200937142 六、發明說明： 【發明所屬之技術領域】 本發明係關於可於液晶顯示元件基板之電極形成面上形 成均一膜厚的配向膜之可撓性印刷板用感光性樹脂板片之 製造裝置及製造方法。 【先前技術】 可撓性（flexo)印刷板被利用於瓦愣紙、紙器、紙袋與軟 ❹ 包裝用膜等包裝、封包領域、或密封標藏領域、完工修飾等 之光澤塗裝領域、建材、電子零件等之標記（marking)領域 等各種被印刷物之印刷。其主要理由在於，由於可撓性印刷 板之特徵在於屬於柔軟且彈力性優異的材料，且來自於將載 於凸部的油墨直接轉印之單純的印刷原理，故油墨本身單純 且容易高濃度化，可印刷於廣泛的被印刷材料。 可撓性板之特徵在於為柔軟且有彈性的材料，通常係利用 〇橡膠板或感光性樹脂板等之有橡膠彈性的材料，最近，基於 印刷品質之高再現精度化的要求，而廣泛地使用活性光線硬 化型之UV硬化型感光性樹脂。 關於可撓性印刷板領域中所使用的ϋν硬化型感光性樹 月曰樹月曰製者已提供有：於日本專利特開昭记號 公報、特開平8-22Q737號公㈣之於活性域照射前為液 體狀態者；或於特_ 55—48744號錢、特開平8_3〇5謂 號公報中所揭示之使用熱塑性聚合物之常溫下為片狀者。 097148908 200937142 於常溫下呈現液狀或固體狀態之該等感光性樹脂，係分別 以活用其特徵的使用法而被利用。亦即，液狀樹脂於印刷加 工時雖必須有用以成形為片狀之裝置，然而具有uv照射後 之未硬化部分可回收再利用、可用自家的裝置製作用於生產 所需厚度之印刷板、生產性較高等特徵。另一方面，固體狀 的感光性樹脂材料由於已被片狀化而販售，故具有於使用 時，不僅不須負擔液狀感光性樹脂般的成形加工設備，且以 樹脂廠商之正規的加工裝置製造，故板厚精度高，可依需要 之尺寸僅利用所需之各類型之感光性樹脂的簡便性的特徵。 為了以此等感光性樹脂作為可撓性印刷板，除了須要求印 刷圖案之高解析再現性之外，為了極力抑制印刷時之印刷變 動量，故可進行柔印（kiss-touch)印刷的樹脂之橡膝硬度必 需為Hs(A)30°至65°左右之柔軟度’且必需為厚度精度高的 印刷板。 如上述般，於液狀感光性樹脂，須進行可滿足作為印刷板 之厚度精度之片材加工處理、與藉由活性光線照射之硬化處 理。亦即，於液狀感光性樹脂用製板裝置中，片材成形與光 成形是必要的，通常係使用將此等以一連串之處理步驟予以 一體化而進行的裝置。因此，作為於進行片材成形與光成形 時之基板，係使用活性光線透過性優異、機械剛性亦優異之 浮式玻璃（float glass)，或由财熱性與高UV透過性而言而 使用派熱司玻璃（Pyrex glass)。於更大型的印刷板製板 097148908 4 200937142 中，針對支持基板之撓屈性降低策略與樹脂之硬化特性則進 行了各種考究。 例如，於選擇成形裝置中所用之活性光線透過性的透明基 板時’為了使因自身重量所致之撓曲極小化，係使用將玻璃 基板厚度設成為20mm以上，或對玻璃進行特殊研磨加工使 其達成之撓曲度為於裝設於成形裝置之狀態下可滿足基板 之表面平坦性。結果，存在有須使用昂貴的基板，且製板裝 • 置之設備成本亦提高之問題。 再者’作為改善感光性樹脂於光硬化時之反應熱、來自活 性光線之燈熱所導致之透明基板的熱膨脹撓曲之方法，已知 有：將玻璃作成為凹狀之日本專利特開平11-84633號公 報，使上下2片支持基板的間隔於活性光線曝光中改變之特 開平3-226757號公報、特開2007-279325號公報。 尤其’於本發明用途之液晶領域配向膜印刷中’亦可見到 © 自感光性樹脂板本身所產生的物質造成配向膜性能降低的 問題之事例，故偏好使用UV硬化後之未反應物質、亦即未 參與光聚合之柔軟劑、可塑劑等添加物較少，得到之聚合物 之耐溶劑性優異之液狀感光性樹脂製之印刷板。再者，須要 求印刷板較包裝材料印刷與標示印刷所須尺寸更大，且具有 較塗膜厚度要求之高精度更高的精度。 然而，如上述般，於使用習知技術之大型板製板裝置中， 存在為了滿足透明基板玻璃本身之平坦性的限度，實務上係 097148908 5 200937142 銜接複數片印刷板等以因應大型印刷板。因此，於液晶配向 膜印刷之去角方面有所限制，存在有因印刷板雛所致之板 内厚度精度之降低、或樹脂銜接部分之财久性不足導致之印 刷壽命降低崎等、於液晶配向膜印刷之大型化方面的重大 障礙。 本發明者等’於日本專利特開2007-201693號公報（未公 開）中雖曾提案了由印刷面之表面粗糖度⑸為卜^肌之可 撓性印刷板所構成的感光性樹脂製印刷板，然而，此可撓性 板之較佳製造裝置及製造方法的開發仍是課題。 [專利文獻1]日本專利特開昭52-90304號公報 [專利文獻2]日本專利特開平8_22〇737號公報 [專利文獻3]日本專利特開昭55_48744號公報 [專利文獻4]日本專利特開平8_3〇5〇3〇號公報 [專利文獻5]曰本專利特開平u—84633號公報 [專利文獻6]曰本專利特開平3_226757號公報 [專利文獻7]日本專利特開2007-279325號公報 [專利文獻8]日本專利特願2007-201693(未公開） 【發明内容】 (發明所欲解決之問題） 本發明之課題在於提供一種於要求無針孔的高精度之薄 膜印刷性的液晶配向膜用印刷板中，即使是較大製板尺寸亦 可高板精度且安定地進行可撓性印刷板等之感光性樹脂印 097148908 6 200937142 刷板之製板的製造裝置及製造方法。 (解決問題之手段） 了本 本發明者等，針對前述課題刻意進行研究，結果達成 發明。亦即，本發明係如下述： (1) 一種感光性樹脂板片之製造裝置，係使上下2片支持 基板相對向以構成配置感光性樹脂的間隙，該支持基板之兩 者或至少一者為可穿透活性光線之透明基板，該透明基板之 ❹ 任一者之内面係經粗面化，使液狀感光性樹脂與該粗面接 觸，經由前述透明基板照射活性光線，藉此使前述液狀感光 性樹脂硬化者；其特徵為，具有使前述上下2片支持基板之 兩者或一者上下移動以調整前述間隙之間隙調整機構。 (2) 如（1)之感光性樹脂板片之製造裝置，其中，於前述上 下相對向的支持基板之内面具有吸附構造。 (3) 如（1)或（2)之感光性樹脂板片之製造裝置，其中，前 ❹述上下相對向的支持基板之間隙調整機構，係使該支持基板 於貪面側之寬方向及長方向上分別以100mm間距以上、 500mm間距以下的間隔上下移動之機構。 ， (4)如（1)至（3)中任一項之感光性樹脂板片之製造裝置， • 其中’前述上下相對向的支持基板之間隙調整機構之自該支 持基板的背面侧進行上下移動之平坦性調整寬度為1腿以 上’其調整精度為0.01咖(1以下。 (5)如（1)至（4)中任一項之感光性樹脂板片之製造裝置， 097148908 200937142 其中，前述上下相對向的支持基板之間隙調整機構，係棒構 造的支持體將下侧之透明支持基板背面往上推壓之機構，與 該透明支持基板的接觸面之面積為100mm2以下。 (6)—種感光性樹脂板片之製造方法，其特徵為，係使用 (1)至（5)中任一項之製造裝置所製造。 (發明效果） 依據本發明，由於可調整大尺寸透明支持基板之平坦性， 並可達成迄今所未能達成之相對向的2片支持基板間的間 隙控制’故可安定生產單片之板厚精度優異的大型尺寸液晶 配向膜用印刷板，更大型之液晶顯示基板之生產亦較先前之 液晶顯示基板之去角之自由度與取得數目有利，於生產性可 有大幅度之貢獻。 【實施方式】 本案發明之構成係如圖1所示般，於在上面具有粗化面 11的下部透明支持基板1〇上依序積層配置感光性樹脂12、 基底薄膜13，在其上藉由將具有真空孔15之上部不透明基 板14保持於間隔物18上，而構成上下支持基板之間隙、亦 即感光性樹脂板片之厚度。 又，於將下部透明支持基板牢固地安置於裝置框後，取得 該透明支持基板上面整體之大致水平，再使安裝於配置於該 基板下侧之插針基板19的平坦度調整銷16預先調整至輕抵 該基板的位置。 097148908 200937142 各別的支持基板之平坦度可利用使用了雷射之平坦度調 整方法，於下部透明支持基板的端部放置基準塊（block)而 決定基準高度後’一邊於有平垣度調整銷的位置依序替換該 塊，一邊使平坦度調整銷升降至各雷射光之基準高度，以調 整至目標高度。 另一方面，於本案發明中’上部支持基板係金屬製，該基 板之下面平坦度，係藉由機械研磨而取得整體之平坦性後， Φ 因本身重量所致之撓曲所產生的平坦度修正係藉由安裝於 上部支持基板之平坦度調整螺絲基板上所配置的平坦度調 整螺絲21 ’以前述使用了雷射之平坦度調整方法等進行更 高精度的平坦性之微調整。 如此，配置於經預先提高平坦度之上下支持基板間的樹脂 12與基底薄膜13，係經由設於與基底薄膜相接之上部支持 基板表面的真空孔15使基底薄膜背面吸附密著，於由該上 ❹下支持基板所作成的高精度的間隙中進行成形後，藉由經由 下部透明支持基板以活性光線燈17進行硬化處理，可製造 優異之厚度精度的感光性樹脂板片^ 亦即，本案發明係關於一種裝置與使用該裝置之感光性樹 脂板片之製造方法，其係利用上下支持基板之間隙將感光性 樹脂進行成形、曝光的方法，其特徵為，使用上下支持基板 之兩者或至少一者基板之作成間隙的面具有可調整平坦度 之構造的該基板，對上下支持基板間之間隙進行控制。 097148908 9 200937142 以下，針對本發明更詳細地進行說明。 本發明中所使用之支持基板，係指於成形及曝光中不受到 其他力量的拘束’介在著間隔物以自由狀態相對向配置的基 板’所謂透明或不透明係指屬於紫外線之UV-Α區域的活性 光線之穿透性之有無，具有5%以上的[jy_A穿透率之基板 稱為透明基板。此UV-Α透過率可由市售的紫外線照度計、 例如UV-302A(商品名，〇RC製作所製）等所測定之紫外線照 度於紫外線通過前後之變化率加以定義。 又，本發明中所用之支持基板係於日本專利特開 2007-279325號公報或特開平4—7552號公報中所揭示之使 用感光性樹脂對印刷板進行成形、曝光時所用之玻璃製透明 基板’在基於必須自背面與凸板（relief)面之兩侧照射活性 光線而使上下2片以透明支持基板構成的例子中，於僅可在 凸板面施行曝光處理的感光性樹脂之成形、曝光裝置中，相 對向之背面基板通常採用不透明支持基板。 此時，2片支持基板的間隙可用安置於上或下支持基板表 面的既定厚度之塊（以下亦稱為間隔物）設定，依所要目標的 完成厚度而改變此間隔物之厚度而製板。作為設定2片支持 基板的間隙之方法有：在相對向的基板之兩者或任—者單侧 内表面設置間隔物，或以使下支持基板的外側較支持基板表 面高，在將上支持基板放置於該間隔物上時可生成所需之目 標間隙的方式’設置間隔物高度構造等方法。 097148908 10 200937142 此等支持基板中，由活性光線穿透性、材料之剛性、耐久 性而言，多使用玻璃作為透明支持基板，但亦可使用丙烯酸 樹脂、聚碳酸酯樹脂、聚酯樹脂等之塑膠材料。又，作為不 透明支持基板，由加工性、剛性等而言’通常使用鐵、紹等 之金屬材料。 用以製造本發明之感光性樹脂板片之透明支持基板，係凸 板面之粗面化與優異的厚度精度可藉由光成形同時形成 ❹ 者’係為了得到目標之印刷凸板面的表面粗糙度而預先將基 板表面均一地進行粗面化者，透明支持基板之該粗面化模係 用研磨粒以喷砂或摩擦等周知的製造法而調製。 又’本發明之感光性樹脂板片之製造方法中，可使用液狀 感光性樹脂，例如於日本專利特開昭52—90304號公報與特 開2003-156837號公報等中所揭示之感光性樹脂。使用此等 感光性樹脂所製造之感光性樹脂板，係以尺寸安定性與機械 ©物性優異的聚醋膜或片等使用作為支持體，並使用於該膜或 片之與感光性樹脂相接之側上預先施行了接著處理等之基 材。 本發月裝置中所使用之上下支持基板中，各別之成為對向 面的面之平坦性較佳係於基板製造時即已取得。亦即，較佳 係於未發生本身重量所致之撓曲的條件下之平坦度、亦即該 基=表面於懸吊狀態或於基座上之平坦度精度為5/ι〇〇丽 以内、較佳3/刚職以内’而無局部的凹凸狀態。此等於懸 097148908 11 200937142 吊狀態或於基座上之平坦度精度，對金屬材料當然可使用通 常的機械研削法等獲得，於本發明中所使用之透明玻璃基板 的情況亦可用習知的玻璃材料之研削方法得到。 於將本發明之可調整間隙的構造設置於2片支持基板兩 者之裝置的情況，由於可調整各別之支持基板面之平坦度， 故2片支持基板間之間隙可滿足更佳的精度。又，於因活性 光線或樹脂硬化時之熱等導致上或下支持基板發生變形的 情況，亦可自所得之感光性樹脂板片讀取其狀態並進行修 正，故於製造高精度且安定的感光性樹脂板片上屬極有效的 方法， 上下各別之支持基板的平坦度調整，可利用配置於各別基 板内之水準（level)調整螺絲調整，圖i係表示配置於上下 之2片支持基板的平坦度調整構造之一例，圖2係表示配置 於下部透明支持基板下側的平坦度調整構造之一例。平扭度 調整構造係於支持基板内以議匪以上、5〇〇賴以内之間隔 配置，分別設置有可單獨上下移動之構造，其上下移動係可 旋轉安裝於該部之水準調整螺絲而進行，上移下移量只要為 相對於基準為l.0mm以上之調整量即可，該水準調整精度以 0.01_以下為佳，若為可更高精度調整者則更佳。平坦度 調整構造若之配置仙等間隔配置為較容易進行調整，= 置密度若較高，則有不歸置成本高，且調整亦較費時 題。 097148908 12 200937142 ❿ 將平坦度調整構造之水準調整螺絲之前端，亦即，在位於 2持基板時其係安裝在支縣板之上部水準調整螺絲安 之間’使該水準調整螺絲旋轉，以進行上支持基板表 面的平坦度之上下調整。另—方面，於配置在下側的透明支 持基板之情況’水準調整螺絲之前端係作成為自下侧支持基 板下面突起之形狀之銷構造，下側透明基板之自身重量之撓 曲所致之下降’可藉峻轉作成域雜之水準調整螺絲使 銷刖端上下移動而調整’本發财所指之上部支持基板中可 使用之水準調整螺絲’可使用FA用機械（meehanieal)標準 零件中周知的水準調整螺絲、水準調整螺帽、鎖緊螺母 (locknut)組合所成者。 於前述感光性樹脂製板之揭示專利與本發明之感光性樹 脂板片之製板中’大多係將凸板面設於下部透明支持基板 侧’將稱為基底薄臈之印刷基材面設於上部支持基板侧之 ❹例。此係肇因於液狀感光性樹脂之成形法者 ，因使用一邊將 樹脂擠壓擴展、一邊使基底薄獏疊合而片狀化的高便利性之 液狀樹脂成形方式所致。 由於本發明中之下部透明基板之平坦度調整用之銷係位 於與透明支持基板直接相接處，故因銷形狀成為活性光線之 陰影處，而使活性光線分布精度於印刷凸板面造成不良影 響。