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TW200932523A - Flexible printed circuit board, inlet sheet using the same, RFID medium and method producing the same - Google Patents

Flexible printed circuit board, inlet sheet using the same, RFID medium and method producing the same Download PDF

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Publication number
TW200932523A
TW200932523A TW97141119A TW97141119A TW200932523A TW 200932523 A TW200932523 A TW 200932523A TW 97141119 A TW97141119 A TW 97141119A TW 97141119 A TW97141119 A TW 97141119A TW 200932523 A TW200932523 A TW 200932523A
Authority
TW
Taiwan
Prior art keywords
film
resin
layer
heat
polyester film
Prior art date
Application number
TW97141119A
Other languages
Chinese (zh)
Inventor
Mutsuo Nishi
Yoshinori Itsuki
Yasushi Sasaki
Seiichiro Yokoyama
Original Assignee
Toyo Boseki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007278470A external-priority patent/JP2009110987A/en
Priority claimed from JP2007278471A external-priority patent/JP5157366B2/en
Application filed by Toyo Boseki filed Critical Toyo Boseki
Publication of TW200932523A publication Critical patent/TW200932523A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514—Oriented
    • B32B2307/518—Oriented bi-axially
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

To provide a suitable FPC for RFID medium use, and to provide a RFID medium and manufacturing method thereof, for improving variations of production speeds, defect rates, electrical qualities, and good product appearance. A flexible printed circuit board manufactured by performing an etching treatment to the laminated body, which is consisting of biaxially oriented polyester film and metal foil, wherein the above biaxially oriented polyester film is forming thermal adhesion layer and base material layer by coextrusion, and wherein the above metal foil is adhered to the surface of said biaxially oriented polyester film through a thermal adhesion layer, characterized in that the base material layer of biaxially oriented polyester film having melting point in the range of 200 to 300 DEG C, and the thermal adhesion layer is consisting of polyester resin containing wax.

