200933081 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種如申請專利範圍第1項前言所述之機場 照明裝置，其具有至少一發光二極體。 【先前技術】 爲了使飛機例如在黑暗中和煙霧中起飛和降落，起飛-和 降落軌道須使用一種所謂機場照明裝置，其例如可標示各 軌道之側面邊界、中央、起始處和終止處以及亦可標示個 別的區段。於是’此種照明裝置必須符合官方的規定且應 具有高的可靠性和壽命。 【發明內容】 本發明之特定實施形式之至少一目的是提供一種具有至 少一發光二極體之機場照明裝置。 上述目的以具有申請專利範圍獨立項第1項之特徵的物 件來達成。該物件之·有利的實施形式和其它形式描述在$ 請專利範圔各附屬項中’且說明書及圖式另外'描述於·下° 依據一種實施形式，該機場照明裝置特別是包括： _第一基體上的至少一第一發光二極體（LED)， -第一導熱管’其具有傳熱媒體， -第一冷卻體，以及 .外殼，其中配置著第一基體和第一導熱管，其中 _第一導熱管熱耦合至第一基體上和第一冷卻體上，且 -傳熱媒體可在第一導熱管中循環’使至少一第一發光二 200933081 極體在操作時所產生的熱可由第一基體排出至第一冷卻 am 體。 機場照明裝置中通常使用鹵素燈或鹵素-反射燈以產生 光。這些燈通常具有數百。c之高的操作溫度且因此具有高 的熱損耗功率。與鹵素燈相比較下，LED s可具有小很多的 熱損耗功率且同時具有高的壽命和可靠性。然而，在此處 所述的機場照明裝置中爲了使一 LED達成一種像至少一第 —LED —樣長的壽命，該LED之產生光的各層中的溫度須 ❹ 持續保持在一種臨界（critical)極限下，使該LED中不會發 生過早的劣化效應，否則會使壽命縮短。例如，LED中的 阻止層之溫度在一種持續操作中須保持在125t之溫度下 且較佳是保持在90°C以下。當鹵素-反射燈中習知的冷卻體 太小而不能有效地冷卻且至少一 LED在操作時所產生的熱 不能足夠有效地經由金屬·電路板或藉由外殼上的自由對 流（convection)而排出時，可藉第一熱導管使至少一 LED操 Q 作時所產生的熱有效地由第一基體傳導至第一冷卻體。 至少一第一 LED可配置在第一基體上，使該至少一第一 LED可與第一基體形成熱接觸。該至少一第一 LED在操作 時所產生的熱因此可經由一具有第一基體的接觸面而轉送 至第一基體。藉由第一基體與第一導熱管之間的熱接觸， 熱可另外轉送至第一導熱管。於是，第一導熱管可具有第 一部份區域和第二部份區域，使熱可藉該傳熱媒體而由第 —部份區域輸送至第二部份區域中。特別有利的是，第一 200933081 部份區域和第二部份區域是該導熱管之互相面對的側面或 末端。第一部份區域因此可與第一基體形成熱接觸’第二 部份區域則可與第一冷卻體形成熱接觸。第一導熱管可另 外具有一種由一外壁完全包圍著的內體積，此內體積中存 在著該傳熱媒體。 第一部份區域較佳是配置在該導熱管之第一末端上。第 —導熱管特別適合用來在第一部份區域中使熱（即’熱能） 由該至少一第一 led傳送至該傳熱媒體。於此’該傳熱媒 體在第一部份區域中至少一部份由第一狀態轉換成第二狀 態，其中第一和第二狀態例如可以是不同的聚集（Aggregate) 狀態。特別是第一狀態可包括一種固體相（Phase)及/或流體 相，第二狀態具有一種蒸氣形式的相。這表示：該傳熱媒 體在第一部份區域中可藉由對熱源之熱的吸收而蒸發或昇 華。於是，該傳熱媒體可在第一部份區域中具有第一蒸氣 壓。另一方式是，第一狀態亦可包括一種蒸氣形式的相’ Q 此時第二狀態的密度較佳是小於第一狀態之蒸氣形式之相 的密度。 該傳熱媒體之至少一部份是在吸收第一部份區域中的熱 之後處於第二狀態中，然後，傳熱媒體之該至少一部份可 例如藉由對流作用而移動至第二部份區域，其較佳是配置 在該導熱管之第二末端上。第二部份區域中該傳熱媒體又 藉由熱的排出（即，冷凝或再昇華），由第二狀態轉換成第 一狀態。特別是該傳熱媒體在第二部份區域中亦可具有第 -7- 200933081 二蒸氣壓，其小於第一蒸氣壓。藉由該傳熱媒體之轉變所 釋放的熱可由第二部份區域排出至環境（特別是第一冷卻 體）中。 特別是以上所描述的作用原理是以第一部份區域所具有 的溫度高於第二部份區域的溫度作爲條件。 然後，第二部份區域中處於第一狀態的該傳熱媒體例如 可藉由一種力或多種力（大致上是重力及/或毛細管作用力） 之作用而傳送回到第一部份區域中。特別是適合使用網狀 結構、燒結體結構、凹槽或切口或這些形式的組合（其配置 在該內體積中或以圍繞該內體積的方式配置在該導熱管 中），俾藉由毛細管作用力，將該傳备媒體由第二部份區域 輸送至第一部份區域中。 例如，第一導熱管可依據上述原理，藉該傳熱媒體來傳 導熱能，此第一導熱管可以是（或包括）一種熱虹吸管或特 別是包括一種熱管。此種依據上述原理來操作的導熱管可 有利地以經濟的方式，在不需其它的能量消耗下，有效率 地將熱能由第一部份區域傳送至第二部份區域。特別是， 機場照明裝置可具有一種熱管以作爲第一導熱管，其在藉 由該傳熱媒體有效率地傳熱時，可具有一種在該機場照明 裝置操作時所需的安裝定向（orientation)，這與機場的重力 方向及/或延伸方向有關。這特別是表示：第一導熱管在該 機場照明裝置之上述安裝狀態中水平地由第一基體延伸至 第一冷卻體。 200933081 第一導熱管可具有一種長棒形的形式。於此，第一導熱 管特別是可具有一種垂直於縱軸的圓形橫切面。第一導熱 管之第一和第二部份區域因此以有利的方式，藉由棒形的 末端區來形成。替代或附加地，第一導熱管亦可具有橢圓 形或η角形的橫切面，其中η是大於3或等於3之整數。 此外，第一導熱管亦可具有多個互相分離的內體積，內體 積中具有該傳熱媒體。第一導熱管亦可具有多個導熱管， 其可互相獨立地與第一基體、第一冷卻體都形成熱接觸或 © 亦可整合成一種共同的構件，例如，可形成二個依據長度 而連接的棒形導熱管。此外，第一導熱管亦可具有一種延 伸的形式或一種至少 ;在一部份區域中彎曲的形式。 第一導熱管在熱性上耦合至第一基體和第一冷卻體，這 特別是表示：第一導熱管之第一部份區域是與第一基體形 成熱接觸，且因此亦與配置在第一基體上的至少一第一 LED形成熱接觸，以及第一導熱管之第二部份區域是與第 _ —冷卻體形成熱接觸。 © 上述熱接觸或熱耦合可藉由機械式的接觸來達成，例 如，藉由第一導熱管、第一基體和第一冷卻體上的接觸面 或接觸區來達成。特別是第一基體及/或第一冷卻體因此可 具有一種鑽孔、凹槽或開口，以形成接觸面，第一導熱管 的一部份向內伸入至該鑽孔、凹槽或開口中及/或第一導熱 管的一部份延伸至該鑽孔、凹槽或開口中。於是，可另外 藉由一種導熱的連接媒體，例如，導熱糊及/或一種具有焊 200933081 劑之焊接連接劑使各接觸面或接觸區 得改良’其中該導熱糊塗佈在各接觸 第一導熱管可分別藉由一種可鬆開 第一基體上及/或第一冷卻體上。可鬆 可包括機械固定方式，例如，螺栓、 以上各方式的組合。此外，第一導熱 後不易鬆開或在正常條件下不可鬆開 焊接、熔合、黏合或其組合，連接至 卻體上。第一導熱管亦可藉由二種或 組合，即，螺栓、插接、凸緣、夾緊 連接至第一基體及/或第一冷卻體上。 該傳熱媒體較佳是具有水。另一方 具有乙烷、丙烷、丁烷、戊烷、甲胺 甲苯、丙酮及/或二氧化碳或以上各衫 例如，該傳熱媒體可具有水和冰凍保 〇 使第一導熱管亦可在水的冰點以下， 體仍成流體相。 此外，在與第一導熱管之內體積夕 力比較下，該內體積中主要是存在-還小的壓力。另一方式是，在該內1 環境的空氣壓力還高的壓力。藉由 力，則可與該傳熱媒體之選擇以及 如，長度的選擇一起來調整形式、ϋ 相互之間之熱耦合獲 面或接觸區上。 的固定方式而連接在 開的固定方式特別是 插接、凸緣、夾緊或 管藉由一種在固定之 之固定方式，例如， 第一基體及/或第一冷 多種上述固定方式之 、焊接'熔合、黏合， 式是，該傳熱媒體可 、氨、甲醇、乙醇、 3質之混合物或組合。 護劑，例如，酒精， 有至少一部份傳熱媒 .部的環境中的空氣壓 •種較環境的空氣壓力 [積中亦可存在一種較 調整該內體積中的壓 第一導熱管之尺寸例 :徑及所期望的溫度範 -10- 200933081 圍。該溫度範圍中第一導熱管可有效率地操作。特別是對 機場照明裝置而言由於官方的規定，上述調整需要可靠地 且持續地在-55 °C至+55 °C之溫度範圍中操作。 第一導熱管可另外具有一種高導熱性的材料，特別是像 銅或鋁之類的金屬。尤其第一基體亦可具有一種高導熱性 的材料，特別是像銅或鋁之類的金屬。此外，第一基體例 如亦可以是或具有一種金屬核心電路板，例如，鋁核心電 路板。於是’第一基體可具有像安裝面或導電軌之類的機 〇 械性或電性接觸區和接觸面，藉此可在機械上和電性上連 接該至少一第一 LED。 此外’第一冷卻體可形成該外殼的至少一部份，其中在 第一基體上配置該至少一第一 LED。這表示：第一冷卻體 例如可形成該外殻壁之一部份，其在該機場照明裝置之環 境的第一基體上鄰接於該至少一第一 LED。於是，可確保 該至少一第一LED之熱可有效率地經由第一基體、第一導 Q 熱管和第一冷卻體而排出至該機場照明裝置之環境中。 第一冷卻體可圍繞第一基體而形成且配置著。此種形式 的第一冷卻體因此可節省空間地配置在第一基體之周圍， 以形成一種緊密的機場照明裝置。特別是第一冷卻體可包 圍著第一基體，這樣可以相同形式，將第一冷卻體之熱對 稱地排出至該機場照明裝置之環境中。例如，第一冷卻體 可以是圓柱形，其具有圓形、橢圓形或三角形或多角形的 橫切面或這些形式的組合。 -11- 200933081 此外，第一冷卻體具有一種像銅或鋁之類的金屬之高導 熱性的材料。特別是當第一冷卻體之表面相對於體積之比 較高時是有利的。因此，該冷卻體較佳是具有凹槽、冷卻 肋、薄片及/或鰭片。於是，可大面積且有效率地將熱排出 至環境中。例如，第一冷卻體可在一遠離第一基體之外表 面上，以圍繞第一基體之方式具有多個凹槽、冷卻肋、薄 片及/或鰭片。特別是當第一冷卻體形成該外殼之至少一部 份時，則該凹槽、冷卻肋、薄片及/或鰭片亦可配置在該外 Ο 殼之外側上，即，該外殼壁之外側上。 除了第一冷卻體之外，第一基體本身亦可具有第二冷卻 體。於是，第一基體亦可形成第二冷卻體，其上配置著該 至少一第一 LED。除了經由第一導熱管和第一冷卻體將熱 排出以外，第二冷卻體可使該至少一第一 LED之排熱量提 高。由於第一冷卻體和第二冷卻體配置在該機場照明裝置 之外殼中，則該至少一第一 LED之熱可經由第二冷卻體而 Q 排出至該外殼的內空間中。這在下述情況下是有利的，即： 當配置該機場照明裝置的環境中的溫度低到使第一導熱管 中該傳熱媒體在該至少一第一 led未操作時，完全或至少 一大部份被冷凍’致使緊接在該至少一第一LED起動之 後，該導熱管中的傳熱媒體不能循環或不能充份地循環， 因此不能將該至少一第一 LED所產生的熱有效率地排出至 第一冷卻體。