200947594 七、指定代表圖： (一） 本案指定代表圖為：第（二）圖。 (二) 本代表圖之元件符號簡單說明： 100 晶片取放裝置 110 氣壓缸 120 本體 121 控制器 122 第一氣壓接頭 123 第二氣壓接頭 124 氣壓管 300 測試裝置 310 控制裝置 311 第一按鈕 312 第二按麵 313 第三按鈕 314 第四按4丑 315 電源線 320 真空量測裝置 Q 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式： 九、發明說明： 【發明所屬之技術領域!】 本發明是有關於一種測試裝置，特別是有關於一種可 檢測晶片取放裝置的測試裝置。 【先前技術】 5 200947594 半導體元件經過設計、製造後，尚須經過測試，才能 確保結構與功能可以正常運作。其中晶片測試機上的晶片 取放裝置會影響晶片測試的速度與準確性，晶片測試機每 小時需處理數千片的晶片，加上晶片尺寸逐漸小型化與輕 量化，使得晶片取放裝置的工作準確性與測試效率息息相 關0 ❹ 第一圖顯示一習知晶片取放裝置100的示意圖，晶片 取放裝置100設置於一晶片測試機200，用以進行晶片10 的取放。晶片取放裝置100包含一氣壓缸110、一本體120 以及一吸嘴130。吸嘴130設置於氣壓缸110之前端，藉 由真空吸力進行晶片10的取放；本體120包含一控制器 121、第一氣壓接頭122以及第二氣壓接頭123，第一氣壓 接頭122連接至一氣壓源（圖中未示），第二氣壓接頭123 ❹ 藉由一氣壓管124連接至吸嘴130。本體120内部包含複 數之電磁閥（圖中未示）及至少一真空產生器（圖中未示）， 控制器121接收晶片測試機200之動作信號，控制前述之 電磁閥，使得晶片取放裝置100進行晶片10的取放：首先， 氣壓缸110之前端向下移動，使得吸嘴130以適當的速度 接觸晶片10;接著，真空產生器產生適當的真空吸力，藉 以吸取晶片10 ;然後，氣壓缸110之前端向上移動，並將 200947594 晶片10移至適當位置;最後，氣壓幻1〇之前端向下移動， 亚藉由队乳破壞吸嘴13G内部的真空狀態，使得晶片1〇自 然落h藉由㈣器121控制前述之電磁閥可使晶片取放 裝置刪達到拾取與放^Pickandpiaw晶片1()的功 能。 由於晶片測試機200係以不停機的方式持續運轉，而 ©且晶片測試機200每小時需處理數千片的晶片1〇,上述的 日日片取放裝置1〇〇内部的電磁閥很容易因為粉塵的阻塞而 導致吸取晶片10的真空度不足；或者氣壓幻1G因為磨損 而使得動作不正常，進;^晶片10的取放時，無法達到適當 的速度及位置。-般在^行晶片取放裝置丨⑼的維修與檢 剩時，需要將晶片取放裝置1〇〇紐裝至晶片測試機2〇〇， 藉由晶片測試機200所提供之動作信號，使得晶片取放裝 置100進行各項動作；上述之檢測方式會導致晶片測試機 2〇〇無法進行一般的生產，因而造成晶片取放裝置100的 檢測成本很高。 鑑於上述習知技術所存在的缺點，有必要提出一種測 忒襞置，可檢測晶片取放裝置，不需將晶片取放裝置組裝 至晶片測試機，即可進行晶片取放裝置之檢測。 【發明内容】 200947594 本發明的目的在於提出一種測試裝置，可檢測晶片取 放裝置，不需將晶片取放裝置組裝至晶片測試機，即可進 行晶片取放裝置之檢測。 根據上述的目的，本發明揭露一種測試裝置，該測試 裝置可檢測一晶片取放裝置，該晶片取放裝置可設置於一 晶片測試機，該測試裝置包含：一控制裝置，該控制裝置 Q 可提供至少一操作信號至該晶片取放裝置，該操作信號與 該晶片測試機提供至該晶片取放裝置之一動作信號相同。 本發明同時揭露一種測試方法，該測試方法可檢測一晶片 取放裝置，該晶片取放裝置可設置於一晶片測試機，該測 試方法包含：提供至少一操作信號至該晶片取放裝置，該 操作信號與該晶片測試機提供至該晶片取放裝置之一動作 信號相同。 ❹ 本發明的功效在於提供一種測試裝置及測試方法，可 檢測晶片取放裝置，不需將晶片取放裝置組裝至晶片測試 機，即可進行晶片取放裝置之檢測。 【實施方式】 本發明的一些實施例將詳細描述如下。然而，除了如 下描述外，本發明還可以廣泛地在其他的實施例施行，且 200947594 本發明的範圍並不受實施例之限定，其以之後的專利範圍 為準。再者，為提供更清楚的描述及更易理解本發明，圖 式内各部分並沒有依照其相對尺寸繪圖，某些尺寸與其他 相關尺度相比已經被誇張；不相關之細節部分也未完全繪 出’以求圖式的簡潔。 第二圖顯示根據本發明一較佳實施例之測試裝置的 ❹示意圖。該測試裝置300可檢測晶片取放裝置1〇〇，該測 試裝置300包含：一控制裝置310，該控制裝置310可提 供至少一操作信號至晶片取放裝置100。前述之操作信號 與晶片測試機200所提供之動作信號相同，因此不需將晶 片取放裝置1〇〇組裝至晶片測試機2〇〇，即可進行晶片取 放裝置100之檢測。 ❹ 本實施例中，第一氣壓接頭122連接至一氣壓源（圖 中未示），控制裝置310連接至晶片取放裝置1〇〇之控制器 121’控制裝置310係一電路板，該電路板包含電源線315、 第一按紐311、第二按鈕312、第三按鈕313以及第四按鈕 314，電源線315連接至一電源（圖中未示），按下不同按鈕 可使控制裝置310輸出不同操作信號至控制器121，控制 器121接收上述操作信號，控制晶片取放裝置1〇〇内部之 200947594 電磁閥’使得晶片取放裝置100進行不同的動作。 本實施例中，測試裝置3 0 0更包含·一真空量測裝置 320 ’用以量測晶片取放裝置1〇〇之第二氣壓接頭123内部 之真空度，第二氣壓接頭123係藉由氣壓管124連接至真 空量測裴置320。當晶片取放裝置100安裝於晶片測試機 200時’吸嘴130内部之真空度係由第二氣壓接頭123藉 ❹ 由氣壓管124所提供，因此量測晶片取放裝置1〇〇之第二 氣壓接頭123内部之真空度，即相當於量測吸嘴130内部 • 之真空度。 應用本發明之測試裝置300檢測晶片取放震置1〇〇之 測試方法如下：首先’按下第一按紐311，使控制裝置310 輸出一第一操作信號至晶片取放裝置1〇〇之控制器m， ❹控制器121接收上述第一操作信號，控制晶片取放裝置100 内部之電磁閥，使得晶片取放裝置1〇〇之第二氣壓接頭123 内部產生真空狀態，藉由真空量測裝置320量測第二氣壓 接頭123内部之真空度，可確認晶片取放裝置100的真空 特性是否正常，當第二氣壓接頭123内部之真空度不足 時，可能是晶片取放裝置100·内部之電磁閥或真空產生器 被粉塵所堵塞。 200947594 接著，按下第二按鈕312，使控制裝置31〇輸出一第 二操作信號至晶片取放裝置100之控制器121，控制器m 接收上述第二操作信號’控制晶片取放裝置1〇〇内部之電 磁閥’使得晶片取放厚置100之第二氣壓接頭123内部停 止產生真空，此時第二氣壓接頭123内部仍維持一定的真 空狀態。 © 然後，按下第三按鈕313，使控制裝置31〇輸出一第 一操作"is说至晶片取放裝置100之控制器121，控制器121 接收上述第三操作信號’控制晶片取放裝置丨00内部之電 磁閥，使得空氣吹入晶片取放裝置100之第二氣壓接頭123 内部’藉以破壞第二氣壓接頭123内部的真空狀態。 