TW200946254A - Cleaning method and cleaning system for electronic part - Google Patents
Cleaning method and cleaning system for electronic part Download PDFInfo
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- TW200946254A TW200946254A TW098107271A TW98107271A TW200946254A TW 200946254 A TW200946254 A TW 200946254A TW 098107271 A TW098107271 A TW 098107271A TW 98107271 A TW98107271 A TW 98107271A TW 200946254 A TW200946254 A TW 200946254A
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- cleaning
- electronic component
- fluorine
- composition liquid
- refining
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- H10P72/0416—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
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- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
Description
200946254 六、發明說明: 【發明所屬之技術領域】 種使用含氟有機清洗劑組成物液來清 洗電子組件之方法及清洗系統。 【先前技術】 J在’就使用含氟有機清洗劑組成物液(以下亦稱為 「氟系清洗液」)來清^夕晶圓、石夕晶片、印刷基板等電子 組件之裝置而έ ’係使用蒸氣脫脂清洗裝置(例如專利文獻 © 1)。 此外’已提案有-種方法,係將使用於電子組件的清 ’先之在m洗裝置内已污染的氟系清洗液投人至另外設置的 再生裝置予以再生’而再:欠使用於電子組件的清洗(例如專 利文獻2)。 專利文獻1 :美國專利第3881949號 專利文獻2 :日本特開2001-129302號公報 ❿ 【發明内容】 (發明所欲解決之課題) 近年來’由於電子組件中的元件與配線等的高密度 $ ’以住所容許之在元件與配線的圖案形成所產生的殘渣 里亦逐漸變得無法容許,且元件與配線的間距間隔亦逐漸 變乍,因此要求氟系清洗液的高純度化。 另一方面’在以往的蒸氣脫脂清洗裝置中,污垢成分 =積於清洗裝置内’隨著時_經過,清洗裝置内的氟系 /月洗液的清洗能力會降低,故必須頻繁地更換未使用的氟 3 321090 200946254 系清洗液或再生的it系清洗液。 然而,由於未使用的氟系清洗液通常係收容於容器, 並由製造商運送至使用現場,因此容器内的微量污垢成分 很可能會混入氟系清洗液中,而且在將該容器開封以將氟 系清洗液投入清洗裝置内時,氟系清洗液接觸外部環境而 使外部環境中的污垢成分混入氟系清洗液中的可能性很 高,因此即使是未使用的氟系清洗液亦未必一定是以所要 求的高純度來使用。 此外,在再生的氟系清洗液的情形時,由於在再生後 的氟系清洗液從再生裝置收容至容器並予以搬運的期間, 以及在將容器開封並將氟系清洗液投入至清洗裝置内的期 間,亦與前述相同地氟系清洗液會被污染,因此再生的氟 系清洗液未必以所要求的高純度來使用。 因此,為了清洗傾向於更高密度化與小型化的電子組 件,係期望使用更高純度的氟系清洗液。 (解決課題的手段) 本發明乃有鑑於上述課題而研創者,其目的係提供一 種能以高純度使用氟系清洗液之電子組件之清洗方法以及 使用該清洗方法之清洗系統。 亦即,本發明係提供一種清洗方法,係包含有:精製 步驟,係藉由精製裝置精製未使用之含氟有機清洗劑組成 物液;以及清洗步驟,係使用從前述精製裝置供給至清洗 裝置内之精製後的清洗劑組成物液來清洗電子組件;在前 述精製步驟中,至少進行藉由精餾裝置所進行之有機性污 321090 200946254 染物的去除、以及藉由過濾裝置所進行之固體污染物的去 ' 除,以精製前述清洗劑組成物液,並使用如上方式精製的 清洗劑組成物液來清洗電子組件。 此外,依據本發明的另一觀點,本發明係提供一種電 子組件之清洗系統,係藉由前述清洗方法來清洗電子組 件,該清洗系統係具備有:精製裝置,係去除未使用的含 氟有機清洗劑組成物液所含有的污染物而予以精製;以及 清洗裝置,係使用由該精製裝置所精製的前述清洗劑組成 ® 物液來清洗電子組件;前述精製裝置係至少具備有用以去 除有機性污染物之精餾裝置、以及用以去除固體污染物之 過濾裝置,並構成為於前述精餾裝置以及前述過濾裝置流 通前述清洗劑組成物液並予以精製。 (發明之效果) 依據本發明,能將含氟有機清洗劑組成物液(氟系清洗 液)的製造商所運輸來的未使用之氟系清洗液從該容器投 Φ 入至精製裝置,並以精製裝置去除未使用的氟系清洗液中 的污垢成分以精製該清洗液。 因此,在製造商端,由於在附著有微量的污垢成分的 容器内填充氟系清洗液,因此即使於氟系清洗液中混入污 垢成分,亦能以精製裝置去除氟系清洗液中的污垢成分而 予以精製,因此能在使所精製的高純度氟系清洗液不會接 觸外部環境之情形下供給至清洗裝置以清洗電子組件。換 言之,依據本發明,可防止起因於未使用的氟系清洗液之 電子組件的品質降低。 5 321090 200946254 因此,本發明係能對應矽晶圓、陶瓷晶圓、切斷前述 矽晶圓所得之矽晶片、切斷前述陶瓷晶圓所得之陶瓷晶 片、玻璃基板、金屬基板、彩色濾光片基板、印刷基板、 以及使用該等之電子組件等電子組件的進一步的高密度化 與小型化。 此外,可恆常地以高純度之經過清淨化的氟系清洗液 來清洗電子組件,而能確保穩定的清洗品質。 【實施方式】 本發明的電子組件的清洗方法係包含有:精製步驟, 係藉由精製裝置精製未使用之含氟有機清洗劑組成物液; 以及清洗步驟,係使用從前述精製裝置供給至清洗裝置内 之精製後的清洗劑組成物液來清洗電子組件;在前述精製 步驟中,至少進行藉由精餾裝置所進行之有機性污染物的 去除、以及藉由過濾裝置所進行之固體污染物的去除,並 任意地進行藉由水清洗裝置所進行的水溶性污染物的去 除。 在前述精製步驟中,去除有機性污染物、水溶性污染 物、固體污染物之順序雖為任意,但從有效地去除各種污 染物的觀點而言,較佳為以有機性污染物、水溶性污染物、 固體污染物的順序,或者以水溶性污染物、有機性污染物、 固體污染物的順序予以去除,以精製清洗劑組成物液。 此清洗方法雖未限定被清洗物,但可應用於清洗要求 以高純度的氟系清洗液所進行的高清淨化之矽晶圓、陶瓷 晶圓、切斷前述矽晶圓所得之矽晶片、切斷前述陶瓷晶圓 6 321090 200946254 .所得之陶瓷晶片、破璃基板、金屬基板、彩色濾光月基板、 印刷基板、以及使用該等之電子組件等電子組件。200946254 VI. Description of the Invention: [Technical Field of the Invention] A method and a cleaning system for cleaning an electronic component using a fluorine-containing organic cleaning composition liquid. [Prior Art] J is a device that uses a fluorine-containing organic cleaning agent composition liquid (hereinafter also referred to as "fluorine-based cleaning liquid") to clean electronic components such as wafers, stone substrates, and printed boards. A vapor degreasing cleaning device is used (for example, Patent Document 1). In addition, 'there is a method that has been proposed for the cleaning of electronic components. First, the contaminated fluorine-based cleaning solution in the m-washing device is thrown into another regenerative device for regeneration." Cleaning of components (for example, Patent Document 2). [Patent Document 1] US Patent No. 388 1949 Patent Document 2: JP-A-2001-129302 ❿ SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] In recent years, "high density" due to components and wiring in electronic components The residue generated by the formation of the pattern of the element and the wiring which is allowed by the residence is gradually unacceptable, and the interval between the element and the wiring is gradually reduced. Therefore, the purity of the fluorine-based cleaning liquid is required to be high. On the other hand, in the conventional steam degreasing and cleaning device, the dirt component = accumulated in the cleaning device, the cleaning ability of the fluorine-based/monthly washing liquid in the cleaning device is lowered as time passes, so it is necessary to frequently replace the Fluorine 3 321090 200946254 used is a cleaning solution or a regenerated I-based cleaning solution. However, since the unused fluorine-based cleaning liquid is usually stored in a container and transported to the use site by the manufacturer, a trace amount of the dirt component in the container is likely to be mixed into the fluorine-based cleaning liquid, and the container is opened to be opened. When the fluorine-based cleaning liquid is introduced into the cleaning device, the fluorine-based cleaning liquid is likely to be in contact with the external environment, and the dirt component in the external environment is likely to be mixed into the fluorine-based cleaning liquid. Therefore, even the unused fluorine-based cleaning liquid does not necessarily have to be fixed. It is used in the required high purity. In the case of the regenerated fluorine-based cleaning liquid, the fluorine-based cleaning liquid after the regeneration is stored in the container from the regeneration device and transported, and the container is opened and the fluorine-based cleaning liquid is introduced into the cleaning device. In the same period as described above, the fluorine-based cleaning liquid is contaminated, so that the regenerated fluorine-based cleaning liquid is not necessarily used in the required high purity. Therefore, in order to clean an electronic component which tends to be higher in density and miniaturization, it is desirable to use a fluorine-based cleaning liquid of higher purity. (Means for Solving the Problems) The present invention has been made in view of the above problems, and an object thereof is to provide a cleaning method for an electronic component capable of using a fluorine-based cleaning liquid with high purity and a cleaning system using the cleaning method. That is, the present invention provides a cleaning method comprising: a refining step of purifying an unused fluorine-containing organic detergent composition liquid by a refining device; and a washing step of supplying the cleaning device from the refining device to the cleaning device The purified cleaning agent composition liquid is used to clean the electronic component; in the above-mentioned refining step, at least the organic matter 321090 200946254 dye removal by the rectification device and the solid contamination by the filtering device are performed. The material is removed to purify the above-mentioned cleaning agent composition liquid, and the cleaning agent composition liquid refined as above is used to clean the electronic component. In addition, according to another aspect of the present invention, the present invention provides a cleaning system for an electronic component, which is characterized in that the cleaning system is provided with a refining device for removing unused fluorine-containing organic compounds. The cleaning agent is refined by the contaminants contained in the composition liquid; and the cleaning device cleans the electronic components by using the cleaning agent composition liquid purified by the refining device; the refining device is at least useful for removing organic matter The rectification device for contaminants and the filtration device for removing solid contaminants are configured to circulate and purify the cleaning agent composition liquid in the rectification device and the filtration device. (Effect of the Invention) According to the present invention, an unused fluorine-based cleaning liquid transported by a manufacturer of a fluorine-containing organic cleaning composition liquid (fluorine-based cleaning liquid) can be injected into the refining device from the container. The cleaning component is purified by removing the dirt component in the unused fluorine-based cleaning liquid by a refining device. Therefore, at the manufacturer's end, since the fluorine-based cleaning liquid is filled in the container to which a small amount of the dirt component is adhered, the dirt component in the fluorine-based cleaning liquid can be removed by the refining device even if the fluorine-based cleaning liquid is mixed with the dirt component. Further, since it is purified, it is possible to supply the purified high-purity fluorine-based cleaning liquid to the cleaning device without cleaning the external environment to clean the electronic component. In other words, according to the present invention, it is possible to prevent deterioration in quality of an electronic component caused by an unused fluorine-based cleaning liquid. 5 321090 200946254 Therefore, the present invention is capable of corresponding to a silicon wafer, a ceramic wafer, a tantalum wafer obtained by cutting the tantalum wafer, and a ceramic wafer, a glass substrate, a metal substrate, and a color filter obtained by cutting the ceramic wafer. The substrate, the printed circuit board, and electronic components using such electronic components are further increased in density and miniaturization. In addition, the electronic components can be cleaned constantly with a high-purity purified fluorine-based cleaning solution to ensure stable cleaning quality. [Embodiment] The method for cleaning an electronic component according to the present invention includes: a purification step of purifying an unused fluorine-containing organic detergent composition liquid by a refining device; and a washing step of supplying the cleaning from the refining device to the cleaning a purified cleaning agent composition liquid in the apparatus to clean the electronic component; in the refining step, at least the removal of the organic contaminant by the rectification apparatus and the solid contaminant by the filtering device Removal, and arbitrarily removing the water-soluble contaminants by the water cleaning device. In the above-mentioned refining step, the order of removing organic contaminants, water-soluble contaminants, and solid contaminants is arbitrary, but from the viewpoint of effectively removing various contaminants, it is preferable to use organic contaminants and water-soluble. The order of contaminants and solid contaminants is removed in the order of water-soluble contaminants, organic contaminants, and solid contaminants to refine the detergent composition liquid. Although the cleaning method does not limit the object to be cleaned, it can be applied to cleaning a wafer, a ceramic wafer, and a wafer obtained by cutting a high-purity fluorine-based cleaning liquid, and cutting the wafer. The ceramic wafer 6321090 200946254 is obtained. The obtained ceramic wafer, the glass substrate, the metal substrate, the color filter substrate, the printed substrate, and electronic components using the electronic components.