藉第二冷卻體，該至少一第一LED所產生的 熱可排出至該外殼的內體積中，且因此重新分佈，使該外 -12- 200933081 殼中的溫度以及第一導熱管中的溫度可較環境溫度還高， 使第一導熱管中的傳熱媒體又可充份地循環。替代或附加 地，可在該外殻中配置一加熱元件以對第一導熱管加熱， 使第一導熱管加熱至排熱時所需的操作溫度》特別是，該 操作溫度可藉該傳熱媒體之熔點或沸點溫度來設定。 在上述機場照明裝置中，該至少一第一LED之電功率不 必因該外殻中該LED之可防止的過熱危險性而受到限制。 反之，該至少一第一 LED所具有的電功率可大於20瓦。就 像在高功率-LED中一樣，此處描述的排熱作用可藉第一導 熱管和第一冷卻體，使該機場照明裝置實現長的使用壽命。 此外，該至少一第一LED亦可以是或包括一種LED陣 列，其是在第一基體上由多個相同形式或不同的LED所形 成的配置。該至少一第一 LED或LED陣列之LEDs較佳是 可發出一種在可見波長範圍中的光，此光在觀看者中造成 一種彩色的、混合彩色的或白色的發光印象。此種LED陣 Q 列和LEDs之特徵已爲此行的專家所知悉，因而此處不再贅 述。 第一基體上除了該至少一第一 LED之外，該機場照明裝 置在第二基體上亦可具有至少一第二LED。此外，該機場 照明裝置可具有一第二導熱管，其熱耦合至第二基體及第 一冷卻體上且包括一傳熱媒體，其在該至少一第二LED操 作時，可在第二導熱管中循環。於是，由該至少一第二LED 所產生的熱可由第二基體排出至第一冷卻體中。 -13- 200933081 第二基體可具有像上述第一基體的特徵。第二導熱 具有像上述第一導熱管之特徵。該至少一第二led可 像上述至少一第一 LED之特徵。 特別是第一基體和第二基體須配置在該外殻中’使 少一第一 LED和該至少一第二LED在操作時，可在相 向或不同的方向中發出光束。 上述機場照明裝置之其它優點和有利的實施形式將 在以下第1至2B圖所示的實施形式中。 【實施方式】 各實施例和圖式中相同或作用相同的各組件分別標 同的參考符號。所示各元件和各元件i間的比例未必 例繪出，反之，爲了清楚及/或更容易理解之故各圖式 些細節，例如，層、構件、組件和區域已予放大地顯元 第1圖顯示機場照明裝置100之一實施例。其配置 凹口 97中的機場98上，機場98大致上包括起飛軌道 Q 落軌道或滑行軌道。多個此種下降至底部中的機場照 置100例如可顯示出機場98之多個邊界或中線。 機場照明裝置100具有至少一第一 LED，其在沿箭 所示的方向中發出光束。該至少一第一LED可依據機 之形式而發出一種具有官方預設的彩色和發射特性的 典型地，該機場照明裝置在滑行軌道的邊緣顯示藍光 在起飛-和降落軌道之邊緣發出白色的光。中線標示用 場照明裝置例如亦可依據一起飛軌道或降落軌道之位 管可 具有 該至 同方 描述 以相 依比 的一 :出。 在一 或降 明裝 頭99 場98 光。 ，且 的機 置而 -14- 200933081 發出白光、白色-和紅色光或紅色光。爲了達成官方規定的 亮度’該至少一第一 LED 1具有大於20瓦的功率。另一方 式是，該至少一第一 LED 1亦可以LED陣列（即，多個LEDs) 來形成，其都具有所需的發射特性和亮度》 該至少—第一 LED 1配置在第一基體2上，第一基體2 用作機械式載體，且具有電性導線以連接至該至少一第一 LED。於本實施例中，第一基體2以鋁核心基板來構成， 其與該至少一第一 LED 1形成熱接觸。 〇 於第一導熱管3之內體積中，具有傳熱媒體31之第一導 熱管3是與第一基體2和第一冷卻體4形成熱接觸。須形 成導熱管3，使該傳熱媒體31可在該導熱管3之內體積中 循環，且在該至少一第一 LED 1操作時所產生的熱可排出 至第一冷卻體4。 此外，該機場照明裝置100包括一外殼5,其具有一蓋部 51和一下部52,此二部包含一外殼內體積50»該至少一第 Q 一 LED 1配置在第一基體2上，且第一導熱管3配置在該 外殼5內部》須形成第一冷卻體4,使藉第一導熱管3，由 該至少一第一 LED 1排出至第一冷卻體4上的熱可排出至 環境中，本實施例中該熱是排出至機場98之凹口 97中。於 此，第一冷卻體4是與該外殼5之下部52之壁形成熱接觸。 此外，該外殼內體積50中安裝一加熱元件（未顯示），其 用來將第一導熱管2加熱至一種排熱時所需的操作溫度， 已如上所述。 -15- 200933081 其它光學-、電性-和機械構件，例如，蓋部5 1中的視窗、 透鏡、電性導線和此處所述的各構件用的組件或機械固定 裝置爲了清楚之故而未顯示。然而，這些組件可另外配置 在該外殻內體積50中。此外，該外殼50外部之凹口 97中 例如亦可配置電性導線及/或組件，例如，電晶體，且經由 適當的插接及/或導引（未顯示）而延伸至該機場照明裝置 100 中。 除了此處所示之下降至底部中的機場照明裝置100之 外，該機場照明裝置100例如亦可配置在機場98上方之一 支持裝置，例如，柱子上。 第2A, 2B圖中顯示機場照明裝置之另一實施例200之三 維空間顯示圖，其中第2A圖在與第1圖比較下，只顯示該 外殼5之下部52，爲了清楚起見，該蓋部51已省略。第 2B圖在與第2A圖比較下爲了較容易理解而只顯示第2A圖 中配置在該外殻5內部中的組件。以下的描述同時針對第 2A和2B圖。 機場照明裝置2 00具有一冷卻體4,其形成該外殼之下部 5 2之一部份。此冷卻體4具有圓柱形的形式，且包圍著一 外殼內體積50，其中在第一基體2上配置著第一 LEDs 1 ’ 且在第二基體7上配置著多個第二LEDs 6。這些多個第一 LEDs 1和多個第二LEDs 6中分別顯示例如二個LEDs，其 分別具有光學元件以使射束成形。這些第一LEDs 1和第二 LEDs 6配置成在互相不同的方向中可獨立地發出光束。 -16- 200933081 第一基體2和第二基體7分別形成第二冷卻體，其分別 具有冷卻薄片21或71，這樣可使LEDs 1或LEDs 6操作時 所產生的熱的至少一部份以上述方式排出至該外殻內體積 50中。 第一導熱管3是與第一基體2在熱性上相連接，此時第 一導熱管3之末端插入至第一基體之開口中’且第一導熱 管3由第一基體2偏移而以彎曲的形式延伸至第一冷卻體 4。第一導熱管3具有類似螺旋狀的形式，其依據第一冷卻 體4之與第一和第二基體2，7相面對的內側的形式來調 整。第一導熱管3因此以圍繞第一基體2的形式而沿著第 一冷卻體4之內面來配置著。第一冷卻體4另外λ有一切 口，切口中沿著第一冷卻體4之大約內周的一半而配置著 第一導熱管3。這樣就可在第一導熱管3和第一冷卻體4 之間形成大面積的熱接觸。 第二導熱管8在熱性上與第二基體7相連接，其中第二 Q 導熱管8插入至第二基體7之開口中，且第二導熱管8就 像第一導熱管3 —樣，具有類似螺旋的形式，且同樣配置 在第一冷卻體4中的切口中。第一導熱管3因此沿著第一 冷卻體4之內面而延伸至第二基體7,第二導熱管8則沿著 第一冷卻體4之內面而延伸至第一基體2。特別是由第2B 圖可知，第一和第二基體2, 7以及第一和第二導熱管3’ 8 可最緊密地配置在該外殼內體積50中，且同時可在導熱管 3 ’ 8和第一冷卻體4之間分別達成大面積的熱接觸。 -17- 200933081 導熱管2，7在本實施例中就像上述之熱管一樣配置在 LEDs 1，6之高度處或亦可配置在其下方。在機場照明裝置 200之一種安裝狀態中，如第1圖所示’導熱管3 ’ 8沿著 第一冷卻體4而在水平方向中延伸。”水平”相對於重力方 向的關係已定義在該機場照明裝置200之一種安裝狀態 中。這表示：該機場照明裝置200之安裝定向在本實施例 中須使第一冷卻體4之圓柱軸在安裝狀態下平行於該重力 方向。 ❹ 冷卻體在遠離第一和第二基體2，7之外表面’即，該外 殼的外側上，以圍繞各基體2，7的方式具有多個冷卻肋 41。於是，第一冷卻體4可大面積地熱耦合至環境中，且 因此亦使該機場照明裝置200之外殻可大面積地熱耦合至 環境中，該環境大致上是指第1圖所示之機場之凹口。因 此，可確保該第一冷卻體4能有效地將熱排出至環境中。 除了所示的垂直式冷卻肋之外，替代或附加地，第一冷卻 〇 體4亦可具有水平的或傾斜地在徑向中圍繞該外殼內體積 50的冷卻肋或冷卻薄片。 本發明當然不限於依據各實施例中所作的描述。反之， 本發明包含每一新的特徵和各特徵的每一種組合，特別是 包含各申請專利範圍-或不同實施例之各別特徵之每一種 組合，當相關的特徵或相關的組合本身未明顯地顯示在各 申請專利範圍中或各實施例中時亦屬於本發明。 -18. β 200933081 【圖式簡單說明】 第1圖係機場照明裝置之一實施例的圖解。 第2Α和2Β圖係機場照明裝置之另一實施例的圖解。 【主要元件符號說明】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an airport lighting device as described in the preamble of claim 1, which has at least one light emitting diode. [Prior Art] In order to take off and land an aircraft, for example, in the dark and in smoke, the take-off and landing orbits shall use a so-called airport lighting device, which may, for example, indicate the lateral boundaries, the center, the start and the end of each track, and Individual sections can also be marked. Therefore, such lighting devices must comply with official regulations and should have high reliability and longevity. SUMMARY OF THE INVENTION At least one object of certain embodiments of the present invention is to provide an airport lighting device having at least one light emitting diode. The above object is achieved by an object having the features of item 1 of the independent scope of the patent application. Advantageous embodiments and other forms