200947039 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種顯示元件’且特別是有關於一種單晶 石夕液晶元件（liquid crystal on silicon device, LCOS device)及 其與線路板的組裝結構。 【先前技術】 圖1是習知一種單晶石夕液晶元件與可撓性線路板（flexibie printed circuit board，FPCB)的組裝結構示意圖。請參照圖i， 習知單晶矽液晶元件1〇〇包括一矽基板11〇以及一彩色濾光基 板（color filter substrate) 120。矽基板U〇具有相對的一第一 表面112與一第二表面114，其中第一表面112上設有一線路 層116，而線路層116具有至少一焊墊（b〇ndingpad) n6a。 彩色濾光基板120與第一表面ii2相對，且局部覆蓋矽基板 110的第一表面112及線路層116，以暴露出焊墊n6a。200947039 IX. Description of the Invention: [Technical Field] The present invention relates to a display element 'and particularly relates to a liquid crystal on silicon device (LCOS device) and a circuit board thereof Assembly structure. [Prior Art] FIG. 1 is a schematic view showing an assembly structure of a single crystal silicon solar cell element and a flexible printed circuit board (FPCB). Referring to FIG. 1, a conventional single crystal germanium liquid crystal cell 1 includes a germanium substrate 11A and a color filter substrate 120. The substrate U has an opposite first surface 112 and a second surface 114. The first surface 112 is provided with a wiring layer 116, and the wiring layer 116 has at least one pad n6a. The color filter substrate 120 is opposite to the first surface ii2 and partially covers the first surface 112 of the ruthenium substrate 110 and the wiring layer 116 to expose the pad n6a.
在習知技術中，將單晶矽液晶元件1〇〇與一可撓性印刷電 路板60組裝的方法是先將一導熱膠體5〇放置於可撓性印刷電 路板60上’再將單晶矽液晶元件1〇〇放置於導熱膠體兄上， 之後再固化導熱膠體5G以使單㈣液晶元件⑽固著於可 性印刷電路板60上。接著，進行打線製程，使一焊線㈤祕 wire 7〇連接於單晶石夕液晶元件1〇〇的焊塾n6a與可撓性 ，電，板6〇的一焊墊62之間。如此，單晶石夕液晶元件ι〇〇可 透過焊線70而電性連接至可撓性印刷電路板60。 音圖圖而作於—晶K 上的單晶魏晶元件的示 ^ 2盘1 ^圖2 _部分單晶魏晶元件的示意圖。請參照 _ I晶石夕液晶元件100的製作方法是在一晶圓200 上同、作多個單晶石夕液晶元件1〇〇，之後再進行分離製程， 200947039 以分離這些單晶矽液晶元件100。 120Ϊ每一單晶雜晶元件1〇0中，由於彩色濾、光基板 且石夕基板110的第一表面112及線路層116，而 且口丨刀杉色濾光基板12〇突出於矽基板U〇外， 需分別針對彩色濾、光基板12_基板職行^ /、裂^裎’且晶圓之縣板！ 1〇侧需有切割指示線21〇。 Ο 土於上述，習知單晶石夕液晶元件的製 =裂片製程，所以較為費時。此外，在進=需製進程仃兩 谷易發生裂片不良的情形。 【發明内容】 本發明提供一種單晶石夕液晶元件，其具有容易製作的優 本發明另提供-種單晶石夕液晶元件與線路板的組裂結 構’其具有容易組裝的優點。 為達上述優點，本發明提出一種單晶矽液晶元件，其包括 一矽基板（silicon substrate )以及一對向基板（〇pp〇site ❹substrate)。矽基板具有相對的一第一表面與一第二表面，其 中第一表面設有一線路層，而矽基板更具有多個導通^ (conductivethroughhole)，從第一表面貫穿矽基板而至第二 表面對向基板與第-表面相對，且對向基板是完全覆蓋第一 表面。 在本發明之-實施例中，上述之對向基板之一第三表面的 尺寸與矽基板之第一表面的尺寸相同，且第三表面面向第一表 面0 在本發明之-實施例令，上述之對向基板為一玻璃基板或 一彩色濾光基板。 6 200947039 之—實施射，上述之單日日日麵晶元件更包括一 液曰曰層，配置於矽基板與對向基板之間。 媸ίίΓ另提出一種單晶石夕液晶元件與線路板的組裝結 括-線路板、—導電膠體以及上述之單晶石夕液晶元 電膠體是配置於線路板與單晶雜晶元件之間，且單晶 矽液Βθ元件的第二表面是連接於導電膠體。 在本發明之-實施例中，上述之線路板為一可繞性印 路板。In the prior art, the method of assembling the single crystal germanium liquid crystal element 1 to a flexible printed circuit board 60 is to first place a thermal conductive paste 5 on the flexible printed circuit board 60. The liquid crystal element 1 is placed on the thermally conductive colloid, and then the thermally conductive colloid 5G is cured to fix the single (tetra) liquid crystal element (10) to the flexible printed circuit board 60. Next, a wire bonding process is performed so that a wire (5) wire 7 is connected between the wire n6a of the single crystal solar cell element 1 and the bonding pad 62 of the flexible, electric, and plate 6 turns. Thus, the single crystal solar cell element ι can be electrically connected to the flexible printed circuit board 60 through the