該清洗方法亦能作為其他的被清洗物的清洗方法來使 用’例如亦此作為液晶單元、PDP(plasma display panel ; 電漿顯示器)面板、壓膜(stamper)、塑模、磁頭、VCM (voice-coil motor ;聲圈馬達)、MS(Hea(i StackThe cleaning method can also be used as a cleaning method for other objects to be cleaned, for example, as a liquid crystal cell, a PDP (plasma display panel), a stamper, a mold, a magnetic head, a VCM (voice). -coil motor; voice coil motor), MS (Hea(i Stack)
Assembly;磁頭堆疊組合)、以及卡匣等的清洗方法來使用。 在本發明中,就氟系清洗液而言,亦能使用適用於電 子組件的清洗之清洗液。 就含氟有機清洗劑組成物液而言,係能例舉分子量未 滿1000且骨架中含有碳原子與氟原子,在室溫中為液狀且 具有揮發性之氟化合物。該氟化合物雖未特別限定,但從 止地球暖化的觀點來看’為了縮短在大氣中的壽命,較 佳為復含有氫原子。此外,亦可含有氧原子、硫原子、以 及氮原子等。碳骨架係可為直鏈(linear)狀、分枝鏈狀、 ❹或環狀中的任一者,亦可具有雙鍵或三鍵。 就具有此種特性的氟系清洗液而言,係能例舉九氟丁 基曱基醚、1,1,1,2, 2, 3, 4, 5, 5, 5-十氟丙燒、1, 2, 2, 2-四 氟乙基-2, 2, 2-三氟甲基醚、1,1,1,3, 3-五氟丁烷、l l 2, 2, 3, 3, 4-七氟環戊烷、二氯五氟丙烷等,其中,較佳為 1,1,1’ 2, 2, 3, 4,5,5,5 h 氣丙烧。 此外,在本發明中,氟系清洗液亦可為一種或兩種以 上的氟系清洗液的混合液。 此外,亦可為氟系清洗液與其他有機溶劑的一種或兩 321090 7 200946254 種以上的混合液。就有機溶劑而言,係能例舉例如2 —两醇、 乙醇等_、_等輔、二㈣等賴、醋酸等' 類、乙酸乙醋等酉旨類、-蕕产庙-备T总 次 .★ a頰一虱乙烯、一氯五氟丙烷等鹵化烴 類等。 二 有時會有因應電子組件和污垢的種類而將氣系清洗 與水溶性有機溶劑(例如醇類)的混合物(㈣混合物) 清洗液來使肖。在此情形巾,前述精製步難*包含 性污染物的去除步驟。 办 此外’备I系清洗液為具有共沸組成之混合物時 佳為以共沸組合的混合比。 ^ 接者’說日洗方法清洗電子組件之本發明的清 此清洗系關具備有:精難置,縣除未使用的含 鼠有機清洗劑組成物液所含有的污㈣並予以精製;以及 =洗裝置’係使用由該精製裝置所精製的前述清洗劑組成 物液來清洗電子組件;前述精製裝置係至少具財用 t有機性污染物之精㈣置、及用以去除固體污染物之過 濾裝置;於前述精難置及前述㈣裝置流通前述清洗劑 tf勿液並予以精製;復具備有用以去除水溶性污染物之 水>月洗裝置、以及用以去除水分之水分去除裝置。 =前述精製裝置中,精㈣置、水清洗裝置、水分去 3置、軸裝置的配置順序雖為任意,但如前述從有效 ,各污染物的觀點來看’精製裝置較佳為以精顧裝 /月洗裝置、7jC分去除裝置、以及過遽|置的順序, 321090 8 200946254 或者是以水清洗裝置、水分去除裝置、精餾裝置、以及過 4 濾裝置的順序流通前述清洗劑組成物液並予以精製。 (清洗裝置的說明) 在本發明中,前述清洗裝置只要構成為收容用以去除 附著於電子組件的污垢之氟系清洗液,且在清洗裝置内清 洗電子組件即可,並無特別限定。 就清洗裝置的構成而言,係能例舉例如具備有:洗滌 槽,係被供給有由精製裝置所精製的氟系清洗液;清洗槽, ^ 係收容從該洗滌槽溢出的氟系清洗液;蒸氣滯留部,係滯 留有在該清洗槽内經加熱而氣化的氟系清洗液的蒸氣;以 及蒸氣凝結部,係使該蒸氣滯留部的蒸氣凝結並回流至前 述洗滌槽;並且將電子組件浸潰於前述清洗槽内的氟系清 洗液中予以清洗,並將清洗後的電子組件浸潰於前述洗滌 槽内的氟系清洗液中予以洗滌,再以蒸氣滯留部的前述蒸 氣將洗滌後的電子組件予以蒸氣清洗。 ❿ 具體而言,係能使用例如日本特開平8-243515號公報 或曰本特開平10-192797號公報等記載的公知多槽式清洗 裝置。 此外,清洗裝置亦可構成為復具備有淋浴喷嘴,從前 述淋浴喷嘴喷出由精製裝置所精製的氟系清洗液,並將前 述蒸氣清洗後的電子組件予以淋浴清洗。 依據此構成,能進一步提高藉由本發明的清洗系統之 電子組件的清淨度。 (精製裝置的說明) 321090 200946254 未使=!?精製裝置係為因應污垢的種類將混入於 未使用的m洗液中的污垢成分予以去除之裳置,如上 ^述至y具備有心去除有機性污染物之精 二=固體污染物之過遽裝置,並且亦可具備有用以去 ^浴性污染物之水清洗裝置、心去除水分之水分去除 ^置、以及用时轉子性污染物之料性污染物去除裝 置0 在本發明中’就污染物的種類而言,係能例舉前述有 ,性'染物、水溶性污染物、離子性污染物、以及固體污 染物:就此等各種污染物而言,具體而言可例舉下述者。 就有機性污染物而言,可例舉說油(例如(註冊 商標))、氟聚合物等。 就水溶性污染物而言,可例舉異丙醇(iSOPr〇Pyl alcohol)、乙醇等醇類、丙酮等酮類等。 就離子性污染物而言,可例舉氟離子、罐酸離子、碳 酸氩離子、銨離子、鈉離子等離子類。 a就,體污染物而言,可例舉塑膠或彈性體(elastomer) 等有機同刀子化合物粒子 '金屬粒子、以及粉塵等。 ^以下,說明精製裝置的具體構成。此外,精製裝置當 然亦可具有用以去除前述以外的性質的污染物之裝置。 <精餾裝置> 、就精顧裝置而言,係能夠成為藉由利用氟系清洗液的 ’弗,與有機性污染物的沸點之差(以下稱為「沸點差」)的 熱父換作用’去除未使用的㈣清洗液巾所含有的有機性 10 321090 200946254 污染物。 例如,在沸點差較小的情形時,氟系清洗液與 污染物的分離係需要複數次的熱交換作用,並選裸具有言 度的回流功能之精餾裝置,而在沸點差較大的情形^ ^ 選擇亭祭德農置或以不會使氟系清洗液彿騰之方次進/力' 溫的加溫裝置。 © Ο 如此,精餾裝置係因應氟系清洗液與有機性污^物的 沸點差或電子組件所需的清淨度適當地選擇最佳的事'置。 此外’在精餾裝置(例如蒸餾裝置)與清洗骏置二體化 的情形時,精製裝置係能省略精餾裝置。 <水清洗裝置> 由於使氟系清洗液接觸水並將水溶性污染物溶入水中 即可有效地進行氟系清洗液中所含有的水溶性污染物的去 除,因此水接觸裝置係適合作為水清洗裝置。雖然接觸方 法並未特別限定,但考慮到簡便性及操作性,較佳為向流 型接觸方法0 又° /瓜 就此種水接觸裝置而言,可例舉例如於上游端具有清 洗液流人Π及水排出口且下游端具有清洗㈣^口^水流 入口之筒體的内部配置複數個區隔板或填 提高在内部流通路徑的氣系清洗液與水的接觸=觸 裝置。此種構成的水接觸裝置較佳 =觸 於下部配置下游端,從上方朝士 丨配置上游私 方朝上方流動的水流中。 枝_清洗液流入從下 此外’由於藉此使氟系清 与,先液與水接觸,藉此使微量 321090 11 200946254 :==系清洗液中’因此於水接觸裝置的下游側併 认用以去除氟錢洗液中的水分之前述水分去除裝置。 外’如麵述m㈣氣系清歧 :=之混合物所構成的情形時,精製裝置係省略水清= 裝置與水分去除裝置。 <水分去除裝置> 就水分去除裝置而言,係可例舉例如於上游端 洗,口且下游端具有清洗液排出口之筒體的内部填: ❹ 二性的粒狀吸收材料而構成的水分 tti 在水溶性污染物亦具有離子性的情形時, 藉月U述水接觸裝置與水分去除震置所進行的水溶 物的去除亦兼具離子性污染物的去除。 木 =外’由於吸濕材料的水分吸附量有所極限,因此水 分β置亦可具備用以將吸附於吸濕材料 外部的水分排出手段。 ·Ν刀排出至 〇 就水分排出手段而言,絲❹下述構成者:具備有 例如.空氣流人σ與空氣排出σ,係形成於水分去 的上游端與下游端;帶狀加熱器(bandhe伽),係捲繞於 用:將減吹人至空氣流人口之熱風供給裝置、或用以將 室/皿空乳吹入至空氣流入口之送風機及筒體,並加埶内 D藉由使經過加熱的空氣流通於筒體,而使吸濕㈣乾 =外’水分去除裝置較佳為排列設置兩個以上。如此, 由;b在個水刀去除裝置的吸濕材料乾燥_時以另—個 321090 12 200946254 水分去除裝置進行氟系清洗液中的水分去除,因此能提高 精製裝置所進行的氟系清洗液的清淨化效率。 此外,以透明窗構成筒體的周圍壁的一部分,且將以 藍色矽膠為代表的飽和指示材料與吸濕材料預先混合,藉 此能藉由飽和指示材料的顏色目視吸濕材料的吸濕程度 (乾燥程度)。或者,亦可於水分去除裝置的下游測設置水 分測量裝置,以水分測量裝置測量有助於乾燥的空氣中的 水分率,藉此調查吸濕材料的乾燥程度。 ® 此外,為了提升以吸濕材料進行的水分去除效率,利 用氟系清洗液的比重與溶解於氟系清洗液中的水分的比重 之差將氟系清洗液與水予以分離之水分離器,亦可設置於 水接觸裝置與水分去除裝置間。 <離子性污染物去除裝置> 就離子性污染物去除裝置而言,係可例舉例如於上游 端具有清洗液流入口且下游端具有清洗液排出口的筒體内 © 部填充氧化銘凝膠(alumina gel)而構成的離子性污染物 去除裝置。 <過濾裝置> 就用以去除固體污染物之過濾裝置而言,係能例舉於 用以使氟系清洗液通過之筒體内設置精密過濾膜或超過濾 膜等過濾裝置。在此情形中,以過濾裝置所去除的固體污 染物係藉由濾心的交換而從筒體内排出至外部。此外,亦 可組合複數個相同的過濾膜或不同的過濾膜來使用。 以有效地去除前述各種污染物的觀點來看,本清洗系 13 321090 200946254 統中的精製裝置較佳為以從上游朝向下游,以精餾裝置、 水清洗裝置、水分去除裝置、以及過濾裝置的順序、或者 以水清洗裝置、水分去除裝置、精餾裝置、以及過濾裝置 的順序以配管連續性地連接各裝置。此外,在精製裝置具 有離子性污染物去除裝置的情形時,只要在水清洗裝置與 水分去除裝置之間以外,離子性污染物去除裝置的設置位 置並未限定。 <其他構成> 本清洗系統亦可構成為,復具備有:再生裝置,係將 ^ 在清洗裝置内用於電子組件的清洗之使用完畢的氟系清洗 液予以再生;再生裝置係藉由循環配管與清洗裝置連接, 使用完畢的氟系清洗液係從清洗裝置輸送至再生裝置予以 再生,所再生的氟系清洗液係從再生裝置循環供給至清洗 裝置。 如此,藉由將再生裝置一體性地組入於清洗系統,能 將使用完畢的髒污氟系清洗液從清洗裝置通過循環配管移 ❹ 送至再生裝置,將經過再生處理的氟系清洗液從再生裝置 通過循環配管移送至清洗裝置。結果,能容易且短時間地 進行氟系清洗液的移送,且可在使經過再生處理的氟系清 洗液不會與外部環境接觸之情形下移送至清洗裝置,因此 能避免污染物從外部混入至清洗液中。 在本發明中,再生裝置只要為能去除使用完畢的氟系 清洗液中所含有的各種污染物即可,較佳為能再生成與使 用前的純度相同高純度的氟系清洗液。 14 321090 200946254 例如,在使用完畢的氣系清洗液中含有有機性污染Assembly; head stacking combination), and cleaning methods such as cassettes are used. In the present invention, as the fluorine-based cleaning liquid, a cleaning liquid suitable for cleaning of an electronic component can also be used. The fluorine-containing organic detergent composition liquid is exemplified by a fluorine compound having a molecular weight of less than 1,000 and having a carbon atom and a fluorine atom in the skeleton, and being liquid at room temperature and having a volatility. The fluorine compound is not particularly limited, but from the viewpoint of global warming, it is preferable to further contain a hydrogen atom in order to shorten the life in the atmosphere. Further, it may contain an oxygen atom, a sulfur atom, a nitrogen atom or the like. The carbon skeleton may be any of a linear shape, a branched chain shape, a ruthenium or a cyclic shape, and may have a double bond or a triple bond. The fluorine-based cleaning liquid having such characteristics can be exemplified by nonafluorobutyl decyl ether, 1,1,1,2, 2, 3, 4, 5, 5, 5-trifluoropropane, 1, 2, 2, 2-tetrafluoroethyl-2, 2, 2-trifluoromethyl ether, 1,1,1,3,3-pentafluorobutane, ll 2, 2, 3, 3, 4 - heptafluorocyclopentane, dichloropentafluoropropane, etc., among which 1,1,1' 2, 2, 3, 4, 5, 5, 5 h gas-propylene is preferred. Further, in the present invention, the fluorine-based cleaning liquid may be a mixture of one or more fluorine-based cleaning liquids. Further, it may be a mixture of a fluorine-based cleaning solution and another organic solvent, or a mixture of two or more 321090 7 200946254 or more. Examples of the organic solvent include, for example, 2-diethanol, ethanol, etc., _, _, etc., bis(tetra), etc., acetic acid, etc., acetic acid, vinegar, etc., Times. ★ a cheek, such as halogenated hydrocarbons such as ethylene and chloropentafluoropropane. 2. In some cases, a mixture of a gas-based cleaning solution and a water-soluble organic solvent (for example, an alcohol) ((4) mixture) may be used in response to the type of electronic components and dirt. In this case, the aforementioned refining step is difficult* to remove the contaminant. In addition, when the preparation liquid of the preparation I system is a mixture having an azeotropic composition, it is preferable to use a mixture ratio of azeotropic combination. ^ Receiver's said that the daily cleaning method cleans the electronic components of the present invention. The cleaning system is equipped with: fine hard-working, the county contains the dirt (4) contained in the composition of the mouse-free organic cleaning agent, and is refined; The "washing device" uses the aforementioned cleaning agent composition liquid purified by the refining device to clean the electronic component; the refining device is at least used for the purification of solid contaminants and for removing solid contaminants. a filtering device; and the above-mentioned (4) device is configured to circulate the cleaning agent tf and to refine the liquid; the water is provided to remove water-soluble contaminants; the monthly washing device and the moisture removing device for removing moisture. = In the refining device, the arrangement order of the fine (four), the water washing device, the moisture removal, and the shaft device is arbitrary. However, as described above, it is effective to treat the refining device. The order of the loading/month washing device, the 7jC removing device, and the passing device, 321090 8 200946254 or the flow of the cleaning agent composition in the order of the water washing device, the moisture removing device, the rectifying device, and the passing filter device The liquid is refined. (Description of the cleaning device) The cleaning device is not particularly limited as long as it is configured to house a fluorine-based cleaning liquid for removing dirt adhering to the electronic component and to clean the electronic component in the cleaning device. In the configuration of the cleaning device, for example, a washing tank is provided, and a fluorine-based cleaning liquid purified by a refining device is supplied, and a cleaning tank is provided to contain a fluorine-based cleaning liquid overflowing from the washing tank. The vapor retention portion is a vapor in which a fluorine-based cleaning liquid heated and vaporized in the cleaning tank is retained, and a vapor condensation portion that condenses and recirculates the vapor in the vapor retention portion to the washing tub; The module is immersed in the fluorine-based cleaning liquid in the cleaning tank, and the cleaned electronic component is immersed in the fluorine-based cleaning liquid in the washing tank to be washed, and then washed by the vapor in the vapor retention portion. The subsequent electronic components are steam cleaned. Specifically, a known multi-tank cleaning device described in, for example, Japanese Laid-Open Patent Publication No. Hei 8-243515 or Japanese Patent Application Laid-Open No. Hei No. 10-192797. Further, the cleaning device may be configured to include a shower nozzle, and a fluorine-based cleaning liquid purified by the refining device is ejected from the shower nozzle, and the electronic component after the steam cleaning is shower-cleaned. According to this configuration, the cleanliness of the electronic component of the cleaning system of the present invention can be further improved. (Description of the refining device) 321090 200946254 The refining device is a device that removes the dirt components mixed in the unused m washing solution according to the type of the dirt. Concentrate of contaminants = a device for the removal of solid contaminants, and may also have a water cleaning device for removing bathing contaminants, a moisture removal device for removing moisture from the heart, and a material contamination of the rotor contaminants during use. In the present invention, in terms of the kind of the contaminant, the foregoing can be exemplified by the 'stain', the water-soluble contaminant, the ionic contaminant, and the solid contaminant: in terms of various contaminants Specifically, the following may be mentioned. As the