200936291 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種藉由對脆性材料基板掃描雷射光束 進行加熱接著再予以冷卻，藉此斷開基板的雷射加工裝置 及雷射加工方法。 本發明中所稱之「脆性材料基板」，除了玻璃基板以 外’亦包含石英、單晶矽、藍寶石、半導體晶圓、及陶瓷 等之基板。又，亦包含LCD用基板等貼合基板。以下，主 要雖使用玻璃基板作說明，不過其他脆性材料基板亦同樣。 【先前技術】 當對玻璃等脆性材料基板（以下，稱為「基板」），一邊 進行雷射光束掃描一邊以低於基板軟化之溫度加熱時，在 加熱區域會產生壓縮應力。再者，藉由在雷射光束照射之 後方吹送冷媒加以冷卻，在冷卻區域即產生伸張應力。以 此方式’藉由接近產生壓縮應力之區域以形成產生伸張應 力之區域便可形成應力梯度。近年來，已利用此應力梯度 以斷開玻璃基板之加工技術。 使用雷射之斷開加工，有劃線加工與全切加工兩種。 劃線加工係指藉由先進行雷射光束之加熱，再從後方藉由 冷媒喷射進行冷卻，以在基板内部形成加熱區域（壓縮應力 區域）、及在基板表面形成冷卻區域（伸張應力區域）而產生 深度方向之應力差，藉此形成未到達基板背面之深度（例如 板厚之10〜20%左右之深度）之裂痕（劃線）的加工。 200936291 =加工時，在形成劃線後，藉由進行例如沿劃線按 壓裂斷杯以施加弯折力距之裂斷處理即可斷開基板。 另一方面，全切加工係指形成從基板表面到達基板背 面之裂痕的加卫’無須進行裂斷處理即可斷開基板的加工 i參照專利文獻1、專利文獻2)。全切加工係藉由前方之加 ，、、區域(壓縮應力區域)與後方之冷卻區域(伸張應力區域)所 產生之前後方向的應力差，使基板後方較前方更往左右方 向裂開之力產生作用，藉此完全斷開基板的加工。 選擇劃線加工或全切加工，雖取決於加熱條件（照射時 間、照射功率、及掃描速度等）或冷卻條件（冷媒溫度、吹送 量、及吹送位置等)等加工條件，但亦取決於裝載被加工基 板之載台面與玻璃基板的接觸狀態。 ’、即’-般而言，於全切加工時，雖藉由基板後方較 前方更往左右方向裂開之力(斷開力)產生作用以完全斷開 基板’但在基板與載台面直接接觸之情況下，於玻璃基板200936291 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a laser processing apparatus and a laser processing method for heating a brittle material substrate by scanning a laser beam and then cooling it, thereby breaking the substrate . The "brittle material substrate" referred to in the present invention includes a substrate such as quartz, single crystal germanium, sapphire, semiconductor wafer, or ceramic, in addition to the glass substrate. Further, a bonded substrate such as a substrate for LCD is also included. Hereinafter, the glass substrate is mainly used for explanation, but the other brittle material substrates are also the same. [Prior Art] When a brittle material substrate such as glass (hereinafter referred to as "substrate") is heated while being irradiated with a laser beam at a temperature lower than the softening of the substrate, a compressive stress is generated in the heating region. Further, by blowing the refrigerant after the laser beam is irradiated and cooled, a tensile stress is generated in the cooling region. In this way, a stress gradient can be formed by approaching a region where compressive stress is generated to form a region where a tensile stress is generated. In recent years, this stress gradient has been utilized to break the processing technology of glass substrates. The use of laser breaking processing, there are two kinds of scribing processing and full cutting processing. The scribing process refers to cooling by a laser beam and cooling by a refrigerant jet from the rear to form a heating region (compressive stress region) inside the substrate and a cooling region (extension stress region) on the substrate surface. On the other hand, a stress difference in the depth direction is generated, thereby forming a crack (dash) which does not reach the depth of the back surface of the substrate (for example, a depth of about 10 to 20% of the thickness). 200936291 = At the time of processing, after forming the scribe line, the substrate can be broken by performing, for example, a cleavage of the broken cup along the scribe line to apply a bending force. On the other hand, the full-cut processing refers to the process of forming a crack from the surface of the substrate to the back surface of the substrate. The processing for breaking the substrate without performing the cracking process is referred to Patent Document 1 and Patent Document 2). The full-cutting process is a force that causes the rear of the substrate to be split in the left-right direction from the front side by the stress difference between the front and the rear (the compressive stress region) and the rear cooling region (the tensile stress region). This produces an effect whereby the processing of the substrate is completely broken. Selecting the scribing process or the full-cutting process depends on the processing conditions such as heating conditions (irradiation time, irradiation power, scanning speed, etc.) or cooling conditions (refrigerant temperature, blowing amount, and blowing position), but also depends on loading. The contact state between the stage surface of the substrate to be processed and the glass substrate. ', that is, in general, during the full-cutting process, the force (breaking force) that is split in the left-right direction from the front of the substrate acts to completely disconnect the substrate, but directly on the substrate and the stage. In the case of contact, on a glass substrate
與載台面之間，藉由與該_力抗衡之摩擦阻力的作用， 斷開力會因摩擦阻力而抵銷，其結果並無法成為全切加工 而卻變成劃線加工。 因此’在進行全切加工日寺，如專利文獻i、專利文獻2 所揭示’係使基板從载台面浮起以進行加工，以抑制摩擦 阻力。藉由以此種全切加工來斷開基板，即無需裂斷步驟。 專利文獻1 .日本專利第3887394號公報 專利文獻2 :日本特開2007 — 90860號公報 7 200936291 【發明内容】 圖15係係表示藉由全切加工逐步斷開基板〇之緣材 分G1時之變化。 此處’係將基板G之中央部分G0固定於未圖示之載 台’並使緣側部分G1浮起於載台而成非接觸狀態。 全切加工，如圖15(a)所示，係從基板G之斷開開始端 朝向相反側之斷開結束端相對移動具有雷射光束之光束點 BS(雷射光束之照射區域）及冷卻點cs(冷媒之喷射區域）的 加熱冷卻機構部1 0。 為說明方便，係以光束點BS及冷卻點CS之移動方向 為Y方向。在加熱冷卻機構部之行進距離d較短之時點， 如圖15(b)所示，係形成裂痕並從斷開開始端形成緣材， 隨著裂痕之進展，裂痕往正交於Y方向之χ方向的開口寬 度即擴展，而使緣材G1之斷開面朝向χ方向移動。 接著，在熱冷卻機構部10行進，行進距離d變長之時 點，如圖15(c)所示，隨著裂痕之前端逐漸離開基板G之斷 開開始端，從所形成之緣材G1之斷開開始端起之長度亦逐 漸變長，因此所形成之緣材G1的重量即增加。 因此，隨著裂痕之前端逐漸離開基板G之斷開開始端， 僅以熱應力差所產生之斷開力變得難以使裂痕進展在斷 開開始端附近裂痕雖容易進展，但不久到達基板中央後裂 痕即難以進展，有時進展亦會停止。亦即，隸已使基板G 浮起㈣㈣擦阻力’不過當全切加1之裂痕進展至基板 中央附近後，由於會與緣材〇1之重量抗衡而逐漸不易產生 200936291 ，因此使 往緣材⑴之x方向的料，*f要更大之斷開力 裂痕之行進變得困難。 此外，如圖15(d)所不’在光束點Bs離開基板外側後 之時點，僅冷卻點CS殘留在基板上，前後方向之埶應力差 即變小’而使往左右方向裂開之力(斷開力)變小，其結果有 時裂痕之進展即停止。 為了解決此種問題’上述專利文獻2，係設置成在基板Between the surface of the stage and the surface of the stage, the breaking force is offset by the frictional resistance by the frictional resistance against the force, and as a result, it cannot be a full-cut process but becomes a scribing process. Therefore, in the case of performing the full-cut processing of the Japanese temple, as disclosed in Patent Document i and Patent Document 2, the substrate is floated from the stage surface for processing to suppress the frictional resistance. By breaking the substrate in such a full cut process, the cracking step is not required. [Patent Document 1] Japanese Patent No. 3887394 Patent Document 2: Japanese Laid-Open Patent Publication No. 2007-90860 No. 200936291 [Description of the Invention] Fig. 15 is a view showing a state in which the edge material G1 of the substrate is gradually broken by the full cutting process. Variety. Here, the central portion G0 of the substrate G is fixed to a stage (not shown), and the edge side portion G1 is floated on the stage to be in a non-contact state. The full-cut processing, as shown in Fig. 15 (a), is a beam spot BS (a laser beam irradiation region) having a laser beam and a relative movement from a disconnection start end of the substrate G toward the opposite end end. The heating and cooling mechanism portion 10 of the point cs (injection region of the refrigerant). For convenience of explanation, the moving direction of the beam spot BS and the cooling point CS is the Y direction. When the traveling distance d of the heating and cooling mechanism portion is short, as shown in Fig. 15 (b), a crack is formed and a rim material is formed from the breaking start end, and as the crack progresses, the crack is orthogonal to the Y direction. The opening width in the χ direction is expanded, and the breaking surface of the rim material G1 is moved in the χ direction. Next, when the thermal cooling mechanism unit 10 travels and the traveling distance d becomes long, as shown in FIG. 15(c), the leading end of the crack gradually leaves the breaking start end of the substrate G, and the formed edge material G1 is formed. The length of the breaking start end is also gradually lengthened, so that the weight of the formed edge material G1 is increased. Therefore, as the front end of the crack gradually leaves the breaking start end of the substrate G, the breaking force generated only by the difference in thermal stress becomes difficult to cause the crack to progress near the beginning of the break, although the crack easily progresses, but reaches the center of the substrate soon. Post-cracks are difficult to progress and sometimes progress will stop. That is, the substrate G has been floated (4) (4) rubbing resistance 'but when the crack of the full cut plus 1 progresses to the vicinity of the center of the substrate, it will gradually become difficult to produce 200936291 due to the weight of the edge material 〇1, thus making the edge material (1) The material in the x direction, *f is more difficult to travel with a breaking force crack. Further, as shown in Fig. 15(d), when the beam spot Bs is separated from the outside of the substrate, only the cooling point CS remains on the substrate, and the stress difference in the front-rear direction becomes small, and the force is split in the left-right direction. (The breaking force) becomes small, and as a result, the progress of the crack sometimes stops. In order to solve such a problem, the above Patent Document 2 is provided on a substrate.