最後’按下第四按鈕314，使控制裝置310輸出一第 ❹ 四操作信號至晶片取放裝置100之控制器12卜控制器121 接收上述第四操作信號，控制晶片取放裝置100内部之電 磁閥’使得氣壓缸110產生動作，藉以測試氣壓缸11〇的 動作是否正常，是否有因為磨損而產生位置或速度不正破 的現象。 11 200947594 藉由本發明之測試裝置及測試方法，可檢測晶片取放 裝置，不需將晶片取放裝置組裝至晶片測試機，即可進行 晶片取放裝置之檢測。 上述之實施例僅係為說明本發明之技術思想及特點， 其目的在使熟悉此技藝之人士能了解本發明之内容並據以 Ο 實施，當聽狀Μ本發日狀專鄕圍，即凡其他未脫 離本發明所揭讀神㈣成之各㈣效改變祕飾都涵蓋 在本發明所揭露的範_，均應包含在下述之申請專利範 圍内。 ❿ 12 200947594 【圖式簡單說明】 第一圖顯示一習知晶片取放裝置的示意圖。 第二圖顯示根據本發明一較佳實施例之測試裝置的 示意圖。200947594 VII. Designation of representative representatives: (1) The representative representative of the case is: (2). (2) Brief description of the components of the representative diagram: 100 wafer pick-and-place device 110 pneumatic cylinder 120 body 121 controller 122 first air pressure connector 123 second air pressure connector 124 air pressure tube 300 test device 310 control device 311 first button 312 Second press 313 Third button 314 Fourth press 4 ug 315 Power line 320 Vacuum measuring device Q VIII. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: IX. Invention description: [Technology to which the invention belongs FIELD OF THE INVENTION The present invention relates to a test apparatus, and more particularly to a test apparatus for a detectable wafer pick and place apparatus. [Prior Art] 5 200947594 After designing and manufacturing a semiconductor component, it must be tested to ensure that the structure and function can operate normally. Among them, the wafer pick-and-place device on the wafer testing machine will affect the speed and accuracy of the wafer testing. The wafer testing machine needs to process thousands of wafers per hour, and the wafer size is gradually miniaturized and lightened, so that the wafer pick-and-place device The accuracy of the work is closely related to the test efficiency. The first figure shows a schematic diagram of a conventional wafer pick and place device 100. The wafer pick and place device 100 is disposed in a wafer tester 200 for picking up and dropping the wafer 10. The wafer pick-and-place device 100 includes a pneumatic cylinder 110, a body 120, and a nozzle 130. The nozzle 130 is disposed at the front end of the pneumatic cylinder 110, and the wafer 10 is taken by the vacuum suction. The body 120 includes a controller 121, a first pneumatic joint 122 and a second pneumatic joint 123. The first pneumatic joint 122 is connected to the first nozzle. A pneumatic source (not shown), the second pneumatic connection 123 连接 is connected to the suction nozzle 130 by a pneumatic tube 124. The body 120 includes a plurality of solenoid valves (not shown) and at least one vacuum generator (not shown). The controller 121 receives the action signal of the wafer testing machine 200 and controls the solenoid valve to make the wafer pick-and-place device. 