organic pollutant, an oil (e.g., (registered trademark)), a fluoropolymer, or the like can be exemplified. The water-soluble contaminant may, for example, be isopropyl alcohol (iSOPr〇Pyl alcohol), an alcohol such as ethanol, or a ketone such as acetone. The ionic contaminant may, for example, be a fluoride ion, a can acid ion, an argon carbonate ion, an ammonium ion or a sodium ion. In the case of the body contaminant, an organic or knife compound particle such as a plastic or an elastomer (metal particles, and dust) may be mentioned. ^ Hereinafter, the specific configuration of the refining device will be described. Further, the refining device may of course have means for removing contaminants of properties other than the foregoing. <Rectification device> It is a hot parent who can use the difference between the boiling point of the fluorine-based cleaning liquid and the boiling point of the organic pollutant (hereinafter referred to as "boiling point difference") Replacement 'Removal of organic (10) 200946254 contaminants contained in unused (four) cleaning wipes. For example, in the case where the difference in boiling point is small, the separation of the fluorine-based cleaning liquid and the contaminant requires a plurality of heat exchange effects, and a rectifying device having a reversible function of reversing is selected, and the boiling point difference is large. Situation ^ ^ Select the pavilion to set up the De Nong set or the heating device that will not make the fluorine-based cleaning solution Fo Teng's side into the force. © 如此 In this case, the rectification unit selects the optimum one based on the difference in boiling point between the fluorine-based cleaning solution and the organic contaminant or the required cleanness of the electronic component. Further, in the case where the rectification apparatus (e.g., distillation apparatus) and the cleaning apparatus are dimerized, the refining apparatus can omit the rectification apparatus. <Water cleaning device> Since the fluorine-based cleaning liquid is brought into contact with water and the water-soluble contaminant is dissolved in water, the water-soluble contaminant contained in the fluorine-based cleaning liquid can be effectively removed, so that the water contact device is suitable As a water cleaning device. Although the contact method is not particularly limited, in view of simplicity and operability, it is preferred that the flow contact method 0 and the water contact device have a cleaning liquid flow, for example, at the upstream end. Π and the water discharge port and the downstream end of the cylinder having the cleaning (4) ^ water flow inlet is provided with a plurality of partitions or filling the contact between the gas cleaning liquid and the water in the internal circulation path = contact device. Preferably, the water contact means of this configuration is placed in contact with the downstream end of the lower portion, and is disposed from the upper side toward the flow of water flowing upwardly from the upstream. The branch_cleaning liquid flows in from below, and the first liquid is brought into contact with water, whereby the trace amount is 321090 11 200946254 :== in the cleaning liquid, so it is recognized on the downstream side of the water contact device. The aforementioned moisture removing device for removing moisture in the fluorine money washing liquid. In the case where the mixture of the m (four) gas system is not the same as the above, the refining device omits the water clearing device and the moisture removing device. <Moisture Removal Device> The water removal device may be, for example, a container in which the upstream end is washed, and the inside of the cylinder having the cleaning liquid discharge port at the downstream end is filled with: ❹ a granular absorbent material. Moisture tti In the case where the water-soluble contaminant is also ionic, the removal of the water-soluble matter by the water contact device and the moisture removal device also removes the ionic contaminant. Wood = outer' Since the amount of moisture adsorbed by the moisture absorbing material is limited, the moisture β may also have a means for discharging moisture adsorbed to the outside of the moisture absorbing material. - The squeegee is discharged to the sputum, and the sputum is composed of, for example, an air flow person σ and an air discharge σ, which are formed at the upstream end and the downstream end of the moisture; the strip heater ( Bandhe gamma), used for winding: a hot air supply device that blows the person to the air stream population, or a blower and a cylinder for blowing the chamber/empty air into the air inlet, and adding It is preferable to arrange two or more moisture absorbing (four) dry = outer moisture removing means by circulating the heated air to the cylindrical body. In this way, when the moisture absorbing material of the water jet removing device is dried, the water in the fluorine-based cleaning liquid is removed by another 321090 12 200946254 moisture removing device, so that the fluorine-based cleaning liquid by the refining device can be improved. Clear purification efficiency. Further, a portion of the surrounding wall of the cylindrical body is formed by a transparent window, and a saturated indicating material typified by blue silicone is preliminarily mixed with the moisture absorbing material, whereby the moisture absorption of the moisture absorbing material can be visually observed by the color of the saturated indicating material. Degree (dryness). Alternatively, a moisture measuring device may be provided downstream of the moisture removing device, and the moisture measuring device may measure the moisture content in the air which is conducive to drying, thereby investigating the degree of drying of the moisture absorbing material. In addition, in order to improve the water removal efficiency by the moisture absorbing material, the water separator that separates the fluorine-based cleaning liquid from the water by the difference between the specific gravity of the fluorine-based cleaning liquid and the specific gravity of the water dissolved in the fluorine-based cleaning liquid is used. It can also be placed between the water contact device and the moisture removal device. <Ionic Contaminant Removal Device> The ionic contaminant removal device may, for example, be filled with a cleaning liquid inflow port at the upstream end and a cleaning liquid discharge port at the downstream end. An ionic contaminant removal device constructed of an alumina gel. <Filtering device> The filtering device for removing solid contaminants can be exemplified by a filtering device such as a microfiltration membrane or an ultrafiltration membrane for allowing a fluorine-based cleaning liquid to pass through. In this case, the solid contaminants removed by the filtering means are discharged from the cylinder to the outside by exchange of the filter core. Further, a plurality of the same filter membranes or different filter membranes may be combined for use. The refining device in the cleaning system 13 321090 200946254 is preferably from upstream to downstream, with a rectification device, a water cleaning device, a moisture removing device, and a filtering device, from the viewpoint of effectively removing the aforementioned various contaminants. The devices are continuously connected in a sequence or in the order of a water washing device, a water removing device, a rectifying device, and a filtering device. Further, in the case where the refining device has the ionic contaminant removing device, the setting position of the ionic contaminant removing device is not limited as long as it is between the water washing device and the moisture removing device. <Other Configurations> The cleaning system may be configured to regenerate a fluorine-based cleaning liquid for cleaning the electronic components in the cleaning device, and to regenerate the device. The circulation piping is connected to the cleaning device, and the used fluorine-based cleaning liquid is sent from the cleaning device to the regeneration device for regeneration, and the regenerated fluorine-based cleaning liquid is circulated and supplied from the regeneration device to the cleaning device. By integrating the regenerating device into the cleaning system as a whole, the used dirty fluorine-based cleaning liquid can be transferred from the cleaning device to the regenerating device through the circulation pipe, and the regenerated fluorine-based cleaning solution can be removed from the cleaning device. The regeneration device is transferred to the cleaning device through a circulation pipe. As a result, the fluorine-based cleaning liquid can be easily and quickly transferred, and the fluorine-based cleaning liquid subjected to the regeneration treatment can be transferred to the cleaning device without being in contact with the external environment, thereby preventing contamination from being mixed from the outside. To the cleaning solution. In the present invention, the regenerating apparatus is preferably a fluorine-based cleaning liquid having a purity as high as that before use, as long as it can remove various contaminants contained in the used fluorine-based cleaning liquid. 14 321090 200946254 For example, the use of organic gas cleaning fluid contains organic pollution