bonding wire 70. The schematic diagram of the single crystal WeiGe element on the crystal K is shown in Fig. 2, and the schematic diagram of the partial single crystal WeiGe element. Please refer to the method for manufacturing the crystal cell element 100. The method for fabricating the liquid crystal device 100 is to form a plurality of single crystal silicon liquid crystal elements on a wafer 200, and then perform a separation process, 200947039 to separate the single crystal germanium liquid crystal elements. 100. 120 Ϊ each of the single crystal heteromorphic elements 1 〇 0, due to the color filter, the optical substrate and the first surface 112 of the slab substrate 110 and the circuit layer 116, and the spur color filter substrate 12 〇 protrudes from the 矽 substrate U In addition, it is necessary to separately target the color filter, the optical substrate 12_substrate, the ^^, the crack ^裎' and the wafer plate! The cutting indicator line 21〇 is required on the 1〇 side. In the above, it is known that the single crystal stone liquid crystal element is manufactured by the splint process, which is relatively time consuming. In addition, in the process of entering the demand system, the situation is prone to splinter failure. SUMMARY OF THE INVENTION The present invention provides a single crystal solar cell element which is easy to fabricate. Further, the present invention provides an assembly structure of a single crystal solar cell element and a wiring board, which has an advantage of being easy to assemble. In order to achieve the above advantages, the present invention provides a single crystal germanium liquid crystal cell comprising a silicon substrate and a pair of substrates (〇pp〇site ❹substrate). The 矽 substrate has a first surface and a second surface, wherein the first surface is provided with a circuit layer, and the 矽 substrate further has a plurality of conductive through holes, the first surface penetrates the 矽 substrate to the second surface The substrate is opposed to the first surface, and the opposite substrate completely covers the first surface. In an embodiment of the invention, the size of one of the third surfaces of the opposite substrate is the same as the size of the first surface of the germanium substrate, and the third surface faces the first surface 0. In the present invention, The opposite substrate is a glass substrate or a color filter substrate. 6 200947039 - The first single day solar array element further comprises a liquid helium layer disposed between the germanium substrate and the counter substrate.媸ίίΓ further proposes a single crystal stone solar cell component and a circuit board assembly comprising - a circuit board, a conductive colloid, and the above single crystal solar cell electrocolloid is disposed between the circuit board and the single crystal heteromorphic element, And the second surface of the single crystal germanium Βθ element is connected to the conductive colloid. In the embodiment of the invention, the circuit board is a flexible printed circuit board.
