TW200931556A - Probe apparatus and probing method - Google Patents

Abstract

A probe apparatus includes an imaging unit imaging probes and a first and a second imaging unit imaging the wafer surface. The apparatus further includes a control unit obtaining positions of a mounting table at which focuses of the imaging unit and the first imaging unit are made to coincide with each other and then the focuses of the image unit and the second imaging unit are made to coincide with each other by moving the mounting table; obtaining positions of the mounting table at which the images of the wafer are sequentially taken by the first and the second imaging unit by moving the mounting table; obtaining a position of the mounting table at which the probes are imaged by the imaging unit, and calculating a position of the mounting table at which the wafer contacts with the probes based on the obtained positions of the mounting table.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for electrically contacting a probe to an electrode pad of a test object and measuring electrical characteristics of the test object. [Prior Art] • In order to investigate the electrical characteristics of the 1C wafer on a semiconductor wafer (hereinafter referred to as a wafer), in order to investigate the electrical characteristics of the 1C wafer, the detection test is performed by the detecting device in the state of the wafer. The detecting device is configured to mount a wafer on a wafer holder (wafer mounting table) that is freely movable in the X, Y'z direction and freely rotatable on the Z axis, and is provided with a probe card disposed above the wafer holder The position of the wafer holder is controlled by means of a probe such as a probe and an electrode pad of the 1C wafer of the wafer. In order to properly contact the electrode pads and detectors of the 1C wafer on the wafer, an operation called precision calibration is performed in advance, and according to the result, positive φ is determined to determine the crystal of the electrode pad of the 1C wafer and the detector. The position of the circular fixture, for example, the coordinate position of the drive system managed by the pulse code associated with the drive motor that drives the wafer holder. Further, for the coordinate position of the drive system, even if it is, for example, an X table moving in the X direction, a γ table moving in the γ direction, and a ζ table moving in the Ζ direction, a linear scale is provided, The number of pulses of the optical information forming the slit, and the coordinates of the specific directions in the respective linear scales may also be used. In order to perform the precision calibration, a camera for viewing a wafer with a downward viewing angle is disposed on a moving body that moves horizontally between the wafer holder and the probe card, and a photo probe is also disposed on the wafer holder side. The configuration of the camera is advantageous (Patent Document 1). This is because by calibrating the focus of the cameras, and the photographic wafer surface and detectors can achieve the same results as with one camera. Then, in order to create a wafer map on the wafer, the wafer is photographed by the camera for wafer photography. For example, four points are obtained, and the center position of the wafer (the coordinate position of the driving system of the wafer holder) is obtained. The operation of determining the orientation of the wafer is performed on a specific portion of the photographic wafer, for example, a corner portion of two 1C wafers separated from each other. Then, after aligning the orientation of the wafer, and photographing a plurality of specific points on the wafer, according to the result of the photographing, the position of the wafer holder of the 1C wafer and the position of the wafer holder when the detector is in contact (the so-called contact position) is obtained with high precision. ). By performing such a precise calibration, the moving body is stationary at a predetermined position, the wafer jig is moved, and each point on the wafer is sequentially photographed by a camera for wafer photography, but the wafer jig is moved due to a large number of photographing points. The total time required for 变 becomes longer. Furthermore, since the moving range of the wafer jig is wide, the detecting device itself must be designed to correspond to the moving range. Therefore, the device is enlarged. In particular, the wafer size is becoming larger and larger, and it is conceivable that the wafer size will exceed 12 今后 in the future. Therefore, when the number of detector devices is increased, a wide area is required, and when the area of the clean room is limited, It is not possible to increase the number of sets of detection devices. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2001-156127 [Draft of the Invention] -6-200931556 (Problems to be Solved by the Invention) The present invention has been made in view of such circumstances, and an object thereof is to provide a device It is miniaturized and has a high productivity detection device. (Means for Solving the Problem) * The detecting device of the present invention is a wafer mounting table in which a plurality of wafers to be inspected are arranged and placed in a horizontal direction and a vertical direction by a driving portion of the mounting table. And the electrode pad of the inspected wafer is in contact with the detector of the probe card, and the inspection of the inspected wafer is performed, and the photographing means for photographing the detector with the viewing angle of the detector for detecting the detector is used. Is disposed on the wafer mounting table; and the moving body is disposed at a height position between the wafer mounting table and the probe card to be movable in a horizontal direction: and a wafer with a downward viewing angle for photographing the surface of the wafer The first photo-shadowing means and the second photographing means are disposed on the moving body, and the optical axes thereof are spaced apart from each other; and the control means for performing the step group includes: moving the wafer Set the stage, the focus of the photographic means for detector photography, the focus of the first photographic means for wafer photography, and the focus of the second photographic means. a step of positioning the wafer mounting table, and moving the wafer mounting table to sequentially scan the wafer on the wafer mounting table according to the first imaging means and the second imaging means for wafer imaging, and obtain the photography in 200931556 The step of the position of the wafer stage, and the photographing means for the photographing of the detector, the step of taking the position of the wafer stage at the time of photographing, and the position of the wafer stage obtained in each step The step of calculating the position of the wafer stage for contacting the wafer with the detector. Further, there is provided a wafer photographing provided in the moving body 'each of which has an optical axis spaced apart from each other for photographing the wafer surface, and the magnification is lower than the φ 1 photographic means and the second photographic means The first low magnification camera and the second low magnification camera used. Then, the group of the optical axes of the first imaging means and the camera for the first low magnification, and the group of the optical axes of the second imaging means and the camera of the second low magnification are formed to be bilaterally symmetrical. The step group includes the first low-magnification camera and the second low-magnification camera for wafer photography, and sequentially photographs two points on the edge of the wafer on the wafer mounting table, and then the wafer mounting table is orthogonal to each other. (1) The optical axes of the low-magnification camera and the second low-magnification camera move linearly, and the first low-magnification camera and the second low-magnification camera sequentially scan the wafer. • Two points on the opposite side of the two points The step of determining the center position of the wafer based on the positions of the crystal-circle mounting stages at the four-point shooting. Then, in the detecting device of the present invention, the first imaging means for wafer photography and the second imaging means 'replace the i-th low-magnification camera and the second low-magnification camera for wafer imaging' to perform the imaging wafer loading Two points on the periphery of the wafer on the stage and two points on the periphery of the opposite side of the photograph. Furthermore, the above-mentioned step group includes the first imaging means and the second imaging means for wafer photography, and the two images are spaced apart from each other on the wafer. - ??? The position of the circular stage is such that the wafer stage is rotated into a wafer in a previously set direction. Further, the first imaging means and the second imaging means for wafer photography are provided such that the moving bodies are connected to each other by a driving unit for the imaging means. Then, the control unit is configured such that the distance between the optical axes of the first imaging means and the second imaging means is a distance between two specific points on the wafer* based on the information corresponding to the type of the wafer. A control signal for controlling the driving unit for the photographing means φ is output. In the detection method of the present invention, a wafer in which a plurality of wafers to be inspected are arranged is placed on a wafer mounting table that can be moved in the horizontal direction and the vertical direction by a driving portion of the mounting table, and the electrode pads of the wafer to be inspected are placed. Contacting the probe of the probe card to perform inspection of the wafer to be inspected, characterized in that: a photographing means for photographing the detector with the viewing angle of the detector for photographing upward is used, which is disposed on the wafer mounting table; The first photographing means and the second photographing means for photographing the wafer surface with the viewing angle facing downward, which are