Description

200932523 九、發明說明： 【發明所屬之技術領域】 本發明係關於可撓性印刷線路板及使用其之鑲嵌片與 RFID媒體。又係關於RFID媒體之製造方法。 【先前技術】 ， 近年來內藏有1C晶片之卡片或標籤之資訊的管理運 • 用系統（RF1D系統）相當普及。該等所使用之rfid媒體一般 稱爲「1C卡」或「1C標籤」，與習知印刷/書寫式、磁性 〇 記錄式之卡片/標籤等比較，因在可紀錄/保持多量資訊之點 爲有用，故在管理運用人或物品各種資訊之各種領域可被 . 活用》 . 在構成RFID媒體之塑膠材料方面，習知以使用聚氯化 乙烯（PVC)爲主流。但是，近年來就環境保護之觀點而言， 不使用鹵素元素之代替材料之需求極高，該材料以逐漸替 代聚酯系樹脂而成爲主流。在由聚酯系樹脂所成薄片或薄 Q 膜方面，就爲非晶性且具有接近PVC加工特性之點而言， 以含有使1，4一環己烷二甲醇作爲共聚成份之共聚聚酯 (PETG)所成無配向薄片，或就廣泛使用性之點而言，主要 爲使用二軸拉伸聚對酞酸乙二酯（PET)薄膜。 * [習知技術之問題] 在使用該等薄片或薄膜並製造RFID媒體中，在薄片或 薄膜表面配置1C晶片或天線電路等鑲嵌片之單面或兩面 配置其他薄片或薄膜，在其中夾持著熱熔性黏接劑等並進 200932523 行熱壓，進行熔融黏接而得積層體。但是，在此製造方法 中有著生產性或製品性能方面難以解決之一些問題。 最重要的問題點在於生產性（生產速度）。亦即現行的 製造方法係使ic卡進行數片乃至數十片重疊，予以一片一 片壓製之製造步驟，因而每一單位時間所可製造之數量有 受到限制之問題。對此問題，以一次壓製而可增加積層之 ' 設定數，在將壓機之型的大小加大下而可謀求大致之改 _ 善，藉此可提高之生產性至多爲現狀之數倍至十倍左右， ❹ 今後要對應於可預期之RFID媒體之急劇性地普及恐有困 難。 又，在生產性上，施加壓製面全體且均一的壓力或溫 ^ 度在壓製之設備/步驟之性質上困難，要顯著減低不良品之 發生率亦有困難之問題存在。針對此問題，藉由在電路設 計上下工夫或耐熱性之提高等而可謀求大致之改善，然而 要對應於今後可預想的高功能化，亦即電路微細化或複雜 Q 化恐有困難。 又，在製品性能中問題點之一係在於各個RFID媒體 中，天線之獲益乃至於可通信距離產生偏差的問題。此係 因爲現行之製造方法係使用黏接劑進行熱壓黏接之方法， ' 因而要嚴密控制黏接劑層之厚度則有困難，在壓製之批次 (lot)內或者批次間則產生偏差。以非接觸方式識別之RFID 媒體，其內部具有之天線或線圈在與外部讀取裝置之間進 行電子信號交換而可予識別。在佔有天線或線圈之極近邊 200932523 空間的材料之介電率或介電損失’因係支配該等電特性之 決定性要因，故於黏接層之厚度產生偏差則成爲對製品性 能產生偏差之決定性要因。 在本發明，爲了要製造可改善前述三個問題（生產速 度、不良率、品質偏差）之RFID媒體，故本發明提案作爲 其構件爲適當的可撓性印刷線路板（以下簡稱FPC)與鑲嵌 ' 片，並提案使用此而構成之RFID媒體及其製造方法。 〔關於基材改善之習知技術] 〇 在與本發明FPC相關連之習知技術方面，有揭示如以 下之技術。 - (1)表面含有非晶形聚對酞酸乙二酯之基材與和此基 ^ 材接觸所形成之金屬圖型所成1C卡用天線線圈構成體。（參 照例如專利文獻1) (2) 含有氯化乙烯樹脂之基材與和此基材接觸所形成 之金屬圖型所成1C卡用天線線圈構成體。（參照例如專利 Q 文獻2) (3) 使金屬箔積層於聚酯樹脂薄膜而成之1C卡用基 板。（參照例如專利文獻3) (4) 在聚酯樹脂薄膜表面，藉由共擠壓以積層有熱黏接 ' 層的熱黏接性聚酯薄膜。（參照例如專利文獻4、5) (5) 在聚酯樹脂薄膜表面積層緩衝層及黏接層進行積 層之積層薄片上，埋設1C晶片，而成之1C卡之製造方法（參 照例如專利文獻6、7)。 200932523 【專利文獻丨】日本特開2004-46362號公報 【專利文獻2】日本特開2004-46360號公報 【專利文獻3】日本特開2002-270975號公報 【專利文獻4】日本特開2006-327190號公報 【專利文獻5】日本特開2006-327191號公報 ' 【專利文獻6】日本特開2000-36024號公報 【專利文獻7】日本特開平n—328340號公報 【發明內容】 〇 在該等文獻中’並不使用黏接劑而可有效率的製造 RFID媒體之方法有大致揭示。 • 但是在專利文獻1及3之發明，基材係使用非晶形之 . 聚對駄酸乙二酯薄膜，或者將二軸拉伸聚酯薄膜再加熱至 熔融溫度爲止，進行非晶化而與金屬箔黏接。因此，該等 發明之構成體/基板實質上成爲非晶質基材。基材爲非晶質 時，在後步驟之RFID媒體製造步驟，於加諸高溫時因軟化 Q 而變形’故加諸張力進行連續地積層有困難。又藉此所製 造之RFID媒體之耐熱性亦不充分。 又，記載於專利文獻2之發明係由PVC所構成，故在 環境適性上並非適當。 ' 又，在專利文獻4及5之發明，雖有揭示耐熱性與熱 黏接性並存之RFID用聚酯基材，然而就使金屬箔積層並蝕 刻，作爲天線電路用FPC使用則並無硏討。就該等聚酯基 材而言，在其表面熱積層金屬箔並蝕刻，而形成FPC電路 200932523 者爲大致可能。但是一般在金屬箔表面與塑膠樹脂所成基 材表面比較因爲顯著的平滑’故在將金屬箔積層於該等聚 酯基材之情形，則黏接面之空氣抽出或潤滑性並不充分’ 會有產生黏接力降低或發生皺折之情形。 又，在專利文獻6及7記載之發明，因埋設1C晶片故 • 使緩衝層及黏接層比基材更厚。緩衝層、黏接層因軟化溫 ’ 度低，故與專利文獻1及3相同，在RFID媒體製造步驟上 及耐熱性之點並非適當。 〇 就是說在習知技術中，並不使用黏接劑而是以連續積 層步驟製造FPC，使用此以連續步驟可用以製造RFID媒體 - 爲適當之基材則並無掲示。 > [關於製造方法之改善的習知技術] 在與本發明相關連之RFID媒體之製造方法方面，有揭 示如以下之習知技術。 (5) 將配線印刷於輥狀材料並裝載1C之1C標籤輥之製 〇 造方法（參照例如專利文獻4) (6) 使用到輥狀ic卡材料之1C卡之製造方法（參照例如 專利文獻5) (7) 在二條帶之間供給塑膠薄片以加熱輥加熱後，以使 液狀油成爲加壓介質之連續壓製步驟而進行黏接之1C卡 之製造方法（參照例如專利文獻6) (8) 將上下積層薄膜以積層輥黏接之IC卡之製造方法 (參照例如專利文獻7) 200932523 (9) 在電路模組表面介由黏接劑黏接表層（c〇ver)薄 片’在低溫/低S進行輥壓製之後，在高溫/高壓進行靜壓壓 製之1C卡之製造方法（參照例如專利文獻8) (10) 黏接劑係使用紫外線硬化型樹脂，藉由輥加壓在 使黏接劑層平坦化之後照射紫外線使黏接劑層之厚度成爲 均一的1C卡之製造方法（參照例如專利文獻9) (11) 將反應型黏接劑塗布於輥狀薄片材並封入1C晶片 0 後以薄片材料插入’使黏接劑反應/硬化之1C卡之製造方 法（參照例如專利文獻1 0) (12) 因預先將軟化溫度低的樹脂層被覆於1C卡底板表 面之後’使塑膠薄膜或黏接劑層進行積層之1C卡之製造方 . 法（參照例如專利文獻11) 【專利文獻8】日本特開2005-259091號公報 【專利文獻9】日本特開2001-229361號公報 【專利文獻10】日本特開平10-2 1 765 8號公報 〇 【專利文獻11】日本特開平8-216574號公報 【專利文獻12】日本特開2000-57295號公報 【專利文獻13】日本特開平10-175388號公報 【專利文獻14】日本特開2005-332384號公報 【專利文獻15】日本特開平11-111743號公報 在該等文獻中，於連續製造步驟中製造RFID媒體之方 法有大致揭示，提高生產性之製造方法亦有大致揭示。 但是，在專利文獻8之方法積層薄膜等來製造該等之 -10- 200932523 方法則尙未硏討出結果，在專利文獻10及13、14之方法 結果是爲了以壓製步驟來製造則無法充分謀求生產性之提 高及不良率之減輕，在專利文獻9及11〜15之方法中，結 果是因爲使用黏接劑，故改善黏接劑層之厚度不均有困 難，故尙未提案出可完全改善生產速度與不良率' 品質偏 差之技術。 亦即，習知技術中係使用藉由共擠壓而預先形成有黏 ^ 接劑層之網狀二軸拉伸聚酯薄膜，藉由不具有壓製步驟之 〇 積層輥黏接步驟而不使用黏接劑來製造，但藉以完全改善 生產速度與不良率、品質偏差之RFID媒體之製造方法則尙 • 未揭示。又，藉由共擠壓形成黏接劑層而可使黏接劑層之 . 厚度均一化來改善RFID媒體介電特性之技術，或藉由不經 壓製步驟之積層黏接步驟來改善不良率之技術則並無記載 或教示，在其製造方法中可完全改善生產速度與不良率、 品質偏差之技術則尙未提案。 Q 〔發明欲解決之課題〕 本發明之目的係提供一種使用於RFID媒體爲適當的 FPC，並提供一種可改善生產速度與不良品發生率、電氣品 質、製品外觀之RFID媒體及其製造方法。 ' 〔解決課題之手段〕 可解決上述課題之本發明係由以下之構成而成。 1. 一種可撓性印刷線路板，其中積層體係由，以共擠 壓形成熱黏接層及基材層之二軸拉伸聚酯薄膜；與隔著熱 -11- 200932523 黏接層黏接於該二軸拉伸聚酯薄膜表面之金屬箔所構成， 將該積層體進行蝕刻處理並製造可撓性印刷線路板，其特 徵爲二軸拉伸聚酯薄膜之基材層具有200〜300 °C之熔點， 熱黏接層係由含有蠟之聚酯樹脂所組成。 2 .如第1項之可撓性印刷線路板，其中二軸拉伸聚酯 薄膜之基材層係其內部含有白色顏料及/或微細空洞之白 色聚酯薄膜。 3. 如第1或2項之可撓性印刷線路板，其中熱黏接層 © 係由非晶性聚酯樹脂A，與和此樹脂A非相溶的熱塑性樹 脂B及蠟之混合物所組成^ 4. 如第1〜3項中任一項之可撓性印刷線路板，其中熱 . 黏接層具有以下（1)〜（4)之所有特徵： (1) 非晶性聚酯樹脂A之玻璃轉移溫度爲50〜95°C ; (2) 熱塑性樹脂B係熔點50〜180°C之結晶性樹脂，或 玻璃轉移溫度- 50〜150°C之非晶性樹脂、該等之混合物； 〇 (3)熱黏接層中含有熱塑性樹脂B爲1〜30質量％; (4)熱黏接層之厚度爲5〜30/zm。 5 . —種可撓性印刷線路板，其特徵爲隔著以如第1項 之可撓性印刷線路板之蝕刻處理所露出之熱黏接層，進而 ' 黏接由其他樹脂所成之薄膜並積層。 6. —種RFID媒體用鑲嵌片，其特徵爲配置積體電路於 如第1〜5項中任一項之可撓性印刷線路板。 7. —種RFID媒體，其特徵爲使用如第6項之鑲嵌片所 -12- 200932523 構成。 8. —種可撓性印刷線路板之製造方法，其係具有將捲 繞成輥狀之網狀薄膜與金屬箔開捲（unwind)，同時連續地進 行熱積層之步驟，其特徵爲網狀薄膜係使用二軸拉伸聚酯 薄膜，該二軸拉伸聚酯薄膜係將由含有以共擠壓所形成蠟 之聚酯樹脂所組成熱黏接層形成於具有200〜280°C熔點之 聚酯基材層。 9. 一種RFID媒體之製造方法，其具有：將捲繞成輥狀 之複數網狀薄膜與可撓性印刷線路板或鑲嵌片開捲，同時 連續地進行熱積層之步驟，其特徵爲使用如第1〜6項中任 . 一項之可撓性印刷線路板或鑲嵌片。 ^ ^ 10.如第9項之RFID媒體之製造方法，其係使天線電 路配置於如第1〜6中任一項之可撓性印刷線路板或鑲嵌 片之二軸拉伸聚酯薄膜熱黏接層面。 〔發明效果〕 @ 藉由使用本發明之FPC及鑲嵌片、RFID媒體之製造方 法，可將習知製造方法所無法達成之高生產性與低不良 率，電性品質之偏差予以減低。 [主要構成與作用效果] ' 本發明之FPC，基材係使用預先設置熱黏接層之二軸 拉伸聚酯薄膜，故在熱積層加工或其前步驟中並無必要塗 布或積層黏接劑層，可使製造步驟簡略化。 又，本發明之FPC，係將以熱黏接層黏接於薄膜表面 -13- 200932523 之金屬箔進行鈾刻處理而製造，故以蝕刻除去金屬箔之部 位再度作爲熱黏接層而作用。因此，將此積層於其他樹脂 薄膜等來製造RFID媒體或扁平電纜等時並無重新塗布黏 接劑之必要，可使生產步驟簡略化。 又，在本發明之FPC，爲二軸拉伸聚酯薄膜特徵之聚 酯分子之配向結晶構造可照樣維持（維持聚酯薄膜之熔點 於200〜300 °C)可黏接金屬箔來製造，故力學強度或耐熱性 優異，作爲網狀薄膜，可連續供給於熱積層步驟。又加工 後之1C卡或1C標籤之熱變形可改善至實用上無問題之範 圍。 0 . 又，本發明之熱黏接層因係以共擠壓而預先設置，在 _ 將網狀薄膜拉伸並製造時可共同進行拉伸配向。因此熱黏 接層之厚度與擠壓積層或溶液塗布等所致加工比較爲優異 並爲均一，在配置於1C卡或1C標籤之天線電路附近時， 可防止其介電特性偏差之發生，亦即可減輕通信距離之偏 Q 差。又，被拉伸配向之熱黏接層，因亦爲非晶質分子被配 向，故爲強固的黏接層並可發揮強黏接性。 又，本發明之FPC所用之二軸拉伸聚酯薄膜，係由不 含鹵素之結晶性聚酯樹脂所成。因此除了用於RFID媒體時 ' 之環境適性優異之外，耐熱性、耐藥品性亦爲優異。 又，在本發明之FPC所用之二軸拉伸聚酯薄膜，在其 黏接層含有適量蠟。藉此改善潤滑性，可減低使金屬箔進 行熱黏接時皺折的發生。又可獲得必要的黏接強度。 -14- 200932523 在本發明之製造方法，並不仰賴於壓製步驟因使網狀 薄膜連續地進行熱積層以製造RFID媒體，故與現在被廣泛 使用之薄片之壓製加工比較，可飛躍地提高生產速度。 又，在本發明之製造方法，網狀薄膜因係使用二軸拉 伸聚酯薄膜，故在高溫之積層加工爲可行，與耐熱性不良 之非晶性樹脂製未拉伸薄片比較在格外地高速之量產加工 爲可行。 又，在本發明之製造方法，藉由經加熱之輥進行連續 ❹ 地積層加工，故被黏接加工之面全體之溫度或壓力之分布 可容易地均一地調整。使溫度或壓力之分布均一化者受到 . 機械精度所限制，又在壓製處理之時與有必要進行溫度或 壓力再調整的習知步驟比較，可減輕1C晶片或電路之熱/ 機械損害之發生頻度。 〔其他構成與作用效果〕 在本發明FPC所用之二軸拉伸聚酯薄膜，係藉由製造 Q 含有空洞之聚酯薄膜的周知技術，可在薄膜中多數含有微 細空洞。此在習知PVC或PETG薄片已爲困難之技術。藉 此熱黏接性聚酯薄膜之表觀密度，亦即空洞含量進而是薄 膜緩衝性或柔軟性在用於RFID媒體時可在適切範圍調節。 ' 於薄膜中適度含有微細空洞係指爲賦予RFID媒體輕 量性或柔軟性、緩衝性、書寫性而爲有效。又，將含有空 洞聚醋薄膜作爲材料使用之RFID媒體之比重輕，即使掉落 水中或海中亦不會馬上沈沒。因此，可迴避有遺失媒體之 -15- 200932523 t 情形。 又，含有空洞聚酯薄膜，與不含有空洞之聚酯薄膜或 薄片比較，外觀之介電率低。因此.，在HF帶乃至SHF帶 之髙頻所致通信中介電損失少。亦即，以含有空洞聚酯薄 膜作爲材料使用之RFID媒體獲利高，在通信精度或通信距 離、省電力化爲有效。 又’本發明之FPC所使用之二軸拉伸聚酯薄膜，係具 有以非晶性聚酯樹脂爲主體之適度厚度的熱黏接層。因此 藉由熱黏接步驟，可被蝕刻之金屬箔（天線電路）埋沒於熱 Ο 黏接層並減輕凹凸，可提高RFID製品之外觀或收率。 又，本發明之FPC所用之二軸拉伸聚酯薄膜，在其表 面具有：非晶性聚酯樹脂與和此樹脂非相溶之熱塑性樹脂 及蠟之混合物所成熱黏接層。因此，以蝕刻處理除去金屬 ' 箔並露出之熱黏接層，靜摩擦係數爲0.1〜0.6，在製造鑲 嵌片時，及使用鑲嵌片製造RFID媒體時之阻塞（blocking) 可予改善。 又，將此非晶性聚酯樹脂之熱塑性樹脂的添加量或玻 〇 璃轉移溫度、熔點調整於適切的範圍，藉以在不阻礙熱黏 接性而可謀求摩擦係數之減低或空氣漏出之促進，並可提 高黏接後外觀或製品之收率。 . 又，在本發明之FPC所用之二軸拉伸聚酯薄膜之熱黏 接層中，由於熱塑性樹脂所形成之突起，即使爲大突起也 幾乎不會脫落，並少有引起在步驟中污染之虞。又，依照 -16- 200932523 低熱黏接溫度，在熱黏接時亦因軟化變形而進行平坦化， 故在添加如習知大粒徑之無機/有機粒子時並無所產生之 熱黏接性降低。又，與無機/有機粒子比較因變形之可能性 (likelihood)亦大，故發生薄膜強度降低之顧慮亦小。 又，本發明所用之熱黏接性聚酯薄膜，在作爲RFID媒 體之構成材料使用時可獲得必要的平面性。此係調整熱黏 接層之厚度與網狀薄膜之厚度，又在薄膜之表裏中可控制 熱收縮率或線膨脹係數於適切範圍，因而可減少後加工步 驟等產生之卷縮。 進而，本發明所用之二軸拉伸聚酯薄膜，用在構成 - RFID媒體之外裝或中間層爲適當。將此薄膜作爲外插或中 間層使用，可藉以確實地內包必要的電子零件/電路。此係 本發明在熱黏接加工時具有可適度地軟化並變形之熱黏接 層，又在不阻礙，將具有熔點或玻璃轉移溫度之聚合物於 熱黏接層中因而含有作爲島成份（粒子狀分散體）之故。亦 Q 即’本發明所用二軸拉伸聚酯薄膜，因可維持潤滑性，同 時具有可確實吸收1C晶片或金屬箔電路等凹凸之成形性。 〔實施發明之最佳型態〕 在本發明之FPC，係藉由共擠壓而預先形成有熱黏接 ' 層之二軸拉伸聚酯薄膜，與隔著熱黏接層黏接於薄膜表面 之金屬箔所成積層體，進行蝕刻處理所製造之FPC中，二 軸拉伸聚酯薄膜之基材具有200〜300 °C之熔點，且熱黏接 層含有蠟。 -17- 200932523 又，本發明FPC之更佳實施形態爲，藉由以蝕刻處理 所露出之熱黏接層來黏接樹脂薄膜而積層。 又，在本發明FPC之更佳實施形態爲，二軸拉伸聚酯 薄膜，其內部含有白色顏料或微細空洞之白色聚酯薄膜。 又，在本發明之FPC，二軸拉伸聚酯薄膜之熱黏接層 係由含有蠟之聚酯樹脂所成。聚酯樹脂以非晶性聚酯爲 佳。進而較佳爲，二軸拉伸聚酯薄膜之熱黏接層係由非晶 ^ 性聚酯樹脂A與和此樹脂A非相溶的熱塑性樹脂B及蠟之 ❹ 混合物所成，將二軸拉伸聚酯薄膜之表裏兩面進行疊合而 測定之靜摩擦係數爲0.1〜0.6更佳。又，使FPC以蝕刻處 - 理除去金屬箔之薄膜表裏兩面進行疊合而測定之靜摩擦係 _ 數以0.1〜0.6更佳。 又，在本發明之FPC，關於設置於二軸拉伸薄膜之熱 黏接層，其厚度以5〜30 爲佳，其係由玻璃轉移溫度 50〜95 °C之非晶性聚酯樹脂A與和此樹脂A非相溶的熱塑 〇 性樹脂B之混合物所成，熱塑性樹脂B係（a)熔點50〜180 °C之結晶性樹脂、（b)玻璃轉移溫度-50〜150°C之非晶性樹 脂或（c)該等之混合物，更佳實施形態爲在熱黏接層中含有 1〜30質量％。 ' 又，在本發明之RFID媒體用鑲嵌片，實施形態以配置 1C於上述FPC者爲佳。 又，本發明之RFID媒體之較佳實施形態係使用上述鑲 嵌片而構成。 -18- 200932523 又，在本發明之RFID媒體之製造方法中，係具有：將 捲繞成輥狀之複數網狀薄片一面開捲，一面積層並連續地 進行熱積層之步驟，較佳實施形態爲網狀薄膜係使用上述 FPC或鑲嵌片，並使用不具有壓製步驟之積層輥的黏接步 驟來製造。 又，在本發明之RFID媒體之製造方法中，作爲鄰接於 天線電路之層，較佳實施形態以不配置黏接劑層更佳。 以下就本發明之實施形態予以詳細說明。 〇 〔可撓性印刷線路板〕 本發明之FPC，係藉由共擠壓以預先形成熱黏接層之 - 二軸拉伸聚酯薄膜，與藉由熱黏接層以黏接於薄膜表面之 金屬箔所成積層體，進行飩刻處理所製造之FPC，所觀測 到蝕刻處理後二軸拉伸聚酯薄膜之熔點則爲200〜300°C。 在此所用金屬箔之材料係可使用銀或銅、金、鋁等電 阻小的金屬，而因係藉由蝕刻處理來形成電路，故以使用 Q 蝕刻容易之銅或鋁爲佳。又就金屬箔之厚度而言並無特別 限制，但就FPC製造步驟之作業性或步驟穩定性、電氣性 能、成本之觀點而言，以5〜100/zm爲佳，以1〇〜50#m 更佳。又，就吸收金屬箔（天線電路）凹凸的觀點而言，以 15〜60/zm爲佳。 將此金屬箔黏接於二軸延伸聚酯薄膜之方法，除了& 熱黏接的方法以外並無特別限定，通常廣泛使用之方法可 使用熱壓製所致熱壓黏接或加熱輥所致熱積層黏接。藉自 -19- 200932523 在熱壓黏接係施加高壓力，即使厚的金屬箔也有可 黏接的優點，然而因生產速度提高或不良率減低有 以藉由熱積層來黏接更佳。 將此金屬箔進行蝕刻處理以形成電路之方法， 成與金屬箔黏接之二軸拉伸聚酯薄膜或其熱黏接層 有顯著損傷之方法，則並無特別限定。例如在金屬 用銅箔或鋁箔之情形係可使用使用到氯化鐵 chloride)水溶液之周知方法。 〇 又，在本發明，作爲FPC被加工後在二軸拉伸 膜於200〜3 00 °C之範圍中有顯示熔點之必要。在使 拉伸聚酯薄膜所製造之周知FPC，係爲了使金屬箔 _ 積層黏接，則加熱至溫度超過構成基材之聚酯樹脂 之溫度並予黏接。 該等習知之FPC在黏接性中雖可發揮充分的性 而基材之聚酯薄膜實質上被非晶化，故使用FPC Q RFID之步驟或作爲RFID或FPC之製品所使用之情 熱性並不充分。亦即，在後步驟中自輥開捲並與其 薄片等積層之情形，基材會軟化而加諸充分的張 難，或有在作爲RFID或FPC使用時因環境溫度而 ' 形之情形。 二軸拉伸聚酯薄膜在作爲FPC進行加工後在羅 〜300°C熔點之情形，更佳爲在顯示250〜300°C之熔 形，可充分保持二軸拉伸薄膜原來之配向結晶化構 確實地 限，故 若不造 之功能 箔係使 (ferric 聚酯薄 用二軸 進行熱 之熔點 能，然 來製造 形的耐 他樹脂 力有困 產生變 示200 點之情 造，故 -20- 200932523 可防止起因於耐熱性不足之該等問題。使熔點在上述範 圍，其係指作爲二軸拉伸聚酯薄膜，係使用使聚對酞酸乙 二酯樹脂或聚乙烯萘二酸酯樹脂、聚三亞甲基對苯二酸醋 樹fc及該等作爲基本骨架之共聚聚酯樹脂所成二軸拉伸聚 酯薄膜’使其作爲FPC在加工時不加熱至熔點以上之溫度 而可行。 又’在本發明之FPC，藉由蝕刻處理除去金屬箔之部 分有熱黏接層露出。此露出之熱黏接層因係維持著熱黏接 性，故在不使用黏接劑下可與其他樹脂薄片或薄膜進行熱 黏接來構成FPC或鑲嵌片，而可構成RFID媒體。在如此 所構成之製品因並不使用黏接劑，故可減低電氣特性亦即 介電率或介電損失之偏差。 藉由露出之熱黏接層將樹脂薄片或薄膜黏接進行積層 之情形，其黏接強度以1〜50N/cm爲佳，以3〜20N/cm更 佳。在黏接強度無法滿足此範圍之情形，在作爲FPC或RFID 媒體等製品使用時，因彎曲或摩擦等產生剝離，會有製品 被破壞之情形並不佳。又，在超過此範圍之情形並無特別 問題產生，其畢竟爲超過基材本身強度之黏接力，因造成 過剩品質故不適當。 此外，作爲將黏接強度調整於此範圍之方法，除了如 下述適切的設計熱黏接層之外，使熱黏接時之溫度爲90〜 20(TC，較佳爲在130°C〜180°C之範圍調節則爲可行。， 又，在本發明之FPC，在使表裏兩面對向並叠合時之 -21- 200932523 靜摩擦係數以0.1〜0.6爲佳’以0.3〜0.5更佳。靜摩擦係 數在不足於此範圍之情形’因潤滑性過高，則將FPC堆叠 並保管時或作爲輥進行捲繞時，產生貨物崩塌或捲繞偏差 而使處理造成困難。又靜摩擦係數在超過上述範圍之情 形，會有經裁切之FPC以片（sheet)處理時或捲繞於輥時產 生阻塞之情形。 [鑲嵌片與RFID媒體] 鑲嵌片係指在薄膜基材表面以金屬等導體所形成之天 〇 線電路，與和此電路連接之電容器或1C等所成RFID媒體 製造用之中間製品。 本發明之鑲嵌片係使本發明之FPC作爲天線電路而在 此電路配置如上述之電子零件。關於其構成並無特別限 定，而以使熱黏接層露出於其至少單側表面者爲佳。此經 露出之熱黏接層係爲維持熱黏接性用，並不使用黏接劑而 是與其他樹脂薄片或薄膜進行熱黏接而可構成RFID媒 Q 體。在如此所構成之製品因不使用黏接劑’故可使電氣特 性亦即介電率或介電損失之偏差減低。 在以經露出之熱黏接層進行樹脂薄片或薄膜之黏接並 積層之情形，其黏接強度以1〜50N/cm爲佳，以3〜20N/cm 爲佳。在黏接強度不足此範圍之情形，在作爲FPC或RFID 媒體等製品使用時，因彎曲或摩擦等而產生剝離會有製品 被破壞之情形並不佳。又，雖在超過此範圍之情形並無特 別之問題產生，但畢竟是超過基材本身強度之黏接力，因 -22- 200932523 會造成過剩品質故不佳。 此外，在將黏接強度調整於此範圍之方法方面，除了 使熱黏接層適切的設計成如下述方式之外，可調節熱黏接 時之溫度爲90〜2 00 °C，較佳爲130 °C〜180 °C之範圍。 又，本發明之RFID媒體，若爲可使用本發明之鑲嵌片 則並無特別限定，其他樹脂薄片或薄膜則可積層並黏接於 本發明之鑲嵌片。積層之樹脂薄片及薄膜則並無特別限 定，但就由環境適性之觀點而言，以由聚酯系樹脂所成薄 〇 片或薄膜爲佳，就由耐熱性或耐藥品性、機械強度等之觀 點而言以使用二軸拉伸聚酯較佳，其內部以含有白色顏料 - 或微細空洞之白色聚酯薄膜進而爲佳。 ^ 使白色聚酯薄膜進行積層使用係指可改善RFID媒體 之隱蔽性或白色性之適當實施形態。藉此，在表面實施印 刷之情形可製造美觀的媒體。又，將內藏之電子部件或電 路加以隱蔽可強化安全性》 ❹又，最佳之實施形態係使用內部含有微細空洞之薄 膜。因微細空洞之效果，可賦予RFID媒體緩衝性，除了可 保護內部之電路之外，亦可使RFID成爲有彈性，可提高處 理性，在卡片上記上簽名等情形之書寫性優異，可使介電 率與介電損失減低，而大幅提高RFID之可通信距離等，有 著極多之優點。 又’使二軸拉伸聚酯薄膜藉由熱黏接進行積層之情 形，在使用表面具有黏接性改善層之薄膜，對黏接強度提 -23- 200932523 筒爲有效。 [薄膜之構成] 本發明FPC之特徵爲，藉由共擠壓來使用預先形 黏接層之二軸拉伸聚酯薄膜。以下’就此二軸拉伸聚 膜加以詳述。 本發明所用之二軸拉伸聚酯薄膜係由基材與在該 單面或兩面積層有熱黏接層之構成所成。在基材方面 使用二軸拉伸聚酯薄膜，而除了環境適性（不含鹵素化 〇 之外，就耐熱性或耐藥品性、強度、剛性等點而言爲重 藉此與習知所持續使用之無配向PVC薄片或PETG薄 - 比較，該等特性可飛躍地提高。 又，本發明所用之二軸拉伸聚酯薄膜係在其單面 面具有熱黏接層爲緊要。在此之熱黏接層係指於加熱 下’與構成1C卡或1C標籤之塑膠薄膜或薄片、金屬 形成於該等表面之各種塗布層爲可行熱黏接之層。在 〇 熱黏接層積層於基材，可賦予與爲習知ic卡或ic標 材料的PVC或PETG等相同之熱黏接性。 此熱黏接層厚度以每一層爲5/zm以上且30/zm 爲重要。熱黏接層之厚度在未達5/zm之情形，熱黏接 凹凸吸收性並不充分。另一方面，熱黏接層之厚度在 3〇vm之情形，與使習知pETG薄片作爲材料使用之卡 同’耐熱性或耐藥品性下降。熱黏接層厚度之下限以 爲佳’以10;/m更佳。另一方面，熱黏接層厚度上限 成熱 酯薄 基材 ，係 合物） :要。 片等 或兩 條件 膜、 將此 籤之 以下 性與 超過 片相 % β τα. 以25 -24- 200932523 /im爲佳，以20#m更佳。 在將熱黏接層設置於基材表面之手段方面，在擠壓熔 融之原料來製造未拉伸薄片之步驟中，將2種樹脂於熔融 狀態下進行積層並擠壓之方法，其係使用所謂共擠壓法。 藉由此方法經積層之熱黏接層在平面內各部分中因厚度變 動小，故與黏接劑等所致黏接層比較在各部位中介電特性 偏差小，可謀求使用此所製造FPC或RFID媒體之電氣特 性提高，進而可謀求漏電流之現象或通信距離之提高。 ❹ 又，本發明所用之二軸拉伸聚酯薄膜中，在基材兩面 設置熱黏接層，就可抑制薄膜卷縮之點而言，爲適當的實 - 施形態。本發明中，熱黏接層主係由非晶性樹脂所構成，與 使結晶性聚酯樹脂成爲主體之基材則熱膨脹係數大爲不 同。因此，在僅基材之單面設置熱黏接層之情形，根據加 工條件或使用條件會有如雙金屬般卷縮之情形，且會顧慮 到平面性或處理性之不良。 Q 在基材兩面設置熱黏接層之情形，表裏之熱黏接層厚 度比率以0.5以上且2.0以下爲佳。在超過此範圍之情形， 因上述理由會有發生卷縮之情形。此外，即使在發生卷縮 之情形，於無負荷之狀態下在進行1 1 〇 °C、3 0分鐘之加熱 ' 處理後卷縮値在5mm以下時對處理性並無實質上障礙。更 佳爲卷縮値3mm以下，特佳爲lmm以下。 又，另一種可抑制卷縮之方法係，對賦予薄膜表面與 背面之溫度或熱量積極地產生差距，結果有使卷縮値接近 -25- 200932523 零之方法。具體言之，以縱拉伸或橫拉伸等拉伸步驟及熱 固定步驟，使薄膜正背溫度或熱量成爲不同之値，而可獨 立地控制薄膜表面與背面之配向度，使薄膜表面與背面之 構造或物性均衡化。結果可減低卷縮。在使用此方法之情 形，在使薄膜進行縱拉伸步驟之加熱/冷卻過程中，要調整 使薄膜表面與背面加熱之輥或紅外線加熱器之溫度則爲容 易，且爲適當的方法。 又，本發明所用之二軸拉伸聚酯薄膜以薄膜全體厚度 以25 y m以上且350 # m以下爲佳。薄膜全體厚度之下限 以38#m較佳，以50#m進而爲佳。又薄膜全體厚度之上 限以2 80 v m較佳，以200 // m進而爲佳/薄膜全體厚度未 達25 y m之情形，因機械強度或處理性、FPC或RFID媒體 製造時步驟穩定性並不充分故不佳。另一方面，薄膜全體 厚度在超過350/zm之情形，在RFID媒體之標準厚度（例如 JIS規格中1C卡爲0.76mm)之中，因有限制其他薄片或薄 膜、電路之組合故不佳。 又，在本發明所用之二軸拉伸聚酯薄膜，爲更加改善 熱黏接性或潤滑性，或爲賦予防靜電性等之其他功能，亦 可在薄膜表面設置塗布層。在構成塗布層之樹脂或添加劑 方面，可例舉聚酯樹脂、聚胺甲酸酯樹脂、聚酯胺甲酸乙 酯樹脂、丙烯酸系樹脂等，爲提高通常聚酯薄膜之黏接性 所使用之樹脂，或提高防靜電性之防靜電劑等。在自該等 樹脂或添加劑中選擇適當之物的標準方面，以本發明所用 -26- 200932523 之二軸拉伸聚酯薄膜，與相對於積層於該薄膜之材料以親 和性高者爲佳。具體言之，以選擇表面張力或溶解度參數 接近之樹脂或添加劑爲佳。但是，在塗布硬化性樹脂等之 情形，本發明重要效果之熱黏接性會有產生障礙之虞，材 料之選擇上有予以注意之必要。 在設置塗布層之方法方面，可適用凹版印刷（gravUre ) 塗布方式、接觸式塗布（kiss coat)方式、浸漬方式、噴灑塗 布方式、簾塗布方式、氣刀塗布方式、刀片塗布方式、逆 輥塗布方式等通常所用之方法。在塗布之階段方面，可使 用在薄膜之拉伸前塗布之方法，在縱拉伸後塗布之方法， . 在完成配向處理之薄膜表面塗布之方法等之任一種方法。 [熱黏接層] 在本發明之FPC中，基材以使用藉由共擠壓預先形成 熱黏接層之二軸拉伸聚酯薄膜爲重要，在此熱黏接層含有 蠟爲非常重要。 Q 此等蠟方面，除了聚烯烴系樹脂或聚酯系樹脂、聚醚 系樹脂、丙烯酸系樹脂、聚矽氧系樹脂等所成合成高分子 系之蠟之外，可使用褐煤蠟等天然礦物系蠟，巴西棕櫚蠟 等植物系蠟，與聚酯樹脂一起，因可被加工故以具有耐熱 ' 性爲重要。其中可適當使用者則爲合成高分子系蠟，就軟 化溫度或表面張力、處理性等觀點而言，以聚烯烴系蠟更 佳。 在此，作爲使蠟含於熱黏接層之方法係除了上述般直 -27- 200932523 接添加蠟之外，在添加聚乙烯樹脂或聚丙烯樹脂、聚乙二 醇樹脂等樹脂成份，結果可含有使含於該樹脂中之低分子 量成份作爲蠟。含有蠟之適量依照其種類而不同，要一槪 限定有困難。例如在使用聚烯烴系蠟或聚乙二醇樹脂之情 形，相對於熱黏接層以0·03〜3質量％爲佳，以0.1〜0.8質 量％更佳。又，添加聚乙烯樹脂，且在將此低分子量成份作 爲蠟而利用之情形，作爲聚乙烯樹脂以添加1〜2 0質量％ 爲佳，添加3〜1 0質量％更佳。其他蠟之適切添加量，係可 在將薄膜表面以丙酮充分清拭時設計使靜止摩擦係數以 0.1〜0.5左右增加方式之添加量爲目標。 . 又，蠟方面以使用熔點40〜150 °C之物爲佳，以50〜 1 20 °C之物更佳。在熔點不足此範圍之情形，熔融擠壓之步 - / 驟並不穩定，或易於產生熱劣化物，因於薄膜表面流跡 (bleed out)並析出並不佳。又熔點在超過此範圍之情形，因 會降低摩擦之減低效果，或阻礙熱黏接性故不佳。 Q 又，熱黏接層以使熔融熱量爲20mJ/mg以下非晶性聚 酯樹脂A做爲主要構成成份爲佳。在此熔融熱量係指根據 JIS-K7122記載之「塑膠之轉移熱測定方法」，使用DSC 裝置，在氮氛圍下，以10°C /分速度進行加熱而測定之熔融 ' 熱量。本發明中，上述熔融熱量以10m J/mg以下爲佳，以200932523 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a flexible printed wiring board and an embedded sheet and an RFID medium using the same. It is also a method of manufacturing RFID media. [Prior Art] In recent years, the management system (RF1D system) in which information on cards or tags of 1C chips is contained is quite popular. The rfid media used in these are generally referred to as "1C cards" or "1C tags", compared with conventional printed/written, magnetic-recorded cards/labels, because of the ability to record/hold a large amount of information. Useful, so it can be used in various fields of managing various information about people or objects.  Use it .  In the case of plastic materials constituting RFID media, it is conventional to use polyvinyl chloride (PVC) as the mainstream. However, in recent years, from the viewpoint of environmental protection, the demand for a substitute material that does not use a halogen element is extremely high, and this material has become a mainstream by gradually replacing the polyester-based resin. In the case of a sheet formed of a polyester resin or a thin Q film, it is amorphous and has a processing property close to that of PVC, and a copolymerized polyester containing 1,4-cyclohexanedimethanol as a copolymer component ( PETG) is formed into an unaligned sheet, or in terms of wide-spreadness, mainly using a biaxially stretched polyethylene terephthalate (PET) film. * [Problems of the prior art] In the use of such sheets or films to manufacture RFID media, other sheets or films are placed on one or both sides of a panel such as a 1C wafer or an antenna circuit on a sheet or film surface, and are sandwiched therein. A hot-melt adhesive or the like is placed in hot melt at 200932523, and is melt-bonded to obtain a laminate. However, there are some problems in the manufacturing method that are difficult to solve in terms of productivity or product properties. The most important issue is productivity (production speed). That is, the current manufacturing method is such that the ic card is stacked in a plurality of pieces or even tens of pieces, and the manufacturing steps are performed one by one, so that the number of parts that can be manufactured per unit time is limited. In this case, the number of sets can be increased by one press, and the size of the press can be increased to improve the size of the press, thereby improving the productivity to at most several times the current status. About ten times, 恐 It will be difficult to correspond to the rapid spread of predictable RFID media in the future. Further, in terms of productivity, it is difficult to apply the entire pressing surface and uniform pressure or temperature in the nature of the apparatus/step of pressing, and it is difficult to significantly reduce the incidence of defective products. In order to solve this problem, it is possible to achieve a substantial improvement in terms of circuit design, heat resistance, and the like. However, it is difficult to achieve high functionality in the future, that is, circuit miniaturization or complex Q. Moreover, one of the problems in the performance of the product is that in the respective RFID media, the benefit of the antenna is even a problem that the communication distance is deviated. This is because the current manufacturing method is a method of thermocompression bonding using an adhesive, so it is difficult to strictly control the thickness of the adhesive layer, which is generated in the batch or between batches. deviation. The RFID media that is identified in a non-contact manner can be identified by an internal antenna or coil that is electronically exchanged with an external reading device. The dielectric constant or dielectric loss of the material in the space of 200932523, which is near the antenna or coil, is a decisive factor in controlling the electrical properties. Therefore, variations in the thickness of the adhesive layer may cause deviations in product performance. Decisive factor. In the present invention, in order to manufacture an RFID medium capable of improving the above three problems (production speed, defective rate, quality deviation), the present invention proposes as a suitable flexible printed wiring board (hereinafter referred to as FPC) and mosaic. 'Piece, and propose to use this to constitute the RFID media and its manufacturing methods. [About the conventional technique for improving the substrate] 〇 In the conventional technology related to the FPC of the present invention, the following techniques are disclosed. - (1) A 1C card antenna coil formed by a substrate having an amorphous polyethylene terephthalate substrate and a metal pattern formed by contact with the substrate. (Refer to, for example, Patent Document 1) (2) A 1C card antenna coil structure in which a base material containing a vinyl chloride resin and a metal pattern formed by contact with the base material are used. (Refer to, for example, Patent Q Document 2) (3) A 1C card substrate in which a metal foil is laminated on a polyester resin film. (See, for example, Patent Document 3) (4) A heat-adhesive polyester film in which a layer of a heat-bonding layer is laminated by co-extrusion on a surface of a polyester resin film. (See, for example, Patent Documents 4 and 5) (5) A method of manufacturing a 1C card by embedding a 1C wafer on a laminated sheet in which a buffer layer and a bonding layer of a polyester resin film surface layer are laminated (see, for example, Patent Document 6) , 7). Japanese Laid-Open Patent Publication No. 2004-46360 (Patent Document 3) JP-A-2002-270975 (Patent Document 4) JP-A-2006- [Patent Document 5] Japanese Laid-Open Patent Publication No. 2000-36024 (Patent Document 7) Japanese Laid-Open Patent Publication No. H-328340 (Summary of the Invention) The method of making RFID media efficiently without using an adhesive is generally disclosed in the literature. • However, in the inventions of Patent Documents 1 and 3, the substrate is made of an amorphous one.  The polyethylene terephthalate film or the biaxially stretched polyester film is heated to a melting temperature, and is amorphized to adhere to the metal foil. Therefore, the constituent body/substrate of the invention is substantially an amorphous substrate. When the substrate is amorphous, the RFID media manufacturing step in the subsequent step is deformed by softening Q when high temperature is applied. Therefore, it is difficult to continuously laminate by applying tension. Moreover, the heat resistance of the RFID media manufactured by this is also insufficient. Further, the invention described in Patent Document 2 is composed of PVC, and therefore is not suitable for environmental suitability. In addition, in the inventions of Patent Documents 4 and 5, the polyester base material for RFID which exhibits both heat resistance and thermal adhesion is disclosed. However, the metal foil is laminated and etched, and it is not used as an antenna circuit for FPC. discuss. In the case of such polyester substrates, it is generally possible to thermally laminate a metal foil on the surface thereof and etch it to form an FPC circuit 200932523. However, in general, the surface of the metal foil is significantly smoother than the surface of the substrate formed of the plastic resin. Therefore, when the metal foil is laminated on the polyester substrate, the air extraction or lubricity of the bonding surface is insufficient. There is a case where the adhesive force is lowered or wrinkles occur. Further, in the inventions described in Patent Documents 6 and 7, since the 1C wafer is buried, the buffer layer and the adhesive layer are made thicker than the substrate. Since the buffer layer and the adhesive layer have a low softening temperature, the same as Patent Documents 1 and 3, the RFID media manufacturing step and heat resistance are not appropriate. That is to say, in the prior art, the FPC is manufactured in a continuous lamination step without using an adhesive, and the continuous steps can be used to manufacture the RFID medium - which is not indicated for a suitable substrate. > [Prior Art for Improvement of Manufacturing Method] In the method of manufacturing an RFID medium related to the present invention, the following conventional techniques are disclosed. (5) A method of manufacturing a 1C label roll by printing a 1C label roll on a roll-shaped material (see, for example, Patent Document 4) (6) A method of manufacturing a 1C card using a roll-shaped ic card material (see, for example, a patent document) (5) A method of manufacturing a 1C card in which a plastic sheet is supplied between two strips and heated by a heating roller, and the liquid oil is adhered to a continuous pressing step of a pressurized medium (see, for example, Patent Document 6). 8) A method of manufacturing an IC card in which a laminated film is bonded by a build-up roll (refer to, for example, Patent Document 7) 200932523 (9) Bonding a surface layer (c〇ver) sheet at a surface of a circuit module via an adhesive at a low temperature / Low S is a method of manufacturing a 1C card which is subjected to hydrostatic pressing at a high temperature/high pressure (see, for example, Patent Document 8). (10) The adhesive is an ultraviolet curable resin, and is pressed by a roller to make it sticky. A method of manufacturing a 1C card in which the thickness of the adhesive layer is uniform after the flattening of the adhesive layer is irradiated with ultraviolet rays (see, for example, Patent Document 9). (11) A reactive adhesive is applied to a roll-shaped sheet and sealed in a 1C wafer. After inserting the sheet material into the 'adhesive agent (1) For example, the method of manufacturing a 1C card (see, for example, Patent Document 10) (12) A 1C card in which a plastic film or an adhesive layer is laminated after a resin layer having a low softening temperature is applied to the surface of the 1C card substrate in advance. Manufacturer.  Japanese Patent Publication No. 2001-229361 (Patent Document 10) Japanese Patent Laid-Open No. Hei No. 2001-229361 (Patent Document 10) Japanese Patent Laid-Open No. Hei 10-2 1 765 No. 8 [Patent Document 11] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Japanese Laid-Open Patent Publication No. Hei No. Hei 11-111743. In these documents, a method of manufacturing an RFID medium in a continuous manufacturing step is disclosed, and a manufacturing method for improving productivity is also generally disclosed. However, in the method of Patent Document 8, a method of laminating a film or the like to produce the above-mentioned 10-200932523 method does not reveal the result, and the results of the methods of Patent Documents 10 and 13, 14 are not sufficient for the production by the pressing step. In order to improve the productivity and reduce the defect rate, in the methods of Patent Documents 9 and 11 to 15, the result is that since the adhesive is used, it is not difficult to improve the thickness of the adhesive layer, so that it is not proposed. A technology that completely improves production speed and non-performing rate' quality deviation. That is, in the prior art, a reticulated biaxially stretched polyester film in which a layer of a binder is previously formed by co-extrusion is used, without using a layered roll bonding step without a pressing step. Adhesives are manufactured, but the manufacturing methods of RFID media that completely improve production speed, defect rate, and quality deviation are not disclosed. Moreover, the adhesive layer can be formed by co-extrusion to form an adhesive layer.  The technique of uniformizing the thickness to improve the dielectric properties of the RFID medium, or the technique of improving the defect rate by the lamination bonding step without the pressing step, is not described or taught, and the production speed and the defect can be completely improved in the manufacturing method thereof. The technology of rate and quality deviation has not been proposed. Q [Problem to be Solved by the Invention] An object of the present invention is to provide an FPC suitable for use in an RFID medium, and to provide an RFID medium and a method of manufacturing the same that can improve the production speed, the occurrence rate of defective products, the electrical quality, and the appearance of the product. [Means for Solving the Problem] The present invention which solves the above problems is constituted by the following constitution. 1.  A flexible printed circuit board, wherein the laminated system comprises a biaxially stretched polyester film formed by co-extrusion to form a thermal adhesive layer and a substrate layer; and the adhesive layer is adhered to the adhesive layer via a heat -11-200932523 The metal foil of the surface of the biaxially stretched polyester film is formed, and the laminated body is etched to produce a flexible printed wiring board, wherein the substrate layer of the biaxially stretched polyester film has a temperature of 200 to 300 ° C. The melting point, the heat bonding layer is composed of a polyester resin containing wax. 2 . The flexible printed wiring board according to item 1, wherein the substrate layer of the biaxially stretched polyester film is a white polyester film containing white pigment and/or fine voids therein. 3.  The flexible printed wiring board according to Item 1 or 2, wherein the thermal adhesive layer is composed of a mixture of an amorphous polyester resin A and a thermoplastic resin B and a wax which are incompatible with the resin A. .  A flexible printed wiring board according to any one of items 1 to 3, wherein the heat is used.  The adhesive layer has all the following features (1) to (4): (1) The glass transition temperature of the amorphous polyester resin A is 50 to 95 ° C; (2) The thermoplastic resin B has a melting point of 50 to 180 ° C. a crystalline resin, or an amorphous resin having a glass transition temperature of -50 to 150 ° C, a mixture thereof; 〇 (3) a thermal adhesive layer containing a thermoplastic resin B of 1 to 30% by mass; (4) heat The thickness of the adhesive layer is 5 to 30/zm. 5 .  A flexible printed wiring board characterized in that a thermal adhesive layer exposed by an etching treatment of a flexible printed wiring board according to item 1 is bonded, and a film formed of another resin is bonded and laminated. . 6.  An embedded sheet for RFID media, characterized in that the integrated circuit is a flexible printed wiring board according to any one of items 1 to 5. 7.  An RFID medium characterized by the use of an inlay piece as in item 6 - 200932523. 8.  A method for producing a flexible printed wiring board, which comprises the steps of unwinding a web-like film wound into a roll shape and unwinding a metal foil while continuously performing heat lamination, which is characterized by a network film system A biaxially stretched polyester film is used, which is formed of a heat-bonding layer composed of a polyester resin containing a wax formed by co-extrusion at a polyester base having a melting point of 200 to 280 ° C. Material layer. 9.  A method of manufacturing an RFID medium, comprising: a step of unwinding a plurality of mesh films wound in a roll shape and a flexible printed wiring board or an inlay, and continuously performing heat lamination, wherein the use is as in the first ~6 items in the middle.  A flexible printed circuit board or inlay. ^ ^ 10. The method of manufacturing the RFID medium of the ninth aspect, wherein the antenna circuit is disposed on the heat-bonding layer of the biaxially stretched polyester film of the flexible printed wiring board or the inlay of any one of the first to sixth embodiments. [Effect of the Invention] @ By using the FPC, the embedded sheet, and the RFID media manufacturing method of the present invention, it is possible to reduce the high productivity, low defect rate, and electrical quality which cannot be achieved by the conventional manufacturing method. [Main structure and effect] The FPC of the present invention uses a biaxially stretched polyester film in which a thermal adhesive layer is provided in advance, so that it is not necessary to apply or laminate in the thermal lamination process or the previous step. The agent layer can simplify the manufacturing steps. Further, the FPC of the present invention is produced by subjecting a metal foil having a heat-bonding layer adhered to the surface of the film -13-200932523 to uranium engraving, so that the portion where the metal foil is removed by etching is again used as a thermal bonding layer. Therefore, when the RFID medium or the flat cable or the like is laminated on another resin film or the like, it is not necessary to recoat the adhesive, and the production steps can be simplified. Further, in the FPC of the present invention, the alignment crystal structure of the polyester molecule characterized by the biaxially stretched polyester film can be maintained by maintaining the melting point of the polyester film at 200 to 300 ° C to bond the metal foil. Therefore, it is excellent in mechanical strength or heat resistance, and can be continuously supplied to the heat lamination step as a mesh film. The thermal deformation of the processed 1C card or 1C label can be improved to a practically problem-free range. 0 .  Further, the heat-adhesive layer of the present invention is previously provided by co-extrusion, and can be stretch-aligned together when the mesh film is stretched and produced. Therefore, the thickness of the thermal bonding layer is superior and uniform compared to the processing caused by extrusion lamination or solution coating, and the dielectric characteristics deviation can be prevented when disposed near the antenna circuit of the 1C card or the 1C tag. This can reduce the partial Q difference of the communication distance. Further, since the heat-bonding layer which is stretched and aligned is also oriented as an amorphous molecule, it is a strong adhesive layer and can exhibit strong adhesion. Further, the biaxially stretched polyester film used in the FPC of the present invention is formed of a crystalline polyester resin containing no halogen. Therefore, in addition to being excellent in environmental suitability for use in RFID media, heat resistance and chemical resistance are also excellent. Further, the biaxially stretched polyester film used in the FPC of the present invention contains an appropriate amount of wax in the adhesive layer. Thereby, the lubricity is improved, and the occurrence of wrinkles when the metal foil is thermally bonded can be reduced. The necessary bonding strength can be obtained. -14- 200932523 In the manufacturing method of the present invention, the pressing step is not relied on the continuous lamination of the web film to produce an RFID medium, so that the production can be greatly improved as compared with the pressing processing of the sheet which is now widely used. speed. Further, in the production method of the present invention, since the mesh film is a biaxially stretched polyester film, it is possible to form a laminate at a high temperature, and it is particularly advantageous in comparison with an unstretched sheet made of an amorphous resin having poor heat resistance. High-speed mass production and processing is feasible. Further, in the production method of the present invention, the continuous laminating process is performed by the heated roll, so that the temperature or pressure distribution of the entire surface to be bonded can be easily and uniformly adjusted. Uniformity of the distribution of temperature or pressure.  The mechanical accuracy is limited and the frequency of thermal/mechanical damage to the 1C wafer or circuit is reduced as compared to conventional steps where temperature or pressure re-adjustment is necessary during the pressing process. [Other Structures and Effects] The biaxially stretched polyester film used in the FPC of the present invention contains a fine void in the film by a known technique for producing a polyester film containing voids in Q. This is a difficult technique in conventional PVC or PETG sheets. The apparent density of the heat-adhesive polyester film, i.e., void content, and thus film cushioning or softness, can be adjusted in a suitable range for use in RFID media. The moderate inclusion of fine voids in the film is effective for imparting weight, flexibility, cushioning, and writing properties to the RFID medium. Moreover, the RFID media used as a material containing a hollow polyacetal film is light in weight and will not sink immediately even if it falls in the water or in the sea. Therefore, it is possible to avoid the situation of lost media -15-200932523 t. Further, it contains a hollow polyester film, and the dielectric ratio of the appearance is low as compared with a polyester film or sheet which does not contain voids. therefore. In the HF band and even the SHF band, the communication medium has less communication loss. In other words, RFID media using a hollow polyester film as a material has a high profit, and is effective in communication accuracy, communication distance, and power saving. Further, the biaxially stretched polyester film used in the FPC of the present invention has a heat-adhesive layer of a moderate thickness mainly composed of an amorphous polyester resin. Therefore, by the thermal bonding step, the etched metal foil (antenna circuit) is buried in the heat-bonding layer and the unevenness is reduced, and the appearance or yield of the RFID article can be improved. Further, the biaxially stretched polyester film used in the FPC of the present invention has a heat-bonding layer formed of a mixture of an amorphous polyester resin and a thermoplastic resin and a wax which are incompatible with the resin. Therefore, the metal foil is removed by etching and exposed to the thermal bonding layer, and the static friction coefficient is 0. 1~0. 6. Blocking can be improved when manufacturing inserts and when using RFID to fabricate RFID media. Moreover, the addition amount of the thermoplastic resin of the amorphous polyester resin, the glass transition temperature and the melting point are adjusted to an appropriate range, whereby the friction coefficient can be reduced or the air leakage can be promoted without impairing the thermal adhesion. And can improve the appearance of the adhesive or the yield of the product. .  Further, in the thermal adhesive layer of the biaxially stretched polyester film used in the FPC of the present invention, the protrusion formed by the thermoplastic resin hardly falls off even if it is a large protrusion, and rarely causes contamination in the step. Hey. Moreover, according to the low-heat bonding temperature of -16-200932523, it is flattened by softening deformation during thermal bonding, so that there is no thermal adhesion generated when adding inorganic/organic particles of a large particle size. reduce. Further, since the possibility of deformation is also large compared with the inorganic/organic particles, there is a concern that the film strength is lowered. Further, the heat-adhesive polyester film used in the present invention can obtain the necessary planarity when used as a constituent material of the RFID medium. This adjusts the thickness of the thermal bonding layer and the thickness of the mesh film, and controls the heat shrinkage rate or the coefficient of linear expansion in the surface of the film in a suitable range, thereby reducing the curling caused by the post-processing steps and the like. Further, the biaxially stretched polyester film used in the present invention is suitably used in the exterior or intermediate layer of the RFID medium. The use of this film as an extrapolation or intermediate layer allows for the incorporation of the necessary electronic components/circuits. The present invention has a heat-bonding layer which can be moderately softened and deformed during thermal bonding processing, and without hindering, a polymer having a melting point or a glass transition temperature is contained in the heat-bonding layer and thus contains an island component ( Particle dispersion). In other words, the biaxially stretched polyester film used in the present invention has moldability which can surely absorb irregularities such as a 1C wafer or a metal foil circuit because it can maintain lubricity. [Best Mode of Carrying Out the Invention] In the FPC of the present invention, a biaxially stretched polyester film having a heat-bonded layer formed in advance by co-extrusion is adhered to the film via a heat-bonding layer. In the FPC produced by the etching of the metal foil on the surface, the substrate of the biaxially stretched polyester film has a melting point of 200 to 300 ° C, and the thermal adhesive layer contains wax. -17- 200932523 Further, in a preferred embodiment of the FPC of the present invention, the resin film is adhered by a heat-bonding layer exposed by etching to be laminated. Further, in a preferred embodiment of the FPC of the present invention, the biaxially stretched polyester film contains a white pigment or a fine void white polyester film. Further, in the FPC of the present invention, the heat-bonding layer of the biaxially stretched polyester film is made of a polyester resin containing wax. The polyester resin is preferably an amorphous polyester. Further preferably, the thermal adhesive layer of the biaxially stretched polyester film is formed by a mixture of an amorphous polyester resin A and a thermoplastic resin B which is incompatible with the resin A and a wax. The static friction coefficient of the stretched polyester film measured on both sides of the surface is 0. 1~0. 6 is better. Further, the static friction coefficient measured by the FPC is superposed on both sides of the film surface of the film in which the metal foil is removed by etching. 1~0. 6 is better. Further, in the FPC of the present invention, the thickness of the thermal adhesive layer provided on the biaxially stretched film is preferably 5 to 30, which is an amorphous polyester resin A having a glass transition temperature of 50 to 95 ° C. a mixture of a thermoplastic resin B which is incompatible with the resin A, a thermoplastic resin B (a) a crystalline resin having a melting point of 50 to 180 ° C, and (b) a glass transition temperature of -50 to 150 ° C In the preferred embodiment, the amorphous resin or (c) the mixture is contained in the heat-adhesive layer in an amount of 1 to 30% by mass. Further, in the embodiment of the RFID media insert of the present invention, it is preferable that the embodiment 1C is disposed in the FPC. Further, a preferred embodiment of the RFID medium of the present invention is constructed using the above-described insert sheet. -18-200932523 Further, in the method for producing an RFID medium according to the present invention, the method further comprises the steps of: unwinding a plurality of mesh sheets wound in a roll shape, and continuously performing heat buildup in one area layer, and preferably in the embodiment The above-mentioned FPC or insert is used for the mesh film, and is produced by a bonding step of a build-up roll which does not have a pressing step. Further, in the method of manufacturing an RFID medium of the present invention, as a layer adjacent to the antenna circuit, it is more preferable that the adhesive layer is not disposed. Hereinafter, embodiments of the present invention will be described in detail. 〇 [Flexible Printed Wiring Board] The FPC of the present invention is a biaxially stretched polyester film which is pre-formed by a co-extrusion to form a thermal adhesive layer, and adhered to the surface of the film by a heat bonding layer. The FPC produced by the engraving treatment of the metal foil was observed to have a melting point of 200 to 300 ° C after the etching treatment. The material of the metal foil used herein may be a metal having a small electrical resistance such as silver or copper, gold or aluminum, and since the circuit is formed by etching, it is preferable to use copper or aluminum which is easily etched by Q. Further, the thickness of the metal foil is not particularly limited, but from the viewpoints of workability or step stability, electrical performance, and cost of the FPC manufacturing step, it is preferably 5 to 100/zm, and 1 to 50#. m is better. Further, from the viewpoint of absorbing the unevenness of the metal foil (antenna circuit), it is preferably 15 to 60/zm. The method of bonding the metal foil to the biaxially stretched polyester film is not particularly limited except for the method of & thermal bonding, and the method which is generally widely used may be caused by thermocompression bonding or heating roller by hot pressing. The thermal laminate is bonded. By -19- 200932523 High pressure is applied in the thermocompression bonding system, even if the thick metal foil has the advantage of being able to be bonded, it is better to bond by the heat buildup due to an increase in production speed or a decrease in the defective ratio. The method of etching the metal foil to form a circuit is not particularly limited as long as the biaxially stretched polyester film adhered to the metal foil or the heat-adhesive layer thereof is significantly damaged. For example, in the case of copper foil or aluminum foil for metal, a well-known method using an aqueous solution of ferric chloride chloride can be used. Further, in the present invention, it is necessary to exhibit a melting point in the range of 200 to 300 ° C in the biaxially stretched film after being processed as an FPC. The well-known FPC produced by stretching the polyester film is heated to a temperature higher than the temperature of the polyester resin constituting the substrate and adhered in order to bond the metal foil _ laminate. Although these conventional FPCs exhibit sufficient properties in adhesion and the polyester film of the substrate is substantially amorphized, the steps of using FPC Q RFID or the heat used as products of RFID or FPC are insufficient. That is, in the case where the roll is unwound from the roll and laminated with the sheet or the like in the subsequent step, the substrate is softened to provide sufficient difficulty, or it may be shaped by the ambient temperature when used as an RFID or FPC. The biaxially stretched polyester film is melted at a temperature of 〜300 ° C after being processed as an FPC, more preferably at a temperature of 250 to 300 ° C, and the original alignment crystallization of the biaxially oriented film can be sufficiently maintained. The structure is really limited, so if the functional foil is not made (the ferric polyester thin uses the two-axis to heat the melting point of the heat, then the shape-resistant resin resistance is trapped and the deformation is 200 points, so - 20- 200932523 It is possible to prevent such problems caused by insufficient heat resistance. The melting point is in the above range, which is referred to as a biaxially stretched polyester film using polyethylene terephthalate resin or polyethylene naphthalate. The biaxially stretched polyester film of the ester resin, the polytrimethylene terephthalate fc and the copolyester resin as the basic skeleton is made to be a temperature at which the FPC is not heated to a temperature above the melting point during processing. Further, in the FPC of the present invention, the portion of the metal foil removed by the etching treatment is exposed by the heat bonding layer. The exposed thermal bonding layer maintains thermal adhesion, so that the adhesive is not used. Thermal bonding to other resin sheets or films The FPC or the embedded sheet can be used to form an RFID medium. The product thus formed can reduce the electrical characteristics, that is, the dielectric constant or the dielectric loss, because the adhesive is not used. When the resin layer or the film is bonded to laminate, the bonding strength is preferably 1 to 50 N/cm, more preferably 3 to 20 N/cm, and the bonding strength cannot satisfy the range, and is used as the FPC. When a product such as an RFID medium is used, peeling due to bending or rubbing may cause the product to be damaged. In addition, there is no particular problem in the case where the range is exceeded, which is, after all, exceeds the strength of the substrate itself. Adhesive force is not suitable due to excessive quality. In addition, as a method of adjusting the bonding strength to this range, in addition to the appropriate design of the thermal bonding layer as described below, the temperature at the time of heat bonding is 90 to 20 ( Preferably, the TC is adjusted in the range of 130 ° C to 180 ° C. Further, in the FPC of the present invention, the static friction coefficient is -0. 1~0. 6 is better than 0. 3~0. 5 is better. When the static friction coefficient is less than this range, when the FPC is stacked and stored, or when it is wound as a roll due to excessively high lubricity, the product collapses or the winding deviation causes difficulty in handling. Further, if the coefficient of static friction exceeds the above range, there is a case where the cut FPC is treated as a sheet or when it is wound on a roll. [Inlay sheet and RFID medium] The insert sheet refers to an antenna circuit formed by a conductor such as a metal on the surface of a film substrate, a capacitor connected to the circuit, or an intermediate product for manufacturing an RFID medium. The inlay piece of the present invention is such that the FPC of the present invention is used as an antenna circuit, and the electronic component as described above is disposed in the circuit. The composition is not particularly limited, and it is preferred that the heat-adhesive layer is exposed on at least one of its sides. The exposed thermal adhesive layer is used for maintaining thermal adhesion, and can be thermally bonded to other resin sheets or films without using an adhesive to form an RFID medium. In the product thus constituted, since the adhesive is not used, the electrical characteristics, that is, the variation in dielectric constant or dielectric loss can be reduced. In the case where the resin sheet or the film is adhered and laminated by the exposed heat bonding layer, the bonding strength is preferably 1 to 50 N/cm, preferably 3 to 20 N/cm. In the case where the bonding strength is less than this range, when it is used as a product such as an FPC or an RFID medium, peeling due to bending or friction may cause the product to be damaged. Further, although there is no particular problem in the case where the range is exceeded, it is a bonding strength exceeding the strength of the substrate itself, and -22-200932523 causes excessive quality and is therefore poor. In addition, in the method of adjusting the bonding strength to the range, the temperature of the thermal bonding layer can be adjusted to be 90 to 200 ° C, except that the thermal bonding layer is appropriately designed as follows. 130 ° C ~ 180 ° C range. Further, the RFID medium of the present invention is not particularly limited as long as the insert of the present invention can be used, and other resin sheets or films can be laminated and adhered to the insert of the present invention. The resin sheet and the film which are laminated are not particularly limited, but from the viewpoint of environmental suitability, it is preferable to form a thin sheet or a film made of a polyester resin, and heat resistance, chemical resistance, mechanical strength, and the like are preferable. In view of the above, it is preferred to use a biaxially stretched polyester, and it is preferably a white polyester film containing a white pigment or a fine void. ^ The use of a white polyester film for lamination means an appropriate embodiment for improving the concealability or whiteness of the RFID medium. Thereby, an aesthetically pleasing medium can be produced in the case where the surface is printed. Moreover, concealing the built-in electronic components or circuits can enhance safety. ❹ In addition, the best implementation is to use a thin film containing fine voids inside. The effect of the micro-cavity can provide the RFID media with cushioning properties. In addition to protecting the internal circuit, it can also make the RFID flexible, improve the processing performance, and write excellent signatures on the card. The power rate and dielectric loss are reduced, and the communication distance of the RFID is greatly improved, and the like has many advantages. Further, in order to laminate the biaxially stretched polyester film by thermal bonding, it is effective to use a film having an adhesion improving layer on the surface to improve the bonding strength of the -23-200932523. [Composition of Film] The FPC of the present invention is characterized in that a biaxially stretched polyester film of a pre-shaped adhesive layer is used by co-extrusion. The following is a detailed description of the biaxially stretched film. The biaxially stretched polyester film used in the present invention is composed of a substrate and a heat-bonding layer on the one-sided or two-layer layer. Biaxially stretched polyester film is used for the substrate, and in addition to environmental suitability (excluding halogenated antimony, it is heavy in terms of heat resistance or chemical resistance, strength, rigidity, etc.) The use of the unaligned PVC sheet or the PETG thin-comparison, these characteristics can be dramatically improved. Moreover, the biaxially stretched polyester film used in the present invention is important in that it has a heat-bonding layer on one side thereof. The heat-bonding layer refers to a layer that is heat-bonded to the various coating layers formed on the surface of the plastic film or sheet constituting the 1C card or the 1C label, and is laminated on the heat-bonding layer. The material can be given the same thermal adhesion as PVC or PETG which is a conventional ic card or ic standard material. The thickness of this thermal bonding layer is 5/zm or more and 30/zm is important for each layer. When the thickness of the layer is less than 5/zm, the thermal adhesion is not sufficient. On the other hand, the thickness of the thermal bonding layer is 3 〇vm, and the card for using the conventional pETG sheet as a material. Same as 'heat resistance or chemical resistance. The lower limit of the thickness of the thermal bonding layer is better' to 10 ; / m is better. On the other hand, the upper limit of the thickness of the thermal bonding layer into a hot ester thin substrate, the compound): The film is equal to or two conditions, and the sign is less than the film phase % β τα.  It is better to use 25 -24-200932523 /im and 20#m. In the step of arranging the hot-adhesive layer on the surface of the substrate, in the step of extruding the molten raw material to produce the unstretched sheet, the method of laminating and extruding the two kinds of resins in a molten state is used. The so-called co-extrusion method. According to the method, the thermal adhesive layer which is laminated in the layer has a small variation in thickness in each part of the plane, so that the dielectric characteristic deviation between the parts is small compared with the adhesive layer caused by the adhesive or the like, and the FPC manufactured by using the FPC can be used. Or the electrical characteristics of the RFID medium are improved, and the leakage current phenomenon or the communication distance can be improved. Further, in the biaxially stretched polyester film used in the present invention, a heat-adhesive layer is provided on both surfaces of the substrate, and the film can be suppressed from being crimped, which is an appropriate embodiment. In the present invention, the thermal adhesive layer is mainly composed of an amorphous resin, and the thermal expansion coefficient is greatly different from the base material in which the crystalline polyester resin is a main component. Therefore, in the case where the heat-adhesive layer is provided on only one side of the substrate, there is a case where it is curled like a bimetal depending on the processing conditions or the use conditions, and the planarity or handling property is unfavorable. Q In the case where a thermal bonding layer is provided on both sides of the substrate, the ratio of the thickness of the thermal bonding layer in the surface is 0. 5 or more and 2. 0 or less is preferred. In the case where the range is exceeded, the case of curling may occur for the above reasons. Further, even in the case where the crimping occurs, there is no substantial hindrance to the handleability when the heating is performed at a temperature of 1 1 〇 ° C for 30 minutes in a no-load state. More preferably, the crimp is less than 3 mm, and particularly preferably less than 1 mm. Further, another method for suppressing curling is to positively cause a difference in temperature or heat imparted to the surface of the film and the back surface, and as a result, there is a method of making the curling 値 close to -25 - 200932523. Specifically, the stretching step and the heat fixing step such as longitudinal stretching or transverse stretching are used to make the positive or negative temperature or heat of the film different, and the orientation of the surface of the film and the back surface can be independently controlled to make the surface of the film and The structure or physical balance of the back is balanced. The result is a reduction in curling. In the case of using this method, it is convenient and appropriate to adjust the temperature of the roller or the infrared heater which heats the surface of the film and the back surface during the heating/cooling of the film in the longitudinal stretching step. Further, the biaxially stretched polyester film used in the present invention is preferably 25 μm or more and 350 # m or less in total thickness of the film. The lower limit of the overall thickness of the film is preferably 38#m, more preferably 50#m. Further, the upper limit of the total thickness of the film is preferably 2 80 vm, preferably 200 // m, and the thickness of the entire film is less than 25 μm, because of mechanical strength or handling, the stability of the steps in the manufacture of FPC or RFID media is not It is not good enough. On the other hand, the thickness of the entire film exceeds 350/zm, and the standard thickness of the RFID medium (for example, the JC specification is 0. Among the 76 mm), it is not preferable because it restricts the combination of other sheets or films and circuits. Further, in the biaxially stretched polyester film used in the present invention, a coating layer may be provided on the surface of the film in order to further improve heat adhesion or lubricity, or to impart other functions such as antistatic property. The resin or the additive constituting the coating layer may, for example, be a polyester resin, a polyurethane resin, a polyester urethane resin or an acrylic resin, and is used for improving the adhesion of a usual polyester film. Resin, or an antistatic agent that improves antistatic properties. The biaxially stretched polyester film of -26 to 200932523 used in the present invention is preferably one having a higher affinity with respect to the material laminated on the film in terms of the criteria for selecting an appropriate one from the resins or additives. Specifically, it is preferred to select a resin or an additive which is close to the surface tension or solubility parameter. However, in the case where a curable resin or the like is applied, the thermal adhesiveness of the important effect of the present invention may be hindered, and the selection of materials is necessary. In terms of a method of providing a coating layer, a gravure coating method, a kiss coating method, a dipping method, a spray coating method, a curtain coating method, an air knife coating method, a blade coating method, and a reverse roll coating method can be applied. The method usually used. In the coating stage, a method of coating before stretching of the film, a method of coating after longitudinal stretching, can be used.  Any of the methods of coating the surface of the film subjected to the alignment treatment, and the like. [Thermal bonding layer] In the FPC of the present invention, the substrate is important to use a biaxially stretched polyester film in which a heat bonding layer is previously formed by co-extrusion, and it is important that the heat bonding layer contains a wax. . In addition to the polyolefin-based resin, the polyester-based resin, the polyether-based resin, the acrylic resin, and the polyfluorene-based resin, a natural mineral such as montan wax can be used. A plant wax such as wax or carnauba wax is important together with a polyester resin because it can be processed to have heat resistance. Among them, a suitable polymer wax is a synthetic polymer wax, and a polyolefin wax is more preferable from the viewpoints of softening temperature, surface tension, and handleability. Here, as a method of allowing the wax to be contained in the heat-adhesive layer, in addition to the above-mentioned addition of the wax, a resin component such as a polyethylene resin, a polypropylene resin or a polyethylene glycol resin is added. It contains a low molecular weight component contained in the resin as a wax. The amount of wax contained varies depending on the type, and it is difficult to limit it at a time. For example, in the case of using a polyolefin wax or a polyethylene glycol resin, it is preferably 0. 03 to 3 mass% with respect to the heat bonding layer, and is 0. 1~0. 8% by mass is better. Further, when a polyethylene resin is added and the low molecular weight component is used as a wax, it is preferable to add 1 to 20% by mass as the polyethylene resin, and more preferably 3 to 10% by mass. The appropriate addition amount of other waxes can be designed to make the static friction coefficient of 0. 1~0. The addition amount of 5 or so is the target. .  Further, the wax is preferably a material having a melting point of 40 to 150 ° C, more preferably 50 to 1 20 ° C. In the case where the melting point is less than this range, the step of melt extrusion is unstable, or is liable to cause thermal deterioration, because the surface of the film is bleed out and precipitation is not good. Further, when the melting point is outside this range, the effect of reducing the friction is lowered, or the thermal adhesion is hindered. Further, the heat-adhesive layer is preferably composed of an amorphous polyester resin A having a heat of fusion of 20 mJ/mg or less as a main component. Here, the heat of fusion refers to the melting heat measured by heating in a nitrogen atmosphere at a rate of 10 ° C /min according to the "method of measuring transfer heat of plastics" described in JIS-K7122. In the present invention, the heat of fusion is preferably 10 m J/mg or less,