，本發明之單晶魏晶元件巾，由於對向基板是完全覆蓋 石土反’且未突出树基板外，所以在分離晶®上的多個單晶 矽液晶疋件時，只需進行一次晶圓切割製程。因此，相較於習 ^技術，本發^之單晶魏晶元件具有容易製作的優點。此 外’本發明之單晶魏晶元件與祕板的組裝結射，由於單 晶石夕液晶元件的線路層是透過導通孔與導電賴而電性連接 至線路板L所以不需進行打線製程。因此，相較於f知技術， 本發明之單晶矽液晶元件與線路板的組裝結構具有容易組裝 的優點。 為讓本發明之上述和其他目的、特徵和優點能更明顯易 懂’下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖4是本發明一實施例之一種單晶矽液晶元件的示意 圖。請參照圖4，本實施例之單晶矽液晶元件3〇〇包括一矽基 板310以及一對向基板320。矽基板310具有相對的一第一& 面312與一第二表面314，其中第一表面312設有一線路層 316。矽基板310更具有多個導通孔318，這些導通孔318是 從第一表面312貫穿石夕基板310而至第二表面314。對向基板 7 200947039 320是配置於第-表φ 312，且對向基板32q《完全覆蓋第一 表面312。 承上述，對向基板320可為一玻璃基板或一彩色濾光基 -板。此外，對向基板320之一第三表面322的尺寸與矽基板 310之第一表面312的尺寸相同，且第三表面322是面向第一 表面312。換言之，對向基板32〇是完全覆蓋第一表面312及 線路層316，且未突出於矽基板31〇外。此外，單晶矽液晶元 件300可更包括一液晶層33〇，其配置於矽基板31〇與對向基 Ο 板320之間。 在本實施例之單晶石夕液晶元件300中，石夕基板31〇具有導 通孔318，且線路層316可透過導通孔318而與其他元件電性 連接。相較於習知技術，由於本實施例之單晶矽液晶元件3〇〇 不需於矽基板310的第一表面312設置焊墊，所以對向基板 320不需突出於矽基板31〇外，以暴露出焊墊。因此，在本實 施例中’對向基板320可完全覆蓋第一表面312及線路層316, 且不需突出於矽基板310外。如此，在將晶圓上的多個單晶石夕 ❹液晶元件300分離時，只需進行一次切割製程，且在晶圓上不 需切割線。相較於習知技術需進行兩次切割及裂片製程，本實 施例之單晶矽液晶元件300具有易於製作的優點。此外，由於 不需進行裂片製程，所以可避免發生裂片不良的情形，進而提 高單晶矽液晶元件300的生產良率。 圖5是本發明一實施例之單晶矽液晶元件與線路板的組 裝結構示意圖。請參照圖5 ’本實施例之單晶石夕液晶元件與線 路板的組裝結構400包括一線路板410、一導電膠體420以及 上述之單晶矽液晶元件300。導電膠體420是配置於線路板41〇 與單晶矽液晶元件300之間，且單晶矽液晶元件3〇〇的第二表 200947039 面314是連接於導電膠體42〇。此外，線路板41〇可為一可撓 性印刷電路板，但不以此為限。 在本實施例中，將單晶矽液晶元件3〇〇與線路板41〇組裝 的方法是藉由導電膠體420將單晶石夕液晶元件3〇〇目著於線路 板410。矽基板31〇的線路層316可透過導通孔318及導電膠 體420而與線路板41〇 f性連接。相較於 實 ❹ ❾ 施例不需進行打線製程，所以可提高單晶賴晶元件 的組裝結構_之絲鱗。 U裕板 綜上所述，本發明至少具有下列優點： “ 1.在本發明之單晶魏晶元件中，由於對向基板是完全 盘石夕基板’且未突出财基板外，所以在將晶圓上的多個單晶 石夕，紅件分離時，只需進行—次晶圓切割製程。因此，相較 於習知技術，本發明之單晶魏晶元件具有㈣製作的優點。 罝曰^發日明之單晶魏晶元件與線路板的組裝結構中，由於 ^曰曰^液晶7G件的線路層是透過導通孔與導電膠體而電性連 接至線路板’所以不需進行打線製程，如此可使本發明之單曰 石夕液晶兀件與線路板的组裝結構具有容易組裝的優點。日日 雖然本發明已以較佳實施例揭露如上非 本發明，所屬技術領域中具有通常知H a非用以限疋 精神和範圍内，當可作㈣====本料之 範圍當視_之巾請專·_界定者 明之保遵 【圖式簡單說明】 圖1是習知一種單晶矽液晶元件與 結構示意圖。 、撓性線路板的組裝 上的單晶石夕液晶元件的示意圖。 圖3疋圖2中刀单晶石夕液晶元件的示意圓。 9 200947039 圖4疋3本發明—實施例之—種單晶魏晶it件的示意圖。 圖5疋本I日月一實施例之單晶石夕液晶元件與路板的組 裝結構示意圖。 【主要元件符號說明】 50 :導熱膠體 60 :可撓性印刷電路板 62、116a :焊塾 70 :焊線 ❹ 、_ :單晶矽液晶元件 110、310 :矽基板 112、312 :第一表面 114、314 :第二表面 116、316 :線路層 120 :彩色濾光基板 200 .晶圓 210 :切割指示線 ©318 :導通孔 320 :對向基板 322 :第三表面 330 ·液晶層 400 :單晶石夕液晶元件與線路板的組裝纟士構 410 :線路板 u 420 :導電膠體 10In the single crystal WeiGe component of the present invention, since the opposite substrate is completely covered with the stone and does not protrude from the substrate, it is only necessary to perform the separation of the plurality of single crystal germanium liquid crystal devices on the crystal®. Wafer cutting process. Therefore, compared with the conventional technique, the single crystal Wei crystal element of the present invention has an advantage of being easy to manufacture. Further, the assembly of the single crystal WeiGe element and the secret plate of the present invention is performed, and since the wiring layer of the monocrystalline solar cell element is electrically connected to the wiring board L through the via hole and the conductive pad, the wire bonding process is not required. Therefore, the assembled structure of the single crystal germanium liquid crystal element and the wiring board of the present invention has an advantage of being easy to assemble as compared with the known technique. The above and other objects, features and advantages of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; [Embodiment] Fig. 4 is a schematic view showing a single crystal germanium liquid crystal cell according to an