of the object are described in the appended claims, and the description and drawings are additionally described in the following. According to one embodiment, the airport lighting device comprises, in particular: At least one first light-emitting diode (LED) on a substrate, a first heat transfer tube having a heat transfer medium, a first heat sink, and a casing, wherein the first substrate and the first heat pipe are disposed Wherein the first heat pipe is thermally coupled to the first substrate and the first heat sink, and the heat transfer medium can be circulated in the first heat pipe to cause at least one first light emitting diode 200933081 to be generated during operation. Heat may be discharged from the first substrate to the first cooling am body. Halogen lamps or halogen-reflecting lamps are commonly used in airport lighting to produce light. These lights usually have hundreds. The operating temperature of c is high and therefore has a high heat loss power. Compared to halogen lamps, LEDs can have much smaller heat loss power and at the same time have high lifetime and reliability. However, in the airport lighting device described herein, in order for an LED to achieve a life like at least one first LED, the temperature in each layer of the LED that generates light must be maintained at a critical value. Under the limit, the premature degradation effect does not occur in the LED, otherwise the life will be shortened. For example, the temperature of the barrier layer in the LED must be maintained at a temperature of 125 t and preferably maintained below 90 ° C in a continuous operation. Conventional heat sinks in halogen-reflecting lamps are too small to be effectively cooled and the heat generated by at least one LED during operation cannot be sufficiently efficiently via a metal circuit board or by free convection on the outer casing. When discharging, the heat generated by the at least one LED can be effectively conducted by the first heat pipe from the first substrate to the first heat sink. The at least one first LED can be disposed on the first substrate such that the at least one first LED can be in thermal contact with the first substrate. The heat generated by the at least one first LED during operation can thus be transferred to the first substrate via a contact surface having the first substrate. Heat can be additionally transferred to the first heat pipe by thermal contact between the first substrate and the first heat pipe. Thus, the first heat transfer tube can have a first partial region and a second partial region, so that heat can be transferred from the first partial region to the second partial region by the heat transfer medium. It is particularly advantageous that the first portion of the first portion of the 200933081 and the second portion of the region are the mutually facing sides or ends of the heat pipe. The first partial region is thus in thermal contact with the first substrate. The second portion of the region is in thermal contact with the first heat sink. The first heat pipe may additionally have an inner volume completely surrounded by an outer wall in which the heat transfer medium is present. The first portion of the region is preferably disposed on the first end of the heat pipe. The first heat pipe is particularly suitable for transferring heat (i.e., 'thermal energy) from the at least one first led to the heat transfer medium in the first partial region. The heat transfer medium converts at least a portion of the first partial region from the first state to the second state, wherein the first and second states may be, for example, different Aggregate states. In particular, the first state may comprise a solid phase and/or a fluid phase and the second state has a phase in the form of a vapor. This means that the heat transfer medium can evaporate or sublime in the first partial region by absorption of heat from the heat source. Thus, the heat transfer medium can have a first vapor pressure in the first partial region. Alternatively, the first state may also include a phase in the form of a vapor. Q The density of the second state is preferably less than the density of the vapor phase of the first state. At least a portion of the heat transfer medium is in a second state after absorbing heat in the first partial region, and then the at least a portion of the heat transfer medium can be moved to the second portion by, for example, convection The portion is preferably disposed on the second end of the heat pipe. In the second partial region, the heat transfer medium is again switched from the second state to the