100: picking up the wafer 10: first, the front end of the pneumatic cylinder 110 is moved downward, so that the nozzle 130 contacts the wafer 10 at an appropriate speed; then, the vacuum generator generates an appropriate vacuum suction to suck the wafer 10; The front end of the cylinder 110 is moved upward, and the 200947594 wafer 10 is moved to a proper position; finally, the front end of the air pressure is shifted downward, and the vacuum state inside the suction nozzle 13G is destroyed by the emulsion, so that the wafer 1 is naturally dropped. The above-mentioned solenoid valve is controlled by the (four) device 121 to enable the wafer pick-and-place device to delete the function of picking up and releasing the Pickandpiaw wafer 1 (). Since the wafer tester 200 is continuously operated in a non-stop manner, and the wafer tester 200 needs to process thousands of wafers per hour, the above-mentioned solar valve pick-up device 1 〇〇 internal solenoid valve is easy The vacuum of the suction wafer 10 is insufficient due to the clogging of the dust; or the pressure illusion 1G is not properly operated due to wear, and the appropriate speed and position cannot be achieved when the wafer 10 is picked up or lowered. When the maintenance and repair of the wafer pick-and-place device (9) is performed, the wafer pick-and-place device 1 is required to be loaded into the wafer tester 2, and the action signal provided by the wafer tester 200 is used. The wafer pick-and-place device 100 performs various operations; the above-described detection method may cause the wafer testing machine 2 to fail to perform general production, thereby causing high cost of detecting the wafer pick-and-place device 100. In view of the above-mentioned shortcomings of the prior art, it is necessary to provide a measuring device capable of detecting a wafer pick-and-place device, and detecting the wafer pick-and-place device without assembling the wafer pick-and-place device to the wafer testing device. SUMMARY OF THE INVENTION 200947594 It is an object of the present invention to provide a test apparatus for detecting a wafer pick-and-place apparatus that can perform wafer pick-and-place apparatus inspection without assembling the wafer pick-and-place apparatus to the wafer tester. According to the above objective, the present invention discloses a testing device capable of detecting a wafer pick and place device, the wafer pick and place device being disposed on a wafer testing machine, the testing device comprising: a control device, the control device Q At least one operational signal is provided to the wafer pick and place device, the operational signal being the same as the one of the wafer tester providing an action signal to the wafer pick and place device. The present invention also discloses a test method for detecting a wafer pick and place device, the wafer pick and place device can be disposed on a wafer tester, the test method comprising: providing at least one operation signal to the wafer pick and place device, The operational signal is the same as the one of the wafer tester provides an action signal to the wafer pick and place device. The effect of the present invention is to provide a test apparatus and a test method for detecting a wafer pick-and-place apparatus, which can perform wafer pick-and-place apparatus detection without assembling the wafer pick-and-place apparatus to the wafer tester. [Embodiment] Some embodiments of the present invention will be described in detail below. However, the present invention may be widely practiced in other embodiments except