200923109 九、發明說明 【發明所屬之技術領域】 本發明，係有關於被使用爲蒸鍍遮罩的附有蒸鍍遮罩 之薄片。又，本發明，係有關於從附有蒸鍍遮罩之薄片而 製造具備有蒸鍍遮罩之蒸鍍遮罩裝置的方法。進而，本發 明’係有關於製造被使用爲蒸鍍遮罩的附有蒸鍍遮罩之薄 片之方法。 【先前技術】 於先前技術中，係週知有：使用包含有以所期望之圖 案而被配列之孔的蒸鍍用遮罩，來以所期望之圖案而形成 薄膜之方法。而，最近，係強烈地要求有：例如在有機 EL顯示裝置之製造時而將有機材料蒸鍍於基板上的情況 等之中，經由蒸鍍來進行極爲高精細度之圖案化。 另外，此種蒸鍍用遮罩，一般而言，係可經由使用有 光微影技術之蝕刻，來在金屬板上形成孔，並藉由此而製 造之（例如，JP2004-393 1 9A )。又，在經由蝕刻而在金 屬板上形成孔的情況時，係存在有：從金屬板之兩方之側 的面來進行蝕刻之方法、和僅從金屬板之其中一方之側的 面來進行蝕刻之方法。 【發明內容】 然而’當對於爲了進行極爲高精細度之圖案化而以良 好精確度來形成有細微之孔的蒸鍍遮罩作處理的情況時， -4- 200923109 例如，在搬送蒸鍍遮罩時，會有使蒸鍍遮罩破損之虞。特 別是，在製造有機EL顯示裝置時，例如在爲了以所期望 之圖案來將有機發光材料於玻璃基板上作圖案化而被使用 的蒸鍍遮罩中，係有將在相同之方向上而延伸爲細長狀之 複數的孔以短節距來作配置的情形。而，當對此種蒸鍍遮 罩作處理時，由於對蒸鍍遮罩所作用之力，會容易地產生 有：蒸鍍遮罩之孔與孔之間被切斷、或是在孔與孔之間而 延伸爲線狀之部分其彼此之間相交絡一般的問題。 又，在使用有經由蝕刻所致作之蒸鍍遮罩的情況時， 就算是蒸鍍遮罩並未破損，亦會有無法以良好精確度來進 行極爲高精細度之圖案下的蒸鍍之問題。在本案發明者針 對此問題之原因而進行了調查硏究後，確認了以下之事態 〇 在使用有光微影技術之蝕刻中，侵蝕係從金屬板中之 未被光阻膜所覆蓋的區域而開始進行。而後，侵蝕係不僅 是在金屬板之厚度方向進行，而亦在沿著金屬板之板面的 方向上進行。故而，經由蝕刻，係被形成有前端爲細之孔 。因此，當從金屬板2之兩方之側的面來進行蝕刻的情況 時，係如圖12所示一般，成爲在金屬板2之厚度方向的 端部以外處，被形成有在孔2a內而剖面積（開孔面積） 成爲最小之突出部3。而後，當使用此種蒸鍍遮罩1來進 行蒸鍍的情況時，在對應於基板4中之突出部3的背面側 之區域處所被成膜之蒸鍍膜5的膜厚係不會安定。其結果 ，蒸鍍圖案之邊緣部會暈開（蒸鍍圖案之輪廓會變的不明 -5- 200923109 確）。又，基本上，對於在孔內所形成之突出部的位置或 是剖面形狀作控制一事本身便極爲困難。由以上可以得知 ，當對金屬板從兩方側之面來作蝕刻的情況時，係無法以 良好精確度來進行極爲高精細度的圖案下之蒸鍍。 另一方面，當對於金屬板而僅從上方側之面來進行蝕 刻處理的情況時，在經由侵蝕所形成之前端較細之孔中， 會殘留有已被使用於侵蝕而侵蝕能力變低了的蝕刻液。而 後，當金屬板之孔到達了下方側之面處時，到此爲止所殘 留在孔內之鈾刻液會從下方之面而流出，而侵蝕能力爲高 之新的鈾刻液會流入所形成之孔內。 此時，在剖面積（開孔面積）變小的孔內之下方側區 域處，液壓係變高，而孔內之下方側的區域，會被新的蝕 刻液而劇烈地侵蝕。其結果，與從金屬板之兩側來進行蝕 刻的情況時同樣的，在孔內會形成突出部。 又，當隔著光阻膜7而對於金屬板6僅從下方側之面 來進行鈾刻的情況時，如同圖1 3所示一般，若是藉由侵 蝕所形成之前端爲細的孔6a貫通金屬板6，則在上側面之 孔的周圍，會有殘留有蝕刻液8的情況。其結果，由於所 殘留之蝕刻液，從金屬板之上方側的面，侵蝕亦會進行’ 而與從金屬板之兩側來進行蝕刻的情況時同樣的’在孔內 會形成突出部。 由於此些原因，就算是在對於金屬板而僅從一方側之 面來進行蝕刻的情況中，蒸鍍圖案之邊緣部亦會暈開（蒸 鍍圖案之輪廓會變的不明確）。又，基本上，當對於金屬 -6- 200923109 板而從一方之面側來進行鈾刻的情況時，藉由在孔被貫 而蝕刻液開始流入時之所產生之壓力，會有孔的剖面形 變形的情況。而，於此情況，將孔以良好精確度來形成 所期望之形狀一事本身係成爲困難。此現象，係在上述 用以進行尚精細的圖案化之蒸鍍遮罩中，會成爲更加顯 。由以上可以得知，當對金屬板而僅從一方側之面來作 刻的情況時，亦係無法以良好精確度來進行極爲高精細 的圖案下之蒸鍍。 而，本發明，係爲考慮有此些之點而進行者，其目 ，係在於提供一種附有蒸鍍遮罩之薄片，其係包含有可 行極爲高精細度之圖案化的蒸鍍遮罩，且能夠對處理中 蒸鍍遮罩的破損作抑制。 又，本發明之目的，係在於提供一種：從係包含有 進行極爲高精細度之圖案化的蒸鍍遮罩之附有蒸鍍遮罩 薄片，來不使蒸鍍遮罩產生破損地而製造蒸鍍遮罩之方 0 進而，本發明之目的，係在於提供一種製造包含有 進行極爲高精細度之圖案化的蒸鍍遮罩’且能夠對處理 之蒸鍍遮罩的破損作抑制之附有蒸鍍遮罩之薄片的方法 本發明所致之附有蒸鍍遮罩之薄片’其特徵爲’具 有：樹脂製薄片；和被形成有複數之孔’且被層積於前 樹脂製薄片處之金屬製薄片，前述金屬製薄片，係在與 述樹脂製薄片分離後，成爲被作爲蒸鍍遮罩而使用。 在本發明所致之附有蒸鍍遮罩之薄片中’亦可設爲 通 狀 爲 之 著 蝕 度 的 進 之 可 之 法 可 中 3 備 述 刖 200923109 從前述金屬製薄片之不與前述樹脂製薄片相對面的側之面 起，朝向前述金屬製薄片之與前述樹脂製薄片相對面之側 的面，被形成於前述金屬製薄片處之孔的剖面積係逐漸變 小。在此種附有蒸鑛遮罩之薄片中，前述孔，係亦可爲藉 由在將前述金屬製薄片與前述樹脂製薄片相層積後的狀態 下而對前述金屬製薄片作蝕刻來形成之。 又，本發明所致之附有蒸鍍遮罩之薄片’係亦可更進 而具備有被與前述金屬製薄片相互固定了的框架。 進而，在本發明所致之附有蒸鍍遮罩之薄片中’前述 樹脂製薄片之對於前述金屬製薄片的接合力’係亦可成爲 會藉由對前述樹脂製薄片照射UV光而降低。在此種附有 蒸鍍遮罩之薄片中，前述樹脂製薄片，係具備有基材薄片 、和將前述基材薄片與前述金屬製薄片相接合之uv剝離 層，前述UV剝離層之接合力，係亦可成爲若是被照射 u V光則會降低。 進而，在本發明所致之附有蒸鍍遮罩之薄片中’亦可 設爲：前述複數之孔，係沿著一個方向而被並排配列’各 孔，係沿著與前述一個方向而相正交之另外一個方向而延 伸。 進而，在本發明所致之附有蒸鑛遮罩之薄片中’前述 金屬製薄片，係亦可爲包含有：以特定之圖案而被配置有 複數之孔的複數之有孔區域；和被配置於前述有孔區域間 之無孔區域。 進而，在本發明所致之附有蒸鍍遮罩之薄片中’係亦 -8- 200923109 可設爲：在與前述金屬製薄片之薄片面正交的剖面 連接前述金屬製薄片之不與前述樹脂製薄片相對面 之前述孔的端部、以及在前述金屬製薄片之與前述 薄片相對面的側處之前述孔的端部之兩者間的直線 述金屬製薄片之與前述樹脂製薄片相對面之面，其 所成之角度，係爲60°以下。 本發明所致之蒸鍍遮罩裝置之製造方法，係爲 之附有蒸鍍遮罩之薄片來製造蒸鍍遮罩裝置之方法 徵爲’具備有：使前述樹脂製薄片從前述金屬製薄 離’並將前述樹脂製薄片從前述附有蒸鍍遮罩之薄 除去之工程。 在本發明所致之蒸鍍遮罩裝置之製造方法中， 爲：前述樹脂製薄片之對於前述金屬製薄片的接合 成爲會藉由對前述樹脂製薄片照射UV光而降低， 除去樹脂製薄片之工程中，係對前述樹脂製薄片照 光’而使前述金屬製薄片與前述樹脂製薄片相分離 又’在本發明所致之蒸鍍遮罩裝置之製造方法 亦可爲：前述複數之孔，係沿著一個方向而被並排 各孔’係沿著與前述一個方向而相正交之另外方向 ’在前述除去樹脂製薄片之工程中，係沿著前述另 而使前述金屬製薄片與前述樹脂製薄片相分離。 進而’本發明所致之蒸鍍遮罩裝置之製造方法 可更進而具備有在前述金屬製薄片上安裝前述框架 °在金屬製薄片上安裝前述框架之工程，係可在將 處，在 的側處 樹脂製 ，和前 兩者間 由上述 ，其特 片而分 片上而 係亦可 力，係 在前述 射 UV 〇 中，係 配列， 而延伸 外方向 ，係亦 之工程 樹脂製 -9 - 200923109 薄片除去之工程前來進行，亦可在將樹脂製薄片除去之工 程後再來進行。 本發明所致之附有蒸鍍遮罩之薄片之製造方法，係爲 製造如上述一般之附有蒸鍍遮罩之薄片之方法，其特徵爲 ，具備有：供給具備有樹脂製薄片和被層積於前述樹脂製 薄片上之金屬製薄片的層積體之工程；和對所供給之層積 體進行蝕刻，而在金屬製薄片上形成多數之孔的工程。 在本發明所致之附有蒸鍍遮罩之薄片的蝕刻前述層積 體之工程中，係亦可形成身爲沿著一個方向而被並排配列 、且各孔係沿著與前述一個方向而相正交之另外方向而延 伸的多數之孔。 又，在本發明所致之附有蒸鍍遮罩之薄片中，前述層 積體，係亦可沿著前述另外方向而被供給。 進而，在本發明所致之附有蒸銨遮罩之薄片的前述蝕 刻層積體之工程中，係亦可在金屬製薄片處，形成複數之 以特定之圖案而被配置有複數之孔的有孔區域。 進而’在本發明所致之附有蒸鍍遮罩之薄片的前述供 給層積體之工程中，係亦可供給包含有若是照射UV光， 則其之對於前述金屬製薄片的接合力會降低之樹脂製薄片 的層積體。 進而’本發明所致之附有蒸鍍遮罩之薄片之製造方法 的前述供給層積體之工程中，係亦可將捲繞有前述層積體 之捲體回捲’而將延伸爲帶狀之層積體作供給。 若藉由本發明’則係可以得到包含有隨著從其中一方 -10- 200923109 之面而朝向另外一方之面而剖面積逐漸地變小、同時在另 外一方之面的形狀係被高精確度地形成的蒸鍍遮罩之附有 蒸鍍遮罩之薄片。且，在對附有蒸鍍遮罩之薄片作處理的 期間中，例如在搬送附有蒸鍍遮罩之薄片的期間中，成爲 蒸鍍遮罩之被形成有多數的孔之金屬製薄片，係經由樹脂 製薄片而被保護。故而，在搬送等之處理中，係能夠防止 成爲蒸鍍遮罩之金屬製薄片破損的事態。 【實施方式】 以下，參考圖1乃至圖1 1，對本發明所致之附有蒸鍍 遮罩之薄片、蒸鍍遮罩裝置之製造方法、以及附有蒸鍍遮 罩之薄片的製造方法之其中一種實施型態作說明。於此， 圖1乃至圖1 1，係爲用以對本發明之其中一種實施型態作 說明之圖。另外，在以下之實施型態中，係列舉出相關於 在製造有機EL顯示裝置時用以將有機發光材料以所期望 之圖案來在玻璃基板上進行圖案化而被使用之蒸鍍遮罩（ 蒸鍍用之金屬遮罩）的例子，來對附有蒸鍍遮罩之薄片、 蒸鍍遮罩裝置之製造方法、以及附有蒸鍍遮罩之薄片之製 造方法作說明。但是，本發明係並不被限定於此種例子， 對於在各種之用途中所被使用之蒸鍍遮罩（蒸鍍用之金屬 遮罩），均可適用本發明。 最初，針對附有蒸鍍遮罩之薄片、還有由此附有蒸鍍 遮罩之薄片所得到之蒸鍍遮罩以及蒸鍍遮罩裝置的其中一 例，主要參考圖1乃至圖6而作說明。於此，圖1係爲將 -11 - 200923109 附有蒸鍍遮罩之薄片由樹脂製薄片側來作展示的平面圖’ 圖2係爲沿著圖1之Π - Π線的剖面圖，圖3係爲將附有 蒸鍍遮罩之薄片從金屬製薄片側來作展示的部分平面圖’ 圖4係爲展示可由圖1中所示之附有蒸鍍遮罩之薄片而製 造的蒸鍍遮罩以及蒸鍍遮罩裝置之其中一例的立體圖’圖 5係爲用以對蒸鍍遮罩以及蒸鍍遮罩裝置之使用方法作說 明的圖。 如同於圖1乃至圖4中所示一般’附有蒸鍍遮罩之薄 片60，係具備有樹脂製薄片32、和被層積於樹脂製薄片 32上之金屬製薄片34。金屬製薄片34’係由矩形狀之金 屬製薄片所成’並被形成有複數之孔25。又’金屬製薄片 34，係在從樹脂製薄片32而被分離後，成爲蒸鍍遮罩20 〇 如圖1中所示一般，在本實施型態中，以成爲蒸鍍遮 罩20之方式而成的附有蒸鍍遮罩之薄片60的金屬製薄片 3 4，在俯視時係爲略四角形形狀，更正確而言’係於俯視 時具備有略矩形狀之輪廓。附有蒸鍍遮罩之薄片60的金 屬製薄片34，係具備有：被形成有孔25之複數的有孔區 域22、和並未被形成有孔25，而佔據將有孔區域22之周 圍作包圍的區域之無孔區域2 3。如圖1所示一般，各有孔 區域2 2，於俯視時係爲略四角形形狀，更正確而言，係於 俯視時而具備有略矩形狀之輪廓。 在本實施型態中，複數之有孔區域22 ’係沿著與附有 蒸鍍遮罩之薄片60之金屬製薄片34的一邊相平行之一方 -12- 200923109 向，而空出有特定之間隔地被作配置，同時，係沿著與前 述一方向相正交之另外一方向，而空出有特定之間隔地被 作配置。 又，如圖1以及圖3中所不一般，被設置在各有孔區 域22處之複數的孔25 ’在該當有孔區域22中，係沿著前 述之一方向而空出有等間隔地被並排配置。 又’各孔25’係平行於與前述一方向正交之另一方向 ，而從有孔區域22之其中一端起直到另外一端地延伸爲 細長狀。又’如圖2所示一般，從金屬製薄片34之其中 〜方之面34a而朝向另外一方之面34b，在沿著金屬製薄 片3 4之薄片面的剖面處之各孔2 5之剖面積，係成爲逐漸 地變小。 如同於後所詳述一般，從附有蒸鍍遮罩之薄片60，而 製作出蒸鍍遮罩裝置1〇。特別是，附有蒸鍍遮罩之薄片 6〇的金屬製薄片34 ’在與樹脂製薄片32相分離後，係成 舄作爲蒸鍍遮罩裝置10之蒸鍍遮罩20而被使用。 於此’參考圖4乃至圖6，對使用蒸鍍遮罩20以及蒸 _遮罩裝置10來進行蒸鍍的方法作說明。於圖4所示之 例中’蒸鍍遮罩裝置10,係具備有：由附有蒸鍍遮罩之薄 片60之金屬製薄片34所成的蒸鍍遮罩20、和被安裝於矩 形狀之蒸鍍遮罩20的周圍邊緣部之框架1 5。蒸鍍遮罩裝 置1〇之框架15，係以不會使蒸鍍遮罩20彎曲的方式，來 将蒸鍍遮罩保持在被拉張之狀態下。蒸鍍遮罩20與框架 1 5 ’例如係藉由點溶接而相互地被固定。 -13- 200923109 蒸鍍遮罩裝置1 〇，係如圖5以及圖6中所示一般，使 蒸鍍遮罩2〇成爲與玻璃基板42相對面’並支持於蒸鍍裝 置40內。在蒸鍍裝置40內，係在挾持此蒸鍍遮罩裝置10 之玻璃基板4 2的下方處’被配置有：收容蒸鍍材料（作 爲其中一例，例如有機發光材料）48的坩鍋44、和對坩 鍋44作加熱之加熱器46。 坩鍋44內之蒸鍍材料48 ’係藉由從加熱器48所進行 之加熱，而被氣化又或是昇華’並成爲附著於玻璃基板42 之表面上。如上述一般，在蒸鍍遮罩2〇處’係被形成有 多數之孔25，蒸鍍材料48 ’係經由此孔25而附著於玻璃 基板4 2上。 其結果，蒸鍍材料48，係以對應於蒸鍍遮罩20之孔 25的位置之所期望的圖案，而在玻璃基板42之表面上成 膜。 另外，在本實施型態中，1個的有孔區域22，係成爲 對應於1個的有機EL顯示裝置。亦即是，若是藉由於圖 1中所示之蒸鍍遮罩裝置1〇(蒸鍍遮罩20)，則成爲可進 行多區劃面之蒸鍍。 然而，如圖6中所示一般，當蒸鍍遮罩裝置1〇被收 容於蒸鍍裝置4〇中的情況時，蒸鍍遮罩20 (金屬製薄片 34)之其中一方的面20a(34a)，係與保持蒸鍍材料48 之坩鍋44相對面，而蒸鍍遮罩20 (金屬製薄片34 )之另 外一方的面2 0 b ( 3 4 b )，係與玻璃基板4 2相對面。亦即 是’如圖6中所不一般，蒸鑛材料4 8，係通過剖面積逐漸 -14- 200923109 變小之孔2 5，而附著於玻璃基板4 2上。如圖6 般，蒸鍍材料48，係亦會有並不從相·鍋44朝向 4 2進行直線移動’而是對於玻璃基板4 2之板面 動的情況。此時，若是孔25之剖面形狀係具備: 之以點線所展示的輪廓，則斜向移動之蒸鍍材料 附著在蒸鍍遮罩2 0上，而不會到達玻璃基板4 2 t 亦即是，爲了提高蒸鍍材料之利用效率（成 附著於玻璃基板42上之比例）而節約高價的蒸 在蒸鍍遮罩20(金屬製薄片34)之與薄片面正 (圖6之剖面）處，經由連接其中一方之面2〇a 的孔2 5之端部以及另外一方之面2 0 b ( 3 4 b )側β 端部的直線L、和另外一方之面2 0 b ( 3 4 b )的兩 之角度/3，係以越小越好。但是，相對於玻璃基 垂線而以大的角度來朝向玻璃基板42來移動的 之比例係爲少。而，若是前述之直線L相對於另 面20b所成的角度石係成爲60°以下，則蒸鍍材 效率係成爲充分的値。又，若是欲將直線L與另 面2 0 b所成的角度/3設爲未滿3 0 °，則不但孔2 5 成爲困難，且並無法得到能夠匹配於其之困難性 率之提升。亦即是，直線L與另外一方之面20b 度/3 ’係以設爲30°以上60°以下爲理想。 另外’若是將角度/3縮小，則係如同在圖6 鍊線所示一般，相鄰之孔2 5的壁面會成爲彼此 而’若是考慮蒸鑛遮罩20 (金屬製薄片）之強度 中所不一 玻璃基板 而斜向移 曾圖6中 4 8，係會 膜效率： 鍍材料， 交的剖面 (34a)側 勺孔2 5之 者間所成 板42之 蒸鍍材料 外一方之 料之成膜 外一方之 之形成係 的成膜效 所成之角 中以二點 連接。然 ，則係以 -15- 200923109 不使相鄰之孔25的壁面彼此連接爲理想，並以在其中一 方之面20a處的相鄰之孔25之間形成有5 " m以上之平坦 的面爲更理想。 亦即是，直線L之與另外一方之面20b所成的角度/3 ’係以設爲能夠在其中一方之面20a處的相鄰之孔25之 間形成有5 // m以上之平坦的面的角度以上，而設爲6 0 °以 下爲理想。 然而，如同上述一般，在本實施型態中，孔25係在 各有孔區域2 2處被等間隔地配置。作爲其中一例，當附 有蒸鍍遮罩之薄片60係被使用於用以製作行動電話或是 數位相機等之顯示器（2〜3吋左右）的蒸鍍遮罩20(蒸 鍍遮罩裝置1 0 )之情況時，孔2 5之配列節距（參考圖3 )，係可設爲 84em( 300ppi)以上，254/im(l〇〇ppi) 以下左右。另外，當欲進行彩色顯示的情況時，亦可沿著 孔25之配列方向（前述之其中一方向）而使蒸鍍遮罩20 (蒸鍍遮罩裝置1 0 )與玻璃基板42緩慢少量地相對移動 ，並將紅色用之有機發光材料、綠色用之有機發光材料以 及藍色用之有機發光材料依序作蒸鍍。又，當附有蒸鍍遮 罩之薄片60係被使用於用以製作行動電話之顯示器的蒸 鍍遮罩20 (蒸鍍遮罩裝置1 〇 )之情況時，沿著各孔25之 配列方向（上述之其中一方向）的寬幅（細縫寬幅），係 可設爲28//m以上84//πι以下左右。 又’蒸鍍遮罩裝置10，係被保持於成爲高溫氛圍之蒸 鍍裝置40的內部。故而，將成爲蒸鍍遮罩20之附有蒸鍍 -16- 200923109 遮罩之薄片60的金屬製薄片60、以及被使用於蒸鍍遮罩 裝置60中的框架15，係爲了防止彎曲或是熱應力的發生 ，而以經由熱膨脹率爲低之相同的材料來製作爲理想。作 爲此種材料，例如，係可使用3 6 % N i之恆範鋼（i n v ar ) 材。但是，係並不限定於此，而亦可將由不鏽鋼、銅、鐵 、鋁所成之薄片作爲金屬製薄片34而使用。 另一方面，作爲附有蒸鍍遮罩之薄片60的樹脂製薄 片32’例如，係可使用由具備有50//m〜150/zm左右之 厚度的聚對苯二甲酸乙二酯或是聚丙烯所成之薄片。在本 實施型態中，係採用若是照射UV光則其之相對於金屬製 薄片34的接合力會下降一般之樹脂製薄片32。具體而言 ’係如圖2所示一般，樹脂製薄片3 2，係可設爲具備有： 由聚對苯二甲酸乙二酯所成之基材薄片32a、和在被層積 在基材薄片32a上的同時，而與金屬製薄片34相對面之 UV剝離層32b。於此，所謂UV剝離層32b，於初始，係 爲具備有黏著力，並將基材薄片32a與金屬製薄片34相 接著’但是’若是被照射UV光，則被照射之部分的黏著 力係會降低。例如，係成爲若是被照射UV光，則被照射 之部分會硬化且對於金屬製薄片3 4之接合力會降低。此 種UV剝離層32b，例如，係可由丙烯系UV再剝離型接 合劑來形成。 接下來，針對使用由上述一般之構成所成之附有蒸鍍 遮罩之薄片60而製造蒸鍍遮罩裝置1〇的方法，主要參考 圖7而作說明。 -17- 200923109 如圖7所示一般，在本實施型態中，蒸鍍遮罩裝置之 製造方法，係包含有：準備包含有樹脂製薄片32與被層 積在樹脂製薄片32上並已形成有孔之金屬製薄片34的附 有蒸鍍遮罩之薄片60的工程；和使樹脂製薄片32從金屬 製薄片34而分離，並將樹脂製薄片32從附有蒸鍍遮罩之 薄片60上而除去之工程；和將金屬製薄片34安裝於框架 1 5上的工程。針對各工程，於以下更進而作詳細說明。 首先，將所準備之附有蒸鍍遮罩之薄片60，供給至除 去裝置（除去手段）54處。 於圖7所示之例中，附有蒸鍍遮罩之薄片60，係以使 金屬製薄片34位置於下方，同時使樹脂製薄片32位置於 上方的方式，來作供給。又，如圖7所示一般，在本實施 型態中之除去裝置54，係具備有UV光照射手段55。UV 光照射手段5 5，係沿著附有蒸鍍遮罩之薄片6 0的移動路 徑而被設置，並具備有將附有蒸鍍遮罩之薄片60從樹脂 製薄片32側來作包覆之遮蔽罩（shade ) 5 5a，和被配置 在遮蔽罩55a內之UV光源55b。而後，被作搬送之附有 蒸鍍遮罩之薄片60，係從樹脂製薄片32側而被照射UV 光，經由通過樹脂製薄片32之基材薄片32a的UV光，將 基材薄片32a與金屬製薄片34 (蒸鍍遮罩20 )作接著之 UV剝離層32b的接著力係大幅減弱。其結果，成爲附有 蒸鍍遮罩之薄片60之樹脂製薄片32與金屬製薄片34 (蒸 鍍遮罩20 )，係成爲可相互分離。而後，如圖7所示一般 ，一面經由滾輪57來對附有蒸鍍遮罩之薄片60作導引， -18- 200923109 一面將樹脂製薄片3 2從金屬製薄片3 4而緩慢地剝離。 另外，將樹脂製薄片3 2從金屬製薄片3 4而拉扯剝離 之方向，係以與被形成在金屬製薄片34上之孔25所延伸 存在之方向（上述之另外方向）平行爲理想。當沿著此種 方向而將樹脂製薄片3 2從金屬製薄片3 4分離的情況時， 係能夠有效地防止金屬製薄片3 4之孔2 5與孔2 5之間被 切斷、或是在孔2 5與孔2 5之間而延伸爲線狀之部分相交 絡的事態。 如此這般，係可得到由從樹脂製薄片32所分離之金 屬製薄片34而成的蒸鍍遮罩20。而後，對於所得到之蒸 鍍遮罩2 0，而將框架1 5固定。在圖7所示之例中，係經 由銲點溶接裝置59，來將框架1 5對於蒸鍍遮罩20而作固 定。 如同上述一般，而得到由蒸鍍遮罩2 0和被固定於蒸 鍍遮罩20上之框架15所成的蒸鍍遮罩裝置10。 另外，在上述一般之蒸鍍遮罩裝置之製造方法中，附 有蒸鍍遮罩之薄片60以及蒸鍍遮罩20(金屬製薄片34) 之搬送方向，係以與被形成在金屬製薄片34上之孔25所 延伸存在之方向（上述之另外方向）平行爲理想。當沿著 此種方向而搬送附有蒸鍍遮罩之薄片60以及蒸鍍遮罩20 (金屬製薄片3 4 )的情況時，係能夠有效地防止金屬製薄 片34之孔25與孔25之間被切斷、或是在孔25與孔25 之間而延伸爲線狀之部分相交絡的事態。 若藉由上述一般之方法，則係能夠從附有蒸鍍遮罩之 -19- 200923109 薄片60，而極爲容易地製作蒸鍍遮罩裝置1〇。又，藉由 將把樹脂製薄片32從金屬製薄片而剝離之方向、以及附 有蒸鍍遮罩之薄片60以及蒸鍍遮罩20 (金屬製薄片34) 的搬送方向，均設定爲被形成在金屬製薄片34處之孔25 所延伸的方向，係能夠有效地防止金屬製薄片3 4之孔2 5 與孔2 5之間被切斷、或是在孔2 5與孔2 5之間而延伸爲 線狀之部分相交絡的事態。亦即是，能夠避免已被形成於 金屬製薄片3 4處的細微之孔2 5的形狀，在其後之處理過 程中被損傷的問題。 接下來’針對製造附有蒸鍍遮罩之薄片的方法，主要 參考圖8乃至圖1〇而作說明。 如圖8中所示一般’在本實施型態中之蒸鍍遮罩之製 造方法’係包含有：供給具備有樹脂製薄片3 2和被層積 於樹脂製薄片32上之金屬製薄片34的層積體30之工程 ;和對層積體3 0之金屬製薄片3 4施加使用有光微影技術 之蝕刻，而在金屬製薄片34上形成多數之孔25的工程； 和在蝕刻工程後，將層積體3 0切斷爲特定之長度的工程 。針對各工程，於以下更進而作詳細說明。 如圖8中所示一般，在本實施型態中，係準備有將層 積體30捲收於供給芯3 1的層積體之捲體29。而後，藉由 使此供給芯旋轉並將捲體29回捲，來如同圖8所示一般 地供給延伸爲帶狀之層積體3 0。於此，層積體3 0，係以 使金屬製薄片34位置於下方，同時使樹脂製薄片32位置 於上方的方式，來作供給。此種捲體29，係可以低價而獲 -20- 25 200923109 得，且在處理上係非常方便。 另外’層積體30之金屬製薄片34，係被形成有孔 並成爲蒸鑛遮罩20。故而’如上述一般，金屬製薄片 ’例如係由3 6 % N i恆範鋼材所成。又，樹脂製薄片3 2 係如上述一般’例如’係由具備有50；am〜150//m左 之厚度的聚對苯二甲酸乙二酯或是聚丙烯所成。但是， 了能夠從金屬製薄片3 4而將樹脂製薄片3 2容易地剝離 係如上述一般，以使用若是照射UV光則其之對於金屬 薄片3 4的接合力係會降低的樹脂製薄片3 2爲理想。 被供給之層積體3 0，係經由蝕刻裝置（蝕刻手段） 而被施加蝕刻處理。具體而言，首先，係在層積體30 金屬製薄片34的面上（圖9之紙面處的下側之面上） 布感光性光阻材料’並在金屬製薄片3 4上形成光阻膜 。接下來’準備以不使光透過光阻膜36中之欲除去之 域的方式而製作的玻璃乾板3 7，並將玻璃乾板3 7配置 光阻膜3 6上。 而後，如圖9所示一般，將光阻膜3 6隔著玻璃乾 37而曝光’並進而將光阻膜36顯像。如上述一般，而 層積體30之金屬製薄片34上形成光阻圖案36a。 另外，亦可將玻璃乾板37中之與欲除去的光阻膜 對面之區域設爲黑色，並使用可視光來作爲曝光光。於 情況，藉由以黑色部分來吸收可視光，在光阻膜3 6之 除去的區域處係不會入射有光，而光阻膜3 6係不會固 在金屬製薄片34上。另一方面，在光阻膜36之不應除 34 右 爲 ， 製 50 之 塗 36 區 在 板 在 相 此 應 定 去 -21 - 200923109 的區域處係會入射光，而在該當區域光阻膜36係會固定 在金屬製薄片34上。未固定之光阻膜36，例如係經由熱 水洗淨而被除去。 接下來，如圖10所示一般，將被形成在金屬製薄片 3 4上之光阻圖案3 6 a作爲遮罩，而藉由蝕刻液3 8來對層 積體3 0作蝕刻。在本實施型態中，鈾刻液3 8，係從配置 在被作搬送之層積體30的下方處之飩刻裝置50的噴嘴51 ，來隔著光阻圖案36a而朝向金屬製薄片34之其中一方 的面3 4 a來作噴射。此時，如同於圖1 0中以點線所示一 般，在金屬製薄片34中之未被光阻圖案36a所覆蓋的區 域處，係開始蝕刻液所致之侵蝕。而後，侵蝕係不僅是在 金屬製薄片34之厚度方向進行，而亦在沿著金屬製薄片 34之薄片面的方向上前進。如上述一般，蝕刻液所致之侵 蝕，係從金屬製薄片34之其中一方的面34a而進行至另 外一方之面34b，並形成將金屬製薄片34貫通之孔25。 而後，將層積體30上之光阻圖案3 6a除去，並進而 對層積體3 0進行水洗。如此這般，係可得到由樹脂製薄 片32和被形成有多數之孔25的金屬製薄片34而成之附 有蒸鍍遮罩之薄片60。 然而，若是未設置有樹脂製薄片32，則如上述一般’ 在金屬製薄片34被貫通並形成了孔25之後，在金屬製薄 片34之另外一方之面34b側，蝕刻液係會滯留，而有可 能會產生使孔25之形狀以及大小變得不安定之問題。但 是，若藉由本實施型態，則就算是被形成有將金屬製薄片 -22- 200923109 34貫通之孔25，此孔25之上方側，亦係經由樹脂製薄 32而被覆蓋。故而，能夠對於在先前之方法中所產生的 題確實地迴避。 其結果，金屬製薄片34係僅從其中一方之面34a 進行侵蝕，被形成於金屬製薄片34處之孔25的剖面積 係成爲從其中一方之面34a ( 20a )起朝向另外一方之 3 4b ( 2 0b )而逐漸地變小。又，係能夠將具備有所期望 開孔面積（俯視時之孔2 5的面積）的孔2 5，以良好精 度來形成。 而後，如此這般所得到之附有蒸鍍遮罩之薄片6 0， 藉由以將該當附有蒸鍍遮罩之薄片60作挾持的狀態來 旋轉的一對之搬送滾輪52、52，而被搬送至切斷裝置（ 斷手段）5 3處。另外，經由以此搬送滾輪5 2、5 2之旋 而在附有蒸鍍遮罩之薄片60以及層積體處起作用的張 (拉張力），來使上述之供給芯31旋轉，並成爲從捲 29而供給層積體30。 又，在本實施型態中，金屬製薄片34係經由樹脂 薄片32而被作支持以及補強。故而，在層積體30以及 有蒸鍍遮罩之薄片60的搬送時，能夠對於經由在孔25 孔25之間所作用之應力所造成的在金屬製薄片34之孔 與孔25之間被切斷、或者是在孔25與孔25之間而延 爲線狀的部分相交絡一般之問題極爲有效的作抑制。其 果，能夠避免在蝕刻工程中所形成於金屬製薄片3 4處 細微之孔25的形狀，在其後之處理過程中被損傷的問 片 問 而 面 之 確 係 作 切 轉 力 體 製 附 與 25 伸 結 的 題 -23- 200923109 另外，當形成有如同上述一般之沿著與配列方向相正 交之方向而細長延伸的孔2 5之情況時’孔2 5之延伸方向 (上述之另外方向），與層積體30之被作供給的方向（ 層積體以及附有蒸鎪遮罩之薄片60被作搬送的方向）， 係以成爲略平行爲理想。於此情況，係能夠有效地防止金 屬製薄片34之孔25與孔25之間被切斷、或是在孔25與 孔2 5之間而延伸爲線狀之部分相交絡的事態。 如此這般而被搬送至切斷裝置53處的附有蒸鍍遮罩 之薄片60，係以使金屬製薄片34成爲具備有與一枚之蒸 鍍遮罩20的長度相同長度之方式，而依序被切斷。如上 述一般，而依序製作枚葉狀之附有蒸鍍遮罩之薄片60。 如上述一般，若藉由本實施型態，則會成爲蒸鍍遮罩 20之附有蒸鍍遮罩之薄片60的金屬製薄片34’係被層積 於樹脂製薄片32上，並經由樹脂製薄片32而被保護。故 而，在處理附有蒸鍍遮罩之薄片60時，例如在搬送附有 蒸鍍遮罩之薄片60時，作用在附有蒸鍍遮罩之薄片中的 金屬製薄片34處的張力（拉張力）係顯著的降低，而能 夠有效地防止被形成在金屬製薄片34上之細微的孔25之 破損。 又，可對於被層積在樹脂製薄片32上之金屬製薄片 34來形成孔25。故而，能夠對於金屬製薄片34而僅從其 中一方之面34a來作蝕刻，並形成貫通金屬製薄片34之 孔25。於此情況，孔25雖係貫通金屬製薄片34，但是位 -24- 200923109 置於金屬製薄片34之另外一方的面34b側之孔25的端部 ，係經由樹脂製薄片32而被覆蓋。亦即是，由於孔25係 並未貫通層積體3 0，因此，能夠避免上述之先前技術中的 問題。藉由此，能夠在金屬製薄片3 4上，形成從其中一 方之面34a (20a)起朝向另外一方之面34b (20b)而剖 面積逐漸變小之孔25。又，亦能夠將以高精細之圖案而開 孔之蒸鍍遮罩20，以良好精確度來製作。 而後，經由從此附有蒸鍍遮罩之薄片60而將樹脂製 薄片32除去，而能夠容易地製作由金屬製薄片34而成的 蒸鍍遮罩20。若藉由如此這般所得到之蒸鍍遮罩20、以 及使用有此蒸鍍遮罩2 0之蒸鍍遮罩裝置1 〇，則能夠以良 好精確度來進行高精細之圖案下的蒸鍍。故而，如此這般 所得到之蒸鍍遮罩2〇以及蒸鍍遮罩裝置10，係非常適合 於在製造有機EL顯示裝置時而用以例如將有機發光材料 以所期望之圖案來在玻璃基板上進行圖案化所使用的蒸鍍 遮罩（蒸鍍用之金屬遮罩）。 另外，關於上述之實施形態，係可在本發明之要旨內 作各種的變更。 以下，針對變形例之其中一例作說明。 在上述之實施型態中，在製造蒸鍍遮罩裝置1〇時， 雖係展示對樹脂製薄片3 2照射UV光，並將樹脂製薄片 32從層積體3〇而除去的例子作了說明，但是，樹脂製薄 片3 2之除去方法’係並不限定於此。例如，亦可將層積 體30送入加熱爐（除去手段）中，並使層積體3〇之樹脂 -25- 200923109 製薄片32燃燒，來從層積體30而將樹脂製薄片32除去 。當使樹脂製薄片3 2燃燒而將其除去的情況時，係可藉 由使用有簡易的裝置之簡易的方法’來不對形成於金屬製 薄片34 (蒸鍍遮罩20 )上之孔25形成影響地而將樹脂製 薄片32從金屬製薄片34而分離。另外，當使樹脂製薄片 32燃燒並將其除去的情況時，則係並不需要使用經由照射 UV光而使其之對於金屬製薄片34的接合力降低的樹脂製 薄片32。 又’在上述之實施型態中，在製造附有蒸鍍遮罩之薄 片60時，雖係展示準備預先將樹脂製薄片32與樹脂製薄 片3 4作了層積後的層積體3 0並作供給的例子作了說明， 但是’係並不限定於此。例如，係亦可在供給延伸爲帶狀 之金屬製薄片34的同時，供給延伸爲帶狀之樹脂製薄片 ’並將所供給之金屬製薄片3 4與樹脂製薄片3 2作層積， 而製作層積體30，再對依序被製作之層積體30而施加上 述之處理，來製作附有蒸鍍遮罩之薄片60。或者是，亦可 在供給延伸爲帶狀之金屬製薄片34的同時，在被供給之 金屬製薄片34上層積枚葉狀之樹脂製薄片32，並對於金 屬製薄片34中之被層積有枚葉狀之樹脂製薄片32的部分 (層積體30)依序施加上述之處理，來製作附有蒸鍍遮罩 之薄片60。或者是，亦可在供給延伸爲帶狀之樹脂製薄片 32的同時，在被供給之樹脂製薄片32上層積枚葉狀之金 屬製薄片34’並對於被層積於樹脂製薄片32上之金屬製 薄片34而依序施加上述之處理，來製作附有蒸鍍遮罩之 -26- 200923109 薄片60。 進而’在上述之實施型態中，在製造附有蒸鍍遮罩之 薄片6〇時’雖係展示在金屬製薄片34上形成孔25，而後 將金屬製薄片34經由切斷裝置53來切斷爲特定之長度的 例子作了說明，但是，係並不限定於此。例如，係亦可在 將孔25形成於金屬製薄片34處之前，而進行將金屬製薄 片3 4切斷之工程。 進而，在上述之實施型態中，在製造附有蒸鏟遮罩之 薄片60時’雖係展示以使附有蒸鍍遮罩之薄片6〇的金屬 製薄片34成爲具備有與蒸鍍遮罩20之一枚份的長度相同 之長度的方式，來將附有蒸鍍遮罩之薄片60作切斷的例 子作了說明，但是，係並不限定於此。例如，亦能夠以使 附有蒸鍍遮罩之薄片60的金屬製薄片34成爲具備有較蒸 鍍遮罩20之一枚份的長度爲更長之長度（例如，蒸鍍遮 罩20二枚份之長度）的方式，來切斷附有蒸鍍遮罩之薄 片60。又，亦可如圖1 1所示一般，並不將延伸爲帶狀之 附有蒸鍍遮罩之薄片60切斷，而將其捲取於捲取芯61上 ，並作爲附有蒸鍍遮罩之薄片60的捲體60a來進行處理 (出貨以及搬送等）。進而，代替將附有蒸鍍遮罩之薄片 6〇全體作切斷，亦能夠以不會將樹脂製薄片32 —起切斷 的方式，來將層積體30作半切斷（half cut)，而僅將金 屬製薄片34切斷。進而，在經由蝕刻而形成孔25之工程 中，亦能夠以將金屬製薄片34以特定之長度來作邊緣切 割的方式而進行蝕刻。亦即是，在經由蝕刻而形成孔2 5 -27- 200923109 時’亦能夠藉由蝕刻來將金屬製薄片34分離爲特定之長 度。於此情況’係遗夠節省另外將金屬製薄片3 4切斷爲 特定之長度的工程。 進而’在上述之實施型態中’在從附有蒸鍍遮罩之薄 片60來製造蒸鍍遮罩裝置1〇時，雖係展示將框架丨$安 裝在從樹脂製薄片32所分離之金屬製薄片34 (蒸鍍遮罩 20 )上的例子’但是’係並不限定於此。例如，亦可在從 樹脂製薄片32而分離之前’便將框架15安裝在金屬製薄 片34(蒸鍍遮罩20)上。又’在製造附有蒸鍍遮罩之薄 片60時，亦可設置將框架15安裝於金屬製薄片上之 工程’並作爲被安裝有框架15之附有蒸鍍遮罩之薄片6〇 來進行處理（出貨以及搬送等）。 【圖式簡單說明】 〔圖1〕圖1，係爲展示本發明所致之附有蒸鍍遮罩 之薄片的其中一種實施型態之俯視圖。 〔圖2〕圖2 ’係爲沿著圖1之E — π線的剖面圖。 〔圖3〕圖3，係爲圖1中所示之附有蒸鍍遮罩之薄 片的部分底面圖。 〔圖4〕圖4，係爲展示可由圖1中所示之附有蒸鍍 遮罩之薄片而製造的蒸鍍遮罩以及蒸鍍遮罩裝置之其中一 例的立體圖。 〔圖5〕圖5，係爲用以對蒸鍍遮罩以及蒸鍍遮罩裝 置之使用方法作說明的圖。 -28- 200923109 〔圖6〕圖6，係爲用以對蒸鍍遮罩之作用作說明的 圖。 〔圖7〕圖7，係爲用以對本發明所致之蒸鍍遮罩裝 置之製造方法的其中一種實施型態作說明之圖’而係爲用 以對從圖1中所示之附有蒸鍍遮罩之薄片來製造蒸鍍遮罩 以及蒸鍍遮罩裝置之方法作說明之圖。 〔圖8〕圖8，係爲用以對本發明所致之附有蒸鍍遮 罩之薄片之製造方法的其中一種實施型態作說明之圖，而 係爲用以對製造圖1中所示之附有蒸鍍遮罩之薄片的方法 作說明之圖。 〔圖9〕圖9，係爲用以對在層積體（金屬製薄片） 上形成光阻圖案之方法作說明的圖。 〔圖10〕圖1〇，係爲用以說明對層積體（金屬製薄 片）作蝕刻之方法的圖。 〔圖1 1〕圖1 1，係爲對應於圖8之圖，而係爲用以 對製造附有蒸鍍遮罩之薄片之方法的其中一種變形例作說 明的圖。 〔圖12〕圖12 ’係爲對應於圖6之圖，而係爲用以 封使用由從兩側而被飽刻之金屬板所成的蒸鍍遮罩來進行 蒸鍍之方法作說明的圖。 〔圖1 3〕圖1 3，係爲對應於圖1 〇之圖，而係爲用以 對從下方側之面而對金屬板進行蝕刻來製造蒸鑛遮罩之方 法作說明的圖。 -29- 200923109 【主要元件符號說明】 1 :蒸鍍遮罩 2 :金屬板 2 a .