光 (B)、而較佳為白光LED。本發明亦不欲限制發光元件105 的數目以及大小，此乃根據背光模組101的尺寸以及使用 目的而定，熟此技藝者可參考習知LED背光模組所使用 之LED發光元件配置，在此不加贅述。惟以下關於本發 明之說明，發光元件105將以白光LED為例。 _ 此外，背光模組更含有框架111與導電元件113。 框架U1 —般而言為膠框，其材質可參考習知液晶顯示裝 置中搭配背光模組所使用之膠框。框架1U上形成有較大 的容置部112，而導光板103即設置在容置部112中，但 框架111另外具有較小的容置部115，與容置部112相連 通，其間並形成有一開口 〇p，而容置部115較佳，但不 限於，大致為一矩形，以供發光元件1〇5設置其中，發光 疋件105之發光面ES乃朝向開口 〇P，發光元件1〇5所發 出之光通過開口 OP而入射至導光板1〇3之入光面RS。此 8 200949377 外’在容置部115與開口 OP相對之一侧壁ιι51上更形成 有溝槽117 ’溝槽117並從容置部115的側壁1151向外延 伸，而溝槽117之寬度稍大於導電元件113之厚度，讓導 電元件113能夠嵌合在溝槽117之中，如圖1B之組合圖 戶斤示。 圖ic乃背光模組ιοί中發光元件105的組合狀況之 Φ 俯視放大圖。發光元件105例如是一 led元件，且其出 光面ES與電極1051、1053位置乃分別位於前後兩侧。導 電元件113在對應容置部115的位置更具有導電部U31 與1133，例如為金屬彈片，而導電部1131與1133從發光 元件105之背面分別與電極1051、1〇53抵接，並形成電 性導通’此種設置的優點將敘述於後。 在組裝時，導電元件113乃預先嵌合設置在溝槽117, 而另外連結至一電路板(或是軟性電路板)上之控制電路 (皆未圖示）。之後再將LED 105放置在容置部115中，此 時LED 105乃會擠壓導電元件113之導電部mi、1133， 而LED 105之電極1〇5卜1〇53與導電部113卜1133緊密 地抵接，以提供電源予發光元件1〇5，並使得前述控制電 路知以控制發光元件1〇5。此處導電部、1133與LED 105之電極1〇51、1053乃直接接觸，而不需要額外的焊錫 或是導電膠，即可達成良好的電性接觸。此外，導電部 1131、1133的材料較佳為具有良好導電性之金屬，例如銅。 9 200949377 在圖1A至圖lc所示的實施例中，開口 〇1>的寬度小 於發光元件105的寬度’而導光板1G3具有一凸出部，入 光面RS係位於凸出部，而此凸出部伸入開口 〇p，藉此入 光面RS抵接發光面Es，以確保光線不至於漏失。此外， 框架111在開口 OP處具有兩定位結構nu、1113，而定 位結構111卜1113將具有阻止發光元件1〇5朝往導光板 103的方向移動的作用，但同時導電部1131、1133之彈力 ❹ 會將發光元件105朝導光板103的方向推擠，因此發光元 件105會牢牢地被箝制在容置部115内，而不會輕·易晃 動，而避免斷路或是光線輕合的逸失。 如圖1C所示，爲了進一步將發光元件1〇5箝制在容 置部115，可在容置部Π5左右側壁1153、Π55(也就是與 侧壁1151相鄰之左右側壁)上設置嵌合件1154、ι156。舉 例來說，嵌合件1154、1156例如為一凸部，而LED 105 談 亦具有固定部1054、1056，例如為一凹部，分別抵接嵌合 件1154、1156，用以進一步地將LED 1〇5固定在容置部 115中。值得一提的是，嵌合件亦可設置在其他位置，例 如位於容置部115之另一侧壁1151。 圖2A顯示本發明背光模組2〇1之另一實施例之爆炸 圖’而圖2B則為背光模組2〇1之組合圖。與圖1 a與圖 1B相比’差異在於背光模組2〇1中開口 的寬度約等於 容置部215之寬度，導光板203亦無凸出部，因此可避免 200949377Therefore, it is necessary to provide a new backlight module in which a simple and easy-to-use method is used to secure the backlight of the LED and provide good electrical contact. In particular, the LED is not subject to high temperature damage. SUMMARY OF THE INVENTION In view of the deficiencies of the prior art, the present invention provides a backlight module in which a variety of fresh, material, and medium-sized coffees are stably fixed and provided well. Miscellaneously, the use of metal shrapnel in the present invention replaces the conventional use of solder = "so can avoid the conventional technology, high temperature tin furnace caused by the failure, in the embodiment of the backlight module, the f optical module contains The light plate, the light-emitting element and the conductive element, and the second receiving part, wherein the first receiving part 2; the dead part has an opening to make the first receiving part and the second receiving part two: setting = saving money first capacity The money system is disposed at the front surface, and the light incident surface is oriented toward 6 200949377. The core is connected to the trench, and the electrical conduction portion is formed to be electrically connected to the light emitting device. According to another embodiment of the present invention, The umbrella finger n-a board, the light-emitting element, and the material-containing frame, the light-guiding second accommodating portion, the ejector-receiving portion and the opening and the second accommodating portion are accommodating in the second accommodating portion The department has a bet. The light guide is placed on the first and the guide plate has a light incident surface, and the light guide light element is disposed in the second accommodation portion, and the light emitting element has: a = surface and the light emitting surface faces the opening. The conductive element has a power to abut the bottom of the light-emitting element adjacent to the light-emitting surface: a shaped opening. The illuminating element is disposed in the first accommodating portion, and the illuminating element has the purpose, characteristics and advantages of the present invention. 