embodiment of the present invention. Referring to FIG. 4, the single crystal germanium liquid crystal cell 3 of the present embodiment includes a germanium substrate 310 and a pair of substrates 320. The germanium substrate 310 has a first & surface 312 and a second surface 314, wherein the first surface 312 is provided with a wiring layer 316. The germanium substrate 310 further has a plurality of vias 318 that extend from the first surface 312 through the stone substrate 310 to the second surface 314. The opposite substrate 7 200947039 320 is disposed on the first table φ 312, and the opposite substrate 32q "completely covers the first surface 312. In the above, the opposite substrate 320 can be a glass substrate or a color filter substrate. Furthermore, the size of one of the third surfaces 322 of the counter substrate 320 is the same as the size of the first surface 312 of the haptic substrate 310, and the third surface 322 is facing the first surface 312. In other words, the opposite substrate 32 完全 completely covers the first surface 312 and the wiring layer 316 and does not protrude beyond the 矽 substrate 31. Further, the single crystal germanium liquid crystal element 300 may further include a liquid crystal layer 33, which is disposed between the germanium substrate 31 and the opposite base plate 320. In the single crystal solar cell device 300 of the present embodiment, the lithium substrate 31 has a via hole 318, and the wiring layer 316 can be electrically connected to other elements through the via hole 318. Compared with the prior art, since the single crystal germanium liquid crystal element 3 of the present embodiment does not need to be provided with a solder pad on the first surface 312 of the germanium substrate 310, the opposite substrate 320 does not need to protrude beyond the germanium substrate 31. To expose the pads. Therefore, in the present embodiment, the opposite substrate 320 can completely cover the first surface 312 and the wiring layer 316 without protruding beyond the germanium substrate 310. Thus, when a plurality of single crystal silicon solar cell elements 300 on a wafer are separated, only one cutting process is required, and no cutting line is required on the wafer. The single crystal germanium liquid crystal cell 300 of the present embodiment has an advantage of being easy to manufacture, compared to the prior art which requires two cutting and splitting processes. Further, since the splicing process is not required, the occurrence of cracking failure can be avoided, and the production yield of the single crystal germanium liquid crystal element 300 can be improved. Fig. 5 is a view showing the assembly structure of a single crystal germanium liquid crystal element and a wiring board according to an embodiment of the present invention. Referring to FIG. 5, the assembled structure 400 of the single crystal solar cell element and the wiring board of the present embodiment includes a wiring board 410, a conductive paste 420, and the above-described single crystal germanium liquid crystal element 300. The conductive paste 420 is disposed between the wiring board 41A and the single crystal germanium liquid crystal element 300, and the