保持機構配備應力施加機構。具體而言，係設置藉由微動 載台從外部對基板賦予力之外力賦予部，在割斷單元之位 置從斷開始點、中央、斷開終點逐步移動日夺，控制賦予至 橫方向（X方向）之力。 日然而，此方法，係設置移動量感測器（位置檢測器）以檢 測提供應力之微動載台的動作，並根據檢測結果進行微動 載台之控制，以施加預先所設定之橫方向的應力（斷開力）。 因此係與裂痕之行進狀況無關來施加應力，依裂痕之行 進狀況有可能會將不須之力勉強施加於裂痕之前端或所 形成之裂痕會偏離斷開預定線等。 因此本發明之目的在於提供一種雷射加工裝置，其 糸鼓置成在斷開開始初期並不進行施加外力強制推進裂痕 之仃進的動作，而係可視裂痕之行進狀況在需要時再將辅 助性斷開力施加於裂痕之斷開面，而可確實地至基板終端 為止進行全切加工。 又’如LCD基板之貼合基板，為了形成端子部，有時 係進行僅切取單側基板之端材（端部），而使另一側之端子電 9 200936291 極部露出的全切加工。妹、，人 夕T -Λ-. 使全切加工進行此種斷開加工 之情況下，亦會產吐4别占 1 ^ 迷裂痕之行進停止的問題。 因此，本發明之目的在於提供一 可確實地至基板終端為止 ^ =基板亦 為為止進仃全切加工的雷射加工裝置。 又，為了進行令切& τ 1 仃全切加工，若以使基板浮起於载台面（基 板支承機構)之狀態，喷射含水分之冷媒時，在基板與載(Ϊ :之二冷媒有時會迁迴擴展導致水分附著於載台二 附著於載台面之狀態下降後，基板與載台面即密 σ，導致之後難以移動基板。因此，本發明之 供一種可抑制冷媒緖^ H 繞至載台面而可進行全切h的雷射加 工裝置。 為解決上述問題，本發明之雷射加工裝置，係具備： 基板支承機構’用以使脆性材料基板之較斷開預定線靠緣 側之邛刀子起，且將基板固定在較斷開預定線靠中央側. 鉤止機構’在位於該臂部之另一端且該臂部之凸部離開該 基板之待機位置、與該凸部進入藉由熱應力而形成在該基 板之裂痕之開口内的卡止位置之間，使該臂部旋動；鉤止 機構移動部，係在該凸部呈已進入該裂痕之開口内之狀態 時，使鉤止機構水平移動於將該緣側部分從中央側拉開2 方向；以及輔助斷開力控制部，用以控制鉤止機構及:止 機構移動部，並施加用以輔助該裂痕行進之斷開力；該辅 助斷開力控制部係進行下述動作之控制：當開口之該裂疳 之中央側基板之斷開面與該緣側部分之斷開面的距離足夠 時，將該凸部置入該裂痕之開口内，然後開始進行鉤止機 200936291 構之水平移動，使該緣側部分之斷開面與該凸部的距離逐 漸接近，在該凸部抵接於該緣側部分之斷開面之後，透過 該凸部對該緣側部分之斷開面施加辅助裂痕進展之斷開 力。 本案之雷射加工裝置係一種脆性材料基板之雷射加工 裝置’其#備，4有雷射光束照射機構及喷射冷媒之冷卻 機構的加熱冷卻機構部、以及使該加熱冷卻機構部對由脆 ❹性材料所構成之基板相對移動的掃描機構，並藉由沿設定 於該基板之斷開預定線使加熱冷卻機構部相對移動，以低 於該基板軟化之溫度加熱，接著沿該光束點所通過之軌 跡，使該冷卻點相對移動以冷卻該基板，因熱應力產生貫 通基板之裂痕並沿該斷開預定線使該裂痕行進而予以 開。 此處，掃描機構係可移動基板側，亦可移動加熱冷卻 機構部（雷射光束照射機構及冷卻機構）。 〇 根據本發明，雷射光束照射機構係沿斷開預定線進行 掃描#著冷卻機構即進行掃描。加熱冷卻機構部（雷射光 束，射機構及冷卻機構）往前掃描時，於斷開開始側之斷開 =線’因熱應力形成從基板之上面貫通至下面的裂痕（構 成全切加工之裂痕），沿斷開預定線逐漸進展。在稍離開進 展之裂痕之前端的後方位置，裂痕即擴展並形成開口。辅 助斷開力控制部係將鉤止機構之凸部置入該裂痕之開口 内。置入凸部之時點係設定成至凸部與裂痕之斷開面未接 觸之程度裂痕擴展後。該時點係設定成使加熱冷卻機構部 11 200936291 射先束,、，、射機構及冷卻機構)以一定速度進行掃描，掃描 開始起經過一定時間後置入即可。'料，係設定成在光束 點、冷卻點從斷開開始端起掃描一定距離後之時點置入凸 Z。或者，如後述般，亦可設定成監測實際形成於基板之 裂痕的開口，在開口充分打開之時點置入凸部。接著，藉 由鉤止機構移動部使釣止機構水平移動至正交於斷開預^ 線之方向（從基板中央側拉開之方向）。 裂痕之開口 ’在最初期間(裂痕前端位於接近斷開開始 Ο 端之位置)雖隨著裂痕前端之進展而成長(開口之寬度擴 展），不過當裂痕前端遠離斷開開始端後，不久成長即降低 (開口之寬度不易變化）。因此’開始進行水平移動之時點可 在將凸部置入裂痕後立即開始，亦可從開口之寬度充分擴 展後開始。 較佳為鉤止機構係構成為配置於該基板之下面側，且 在使裂痕之斷開面與該凸部之距離逐漸接近時，將緣側部 为（以下，稱為緣材）支承成可在鉤止機構之臂部上移動。 此種構成，在所形成之裂痕的前端從鉤止機構朝向基板之 〇 斷開結束端尚未進展足夠之距離時，緣材便在臂部上移動 而往X方向之移動即被抑止。裂痕之前端從鉤止機構朝向 基板之斷開結束端已進展足夠之距離時，較佳為設定緣材 與臂部之摩擦力等’使緣材以與臂部之摩擦力停在臂部上 而往X方向移動。如此，由於緣材與臂部係具有裕度因 此可視裂痕之前端位置或所形成之開口寬度等裂痕進展狀 態簡單除去妨礙裂痕進展之主要原因（因緣材之身長導致重 12 200936291 量增加等）。 此外’藉由鉤止機構移動部被水平移動來到之凸部便 逐漸接近裂痕斷開面’不久裂痕斷開面與凸部即抵接，而 將此按壓。該按壓力之大小係只要以所形成之緣材之重量 等不妨礙裂痕進展下往又方向按壓緣材即足夠。 以此方式，當實際之裂痕進展降低且必要時再施加辅 助性斷開力。 辅助斷開力控制部亦可預先設定控制程式，而以既定 時點，開始進行將該凸部置入該裂痕之開口内的步驟、開 始進行鉤止機構之水平移動以使裂痕之斷開面與該凸部之 距離逐漸接近的步驟、以及透過該凸部施加輔助裂痕進展 之斷開力的步驟。 此時，亦可藉由檢測加熱冷卻機構部之從斷開開始起 的經過時間或加熱冷卻機構部之位置來設定各時點。 又，亦可以攝影機觀察裂痕並視其結果來設定各時點。 g 此外，輔助斷開力控制部亦可在開始進行鉤止機構之 水平移動，以使裂痕之斷開面與該凸部的距離逐漸接近， 該凸部抵接於該裂痕之斷開面之後，以既定時點或立即對 該裂痕之斷開面將辅助裂痕進展之斷開力施加於該凸部。 本發明之雷射加工方法，係將脆性材料基板局部加 熱，利用其熱應力於該基板形成裂痕後予以斷開，其具備： 使該基板之較斷開預定線靠緣側之部分浮起且在較斷開預 定線靠中央側將基板固定於基板支承機構之步驟；使雷射 光沿該斷開預定線一邊移動一邊照射之步驟；使一端具有 13 200936291 凸部之臂部移動並將該凸部置入形成於該基板之裂痕的開 口内之步驟；以及使臂部水平移動之步驟，以使臂部之一 部分抵接於該緣側部分之主面，並在此狀態下使該緣側部 分之斷開面與該凸部的距離接近。此外，具備在該臂部之 凸部抵接於該緣側部分之斷開面之後，透過該凸部對該緣 側部分之斷開面施加輔助裂痕進展之斷開力之方式動作之 步驟。 根據本發明，由於在裂痕之進展鈍化後（或停止後）使卡 止部之凸部抵接於裂痕之斷開面，然後再施加辅助性斷開 力，因此可不勉強施加輔助性斷開力，不會偏離斷開預定 線形成斷開線，而可至基板終端為止確實地進行全切加工。 上述發明中，較佳為鉤止機構係設置於至少斷開開始 側之基板端附近的位置。藉由設置於斷開開始端之鉤止機 構，可辅助至基板終端端附近之裂痕的行進。 又，上述發明中，鉤止機構亦可設置於至少斷開開始 側之基板端附近之位置、與從斷開結束側之基板端起往内 側相隔既定距離之位置的兩個部位。 之鉤止機構，可辅助至 又，藉由設置於斷開終 據此’藉由設置於斷開開始端 基板終端附近為止之裂痕的行進。 端附近之鉤止機冑，可藉由冑射照射機構在基板終端端附 近來輔助斷開力，而可至基板終端為止確實予以斷開。此 外，此處所稱之既定距離係指卡止部之凸部不會接觸斷開 面，而至可進入裂縫（間隙）之區域為止的距離。 上述發明中，亦可設置成將鉤止機構配置於該基板之 200936291 下面側，且在使裂痕之斷開面與該凸部之距離逐漸接近 時，將緣側部分在鉤止機構之臂部上支承成可移動。 根據本發月可視裂痕之行進將逐漸從中央侧分離之 緣側部分在鉤止機構之臂部上支承成可移動。藉此，可藉 由移動-邊吸收相對於與拉開釣止機構之方向（設為X方向） 正交之方向（設為Y方向）或ΧΥΦ内之旋轉方向（設為0方 向）的位置偏移，一邊施加一定之斷開力。The holding mechanism is equipped with a stress applying mechanism. Specifically, the force applying portion is provided by externally applying a force to the substrate by the fine movement stage, and the position of the cutting unit is gradually moved from the break start point, the center, and the cut end point, and the control is applied to the lateral direction (X direction). )Power. However, in this method, a movement amount sensor (position detector) is provided to detect the action of the micro-motion stage that provides stress, and the control of the micro-motion stage is performed according to the detection result to apply a previously set lateral stress ( Breaking force). Therefore, stress is applied irrespective of the progress of the crack, and depending on the progress of the crack, there is a possibility that the unnecessary force is applied to the front end of the crack or the crack formed may deviate from the line to be broken. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a laser processing apparatus in which a tamper is placed so as not to perform an action of applying an external force to force a crack in the initial stage of the disconnection, and the traveling condition of the visible crack is assisted when necessary. The breaking force is applied to the breaking surface of the crack, and the cutting process can be surely performed until the end of the substrate. Further, in the case of the bonded substrate of the LCD substrate, in order to form the terminal portion, the end material (end portion) in which only the one-side substrate is cut out may be cut, and the other end of the terminal electrode 9 200936291 may be exposed. Sister, person, evening T-Λ-. In the case of full-cut processing for such disconnection processing, there is also a problem that the production of vomiting 4 does not affect the travel of the crack. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a laser processing apparatus which can be surely processed to the end of the substrate. In addition, in order to perform the full cutting of the cutting & τ 1 ,, when the substrate is floated on the stage surface (substrate supporting mechanism), and the moisture-containing refrigerant is ejected, the substrate and the carrier are provided. When the state is relocated and expanded, the state in which the moisture adheres to the stage 2 adheres to the stage surface is lowered, and the substrate and the stage surface are densely σ, which makes it difficult to move the substrate afterwards. Therefore, the present invention provides a method for suppressing the refrigerant to the refrigerant. In order to solve the above problems, the laser processing apparatus of the present invention includes: a substrate supporting mechanism 'for making the brittle material substrate be closer to the predetermined line than the predetermined line. The boring tool is lifted, and the substrate is fixed to the center side of the predetermined line to be disconnected. The hooking mechanism 'takes at the other end of the arm portion and the convex portion of the arm portion leaves the standby position of the substrate, and the convex portion enters When the thermal stress is formed between the locking positions in the opening of the crack of the substrate, the arm portion is rotated; and the hooking mechanism moving portion is in a state in which the convex portion has entered the opening of the crack. Hook mechanism water Moving in a direction in which the rim portion is pulled away from the center side; and an auxiliary breaking force control portion for controlling the hooking mechanism and the stopping mechanism moving portion, and applying a breaking force for assisting the traveling of the crack; The auxiliary breaking force control unit performs control for placing the convex portion into the crack when the distance between the opening surface of the center side substrate of the split and the opening surface of the edge side portion is sufficient. In the opening, the horizontal movement of the hooking machine 200936291 is started, and the distance between the breaking surface of the edge portion and the convex portion is gradually approached, after the convex portion abuts the breaking surface of the edge portion The breaking force of the crack-progressing progress is applied to the broken surface of the edge portion through the convex portion. The laser processing device of the present invention is a laser processing device for a brittle material substrate, and the laser beam is irradiated by the laser beam. a heating and cooling mechanism portion of the mechanism and the cooling mechanism for injecting the refrigerant, and a scanning mechanism for relatively moving the substrate composed of the brittle material by the heating and cooling mechanism portion, and by a predetermined line of disconnection set on the substrate The heat-cooling mechanism portion is relatively moved, heated at a temperature lower than the softening temperature of the substrate, and then moved along the trajectory of the beam spot to relatively move the cooling point to cool the substrate, and the crack is penetrated through the substrate due to thermal stress The predetermined line is opened to open the crack. Here, the scanning mechanism is a movable substrate side, and the heating and cooling mechanism portion (the laser beam irradiation mechanism and the cooling mechanism) may be moved. 