'Embodiment】 Figure. The explosion phase of one embodiment of the backlight module 101 of the present invention is used in, but not limited to, a mobile phone, a digital phone, a notebook computer, a desk (four) brain, a television, and a ‘. . Liquid crystal display devices such as aircraft display, global positioning system (GPS) or portable 200949377 DVD player. It is to be understood that the drawings are intended to be illustrative of the present invention, and the relative proportions and dimensions of the drawings and the relative positions of the various 7G parts are for reference only and should not be used to limit the invention. As shown in FIG. 1A, the backlight module 101 includes a light guide plate 103 and a light emitting element 105. The light-emitting element 1〇5 is used to generate light and is incident on the light guide plate 1〇"3, ® (d) The details of this part will be described later. Preferably, the light-emitting element 105 can be a light-emitting diode (LED), and is not limited to red (R), green (G), blue (B), and preferably white LED. The present invention also does not intend to limit the number and size of the light-emitting elements 105, which is determined according to the size of the backlight module 101 and the purpose of use. Those skilled in the art can refer to the LED light-emitting component configuration used in the conventional LED backlight module. This is not mentioned here. However, in the following description of the present invention, the light-emitting element 105 will be exemplified by a white LED. In addition, the backlight module further includes a frame 111 and a conductive element 113. The frame U1 is generally a plastic frame, and its material can refer to the plastic frame used in the conventional liquid crystal display device with the backlight module. A large accommodating portion 112 is formed on the frame 1U, and the light guide plate 103 is disposed in the accommodating portion 112, but the frame 111 additionally has a small accommodating portion 115, which communicates with the accommodating portion 112, and is formed therebetween. There is an opening 〇p, and the receiving portion 115 is preferably, but not limited to, substantially rectangular, for the light-emitting element 1〇5 is disposed therein, and the light-emitting surface ES of the light-emitting element 105 is directed toward the opening 〇P, and the light-emitting element 1〇 The light emitted by the fifth light is incident on the light incident surface RS of the light guide plate 1〇3 through the opening OP. The outer surface of the accommodating portion 115 and the opening OP is further formed with a groove 117' groove 117 and extends outward from the side wall 1151 of the accommodating portion 115, and the width of the groove 117 is slightly larger than The thickness of the conductive member 113 allows the conductive member 113 to be fitted into the trench 117 as shown in the combination of FIG. 1B. Figure ic is a magnified plan view of the combination of the light-emitting elements 105 in the