first state by thermal discharge (i.e., condensation or sublimation). In particular, the heat transfer medium may have a vapor pressure of -7-200933081 in the second partial region, which is less than the first vapor pressure. The heat released by the transition of the heat transfer medium can be discharged to the environment (especially the first heat sink) by the second partial region. In particular, the principle of action described above is based on the condition that the temperature of the first partial region is higher than the temperature of the second partial region. Then, the heat transfer medium in the first state in the second partial region can be transferred back to the first partial region by, for example, a force or a plurality of forces (generally gravity and/or capillary force). . In particular, it is suitable to use a mesh structure, a sintered body structure, a groove or a slit or a combination of these forms (which are disposed in the inner volume or in a manner surrounding the inner volume), by capillary action The force is transported from the second partial area to the first partial area. For example, the first heat pipe can transfer thermal energy through the heat transfer medium according to the above principle. The first heat pipe can be (or include) a thermosiphon or, in particular, a heat pipe. Such a heat pipe operated in accordance with the above principles advantageously enables efficient transfer of thermal energy from the first partial region to the second partial region in an economical manner without the need for additional energy consumption. In particular, the airport lighting device can have a heat pipe as the first heat pipe that, when efficiently transferred by the heat transfer medium, can have an installation orientation required for operation of the airport lighting device. This is related to the direction of gravity and/or the direction of extension of the airport. This means in particular that the first heat pipe extends horizontally from the first substrate to the first heat sink in the above-described mounted state of the airport lighting device. 200933081 The first heat pipe can have a long rod shape. Here, the first heat pipe may in particular have a circular cross section perpendicular to the longitudinal axis. The first and second partial regions of the first heat-conducting tube are thus formed in an advantageous manner by the end regions of the bars. Alternatively or additionally, the first heat transfer tube may also have an elliptical or etagonal cross section, where n is an integer greater than 3 or equal to 3. Further, the first heat transfer tube may have a plurality of mutually separated inner volumes having the heat transfer medium in the inner volume. The first heat pipe may also have a plurality of heat pipes, which may be in thermal contact with the first substrate and the first heat sink independently of each other or may be integrated into a common member, for example, two depending on the length. Connected rod-shaped heat pipe. Furthermore, the first heat transfer tube can also have an extended form or a form of at least a bend in a partial area. The first heat pipe is thermally coupled to the first substrate and the first heat sink, which means that the first portion of the first heat pipe is in thermal contact with the first substrate, and thus is also disposed in the first At least one first LED on the substrate forms a thermal contact, and a second portion of the first heat pipe is in thermal contact with the first heat sink. © The above thermal contact or thermal coupling can be achieved by mechanical contact, for example, by the contact surface or contact area on the first heat pipe, the first substrate and the first heat sink. In particular, the first base body and/or the first heat sink can thus have a bore, a recess or an opening to form a contact surface into which a portion of the first heat pipe extends inwardly into the bore, groove or opening. A portion of the middle and/or first heat pipe extends into the bore, the recess or the opening. Thus, each contact surface or contact region can be modified by a thermally conductive connecting medium, such as a thermally conductive paste and/or a soldering agent having a solder 200933081 agent, wherein the thermally conductive paste is applied to each of the first heat pipes. The first base body and/or the first heat sink can be loosened by a type. The cork can include mechanical fastening means, such as bolts, combinations of the above. In addition, after the first heat conduction, it is not easy to loosen or under normal conditions, it cannot