disposed at a height position between the wafer mounting table and the probe card, In the moving body moving in the horizontal direction, each of the optical axes is spaced apart from each other, and the focus of the photographing means for photographing the detectors and the focus of the first photographing means for wafer photographing are sequentially performed by moving the wafer mounting table. The position of the focus of the second photographic means, the acquisition of the position of the wafer stage at each time point; and the movement of the wafer stage by the wafer photography 1 -9 - 200931556 The means of photography and the second means of photography 'sequentially photographing the wafers on the wafer, obtaining the position of the wafer stage at the time of photography, and the photographic detectors for the photographic means for detector photography. The step of obtaining the position of the wafer stage at the time of photographing, and the calculation of the position of the wafer stage for bringing the wafer and the probe into contact based on the position of the wafer stage obtained at each step. Further, the detection method of the present invention is a process of sequentially scanning a wafer on a wafer mounting table by the φ 1 imaging means and the second imaging means for wafer imaging, including the first use of wafer photography. The photographing means and the second photographing means sequentially photographing two points on the edge of the wafer on the wafer mounting stage, and then, the wafer mounting stage is orthogonal to a line connecting the optical axes of the first imaging means and the second imaging means to each other. Moving, and sequentially scanning the two points on the opposite side of the two sides of the wafer by the first photographing means and the second photographing means, and determining the center of the wafer based on the positions of the wafer mounts during the four-point photographing The steps of the location. Φ Furthermore, the first imaging means for the wafer photography and the second imaging means are used to capture two specific points spaced apart from each other on the wafer, according to the wafer mounting stage at each shooting. The position is such that the wafer stage is rotated into a wafer to be in a previously set direction. According to the information corresponding to the type of the wafer, the distance between the first imaging means for the wafer photography and the optical axis of the second imaging means is such that the distance between the two specific points on the wafer is different from each other. The project of adjusting the position of the first photographing means and the second photographing means by the driving unit for the photographing means. The Kee Media Co., Ltd. of the present invention stores a computer program -10-200931556 for use in a detecting device, which is mounted on a wafer on which a plurality of wafers to be inspected are placed, and is placed on a driving portion of the mounting table. a wafer mounting table that moves in the horizontal direction and the vertical direction, and the electrode pad of the inspected wafer is in contact with the detector of the probe card, and performs inspection of the inspected wafer, wherein the computer program is configured to implement the above-mentioned detection methods. The way to form a group of steps. φ [Effect of the Invention] The present invention is characterized in that the moving bodies which are horizontally movable at a height position between the wafer mounting table and the probe card are provided with respective optical axes spaced apart from each other for viewing the surface of the wafer downward. Since the first imaging section and the second imaging means 2 for wafer imaging are used, in order to obtain the positional information of the wafer, the amount of movement of the wafer mounting table may be small when the wafer is photographed. Therefore, since it is possible to reduce the size of the device, it is also possible to shorten the time required to acquire the position information of the wafer, which contributes to high productivity. Further, when the first imaging means and the second imaging hand segment for wafer imaging are separately and arbitrarily connected, the separation distance can be adjusted to the mutual distance between two specific points on the wafer. Therefore, when the wafer stage is moved to a specific point of photographing, the wafer stage can be made to stand still, and another specific point of photographing can be directly performed, which contributes to higher productivity. [Embodiment] The probe device according to the first embodiment of the present invention is provided with a transfer of a crystal 11 - 200931556 circle w which is a substrate on which a plurality of wafers to be inspected are arranged, as shown in Figs. 1 to 3 . The loading unit 1 and the detecting device body 2 that perform detection on the wafer w. First, the overall design and arrangement of the loading unit 1 and the probe unit 2 will be briefly described. The loading unit 1 includes the first loading cassette 11 and the second loading cassette 12 that carry the first carrier C1 and the second carrier C2 that are transporting the wafer W that accommodates a plurality of wafers, and are disposed in the loading cassette 11 Between 12 and 12 • Carrying room 1〇. In the first loading cassette 11 and the second loading cassette 12, the first mounting stage 13 and the second mounting stage 14' are disposed so as to be spaced apart from each other in the Y direction. The first carrier C1 and the second carrier C2 are disposed. The carriers C1 and C2 are placed on the interface (front opening) in such a manner as to face each other. Further, in the transfer chamber 10, a wafer transfer mechanism (substrate transfer mechanism) 3 for transporting the wafer W by the mechanical arm 30 belonging to the substrate holding member is provided. The probe device main body 2 includes a mounting portion 1 and a housing 22 that is disposed adjacent to the loading portion 1 so as to be aligned in the X direction, and constitutes a housing portion of the probe device main body 〇 2 . The casing 22 is divided into two in the Y direction by the partition wall 20, and one divided portion and the other divided portion correspond to each other. The first inspection portion 21A and the second inspection portion 21B are formed separately. First

The inspection unit 21A includes a wafer holder 4A belonging to the substrate stage, and an alignment bridge 5A constituting a moving body including a camera unit, and the movement system moves in the Y direction above the wafer holder 4A ( The direction in which the loading portions 11 and 12 are connected, and the probe card 6A provided on the top plate 201 constituting the ceiling portion of the casing 22 are provided. The second inspection unit 21B has the same configuration, and includes the wafer holder 4B, the alignment bridges 5B-12-200931556, and the probe card 6B. Next, the loading unit 1 will be described in detail. Since the second load 埠n and the second load 埠12 are symmetrical to each other and have the same configuration, the structure of the first load cassette 11 is represented by a fourth diagram. The loading unit i is divided from the transfer chamber 1 by the partition wall 20a as shown in Figs. 3 and 4, and is provided with a shutter S and an integral switch and the partition wall 20a'. A switching mechanism 20b that interfaces the shutter S and the first carrier C1. Further, the first mounting table 13 is configured to be clockwise and counterclockwise rotated by 90 degrees by a non-drawing rotating mechanism ‘ provided on the lower side of the first mounting table 13. In other words, the first mounting table 13 is configured such that, for example, the sealed type carrier C1 called the FOUP from the front side (the right side in the X direction in the drawing) of the detecting device, the front opening portion faces the detecting device side ( When the automatic transfer vehicle (AGV) in the interior of the X-ray is placed on the first mounting table 13, the first mounting table 13 is rotated 90 degrees clockwise to open the opening portion. When the shutter S is relatively "when the first carrier C1 is carried out from the first stage 13", the first carrier C1 is rotated by 90 degrees in the clockwise direction. The transfer of the wafer w between the first carrier C1 and the wafer transfer mechanism 3 is performed by the opening of the first carrier c 1 facing the shutter S side, and is integrally opened in accordance with the switch mechanism 20b described above. The interface s between the shutter s and the first carrier ci communicates with the inside of the first carrier ci, and the wafer transport mechanism 3 advances and retracts the first carrier C1. The wafer conveyance mechanism 3 has a conveyance base 35, a rotation shaft 3a that rotates the conveyance bases 35 -13 - 200931556 about a vertical axis, and an unillustrated lifting mechanism that raises and lowers the rotation shaft 3a, and the conveyance base 35 Three robot arms 30 are provided in advance and retreat, and each of the robot arms 30 advances and retracts independently of each other, and has the function of performing wafer W transport. The center of rotation of the rotating shaft 3a is provided between the first carrier C1 and the second carrier C2, that is, at a distance from the first carrier C1 and the second carrier C2. Further, the wafer transfer mechanism 3 can transfer the upper side of the wafer W between the first carrier C1 or the second carrier C2, and the first inspection portion 21A or the second inspection portion 21B. It is used to transfer between the positions below the wafer W. Further, the wafer transfer mechanism 3 is provided with a pre-calibration mechanism 39 for performing pre-calibration of the wafer W. The pre-alignment mechanism 39 includes a shaft portion 36a that is slidable and slidable in the through-transporting base 35, and a recess that is provided on the top of the shaft portion and that is normally fitted to the surface of the transport base 35, and is identical to the surface. The surface of the table is rotated by the clamp portion 36. The clamp portion 36 is set at a