孔 3 :突出部 4 :基板 5 :蒸鍍膜 6 :金屬板 6 a :孔 7 :光阻膜 8 :蝕刻液 1 〇 :蒸鍍遮罩裝置 1 5 :框架 20 :蒸鍍遮罩 20a :其中一方之面 2 0b :另外一方之面 2 2 :有孔區域 2 3 :無孔區域 2 5 ·孔 29 :捲體 30 :層積體 3 1 :供給芯 3 2 :樹脂製薄片 32a :基材薄片 -30 200923109 3 2 b : U V剝離層 34 :金屬製薄片 34a:其中一方之面 34b:另外一方之面 3 6 :光阻膜 3 6a :光阻圖案 3 7 :玻璃乾板 3 8 :蝕刻液 40 :蒸鍍裝置 42 :玻璃基板 4 4 :坩鍋 4 6 :加熱器 4 8 :蒸鍍材料 50 :蝕刻裝置 5 1 :噴嘴 5 2 :搬送滾輪 5 3 :切斷裝置 54 :除去裝置 55 : UV光照射手段 55a :遮蔽罩 5 5 b : U V光源 5 7 :滾輪 5 9 :點溶接裝置 60 :附有蒸鍍遮罩之薄片 -31 200923109 60a :捲體 6 1 :捲取芯 -32200923109 IX. [Technical Field] The present invention, There is a sheet with an evaporation mask that is used as an evaporation mask. also, this invention, There is a method of manufacturing a vapor deposition mask having a vapor deposition mask from a sheet with a vapor deposition mask. and then, The present invention relates to a method of manufacturing a vapor-coated mask-coated sheet that is used as an evaporation mask. [Prior Art] In the prior art, The department knows that: Using a mask for vapor deposition that includes holes arranged in a desired pattern, A method of forming a film in a desired pattern. and, recent, The department strongly requests: For example, in the case where an organic material is vapor-deposited on a substrate during the manufacture of an organic EL display device, Extremely high definition patterning is carried out by evaporation. In addition, Such a mask for vapor deposition, In general, It can be etched by using photolithography. To form holes in the metal plate, And manufactured by it (for example, JP2004-393 1 9A). also, In the case where a hole is formed in a metal plate by etching, There are: a method of etching from a side of both sides of a metal plate, And etching is performed only from the side of one side of the metal plate. SUMMARY OF THE INVENTION However, when a vaporized mask having fine holes is formed with good precision for patterning with extremely high definition, -4- 200923109 For example, When transporting the vapor deposition mask, There will be a flaw in the evaporation mask. especially, When manufacturing an organic EL display device, For example, in an evaporation mask used to pattern an organic light-emitting material on a glass substrate in a desired pattern, There are cases where a plurality of holes extending in the same direction and extending into a slender shape are arranged with a short pitch. and, When processing this type of vapor deposition mask, Due to the force exerted on the vapor deposition mask, Will be easy to produce with: The hole between the vapor deposition mask and the hole is cut, Or a problem in which a portion extending in a line shape between a hole and a hole is in contact with each other. also, When using a vapor deposition mask caused by etching, Even if the vapor deposition mask is not damaged, There is also the problem that evaporation under extremely high definition patterns cannot be performed with good precision. After the inventor of the case investigated the cause of the problem, The following matters have been confirmed 〇 In the etching using photolithography, The erosion is initiated from the area of the metal sheet that is not covered by the photoresist film. then, The erosion system is not only carried out in the thickness direction of the metal sheet, It is also carried out in the direction along the surface of the metal plate. Therefore, Via etching, The system is formed with a fine hole at the front end. therefore, When etching is performed from the faces on both sides of the metal plate 2, As shown in Figure 12, Beyond the end in the thickness direction of the metal plate 2, The protruding portion 3 having the smallest sectional area (opening area) in the hole 2a is formed. then, When such a vapor deposition mask 1 is used for vapor deposition, The film thickness of the vapor deposited film 5 which is formed at a region corresponding to the back surface side of the protruding portion 3 in the substrate 4 is not stabilized. the result , The edge of the vapor deposition pattern will smudge (the outline of the vapor deposition pattern will become unknown -5 - 200923109). also, basically, It is extremely difficult to control the position or the shape of the projection formed in the hole itself. It can be known from the above that When the metal plate is etched from the sides of the two sides, It is not possible to perform vapor deposition under extremely high definition patterns with good precision. on the other hand, When etching is performed only from the upper side of the metal plate, In the thin hole at the front end formed by erosion, An etchant that has been used for erosion and has reduced etching ability remains. Then, When the hole of the metal plate reaches the lower side, The uranium engraving remaining in the hole will flow out from below. A new uranium entrainment with high erosion capacity will flow into the formed pores. at this time, At a lower side region in the hole where the sectional area (opening area) becomes smaller, The hydraulic system becomes higher, The area on the lower side of the hole, It will be violently eroded by new etchants. the result, The same as in the case of etching from both sides of the metal plate, A protrusion is formed in the hole. also, When the uranium engraving is performed only on the surface of the metal plate 6 from the lower side via the photoresist film 7 As shown in Figure 13. If the hole 6a which is formed at the front end by the erosion penetrates the metal plate 6, Then around the hole on the upper side, There may be cases where the etching liquid 8 remains. the result, Due to the residual etching solution, From the upper side of the metal plate, The erosion also proceeds to the same extent as in the case of etching from both sides of the metal plate, and a projection is formed in the hole. For these reasons, In the case of etching only from one side to the metal plate, The edge of the vapor deposition pattern is also fainted (the outline of the evaporation pattern becomes unclear). also, basically, When uranium engraving is performed from the side of one side to the metal -6-200923109 board, By the pressure generated when the hole is passed and the etching liquid starts to flow in, There will be a case where the profile of the hole is deformed. and, In this case, It is difficult to form the desired shape by the hole with good precision. This phenomenon, In the above-described vapor deposition mask for performing fine patterning, Will become more obvious. It can be known from the above that When the metal plate is only etched from the side of one side, It is also impossible to perform vapor deposition under extremely high-definition patterns with good precision. and, this invention, In order to consider having such a point, Its purpose, Is to provide a sheet with an evaporation mask, It contains a vaporized mask that can be patterned with extremely high definition. Moreover, it is possible to suppress breakage of the vapor deposition mask during processing. also, The purpose of the present invention, The system is to provide one: The vapor-containing mask is provided with an evaporation mask that is patterned to a very high definition. In order to prevent the vapor deposition mask from being damaged, the vapor deposition mask is produced. 0 Further, The purpose of the present invention, The present invention provides a method for producing a vapor-deposited sheet comprising a vapor-deposited mask that performs patterning with extremely high definition and capable of suppressing damage of the vapor-deposited mask to be treated. A sheet with an evaporated mask 'characterized' has: Resin sheet; And a metal sheet which is formed with a plurality of holes' and is laminated on the front resin sheet. The aforementioned metal flakes, After being separated from the resin sheet, It is used as a vapor deposition mask. In the sheet with the vapor deposition mask which is obtained by the present invention, the method of forming the surface of the vapor-deposited mask can also be used as a method for making the degree of corrosion. 3 备200923109 The metal sheet is not made of the above resin. The side of the opposite side of the sheet, a surface facing the side of the metal foil opposite to the surface of the resin sheet, The cross-sectional area of the hole formed at the aforementioned metal foil is gradually reduced. In such a sheet with a steam mask, The aforementioned holes, The metal flakes may be formed by etching the metal flakes in a state in which the metal flakes are laminated with the resin flakes. also, The sheet with the vapor deposition mask attached to the present invention may be further provided with a frame that is fixed to the metal sheet. and then, In the sheet with the vapor deposition mask of the present invention, the "bonding force of the resin sheet to the metal sheet" may be lowered by irradiating the resin sheet with UV light. In such a sheet with an evaporation mask, The aforementioned resin sheet, Is provided with a substrate sheet, And a uv release layer that bonds the aforementioned substrate sheet to the aforementioned metal sheet, The bonding force of the aforementioned UV release layer, It can also be reduced if it is irradiated with u V light. and then, In the sheet with the vapor deposition mask resulting from the present