因此，本發明者等針對平坦度調整所必須之銷頂部保持 面的形狀與印刷凸板之影響進行潛心研究，結果發現，若透 097148908 13 200937142 明基板接觸面之大小為l〇〇mm2以下，則可於不影塑印刷凸 板面之下進行本發明之感光性樹脂板片製板裝置之平坦声 調整，而達成本發明H面，為了自下面支撐透明基板 之玻璃，該銷之接觸面亦可為點，但由防止對玻璃面造成傷 痕與安定的保持性而言，較佳係其前端形狀為半徑以 上、較佳半徑2mm以上之球狀，或於其間加入不妨礙印刷凸 板形成之大小的可撓性材料等緩衝材。 作為調整上下支持基板表面的平坦度之方法，可利用使用 了雷射等之公知方法。作為使用雷射調整平坦性之方法，有 如使用可見光二極體雷射之「精密校準雷射系統」（商品名， HAMAR LASER公司製，美國）等。此等測量系統係由雷射發 射裳置與接收裝置所構成，係於同一面上配置雷射發射掌置 與一個或複數個以上之受光部，以來自發射襞置之雷射光古 度為基準水準’藉由前述平坦度調整螺絲之操作使各受光部 间度上下移動，藉此進行上下支持基板表面之水準調整。 此專發射裝置及接收裝置係利用磁力而安裝者，只要上支 持基板為金屬製，則可利用磁力而安裝於下側面，受光骏置 係於各測定處所之調整完成後依序移動而可進行面整體之 平坦度調整。又，前述雷射系統中之平面測定時之測定精度 為0.0025_至0.001mm，為作為本發明之平坦度調整裴^ 之充分檢測精度。 即使為只於上下支持基板之單側之平坦度調整構造亦可 097148908 200937142 得到迄今所無法得到之高厚度精度的感光性樹脂板。亦即， 藉由本發明之平坦度調整機構之上下調整，並以進行追隨相 對向的支持基板之平面狀態的平坦度調整，則相較於前述般 設置於上下支持基板兩方的情況相比，於調整上雖較費時， 然而與不具有調整構造的以往方法相比，其可達成具有高精 度的厚度精度之感光性樹脂之製板。 本發明之感光性樹脂板片之製造方法，係於預先調整了平 ❹ 坦度的表面經粗面化之下部透明支持基板10上，直接擠壓 擴展既定厚度的感光性樹脂12,再使基底薄膜13疊合於其 上’將樹脂與基底薄膜一體成形為片狀，再使預先調整了平 坦度之上部支持基板14下降，使該端面保持於間隔物18 上。其後’以設置於上部支持基板之真空孔15吸附基底薄 膜而與上支持基板密接’經由下部透明支持基板使用活性光 線燈17進行照射，進行感光性樹脂之光硬化。照射終了後， ❿將光硬化之感光性樹脂板片與基底薄膜一起自下透明基板 表面剝離取下，完成感光性樹脂板片之製板。 如此得到之感光性樹脂板片，係與以往之未控制上下支持 基板的間隙之方法相比，中央部不至於變厚或變薄，可依4憂 異之厚度精度安定地製造。 [實施例] 依據實施例說明本發明。 又，發明例及比較例中之厚度精度及對印刷凸板面之影響 097148908 15 200937142 度評估係如下述： (1) 厚度精度ΔΤ:對800x1050mm之範圍，以5〇_間隔，γ 最小表示刻度i/i〇〇mn^度盤規（dial gauge)測量格子點Μ 表示其最大值與最小值之差。由在配向膜印刷時職予良=的 印刷方面而言，厚度精度Δτ之評估係如下述： ◎ : 4/1 〇〇mm 以下 〇：5/100mm〜6/l〇〇mm x : 7/100mm 以上 (2) 對印刷凸板之影響：以聚醯亞胺（稱為ρι)油墨用柔印 (kiss-touch)印刷，針對以無刮痕、無斑駁的狀態進行印刷 之狀態，依下述判定： ◎:完全未辨認到異常 〇·辨認到稍有擦痕 x '·辨認到明確的痕跡 (3) 作為pi印刷板之綜合判定： ◎:適合於實用 〇：可實用 X:無法實用 [發明例1] 作成下述構造：上部支持基板為鐵製，其下面之板厚為 5mm ’並以將i5〇mm正方板接合之構造進行配置，其表面係 以平面機械研磨精度3/100mm以内進行了研磨。於上部支持 °97148908 16 200937142 基板之背面安裝水準調整螺絲，藉由旋轉主體上面之水準調 整螺絲可進行經高精度研磨的該基板面之平坦度調整。 又，係作成為於該上部支持基板面，於基板面内82〇刪χ 1070顏之内側以均一的間隔（約50丽間距）配置直徑imm的 孔’可藉由排氣風扇而進行真空吸附之構造。 另一方面，與上部支持基板相比小一圈之下部支持基板， 係使用具有活性光線透過性的1000 χ 1300mm尺寸、厚度 ❹19匪之汙式破璃，對單面進行平面研磨後以#4〇〇之鑽石研 磨粒打磨成均—而微細的粗糙面。將此玻璃豎立吊起所測量 之表面平坦度為3/100麵。 使經粗面化之此玻璃的表面朝上而載置於可保持四周的 裝置之支持框，進行四周之轉調整。然後，自活性光線燈 1使以此玻璃的中心為基準而於左右15〇mm的間隔配置 之具有半彳！ 2_的圓形之銷形狀了頁部，完全安置於輕輕地抵 Ο 接玻璃下面的位置。此時，自τ部支持基板玻璃之下面至燈 中〜的距離為80mm，此獅狀之平坦度調整棒係設置於設 於燈下之銷支持基板上’作成為藉由旋轉安裝於該基板之水 準調整螺絲而可上下移動之構造。卿狀之平坦度調整棒之 全高為180,自銷頂部至燈中心的8〇咖位置為止係使 用基部徑20mm粗的圓錐形者。 =後，將上賴製支持基板與下部支縣板，使用 精从準雷射系統（商品名，HAMARUSER公司製，美國）調 097148908 17 200937142 整平:L·度，將上部鐵製支持基板之下面往凹傾向調整 l/100mm，將下部支持基板表面往凹傾向調整2/ι〇〇_。 然後，於下部玻璃製支持基板上擠壓擴展液狀感光性樹脂 APR(註冊商標）K11(商品編號，旭化成化學品（股）製），將預 先裁切成既定尺寸之厚度約〇. 2mm之基底膜BF E〇6(商品編 號，旭化成化學品（股）製）疊合。然後，使上部鐵製支持基 板下降降至没置於下部玻璃支持基板之長度方向兩端部之 間隔物上，保持著支持基板間的間隙，自上部支持基板之真 空孔吸附基底薄膜背面使其與上部支持基板密接。 於保持上部支持基板與基底薄膜之密著性3〇秒之後，透 過下部支持基板之基板玻璃照射活性光線15〇秒，完成印刷 凸板層表面之形成與樹脂層本身之光硬化。再解除上部支禅 基板之真空，使上部支持基板上昇後，將下部支持基板玻璃 上之硬化樹脂與基底薄膜一起剝離取下，得到感光性樹脂板 片° 對得到之感光性樹脂板片之厚度以表示刻度1/1〇〇顏之 數位式度盤規測定，結果平均厚度為2. 84mm、最小值為 2.82mm、最大值為2.85mm。板内之偏差精度為3/1〇〇mm，於 醯亞胺配向膜之柔印印刷時，於下部支持基板之銷位置未見 到任何痕跡，為良好者。 [發明例2] 上部支持基板及下部支持基板皆使用19_厚之鈉玻璃， 097148908 18 200937142 對上部支持基板的下面與下部支持基板之玻璃的上面 ，分別 進行機械研削以取得表面精度後，用#4〇〇之鑽石研磨粒予 以磨擦以進行粗面化加工。分別將各玻璃豎立吊起測得之表 面平坦度係上部支持基板為2/1 〇〇_之凹傾向，下部支持基 板為3/lOOmm之凹傾向。於上部支持基板玻璃中之82〇_ χ 1070mm之位置施行寬2顏、深丨麵之基底薄膜吸附用溝之加 工’於真空溝框之相對向的角落2處設置2mm之貫穿孔作成 參真空排氣孔。將基底薄膜吸附用真空溝之内侧整體藉由#220 氧化鋁研磨粒進行輕度喷砂而予以粗面化。 將下部支持基板玻璃以與發明例1之相同方法、相同順序 女裝於曝光裝置之支持框，調整自該基板之下部之銷之抵 觸’用精密校準雷射系統確認為2/100mm之凹傾向。 以與發明例1相同之方法、相同順序將樹脂擠壓擴展並疊 合基底薄膜之後’使其下降至設置於下部支持基板玻璃上的 ❹長度方向兩端部之間隔物上，自上部支持基板玻璃之真空孔 吸附基底薄膜背面而與上支持基板密接。以與發明例1之相 同順序、相同條件進行基底薄膜吸附、曝光、感光性樹脂板 片之剝離。得到的板片之平均厚度為2. 84mm、最小值為 2· 82mm、最大值為2. 86mm與厚度之偏差精度為4/100mm， 為良好者’於配向臈之柔印印刷時，亦幾乎未辨識到平坦度 調整銷之痕跡，為良好者。 [發明例3] 097148908 19 200937142 將發明例1中所使用之π却±a 之下邛支持基板玻璃中使 180mm的頂部80mm高之部分 冋 丨刀取代+徑2咖的銷頂部改為 頂部4mm角錐（發明例3〜i、 7 1)、7削1角錐（發明例3、2)、10_ 角錐（發明例3-3)，作成Α ； 战為使其連結於直徑20mm棒基部的 形狀，以與發義1之相同方法、相_序調整平扭度，以 與發明例1之相同材料、相_序、相同條件進行感光性樹 脂板片之製板。進行整體之厚度精度與聚醯亞胺配向膜之柔 印印刷時之平坦度調整銷的痕跡評估，結果，除了 1〇_角 錐以外，於柔印之配向膜印刷中完全無法辨識出痕跡。又， 10賴角錐之痕跡亦輕微，為實用上可使用者。 [發明例4] 除了於發明例1中未使用下部支持基板之平坦度調整銷 以外，係全部使用相同方法、相同材料，以相同順序進行感 光性樹脂板月之製板。結果，板之厚度精度ΔΤ為6/100mm， 於PI配向膜印刷中’雖見到濃印邊緣變寬之傾向，但仍為 ❹ 可用於實用者。 [比較例1] 於發明例2中，除了與發明例4同樣地未使用下部支持基 板玻璃之平坦度調整銷之外，係用與發明例4相同方法、相 同順序、相同材料，所得到之感光性樹脂板片之厚度精度△ T為8/100mm ’於配向膜印刷中，有濃印邊緣部之邊際 (marginal)變大的問題。 097148908 20 200937142 [比較例2] 除了於發明例3中將下部支持基板玻璃之平坦度調整用 之鎖上部80mm之頂部形狀作成為15mni角（比較例2-1)、 20mm角柱（比較例2-2)，以與發明例1之相同方法、相同順 序調整平坦度，並以與發明例1之相同順序、相同條件進行 感光性樹脂板片之製板。其結果示於另表，得知其雖然厚度 精度ΔΤ良好，但於銷位置可見到些許擦痕，於實用上有問 ❹題。 [表1 ][Technical Field] The present invention relates to a manufacturing apparatus for a photosensitive resin sheet for a flexible printed board which can form an alignment film having a uniform film thickness on an electrode forming surface of a liquid crystal display element substrate. And manufacturing methods. [Prior Art] Flexible (flexo) printing plates are used in the packaging and packaging fields of corrugated paper, paper, paper bags and soft enamel packaging, or in the field of sealing, sealing, finishing, etc. Printing of various printed materials such as markings in electronic parts and the like. The main reason for this is that the flexible printed board is characterized by being soft and elastic, and comes from a simple printing principle in which the ink carried on the convex portion is directly transferred, so that the ink itself is simple and easy to have a high concentration. It can be printed on a wide range of materials to be printed. The flexible sheet is characterized by being soft and elastic, and is usually made of a rubber-elastic material such as a rubber sheet or a photosensitive resin sheet. Recently, it has been widely used for the high reproduction accuracy of printing quality. An active light curing type UV curing type photosensitive resin is used. The ϋν-curable photosensitive tree 曰 曰 曰 使用 使用 使用 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可It is a liquid state before the irradiation; or a sheet having a thermoplastic polymer disclosed at a normal temperature as disclosed in Japanese Laid-Open Patent Publication No. Hei 55-48744, No. Hei. 097148908 200937142 These photosensitive resins which are in a liquid or solid state at normal temperature are used in a manner in which the characteristics are utilized. That is, the liquid resin must be useful for forming a sheet-like device during printing, but the unhardened portion after UV irradiation can be recycled and reused, and can be produced by a device for producing a printing plate of a desired thickness. High