be loosened, welded, fused, bonded or a combination thereof, and connected to the body. The first heat pipe may also be connected to the first substrate and/or the first heat sink by two or combinations, i.e., bolts, plugs, flanges, and clamps. The heat transfer medium preferably has water. The other side has ethane, propane, butane, pentane, methylamine toluene, acetone and/or carbon dioxide or above. For example, the heat transfer medium may have water and freeze protection so that the first heat pipe can also be in water. Below the freezing point, the body remains a fluid phase. In addition, there is mainly a small but small pressure in the inner volume compared to the volume inside the first heat pipe. Another way is that the air pressure in the inner 1 environment is still high. By force, the choice of the heat transfer medium and, e.g., the choice of length, can be used to adjust the form, the thermal coupling surface or the contact area between each other. The fixing means is connected to the opening, in particular the insertion, the flange, the clamping or the tube by means of a fixed manner, for example, the first base body and/or the first cold type of the above-mentioned fixing manner, welding 'Fusion, bonding, the formula, the heat transfer medium, ammonia, methanol, ethanol, a mixture or combination of three. The protective agent, for example, alcohol, has at least a part of the heat medium, the air pressure in the environment, and the air pressure in the environment. [There may also be a first heat pipe that adjusts the pressure in the inner volume. Example of size: diameter and expected temperature range - -10-330330. The first heat pipe in this temperature range can operate efficiently. Especially for airport lighting, due to official regulations, the above adjustments need to be reliably and continuously operated in the temperature range of -55 °C to +55 °C. The first heat pipe may additionally have a material having a high thermal conductivity, particularly a metal such as copper or aluminum. In particular, the first substrate may also have a material having a high thermal conductivity, in particular a metal such as copper or aluminum. Further, the first substrate may be, for example, or have a metal core circuit board such as an aluminum core circuit board. Thus, the first substrate can have mechanical or electrical contact areas and contact faces, such as mounting faces or conductive tracks, whereby the at least one first LED can be mechanically and electrically connected. Further, the first heat sink can form at least a portion of the outer casing, wherein the at least one first LED is disposed on the first substrate. This means that the first heat sink, for example, can form part of the outer casing wall adjacent to the at least one first LED on the first substrate of the environment of the airport lighting device. Thus, it can be ensured that the heat of the at least one first LED can be efficiently discharged into the environment of the airport lighting device via the first substrate, the first Q-think and the first heat sink. The first heat sink may be formed and disposed around the first substrate. This form of first heat sink can thus be spatially arranged around the first substrate to form a compact airport lighting device. In particular, the first heat sink can enclose the first substrate so that the heat of the first heat sink can be symmetrically discharged into the environment of the airport lighting device in the same form. For example, the first heat sink may be cylindrical, having a circular, elliptical or triangular or polygonal cross section or a combination of these forms. -11- 200933081 In addition, the first heat sink has a material having a high heat conductivity of a metal such as copper or aluminum. Especially when the ratio of the surface of the first cooling body to the volume is high, it is advantageous. Therefore, the heat sink preferably has grooves, cooling ribs, sheets and/or fins. Thus, heat can be discharged to the environment over a large area and efficiently. For example, the first heat sink may have a plurality of grooves, cooling ribs, sheets and/or fins on a surface away from the first substrate to surround the first substrate. In particular, when the first heat sink forms at least a portion of the outer casing, the grooves, cooling ribs, sheets and/or fins may also be disposed on the outer side of the outer casing, ie, the outer side of the outer casing wall on. In addition to the first heat sink, the first substrate itself may also have a second heat sink. Thus, the first substrate can also form a