實質上無法觀察熔融峰値更佳。在熔融熱量爲20m〗/mg以 下之情形，在熱黏接步驟中熱黏接層易於變形，可更良好 的吸收金屬箔或電子零件等凹凸，可供平面性優異之FPC -28- 200932523 或鑲嵌片、RFID媒體》 又，非晶性聚酯樹脂A，以玻璃轉移溫度50°C以上且 95 °C以下爲重要。此外上述玻璃轉移溫度，依照IIS-K7 121 記載之「塑膠之轉移溫度測定方法」，使用DSC裝置，在 氮氛圍下，以1CTC /分速度加熱，所得之DSC曲線爲基礎 所求得之中間點玻璃轉移溫度（Tmg)之意。非晶性聚酯樹脂 A之玻璃轉移溫度之下限以60°C爲佳，以70°C更佳。另一 ❹ 方面，玻璃轉移溫度之上限以90°C爲佳，以85 °C更佳。在 玻璃轉移溫度未達50°C之情形，在作爲FPC或RFID媒體 > 使用時耐熱性不足而變形，或僅稍微加熱使熱黏接層再剝 離。另一方面，玻璃轉移溫度在超過95t之情形，在製造 FPC或RFID媒體時於高溫度因產生加熱之必要，因而使生 產速度減少，或對電路等負担變大並不佳。 非晶性聚酯樹脂A之種類則並無特別限定，就相對於 Q 廣泛使用性或成本、耐久性或PETG薄片等熱黏接性之觀 點而言，以使用導入各種共聚合成份於聚對酞酸乙二酯所 代表之芳香族聚酯樹脂之分子骨架者爲佳。在導入之共聚 成份中，二醇成份方面，可例舉乙二醇或二乙二醇、新戊 二醇（NPG)、環己烷二甲醇（CHDM)、丙二醇、丁二醇等。 另一方面’酸成份方面可例舉對苯二甲酸或異酞酸、萘二 羧酸等。共聚成份方面，係選擇可使玻璃轉移溫度降低，可 提高在低溫之熱黏接性之單體。此種共聚成份方面，可例舉 -29- 200932523It is substantially impossible to observe the melting peak 値. In the case where the heat of fusion is 20 m/mg or less, the heat-adhesive layer is easily deformed in the thermal bonding step, and the irregularities such as metal foil or electronic parts can be better absorbed, and the FPC -28-200932523 or the flatness is excellent. Inlay sheet, RFID medium Further, the amorphous polyester resin A is important in a glass transition temperature of 50 ° C or more and 95 ° C or less. In addition, the above-mentioned glass transition temperature is obtained by using a DSC apparatus and heating at a rate of 1 CTC /min in a nitrogen atmosphere in accordance with the "measurement method of transfer temperature of plastic" described in IIS-K7121, and the intermediate point obtained based on the obtained DSC curve. Glass transfer temperature (Tmg). The lower limit of the glass transition temperature of the amorphous polyester resin A is preferably 60 ° C, more preferably 70 ° C. On the other hand, the upper limit of the glass transition temperature is preferably 90 ° C, more preferably 85 ° C. In the case where the glass transition temperature is less than 50 ° C, it is deformed by insufficient heat resistance when used as an FPC or RFID medium > or only slightly heated to peel off the heat-adhesive layer. On the other hand, when the glass transition temperature exceeds 95 t, it is necessary to generate heat at a high temperature in the production of FPC or RFID medium, so that the production speed is reduced, or the burden on the circuit or the like is not so high. The type of the amorphous polyester resin A is not particularly limited, and it is used for the purpose of thermal compatibility such as Q wide-spreadness, cost, durability, or PETG sheet. The molecular skeleton of the aromatic polyester resin represented by ethylene phthalate is preferred. Among the copolymer components to be introduced, ethylene glycol, diethylene glycol, neopentyl glycol (NPG), cyclohexanedimethanol (CHDM), propylene glycol, butylene glycol, and the like are exemplified as the diol component. On the other hand, the acid component may, for example, be terephthalic acid or isophthalic acid or naphthalene dicarboxylic acid. In terms of copolymerization components, monomers which lower the glass transition temperature and improve the thermal adhesion at low temperatures are selected. Such a copolymerization component can be exemplified by -29-200932523