productivity and other characteristics. On the other hand, since the solid photosensitive resin material is sold in the form of a sheet, it is not only required to be used for molding processing equipment such as a liquid photosensitive resin, but also by a resin manufacturer. Since the device is manufactured, the plate thickness is high in precision, and it is possible to use only the characteristics of the simpleness of each type of photosensitive resin required in accordance with the required size. In order to use such a photosensitive resin as a flexible printed board, in addition to requiring high resolution reproducibility of a printed pattern, in order to suppress the amount of printing variation at the time of printing, a resin which can perform kiss-touch printing can be performed. The rubber knee hardness must be Hs (A) 30 ° to 65 ° softness ' and must be a high precision printing plate. As described above, the liquid photosensitive resin is subjected to a sheet processing which satisfies the thickness precision of the printing plate and a curing treatment by irradiation with active rays. In other words, in the plate making apparatus for a liquid photosensitive resin, sheet forming and photoforming are necessary, and a device which is integrated by a series of processing steps is usually used. Therefore, as a substrate for performing sheet forming and photoforming, a float glass which is excellent in active light transmittance and excellent in mechanical rigidity, or a fin glass which is excellent in heat and high UV permeability is used. Pyrex glass. In the larger printed board 097148908 4 200937142, various techniques have been developed for the flexural deflection reduction strategy of the supporting substrate and the hardening characteristics of the resin. For example, when selecting a transparent light-transmitting transparent substrate used in a molding apparatus, in order to minimize the deflection due to its own weight, the thickness of the glass substrate is set to 20 mm or more, or the glass is specially polished. The degree of deflection achieved is such that the surface flatness of the substrate can be satisfied in the state of being mounted on the forming device. As a result, there is a problem that an expensive substrate is required, and the equipment cost of the plate-making apparatus is also increased. In addition, as a method of improving the heat of reaction of the photosensitive resin in photohardening and the thermal expansion of the transparent substrate caused by the lamp heat of the active light, Japanese Patent Laid-Open No. 11 which makes the glass concave is known. Japanese Patent Publication No. Hei. No. Hei. No. Hei. No. 2007-279325, the disclosure of which is incorporated herein by reference. In particular, in the alignment film printing of the liquid crystal field of the present invention, it is also possible to see that the substance produced from the photosensitive resin sheet itself causes a problem in that the performance of the alignment film is lowered. Therefore, it is preferred to use an unreacted substance after UV curing. That is, a printing plate made of a liquid photosensitive resin which is less in addition to a softening agent or a plasticizer which does not participate in photopolymerization, and which has excellent solvent resistance of the obtained polymer. Furthermore, it is required that the printing plate be larger in size than the printing and marking printing of the packaging material, and have higher precision and higher precision than the coating film thickness. However, as described above, in the large-scale plate-making apparatus using the conventional technique, there is a limit in order to satisfy the flatness of the transparent substrate glass itself, and in practice, 097148908 5 200937142 is connected to a plurality of printing plates and the like in response to a large-sized printing plate. Therefore, there is a limitation in the chamfering of the liquid crystal alignment film printing, and there is a decrease in the thickness precision of the board due to the printing plate, or a decrease in the printing life due to insufficient durability of the resin joint portion, and the like. A major obstacle to the enlargement of alignment film printing. In the inventors of the present invention, Japanese Patent Laid-Open Publication No. 2007-201693 (not disclosed) has proposed a photosensitive resin printing comprising a flexible printing plate having a surface roughness (5) of a printing surface. However, the development of a preferred manufacturing apparatus and manufacturing method of the flexible board is still a subject. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document 5] Japanese Patent Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document 8] Japanese Patent Application No. 2007-201693 (Unpublished) [Problem to be Solved by the Invention] An object of the present invention is to provide a high-precision film-printable liquid crystal which requires pinhole-free In the printing plate for an alignment film, a photosensitive resin printing 097148908 6 200937142 manufacturing apparatus and a manufacturing method of a photosensitive plate such as a flexible printing plate can be stably performed with high plate precision even in a large plate size. (Means for Solving the Problem) The inventors of the present invention deliberately conducted research on the above-mentioned problems, and as a result, achieved the invention. In other words, the present invention is as follows: (1) A device for producing a photosensitive resin sheet, wherein two or more of the support substrates are disposed to face each other with a gap between the upper and lower support substrates, and at least one of the support substrates a transparent substrate that can penetrate the active light, wherein the inner surface of either of the transparent substrates is roughened, the liquid photosensitive resin is brought into contact with the rough surface, and the active light is irradiated through the transparent substrate, thereby The liquid photosensitive resin is cured; and is characterized in that it has a gap adjusting mechanism that moves