9J 物、水溶性污染物、離子性污染物、以及固體污染物之情 形時,再生裝置必須全部去除各種污染物,而能藉由循環 配置將例如日本特開2001-129302號公報所記載的再生裝 置與清洗裝置連接。 此外,本清洗系統亦可於前述精製裝置與前述清洗裝 置之間以及前述清洗裝置與前述再生裝置之間的至少一方 具備暫時性地儲留氟系清洗液之緩衝槽。 在將精製用缓衝槽設置於精製裝置的下游側之情形 時,能夠以與清洗裝置所進行的清洗步驟並行之方式,為 了接下來的批次清洗處理,將精製完畢之未使用的氟系清 洗液預先儲留於精製用緩衝槽内。因此,在將清洗裝置内 辦污的使用完畢之氣糸清洗液更換成新的氣糸清洗液、或 者將使用完畢的氟系清洗液以再生裝置進行再生處理時, 能將精製用缓衝槽内的精製完畢之氟系清洗液供給至接下 〇 來的批次清洗處理,而能效率佳地進行清洗處理。 此外,在將再生用缓衝槽設置於再生裝置的上游側之 情形時,藉由再生裝置將清洗裝置内髒污的使用完畢之氟 系清洗液予以再生處理時,係能將使用完畢的氟系清洗液 移送至再生用缓衝槽,並從精製裝置將精製完畢的氟系清 洗液供給至清洗裝置,而於清洗裝置所進行的清洗步驟之 期間,從再生用緩衝槽將使用完畢的氟系清洗液供給至再 生裝置以進行再生處理。此外,當於再生裝置的下游側亦 設置第二再生用緩衝槽時,能將經過再生的氟系清洗液連 15 321090 200946254 續送入至第二再生用缓衝槽,並預先儲留以用於接下來的 分批清洗。 此外,在設置精製用缓衝槽與再生用緩衝槽兩者之情 形時,能獲得各缓衝槽之前述優點,而能更有效地進行二 洗處理。 本發明的清洗系統係以配管連接以配管連續性地連接 前述各污染物去除裝ί之精製裝置與清洗裝置而成為—體 化,藉此能將從未使用的氟系清洗液連續地去除农 _In the case of 9J, water-soluble contaminants, ionic contaminants, and solid contaminants, the regeneration device must completely remove various contaminants, and the regeneration described in, for example, JP-A-2001-129302 can be circulated. The device is connected to the cleaning device. Further, the cleaning system may include a buffer tank for temporarily storing the fluorine-based cleaning liquid between at least one of the refining device and the cleaning device, and between the cleaning device and the regenerating device. When the purification buffer tank is installed on the downstream side of the refining device, the purified fluorine system can be purified for the next batch cleaning process in parallel with the washing step performed by the cleaning device. The cleaning liquid is previously stored in the purification buffer tank. Therefore, when the used gas cleaning liquid that has been cleaned in the cleaning device is replaced with a new gas cleaning liquid, or the used fluorine-based cleaning liquid is regenerated by the regeneration device, the purification buffer tank can be used. The purified fluorine-based cleaning liquid in the inside is supplied to the subsequent batch cleaning treatment, and the cleaning treatment can be performed efficiently. In addition, when the regeneration buffer tank is installed on the upstream side of the regeneration apparatus, when the fluorine-based cleaning liquid that has been used in the cleaning apparatus is regenerated by the regeneration apparatus, the used fluorine can be used. The cleaning liquid is transferred to the regeneration buffer tank, and the purified fluorine-based cleaning liquid is supplied from the refining device to the cleaning device, and the used fluorine is used from the regeneration buffer tank during the cleaning step performed by the cleaning device. The cleaning liquid is supplied to the regeneration device for regeneration treatment. Further, when the second regeneration buffer tank is provided on the downstream side of the regeneration device, the regenerated fluorine-based cleaning liquid can be continuously fed to the second regeneration buffer tank and stored in advance for use. In the next batch cleaning. Further, when both the purification buffer tank and the regeneration buffer tank are provided, the above advantages of the respective buffer tanks can be obtained, and the double washing treatment can be performed more efficiently. The cleaning system of the present invention is connected by piping to continuously connect the refining device and the cleaning device of the respective contaminant removing devices, thereby continuously removing the unused fluorine-based cleaning liquid. _
物而精製成的高純度氟系清洗液直接供給至 ’万染 會與外部環境接觸。 >此外’在本清洗系統中,為了不使氟系清洗液的心 停滯’係可將例如泵式或空氣式的移送手段設置於配管# 中途,亦可藉由重力差移送氟系清洗液。 (清洗方法的說明) 在上述構成的清洗系統巾,用以清洗電子組件之本發The high-purity fluorine-based cleaning solution prepared by the product is directly supplied to the '10,000 dyes' and is in contact with the external environment. > In addition, in the present cleaning system, in order to prevent the heart of the fluorine-based cleaning liquid from stagnating, for example, a pump type or an air type transfer means can be provided in the middle of the pipe #, and the fluorine-based cleaning liquid can be transferred by gravity difference. . (Description of cleaning method) The cleaning system towel constructed as described above is used for cleaning the hair of the electronic component
明的清洗方法亦可包含清洗液再生步驟,係以再生裝置再 生u裝置所排出的氟系清洗液,並循環供給至清洗裝 置。 ^ 此外亦可包含凊洗液補給步驟,係將所精製的氟系 清洗液從精製裝置補給至清洗裝置。 鼠糸 〆=外,清洗步驟亦可為將電子組件浸潰於清洗槽内的 氟系π $液中進打清洗,將清洗後的電子組件浸潰於洗滌 槽3if、清洗液巾進行統,以蒸氣滯留部將洗條後的 電子、’件予以洛氣清洗,藉由來自淋浴喷嘴之精製完畢的 321090 16 200946254 氣系清洗液將經過蒸氣清洗的電子組件予以淋浴清洗。 e 以下,參照附圖詳細說明本發明的實施形態。此外, 本發明並未限定於以下例示的實施形態。 (實施形態一) 第1圖系顯示本發明的清洗系統的實施形態一的概略 構成圖。 實施形態一的清洗系統係由清洗裝置10、以及藉由配 管而與清洗裝置10連接的精製裝置20所構成。 清洗裝置10係具備有:上方為開口狀的主體11、配 置於主體11内下部的清洗槽12與洗滌槽13、以及沿著主 體11的上部開口緣配置的蒸氣凝結部14,於清洗槽12與 洗滌槽13的内部收容有氟系清洗液C。此外,在第1圖中, 二點鏈線係表示氟系清洗液C的液面,氟系清洗液C的量 係設定成清洗槽12的液面恒常地低於洗滌槽13的液面。 清洗槽12係於内部底面具有加熱器12a,藉由加熱器 〇 12a加熱清洗槽12内的氟系清洗液C。此外,清洗槽12内 之被加熱的氟系清洗液C的一部分係變成蒸氣而上升,於 清洗槽12及洗滌槽13的上方形成氟系清洗液C的蒸氣層 S。此外,在第1圖中,虛線係表示蒸氣層S與大氣的交界。 洗滌槽13係於内部底面具有超音波產生機13a,藉由 超音波產生機13a對洗滌槽13内的氟系清洗液C施予超音 波。 蒸氣凝绪部14係具備有:凝結管14a,係沿著主體11 的上部開口緣的内面而設置;未圖示的冷卻循環部,係使 17 321090 200946254 冷媒循環於凝結管Ha β ;排水槽部l4b,係設置於凝結 的下部;以及水分離器14c,係經由配管連接排水 槽部14b及洗滌槽13。 祭亂層S中之蒸氣的—部分係與 熱能,藉此會液化而聚集至排水槽/ 14接觸而丧失 系清洗液C係含有F广價丨14b。由於液化的氟 系清洗液e係從排,的水減所_、%的水分,因此氣 水分離,比重比氟系、主、P 14b導入至水分離ϋ 14c内而與 上部的排水π排出C還小的水係從水分離器14c 下部的開π經過配管=’㈣'清洗液e係從水分離器14c 精製裝置20係择入至洗務槽13内。 成用以去除水溶性污:配管從上游側依序串聯連接有:構 構成水分絲裝置q八m絲I之錢觸管桂2卜 成離子性污染物去除/離$ 22與吸濕材料管柱23、構 成用以去除有機性污^之離子性污染物去除管柱24、構 塔25、以及用以去除;二之精餾裝置的加熱器内建型蒸餾 水接觸管柱2丨《狀污染物之過濾裝置26。 與水排出口,並於下部:上°卩的上游端具有清洗液流入口 Λ口’清洗液流的下游端具有清洗液排出口與水流 清洗液C導人至内部=由配管連接用以將未使用的氟系 由配管連接未圖示料斗(hopper)21 a,水流入口係經 此外,過遽裝置源。 槽13。 ㈣管連接清洗裝置10的洗滌 使用該清洗系統之、、主、 a洗方法係包含有:精製步驟,係 321090 200946254 將未使用的氟系清洗液供給至精製裝置20並予以精製;以 ¢/ 及清洗步驟,係藉由清洗裝置10内的氟系清洗液C清洗電 子組件;在清洗裝置10内進行電子組件的清洗前,將精製 的氟系清洗液C供給至清洗裝置10。 <關於精製步驟> 在水接觸管柱21内,氟系清洗液係從上方流入,水係 從下方流入。在氟系清洗液中含有水溶性污染物的情形 時,在氟系清洗液下降的期間去除水溶性污染物後,移送 〇 至水分離器22。此外,從水接觸管柱21的上部排出處理 所使用的水。 由於移送至水分離器22的氟系清洗液含有微量的 水,因此在水分離器22内氟系清洗液與水係分離成下層與 上層,下層的氟系清洗液係移送至吸濕材料管柱23。此外, 從水分離器22的上部排出分離的水。 由於移送至吸濕材料管柱23的氟系清洗液含有微量 ❹ 的水分,因此藉由吸濕材料(例如沸石)去除水分後,氟系 清洗液係移送至離子性污染物去除管柱24。 在移送至離子性污染物去除管柱24之氟系清洗液中 含有離子性污染物之情形時,在離子性污染物去除管柱24 内藉由離子性污染物去除材料(例如氧化鋁凝膠)去除該離 子性污染物後,氟系清洗液係移送至蒸德塔2 5。 在移送至蒸餾塔25的氟系清洗液中含有有機性污染 物之情形時,藉由使用有機性污染物與氟系清洗液的沸點 差之蒸餾塔25内的蒸餾操作去除該有機性污染物後,氟系 19 321090 200946254 清洗液係移送至過濾裝置26。 在移送至過濾裝置26之氟系清洗液中含有固體污染 物的情形時,藉由具有精密過濾膜與超過濾膜之過濾裝置 26去除固體污染物。此外,有時固體污染物亦會含有從上 游側流而來的吸濕材料或離子性污染物去除材料。 如此,通過水接觸管柱21、水分離器22、吸濕材料管 柱23、離子性污染物去除管柱24、蒸餾塔25、以及過濾 裝置26之氟系清洗液係成為未含有水溶性、離子性、有機 性、以及固體的各種污染物之以高純度所精製的氟系清洗 液C,並傳送至清洗裝置10的洗滌槽13。 亦即,在使用最新的氟系清洗液來清洗電子組件之情 形時,將所精製的氟系清洗液C供給至清洗裝置10的空洗 滌槽13内,而從洗滌槽13溢出的氟系清洗液C係供給至 清洗槽12。 <關於清洗步驟> 在清洗步驟中,首先,將電子組件浸潰於清洗槽12内 之經過加熱的氟系清洗液C中,去除電子組件表面的髒污 (主要為有機性污染物)。 接著,將電子組件浸潰於洗滌槽13内的氟系清洗液C 中。由於洗務槽13内的氟i系清洗液C係保持於比清洗槽 12内的氟系清洗液C還低的溫度,因此在洗滌槽13内冷 卻電子組件。此外,由於在洗滌槽13中藉由超音波產生機 13a對氟系清洗液C施予超音波,因此在清洗槽12中未被 去除而殘留於電子組件表面的髒污係藉由超音波的作用而 20 321090, 200946254 從電子組件剝離去除。 ψ 之後,從洗滌槽13撈出電子零件並導入至蒸氣層S, 藉由在電子組件表面凝結液化的氟系清洗液進行最後的洗 滌,從清洗裝置10上方的開口部取出電子組件。 在清洗步驟中,在凝結部14凝結液化之清淨的氟系清 洗液係在進行水分離後返回洗滌槽13,隨著電子組件從清 洗槽12帶入至洗蘇槽13的污染物係藉由溢流而返回清洗 槽12。 在該清洗步驟中,由於能使用進一步提高未使用的氟 系清洗液的純度之氟系清洗液來清洗電子組件,因此能進 一步地提升電子組件的清淨度。 此外,在本清洗系統中,在藉由反覆清洗裝置10所進 行的電子組件的清洗處理而使内部的氟系清洗液C減少的 情形時,係能在清洗中及/或清洗後將精製的氟系清洗液 補充至洗滌槽13。 Φ 此外,在本清洗系統中,藉由清洗裝置10進行預定個 數的電子組件的清洗處理(1批次清洗處理)後,必須更換 清洗裝置10内髒污的氟系清洗液C。 此時,開啟設置於清洗槽12與洗滌槽13底部之未圖 示的排出口的閥,將内部使用完畢的氟系清洗液回收至回 收容器,並依需要以由精製裝置20所精製的氟系清洗液C 清洗空的清洗裝置10的内部,關閉前述排出口後,如前述 將由精製裝置20所精製的氟系清洗液C導入至洗滌槽13 與清洗槽12。 21 321090 200946254 此外,所回收之使用完畢的氟系清洗液係被廢棄處 置’或亦可藉由再生裝置予以再生,並將再生的氟系清洗 液直接導入清洗裝置10並予以再使用,亦可藉由精製裝置 進一步提高純度後導入至清洗裝置10並予以再使用。 (實施形態二) 第2圖係本發明的清洗系統的實施形態二的概略構成 圖。 與實施形態一相同,實施形態二的清洗系統係由清洗 裝置100以及藉由配管連接清洗裝置100之精製裝置200 所構成,但清洗裝置1〇〇與糈製裝置200的構成係與實施 形態一些微不同。 以下,主要說明實施形態二中之與實施形態一的不同 點。 清洗裝置100係具備有:上方為開口狀的主體11〇、 配置於主體110内的下部之清洗槽120與洗滌槽13〇、沿 著主體110的上部開口緣而配置的蒸氣凝結部140、與清 洗槽120鄰接配置的蒸氣產生槽15〇、以及配置於蒸氣產 生槽150上方的蒸餾塔16〇。 與實施形態一相同,清洗槽120係具有加熱器i2〇a, 洗滌槽130係具有超音波產生機130a,蒸氣凝結部1係 具有凝結管140a、排水槽部i4〇b、以及水分離器14〇c。 此外,亦可取代加熱斋12〇a,將超音波產生機設置於清洗 槽120内。 蒸氣產生槽150係設置於蒸氣凝結部14〇外側,於内 200946254 . 部底面具有加熱器150a。 主體110係具有覆蓋蒸氣產生槽150上方之部分,於 該部分搭載有蒸餾塔160。此外,蒸餾塔160與蒸氣產生 槽150係藉由形成於主體110的連通孔而相互連通。 此外’於蒸餾塔160的上端形成排出蒸氣之排出口, 該排出口係經由配管而通過蒸氣凝結部14〇的凝結管14〇a 的附近。 ❹ 藉由清洗裝置100所進行的電子組件的清洗步驟亦與 實施形態一相同’首先,電子組件係浸潰於清洗槽120内 之經過加熱的氟系清洗液C中進行请洗,接著浸潰於洗滌 槽13中之施予有超音波的氟系清洗液^中進行洗滌,撈出 至a洗槽120内之加熱後的氟系清洗液c所氣化的蒸氣層 S中予以蒸氣清洗後,取出至外部。 在此期間,溢流出清洗槽120的氟系清洗液c係被導 入至蒸氣產生槽150内,在蒸氣產生槽150内被加熱而氣 ❹化的氟^清洗液C的蒸氣的一部分係通過蒸鶴塔160而接 觸凝結管140a,藉此會液化而聚集於排水槽部_。亦 即,,清洗步驟中’清洗槽120内髒污的氟系清洗液係流 j蒸氣產生槽150,含有有機污染物的氟系清洗液係於 蒸,產生槽160氣化,該蒸氣中之有機污染物的蒸氣係藉 2瘵餾塔160而冷卻、液化並返回蒸氣產生槽16〇,僅未 f有有機污染物的氟系清洗液的蒸氣通過蒸餾塔丨⑼,並 藉由瘵氣凝結部140而液化。與此同時,蒸氣層$ 一部分 的蒸氣亦藉由蒸氣凝結部丨4 〇液化而聚集於排水槽部 321090 23 200946254 140b,清淨的氟系清洗液係從排水槽部140b通過水分離器 140c返回至洗滌槽130。 精製裝置200係構成為:藉由配管連續性地串聯連 接:連接有給料斗210a之水接觸管柱210、水分離器220、 吸濕管柱230、離子性污染物去除管柱240、以及過濾裝置 260,且過濾裝置260係藉由配管連接清洗裝置100的洗滌 槽130。亦即,該精製裝置200除了省略實施形態一的精 製裝置20中的蒸餾塔25(參照第1圖)以外,係與實施形 態-相同。 ❹ 依據實施形態二的清洗系統,能將經過藉由精製裝置 200所進行之未使用的氟系清洗液中的有機性污染物以外 的水溶性污染物的去除、離子性污染物的去除、以及固體 污染物的去除而精製的氟系清洗液予以導入至清洗裝置 100的洗滌槽130,一邊藉由清洗裝置100清洗電子組件, 一邊藉由蒸餾塔160淨化含有有機性污染物的氟系清洗 液,並使其回流至洗滌槽130。 ❹ (實施形態三) 第3圖係顯示本發明的清洗系統的實施形態三的概略 構成圖。 實施形態三的清洗系統係具備有與第1圖所說明之實 施形態一相同的清洗裝置10與精製裝置20,且復具備有 用以再生使用完畢的氟系清洗液之再生裝置30。在第3圖 中,與第1圖相同的構成要素係附上相同的符號。 以下,主要說明實施形態三中之與實施形態一的不同 24 321090 200946254 再生裝置30係藉由循環配管31連接清洗裝置10的清 洗槽12與洗滌槽13,將清洗槽12内髒污的氟系清洗液導 入至再生裝置30,使經過清淨化而再生的I系清洗液返回 洗滌槽13並予以再使用。 例如,在結束一批次的清洗處理後,從清洗槽12將髒 污的氟系清洗液連續性地移送至再生裝置30進行再生,將 再生的清洗劑組成物液連續性地供給至下一批次的清洗處 理開始前的洗滌槽13。 此外,在本清洗系統中,在反覆清洗裝置10所進行的 電子組件的清洗處理而減少内部的氟系清洗液C的情形 時,亦可於清洗中及/或清洗後將經過精製的氟系清洗液 補充至洗滌槽13。 再生裝置30較佳為具備有用以去除各種污染成份之 複數個污染物去除裝置,例如具備有與精製裝置20相同的 〇 水清洗裝置、水分去除裝置、離子性污染物去除裝置、精 餾裝置、以及過濾裝置,亦能使用公知的再生裝置。 依據該清洗系統,能將使用完畢的髒污的氟系清洗液 從清洗裝置10通過循環配管31移送至再生裝置30,並將 .經過再生處理的氟系清洗液從再生裝置30通過循環配管 31移送至清洗裝置10。結果,能容易地於短時間進行氟系 清洗液的移送,並能在使經過再生處理的氟系清洗液不會 接觸外部環境之情形下移送至清洗裝置10,因此能避免污 染物從外部混入至清洗液中。 25 321090 200946254 (實施形態四) 第4圖係顯示本發明的清洗系統的實施形態四的概略 構成圖。 實施形態四的清洗系統係具備有與第2圖所說明的實 施形態二相同的清洗裝置100與精製裝置200,且復具備 有與實施形態三相同的再生裝置30。在第4圖中,與第2 圖及第3圖相同的構成要素係附上相同的符號。 實施形態四的清洗系統亦與實施形態三相同,能在系 統内簡單且高純度地再生使用完畢的髒污的氟系清洗液。 (實施形態五) 第5圖係顯示本發明的清洗系統的實施形態五的概略 構成圖。 如第5圖所示,實施形態五的清洗系統係於實施形態 三的清洗系統(參照第3圖)中的精製裝置20與清洗裝置 10之間具備有用以暫時性地儲留精製後的氟系清洗液之精 製用緩衝槽41,並於再生裝置30的下游側與清洗裝置10 之間具備有用以暫時性地儲留再生後的氟系清洗液之再生 用緩衝槽42。 依據實施形態五的清洗系統,能將清洗裝置10内的氟 系清洗液C連續性地移送至再生裝置30以進行再生處理, 並將再生完畢的氟系清洗液連續性地移送至再生用緩衝槽 42,在此期間,將精製用缓衝槽41内的精製完畢的氟系清 洗液連續性地移送至清洗裝置10,以進行下一次清洗步驟 的準備。 26 321090 200946254 , 此外,亦能將清洗裝置10内的氟系清洗液C連續性地 移送至再生裝置30進行再生處理,並將再生用缓衝槽42 内的再生完畢的氟系清洗液連續性地移送至清洗裝置10, 以進行下一次清洗步驟的準備。因此,能效率佳地進行批 次單位的清洗處理。 此外,亦可將儲留於各緩衝槽41、42的精製或再生的 氟系清洗液的一部分隨時補充至清洗裝置10。 此外,精製用緩衝槽41的位置係未限定於圖示的位 〇 置,其位置可在蒸餾塔25與過濾器26之間、離子性污染 物去除管柱24與蒸餾塔25之間、吸濕材料管柱23與離子 性污染物去除管柱24之間、或者水接觸管柱21之前。在 此情形中,於精製用缓衝槽暫時性地儲留精製中或精製前 的氣糸清洗液。 此外,再生用緩衝槽42的位置亦可在再生裝置30的 上游侧與清洗裝置10之間。在此情形中,於再生用缓衝槽 〇 42暫時性地儲留再生前的It系清洗液。 此外,在實施形態五中,缓衝槽亦可僅為精製用與再 生用的任一方。 此外,具備有此種精製用缓衝槽41及/或再生用緩衝 槽42之構成除了實施形態三的清洗系統之外,當然亦能應 用於前述實施形態一、二、及四的清洗系統。 (實施形態六) 第6圖係顯示本發明的清洗系統的實施形態六的概略 構成圖。 27 321090 200946254 實施形態六的清洗系統係構成為:具備有與第3圖所 * 說明的實施形態三相同的清洗裝置10與精製裝置20,清 洗裝置10復具備有淋浴噴嘴17,從前述淋浴喷嘴Π喷出 由精製裝置20所精製的氟系清洗液,將蒸氣清洗後的電子 組件予以淋浴清洗。在第6圖中,與第3圖相同的構成要 素係附上相同的符號。 以下,主要說明實施形態六中之與實施形態三的不同 點。 在實施形態六中,例如將淋浴喷嘴17配置於清洗裝置 ® 10中的蒸氣滯留部S的上方且為靠近清洗槽12的主體11 的上緣附近,且設置分歧配管28並連接分歧配管28與淋 浴喷嘴17,該分歧配管28係從連接精製裝置20的過濾器 26與清洗裝置10之配管27的中途而分歧。此外’於分歧 配管28的中途設置開閉閥28a,並於配管27的比分歧配 管28更下游侧設置開閉閥27a。 依據此構成,於清洗步驟中,能關閉開閉閥27a,打 〇 開開閉閥28a,從淋浴喷嘴17喷出由精製裝置20所精製 的氟系清洗液,將藉由蒸氣滯留部的蒸氣S進行蒸氣清洗 後的電子組件予以淋浴清洗。此外,能使業經使用於淋浴 清洗的敗系清洗液流落至清洗槽12中,而於清洗槽12内 再利用。 因此,即使於蒸氣S中含有有機性污染物的蒸氣,且 於蒸氣清洗後的電子組件的表面殘留有機性污染物,由於 藉由精製過的淋浴狀的敗系清洗液沖洗電子組件表面的有 28 321090 200946254 機性污染物,因此能進一步提高電子組件的清淨度。 $ 此外,可進行此種淋浴清洗之構成,除了實施形態三 的清洗系統之外,亦能應用於前述實施形態一、二、四、 及五的清洗系統。 其中,較佳為構成為從精製用缓衝槽41 (參照第5圖) 隨時將精製完畢的氟系清洗液供給至淋浴喷嘴17。 (實施形態七) 第7圖係顯示本發明的清洗系統的實施形態七的概略 構成圖。 實施形態七的清洗系統除了與第1圖所說明的實施形 態一的清洗系統中的清洗裝置10不同之外,係與實施形態 一相同。在第7圖中,與第1圖相同的構成要素係附上相 同的符號。 以下,主要說明實施形態七中之與實施形態一的不同 點。 ❿ 實施形態七中的清洗裝置10A係具備有:主體11,係 具有上方開口部;蓋體11a,係可開閉地遮蔽主體11的上 方開口部;以及清洗槽12與洗滌槽13,係階層式地配置 於主體11内的下部;於清洗槽12與洗滌槽13的内部收容 有氟系清洗液C。氟系清洗液C的量係設為清洗槽12的液 面恆常地低於洗滌槽13的液面。 此外,於清洗槽12與洗滌槽13的内部底面分別具有 超音波產生機13a,藉由各超音波產生機13a對清洗槽12 與洗滌槽13内的氟系清洗液C施予超音波。 29 321090 200946254 在藉由清洗裝置10A進行電子組件的清洗時,打開蓋 體11a,首先,將電子組件浸潰於室溫的清洗槽12内的氟 系清洗液C中,藉由超音波的作用剝離電子組件表面的髒 污。接著,將電子組件浸潰於室溫的洗滌槽13内的氟系清 洗液C中,藉由超音波的作用剝離殘留於電子組件表面的 髒污後,從清洗裝置10A的上方開口部取出電子組件。 如此,在實施形態七中,係省略實施形態一所進行的 蒸氣清洗。此外,除了電子組件的清洗步驟外,基本上蓋 體11a係關閉,且以灰塵、塵埃、髒物等不會進入清洗槽 12與洗滌槽13内之方式密閉清洗裝置10A内。 (實施形態八) 第8圖係顯示本發明的清洗系統的實施形態八的概略 構成圖。 實施形態八的清洗系統除了與第7圖所說明的實施形 態七的清洗系統中的清洗裝置10A不同之外,係與實施形 態七相同。在第8圖中,與第7圖相同的構成要素係附上 相同的符號。 以下,主要說明實施形態八中之與實施形態七的不同 點。 實施形態八中的清洗裝置10B係為於實施形態七中的 清洗裝置10A設置有淋浴喷嘴17(參照第6圖)者。淋浴噴 嘴17係與實施形態六同樣地,與精製裝置20連接。 在藉由清洗裝置10B進行電子組件的清洗時,與實施 形態七相同,電子組件係於清洗槽12與洗滌槽13清洗後, 30 321090 200946254 藉由淋浴喷嘴17所噴出之精製過的氟系清洗液C予以淋浴 清洗。