TW200922852A - Load lock fast pump vent - Google Patents

Abstract

A substrate processing tool including a frame forming at least one isolatable chamber configured to hold a controlled atmosphere, at least two substrate supports located within each of the at least one isolatable chamber, each of the at least two substrate supports being stacked one above the other and configured to hold a respective substrate and a cooling unit communicably coupled to the at least two substrate supports such that the at least two substrate supports and cooling unit effect simultaneous conductive cooling of each of the respective substrates located on the at least two substrate supports.

Description

200922852 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a controlled atmospheric environment, and more particularly to productivity enhancement in such an environment. [Prior Art] The manufacturing industry of electronic components, especially the semiconductor devices constituting more advanced electronic components, is expected to achieve efficiency improvements. Optimize the productivity of hot wafers that use statically loaded lock chamber cooling jackets by using cluster tools while minimizing component count and assembly complexity, especially for any activity/device in the load lock chamber . The traditional approach is to use multiple load lock chamber modules to achieve higher productivity of cluster tools. This will increase the complexity of the equipment and the cost of the end user. A normal pressure gate is typically employed in a semiconductor processing system to seal a wafer gap opening between a load lock chamber and an atmospheric interface such as an equipment front end module (EFEM) or a load port module. The normal pressure door is usually vertically moved by a hydraulic drive to cover the slit opening. The atmospheric door is then driven into contact with the load lock chamber sealing contact surface around the slit opening to seal the opening from the outside atmosphere. When sealing the contact surface of the interlocking chamber, the broken door seal, the failed door activity and foreign matter may damage the contact area of the load lock chamber and cause leakage into the load lock chamber when the load lock chamber is removed. Repair of the load lock chamber sealing contact surface is very time consuming and labor intensive, and the surface must be re-cut or burned to create an initial surface condition. Reprocessing of the sealing contact surface can take several hours and cause a significant increase in downtime for the processing tool. The load lock chamber will need to be replaced when the seal contact surface is not serviceable. 5 200922852 A normal pressure door contact surface should be placed on the load lock chamber for quick replacement to minimize tool downtime. The substrate is protected from the importance of particulate contamination in the fabrication of semiconductor substrates when the substrate is transferred from, for example, a processing module to a load-lock module or reverse retrograde. In order to minimize contamination of the substrate, all of the active components of the substrate transport module are typically disposed below the substrate path. Commonly used and grooved valve systems commonly used in substrate processing equipment include, but are not limited to, load lock chambers disposed below the substrate transfer plane to minimize airborne particulate contamination of the substrate. The door actuator is disposed in the substrate transfer zone, such as with a stacked or double load interlocking normal pressure gate and a slotted valve mounted over the substrate transfer plane opposite the reverse side of the load lock chamber. When the door actuator is placed above the substrate transfer plane, the substrate actuator will cause localized particle contamination. Preferably, the door actuator of the normal pressure door is not disposed above the substrate transfer plane or within the substrate transfer area, thereby minimizing substrate particulate contamination. SUMMARY OF THE INVENTION A first embodiment of the present invention provides a substrate processing tool. The substrate processing tool includes at least one isolation frame for maintaining a control atmosphere, and at least two substrate supports disposed in each of the at least one spacer, each of the at least one substrate support being stacked on each other and used for grasping The opposite substrate and the cooling unit coupled to the at least two substrate supports, wherein the at least two substrate supporting and cooling units simultaneously activate the opposite cooling substrates disposed on the at least two substrate supports . [Embodiment] The above and other features of the embodiment of the present invention will be hereinafter described with reference to the accompanying drawings. 200922852 1A-1B is a schematic perspective view of a substrate processing module 10 having one of the features of the embodiment. Although the following description will be made with reference to the embodiments shown in the drawings, it should be understood that the embodiments may be embodied in various modifications. In addition, any suitable size, shape or type of element or material may be employed. As can be seen from Figures 1A-1B, the module 10 has a common configuration for the module to pair the desired number of processing tool portions to perform one or more desired processing on the substrate (such as material plating, etching, lithography, ion implantation). , wash, polish, etc.). The substrate is of any suitable type, such as 200 mm, 300 mm, 450 mm diameter semiconductor wafers, gratings, liquid film or screens for flat screen displays. The modules of the embodiment shown in Figures 1A-1B are one loaded with an interlocking chamber module, and the modules in the modified form are of any suitable type. The construction of the modules shown in the embodiments is described by way of example only, and the modified load lock chamber module can have any other desired configuration. The load lock chamber module 10 of one embodiment is connected between different portions of the processing tool as shown in Figures 2 and 3. Each of the different portions may have a different atmosphere (e.g., one side is an inert gas and the other side is a vacuum, or one side is atmospheric clean air and the other side is vacuum/inert gas). Figure 2 shows a processing apparatus such as a semiconductor tool station 690 of an embodiment. Although a semiconductor tool is shown in the drawings, the present embodiment is applicable to any tool station or application using a manipulator. The tool 690 of the present embodiment is shown as a group tool, however this embodiment can be applied to any suitable tool station, such as the linear tool station shown in FIG. 3 and the US patent filed on May 26, 2006. Application No. 11/442,511, “Linear Distributed Semiconductor Workpiece Processing Tools”, which is hereby incorporated by reference. The tool station 690 generally includes a constant pressure front end portion 600, a load mutual 7 200922852 lock vacuum chamber 610 and a vacuum rear end portion 620. The tool station of the modified aspect can have any suitable configuration. Each of the front end portion 600, the load lock chamber 610 and the rear end portion 620 can be coupled to the controller 691 as one of the appropriate control devices, such as group design control. The control system is a closed loop controller having a main controller, a group controller, and an automatic remote controller, such as U.S. Patent Application Serial No. 11/178,615, filed on Jul. 11, 2005, which is incorporated herein by reference. Any suitable controller and/or control system can be employed in the aspect. The front portion 600 of the prior embodiment typically includes a loading cassette module 605 and a micro environment 660 such as an equipment front end module (EFEM). Loaded 埠 module 605 is the opener/loader of the tool standard (BOLTS) interface, which conforms to 3mm load 埠, SEMI standard E15.1, E47.1 for front opening or bottom open box/container and cassette. E62, E19.5 or E1.9. The modified loading module is designed as a 2 〇〇mrn crystal interface or any other suitable substrate interface, such as a larger or smaller wafer or flat screen of a flat screen display. Although two loading cassettes are shown in Figure 2, the modified aspect can add any suitable number of loading cassette modules to the front end 600. The loading cassette module 605 can be designed to receive a substrate carrier or cassette 650 from an overhead transport system, from an I. moving guided motor vehicle, a manually guided motor vehicle, a track guided motor vehicle, or any other suitable transport method. . The loading cassette module 605 can be coupled to the micro environment 660 via an loading port 640. Loading the crucible 640 allows the substrate to pass through the channel between the substrate cassette 650 and the microenvironment 660. Microenvironment 660 typically includes a transfer robot (not shown) for transporting substrates from cassette 65 to, for example, load lock chamber 610. The transfer robot in one of the embodiments is a trajectory mounting robot, as disclosed in U.S. Patent No. 6,002,840, which is incorporated herein by reference. The microenvironment 660 provides a controlled cleansing zone for the substrate to be transferred between a plurality of loaded die 200922852 groups. The interlocking vacuum is loaded to the 610 system substantially similar to the module 10 shown in the ia_if diagram and may be disposed between and connected to the microenvironment 660 and the rear end portion 620. The substrate holding chamber of the load lock chamber 610 typically includes a normal pressure and vacuum slotted valve in a manner similar to the valves 12, 13 (see Figure 4A) described below. The slotted valves shown are aligned with each other or at approximately 180 degrees apart, and the modified aspects may have a groove of approximately 90 degrees to form a substrate transport path having an angle of approximately 9 degrees. The modified slotted valve system has any suitable spatial relationship. Each slotted valve of the compartment is independently closed by a suitable door with a slotted valve. The slotted valve provides environmental isolation as the load lock chamber 610 draws air from a normal pressure front end portion 6 〇〇 and maintains a vacuum in the transport chamber when exhausting an inert gas such as nitrogen from the interlock chamber. Referring to FIG. 2, the load lock chamber 61 of one embodiment also includes an aligner for aligning the base point of the substrate to a desired position for processing. The load lock chamber can be set to Any suitable location of the processing device, and can have any suitable configuration, including any suitable substrate processing equipment.