直鏈成份長的乙二醇，或立體障礙大的非線狀構造成份。 後者之成份係使用於可使熱黏接層之結晶性有效地減低並 欲提高凹凸吸收性之情形。在本發明中，就相對於PETG 薄片之熱黏接性之觀點而言，以CHDM或NPG爲佳，以NPG 更佳。 又，作爲非晶性聚酯樹脂A，一般係開發作爲黏接劑 用途，亦有在市面上販售者。在使用此種黏接劑用樹脂之 情形，原來因開發作爲黏接劑使用，而有可黏接於廣泛材 料之可能性。但是此種黏接劑用樹脂，在二軸拉伸薄膜之 製造步驟中穩定地共擠壓者會有困難之情形。在共擠壓無 - 法穩定地進行之情形，爲本發明要點之一的熱黏接層厚度 . 偏差無法充分減低，就會損及1C卡或1C標籤之電氣特性。 在此種情形，充分調整擠壓機溫度之控制或熱黏接層之厚 度等，使熱黏接層厚度分布予以均一化則爲必要。 又，本發明中，熟黏接層含有非晶性聚酯樹脂A，與 Ο 和此樹脂A爲非相溶的非晶性或結晶性之熱塑性樹脂B， 形成爲海島構造。熱塑性樹脂B在熱黏接層中係以分散體 (島構造）存在。又，起因於此海島構造之島構造的突起， 賦予潤滑性於熱黏接性聚酯薄膜，在熱黏接之步驟該突起 崩解並變平坦，則有不致阻礙熱黏接性，等之作用效果。 以下，就可作爲熱塑性樹脂B使用之非晶性熱塑性樹 脂與結晶性熱塑性樹脂加以說明。 上述非晶性熱塑性樹脂係指熔融熱量20m〗/mg以下之 -30- 200932523 熱塑性樹脂。此外’熔融熱量係依照ns Κ 7122γ塑膠之 轉移熱測定方法」’使用DSC裝置，在氮氛圍下，於10〇c /分速度進行加熱來測定。 非晶性熱塑性樹脂’在熱黏接層內部於非晶性聚酯樹 脂中形成島構造’起因於此之突起形成於熱黏接層表面。 此突起，在室溫中可維持充分的硬度，而有必要提高薄膜 之潤滑性。因此’本發明中’作爲成爲島成份之熱塑性樹 座 脂B在使用非晶性之熱塑性樹脂之情形，樹脂之玻璃轉移 溫度在-50°C以上且150°C以下爲重要。此外，上述玻璃轉 移溫度係根據JIS K 7121所示「塑膠之轉移溫度測定方 . 法」。因此，以DSC裝置在氮氛圍下於10 °C/分之加熱過 程測定之，中間點玻璃轉移溫度之意。 非晶性熱塑性樹脂之玻璃轉移溫度之下限以- 20 °C爲 佳，以0 °C更佳。非晶性熱塑性樹脂之玻璃轉移溫度在未 達一 50°C之情形，在處理薄膜時會有無法獲得需要的潤滑 Q 性之情形，或在製造FPC或RFID媒體後有熱塑性樹脂成 份滲出於表面之情形。 又，此海島構造所致突起在熱黏接步驟被破壞成爲平 坦，以不致阻礙熱黏接性之方式作用。在本發明係在製造 ' FCP或RFID媒體時所進行之積層，較佳可在1〇〇〜200°C可 適當實施。因此上述非晶性熱塑性樹脂之玻璃轉移溫度之 上限以130°C較佳，以100°C以下進而爲佳。另一方面，非 晶性熱塑性樹脂之玻璃轉移溫度在超過150 °C之情形’在通 -31- 200932523 常黏接溫度並無法獲得充分的熱黏接性，在更高溫度進行 熱黏接之情形會有對電路等之負担變大的問題。 另一方面，在本發明中，作爲添加於熱黏接層所使用 之熱塑性樹脂B，可使用結晶性熱塑性樹脂。上述結晶性 熱塑性樹脂係指熔融熱量超過20mJ/mg之熱塑性樹脂。此 外，熔融熱量係根據〗IS K 7122記載之「塑膠之轉移熱測 定方法」，使用DSC裝置，在氮氛圍下，於10°C/分昇溫 速度加熱並測定。 〇 此結晶性熱塑性樹脂，因與非晶性聚酯樹脂A爲非相 溶，故在非晶性聚酯樹脂中形成作爲分散體之島構造，起 . 因於此之突起形成於熱黏接層表面。此突起在室溫中可維 持硬度，而有提高薄膜之潤滑性的必要。因此，結晶性之 熱塑性樹脂，熔點以50°C以上且200°C以下之樹脂爲重要。 此外，結晶性熱塑性樹脂之熔點係根據〗IS K 7 1 2 1記載之 「塑膠之轉移溫度測定方法」，使用DSC裝置，在氮氛圍 0 下，於I0°c /分之速度進行加熱並測定。 結晶性熱塑性樹脂熔點之下限以70°C較佳，以90°C爲 佳。又，在熱黏接之步驟中被破壞成爲平坦，而爲了以不 致阻礙黏接之方式作用，故樹脂之熔點在熱黏接步驟比最 ' 高溫度還超過30°C以上並不佳。更具體言之，樹脂熔點之 上限以180°C較佳，以160°C進而爲佳。 本發明中，熱黏接層中所使用之熱塑性樹脂，並無特 別限定，因與非晶性聚酯樹脂混合而使用，故溶解度參數 -32- 200932523 之差與聚對酞酸乙二酯比較，以成爲2.0(J/cm3)W2 脂爲適當。 作爲非晶性且廣泛使用性高的樹脂，可例舉 或聚碳酸酯、丙烯酸樹脂類、環狀烯烴樹脂類或其 立體規則性低的低密度聚丙烯或聚乙烯等烯烴類 物等，而因對熱或紫外線、氧之穩定性高，因更廣 故以聚苯乙嫌或聚烯烴類爲佳，就耐熱性高之觀 以聚苯乙烯或環狀烯烴共聚物更佳。 〇 又，在結晶性且廣泛使用性高的樹脂方面， 乙烯或聚丙烯、聚丁二烯、聚乙烯丙烯橡膠、聚 氧化亞甲基等。該等中就相'對於熱或紫外線、氧 . 高’可更廣泛使用之點而言，以聚乙烯或聚丙烯 熔點爲適切之點而言，以聚乙烯更佳。此外，在 由結晶性之點而言以密度超過〇.90g/cm3之高密 或直鏈狀低密度聚乙烯爲佳。 〇 又，在本發明中’含於熱黏接層之熱塑樹脂 相對於構成熱黏接層之材料，爲1質量％以上且 以下。熱塑性樹脂B含量之下限以3質量％爲佳 量％更佳。另一方面，熱塑性樹脂B之含量上限| %爲佳，以20質量％更佳。熱塑性樹脂B之含量， 質量％之情形，則無法獲得必要的潤滑性。另一方 性樹脂B之含量’在超過30質量％之情形，成爲雅 在自薄膜表面脫落之情形，反而使潤滑性變差之 以上之樹 聚苯乙烯 共聚物， 或其共聚 泛使用， 點而言， 可例舉聚 乳酸、聚 之穩定性 爲佳，在 聚乙烯， 度聚乙烯 B之量， 3 0質量％ ，以5質 义25質量 在未達1 面，熱塑 I大突起， 情形，或 -33- 200932523 在熱黏接步驟並無法充分平坦化而會有熱黏接性變差之情 形。 又，在本發明中，熱黏接層表面之最大高度爲1.0//m 以上，且以10/zm以下爲佳。熱黏接層表面最大高度之下 限，以1.2/zm進而爲佳，以l_5/zm特佳。另一方面，熱 黏接層表面最大高度之上限，以8.0ym較佳，以5.0//m 特佳。熱黏接層表面之最大高度在未達1.0/zm之情形，並 無法獲得充分潤滑性，使得薄膜之處理性變困難。另一方 © 面，熱黏接層表面之最大高度在超過10"m之情形，因擦 過使得薄膜表面之突起脫落而污染到反應步驟，或反而使 . 潤滑性變差^ 又，在本發明中，熱黏接層表面之最大高度（Stl)與算 術平均表面粗度（Sal)之比（Stl/Sal)以3.0以上，且以20以 下爲佳。Stl/Sal之下限以5.0較佳，以7.0特佳。另一方 面，Stl/Sal之上限以16較佳，以12特佳。在Stl/Sal未 Q 達3.0之情形，改善潤滑性有困難。另一方面，stl/Sal在 超過20之情形’則難以獲得熱黏接性。 在將熱黏接層表面中突起之最大高度調節於適切範圍 之方法方面’可例舉（1)選擇非晶性聚酯樹脂A之熔融黏度 ' 或玻璃轉移溫度之方法，（2)選擇熱塑性樹脂B之熔融黏度 或玻璃轉移溫度、熔點、表面張力、溶解度參數、添加量 之方法’（3)選擇將熱黏接層之樹脂擠壓於薄膜表面時之溫 度之方法等。即使在該等方法中，調節非晶性聚酯樹脂之 -34- 200932523 玻璃轉移溫度，與熱塑性樹脂之種類或添加量、擠壓溫度 之方法爲容易且確實。 又，在本發明中，將熱黏接層之表面，與平滑且清淨 的玻璃板對向並夾持，以使經熱壓處理（loot、IMPa、1 分鐘）後熱黏接層表面之最大突起髙度（St2)，以0.00 1/zm 以上且3/zm以下爲佳。St2之下限以0.00 5/zm較佳，0.01 ym最佳。又，St2之上限以2.5ym較佳，以2#m以下最 佳。 ^ 在St2未達0.00 5/zm之情形，在熱積層時構成熱黏接 層之樹脂流動，會有加工穩定性不充分之虞。又，St2在超 _ ' 過0.01 # m之情形，即使在熱黏接後殘留有多數突起，在 發揮穩定之黏接力上，因無法獲得充分的黏接界面故不 佳。此外，爲使St2調節於0.001〜3ym之範圍，可將結 晶性熱塑性樹脂之熔點調整於50〜200°C之範圍內，或使結 晶性熱塑性樹脂之含量調節於1〜30質量％之範圍內則爲 Q 有效。 又，本發明所用之熱黏接性聚酯薄膜，係使薄膜表面 與背面相對向，在其界面中靜摩擦係數爲0.1以上且0.6 以下爲佳。摩擦係數之下限以0.2更佳。另一方面，摩擦 ' 係數之上限以0.7較佳，以0.6進而爲佳，而以0.5特佳。 在薄膜表面與背面間之靜摩擦係數未達0.1者在本發明技 術之範圍爲困難。另一方面，上述靜摩擦係數在超過0.8 之情形，薄膜之處理性顯著變差。爲使靜摩擦係數調節於 -35- 200932523 〇·1〜0.8之範圍，如上述方式以調節熱黏接層 度’或調節熱黏接層之彈性率或表面張力爲佳 又，用以調節靜摩擦係數於上述範圍之方 添加蠟於熱黏接層上。熱黏接層因爲非晶性故 相對地黏性高。在此種熱黏接層即使添加非相 樹脂或無機粒子、有機粒子亦無法充分減低摩 添加蠟。 又，在配置於FPC上之電路或RFID媒體f 片等所致凹凸，在本發明所用之二軸拉伸聚酯 接層被吸收。此凹凸吸收性作爲熱黏接步丨 - (forming)性之標準，係可以成形率及成形部分 之參數來表現。在此成形率係指將天線電路或 於熱黏接層表面，經熱壓後，於常溫常壓在將 銅箔片除去時，因天線電路或銅箔片所產生之 處之深度之意，成形部外緣之傾斜度係指在此 〇 中壁面之傾斜度之意。 又，在本發明所用之二軸拉伸聚酯薄膜， 形率爲40%以上，且以105%以下爲佳。就可吸 1C晶片或電路凹凸的觀點而言，成形率之下 ' 佳，以60%進而爲佳。 由此觀點可知，當然成形率之上限越高則 但是，爲使成形率提高，於加熱時將易於極端 脂作爲熱黏接層使用之情形，在熱黏接步驟會 表面最大高 〇 法方面，可 彈性率低， 溶之熱塑性 擦係數，故 勺部之1C晶 薄膜之熱黏 潔所致成形 外緣傾斜度 銅箔片載置 天線電路或 熱黏接層凹 凹處之外緣 熱壓所致成 收本發明之 限以 5 0 %較 越爲理想。 地軟化之樹 有熱黏接層 -36- 102% 200932523 流動等使得加工穩定性降低之顧慮，故就現實而言j 以下，更現實而言以定於98 %以下更佳。此外，作 形率調整於40〜105 %以下之方法，可例舉將熱黏接 度調整於5/zm以上，或將構成熱黏接層之非晶性聚 A或熱塑性樹脂B之玻璃轉移溫度或熔點接近熱 度，或適宜調整混合比率、黏度、彈性率等之方法 又，本發明中，因熱壓所致成形部外緣之傾斜度 以上，且1 000%以下爲佳。本發明中就由熱黏接層I 晶片或電路凹凸之觀點而言，所成形之凹部形狀， 路等外形一致者爲佳。成形部外緣之傾斜度，在未 _ 之情形係指相對於電路等之凸部，至其周邊爲止受 並變形，或者無法充分吸收凸部形狀之狀態之意。 度以50%以上較佳，以100%以上進而爲佳。 又’就凹凸吸收性之觀點而言，熱壓所致成形 之傾斜度越大，當然越爲理想的變形，在幾何學上 0 大者最佳。但是，在本發明所揭示之技術範圍要在 達成，則爲至上限1〇〇〇 %爲止，在更一般的加工步 實上要達成則爲500 %以下。此外，在將熱壓所致成 緣之傾斜度調整爲20〜1 000%範圍內之方法方面， ' 熱黏接層厚度調整於5/zm以上以外，亦有適宜調整 黏接層之非晶性聚酯樹脂A或非晶性熱塑性樹脂b 轉移溫度或混合比率、黏度、彈性率等等之方法。 又’本發明所用之二軸拉伸聚酯薄膜中，尤其 爲將成 層之厚 酯樹脂 黏接溫 等。 以20% S;收 1C 以與電 達20% 到影響 其傾斜 部外緣 以無限 現實上 驟在現 形部外 除了將 構成熱 之玻璃 是在作 -37- 200932523 爲白色且隱蔽性爲必要的卡片或標籤之材料使用之情形， 在熱黏接層中以含有白色顔料者爲適當實施形態之一。在 含於熱黏接層之白色顏料方面，以由氧化鈦、碳酸鈣、硫 酸鋇及該等複合體所成者爲佳，就由隱蔽效果之觀點而 言，以使用氧化鈦更佳。該等無機粒子，相對於基材之二 軸拉伸聚酯薄膜之構成材料以含有30質量％以下範圍爲 佳，以20質量％以下更佳。在添加超過上述範圍之情形， 在二軸拉伸聚酯薄膜之製造步驟發生薄膜之裂斷可使生產 〇 效率顯著降低，或使薄膜之介電率或介電損失上昇使得 FPC或RFID之電氣特性降低故不佳。 又，在本發明所用之二軸拉伸聚酯薄膜，在不阻礙熱 黏接性或潤滑性、凹凸吸收性之範圍，以在熱黏接層含有 有機粒子亦無妨。藉由在熱黏接層含有有機粒子，可使突 起形成於熱黏接層之表面，在藉由熱積層進行熱黏接以製 造FPC或RFID媒體時，可使薄膜間之氣泡有效地排出。 Q 作爲有機粒子，以三聚氰胺樹脂或交聯聚苯乙烯樹 脂、交聯丙烯酸樹脂及以該等爲主體之複合粒子爲佳。此 外，該等無機粒子，相對於熱黏接層之構成材料以含有30 ' 質量％以下範圍爲佳，以20質量％以下更佳。在添加超過 上述範圍之情形，在二軸拉伸聚酯薄膜之製造步驟會有薄 膜之裂斷發生，使生產效率顯著降低之情形並不佳。 [塗布層] 在本發明所用之二軸拉伸聚酯薄膜，其特徵爲表面具 -38 - 200932523 有因塗布所形成之黏接層。形成塗布層之目的，除了具有 熱黏接層之固定效果，加上在爲金屬與塗布層之主成份的 樹脂之間所形成之化學鍵結，因而可獲得更爲強固的黏接 強度。 作爲塗布層所使用之樹脂，爲熱塑性樹脂，以含有可 與羥基、羧基等金屬配位鍵結的官能基爲所望。又，與形 成水與塗布層之二軸拉伸聚酯薄膜之接觸角以80度以下 爲佳，以75度以下較佳，70度以下進而爲佳。在滿足此種 〇 條件之樹脂方面，以聚胺甲酸乙酯樹脂、丙烯酸樹脂、聚 烯烴樹脂、聚酯樹脂、聚酯胺甲酸乙酯樹脂等使通常聚酯 _ 薄膜之黏接性提高所使用之樹脂爲佳，較佳爲聚胺甲酸乙 酯樹脂、聚烯烴樹脂、聚酯樹脂，更佳可使用聚胺甲酸乙 酯樹脂、聚烯烴樹脂。在其中之蝕刻處理步驟、光阻剝離 處理步驟中因浸漬於酸、鹼溶液中，故以耐水解性優異之 樹脂更佳。 Q 又，爲塗布層主成份的樹脂，藉由添加熱而可與薄膜、 金屬等基材黏接。爲黏接對象之基材與樹脂將爲剝離強度 3N/cm以上之黏接溫度之下限値作爲黏接開始溫度時，在 製造FPC或RFID時，由於積層在100〜200 °C可適當的實 施，故塗布層之黏接開始溫度以130°C以下爲佳，以100°C 以下更佳。塗布層之黏接開始溫度係在超過1 6 0 °C之情形， 塗布層之樹脂並無法充分軟化，因會黏接不良故不佳。 塗布層係在二軸拉伸聚酯薄膜之製膜步驟中塗布塗布 -39- 200932523 液後，經過乾燥步驟、拉伸步驟、熱固定處理步驟而形成 之物。作爲設置塗布層之方法，可適用通常所使用之凹版 印刷（gravure)塗布方式、接觸塗布方式、浸漬方式、噴 灑塗布方式、簾塗布方式、氣刀塗布方式、刀片塗布方式、 逆輥塗布方式等方法。作爲塗布之階段，可使用在薄膜拉 伸前進行塗布之方法，在縱拉伸後進行塗布之方法，在完 成了配向處理之薄膜表面進行塗布之方法等任一種方法， 但就維持薄膜之平面性之觀點而言，在塗布後至少在一軸 方向進行拉伸之方法爲佳。 塗布層之厚度以0.005〜lym爲佳，以0.01〜0.5ym . 較佳，以0.02〜0.1/zm最佳。厚度在無法滿足此範圍之情 形下，因無法維持黏接性故不佳。又厚度超過此範圍之情 形，因會降低具有熱黏接層之凹凸吸收性故不佳。 塗布面係在與塗布層所加熱之輥面接觸時，輥與薄膜 因黏接完成，故較佳之實施形態爲成爲只有不與輥面接觸 Q 之二軸拉伸聚酯薄膜之單面。 塗布液並不會損及在以隱蔽性、緩衝性爲始之二軸拉 伸聚酯薄膜之優點。又，因在二軸拉伸聚酯薄膜上薄薄的 ' 塗布，故即使對凹凸吸收性亦無影響。又，在塗布後因在 ' 至少一軸方向拉伸，故並無損及二軸拉伸聚酯薄膜之平面 性。 [二軸拉伸聚酯薄膜之基材層] 本發明所用之二軸拉伸聚酯薄膜，係使至少一層之二 -40- 200932523 軸拉伸聚酯薄膜層成爲基材。此層可以習知之方法而容易 地調節光學特性或力學特性。 在將本發明所用之二軸拉伸聚酯薄膜作爲白色或高隱 蔽之FPC或RFID媒體之材料使用之情形，作爲基材薄膜， 於其內部以多數含有微細空洞之，含有空洞之聚酯薄膜爲 佳。藉由薄膜內部之多數微細空洞，以將薄膜之表觀密度 控制於0.7g/cm3以上且1.3g/cm3以下爲佳。薄膜表觀密度 之下限以0.8g/cm3較佳，以0.9g/cm3爲更佳。另一方面， 〇 薄膜表觀密度之上限以1.2g/cm3較佳，以l.lg/cm3爲更佳。 薄膜之表觀密度在未達0.7 g/cm3之情形，薄膜之強度或耐 . 縱向彎曲性、壓縮回復率降低，在FPC或RFID媒體製造 時或使用時並無法獲得適切的力學性能。另一方面，薄膜 之表觀密度在超過1.2g/cm3之情形，並無法獲得作爲FPC 或RFID媒體爲必要的柔軟性或緩衝性、輕量性。 作爲薄膜內部含有空洞之方法，可例舉（1)使含發泡劑 〇 在擠壓時或製膜時因熱而發泡，或因化學分解而致發泡之 方法，（2)在擠壓時或擠壓後添加碳酸氣體等氣體或可氣化 的物質，予以發泡之方法，（3)添加非相溶性之熱塑性樹脂 於聚酯與該聚酯，在熔融擠壓後，進行一軸或二軸拉伸之 ' 方法，（4)添加有機或者無機之微粒子予以熔融擠壓後，進 行一軸或二軸拉伸之方法等。 在上述薄膜內部使含有空洞之方法中，上述（3)之方 法’亦即係添加聚酯與非相溶性之熱塑性樹脂，在熔融擠 -41 - 200932523 壓後，以進行一軸或二軸拉伸之方法爲佳。作爲在聚酯樹 脂之非相溶熱塑性樹脂，並無任何限制，但可例示聚丙烯 或聚甲基戊烯所代表之聚烯烴系樹脂、聚苯乙烯系樹脂、 聚丙烯酸系樹脂、聚碳酸酯樹脂、聚颯系樹脂、纖維素系 樹脂、聚伸苯基醚系樹脂等。 該等熱塑性樹脂可單獨使用，又亦可組合複數熱塑性 樹脂使用。與該等聚酯樹脂爲非相溶性之熱塑性樹脂之含 _ 量，相對於含有空洞聚酯層之樹脂以3〜20質量％爲佳，進 ❹ 而以5〜1 5質量％爲佳。而且，在聚酯樹脂中非相溶性之熱 塑性樹脂含量係相對於形成含有空洞聚酯層之樹脂若未達 - 3質量％時，因形成於薄膜內部之含有空洞含量少，故隱蔽 、 性降低。另一方面，非相溶性之熱塑性樹脂含量，相對於 形成白色聚酯層之樹脂於超過20質量％之情形，於薄膜製 造步驟之裂斷頻發。此外，含有空洞聚酯薄膜內部之含有 空洞率以10〜50體積％爲佳，以20〜40體積％更佳。 〇 又，本發明所用之二軸拉伸聚酯薄膜在作爲白色或高 隱蔽之FPC或RFID媒體之材料使用之情形，作爲基材薄 膜係使白色顏料含於二軸拉伸聚酯層，白色聚酯薄膜亦爲 令人滿意的實施形態之一。在此所用之白色顏料並無特別 ’ 限定，但就由廣泛使用性之觀點而言，以由氧化鈦、碳酸 鈣、硫酸鋇及該等複合體所成者爲佳，就隱蔽效果之觀點 而言，以使用氧化鈦更佳。 該等無機粒子，相對於白色聚酯層之構成材料，以含 -42- 200932523 有25質量％以下之範圍爲佳，以20質最％以下更佳。在添 加超過上述範圍之情形，在薄膜製造時多發生裂斷會有在 工業等級之穩定生產爲困難之情形。 又，作爲本發明所用之二軸拉伸聚酯薄膜在作爲白色 或高隱蔽之FPC或RFID媒體之材料使用之情形，適宜地 調節微細空洞或白色顏料之含量，以光學濃度爲0.5以上， 且3.0以下爲佳。光學濃度之下限以0.7較佳，以0.9進而 爲佳。又，光學濃度之上限以2.5較佳，以2.0進而爲佳。 光學濃度在不足上述範圍之情形，在作爲1C卡或1C標籤 時，因隱蔽性不足會有1C晶片或電路等內部構造可以透見 之情形，在新式樣上又安全性上並不適當。又，爲以光學 濃度超過上述範圍之方式來製造薄膜，薄膜內部之微細空 洞或白色顏料含量必須爲非常多，而致薄膜強度等降低。 此外，將本發明所用之二軸拉伸聚酯薄膜作爲白色或 高隱蔽之FPC或RFID媒體之材料使用之情形，以在聚酯 Q 樹脂中調配非相溶之熱塑性樹脂來作爲形成空洞之方法， 與調配白色顏料之方法，予以倂用之方法最佳。 本發明所用之二軸拉伸聚酯薄膜中，除了熱黏接層之 各層以結晶性聚酯作爲主體來構成者爲佳。在此之結晶性 • 聚酯樹脂係指熔融熱量超過20mJ/mg之聚酯樹脂。熔融熱 量之測定方法係與上述相同。 此種結晶性聚酯係將對苯二甲酸、異酞酸、萘二羧酸 等芳香族二羧酸或其酯與乙二醇、二乙二醇、丨，3 一丙二 -43- 200932523 醇、1，4一 丁二醇、新戊二醇等二醇以適當比率縮聚而製造 之聚酯。該等聚酯係將芳香族二羧酸與乙二醇進行直接反 應之直接聚合（direct polymerization)法之外，再將芳香族二 羧酸之烷酯與乙二醇進行酯交換反應後，予以縮聚之酯交 換法’或將芳香族二羧酸之二乙二醇酯進行縮聚等方法來 製造。 上述結晶性聚酯之代表例方面，可例舉聚對酞酸乙二 酯、聚三亞甲基對苯二酸酯、聚對苯二甲酸丁二醇酯（ΡΒΤ) 或聚乙烯一 2,6—萘二酸酯。上述聚酯可爲均質聚合物，可 爲使第三成份共聚者。藉由將第三成份共聚使結晶性降低 之樹脂在使用之情形，在熱黏接之步驟中發生適度的變 形，而可緩和天線電路或積體電路之凹凸呈現於製品表面。 【RFID媒體之製造方法】 在本發明之RFID媒體之製造方法，首先係將捲繞成輥 狀之複數網狀薄膜一面開捲，一面積層。在習知一般所用 之壓製步驟所致製造係使基材薄膜等以片（sheet)方式積層 著，然而在本發明之方法係使用捲繞成輥狀之網狀基材， 故處理性可大幅提高，同時，對基材薄片群之平放亦不需 要寬廣的保管場所，在保管或處理中有貨物崩塌發生，或 在一片片之薄片間混入異物等之風險亦小，可大幅減輕製 程步驟之繁雜性。 在此作爲積層本發明鑲嵌片之網狀薄膜之一條使 用，積層其他樹脂薄片或薄膜並黏接。此樹脂薄片與薄膜 -44 - 200932523 若爲捲繞於輥之連續網狀之物則並無特別限定，就由RFID 媒體之耐熱性或耐藥品性、環境適性等觀點而言，以二軸 拉伸聚酯薄膜爲佳。又二軸拉伸聚酯薄膜中以隱蔽性或新 式樣性等之點以使用白色聚酯薄膜爲佳，就由緩衝性或輕 量性.、柔軟性、書寫性等之點而言，以含有微細空洞之白 色聚酯薄膜更佳。 又，鑲嵌片因通常係天線電路或金屬線圈、1C晶片成 爲裸露之狀態，故如於本發明FPC中使用般之熱黏接層積 〇 層於表面之薄膜加以使用，以將熱黏接層與該等電路相對 之形式，以保護該等之方式進行積層者爲更佳之實施形 . 態。熱黏接層在熱積層步驟中可容易地變形，故可將起因 於電路或晶片之凹凸予以有效地緩和，藉此可製造外觀美 麗的卡片或標籤。 此外，在本發明中，將黏接劑薄片等積層者，就加工 之高速化觀點而言並不適當，在作爲鄰接於天線電路之層 Q 並積層黏接劑層，會導至電氣特性之偏差並不佳。 又，在本發明之RFID媒體之製造方法中，將以上述方 式開捲之複數網狀薄膜，藉由不具有壓製步驟之積層輥黏 ' 接步驟進行連續地熱積層黏接。 在此進行之積層輥黏係引導積層於經加熱之一對以上 積層輥之複數網狀薄膜，藉由熱黏接層之軟化溫度以上之 溫度進行壓著來進行爲佳。本發明中，熱黏接性薄膜因係 使用二軸拉伸聚酯薄膜來進行，可加熱至比熱黏接溫度爲 -45- 200932523 充分高溫並進行黏接，與使未拉伸薄片群進行積層之周知 方法比較，在更高溫，可進行高速黏接。 用以進行積層之加熱輥方面則並無特別限定，爲減輕 熱黏接層之黏著，則如聚矽氧橡膠般以使用耐熱性樹脂輥 或金屬輥爲佳。又，爲了使熱黏接層成爲鏡面最後加工， 以使用經鏡面加工之金屬輥或鉻合金等經鍍敷之輥爲佳。 在進行黏接之溫度方面，在使用聚酯樹脂系熱黏接層 之情形，有必要在比該玻璃轉移溫度更高溫下進行，以在Ethylene glycol with a long linear component or a non-linear structural component with a large steric hindrance. The latter component is used in a case where the crystallinity of the heat-adhesive layer is effectively reduced and the unevenness absorption is desired. In the present invention, from the viewpoint of thermal adhesion to the PETG sheet, CHDM or NPG is preferred, and NPG is more preferable. Further, the amorphous polyester resin A is generally developed as a binder, and is also commercially available. In the case of using such a resin for an adhesive, it was originally developed as an adhesive and has the possibility of being bonded to a wide range of materials. However, such a resin for an adhesive may be difficult to coextrude stably in the production step of the biaxially stretched film. In the case where the co-extrusion is not performed stably, the thickness of the thermal bonding layer which is one of the points of the present invention is not sufficiently reduced, and the electrical characteristics of the 1C card or the 1C tag are impaired. In this case, it is necessary to sufficiently adjust the temperature of the extruder or the thickness of the thermal bonding layer to uniformize the thickness distribution of the thermal bonding layer. Further, in the present invention, the cooked adhesive layer contains the amorphous polyester resin A, and the amorphous or crystalline thermoplastic resin B which is incompatible with the resin A is formed into an island structure. The thermoplastic resin B is present in the heat-adhesive layer as a dispersion (island structure). In addition, the protrusion of the island structure island structure imparts lubricity to the heat-adhesive polyester film, and the protrusion is disintegrated and flattened in the step of thermal bonding, so that the heat-adhesive property is not hindered. Effect. Hereinafter, the amorphous thermoplastic resin and the crystalline thermoplastic resin which can be used as the thermoplastic resin B will be described. The above amorphous thermoplastic resin means a thermoplastic resin of -30 to 200932523 having a heat of fusion of 20 m/mg or less. Further, 'the heat of fusion is measured according to the transfer heat method of ns Κ 7122 γ plastic' using a DSC apparatus and heating at a rate of 10 〇c /min in a nitrogen atmosphere. The amorphous thermoplastic resin 'forms an island structure in the amorphous polyester resin inside the heat-bonding layer' because the protrusions are formed on the surface of the heat-adhesive layer. This protrusion maintains sufficient hardness at room temperature, and it is necessary to improve the lubricity of the film. Therefore, in the case where the thermoplastic resin which is an island component is used as the resin component in the present invention, the glass transition temperature of the resin is preferably -50 ° C or more and 150 ° C or less. Further, the above glass transition temperature is based on "Method for Measuring Transfer Temperature of Plastics" as described in JIS K 7121. Therefore, it was measured by a DSC apparatus under a nitrogen atmosphere at a heating rate of 10 ° C / min, and the intermediate point glass transfer temperature was intended. The lower limit of the glass transition temperature of the amorphous thermoplastic resin is preferably - 20 ° C, more preferably 0 ° C. When the glass transition temperature of the amorphous thermoplastic resin is less than 50 ° C, the desired lubricating Q property may not be obtained when the film is processed, or the thermoplastic resin component may be oozing out of the surface after the FPC or RFID medium is manufactured. The situation. Further, the projections caused by the island structure are broken into flat in the thermal bonding step, and act in such a manner as not to impede thermal adhesion. In the present invention, the laminate which is carried out in the manufacture of 'FCP or RFID medium can be suitably carried out at a temperature of from 1 Torr to 200 °C. Therefore, the upper limit of the glass transition temperature of the amorphous thermoplastic resin is preferably 130 ° C, more preferably 100 ° C or less. On the other hand, when the glass transition temperature of the amorphous thermoplastic resin exceeds 150 ° C, it is not able to obtain sufficient thermal adhesion at the normal bonding temperature of -31-200932523, and it is thermally bonded at a higher temperature. In the case, there is a problem that the burden on the circuit or the like becomes large. On the other hand, in the present invention, as the thermoplastic resin B to be used for the heat-adhesive layer, a crystalline thermoplastic resin can be used. The above crystalline thermoplastic resin means a thermoplastic resin having a heat of fusion of more than 20 mJ/mg. Further, the heat of fusion was measured by a DSC apparatus in accordance with the "transfer heat measurement method of plastics" described in IS K 7122, and heated at a heating rate of 10 ° C / minute in a nitrogen atmosphere. Since the crystalline thermoplastic resin is incompatible with the amorphous polyester resin A, an island structure as a dispersion is formed in the amorphous polyester resin, and the protrusions are formed in the thermal bonding. Layer surface. This protrusion maintains hardness at room temperature and has the necessity of improving the lubricity of the film. Therefore, a crystalline thermoplastic resin having a melting point of 50 ° C or more and 200 ° C or less is important. In addition, the melting point of the crystalline thermoplastic resin is measured by a DSC apparatus using a DSC apparatus at a rate of 10 ° C /min in a nitrogen atmosphere according to the "Method for measuring the transfer temperature of the plastic" described in IS K 7 1 2 1 . . The lower limit of the melting point of the crystalline thermoplastic resin is preferably 70 ° C and preferably 90 ° C. Further, in the step of thermal bonding, it is broken to be flat, and in order to prevent the adhesion from being applied, the melting point of the resin is not preferable to the hottest step of more than 30 °C. More specifically, the upper limit of the melting point of the resin is preferably 180 ° C, more preferably 160 ° C. In the present invention, the thermoplastic resin used in the heat-adhesive layer is not particularly limited and is used by mixing with an amorphous polyester resin, so the difference in solubility parameter -32-200932523 is compared with polyethylene terephthalate. It is appropriate to become 2.0 (J/cm3) W2 fat. The resin which is amorphous and widely used may, for example, be a polycarbonate, an acrylic resin, a cyclic olefin resin or a low-density polypropylene having low stereoregularity or an olefin such as polyethylene. The polystyrene or the cyclic olefin copolymer is more preferable because of the high stability against heat, ultraviolet rays, and oxygen, and polystyrene or polyolefin is preferred because it is more widely used. Further, in terms of a resin having high crystallinity and high usability, it is ethylene, polypropylene, polybutadiene, polyethylene propylene rubber, polyoxymethylene or the like. In the case where the heat or ultraviolet rays, oxygen and high are more widely used, polyethylene is more preferable in terms of the melting point of polyethylene or polypropylene. Further, a high-density or linear low-density polyethylene having a density exceeding 〇.90 g/cm3 is preferable from the viewpoint of crystallinity. In the present invention, the thermoplastic resin contained in the heat-adhesive layer is 1% by mass or more and less than the material constituting the heat-adhesive layer. The lower limit of the content of the thermoplastic resin B is more preferably 3% by mass. On the other hand, the upper limit of the content of the thermoplastic resin B is preferably %, more preferably 20% by mass. When the content of the thermoplastic resin B is in the mass%, the necessary lubricity cannot be obtained. When the content of the other resin B is more than 30% by mass, it may be detached from the surface of the film, and the above-mentioned polystyrene copolymer having a poor lubricity may be used, or a copolymer thereof may be used. In other words, it can be exemplified that the stability of polylactic acid and poly is good. In polyethylene, the amount of polyethylene B is 30% by mass, and the mass of 5 mass is less than 1 surface, and the thermoplastic I is large. , or -33- 200932523 In the thermal bonding step, it is not sufficiently flattened and there is a case where the thermal adhesion is deteriorated. Further, in the present invention, the maximum height of the surface of the heat-adhesive layer is 1.0//m or more, and preferably 10/zm or less. The lower limit of the maximum height of the surface of the thermal bonding layer is preferably 1.2/zm, and particularly preferably l_5/zm. On the other hand, the upper limit of the maximum height of the surface of the thermal bonding layer is preferably 8.0 μm, more preferably 5.0//m. The maximum height of the surface of the thermal bonding layer is less than 1.0/zm, and sufficient lubricity is not obtained, making the film rationally difficult. On the other side, in the case where the maximum height of the surface of the thermal bonding layer exceeds 10 "m, the protrusion of the film surface is peeled off to contaminate the reaction step, or vice versa. The ratio of the maximum height (Stl) of the surface of the thermal bonding layer to the arithmetic mean surface roughness (Sal) (Stl/Sal) is 3.0 or more, and preferably 20 or less. The lower limit of Stl/Sal is preferably 5.0, and particularly preferably 7.0. On the other hand, the upper limit of Stl/Sal is preferably 16 and is particularly good at 12. In the case where Stl/Sal does not reach Q, it is difficult to improve lubricity. On the other hand, in the case where stl/Sal exceeds 20, it is difficult to obtain thermal adhesion. In the method of adjusting the maximum height of the protrusions in the surface of the thermal bonding layer to a suitable range, (1) a method of selecting a melt viscosity of the amorphous polyester resin A or a glass transition temperature, and (2) selecting a thermoplasticity Method for melting viscosity or glass transition temperature, melting point, surface tension, solubility parameter, and amount of addition of resin B' (3) A method of selecting a temperature at which a resin of a heat-adhesive layer is pressed against a surface of a film. Even in these methods, it is easy and reliable to adjust the glass transition temperature of the amorphous polyester resin from -34 to 200932523, the type of the thermoplastic resin, the amount of addition, and the extrusion temperature. Moreover, in the present invention, the surface of the thermal bonding layer is opposed to and sandwiched by the smooth and clean glass plate so that the surface of the thermal bonding layer is maximized after hot pressing (loot, IMPa, 1 minute). The protrusion twist (St2) is preferably 0.001/zm or more and 3/zm or less. The lower limit of St2 is preferably 0.005/zm, and most preferably 0.01 ym. Further, the upper limit of St2 is preferably 2.5 μm, and the best is 2 #m or less. ^ In the case where St2 is less than 0.00 5/zm, the flow of the resin constituting the heat-adhesive layer in the heat build-up layer may cause insufficient processing stability. Further, in the case where St2 exceeds 0.01 #m, even if a large number of protrusions remain after thermal bonding, it is not preferable because a sufficient adhesion interface cannot be obtained in order to exert a stable adhesive force. Further, in order to adjust St2 to a range of 0.001 to 3 μm, the melting point of the crystalline thermoplastic resin may be adjusted within a range of 50 to 200 ° C, or the content of the crystalline thermoplastic resin may be adjusted within a range of 1 to 30% by mass. Then it is valid for Q. Further, the heat-adhesive polyester film used in the present invention is such that the surface of the film faces the back surface, and the static friction coefficient at the interface is preferably 0.1 or more and 0.6 or less. The lower limit of the coefficient of friction is preferably 0.2. On the other hand, the upper limit of the friction ' coefficient is preferably 0.7, more preferably 0.6, and particularly preferably 0.5. It is difficult to have a static friction coefficient between the surface of the film and the back surface of less than 0.1 in the range of the present technology. On the other hand, when the above static friction coefficient exceeds 0.8, the rationality of the film is remarkably deteriorated. In order to adjust the static friction coefficient to the range of -35-200932523 〇·1~0.8, as in the above method to adjust the thermal adhesion layer degree ' or adjust the elastic bond layer elastic modulus or surface tension is better, to adjust the static friction coefficient Wax is added to the thermal bonding layer in the above range. The thermal bonding layer is relatively viscous due to its amorphous nature. Even if a non-phase resin, inorganic particles, or organic particles are added to such a heat-bonding layer, the wax is not sufficiently reduced. Further, the unevenness caused by the circuit or the RFID medium f sheet placed on the FPC is absorbed in the biaxially stretched polyester layer used in the present invention. This unevenness absorbability is expressed as a standard of the heat bonding step-forming property, which can be expressed by the forming ratio and the parameters of the formed portion. The forming ratio refers to the depth of the antenna circuit or the copper foil when the copper foil is removed at normal temperature and pressure after the antenna circuit or the surface of the thermal bonding layer is hot-pressed. The inclination of the outer edge of the forming portion means the inclination of the wall surface in this crucible. Further, in the biaxially stretched polyester film used in the present invention, the shape ratio is 40% or more, and preferably 105% or less. From the viewpoint of being able to absorb the unevenness of the 1C wafer or the circuit, the forming ratio is 'good', preferably 60%. From this point of view, it is understood that the upper limit of the forming ratio is higher. However, in order to increase the forming ratio, it is easy to use the extreme grease as a thermal bonding layer during heating, and the surface is maximally high in the thermal bonding step. The elastic modulus is low, and the thermoplastic rubbing coefficient is dissolved. Therefore, the hot edge of the 1C crystal film of the scoop is formed due to the hot edge of the outer edge of the copper foil placed on the antenna circuit or the outer edge of the heat-adhesive layer. The limit of the invention is more than 50%. Softening tree with thermal bonding layer -36- 102% 200932523 Flow and other concerns that reduce processing stability, so in reality, j is more practical, and more preferably 98% or less. Further, the method of adjusting the molding rate to 40 to 105% or less may, for example, adjust the thermal adhesion to 5/zm or more, or transfer the glass of the amorphous poly A or thermoplastic resin B constituting the thermal bonding layer. Further, in the present invention, the temperature or the melting point is close to the heat, or the mixing ratio, the viscosity, the modulus of elasticity, and the like are appropriately adjusted. In the present invention, the inclination of the outer edge of the formed portion due to hot pressing is not less than 1,000,000%. In the present invention, it is preferable that the shape of the formed concave portion, the shape of the road or the like is uniform from the viewpoint of the heat-adhesive layer I wafer or the unevenness of the circuit. The inclination of the outer edge of the molded portion means a state in which the convex portion is not deformed with respect to the convex portion of the circuit or the like, or the shape of the convex portion cannot be sufficiently absorbed. The degree is preferably 50% or more, more preferably 100% or more. Further, from the viewpoint of the unevenness absorbability, the inclination of the forming due to hot pressing is larger, and of course, the more ideal the deformation is, the geometrically superior is the best. However, in the technical scope disclosed in the present invention, it is up to 1% of the upper limit, and 500% or less is achieved in a more general processing step. In addition, in the method of adjusting the inclination of the edge caused by hot pressing to a range of 20 to 1 000%, the thickness of the thermal adhesive layer is adjusted to be more than 5/zm, and the amorphous layer of the adhesive layer is also suitably adjusted. The method of transferring temperature or mixing ratio, viscosity, modulus of elasticity, etc. of the polyester resin A or the amorphous thermoplastic resin b. Further, in the biaxially stretched polyester film used in the present invention, in particular, the layered thick ester resin is bonded to the temperature. Take 20% S; receive 1C with electricity up to 20% to affect the outer edge of the inclined part to infinitely realistically outside the current shape except the glass that will constitute the heat is -37- 200932523 white and concealed is necessary In the case where the material of the card or label is used, one of the suitable embodiments is to include a white pigment in the thermal bonding layer. In the case of the white pigment contained in the heat-adhesive layer, it is preferable to use titanium oxide, calcium carbonate, strontium sulphate or the like, and it is more preferable to use titanium oxide from the viewpoint of the concealing effect. The inorganic particles are preferably contained in a range of 30% by mass or less, more preferably 20% by mass or less, based on the constituent material of the biaxially stretched polyester film of the substrate. In the case where the addition exceeds the above range, the cracking of the film in the manufacturing process of the biaxially stretched polyester film may significantly reduce the production enthalpy efficiency, or increase the dielectric constant or dielectric loss of the film to make the FPC or RFID electrical The performance is degraded and it is not good. Further, the biaxially stretched polyester film used in the present invention may contain organic particles in the heat-bonding layer without impairing the thermal adhesive property, the lubricity, and the unevenness absorbability. By containing organic particles in the thermal bonding layer, protrusions can be formed on the surface of the thermal bonding layer, and when FPC or RFID media is thermally bonded by thermal lamination, bubbles between the films can be efficiently discharged. Q As the organic particles, a melamine resin or a crosslinked polystyrene resin, a crosslinked acrylic resin, and a composite particle mainly composed of these are preferable. Further, the inorganic particles are preferably contained in a range of 30% by mass or less, more preferably 20% by mass or less, based on the constituent material of the heat-adhesive layer. In the case where the addition is more than the above range, cracking of the film occurs in the production step of the biaxially stretched polyester film, and the production efficiency is remarkably lowered. [Coating layer] The biaxially stretched polyester film used in the present invention is characterized in that the surface has a bonding layer formed by coating from -38 to 200932523. The purpose of forming the coating layer is to obtain a stronger bonding strength in addition to the fixing effect of the heat bonding layer and the chemical bonding formed between the metal and the resin of the main component of the coating layer. The resin used as the coating layer is a thermoplastic resin, and it is expected to contain a functional group which is coordinately bonded to a metal such as a hydroxyl group or a carboxyl group. Further, the contact angle with the biaxially stretched polyester film forming the water and the coating layer is preferably 80 or less, more preferably 75 or less, and still more preferably 70 or less. In the case of a resin satisfying such an antimony condition, the adhesion of a usual polyester film is improved by using a polyurethane resin, an acrylic resin, a polyolefin resin, a polyester resin, a polyester urethane resin or the like. The resin is preferably a polyurethane resin, a polyolefin resin or a polyester resin, and more preferably a polyurethane resin or a polyolefin resin. In the etching treatment step and the photoresist stripping treatment step, the resin is preferably immersed in an acid or an alkali solution, so that the resin is excellent in hydrolysis resistance. Q Further, the resin which is the main component of the coating layer can be bonded to a substrate such as a film or a metal by adding heat. When the substrate and the resin to be bonded are the lower limit of the bonding temperature of the peeling strength of 3 N/cm or more, as the bonding start temperature, when the FPC or the RFID is manufactured, the laminate can be suitably implemented at 100 to 200 °C. Therefore, the adhesion starting temperature of the coating layer is preferably 130 ° C or less, more preferably 100 ° C or less. When the adhesion initiation temperature of the coating layer is more than 160 ° C, the resin of the coating layer is not sufficiently softened, which may be poor due to poor adhesion. The coating layer is formed by applying a drying step, a stretching step, and a heat setting treatment step after applying a coating of -39 to 200932523 in a film forming step of the biaxially stretched polyester film. As a method of providing a coating layer, a gravure coating method, a contact coating method, a dipping method, a spray coating method, a curtain coating method, an air knife coating method, a blade coating method, a reverse roll coating method, and the like which are generally used can be applied. method. As the coating stage, any method such as a method of coating before stretching of the film, a method of coating after longitudinal stretching, a method of coating the surface of the film subjected to the alignment treatment, or the like may be used, but the plane of the film is maintained. From the viewpoint of properties, a method of stretching at least in one axial direction after coating is preferred. The thickness of the coating layer is preferably 0.005 to lym, preferably 0.01 to 0.5 ym. Preferably, it is preferably 0.02 to 0.1/zm. In the case where the thickness cannot satisfy this range, it is not good because the adhesion cannot be maintained. Further, if the thickness exceeds this range, the unevenness of the heat-adhesive layer is lowered, which is not preferable. When the coated surface is in contact with the roll surface heated by the coating layer, since the roll and the film are bonded, the preferred embodiment is a single side of the biaxially stretched polyester film which is not in contact with the roll surface. The coating liquid does not impair the advantages of the two-axis stretch polyester film starting from the concealability and cushioning properties. Further, since the coating is thin on the biaxially stretched polyester film, it has no effect on the unevenness absorbability. Further, since it is stretched in at least one axial direction after coating, the planarity of the polyester film is not impaired and biaxially stretched. [Substrate Layer of Biaxially Stretched Polyester Film] The biaxially stretched polyester film used in the present invention is such that at least one of the two-40-200932523 axially stretched polyester film layers becomes a substrate. This layer can be easily adjusted in optical properties or mechanical properties by a conventional method. In the case where the biaxially stretched polyester film used in the present invention is used as a material of a white or highly concealed FPC or RFID medium, as a base film, a polyester film containing voids and containing a large void is contained therein. It is better. It is preferable to control the apparent density of the film to 0.7 g/cm3 or more and 1.3 g/cm3 or less by a plurality of fine voids in the inside of the film. The lower limit of the apparent density of the film is preferably 0.8 g/cm3, more preferably 0.9 g/cm3. On the other hand, the upper limit of the apparent density of the ruthenium film is preferably 1.2 g/cm3, more preferably 1.lg/cm3. When the apparent density of the film is less than 0.7 g/cm3, the strength or resistance of the film is lowered, the longitudinal bending property and the compression recovery rate are lowered, and the appropriate mechanical properties are not obtained when the FPC or the RFID medium is manufactured or used. On the other hand, when the apparent density of the film exceeds 1.2 g/cm3, the flexibility, cushioning property, and lightness which are necessary as an FPC or RFID medium cannot be obtained. The method of containing voids in the inside of the film may, for example, be a method in which the foaming agent is foamed by heat during extrusion or film formation, or foamed by chemical decomposition, and (2) squeezed. a method of foaming by adding a gas such as carbonic acid gas or a vaporizable substance after pressing or pressing, and (3) adding an incompatible thermoplastic resin to the polyester and the polyester, and performing a shaft after melt extrusion Or the method of biaxial stretching, (4) adding organic or inorganic fine particles to melt extrusion, and then performing one-axis or two-axis stretching. In the method of containing a void inside the film, the method (3) above is to add a polyester and an incompatible thermoplastic resin, and after being melt-extruded -41 - 200932523, to perform one-axis or two-axis stretching. The method is better. The non-compatible thermoplastic resin in the polyester resin is not particularly limited, and examples thereof include a polyolefin resin represented by polypropylene or polymethylpentene, a polystyrene resin, a polyacryl resin, and a polycarbonate. Resin, polyfluorene-based resin, cellulose-based resin, polyphenylene ether-based resin, and the like. These thermoplastic resins may be used singly or in combination with a plurality of thermoplastic resins. The content of the thermoplastic resin which is incompatible with the polyester resin is preferably from 3 to 20% by mass based on the resin containing the voided polyester layer, and preferably from 5 to 15% by mass. Further, when the content of the non-compatible thermoplastic resin in the polyester resin is less than 3% by mass based on the resin forming the void-containing polyester layer, the content of voids formed in the inside of the film is small, so that the concealment property is lowered. . On the other hand, the content of the incompatible thermoplastic resin is more than 20% by mass based on the resin forming the white polyester layer, and the crack is frequently generated in the film production step. Further, the void ratio in the interior of the void-containing polyester film is preferably 10 to 50% by volume, more preferably 20 to 40% by volume. Further, in the case where the biaxially stretched polyester film used in the present invention is used as a material of white or highly concealed FPC or RFID medium, the white film pigment is contained in the biaxially stretched polyester layer as a base film. Polyester film is also one of the satisfactory embodiments. The white pigment used herein is not particularly limited, but from the viewpoint of wide-spreadness, it is preferable to use titanium oxide, calcium carbonate, barium sulfate, and the like, and it is preferable from the viewpoint of concealing effect. In other words, it is better to use titanium oxide. The inorganic particles are preferably contained in an amount of 25% by mass or less based on -42 to 200932523, and more preferably 20% by mass or less, based on the constituent material of the white polyester layer. In the case where the above range is added, it is difficult to stably produce at the industrial grade when the film is broken at the time of film production. Further, in the case where the biaxially stretched polyester film used in the present invention is used as a material of white or highly concealed FPC or RFID medium, the content of fine voids or white pigment is appropriately adjusted to have an optical density of 0.5 or more, and 3.0 or less is preferred. The lower limit of the optical density is preferably 0.7, more preferably 0.9. Further, the upper limit of the optical density is preferably 2.5, and more preferably 2.0. When the optical density is less than the above range, when the 1C card or the 1C label is used, the internal structure such as the 1C chip or the circuit may be transparent due to insufficient concealability, and the safety is not appropriate in the new pattern. Further, in order to produce a film in such a manner that the optical density exceeds the above range, the content of fine voids or white pigment inside the film must be extremely large, and the film strength and the like are lowered. Further, in the case where the biaxially stretched polyester film used in the present invention is used as a material of white or highly concealed FPC or RFID medium, a method of forming a void by formulating a non-compatible thermoplastic resin in a polyester Q resin , and the method of blending white pigments is best used. In the biaxially stretched polyester film used in the present invention, it is preferred that the layers of the heat-adhesive layer are composed of a crystalline polyester as a main component. Crystallinity here • Polyester resin means a polyester resin having a heat of fusion exceeding 20 mJ/mg. The method of measuring the heat of fusion is the same as described above. Such a crystalline polyester is an aromatic dicarboxylic acid such as terephthalic acid, isophthalic acid or naphthalene dicarboxylic acid or an ester thereof, and ethylene glycol, diethylene glycol, hydrazine, and 3-propane-43-200932523 A polyester produced by polycondensation of a diol such as an alcohol, 1,4-butylene glycol or neopentyl glycol at an appropriate ratio. These polyesters are a direct polymerization method in which an aromatic dicarboxylic acid is directly reacted with ethylene glycol, and then an alkyl ester of an aromatic dicarboxylic acid is subjected to a transesterification reaction with ethylene glycol. It is produced by a method such as polycondensation transesterification method or polycondensation of an aromatic dicarboxylic acid diethylene glycol ester. Representative examples of the above crystalline polyester may, for example, be a polyethylene terephthalate, a polytrimethylene terephthalate, a polybutylene terephthalate (oxime) or a polyethylene-2,6. - naphthalened diester. The above polyester may be a homogeneous polymer and may be a copolymer of the third component. When the resin having a reduced crystallinity by copolymerizing the third component is used, a moderate deformation occurs in the step of thermal bonding, and the unevenness of the antenna circuit or the integrated circuit can be alleviated on the surface of the article. [Manufacturing Method of RFID Media] In the method of manufacturing the RFID medium of the present invention, first, a plurality of mesh-shaped films wound in a roll shape are unwound one by one. In the conventional manufacturing process, the substrate film or the like is laminated in a sheet form. However, in the method of the present invention, a web substrate wound into a roll shape is used, so that the handleability can be greatly improved. At the same time, it is not necessary to have a wide storage place for the flat sheet of the substrate sheet, and there is a risk that the goods collapse during storage or handling, or the foreign matter is mixed between the sheets of the sheet, and the process steps can be greatly reduced. The complexity. Here, as one of the web films of the inlaid sheet of the present invention, a laminate of other resin sheets or films is laminated and bonded. The resin sheet and the film-44 - 200932523 are not particularly limited as long as they are wound around the continuous web of the roll, and are biaxially pulled from the viewpoints of heat resistance, chemical resistance, and environmental suitability of the RFID medium. Stretching polyester film is preferred. In the biaxially stretched polyester film, it is preferable to use a white polyester film in terms of concealability or new pattern, etc., in terms of cushioning property, lightness, flexibility, writing property, etc., A white polyester film containing fine voids is preferred. Moreover, since the mounting piece is usually in a state in which the antenna circuit, the metal coil, and the 1C wafer are exposed, the film is laminated on the surface by thermal bonding as in the FPC of the present invention to bond the thermal bonding layer. In contrast to the forms of these circuits, it is a better practice to perform the lamination in a manner that protects them. The heat-adhesive layer can be easily deformed in the step of laminating heat, so that the irregularities due to the circuit or the wafer can be effectively alleviated, whereby a beautifully priced card or label can be manufactured. Further, in the present invention, the laminate of the adhesive sheet or the like is not suitable from the viewpoint of high speed of processing, and the layer of the adhesive layer adjacent to the antenna circuit Q is laminated to the electrical characteristics. The deviation is not good. Further, in the method of manufacturing an RFID medium of the present invention, the plurality of mesh films unwound in the above manner are continuously thermally bonded by a lamination step of the lamination roller which does not have a pressing step. It is preferable that the build-up roll adhesion carried out here is carried out by laminating a plurality of mesh-shaped films which are heated to one or more of the build rolls, and is pressed by a temperature higher than a softening temperature of the heat-bonding layer. In the present invention, the heat-adhesive film is formed by using a biaxially stretched polyester film, and can be heated to a specific heat bonding temperature of -45 to 200932523, and is bonded at a high temperature, and the unstretched sheet group is laminated. Compared with the well-known methods, high-speed bonding is possible at higher temperatures. The heat roller for laminating is not particularly limited, and in order to reduce the adhesion of the heat-adhesive layer, it is preferable to use a heat-resistant resin roll or a metal roll like a silicone rubber. Further, in order to form the thermal adhesive layer into a mirror surface, it is preferable to use a mirror-processed metal roll or a plated roll such as a chrome alloy. In terms of the temperature at which the bonding is performed, in the case of using a polyester resin-based thermal bonding layer, it is necessary to carry out at a higher temperature than the glass transition temperature to