backlight module ιοί. The light-emitting element 105 is, for example, a led element, and the positions of the light-emitting surface ES and the electrodes 1051 and 1053 are located on the front and rear sides, respectively. The conductive element 113 further has conductive portions U31 and 1133 at positions corresponding to the accommodating portion 115, for example, metal elastic pieces, and the conductive portions 1131 and 1133 abut against the electrodes 1051 and 1〇53 from the back surface of the light-emitting element 105, respectively, and form electricity. Sexual Conduction's advantages of this setup will be described later. At the time of assembly, the conductive member 113 is pre-fitted in the trench 117, and is additionally connected to a control circuit (not shown) on a circuit board (or a flexible circuit board). Then, the LED 105 is placed in the accommodating portion 115. At this time, the LED 105 is pressed against the conductive portions mi and 1133 of the conductive member 113, and the electrodes 1〇5b1〇53 of the LED 105 are closely related to the conductive portion 1131133. The ground is abutted to supply power to the light-emitting elements 1〇5, and the aforementioned control circuit is configured to control the light-emitting elements 1〇5. Here, the conductive portion, 1133 is in direct contact with the electrodes 1〇51, 1053 of the LED 105, and no good solder or conductive paste is required to achieve good electrical contact. Further, the material of the conductive portions 1131, 1133 is preferably a metal having good conductivity, such as copper. 9 200949377 In the embodiment shown in FIGS. 1A to 1c, the width of the opening &1> is smaller than the width ′ of the light-emitting element 105 and the light guide plate 1G3 has a convex portion, and the light-incident surface RS is located at the convex portion, and this The projection extends into the opening 〇p, whereby the light incident surface RS abuts the light emitting surface Es to ensure that the light is not lost. In addition, the frame 111 has two positioning structures nu, 1113 at the opening OP, and the positioning structure 111 1113 will have the function of preventing the light-emitting element 1〇5 from moving toward the light guide plate 103, but at the same time the elastic force of the conductive portions 1131 and 1133. ❹ The light-emitting element 105 is pushed in the direction of the light guide plate 103, so that the light-emitting element 105 is firmly clamped in the accommodating portion 115 without being light and easy to shake, and avoiding the disconnection or the light-emitting loss. . As shown in FIG. 1C, in order to further clamp the light-emitting element 1〇5 to the accommodating portion 115, a fitting member may be disposed on the left and right side walls 1153 and Π55 of the accommodating portion (5 (that is, the left and right side walls adjacent to the side wall 1151). 1154, ι156. For example, the fittings 1154, 1156 are, for example, a convex portion, and the LED 105 also has a fixing portion 1054, 1056, for example, a recess, abutting the fittings 1154, 1156, respectively, for further LED 1 The crucible 5 is fixed in the housing portion 115. It is worth mentioning that the fitting member can also be disposed at other positions, such as the other side wall 1151 of the receiving portion 115. 2A shows an exploded view of another embodiment of the backlight module 2〇1 of the present invention, and FIG. 2B shows a combination of the backlight module 2〇1. The difference between FIG. 1a and FIG. 1B is that the width of the opening in the backlight module 2〇1 is approximately equal to the width of the accommodating portion 215, and the light guide plate 203 has no protruding portion, thereby avoiding 200949377.