second heat sink on which the at least one first LED is disposed. In addition to discharging heat through the first heat pipe and the first heat sink, the second heat sink can increase the heat rejection of the at least one first LED. Since the first heat sink and the second heat sink are disposed in the outer casing of the airport lighting device, the heat of the at least one first LED can be discharged into the inner space of the outer casing via the second heat sink. This is advantageous when the temperature in the environment in which the airport lighting device is configured is low enough that the heat transfer medium in the first heat pipe is not operating at the at least one first led, completely or at least one large The portion is frozen' such that immediately after the at least one first LED is activated, the heat transfer medium in the heat pipe cannot circulate or cannot be fully circulated, so the heat generated by the at least one first LED cannot be efficiently The ground is discharged to the first cooling body. With the second heat sink, the heat generated by the at least one first LED can be discharged into the inner volume of the outer casing, and thus redistributed, so that the temperature in the outer -12-200933081 shell and the temperature in the first heat pipe It can be higher than the ambient temperature, so that the heat transfer medium in the first heat pipe can be fully circulated. Alternatively or additionally, a heating element may be disposed in the outer casing to heat the first heat pipe to heat the first heat pipe to an operating temperature required for heat removal. In particular, the operating temperature may be utilized for the heat transfer. The melting point or boiling point temperature of the medium is set. In the above airport lighting device, the electrical power of the at least one first LED is not necessarily limited by the preventable risk of overheating of the LED in the housing. Conversely, the at least one first LED can have an electrical power greater than 20 watts. As in high power LEDs, the heat rejection described herein allows the airport lighting device to achieve a long service life by means of the first heat pipe and the first heat sink. Additionally, the at least one first LED can also be or include an array of LEDs that are formed from a plurality of identical or different LEDs on the first substrate. The LEDs of the at least one first LED or LED array preferably emit light in the visible wavelength range that creates a colored, mixed color or white illumination impression in the viewer. The characteristics of such LED arrays and LEDs have been known to experts in this field and will not be described here. The airport illumination device may have at least one second LED on the second substrate in addition to the at least one first LED. In addition, the airport lighting device can have a second heat pipe that is thermally coupled to the second substrate and the first heat sink and includes a heat transfer medium that can be in the second heat conduction when the at least one second LED is operated Loop in the tube. Thus, heat generated by the at least one second LED can be discharged into the first heat sink by the second substrate. -13- 200933081 The second substrate may have features like the first substrate described above. The second heat conduction has the features of the first heat pipe as described above. The at least one second LED can be characterized by at least one of the first LEDs. In particular, the first substrate and the second substrate must be disposed in the housing to enable a first LED and the at least one second LED to emit light beams in opposite or different directions during operation. Further advantages and advantageous embodiments of the above described airport lighting device will be in the embodiment shown in Figures 1 to 2B below. [Embodiment] Each component in the embodiment and the same or the same function in the drawings has the same reference numerals. The ratios of the various elements shown and the elements i are not necessarily drawn. Conversely, for the sake of clarity and/or easier understanding, details of the various figures, such as layers, components, components and regions, have been enlarged. 