200930134 九、發明說明： '【發明所屬之技術領域】 ' 本發明涉及一種散熱裝置，特別涉及一種發光二極體 散熱裝置。 【先前技術】 隨著電子產業之飛速發展，電子元件運行速度 不斷提升，運行時產生大量熱量，使其本身及系統 Φ溫度升高，繼而影響其工作之穩定性。為確保電子 元件能正常運行，通常在其上安裝一散熱器，以排 出其所產生之熱量。 電子元件散熱問題之傳統解決方案通常係在 每個發熱電子元件上安裝一散熱器，該散熱器包括 與電子元件緊密接觸之一底板、設於底板上之複數 散熱鰭片。惟，對於一些特殊之發熱電子元件如數 量龐大之發光二極體，如此如果按傳統之散熱解決 ®方案，利用一實心之底板與所有之發光二極體接 觸，通過將發光二極體之熱量傳導到散熱鰭片上而 散發到周圍空氣中來散熱。 然而，此類底板體積和面積都比較大，不僅加 大散熱器之成本同時亦造成整個產品過大、過重。 更重要者係由於底板寬大且實心其中間部位高熱 區之散熱鰭片周圍之空氣對流強度明顯較底板周 緣之散熱鰭片差，如此會極大地影響該散熱器之整 6 200930134 體散熱能力，同時會產生散熱不均勻現象而易造成 .部分發熱元件損壞之嚴重後果。 ^【發明内容】 有鑒於此，有必要提供一種空氣對流較好之發 光二極體散熱裝置。 一種發光二極體散熱裝置，其包括複數散熱 器、複數散熱單元和複數熱管，該等散熱器均包括 一底板及從底板頂面向上延伸之複數散熱鰭片，該 ©等散熱單元均由複數散熱片體構成，每兩相鄰散熱 片體之間形成有氣流通道，該等熱管將該等散熱器 底板與散熱單元串接在一起，該等氣流通道連通該 等發光二極體散熱裝置之上下區域。 上述散熱片體間之氣流通道連通談發光二極 體模組上下區域，當氣流通道内之空氣受熱進入發 光二極體模組上面區域之同時馬上得到來自發光 &二極體模組下區域之空氣氣流補充進來，如此形成 上下氣流之迴圈能有效提高該發光二極體模組之 散熱效率。 【實施方式】 如圖1-4所示，本發明發光二極體散熱裝置用 於對貼設於其底部之發光二極體模組 40進行散 熱，其包括三結構相同之散熱器10、二組夾設在 相鄰兩散熱器10之間之散熱單元20和複數將散熱 器10及散熱單元20熱導性連接在一起之熱管3 0。 7 200930134 如圖1-2所示，上述散熱器10可由導熱性 .良好之金屬材料如鋁、銅等一體成型，其包括一 形底板1 2和複數自底板1 2頂面垂直向上延伸之 * 熱鰭片14。該等散熱鰭片14相互等距間隔且與 板12之相對兩長邊平行，每兩散.熱鰭片14之間 成有供氣流通過之氣流通道（未標號）。該散熱 10開設有將散熱鰭片1 4切分成複數等份之複數 向通道16，該等橫向通道16垂直於散熱鰭片 ❹延伸，且對應橫向通道16底部之底板12上開設 容置熱管30之半圓形凹槽120。 上述每一組散熱單元20包括在相鄰兩散熱 10之間排成列之三鰭片組，每一鰭片組由矩形 屬薄片製成之複數散熱片體22構成，該散熱片 22之寬度略小於該散熱器10之高度，以使散熱 元20夾置在二散熱器10之間時未凸伸出散熱 10之上下面，即每一散熱片體22頂面與底面均 於散熱器10之頂面與底面之間。每一散熱片體 在靠近其下邊緣設有與散熱器10底板12上之凹 120對應之三間隔穿孔220，該穿孔220之周緣 直延伸有環形折邊222，當所有散熱片體22相 疊加在一起形成散熱單元22時，該等對應之穿 220與折邊222 —起形成一供熱管30穿置並與 熱器10凹槽120對應連通之管狀容置通道。該 熱片體22之上下邊緣分別垂直向折邊222之同 能 矩 散 底 形 器 橫 14 有 器 金 體 單 器 位 22 槽 垂 互 孔 散 散 側 8 200930134 延伸有複數間隔凸片224，該凸片224之延伸長度 -與折邊222之相等，以將散熱片體22相互等距間 ，隔開來。每兩相鄰之散熱片體22之間形成有連通 該發光二極體散熱裝置上下區域之氣流通道。 上述熱管30之數量為九根’分為三組，每組 三根’其中每一組熱管30穿置在一鰭片組内。每 一熱管30平直延伸，其截面為圓形。 ❹ 味一併參閱圖3’上述發光二極體模組4〇等 距間隔地安裝在每一散熱器10底板12之底面上， =匕括一矩形電路板42和複數呈矩陣排列地安裝 於電路板42上之發光二極體44,該發光二極體44 背向散熱器1 〇。 会入凊一併參閱圖4’上述發光二極體散熱裝置在 、’且σ時’將上述熱管3〇穿置在兩組互間隔之散 孰嚴一 1 70 〇之容置通道内’暴露在兩組散熱單元20 〇生間及相對兩側之熱管30部分通過散熱器10上之 杈向通道16嵌置於底板12上 内益玎通 過煜垃， 切=接、粘貼等方式固定。上述發光二極體模耝 可通過鎖螺釘或粘貼等方 散熱器10 ^之底面。此時，散熱單元20分別緊密失置 片體政熱器1 〇底板12兩相對長侧邊之間，其散熱 i〜22及氣流通道均與散熱器10之散熱鰭片14 千4丁 〇 上逑發光二極體散熱裝置在使用時，發光一極 9 200930134 體模組40產生之熱量被底板1 2吸收，然後一部分 .熱量被傳導到散熱器1 〇之散熱鰭片14上，另一部 分通過熱管30被傳導到散熱單元20上並最終通過 ? 散熱鰭片14和散熱片體22散發到周圍空氣中來達 到冷卻發光二極體模組4 0之效果。 上述散熱單元20之散熱片體22為重量相對 較輕而面積較大之金屬薄片，且通過熱管30與散 熱器10連接無需設置底座，所以在輕微加重發光 ❹二極體散熱裝置總體重量之情況下，顯著增加該發 光二極體散熱裝置之總體散熱面積，同時亦減少底 座材料之使用而降低該發光二極體散熱裝置製造 之材料成本。而且上述散熱片體22間之氣流通道 連通該發光二極體模組40上下區域，當氣流通道 内之空氣受熱進入發光二極體模組40上面區域之 同時馬上得到來自發光二極體模組40下區域之空 &氣氣流補充進來，如此形成上下氣流之迴圈能有效 ❹ 提高該發光二極體模組40之散熱效率。 可以理解，在其他實施例中，發光二極體散熱 裝置可以包括二或者三個以上之散熱器10，對應 數量之散熱單元20夾置在每相鄰之兩散熱器10之 間和足夠穿過該等散熱器10與散熱單元20之熱管 30 ° 綜上所述，本發明符合發明專利要件，爰依法 提出專利申請。惟，以上所述者僅為本發明之較佳 10 200930134 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 .精神所作之等效修飾或變化，皆應涵蓋於以下之申 ，請專利範圍内。 【圖式簡單說明】 圖1係本發明發光二極體散.熱裝置之立體圖。 圖2係圖1中發光二極體散熱裝置之立體分解 圖。 圖3係圖1中發光二極體散熱裝置之倒置圖。 圖4係圖1中發光二極體散熱裝置之俯視圖。 