both or one of the upper and lower support substrates up and down to adjust the gap. (2) The apparatus for producing a photosensitive resin sheet according to (1), wherein the inner surface of the support substrate facing the upper and lower sides has an adsorption structure. (3) The apparatus for manufacturing a photosensitive resin sheet according to (1) or (2), wherein the gap adjusting mechanism of the support substrate that faces up and down is described in the width direction of the greedy side and A mechanism that moves up and down at intervals of 100 mm or more and 500 mm or less in the longitudinal direction. (4) The apparatus for manufacturing a photosensitive resin sheet according to any one of (1) to (3), wherein the gap adjusting mechanism of the support substrate that faces the upper and lower sides is up and down from the back side of the support substrate The flatness adjustment width of the movement is one leg or more, and the adjustment precision is 0.01 coffee (1 or less. (5) The manufacturing apparatus of the photosensitive resin sheet of any one of (1) to (4), 097148908 200937142 In the gap adjusting mechanism of the support substrate that faces up and down, the support body of the rod structure pushes the back surface of the lower transparent support substrate upward, and the area of the contact surface with the transparent support substrate is 100 mm 2 or less. (6) A method for producing a photosensitive resin sheet, which is produced by using the production apparatus according to any one of (1) to (5). (Effect of the Invention) According to the present invention, a large-sized transparent support substrate can be adjusted Flatness, and the gap control between the two supporting substrates that have not been achieved so far can be achieved. Therefore, it is possible to stably produce a large-sized liquid crystal alignment film printing plate with excellent sheet thickness precision, and a larger liquid. The production of the crystal display substrate is also advantageous in terms of the degree of freedom and the number of acquisitions from the previous liquid crystal display substrate, and can be greatly contributed to the productivity. [Embodiment] The composition of the present invention is as shown in FIG. The photosensitive resin 12 and the base film 13 are sequentially laminated on the lower transparent support substrate 1 having the roughened surface 11 thereon, and the opaque substrate 14 having the vacuum hole 15 is held on the spacer 18 thereon. And forming a gap between the upper and lower support substrates, that is, the thickness of the photosensitive resin sheet. Further, after the lower transparent support substrate is firmly placed in the device frame, the entire upper surface of the transparent support substrate is obtained substantially horizontally, and then mounted. The flatness adjustment pin 16 of the pin substrate 19 on the lower side of the substrate is adjusted in advance to a position that is lightly opposed to the substrate. 097148908 200937142 The flatness of each support substrate can be adjusted by using a flatness adjustment method of the laser. After the reference block height is determined by placing the reference block at the end of the transparent support substrate, the block is sequentially replaced at the position with the flatness adjustment pin. The flatness adjustment pin is raised and lowered to the reference height of each of the laser light to adjust to the target height. On the other hand, in the invention of the present invention, the upper support substrate is made of metal, and the flatness of the lower surface of the substrate is mechanically ground. After obtaining the overall flatness, the flatness correction caused by the deflection of Φ due to its own weight is used by the flatness adjusting screw 21' disposed on the flatness adjusting screw substrate of the upper support substrate. The fineness adjustment method of the laser or the like performs fine adjustment of the flatness with higher precision. In this manner, the resin 12 and the base film 13 disposed between the support substrates and the base film 13 are placed on the base film. The vacuum hole 15 on the upper surface of the support substrate causes the back surface of the base film to be adhered to the inside, and is formed in a high-precision gap formed by the upper and lower support substrates, and then the active light lamp 17 is passed through the lower transparent support substrate. a photosensitive resin sheet capable of producing excellent thickness precision by hardening treatment, that is, the present invention relates to a device and use thereof A method for producing a photosensitive resin sheet of a device, which is a method for molding and exposing a photosensitive resin by using a gap between upper and lower support substrates, wherein a gap is formed by using both of the upper and lower support substrates or at least one of the substrates. The substrate having a structure with adjustable flatness controls the gap between the upper and lower support substrates. 097148908 9 200937142 Hereinafter, the present invention will be described in more detail. The support substrate used in the present invention refers to a substrate which is not restricted by other forces during molding and exposure. The substrate which is disposed in a free state with respect to the spacer is so-called transparent or opaque means a UV-Α region belonging to ultraviolet rays. The presence or absence of penetration of active light, and a substrate having a transmittance of 5% or more [jy_A transmittance] is referred to as a transparent substrate. The UV-Α transmittance can be defined by a rate of change of ultraviolet ray illuminance measured by a commercially available ultraviolet illuminometer, for example, UV-302A (trade name, manufactured by 〇RC), before and after the passage of ultraviolet rays. Further, the support substrate used in the present invention is a glass transparent substrate which is used for forming and exposing a printing plate using a photosensitive resin as disclosed in Japanese Laid-Open Patent Publication No. Hei. No. 2007-279325 or Japanese