或者,亦可省略在清洗槽12進行的清洗與在洗滌槽 13進行的清洗令的一方或雙方,直接進行淋浴清洗。此外, 淋浴清洗亦可為高壓淋浴清洗。 (實施形態九) 第9圖係顯示本發明的清洗系統的實施形態九的概略 構成圖。 實施形態九的清洗系統除了與第1圖所說明的實施形 ® 態一的清洗系統中的清洗裝置10不同之外,係與實施形態 一相同。在第9圖中,與第1圖相同的構成要素係附上相 同的符號。 以下,主要說明實施形態九中之與實施形態一的不同 點。 實施形態九中的清洗裝置i〇c係省略實施形態一中的 清洗裝置10的洗蘇槽13。 ❹ 在藉由清洗裝置10C進行電子姐件的清洗時,電子組 件係不浸潰於清洗槽12内之經過加熱的氟系清洗液c中, 而於蒸氣層S内進行清洗。此時,在電子組件冷卻的狀態 下置入於蒸氣層S内時,在組件表面上清洗液的蒸氣會凝 結並液化,猎此沖洗組件表面上的辨污。之後,暫時放置, 由於電子組件的溫度逐漸上升最後達到清洗液的沸點,因 此組件表面上的清洗液會氣化,電子組件則會乾燥。此外, 亦可於電子組件乾燥前從蒸氣層s取出電子組件,使電子 組件自然乾燥或藉由外部的乾燥裝置使其乾燥。 321090 200946254 (其他實施形態) (1) 在前述各實施形態中,亦可構成為設置用以循環清 洗裝置的洗滌槽内的氟系清洗液之循環路徑,於該循環路 徑設置過濾器,循環式地使洗滌槽内的氟系清洗液通過過 濾器予以清淨化。依據此構成,即使在清洗前附著於電子 組件的固體污染物在洗滌槽内剝離而混入於氟系清洗液中 之情形時,亦能從洗滌槽内的氟系清洗液去除固體污染 物,而能進一步提高電子組件的清淨度。 (2) 由於實施形態二(參照第2圖)與實施形態四(參照 第4圖)的清洗系統係於清洗裝置100具備有用以從已使用 的氟系清洗液去除有機性污染物之蒸餾塔160,因此雖從 精製裝置200省略蒸餾塔,但亦可與實施形態一(參照第1 圖)與實施形態三(參照第3圖)相同,於精製裝置200具備 蒸餾塔。藉由於精製裝置200設置蒸餾塔,能將已去除有 機性污染物之更高純度的未使用氟系清洗液供給至清洗裝 置 100。 (3) 實施形態七至九(第7圖至第9圖)的清洗系統亦可 與實施形態三至六(第3圖至第6圖)相同,具備再生裝置 30與缓衝槽41、42。 (實施例) 以下,列舉實施例進一步詳細說明本發明,但本發明 並未限定於這些實施例。 (實施例一)The cleaning method may include a cleaning liquid regeneration step of regenerating the fluorine-based cleaning liquid discharged from the u device by the regeneration device, and circulating it to the cleaning device. Further, the washing liquid replenishing step may be further included, and the purified fluorine-based cleaning liquid is supplied from the refining device to the washing device. In addition, the cleaning step may be performed by immersing the electronic component in the fluorine-based π $ liquid in the cleaning tank, and immersing the cleaned electronic component in the washing tank 3if and cleaning the liquid towel. The electrons and the pieces after the washing were cleaned by the vapor retention portion, and the steam-cleaned electronic components were shower-washed by the purified 321090 16 200946254 gas-based cleaning liquid from the shower nozzle. e Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Further, the present invention is not limited to the embodiments exemplified below. (First Embodiment) Fig. 1 is a schematic configuration view showing a first embodiment of a cleaning system according to the present invention. The cleaning system of the first embodiment is composed of a cleaning device 10 and a refining device 20 connected to the cleaning device 10 by piping. The cleaning device 10 includes a main body 11 having an open top, a washing tank 12 disposed in the lower portion of the main body 11, a washing tub 13, and a vapor condensation portion 14 disposed along an upper opening edge of the main body 11 in the washing tank 12 A fluorine-based cleaning liquid C is accommodated in the inside of the washing tub 13. Further, in Fig. 1, the two-point chain line indicates the liquid level of the fluorine-based cleaning liquid C, and the amount of the fluorine-based cleaning liquid C is set such that the liquid level of the cleaning tank 12 is constantly lower than the liquid level of the washing tank 13. The cleaning tank 12 has a heater 12a on the inner bottom surface, and the fluorine-based cleaning liquid C in the cleaning tank 12 is heated by the heater 〇 12a. In addition, a part of the heated fluorine-based cleaning liquid C in the cleaning tank 12 is vaporized and rises, and a vapor layer S of the fluorine-based cleaning liquid C is formed above the cleaning tank 12 and the washing tank 13. Further, in Fig. 1, a broken line indicates the boundary between the vapor layer S and the atmosphere. The washing tub 13 has an ultrasonic generator 13a on the inner bottom surface, and ultrasonic waves are applied to the fluorine-based cleaning liquid C in the washing tub 13 by the ultrasonic generator 13a. The vapor condensation portion 14 is provided with a condensation tube 14a provided along the inner surface of the upper opening edge of the main body 11, and a cooling circulation portion (not shown) circulates 17321090 200946254 refrigerant in the condensation tube Haβ; The portion l4b is provided at a lower portion of the condensation; and the water separator 14c is connected to the drain groove portion 14b and the washing tub 13 via a pipe. The part of the vapor in the sacrificial layer S is combined with thermal energy, whereby it will liquefy and accumulate in the drain tank / 14 contact and lose. The cleaning liquid C contains F wide price 丨 14b. Since the liquefied fluorine-based cleaning liquid e is dehydrated from the water discharged from the water, the gas and water are separated, and the specific gravity is introduced into the water separation crucible 14c than the fluorine-based, main, and P 14b, and is discharged to the upper drainage π. The small water system of C is selected from the lower portion π of the water separator 14c through the piping = '(four)' cleaning liquid e, and is selected from the water separator 14c refining device 20 into the washing tank 13. In order to remove water-soluble dirt: the pipes are connected in series from the upstream side in series: the structure of the water wire device q 八 m wire I of the money contact tube 2 urethane ionic contaminant removal / away from $ 22 and the hygroscopic material tube a column 23, an ionic contaminant removal column 24 for removing organic pollutants, a turret 25, and a heater built-in type of distilled water contact column for removing the second rectification device Filter device 26 of the object. With the water discharge port, and at the lower part: the upstream end of the upper 卩 has a cleaning liquid flow inlet port. The downstream end of the cleaning liquid flow has a cleaning liquid discharge port and a water flow cleaning liquid C leading to the inside = connected by a pipe for The unused fluorine system is connected to a hopper 21a (not shown) by a pipe, and the water inlet is passed through the source of the device. Slot 13. (4) Washing of the pipe connection cleaning device 10 The main and a washing method of the cleaning system includes: a purification step, 321090 200946254. The unused fluorine-based cleaning liquid is supplied to the refining device 20 and refined; In the cleaning step, the electronic component is cleaned by the fluorine-based cleaning liquid C in the cleaning device 10, and the purified fluorine-based cleaning liquid C is supplied to the cleaning device 10 before the electronic component is cleaned in the cleaning device 10. <Regarding the Purification Step> In the water contact column 21, the fluorine-based cleaning liquid flows in from above, and the water system flows in from below. When the fluorine-based cleaning liquid contains a water-soluble contaminant, the water-soluble contaminant is removed while the fluorine-based cleaning liquid is lowered, and then transferred to the water separator 22. Further, water used for the treatment is discharged from the upper portion of the water contact column 21. Since the fluorine-based cleaning liquid transferred to the water separator 22 contains a trace amount of water, the fluorine-based cleaning liquid and the water are separated into a lower layer and an upper layer in the water separator 22, and the lower fluorine-based cleaning liquid is transferred to the moisture-absorbing material tube. Column 23. Further, the separated water is discharged from the upper portion of the water separator 22. Since the fluorine-based cleaning liquid transferred to the moisture absorbing material column 23 contains a trace amount of hydrazine moisture, the fluorine-based cleaning liquid is transferred to the ionic pollutant removal column 24 after the moisture is removed by the moisture absorbing material (e.g., zeolite). When the fluorinated cleaning solution transferred to the ionic contaminant removal column 24 contains ionic contaminants, the ionic contaminant removal column 24 is removed by ionic contaminants (eg, alumina gel). After removing the ionic contaminant, the fluorine-based cleaning liquid is transferred to the steaming tower 25 . In the case where the fluorine-based cleaning liquid transferred to the distillation column 25 contains an organic contaminant, the organic contaminant is removed by a distillation operation in the distillation column 25 using a difference in boiling point between the organic contaminant and the fluorine-based cleaning liquid. Thereafter, the fluorine system 19 321090 200946254 cleaning liquid is transferred to the filtration device 26. When the fluorine-based cleaning liquid transferred to the filtering device 26 contains solid contaminants, the solid contaminants are removed by the filtering device 26 having the fine filtration membrane and the ultrafiltration membrane. In addition, solid contaminants sometimes contain absorbent materials or ionic contaminant removal materials that flow from the upstream side. Thus, the fluorine-based cleaning liquid through the water contact column 21, the water separator 22, the moisture absorbing material column 23, the ionic contaminant removal column 24, the distillation column 25, and the filtration device 26 is not water-soluble, The fluorine-based cleaning liquid C purified by high purity of various ionic, organic, and solid contaminants is sent to the washing tub 13 of the washing apparatus 10. In other words, when the electronic component is cleaned using the latest fluorine-based cleaning liquid, the purified fluorine-based cleaning liquid C is supplied into the empty washing tank 13 of the cleaning device 10, and the fluorine-based cleaning overflowing from the washing tank 13 is performed. Liquid C is supplied to the washing tank 12. <Regarding the cleaning step> In the cleaning step, first, the electronic component is immersed in the heated fluorine-based cleaning liquid C in the cleaning tank 12 to remove the dirt (mainly organic contaminants) on the surface of the electronic component. . Next, the electronic component is immersed in the fluorine-based cleaning liquid C in the washing tub 13. Since the fluorine-based cleaning liquid C in the washing tank 13 is kept at a lower temperature than the fluorine-based cleaning liquid C in the cleaning tank 12, the electronic components are cooled in the washing tub 13. Further, since the fluorine-based cleaning liquid C is ultrasonically applied to the washing tank 13 by the ultrasonic generator 13a, the dirt remaining in the cleaning tank 12 and remaining on the surface of the electronic component is acted upon by ultrasonic waves. 