D 70°C以上進行爲佳，以在90°C以上進行因可提高生產效率 與黏接強度故更佳。 . 又，在本發明因獲得有效利用二軸拉伸聚酯薄膜特性 (耐熱性或耐藥品性、尺寸穩定性等）之RFID媒體爲重要的 宗旨，因此黏接溫度有必要爲比聚酯薄膜之熔點更低之溫 度，更具體言之以在200°C以下進行較佳，以在160°C以下 進行更佳。在超過該等溫度進行加熱之情形，除了上述薄 p 膜之特性喪失之外，因會使薄膜變形，或因對搬運中薄膜 之張力產生變動，或在經製造之RFID媒體產生卷縮故並不 佳。 ' 在進行積層時所搬運之網狀薄膜，係以積層輥進行加 • 熱並壓著，而在以僅一對輥進行急遽加熱時，溫度不均或 伴隨此之黏接不均，會使變形發生，在導入積層輥以前做 預熱準備爲佳。進行此預熱之方法並無特別限定，但在將 經加熱之輥依順序通過，同時使薄膜溫度上昇之方法以 -46 - 200932523 外’亦可以使用到熱風或紅外線等非接觸加熱器進 熱。在製造裝置簡便性之上而言以加熱輥所致預熱爲 而在RFID媒體之防止變形或減低不良率中，以非接觸 器所致方法爲佳。 搬運至積層輥之網狀薄膜，係爲了防止所製造之 或標籤之卷縮，以在預熱後保持於平面之狀態導至積 爲佳。例如在作爲網狀薄膜係使用聚酯系薄膜之情形 比該玻璃轉移溫度更低之大致70°C以下以保持於平面 方式進行開捲之後，進行積層爲佳。 又，根據本發明之製造方法，可以將以積層輥所 接之RFID媒體之網狀連續體捲繞成輥狀並予保管，或 處理。但是，經加熱黏接之積層體並無法充分冷卻而 繞成輥狀之情形，於裁切後使用時，會有產生無法解 卷縮之情形。爲防範此發生在積層後除去張力之前， 樣保持平面並進行充分冷卻爲佳。冷卻之目標溫度因 設備條件等而決定，故無法一槪而論，在作爲網狀薄 使用二軸拉伸聚酯薄膜之情形，吾人要求冷卻至大致 以下，而以冷卻至50°C以下較佳，以冷卻至室溫爲止1 在積層時所搬運之網狀薄膜，爲了保持平面性， 加經控制之張力進行保持爲佳。此時所加諸之張力方 由平面性保持之觀點而言以lN/m以上爲佳，以10N/m 更佳。又以薄膜之彈性變形進而以防止1C卡或標籤之 之觀點而言，以lKN/m以下爲佳，以200Ν/Π1以下更1 行預 佳， 加熱 卡片 層輥 ，在 狀之 熱黏 進行 在捲 決之 以照 係由 膜係 7(TC [佳。 以施 面， 以上 卷縮 -47- 200932523 又’爲了積極地控制卷縮並爲了提高1C卡或ic標籤 之平面性，在積層時使兩面之加熱溫度產生差距，結果可 調整平面如所得。在卷縮係因黏合於表裏之薄膜的熱膨脹 而產生之情形，結果則使成爲捲內側之面的加熱溫度相對 於相反面設定爲低並進行積層爲佳。 又，熱積層時之壓力以0.1〜20MPa爲佳，以0.3〜 lOMPa更佳。熱積層時之壓力在未達〇. 1 MPa之情形，卡片 或標籤之平面性並非充分，並無法獲得美麗的外觀。另一 方面，熱積層時之壓力在超過2 0M Pa之情形，即使使用將 含有空洞聚酯薄膜作爲基材之熱黏接性聚酯薄膜，其優異 緩衝性或凹凸吸收性之效果，因高壓力而變小。結果，付 諸於1C晶片等電路之負担過大，使得電性故障易於發生。 本發明所製造之RFID媒體適當實施形態之一，係使用 在薄膜內部含有多數微細空洞之含有空洞薄膜作爲基材之 二軸拉伸聚酯薄膜（表觀密度0.7〜1.3g/cm3)之物，使表觀 密度0.7g/cm3以上，未達1.3g/cm3之RFID媒體。此表觀密 度之下限以0.8g/cm3較佳，以0.9g/cm3進而爲佳。另一方 面，卡片或標籤之表觀密度之上限以1.2g/cm3較佳，以 l.lg/cm3進而爲佳。又此表觀密度在未達〇.7g/cm3之情形， 則使得RFID媒體強度或耐縱向彎曲性，壓縮回復率降低， 在加工時或使用時無法獲得適當的力學性能。另一方面， 卡片或標籤之表觀密度在1.3g/cm3以上之情形，並無法獲 得作爲RFID媒體之輕量性或柔軟性。又，表觀密度在 -48 - 200932523 0.7g/cm3以上，未達1.3g/cm3之RFID媒體，在被水淹沒事 故時會浮於水面，或者在沈没爲止間之時間可有充分時間 回收。因此，本形態之卡片，例如個人可紀錄其個人資料， 用作日常個人持有使用之個人資料記錄卡極爲適當。 【實施方式】 接著，以下以實施例與比較例進而詳細說明本發明之 技術要件與效果之關連性。 此外，本發明所用之特性値係使用下述方法進行評價。 [評價方法] (1) 樹脂熔點與玻璃轉移溫度 依照JIS K 7121記載之「塑膠之轉移溫度測定方法」 進行DSC測定。樣本係使用附有放大鏡之切片刀將自薄膜 切削熱黏接層之小片約10mg予以密封於銘盤（aluminium pan)在300°C進行3分鐘熔融，並使用到以液體氮予以驟冷 之物。測定器係使用差式掃描熱量計（精工儀器公司製， EXSTAR6200DSC) >在乾燥氮氛圍下實施。自室溫以10°C/ 分之速度加熱求得中間點玻璃轉移溫度後，並求得熔融峰 値溫度（熔點）。 (2) 樹脂之熔融熱畳 以JIS K 7122記載之「塑膠之轉移熱測定方法」來求 得熔融熱量。DSC測定之詳情係與上述熔點測定相同。 (3) 聚酯樹脂之固有黏度 藉由JIS K 7 3 67-5記載之「使用到塑膠毛細管型黏度 -49- 200932523 計之聚合物稀釋溶液黏度之求法」，以使用苯酚/1,1,2,2-四氯乙烷（60/40;質量份）之混合溶劑在30°C測定。 (4) 粒子平均粒徑 將粒子以掃描型電子顯微鏡（日立製作所製，S2500)觀 察，因應粒子大小改變適宜倍率，將經照片攝影之物進行 擴大影印。接著，就隨機選擇之至少200個以上粒子，追 蹤各粒子之外周。使用畫面解析裝置來測定自該等追蹤影 像之粒子等圓直徑（circle equivalent diameter)，將該等平均 値作爲平均粒子徑。 (5) 薄膜厚度 依照JIS K 7130記載之「發泡塑膠薄膜及薄#厚度測 定方法」進行測定。測定器係使用電子測微計（Maar公司 製，millitron 1240)。自欲測定之薄膜的任意4處所切去5cm 角樣本4片，測定每一片各5點（計20點）以平均値作爲厚 度。 (6) 薄膜之積層厚度 自欲測定之薄膜的任意3處所切去小片。使用切片刀 切削小片，製成與薄膜表面正交之薄膜剖面。在此剖面進 行鉑鈀合金之濺鍍作成樣本，使用掃描型電子顯微鏡（日立 製作所製，S2500)進行剖面之顯微鏡鏡檢查（microsc〇pe inspection)。以使薄膜全厚度含於一視野之適切倍率觀察， 測定各層厚度。測定係在每一視野之3處所進行，以合計 9處所之平均値作爲積層厚度。 -50- 200932523 (7) 薄膜之表觀密度 就以任意5處所所切去之100mm四方之樣本5片，藉 由JIS K 7 222記載之「發泡塑膠及橡膠表觀密度之測定」 來測定。測定係在室溫進行，以平均値作爲表觀密度。此 外，爲使表述簡便起見單位則換算爲g/cm3。 (8) 薄膜之卷縮値 將欲測定之薄膜以任意3處所在長度方向於100mm， 寬度方向於50mm切出爲紙張狀，在無負荷之狀態下，於 11 0°C經30分鐘加熱處理後，使薄膜凸部在下方，靜置於 水平玻璃板上，玻璃板與立起之薄膜4角下端的垂直距離 . 係以最小刻度0.5mm單位使用定規'來測定，使此4處所之 測定値的平均値作爲卷縮値。就3片進行測定，將此平均 値作爲卷縮値》 (9) 薄膜之成形率與成形部外緣之傾斜度 就製作之FPC，將電路與熱黏接層間之黏接面小心的 u 剝離。在此熱黏接層之剝離面中選擇進行界面剝離之部 分，使電路刻痕（indentation)之高低差以含於視野之方式與 上述（5)相同，獲得三次元形狀之畫面。依照相同軟體之剖 面解析功能，獲得與壓痕之高低差正交之剖面形狀輪廓。 ' 由此輪廓來求得印刷電路所致刻痕之深度，以除以原來電 路之高度來求得成形率。又，在壓痕之外緣部分中，就自 壓痕部至非壓痕部之高低差所求得傾斜度（含有高低差中 央部，以高低差之約1/3部分之傾斜度），作爲成形部外緣之 -51- 200932523 傾斜度。此外，觀察係就3視野進行，i 之平均値。 (10)薄膜之光學濃度與光線透過率 使用透過光學濃度計（Macbeth公司 白色光之光學濃度。就由欲測定樣本之 50mm四方的樣本5片進行測定，其平均 (1 1)FPC之靜摩擦係數 以〗IS K 7 125所記載之「發泡塑膠 數之試驗方法」進行測定。測定器係使, 製作所製，AG1KNI)。將欲測定之FPC樣 . 對向，加諸於潤滑片之負荷爲l,500g， 値作爲靜摩擦係數。 (12) FPC之剝離強度 關於所製作之FPC或金屬箔積層體 之方法測定金屬箔與薄膜之剝離強度。 Q 於黏接界面之剝離並不發生，而薄膜基 「材料破壞」，並判斷具有充分的黏接 (13) FPC或RFID媒體之外觀 將製作之FPC琛RFID媒體之外觀 ' 因於對黏接面之氣泡殘留或雛折、顯著 性）、積體電路等的凹凸加以觀察，實用 好」，對圖案性有問題者則爲「不良」 (14) FPC或RFID媒體之耐熱性 評價合1十15輪廊 ，RD-914)，測定以 任意5處所切去之 丨値作爲光學濃度。 薄膜及薄片摩擦係 电拉伸試驗機（島津 本的表裏兩面予以 使合計5次之平均 ，以 JIS X 6305-1 此外在實施例中， 材經破壞者記載爲 力（剝離強度）。 以目視評價。對起 翹曲、波浪形（平面 丨上無障礙者爲「良 -52- 200932523 將已製作之FPC或RFID媒體靜置於清淨且平坦的不 銹鋼鋼板（SUS304，厚度0.8mm)上，使用烤爐在空氣氛圍 下，於1 10°C經24小時加熱保持。加熱前後之試料外觀（光 澤損失或變色、模糊、裂縫（cracks)、變形、熔融、熔解（fusion)) 以目視評價，在加熱前後可確認無差異者爲〇，可確認有 差異者則視程度爲△或X。 (15) RFID媒體之不良品發生率 就已製作之RFID媒體，使用RF-ID展示組合（Omron 軟體公司製，L720-H01T-W001)進行信號交換測試。就50 片之標籤或卡片進行評價，求得無法信號交換之不良品發 生^。不良品發生率未達1 %之情形爲〇，1 %以上，未達 5%之情形爲△，5%以上之情形爲X。 (16) IC卡或1C標籤通信距離之偏差 就已製作之1C標籤或1C卡，使用RF-ID展示組合 (Omron軟體公司製，L720-HO1T- W001)進行信號交換測 試。將10片標籤或卡片端部以非金屬製之把持具把特，自 大約50cm之距離緩緩地接近接收天線測定所識別之最長 距離。自以最遠識別之情形，與至最近仍無法識別之情形， 之通信距離求得平均通信距離與偏差。 實施例所使用之原料樹脂及主顆粒係如下述。 [聚對酞酸乙二酯樹脂（PET樹脂）] 使用固有黏度0.62dl/g、Sb含量144ppm、Mg含量 5 8ppm、P含量40ppm、實質上不含有惰性粒子及內部析出 -53- 200932523 粒子之聚對酞酸乙二酯樹脂。 [聚乙烯萘二酸酯樹脂（PEN樹脂）] 使用固有黏度〇_63dl/g、Sb含量250ppm、Mg含量58ppm、 P含量40pPm、實質上不含有惰性粒子及內部析出粒子之聚 乙烯萘二酸酯樹脂（PEN樹脂）。 [非晶性聚酯樹脂] 非晶性聚酯樹脂A1:乙二醇成份爲乙二醇/新戊二醇 = 70/30莫耳比’使用固有黏度〇.62dl/g、Sb含量150ppm、 ΟD is preferably carried out at 70 ° C or higher, and is preferably carried out at 90 ° C or higher because it can improve production efficiency and adhesion strength. Further, in the present invention, an RFID medium which is effective in utilizing the characteristics (heat resistance, chemical resistance, dimensional stability, etc.) of the biaxially stretched polyester film is important, and therefore the bonding temperature is necessary to be a polyester film. The temperature at which the melting point is lower is more preferably 200 ° C or lower, more preferably 160 ° C or lower. In the case where the heating is performed at a temperature exceeding the temperature, in addition to the loss of the characteristics of the thin p film described above, the film may be deformed, or the tension of the film during transportation may be changed, or the RFID medium produced may be crimped. Not good. 'The web-like film that is transported during lamination is heated and pressed by a laminating roll, and when it is heated by a pair of rolls, the temperature is uneven or the adhesion is uneven. Deformation occurs, and it is preferable to prepare for preheating before introducing the laminated roller. The method of performing the preheating is not particularly limited, but the method of passing the heated rolls in order while raising the temperature of the film may be -46 - 200932523 - a non-contact heater such as hot air or infrared rays may be used for heating. . In terms of the simplicity of the manufacturing apparatus, it is preferable to use a non-contactor in the prevention of deformation or reduction in the defect rate of the RFID medium by the preheating by the heating roller. The mesh film conveyed to the build-up roll is preferably formed to prevent it from being rolled up after being preheated in order to prevent curling of the manufactured or label. For example, when a polyester film is used as the mesh film, it is preferable to laminate the film after the film is opened at a temperature of substantially 70 ° C or less lower than the glass transition temperature. Further, according to the production method of the present invention, the mesh-like continuous body of the RFID medium connected to the build-up roll can be wound into a roll and stored or processed. However, in the case where the laminated body which is heat-bonded is not sufficiently cooled and wound into a roll shape, it may be unfolded when it is used after cutting. In order to prevent this from happening, it is preferable to keep the plane and sufficiently cool it before removing the tension after lamination. The target temperature for cooling is determined by equipment conditions, etc., so it cannot be said in a simple way. In the case of using a biaxially stretched polyester film as a mesh thinner, we require cooling to be substantially below, and cooling to below 50 °C. Preferably, it is preferably cooled to room temperature. 1 The mesh film to be conveyed during lamination is preferably maintained under controlled tension in order to maintain planarity. The tension applied at this time is preferably 1 N/m or more from the viewpoint of planarity, and more preferably 10 N/m. Further, in terms of elastic deformation of the film and further prevention of the 1C card or the label, it is preferably 1 kN/m or less, more preferably 200 Ν/Π1 or less, and the card layer roll is heated, and the heat is applied in the form. The film is made by the film system 7 (TC [good. to the surface, above the crimp -47- 200932523 and 'in order to actively control the curl and in order to improve the planarity of the 1C card or ic label, in the layering The difference in heating temperature between the two faces is obtained as a result of adjusting the plane. When the crimping is caused by thermal expansion of the film adhered to the surface, the heating temperature of the surface which becomes the inner side of the roll is set lower than the opposite surface. Further, the pressure in the heat buildup layer is preferably 0.1 to 20 MPa, more preferably 0.3 to 10 MPa, and the pressure at the time of heat buildup is less than 1 MPa, and the flatness of the card or the label is not sufficient. On the other hand, when the pressure at the time of heat lamination is more than 20 MPa, even if a heat-adhesive polyester film containing a hollow polyester film as a substrate is used, the cushioning property or the unevenness is excellent. Suck The effect of the retractability is reduced by the high pressure. As a result, the burden placed on the circuit such as the 1C chip is too large, and electrical failure is likely to occur. One of the suitable embodiments of the RFID medium manufactured by the present invention is used inside the film. A biaxially stretched polyester film (apparent density: 0.7 to 1.3 g/cm 3 ) containing a hollow film containing a hollow film as a substrate, and having an apparent density of 0.7 g/cm 3 or more and less than 1.3 g/cm 3 The RFID medium. The lower limit of the apparent density is preferably 0.8 g/cm 3 , and more preferably 0.9 g/cm 3 . On the other hand, the upper limit of the apparent density of the card or the label is preferably 1.2 g/cm 3 . Lg/cm3 is further preferred. In addition, the apparent density is less than .7g/cm3, which makes the RFID medium strength or longitudinal bending resistance, compression recovery rate reduced, and the appropriate mechanics cannot be obtained during processing or use. On the other hand, when the apparent density of the card or the label is 1.3 g/cm3 or more, the lightweight or softness of the RFID medium cannot be obtained. Moreover, the apparent density is -48 - 200932523 0.7 g/cm3. Above, the RFID media that did not reach 1.3g/cm3 was flooded with water. It will float on the surface of the water, or it will be fully reclaimed at the time of sinking. Therefore, cards of this form, such as individuals who can record their personal data, are very suitable for use as a personal data record card for daily personal use. The following is a detailed description of the relationship between the technical requirements and effects of the present invention by way of examples and comparative examples. Further, the characteristics used in the present invention are evaluated by the following methods. [Evaluation method] (1) Resin melting point The glass transition temperature was measured by DSC according to "Method for Measuring Transfer Temperature of Plastics" described in JIS K 7121. The sample was sealed with a magnifying knife with a magnifying glass. Approximately 10 mg of the small piece of the film-cut thermal bonding layer was sealed on an aluminum pan and melted at 300 ° C for 3 minutes, and used to quench with liquid nitrogen. . The measuring device was carried out using a differential scanning calorimeter (EXSTAR 6200 DSC, manufactured by Seiko Instruments Inc.) under a dry nitrogen atmosphere. The intermediate point glass transition temperature was obtained by heating at room temperature at a rate of 10 ° C /min., and the melting peak temperature (melting point) was determined. (2) Melting heat of resin The heat of fusion is determined by the "method of measuring the transfer heat of plastic" described in JIS K 7122. The details of the DSC measurement are the same as those described above for the melting point. (3) The intrinsic viscosity of the polyester resin is phenol/1,1, as described in JIS K 7 3 67-5, "Using the viscosity of a polymer diluted solution of a plastic capillary type -49-200932523". A mixed solvent of 2,2-tetrachloroethane (60/40; parts by mass) was measured at 30 °C. (4) Average particle diameter of the particles The particles were observed by a scanning electron microscope (S2500, manufactured by Hitachi, Ltd.), and the photo-photographic objects were enlarged and photocopied in response to the change in the particle size. Next, at least 200 or more particles randomly selected are selected to track the outer periphery of each particle. The circle equivalent diameter of the particles from the tracking images is measured using a screen analyzing device, and the average 値 is used as the average particle diameter. (5) Film thickness The measurement was carried out in accordance with the "foamed plastic film and thin #thickness measuring method" described in JIS K 7130. The measuring instrument was an electronic micrometer (manutron 1240, manufactured by Maar Co., Ltd.). Four pieces of 5 cm angle samples were cut out from any four places of the film to be measured, and each piece was measured at 5 points (20 points) with an average 値 as a thickness. (6) Thickness of the film layer The small piece is cut from any three places of the film to be measured. A small piece is cut using a slicing knife to form a film profile orthogonal to the surface of the film. In this section, a platinum-palladium alloy was sputtered to prepare a sample, and a scanning electron microscope (S2500, manufactured by Hitachi, Ltd.) was used for microsc〇pe inspection. The thickness of each layer was measured by observing the full thickness of the film in a field of view. The measurement was carried out at 3 points in each field of view, and the average enthalpy of the nine locations was used as the laminate thickness. -50- 200932523 (7) The apparent density of the film is determined by measuring 5 pieces of a 100 mm square cut at any five places, and measuring "apparent density of foamed plastic and rubber" as described in JIS K 7 222. . The measurement was carried out at room temperature with an average enthalpy as the apparent density. In addition, the unit is converted to g/cm3 for the sake of simplicity. (8) Film shrinkage The film to be measured is cut into 100 mm in the length direction of any three places, and cut into paper shape in the width direction at 50 mm, and heat-treated at 110 ° C for 30 minutes under no load. After that, the film convex portion is placed below, and is placed on the horizontal glass plate, and the vertical distance between the glass plate and the lower end of the rising film 4 corner is determined by using a gauge of '0.5 mm unit at a minimum scale, so that the measurement of the four places is performed. The average 値 is used as a curling 値. For the measurement of three sheets, the average enthalpy is used as the crimping crucible. (9) The FPC produced by the forming ratio of the film and the outer edge of the forming portion is carefully peeled off from the bonding surface between the circuit and the thermal bonding layer. . The portion where the interface is peeled off is selected from the peeling faces of the heat-bonding layer, and the height difference of the circuit indentation is the same as that of the above (5) in such a manner as to be contained in the field of view, and a three-dimensional shape is obtained. According to the cross-sectional analysis function of the same software, a cross-sectional shape profile orthogonal to the height difference of the indentation is obtained. From this contour, the depth of the score caused by the printed circuit is obtained, and the forming ratio is obtained by dividing the height of the original circuit. Further, in the outer edge portion of the indentation, the inclination is obtained from the height difference from the indented portion to the non-indented portion (including the center portion of the step, and the inclination of about 1/3 of the height difference), As the outer edge of the forming section -51- 200932523 inclination. In addition, the observation system is performed on 3 fields of view, and the average value of i is 値. (10) The optical density and light transmittance of the film were measured by optical density meter (the optical density of white light from Macbeth). The sample was measured from 5 samples of 50 mm square of the sample to be measured, and the average (1 1) FPC static friction coefficient. The measurement was carried out in the "Testing Method for the Number of Foamed Plastics" described in IS K 7 125. The measuring device was manufactured by AGHK). The FPC sample to be measured. In the opposite direction, the load applied to the lubricating sheet was 1,500 g, and 値 was used as the static friction coefficient. (12) Peel strength of FPC The peel strength of the metal foil and the film was measured by the method of producing the FPC or the metal foil laminate. The peeling of the Q at the bonding interface does not occur, and the film-based "material destruction" and judged to have sufficient adhesion (13) The appearance of the FPC or RFID media will be produced by the FPC 琛 RFID media's due to the bonding (Face of the bubble or the original fold, significant), and the unevenness of the integrated circuit is observed, and it is practical." If there is a problem with the pattern, it is "bad". (14) Evaluation of heat resistance of FPC or RFID media 15 wheel gallery, RD-914), the enthalpy cut at any 5 points was measured as the optical density. Film and sheet friction electric tensile tester (the average of the surface of both sides of Shimadzu is 5 times in total, and JIS X 6305-1. In addition, in the examples, the material is described as force (peel strength). Evaluation: For warping and wavy shape (the flat-panel-accessible person is "Good-52-200932523. Place the fabricated FPC or RFID media on a clean and flat stainless steel plate (SUS304, thickness 0.8mm), use The oven was heated and maintained at 10 ° C for 24 hours in an air atmosphere. The appearance of the sample before and after heating (gloss loss or discoloration, blur, cracks, deformation, melting, fusion) was visually evaluated. Before and after heating, it can be confirmed that there is no difference, and if the difference is confirmed, the degree of observation is △ or X. (15) The RFID media produced by the RFID media has been produced using the RF-ID display combination (Omron Software Corporation) System, L720-H01T-W001) Perform signal exchange test. Evaluate the 50-piece label or card and find the defective product that cannot be exchanged. ^ The case where the defective product rate is less than 1% is 〇, 1% or more , The case of 5% is △, and the case of 5% or more is X. (16) Deviation of IC card or 1C tag communication distance The 1C tag or 1C card has been created, and the RF-ID display combination is used (Omron software company, L720-HO1T-W001) Perform a handshake test. Use 10 non-metallic handles at the end of the label or card to slowly approach the longest distance identified by the receiving antenna from a distance of approximately 50 cm. In the case of far recognition, the average communication distance and deviation are obtained from the communication distance to the case where it has not been recognized until recently. The raw material resin and the main particle used in the examples are as follows. [Polyethylene terephthalate resin (PET) Resin)] A polyethylene terephthalate resin having an intrinsic viscosity of 0.62 dl/g, an Sb content of 144 ppm, a Mg content of 58 ppm, a P content of 40 ppm, substantially no inert particles, and an internal precipitation of -53-200932523 particles. Vinylene naphthalate resin (PEN resin)] Polyethylene naphthalate resin having an intrinsic viscosity of 6363d/g, a Sb content of 250ppm, a Mg content of 58ppm, a P content of 40pPm, and substantially containing no inert particles and internal precipitated particles (PEN resin) [Amorphous polyester resin] Amorphous polyester resin A1: ethylene glycol component is ethylene glycol / neopentyl glycol = 70 / 30 molar ratio 'use inherent viscosity 〇 62d / g, Sb content 150ppm, Ο