second surface 200947039 surface 314 of the single crystal germanium liquid crystal element 3 is connected to the conductive paste 42. In addition, the circuit board 41 can be a flexible printed circuit board, but is not limited thereto. In the present embodiment, the method of assembling the single crystal germanium liquid crystal element 3A and the wiring board 41 is to expose the single crystal silicon liquid crystal element 3 to the wiring board 410 by the conductive paste 420. The wiring layer 316 of the substrate 31 is permeable to the wiring board 41 through the via 318 and the conductive paste 420. Compared with the actual ❹ ❾ embodiment, the wire bonding process is not required, so that the assembly structure of the single crystal lysate element can be improved. In view of the above, the present invention has at least the following advantages: 1. In the single crystal Wei crystal element of the present invention, since the opposite substrate is a complete disk substrate and does not protrude from the financial substrate, the crystal is In the case of a plurality of single crystals on a circle, when the red pieces are separated, only a single wafer cutting process is required. Therefore, the single crystal Wei crystal element of the present invention has the advantages of (4) fabrication compared to the prior art. ^In the assembly structure of the single crystal Weijing element and the circuit board, the circuit layer of the 7G piece of liquid crystal is electrically connected to the circuit board through the via hole and the conductive paste, so the wire bonding process is not required. Thus, the assembly structure of the monolithic liquid crystal element and the circuit board of the present invention can be easily assembled. Although the present invention has been disclosed in the preferred embodiment as above, it is not known in the art, and is generally known in the art. H a is not used to limit the spirit and scope, when it can be used as (4) ==== the scope of the material is regarded as _ 巾 巾 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Schematic diagram of a single crystal germanium liquid crystal cell and structure. Schematic diagram of a single crystal solar cell element on the assembly of a circuit board. Fig. 3 is a schematic circle of a single crystal cell element of a knife in Fig. 2. Fig. 4疋3 The present invention - an example of a single crystal Wei BRIEF DESCRIPTION OF THE DRAWINGS Fig. 5 is a schematic view showing the assembly structure of a single crystal stone solar cell element and a circuit board according to an embodiment of the present invention. [Main component symbol description] 50: Thermal adhesive colloid 60: Flexible printed circuit board 62 116a: solder fillet 70: wire bond 、, _: single crystal germanium liquid crystal element 110, 310: germanium substrate 112, 312: first surface 114, 314: second surface 116, 316: circuit layer 120: color filter substrate 200. Wafer 210: cutting indication line ©318: via hole 320: opposite substrate 322: third surface 330 • liquid crystal layer 400: assembly of single crystal silicon liquid crystal element and wiring board: gentleman structure 410: circuit board u 420 : Conductive colloid 10