The vacuum rear end portion 620 generally includes a transport compartment 625, one or more processing stations 63A, and a transfer robot (not shown). The transfer robot is disposed within the shipping bay 625 to transport the substrate between the load lock chamber 610 and the various processing stations 630. The processing station 630 can form an electronic circuit or other structure on the substrate through various mineral deposits, surnames, or other types of processing operations, such as (but not limited to) using such as plasma etching or other etching. Phytosanitary steam (CVD), plasma distillation (PVD) such as ion clock (ALD), oxidation / ^ operation, rapid thermal processing (RTP), dry strip atomic layer emulsification / expansion, formation of nitride , vacuum electro-printing, crystal derivative 9 200922852 (EPI) 'Wire welding and evaporation or other film processing operations using vacuum pressure, processing station 630 is connected to the transport compartment 625 for the substrate to pass through the transport compartment 625 to the processing station 630 or In the reverse mode, Fig. 3 shows another example of a substrate processing tool 71 having different portions. The processing tool in this embodiment is a linear processing tool in which the tool interface portion 712 is mounted on the shipping compartment module 718. The mediator face 712 is oriented (eg, facing inward) but offset from the longitudinal axis X of the transport compartment 718. The transport grab module 71g will be another

A transport inspection module 718A ' 7181, 718J is attached to the interface 750, 760, 770 for extension in any suitable orientation, as disclosed in U.S. Patent Application Serial No. 11/442,511, the disclosure of which is incorporated herein by reference. The interface 75 〇, 76 〇, 77 大致 is substantially similar to the load lock chamber 1 文 described herein. Each of the transport module modules 718, 719A, 7181, 718J includes a suitable substrate transport device 78 to transport the substrate through the processing system 710 and into and out of the processing module pM. It can be seen that each compartment module can be used to maintain an isolated or controlled atmosphere (e.g., N2, clean air, vacuum, etc.). The modified transport module modules 718, 719A, 718I may be characterized as including the two-load interlocking chamber 1A described herein. _ Referring again to FIGS. 1A and 1B, the load lock chamber module 1 can be connected to each other with no atmosphere: for example, the side is inert gas and the other side is vacuum, or the side is normal pressure clean air and the other side is Vacuum/inert gas) different parts of the processing tool (not shown in Figure 1G will not be loaded with interlocking wire group 1G will form several substrates to maintain the robbery, first known as the cabin (4), as will be detailed below, each can be isolated There can be a combination of the module's atmosphere with a part of the atmosphere of the laboratory. Although there are only two substrates in the i-picture to hide 14A, 14B, it is necessary to know how much more or less the load-lock chamber can touch κ. The two compartments maintain the cabin. In the embodiment, the load lock chamber module 10 200922852 cabin 14 is φ λ to provide a rapid cycle of the cabin atmosphere, which will be described in more detail below. Refer to the ', ', 1C 1Ε' substrate The maintenance compartment 14 can have a substrate transport opening 16' 18 disposed on the side of the module. The location of the transport openings 16, 18 in the figure is merely illustrative; and the altered aspect of the face can be any other expectation in the module The side (for example, her adjacent side) is connected. The inspection opening is slotted by the appropriate door. The valves η, 13 are independently switched. The second Α-2 Β diagram shows a sectional view of the module 1 ,, the internal module in the embodiment can form two or more independent _ and the recyclable substrate maintains 擒 "a, The compartments in the embodiment of 14b are in the shape of a dome. The second compartment is a compact chamber, which will be described below. The integrated module of the modified aspect has more or less painting chambers. Each has a separate switch opening that is controlled by a suitable width 12, 13 (eg, a six-pressure and vacuum slotted valve) disposed on the common side of the module. Thus, the direction of transport of the substrate through the various chambers is substantially parallel. The shaft, the more aspect of the cabin, has corresponding transport openings provided on different sides of the module. The valve of the embodiment (for example, a detachable connection (for example, a screw-on type) module) may be provided by a module. The outer side of the compartment. Sections 4A-4B show the section of the module 1〇. The module 1〇 of the embodiment can form two or more independent isolation and/or circulating substrate maintenance compartments 14A, 14B. The cabins 14A and 14B in the middle are in a dome shape. Side-by-side configuration or any other suitable spatial configuration of each other. As mentioned above, the two-chamber to 14A, 14B-based compact compartments. The integrated modular module of the modified form may have more or fewer compartments. Each has independent switch-type transport openings 14AO, 14BO (see Figure 1B) that are located on opposite sides of the module, such as appropriate valves 12, 13 (e.g., atmospheric and vacuum slotted valves). The substrate is then transported through the various compartments. 200922852 The direction of travel is along a substantially parallel axis. In one embodiment, the compartments 14A, 14B are designed such that the direction of travel through each of the compartments 14A, 14B is bidirectional. The compartment of another embodiment is designed to pass the substrate therethrough. The transport direction of one of the compartments 14A, 14B is different from the transport direction of the substrate through the other compartments 14A, 14B. As a non-limiting example, the compartment 14A may allow the substrate to be transferred from a front end unit to a processing chamber at the rear end of the processing tool, and The chamber 14B may allow the substrate to be transferred from the processing chamber to the front end unit. Referring to the foregoing description of Figures 2 and 3, the compartments of the modified aspect may be provided with corresponding transport openings on different sides of the module. Each of the compartments 14A, 14B and their associated slotted valves 12, 13 operate independently, for example, the substrates of one of the compartments 14A, 14B are cooled and the other compartments HA, 14B can be placed or removed. The valves 12, 13 of the embodiment are designed to be detachable (e.g., screw or other suitable detachment) modules that may be disposed on the outside of the chamber portions 14A, 14B formed by the module 10. The valve module of the modified state is detachably integrated into the wall of the module 10, which will be described in detail below. One of the other variants of the valve or valve is incapable of being disconnected from the module 10. Figure 1F shows an exploded view of the module 1 (the top and bottom covers 2〇, 22 are not shown for illustration). The module of the embodiment is provided with a general center or skeleton frame 30, and top and bottom covers 32, 34. The frame 3 of the embodiment is made of a piece of a member (e.g., a unitary construction) made of any suitable material, such as an aluminum alloy. The framework of the altered state is an assembly and may be made of any suitable material or any number of parts. As shown in Fig. 1F, the frame 3 of the embodiment will generally form the outer periphery of the module and the periphery of the chamber. The web member w as shown in Figures 1F and 4A can segment the module 10 to form a stacked compartment. The modified compartment may have more than one web member W. Another alternative aspect of the stacked compartment can be constructed in any suitable manner. For example, the module ίο has a universal opening for the cabin sub-module to be inlaid, and the cabin sub-module includes a stacked compartment having any number of compartments. It can be seen that the compartments 14A, 14B can be closed by their closures 32, 34 at the top and bottom thereof, the closure being attached to the frame 30 by any intended connection means such as, but not limited to, mechanical, electronic and/or chemical fasteners. on. The interface with the slotted valves 12, 13 is associated with the frame 30 in any suitable manner, such as shown in the drawings and in the manner which will be described in detail below. The load lock chamber module 10 is a communication module that provides for the transfer of substrates between the tool components to which they are attached. Therefore, the height of the module 10 must be related to the height of the adjacent component or module, and depends on factors such as the traveling axis z of the substrate transport device adjacent to the module (by passing the rate of the interlocking module, and by, for example, the mode Group size or z-drive and/or structural considerations are delimited). The relationship between the through module 10 and the rotary module 15 is shown in Fig. 6, which shows the substrate transfer compartment 7 in which the load lock chamber module 10 is paired with the group tool. It can be seen that when the height of the module 10 is higher than the effective z-travel of the transport device, it will result in an unstable load lock chamber volume and increase the extraction/exhaustion time. Similarly, when the module height is lower than the effective z-travel, the overall effective travel bandwidth of the transport device will not be utilized, thus limiting the productivity of loading the inter-lock chamber module. The load lock compartments 14A, 14B of the embodiment are characterized by a configuration that provides a height at which the stacked load lock compartments are formed within the module 10. As shown in the foregoing and 4A-4B, the second embodiment of the load lock compartments 14A, 14B are stacked in the module 10, and the load interlocking cages in the modified single module are stacked. More (or fewer) load lock chambers may be included, such as three or more compartments. It can be seen that the provision of a plurality of independent load lock compartments 14A, 14B within the compact space envelope of the common module 10 will result in a plurality of independent and unrestricted transport paths, and the productivity of the module 10 is equally increased. 1A-1E Figure 13 200922852 In the example, each of the load lock compartments 14A, 14B are substantially similar to each other. In one embodiment, the load lock compartments 14A, 14B are placed along the middle of the partition load lock chamber. The plane has a contradictory structure. The loading interlock chambers of the modified aspects may be different from each other for operating substrates of different sizes and types. The module 10 shown in Fig. 1F has a modular configuration. The loadable interlocking chamber is composed of similar or different configurations. The load lock compartments 14A, 14B of the embodiment have a height sufficient to accommodate a plurality of stacked substrates (two substrates are shown in each of the compartments in Figures 4 & 4b). The modified interlocking compartments 14A, 14B can accommodate more or less stacked substrates as desired. Referring again to Figures 4A-4B, in the embodiment, each of the load lock chambers i4A, 14B may have a heating device or a cooling device, or both, to accommodate the interior of the load lock chamber when the atmosphere is in circulation. The contained substrate is heated or cooled. The loading of the interlocking chamber - a suitable example has the cooling/heating features described below. As shown in Fig. 4A, each of the load lock chambers of the embodiment has support frames 22A, 22B for heat treatment of the substrate by conductivity or the like. The support brackets 22A, 22B of the embodiment are designed to cool the substrate during exhaust such as load lock chambers. For example, the support frame may be coupled to a suitable heat treatment tank such as cooling block 27 in any desired manner to form a substrate cooling surface 24A' 24L on the side of each of the support frames 22A, 22B. The cooling block 27 of one embodiment includes Radiation fins (not shown) are provided to provide temperature transfer of the substrate cooling surfaces 24A, 24B, while another embodiment of the cooling block has heat within which the coolant flows to absorb the substrate cooling surface 24A '24B. The cooling block 27 in still another embodiment has a combination of a radiating fin and a coolant flow. The modified support frame has a substrate heating surface. In another variation, the load lock