center position corresponding to the crystal φ circle W on the robot arm 30 in the retracted state on the way, and constitutes a wafer on the robot arm 30 from which only a few segments of the robot arm 30 are lifted. W rotates. Further, the pre-alignment mechanism 39 is provided with photo sensors 37 and 38 for detecting a detecting portion including a light-emitting sensor and a light-receiving sensor on the periphery of the wafer W which is rotated by the chuck portion 36. The photo sensors 3 7 and 38 are fixed by the transfer base 35 at a position laterally offset from the moving region of the robot arm 30. In this example, the wafer W to be pre-calibrated is regarded as the lower stage. The wafer W on the robot arm 33 and the wafer W on the middle arm 32 are placed above the periphery of each wafer W lifted by the clamp portion 36, and accessed at the crystal-14-200931556 circle w In the case where the height of the wafer W is not disturbed, although there is no pattern, the detection unit 1 is provided with the detection signals of the root detectors 3 7 and 38, and the crystal orientation plane of the wafer W is detected. As a result of detecting the center position of the direction reference portion and the wafer W, the clamp portion 36 is rotated into a notch or the like toward the special device. The wafer W on the arm (3) of the orientation (pre-calibration) of the wafer W is adjusted by the photodetector 3 7 and 38 and the chuck portion 36 calibration mechanism 39 as an example, and will be briefly described below. The head portion 36 rotates only the wafer W on the lower arm 33 by a slight circle W, and the light from the light-emitting portion of the photodetector 38 is irradiated to the light-receiving portion via the region including the peripheral portion (end portion). The orientation of the circle W is in a specific orientation on the lower arm 33. The clamp portion 36 is stopped, the clamp portion 36 is lowered, and the wafer W is transferred to the wafer 3 to adjust the orientation of the wafer W. Thereafter, the wafer holder 4A of the first inspection unit 21A mounts the eccentricity of the positive wafer W of the wafer W, and adjusts the wafer transfer mechanism to perform the orientation and eccentricity of the wafer. And ': the pattern of the photo sensors 37, 38 is omitted. Next, in the casing 22 of the apparatus main body 2, the first inspection unit 21A and the second inspection unit 21B on the side of the loading unit 1 are disposed to extend in the lateral direction (γ direction). In the case of the belt, the first inspection unit 21A and the second inspection unit 21B are leveled. And according to the notch or the position of the light-sensing circle, according to the control of the direction, the lower part of the machine is pre-existed, and the wafer is lifted by the clamp to make the wafer W, and then the lower part is made by crystal The robot arm, when in the case of, for example, repairs the position of 3. In Figure 3, . In the detection wall, in order to open the port 22a in the wafer W. And through the rotation center of the wafer transfer -15-200931556, the intersection position of each wafer W, the surface of the wafer W for the horizontal line HL orthogonal to the line connecting the first loading port 11 and the second loading port 12 The photographing position and the installation position of the probe card 6A are bilaterally symmetrical and have the same configuration. Therefore, in order to avoid redundant description, the first inspection unit 21A will be described with reference to FIGS. 3, 6 and 7.

• The inspection unit 21A is provided with a base 23 on which the Y stage 24 that is driven in the Y direction, such as a ball screw, is extended along the guide rail extending in the Y direction, and extends along the base 23 The guide rail in the X direction is driven by the X table 25 in the X direction by, for example, a ball screw. A motor in which the encoder is combined is provided in each of the X table 25 and the Y table 24, but is omitted here. The X table 25 is provided with a motor having a combination of encoders and is driven by a Z moving portion 26 in the Z direction, and the Z moving portion 26 is provided to be rotatable about the Z axis (at 0). The direction moves freely.) The wafer holder 4A of the substrate stage. Therefore, the wafer holder 4A can be moved in the X, Y, Z, and 0 directions. The X platform 25, the X platform 24, and the Z moving unit 26 constitute a driving portion that constitutes a transfer position for performing transfer of the wafer W with the wafer transfer mechanism 3, and a surface of the wafer W as will be described later. The wafer holder 4A is driven between the photographing position and the contact position (inspection position) of the probe 29 contacting the probe card 6A. A probe card 6A is detachably attached to the top plate 201 above the moving area of the wafer holder 4A. Forming an electrode group on the upper side of the probe card 6A, in order to obtain an electrical guide between the electrode group and the test head without a pattern, the test electrode 6A is placed above the probe card 6A to correspond to the electrode of the probe card 6A. The pogo pin unit 28 in which the plurality of electrode portions 28a are formed below is provided in such a manner that the group is disposed. Above the pogo pin unit 28, a test head without a pattern is usually placed, but in this example, the test head is disposed at a different position from the probe body 2, and the pogo pin unit 28 and the test head are not shown. Cable connection. Further, on the lower side of the probe card 6A, corresponding to the arrangement of the electrode pads of the wafer W, for example, the detector card 6A is provided with a detector electrically connected to the electrode group on the upper side, for example, A vertical needle (wire probe) with a vertical extension of the surface of the wafer W. The probe may be a probe 29 composed of a metal wire extending obliquely to the surface of the wafer W, or a metal bump electrode formed of a flexible film. In this example, the probe card 6A constitutes all of the electrode pads of the wafer to be inspected (1C wafer) which can be in contact with the surface of the wafer W at one time, so that the measurement of the electrical characteristics is completed by one contact. 〇In the side position of the partition wall • 20 side of the wafer holder 4A in the z moving unit 26 described above, the photography for the probe photography is fixed via the fixing plate 4 1 a. The micro-camera with the viewing angle of the means upwards 41. The micro camera 41 is configured to magnify the needle of the probe 29 or the calibration mark of the probe card 6A to be photographed as a high magnification camera including a CCD camera. The micro-camera 41 is located at a midpoint of the X-direction in the wafer holder 4A. Further, in order to investigate the orientation and position of the arrangement of the probes 29 during the calibration, the micro-camera 41 photographs the specific probe 29 such as the probe 29 at both ends in the X direction and the probe 29 at both ends in the Y direction, and further Periodically observe the status of each probe-17-200931556 29, and hold all the probes 29 as a sequential photograph. Further, on the fixed plate 4a, a micro camera 42 connected to the micro camera 41 for photographing the low magnification camera of the probe 29 in a wide area is fixed. Further, a target 44 is provided on the fixed plate 41a so that the advancing and retracting mechanism 43 can advance and retreat in a direction intersecting the optical axis with respect to the focal plane of the micro camera 41. The target 44 is configured to be image-recognizable by the micro-camera 41 and the micro-cameras 71 and 72 to be described later. For example, a transparent metal plate is used to vapor-deposit a circular metal film of the object for positioning, for example, a metal film having a diameter of 140 μm. Fig. 7 (a) and (b) are plan views and side views showing the positional relationship between the wafer holder 4A, the micro camera 41, and the micro camera 42 in a schematic manner. Further, in Fig. 7, the drawings of the target 44 or the advancing and retracting mechanism 43 described above are omitted. On both sides (front side and rear side) in the X direction of the inner wall surface of the casing 22 in the region between the wafer jig 4A and the probe card 6A, guide rails 47 are provided along the Y direction. Along the guide rail 47, as shown in Fig. 8, an alignment bridge 5A capable of moving in the Y direction is provided between a standard position and an imaging position which will be described later. In the following description, the X direction (refer to FIG. 2) is referred to as a left-right direction for convenience of explanation. As shown in FIG. 9, the alignment bridge strip 5A' is provided with the first micro camera 71 and the second micro camera 72 symmetrically with respect to the center line 70 which is equally divided between the left and right sides of the bridge strip 5A, and is opposite to the above-mentioned line 70. The first macro camera 81 and the second macro camera 82 are symmetrically disposed. Each of the first micro camera 71 and the second micro camera 72 corresponds to the first imaging means and the second imaging means. Each of the first macro cameras 81 -18 to 200931556 and the second macro camera 82 corresponds to a first low magnification camera and a second low magnification camera. The viewing angle of any of these cameras is downward. Here, the micro camera Micro Camera (or Macro Camera) is constituted by an optical system including a camera body 71a (72a) and a mirror 71b (72b) as shown in Fig. 16 which will be described later, but in the present invention Technology • Sex is important because it is located below the self-aligning bridge 5A and extends to the optical axis below ©. Therefore, the term "micro camera" (or macro camera) is used in the case of convenience. In the case of aligning the window portion of the photographing under the bridge strip 5A, and referring to the case of the optical system including the camera body and the mirror. In Fig. 9, a small circular portion called a micro camera (or a macro camera) indicates