Mg含量60ppm、Ρ含量40ppm之共聚聚對酞酸乙二酯樹脂。 在此樹脂之DSC裝置所致分析並無法觀測熔點，玻璃轉移 . 溫度爲74°C。 非晶性聚酯樹脂A2:二羧酸成份爲對苯二甲酸/萘二羧 酸=60/4 0莫耳比，使用固有黏度〇.62(11/2、31)含量15〇1)1)111、 Mg含量60 ppm、P含量4 Oppm、1.5/zm之無定形二氧化矽 粒子含有500PPm之共聚聚對酞酸乙二酯樹脂。在此樹脂之 0 DSC裝置所致分析並無法觀測熔點，玻璃轉移溫度爲98°C。 非晶性聚酯樹脂A3:二羧酸成份爲對苯二甲酸/癸二酸 = 90/10莫耳比’乙二醇成份爲乙二醇/新戊二醇^川/⑺莫耳 比，使用固有黏度0.62dl/g、Sb含量150ppm、Mg含量 • 60ppm、P含量40ppm之共聚聚對酞酸乙二酯樹脂。在此樹A copolymerized polyethylene terephthalate resin having a Mg content of 60 ppm and a cerium content of 40 ppm. The analysis by the DSC device of this resin did not allow the melting point to be observed, and the glass was transferred. The temperature was 74 °C. Amorphous polyester resin A2: The dicarboxylic acid component is terephthalic acid / naphthalene dicarboxylic acid = 60 / 40 molar ratio, using the intrinsic viscosity 〇.62 (11/2, 31) content 15 〇 1) 1 111. The amorphous cerium oxide particles having a Mg content of 60 ppm, a P content of 4 Oppm, and 1.5/zm contain a copolymerized polyethylene terephthalate resin of 500 ppm. The melting point was not observed in the analysis by the 0 DSC apparatus of the resin, and the glass transition temperature was 98 °C. Amorphous polyester resin A3: the dicarboxylic acid component is terephthalic acid / azelaic acid = 90/10 molar ratio 'ethylene glycol component is ethylene glycol / neopentyl glycol ^ Chuan / (7) molar ratio, A copolymerized polyethylene terephthalate resin having an intrinsic viscosity of 0.62 dl/g, an Sb content of 150 ppm, a Mg content of 60 ppm, and a P content of 40 ppm was used. In this tree

脂之D S C裝置所致分析並無法觀測熔點，玻璃轉移溫度爲 5 2〇CThe analysis caused by the D S C device of the grease could not observe the melting point, and the glass transition temperature was 5 2〇C.

[含有空洞形成劑主顆粒之調製] -54- 200932523 將熔融率1.5之聚苯乙烯樹脂（日本聚苯乙烯公司製， G797N)20質量％，熔融率3.0之氣相法聚合聚丙烯樹脂（出 光石油化學公司製，F300SP)20質量％及熔融率180之聚甲 基戊烯樹脂（三井化學公司製，TPX DX820)60質量％進行顆 粒混合，供給於二軸擠壓機進行充分捏合，將組成部分 (strand)冷卻、切斷並調整含有空洞形成劑主顆粒。 [含有氧化鈦主顆粒之調製] 在上述聚對酞酸乙二酯樹脂50質量％，將混合平均粒 徑0.3/zm(電子顯微鏡法）之銳鈦礦（anatase)型二氧化鈦50 質量％之物供給於通氣式二軸擠壓機進行預備捏合後，將熔 融聚合物連續地供給於通氣式單軸捏合機進行捏合並調整 含有氧化鈦主顆粒。 [含有蠟主顆粒之調製] 將混和有上述非晶性聚酯樹脂A195質量％，與聚乙烯 蠟（三井化學公司製，high wax 500，熔點105°C )5質量％之 物供給於通氣式二軸擠壓機在285 °C進行預備捏合。將此熔 融聚合物連續地供給於單軸擠壓機進行捏合來調整含有蟣 主顆粒W1。 將混合有上述非晶性聚酯樹脂A180質量％，與聚乙二 醇（東邦化學公司製，PEG 10000，熔點56°C )20質量％之物 供給於通氣式二軸擠壓機在270°C進行預備捏合。將此熔融 聚合物連續地供給於單軸擠壓機進行捏合來調整含有蠘主 顆粒W2。 -55- 200932523 (實施例1) [熱接性二軸拉伸聚酯薄膜之製造] 將上述含有空洞形成劑主顆粒8質量％，與上述含氧化 鈦主顆粒8質量％，及上述PET樹脂84質量％所成之混合 物作爲原料M。又，將上述非晶性聚酯樹脂A1 80質量％ 與無規聚苯乙烯樹脂（日本聚苯乙烯公司製，G797N;玻璃轉 移溫度95 °C)10質量％、含有蠟主顆粒W1 10質量％之混合 物作爲原料C。 〇 將原料Μ及原料C進行真空乾燥至水分率80ppm爲 止’各自供給於其他擠壓機進行熔融並導至給油套管，在 - 由原料Μ所成中間層（基材）兩面以使原料C所成熱系接層 積層之方式，以給油套管接合後，在以Τ型鑄模調節成20 °C之冷卻鼓上擠壓成薄膜狀，來製造厚度2.4mm之3層構 成的未拉伸薄膜。此外，在未拉伸薄膜製造時，於冷卻鼓 之相反面吹上調節至20°C之冷風並冷卻之。 Q 所得之未拉伸薄膜係使用加熱輥均一地加熱至70°C， 進而使用紅外線加熱器再進行加熱以使薄膜溫度成爲95 °C，同時在輥間利用速度差在縱方向進行3.4倍拉伸。如 ' 此一來所得縱一軸拉伸薄膜兩端以夾具把持，以熱風預熱 ' 使薄膜表面溫度成爲大約100°C後，一邊加熱至大約140 °C，一邊在橫方向進行3.8倍拉伸。其後，在使薄膜寬予 以固定之狀態下以乾燥熱風加熱至大約230°C爲止進行熱 固定，在冷卻至大約2 00°C爲止，同時在寬方向進行5%之 -56 - 200932523 鬆弛（relaxing)熱處理。其後緩緩進行冷卻，在薄膜表面溫 度比熱黏接層之玻璃轉移溫度更充分低的溫度之45 °C切除 薄膜端部，接著將薄膜捲繞成輥狀。 藉由以上方法，獲得厚度200 /zm之熱黏接性聚酯薄 膜。此外，將薄膜剖面以掃描型電子顯微鏡觀察，則各層 厚度（熱黏接層 Aa/中間層（基材）/熱黏接層Ab)，大約爲 20/160/20(單位；;u m)。 [可撓性印刷線路板之製造] 使用上述所得之熱黏接性二軸拉伸聚酯薄膜’以下述 方法來製作FPC。 . 首先，將上述所得薄膜之輥逢行縫隙加工獲得寬 400mm、捲長100m的網狀薄膜之輥。將與薄膜單面同寬之 鋁箔（1N30-O，厚度20μ m)自輥開捲同時予以積層，並實施 熱積層黏接。 在此所用積層黏接步驟之模式圖係如第1圖所示。 g 將以輥所開捲之網狀熱黏接性二軸拉伸聚酯薄膜’通 過導輥，以l〇m/分之速度導至加熱至表面溫度1〇〇°C的預 熱輥，使張力調節至20N/m同時進行預熱。在另一方面’ ' 使鋁箔通過導輥使張力調節於50N/m之同時進行開捲’以 . 加熱至16CTC之積層輥積層上述熱黏接性聚酯薄膜並進行 積層黏接。經積層後之網狀積層體經過空中放熱與以表面 溫度2 0 °C之冷卻輥的冷卻’在冷卻至表面溫度4 〇 °C後通過 導輥捲繞成輥狀。 -57- 200932523 接著，將此積層體表面之鋁箔蝕刻形成天線電路。 首先，在鋁箔表面使用紫外線硬化型蝕刻光阻油墨（東 洋紡績公司製，ER225N)進行電路圖型之連續印刷，照射 (5 00m〗/cm2)紫外線使油墨硬化。使用碳酸鈉水溶液（1質量 %)使光阻顯影後，在以添加有鹽酸氯化鐵 （ferric chloride) 水溶液（39質量％)進行蝕刻，以氫氧化鈉冰溶液（3質量％) 洗淨並除去光阻層。將其水洗後，於140 °C進行連續乾燥獲 得 FPC。 〇 [鑲嵌片及RFID媒體之製造] 使用以上述所得之FPC來製造鑲嵌片。亦即，就以輥 . 所開捲之網狀FPC _續體，使用絕緣油墨（東洋紡績公司 製，SR610C)與導電油墨（東洋紡績公司製，DW545)在要組 裝該1C之位置印刷跨接電路。將此導電性油墨作爲黏接劑 使1^10用1(：晶片〈準照13015693，13.561^1^〉固定於？？〇 上。將此捲繞成輥狀，獲得RFID媒體用鑲嵌片。[Preparation of main particles containing void-forming agent] -54- 200932523 A gas-polymerized polypropylene resin having a melt ratio of 1.5 polystyrene resin (G797N, manufactured by Nippon Polystyrene Co., Ltd.) and a melt ratio of 3.0 (light-emitting) 60% by mass of polymethylpentene resin (TPX DX820, manufactured by Mitsui Chemicals Co., Ltd.) of 20% by mass and a melting rate of 180, manufactured by Petrochemical Co., Ltd., and mixed with pellets, and supplied to a two-axis extruder for kneading. The strand cools, cuts, and adjusts the main particles containing the void former. [Preparation of main particles containing titanium oxide] 50% by mass of the above-mentioned polyethylene terephthalate resin, 50% by mass of anatase type titanium dioxide having an average particle diameter of 0.3/zm (electron microscopy) After being supplied to a ventilated two-axis extruder for preliminary kneading, the molten polymer was continuously supplied to a ventilating uniaxial kneader to knead and adjust the main particles containing titanium oxide. [Preparation of the wax-containing main particles] The amorphous polyester resin A was mixed with 195 mass%, and the polyethylene wax (manufactured by Mitsui Chemicals Co., Ltd., high wax 500, melting point 105 ° C) was supplied to the ventilated type. The two-axis extruder was subjected to preliminary kneading at 285 °C. This molten polymer was continuously supplied to a uniaxial extruder for kneading to adjust the main particles W1 containing ruthenium. 180% by mass of the above-mentioned amorphous polyester resin A was mixed with polyethylene glycol (manufactured by Toho Chemical Co., Ltd., PEG 10000, melting point: 56 ° C) to 20% by mass to a ventilated two-axis extruder at 270°. C performs preparatory kneading. This molten polymer was continuously supplied to a uniaxial extruder for kneading to adjust the ruthenium-containing main particles W2. -55-200932523 (Example 1) [Production of heat-bonding biaxially stretched polyester film] The above-mentioned void-forming agent main particles 8 mass%, and the above-mentioned titanium oxide-containing main particles 8 mass%, and the above PET resin A mixture of 84% by mass was used as the raw material M. In addition, 80% by mass of the amorphous polyester resin A1 and a random polystyrene resin (G797N, manufactured by Nippon Polystyrene Co., Ltd.; glass transition temperature: 95 ° C) are 10% by mass, and the wax main particle W1 is 10% by mass. The mixture is used as the raw material C. ΜThe raw material Μ and the raw material C are vacuum-dried until the water content is 80 ppm. Each of them is supplied to another extruder to be melted and guided to the oil supply nipple, and the raw material Μ is formed on both sides of the intermediate layer (substrate) to make the raw material C The heat-separating layer is formed by laminating the oil-injection sleeve and then extruding into a film on a cooling drum adjusted to 20 ° C by a 铸-type mold to produce an unstretched three-layer structure having a thickness of 2.4 mm. film. Further, in the production of the unstretched film, cold air adjusted to 20 ° C was blown on the opposite side of the cooling drum and cooled. The unstretched film obtained by Q was uniformly heated to 70 ° C using a heating roll, and further heated by an infrared heater to make the film temperature 95 ° C, and 3.4 times in the longitudinal direction by the difference in speed between the rolls. Stretch. For example, 'the longitudinally-axially stretched film obtained at both ends is held by a jig and preheated by hot air'. After the film surface temperature is about 100 ° C, it is heated to about 140 ° C and stretched 3.8 times in the transverse direction. . Thereafter, the film is fixed in a state where the film width is fixed, and is heat-fixed by heating with a dry hot air to about 230 ° C, and is cooled to about 200 ° C while performing 5% -56 - 200932523 relaxation in the width direction ( Relaxing) heat treatment. Thereafter, the film was slowly cooled, and the film end portion was cut at 45 ° C at a temperature at which the film surface temperature was sufficiently lower than the glass transition temperature of the heat bonding layer, and then the film was wound into a roll shape. By the above method, a heat-adhesive polyester film having a thickness of 200 / zm was obtained. Further, when the film cross section is observed by a scanning electron microscope, the thickness of each layer (thermal bonding layer Aa / intermediate layer (substrate) / thermal bonding layer Ab) is about 20/160/20 (unit; ; u m). [Production of Flexible Printed Wiring Board] FPC was produced by the following method using the heat-adhesive biaxially stretched polyester film obtained above. First, the roll of the above-mentioned obtained film was subjected to slit processing to obtain a roll of a web-like film having a width of 400 mm and a roll length of 100 m. An aluminum foil (1N30-O, thickness 20 μm) having the same width as one side of the film was unrolled from the roll while being laminated, and a thermal laminate was bonded. The pattern diagram of the layer bonding step used herein is as shown in Fig. 1. g The web-shaped heat-adhesive biaxially stretched polyester film unwound by a roll is guided by a guide roller to a preheating roll heated to a surface temperature of 1 ° C at a speed of 10 μm/min. The tension was adjusted to 20 N/m while preheating. On the other hand, ''the aluminum foil was unrolled while being adjusted to a tension of 50 N/m by a guide roller'. The laminate was heated to a laminate of 16 CTC to laminate the above-mentioned heat-adhesive polyester film and laminated. The laminated mesh laminate was cooled in the air and cooled by a chill roll at a surface temperature of 20 ° C. After cooling to a surface temperature of 4 〇 ° C, it was wound into a roll by a guide roll. -57- 200932523 Next, the aluminum foil on the surface of the laminate is etched to form an antenna circuit. First, an ultraviolet curable etching resist ink (ER225N, manufactured by Toyobo Co., Ltd.) was used for continuous printing on a surface of an aluminum foil, and ultraviolet rays were irradiated (500 m/cm2) to harden the ink. After developing the photoresist with an aqueous solution of sodium carbonate (1% by mass), it was etched with an aqueous solution of ferric chloride (39% by mass), and washed with an ice water solution (3 mass%). Remove the photoresist layer. After washing with water, continuous drying was carried out at 140 ° C to obtain FPC. 〇 [Manufacture of Mosaic and RFID Media] The embedded sheet was produced using the FPC obtained above. In other words, in the mesh FPC _ continuation of the roll, the insulating ink (SR610C, manufactured by Toyobo Co., Ltd.) and the conductive ink (DW545, manufactured by Toyobo Co., Ltd.) are used to print the bridge at the position where the 1C is to be assembled. Circuit. This conductive ink was used as a bonding agent, and 1 (10) was fixed on a crucible by using a wafer 1 (a wafer of reference 13015693, 13.561^1^). This was wound into a roll to obtain an insert for RFID media.