invention' can also be set as: The aforementioned plurality of holes, Are arranged side by side in one direction, 'holes, The extension is in another direction orthogonal to one of the foregoing directions. and then, In the sheet of the present invention with a steam mask, the aforementioned metal sheet, The system can also include: a plurality of apertured regions having a plurality of apertures configured in a particular pattern; And a non-porous region disposed between the aforementioned perforated regions. and then, In the sheet with the vapor deposition mask caused by the present invention, the system can be set as follows: a cross section perpendicular to a surface of the sheet of the metal foil is connected to an end of the hole of the metal foil which is not opposite to the resin sheet, And a surface of the metal foil which is opposite to the surface of the resin sheet on the side of the hole at the side of the metal foil opposite to the sheet, Its perspective, It is 60° or less. A method of manufacturing an evaporation mask device according to the present invention, A method of manufacturing a vapor deposition mask with a sheet of vapor-deposited mask is provided as: The resin sheet is thinned from the metal and the resin sheet is removed from the thin portion with the vapor deposition mask. In the method of manufacturing the vapor deposition mask device of the present invention, for: The joining of the resin sheet to the metal sheet is reduced by irradiating the resin sheet with UV light. In the process of removing resin sheets, The method of manufacturing the vapor deposition mask according to the present invention may be carried out by illuminating the resin sheet to remove the metal sheet from the resin sheet. The aforementioned plurality of holes, By arranging the holes in one direction along the other direction ′ in a direction orthogonal to the one direction described above, in the foregoing process of removing the resin sheet, The metal flakes are separated from the resin flakes in the same manner as described above. Further, the method for producing a vapor deposition mask device according to the present invention may further include a process of attaching the frame to the metal foil, and attaching the frame to the metal foil. Can be in the will, On the side of the resin, Between the former and the former Its special film can be divided into pieces and can be used. In the aforementioned UV 〇, Matching column, And extending the outer direction, Department of Engineering Resin -9 - 200923109 The process of removing the sheet is carried out, It can also be carried out after the process of removing the resin sheet. A method for manufacturing a sheet with an evaporation mask caused by the present invention, Is a method of manufacturing a sheet having an evaporated mask as described above, Its characteristic is that Have: Supplying a laminate including a resin sheet and a metal sheet laminated on the resin sheet; And etching the supplied layered body, The project of forming a plurality of holes in a metal foil. In the process of etching the foregoing laminate with the sheet of the vapor deposition mask caused by the present invention, The system can also be formed to be arranged side by side in one direction, And each of the holes is a plurality of holes extending in the other direction orthogonal to the aforementioned one direction. also, In the sheet with the vapor deposition mask caused by the present invention, The aforementioned laminate, It can also be supplied along the other direction described above. and then, In the construction of the foregoing etched laminate with a sheet of vaporized ammonium mask resulting from the present invention, It can also be found in metal sheets. A plurality of perforated regions in which a plurality of holes are arranged in a specific pattern are formed. Further, in the above-mentioned work for supplying the laminate of the vapor-deposited sheet, which is caused by the present invention, The system can also supply if it is irradiated with UV light. Then, it is a laminate of a resin sheet in which the bonding strength of the metal flakes is lowered. Further, in the construction of the supply layered body in which the method of manufacturing a sheet of a vapor deposition mask is produced by the present invention, Alternatively, the wound body wound with the laminate may be wound back to supply a laminated body extending in a strip shape. According to the present invention, it is possible to obtain a cross-sectional area which gradually becomes smaller as it goes toward the other side from the side of one of the -10-200923109, At the same time, the shape of the other side is a high-precision vapor-deposited mask with a vapor-deposited mask. And, During the processing of the sheet with the vapor-deposited mask, For example, during the conveyance of the sheet with the vapor deposition mask, a metal sheet formed of a plurality of holes into a vapor deposition mask, It is protected by a resin sheet. Therefore, In the handling of transportation, etc. It is possible to prevent the metal sheet which is a vapor deposition mask from being damaged. [Embodiment] Hereinafter, Refer to Figure 1 to Figure 1 1. For the sheet of the present invention with an evaporation mask, Manufacturing method of vapor deposition mask device, And an embodiment of the manufacturing method of the sheet with the vapor deposition mask described above. herein, Figure 1 to Figure 1 It is a diagram for explaining one of the embodiments of the present invention. In addition, In the following implementations, An example of a vapor deposition mask (metal mask for vapor deposition) for use in patterning an organic light-emitting material on a glass substrate in a desired pattern when manufacturing an organic EL display device , To the sheet with the vapor deposition mask, Manufacturing method of vapor deposition mask device, And a method of manufacturing a sheet with a vapor deposition mask as an illustration. but, The present invention is not limited to such an example. For vapor deposition masks (metal masks for vapor deposition) used in various applications, The present invention is applicable. initial, For sheets with an evaporated mask, There is also an example of a vapor deposition mask and a vapor deposition mask obtained by attaching a sheet of a vapor deposition mask, The description will be mainly made with reference to Fig. 1 to Fig. 6. herein, Fig. 1 is a plan view showing a sheet of a vapor deposition mask attached to a -11 - 200923109 from a side of a resin sheet. Fig. 2 is a cross-sectional view taken along line Π - Π of Fig. 1, Figure 3 is a partial plan view showing the sheet with the vapor-deposited mask attached from the side of the metal sheet. Figure 4 is a view showing the vapor deposition which can be produced by the sheet with the vapor-deposited mask shown in Figure 1. FIG. 5 is a perspective view for explaining a method of using a vapor deposition mask and a vapor deposition mask. FIG. As shown in Fig. 1 through Fig. 4, generally, a sheet 60 with an evaporation mask is attached. It is provided with a resin sheet 32, And a metal foil 34 laminated on the resin sheet 32. The metal foil 34' is formed of a rectangular metal sheet and is formed with a plurality of holes 25. And 'metal sheet 34, After being separated from the resin sheet 32, Become a vapor deposition mask 20 一般 As shown in Figure 1, In this embodiment, A metal foil 3 4 having a vapor deposition mask sheet 60 formed by vapor deposition mask 20, It has a slightly square shape when viewed from the top. More precisely, it has a slightly rectangular outline when viewed from above. a metal sheet 34 with a vapor-coated mask sheet 60, The system has: a plurality of apertured regions 22 formed with apertures 25, And not formed with holes 25, The non-porous region 2 3 occupies a region surrounded by the perforated region 22. As shown in Figure 1, in general, Each hole has a region 2 2, It has a slightly quadrangular shape when viewed from above. More correctly, It has a slightly rectangular outline when viewed from above. In this embodiment, The plurality of perforated regions 22' are along a side parallel to one side of the metal flakes 34 to which the vapor-deposited mask sheet 60 is