a window portion for photography, and the same will be described later. Then, a micro camera 71, 72 (or a Macro Camera 81, 82) is provided, and two micro cameras are provided, and each of the photographic images is processed by a control unit to be described later. When the micro cameras 71 and 72 are shown in Fig. 2, they are positioned at a larger distance. The cameras 81 and 82 are close to the horizontal line HL side of the boundary between the first inspection unit 21A and the second inspection unit 21B. Further, when the wafer size (wafer diameter) is 300 mm, the distance between the micro camera Ή, 72 and the center line 70 is, for example, 73 mm, and the distance between the macro cameras 81, 82 and the center line 70 is, for example, 45 mm. Further, when the camera indicates the distance from other parts, the optical axis of the camera is set as the measurement point. For example, the distance 1 between the micro cameras 7 1 and 72 and the center line 70 means the distance 1 between the optical axes -19-200931556 of the micro cameras 7 1 and 72 and the center line 70. Further, the 'micro cameras 71 and 72 are configured to enlarge the surface of the wafer W to form a camera having a high magnification of the CCD camera, and the macro cameras 81 and 82 are configured to capture the wafer W at a wide viewing angle. Magnification camera. The standard position of the stop position of the alignment bridge strip 5A is when the wafer W is transferred between the wafer/clamp 4A and the wafer transport mechanism 3, and when the wafer circle W is in contact with the probe card 6A and by the first When the photographing means (micro camera 41) performs the photographing of the probe 29, it is retracted until the alignment bridge strip 5A does not interfere with the position of the wafer holder 4A or the wafer transport mechanism 3. Further, the photographing position is a position at which the surface of the wafer W is photographed by the micro cameras 71 and 72 and the macro cameras 81 and 82 of the bridge strip 5A. The surface of the wafer W is imaged by the micro cameras 71 and 72 and the macro cameras 81 and 82, and the wafer holder 4A is moved by the fixed alignment of the bridge strip 5A at the photographing position. ❹ Then, the photographing position is also shifted from the center position of the probe card 6A to the side after the Y-axis direction (the detection device. The center side of the body 2) as shown in the lower side of Fig. 10. The reason is as follows. As previously stated

In general, the micro camera 41 is disposed on the side of the wafer holder 4A (the front side in the Y-axis direction), and the micro-camera 41, when photographing the probe 29, is also shown in the middle of the wafer. The movement stroke D2 in the Y-axis direction of 4A (the movement range of the center position 〇1 of the wafer holder 4A) is shifted from the center position 02 of the probe card 6A to the surface side after the Y-axis direction. Further, as shown in the upper part of Fig. 10, the moving stroke D1 of the wafer holder 4A at the time of contact (when the wafer W -20-200931556 is in contact with the probe 29), for example, the wafer W and the probe 29 are used. The second contact with the probe card 6A makes it possible to form a plurality of probes 29, so that it becomes a very short distance. Therefore, when the center position 02 of the photographing position alignment detecting card 6A of the bridge strip 5A is aligned, the movement stroke D3 of the wafer holder 4A at the time of photographing the surface of the wafer W is jumped out to the above-mentioned movement-stroke by the micro cameras 71, 72. The right side of D 1 . Here, the photographing position of the alignment bridge strip 5A is shifted to the front side in the Y-axis direction, and the movement strokes D2 and D3 are overlapped to include the movable stroke of the region of the movement strokes D1 to D3 of the wafer holder 4A (movable Scope) The manner in which D4 is shortened is to shorten the length of the probe device body 2 in the Y-axis direction. Further, even if the movement strokes D2 and D3 are not in the same range, the photographing position of the alignment bridge strip 5A may be shifted from the center position 02 of the probe card 6A to the back side of the Y-axis direction. Further, as shown in Fig. 2, the detecting device is provided with, for example, a control unit 15 composed of a computer, and the control unit 15 includes a data processing unit including a program, a memory, and a CPU. The program is carried in the carrier C. After loading the cassette 11 (12), the wafer W is inspected, and thereafter,

Each of a series of operations until the wafer W returns to the carrier C and the carrier C is carried out is controlled to constitute a step group. The program (including the input operation of the processing parameters or the program related to the display) is, for example, stored in a memory medium 16 such as a floppy disk, a CD, an MO (optical magnetic disk), a hard disk, or the like, and is installed in the control unit 15 > An example of the configuration of the control unit 15 shown in Fig. 2 is shown in Figs. 11-21-200931556. 151 is a program for executing a series of operations of the detecting device, 153 is a processing program storage unit for storing an inspection processing program executed by the inspection unit 21A (21B), and 154 is a setting of a parameter or an operation mode of the detecting device, or performs related operations. The operation unit 155 of each operation is a bus bar. The operation unit 154 is constituted by a screen such as a touch panel. Next, the action of the above-described detecting device will be described below. First, the carrier C is carried into the loading cassette 11 from the side opposite to the detecting unit body 2 of the loading cassette 11 (12) by the automatic transport vehicle (AGV) in the clean room. At this time, the interface of the carrier C faces the probe main body 2, but the mount 13 (I4) rotates to face the shutter S. After that, the stage 13 advances, and the carrier C is pushed to the side of the shutter S, and the cover of the downloaded body C and the shutter S are taken. Next, the wafer W is taken out from the carrier C and transported to the inspection unit 2 1 A ( 2 1 B ). However, for the subsequent operation, the two wafers W1 and W2 are each subjected to the first inspection unit 21A and The second inspection unit 21B checks, ❹, in this state, the wafer W3 and the wafer W4, which will be described later, are taken out from the carrier C. • A description will be given of how to perform a series of processes. First, as shown in Fig. 12, the middle arm 32 enters the second carrier C2, receives the wafer W3, and retreats to the pre-calibrated position. Then, the gripper portion 36 is raised to raise the wafer W3, and is rotated, and the orientation of the wafer W is adjusted based on the detection result of the photodetector 37, so that the first and second inspection portions 21A and 21B are moved in. The notch orientation of the inspection portion 21A (21B) of the wafer W3 is detected even for the eccentricity, and pre-calibration is performed. Then, the lower arm 36 enters the second -22-200931556 carrier C2, as shown in Fig. 13, 'takes the wafer W4' to perform the orientation adjustment of the wafer W4 and the eccentricity detection'. The notch orientation of the inspection portion 21 (21B) of the wafer W4 is carried. Then, in order to perform the exchange of the wafers W3, W4 and the wafers W1, W2, the wafer transport mechanism 3 is lowered. Next, the exchange of the wafer W1 in the first inspection unit 21A and the wafer W3 on the wafer conveyance mechanism 3 is performed. When the inspection of the wafer W1 is completed, the wafer holder 4A is moved to a position close to the partition wall 20 as in Fig. 14. Then, the suction jig of the wafer holder 4A is released, and the lift pins in the wafer holder 4A are raised to raise the wafer W1. Next, the empty upper arm 31 enters the wafer holder 4A, and the wafer W1 is taken up by the lift pin down, and then retracted. Furthermore, the wafer transport mechanism 3 is slightly raised, and the middle robot arm 32 enters the wafer chuck 4A. When the position of the wafer W3 is deviated from the center position of the wafer W3 by the previous pre-calibration, the eccentricity of the wafer W3 is corrected. The wafer W3 is placed on the wafer holder 4A by the joint operation of the rising pin and the middle machine arm 32 without a pattern. Then, as shown in Fig. 15, the wafer W3 is delivered to the first inspection unit 21A, and the empty intermediate robot 32 enters the second inspection unit 21B, and is received from the wafer holder 4B. After the wafer W2 is inspected, after the retreat, the lower arm 33 is brought into the wafer holder 4B, and the wafer W4 before inspection is transferred from the lower arm 33 to the wafer holder 4B. Thereafter, the wafer transfer mechanism 3 is raised, and the wafer W1 and the wafer W2 are returned to, for example, the first carrier C1, and even if the next wafer W (wafers W5 and W6) is taken out from the carrier C, two pieces are taken out. The same implementation department -23- 200931556. Further, in the first inspection unit 21A, after the wafer W3 is delivered to the wafer holder 4A, the probe 29 of the probe card 6A is imaged by the micro camera 41 provided in the wafer holder 4A. That is, the needle of the probe 29 is placed at the center of the viewing angle of the micro camera 41, for example, at the center of the cross mark, and the position coordinates of the driving system of the wafer holder 4A at this time are obtained. (Coordinates in the X, Y, and Z directions) . Specifically, the probe 29, such as the probe 29 at the farthest end from the X direction, and the probe 29 at the farthest from the x direction, are photographed, and the center of the probe card 6 and the arrangement direction of the probe 29 are grasped. At this time, the area near the target is found by the micro camera 42 provided in the wafer holder 4, and then the position of the probe of the target probe 29 is detected by the micro camera 41. Also, at this time, the alignment bridge strip 5 is retracted to the standard position shown in Fig. 8.