Patent Publication No. Hei 4-7552. In the example in which the upper and lower sheets are formed of a transparent support substrate by irradiating the active light rays from both sides of the back surface and the relief surface, the photosensitive resin can be formed only by the exposure treatment on the convex sheet surface. In the exposure apparatus, an opaque support substrate is usually used for the back substrate. At this time, the gap of the two supporting substrates can be set by a block of a predetermined thickness (hereinafter also referred to as a spacer) disposed on the upper or lower support substrate surface, and the thickness of the spacer is changed according to the desired thickness of the target to form a plate. As a method of setting a gap between two supporting substrates, a spacer is provided on either or both sides of the opposite substrate, or the outer side of the lower supporting substrate is higher than the surface of the supporting substrate, and is supported on the upper surface. A method of setting a spacer height structure, such as a method of setting a desired target gap when the substrate is placed on the spacer. 097148908 10 200937142 In the support substrates, glass is used as a transparent support substrate in terms of active light transmittance, rigidity of the material, and durability. However, acrylic resin, polycarbonate resin, polyester resin, or the like may be used. Plastic material. Further, as the opaque support substrate, a metal material such as iron or sinter is usually used in terms of workability, rigidity, and the like. The transparent support substrate for producing the photosensitive resin sheet of the present invention is characterized in that the roughening of the convex surface and the excellent thickness precision can be simultaneously formed by light forming to obtain the surface of the target printing convex surface. The surface of the substrate is roughened in a uniform manner in advance, and the roughened mold of the transparent support substrate is prepared by a known manufacturing method such as sand blasting or rubbing. In the method of producing the photosensitive resin sheet of the present invention, a liquid photosensitive resin can be used, and the photosensitivity disclosed in, for example, JP-A-52-90304 and JP-A-2003-156837, etc., can be used. Resin. A photosensitive resin sheet produced by using such a photosensitive resin is used as a support by a polyester film or sheet having excellent dimensional stability and mechanical properties, and is used to connect the photosensitive resin to the film or sheet. The substrate on which the treatment or the like is performed is previously performed on the side. In the upper and lower support substrates used in the device of the present month, the flatness of the surface which is the opposite surface is preferably obtained at the time of substrate production. That is, it is preferable that the flatness under the condition that the deflection due to its own weight does not occur, that is, the basis = the surface is in a suspended state or the flatness accuracy on the pedestal is within 5/m. , preferably 3 / just inside the job 'with no local bumps. This is equivalent to the suspension 097148908 11 200937142 in the hanging state or the flatness accuracy on the susceptor. The metal material can of course be obtained by a usual mechanical grinding method or the like. In the case of the transparent glass substrate used in the present invention, a conventional glass can also be used. The grinding method of the material is obtained. In the case where the adjustable gap structure of the present invention is provided on two devices of the two supporting substrates, since the flatness of the respective supporting substrate faces can be adjusted, the gap between the two supporting substrates can satisfy the better precision. . Further, when the upper or lower support substrate is deformed by the active light or the heat during curing of the resin, the state of the photosensitive resin sheet can be read and corrected, so that high precision and stability can be produced. The photosensitive resin sheet is extremely effective. The flatness adjustment of the upper and lower support substrates can be adjusted by the level adjustment screws arranged in the respective substrates. Figure i shows the two pieces supported on the top and bottom. An example of the flatness adjustment structure of the substrate, and FIG. 2 is an example of a flatness adjustment structure disposed on the lower side of the lower transparent support substrate. The flat twist adjustment structure is disposed in the support substrate at intervals of less than 5 inches, and is provided with a structure that can be vertically moved up and down, and the vertical movement is rotatably mounted on the level adjustment screw of the portion. The upward shift amount may be an adjustment amount of 1.0 mm or more with respect to the reference, and the level adjustment accuracy is preferably 0.01_ or less, and more preferably adjusted for higher precision. The flatness adjustment structure is configured to be easier to adjust if it is arranged at equal intervals. If the density is higher, there is a high cost of non-relocation, and the adjustment is also time-consuming. 097148908 12 200937142 ❿ Adjust the front end of the leveling adjustment screw of the flatness adjustment structure, that is, when it is located on the 2 holding board, it is installed between the leveling adjustment screws on the upper part of the branch plate to make the level adjustment screw rotate to perform Supports the flatness of the substrate surface to be adjusted up and down. On the other hand, in the case of the transparent support substrate disposed on the lower side, the front end of the level adjusting screw is formed as a pin structure having a shape protruding from the lower side of the lower supporting substrate, and the deflection of the lower transparent substrate is caused by the deflection of its own weight. 