chamber is designed to heat the 14 200922852 gas in the load lock chamber. Each of the load lock chambers in the embodiment is provided with two support frames 22A, 22B having cooling surfaces 24a, 24b (although more or less wafer cooling surfaces are provided as previously described). From this, it is understood that heat exchange by conduction between the substrate and the support frame, the cooling surface of 22B, can be achieved by the substrate being seated on the cooling surface 24A' 24B of the support frame. The support frame in the embodiment is a solid state device (e.g., without a transmission/active mechanical component). This provides a minimum of style and height of the support frames Μa, 22B (thus helping to provide a dense height for loading the interlocking chamber). By way of example, the support brackets 22, 22 are fixed or static relative to the frame portion 30 and have a height of about 10 mm sufficient to allow the end effector EE of the transport device to directly grasp and place the substrate from the seat s state for cooling. On the surface 24A, the substrate is transferred from/to the load lock chambers 14A, 14B at 1/(see Figures 5A-5B and Figure )). The stent of the modified aspect can have any suitable height. The support frame 22, 22 of another embodiment is movable relative to the frame portion 30 such that the height of the bracket can be adjusted according to a predetermined distance between the brackets 22, 22". As shown in Fig. 4, the support frame 22A' 22 is configured to form a passage gap 26 of the end effector. The support frame 22A' 22B of the embodiment can be segmented to form a void 26 for receiving the end effector vanes. The void 26 provides z movement of the end effector to grasp and place the substrate on the cooling surface. By way of example, the end effector EE can place the substrate substantially simultaneously on the cooling surfaces 24A, 24B of the support frames 22A, 22B (on one of the stacked load lock chambers). For example, the load lock chamber can cool the substrate while exhausting. The cooled substrate can be grasped and transported from the load lock chamber 22A substantially simultaneously. When the substrate is cooled in one of the load lock chambers 14A, 14B, the other operation (loading the lock chamber module 10) loading the lock chambers 14A, 14B is performed in a substantially unrestricted manner. In a variant, the operations performed by each load lock chamber are interconnected in sequence in any suitable manner. Referring again to the first Α-1Β囷, in the embodiment, each of the load lock chambers 14Α, 14Β (see also Fig. 4, Fig. 4) has corresponding vacuum control valves 4〇Α, 4〇Β and exhaust valves 42Α, 42Β (such as With or without a diffuser) to provide an independent cycle of loading the interlocking chamber atmosphere. The vacuum control valves 4〇Α, 40Β and the exhaust valves 42Α, 42Β of the embodiment can be disposed in the module as interchangeability, as will be described in detail below. Referring again to Fig. 1F, the frame portion 3 of the embodiment has openings 36, 36, 37, 37. The cornice will form a relative vacuum port 36Α, 36Β and an exhaust port 37Α, 3*7Β in each load lock chamber 14Α, 14Β. The configuration of the exhaust and vacuum ports shown in the figures is for illustrative purposes only, and the modified exhaust and vacuum ports may have any other suitable configuration. The vacuum vents of the embodiment 36 Α, 36 设置 are disposed on one side of the mold set 10, and the exhaust vents 37 Α, 37 Β are disposed on different sides of the module 1 。. The modified exhaust and vacuum ports can be placed on the same side of the module. As shown in Fig. 1F, the vacuum and exhaust ports 36 Α, 37 Α , 36 Β, 37 相对 relative to the load lock chamber 14 Α ' 14 垂直 are vertically offset from each other. The vacuum and exhaust ports of the modified aspect are vertically aligned or have any other spatial relationship. Each mouth has a suitable mating interface (such as around the cornice) to connect the intended vacuum or vent valve to the monument (and module). In the embodiment, two or more mating interfaces 38 Α, 38 Β, 39 Α, 39 埠 relative to the mouth can be designed to have a substantially similar pairing configuration (eg, mating flange, sealing surface, screwing style, etc.) for having a complementary mating interface. Any of the valves can be paired with any of the mouthpiece's mating interfaces. For example, as shown in the first and if figures, the exhaust valve can be combined with the exhaust valve modules 42A, 42Β, each having a similar mating interface 421 for each module to be interchangeably mounted in either compartment. Air mouth interface. Embodiment 16 200922852 Example venting _m2a, 42b of a pressure enclosure or shroud having a unitary construction may include a row (four) body 42VB to provide; j; same flow rate or control configuration (eg, throttle and/or different capacity) Box valve). Embodiments are described with respect to individual exhaust and vacuum ports, while valves of other embodiments may be designed to vent and evacuate from a chamber through a single port. For example, the valve can be designed with appropriate valve characteristics to be translated between the vacuum source and the exhaust source. In another variation, each module has an exhaust and vacuum port, and a single exhaust/vacuum module can be used to vent and/or pump the cabin. The vent valve module housings 42A, 42B of the illustrated embodiment may permit the installation of three valve bodies 42 VB having a common source and a common discharge port. The valve modules 42 A, 42B are designed to provide any desired number of valve bodies 42 VB to achieve any desired predetermined valve body. The modular body 42A, 42B of the modified aspect can accommodate more or fewer valves. Different embodiments of the exhaust modules 42A' 42B, 42A' are shown in Figures 1A-1F and 8A-8D. The embodiment of the exhaust module shown in the figures is by way of example only and the exhaust module may have any suitable module body 42AB configuration to connect the exhaust module to, for example, a gas inlet, a valve body 42VB, and a diffuser. 44A and so on. However, different modules having different module bodies 42AB and 42VB may share a common mating interface configuration 421, thus permitting the interchangeability of the exhaust mold stages 42A, 42B' 42A' of the load lock chamber 1〇. The exhaust valve modules 42A, 42B of the embodiment may also include a suitable diffuser 44A that may be disposed substantially when entering the valve modules 42A, 42B in the exhaust ports 37A, 37B of the load lock chamber. Add the discharge surface of the interlocking chamber to the discharge surface or near. The exhaust valve modules 42A, 42B of one of the embodiments are designed to receive and/or secure the diffuser 44A to the recess (or other suitable recess or slot on the module body 42AB). The modified diffuser can be added or fixed to an exhaust port 17 200922852 36A, 37A, 36B, 37B such as a wall of the load lock chamber 10. Sections 7A-7B show a perspective view and a cross-sectional view of a module 1 of another embodiment. The module 10' is substantially similar to the module 10 described above. The vacuum control valve and exhaust valve of the illustrated embodiment can be combined with a single module 40A', 40B'. As shown in Fig. 7B, the module structure has ports 36A', 36B', 37A, 37B. The jaws of the illustrated embodiment are arranged in a generally symmetrical configuration (e.g., as shown, the bee is placed on the side walls for vacuum and exhaust ducts to be attached to both sides of the module). The load lock chambers then have four active ports to connect the vacuum and exhaust lines, such as two ports on each side. Each of the load lock chambers in the modified aspect can have any suitable number of ports with a suitable spatial relationship to each other. In the embodiment, the mating interfaces 38A', 38B', 39A, 39B' of the mouthpieces 36A, Mb, 37A', 37B' are similar to provide interchangeability of the modules 40A', 40B'. One or more of the matching aspects are non-similar to provide selective interchangeability between the interface and the opposing modules having corresponding interfaces. As shown in Fig. 7B, the mating interfaces 38A, 38B, 39A, 39B can be disposed on the pair of jaws, one of which is disposed on the other. For example, the ports 36, and 36B' are disposed on the same wall as the __ module wall, wherein __ is disposed on the other and a shared interface 39A' is shared. The valve modules 4A, 4B of the present embodiment are interchangeably matched to any pair of port matching interfaces 38A, 38B, 39A, 39B. The valve module 40A'' 40B' is designed to be in the mating compartment module 1 (as shown in Figure 7a-7b) with each of the bays (e.g., 36A, 36B). The implementation of the wide module 40A 4GB has a module body (10) to form a mating interface design to be paired with the module ί 'where the module body 41B, the mating interface includes a relative exhaust (discharge port) and a vacuum (into π ) 埠 mouth. The "true" control valve is mounted on the module body 41B' to maintain the flow Mit with the true port. _, in the module body 41B, upper 18 200922852 is provided with an exhaust valve 42VB' to maintain fluid communication with the exhaust port. Wherein - the valve module configuration results in a module 40A, 40B that operates to provide specific lock chambers 14A, 14B, and the other modules 4A, 4B, operate to provide mutual Pumping chambers 14A', HB' are pumped. The valve module 4A, 働 includes an exhaust diffuser, for example, as previously described. As shown in Figures 7 and 7B, the modules ,8, and 40B' are designed such that the modules are in communication with the two compartments 14A', 14B. For example, the module 40B' can be coupled to the module 1 〇 to cause the module 4 〇 B to perform the venting of the chamber 14 and the chamber 14B' (e.g., by vacuum). The module 4A is coupled to the module 10' to cause the module 40A' to perform the chamber 14β, the exhaust and the chamber 14A, and the pumping chamber includes a single load lock chamber. The single load lock chamber is provided with an extraction/exhaust interface having a plurality of exhaust and vacuum ports substantially similar to the foregoing. The pair of ports can be designed to be connected to similar modules 4〇A, 4〇B, and the exhaust/exhaust module, so that a single compartment can be vented and pumped with a single module to make a single load interlock. The complexity, size and cost of the chamber modules are reduced or minimized. Figure 9 is a cross-sectional view showing the substrate holders 22A, 22B of the load lock chamber module of another embodiment. Although four support additions are shown in Fig. 9 (two support frames are provided in each compartment as described above), only two brackets 22A, 22B will be described below. It is to be understood that the remaining substrate support frames are generally similar to the brackets 22A, 22B. The support frames 22A, 22B of the embodiment shown in Fig. 9 are substantially similar to the support frames described above with reference to Figs. 5A and 5B. The support frames 22A, 22B are statically set and placed at an expected distance p (e.g., 1 〇 mm or any other suitable distance greater than 10 mm) to support the substrate S stack. The support frames 22A, 22B of one of the embodiments are adjustable and provide an adjustment of the distance P. The bracket 19 200922852 22A, 22B of another embodiment can be moved relative to each other, as will be described in detail below. The modified support frames 22A, 22B are modularized and additional brackets can be added (or removed) with the expected distance p. Each of the support frames 22A, 22B of the embodiment has cooling surfaces 24A, 24B for conductive cooling of the substrate SI'S2 seated on one of the support cooling surfaces 24A, 24B. In the embodiment shown in Fig. 9, each of the substrate support frames 22A'22B may be provided with a gas damper 54 (the number of support frames is illustrated as an example only, and more or fewer support frames may be provided in the modified aspect) . The gas cartridge 54 is shown schematically in Figure 9 and has any number and any desired size of the cornice distributed along the support frame. The gas raft 54 is designed such that the gas system through the cornice is laminar to minimize particle formation. The gas cartridge 54 of one of the embodiments may include any suitable diffuser, and the diffuser of another embodiment may be disposed at the upstream portion of the gas cartridge 54. The diffuser of the modified aspect has any suitable spatial relationship with the relative mouth. As shown in Fig. 9, the air dam 54 is disposed between the opposite upper side on the cooling surfaces 24A' to 24B of the support frames 22A, 22B and the lower side and the upper side surface of the lower substrates