1 shows an embodiment of an airport lighting device 100. At the airport 98 in the configuration of the recess 97, the airport 98 generally includes a takeoff track Q drop track or a slide track. A plurality of such airport views 100 that are lowered into the bottom can, for example, display multiple boundaries or midlines of the airport 98. The airport lighting device 100 has at least a first LED that emits a beam of light in the direction shown by the arrow. The at least one first LED can typically emit an officially preset color and emission characteristic in the form of a machine that displays blue light at the edge of the taxi track and emits white light at the edge of the take-off and landing track . The center line indicating the field illuminating device, for example, may also have a one-to-one ratio according to the same description of the flying or falling track. 98 lights in 99 fields in one or lower head. And the machine -14- 200933081 emits white light, white-and red or red light. In order to achieve an officially specified brightness, the at least one first LED 1 has a power greater than 20 watts. Alternatively, the at least one first LED 1 can also be formed by an LED array (ie, a plurality of LEDs) having the desired emission characteristics and brightness. The at least one first LED 1 is disposed on the first substrate 2 The first substrate 2 serves as a mechanical carrier and has electrical leads for connection to the at least one first LED. In this embodiment, the first substrate 2 is formed of an aluminum core substrate that is in thermal contact with the at least one first LED 1. In the inner volume of the first heat transfer pipe 3, the first heat transfer pipe 3 having the heat transfer medium 31 is in thermal contact with the first base body 2 and the first heat sink body 4. The heat transfer tube 3 is formed such that the heat transfer medium 31 can circulate in the inner volume of the heat transfer tube 3, and heat generated when the at least one first LED 1 is operated can be discharged to the first heat sink 4. In addition, the airport lighting device 100 includes a casing 5 having a cover portion 51 and a lower portion 52, the two portions including an inner casing volume 50»the at least one Q-th LED 1 disposed on the first base body 2, and The first heat pipe 3 is disposed inside the outer casing 5 to form a first heat sink 4, so that the heat discharged from the at least one first LED 1 to the first heat sink 4 can be discharged to the environment by the first heat pipe 3. In the present embodiment, the heat is discharged into the recess 97 of the airport 98. Thus, the first heat sink 4 is in thermal contact with the wall of the lower portion 52 of the outer casing 5. In addition, a heating element (not shown) is mounted in the inner volume 50 of the housing for heating the first heat pipe 2 to an operating temperature required for heat removal, as described above. -15- 200933081 Other optical, electrical and mechanical components, for example, windows, lenses, electrical conductors in the cover 5 1 and components or mechanical fixtures for the various components described herein are not clear display. However, these components can be additionally configured in the volume 50 within the housing. In addition, electrical recesses and/or components, such as transistors, may be disposed in the recess 97 outside the outer casing 50, and extended to the airport lighting device via appropriate plugging and/or guiding (not shown). 100 in. In addition to the airport lighting device 100 that is lowered to the bottom as shown here, the airport lighting device 100 can be configured, for example, on one of the support devices above the airport 98, such as a pole. 2A, 2B shows a three-dimensional spatial display of another embodiment 200 of an airport lighting device, wherein FIG. 2A shows only the lower portion 52 of the outer casing 5 in comparison with the first drawing, the cover being shown for clarity. The part 51 has been omitted. Fig. 2B shows only the components disposed in the interior of the casing 5 in Fig. 2A for easier understanding in comparison with Fig. 2A. The following description refers to both Figures 2A and 2B. The airport illuminator 200 has a heat sink 4 which forms part of the lower portion 52 of the casing. The heat sink 4 has a cylindrical form and encloses an inner volume 50 in which a first LED s 1 ′ is disposed on the first substrate 2 and a plurality of second LEDs 6 are disposed on the second substrate 7 . Each of the plurality of first LEDs 1 and the plurality of second LEDs 6 respectively displays, for example, two LEDs each having an optical element to shape the beam. These first LEDs 1 and second LEDs 6 are configured to independently emit light beams in mutually different directions. -16- 200933081 The first base body 2 and the second base body 7 respectively form a second heat sink having cooling fins 21 or 71, respectively, such that at least a portion of the heat generated