〇 The laser beam irradiation mechanism according to the present invention Scanning is performed along the line to be disconnected. The cooling mechanism is used for scanning. When the heating and cooling mechanism (laser beam, firing mechanism, and cooling mechanism) is scanned forward, the disconnection on the opening side = line ' due to thermal stress Cracks penetrating from the upper surface of the substrate to the lower surface (cracks constituting the full cut process) are formed, and gradually progress along the line to be cut. The crack spreads and forms an opening at a position rearward of the end slightly before the crack is progressed. The auxiliary breaking force control unit places the convex portion of the hooking mechanism into the opening of the crack. The point at which the convex portion is placed is set such that the crack is expanded to the extent that the convex portion and the broken surface of the crack are not in contact. At this time, the heating/cooling mechanism unit 11 200936291 is used to start the beam, and the radiation mechanism and the cooling mechanism are scanned at a constant speed, and the scanning is performed after a certain period of time has elapsed since the start of scanning. The material is set so that the convex Z is placed at a point when the beam spot and the cooling point are scanned a certain distance from the beginning of the opening. Alternatively, as will be described later, it is also possible to set an opening for monitoring the crack actually formed on the substrate, and to insert the convex portion when the opening is sufficiently opened. Next, the fishing mechanism is horizontally moved by the hooking mechanism moving portion to a direction orthogonal to the breaking pre-wire (a direction pulled away from the center side of the substrate). The opening of the crack 'in the initial period (the position at which the tip of the crack is located near the end of the break) grows as the front end of the crack progresses (the width of the opening expands), but when the front end of the crack moves away from the beginning of the break, it grows soon. Lower (the width of the opening is not easily changed). Therefore, the point at which the horizontal movement starts can be started immediately after the projection is placed in the crack, or can be started after the width of the opening is sufficiently expanded. Preferably, the hooking mechanism is disposed on the lower surface side of the substrate, and when the distance between the broken surface of the crack and the convex portion is gradually approached, the edge portion is supported (hereinafter referred to as a rim material). It can be moved on the arm of the hooking mechanism. In such a configuration, when the tip end of the formed crack is not sufficiently advanced from the hook end mechanism toward the end of the substrate, the edge member moves on the arm portion and the movement in the X direction is suppressed. When the front end of the crack has progressed from the hooking mechanism toward the end of the breaking end of the substrate, it is preferable to set the frictional force of the edge material and the arm portion, etc., so that the edge material is stopped on the arm portion by the frictional force with the arm portion. Move to the X direction. In this way, since the edge material and the arm portion have a margin, the crack progress state such as the position of the front end of the visible crack or the width of the opening formed is simply removed to prevent the progress of the crack (the length of the edge material is increased due to the length of the edge material). Further, the convex portion that has been moved by the hooking mechanism is gradually moved closer to the crack-breaking surface, and the crack-breaking surface abuts against the convex portion, and is pressed. The pressing force is sufficient as long as the weight of the formed edge material or the like does not hinder the progress of the crack and presses the edge material in the direction. In this way, the auxiliary cracking force is reduced when the actual crack progression is reduced and if necessary. The auxiliary breaking force control unit may set a control program in advance, and at the same time, start the step of placing the convex portion into the opening of the crack, and start the horizontal movement of the hooking mechanism to make the broken surface of the crack The step of gradually approaching the distance between the convex portions and the step of applying a breaking force for assisting the progress of the crack through the convex portion. At this time, each time point can be set by detecting the elapsed time from the start of the heating and cooling mechanism portion or the position of the heating and cooling mechanism portion. Further, the camera may observe the crack and set the time points depending on the result. g, the auxiliary breaking force control unit may start the horizontal movement of the hooking mechanism so that the distance between the breaking surface of the crack and the convex portion gradually approaches, and the convex portion abuts against the breaking surface of the crack The breaking force that assists the progress of the crack is applied to the convex portion at a timing point or immediately on the broken surface of the crack. In the laser processing method of the present invention, the substrate of the brittle material is locally heated, and the thermal stress is broken by the substrate to form a crack, and the method comprises: floating a portion of the substrate on the side closer to the predetermined line of the broken line and a step of fixing the substrate to the substrate supporting mechanism on the center side of the disconnected predetermined line; a step of moving the laser light while moving along the line to be cut; and moving the arm portion having the protrusion of 13 200936291 at one end and the convex portion a step of inserting the opening formed in the opening of the substrate; and a step of horizontally moving the arm portion such that one of the arm portions abuts against the main surface of the edge side portion, and the edge portion is made in this state The partial breaking surface is close to the convex portion. Further, after the convex portion of the arm portion abuts against the breaking surface of the edge portion, the step of operating the opening portion of the edge portion to apply a breaking force for assisting the crack development is provided. According to the present invention, since the convex portion of the locking portion abuts against the breaking surface of the crack after the progress of the crack is passivated (or after the stop), and then the auxiliary breaking force is applied, the auxiliary breaking force can be hardly applied. The disconnection line is formed without deviating from the predetermined line to be cut, and the full cutting process can be surely performed up to the end of the substrate. In the above invention, it is preferable that the hooking mechanism is provided at a position at least near the end of the substrate at the start side. By the hooking mechanism provided at the break start end, the travel to the crack near the terminal end of the substrate can be assisted. Further, in the above invention, the hooking mechanism may be provided at at least a position at a position near the end of the substrate on the side on which the opening is started, and at a position spaced apart from the substrate end on the side of the opening end by a predetermined distance. The hooking mechanism can assist in the travel of the crack by being disposed at the vicinity of the end of the substrate at the beginning of the disconnection. The hooking device near the end can assist the breaking force by the vicinity of the terminal end of the substrate by the radiation irradiation mechanism, and can be disconnected until the substrate terminal. Further, the predetermined distance referred to herein means the distance from which the convex portion of the locking portion does not contact the breaking surface to the area where the crack (gap) can enter. In the above invention, the hooking mechanism may be disposed on the lower side of the substrate 200936291, and when the distance between the broken surface of the crack and the convex portion is gradually approached, the edge portion is at the arm portion of the hooking mechanism. The upper support is movable. The edge portion which is gradually separated from the center side is supported to be movable on the arm portion of the hooking mechanism in accordance with the progress of the visible crack in the present month. Thereby, it is possible to absorb the position in the direction orthogonal to the direction in which the fishing mechanism is pulled (in the X direction) (in the Y direction) or in the direction of rotation in the ΧΥΦ (set to the 0 direction) by moving. Offset, applying a certain breaking force on one side.