S1, S2. The pneumatic raft 54 is coupled through a suitable passage formed in the support frames 22A, 22B to connect a suitable gas supply suitable for loading the lock chamber venting (e.g., venting gas). The channel of the altered aspect may not be merged with the support frame. As shown in Fig. 9, the gas cylinder 54 is designed to discharge gas into the gap 6 between the surfaces of the exposed substrates (e.g., to the neighboring cooling substrates s 1, S2 (see Figures 7 and 9)). For example, one or more of the support frames 22A, 22B have a gap or aperture 6 (e.g., a gap 26 similar to that shown in Figure 5B for the end effector to enter) to receive cooling on the support frame 22A. The (heating state) is exposed to another lower substrate which is also heated and cooled by the support frame 22B. The gas exhausted by the gas enthalpy 54 in the gap 6 will form a thermal barrier or barrier TB between the covered surface of the lower substrate S1 and the upper substrate S2, which is not covered by the cover surface (illustrated size and position are merely illustrative) The convection heating effect of the upper substrate S2 by the lower substrate si is minimized or completely eliminated. The circulating gas also provides convective cooling relative to the substrate in addition to conductive cooling. It can be seen that the gas discharged from the gas cylinders 54Α, 54 may flow through the gap 6' to interrupt the stagnant gas of the gap 6 and interrupt the unintended temperature transfer between the lower thermal substrate S1 and the exposed surface of the upper thermal substrate S2 through convection. . At the same time, the gas introduced by the gas cylinders 54, 54 can be removed or promoted by appropriate vacuum or degassing, such as suitably placed in the chamber (e.g., in the void 6 or other suitable location) (generating gas circulation therein - The vacuum crucible of the embodiment is attached to the support frames 22A, 22A in a manner similar to the aforementioned reference gas manifold 54. The vacuum crucible of another embodiment may be disposed in the chamber wall between the support frames, as described in reference to FIG. According to the above, since the cooling distribution on the stacked substrates is kept on the substrate stack, the cooling time of the substrate stacking will be reduced. The gas discharged from the gas cylinder 54' 54A has a set Reynolds coefficient of the low velocity laminar flow ( Re), preventing the particles from being deposited on the upper surface of the lower substrate. Figures 10A and 10B are exploded views showing the load lock chamber module 1 of another embodiment. The module is substantially similar to the foregoing. The load lock chamber module 1〇. The module 1〇〇 of the embodiment also has two load lock chambers U4A, 114B' stacked on each other. However, in the modified aspect, the load lock chamber module can have any Appropriate number of stacks The module 100 also includes cooling collets 12A, 120B. Each of the load lock chambers 114A, ii4B has a cooling collet disposed therein. The cooling collets 120A, 120B are capable of z-axis movement by a suitable z-driver 120Z The chuck can also be moved horizontally (for example, X and Y). The chucks 120A and 120B are arranged substantially in the opposite configuration as shown in the figure, so that the chuck is in the direction of the arrow 700 21 200922852

The drive will face or deviate from each other. Referring to the cross-sectional view of the module 100 shown in FIG. 10B, wherein the load lock chamber is in a standby state, each load lock chamber 114A, 114B has a support frame 122A, 122B. The two substrates S1, S2 are supported in each of the load lock chambers 114A, 114B (more or less substrates are provided in the modified aspect) (see also Figure 11C). The support frame 122A of the embodiment is statically fixed (e.g., fixed to the structure or any other suitable fixed structure within the compartment) and the support frame 22B is active (e.g., attached to the movable collet 12A, 120B or any other Properly active support frame). The two support frames of the modified aspect are statically set, while the two support frames of the other modified form are active. The support frame 122B of one of the embodiments is supported by the collets 12A, 120B and connected by extensions or support frames 121A, 121B. The extension 121A'121B has a unitary structure with respect to one of the chucks 12A, 12B, and/or the bracket 122B. The modified support frames 121A, 121B can have any suitable configuration. As shown in Fig. 10B, the extending portions 121A, 121B extend outward from the surface 124A of the chuck 12A, 12B, so that the fixing bracket ι22 is disposed between the surface ι24Α and the bracket 122B (attached to the extension portion 121Α) , 121Β) β When the collet 12〇A, 120B is in the contracted state, there is ample space between the brackets 122A, mB for the end effector of the substrate transport device to place the substrate on the bracket mB. The support frame is arranged in the embodiment such that the substrate can be grasped or attached to the opposite support frame i22A' by the z-movement of the transfer arm end effector. The modified support frame and/or compartment can be moved to lift the substrate from the end effector. The chuck 120A' 120B is disposed in a collapsed state of the shelf type as shown in Fig. 1B (see also Fig. 11D) for attaching and detaching the substrate to the load lock chambers U4A, 114B. In the embodiment, the position of the head 120A' 120B can be changed (along the z-axis direction (i.e., the direction of the arrow 700), such as the closed state shown in the UE map) to support the loading of the 22-2222852 lock chambers 114A, 114B. The substrates on the shelves 122A, 122B are simultaneously cooled. The chuck of the modified aspect can perform the heating action of the substrate, or the cooling and heating. In the embodiment illustrated in Figure 10B, the collets 120A, 120B have temperature transfer contact surfaces 124A (e.g., conductive cooling surfaces). The temperature transfer surface 124A on the chucks 120A, 120B can be thermally coupled to a suitable heat sink 152A. In the embodiment illustrated in Fig. 10B, such a thermal communication system is illustrated as a connecting tab and a connecting fin 150A' 152A on the grab chamber, designed to allow the chuck to move freely in the z-direction. The heat sink of the modified aspect can have any suitable configuration. As shown in FIG. 7B, each of the compartments 114A, 114B has a static temperature transfer contact surface 124B (eg, a cooling surface), generally disposed opposite the chucks 120A, 120B. Referring also to FIG. 11A, the illustrated module 100 has The cooling chucks 120A, 120B are in an open state, and the substrates S1, S2 are mounted on opposite support frames of the load lock chambers 114A, 114B. As described above, when the substrate is cooled, the chuck 120A is moved (along the z direction) to the closed state. As shown in Fig. 11B (see also the sectional view of the chuck in the open and closed states as shown in Fig. 11D-11E). It is to be understood that the operation of the collet 120B is substantially similar to that of the collet 120A. Each of the collets 120A, 120B operates independently, and the collets 120A, 120B shown in the UB diagram are illustrated by way of example only. In a variant, the chucks 120A, 120B of one of the load lock chambers 114A, 114B are open and the other chucks 120A, 120B of the other load lock chambers 114A, 114B are closed or between open and closed. Any other expected state. As shown in Fig. 11B, the movement toward the closed state will cause the collet to grip the substrate SI, S2 (e.g., the substrate on the bracket 122B) toward and substantially in contact with the stacked cooling surface 124B, and move the collet cooling surface 124A toward The opposing substrate S1'S2 on the stationary stent 122A is contacted. Thus, the difference between the chucks 120A, 120B and the load lock chambers 114A, 114B will simultaneously cool 23 substrates 222009. The chucks 120A, 120B are returned to the open state to remove the substrates SI, S2. The chuck system in the modified aspect is designed to remove (and inlay) the substrate SI, S2 without the need to return to the open state. 12A-12B is a cross-sectional view of a module of a cooling collet heat exchanger arrangement 1000 of another embodiment in which a heat transfer fluid is directed to the heads of the collets 120A, 120B using a suitable conduit 1001 for temperature transfer. The board maintains the expected temperature. The fluid conduit 1001 is flexible to allow the interface between the fluid conduits 1001 of the aforementioned 3-axis movement of the collet to be rigid or semi-rigid, and the collets 120A, 120B are slidable or stretchable. The interface/coupling has a suitable sealing member to seal the interface while allowing relative movement between the catheter 1001 and the collets 120A, 120B. As shown in Figures 12A and 12B, the heat exchanger arrangement also includes a conduit 1002 that directs the heat exchange fluid into the static temperature transfer surface 124B. The cooling stream system is any suitable fluid including, but not limited to, water, oil, air or any other suitable fluid that can transfer the thermal energy of the chucks 120A, 120B and the static temperature transfer surface 124B. The cooling collet heat exchanger configuration can include any suitable fluid temperature adjustment device (not shown), such as a heat sink with appropriate feed and return lines to circulate into and out of the collet 120A, 120B and/or static temperature during fluid circulation. The fluid is cooled as it is transferred to surface 124B. Only the cooling flow feed line (e.g., the line that transports the cooling fluid into the chuck and the static temperature transfer surface) is shown as an example. The modified chucks 120A, 120B and the static temperature transfer surface 124B are fed by individual cooling lines and/or individual heat exchanger systems. Fig. 13 is a partial cross-sectional view showing the load lock chamber H4A' of the module 1' of another embodiment. The module 100 is similar to the module 1 and includes a movable collet 120A'. The collet 120A' has a derivative substrate support similar to that described above. Loading Mutual 24 200922852 The lock chamber 114A' has a derivatized substrate holder mA% collet ι2 〇Α having a temperature transfer surface 124A'. The load lock chamber U4A has a temperature transfer surface 124B' disposed thereon. The temperature transfer surface 124B' is connected in series to the heat source +q by a suitable heat exchange means. In an embodiment, when pumping the load lock chamber, the chuck can be driven to reduce the gap between the load lock chamber support frame 122A, the substrate and the chuck surface 124A', or the chuck support frame 122B. The gap between the upper substrate and the load lock chamber surface 124B'. The reduced void between the substrate and the adjacent surface can be used to increase the temperature of the gas, thereby slowing the generation of particles during pumping. In addition, the temperature surfaces 124A', 124B' can be heated to act in conjunction with the collet or directly heat the gas by itself, further slowing the generation of particulates during pumping of the interlocking chamber. 