'You can use the level of the adjustment screw to make the pin end up and down and adjust the 'leveling adjustment screw that can be used in the upper support board'. It can be used in the standard parts of FA machinery (meehanieal). The level adjustment screw, level adjustment nut, locknut (locknut) combination. In the above-mentioned photosensitive resin sheet-forming invention and the photosensitive resin sheet sheet of the present invention, "mostly, the convex plate surface is provided on the lower transparent support substrate side" will be referred to as a base substrate. An example of the upper support substrate side. In this case, the liquid resin is formed by a method of molding a liquid photosensitive resin, and the resin is extruded and expanded, and the substrate is thinned and laminated to form a highly convenient liquid resin molding method. Since the pin for adjusting the flatness of the lower transparent substrate in the present invention is directly in contact with the transparent support substrate, the pin shape becomes a shadow of the active light, and the active light distribution accuracy is poor on the printed convex plate surface. influences. Therefore, the inventors of the present invention conducted intensive studies on the shape of the pin top holding surface and the influence of the printing convex plate which are necessary for the flatness adjustment, and found that if the size of the substrate contact surface is 〇〇 〇〇 mm 2 or less, 097148908 13 200937142 Then, the flat acoustic adjustment of the photosensitive resin sheet forming apparatus of the present invention can be carried out without forming the convex surface of the printing sheet, thereby achieving the H surface of the present invention, and the contact surface of the pin for supporting the glass of the transparent substrate from below. It may be a point, but in order to prevent scratches and stability of the glass surface, it is preferable that the shape of the front end is a spherical shape having a radius of not less than 2 mm, or a radius of 2 mm or more, or the addition of the convex plate is not hindered. A cushioning material such as a flexible material of a size. As a method of adjusting the flatness of the surface of the upper and lower support substrates, a known method using laser or the like can be used. As a method of adjusting the flatness by using a laser, for example, a "precision calibration laser system" (trade name, manufactured by HAMAR LASER, USA) using a visible light diode laser is used. These measuring systems are composed of a laser emitting and receiving device, and are arranged on the same surface with a laser emitting palm and one or more light receiving portions, based on the laser light history from the transmitting device. The level 'the operation of the flatness adjusting screw causes the respective light receiving portions to move up and down, thereby adjusting the level of the upper and lower support substrates. The special transmitting device and the receiving device are mounted by magnetic force, and if the upper supporting substrate is made of metal, the magnetic field can be attached to the lower side surface by the magnetic force, and the light receiving device can be sequentially moved after the adjustment of each measurement site is completed. Flatness adjustment of the overall surface. Further, the measurement accuracy in the measurement of the plane in the laser system is 0.0025_ to 0.001 mm, which is a sufficient detection accuracy as the flatness adjustment of the present invention. Even if it is a flatness adjustment structure which is only one side of the upper and lower support substrates, 097148908 200937142 can obtain a photosensitive resin sheet having high thickness precision which has not been obtained so far. In other words, the flatness adjustment mechanism of the present invention is adjusted upward and downward, and the flatness adjustment of the planar state of the support substrate that follows the opposing direction is compared with the case where the upper and lower support substrates are provided as described above. Although it is time-consuming to adjust, compared with the conventional method which does not have an adjustment structure, it can achieve the board|substrate of the photosensitive resin with the precision precision of high precision. The method for producing a photosensitive resin sheet according to the present invention is to directly press the photosensitive resin 12 having a predetermined thickness on the surface of the roughened lower transparent support substrate 10 in which the flatness is adjusted in advance, and then to expose the substrate. The film 13 is superposed thereon. The resin and the base film are integrally formed into a sheet shape, and the upper support substrate 14 is lowered in advance to adjust the flatness, and the end surface is held on the spacer 18. Thereafter, the base film is adsorbed by the vacuum hole 15 provided in the upper support substrate, and is adhered to the upper support substrate. The active light beam 17 is irradiated through the lower transparent support substrate to perform photocuring of the photosensitive resin. After the end of the irradiation, the photosensitive resin sheet which has been light-hardened is peeled off from the surface of the lower transparent substrate together with the base film to complete the production of the photosensitive resin sheet. The photosensitive resin sheet obtained in this manner is thicker or thinner than the conventional method in which the gap between the upper and lower supporting substrates is not controlled, and can be stably manufactured with a thickness of 4 different thicknesses. [Examples] The present invention will be described based on examples. Further, the thickness accuracy in the inventive examples and the comparative examples and the influence on the printed convex plate surface are as follows: (1) Thickness accuracy ΔΤ: for a range of 800×1050 mm, at intervals of 5 〇 λ, γ represents a minimum scale The i/i〇〇mn^dial gauge measures the grid point Μ to indicate the difference between its maximum and minimum values. From the aspect of printing in the case of the alignment film printing, the thickness accuracy Δτ is evaluated as follows: ◎ : 4/1 〇〇mm or less 〇: 5/100 mm 