by the operation of the LEDs 1 or LEDs 6 is as described above The mode is discharged into the volume 50 within the housing. The first heat pipe 3 is thermally connected to the first substrate 2, at which time the end of the first heat pipe 3 is inserted into the opening of the first substrate and the first heat pipe 3 is offset by the first substrate 2 The curved form extends to the first heat sink 4 . The first heat transfer tube 3 has a spiral-like form which is adjusted in accordance with the inner side of the first cooling body 4 facing the first and second base bodies 2, 7. The first heat transfer pipe 3 is thus arranged along the inner face of the first heat sink 4 in a form surrounding the first base body 2. The first cooling body 4 has a further λ, and the first heat transfer pipe 3 is disposed along the half of the inner circumference of the first cooling body 4 in the slit. This makes it possible to form a large area of thermal contact between the first heat pipe 3 and the first heat sink 4. The second heat pipe 8 is thermally connected to the second substrate 7, wherein the second Q heat pipe 8 is inserted into the opening of the second substrate 7, and the second heat pipe 8 is like the first heat pipe 3, It is in the form of a spiral and is also arranged in the slit in the first heat sink 4. The first heat pipe 3 thus extends along the inner face of the first heat sink 4 to the second base body 7, and the second heat pipe 8 extends along the inner face of the first heat sink body 4 to the first base body 2. In particular, it can be seen from Fig. 2B that the first and second base bodies 2, 7 and the first and second heat transfer tubes 3' 8 can be most closely arranged in the inner volume 50 of the outer casing, and at the same time can be in the heat transfer tube 3' 8 A large area of thermal contact is achieved between each of the first and second cooling bodies 4 . -17- 200933081 The heat pipes 2, 7 are disposed at the height of the LEDs 1, 6, or may be disposed below the heat pipes 2, 7 in this embodiment. In an installation state of the airport lighting device 200, as shown in Fig. 1, the heat transfer pipe 3' 8 extends in the horizontal direction along the first heat sink 4. The relationship of "horizontal" with respect to the direction of gravity has been defined in an installation state of the airport lighting device 200. This means that the installation orientation of the airport lighting device 200 is such that the cylindrical axis of the first cooling body 4 is parallel to the direction of gravity in the mounted state in this embodiment. The heat sink has a plurality of cooling ribs 41 on the outer surface away from the first and second base bodies 2, 7, i.e., on the outer side of the outer casing, around the respective base bodies 2, 7. Thus, the first heat sink 4 can be thermally coupled to the environment over a large area, and thus the outer casing of the airport lighting device 200 can also be thermally coupled to the environment over a large area, which is generally referred to as the airport shown in FIG. The notch. Therefore, it is ensured that the first cooling body 4 can efficiently discharge heat into the environment. In addition to or in addition to the vertical cooling ribs shown, the first cooling body 4 can also have cooling ribs or cooling fins that surround the inner volume 50 of the housing horizontally or obliquely in the radial direction. The invention is of course not limited to the description made in accordance with the various embodiments. In contrast, the present invention encompasses each novel feature and each combination of features, and in particular, each of the various combinations of the various features of the invention, or the various features of the different embodiments, when the relevant features or related combinations are not The present invention is also included in the scope of each patent application or in the respective embodiments. -18. β 200933081 [Simple description of the drawings] Fig. 1 is an illustration of an embodiment of an airport lighting device. Figures 2 and 2 are diagrams of another embodiment of an airport lighting device. [Main component symbol description]
1 第 -- LED 2 第 一 基 am 體 3 第 -—* 導 熱 管 4 第 -‘ 冷 卻 體 6 第 二 LED 7 第 二 基 體 21 冷 卻 薄 片 3 1 傳 熱 媒 體 ΠΤΓ. 50 外 殼 內 體 積 51 蓋 部 52 下 部 97 凹 Ρ 98 機 場 100 機 場 照 明 裝 置 200 機 場 照 明 裝 置 -19-1 No. - LED 2 First base am body 3 --* Heat pipe 4 -' Cooling body 6 Second LED 7 Second base 21 Cooling foil 3 1 Heat transfer medium 50 50 Outer casing volume 51 Cover 52 Lower 97 Concave 98 Airport 100 Airport Lighting 200 Airport Lighting -19-