14A-14E illustrate an example of a load lock chamber 10100 of an embodiment. Although the embodiment is described with reference to a normal pressure gate or a grooved valve, the embodiment is equally applicable to a vacuum door or a grooved valve in a substrate processing apparatus. The load lock chamber 10100 in this embodiment is designed to have a stack load lock chamber of the first load lock chamber 10140 and the second load lock chamber 10150. The loading interlocking chamber of the modified aspect has any suitable configuration. Each of the load lock chambers 10140, 10150 has any suitable configuration including, but not limited to, the foregoing. For example, the load lock chambers 10140, 10150 are designed as dual load lock chambers (ie, each load lock chamber is designed to grip two substrates) or a single load lock chamber (ie, each load lock chamber design) To grasp a substrate). Each of the load lock chambers 10140, 10150 is designed to grip more than two substrates. Each of the load lock chambers 10140, 10150 can have a normal pressure load lock chamber door 10130' 1012 〇 and a vacuum load lock chamber door or slotted valve 10160, 1 161. In the present embodiment, the atmospheric pressure loading 25 200922852 interlocking chamber door 10130 and the vacuum slotted valve 10160 are respectively an atmospheric pressure door and a vacuum door for loading the interlocking chamber 1〇14〇, and the loading interlocking chamber 1〇12〇 and The slotted valve 1 161 is a normal pressure gate and a vacuum door for loading the interlocking chamber 10150, respectively. Normal pressure door 1〇13〇, 1〇12〇 loadable interlocking chamber is connected to the atmospheric processing unit, including but not limited to the equipment end module (EFEM), and the slotted valve 10160, 10161 is available for loading. The interlocking chamber is coupled to the vacuum module, including but not limited to the processing modules described above with reference to Figures 2 and 3. Figures 14A and 14D show that the atmospheric pressure door 1〇13〇 of the load lock chamber ι0100 is closed, and the normal pressure gate 1〇13〇 shown in Fig. 14b and the figure is turned on, thereby providing the substrate. Access to the channel of the load lock chambers ^140, 10150. Referring also to Fig. 15, the load lock chamber door is operated by one or more drive modules such as drive modules 10200, 10210. The driving module T0200,1〇21〇 shown in this embodiment is set on the door 1〇13〇, 1〇12〇 as an example. “Another embodiment has only one driving module located in the door 10130. Any one of the sides of the 10120, and the appropriate substrate supporting module is disposed on the other side of the door to properly support the cymbal, and the following will explain that any suitable number of driving modules in the n-th aspect is set in the opposite ^ Any suitable position of the door. For example, the first module is 1Q2 (10), and the 1G21G is disposed outside the substrate transfer region lorn. The drive modules 10200, 10210 are disposed on the outer side of the substrate transfer area to protect the protective bellows or particle fields from the particulate contamination caused by the movable parts disposed on the substrate (9). The drive module 1G2GG 1G21G is at least partially disposed on the front side of the seal contact surface 1G23G of the load lock chamber. The modified group is suitably designed to be placed on the front side or the back side of the sealing contact surface Q in any suitable manner. The sealing contact surface 10230 is loaded with the interlocking chamber 10100 and the atmospheric pressure gates 10130, 10120 cooperate to form a sealing body to prevent leakage of the surface of the atmosphere in the loading interlocking chambers 10140, 10150. The drive module 10200, 10210 of one embodiment is a modular unit that is coupled to the surface of the load lock chamber 10100 by means of, for example, mechanical fixtures, chemical fixtures, adhesives, or soldering. It can be seen that the drive modules 10200, 10210 can be permanently or detachably coupled to the surface of the load lock chamber 10100. The drive unit of another embodiment is incorporated in the load lock chamber 10100 such that the drive module forms part of the load lock chamber cover. The drive module 10200, 10210 of the illustrated embodiment includes a suitable access plate or The cover is for accessing the drivers 10210A, 10210B, 10200A, 10200B provided in the drive module, as will be described below. Access to the altered aspects of the drives 10210A, 10210B, 10200A, 10200B can be provided in any suitable manner. The drive modules 10200, 10210 each include an upper drive actuator 10200A, 10210A and a lower drive actuator 10200B, 10210B, respectively. Drive actuators 10210A, 10210B, 10200A, 10200B are any suitable drivers including, but not limited to, hydraulic drives, hydraulic drives, differential pressure drives, electronic rotary or linear drives, and magnetic drives. The drive actuators are designed as single or dual axis drives 10210A, 10210B, 10200A, 10200B. A modified drive can have more than two axes. The actuator can be designed to move the door ^130, 10120 away from the contact surface 10230 when the door is opened to minimize particle production and substrate contamination. The actuator is also designed to move the doors 10130, 10120 to contact the sealing contact surface 10230 to minimize particle production. The upper drive actuators 10200A, 10210A can cooperate with each other to open and close the door 10130, while the lower drive actuators 10200B, 10210B can cooperate with each other to open and close the door 10120 with 27 200922852. The doors 10130, 10120 in this embodiment are individually operated, for example, one of the doors can be opened and closed while the other door remains closed, or one of the doors can be opened and the other door is closed. In the change mode, each of the driving modules 10200 and 丨02 1 0 is connected to the opposite door, so that the two doors are simultaneously opened and closed at the same time. In another variation, the single driver of each of the drive modules 10200, 1 〇 21 差异 is differentially coupled to the opposite door' such that when one of the doors is open, the other is closed. In yet another variation, only one drive module 10200, 10210 includes one or more drivers and the other drive modules 10200, 10210 are driven by the first drive module. For example, the drive module 10210 suitably supports and drives the doors 10130, 10120 and the drive module 10200 includes suitable linear bearings to support and permit movement of the doors 10130, 10120. Referring again to Fig. 15, each of the drive modules 10200, 10210 can include an opening disposed on a front side of the contact surface 10230 for providing each of the atmospheric pressure gates 1 〇 13 〇, 1 〇 12 联 to be coupled to their opposite drivers. For example, the driving module 1〇2〇〇 may include an opening 10203 for the door 10130 to be coupled to the upper driver 1〇2〇〇A and the opening 1〇2〇4 for the door 10120 to be coupled to the lower driver 1〇2〇. 〇B. The opening of this embodiment is generally orthogonal to the door contact surface 10230'. However, the opening of the modified aspect may be substantially parallel to the contact surface 1G23G1-the open aspect of the opening may have any suitable spatial relationship with respect to the contact surface 10230. The drive module 1〇21〇 may include an opening ι〇2〇ι for the door 10130 to be coupled to the upper driver 1〇21〇8, and the opening 1〇2〇2 for the door 10120 to be coupled to the lower side drive $! Wherein the opening 10201-102G4 of the embodiment may include any suitable seal including, but not limited to, a bellows seal 'by thereby causing any particulates generated by the appliance to be contained and not contaminated into and out of the load lock to 10100 Any substrate. The threshold is 13丨〇, ι〇ι2 is connected to the opposite drive in any suitable way. For example, the door 1〇13〇 can be coupled to the upper driver 1〇2〇〇A by the link 10204A, and coupled to the upper driver 10200A by the link 1〇2〇4B. As shown, the links 1〇2〇4A, 10204B are generally parallel to the contact surface 10230' but may be suitably spaced from the contact surface 1〇23〇 to prevent the generation of particles. The linkage of one of the embodiments extends from the opposite door 1〇13〇, 10120 and is integrally formed with the door. Another embodiment of the door and its relative linkage are assembled wherein the linkage is coupled to the door in any suitable manner. The door 1〇12〇 can be coupled to the lower driver 1〇21〇B by the link 10203A and to the lower driver i〇2〇〇B by the link 10203B. Connecting rods i〇204A, 10204B,

10203A, 10203B are placed on the front side of the contact surface 1〇23(), so that there is ample clearance between the contact surface 10230 and the connecting rod to prevent or minimize particle generation and substrate contamination. The modified aspect links i0204A, 丨〇2〇4B, 丨〇2〇3 A, 丨〇2〇3B have any suitable spatial relationship with the contact surface 10230 and are designed to minimize particle generation. The connecting rods 10204A, 10204B, 10203A, 10203B are coupled to their opposite drivers 10210A, 10210B, i〇2〇〇A, 10200B such that the door remains parallel to the contact surface of the load lock chamber 1〇1〇〇 when the door is opened and closed. 1〇23〇. The modified links 10204A, 10204B, 10203A, 10203B are coupled to their opposite drivers for rotation relative to the contact surface 1〇23〇 when the door is opened and closed. The openings 10201-10204 shown are generally straight, such that the doors 10130, 10120 travel along a line generally parallel to the contact surface 1〇23〇 of the load lock chamber. The openings 10201-10204 of another embodiment can have any suitable shape, as will be described in more detail below. Any suitable seal may be provided between the doors 10130, 10120 and the contact surface 10230 to prevent leakage of the internal atmosphere of the load lock chambers 1〇14〇1〇15〇. The sealing system of this embodiment is designed to minimize friction and particle generation when the door is opened and closed 29 200922852. The opening 10201-10204 of another embodiment is angular or as shown in Figures 15A, 15B. When the doors 10130, 10120 are open, the door 10130' 10120 will move away from the contact surface 10230 to prevent the door and/or seal from rubbing. Contact surface 10230. The opening 10201 in Fig. 15A is angularly offset from the contact surface 10230' so that when the door is moved in the direction of the arrow T, the opening 10201' deflects the guide door away from the contact surface 10201" and vice versa. Figure 15B shows the opening 10201" has a cam configuration that guides the door away from the contact surface 10230 as it moves in the direction of the arrow τ, and directs the guide door toward the contact surface 10230 when the door is closed in the opposite direction of the arrow ,, causing the door to contact A sealing effect is created between the surfaces 10230. The drive units 10210Α, 10210Β, 10200Α, 10200Β are suitably coupled to the links 10204Α, 10204Β, 10203Α, 10203Β to provide cam movement of the doors 10130, 10120 as described in Figures 15 and 15D. The door of another embodiment is driven in the opening by two wheels as shown, so that the links 10204Α, 10204Β, 10203Α, 1〇2〇3Β will have substantially no contact with their opposite openings. The door to the change is driven in any suitable way. Figures 6 and 16A-16C show a load lock chamber loioo of an embodiment. The load lock chamber of Figure 16 is substantially similar to the load lock chamber 10100 described above and is illustrated in a portion of the base processing system, wherein the load lock chamber is 1〇1, coupled to the machining wedge 1〇3〇〇. The load lock chamber 1〇1〇〇 of this embodiment is designed as a single chamber force 0 load lock chamber. The modified load lock chamber 10100 can have any suitable number of compartments. The load lock chamber 10100' can include a chamber 10150, a seal contact surface 10230, a normal pressure gate 10320, and drive modules 1〇31〇, 10330. As described above, the drive modules 10310, 1033 are disposed on the outer side of the substrate transfer region 10110 as shown in Fig. 16A. The drive modules 1031〇 and 1〇33〇 include 30 200922852 drive units 10310A, 10330A and openings 10302. The drive units 10310A, 10330A are substantially similar to the aforementioned drive units 10200A, 10200B, 10210A, 10210B. In another embodiment, as described in FIGS. 14A-E and 15 , the load lock chamber 1 〇 1 〇〇 ' has a drive portion provided on either side of the door to support and activate the movement of the door 10320 At the same time, a passive support is provided on the other side of the door to support and permit the movement of the door 10320. Opening 10302 is generally similar to opening 10201-10204 described above. The link 10304, which is similar to the aforementioned links 10204A, 10204B, 10203A, 10203B in this embodiment, is coupled to the drive portions 10310A, 10330A via the notches 10302 in any suitable manner, such as in the manner previously described. The door 10320 is coupled to the drive units 10310A, 10330A in any suitable manner. It is noted that the load lock chamber 10100 also includes a vacuum valve or door 10321 similar to the door 10320 and operates in a manner similar to the aforementioned reference door 10320. The modified air valve or door 10321 can have any suitable configuration. Figures 17 and 18 show a load lock chamber 20100 of an embodiment. The load lock chamber 20100 of the present embodiment is designed as a right angle load lock chamber, wherein the atmospheric pressure interface 20101 is disposed at an angle of substantially 90 degrees to the vacuum interface 20102. The loading interlocking chamber of any variation has any suitable configuration in which the atmospheric interface 20101 has any suitable angular or spatial relationship to the vacuum interface 201021. The atmospheric pressure interface 20101 of the load lock chamber 20100 of the present embodiment includes a load lock chamber door inlay 20130, a normal pressure gate 20120 and a door drive unit 20125. The vacuum interface of the load lock chamber 20100 is designed to be substantially similar to the aforementioned reference normal pressure interface 20101. The vacuum interface of the modified aspect has any suitable configuration. The door drive unit 20125 is designed to be opened when the door is offset from the door inset surface 20150 in the direction of the arrow H1 and then offset from the substrate opening 31 in the direction of the arrow VI. 200922852 20140. The normal pressure door 2〇1 is designed to close in a substantially opposite manner. Often::, the drive can be moved in the direction of the arrow V2. 