20 321090, 200946254 Peel off from electronic components. Then, the electronic component is taken out from the washing tub 13 and introduced into the vapor layer S, and the final cleaning is performed by the fluorine-based cleaning liquid condensed and liquefied on the surface of the electronic component, and the electronic component is taken out from the opening above the cleaning device 10. In the washing step, the cleaned fluorine-based cleaning liquid which is condensed and liquefied in the condensing unit 14 is returned to the washing tank 13 after the water separation, and the contaminants brought into the sacrificial tank 13 by the electronic component from the washing tank 12 are used. The overflow flow returns to the cleaning tank 12. In the cleaning step, since the electronic component can be cleaned by using a fluorine-based cleaning liquid which further increases the purity of the unused fluorine-based cleaning liquid, the cleanliness of the electronic component can be further improved. In the cleaning system, when the internal fluorine-based cleaning liquid C is reduced by the cleaning process of the electronic component by the cleaning device 10, the cleaning can be performed during and/or after cleaning. The fluorine-based cleaning liquid is replenished to the washing tub 13. Φ In addition, in the cleaning system, after the predetermined number of electronic components are cleaned (one batch of cleaning process) by the cleaning device 10, it is necessary to replace the dirty fluorine-based cleaning liquid C in the cleaning device 10. At this time, the valve provided in the discharge port (not shown) at the bottom of the washing tank 12 and the washing tub 13 is opened, and the fluorine-based cleaning liquid that has been used internally is collected in the recovery container, and the fluorine purified by the refining device 20 is used as needed. The cleaning liquid C cleans the inside of the empty cleaning device 10, and after closing the discharge port, the fluorine-based cleaning liquid C purified by the refining device 20 is introduced into the washing tank 13 and the washing tank 12 as described above. 21 321090 200946254 In addition, the recovered fluorine-based cleaning liquid is disposed of by disposal or may be regenerated by a regeneration device, and the regenerated fluorine-based cleaning liquid may be directly introduced into the cleaning device 10 and reused. The purity is further increased by the refining device, and then introduced into the cleaning device 10 and reused. (Second embodiment) Fig. 2 is a schematic configuration diagram of a second embodiment of the cleaning system of the present invention. As in the first embodiment, the cleaning system of the second embodiment is constituted by the cleaning device 100 and the refining device 200 connected to the cleaning device 100 by piping. However, the configuration of the cleaning device 1 and the tanning device 200 and the embodiment are somewhat Minor. Hereinafter, differences between the second embodiment and the first embodiment will be mainly described. The cleaning device 100 includes a main body 11 that is open at the top, a cleaning tank 120 disposed in the lower portion of the main body 110, a washing tank 13A, and a vapor condensation unit 140 disposed along the upper opening edge of the main body 110, and The cleaning tank 120 is adjacent to the vapor generation tank 15A disposed and the distillation column 16〇 disposed above the vapor generation tank 150. In the same manner as in the first embodiment, the washing tank 120 has a heater i2〇a, the washing tank 130 has an ultrasonic generator 130a, and the vapor condensation unit 1 has a condensation tube 140a, a drain portion i4〇b, and a water separator 14. 〇c. Further, instead of heating the heater 12, the ultrasonic generator may be placed in the cleaning tank 120. The steam generating tank 150 is disposed outside the vapor condensing unit 14 ,, and has a heater 150a on the bottom surface of the unit. The main body 110 has a portion covering the upper portion of the vapor generation tank 150, and a distillation column 160 is mounted on the portion. Further, the distillation column 160 and the vapor generation groove 150 are in communication with each other by a communication hole formed in the main body 110. Further, a discharge port for discharging steam is formed at the upper end of the distillation column 160, and the discharge port passes through the vicinity of the condensation pipe 14〇a of the vapor condensation portion 14 via the pipe.清洗 The cleaning process of the electronic component by the cleaning device 100 is also the same as that of the first embodiment. First, the electronic component is immersed in the heated fluorine-based cleaning liquid C in the cleaning tank 120, and then washed. The fluorine-based cleaning liquid to which the ultrasonic wave is applied in the washing tank 13 is washed, and is taken out to the vapor layer S vaporized by the heated fluorine-based cleaning liquid c in the washing tank 120, and then steam-cleaned. , take it out to the outside. During this period, the fluorine-based cleaning liquid c overflowing into the cleaning tank 120 is introduced into the steam generation tank 150, and a part of the vapor of the fluorine cleaning liquid C heated and vaporized in the steam generation tank 150 is steamed. The crane tower 160 contacts the condensation tube 140a, thereby liquefying and collecting in the drainage groove portion_. That is, in the cleaning step, the fluorine-based cleaning liquid stream in the cleaning tank 120 is vapor-generated, and the fluorine-based cleaning liquid containing organic contaminants is vaporized, and the tank 160 is vaporized. The vapor of the organic pollutant is cooled, liquefied, and returned to the vapor generation tank 16 by the second distillation column 160, and only the vapor of the fluorine-based cleaning liquid having no organic pollutant passes through the distillation column (9), and is coagulated by helium gas. The part 140 is liquefied. At the same time, a part of the vapor of the vapor layer is also liquefied by the vapor condensation unit 聚集4 聚集 and is collected in the drain tank portion 321090 23 200946254 140b, and the clean fluorine-based cleaning liquid is returned from the drain tank portion 140b through the water separator 140c to Washing tank 130. The refining device 200 is configured to be continuously connected in series by a pipe: a water contact pipe 210 to which the feed hopper 210a is connected, a water separator 220, a moisture absorption pipe column 230, an ionic pollutant removal pipe column 240, and filtration The device 260 and the filter device 260 are connected to the washing tub 130 of the washing device 100 by piping. In other words, the refining device 200 is the same as the embodiment-described except that the distillation column 25 (see Fig. 1) in the finishing device 20 of the first embodiment is omitted. ❹ According to the cleaning system of the second embodiment, it is possible to remove water-soluble contaminants other than organic contaminants in the unused fluorine-based cleaning liquid by the refining device 200, and to remove ionic contaminants, and The fluorine-based cleaning liquid purified by the removal of the solid contaminant is introduced into the washing tank 130 of the washing apparatus 100, and the electronic component is cleaned by the washing apparatus 100, and the fluorine-based cleaning liquid containing the organic contaminant is purified by the distillation column 160. And returning it to the washing tank 130.实施 (Embodiment 3) Fig. 3 is a schematic configuration view showing a third embodiment of the cleaning system of the present invention. The cleaning system of the third embodiment includes the cleaning device 10 and the refining device 20 which are the same as those of the first embodiment described in Fig. 1, and further includes a regenerating device 30 for regenerating the used fluorine-based cleaning liquid. In Fig. 3, the same components as those in Fig. 1 are denoted by the same reference numerals. Hereinafter, the difference between the third embodiment and the first embodiment will be mainly described. 24 321090 200946254 The regenerative device 30 is connected to the washing tank 12 and the washing tub 13 of the washing device 10 by the circulation pipe 31, and the fluorine in the washing tank 12 is contaminated. The cleaning liquid is introduced into the regeneration device 30, and the I-based cleaning liquid that has been purified and purified is returned to the washing tub 13 and reused. For example, after the completion of one batch of the cleaning process, the dirty fluorine-based cleaning liquid is continuously transferred from the cleaning tank 12 to the regeneration device 30 for regeneration, and the regenerated detergent composition liquid is continuously supplied to the next step. The washing tank 13 before the start of the washing process of the batch. Further, in the cleaning system, when the cleaning process of the electronic component by the cleaning device 10 is repeated to reduce the internal fluorine-based cleaning liquid C, the purified fluorine system may be used during cleaning and/or after cleaning. The cleaning liquid is replenished to the washing tub 13. The regeneration device 30 preferably includes a plurality of contaminant removal devices for removing various contaminant components, for example, a dewatering cleaning device, a moisture removal device, an ionic contaminant removal device, and a rectification device, which are provided in the same manner as the refining device 20. As well as the filter device, a known regeneration device can also be used. According to the cleaning system, the used fluorine-based cleaning liquid can be transferred from the cleaning device 10 to the regeneration device 30 through the circulation pipe 31, and the fluorine-based cleaning liquid subjected to the regeneration treatment can be passed from the regeneration device 30 to the circulation pipe 31. Transfer to the cleaning device 10. As a result, the fluorine-based cleaning liquid can be easily transferred in a short time, and the fluorine-based cleaning liquid subjected to the regeneration treatment can be transferred to the cleaning device 10 without coming into contact with the external environment, thereby preventing contamination from being mixed from the outside. To the cleaning solution. 