attached, -12-200923109. The vacancy is configured at a specific interval. Simultaneously, In another direction orthogonal to the aforementioned direction, The vacancy is configured at a specific interval. also, As shown in Figure 1 and Figure 3, A plurality of holes 25' disposed at each of the perforated regions 22 are in the perforated region 22, They are arranged side by side at equal intervals in one of the directions described above. Further, each of the holes 25' is parallel to the other direction orthogonal to the aforementioned one direction, From the one end of the perforated area 22 to the other end, it is elongated. Again, as shown in Figure 2, From the square surface 34a of the metal foil 34 to the other surface 34b, The cross-sectional area of each of the holes 25 along the section of the sheet surface of the metal foil 34, The system gradually became smaller. As detailed later, From the sheet 60 with the evaporated mask, A vapor deposition mask device was produced. especially, A sheet of vapor-deposited mask 6 〇 is separated from the resin sheet 32 by The crucible is used as the vapor deposition mask 20 of the vapor deposition mask device 10. Here, reference is made to FIG. 4 to FIG. 6, A method of performing vapor deposition using the vapor deposition mask 20 and the vaporization mask unit 10 will be described. In the example shown in Fig. 4, the vapor deposition mask device 10 is The system has: a vapor deposition mask 20 formed of a metal foil 34 with a vapor-coated mask sheet 60; And a frame 15 which is attached to the peripheral edge portion of the vapor-deposited mask 20 of the rectangular shape. The frame 15 of the vapor deposition mask device is In a manner that does not bend the vapor deposition mask 20, To keep the evaporation mask in tension. The vapor deposition mask 20 and the frame 15 5 ' are fixed to each other by, for example, spot welding. -13- 200923109 Evaporating mask device 1 〇, As shown in Figure 5 and Figure 6, The vapor deposition mask 2 is placed opposite the glass substrate 42 and supported in the vapor deposition device 40. In the vapor deposition device 40, The lower portion of the glass substrate 4 2 holding the vapor deposition mask device 10 is disposed with: Containing vapor deposition materials (as an example, a crucible 44 such as an organic luminescent material 48, And a heater 46 for heating the crucible 44. The vapor deposition material 48' in the crucible 44 is heated by the heater 48. It is vaporized or sublimated, and becomes attached to the surface of the glass substrate 42. As above, A plurality of holes 25 are formed in the vapor deposition mask 2', The vapor deposition material 48' is adhered to the glass substrate 42 through the hole 25. the result, Evaporating material 48, Corresponding to the desired pattern corresponding to the position of the aperture 25 of the evaporation mask 20, On the other hand, a film is formed on the surface of the glass substrate 42. In addition, In this embodiment, 1 perforated area 22, It is an organic EL display device corresponding to one. That is, If it is by the vapor deposition mask device 1 shown in Fig. 1 (vapor deposition mask 20), Then, it becomes a vapor deposition which can perform multi-zones. however, As shown in Figure 6, in general, When the vapor deposition mask device 1 is accommodated in the vapor deposition device 4, The surface 20a (34a) of one of the vapor masks 20 (metal sheets 34) is vapor-deposited, It is opposite to the crucible 44 holding the evaporation material 48, And the other surface 2 0 b ( 3 4 b ) of the vapor deposition mask 20 (metal foil 34), It is opposite to the glass substrate 42. That is, as shown in Figure 6, Steamed mineral material 4 8, Through the section area gradually -14- 200923109, the hole 2 5, It is attached to the glass substrate 42. As shown in Figure 6, Evaporating material 48, There is also a case where the surface of the glass substrate 42 is not moved from the phase of the pan 44 to the linear movement. at this time, If the cross-sectional shape of the hole 25 is: The outline shown by the dotted line, The vapor deposition material moving obliquely is attached to the vapor deposition mask 20, Without reaching the glass substrate 4 2 t, that is, In order to increase the utilization efficiency of the vapor deposition material (the ratio of adhesion to the glass substrate 42), high-priced steam is saved. At the vapor deposition mask 20 (metal foil 34) and the sheet surface (section of Fig. 6), a straight line L passing through the end of the hole 2 5 connecting the one surface 2〇a and the other end surface 2 0 b ( 3 4 b ) side β end The angle between the two sides of the other side 2 0 b ( 3 4 b ) / 3, The smaller the better. but, The ratio of moving toward the glass substrate 42 at a large angle with respect to the glass-based perpendicular is small. and, If the angle L formed by the straight line L with respect to the other surface 20b is 60 or less, The efficiency of the vapor deposition material is sufficient. also, If the angle /3 formed by the line L and the other surface 2 0 b is set to less than 30 °, Not only does hole 2 5 become difficult, And there is no improvement in the difficulty rate that can match it. That is, The line L and the other surface 20b/3' are preferably 30° or more and 60° or less. In addition, if the angle / 3 is reduced, It is as shown in the chain line of Figure 6. The wall faces of the adjacent holes 25 will become mutually and if the glass substrate is not affected by the strength of the steam mask 20 (metal sheet), it is obliquely shifted. Membrane efficiency: Plating material, The cross-section (34a) side of the scoop hole 2 is formed by the vapor deposition material of the plate 42. The film formation effect of the other one is formed by the two-point connection. Of course, It is desirable that -15-200923109 does not connect the walls of adjacent holes 25 to each other. And 5 " is formed between adjacent holes 25 at the face 20a of one of the faces A flat surface above m is more desirable. That is, The angle /3 ' formed by the straight line L and the other surface 20b is equal to or higher than the angle at which a flat surface of 5 // m or more is formed between the adjacent holes 25 at one of the faces 20a. , It is ideal to set it to 60 ° or less. however, As above, In this embodiment, The holes 25 are arranged at equal intervals in each of the perforated regions 22. As an example, When the sheet 60 with the vapor deposition mask is used for the vapor deposition mask 20 (evaporation mask device 10) for producing a display such as a mobile phone or a digital camera (about 2 to 3 inches) Time, The arrangement pitch of holes 2 5 (refer to Figure 3), Can be set to 84em (300ppi) or more. 254/im (l〇〇ppi) is about the following. In addition, When you want to display in color, The vapor deposition mask 20 (the vapor deposition mask device 10) and the glass substrate 42 may be moved relatively slowly in a small amount along the arrangement direction of the holes 25 (one of the directions described above). And use the organic luminescent material for red, The organic light-emitting material for green and the organic light-emitting material for blue are sequentially vapor-deposited. also, When the sheet 60 to which the vapor deposition mask is attached is used in the case of the vapor deposition mask 20 (evaporation mask apparatus 1 〇) for producing a display of a mobile phone, a width (slit width) along the arrangement direction of each of the holes 25 (one of the above directions), It can be set to about 28//m or more and 84//πι or less. And 'vapor deposition mask device 10, It is held inside the vapor deposition device 40 which is a high temperature atmosphere. Therefore, A metal sheet 60 to which the vapor-deposited mask 20 is attached with a sheet 60 of the mask -16-200923109 mask, And the frame 15 used in the vapor deposition mask device 60, In order to prevent bending or thermal stress, It is preferable to produce it by the same material having a low thermal expansion coefficient. For this material, E.g, It is possible to use 3 6 % N i of constant steel (i n v ar ). but, The system is not limited to this. It can also be made of stainless steel, copper, Iron, A sheet made of aluminum is used as the metal sheet 