Next, the alignment bridge strip 5 is moved to the photographing position of the wafer W32 (refer to Fig. 8), and as shown in Fig. 16(a), the target 44 ❹ is projected to the micro-camera 41 on the side of the wafer holder 4A. And aligning the area between the bridge strip 5A and the first micro camera 7 1 on the side, aligning the position of the wafer holder 4 A so that the focus and optical axis of the two cameras 41, 71 coincide with the target mark of the target 44, The search origin of the so-called two cameras 41, 71 is performed. Further, as shown in Fig. 16(b), even for the second micro camera 72, the search origin is similarly executed. In the time point when the search origin of the two cameras 41, 71 is executed and the time when the origin of the two cameras 41, 72 is executed, the coordinate position managed by the drive system in the memory wafer holder 4A (the X-direction coordinate position, Y coordinate position, Z direction coordinate position -24-200931556). Next, after the target 44 is retracted, the wafer holder 4A is aligned to the lower side of the bridge strip 5A, and thus the precision calibration is performed. First, the center of the wafer W is obtained using the macro cameras 81, 82. Figure 17 shows the coordinates of each of the four points E1 to E4 on the periphery of the photographic wafer W. These lines represent the line connecting the two points of E1 E3 of the four points and the two points connecting E2 and E4. The intersection of the lines • Looks. At this time, the position of the wafer holder 4A is adjusted so that the circumference 0 of the wafer W is located at the center of each corner of the first macro camera 81 and the second macro camera 82, for example, at the center of the cross mark. Then, after the photographs E2 and E3, the movement is made orthogonal to the line connecting the centers of the respective viewing angles. Since the photographs E1 and E4 are photographed, the intersection of the two straight lines becomes the coordinates of the center C of the wafer. As described above, the micro camera 71 and the second micro camera 72 on the side of the bridge bar 5A and the micro camera 41 of the wafer jig 4A perform the search origin, and the micro camera 71 and the second micro are known in advance. The distance between the optical axes of the camera 72 is φ and the distance between the optical axes of the first micro camera 81 and the second micro camera 82 is known in advance. Therefore, it can be understood that the center C of the wafer is opposite to the wafer. The relative coordinates of the optical axis of the camera 41. Further, the length of the straight line connecting El and E3 (E2, E4) becomes the diameter of the circle W. For example, even if the wafer W is 300 mm, since the diameter of the actual wafer W contains some error for 300 mm, in order to correctly map the wafer on the wafer W (the coordinates of each electrode pad), the center coordinates of the wafer W must be And diameter. Furthermore, since the electrode pads of the wafers in the coordinate system on the wafer (the so-called ideal coordinate system) are registered in place, the side of the edge W is on the side 1 from the respective crystals. - 200931556 Set, the memory is in the relative position from the center coordinates of the wafer W, so the center coordinates of the wafer W must be obtained. In this example, as shown in Figs. 18(a) and (b), the macro cameras 81 and 82 sequentially scan the lower half of the 18th image of the wafer W to obtain E2. The location of E3. Next, by moving the wafer W to the Y direction, as shown in FIGS. 19(a) and (b), the macro cameras 81 and 82 sequentially scan the top half of the wafer 19 of FIG. Around the department, seek the position of El, E4. Next, the arrangement of the 1C wafers on the wafer W (the cut lines formed on the lines of the substrates between the wafers) coincides with the orientation of the wafer W along the X-axis and the Y-axis. Before the wafer w is placed on the wafer holder A4, the orientation is adjusted by performing the calibration. Therefore, at this stage, one of the alignment directions of the 1C wafer of the wafer W is parallel to the Y-axis, even if it has orientation. The deviation 'the angle is also about 1 degree. Fig. 2 is a view showing an example of arrangement of 1C wafers on the wafer W, 400 is a 1C wafer, and 500 is a dicing line.