【主要元件符號說明】 散熱器 10 底板 12 凹槽 120 散熱鰭片 14 橫向通道 16 散熱單元 20 散熱片體 22 穿孔 220 折邊 222 凸片 224 熱管 30 發光二極體模 組 40 電路板 42 發光二極體 44 11200930134 IX. Description of the invention: '[Technical field to which the invention pertains] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for a light emitting diode. [Prior Art] With the rapid development of the electronics industry, the operating speed of electronic components is continuously increasing, and a large amount of heat is generated during operation, which increases the temperature of itself and the system Φ, which in turn affects the stability of its work. To ensure proper operation of the electronic components, a heat sink is usually mounted on it to dissipate the heat it generates. A conventional solution to the heat dissipation problem of electronic components is usually to mount a heat sink on each of the heat-generating electronic components. The heat sink includes a bottom plate in close contact with the electronic components and a plurality of heat-dissipating fins disposed on the bottom plate. However, for some special heating electronic components, such as a large number of LEDs, if you use the traditional thermal solution solution, use a solid bottom plate to contact all the LEDs, and pass the heat of the LEDs. It is conducted to the heat sink fins and is radiated to the surrounding air for heat dissipation. However, such a base plate has a relatively large volume and area, which not only increases the cost of the heat sink but also causes the entire product to be too large or too heavy. The more important one is that the air convection intensity around the heat dissipation fins in the high heat region of the solid portion is obviously lower than that on the peripheral edge of the bottom plate, which greatly affects the heat dissipation capability of the heat sink. It will cause uneven heat dissipation and easily cause serious damage to some heating elements. ^ [Summary of the Invention] In view of the above, it is necessary to provide a light-emitting diode heat sink with better air convection. An illuminating diode heat dissipating device includes a plurality of heat sinks, a plurality of heat dissipating units and a plurality of heat pipes, each of the heat sinks comprising a bottom plate and a plurality of heat dissipating fins extending upward from a top surface of the bottom plate, wherein the heat dissipating units are plural The heat sink body is configured to form an air flow passage between each two adjacent heat sink bodies, and the heat pipes connect the heat sink bottom plates and the heat dissipating unit in series, and the air flow passages communicate with the light emitting diode heat dissipating devices Upper and lower areas. The air flow passage between the heat sink bodies communicates with the upper and lower regions of the light emitting diode module, and when the air in the air flow passage is heated into the upper area of the light emitting diode module, the area under the light emitting & diode module is immediately obtained. The air flow is supplemented, so that the loop of the upper and lower airflow can effectively improve the heat dissipation efficiency of the LED module. [Embodiment] As shown in FIG. 1-4, the light emitting diode heat dissipating device of the present invention is used for dissipating heat from a light emitting diode module 40 attached to a bottom thereof, and includes three heat sinks 10 and 2 having the same structure. The heat dissipating unit 20 sandwiched between the adjacent two heat sinks 10 and the plurality of heat pipes 30 that thermally connect the heat sink 10 and the heat dissipating unit 20 together. 