34. on the other hand, The resin sheet 32' as the sheet 60 to which the vapor deposition mask is attached is, for example, A sheet made of polyethylene terephthalate or polypropylene having a thickness of about 50//m to 150/zm can be used. In this embodiment, When the UV light is irradiated, the bonding force with respect to the metal foil 34 is lowered to a general resin sheet 32. Specifically, 'as shown in Figure 2, Resin sheet 3 2, Can be set to have: a substrate sheet 32a made of polyethylene terephthalate, And while being laminated on the substrate sheet 32a, The UV release layer 32b is opposite to the metal foil 34. herein, The so-called UV peeling layer 32b, At the beginning, For adhesion, The base sheet 32a and the metal sheet 34 are followed by 'but' if it is irradiated with UV light, Then the adhesion of the irradiated part is reduced. E.g, If it is irradiated with UV light, Then, the irradiated portion is hardened and the bonding force to the metal foil 34 is lowered. Such a UV peeling layer 32b, E.g, It can be formed by a propylene-based UV re-peeling type bonding agent. Next, A method of manufacturing a vapor deposition mask device 1 using a sheet 60 with a vapor deposition mask formed by the above-described general configuration, Mainly with reference to Fig. 7 for explanation. -17- 200923109 As shown in Figure 7, in general, In this embodiment, a method of manufacturing a vapor deposition mask device, The system contains: A process of preparing a vapor deposition mask-containing sheet 60 comprising a resin sheet 32 and a metal sheet 34 laminated on the resin sheet 32 and having holes formed therein is prepared; And separating the resin sheet 32 from the metal sheet 34, And removing the resin sheet 32 from the sheet 60 to which the vapor deposition mask is attached; And the work of attaching the metal foil 34 to the frame 15. For each project, The details will be further described below. First of all, The sheet 60 to which the vapor deposition mask is prepared is prepared, It is supplied to the removing device (removal means) 54. In the example shown in Figure 7, a sheet 60 with an evaporation mask, So that the metal foil 34 is positioned below, At the same time, the resin sheet 32 is positioned above, Come for supply. also, As shown in Figure 7, in general, In the present embodiment, the removing device 54, The UV light irradiation means 55 is provided. UV light irradiation means 5 5, It is set along the moving path of the sheet 60 with the vapor deposition mask attached. A mask 5 5a having a sheet 60 with a vapor deposition mask attached from the side of the resin sheet 32 is provided. And a UV light source 55b disposed in the shield 55a. then, The sheet 60 to be conveyed with a vapor deposition mask, The UV light is irradiated from the side of the resin sheet 32, The UV light passing through the substrate sheet 32a of the resin sheet 32, The adhesion force between the base sheet 32a and the metal sheet 34 (vapor deposition mask 20) as the subsequent UV release layer 32b is greatly reduced. the result, The resin sheet 32 and the metal sheet 34 (vapor deposition mask 20) having the vapor deposition mask sheet 60 are attached. The system can be separated from each other. then, As shown in Figure 7, in general, The sheet 60 with the vapor deposition mask is guided via a roller 57, -18- 200923109 The resin sheet 3 2 is slowly peeled off from the metal sheet 34. In addition, The direction in which the resin sheet 3 2 is pulled from the metal sheet 34 is peeled off. It is preferable that the direction in which the hole 25 formed on the metal foil 34 extends (the other direction described above) is parallel. When the resin sheet 3 2 is separated from the metal sheet 34 in such a direction, It is possible to effectively prevent the hole between the hole 2 5 and the hole 2 5 of the metal foil 34 from being cut, Or a situation in which the portion extending between the holes 25 and the holes 25 and extending in a line shape intersects. So, A vapor deposition mask 20 obtained by forming a metal foil 34 separated from the resin sheet 32 is obtained. then, For the obtained vaporized mask 2 0, The frame 15 is fixed. In the example shown in Figure 7, Passing through the solder joint melting device 59, The frame 15 is fixed for the vapor deposition mask 20. As above, The vapor deposition mask device 10 formed by the vapor deposition mask 20 and the frame 15 fixed to the vapor deposition mask 20 is obtained. In addition, In the above manufacturing method of the vapor deposition mask device, The sheet 60 with the vapor deposition mask and the transport direction of the vapor deposition mask 20 (metal sheet 34) are attached. It is preferable that it is parallel to the direction in which the hole 25 formed in the metal foil 34 extends (the other direction described above). When the sheet 60 with the vapor deposition mask and the vapor deposition mask 20 (metal sheet 3 4 ) are conveyed in such a direction, It is possible to effectively prevent the hole 25 of the metal foil 34 from being cut between the hole 25 and the hole 25, Or a state in which a portion extending between the hole 25 and the hole 25 and extending in a line shape is entangled. If by the above general method, It can be obtained from the -19-200923109 sheet 60 with an evaporation mask. It is extremely easy to produce a vapor deposition mask device. also, By peeling the resin sheet 32 from the metal sheet, And a sheet 60 with a vapor deposition mask and a conveyance direction of the vapor deposition mask 20 (metal sheet 34). Both are set in a direction in which the hole 25 formed at the metal foil 34 extends. It is possible to effectively prevent the hole between the hole 2 5 and the hole 2 5 of the metal foil 34 from being cut, Or a state in which the portion extending between the hole 25 and the hole 25 and extending into a line is entangled. That is, It is possible to avoid the shape of the minute holes 25 which have been formed at the metal sheet 34, The problem of being damaged during the subsequent processing. Next, 'for the method of manufacturing a sheet with an evaporation mask, The description will be mainly made with reference to Fig. 8 to Fig. 1 . As shown in Fig. 8, the "manufacturing method of the vapor deposition mask in the present embodiment" generally includes: The process of supplying the laminate 30 having the resin sheet 3 2 and the metal sheet 34 laminated on the resin sheet 32 is supplied; And etching of the metal foil 34 of the laminate body 30 using photolithography, And the process of forming a plurality of holes 25 in the metal foil 34; And after the etching process, The layered body 30 is cut to a specific length of work. For each project, The details will be further described below. As shown in Figure 8, in general, In this embodiment, A wrap 29 in which the laminate 30 is wound around the laminated body of the supply core 31 is prepared. then, By rotating the supply core and rewinding the wrap 29, The laminated body 30 extending in a strip shape is generally supplied as shown in Fig. 8. herein, Laminated body 30, So that the metal foil 34 is positioned below, At the same time, the resin sheet 32 is positioned above, Come for supply. Such a wrap 29, Can be obtained at a low price -20- 25 200923109 And it is very convenient in processing. Further, the metal foil 34 of the laminate 30, A hole is formed and becomes a vapor mask 20. Therefore, as mentioned above, The metal foil ‘ is formed, for example, from 3 6 % N i Hengfan steel. also, The resin sheet 3 2 is generally as described above, for example, having 50; A polyethylene terephthalate having a thickness of am~150//m is formed of polyethylene terephthalate or polypropylene. but, The resin sheet 3 2 can be easily peeled off from the metal sheet 34. It is preferable to use the resin sheet 3 2 which is reduced in the bonding force to the metal foil 34 when the UV light is irradiated. The layered body to be supplied 3 0, An etching process is applied via an etching device (etching means). in particular, First of all, On the surface of the metal foil 34 of the laminate 30 (the lower surface of the paper surface of Fig. 9), a photosensitive photoresist material is disposed, and a photoresist film is formed on the metal foil 34. Next, a glass