2, for example, the drive unit 1 20120, then the door will be opposite the substrate opening 20140, and then the door 2 is placed along the direction of the arrow H2 Above the opening 2_, as shown in Fig. 17, the driving unit 2〇125 of the door 20120 is disposed under the door 2〇12〇', and in the modified aspect, the driving portion may have any suitable position relative to the door ( But the secret) is located on the side of the door as shown in the UK map. Drive = 2G125 is any suitable drive unit, including but not limited to pneumatic pneumatic, hydraulic and magnetic drive. When the pressure of the door seal portion 2 is 15 移, the door is moved toward the opening, and a seal portion is formed between the door ·=20150. Into the I clothing ® and then refer to Figure 17 and the isi, ι type is properly connected to the drive unit 2 (^f press door 2 can be used to any size of the door to the size of the second 2_5, including the use of - or multiple drive shafts - 〇, so that one part of the door will be stacked:,; = when the design is to form a seal around the base · 20140. Keli, face 2 () 15 () and the substrate opening and the surface 2 #(四)体2_G is connected to the periphery of the door surface 2 and the surface of the inlay?n2_. The sealing body 2 is made of appropriate materials. Any door in the seal between the surface 2G15G provides a sealing effect. 卩2G13G can be aged The person loads the opening 2 of the corresponding shape in the surface 20310 of the interlocking chamber 2 (1) 20101. The 12th drawing of the door is made of any suitable material, including but not limited to metal plastic H 'Composite or any combination of the above. The inlaid portion plus % includes the outer peripheral portion 2G35G and the inner groove portion 2 (). The outer peripheral portion 2Q35 has the mention 32 200922852 for adding # s && & ah interlocking chamber 20100 The tolerance of the atmospheric pressure interface 20101 is adjusted to the appropriate thickness T. The outer peripheral portion 20350 has a length L of any suitable size and ^ D ( Figure 17), as shown in Figures 20 and 21, the door will extend through the edge of the door 2〇12〇 when the door is closed. Another embodiment 2〇1:5 The length L and the height D of the portion 20350 are appropriately sized such that the insert portion can extend through the door seal portion 2〇3 without passing through the door edge. The modified portion outer peripheral portion 20350 can have any suitable size. 2〇35〇 may have an opening 2〇21〇 disposed at an outer periphery thereof. The opening is any suitable opening for passage of a removable fastener, including but not limited to, from the load lock chamber 20100 The bolts and screws of the inlaid portion are removed. The inlaid portion of the inlaid portion is coupled to the loading and interlocking chamber 20100 by any suitable means including, but not limited to, chemical, magnetic and vacuum coupling. 20360 can constitute a substrate opening 20140 as a substrate for accessing the channel of the load lock chamber 2〇1〇0. As shown in the figure, the opening 2〇140 formed by the inner groove portion 20360 can have any suitable shape for the substrate and loading. One end of the substrate transport robot The device (or a portion thereof) passes through the opening 2〇14 (wherein the inner groove portion 20360 of the embodiment is dimensioned such that the body of the inner groove portion 20360 is held between the substrate and the substrate and at least the end effector The minimum groove distance. As shown in Fig. 21, the inner groove portion 20360 can extend through any suitable distance D2 of the back surface 2〇4〇〇 of the outer peripheral portion 2〇35〇. The inner groove portion 2〇36 of the present embodiment is extended. To the inner side 20410 of the load lock chamber 20420. The inner groove portion 2〇36〇 of the modified aspect may extend beyond or before the inner side surface 2〇41〇 of the load lock chamber 20420. In another variation, the inner groove portion 20360 may not extend beyond the back surface 20400 of the outer peripheral portion 2〇35〇. 33 200922852 The corresponding opening in the surface 20310 of the load lock chamber atmospheric interface 20101 may have an outer recess 20330 and an inner groove opening 20340. The depth of the outer concave portion 20330 is substantially equal to the thickness T of the outer peripheral portion 20350 of the inlaid portion 20130, and the length and height are greater than the length L and the height D of the inlaid portion 20130, thereby providing the outer peripheral portion 20350 and the recess 20330 of the inlaid portion 20130. Ample clearance around the surface allows the inlaid portion 20130 to be inserted and removed from the recess 20330. The recesses other than the modified aspect may have any suitable size. The recesses other than the modified aspect are designed to be pressed or mated with the inlaid portion 20130. The inner groove opening 20340 has an appropriate size such that the inner groove opening 20340 has an appropriate clearance between the inner groove portion 20360 and the inner groove portion 20360 of the inlaid portion 20130 to provide easy detachment and embedding of the inlaid portion 20130. The modified aspect of the clearance is minimized such that the inlaid portion 20130 is embedded in the outer recess 20330 and the inner slot opening 20340 to create a connection or press fit. Although the illustrated inlaid portion 20130 is disposed in the recess 20330', the back surface of the inlaid portion 20440 (see FIG. 21) of the modified aspect may be coupled to the surface 20310 of the load lock chamber 20100 (eg, the surface 20310 of the inlaid portion is not concave) . As detailed in Fig. 21, the back surface 20400 of the outer recess 20330 includes a recess 20221 surrounding the inner groove opening 20340. The groove 20221 in this embodiment is disposed between the opening 20340 of the inner groove portion and the opening 2〇21 of the detachable fixing member. The modified groove 20221 is disposed at any suitable relative position relative to the opening 20340 of the inner groove portion and the opening 20210 of the detachable fastener. Another modified embodiment of the recess is provided between the inner groove portion 20360 and the inner groove portion opening 2〇34〇. The groove 20221 is configured to receive and hold such as a 〇-shaped ring or any other suitable material, whereby the fixing member presses the sealing portion 20420 when the mounting portion 20130 is coupled to the loading interlocking chamber 2 在 in the recessed portion A sealing seal is created between the back surface 20400 of the 20330 and the inserting portion 20130 of 34 200922852, and the 20420 will maintain the vacuum or other control in the surface chamber 2G1GG in the sealing portion when the interlocking chamber 2 is cleaned for evacuation or exhaust. Atmosphere. The surface 2〇310 is not provided with a recess, and the sealing portion 20· can be provided, for example, as a seal. The vacuum between the other 2 coffee and the loading interlocking chamber frame. & can be maintained in the load lock chamber 20100 by any suitable means

When the ϋ山# 9m interlocks to operate, the substrate and/or transfer robot may hit 20150. The surface of the seal is 2〇150 and the surface is scratched or damaged. The waste on the main seal #2G3GG or the damage door (4) 2_〇 will also be s, = 20150. The failure gate activity will also cause the door to slam the surface 2〇丨5〇&&;; broke 1 ^ the surface 2G15() scratches and other damage will cause the atmosphere in the load lock chamber 0 00 to leak. Instead of removing the load lock chamber from the substrate processing system to the mechanism factory for repair, the user loading the lock chamber can remove and replace the damaged insert β 2G13G with a new insert to make the load lock chamber and its The shutdown time of the associated equipment is reduced to the shortest. The damaged inserts are designed such that the surface 20150 can be mechanismd or repaired to allow the inlay to be recycled. The detachable inlay 20130 described herein can provide a fast and cost effective way to maintain the loading/unlocking interface 2_"" interface 2 without the need to load or lock the interlocking chamber = mechanism or replacement. The seal 20220 between the insert (4) 2G130 and the load lock chamber 20100 maintains a vacuum or other atmosphere within the load lock chamber 2〇42〇. The removable housing inserts described herein can be incorporated into any suitable substrate processing system door. As shown in Fig. 22, the load lock chamber module 5〇1〇〇 includes a frame or cover box 5〇13〇 constituting the compartment 50135 (the top of the compartment is removed for illustrative purposes). 35 200922852 The compartment 50135 of one of the embodiments is isolated from the outside atmosphere and may be maintained in a vacuum or any other suitable control or clean atmosphere. The compartment 50135 is provided with substrate transport openings 50116, 50118 on the side of the load lock chamber mold set 50100. The locations of the transport openings 50116, 50118 shown are for illustrative purposes only, and the modified compartments may be in communication with the openings of any other intended side of the module (e.g., the adjacent side of the ®it). Each of the transport openings of the compartment is individually closed by a suitable door/slotted valve 50120 (only one of which is shown) to seal and isolate the compartment 50135 from the outside atmosphere. The substrate transfer device 50110 of one of the embodiments is at least partially disposed in the chamber 50135 for transporting the substrate S through the module 50100. In another embodiment, as described below with reference to Figures 1A and 1B, the load lock chamber module 50100 is not provided with substrate transfer for processing tools or systems such as equipment front end modules and/or vacuum back ends. Another portion of the substrate transport device places and removes the substrate from the load lock chamber module. The load lock chamber module 50100 of another embodiment can include any suitable substrate processing apparatus including, but not limited to, aligners, heaters, coolers, and metric tools. The transfer device 50110 of the present embodiment has an upper arm portion 50111 that is rotatably coupled to a driving portion (not shown) as shown. The modified embodiment of the transfer device has any suitable number of upper arms. The two forearm portions 50112, 50113 are rotatably coupled to the end portion of the upper arm portion 50111 at the elbow joint. The modified aspect transfer device can have more or less than two forearms coupled to the upper arm. Thus, each of the forearm portions 50112, 50113 includes an end effector or substrate gripper 50410 (see Figure 23A) that is configured to grip one or more substrates. An example of a suitable transfer device is described in U.S. Patent Application Serial No. 11/179,762, filed on Jul. 11, 2005. U.S. Patent Application Serial No. 11/104,397, the entire disclosure of which is incorporated herein by reference in its entirety in the entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all all The modified aspect transfer device 50110 is any suitable transfer device having any suitable arm link configuration including, but not limited to, a transfer device having a support drive, a self-supporting drive, and a magnetic floating arm segment or link. As will be described in more detail below, the module 50100 can be designed to maximize the productivity of the substrate S through the module 50100 and the processing tool, wherein the module 50100 is coupled while simultaneously pumping/exhausting the load lock chamber module 50100. The generation of particles that may contaminate the substrate during this period is minimized. As described above, the load lock chamber module 50100 can have different atmospheres for each of the processing tools (for example, one side is an inert gas and the other side is a vacuum, or one side is a normal pressure clean air and the other side is a vacuum/the other side is a vacuum/ Different parts of inert gas (not shown). The load lock chamber module 5 01 本 of the embodiment can form a grab chamber 5 013 5 for holding the substrate. The modified load lock compartment module 50100 can have more than one compartment, wherein each compartment can be isolated and have a cabin atmosphere that matches the atmosphere of the tool section of the adjoining module. The load lock chamber module compartment of the embodiment is 5 135 dense to provide a rapid circulation of the cabin atmosphere.