First, as shown in Fig. 21(a), the angle of the 1C wafer is photographed by one of the macro photography φ machines 81, and the orientation of the wafer W is grasped by the photographing result. Next, the micro-cameras 71 and 72 respectively select the specific points PI and P2 arranged along the X-axis among the four specific points P 1 to P4 determined in advance. The specific points P1 to P4 correspond to the corners of the ic wafer 400. When the specific points PI and P2 are completely parallel to the X-axis, when the position of the χ' γ coordinate of the specific points P1 and P2 calculated according to the design 一致 coincides with the position of the optical axis of the micro cameras 71 and 72, the specific point pi, Ρ2 should be located at the center of each of the micro cameras 71, 72. However, such a situation is extremely rare. Since the orientation of the wafer W is only slightly deviated from a specific direction, that is, -26-200931556, since the X and γ axes of the cutting line 500 of the vertical axis are inclined, the wafer W is moved to the design position. This causes a situation in which the specific points PI, P2 do not exist in the respective angles of view of the micro cameras 71, 72. Here, first, based on the result of the photographing by the macro camera 81, the maximum orientation of the wafer W is calculated, and based on the calculation result, the wafer jig 4A is driven to sequentially point the specific points PI, P2 at the angles of the micro cameras 71, 72. Inside. Then, the specific points P1, Q P2 are sequentially photographed by the micro cameras 71, 72 (the specific points PI, P2 are located at the center of the angle of view). Fig. 21(b) and Fig. 22(a) show the situation. By the result of the photographing, the deviation of the orientation of the wafer W can be calculated. Therefore, according to the calculation result, the wafer holder 4A is rotated only to offset the orientation of the wafer W (Fig. 22(b) ). As a result, the vertical and horizontal cutting lines 500 of the wafer W are parallel to the X and Y axes. Then, in order to confirm that the orientation of the wafer W is correctly corrected, as shown in Figs. 23(a) and 23(b), the specific points P3 and P4 are sequentially photographed by the micro cameras 71 and 72Q. If the orientation of the wafer W is specific

• When azimuth, calculate the wafer holder 4A for contacting the wafer W and the probe 29

. The coordinate position (contact position) of X, Y, and Z. Further, if the orientation of the wafer W does not become a predetermined orientation, the orientation of the wafer W is corrected again, and then the micro-cameras 71 and 72 respectively photograph the specific points Ρ1 and Ρ2 to perform the wafer W orientation. confirm. In this way, from the position of the wafer holder 4 for performing each photographing and the position of the wafer holder 4 when the search origin is executed, on the side of the control unit 15, each electrode pad and the probe card on the wafer W3 can be calculated. 6Α之探 -27- 200931556 The coordinates of the wafer fixture 4A contacted by the needle 29. Then, the wafer holder 4A is moved to the calculated contact coordinate position, and the respective electrode pads on the wafer W3 are brought into contact with the probes 29 of the probe card 6A at a time. Then, the test head from the no-pattern test unit transmits the specific electrical signal to the electrode pads of the respective 1C wafers on the wafer W3 via the pogo pin unit 28 and the probe card 6A, thereby performing the electrical characteristics of the respective 1C wafers. Thereafter, the wafer/clamp 4B is moved to the delivery position in the same manner as the wafer W1 described above, and the wafer W3 is carried out from the wafer holder φ 4B by the wafer transfer mechanism 3. Further, the inspection is performed in the same manner for the wafer W4 that is carried into the second inspection unit 21B. Further, in the present embodiment, when the apparatus is assembled, the center coordinates of rotation (X and Y coordinates on the table) of the wafer holder 4A are obtained by the following method, and are memorized as machine parameters. First, the reference wafer is placed on the chuck, and the reference pattern of at least 3 points of the outer circumference and its position coordinates are memorized. Then, the wafer holder 4A is rotated only at a certain angle portion, the reference pattern is confirmed, and the position coordinates are stored. Then, the coordinates of the wafer holder 4A before and after the rotation of the wafer holder 4A are linearly connected, and when the vertical bisector is drawn, , each line • cross, remembered by the intersection of its intersection as the center of rotation. Then, during calibration, the coordinates of the center of the wafer w and the rotated coordinates of the target position for calibration can be obtained by the following equation. That is, the coordinates (X2, Y2) when the coordinates of the origin of the rotation center (XI, Y1) are only rotated by the angle 0 in the clock direction can be X2 = Xlxcose + Ylxsin0, Y2 = - Xlxsin0 + Ylxcos0. Here, the advantages of providing two micro cameras 71, 72 and two macro cameras 81, 82 in the alignment bridge 5A will be described. For the photography of the periphery of the wafer w performed for the center position of the wafer W of -28-200931556, for the groups of (E2, E3) and (El, E4), only the macro cameras 81, 82 Switching can be performed almost simultaneously. Then, after the confirmation of the movements El and E3 of the wafer holder 4A is performed, it is only necessary to move in the Y direction once. In this case, if the macro camera is one, the clip must be sequentially moved to a position corresponding to each of the four points on the wafer W. Therefore, by using the two macro cameras 81, 82, the four-point photography of the peripheral position of the wafer φ W is performed in a short time. Further, Fig. 24(a) shows that when the alignment bridge 5A is mounted with only one micro camera 71 and the optical axis is located at the center of the alignment bridge 5A, the wafer w previously described is photographed. The appearance of PI and P2. Further, Fig. 24(b) shows the appearance of PI and P2 on the wafer W in the above embodiment. As can be seen from the figure, when the distance between the wafer holder 4A and the micro camera is L1, when the number of the micro cameras is two, it is L2, and the moving distance L2 大幅度 is significantly shorter than L1. Further, as one of the operations for performing the positioning of the wafer w and the probe 29, there are observation marks for observing the left and right end portions of the wafer W by the micro cameras 71, 72, or viewing the wafer after the inspection. At the time of the stitching on W, the left and right end portions of the wafer W or the vicinity thereof are present immediately below the micro cameras 71, 72. Fig. 25 shows the movement of the wafer holder 4A at the time of performing such an operation. Now, at a position below the alignment bridge strip 5A, the wafer W exists in such a manner that the center line 70 of the alignment bridge strip 5A overlaps with the center C of the wafer W. From then on, when the camera is to be photographed toward the wafer W by the micro camera -29 - 200931556, the wafer holder 4A is moved in the X direction to the left end of the wafer W directly below the micro camera 71. At this time, the amount of movement of the wafer jig 4A becomes M1. Here, if it is a 300 mm wafer, the M1 IJ becomes 77 mm. Therefore, as shown in FIG. 25, the state in which the center C of the wafer W is located at the center line 70 of the alignment bridge 5A is based on the amount of the wafer W from the state to the left region and the right region. For Ml. In this example, since φ uses a 300 mm wafer and Ml is 77 mm, the total amount of movement of the wafer W is 1 54 mm. Fig. 26 is a view showing that when the microbridge 71 is mounted on the alignment bridge 5A, the wafer holder 4A is moved to the X direction and the crystal is moved after the center of the wafer W is placed directly under the micro camera 71. The left and right end portions of the circle W are located directly below the micro camera 71. Therefore, as shown in Fig. 26, the amount M2 of the wafer W moving to the left side region and the right side region corresponds to the radius portion of the wafer W. In this example, since a 〇300 mm wafer is used, M2 is 150 mm, and the amount of movement of the wafer W is 1/3 mm. 由• As apparent from the above, two micro cameras 71 and 72 are provided by aligning the bridge 5A. With the two macro cameras 81 and 82, the amount of movement of the wafer jig 4A is small. Then, when the two macro cameras 81, 82 are used, it is preferable to be symmetrically disposed with respect to the center line 70. The reason is that when the macro cameras 81 and 82 share the photographing of the left and right areas of the wafer W, the moving area of the wafer jig 4A is symmetrical with respect to the center line 70, when it is used with the -30-200931556 by the micro camera. 