200947568 九、發明說明： 【發明所屬之技術領域】 本發明係與發光二極體之製程有關，更詳而言之是指 一種用於發光二極體封裝成型之網板的使用方法。 5【先前技術】 . 按，led封裝作業包含螢光膠塗覆LED晶片之製程。 ❿ 常見製程包含透過點膠或模鑄等方式達成，其中，利用點 膠製程所得之封裝結構存有尺寸不一與膠體移位之問題， 致使出光品質不佳，而模鑄製程雖無上述問題，但其封裝 1〇過程易產生應力，導致LED晶片與基板接觸不良甚至剝 落，可靠度不佳，其次，設備成本亦較高。 為改善上述缺失，遂有業者開發出一種以網印方式在 LED晶片上塗覆螢光膠之製程，此種製程由於網板具有複 數個固定尺寸規格之孔洞，且膠體可受該孔洞限位，是以， ❹15封裝結構的尺寸固定且位置精確，俾使出光品質較佳；再 者，網印製程的設備成本低、生產快速，且無上述應力問 題，可靠度較高。 誠然上述利用網印製程所得之LED成品的出光品質及 可靠度較高，惟，隨著LED封裝結構日趨多元，上述網印 ^程已不敷使用’詳言之’如LED封裝結構具有複數個勞 光膠層及透光膠層時’吾人必須接續使用多款具不同尺寸 ^洞之網板依序_每-闕，始可完成封裝 ，然而’此 2必造成製程繁瑣、生產效率降低及設備成本增加，實 4 200947568 【發明内容】 本發明之主要目的在於提供一種用於發光二極體封裝 成型之網板的使用方法，係藉由重複使用同—網板於發光 、5二極體晶片上塗佈膠層，藉以簡化製程、提高生產效率及 降低設備成本，且可符合多元化LED封裝結構之封裝需求。 © 、緣以達成上述之主要目的，本發明所提供之一種用於 發光二極體封裝成型之網板的使用方法，係於一承載有至 〆一發光一極體晶片之基板上，放置一具有至少一階級孔 1〇且該階級孔具有-大孔徑部與一小孔徑部之網板，並依序 利用該小孔徑部與該大孔徑部分別將一第一封裝膠材與一 第二封裝膠材塗覆至該發光二極體晶片上。 【實施方式】 φ 15 請參照第一至六圖，係本發明之第-較佳實施例，其 揭露-種供應於發光二極體封裝成型製程中之網板的使用 方法，包含以下步驟： 、 首先，提供一網板10，如第一圖所示，該網板10具有 複數個階級孔11 ’各該階級孔u具有一大孔徑部1U與一 2〇小孔徑部112，且孔壁預先經過表面處理(本實施例為鍍上 一層不沾封裝膠材之材料lla)，以利離模； 接著’配合參照第二圖，續將該網板1〇置放於一承載 有複數個發光二極體晶片1〇1之基板1〇〇上，並使該些發 光二極體晶片101位於對應之階級孔11之小孔徑部112 5 200947568 内，爾後，利用點膠機200控制一第一封裝膠材A(如具有 透光性及黏性之螢光粉膠體)的點膠位置及膠量，使該第一 封裝膠材A由該大孔徑部111進入該小孔徑部I〗]後，完200947568 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to the process of a light-emitting diode, and more particularly to a method of using a screen for light-emitting diode package molding. 5 [Prior Art] . Press, led packaging operation includes the process of coating the LED chip with fluorescent glue.常见 The common process is achieved by means of dispensing or molding. Among them, the package structure obtained by the dispensing process has the problems of different sizes and colloid displacement, resulting in poor light quality, but the mold casting process has no such problems. However, the process of packaging is prone to stress, resulting in poor contact or even peeling of the LED chip and the substrate, and the reliability is not good, and secondly, the equipment cost is also high. In order to improve the above-mentioned defects, a manufacturer has developed a process for applying a fluorescent paste on a LED wafer by screen printing. Since the stencil has a plurality of holes of a fixed size specification, and the colloid can be restricted by the hole. Therefore, the size of the ❹15 package structure is fixed and the position is accurate, so that the light-emitting quality is better; in addition, the equipment of the screen printing process has low cost, rapid production, and no stress problem, and high reliability. It is true that the above-mentioned LED products obtained by the screen printing process have higher light quality and reliability. However, as the LED package structure becomes more diversified, the above-mentioned screen printing process is insufficient to use 'detailed', such as LED package structure having multiple When using the glue layer and the light-transmissive layer, 'we must continue to use a variety of stencils with different sizes and holes. _Every-阙 can complete the package, but 'this 2 will cause cumbersome process and reduced production efficiency. The cost of the device is increased, and the actual purpose of the present invention is to provide a method for using a stencil for