上述發明中，亦可設置成鉤止機構係進行該卡止部往 ΧΥΖ之3個軸方向之移動及/或迴旋。 藉此’可適切吸收γ方向移動、ζ方向移動、及0旋 轉’而可將斷開力確實地傳達至緣材侧基板。 上述發明中，亦可設置成釣止機構具 調整機構具有使該卡止部之凸部對裂痕斷開面接二： ==過該凸部對該裂痕之斷開面施加辅助裂 ^ :開力時，賦予釣止機構移動部之移動方向以外的= X以使轉觸部對該裂痕之斷開面緊密接觸且移動。 上述發明中，亦可設置成調整機構係以使診 該鉤止機構之兮辟'^卡止部對 恢稱之該臂部旋動的支軸所構成。 銘叙Γ由叹置使该卡止部旋動之支軸’即可賦予鉤止機播 移動部之蒋叙士丄 Α了判止機構 移動方向以外的自由度。 上述發明中，亦可設置成進一步設置 開口的開口拾cg，丨± 檢測裂痕之 該裂痕之開口而將該釣止機構之該凸部置:：所檢測出之 Je 1八開口内。 *明，可藉由裂痕開口檢測部來判定開口寬 15 200936291 度’在開口確實打開之狀態下置入凸部。因此，不會誤在 開口尚未打開之狀態下置入凸部，以使凸部與基板不會相 撞而傷及基板。 上述發明中，亦可設置成基板支承機構係在使斷開預 定線靠緣侧部分浮起時，喷射防止冷媒繞至浮起部分的氣 簾。 藉此’即使在冷媒含有水分時’亦可消除因水分導致 基板支承機構與基板密合而難以移動基板的問題。 上述發明中，亦可設置成基板支承機構具備吸引機 0 構，以在使斷開預定線靠緣側部分浮起時，防止冷媒繞至 洋起部分。 藉此’即使在冷媒含有水分時，亦可消除因水分導致 基板支承機構與基板密合而難以移動基板的問題。 【實施方式】 以下’以玻璃基板加工用之雷射加工裝置為例，根據 圖式說明本發明之實施形態。 ❹ (實施形態1) 圖1係本發明之一實施形態之雷射加工裝置LM1的整 體構成圖，圖1(a)係立體圖，圖1(b)係前視圖，而圖1(e) 係俯視圖。 此處，被加工基板係玻璃單板，藉由全切加工進行产 基板下面之斷開預定線L將基板G右侧之緣材G1從中央侧 之基板本體G0斷開的加工。此處，係設置成從基板g之下 16 200936291 面側進行雷射光束照射及冷媒之喷射。 雷射加工裝置LM1具有：具有雷射光束照射機構" 與噴射冷媒之冷卻機構12的加熱冷卻機構部1〇、藉由馬達 驅動使加熱冷卻機構部1()對基板G移動的掃描機構13(未 圖示）、用以搬送基板之搬送機構14、基板支承機構15，16、 鉤止機構17, 18、以及鉤止機構移動部19,2〇。此外，鉤止 機構18、鉤止機構移動部20、與鉤止機構17、鉤止機構移 動部19係相同構造’圖1(b)中係配置於釣止機構17、釣止 ϋ 機構移動部20之紙面内侧。 雷射光束照射機構1 1係由透鏡光學系統所構成，用以 將從C〇2雷射光源及雷射光源所射出之雷射光束的截面形 狀整形成橢圓並將光束點BS照射於基板上。冷卻機構12 係由喷嘴所構成，用以噴射含水分之冷媒以將冷卻點〇3形 成在基板上。此等係藉由未圖示之掃描機構13在將雷射光 束照射機構11與冷卻機構12間之距離一直維持於一定 _ 下，沿斷開預定線L移動。 p 於基板G之基板本體G0側的下方，設置有平行排列之 3支軌道狀支承體15a，15b，15c作為基板支承機構15。於 支承體15a〜15c之上面，係以列狀設有吸引夾頭用之多數 個孔，藉由使吸引夾頭動作即可將基板G(基板本體G〇之部 分）吸附固定在所須之位置。 又’於支承體15a，15b之間、及15b，15c之間，配置 有滾輪群14a，14b作為搬送基板之搬送機構14〇該搬送機 構14係在欲將基板G搬入加工區域或搬出加工區域時使 17 200936291 用。 於基板G〇之緣材G1側的下方，設置有浮動台（float Uble)16a作為基板支承機構16。於浮動台16a之上面，設 有將氣體（乾燥空氣）吹送至基板之多數個孔以使基板（緣 材⑺之部分）可浮起。接著，藉由基板支承機構15與基板 支承機構16之協同動作，使基板〇整體支承為大致水平。 在二次雷射掃財，隨著垂直裂痕沿斷開預定線從基板G ^ 一端朝向另—端行進，依照斷開預定線從中央側之基板G 刀離成緣材G卜並逐漸失去中央侧之基板〇的支承而在垂❹ p產生偏# |生該偏移之緣#⑴係、支承在釣止機構 臂邛17c上。此外，於浮動台〗6a附設有使其上面傾 斜之傾斜機構16b’可使藉由後述鉤止機構17,⑽鉤止機 構移動部19, 20切開之緣材G1落下。 釣止機W7, 18係由具有凸部以…之卡止部％ ⑽、及藉由馬達驅動可迴旋之臂部％…所構成，盆係 在卡止部17b，18離開基之待機位置、與凸部以⑽ 進入形成於基板G之垂直裂痕之内部而成的卡止位置之間◎ 使臂部17c旋動。 釣止機構移動部19,20係設置成可在卡止部 2於從基板G開始分離之緣材⑴的位置時，藉由馬達驅 =將緣材⑴以從基板本邀GG(中央側）分離至橫方向^方 向）之方式移動。In the above invention, the hooking mechanism may be configured to perform movement and/or rotation of the locking portion in three axial directions. Thereby, the breaking force can be reliably transmitted to the edge material side substrate by appropriately absorbing the γ direction movement, the ζ direction movement, and the 0 rotation ‘. In the above invention, the fishing mechanism fixing mechanism may be provided such that the convex portion of the locking portion is connected to the cracked surface by the second surface: == the convex portion applies an auxiliary crack to the broken surface of the crack: At this time, =X other than the moving direction of the fishing mechanism moving portion is given so that the turning portion closely contacts and moves the breaking surface of the crack. In the above invention, the adjustment mechanism may be provided so that the locking portion of the hooking mechanism is configured to retract the pivot shaft of the arm portion. The inscription Γ Γ 使 使 使 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ In the above invention, the opening pickup cg of the opening may be further provided, and the opening of the crack of the crack may be detected and the convex portion of the fishing stop mechanism may be placed in the detected opening of the Je 1 eight opening. * Ming, the opening width can be determined by the crack opening detecting portion. 15 200936291 degrees 'The convex portion is placed in a state where the opening is surely opened. Therefore, the convex portion is not mistakenly placed in a state where the opening is not yet opened, so that the convex portion does not collide with the substrate to damage the substrate. In the above invention, the substrate supporting mechanism may be provided to prevent the refrigerant from being wound around the floating portion when the front side of the predetermined line is floated. Therefore, even when the refrigerant contains moisture, it is possible to eliminate the problem that the substrate supporting mechanism and the substrate are adhered to each other due to moisture, and it is difficult to move the substrate. In the above aspect of the invention, the substrate supporting mechanism may be provided with a suction mechanism to prevent the refrigerant from being wound around the rising portion when the predetermined line edge side portion is floated. Therefore, even when the refrigerant contains moisture, it is possible to eliminate the problem that the substrate supporting mechanism and the substrate are adhered to each other due to moisture, and it is difficult to move the substrate. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings, taking a laser processing apparatus for processing a glass substrate as an example. 1 (Embodiment 1) FIG. 1 is a view showing an overall configuration of a laser processing apparatus LM1 according to an embodiment of the present invention. FIG. 1(a) is a perspective view, FIG. 1(b) is a front view, and FIG. 1(e) is a view. Top view. Here, the substrate to be processed is a glass veneer, and the edge material G1 on the right side of the substrate G is disconnected from the substrate body G0 on the center side by the full cutting process. Here, the laser beam irradiation and the ejection of the refrigerant are performed from the surface side of the substrate g 16 200936291. The laser processing apparatus LM1 includes a laser beam irradiation unit " a heating and cooling mechanism unit 1 that is coupled to the cooling mechanism 12 that ejects the refrigerant, and a scanning mechanism 13 that moves the heating/cooling mechanism unit 1 () to the substrate G by motor driving. (not shown), the conveying mechanism 14 for conveying the substrate, the substrate supporting mechanisms 15, 16, the hooking mechanisms 17, 18, and the hooking mechanism moving portions 19, 2'. Further, the hooking mechanism 18, the hooking mechanism moving portion 20, and the hooking mechanism 17 and the hooking mechanism moving portion 19 have the same structure. In Fig. 1(b), the fishing mechanism 17 and the fishing sling mechanism moving portion are disposed. 20 inside the paper. The laser beam illumination mechanism 11 is composed of a lens optical system for forming an ellipse from a cross-sectional shape of a laser beam emitted from a C〇2 laser source and a laser source, and irradiating the beam spot BS on the substrate. . The cooling mechanism 12 is constituted by a nozzle for injecting a moisture-containing refrigerant to form a cooling spot 〇3 on the substrate. These are moved along the line to cut L by the scanning mechanism 13 (not shown) while maintaining the distance between the laser beam irradiation unit 11 and the cooling unit 12 at a constant level. Next, three rail-shaped support bodies 15a, 15b, and 15c which are arranged in parallel are provided as the substrate supporting mechanism 15 below the substrate main body G0 side of the substrate G. On the upper surfaces of the support bodies 15a to 15c, a plurality of holes for attracting the chuck are arranged in a row, and the substrate G (portion of the substrate body G) can be adsorbed and fixed by the suction chuck. position. Further, between the support bodies 15a and 15b and between 15b and 15c, a roller group 14a and 14b are disposed as a transport mechanism 14 for transporting the substrate, and the transport mechanism 14 is intended to carry the substrate G into the processing region or the carry-out processing region. When using 17 200936291. A floating bed 16a is provided as a substrate supporting mechanism 16 below the side of the substrate G1 of the substrate G. Above the floating stage 16a, a plurality of holes for blowing a gas (dry air) to the substrate are provided so that the substrate (part of the rim (7)) can float. Then, by the cooperation of the substrate supporting mechanism 15 and the substrate supporting mechanism 16, the substrate raft as a whole is supported substantially horizontally. In the second laser sweeping, as the vertical crack travels from the end of the substrate G^ toward the other end along the line to be broken, the substrate G from the center side is separated into the edge material G according to the line to be broken, and the center is gradually lost. The support of the substrate 〇 on the side causes the offset p (#) to be supported by the fishing mechanism arm 邛 17c. Further, the tilting mechanism 16b' for tilting the upper surface of the floating table 6a can be lowered by the hooking mechanism 17 which will be described later, and (10) the hooking mechanism moving portion 19, 20 is cut. The fishing machine W7, 18 is composed of a locking portion % (10) having a convex portion, and a swingable arm portion % by a motor, and the basin is separated from the base by the locking portions 17b, 18, Between the locking portion and the convex portion entering the locking position formed inside the vertical crack of the substrate G (the arm portion 17c is rotated). The fishing stop mechanism moving portions 19, 20 are provided so that when the locking portion 2 is at the position of the edge material (1) separated from the substrate G, the edge member (1) is driven by the motor drive GG (center side) Move in a manner separated from the horizontal direction ^ direction).