dry plate 3 7 prepared in such a manner that light is not transmitted through the region of the photoresist film 36 to be removed is prepared. The glass dry plate 3 7 is placed on the photoresist film 36. then, As shown in Figure 9, in general, The photoresist film 36 is exposed through the glass stem 37 and the photoresist film 36 is further developed. As above, On the metal foil 34 of the laminate 30, a photoresist pattern 36a is formed. In addition, The area of the glass dry plate 37 opposite to the photoresist film to be removed may also be set to black. And use visible light as the exposure light. In the case of By absorbing visible light in black, No light is incident at the region where the photoresist film 36 is removed, The photoresist film 36 is not attached to the metal foil 34. on the other hand, In the photoresist film 36 should not be divided 34 right, The area of the coating of the 50th is in the area where the board should be in the range of -21 - 200923109, the incident light will be incident. On the other hand, the area resist film 36 is fixed to the metal sheet 34. Unfixed photoresist film 36, For example, it is removed by washing with hot water. Next, As shown in Figure 10, The photoresist pattern 3 6 a formed on the metal foil 3 4 is used as a mask. The layer 3 is etched by the etching solution 38. In this embodiment, Uranium engraving 3 8, From the nozzle 51 of the engraving device 50 disposed below the laminated body 30 being transported, The ejection is performed toward the surface 3 4 a of one of the metal sheets 34 via the photoresist pattern 36a. at this time, As shown by the dotted line in Figure 10, In the region of the metal foil 34 that is not covered by the photoresist pattern 36a, It is the erosion caused by the etching solution. then, The erosion system is not only carried out in the thickness direction of the metal foil 34, It also advances in the direction along the sheet surface of the metal foil 34. As above, Erosion caused by etching solution, From the surface 34a of one of the metal sheets 34 to the other surface 34b, A hole 25 through which the metal foil 34 is inserted is formed. then, The photoresist pattern 3 6a on the laminate 30 is removed, Further, the layered body 30 is washed with water. So, A sheet 60 with a vapor deposition mask formed of a resin sheet 32 and a metal sheet 34 formed with a plurality of holes 25 is obtained. however, If the resin sheet 32 is not provided, Then, as described above, after the metal sheet 34 is penetrated and the hole 25 is formed, On the other side 34b side of the metal foil 34, The etching solution will stay, However, there is a possibility that the shape and size of the hole 25 become unstable. But yes, According to this embodiment, Even if it is formed with a hole 25 through which the metal sheet -22-200923109 34 is penetrated, Above the hole 25, It is also covered by the resin thin 32. Therefore, It can be avoided with respect to the problems generated in the previous methods. the result, The metal foil 34 is eroded only from one of the faces 34a. The cross-sectional area of the hole 25 formed in the metal foil 34 is gradually reduced from the surface 34a (20a) of one of the faces 34b (20b) toward the other. also, It is possible to have a hole 25 having a desired opening area (area of the hole 25 in a plan view), Formed with good precision. then, The thus obtained sheet of vapor-deposited mask 60 is obtained. a pair of transport rollers 52 that are rotated in a state in which the sheet 60 to which the vapor deposition mask is attached is held 52, It is transported to the cutting device (breaking means) 53 places. In addition, By way of this, the roller 5 is transported. 5 2 rotation and the sheet (with tension) acting on the sheet 60 with the vapor deposition mask and the laminate, To rotate the above-mentioned supply core 31, The laminated body 30 is supplied from the roll 29. also, In this embodiment, The metal foil 34 is supported and reinforced by the resin sheet 32. Therefore, When the laminate 30 and the sheet 60 having the vapor deposition mask are conveyed, It is possible to cut between the hole of the metal foil 34 and the hole 25 caused by the stress acting between the holes 25 in the hole 25, Alternatively, the problem of the entanglement of the portion extending between the hole 25 and the hole 25 is extremely effective. The result, It is possible to avoid the shape of the fine holes 25 formed in the metal foil 34 in the etching process, In the subsequent process, the damaged piece of the question is indeed the result of the rotation force system attached to the 25 extension. -23- 200923109 In addition, When the hole 25 which is elongated and elongated in the direction orthogonal to the arrangement direction as described above is formed, the direction in which the hole 25 extends (the other direction described above), The direction in which the laminated body 30 is supplied (the laminated body and the direction in which the sheet 60 with the vapor mask is attached) is transported, It is ideal to be slightly parallel. In this case, It is possible to effectively prevent the hole 25 of the metal foil 34 from being cut between the hole 25, Or a state in which a portion extending between the hole 25 and the hole 25 and extending in a line shape is entangled. The sheet 60 with the vapor deposition mask attached to the cutting device 53 as such is The metal foil 34 is formed to have the same length as the length of one of the vapor deposition masks 20, And it was cut off in order. As mentioned above, A sheet 60 with a vapor deposition mask attached to the leaf shape is sequentially formed. As above, According to this embodiment, The metal foil 34' which is the vapor deposition mask sheet 60 attached to the vapor deposition mask 20 is laminated on the resin sheet 32. It is protected by the resin sheet 32. Therefore, When processing the sheet 60 with the vapor deposition mask attached, For example, when transporting the sheet 60 with the vapor deposition mask, The tension (tensile tension) at the metal foil 34 acting on the sheet with the vapor deposition mask is remarkably lowered, Further, it is possible to effectively prevent breakage of the fine holes 25 formed on the metal foil 34. also, The hole 25 can be formed for the metal sheet 34 laminated on the resin sheet 32. Therefore, It is possible to etch only one of the faces 34a of the metal foil 34, A hole 25 penetrating through the metal foil 34 is formed. In this case, Although the hole 25 penetrates the metal foil 34, But the position -24- 200923109 is placed at the end of the hole 25 on the side of the other side 34b of the metal foil 34, It is covered by the resin sheet 32. That is, Since the hole 25 does not penetrate the laminate 30, therefore, The problems in the prior art described above can be avoided. By this, Can be on the metal sheet 34, A hole 25 whose sectional area gradually decreases from the surface 34a (20a) of one of the faces 34b (20b) to the other surface 34b (20b) is formed. also, It is also possible to vaporize the mask 20 with a high-definition pattern. Made with good precision. then, The resin sheet 32 is removed via the sheet 60 from which the vapor deposition mask is attached, On the other hand, the vapor deposition mask 20 made of the metal foil 34 can be easily produced. If the vapor deposition mask 20 is obtained by such a method, And using the vapor deposition mask device 1 having the vapor deposition mask 20, It is possible to perform vapor deposition under a high-definition pattern with good precision. Therefore, The vapor deposition mask 2 thus obtained and the vapor deposition mask device 10, It is very suitable for a vapor deposition mask (metal mask for vapor deposition) used for patterning an organic light-emitting material on a glass substrate in a desired pattern, for example, when manufacturing an organic EL display device. In addition, With regard to the above embodiments, Various changes can be made within the gist of the invention. the following, An example of the modification will be described. In the above embodiment, When manufacturing the vapor deposition mask device, Although it is shown that the resin sheet 3 2 is irradiated with UV light, An example in which the resin sheet 32 is