as described below, and the scope of the present invention is not limited by the examples, which are subject to the scope of the following patents. Further, in order to provide a clearer description and a better understanding of the present invention, the various parts of the drawings are not drawn according to their relative dimensions, and some dimensions have been exaggerated compared to other related dimensions; the irrelevant details are not fully drawn. Out of the 'simplification of the pattern. The second figure shows a schematic view of a test apparatus in accordance with a preferred embodiment of the present invention. The test apparatus 300 can detect a wafer pick and place apparatus 1 that includes a control unit 310 that provides at least one operational signal to the wafer pick and place apparatus 100. The operation signal is the same as that provided by the wafer tester 200. Therefore, the wafer pick-and-place device 100 can be detected without assembling the wafer pick-and-place device 1 to the wafer tester. In this embodiment, the first air pressure connector 122 is connected to a gas pressure source (not shown), and the control device 310 is connected to the controller of the wafer pick-and-place device 1', and the control device 310 is a circuit board. The board includes a power line 315, a first button 311, a second button 312, a third button 313, and a fourth button 314. The power line 315 is connected to a power source (not shown), and the control device 310 can be pressed by pressing a different button. Different operation signals are output to the controller 121, and the controller 121 receives the above operation signals, and controls the 200947594 solenoid valve ' inside the wafer pick-and-place device 1 to cause the wafer pick-and-place device 100 to perform different operations. In this embodiment, the testing device 300 further includes a vacuum measuring device 320' for measuring the vacuum inside the second pneumatic joint 123 of the wafer pick-and-place device 1 , and the second pneumatic connector 123 is The air tube 124 is connected to the vacuum measuring device 320. When the wafer pick-and-place device 100 is mounted on the wafer testing machine 200, the vacuum inside the nozzle 130 is provided by the second pneumatic joint 123 by the pneumatic tube 124, so that the wafer pick-and-place device 1 is second. The degree of vacuum inside the pneumatic joint 123 corresponds to the degree of vacuum inside the measuring nozzle 130. The test method for detecting the wafer pick-and-place vibration by using the test apparatus 300 of the present invention is as follows: First, 'pressing the first button 311, causing the control device 310 to output a first operation signal to the wafer pick-and-place device 1 The controller m receives the first operation signal and controls the solenoid valve inside the wafer pick-and-place device 100, so that the vacuum state of the second gas pressure connector 123 of the wafer pick-and-place device 1 is generated by vacuum measurement. The device 320 measures the vacuum inside the second pneumatic joint 123 to confirm whether the