此外，除了上述以外， 在基板之斷開開始端形成初 —起設有 期龜裂（觸發裂痕）之升降式切 18 200936291 刀輪’使初期龜裂可形成在斷開預定線之斷開開始端。於 搬入加工區域後之基板G，係預先藉由切刀輪形成初期龜 裂。 又，實施形態1，雖將雷射光束照射機構u、及冷卻 機構12設置於基板G之下面侧，不過此等亦可設置於上面 側。 其次，針對雷射加工裝置LB1之控制系統作說明。圖2 e 係控制系統的方塊圖。雷射劃線裝Ϊ LB1巾，加熱冷卻機 構。卩10(雷射光束照射機構n、冷卻機構i 2)、掃描機構13、 搬送機構14、基板支承機構（支承體）15、基板支承機構（浮 動台）16、鉤止機構17, 18、以及鉤止機構移動部19, 2〇之 各邛係藉由以電腦（CPU)所構成之控制部21進行控制。於 控制部21係連接由鍵盤、及滑鼠等所構成之輸人部22及 由進行各種顯示之顯示畫面所構成之顯示部23，以將必要 之訊息顯示於畫面且可輸入必要之指示或設定。接著，根 〇 據預先儲存之順序程式執行加工動作。 八次，針對雷射加工裝置LM1之斷開動作作說明。圖 系表不斷開加工中在各時點基板G之裂痕之行進狀態，圖 4係表不鉤止機構17, 18之各時點之動作狀態（相當於圖1(b) 之圖）。 圖3(a)係表示從斷開開始端起剛開始進行光束點 冷卻點CS夕挺 ’、 掃描的狀態。如圖4(a)所示，藉由搬送機構14 G〇。G係藉由支承體⑸〜…吸附固定基板本體側 方面’緣材G1側係藉由從浮動台i6a吹送之氣體 19 200936291 而浮起。鉤止機構17, 置。 18皆已移動至離開基板〇之待機位 圖3(b)係光束點Bs及冷卻點cs從斷開開始端逐漸行 進之時點#狀態。於斷開開始端側<斷開冑定線上，會產 生從上面貫通至下面之裂痕且形成開口 Gc。呈形成開口 ^ 之狀態後，如圖4(b)所示，鉤止機構17即動作，使釣止機 構Π之凸部17a進入開口 Gc。此時，當開口之上述裂痕之 中央側基板之斷開面與緣側部分之斷開面的距離已足夠 時，較佳為調整置入凸部17a之時點，使凸部17&不與斷開 面Gf接觸。具體而言，係預先設定從掃描開始至鉤止機構 17動作為止之延遲時間，等待光束點BS及冷卻點cs沿斷 開預定線行進某種程度後，再使凸部l7a進入開口 Gc。 然後，隨著光束點BS及冷卻點CS行進，如圖4((〇所 示，緣材G1即移動於臂部17c上，裂痕之開口 Gc便逐漸 擴展。此外，另一侧之鉤止機構18(紙面内側）還位於待機 位置尚未動作。 圖3(c)係光束點BS及冷卻點cs進一步行進而遠離斷 開開始端之狀態。此時，緣材G1在臂部17c上之移動量已 降低（或停止）。如圖4(d)所示，鉤止機構移動部！ 9即開始 將鉤止機構17拉往橫方向（X方向^由於緣材G1之移動量 已降低，因此凸部17a即逐漸接近緣材G1之斷開面Gf，不 久如圖4(e)所示，鉤止機構17之凸部17a即接觸緣材G1 之斷開面Gf。然後，緣材G1即與鉤止機構17往X方向之 移動同時亦往橫方向（X方向）移動，以輔助地施加沿斷開預 ❹ ❹ 200936291 定線L往左右裂開之力(斷開力）。 ，亦即’鉤止機構17係配置於上述基板G之下面側，在 使裂痕斷開面與上述凸部m之距離逐漸接近時，係將緣材 ?在釣止機構17之臂部17。上支承成可移動。此處，在 凸部17a接近緣材G1之斷開面沉之前所形成之裂痕的前 端，從鉤止機構17朝向基板G之斷開結束端尚未進展足夠 之距離時’緣材G1#在臂部17e上移動而往χ方向之移動 係被抑止。在凸部17a接觸緣材⑴之斷開面㈣，當裂 痕之前端從鉤止機構17朝向基板G之斷開結束端已進展足 夠之距離時，緣材G1係以與臂部⑺之摩擦力停留在臂部 而往X方向移動。此外，鉤止機構17雖在臂部Pc 上將緣材G1支承成可移動，不過依使基板g浮起之空氣壓 力與緣材G1之重量的關係，有時緣材⑴會不抵接於臂部 1 7 c而浮起。 以此方式，由於緣材G1係與臂部17具有適度之裕度， 亦即透過緣材CH與臂部17之摩擦力柔軟接觸（由於並非緊 密連接）’因此可依裂痕之前端位置或所形成之開口的寬度 等裂痕進展狀態來自動調整往X方向按壓緣材之力。此外， 此時另一侧之鉤止機構18亦尚未動作。 圖3⑷係光束點BS及冷卻點cs進一步行進而光束點 BS接近基板G之斷開預定線L之終端的狀態。此時，配設 於斷開結束端側之鉤止機構18即開始動作，並呈與圖4(b) 所示之鉤止機構丨7同樣的動作狀態，亦即呈卡止部工肋之 凸部心已進入開π 之狀態。此時，係調整凸部W動 21 200936291 作之時點（預先設定從掃描開始至鉤止機構18動作為止之 延遲時間），以使凸部18a不與斷開面Gf接觸。然後，以與 圖4(e)所示之鉤止機構17同樣的動作狀態，使緣材移 動至橫方向（X方向），以辅助性地施加沿斷開預定線l往左 右裂開之力（斷開力）。 此時，斷開力只要依緣材G1之重量，以不妨礙熱應力 之裂痕之進展的方式，將輔助性之力（斷開力）施加於橫方向 (X方向）即可。 圖3(e)係冷卻點CS離開基板G之斷開結束端的狀態。 鉤止機構18藉由將基板G拉往橫方向（χ方向），以輔助裂 痕之行進。藉此，裂痕即行進至基板終端而完全斷開。斷 開之後，傾斜機構16b即動作，藉由使浮動台16a傾斜，而 使緣材G1從載台面落下。 本實施形態，雖例示將緣材G1從基板本體側go分離 廢棄之端材，不過緣材G1即使是從母板之基板G分離成各 個單位基板或單位基板之集合體、或分離成單位基板之條 狀基板，同樣亦可適用本發明。 (實施形態2) 圖5係表示本發明之第二實施形態之雷射加工裝置 LM2的整體構成圖’圖5(a)係立體圖，圖5(b)係前視圖， 而圖5(c)係俯視圖。 本實施形態’於基板G之上面側係具有鉤止機構23, 24，以取代圖1所說明之鉤止機構17,丨8。又，雷射光束照 射機構11、及冷卻機構12，係設置成藉由設在基板G之上 200936291 方側的掃描機構（夫圖 冰* w 斷開預定線Lit行掃描。除此以 號而省略斟i #同之構成，因此藉由賦予相同符 號而4略對相同部分之說明。 鉤止機構23 + b w u 具有凸部233,243之卡止部⑽， 、及藉由馬達驅動而可迴旋之臂部23c， 止部23b，24b可在雜門^ 纟離開基板G之待機位置與接觸至基板之 斷開預定線L的位置之間使臂部17旋動。 ❹ 鉤止機構移動部19, 20係設置成在卡止部23b，24b位 於接觸至斷開預定線L的位置時，可藉由馬達驅動以從基 板本體G0(中央側）分離至橫方向（X方向）之方式 緣 材G1。 又，控制系統係與實施形態丨之圖2相同。 其次，針對雷射加工裝置LM2之斷開動作作說明。圖 6係表不斷開加工中在各時點基板G之裂痕之行進狀態，圖 7係表示鉤止機構23,24之各時點之動作狀態（相當於圖5(b) 之圖）。此外，圖6、圖7係分別對應實施形態i之圖3、圖 4 〇 圖6(a)係表示從斷開開始端起剛開始進行光束點及 冷卻點cs之掃描的狀態。如圖7(a)所示，藉由搬送機構14 搬來之基板G係藉由支承體i5a〜15c來吸附固定基板本體 侧G0。另一方面’緣材G1侧係藉由從浮動台16a吹送之 氣體而浮起。本實施形態2’如後述般，係設定氣體之吹送 量’使緣材G1之上面側可維持與鉤止機構17之臂部23c， 24c之下面抵接的狀態。鉤止機構23, 24皆已移動至離開基 23 200936291 板G之待機位置。 圖6(b)係光束點BS及冷卻點cs逐漸從斷開開始端行 進之時點的狀態。於斷開開始端側之斷開預定線L上，係 產生裂痕並形成開口 Gc。呈形成開口 Gc之狀態後，如圖 7(b)所示，鉤止機構23即動作，使鉤止機構23之凸部pa 進入開口 Gp此時，係調整置入凸部23a之時點，使凸部 23a不與斷開面Gf接觸。具體而言，係預先設定從掃描開 始至鉤止機構17動作為止之延遲時間，等待光束點及 冷部點CS沿斷開預定線行進某種程度後，再使凸部仏進❹ 入開口 Gc。 然後，隨著光束點BS及冷卻點CS行進，如圖7(c)所 示，緣材G1即在臂部23〇之下一邊浮起一邊移動，裂痕之 開口 Gc便逐漸擴展。此外，另一侧之鉤止機構24還位於 待機位置尚未動作。 ' 圖6(c)係光束點BS及冷卻點cs進一步行進而遠離斷 開開始端之狀態。此時，緣材G1之移動量已降低（或停止 如圖7(d)所示，鉤止機構移動部19即開始將鉤止機構n Q 拉往橫方向(X方向）。由於緣材G1之移動量已降低，因此 凸部23a即逐漸接近緣材⑴之斷開面以，不久如圖了⑷ 所不’鉤止機構23之凸部23a即接觸緣材⑺之斷開面 然後’緣材G1係與釣止機構23往χ方向之移動同時亦往 橫方向（X方向）移動，以辅助地施加沿斷開預定線[往左右 裂開之力（斷開力）。亦即’鉤止機構23係配置於上述基板 上面侧纟藉由以適切之空氣壓力從下方吹送之氣體而 24 200936291 浮起之基板G逐漸使裂痕斷開面Gf與上述凸部23a之距離 逐漸接近時，緣材G1之上面側即以可移動支承於鉤止機構 17之臂部17c上。此處，當所形成之裂痕的前端從鉤止機 構17朝向基板G之斷開結束端尚未進展足夠之距離時，緣 材G1之上面係抵接於在臂部23 c，24c之下面而往X方向之 移動即被抑止。另一方面，當裂痕之前端從鉤止機構17朝 向基板G之斷開結束端已進展足夠之距離時，緣材G1之上 _ 面係以與臂部23c，24c之摩擦力停留在臂部23c，24c上而 在X方向移動。 以此方式，由於緣材G1係與臂部23c，24c具有適度之 裕度，亦即透過緣材G1與臂部23c，24c之摩擦力柔軟接觸 (由於並非緊密連接），因此可視裂痕之前端位置或所形成 之開口的寬度等裂痕進展狀態，自動調整往x方向按壓緣 材之力。此外，在此時點另一側之鉤止機構18亦尚未動作。 圖6(d)係光束點BS及冷卻點cs進一步行進光束點 〇 BS接近基板G之斷開預定線L之終端的狀態。此時，配設 於斷開結束端之鉤止機構18即開始動作’並呈與圖7⑻所 示之釣止機構23同樣的動作狀態，亦即卡止部⑽之凸部 24a已進入開口 Gc之狀態。此時，係調整凸部“a動作之 時點（㈣設從掃描開始至定鉤止機構24動作為止之延遲 時間），使凸部24a不與斷開面Gf接觸。然後，以與圖叫 所示之鉤止機構23同樣的動作狀態，使緣材⑺移動至橫 方向（X方向），以辅助性地施加沿斷開預定線l往左右裂開 之力(斷開力）。亦即’從鉤止機構24亦施加促進裂痕行進 25 200936291 之強制性斷開力。 圖6(e)係冷卻點CS離開基板G之斷開結束端之時點的 狀態。鉤止機構24藉由將基板G拉往橫方向（X方向），以 辅助裂痕之行進。藉此，裂痕即行進至基板G之終端而完 全斷開。斷開之後，傾斜機構16b即動作，藉由使浮動台 16a傾斜，而使緣材G1從載台面落下。 此外，實施形態2，雖將雷射光束照射機構丨丨、冷卻 機構12設置於上面侧，而鉤止機構23, 24亦設置於上面 侧，不過亦可將一者設置於下面側而將另一者設置於上面❹ 側。 (實施形態3) ^圖8係本發明之第三實施形態之雷射加工裝置LM3的 别視圖纟實施形態，為了形成貼合基板之端子部，係 進行僅斷開貼合基板下側基板之端材（端部）而使上側基板 之端子電極部露出的加工。為了斷開貼合基板HGT側基板 之端材（端部）’與雷射加工裳置LM1同樣地’係使雷射光 束”’、射機構11之光束點BS與冷卻機構12之冷卻點從❹ 基板HG之下方朝向下側基板進行掃描。 此時’亦藉由執行與圖3、圖4所說明之動作順序相同 之順序，即可斷開基板G。 又，有時雖非將端子露出部設置於貼合基板HG， 沿相同之斷開箱中祕τ 货' 囍由蔣^ 欠即斷開上下兩側基板，此時係 ，射照射機構Π及冷卻機構12設置於上方與下 # H q目@之動作順序斷開基板。 26 200936291 (實施形態4) 圖9係本發明之第四實施形態之雷射加工裝置的 前視圖。本實施形態，在圖8所示之雷射加工裝置LM3之 構成’於浮動台16a之端部係設有噴射氣簾CG的氣簾用喷 嘴16c’用以防止從冷卻機構12所喷射之冷媒繞至浮動台 1 6a之上面。 在冷媒含有冷卻水時，若進入浮動台16a之上面與基板 ❹ HG之間，則基板HG會密合於浮動台16a而無法斷開基板。 因此，藉由在浮動台16a前端侧之端部噴射氣簾CG以防止 适迴擴散’即可使用含冷卻水之冷媒。 此外，在貼合基板HG之情況下，藉由噴射氣簾C(3亦 可防止冷卻水從所形成之裂痕進入貼合基板HG之上側基 板與下側基板之間，而可防止玻璃彼此之密合。 (實施形態5) 圖ίο係本發明之第五實施形態之雷射加工裝置lM5 Q 的前視圖。本實施形態，設有除去含水分之不要之冷媒的 吸弓I 口 16d，以取代圖9所示之雷射加工裝置LM4之氣簾 用噴嘴16c。藉由吸引除去所喷射之冷媒，形成推挽式之氣 簾，而可防止繞至浮動台16a。 (實施形態6) 圖11係表示本發明之六實施形態之雷射加工裝置lm6 之整體構成的立體圖。圖12係表示雷射加工裝置lm6之控 制系統。本實施形態，係在圖！所示之雷射加工裝置中裝 載攝影機25,用以觀察形成於基板之裂痕之開口 Gc的狀 27 200936291 t此外’於控制系、统21係設有視攝影機25所拍攝之影 像以檢測開口之大小的開口檢測部％。開口檢測部％係設 置成從攝影機25之影像檢測出斷開開始端之裂痕寬度（開 口寬度）是否在預先所設定之閾值以上，當開口寬度係在閣 值以上時’即判定為已打開使鉤止機才籌17動作之足夠開 口。藉由增設該判定動作’在因某種原因導致未能形成足 夠之開口時，即可防止鉤止機構17動作。 又，亦可視該攝影機25之觀察結果，來判斷鉤止機構 17之動作時點，亦即將凸告"7a置入裂痕之開口内之步驟 ❹ 開始鉤止機構17之水平移動而使裂痕斷開面與凸部i7a之 距離逐漸接近之步驟、透過凸部17a施加輔助裂痕進展之斷 開力之步驟之開始及結束的時點，以開始或停止鉤止機構 17之動作。 (實施形態7) 圖13係上述各實施形態之鉤止機構17(18, 23,24)之卡 止部17b(18b’ 23b’ 24b)的變形實施形態。以下’針對釣止 機構17作說明。鉤止機構17係設置成透過支軸i7d來連 Θ 結臂部17c與卡止部17b，以在χγφ内具有旋轉方向之自 由度。 緣材側基板G1係隨著裂痕之行進不僅移動至χ方向， 亦產生Υ方向之移動或在χγ面内之旋轉移動（稱為θ旋 轉）。在鉤止機構17之凸部17a之基板與接觸面已固定時， 由於無法吸收Y方向之移動或0旋轉，因此雖會產生接觸 部分之位置偏移，而可能產生無法傳達用以拉緣側部分之 28 200936291 輔助性斷開力之情形， 不過藉由賦予支軸17d之旋轉方向 的自由度’即可吸U方向移動、Θ旋轉，而可確實傳達 往緣材侧基板G1之斷開力。 /圖13，雖例示鉤止機構17(18, 23, 24)之卡止部的凸部 係對裂痕斷開面作面接觸之例，不過亦可設置成鉤止機構 17(18，23，24)之卡止 卩17b的凸部17a係對裂痕斷開面作線 接觸或作點接觸。例如，如圖14所示，係將銷m設置於Further, in addition to the above, an up-cut type of the initial-stage crack (trigger crack) is formed at the break start end of the substrate. 200936291 The cutter wheel is formed so that the initial crack can be formed at the break start end of the line to be cut. . The substrate G which has been moved into the processing area is initially formed with a cutter wheel to form an initial crack. Further, in the first embodiment, the laser beam irradiation means u and the cooling means 12 are provided on the lower surface side of the substrate G, but these may be provided on the upper side. Next, a description will be given of a control system of the laser processing apparatus LB1. Figure 2 is a block diagram of the e system control system. Laser lined LB1 towel, heating and cooling mechanism.卩10 (laser beam irradiation mechanism n, cooling mechanism i 2), scanning mechanism 13, transfer mechanism 14, substrate supporting mechanism (support) 15, substrate supporting mechanism (floating table) 16, hooking mechanisms 17, 18, and Each of the hooking mechanism moving units 19 and 2 is controlled by a control unit 21 composed of a computer (CPU). The control unit 21 is connected to the input unit 22 including a keyboard, a mouse, and the like, and the display unit 23 including a display screen for performing various displays, so that necessary information can be displayed on the screen and necessary instructions can be input or set up. Then, the processing operation is executed according to the program stored in advance. Eight times, the disconnection operation of the laser processing apparatus LM1 will be described. The graph is not interrupted in the traveling state of the cracks of the substrate G at each time point in the processing, and Fig. 4 shows the operating state of each of the hooking mechanisms 17 and 18 (corresponding to the graph of Fig. 1(b)). Fig. 3(a) shows a state in which the beam spot cooling point CS is just turned on and scanned from the beginning of the disconnection. As shown in FIG. 4(a), the transport mechanism 14G is used. G is attached to the substrate body side by the support members (5) to .... The edge material G1 side is floated by the gas 19 200936291 blown from the floating table i6a. The hooking mechanism 17 is placed. 