7 200930134 As shown in FIG. 1-2, the heat sink 10 may be integrally formed of a metal material having good thermal conductivity, such as aluminum, copper, etc., and includes a first-shaped bottom plate 12 and a plurality of vertical extensions from the top surface of the bottom plate 12; Hot fins 14. The heat dissipating fins 14 are equally spaced from each other and parallel to the opposite long sides of the board 12, and an air flow passage (not labeled) is provided between the two heat fins 14 for airflow therethrough. The heat dissipation 10 is provided with a plurality of parallel channels 16 for dividing the heat dissipation fins 14 into a plurality of equal portions. The horizontal channels 16 extend perpendicular to the heat dissipation fins, and the heat dissipation tubes 30 are disposed on the bottom plate 12 corresponding to the bottom of the lateral channels 16. A semicircular groove 120. Each of the heat dissipating units 20 includes a plurality of fin groups arranged in a row between two adjacent heat dissipating 10s. Each fin group is composed of a plurality of fins 22 made of a rectangular sheet, and the width of the fins 22 is Slightly smaller than the height of the heat sink 10, so that the heat dissipating unit 20 is not disposed between the two heat sinks 10 and protrudes below the heat dissipating 10, that is, the top surface and the bottom surface of each heat sink body 22 are on the heat sink 10. Between the top surface and the bottom surface. Each of the fins is provided with three spaced perforations 220 corresponding to the recesses 120 on the bottom plate 12 of the heat sink 10 near the lower edge thereof. The periphery of the perforations 220 extends directly with an annular flange 222, and all the fins 22 are superimposed. When the heat dissipating unit 22 is formed together, the corresponding through holes 220 and the flanges 222 form a tubular receiving passage through which the heat pipe 30 is placed and correspondingly communicates with the groove 120 of the heat exchanger 10. The upper edge of the hot sheet body 22 is perpendicular to the folded edge 222, and the same potential is dispersed. The bottom of the body is horizontally 14 and the gold body is single. The slot 22 is spaced apart from the side of the hole. The extension of the tab 224 is equal to the flange 222 to space the fins 22 equidistant from one another. An air flow passage connecting the upper and lower regions of the heat sink of the light emitting diode is formed between each two adjacent heat sink bodies 22. The number of the heat pipes 30 is nine, divided into three groups of three, each of which is placed in a fin group. Each of the heat pipes 30 extends straight and has a circular cross section. Referring to FIG. 3, the above-mentioned light-emitting diode modules 4 are mounted on the bottom surface of the bottom plate 12 of each heat sink 10 at equal intervals, including a rectangular circuit board 42 and a plurality of matrix arrays. The light-emitting diode 44 on the circuit board 42 faces the heat sink 1 〇. Referring to Figure 4, the above-mentioned light-emitting diode heat-dissipating device is placed in the accommodating channel of the two sets of mutually spaced holes 1 to 70 在 in the 'and σ time' exposure. The heat pipe 30 between the two sets of heat-dissipating units 20 and the opposite sides of the heat-dissipating unit 20 are embedded