〜 6/l 〇〇 mm x : 7/ 100mm or more (2) Effect on printing convex plate: Printing with polyimide-based (called ρι) ink with kiss-touch, for printing in a state without scratches and mottledness, Judgment: ◎: Abnormality is not recognized at all 〇· Identifying a slight scratch x '· Identifying a clear trace (3) As a comprehensive judgment of the pi printing plate: ◎: Suitable for practical use: Practical X: Unusable [Inventive Example 1] The upper support substrate was made of iron, and the thickness of the lower support plate was 5 mm' and was arranged in a structure in which i5 〇 mm square plates were joined, and the surface thereof was planar mechanical polishing precision of 3/100 mm. Grinding was carried out inside. Supporting the upper part °97148908 16 200937142 The leveling screw is mounted on the back of the base plate. The flatness adjustment of the surface of the substrate can be performed by high-precision grinding by rotating the leveling screw on the main body. Further, the upper support substrate surface is formed so that the hole having the diameter imm at a uniform interval (about 50 angstroms) inside the substrate surface 82 can be vacuum-adsorbed by the exhaust fan. Construction. On the other hand, a lower support substrate is used in a lower circle than the upper support substrate, and a 1000 χ 1300 mm size and a thickness of 匪19 具有 having a reactive light transmittance are used, and the single surface is polished to #4. The diamond abrasive grains of the enamel are polished to a uniform-fine surface. The surface flatness measured by erecting the glass was 3/100. The surface of the roughened glass is placed upside down and placed on the support frame of the device that can be held around, and the four-way rotation adjustment is performed. Then, the active light lamp 1 has a half turn at an interval of 15 mm from the center of the glass based on the center of the glass. The 2_ round pin shapes the page and is completely placed in a position that gently abuts against the glass. At this time, the distance from the lower side of the τ portion supporting substrate glass to the light in the lamp is 80 mm, and the lion-like flatness adjusting rod is disposed on the pin supporting substrate provided under the lamp as being mounted on the substrate by rotation The structure of adjusting the screw to move up and down. The flatness of the flatness adjustment bar is 180, and the conical shape with a base diameter of 20 mm is used from the top of the pin to the 8 〇 coffee position in the center of the lamp. After the support substrate and the lower branch plate are used, the fine-precision laser system (trade name, manufactured by HAMARUSER, USA) is used to adjust 097148908 17 200937142 Leveling: L·degree, the upper iron support substrate Next, the concave tendency is adjusted by l/100 mm, and the lower support substrate surface is adjusted to a concave tendency by 2/ι〇〇_. Then, the expanded liquid photosensitive resin APR (registered trademark) K11 (product number, manufactured by Asahi Kasei Chemicals Co., Ltd.) was extruded on the lower glass support substrate, and the thickness was previously cut to a predetermined size of about 〇. 2 mm. The base film BF E〇6 (product number, manufactured by Asahi Kasei Chemicals Co., Ltd.) was laminated. Then, the upper iron support substrate is lowered to a spacer which is not placed at both end portions in the longitudinal direction of the lower glass support substrate, and a gap between the support substrates is held, and the back surface of the base film is adsorbed from the vacuum hole of the upper support substrate. It is in close contact with the upper support substrate. After maintaining the adhesion between the upper support substrate and the base film for 3 seconds, the substrate light passing through the lower support substrate was irradiated with the active light for 15 seconds to complete the formation of the surface of the printed convex plate layer and the photohardening of the resin layer itself. After the vacuum of the upper zen substrate is removed and the upper support substrate is raised, the cured resin on the lower support substrate glass is peeled off together with the base film to obtain a photosensitive resin sheet. The average thickness was 2.84 mm, the minimum value was 2.82 mm, and the maximum value was 2.85 mm, as measured by a digital gauge having a scale of 1/1 〇〇. The deviation accuracy in the plate is 3/1 〇〇 mm. When flexographic printing on the yttrium immissive film, no trace is found on the pin position of the lower support substrate, which is good. [Inventive Example 2] The upper support substrate and the lower support substrate were both 19-thick soda glass, 097148908 18 200937142, and the upper surface of the upper support substrate and the upper support glass were mechanically ground to obtain surface precision, and then used. The #4〇〇 diamond abrasive grain is rubbed for roughening. The surface flatness measured by erecting each glass upright is a concave tendency of the upper support substrate of 2/1 〇〇_, and the lower support substrate is a concave tendency of 3/100 mm. In the upper support substrate glass, the position of 82 〇 χ 1070 mm is applied to the processing of the base film adsorption groove of the wide 2 face and the deep 丨 surface. A 2 mm through hole is formed at the opposite corner 2 of the vacuum groove frame to form a vacuum. Vent. The inside of the vacuum film for the base film adsorption was roughened by light sand blasting with #220 alumina abrasive grains. The lower support substrate glass was attached to the support frame of the exposure apparatus in the same manner as in the first embodiment, and the adjustment of the pin from the lower portion of the substrate was confirmed to be a concave tendency of 2/100 mm by the precision calibration laser system. . The resin was extruded and expanded in the same manner as in Inventive Example 1 and laminated, and then the substrate film was lowered to be placed on the spacers at both end portions in the longitudinal direction of the lower support substrate glass, from the upper support substrate. The vacuum hole of the glass adsorbs the back