71, 72 When the moving regions of the wafer W are overlapped, as a result, the moving region of the wafer holder 4A becomes narrower than when it is asymmetric. Further, the arrangement of the macro cameras 81 and 82 may be asymmetric with respect to the center line 70. The above-described operation of the precision calibration of the device is described mainly on the side of the first ^ inspection unit 2 1 A side in Fig. 1, but the precision calibration is performed exactly the same for the second 'inspection unit 21B'. Further, a series of operations including the precise calibration operation are carried out by the program 152 in the control unit 15. According to the above-described embodiment, the following effects can be obtained. The alignment bridge 5A (5B) of the moving body movable in the horizontal direction between the wafer holder 4A (4B) and the probe card 6A (6B) is provided with two of the wafers for viewing downward. Micro cameras 71, 72 and two macro cameras 81, 82. Then, the micro cameras 71 and 72 are spaced apart from each other, and the macro cameras 81 and 82 are also spaced apart from each other by the G axis of the light. Therefore, in order to obtain the position information of the wafer W, the wafer is w In the case of the wafer holder 4A (4B), the amount of movement of the wafer holder 4A (4B) is small. Therefore, it is possible to reduce the size of the device, and it is also possible to shorten the time required to obtain the position information of the wafer W, which contributes to high productivity. Further, other embodiments of the present invention will be described. Fig. 27 shows the alignment bridge strip 5A and the control unit 15 according to this embodiment. Further, since the alignment bridge 5B has the same configuration, one of the alignment bridges 5 A will be described as a representative. In the alignment bridge strip 5A of the present embodiment, two micro-photographs - 31 - 200931556 machines 71, 72 are movable, and the micro cameras 71, 72 of the two sides are arranged to be connectable and detachable. Then, the drive mechanisms 100, 200 for moving the micro cameras 71, 72 are loaded on the alignment bridge 5A. The drive mechanism 100 is provided with a ball screw 103 and a guide shaft 105 that support both end portions by the support members 101 and 102, and the ball screw 103 and the guide shaft 105 are arranged in parallel with respect to the moving direction of the micro camera 71. Then, on the one end side of the ball screw 103, specifically, the drive motor 104 of the rotary ball screw is connected to the back side of the micro camera 71, and the ball screw 103 is rotated by the drive motor 104, whereby the micro camera 71 It becomes a state of being moved by the state supported by the guide shaft 1〇5. Further, since the drive mechanism 200 has the same configuration as that of the drive mechanism 100, description thereof will be omitted. The drive motors 1〇4 and 2〇4 are connected to the control unit 15, and the control unit 15 controls the drive. In addition to the CPU 151, the program 152, the processing program 153, the operation unit G 154, and the bus bar 155 included in the control unit 15 of the first embodiment, the control unit 15 is provided with a camera movement/workbench via the bus bar 155. 156. The camera moving table 156 is a table corresponding to the distance between the information of the size of the 1C chip-400 and the distance of the micro-camera, and the driving motors 1〇4, 204 are based on the data of the respective stages of the camera moving table 156. drive. In the previously described embodiment, since the positions of the two miniature cameras are fixed, the distance between the P1 and P2 (P3, P4) which are spaced apart from each other in the X direction is inconsistent with the distance of the micro camera (consistently rare), in order to After the photograph P1, the photograph P2' must move the wafer holder 4A slightly. In the case of -32-200931556, the distance between the micro cameras can be adjusted to be the same as the distance between PI and P2 (P3, P4). Since PI and P2 (P3, P4) are the corners of the 1C wafer 400, the distance between PI and P2 (P3, P4) is determined by the size of the 1C wafer 400. Therefore, in the control unit 15, the camera moving table 156 is stored in the memory and the information on the wafer size is input from the input unit at the stage of performing the wafer inspection, and accordingly, the corresponding information is read. Enter the micro-camera of the wafer size ©, and control the drive unit to make the micro-camera move by its separation distance. Then, when the distance between the micro cameras 71, 72 becomes L0, the drive motor 104 is stopped. Accordingly, in the alignment bridge strip 5A of the present embodiment, as shown in FIG. 28, the movement of the two micro cameras 71, 72 can be determined by the size of the 1C wafer 40 0 of the wafer to be photographed. The distance between the two micro cameras 71 and 72 is changed by the distance L0. When the type is implemented in this way, the following effects can be obtained. When the micro cameras 71 and 72 for wafer photographing are detachably connected to each other, the separation distance can be adjusted to two specific points on the wafer W. For example, PI, P2 (P3, P4) in Fig. 20 Since the wafer holder 4A ( 4B ) is moved to a position where a specific point PI ( P3 ) is photographed, the wafer holder 4A ( 4B ) can be stopped and the other specific point P1 can be directly photographed. (P4) and contribute to higher productivity. When the probe card 5A described above is not only subjected to one contact, even if the probe pad 29 is disposed, for example, in a manner corresponding to the electrode pad group of the region divided by the diameter of the wafer W, the probe 29 is divided into two execution crystals. Circle-33-200931556 W and the contact of the probe 29, or in a manner corresponding to the arrangement of the electrode pads of the region in which the wafer W is divided into four, 29 is arranged to sequentially contact the wafer W with the The case of the 4 divided area is OK. At this time, the contact between the probe f and the wafer W is performed by rotating the wafer holder 4A. In the detecting device of the present invention, it is preferable to use a configuration in which the wafer W inspection is completed by the contact of the next to four times. Furthermore, the micro cameras 71 and 72 are in the optical path setting magnification mechanism of the optical system, and even by controlling the zoom mechanism, the angle of view which is slightly lower than the magnification when used as a high camera is obtained. Moreover, the magnification at the time of use as a high magnification is a magnification at which the degree of stitching on the pad can be confirmed, for example, only one electrode pad enters the magnification of the image. After the inspection, when the operator confirms the stitch on the electrode pad, The stitches are not observed from the cameras 81 and 82. In addition, the electrode pads can be confirmed one by one in the micro cameras 71 and 72. It takes a long time, and the intermediate viewing angle can view most of the electrode pads at a time, and the © stitch can be efficiently confirmed. Further, the point for locating the wafer W previously described can be used even if the intermediate viewing angle is used. • In the above, the distance between the optical axis of the first micro camera 71 and the optical axis of the second lithography machine 72 In the above example, it is 14 6 mm, so it is close to the radius of the wafer (150 mm). First, by setting the size between the optical axes close to the wafer diameter, it is possible to make The amount of movement of the table is minimized by placing the wafer W in the camera view of the micro camera 72. In the above, the substrate transfer arm is not limited to the circumferential probe as described above. 1 Upper magnification angle) In the electrode angle, the camera is photographed by the presence or absence of a specific type. 71. It is fixed at -34-200931556. It has three robot arms, even one robot. Further, the 'pre-calibration mechanism is not limited to being incorporated in the substrate transfer arm', and may be provided in the device independently of the substrate transfer arm. At this time, the orientation of the wafer from the substrate transfer arm to the workbench of the pre-calibration mechanism is adjusted to a specific orientation, and the center of the wafer is located at a specific portion of the substrate transfer arm. The wafer is transferred from the workbench to the substrate transfer arm. Further, the probe device to which the present invention is applied can be used for a total of three or more device bodies even if the device body is provided with only one device. [Brief Description of the Drawings] Fig. 1 is a perspective view showing an entire view of an example of a detecting device in a first embodiment of the present invention. Fig. 2 is a schematic plan view showing an example of the above-described detecting device. Fig. 3 is a longitudinal sectional view showing an example of the above detecting device. Fig. 4 is a squint G diagram showing an example of the loading cassette in the above detecting device. Fig. 5 is a schematic diagram showing an example of a wafer transport mechanism in the above-described detecting device. Fig. 6 is a perspective view showing an example of an inspection unit in the above-described detecting device. Fig. 7 is a schematic diagram showing an example of the above-described inspection unit. Fig. 8 is a plan view showing the position of the alignment bridge in the inspection unit. Figure 9 is a plan view showing an alignment bridge bar -35-200931556 according to an embodiment of the present invention. The first drawing is a schematic diagram showing an example of the movement stroke of the wafer jig in the inspection unit. Fig. 11 is a view showing a configuration of an example of a configuration of a control unit used in the above embodiment. - Fig. 12 is a plan view showing an example of the action of the above-described detecting device. ❹ Fig. 13 is a plan view showing an example of the action of the above-described detecting device. Fig. 14 is a plan view showing an example of the action of the above detecting device. Fig. 15 is a plan view showing an example of the action of the above detecting device. Figure 16 is a diagram for explaining the search origin of two cameras. Fig. 17 is an explanatory view showing a method of using the macro camera of the alignment bridge. Fig. 18 is an explanatory view showing a method of using the macro camera of the alignment bridge. Fig. 19 is an explanatory view showing a method of using a macro camera that aligns the bridge strips. Fig. 20 is a view showing an example of arrangement of 1C wafers on the wafer W. Fig. 2 is a first view for explaining the calibration state of the wafer orientation of the present embodiment. Fig. 22 is a second view for explaining the calibration state of the wafer orientation of the present embodiment -36-200931556. Fig. 23 is a third view for explaining the calibration state of the wafer orientation of this embodiment. Fig. 24 is a view for explaining the difference in the moving distance of the wafer jig when the alignment bridge is used in the present embodiment and the conventional example. - Fig. 25 is an explanatory view showing the total amount of movement of the wafer in the X direction when the alignment bridge is used. © Fig. 26 is an explanatory view showing the total amount of movement of the wafer in the X direction when a micro camera is mounted on the alignment bridge. Fig. 27 is a view showing an alignment bridge and a control unit according to another embodiment. Figure 28 is a diagram for explaining the effect of distance adjustment between two miniature cameras. [Main component symbol description] ® 1 : Loading unit 2 : Detection device body * 3 : Wafer transfer mechanism 4A, 4B : Wafer jig 5A, 5B : Alignment bridge bar 6A, 6B : Probe card 10 : Transfer chamber η : 〗Loading 埠12: 2nd loading 埠-37- 200931556 , 21Β : Inspection section probe arm upper arm middle arm lower arm arm part 3 8 : Light sensor miniature camera micro camera micro camera micro camera -38