light-emitting diode package molding by repeating the same-network plate for illuminating, 5-diode The adhesive layer is coated on the wafer to simplify the process, increase production efficiency and reduce equipment cost, and meet the packaging requirements of a diversified LED package structure. In order to achieve the above-mentioned main purpose, a method for using a reticle for forming a light-emitting diode package is provided on a substrate carrying a substrate of a light-emitting diode, and a layer is placed thereon. a stencil having at least one class of holes 1 〇 and having a large aperture portion and a small aperture portion, and sequentially using the small aperture portion and the large aperture portion respectively to form a first encapsulant and a second A package adhesive is applied to the light emitting diode wafer. [Embodiment] φ 15 Referring to the first to sixth embodiments, a first preferred embodiment of the present invention discloses a method of using a stencil supplied in a package manufacturing process for a light-emitting diode package, comprising the following steps: First, a stencil 10 is provided. As shown in the first figure, the stencil 10 has a plurality of class holes 11'. Each of the class holes u has a large aperture portion 1U and a 2 〇 small aperture portion 112, and the hole wall Pre-surface treatment (in this embodiment, a layer of non-stick encapsulant material lla) is applied to facilitate the release of the mold; then 'with reference to the second figure, the stencil is placed on one of the plurality of carriers. The substrate 1 of the LED substrate 1 is placed on the substrate 1 and the LEDs 101 are placed in the small aperture portion 112 5 200947568 of the corresponding class hole 11 and then controlled by the dispenser 200. a dispensing position and a glue amount of a package adhesive A (such as a light-transmitting and viscous phosphor powder colloid), so that the first package adhesive A enters the small aperture portion I from the large aperture portion 111] After finishing
全覆蓋該發光二極體晶片101 ’之後進行第一封装膠材A * 5 的固化作業。 當第一封裝膠材A固化後，接著操作該網板1〇上移， ❹ 並將該網板1〇倒置，如第三至四圖所示，之後網板1〇再 次降下至該基板100上，如第五圖所示，此時利用點膠機 200控制一第一封裝膠材B(如梦膠)由該小孔徑部m進入 10該大孔徑部111，並經由點膠製程使該第二封裝膠材B均勻 塗佈且完全覆蓋於該第一封裝膠材A上，爾後經加熱程序 使第二封裝膠材B達到熟化，再與網板1〇離模，如第六圖 所示’至此即完成發光二極體晶片101之封裝作業。 由上述可知，吾人藉由網板10的階級孔11結構及其 ❹I5旋轉倒置的程序，可達重複使用同一網板1〇即可完成具二 層封裝結構之發光二極體晶片101的封裝作業，是以，相 較於習知必須接續使用二款具有不同尺寸孔洞之網板的使 用方法而言，本發明所提供之網板10的使用方法係可簡化 製程、提高生產效率，以及降低設備成本；再者，當封裝 20結構更為複雜時，本發明之網板1〇使用方法的功效更見明 顯》 β月再參照第七至十一圖所示之本發明第二較佳實施例 斤揭露之網板2〇的使用方法，其與第一較佳實施例之網板 的使用方法大致相同，不同處在於：本實施例之網板20 6 200947568 預先製成其階級孔21之小孔徑部211可容置複數個發光二 極體晶片101，如第七圖所示，藉此，吾人可於第一封裝膠 材A充填完小孔徑部211後，使用一刮刀300對該第一封 裝膠材A進行表面平整處理，使其表面A1平坦，以提升 5產品的均光性；接著，如第八至十圖所示，同樣透過移除 及倒置該網板20，並再次置放至基板100上，隨後利用點 〇 膠機20〇或其他注膠方式將第二封裝膠材B充填至大孔徑 部212’爾後經固化及切割程序即可獲得如第十一圖所示之 發光二極體封裝結構。 10 請續參照第十二至十六圖所示之本發明第三較佳實施 例所揭露之網板30的使用方法，其與第一較佳實施例之網 板10的使用方法大致相同，不同處在於：本實施例之網板 3〇係預先製成其階級孔31之小孔徑部311恰可容置一發光 二極體晶片101，藉此，第一封裝膠材A僅覆蓋於該發光 ⑩I5 —極體晶片101之頂面l〇la，符合正向發光型LED之封裝 需求，之後，同樣藉由本發明獨具之網板3〇的倒置方法， 即可快速將第二封裝膠材B充填至大孔徑部312，最後經 固化及切割程序即可獲得如第十六圖所示之發光二極體封 裝結構。另一提的是，本實施例之發光二極體晶片1〇1係 20 "X預先於其侧面l〇lb及底面至少一面上鐘上一層 反射膜F，以提高取光率。 