Q 接著，使用上述所得鑲嵌片，以熱積層步驟製造RFID 媒體。製造步驟之模式圖係如第2圖所示。 將以輥開捲之網狀鑲嵌片，通過導輥以l〇m/分之速度 ' 導至被加熱至表面溫度1201：之預熱輥，在調節張力至 ' 3 ON/m之同時進行預熱。另一方面將網狀微含有細空洞聚 酯薄膜（東洋紡績公司製，CrispaK2323，250//m)，通過導 輥將張力調節於30N/m同時進行開捲，與上述同以預熱輥 進行預熱。以使該等薄膜加熱至160 °C之積層輥積層於上述 -58- 200932523 熱鑲嵌片兩面進行積層黏接。被積層後網狀RFID媒體經過 在空中之放熱與表面溫度20°C之冷卻輥之冷卻，在冷卻至 表面溫度40°C後通過導輥作爲RFID媒體製品輥進行捲 繞。所得RFID媒體之製品輥係依照常法進行沖切加工，獲 得 86mm X 54mm 之 RFID 媒體（1C 卡）。 (實施例2) 上述含有氧化鈦主顆粒30質量％與上述PET樹脂35 質量％，前期非晶性聚酯樹脂A1爲由35質量％所成之混合 物，作爲原料Μ。又，將上述非晶性聚酯樹脂A2爲85質 量％與直鏈狀低密度聚乙烯樹脂（宇部九善聚乙烯公司製， Umedt 2040F;熔點1 16°C )15質量％之混合物作爲原料C。 又，在製造未拉伸薄膜時變更共擠壓之各層厚度，成爲厚 度25 0 // m，亦即熱黏接層Aa/中間層/熱黏接層Ab之各層 厚度爲12/26/12(單位：# m)。其他則與實施例相同，來製作 熱黏接性二軸拉伸聚酯薄膜。 又，與實施例1相同將所得金屬箔積層體表面進行光 阻處理及蝕刻處理，做成10條寬0.5mm，間隔0.4mm之多 條圖型。在形成有此電路之金屬箔積層體，使用第3圖之 積層步驟，與使用於基材者相同積層熱黏接性二軸拉伸聚 酯薄膜》 亦即，將從輥所開捲之網狀金屬箔積層體（FPC之一形 態）導至加熱爐，以熱風所致加熱預熱至表面溫度l〇〇°C爲 止。又，在此金屬箔積層體之電路側表面積層薄膜。除此 -59- 200932523 之外則與實施例1相同進行薄膜之積層，將電路部分做成 寬10mm之縫隙’來製作於電路兩面配置聚酯薄膜之可撓 性扁平電纜（FPC之一形態）^ (實施例3) 將由上述含空洞形成劑之主顆粒6質量％與上述PET 樹脂94質量％所成混合物作爲原料μ。又，將上述非晶性 聚醋樹脂Α2 87質量％與共聚聚丙烯樹脂（Prime聚合物公司 製’熔點138°C)3質量％、含蠟劑主顆粒W2 10質量％之混 〇 合物作爲原料c。又，在製造未拉伸薄膜時變更共擠壓各 層之厚度，厚度125/zm’亦即熱黏接層Aa/中間層/熱黏接 - 層Ab各層之厚度作爲1〇/1 00/15(單位：// m)。其他則與實施 例1相同來製作熱黏接性二軸拉伸聚酯薄膜。 在此使用所得薄膜，與實施例1相同來製作FPC。但， 在金屬箔方面係使用銅箔（CU-JIS C 6515-E2-S-2規格品， 35/zm)以替代鋁箔，在熱黏接層Ab層側之薄膜表面設置 Q 電路。又，在此使用所得FPC，與實施例1同來製作RFID 媒體用鑲嵌片。 接著，使用上述所得鑲嵌片，藉由熱積層步驟來製造 RFID媒體。製造步驟之模式圖如第4圖所示。 ' 將從輥所開捲之網狀鑲嵌片，通過導輥以10m/分之速 度導至加熱至表面溫度3 00°C之紅外線加熱器之間，將張力 調節至30N/m同時預熱至表面溫度100°C。另一方面將含 網狀微細空洞之聚酯薄膜（東洋紡績公司製，Crispa -60- 200932523 K2323，50# m)，通過導輥使張力調節於l〇N/m同時進行開 捲，以加熱至160°C之積層輥積層於上述熱鑲嵌片兩面進行 積層黏接。被積層後之網狀RFID媒體經過空中之放熱與表 面溫度20°C之冷卻輥的冷卻，在冷卻至表面溫度40°C後通 過導輥作爲RFID媒體製品輥進行捲繞。在此RFID媒體單 面實施黏著加工後進行沖切加工，獲得120mm X 54mm之 RFID媒體（1C標籤）。 (實施例4) ❹ 將上述含有空洞形成劑之主顆粒15質量％與上述PET 樹脂8 5質量％所成混合物作爲原料Μ。又，將上述非晶性 . 聚酯樹脂 A3 88質量％與環狀聚烯烴樹脂（三井化學公司 製，APL8008T，玻璃轉移溫度70°C)6質量％、含有蠟主顆 粒W1 6質量％之混合物作爲原料C。又，在製造未拉伸薄 膜時變更共擠壓之各層厚度，厚度125#m，亦即熱黏接層 Aa/中間層/熱黏接層Ab各層之厚度成爲1 5/220/1 5(單位： φ 〆m)。其他則同於實施例1，來製作熱黏接性二軸拉伸聚 酯薄膜。 接著，同於實施例3將銅箔積層於上述所得薄膜之單 面來製作金屬箔積層體後，以同於實施例2進行光阻處理 及蝕刻處理。進而，在形成電路之金屬箔積層體之電路側 表面進行錫鍍敷處理，來製作可擦性扁平電纜（FPC之一形 態）。 (實施例5) -61- 200932523 僅上述PET樹脂作爲原料Μ。又，將上述非晶性聚酯 樹脂Α1 70質量％與上述無規聚苯乙嫌樹脂 5質量％、直鏈 狀低密度聚乙烯樹脂5質量％、含蠟之主顆粒wi 20質量％ 之混合物作爲原料C。又’在製造未拉伸薄膜時變更共擠 壓之各層厚度，厚度80/zm，亦即熱黏接層Aa /中間層/熱 黏接層Ab各層之厚度作爲20/40/20(單位：^ m)。其他則同 於實施例1，來製作熱黏接性二軸拉伸聚酯薄膜。其他則 同於實施例1，來製作FPC、鑲嵌片及RFID媒體（1C卡）。 (實施例6) 將上述含有空洞形成劑之主顆粒8質量％與上述PEN 樹脂9 2質量.％所)¾混合物作爲原料Μ。又，將上述非晶性 聚酯樹脂Α2 80質量％與無規聚苯乙烯樹脂1〇質量％、含 蠟主顆粒W1 10質量％所成混合物作爲原料C。 將原料Μ及原料C真空乾燥至水分率8 Oppm爲止，供 給至各個其他之擠壓機進行熔融並導至給油套管（feed block) ’在由原料Μ所成中間層（基材）兩面積層有由原料C 所成熱黏接層之方式以給油套管接合後，在以Τ型鑄模調 節至20°C之冷卻鼓上擠壓成薄膜狀，並製造厚度2.4mm之 3層構成的未拉伸薄膜。此外，在未拉伸薄膜製造時，在 冷卻鼓之相反面吹上調節至20°C之冷風予以冷卻。 將所得之未拉伸薄膜使用加熱輥均一地加熱至100 °C ’進而使用紅外線加熱器加熱至薄膜溫度爲120°C，同時 在輥間利用速度差在縱方向進行3.0倍拉伸。如此一來所 -62- 200932523 得縱一軸拉伸薄膜之兩端以夾具把持，以熱風預熱’使薄 膜表面溫度成爲大約140 °C後，在加熱至大約170°C爲止， 同時在橫方向進行3.4倍拉伸。其後，使薄膜寬在固定之 狀態藉由乾燥熱風加熱至大約240°C爲止進行熱固定，在冷 卻至大約200°C爲止，同時在寬方向進行5%之鬆弛熱處 理。其後進行緩慢地冷卻，在薄膜表面溫度以成爲比熱黏 接層之玻璃轉移溫度更充分低之溫度後切除薄膜端部，接 著將薄膜捲繞成輥狀。 〇 藉由以上方法，獲得厚度200 之熱黏接性聚酯薄 膜。此外，使薄膜剖面以掃描型電子顯微鏡觀察，則各層 厚度（熱黏接層 Aa/中間層（基材）/熱黏接層Ab)大約爲 20/160/20(單位：μ m)。 使用上述所得之薄膜，與實施例3相同來製作FPC， 鑲嵌片及RFID媒體（1C標籤）。 (比較例1) Q 將上述含有空洞形成劑之主顆粒8質量％與含有氧化 鈦主顆粒8質量％與上述PET樹脂84質量％所成混合物作 爲原料M。又’將上述非晶性聚酯樹脂A1 95質量％與聚丙 烯樹脂5質量％之混合物作爲原料c。除此之外同於實施 ' 例1 ’來製作FPC，鑲嵌片及rfid媒體（ic卡）。 (比較例2) 將由上述含有氧化欽主顆粒3〇質量％與上述pet樹脂 70質量％所成混合物作爲原料M。又，將上述非晶性聚醋 -63- 200932523 樹脂A2 94質量％與無規聚苯乙烯樹脂6質量％之混合物作 爲原料C。除此之外則與實施例2同，來製作可撓性扁平 電纜（FPC之一形態）。 (比較例3) 在不含有微細空洞之透明二軸拉伸聚酯薄膜（東洋紡 績公司製，CosmoshineA4300，厚度lOOym)之單面藉由擠 壓積層法塗布熱熔性黏接劑（東洋紡績公司製，Vylon GM920)，來製作各層厚度（熱黏接層Aa/中間層（基材）/熱黏 接層Ab)大約10/100/15(單位：/zm)之具有黏接劑層的二軸 拉伸聚酯薄膜》 此薄膜摩擦係數大，又表面顯著平滑，故輥所致金屬 箔之熱積層黏接有困難。因此，藉由習知之熱壓製法來製 作FPC。亦即，將上述薄膜切出3 0 cm四方後，在其熱黏接 層Ab層側表面積層實施例3所用之銅箔，使上下兩面以鐵 氟龍（註冊商標）薄片保護藉由熱壓（140°C、0.3MPa、10分 鐘）進行黏接。關於此金屬箔積層體，將與實施例1相同之 光阻處理及鈾刻處理以批次步驟實施，來製作FPC。 接著，使用此FPC來製作鑲嵌片及RFID媒體。關於 亦即，上述FPC同於實施例1，在製作鑲嵌片後，在該鑲 嵌片兩面配置含有空洞聚酯薄膜（東洋紡績公司製，Crispa K2323，50/zm)藉由熱壓（140°C、0.3MPa、10 分鐘）進行黏 接。其他則與實施例3相同，獲得RFID媒體（1C標籤）。 (比較例4) -64- 200932523 將不含有微細空洞之透明二軸拉伸聚酯薄膜（東洋紡 績公司製、E5000、厚度250// m)與上述鋁箔自輥進行開捲 同時進行積層，並實施熱積層黏接。亦即，使用第3圖之 積層黏接步驟，將以輥所開捲之網狀透明二軸拉伸聚酯薄 膜，通過導輥加熱至溫度180 °C之熱風烤爐以l〇m/分之速 度導引，在使張力調節至5N/m同時進行預熱。在另一方面 將鋁箔通過導輥使張力調節至10 N/m同時進行開捲，以加 熱至290°C之鐵氟龍（註冊商標）製積層輥積層上述二軸拉 伸聚酯薄膜並進行積層黏接。被積層後之網狀積層體經過 在空中之放熱與以表面溫度60°C之鐵氟龍（註冊商標）製冷 卻輥之冷卻’在冷卻至表面溫度40°C爲止後通過導輥捲繞 於輥。 關於所得之金屬箱積層體’實施與實施例4相同之光 阻處理，鈾刻處理與錫鍍敷處理，來製作可擦性扁平電纜 (FPC之一形態）。 (比較例5) 將上述含有氧化鈦主顆粒10質量％及上述非晶性聚酯 樹脂A90質量％所成混合物作爲原料μ。將此原料Μ真空 乾燥至水分率80ppm爲止並供給於一台擠壓機。將此原料 在擠壓機內部加熱至28(TC爲止進行熔融混合後，在以τ 型鑄模調節於20 °C之冷卻鼓上進行擠壓，來製造未拉伸非 晶性白色聚酯樹脂薄片（厚度〇.3mm)。此外，在冷卻鼓之相 反面吹上調節至20°C，相對濕度30%之冷風進行冷卻。 -65- 200932523 所得薄片耐熱性因不充分，在加熱時無法施加充分的 張力，使得輥所致金屬箔之熱積層有困難。因此’與比較 例3相同藉由習知之熱壓製法，以批次步驟製作FPC與鑲 嵌片、RFID媒體（1C標籤）。 (比較例6) 在含有空洞聚酯薄膜（東洋紡績公司製、Crispa K1212、厚度100/zm)之單面使含有環氧基聚酯聚胺甲酸乙 酯黏接劑塗布於2/zm厚度後，將上述鋁箔自輥進行開捲同 時以連續步驟進行乾積層黏接。又，關於此金屬箔積層體 同於實施例1來製作FPC及鑲嵌片。接著，關於上述所得 鑲嵌片，使用上述黏接劑進行乾積層黏接，來製作RFID媒Q Next, using the above-described obtained inlay sheet, an RFID medium is manufactured in a thermal lamination step. The pattern diagram of the manufacturing steps is shown in Figure 2. The web-shaped insert piece unwound by a roll is guided to a preheating roll heated to a surface temperature of 1201 by a guide roller at a speed of 10 μm/min., and the tension is adjusted to '3 ON/m. heat. On the other hand, the mesh-like micro-containing fine-walled polyester film (Crispa K2323, 250//m, manufactured by Toyobo Co., Ltd.) was subjected to unwinding by adjusting the tension to 30 N/m by a guide roller, and performing the preheating roll with the above-mentioned Preheat. The laminate roll of the film was heated to 160 ° C for lamination bonding on both sides of the above-mentioned -58-200932523 heat-insulating sheet. After being laminated, the mesh RFID medium was cooled by a cooling roll in the air and a surface temperature of 20 ° C, and after being cooled to a surface temperature of 40 ° C, it was wound by a guide roll as an RFID media product roll. The obtained RFID media product roll was punched according to the conventional method to obtain 86 mm X 54 mm RFID media (1C card). (Example 2) The mixture containing 30% by mass of the main titanium oxide particles and 35% by mass of the above-mentioned PET resin, and the pre-form amorphous polyester resin A1 being a mixture of 35% by mass, was used as a raw material. In addition, a mixture of the above-mentioned amorphous polyester resin A2 and a linear low-density polyethylene resin (manufactured by Ubetsu Hykasan Polyethylene Co., Ltd., Umedt 2040F; melting point: 16 ° C) of 15% by mass is used as the raw material C. . Moreover, when manufacturing the unstretched film, the thickness of each layer of the co-extrusion is changed to become a thickness of 25 0 // m, that is, the thickness of each layer of the thermal bonding layer Aa/intermediate layer/thermal bonding layer Ab is 12/26/12. (Unit: #m). Otherwise, a heat-adhesive biaxially stretched polyester film was produced in the same manner as in the examples. Further, in the same manner as in Example 1, the surface of the obtained metal foil laminate was subjected to photoresist treatment and etching treatment to obtain 10 patterns having a width of 0.5 mm and a spacing of 0.4 mm. In the metal foil laminate in which the circuit is formed, the laminate step of Fig. 3 is used, and the same layer of the heat-bonding biaxially stretched polyester film is used as the substrate, that is, the web which is unwound from the roll The metal foil laminate (in the form of one of FPC) is led to a heating furnace and heated to a surface temperature of 10 ° C by heating by hot air. Further, a film is formed on the circuit side surface area of the metal foil laminate. In the same manner as in the first embodiment, except that the film was laminated in the same manner as in the first embodiment, and the circuit portion was formed as a slit having a width of 10 mm, a flexible flat cable (in the form of one FPC) in which a polyester film was disposed on both sides of the circuit was produced. (Example 3) A mixture of 6 mass% of the main particles containing the above void-forming agent and 94% by mass of the above-mentioned PET resin was used as the raw material μ. In addition, as a mixed composition of the above-mentioned amorphous polyester resin Α2 87% by mass, a copolymerized polypropylene resin (a melting point of 138 ° C manufactured by Prime Polymer Co., Ltd.) of 3% by mass, and a wax-containing main particle W2 of 10% by mass, Raw material c. Moreover, when manufacturing the unstretched film, the thickness of each layer of the co-extruded layer is changed, and the thickness of each layer of the thermal bonding layer Aa/intermediate layer/thermal bonding layer A is as 1 〇/1 00/15. (Unit: m). Otherwise, a heat-adhesive biaxially stretched polyester film was produced in the same manner as in Example 1. The obtained film was used here, and FPC was produced in the same manner as in Example 1. However, in the case of the metal foil, a copper foil (CU-JIS C 6515-E2-S-2 specification, 35/zm) was used instead of the aluminum foil, and a Q circuit was provided on the surface of the film on the side of the layer of the heat-bonding layer Ab. Further, the obtained FPC was used here, and the embedded sheet for RFID media was produced in the same manner as in Example 1. Next, using the above-described obtained inlay sheet, an RFID medium is manufactured by a thermal lamination step. The pattern of the manufacturing steps is shown in Figure 4. ' The mesh inserts unwound from the rolls are guided by a guide roller at a speed of 10 m/min to an infrared heater heated to a surface temperature of 300 ° C. The tension is adjusted to 30 N/m while preheating to The surface temperature is 100 °C. On the other hand, a polyester film containing a network of fine voids (Crispa-60-200932523 K2323, 50# m, manufactured by Toyobo Co., Ltd.) was subjected to unwinding by a guide roller to adjust the tension to l〇N/m to heat. A laminate roll layer of 160 ° C is laminated on both sides of the above-mentioned hot mosaic sheet. The laminated mesh RFID medium was cooled by a heat release in the air and a cooling roll having a surface temperature of 20 ° C, and was cooled to a surface temperature of 40 ° C and then wound by a guide roll as an RFID media product roll. After the RFID media was subjected to the bonding process on one side, the punching process was performed to obtain a 120 mm X 54 mm RFID medium (1C tag). (Example 4) 混合物 A mixture of 15% by mass of the main particles containing the void-forming agent and 85 % by mass of the above-mentioned PET resin was used as a raw material. In addition, the amorphous polyester resin A3 88% by mass and the cyclic polyolefin resin (APL8008T, glass transition temperature 70 ° C, manufactured by Mitsui Chemicals Co., Ltd.) are 6 mass%, and the mixture containing the wax main particles W16 mass% is contained. As raw material C. Moreover, when manufacturing the unstretched film, the thickness of each layer of the co-extrusion is changed, and the thickness is 125#m, that is, the thickness of each layer of the heat bonding layer Aa/intermediate layer/thermal bonding layer Ab becomes 1 5/220/1 5 ( Unit: φ 〆m). Otherwise, in the same manner as in Example 1, a heat-adhesive biaxially stretched polyester film was produced. Next, in the same manner as in Example 3, a copper foil was laminated on one surface of the obtained film to prepare a metal foil laminate, and then a photoresist treatment and an etching treatment were carried out in the same manner as in Example 2. Further, a tin plating treatment is performed on the surface side of the circuit on which the metal foil laminate of the circuit is formed to form a wipeable flat cable (in the form of one FPC). (Example 5) -61- 200932523 Only the above PET resin was used as a raw material. Further, a mixture of the above-mentioned amorphous polyester resin Α1 70% by mass and the above-mentioned random polyphenylene styrene resin 5 mass%, linear low-density polyethylene resin 5 mass%, and wax-containing main particle wi 20 mass% As raw material C. In addition, when manufacturing the unstretched film, the thickness of each layer of the co-extrusion is changed, and the thickness is 80/zm, that is, the thickness of each layer of the thermal bonding layer Aa/intermediate layer/heat bonding layer Ab is 20/40/20 (unit: ^ m). Otherwise, in the same manner as in Example 1, a heat-adhesive biaxially stretched polyester film was produced. Others are the same as in the first embodiment to fabricate FPCs, mosaics, and RFID media (1C cards). (Example 6) A mixture of 8 % by mass of the above-mentioned main particles containing a void-forming agent and 92 % by mass of the above-mentioned PEN resin was used as a raw material. In addition, a mixture of the above-mentioned amorphous polyester resin Α280% by mass and a random polystyrene resin of 1% by mass and the wax-containing main particle W1 10% by mass is used as the raw material C. The raw material crucible and the raw material C are vacuum-dried to a moisture content of 8 Oppm, and supplied to each of the other extruders to be melted and guided to a feed block 'in the intermediate layer (substrate) formed by the raw material crucible After the oil-filled sleeve is joined by the raw material C, it is extruded into a film on a cooling drum adjusted to 20 ° C by a 铸-type mold, and a three-layer structure having a thickness of 2.4 mm is produced. Stretch the film. Further, in the production of the unstretched film, cold air adjusted to 20 ° C was blown on the opposite side of the cooling drum to be cooled. The obtained unstretched film was uniformly heated to 100 ° C by a heating roll and further heated to a film temperature of 120 ° C by an infrared heater while stretching 3.0 times in the longitudinal direction by a difference in speed between rolls. In this way, -62- 200932523, the two ends of the longitudinally stretched film are held by a jig, and the hot air is preheated to make the film surface temperature about 140 ° C, and then heated to about 170 ° C while in the transverse direction. Perform 3.4 times stretching. Thereafter, the film was allowed to be heat-fixed by heating with a dry hot air to a temperature of about 240 ° C in a fixed state, and was cooled to about 200 ° C while being subjected to a relaxation heat treatment of 5% in the width direction. Thereafter, the film was slowly cooled, and the film end portion was cut at a temperature at which the film surface temperature became lower than the glass transition temperature of the heat-adhesive layer, and then the film was wound into a roll shape.藉 By the above method, a heat-adhesive polyester film having a thickness of 200 is obtained. Further, by observing the cross section of the film by a scanning electron microscope, the thickness of each layer (thermal bonding layer Aa / intermediate layer (substrate) / thermal bonding layer Ab) was about 20/160/20 (unit: μ m). Using the film obtained above, FPC, an embedded sheet, and an RFID medium (1C label) were produced in the same manner as in Example 3. (Comparative Example 1) Q A mixture of 8 mass% of the main particles containing the void-forming agent and 8 mass% of the main titanium oxide particles and 84 mass% of the PET resin was used as the raw material M. Further, a mixture of 95% by mass of the above amorphous polyester resin A1 and 5% by mass of a polypropylene resin was used as the raw material c. In addition to the implementation of 'Example 1', FPC, mosaic and rfid media (ic card) were produced. (Comparative Example 2) A mixture of 3 mass% of the above-mentioned oxidized main particles and 70% by mass of the above pet resin was used as the raw material M. Further, a mixture of 94% by mass of the above-mentioned amorphous polyester-63-200932523 resin A2 and 6% by mass of a random polystyrene resin was used as the raw material C. Otherwise, in the same manner as in the second embodiment, a flexible flat cable (in one form of FPC) was produced. (Comparative Example 3) A hot-melt adhesive was applied by a press lamination method on one side of a transparent biaxially stretched polyester film (Cosmoshine A4300, thickness 100 μm, manufactured by Toyobo Co., Ltd.) which does not contain fine voids (Toyobo Co., Ltd.) , Vylon GM920), to make the thickness of each layer (thermal bonding layer Aa / intermediate layer (substrate) / thermal bonding layer Ab) about 10/100/15 (unit: / zm) of the adhesive layer Axial Stretch Polyester Film This film has a large friction coefficient and a smooth surface. Therefore, it is difficult to bond the thermal laminate of the metal foil caused by the roller. Therefore, the FPC is produced by a conventional hot pressing method. That is, after the film is cut out to a square of 30 cm, the copper foil used in Example 3 is coated on the side surface layer of the heat-bonding layer Ab layer, and the upper and lower sides are protected by Teflon (registered trademark) sheet by hot pressing. (140 ° C, 0.3 MPa, 10 minutes) bonding. With respect to this metal foil laminate, the same photoresist treatment and uranium engraving treatment as in Example 1 were carried out in a batch procedure to produce FPC. Next, the FPC is used to make the mosaic and the RFID media. In the same manner as in the first embodiment, the FPC was placed on both sides of the inlay sheet, and a hollow polyester film (Crispa K2323, 50/zm, manufactured by Toyobo Co., Ltd.) was placed on both sides of the inlay sheet by hot pressing (140 ° C). , 0.3MPa, 10 minutes) for bonding. Otherwise, in the same manner as in the third embodiment, an RFID medium (1C tag) was obtained. (Comparative Example 4) -64-200932523 A transparent biaxially stretched polyester film (manufactured by Toyobo Co., Ltd., E5000, thickness: 250/m) which does not contain fine voids, and the above-mentioned aluminum foil are unrolled from the roll and laminated. Perform thermal laminate bonding. That is, using the laminate bonding step of Fig. 3, the reticulated transparent biaxially stretched polyester film unwound by a roll is heated by a guide roll to a hot air oven at a temperature of 180 ° C at a temperature of l 〇 m / min. The speed guide is preheated while adjusting the tension to 5 N/m. On the other hand, the aluminum foil was unrolled by adjusting the tension to 10 N/m by a guide roll, and the above-mentioned biaxially stretched polyester film was laminated by a Teflon (registered trademark) laminated roll which was heated to 290 °C. Adhesive bonding. The laminated mesh layer is cooled by air in the air and cooled by a Teflon (registered trademark) cooling roll having a surface temperature of 60 ° C. After cooling to a surface temperature of 40 ° C, it is wound by a guide roll. Roller. The resulting metal box laminate was subjected to the same photoresist treatment as in Example 4, uranium engraving treatment and tin plating treatment to produce a rubbed flat cable (in the form of one of FPC). (Comparative Example 5) A mixture of 10% by mass of the above-mentioned titanium oxide main particles and 90% by mass of the above-mentioned amorphous polyester resin A was used as the raw material μ. This raw material was vacuum dried to a moisture content of 80 ppm and supplied to an extruder. The raw material was heated to 28 (TC) in the extruder, and then extruded on a cooling drum adjusted to 20 ° C in a τ type mold to produce an unstretched amorphous white polyester resin sheet. (thickness: 33mm). In addition, the cold air which is adjusted to 20 ° C and the relative humidity of 30% is blown on the opposite side of the cooling drum. -65- 200932523 The heat resistance of the obtained sheet is insufficient, and it is not possible to apply sufficient heat when heated. The tension made it difficult to thermally laminate the metal foil caused by the roll. Therefore, the same procedure as in Comparative Example 3 was used to prepare the FPC and the insert piece, the RFID medium (1C label) in a batch process by a conventional hot pressing method. (Comparative Example 6 The aluminum foil containing the epoxy-based polyester polyurethane adhesive is applied to a thickness of 2/zm on one side of a hollow polyester film (Crispa K1212, thickness 100/zm, manufactured by Toyobo Co., Ltd.) The dry laminate bonding was carried out in a continuous step from the roll unwinding. Further, the FPC and the insert were produced in the same manner as in Example 1 with respect to the metal foil laminate. Next, the above-mentioned obtained insert was dried using the above adhesive. Laminated bonding, RFID media production