，開口 〇P較小而導致發光元件205以及導光板2〇3間部 伤光線的損耗，另一方面，框架211的製作也較簡單。圖 2C乃顯示背光模組2〇1中發光元件2〇5的組合狀況之俯 視放大圖，可清楚顯示開口 OP的寬度約等於容置部215 的寬度，而為了避免導電元件213之導電部2131、2133 之彈力會將LED 205朝導光板203的方向推擠，則容置部 215較佳地在左右側壁2153、2155設置有嵌合件2154、 ❹ 2156。舉例來說，嵌合件2154、2156可為一凸部，而LED 205亦具有固定部2054、2056 ’例如為一凹部，分別抵接 肷合件2154、2156，用以進一步地將LED 205固定在容 置部215中。 相較於圖2C ’圖3顯示另一實施例中背光模組中發 光元件305的組合狀況，其中為了避免圖2C中導電部 2131、2133之彈力會將LED 205朝導光板203的方向推 擠的缺點，圖3中LED 205之電極3051、.3053乃位於左 ® 右兩側’而相對地導電元件313之導電部3131、313亦分 別設置在容置部315左右側壁3153與3155上，與電極 3051、3053抵接’這樣導電部3131、3133從左右兩侧之 彈力會將LED 305嵌制在容置部315中，亦可減少設置嵌 合件的成本。熟此技藝者應可輕易地將圖3中發光元件305 的組合方式，與圖1C或圖2C所示之發光元件之組合方式 互相替換。 200949377 圖4顯示本發明另一實施例之背光模組4〇1爆炸圖。 背光模組401之框架411 一樣具有容置部412以設置導光 板403，以及容置部415以設置發光元件405。但與圖1A 不同的是，發光元件405之電極(未顯示)乃位於底部，而 並非與發光元件405之發光面相對。對應於此，導電元件 413乃設置在容置部415之下方，而導電元件413之導電 部4131、4133再抵接發光元件405底部之電極，並形成 ❹ 電性導通。較佳地，容置部415亦具有如圖1C所示之嵌 合件(圖4中未顯示），以避免導電部4131、4133將發光元 件405推擠’或是因振動而走位。 藉由以上所述之實施例，本發明提出一種新的背光模 組’，其中採用一種簡單、容易實施的方式將背光模組中之 發光元件穩定地固定，並提供良好地電性接觸。相較於習 知设计，本發明不會大幅地增加成本，且又容易實施，更 特別的是，發光元件不會遭受到高溫環境的損宝。 & 口 雖然本發明已以實補揭露如上’然其並_以限定 本發明，任何具有本發明所屬技術領域之通常知識者，在 不脫離本發明之精神和範圍内，當可作各種更動盘潤飾， 實施例，因此本發明之保護範圍當視 後附申Μ專利範圍所界定者為準。 12 200949377 【圖式簡單說明】 圖1A為本發明背光模組101之爆炸圖； 圖1B本發明背光模組101之組合圖 圖1C顯示發光元件1〇5的組合狀況； 圖2A為本發明背光模組201之爆炸圖； 圖2B本發明背光模組2〇1之組合圖； 圖2C顯示發光元件2〇5的組合狀況； ❿ 圖3顯示發光元件305的組合狀況；以及 圖4為本發明背光模組4〇1之爆炸圖。 【主要元件符號說明】 背光模組 導光板 發光元件 框架 容置部 導電元件 溝槽 電極 固定部 定位結構 導電部 側壁 101 ' 201 ' 401 103、203、303、403 105、205、305、405 111 ' 211 ' 411 112、 115、215、315、412、415 113、 213、313、413 117 1051 > 1053 1054、1056、2054、2056 1111 ' 1113 113卜1133、213卜2133、313卜3133、 4131 ' 4133 115 卜 1153、1155、2153、2155 13 200949377The opening 〇P is small, resulting in loss of light between the light-emitting element 205 and the light guide plate 2〇3. On the other hand, the frame 211 is also relatively simple to fabricate. 2C is a top plan enlarged view showing the combination of the light-emitting elements 2〇5 in the backlight module 2〇1, and clearly shows that the width of the opening OP is approximately equal to the width of the accommodating portion 215, and the conductive portion 2131 of the conductive member 213 is avoided. The elastic force of 2133 pushes the LED 205 toward the light guide plate 203. The receiving portion 215 is preferably provided with the fittings 2154 and ❹ 2156 on the left and right side walls 2153 and 2155. For example, the fittings 2154, 2156 can be a convex portion, and the LED 205 also has a fixing portion 2054, 2056', for example, a recess, respectively abutting the clamping members 2154, 2156 for further fixing the LED 205 In the housing portion 215. FIG. 3 shows a combination of the light-emitting elements 305 in the backlight module in another embodiment, in order to prevent the elastic force of the conductive portions 2131, 2133 in FIG. 2C from pushing the LEDs 205 toward the light guide plate 203. The disadvantages are that the electrodes 3051 and .3053 of the LED 205 in FIG. 3 are located on the left side and the right side of the left side, and the conductive portions 3131 and 313 of the opposite conductive elements 313 are also respectively disposed on the left and right side walls 3153 and 3155 of the accommodating portion 