請續參照第十七至二十圖所示之本發明第四較佳實施 例所揭露之網板40的使时法，其與第—較佳實施例之網 板10的使用方法大致相同，不同處在於：本實施例係透過 7 200947568 點膠機200控制點膠位置及膠量，使得充填於階級孔4i之 小孔徑部411的第一封裝膠材a不會覆蓋住發光二極體晶 片101之頂面101a，亦即，第一封裝膠材A之高度H1等 於或小於該發光一極體晶片101之高度H2，藉此，第一封 ，5裝膠材A僅覆蓋於該發光二極體晶片101之侧面1〇lb，以 符合側向發光型LED之封裝需求，之後，同樣藉由本發明 Ο 獨具之網板40的倒置方法(參照第十八至十九圖），即可迅 速將第二封裝膠材B充填至大孔徑部412，最後經固化及 切割即可獲得如第二十圖所示之發光二極體封裝結構β另 1〇 一提的是，本實施例之發光二極體晶片101係可預先於其 頂面101a及底面l〇lc之至少一面上鍍上一層反射膜5?，以 提高取光率。 另特別一提的是，請配合第二十一圖，前述網板⑴、 20、30、40之階級孔11、21、31、41除可以一體成型之方 I5式製作之外’亦可預先透過螺栓400等固定件將具有複數 ❹ 個大孔徑部51之一第一網板50與具有複數個小孔徑部61 之一第二網板60鎖接成一體’以形成各式階級孔；如此一 來’吾人可靈活地組合運用既有之不同孔洞形狀的網板， 如第二十二圖所示之網板70 ’並搭配本發明之網板的使用 20方法，得快速製得如第二十四圖所示之發光二極體封裝結 構500,據以供應日趨增加的LED封裝結構及產能之需求。 當然，前述網板之階級孔的大、小孔徑部係可分別預先製 成發光二極體所欲封裝之形狀，如第二十三圖所示之網板 80即是。The curing operation of the first encapsulant A*5 is performed after the entire LED chip 101' is completely covered. After the first encapsulant A is cured, the stencil 1 is then moved up, ❹ and the stencil is inverted, as shown in the third to fourth figures, after which the stencil 1 〇 is lowered again to the substrate 100. As shown in the fifth figure, at this time, the first encapsulating material B (such as a dream gel) is controlled by the dispenser 200 to enter the large aperture portion 111 from the small aperture portion m, and the dispensing portion is made through a dispensing process. The second encapsulating material B is evenly coated and completely covered on the first encapsulating material A, and then the second encapsulating material B is matured by a heating process, and then separated from the stencil 1 如, as shown in the sixth figure. Thus, the packaging operation of the light-emitting diode wafer 101 is completed. As can be seen from the above, by the structure of the class hole 11 of the stencil 10 and the slewing process of the ❹I5, it is possible to complete the packaging operation of the illuminating diode chip 101 having the two-layer package structure by repeatedly using the same stencil 1 〇. Therefore, the use of the stencil 10 provided by the present invention can simplify the process, improve the production efficiency, and reduce the equipment, compared to the conventional method of using two stencils having holes of different sizes. Cost; Furthermore, when the structure of the package 20 is more complicated, the effect of the method of using the screen 1 of the present invention is more obvious. The second preferred embodiment of the present invention shown in the seventh to eleventh drawings is further referred to. The method of using the stencil 2 揭 is similar to the method of using the stencil of the first preferred embodiment, except that the stencil 20 6 200947568 of the embodiment is pre-made into a small class hole 21 thereof. The aperture portion 211 can accommodate a plurality of LED chips 101, as shown in the seventh figure. Therefore, after the first encapsulation material A is filled in the small aperture portion 211, the first package can be used by using a doctor blade 300. Adhesive A The surface is flattened to make the surface A1 flat to enhance the homogenization of the 5 products; then, as shown in the eighth to tenth views, the stencil 20 is also removed and inverted, and placed on the substrate 100 again. Then, the second package adhesive material B is filled into the large-pore portion 212' by a point glue machine 20 〇 or other injection molding method, and then the curing and cutting process is performed to obtain the light-emitting diode package structure as shown in FIG. . 