18 has moved to the standby position away from the substrate. Figure 3 (b) is the point # state when the beam spot Bs and the cooling point cs gradually advance from the beginning of the disconnection. On the break start end side <breaking the set line, a crack is formed from the upper side to the lower side to form an opening Gc. After the opening ^ is formed, as shown in Fig. 4 (b), the hooking mechanism 17 operates to cause the convex portion 17a of the fishing mechanism to enter the opening Gc. At this time, when the distance between the opening surface of the center side substrate of the opening and the opening surface of the edge portion is sufficient, it is preferable to adjust the timing at which the convex portion 17a is placed so that the convex portion 17 & Open face Gf contact. Specifically, the delay time from the start of scanning to the operation of the hooking mechanism 17 is set in advance, and the beam spot BS and the cooling point cs are waited for a certain degree to travel along the predetermined line, and then the convex portion 17a is brought into the opening Gc. Then, as the beam spot BS and the cooling point CS travel, as shown in FIG. 4 ((wherein, the edge material G1 moves on the arm portion 17c, the opening Gc of the crack gradually expands. Further, the hook mechanism on the other side) 18 (inside the paper surface) is also not in the standby position. Fig. 3(c) is a state in which the beam spot BS and the cooling point cs further travel away from the opening start end. At this time, the amount of movement of the edge material G1 on the arm portion 17c As shown in Fig. 4(d), the hooking mechanism moving portion 9 starts pulling the hooking mechanism 17 in the lateral direction (X direction ^ because the amount of movement of the edge material G1 has decreased, so convex The portion 17a gradually approaches the breaking surface Gf of the edge material G1, and as soon as shown in Fig. 4(e), the convex portion 17a of the hooking mechanism 17 contacts the breaking surface Gf of the edge material G1. Then, the edge material G1 is The movement of the hooking mechanism 17 in the X direction also moves in the lateral direction (X direction) to assist the application of the force (disconnection force) which is split to the left and right along the line L of the opening of the opening ❹ 36 200936291. The hooking mechanism 17 is disposed on the lower surface side of the substrate G, and when the distance between the crack-breaking surface and the convex portion m is gradually approached, The edge material is supported by the arm portion 17 of the fishing stop mechanism 17. The front end of the crack formed before the convex portion 17a approaches the broken surface of the edge material G1 is directed from the hooking mechanism 17 toward the substrate. When the end of the disconnection of G has not progressed enough distance, the movement of the edge material G1# on the arm portion 17e and the movement in the χ direction is suppressed. The convex portion 17a contacts the broken surface of the rim material (1) (four), when the crack When the tip end has progressed from the hooking mechanism 17 toward the end of the disconnection end of the substrate G by a sufficient distance, the edge material G1 stays in the arm portion by the frictional force with the arm portion (7) and moves in the X direction. The edge material G1 is supported to be movable on the arm portion Pc. However, depending on the relationship between the air pressure in which the substrate g floats and the weight of the edge material G1, the edge material (1) may not float against the arm portion 17c. In this way, since the edge material G1 and the arm portion 17 have a moderate margin, that is, the soft contact between the edge material CH and the arm portion 17 is soft (because it is not tightly connected), so the position of the front end of the crack can be determined. Or the shape of the opening formed, such as the width of the crack, to automatically adjust the edge to the X direction Further, at this time, the hook mechanism 18 on the other side has not yet operated. Fig. 3 (4) is a state in which the beam spot BS and the cooling point cs further travel and the beam spot BS approaches the end of the predetermined line L of the substrate G. At this time, the hooking mechanism 18 disposed on the end of the disconnection end starts to operate, and is in the same operational state as the hooking mechanism 丨7 shown in FIG. 4(b), that is, the convex portion of the locking portion. The center of the center has entered the state of opening π. At this time, the timing of the convex portion W motion 21 200936291 is adjusted (the delay time from the start of scanning to the operation of the hooking mechanism 18 is set in advance) so that the convex portion 18a is not disconnected. Face Gf contact. Then, in the same operational state as the hooking mechanism 17 shown in Fig. 4(e), the rim material is moved to the lateral direction (X direction) to assistly apply the force which is split to the left and right along the line to cut 1 (broken force). In this case, the breaking force may be applied to the lateral direction (X direction) so as not to impede the progress of the crack of the thermal stress, depending on the weight of the edge material G1. Fig. 3(e) shows a state in which the cooling point CS is separated from the end of the end of the substrate G. The hooking mechanism 18 assists the travel of the crack by pulling the substrate G in the lateral direction (χ direction). Thereby, the crack travels to the substrate terminal and is completely broken. After the disconnection, the tilt mechanism 16b operates, and the flange member 16a is tilted to cause the edge material G1 to fall from the stage surface. In the present embodiment, the edge material G1 is separated from the substrate main body side by the waste material, but the edge material G1 is separated from the substrate G of the mother substrate into an assembly of the unit substrates or the unit substrates, or is separated into unit substrates. The strip substrate can also be applied to the present invention. (Embodiment 2) Fig. 5 is a perspective view showing the entire configuration of a laser processing apparatus LM2 according to a second embodiment of the present invention, Fig. 5(a) is a perspective view, and Fig. 5(b) is a front view, and Fig. 5(c) Is a top view. In the present embodiment, the hooking mechanisms 23 and 24 are provided on the upper surface side of the substrate G in place of the hooking mechanism 17 and the cymbal 8 described with reference to Fig. 1 . Further, the laser beam irradiation mechanism 11 and the cooling mechanism 12 are arranged to be scanned by the scanning mechanism provided on the side of the substrate G on the side of the 200936291 (the Futu ice*w is disconnected from the predetermined line Lit. The configuration of the same reference numeral is omitted, and the description of the same portion is given by the same reference numeral 4. The hooking mechanism 23 + bwu has the locking portion (10) of the convex portion 233, 243, and the arm that can be rotated by the motor drive The portion 23c, the stopper portions 23b, 24b can rotate the arm portion 17 between the standby position at which the door G is separated from the substrate G and the position at which the predetermined line L is disconnected from the substrate. ❹ The hook mechanism moving portion 19, 20 When the locking portions 23b, 24b are in a position to contact the line to be disconnected L, the edge member G1 can be driven by the motor to be separated from the substrate body G0 (center side) to the lateral direction (X direction). Further, the control system is the same as that of Fig. 2 of the embodiment. Next, the disconnection operation of the laser processing apparatus LM2 will be described. Fig. 6 shows the traveling state of the crack of the substrate G at each time point during the uncut processing, Fig. 7 Indicates the operating state of each of the hooking mechanisms 23, 24 (corresponding to the diagram of Fig. 5(b)). Fig. 6 and Fig. 7 correspond to Fig. 3 and Fig. 4 of the embodiment i, respectively. Fig. 6(a) shows that the beam spot is just started from the beginning of the disconnection. As shown in Fig. 7(a), the substrate G carried by the transport mechanism 14 is used to adsorb and fix the substrate main body side G0 by the supports i5a to 15c. The G1 side is floated by the gas blown from the floating table 16a. In the second embodiment, as will be described later, the gas blowing amount is set such that the upper side of the edge material G1 can be maintained and the arm portion 23c of the hooking mechanism 17 can be maintained. The state of the lower side of the 24c is abutted. The hooking mechanisms 23, 24 have moved to the standby position of the board G of the base 23 200936291. Fig. 6(b) is the beam spot BS and the cooling point cs gradually proceed from the beginning of the opening. In the state of the time point, a crack is formed on the disconnection planned line L on the disconnection start end side, and an opening Gc is formed. After the opening Gc is formed, as shown in FIG. 7(b), the hooking mechanism 23 operates. When the convex portion pa of the hooking mechanism 23 is inserted into the opening Gp, the timing at which the convex portion 23a is placed is adjusted so that the convex portion 23a does not overlap the opening surface G. Specifically, the delay time from the start of scanning to the operation of the hooking mechanism 17 is set in advance, and the beam spot and the cold spot CS are waited for a certain degree along the line to be cut, and then the convex portion is pushed in. Then, as the beam spot BS and the cooling point CS travel, as shown in Fig. 7(c), the edge material G1 moves while floating under