315, and The electrodes 3051 and 3053 are in contact with each other. The elastic force of the conductive portions 3131 and 3133 from the left and right sides will embed the LED 305 in the accommodating portion 315, and the cost of providing the fitting member can be reduced. Those skilled in the art should be able to easily replace the combination of the light-emitting elements 305 of Figure 3 with the combination of the light-emitting elements shown in Figure 1C or Figure 2C. 200949377 FIG. 4 shows an exploded view of a backlight module 4〇1 according to another embodiment of the present invention. The frame 411 of the backlight module 401 has a housing portion 412 to provide a light guide plate 403, and a housing portion 415 for arranging the light-emitting elements 405. However, unlike Fig. 1A, the electrode (not shown) of the light-emitting element 405 is located at the bottom, and is not opposed to the light-emitting surface of the light-emitting element 405. Corresponding to this, the conductive element 413 is disposed under the accommodating portion 415, and the conductive portions 4131, 4133 of the conductive member 413 are further abutted against the electrode at the bottom of the light-emitting element 405, and are electrically conductive. Preferably, the receiving portion 415 also has an engaging member (not shown in FIG. 4) as shown in FIG. 1C to prevent the conductive portions 4131, 4133 from pushing the light-emitting member 405' or moving away due to vibration. With the above-described embodiments, the present invention proposes a new backlight module ' in which the light-emitting elements in the backlight module are stably fixed in a simple and easy-to-implement manner and provide good electrical contact. Compared with the conventional design, the present invention does not significantly increase the cost, and is easy to implement, and more particularly, the light-emitting element does not suffer from a high temperature environment. The present invention has been described in the above as a matter of the above, and is intended to be limited to the invention, and it is possible to make various changes without departing from the spirit and scope of the invention. The invention is to be construed as being limited by the scope of the appended claims. FIG. 1A is an exploded view of a backlight module 101 of the present invention; FIG. 1B is a combination diagram of a backlight module 101 of the present invention; FIG. 1C shows a combination state of the light-emitting elements 1〇5; 2B is a combination view of the backlight module 2〇1 of the present invention; FIG. 2C shows a combination of the light-emitting elements 2〇5; FIG. 3 shows a combination state of the light-emitting elements 305; Explosion diagram of the backlight module 4〇1. [Description of main component symbols] Backlight module light guide plate Light-emitting element Frame accommodating portion Conducting element Groove electrode fixing portion Positioning structure Conducting portion side wall 101 ' 201 ' 401 103, 203, 303, 403 105, 205, 305, 405 111 ' 211 '411 112, 115, 215, 315, 412, 415 113, 213, 313, 413 117 1051 > 1053 1054, 1056, 2054, 2056 1111 '1113 113 Bu 1133, 213 Bu 2133, 313 Bu 3133, 4131 ' 4133 115 Bu 1153, 1155, 2153, 2155 13 200949377
嵌合件 1154、1156、2154、2156 開口 OP 發光面 ES 入光面 RSFittings 1154, 1156, 2154, 2156 Opening OP Illumination surface ES Entrance surface RS
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