removed from the laminate 3 is explained. but, The method of removing the resin sheet 3 2 is not limited thereto. E.g, The laminate 30 can also be fed into a heating furnace (removal means). And the laminated body 3〇 resin -25- 200923109, the sheet 32 is burned, The resin sheet 32 is removed from the laminate 30. When the resin sheet 3 2 is burned and removed, The resin sheet 32 can be separated from the metal sheet 34 without affecting the hole 25 formed in the metal foil 34 (vapor deposition mask 20) by a simple method using a simple device. In addition, When the resin sheet 32 is burned and removed, It is not necessary to use the resin sheet 32 which is reduced in the bonding force with respect to the metal foil 34 by the irradiation of the UV light. And in the above embodiment, When manufacturing the sheet 60 with the vapor deposition mask, An example in which the laminated body 30 in which the resin sheet 32 and the resin sheet 34 have been laminated is prepared and supplied is described. However, the system is not limited to this. E.g, It is also possible to supply the metal foil 34 which is extended into a strip shape, The resin sheet extending in a strip shape is supplied, and the supplied metal sheet 34 and the resin sheet 3 2 are laminated. And the layered body 30 is made, The above treatment is applied to the laminated body 30 which is sequentially produced, A sheet 60 with a vapor deposition mask is produced. or, It is also possible to supply the metal foil 34 which is extended into a strip shape, A leaf-shaped resin sheet 32 is laminated on the supplied metal sheet 34, Further, the above-described treatment is applied to the portion (laminated body 30) of the resin-made sheet 32 in which the leaf-like shape is laminated in the metal-made sheet 34, A sheet 60 with a vapor deposition mask is produced. or, It is also possible to supply the resin-made sheet 32 which is extended into a strip shape, The leaf-shaped metal-made sheet 34' is laminated on the supplied resin sheet 32, and the above-described treatment is applied to the metal sheet 34 laminated on the resin sheet 32. To make a sheet 60 with a vapor deposition mask -26- 200923109. Further, in the above embodiment, When the sheet 6 with the vapor deposition mask is manufactured, the hole 25 is formed on the metal sheet 34, Then, an example in which the metal flakes 34 are cut to a specific length by the cutting device 53 will be described. but, The system is not limited to this. E.g, It is also possible to form the hole 25 before the metal foil 34 is formed. The process of cutting the metal foil 34 is carried out. and then, In the above embodiment, When manufacturing the sheet 60 with the shovel mask, the metal sheet 34 having the sheet 6 附 with the vapor deposition mask is provided to have the same length as one of the vapor deposition masks 20 Length of way, An example in which the sheet 60 with the vapor deposition mask is cut is described. but, The system is not limited to this. E.g, It is also possible to make the metal foil 34 having the vapor deposition mask sheet 60 longer than the length of one of the vapor deposition masks 20 (for example, The method of evaporating the mask to a length of two parts, The sheet 60 with the vapor deposition mask attached is cut. also, It can also be as shown in Figure 11. The sheet 60 with the vapor deposition mask extending in a strip shape is not cut. And winding it on the take-up core 61, Processing (shipping, transportation, etc.) is performed as the wrap 60a of the sheet 60 with the vapor deposition mask. and then, Instead of cutting off the sheet with the vapor deposition mask, the whole is cut off. It is also possible to prevent the resin sheet 32 from being cut off together. To half cut the laminated body 30, Only the metal sheet 34 is cut. and then, In the process of forming the holes 25 by etching, It is also possible to perform etching by cutting the metal foil 34 by a specific length. That is, When the holes 2 5 -27 - 200923109 are formed by etching, the metal flakes 34 can also be separated into a specific length by etching. In this case, it is possible to save the work of separately cutting the metal foil 34 into a specific length. Further, in the above-described embodiment, when the vapor deposition mask device 1 is manufactured from the sheet 60 with the vapor deposition mask attached thereto, The example in which the frame 丨$ is mounted on the metal foil 34 (vapor deposition mask 20) separated from the resin sheet 32 is shown, but the invention is not limited thereto. E.g, The frame 15 may be attached to the metal foil 34 (vapor deposition mask 20) before being separated from the resin sheet 32. In addition, when manufacturing the sheet 60 with the vapor deposition mask, It is also possible to provide a process of attaching the frame 15 to a metal sheet and to perform processing (shipping, transport, etc.) as a sheet 6 of the frame 15 to which the vapor deposition mask is attached. [Simple diagram of the diagram] [Figure 1] Figure 1, It is a plan view showing one of the embodiments of the sheet with the vapor deposition mask resulting from the present invention. [Fig. 2] Fig. 2' is a cross-sectional view taken along line E - π of Fig. 1. [Fig. 3] Fig. 3, It is a partial bottom view of the sheet with the vapor deposition mask shown in Fig. 1. [Fig. 4] Fig. 4, It is a perspective view showing an example of a vapor deposition mask and a vapor deposition mask which can be manufactured by the sheet with the vapor deposition mask shown in Fig. 1. [Fig. 5] Fig. 5, It is a figure for demonstrating the use of a vapor deposition mask and a vapor deposition mask apparatus. -28- 200923109 [Figure 6] Figure 6, It is a diagram for explaining the action of the vapor deposition mask. [Fig. 7] Fig. 7, It is a diagram for describing one of the embodiments of the method for manufacturing the vapor deposition mask device of the present invention, and is for the sheet with the vapor deposition mask shown in FIG. A method of manufacturing a vapor deposition mask and a vapor deposition mask device will be described. [Fig. 8] Fig. 8, It is a diagram for explaining one embodiment of the manufacturing method of the sheet with the vapor deposition mask caused by the present invention, It is a diagram for explaining a method of manufacturing the sheet with the vapor deposition mask shown in Fig. 1. [Fig. 9] Fig. 9, It is a figure for demonstrating the method of forming a photoresist pattern on a laminated body (metal sheet). [Fig. 10] Fig. 1〇, It is a figure for demonstrating the method of etching a laminated body (metal thin film). [Fig. 1 1] Fig. 1 Corresponding to the figure of Figure 8, It is a diagram for explaining one of the modifications of the method of manufacturing a sheet with a vapor deposition mask. [Fig. 12] Fig. 12' corresponds to the diagram of Fig. 6, Further, it is a diagram for explaining a method of performing vapor deposition using a vapor deposition mask formed of a metal plate which is saturated from both sides. [Fig. 1 3] Fig. 1 3, Corresponding to the figure corresponding to Figure 1, Further, it is a diagram for explaining a method of manufacturing a vapor mask by etching a metal plate from the lower side. -29- 200923109 [Description of main component symbols] 1 : Evaporative mask 2 : Metal plate 2 a . Hole 3: Projection portion 4: Substrate 5: vapor-deposited film 6: metal plate 6a: hole 7: photoresist film 8: etching liquid 1 〇: vapor deposition mask device 1 5: frame 20: vapor deposition mask 20a: One side 2 0b : The other side 2 2 : Holed area 2 3 : Non-porous area 2 5 · Hole 29 : Coil 30 : Laminate 3 1 : Supply core 3 2 : Resin sheet 32a : Substrate Sheet -30 200923109 3 2 b : UV release layer 34 : Metal sheet 34a: One of the faces 34b: The other side of the face 3 6 : Photoresist film 3 6a: Resistive pattern 3 7 : Glass dry plate 3 8 : Etchant 40: vapor deposition device 42: glass substrate 4 4: crucible 4 6 : heater 4 8 : vapor deposition material 50 : etching device 5 1 : nozzle 5 2 : conveying roller 5 3 : cutting device 54 : removal device 55 : UV light irradiation means 55a: shielding cover 5 5 b : UV light source 5 7 : roller 5 9 : spot welding device 60 : sheet with vapor deposition mask - 31 200923109 60a : roll body 6 1 : winding core - 32