in the bottom plate 12 through the channel 16 on the heat sink 10, and are fixed by means of cutting, cutting, bonding, and the like. The above-mentioned light emitting diode module can be screwed or pasted to the bottom surface of the heat sink 10 ^. At this time, the heat dissipating unit 20 is respectively tightly dislocated between the two relatively long sides of the substrate heat exchanger 1 and the bottom plate 12, and the heat dissipation i 22 and the air flow passage are both on the heat sink fin 14 and the heat sink fin 14 When the light-emitting diode heat sink is in use, the heat generated by the body module 40 is absorbed by the bottom plate 12, and then a portion of the heat is conducted to the heat sink fins 14 of the heat sink 1 and the other portion is passed. The heat pipe 30 is conducted to the heat dissipation unit 20 and finally radiated to the surrounding air through the heat dissipation fins 14 and the heat sink body 22 to achieve the effect of cooling the light emitting diode module 40. The heat sink body 22 of the heat dissipating unit 20 is a metal foil having a relatively light weight and a large area, and the heat pipe 30 is connected to the heat sink 10 without providing a base, so that the overall weight of the light emitting diode heat sink is slightly increased. The overall heat dissipation area of the light-emitting diode heat sink is significantly increased, and the use of the base material is also reduced to reduce the material cost of the light-emitting diode heat sink manufacturing. The airflow channel between the heat sink body 22 communicates with the upper and lower regions of the light emitting diode module 40. When the air in the airflow channel is heated into the upper area of the light emitting diode module 40, the light emitting diode module is obtained immediately. The airflow of the lower area of the 40 area is supplemented, so that the loop of the upper and lower airflows can effectively improve the heat dissipation efficiency of the LED module 40. It can be understood that in other embodiments, the light emitting diode heat dissipating device may include two or more heat sinks 10, and a corresponding number of heat dissipating units 20 are sandwiched between each adjacent two heat sinks 10 and sufficiently passed through. The heat sink 10 and the heat pipe of the heat dissipating unit 20 are 30 ° in summary, and the invention complies with the invention patent requirements, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention. The equivalent modification or variation of the spirit of the present invention should be covered in the following claims. Within the scope. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a light-emitting diode heat dissipation device of the present invention. 2 is an exploded perspective view of the light emitting diode heat sink of FIG. 1. 3 is an inverted view of the light emitting diode heat sink of FIG. 1. 4 is a top plan view of the light emitting diode heat sink of FIG. 1. [Main component symbol description] Heat sink 10 Base plate 12 Groove 120 Heat sink fin 14 Transverse channel 16 Heat sink unit 20 Heat sink body 22 Perforation 220 Folding edge 222 Tab 224 Heat pipe 30 Light-emitting diode module 40 Circuit board 42 Light-emitting two Polar body 44 11