the arm portion 23, and the opening Gc of the crack gradually expands. Further, the hook mechanism 24 on the other side is not yet in the standby position. [Fig. 6(c) shows a state in which the beam spot BS and the cooling point cs further travel away from the opening start end. At this time, the amount of movement of the edge material G1 has been lowered (or stopped as shown in FIG. 7(d), and the hooking mechanism moving portion 19 starts to pull the hooking mechanism nQ to the lateral direction (X direction). The amount of movement has been reduced, so that the convex portion 23a gradually approaches the breaking surface of the rim material (1), and soon, as shown in (4), the convex portion 23a of the hooking mechanism 23, that is, the breaking surface of the contact edge material (7), and then the edge The material G1 moves in the yaw direction with the fishing stop mechanism 23 and also moves in the lateral direction (X direction) to assist in applying a force (breaking force) that is split along the predetermined line [to the left and right.] The stopper mechanism 23 is disposed on the upper surface side of the substrate, and the substrate G that is floated by the gas under the appropriate air pressure 24 gradually rises the distance between the crack-cut surface Gf and the convex portion 23a. The upper side of the material G1 is movably supported by the arm portion 17c of the hooking mechanism 17. Here, when the leading end of the formed crack is not advanced enough distance from the hook end mechanism 17 toward the end end of the substrate G The upper surface of the edge material G1 is abutted under the arm portions 23 c, 24c and in the X direction. The movement is suppressed. On the other hand, when the front end of the crack has progressed from the hooking mechanism 17 toward the end of the breaking end of the substrate G by a sufficient distance, the edge of the edge material G1 is rubbed against the arms 23c, 24c. The force stays on the arms 23c, 24c and moves in the X direction. In this way, since the edge material G1 and the arm portions 23c, 24c have a moderate margin, that is, the friction between the edge member G1 and the arm portions 23c, 24c The force is softly contacted (because it is not tightly connected), so that the crack progressing state, such as the position of the front end of the crack or the width of the formed opening, is automatically adjusted, and the force of pressing the edge material in the x direction is automatically adjusted. The mechanism 18 has not yet been operated. Fig. 6(d) is a state in which the beam spot BS and the cooling point cs further travel to the end of the beam stop 〇BS close to the predetermined line L of the substrate G. At this time, it is disposed at the end of the disconnection. The hooking mechanism 18 starts to operate 'in the same state as the fishing mechanism 23 shown in Fig. 7 (8), that is, the convex portion 24a of the locking portion (10) has entered the opening Gc. At this time, the convex portion is adjusted. a point in time of action ((4) from the start of scanning to the hook The delay time until the mechanism 24 is actuated, the convex portion 24a is not in contact with the opening surface Gf. Then, the edge material (7) is moved to the lateral direction (X direction) in the same operation state as the hooking mechanism 23 shown in the figure. The auxiliary force (disengagement force) which is split to the right and left along the line to be cut 1 is applied in an auxiliary manner. That is, the forced breaking force for promoting the crack travel 25 200936291 is also applied from the hook mechanism 24 . e) a state in which the cooling point CS is separated from the end of the disconnection end of the substrate G. The hooking mechanism 24 assists the travel of the crack by pulling the substrate G in the lateral direction (X direction). The terminal of the substrate G is completely disconnected. After the disconnection, the reclining mechanism 16b operates, and by tilting the floating table 16a, the edge material G1 is dropped from the stage surface. Further, in the second embodiment, the laser beam irradiation means 丨丨 and the cooling mechanism 12 are provided on the upper surface side, and the hooking mechanisms 23, 24 are also provided on the upper surface side, but one of them may be provided on the lower side and the other side may be provided. One is set on the top side. (Embodiment 3) FIG. 8 is a perspective view of a laser processing apparatus LM3 according to a third embodiment of the present invention. In order to form a terminal portion of a bonded substrate, only the lower substrate of the bonded substrate is disconnected. The end material (end portion) is formed by exposing the terminal electrode portion of the upper substrate. In order to disconnect the end material (end portion) of the bonding substrate HGT side substrate, the laser beam "B", the beam spot BS of the radiation mechanism 11, and the cooling point of the cooling mechanism 12 are similarly selected from the laser processing skirt LM1.下方 The lower surface of the substrate HG is scanned toward the lower substrate. At this time, the substrate G can be turned off by executing the same sequence as that described with reference to FIGS. 3 and 4. Further, the terminals are not exposed. The part is disposed on the bonding substrate HG, and the upper and lower substrates are disconnected by the same in the same broken box. In this case, the radiation irradiation mechanism and the cooling mechanism 12 are disposed above and below. 26 200936291 (Embodiment 4) Fig. 9 is a front view of a laser processing apparatus according to a fourth embodiment of the present invention. In the present embodiment, the laser processing shown in Fig. 8 is shown. The configuration of the apparatus LM3 is provided with an air curtain nozzle 16c' for injecting the air curtain CG at the end of the floating table 16a for preventing the refrigerant injected from the cooling mechanism 12 from being wound onto the upper surface of the floating stage 16a. When the refrigerant contains cooling water If entering the upper surface of the floating table 16a and the substrate ❹ HG, Then, the substrate HG is in close contact with the floating table 16a and the substrate cannot be disconnected. Therefore, the refrigerant containing the cooling water can be used by injecting the air curtain CG at the end portion of the front end side of the floating table 16a to prevent proper back diffusion. In the case where the substrate HG is bonded, by injecting the air curtain C (3, it is also possible to prevent the cooling water from entering between the upper substrate and the lower substrate of the bonded substrate HG from the formed crack, thereby preventing the glass from adhering to each other. (Embodiment 5) FIG. 1 is a front view of a laser processing apparatus 1M5 Q according to a fifth embodiment of the present invention. In the present embodiment, a suction port I port 16d for removing a water-containing unnecessary refrigerant is provided instead of FIG. The air curtain nozzle 16c of the laser processing apparatus LM4 is formed by suctioning and removing the injected refrigerant to form a push-pull air curtain, thereby preventing the winding to the floating stage 16a. (Embodiment 6) FIG. 11 shows the present invention. Fig. 12 is a perspective view showing the overall configuration of a laser processing apparatus lm6 of the embodiment. Fig. 12 is a control system of the laser processing apparatus lm6. In the present embodiment, a camera 25 is mounted in the laser processing apparatus shown in Fig. Observed in The shape of the opening Gc of the crack of the plate 27 200936291 t In addition, the control system 21 is provided with an opening detecting unit % for detecting the size of the opening by the image captured by the camera 25. The opening detecting unit % is provided as the slave camera 25 The image detects whether the crack width (opening width) at the beginning of the break is above a predetermined threshold, and when the width of the opening is above the threshold, it is determined that the opening is sufficient to open the hook machine. By adding the determination operation 'When a sufficient opening is not formed for some reason, the hooking mechanism 17 can be prevented from operating. Further, the movement of the hooking mechanism 17 can be determined based on the observation result of the camera 25. At the time, the step of inserting the "7a into the opening of the crack" is also to be performed. The horizontal movement of the hooking mechanism 17 is started to gradually approach the distance between the cracked surface and the convex portion i7a, and the auxiliary crack is applied through the convex portion 17a. The start and end of the step of breaking the force of progress to start or stop the action of the hooking mechanism 17. (Embodiment 7) Fig. 13 is a modified embodiment of the locking portion 17b (18b' 23b' 24b) of the hooking mechanism 17 (18, 23, 24) of each of the above embodiments. The following description will