Hiiir 體。 亦即，在以輥所開捲之網狀鑲嵌片之電路側表面使含 有環氧基聚酯聚胺甲酸乙酯黏接劑塗布於2;zm之厚度 後，將網狀含有微細空洞聚酯薄膜（東洋紡績公司製、Crispa K2 323、250// m)自輥開捲同時進行乾積層黏接，來製作 RFID媒體（1C卡）。 在上述實施例及比較例所得之熱黏接性二軸拉伸聚酯 薄膜之構成與特性如表1所示，使用其所得之FPC及RFID 媒體之特性如表2所示。 在實施例1〜6所得之FPC及RFID媒體，不良率與通 信距離之偏差小，製品外觀、耐熱性優異。又，作爲網狀 薄膜可進行連續加工，爲生產性優異》 另一方面，在比較例1及2，因薄膜與金屬箔之間的 潤滑性並非充分，故在金屬箔積層時產生微細的皺折，在 -66- 200932523 製品之外觀上產生問題。又，起因於此之不良率亦高，會 產生通信距離之偏差變大之不適合。 又，在比較例3 ’因薄膜與金屬箔間之潤滑性差，產 生顯著的皺折與氣泡而無法以連續積層製造製品，沒有辦 法進行以熱壓製法所致黏接。因此，不僅生產速度低，不 良率亦變大。進而，起因於熱熔性黏接劑層之厚度不均， 使得通信距離之偏差變大。 又’在比較例4’在電路形成後之積層處理步驟中， 薄膜產生熱變形使得平面性喪失，在FPC產生卷縮或皺折 等外觀不良。此係，以熱積層黏接來製作金屬箔積層體時 薄膜層進行熔融，因而使基材層成爲實質上不具有配向之 非晶性聚酯薄片。 又，在比較例5，係使用基材層實質上不具有配向之 非晶性聚酯薄片。因此，在施加張力之狀態進行加熱予以 熱積層則有困難，並無法以連續積層來製造製品。因此， 雖使用熱壓製法，但在熱壓製法所致黏接，生產速度低， 進而無法減低不良率。 在比較例6之製造步驟，並無產生大的問題。但是， 經過二次使用溶劑之乾積層之加工爲必要，故在環境適性 或作業步驟之繁雜性則爲需予改善之方法。此外’因黏接 劑層之厚度並非充分故積體電路或天線電路之凹凸吸收性 並非充分，在製品外觀與通信距離之偏差，則改善爲必要 之結果。 -67- 309Hiiir body. That is, the epoxy-containing polyester polyurethane adhesive is applied to the circuit side surface of the mesh-shaped insert unwound by the roll to a thickness of 2; zm, and the mesh contains fine void polyester. The film (Crispa K2 323, 250//m manufactured by Toyobo Co., Ltd.) was unrolled from the roll and bonded to the dry laminate to produce RFID media (1C card). The composition and characteristics of the heat-adhesive biaxially stretched polyester film obtained in the above examples and comparative examples are shown in Table 1, and the characteristics of the obtained FPC and RFID medium used are shown in Table 2. In the FPC and RFID media obtained in Examples 1 to 6, the variation in the defect rate and the communication distance was small, and the appearance and heat resistance of the product were excellent. Further, the mesh film can be continuously processed and is excellent in productivity. On the other hand, in Comparative Examples 1 and 2, since the lubricity between the film and the metal foil is not sufficient, fine wrinkles are generated when the metal foil is laminated. Folded, there was a problem with the appearance of the product at -66-200932523. Further, the defective rate due to this is also high, and it is not suitable for the variation in the communication distance. Further, in Comparative Example 3, since the lubricity between the film and the metal foil was inferior, significant wrinkles and bubbles were generated, and the product could not be produced by continuous lamination, and there was no method of bonding by hot pressing. Therefore, not only the production speed is low, but also the defect rate is also increased. Further, the thickness of the hot-melt adhesive layer is uneven, so that the deviation of the communication distance becomes large. Further, in Comparative Example 4, in the step of laminating treatment after circuit formation, the film was thermally deformed to lose planarity, and appearance defects such as curling or wrinkles were generated in the FPC. In this case, when the metal foil laminate is formed by heat-bonding, the film layer is melted, so that the base material layer becomes an amorphous polyester sheet having substantially no alignment. Further, in Comparative Example 5, an amorphous polyester sheet having substantially no alignment of the base material layer was used. Therefore, it is difficult to heat the layer in a state where tension is applied, and it is not possible to manufacture a product by continuous lamination. Therefore, although the hot pressing method is used, the bonding is caused by the hot pressing method, the production speed is low, and the defect rate cannot be reduced. In the manufacturing steps of Comparative Example 6, no major problem occurred. However, it is necessary to process the dry laminate of the solvent twice, so the environmental suitability or the complexity of the work steps is a method to be improved. Further, since the thickness of the adhesive layer is not sufficient, the unevenness absorbability of the integrated circuit or the antenna circuit is not sufficient, and the deviation between the appearance of the product and the communication distance is a necessary result. -67- 309

οο 25-_-_-- B Μ 赴 m i « m ^ 05 VQ v〇 cs IQ 1 1 CS m s f 1 s 闵 8 s cs 〇 § S s K 04 8 cn 8 l < 1 ® s Οί 〇 un CN o 1 1 CS I 曄 •S- ΈΠ 鵾 ψ M 啦辄 寸 vn 1 1 1 1 寸 vn 1 1 w-> 1 罐爵 m | m 既 M 9 S剌 邻鲰 V-/ oo 1 \〇 1 oo 〇〇 1 1 1 1 1 嘸 m 銳 U 囊 f ΐ 舶 ^ 1 寸 V) 1 1 § i 寸 _ « m 匾 * m 铵 癍 m s 餾 i： 汩 s II w i 頰 碓 It m m m 魍 m * 患 11 梠 k. 截 i u 媼 联 01 m * m 伥 想 U 1 1 賴 m m 軀 m ¢1 m m «Η 耻 W 駿 1 1 m II m II 1 1 赙 !i 1 ¥ II m abc 黎 S g V〇 r-\ ίύ Pu, 3 Sw/· cs cn iri I 1 騷 讎 a q a a UJ 0-. PU Pl, CQ 伽 U m m M 5 ，_ o VQ en \o VT) V~) o νη so /~s 占e 1 oo cn 1 VD 丁 1 oo CO 1 #5 1 1 o 1 没 1 m 1 m Ph & U U a s s d & < m 艇 黼 嵌 #1 < ^ P 艺 茬 s 其 媒 W sin 羅 避 嵌 m < i u 魎 嵌 m StQ i 避 m m isg 铢 魎 嵌 m < * Dm i 避 联 m * 〇J 婆 避 嵌 m i 避 m 晻 * s M 避 m m < iU_ TV ί m cs 辑 m 匡 m m 寸 辑 v〇 m m m v〇 辑 K i m ii 04 5 u a CO m 鎰 a 寸 U W~t 5 U Λ2 ν〇 霉 u — s- 200932523Οο 25-_-_-- B Μ to mi « m ^ 05 VQ v〇cs IQ 1 1 CS msf 1 s 闵8 s cs 〇§ S s K 04 8 cn 8 l < 1 ® s Οί 〇un CN o 1 1 CS I 晔•S- ΈΠ 鵾ψ M 辄 v vn 1 1 1 1 inch vn 1 1 w-> 1 canister m | m both M 9 S 剌 鲰 V-/ oo 1 \〇1 Oo 〇〇1 1 1 1 1 呒m sharp U sac f ΐ ship ^ 1 inch V) 1 1 § i inch _ « m 匾* m ammonium 癍 ms distillation i: 汩s II wi cheek 碓 It mmm 魍m * suffering 11 梠k. iuiu 媪 01 01 m * m U想 U 1 1 赖mm body m ¢1 mm «Η 耻 W 骏1 1 m II m II 1 1 赙!i 1 ¥ II m abc 黎 S g V〇 R-\ ίύ Pu, 3 Sw/· cs cn iri I 1 雠 雠 aqaa UJ 0-. PU Pl, CQ 伽 U mm M 5 , _ o VQ en \o VT) V~) o νη so /~s e 1 oo cn 1 VD Ding 1 oo CO 1 #5 1 1 o 1 Not 1 m 1 m Ph & UU assd &< m 黼 黼 # #1 < ^ P 茬 茬 s its medium W sin Embedded m < iu 魉 m m StQ i 避 mm isg 铢魉 m < * Dm i avoiding m * 〇J 婆 避 避 mi avoid m dark * s M avoid mm < iU_ TV ί m cs m m m m m m inch v〇 v〇 Series, Series K i m ii 04 5 u a CO m a Yi inch U W ~ t 5 U Λ2 ν〇 mildew u - s- 200932523

200932523 表中之略稱係如下述。ps:無規聚苯乙烯樹脂’ pp:聚 丙烯樹脂，LLDPE:直鏈狀低密度聚乙烯樹脂’ COC:環狀 聚烯烴樹脂，PE :聚乙烯孅’ PEG:聚乙二醇’ A1:鋁箔，Cu: 銅箱。 (實施例7) 使用加熱輥，將實施例1中所得未拉伸薄膜均一地加 熱至70°C，進而使用紅外線加熱器加熱使薄膜溫度變爲95 t，同時利用輥間之速度差在縱方向進行3.4倍拉伸。如 〇 此一來在所得縱一軸拉伸薄膜之表面使胺甲酸乙酯樹脂 1(大日本油墨化學公司製，HW-345;軟化溫度95°C、不揮發 . 分25%、黏度14mPa _ s)塗布成爲濕塗布量20g/m2，在80 °(：經30秒乾燥。塗布後，使縱一軸拉伸薄膜之兩端以夾具 把持，以熱風預熱使薄膜表面溫度成爲大約l〇(TC後，在加 熱至大約140°C爲止並同時在橫方向進行3.8倍拉伸。其 後’在固定薄膜寬之狀態下以乾燥熱風加熱至大約23 (TC爲 ❹ 止並進行熱固定，在冷卻至大約200。(：爲止並同時在寬方向 進行5 %之鬆驰熱處理。其後緩緩地進行冷卻，在薄膜表面 溫度比熱黏接層之玻璃轉移溫度更爲充分低的溫度之45。〇 將薄膜端部切除’接著使薄膜捲繞成輥狀，獲得厚度2〇〇 之熱黏接性聚酯薄膜，與實施例1相同，來製作可撓 性印刷線路板、鑲嵌片及rFID媒體。 (實施例8〜12、及比較例8、9) 與實施例7相同，將在實施例2〜6及比較例2，3中 -70- 200932523 所得之未拉伸薄膜，使用加熱輥在70°C均一地加熱，進而 使用紅外線加熱器加熱薄膜溫度成爲95 °C ’同時在輥間利 用速度差在縱方向進行3.4倍拉伸》如此一來在所得縱一 軸拉伸薄膜之表面塗布胺甲酸乙酯樹脂1(大日本油墨化學 公司製，HW-345;軟化溫度95°C、不揮發分25%，黏度 14mPa· s)使濕塗布量成爲20g/m2，在80°C經30秒乾燥。 塗布後，使縱一軸拉伸薄膜兩端以夾具把持，以熱風預熱 使薄膜表面溫度成爲大約100°C後，加熱至大約140°C爲止 /並在橫方向進行3.8倍。其後，在固定薄膜寬之狀態下藉 由乾燥熱風加熱至大約230°C並進行熱固定，在冷卻至大約 200°C爲止並同時在寬方向進行5%之鬆弛熱處理。其後緩 緩地進行冷卻，在薄膜之表面溫度以成爲比熱黏接層之玻 璃轉移溫度更充分低的溫度之45 °C切除薄膜端部，接著使 薄膜捲繞成輥狀，獲得厚度200 /zm之熱黏接性聚酯薄膜， 與實施例同樣地，來製作可撓性印刷線路板，鑲嵌片及 > RFID媒體。 在實施例7〜12所得之FPC及RFID媒體，不良率與通 信距離之偏差小，製品之外觀，耐熱性爲優異，同時薄膜 與金屬箔之黏接性（剝離強度）亦爲優異。 -71- 200932523 ο ο U嗽】 稹層厚度Um) 熱黏 接層B CN VO CS 1 中間層i (酣）1 S 1 Ή 8 g <N § § 熱黏' 接層 -Α· ! 〇 in 1 中間層（基材）1 白色顔料 含量 (質量 ^_, 寸 1 1 1 1 寸 空洞顯 現劑 含置 (質量 〇〇 1 Ό 1 〇〇 〇〇 1 1 塗布層 1 水性胺甲酸乙酯 樹脂 水性胺甲酸乙酯 樹脂 水性胺甲酸乙酯 樹脂 水性胺甲酸乙酯 樹脂 水性胺甲酸乙酯 樹脂 ! 水性胺甲酸乙酯 樹脂 水性胺甲酸乙酯 觀旨 水性胺甲酸乙酯 樹脂 熱黏接層 ! 鎌粒子 含量 1 (ppm) _1 1 1 1 1 1 〇 寸 m 郷 1 j 二氧化矽| 1 二氧化矽| _i 1 1 1 1二氧化矽 1 二氧化矽 I 蠟劑 _ s <tn £ 1 CS cn — irj 1 1 種類 ω Ρ-. PEG S ω α. ω CL, ! 熱塑性樹脂B 1 含量| (質量1 %) 1 ___.__I 〇 cn Ό ν〇 l〇 ο V-» Tm (°C) 1 \〇 oo 1 v〇 f-H 1 1 〇〇 rn 1 Tg (°C) 没 1 1 ο 1 〇\ νη ΟΝ 1 u-i ON 駿 W ! LLDPE ____1 & COC PS LLDPE 2 a. & 00 cu 非晶性聚醋樹脂A Tg 1 (°C) oo On <30 〇\ OO ON m 函 非晶性聚醒樹脂Α1 非晶性聚酯樹目旨A2 非晶性聚醋樹脂A2 非晶性聚酯樹脂A3 非晶性聚醋樹脂A1 非晶性聚醋觀旨2 非晶性聚酯樹脂A1 1 非晶性聚醋樹脂A2 龍例7 J 實施例8 實施例9 實施例10 賁施例11 實施例12 比較例7 比較例8 •IL_ 200932523200932523 The abbreviations in the table are as follows. Ps: atactic polystyrene resin 'pp: polypropylene resin, LLDPE: linear low density polyethylene resin 'COC: cyclic polyolefin resin, PE: polyethylene 孅' PEG: polyethylene glycol 'A1: aluminum foil , Cu: Copper box. (Example 7) Using the heating roll, the unstretched film obtained in Example 1 was uniformly heated to 70 ° C, and further heated by an infrared heater to change the film temperature to 95 t while using the difference in speed between the rolls. The direction is 3.4 times stretched. For example, the surface of the obtained longitudinally-axially stretched film is made of urethane resin 1 (manufactured by Dainippon Ink Chemical Co., Ltd., HW-345; softening temperature 95 ° C, non-volatile. 25%, viscosity 14 mPa _ s The coating was applied to a wet coating amount of 20 g/m 2 at 80 ° (after drying for 30 seconds. After coating, both ends of the longitudinally-axially stretched film were held by a jig, and the surface temperature of the film was set to about 1 Torr by hot air preheating. Thereafter, the film was heated to about 140 ° C while being stretched 3.8 times in the transverse direction. Thereafter, it was heated to a dry heat of about 23 in a state of a fixed film width (TC was quenched and heat-fixed, under cooling). Up to about 200. (: At the same time, a 5% relaxation heat treatment is performed in the width direction. Thereafter, the cooling is slowly performed at a temperature at which the film surface temperature is sufficiently lower than the glass transition temperature of the heat bonding layer. The film end portion was cut out. Then, the film was wound into a roll shape to obtain a heat-adhesive polyester film having a thickness of 2 Å. A flexible printed wiring board, an insert sheet, and an rFID medium were produced in the same manner as in Example 1. (Examples 8 to 12, and Comparative Examples 8 and 9) and Examples In the same manner, the unstretched film obtained in Examples 2 to 6 and Comparative Examples 2 and 3, -70 to 200932523, was uniformly heated at 70 ° C using a heating roller, and further heated to a temperature of 95 ° by using an infrared heater. C' is simultaneously stretched 3.4 times in the longitudinal direction by the difference in speed between the rolls. Thus, the surface of the obtained longitudinally-axially stretched film is coated with urethane resin 1 (HW-345, manufactured by Dainippon Ink Chemical Co., Ltd.; softening) The temperature was 95 ° C, the nonvolatile content was 25%, the viscosity was 14 mPa·s), the wet coating amount was 20 g/m 2 , and the drying was performed at 80 ° C for 30 seconds. After coating, the longitudinally stretched film was held at both ends by a jig. The hot air preheating causes the surface temperature of the film to be about 100 ° C, is heated to about 140 ° C / and is 3.8 times in the transverse direction. Thereafter, it is heated to about 230 ° C by dry hot air while the film width is fixed. And heat-fixed, and 5% relaxation heat treatment is performed in the width direction while cooling to about 200 ° C. Thereafter, the film is slowly cooled, and the surface temperature of the film is more than the glass transition temperature of the heat bonding layer. 45 °C cut film at low temperature At the end, the film was wound into a roll to obtain a heat-adhesive polyester film having a thickness of 200 / zm, and a flexible printed wiring board, an embedded sheet, and an RFID medium were produced in the same manner as in the examples. The FPC and the RFID medium obtained in Examples 7 to 12 have a small variation in the defect rate and the communication distance, and the appearance of the product is excellent in heat resistance, and the adhesion between the film and the metal foil (peeling strength) is also excellent. 200932523 ο ο U嗽] 稹 layer thickness Um) thermal bonding layer B CN VO CS 1 intermediate layer i (酣)1 S 1 Ή 8 g <N § § heat-adhesive layer - Α· ! 〇in 1 middle Layer (substrate) 1 White pigment content (mass ^ _, inch 1 1 1 1 inch void display agent containing (mass 〇〇 1 Ό 1 〇〇〇〇 1 1 coating layer 1 aqueous urethane resin aqueous uric acid) Ethyl resin aqueous urethane resin aqueous urethane resin aqueous urethane resin! Waterborne urethane resin aqueous urethane ethyl amide (ppm) _1 1 1 1 1 1 inch inch m 1 j cerium oxide | 1 cerium oxide | _i 1 1 1 1 cerium oxide 1 cerium oxide I wax _ s <tn £ 1 CS cn — irj 1 1 species ω Ρ-. PEG S ω α. ω CL, ! Thermoplastic resin B 1 content | (mass 1 %) 1 ___.__I 〇cn Ό ν〇l〇ο V-» Tm (°C) 1 \〇oo 1 v〇fH 1 1 〇〇rn 1 Tg ( °C) No 1 1 ο 1 〇\ νη ΟΝ 1 ui ON Jun W ! LLDPE ____1 & COC PS LLDPE 2 a. & 00 cu Amorphous polyester resin A Tg 1 (°C) oo On <30 〇\ OO ON m Amorphous Revitalizing Resin Α1 Amorphous Polyester Tree A2 Amorphous Polyester Resin A2 Amorphous Polyester Resin A3 Amorphous Polyester Resin A1 Amorphous Poly vine 2 Amorphous polyester resin A1 1 Amorphous polyester resin A2 Dragon Example 7 J Example 8 Example 9 Example 10 Example 11 Example 12 Comparative Example 7 Comparative Example 8 • IL_ 200932523

200932523 [產業上利用可能性] 本發明之FPC係在具有耐熱性之基材上藉由使潤滑性 良好的熱黏接層進行共擠壓而設置’在使網狀薄膜與金屬 箔連續積層步驟進行熱黏接而可製造FPC者。因此’不僅 可獲得高生產速度，使用此亦可使RFID媒體藉由連續積層 步驟而在高生產速度下製造。又藉由連續積層步驟所製造 之RFID媒體，與使用到黏接劑之習知壓製步驟比較可改善 不良品發生率，亦可改善電氣品質之偏差。因此，本發明 1 7 對RFID媒體之普及則有極大的貢獻。 【圖示簡單說明】 第1圖在實施例1、2、5所使用積層黏接步驟之模式 圖。 第2圖在實施例1、3、4、5、6所使用積層黏接步驟 之模式圖。 第3圖在實施例2所使用積層黏接步驟之模式圖。 > 第4圖在實施例3、6所使用積層黏接步驟之模式圖。 【主要元件符號說明】 1 經開捲之薄膜或鑲嵌片、金屬箔積層體之輥 2 導輥 3 經開捲之金屬箔或鑲嵌片、薄膜之輥 4 預熱輥 5 積層輥 6 冷卻輥 -74- 200932523200932523 [Industrial Applicability] The FPC of the present invention is provided on a substrate having heat resistance by co-extruding a thermal adhesive layer having good lubricity to provide a step of continuously laminating a mesh film and a metal foil. FPC can be manufactured by thermal bonding. Therefore, not only can high production speeds be obtained, but also the RFID media can be manufactured at a high production speed by a continuous lamination step. Further, the RFID medium manufactured by the continuous lamination step can improve the incidence of defective products and improve the variation in electrical quality as compared with the conventional pressing step using the adhesive. Therefore, the present invention has a great contribution to the spread of RFID media. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a step of laminating bonding used in Examples 1, 2, and 5. Fig. 2 is a schematic view showing the steps of the layer bonding in the first, third, fourth, fifth, and sixth embodiments. Fig. 3 is a schematic view showing the step of laminating bonding used in the second embodiment. > Figure 4 is a schematic view of the layer bonding step used in Examples 3 and 6. [Description of main component symbols] 1 Unrolled film or insert, roll of metal foil laminate 2 Guide roll 3 Unwound metal foil or insert, film roll 4 Preheat roll 5 Laminated roll 6 Cooling roll - 74- 200932523

7 壓料輥 8 經捲繞之FPC或RFID媒體之製品輥 9 加熱爐 10 紅外線加熱器 -75-7 nip roll 8 Wrapped FPC or RFID media product roll 9 Heating furnace 10 Infrared heater -75-

Claims (1)

200932523 十、申請專利範圍： 1.—種可撓性印刷線路板，其中積層體係由，以共擠壓形 成熱黏接層及基材層之二軸拉伸聚酯薄膜，與隔著熱黏 接層黏接於該二軸拉伸聚酯薄膜表面之金屬箔所構成， 將該積層體進行蝕刻處理並製造可撓性印刷線路板，其 特徵爲二軸拉伸聚酯薄膜之基材層具有200〜300°C之熔 點，熱黏接層係由含有蠟之聚酯樹脂所組成。 2 .如申請專利範圍第1項之可撓性印刷線路板，其中二軸 0 拉伸聚酯薄膜之基材層係其內部含有白色顔料及/或微細 空洞之白色聚酯薄膜。 3 ·如申請專利範圍第1或2項之可撓性印刷線路板，其中 . 熱黏接層係由非晶性聚酯樹脂A，與和此樹脂A非相溶 . 的熱塑性樹脂B及蠟之混合物所組成。 4.如申請專利範圍第1〜3項中任一項之可撓性印刷線路 板，其中熱黏接層具有以下（1)〜（4)之所有特徵： (1)非晶性聚酯樹脂A之玻璃轉移溫度爲5 0〜9 5 °C ; 0 (2)熱塑性樹脂B係熔點50〜180°C之結晶性樹脂，或玻 璃轉移溫度-50〜150 °C之非晶性樹脂、該等之混合 物； • (3)熱黏接層中含有熱塑性樹脂B爲1〜30質量％; (4)熱黏接層之厚度爲5〜30 β m。 5 .如申請專利範圍第1〜4項中任一項之可撓性印刷線路 板，其中在以共擠壓所形成之熱黏接層表面上藉由塗布 而形成所形成之塗布層，且由黏接於該塗布層面之金屬 箔所組成。 -76- 200932523 印 性 撓 可 種第出 一 圍露 5 中 項 層 接 黏 熱 之 範所積 利理並 專處膜 請刻薄 申蝕之 如之成 以板所 著路脂 隔線樹 爲刷他 徵印其 特性由 其撓 ， 可 板之 路項 線一 刷任 接 黏 而 進 層 第 圍 3範 R利R 種專種 一 請 一 路 S ιρτ 澧 積 置 路第 線圍 刷範 印利 性專 配撓請 爲可申 徵之如 特項用 其一 ’ 任 片中 嵌項 鑲 用 體 媒 D 體 媒 D 6 使 爲 徵 特 其 串 之 如。項 於板 7 鑲嵌片所構成。 9. 一種可撓性印刷線路板之製造方法，其係具有將捲繞成 輥狀之網狀薄膜與金屬箔開捲（unwind)，同時連續地進行 熱積層之步驟，其特徵爲網狀薄膜係使用二軸拉伸聚酯 薄膜，該二軸拉伸聚酯薄膜係將由含有以共擠壓所形成 蠟之聚酯樹脂所組成熱黏接層形成於具有200〜280°C熔 點之聚酯基材層。 10. —種RFID媒體之製造方法，其具有：將捲繞成輥狀之 複數網狀薄膜與可撓性印刷線路板或鑲嵌片開捲，同時 連續地進行熱積層之步驟，其特徵爲使用如申請專利範 圍第1〜7項中任一項之可撓性印刷線路板或鑲嵌片。 11. 如申請專利範圍第10項之RFID媒體之製造方法，其係 使天線電路配置於如申請專利範‘圍第1〜7中任一項之可 撓性印刷線路板或鑲嵌片之二軸拉伸聚酯薄膜熱黏接層 面。 -77-200932523 X. Patent application scope: 1. A flexible printed circuit board in which a laminated system consists of a biaxially stretched polyester film formed by co-extrusion to form a thermal bonding layer and a substrate layer, and is thermally bonded The bonding layer is bonded to the metal foil on the surface of the biaxially stretched polyester film, and the laminated body is etched to produce a flexible printed wiring board, which is characterized by a base layer of a biaxially stretched polyester film. It has a melting point of 200 to 300 ° C, and the thermal bonding layer is composed of a polyester resin containing wax. 2. The flexible printed wiring board of claim 1, wherein the base layer of the biaxially oriented polyester film is a white polyester film containing white pigment and/or fine voids therein. 3. The flexible printed wiring board according to claim 1 or 2, wherein the thermal bonding layer is made of amorphous polyester resin A, and is incompatible with the resin A. The mixture consists of a mixture. 4. The flexible printed wiring board according to any one of claims 1 to 3, wherein the thermal bonding layer has all of the following features (1) to (4): (1) amorphous polyester resin The glass transition temperature of A is 50 to 9 5 ° C; 0 (2) the thermoplastic resin B is a crystalline resin having a melting point of 50 to 180 ° C, or an amorphous resin having a glass transition temperature of -50 to 150 ° C, (3) The thermoplastic adhesive layer B contains 1 to 30% by mass of the thermoplastic resin B; (4) The thickness of the thermal adhesive layer is 5 to 30 β m. 5. The flexible printed wiring board according to any one of claims 1 to 4, wherein the formed coating layer is formed by coating on a surface of the thermal bonding layer formed by co-extrusion, and It consists of a metal foil bonded to the coating layer. -76- 200932523 Ink-scratch can be used for the first time. The middle layer of the viscous heat is the result of the smear of the smear and the smear of the smear. He sifted its characteristics by its scratching, and the board road line was brushed and glued into the layer. The third round of the standard R R R kinds of special species one please all the way S ιρτ 澧 置 第 第 第 围 围 范 范Specially designed to be used as a special item, such as the special item, the inlaid item is embedded in the body medium D media D 6 to make it special. The item consists of a panel 7 inlay. A method of producing a flexible printed wiring board, comprising the steps of unwinding a web-like film wound into a roll shape and unwinding a metal foil while continuously performing heat lamination, which is characterized by a web film A biaxially stretched polyester film is used, which is formed of a heat-bonding layer composed of a polyester resin containing a wax formed by co-extrusion at a polyester having a melting point of 200 to 280 ° C. Substrate layer. 10. A method of manufacturing an RFID medium, comprising: a step of unwinding a plurality of mesh films wound in a roll shape and a flexible printed wiring board or an inlay, and continuously performing heat lamination, wherein the use is A flexible printed wiring board or inlay sheet according to any one of claims 1 to 7. 11. The method of manufacturing the RFID medium according to claim 10, wherein the antenna circuit is disposed on the two axes of the flexible printed wiring board or the embedded sheet according to any one of the first to seventh aspects of the patent application. Stretch polyester film heat bonding layer. -77-
TW97141119A 2007-10-26 2008-10-24 Flexible printed circuit board, inlet sheet using the same, RFID medium and method producing the same TW200932523A (en)

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JP2007278470A JP2009110987A (en) 2007-10-26 2007-10-26 Flexible printed circuit board, inlet sheet using the same, and rfid medium
JP2007278471A JP5157366B2 (en) 2007-10-26 2007-10-26 RFID media manufacturing method

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KR101022697B1 (en) * 2010-09-06 2011-03-22 (주)유엘티 Aluminum foil etching process for circuit formation in RFID tag antenna manufacturing
CN103538341B (en) * 2012-07-17 2015-11-25 昆山雅森电子材料科技有限公司 Heat rolls press equipment
CN105365304A (en) * 2015-12-18 2016-03-02 无锡科睿坦电子科技有限公司 RFID tag antenna based on non-transparent PET film and manufacturing technology thereof
CN108712818B (en) * 2018-05-11 2020-12-18 泗阳富朋特电子科技有限公司 Down-pressing wrinkled flexible PCB electronic device preparation machine
CN114195399A (en) * 2020-09-18 2022-03-18 徐强 Chemical thinning process for producing flexible glass coiled material by continuous method

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JP2002155158A (en) * 2000-11-21 2002-05-28 Teijin Ltd Easily bondable laminated film for optical use
JP2002270975A (en) * 2001-03-07 2002-09-20 Toyo Kohan Co Ltd Board for ic card, method for manufacturing board for ic card, board with coil for ic card using them, and ic card using them
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