25 321090 200946254 (Fourth Embodiment) Fig. 4 is a view showing a schematic configuration of a fourth embodiment of the cleaning system of the present invention. The cleaning system of the fourth embodiment includes the cleaning device 100 and the refining device 200 which are the same as those of the second embodiment described in Fig. 2, and the same regenerative device 30 as that of the third embodiment is provided. In the fourth drawing, the same components as those in the second and third figures are denoted by the same reference numerals. In the cleaning system of the fourth embodiment, as in the third embodiment, the used dirty fluorine-based cleaning liquid can be easily and highly purified in the system. (Fifth Embodiment) Fig. 5 is a schematic block diagram showing a fifth embodiment of the cleaning system of the present invention. As shown in Fig. 5, the cleaning system of the fifth embodiment is provided between the refining device 20 and the cleaning device 10 in the cleaning system (see Fig. 3) of the third embodiment to temporarily store and purify the purified fluorine. A buffer tank 41 for purifying the cleaning liquid is provided, and a regeneration buffer tank 42 for temporarily storing the regenerated fluorine-based cleaning liquid between the downstream side of the regeneration device 30 and the cleaning device 10 is provided. According to the cleaning system of the fifth embodiment, the fluorine-based cleaning liquid C in the cleaning device 10 can be continuously transferred to the regeneration device 30 for regeneration processing, and the regenerated fluorine-based cleaning liquid can be continuously transferred to the regeneration buffer. In the tank 42, during this period, the purified fluorine-based cleaning liquid in the purification buffer tank 41 is continuously transferred to the cleaning device 10 to prepare for the next cleaning step. 26 321090 200946254 Further, the fluorine-based cleaning liquid C in the cleaning device 10 can be continuously transferred to the regeneration device 30 for regeneration treatment, and the recycled fluorine-based cleaning liquid in the regeneration buffer tank 42 can be continuously maintained. The ground is transferred to the cleaning device 10 for preparation for the next cleaning step. Therefore, the cleaning process of the batch unit can be performed efficiently. Further, a part of the purified or regenerated fluorine-based cleaning liquid stored in each of the buffer tanks 41, 42 may be replenished to the cleaning device 10 at any time. Further, the position of the buffer tank 41 for purification is not limited to the position shown in the drawing, and the position may be between the distillation column 25 and the filter 26, between the ionic contaminant removal column 24 and the distillation column 25, and suction. The wet material column 23 is separated from the ionic contaminant removal column 24 or before the water contacts the column 21. In this case, the gas cleaning liquid before purification or before purification is temporarily stored in the purification buffer tank. Further, the position of the regeneration buffer tank 42 may be between the upstream side of the regeneration device 30 and the cleaning device 10. In this case, the It-based cleaning liquid before regeneration is temporarily stored in the regeneration buffer tank 42. Further, in the fifth embodiment, the buffer tank may be used only for one of refining and regenerating. Further, the configuration including the purification buffer tank 41 and/or the regeneration buffer tank 42 can be applied to the cleaning systems of the first, second, and fourth embodiments in addition to the cleaning system of the third embodiment. (Embodiment 6) Fig. 6 is a view showing a schematic configuration of a sixth embodiment of the cleaning system of the present invention. 27 321090 200946254 The cleaning system according to the sixth embodiment is configured to include the cleaning device 10 and the refining device 20 which are the same as the third embodiment described in the third drawing, and the cleaning device 10 is provided with a shower nozzle 17 from the shower nozzle. The fluorine-based cleaning liquid purified by the refining device 20 is ejected, and the electronic components after the steam cleaning are shower-washed. In Fig. 6, the same constituent elements as those in Fig. 3 are denoted by the same reference numerals. Hereinafter, differences between the sixth embodiment and the third embodiment will be mainly described. In the sixth embodiment, for example, the shower nozzle 17 is disposed above the vapor storage portion S in the cleaning device 10, and is adjacent to the upper edge of the main body 11 of the cleaning tank 12, and the branch pipe 28 is provided and the branch pipe 28 is connected. In the shower nozzle 17, the branch pipe 28 is branched from the middle of the pipe 26 connecting the refining device 20 and the pipe 27 of the washing device 10. Further, the opening and closing valve 28a is provided in the middle of the branch pipe 28, and the opening and closing valve 27a is provided on the downstream side of the branch pipe 28 of the pipe 27. According to this configuration, in the cleaning step, the opening and closing valve 27a can be closed, the opening and closing valve 28a can be opened, and the fluorine-based cleaning liquid purified by the refining device 20 can be ejected from the shower nozzle 17 to carry out the vapor S in the vapor retention portion. The electronic components after the steam cleaning are shower cleaned. Further, the ruined cleaning liquid which has been used for shower cleaning can be discharged into the cleaning tank 12 and reused in the cleaning tank 12. Therefore, even if the vapor S contains the vapor of the organic contaminant and the organic contaminant remains on the surface of the electronic component after the vapor cleaning, the surface of the electronic component is washed by the purified shower-like depleted cleaning liquid. 28 321090 200946254 Machine-based contaminants, thus further improving the cleanliness of electronic components. Further, the shower cleaning can be carried out in addition to the cleaning system of the third embodiment, and can be applied to the cleaning systems of the first, second, fourth, and fifth embodiments. In particular, it is preferable that the purified fluorine-based cleaning liquid is supplied to the shower nozzle 17 at any time from the purification buffer tank 41 (see FIG. 5). (Embodiment 7) Fig. 7 is a view showing a schematic configuration of a seventh embodiment of the cleaning system of the present invention. The cleaning system according to the seventh embodiment is the same as the first embodiment except that it is different from the cleaning device 10 in the cleaning system of the first embodiment described in Fig. 1. In Fig. 7, the same components as those in Fig. 1 are attached with the same symbols. Hereinafter, differences between the seventh embodiment and the first embodiment will be mainly described. The cleaning device 10A according to the seventh embodiment includes a main body 11 having an upper opening, a lid 11a that opens and closes the upper opening of the main body 11, and a washing tank 12 and a washing tub 13 in a hierarchical manner. It is disposed in the lower portion of the main body 11 and contains a fluorine-based cleaning liquid C in the inside of the washing tank 12 and the washing tub 13 . The amount of the fluorine-based cleaning liquid C is such that the liquid level of the cleaning tank 12 is constantly lower than the liquid level of the washing tank 13. Further, an ultrasonic generator 13a is provided on each of the cleaning tank 12 and the inner bottom surface of the washing tub 13, and ultrasonic waves are applied to the cleaning tank 12 and the fluorine-based cleaning liquid C in the washing tank 13 by the ultrasonic generators 13a. 29 321090 200946254 When the electronic component is cleaned by the cleaning device 10A, the lid 11a is opened, and first, the electronic component is immersed in the fluorine-based cleaning liquid C in the cleaning tank 12 at room temperature, by the action of ultrasonic waves. Peel off the surface of the electronic components. Then, the electronic component is immersed in the fluorine-based cleaning liquid C in the washing tank 13 at room temperature, and the dirt remaining on the surface of the electronic component is peeled off by the action of ultrasonic waves, and the electrons are taken out from the upper opening of the cleaning device 10A. Component. As described above, in the seventh embodiment, the steam cleaning performed in the first embodiment is omitted. Further, in addition to the cleaning step of the electronic component, basically, the lid body 11a is closed, and dust, dust, dirt, and the like are sealed in the cleaning device 10A so as not to enter the washing tank 12 and the washing tub 13. (Embodiment 8) Fig. 8 is a view showing a schematic configuration of an eighth embodiment of the cleaning system of the present invention. The cleaning system of the eighth embodiment is the same as the embodiment 7 except that it is different from the cleaning device 10A in the cleaning system of the seventh embodiment described in Fig. 7. In Fig. 8, the same components as those in Fig. 7 are denoted by the same reference numerals. Hereinafter, differences between the eighth embodiment and the seventh embodiment will be mainly described. In the cleaning device 10B of the eighth embodiment, the shower nozzle 17 (see Fig. 6) is provided in the cleaning device 10A of the seventh embodiment. The shower nozzle 17 is connected to the refining device 20 in the same manner as in the sixth embodiment. When the electronic component is cleaned by the cleaning device 10B, in the same manner as in the seventh embodiment, the electronic component is cleaned by the shower nozzle 17 after the cleaning tank 12 and the washing tub 13 are cleaned, 30 321090 200946254 Liquid C is shower cleaned. Alternatively, one or both of the washing performed in the washing tank 12 and the washing order in the washing tub 13 may be omitted, and the shower washing may be directly performed. In addition, shower cleaning can also be used for high pressure shower cleaning. (Embodiment 9) FIG. 9 is a schematic configuration view showing a ninth embodiment of the cleaning system of the present invention. The cleaning system according to the ninth embodiment is the same as the first embodiment except that it is different from the cleaning device 10 in the cleaning system of the first embodiment described in Fig. 1. In Fig. 9, the same components as those in Fig. 1 are attached with the same symbols. Hereinafter, differences between the ninth embodiment and the first embodiment will be mainly described. In the cleaning device i〇c according to the ninth embodiment, the sacrificial tank 13 of the cleaning device 10 in the first embodiment is omitted. When the electronic device is cleaned by the cleaning device 10C, the electronic component is not immersed in the heated fluorine-based cleaning liquid c in the cleaning tank 12, and is cleaned in the vapor layer S. At this time, when the electronic component is placed in the vapor layer S in a state where the electronic component is cooled, the vapor of the cleaning liquid on the surface of the component condenses and liquefies, and the surface of the rinsing component is smeared. After that, it is temporarily placed, and since the temperature of the electronic component gradually rises to the boiling point of the cleaning liquid, the cleaning liquid on the surface of the module is vaporized, and the electronic components are dried. Alternatively, the electronic component may be taken out from the vapor layer s before the electronic component is dried, so that the electronic component is naturally dried or dried by an external drying device. 