surface of the base film and is in close contact with the upper support substrate. The base film was adsorbed, exposed, and peeled off from the photosensitive resin sheet in the same order and in the same manner as in Inventive Example 1. The average thickness of the obtained sheet is 2.84 mm, the minimum value is 2·82 mm, and the maximum value is 2.86 mm and the thickness deviation accuracy is 4/100 mm, which is also good for the flexo printing of the alignment. The trace of the flatness adjustment pin is not recognized, which is good. [Inventive Example 3] 097148908 19 200937142 In the π but ±a lower 邛 support substrate glass used in Invention Example 1, the top of the 180 mm high part of the knives of 180 mm was replaced by the top of the pin of the + diameter 2 coffee to the top 4 mm. The pyramid (inventive examples 3 to i, 7 1), 7-cut 1 pyramid (invention examples 3 and 2), and 10_ pyramid (invention example 3-3) were prepared as Α; the war was made to be connected to the shape of the base of the diameter of 20 mm, The flatness of the flatness was adjusted in the same manner as in the first embodiment, and the photosensitive resin sheet was formed in the same material, phase, and conditions as in the first embodiment. The thickness accuracy of the whole and the evaluation of the flatness adjustment pin of the polyimide film of the polyimide film were evaluated, and as a result, in addition to the 1〇_corner, the trace was not recognized at all in the alignment film printing of the flexographic printing. Moreover, the traces of the 10 diagonal cones are also slight, which is practical for the user. [Inventive Example 4] The same method and the same material were used except that the flatness adjusting pin of the lower supporting substrate was not used in the first embodiment, and the photosensitive resin sheet was formed in the same order. As a result, the thickness precision ΔΤ of the sheet was 6/100 mm, and in the PI alignment film printing, although the tendency of the thick edge to be widened was observed, it was still 实用 useful for practical use. [Comparative Example 1] In the second embodiment, the same method, the same procedure, and the same materials as in the inventive example 4 were used except that the flatness adjusting pin of the lower supporting substrate glass was not used in the same manner as in the fourth invention. The thickness precision ΔT of the photosensitive resin sheet is 8/100 mm. In the alignment film printing, there is a problem that the margin of the thick edge portion becomes large. 097148908 20 200937142 [Comparative Example 2] In the invention example 3, the top shape of the upper 80 mm of the lock for adjusting the flatness of the lower support substrate glass was set to a 15 nmi angle (Comparative Example 2-1) and a 20 mm angle column (Comparative Example 2) 2) The flatness was adjusted in the same manner and in the same manner as in Inventive Example 1, and the photosensitive resin sheet was formed in the same order and in the same manner as in Inventive Example 1. The results are shown in the table, and it is found that although the thickness precision ΔΤ is good, a slight scratch is observed at the pin position, which is practically problematic. [Table 1 ]
發明例1 平坦度調整銷條件 板厚精度 配向膜印刷性評估 综合評估 上部支 持基板 下部支 持基板 下部基板 銷形狀 厚度偏差 濃印邊緣 部評估 調整銷 痕跡 有 有 4刪球 3/100 ◎ ◎ ◎ 發明例2 無 有 4mm球 4/100 ◎ ◎ ◎ 發明例3-1 發明例ϋ 無 - . 有 4mm角錐 4/100 ◎ ◎ ◎ 無 有 7mm角錐 4/100 ◎ ◎ ◎ 發明例3-3 _發明例4 比^例1 比較例2-1 無 ---—, 有 10晒 角錐 4/100 ◎ 〇 〇 有 無 一 6/100 〇 ◎ 〇 無 r~ ,J 無 無 一 8/100 X ◎ X 有 15mm 角雜 4/100 ◎ X X 比較例2-2 ----— 無 ---- _ 有 20mm 角柱 4/100 ◎ X X (產業上之可利用性） 本發明係關於可於液晶顯示元件基板之電極形成面上形 成均一膜厚的配向膜之可撓性印刷用感光性樹脂板片之製 造裝置及製造方法，可依高厚度精度安定且廉價地製造適合 於朝大型化發展之液晶顯示元件之量產、且無接縫的大型液 097148908 21 200937142 晶配向膜印刷板。藉此，迄今所無法製造的大型尺寸之顯示 元件的製造成為可能，並且可有效率地量產品質安定之液晶 顯示元件。 【圖式簡單說明】 圖1為表示本發明之裝置的整體構成之圖。 圖2為表示本發明之下部支持基板的平坦度調整銷之圖。 【主要元件符號說明】 10 下部透明支持基板 11 經粗化之表面 12 感光性樹脂 13 基底薄膜 14 上部支持基板 15 真空孔 16 平坦度調整銷（下部支持基板用） 17 活性光線燈 18 間隔物 19 平坦度調整插針基板 21 平坦度調整螺絲（上部支持基板用） 22 平坦度調整螺絲（下部支持基板用） 097148908 22Inventive Example 1 Flatness Adjustment Pin Condition Thickness Accuracy Alignment Film Printability Evaluation Comprehensive Evaluation Upper Support Substrate Lower Support Substrate Lower Substrate Pin Shape Thickness Deviation Thick Edge Edge Evaluation Adjustment Pin Trace There are 4 cut balls 3/100 ◎ ◎ ◎ Invention Example 2 No 4 mm ball 4/100 ◎ ◎ ◎ Inventive Example 3-1 Inventive Example ϋ No - . 4 mm pyramid 4/100 ◎ ◎ ◎ No 7 mm pyramid 4/100 ◎ ◎ ◎ Inventive Example 3-3 _Inventive Example 4 ratio ^ example 1 comparison example 2-1 no----, there are 10 sunshade cones 4/100 ◎ 〇〇 there is no one 6/100 〇 ◎ no r~, J no one 8/100 X ◎ X has 15mm角杂4/100 ◎ XX Comparative Example 2-2 ----- No---- _ 20mm Corner column 4/100 ◎ XX (Industrial Applicability) The present invention relates to a liquid crystal display element substrate A manufacturing apparatus and a manufacturing method of a photosensitive resin sheet for flexible printing in which an alignment film having a uniform film thickness is formed on an electrode forming surface, and a liquid crystal display element suitable for a large-scale development can be manufactured stably and inexpensively with high thickness precision. Mass production, seamless seamless liquid 097148908 21 2009371 42 crystal matching film printing plate. Thereby, it is possible to manufacture a large-sized display element which has hitherto been impossible to manufacture, and it is possible to efficiently measure a liquid crystal display element of a stable product quality. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the overall configuration of a device of the present invention. Fig. 2 is a view showing a flatness adjustment pin of a lower support substrate of the present invention. [Description of main component symbols] 10 Lower transparent support substrate 11 roughened surface 12 Photosensitive resin 13 Base film 14 Upper support substrate 15 Vacuum hole 16 Flatness adjustment pin (for lower support substrate) 17 Reactive light lamp 18 Spacer 19 Flatness adjustment pin base plate 21 Flatness adjustment screw (for upper support base) 22 Flatness adjustment screw (for lower support base) 097148908 22