vacuum characteristics of the wafer pick-and-place device 100 are normal. When the vacuum inside the second pneumatic joint 123 is insufficient, the wafer pick-and-place device 100 may be internal. The solenoid valve or vacuum generator is blocked by dust. 200947594 Next, the second button 312 is pressed to cause the control device 31 to output a second operation signal to the controller 121 of the wafer pick-and-place device 100, and the controller m receives the second operation signal 'control wafer pick-and-place device 1' The internal solenoid valve 'stops the vacuum generation inside the second pneumatic joint 123 of the wafer pick-and-place 100, and the inside of the second pneumatic joint 123 maintains a certain vacuum state. Then, the third button 313 is pressed to cause the control device 31 to output a first operation "is to the controller 121 of the wafer pick and place device 100, and the controller 121 receives the third operation signal 'control wafer pick and place device The solenoid valve inside the 00 is such that air is blown into the interior of the second pneumatic joint 123 of the wafer pick-and-place device 100 to thereby destroy the vacuum state inside the second pneumatic joint 123. Finally, the fourth button 314 is pressed to cause the control device 310 to output a fourth operation signal to the controller 12 of the wafer pick-and-place device 100, and the controller 121 receives the fourth operation signal to control the electromagnetic inside the wafer pick-and-place device 100. The valve 'actuates the pneumatic cylinder 110 to test whether the action of the pneumatic cylinder 11 is normal, and whether there is a phenomenon that the position or speed is not broken due to wear. 11 200947594 By the testing device and the testing method of the present invention, the wafer pick-and-place device can be inspected, and the wafer pick-and-place device can be detected without assembling the wafer pick-and-place device to the wafer testing device. The above embodiments are merely illustrative of the technical idea and the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention. All of the other four (four) effect change secrets that are not disclosed in the present invention are covered by the scope of the invention as disclosed in the following claims. ❿ 12 200947594 [Simple description of the drawings] The first figure shows a schematic diagram of a conventional wafer pick-and-place device. The second figure shows a schematic diagram of a test apparatus in accordance with a preferred embodiment of the present invention.
【主要元件符號說明】 10 晶片 100 晶片取放裝置 110 氣壓缸 120 本體 121 控制器 122 第一氣壓接頭 123 第二氣壓接頭 124 氣壓管 130 吸嘴 200 晶片測試機 300 測試裝置 310 控制裝置 311 第一按鈕 312 第二按鈕 313 第三按鈕 314 第四按鈕 315 電源線 320 真空量測裝置 13[Main component symbol description] 10 wafer 100 wafer pick-and-place device 110 pneumatic cylinder 120 body 121 controller 122 first air pressure connector 123 second air pressure connector 124 air tube 130 nozzle 200 wafer test machine 300 test device 310 control device 311 first Button 312 second button 313 third button 314 fourth button 315 power line 320 vacuum measuring device 13