be made with respect to the fishing stop mechanism 17. The hooking mechanism 17 is provided to connect the arm portion 17c and the locking portion 17b through the support shaft i7d so as to have a degree of freedom in the rotational direction within χγφ. The edge-side substrate G1 moves not only to the χ direction as the crack progresses, but also in the Υ direction or in the χγ plane (referred to as θ rotation). When the substrate and the contact surface of the convex portion 17a of the hooking mechanism 17 are fixed, since the movement in the Y direction or the rotation of 0 is not absorbed, the positional displacement of the contact portion may occur, and the flange side may not be transmitted. In the case of the auxiliary breaking force, the degree of freedom in the direction of rotation of the fulcrum 17d can be moved in the U direction and rotated in the U direction, and the breaking force to the edge substrate G1 can be surely transmitted. . / Fig. 13, although the convex portion of the locking portion of the hooking mechanism 17 (18, 23, 24) is exemplified as a surface contact with the crack-breaking surface, but may be provided as a hooking mechanism 17 (18, 23, 24) The convex portion 17a of the latching stopper 17b makes a line contact or a point contact with the crack-breaking surface. For example, as shown in FIG. 14, the pin m is set to
卡止β 17b之基i l7f上。銷17£係沿設置於基们之槽 17g支承成可滑動，並可變更其支數或彼此之間隔。此外， 銷⑺之材㈣料制例如摩㈣力較小域氟龍（註冊 商標）等樹脂。 上述實施形態7，雖形成為鉤止機構17之臂部17c與 卡止部17b可移動於γ 、 動於X方向且在XY面内具有旋轉方向之 自由度’不過鉤止機構亦可構成為使臂部m與卡止部17b 進行往XYZ之3個轴方向之移動或Θ旋轉（迴旋）。 Y方向之移動可構成為使鉤止機冑17之臂告p 17c與卡 止部17b移動於γ方向，藉由增加Y方向之移動，即；在 ΧΥ面内往任意方向更精確將輔助性斷開力傳達至緣側部 分0 Ζ方向之移動可構成為使鉤止機構17之臂部i7e與卡 止部17b移動於與灯面正交之Z方向，#由增加z方向 之移動，即可防止隨著裂痕之進展所造成之從緣側部分之 XY面的下垂’而可更精確進行裂痕之進展。 Θ旋轉可構成為使鉤止機構17之臂部17c與卡止部 29 200936291 17b以支點0(圖13)為中心迴旋，藉由增加0旋轉，可在 XY面内在任意方向更精確將輔助性斷開力傳達至緣侧部 分。 上述實施形態’雖配設2個鉤止機構17，1 8(23，24)， 不過鉤止機構只要1個以上即可，例如可僅位於基板〇之 斷開開始端側，亦可進一步依基板G之斷開長度追加配設 於2個鉤止機構17, 18(23, 24)之間。 上述實施形態，辅助斷開力控制部雖以預先所設定之 時點使以下各步驟動作，亦即將上述凸部17a置入上述裂痕 〇 之開口内、開始鉤止機構17之水平移動而使裂痕斷開面與 凸部17a之距離逐漸接近、以及透過凸部i7a施加輔助裂痕 進展之斷開力，不過亦可使上述一連串步驟連續進行，亦 即將凸部17a置入開口 Gc後，立即開始水平移動，不久抵 接於緣材G1之斷開面後’亦使凸部17a進一步直接進行水 平移動。 上述實施形態’雖使基板G —端側之緣部浮起以進行 全切加工，不過亦可對基板G兩侧之緣部或其以上之基板 ◎ 另一邊端部之緣部大致同時進行同樣的全切加工。 上述實施形態’雖沿斷開預定線L固定設置第一鉤止 機構17及第二鉤止機構18，不過亦可以可移動設置於沿斷 開預定線L之任意位置。 上述實施形態’雖說明除去基板之緣材或使端子電極 露出等之加工例，不過加工之目的並不限於此，本裝置亦 可適用於將單板或貼合基板之母板斷開成條狀、或從條狀 30 200936291 再斷開成各個產品基板。 本發明，可利用於藉由雷射照射進行全切加工之雷射 加工裝置。 【圖式簡單說明】 圖1(a)〜（c)係表示本發明之一實施形態之雷射加工裝 置LM1的構成圖。 圖2係表示圖1之雷射加工裝置之控制系統。 β 圖3(a)〜（e)係表示雷射加工裝置LM1之斷開加工中各 時點基板G之裂痕之行進狀態。 圖4(a)〜（e)係表示雷射加工裝置lmi之鉤止機構各時 點之動作。 圖5(a)〜（c)係本發明之二實施形態之雷射加工裝置 LM2的構成圖。 圖6(a)〜（e)係表示雷射加工裝置LM2之斷開加工中各 & 時點基板G之裂痕之行進狀態。 圖7(a)〜（e)係表示雷射加工裝置LM2之鉤止機構各時 點之動作。 圖8係表示本發明之三實施形態之雷射加工裝置LM3 的前視圖。 圖9係本發明之四實施形態之雷射加工裝置LM4的前 視圖。 圖10係本發明之五實施形態之雷射加工裝置LM5的前 視圖。 31 200936291 圖11係本發明之六實施形態之雷射加工裝置LM6的立 體圖 圖12係表示圖11之雷射加工裝置LM6之控制系統。 圖13(a)、（b)係表示鉤止機構之變形實施形態。 圖14係表示鉤止機構之變形實施形態。 板之 圖15 (a)〜（d)係表示藉由習知之全切加工逐步斷開基 緣材部分時之變化。 【主要 11 12 14 15, 16 18 20 元件符號說明】 0 雷射光束照射機構 冷卻機構 搬送機構 基板支承機構 鉤止機構 鉤止機構移動部 ❹ 32The base of the β 17b is locked on the i l7f. The pin 17 is supported to be slidable along the groove 17g provided in the base, and the number of the pins or the interval therebetween can be changed. In addition, the material of the pin (7) (4) is made of a resin such as a PTFE (registered trademark) with a small force (4). In the seventh embodiment, the arm portion 17c and the locking portion 17b of the hooking mechanism 17 are movable in the γ direction and in the X direction, and have a degree of freedom in the XY plane. However, the hooking mechanism may be configured as The arm portion m and the locking portion 17b are moved or twisted (swinged) in three axial directions of XYZ. The movement in the Y direction may be configured such that the arm of the hooking machine 告 17 and the locking portion 17b are moved in the γ direction by increasing the movement in the Y direction, that is, more accurately assisting in any direction in the facet The movement of the breaking force to the rim portion 0 Ζ direction can be configured such that the arm portion i7e and the locking portion 17b of the hooking mechanism 17 move in the Z direction orthogonal to the lamp surface, and # is moved by increasing the z direction, that is, The progress of the crack can be more accurately prevented by preventing the sag of the XY plane from the edge portion as the crack progresses. The rotation of the crucible can be configured such that the arm portion 17c of the hooking mechanism 17 and the locking portion 29 200936291 17b are pivoted around the fulcrum 0 (Fig. 13), and by adding 0 rotation, the auxiliary can be more accurately performed in any direction in the XY plane. The breaking force is transmitted to the rim portion. In the above-described embodiment, the two hooking mechanisms 17 and 18 (23, 24) are provided, but the hooking mechanism may be one or more. For example, the hooking mechanism may be located only on the side of the cutting start end of the substrate, or may be further The breaking length of the substrate G is additionally disposed between the two hooking mechanisms 17, 18 (23, 24). In the above-described embodiment, the auxiliary breaking force control unit operates the following steps at a predetermined time, that is, the convex portion 17a is placed in the opening of the slit, and the horizontal movement of the hooking mechanism 17 is started to break the crack. The distance between the open surface and the convex portion 17a is gradually approached, and the breaking force for assisting the crack development is applied through the convex portion i7a. However, the series of steps may be continuously performed, that is, the convex portion 17a is placed in the opening Gc, and the horizontal movement is started immediately. Immediately after the contact surface of the edge material G1 is closed, the convex portion 17a is further directly moved horizontally. In the above-described embodiment, the edge portion of the substrate G is floated to perform the full cutting process. However, the edge of the substrate on both sides of the substrate G or the edge portion of the other end portion may be substantially simultaneously performed. Full cut processing. In the above embodiment, the first hooking mechanism 17 and the second hooking mechanism 18 are fixedly disposed along the line to be cut L. However, the first hooking mechanism 17 and the second hooking mechanism 18 may be movably provided at any position along the predetermined line L. The above embodiment describes a processing example in which the edge material of the substrate is removed or the terminal electrode is exposed. However, the purpose of the processing is not limited thereto, and the apparatus may be adapted to break the mother board of the single board or the bonded substrate into strips. Shaped, or disconnected from strips 30 200936291 into individual product substrates. The present invention can be utilized in a laser processing apparatus that performs full cutting by laser irradiation. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 (a) to (c) are views showing the configuration of a laser processing apparatus LM1 according to an embodiment of the present invention. Figure 2 is a diagram showing the control system of the laser processing apparatus of Figure 1. Fig. 3 (a) to (e) show the traveling state of the crack of the substrate G at each time point in the breaking process of the laser processing apparatus LM1. 4(a) to 4(e) show the operation of the hooking mechanism of the laser processing apparatus 1mi at various times. Fig. 5 (a) to (c) are views showing the configuration of a laser processing apparatus LM2 according to the second embodiment of the present invention. 6(a) to 6(e) show the traveling state of the crack of the substrate G at each time point in the breaking process of the laser processing apparatus LM2. 7(a) to 7(e) show the operation of the hooking mechanism of the laser processing apparatus LM2 at various times. Fig. 8 is a front elevational view showing a laser processing apparatus LM3 according to a third embodiment of the present invention. Fig. 9 is a front view of a laser processing apparatus LM4 according to a fourth embodiment of the present invention. Fig. 10 is a front view of a laser processing apparatus LM5 according to a fifth embodiment of the present invention. 31 200936291 Fig. 11 is a perspective view of a laser processing apparatus LM6 according to a sixth embodiment of the present invention. Fig. 12 is a diagram showing a control system of the laser processing apparatus LM6 of Fig. 11. Figures 13(a) and (b) show a modified embodiment of the hooking mechanism. Fig. 14 is a view showing a modified embodiment of the hooking mechanism. Fig. 15 (a) to (d) show changes in the step of gradually breaking the base material portion by the conventional full cutting process. [Main 11 12 14 15, 16 18 20 Description of component symbols] 0 Laser beam irradiation mechanism Cooling mechanism Transport mechanism Substrate support mechanism Hook stop mechanism Hook stop mechanism moving part ❹ 32