10. Referring to the method for using the stencil 30 disclosed in the third preferred embodiment of the present invention shown in FIGS. 12 to 16, the method of using the stencil 10 of the first preferred embodiment is substantially the same. The difference is that the small aperture portion 311 of the stencil 3 of the embodiment which is pre-formed as the class hole 31 can accommodate a light-emitting diode wafer 101, whereby the first encapsulant A covers only the The illuminating 10I5 - the top surface of the polar body chip 101 符合 la, meets the packaging requirements of the forward illuminating LED, and then, by the inverted method of the stencil 3 本 of the present invention, the second encapsulating material can be quickly B is filled into the large aperture portion 312, and finally, the curing diode and the cutting process are used to obtain the light emitting diode package structure as shown in Fig. 16. It is to be noted that the light-emitting diode chip 1〇1 of the embodiment has a reflection film F on at least one side of the side surface l〇1 and the bottom surface thereof to improve the light extraction rate. Please refer to the timing method of the stencil 40 disclosed in the fourth preferred embodiment of the present invention shown in FIGS. 17 to 20, which is substantially the same as the method of using the stencil 10 of the first preferred embodiment. The difference is that in this embodiment, the dispensing position and the amount of glue are controlled by the 7200947568 dispenser 200, so that the first encapsulant a filled in the small aperture portion 411 of the class hole 4i does not cover the LED wafer. The top surface 101a of the 101, that is, the height H1 of the first encapsulating material A is equal to or smaller than the height H2 of the luminous body wafer 101, whereby the first sealing material 5 is covered only by the luminous material A The side surface of the polar body chip 101 is 1 〇 lb to meet the packaging requirements of the lateral light-emitting LED, and then, by the inversion method of the stencil 40 unique to the present invention (refer to FIGS. 18 to 19), The second encapsulating material B is quickly filled into the large-aperture portion 412, and finally the curing and cutting is performed to obtain the LED package structure as shown in FIG. 20, which is further described in the embodiment. The LED chip 101 can be preliminarily on at least one of the top surface 101a and the bottom surface l〇lc A reflective film 5 is applied to the surface to increase the light extraction rate. In addition, please refer to the twenty-first figure, the class holes 11, 21, 31, 41 of the stencils (1), 20, 30, 40 can be made in addition to the one-piece I5 type. The first stencil 50 having a plurality of 大 large aperture portions 51 and the second stencil 60 having a plurality of small aperture portions 61 are integrally coupled by a fixing member such as a bolt 400 to form various class holes; Once, we can flexibly combine the stencils of different hole shapes, such as the stencil 70' shown in Figure 22, and use the 20 method of the stencil of the present invention to quickly obtain the same. The LED package structure 500 shown in FIG. 24 is intended to provide an increasing demand for LED package structures and throughput. Of course, the large and small aperture portions of the class holes of the stencil can be pre-formed into the shape of the package to be packaged, respectively, as shown in the twenty-third figure.