Claims (1)

200931556 X. Patent Application Area 1. A detecting device is a wafer mounting table in which a plurality of wafers to be inspected are arranged and placed on a wafer mounting table that can be moved in the horizontal direction and the vertical direction by a driving portion of the mounting table, and The electrode pad of the inspected wafer is in contact with the detector of the probe card, and performs inspection of the inspected wafer, and is characterized by: - having a photo-taking means for photographing the detector for viewing the detector with the viewing angle upward And being disposed on the wafer mounting table; and the moving body, the height position between the wafer mounting table and the detecting card is set to be movable in a horizontal direction; and the viewing angle of the wafer surface is downward a first photographing means for circular photography and a second photographing means, wherein the moving bodies are disposed, and the optical axes thereof are spaced apart from each other; and the control means for performing the step group includes: moving the wafer mounting table , the focus of the photographic means for detector photography and the focus of the first photographic means for wafer photography and the focus of the second photographic means a step of positioning the wafer mounting table at each time point, and moving the wafer mounting table to sequentially scan the wafer on the wafer mounting table according to the first imaging means and the second imaging means for wafer imaging a step of positioning the wafer stage at each photographing, and a photographing means for photographing the photograph, a photographing detector, a step of obtaining a position of the wafer stage at the time of photographing, and a wafer carried according to each step The position of the stage is set to calculate the position of the wafer stage for contacting the wafer with the detector. The detecting device according to claim 1, wherein the detecting device is provided with the movable body, and the optical axes thereof are spaced apart from each other to face the lower surface of the wafer, and The first low-magnification camera and the second low-magnification camera for wafer imaging having a lower magnification than the first imaging means and the second imaging means. The detection device described in the first or second aspect of the patent application, wherein the first imaging means and the optical axis of the first low magnification camera are combined with the second imaging means and the second imaging means and the second The group of optical axes of the camera for low magnification is formed to be bilaterally symmetrical. 4. The detecting device according to any one of claims 1 to 3, wherein the step group includes a first low magnification camera and a second low magnification camera for wafer photography, and sequentially photographing crystals Two points on the edge of the wafer on the circular mounting table' Next, the wafer mounting table is moved orthogonally to a line connecting the optical axes of the first low-magnification camera and the second low-magnification camera to each other, by the first In the low-magnification camera and the second low-magnification camera, the two points on the opposite side of the two points in the sequential photographic wafer are the steps of determining the center position of the wafer based on the positions of the wafer stage at the four-point imaging. 5. The probe device according to claim 4, wherein the first low-magnification camera for the wafer photographing and the second low magnification are replaced by the first photographing means and the second photographing means for wafer photographing. The camera performs two points on the periphery of the wafer on the photographing wafer mounting table and two points on the periphery of the opposite side of the photographing. The detecting device according to any one of claims 1 to 5, wherein the step group includes photographing by a first photographing means and a second photographing means for wafer photographing At two specific points spaced apart from each other on the wafer, the wafer stage is rotated according to the position of the wafer stage at the time of photographing - the step of forming the wafer into a previously set direction. 7. The probe device according to any one of claims 1 to 6, wherein the first photographing means and the second photographing means for wafer photographing are provided by means of photographing means. The moving parts are connected to each other so as to be disconnected from each other. The detecting device according to any one of the first to seventh aspect, wherein the control unit is configured to light the first photographing means and the second photographing means based on information corresponding to the type of the wafer. The distance between the axes is a distance between two specific points on the wafer @, and a control signal for controlling the driving unit for the photographing means is output. 9. A method of detecting a wafer on which a plurality of wafers to be inspected are placed, and placing them on a wafer stage that can be moved in the horizontal direction and the vertical direction by a driving portion of the mounting table, and the wafer to be inspected is The electrode pad is in contact with the detector of the probe card, and performs inspection of the inspected wafer, and is characterized in that: a photographing means for photographing the detector with the viewing angle of the detector for photographing is used, which is disposed on the wafer mounting table And -41 - 200931556 The first imaging means and the second imaging means for photographing the wafer surface with the viewing angle facing downward, which are disposed at a height position between the wafer mounting table and the probe card, The movable body movable in the horizontal direction is spaced apart from each other by the optical axis, and has a focus of the photographing means for photographing the detector by the movement of the wafer mounting table and the first photographing means for wafer photographing. The focus and the position of the 2' photographic means to obtain the position of the wafer stage at each point in time; and by moving the wafer stage, The first photographing means and the second photographing means for the wafer photographing, sequentially photographing the wafer on the wafer mounting stage, and acquiring the position of the wafer mounting table at each photographing; and photographing means for photographing by the detector The photodetector acquires the position of the wafer stage at the time of photographing, and calculates the position of the wafer stage for bringing the wafer and the probe into contact based on the position of the wafer stage obtained in each step. β 1 〇 · The detection method described in claim 9 of the patent application, wherein the first imaging means for the wafer photography and the second imaging means sequentially scan the wafer on the wafer mounting stage The first imaging means and the second imaging means for wafer photography are used to sequentially scan two points of the edge of the wafer on the wafer mounting table, and then the wafer mounting table is orthogonal to the first imaging means and The optical axis of each of the second imaging means moves in a straight line, and the first imaging means and the second imaging means sequentially scan two points on the wafer on the opposite side of the two points, according to the four points of photography. -42- 200931556 The procedure for determining the center position of the wafer by the position of the circular stage. The detection method according to the ninth or tenth aspect of the patent application, wherein the first imaging means and the second imaging means for photographing the wafers are included, and the images are spaced apart from each other on the wafer. At two specific points, according to the position of the wafer stage at the time of photography, the wafer stage is rotated into a wafer's work in a direction set in advance. The detection method according to any one of claims 9 to 11, wherein the first photographing means for photographing the wafer and the second photographing are included based on information corresponding to the type of the wafer. The distance between the optical axes of the means is such that the distance between the two specific points on the wafer is different from each other, and the position of the first imaging means and the second imaging means is adjusted by the driving means for the imaging means. 13. A memory medium in which a computer program used in a detecting device is stored. The detecting device is provided with a wafer in which a plurality of wafers to be inspected are arranged, and is placed in a horizontal direction by a driving portion of the mounting table. The IB stage is moved in the vertical direction, and the electrode pad of the inspected wafer is brought into contact with the detector of the probe card to perform inspection of the inspected wafer, and the computer program is implemented in the application patent range 8 to The method of the program method described in any of the items 1 to 1 constitutes a group of steps. -43-