321090 200946254 (Other Embodiments) (1) In each of the above embodiments, a circulation path for a fluorine-based cleaning liquid in a washing tank for circulating a cleaning device may be provided, and a filter may be provided in the circulation path. The fluorine-based cleaning liquid in the washing tank is cleaned by a filter. According to this configuration, even when the solid contaminant adhering to the electronic component before the cleaning is peeled off in the washing tank and mixed in the fluorine-based cleaning liquid, the solid contaminant can be removed from the fluorine-based cleaning liquid in the washing tank, and Can further improve the cleanliness of electronic components. (2) The cleaning system according to the second embodiment (see Fig. 2) and the fourth embodiment (see Fig. 4) is provided in the cleaning apparatus 100, and is provided with a distillation tower for removing organic pollutants from the used fluorine-based cleaning liquid. Since the distillation column is omitted from the refining device 200, the refining device 200 may be provided with a distillation column in the same manner as in the first embodiment (see the first drawing) and the third embodiment (see the third drawing). By providing the distillation column in the refining device 200, the unused fluorine-based cleaning liquid having a higher purity from which organic pollutants have been removed can be supplied to the cleaning device 100. (3) The cleaning system of Embodiments 7 to 9 (Figs. 7 to 9) may be the same as Embodiments 3 to 6 (Figs. 3 to 6), and includes the regeneration device 30 and the buffer tanks 41, 42. . (Examples) Hereinafter, the present invention will be described in further detail by way of examples, but the present invention is not limited to these examples. (Embodiment 1)
就氟系清洗液而言,係於Vertrel(註冊商標)XF(DU 32 321090 200946254 PONT-MITSUI FLUOROCHEMICALS C0MPANY,LTD.製造昆 + 2-丙醇(以下記為IPA)200重量ppm作為水溶性涔染物’並 混合Krutox(註冊商標)143AC(DuPont, Inc.製造)5重置 ppm作為有機性污染物,以調配成具有模擬辨淨之氟糸/月 洗液。 使用前述實施形態一(參照第1圖)中的精製裝置20精 製具有模擬髒污的前述氟系清洗液,使用水分計(日本三菱 化學製造,CA-06型)測量從精製後的氟系清洗液已去除多 ® 少程度的各種污染物與水分,將測量結果顯示於表一。此 外,於離子性污染物去除裝置24使用分子篩(molecular sieve)3A(UNI0N SHOWA K. Κ·製造),於精餾裝置25使用蒸 德塔(歐德沙(Oldershaw)型,40段)。 表一 精製前的氟系清洗液 精製後的氟系清洗液 水溶性污染物 (IPA) 166ppm 檢測限度以下 有機性污染物 (Krutox 143AC) 5ppm 檢測限度以下 水分 224ppm 36ppm 從實施例一的結果確認到藉由本發明中的精製裝置精 製具有模擬髒污的氟系清洗液,能獲得高純度的氟系清洗 液。 (實施例二) 首先,調查使用於本發明的清洗系統之未使用的氟系 33 321090 200946254 清洗液中含有何種的污染物,之後,與實施例一同樣地精 製未使用的氟系清洗液,並與實施例一同樣地測量從精製 後的氟系清洗液已去除多少程度的各種污染物,將測量結 果顯示於表二。 作為未使用的氟系清洗液,係使用18L鋼筒的前述 Vertrel XF(註冊商標)。 表二 精製前的氟糸清洗液 精製後的氣糸清洗液 金屬 銅 0. 03ppb 檢測限度以下 鋅 0.14ppb 檢測限度以下 離子 Γ離子 1. 20ppb 檢測限度以下 N(V離子 0. 07ppb 檢測限度以下 HC〇(r離子 0. 03ppb 檢測限度以下 腿+離子 0. 08ppb 0. 02ppb 從實施例二的結果確認到於未使用的氟系清洗液亦含 有複數種類之污染物,藉由精製裝置精製該氟系清洗液, 可獲得更高純度的氟系清洗液。 (產業上的可利用性) 本發明的電子組件的清洗方法與清洗系統雖未限定電 子組件,但特別適合於用以清洗要求以高純度的氟系清洗 液進行高清淨化之石夕晶圓、陶兗晶圓、切斷前述石夕晶圓所 得之矽晶片、切斷前述陶瓷晶圓所得之陶瓷晶片、玻璃基 板、金屬基板、彩色濾光片基板、印刷基板、以及使用該 34 321090 200946254 等之電子組件等電子組件, 氣系清洗液。 且可長期間使用高度清淨化的 【圖式簡單說明】 第1圖係顯示本發明的清洗祕的實卿態1的概略 構成圖。 第2圖係顯示本發明的清洗系統的實施形態2的概略 構成圖。 〇 第3圖係顯示本發明的清洗系統的實施形態3的概略 構成圖。 第4圖係顯示本發明的清洗系統的實施形態4的概 構成圖。 第5圖係顯示本發明的清洗系統的實施形態5的概 構成圖。 第6圖係顯示本發明的清洗系統的實施形態6的 構成圖。 6 # 7 1係_示本發明的清洗祕的實施形態7的概略 構成圖。In the case of the fluorine-based cleaning liquid, it is a water-soluble dyed substance produced by Vertrel (registered trademark) XF (DU 32 321090 200946254 PONT-MITSUI FLUORO CHEMICALS C0MPANY, LTD., manufactured by Kun + 2-propanol (hereinafter referred to as IPA) at 200 ppm by weight. 'And Krutox (registered trademark) 143AC (manufactured by DuPont, Inc.) 5 was used to reset ppm as an organic contaminant to prepare a fluoranthene/month wash with simulated digestion. In the refining device 20 in the figure, the fluorine-based cleaning liquid having the simulated contamination is purified, and the fluorine-based cleaning liquid after the purification is removed by a moisture meter (manufactured by Mitsubishi Chemical Corporation, CA-06 type). The measurement results are shown in Table 1. For the ionic contaminant removal device 24, a molecular sieve 3A (manufactured by UNION SHOWA K.) was used, and a distillation tower was used in the rectification device 25 ( Oldershaw type, 40). Table 1 Fluoride-based cleaning solution before purification, fluorine-based cleaning solution, water-soluble contaminant (IPA) 166ppm Detection limit below organic pollutants (Krutox 143AC) 5ppm inspection The water content of the water is 224 ppm and 36 ppm. The result of the first embodiment is that the fluorine-based cleaning liquid having the simulated soil is purified by the refining device of the present invention, and a high-purity fluorine-based cleaning liquid can be obtained. (Example 2) First, investigation was conducted. In the cleaning system of the present invention, the fluorine-containing 33321090 200946254 is used in the cleaning liquid, and the unused fluorine-based cleaning liquid is purified in the same manner as in the first embodiment, and is measured in the same manner as in the first embodiment. The amount of various contaminants removed from the purified fluorine-based cleaning solution is shown in Table 2. The unused fluorine-based cleaning solution is the above-mentioned Vertrel XF (registered trademark) using an 18-liter steel cylinder.糸 前 检测 检测 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 03 r ion 0. 03ppb detection limit below leg + ion 0. 08ppb 0. 02ppb confirmed from the results of the second example to the unused fluorine-based cleaning solution A fluorine-based cleaning liquid having a higher purity can be obtained by purifying the fluorine-based cleaning liquid by a refining device. (Industrial Applicability) The cleaning method and the cleaning system of the electronic component of the present invention are not The electronic component is limited, but it is particularly suitable for cleaning the silicon wafer, the ceramic wafer, the silicon wafer obtained by cutting the high-purity fluorine-based cleaning solution, cutting the silicon wafer, and cutting the ceramic. A ceramic wafer, a glass substrate, a metal substrate, a color filter substrate, a printed circuit board, and an electronic component such as an electronic component such as the 34321090 200946254, and a gas-based cleaning liquid obtained by the wafer. Further, it is possible to use a high-purity purification for a long period of time. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a schematic configuration of a cleaning state 1 of the present invention. Fig. 2 is a schematic block diagram showing a second embodiment of the cleaning system of the present invention. Fig. 3 is a schematic block diagram showing a third embodiment of the cleaning system of the present invention. Fig. 4 is a view showing the outline of a fourth embodiment of the cleaning system of the present invention. Fig. 5 is a view showing the outline of a fifth embodiment of the cleaning system of the present invention. Fig. 6 is a view showing the configuration of a sixth embodiment of the cleaning system of the present invention. 6 #7 1系 The schematic configuration diagram of the seventh embodiment of the cleaning secret of the present invention.
圖係顯示本發明的清洗系統的實施形態8 的概略 的概略 第9圖係顯示本發明的清洗系統的實施形態9 構成圖。The outline of the embodiment of the cleaning system of the present invention is shown in Fig. 9. Fig. 9 is a view showing the configuration of the cleaning system of the present invention.
10、 10A、10B 11、 110主體 、10A、10B、1〇c、 100、100A、100B、100C 清洗裝置 11a 蓋體 321〇9〇 35 20094625410, 10A, 10B 11, 110 main body, 10A, 10B, 1〇c, 100, 100A, 100B, 100C cleaning device 11a cover 321〇9〇 35 200946254
12a、150a 13a、130a 14a ' 140a 12、 120清洗槽 13、 130洗滌槽 14、 140a蒸氣凝結部 14b、140b排水槽部 14c、22、140c、220 水分離器 17 淋浴喷嘴 20、200 21、210向流型水接觸管柱 21a、210a 23、 230吸濕材料管柱 24、 240離子性污染物去除管柱 25、 160 蒸餾塔 26、260 28 分歧配管 27a、28a 加熱器 超音波產生機 凝結管 精製裝置 給料斗 過渡器 開閉閥12a, 150a 13a, 130a 14a '140a 12, 120 cleaning tank 13, 130 washing tank 14, 140a vapor condensation portion 14b, 140b drainage groove portion 14c, 22, 140c, 220 water separator 17 shower nozzle 20, 200 21, 210 Flowing water contact column 21a, 210a 23, 230 moisture absorbing material column 24, 240 ionic contaminant removal column 25, 160 distillation column 26, 260 28 branching pipe 27a, 28a heater ultrasonic generator condensing pipe Refining device feed hopper transition open/close valve
30 再生裝置 31 循環配管 41 精製用缓衝槽 42 再生用緩衝槽 120a 加熱器或超音波產生機 150 蒸氣產生槽30 Regeneration device 31 Recirculation piping 41 Refining buffer tank 42 Regeneration buffer tank 120a Heater or ultrasonic generator 150 Vapor generation tank
C 含氟有機清洗劑組成物液(氟系清洗液) S 蒸氣層 36 321090C Fluorine-containing organic cleaning agent composition liquid (fluorine-based cleaning solution) S vapor layer 36 321090
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI512818B (en) * | 2013-06-17 | 2015-12-11 | Motech Ind Inc | Cleaning apparatus for silicon wafer |
| TWI571320B (en) * | 2015-07-27 | 2017-02-21 | 盟立自動化股份有限公司 | Basin for washing a plate member |
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| CN102847480B (en) * | 2012-09-19 | 2014-07-30 | 北京七星华创电子股份有限公司 | Chemical liquid mixing device and method |
| JP6898073B2 (en) * | 2016-05-24 | 2021-07-07 | 株式会社Screenホールディングス | Substrate processing equipment and substrate processing method |
| CN107065947A (en) * | 2017-02-27 | 2017-08-18 | 环境保护部华南环境科学研究所 | The intelligent water-controlled equipment and its automatic control water method of batch (-type) backwash plating piece |
| CN108296216A (en) * | 2018-04-03 | 2018-07-20 | 湖州五石科技有限公司 | A kind of silicon wafer cleaning method |
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| US4952386A (en) * | 1988-05-20 | 1990-08-28 | Athens Corporation | Method and apparatus for purifying hydrogen fluoride |
| JP3374256B2 (en) * | 1992-12-18 | 2003-02-04 | 東京エレクトロン株式会社 | Heat treatment apparatus and cleaning method thereof |
| JP2002012894A (en) * | 2000-06-28 | 2002-01-15 | Asahi Kasei Corp | Low flammable cleaning agent, cleaning method and cleaning apparatus |
| JP2004284903A (en) * | 2003-03-24 | 2004-10-14 | Hamada Heavy Industries Ltd | Manufacturing method of high purity zinc carbonate |
| JP4635527B2 (en) * | 2004-09-08 | 2011-02-23 | 三菱化学エンジニアリング株式会社 | Method for recovering hydrofluoric acid |
| JP4581618B2 (en) * | 2004-10-14 | 2010-11-17 | 三菱化学エンジニアリング株式会社 | Method for recovering hydrofluoric acid |
| WO2007126120A1 (en) * | 2006-04-27 | 2007-11-08 | Jfe Chemical Corporation | Method for processing plastic and apparatus therefor |
| JP2008034779A (en) * | 2006-06-27 | 2008-02-14 | Dainippon Screen Mfg Co Ltd | Substrate processing method and substrate processing apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI512818B (en) * | 2013-06-17 | 2015-12-11 | Motech Ind Inc | Cleaning apparatus for silicon wafer |
| TWI571320B (en) * | 2015-07-27 | 2017-02-21 | 盟立自動化股份有限公司 | Basin for washing a plate member |
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