S 200947568 另一提的是，以上所述之第一封裝膠材A與第二封裝 膠材B亦可為相同之材質；以及，前述網板亦可僅為具有 單一階級孔者；再者，階級孔不侷限於圖面所示之二層階 級孔徑而已，亦可為具有多層階級孔徑者。 200947568 【圖式簡單說明】 第一至六圖為本發明第一較佳實施例之網板、使用方法 流程圖。 第七至十一圖為本發明第二較佳實施例之網板使用方 - 5 法流程圖。 第十二至十六圖為本發明第三較佳實施例之網板使用 φ 方法流程圖。 第十七至二十圖為本發明第四較佳實施例之網板使用 方法流程圖。 10 第二十一圖揭示網板由二具有不同孔洞之網板組裝而 成。 第二十二圖類同第二十一圖，揭示另一種階級孔之形 狀態樣。 第二十三圖揭示一體成型於網板之階級孔的形狀態 15 樣。 ® 第二十四圖為利用第二十三圖之網板所製得之發光二 極體封裝結構。 200947568 【主要元件符號說明】 10 網板 11 階級孔 111 大孔徑部 112 小孔徑部 5 20 網板 21 階級孔 211 小孔徑部 212 大孔徑部 30 網板 31 階級孔 10 311 小孔徑部 312 大孔徑部 40 網板 41 階級孔 411 小孔徑部 412 大孔徑部 50 第一網板 51 大孔徑部 15 60 第二網板 61 小孔徑部 70 網板 80 網板 100 基板 101 發光二極體晶片 101 a頂面 101b 側面 20 200 點膠機 300 刮刀 500 發光二極體封裝結構 A 第一封裝膠材 A1 表面 B 第二封裝膠材 HI 高度 H2 局度 lla材料 101c底面 400 螺栓 11S 200947568 In addition, the first encapsulating material A and the second encapsulating material B described above may also be the same material; and the stencil may only be a single-class hole; The class hole is not limited to the two-level class aperture shown in the figure, but may also be a multi-layer class aperture. 200947568 [Simple Description of the Drawings] The first to sixth figures are flowcharts of the stencil and the use method of the first preferred embodiment of the present invention. 7 to 11 are flowcharts of the method for using the stencil of the stencil according to the second preferred embodiment of the present invention. 12 to 16 are flowcharts showing the method of using the φ of the stencil according to the third preferred embodiment of the present invention. 17 to 20 are flowcharts showing a method of using a stencil according to a fourth preferred embodiment of the present invention. 10 The twenty-first figure shows that the stencil is assembled from two stencils with different holes. The twenty-second figure is similar to the twenty-first figure, revealing the state of another class hole. The twenty-third figure reveals the shape state of the class hole integrally formed in the stencil. ® Figure 24 shows a light-emitting diode package made using the stencil of Figure 23. 200947568 [Description of main component symbols] 10 stencil 11 class hole 111 large aperture portion 112 small aperture portion 5 20 stencil 21 class hole 211 small aperture portion 212 large aperture portion 30 stencil 31 class hole 10 311 small aperture portion 312 large aperture Part 40 Stencil 41 Class hole 411 Small aperture portion 412 Large aperture portion 50 First stencil 51 Large aperture portion 15 60 Second stencil 61 Small aperture portion 70 Stencil 80 Stencil 100 Substrate 101 Light-emitting diode wafer 101 a Top surface 101b Side 20 200 Dispenser 300 Scraper 500 Light-emitting diode package A First package adhesive A1 Surface B Second package adhesive HI Height H2 Locality lla Material 101c Bottom 400 Bolt 11