The load lock chamber module 50130 will be described in detail below with reference to Figures 23A and 23B. The compartment 50135 is designed to have a minimum internal volume relative to the active path of the assembly within the compartment 5〇135 and/or the path of the substrate S through the compartment 50135. In one embodiment, the side walls W1, W2 of the compartment 50135 are designed to match the path of the substrate S and/or the arm link 50112 of the transfer device, while only allowing the substrate and/or the arm link and the wall W1, W2. The minimum clear distance between them. As can be seen from Figures 23A and 23B 37 200922852, the wall W1 is designed to cooperate with the arched movement of the elbow joint 50460 of the upper arm portion 50111 and the forearm portion 50112 of the transfer device 50110. The wall W2 in this embodiment is designed to cooperate with the substrate s to be carried by the transfer device 50110 through the path of the edge of the substrate S when the interlocking chamber module 50130 is loaded. The bottom and/or top of the compartment 50135 in this embodiment is also designed to provide only a minimum clear distance between the movable components of the top and/or bottom of the load lock chamber module 50100 and the grab chamber 50135. For example, the surface of the portion B1 at the bottom of the chamber 50135 is raised relative to the surface of the portion B2 to the bottom of the 50135 (see Fig. 23C). For example, the portion B1 only provides the clear distance between the end effector and the substrate on which it is placed, and the portion B2 additionally provides the clear distance between the upper arm portion 5〇111 and the forearm portions 50112, 50113 of the transfer device 50110, thereby providing The distance between the end effector and the substrate on which it is placed. The top of the compartment can also be designed to resemble the bottom of the aforementioned chamber 5〇135. A suitable example of a load-locking chamber having a designed internal surface is described in U.S. Patent Application Serial No. U.S. Patent No. 4,397, the entire disclosure of which is incorporated herein by reference. And U.S. Patent No. 6,91 §, No. 731, filed on May 18, 2008, the disclosure of which is incorporated herein by reference. The changing room can have any suitable shape and design to minimize internal volume. Minimizing the internal volume of the chamber 5〇135 will minimize the volume of gas entering and exiting the chamber 5〇135 during the extraction cycle. This reduction in volume of gas G reduces the cycle time for substrate transfer through the loading of the lock chamber module 50100 as less gas G is drawn or introduced into the chamber 50135. Referring again to Figures 23A and 23B, the interior surfaces (i.e., the top, bottom and side walls) of the compartment 50135 can be designed to include one or more heating elements (or surfaces) 5〇45〇, 38 200922852 50451. The heating element 50450, 50451 of one of the embodiments is embedded in one or more walls of the chamber 50135 to heat the gas G in the chamber. The gas G throughout the chamber in this embodiment can be heated to a substantially average temperature. The gas G in any suitable portion of the compartment of the altered state can be heated. Another modified state of the gas G is not subjected to average heating. The heating elements of other embodiments will also maintain the temperature of the gas G within the compartment 50135. For example, gas G can be directed into the interior of the cabin by any suitable line 50455 at a predetermined temperature rise. The gas supply GS, which in one embodiment is connected to the chamber via line 50455, may include a gas heater 50456 that warms the gas G to a predetermined temperature before it is introduced into the chamber. The modified gas G is heated in any suitable manner prior to being introduced into the chamber 50135. Although only two heating elements 50450, 50451 are shown as an example, it is to be understood that the load lock chamber module can also include any suitable number of heating elements. The heating element of this embodiment is suitably disposed or embedded in the chamber wall to heat the chamber wall and the gas G therein. The wall of the compartment 50135 of another embodiment is itself a heating element. For example, the surface WS (or any other suitable portion) of one or more of the walls 50135 is designed as a heating element to transfer heat to the gas within the compartment 50135. One or more of the heating elements are modularized heating elements that are detachably embedded in the chamber wall β. One or more of the other aspects of the heating element are secured to the compartment 50135 in any suitable manner. surface. For example, the cabin wall may be made of a conductive material such as an aluminum alloy (or any other suitable material). The heating element can be attached to the surface (inner or outer surface) of the one or more walls to thermally heat the wall to a predetermined temperature. Heating elements 50450, 50451 of one of the embodiments are disposed around the chamber 39 200922852 to provide any suitable heating profile. The heating elements 50450, 50451 of one of the embodiments are arranged such that the temperature of the gas G in the chamber is substantially evenly distributed within the chamber 50135. The altered heating element is set to produce a temperature slope. For example, the temperature at the bottom of the chamber is higher than the temperature at the top of the chamber, so any particles generated in the transport during transport will be carried to the bottom of the chamber. A suitable filtration system can be provided at the bottom of the compartment 50135 to hold the particles that flow to the bottom of the compartment due to the temperature slope. Heating elements 50450, 50451 are any suitable heating elements of any suitable configuration. For example, the heating element of one of the embodiments is any suitable electronic heating element. Another embodiment of the heating element can include a conduit disposed within the interior wall of the chamber for the passage of heated fluid through the wall. The heating element raises the temperature of the wall of the compartment 50135 so that the wall appropriately increases the temperature of the gas in the compartment to minimize particulates generated during pumping of the compartment 50135. The temperature in the chamber 50135 during the pumping cycle can be expressed as follows: Ding GAS = D + 0 + (Ding convection - T adiabatic) [1] where T0 is the initial temperature, T Μ is due to gas expansion, and T# flow It is caused by heat transfer from the wall to the cabin. The rate of change of the adiabatic temperature drop is expressed as follows: d Ding rope heat _TGASSeff ~ 1, Γ〇ι

~dT~~~V~( JLJ where TGAS is the current gas temperature, seff is the effective pumping rate, v is the load lock chamber volume and the γ system gas heat capacity ratio. Any suitable equation can be used to define the adiabatic cooling. As shown in equation [2], to reduce the adiabatic cooling temperature change 40 200922852 rate, the pumping rate can be reduced or the cabin volume can be increased, both of which will lead to an increase in pumping time. Refer to Figure 24, cabin wall temperature The increase of the degree will increase the heat generated by the convection. The rate of change of the convection al temperature can be expressed as follows: ~^T=^F(t〇_Tgas) [3] where h is the convective heat transfer coefficient, and the S system is loaded with each other. Lock chamber surface area, ρ system gas, bulk density and Cv system gas heat capacity. Any suitable equation can be used to define the rate of change of convective temperature. As an example, if the gas temperature in the chamber is maintained at 20 during the pumping cycle °C, the gas will remain in this area without any particles. As can be seen from Fig. 24, in another embodiment, the initial gas temperature in the chamber during the pumping cycle can be borrowed from the wall of the chamber 50135 and the gas G. The convection heat transfer between the two is increased, so that when the gas temperature is lowered during the adiabatic expansion, the gas temperature during the pumping at the increased or maximum pumping rate will not be in the region where the particles are generated. See Figure 24, line L1- L4 represents the gas temperature relative to the pumping time of the pumping cycle of the load lock chamber, such as chamber 50135. As shown in Fig. 24, the lift gas initial temperature or the maintenance gas temperature is above the particle's generation temperature (through the chamber wall) The convective heat transfer between the gas and the gas allows the longest pumping time to be maintained in the particle-free region at the same time. In some cases it is not practical to maintain a very high chamber wall temperature. In this embodiment, the interlocking chamber 50100 is loaded. The ratio of surface area to volume is maximized (in a manner similar to that described above with reference to Figures 23A and 23B) to produce optimal convective heat transfer from the heated wall to the gas. Maximizing the surface area to volume ratio of the chamber 50100 and heating The cabin wall will contribute to the load lock chamber with the shortest pumping cycle time, 41 200922852 while preventing the generation of particles in the chamber 50100. The load lock chamber 50135 of the embodiment can also be designed to provide the shortest exhaust cycle time. In one embodiment, particulate generation and contamination within the load lock chamber 50135 can be achieved by maintaining non-turbulent or laminar gas into the load lock chamber. The method within 50135 is minimized or avoided. In one embodiment, the Reynolds coefficient Re of the airflow is less than about 2300. The modified state is any suitable Reynolds coefficient or fluid property. Any particular exhaust manifold The Reynolds coefficient can be calculated by the following formula:

Re = p— [4] where p is the gas density, the enthalpy gas velocity, the diameter of the lanthanide flow conduit, and the η-system gas viscosity. The variant can be determined using any suitable equation to determine the Reynolds number. In one embodiment, the ratio of the gas flow to the highest gas flow should not exceed 0.5 to 0.6 and the ratio of the modified aspect is any suitable value. The overlap pressure between the soft exhaust and the fast exhaust in the compartment 135 depends on the geometry and ranges from a few torr to hundreds of Torr and can be determined by any suitable means such as experimental means. Referring again to another embodiment of the load lock chamber 100 shown in Figures 1A and 1B. The load lock chamber 10 of the present embodiment includes stacked load lock chambers 14A, 14B (the two load lock chambers are illustrated as an example only, and the load lock chamber 10 in the modified aspect may have more or less In two cabins). Each of the load lock chambers 14A, 14B is substantially similar to the aforementioned chamber 50135, such that each chamber includes one or more heating elements and has a maximized ratio of internal area to volume to effectively heat the gases within each chamber. The load lock chambers 14A, 14B of the present embodiment do not include a substrate transport device, however, one or more of the compartments 14A, 14B may include a substrate transport device. As shown in Figures 1A and 1B, the load lock chamber module 10 can have any number of exhaust valves 42A, 42B. Although two exhaust valves 42A, 42B are shown, it is noted that more or less than two exhaust valves may be provided. Each of the exhaust valves 42A, 42B is a modular exhaust valve as described above. The venting valve of the modified aspect can have any suitable configuration. Exhaust valves 42A, 42B are designed such that a high volumetric flow rate of gas can flow through the valve into the chambers 14A, 14B at a low uniform gas velocity. The gas discharged from the port 50650A, 50650B (similar to the port 36A'-37B' described above with reference to FIG. 7B) has a definition of the Reynolds coefficient of the low velocity laminar flow and prevents the particles from being deposited on the load lock chamber module 10 On the substrate. Each of the exhaust valves 42A, 42B of one of the embodiments may include a diffuser/filter 651 mounted at the inlet of the exhaust line relative to one of the compartments 698, 699. The diffuser 651 of the present embodiment is disposed as shown in the cornices 650A, 650B, and the diffuser in the modified aspect is disposed at any suitable position relative to the opposing compartments 14A, 14B. The diffuser/filter 50651 is any suitable diffuser/filter. The diffuser/filter 5 651 of one embodiment is designed to reduce inlet particle concentration by about nine orders of magnitude, with more than about 0.003 x 1 (T6 m diameter removal rate. The minimum exhaust time of chambers 14A, 14B is dependent on relative The internal volume of the chambers 14A, 14B. The internal volume of the chambers 14A, 14B of one embodiment is optimized to maximize productivity in a manner similar to that described above with reference to Figures 23A and UR. The following description will be made with reference to Figure 25 for optimization. The operation of the load lock chamber module 50700 of the pumping cycle time. The load lock chamber module 5〇7〇〇 is similar to the aforementioned load lock chamber module 50100, and may include a minimized internal load lock chamber as described above. The volume, the heating load lock chamber wall body and any suitable combination of the optimal exhaust valve. The load lock chamber module 50700 of the embodiment connects the front end module 5〇72〇 with the & empty rear end portion. Including the vacuum chamber 50710 and the processing module, wherein the interlocking chamber module 50700 does not include a substrate transport device, and the modified load lock chamber module 50700 can include a substrate transport device. For example, The substrate is transferred from the loading cassette 50725 into the load lock chamber module 50700 using a carrier 50721 disposed within an equipment front end module (EFEM) 50720. The substrate is loaded from the load lock chamber using a carrier 50711 such as a vacuum rear end portion 50710 The module 50700 is removed and transferred to one or more processing modules PM. Transferring the substrate from the processing module PM back to the loading cassette 50725 is performed in a substantially reverse manner. The carrier 5〇721 of the present embodiment is designed to be quickly converted. The substrate includes, for example, a plurality of transport arms. Suitable transporters include, but are not limited to, U.S. Patent Application Serial No. 11/179,762, the disclosure of which is incorporated herein by reference. Other suitable transfer devices include U.S. Patent Nos. 5,72,59,5,899,658, U.S. Patent Publication No. 2003/0223853, and U.S. Patent Application Serial No. No. 12/117,355, "Substrate Transport Device", hereinafter referred to as a reference in this case. In operation, the carrier 50721 transfers the substrate through the open normal pressure valve of the EFEM 50720 and the load lock chamber module 50700. Load the interlock chamber module 50700 (block 50750). The load lock chamber module 50700 is isolated from the EFEM 50720 and evacuated to create a interface with the vacuum rear end 50710 (block 50751). The slotted valve system of the chamber module 50700 and the rear end portion 50710 is opened for the carrier 50711 to convert the substrate into/out of the load lock chamber module 50700 (block 50752). The load lock chamber module 50700 is isolated from the rear end portion 5〇71〇 and vented to create an interface with the aforementioned EPEM 50720 (block 50753). When loading the interlocking chamber module 50700 and the EPEM 50720 to create an interface, the carrier 50711 of the rear end portion 50710 converts the substrate into/out processing module ρΜβ through the substrate of the processing 44 200922852 and returns to the loading and interlocking chamber module 50700. The unprocessed substrate is removed from the load lock chamber 50700 in a subsequent load lock chamber mode transition cycle (e.g., block 50754). As shown in Fig. 25, the load lock chamber module 5〇7〇〇 is set to ten to cause it to be undone and the 盾^ shield ring time is 50760. The cycle time of the substrate processing with the rear end portion 50710 is substantially the same. (or shorter), the substrate productivity through the processing tool will be maximized. According to an embodiment, the substrate removed from the processing module is loaded through the load lock chamber 50700 and shipped back such as loading 埠 ('or Tools 5, 2, and any other appropriate part may not need to be buffered before. For example, referring to Fig. 26, a fastener having a conventional load lock chamber module and a processing tool having the load lock chamber module of the present embodiment are compared. Except for loading the interlocking chamber module, any other components used to create the security tool as shown in Figure 26 are substantially identical. As shown in the example of FIG. 26, the conventional wafer load productivity of the conventional load lock chamber module is as shown by the line 5, which is about 150 wafers per substrate (substrate). The productivity of the processing tool is approximately 2 wafers per hour as indicated by line 50810. According to an embodiment, the initial temperature of the gas loaded into the interlocking chamber prior to pumping will be sufficiently enhanced' so that the temperature will not fall below the range of particulates generated during pumping of the load lock chamber when the gas undergoes adiabatic expansion. The internal volume will also be optimized to provide fast venting time while increasing convective heat transfer from gases such as the chamber wall to the load lock chamber module, thereby preventing or reducing particulates generated during pumping down to At least or get a repression. The exhaust valves of the 5 sides of the interlocking chamber module are also optimized to prevent downtime. Any suitable combination of the above features provides a higher I pumping speed during the pumping and exhaust cycle, which will result in substrate throughput through the loading of the interlocking chamber module 100. 45 200922852 An embodiment of the present invention provides a semiconductor processing tool for a semiconductor processing tool, comprising: a frame constituting at least one chamber having a sealing surface along a circumference of the opening, provided - The opening is provided, and the side of the door of the frame is placed on the side of the door of the frame = the heart of the mouth, the cylinder + the knot, the τ 芏 驱 驱 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The front end of the sealing surface is cautious (four) has at least (four) transmission (three)'

Moving the door between the sealed states, in which the HUM, L/, and at least one driver are disposed on the outer side of the substrate transfer area to transfer the substrate through the opening into the recording board. The embodiment provides a semiconductor processing tool. == having a frame forming at least one of the compartments, the frame having at least one aperture disposed in the recess for accessing at least one of the apertures, and a separate door inlay coupled to the frame, the The door inlay has a design designed to fit the outer peripheral portion of the recess and has an inner groove with a single structure with the outer peripheral portion. 2 = less - the opening ' utilizes at least one k-port connected to the frame' The sealing portion is configured to seal the at least one opening with the outer peripheral edge, and at least one door is provided in the concave portion: a sealing portion surrounding each of the at least one opening, the at least one door inlaid portion sealing portion and the door inlay The parts are different and are designed to create a seal between the interface insert and the frame with the door inlay. & Another embodiment provides a wealth. The device includes a first chamber, a first cooling surface is disposed in the first chamber, a first substrate supporting system is disposed in the first chamber and the phase supporting substrate is disposed, and the first chuck is at least partially disposed In a compartment, the first chuck has a second cooling surface disposed substantially opposite the first cooling surface, and the second substrate support is derived from the Hth second substrate branch 46 200922852 to support the second substrate Wherein the first collet is movable between a loading position and a cooling position, wherein the second cooling surface substantially contacts the surface of the first substrate when in the cooling position, and the first cooling surface is substantially in contact with the second substrate surface. Yet another embodiment provides an apparatus. The apparatus includes a frame forming an isolated compartment for supporting at least one substrate, the isolated compartment including a cabin wall and at least one heating element incorporated in the compartment wall for heating the cabin wall, wherein the compartment wall system design The ratio of the wall surface area of the compartment to the volume of the isolated compartment is maximized, thereby facilitating optimal heat transfer between the chamber wall and the gas in the isolated compartment. It is to be understood that the embodiments may be used alone or in any combination. The foregoing description is only illustrative of the embodiments. It will be apparent to those skilled in the art that many alternatives and modifications can be made without departing from the embodiments. Therefore, the present embodiments are intended to cover all alternatives, modifications and variations in the scope of the application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A-1B is a schematic perspective view of a substrate processing module having features of embodiments shown in different perspective directions; 1C-1E is another direction of the module. 1A is an exploded view of the module; 2 and 3 are schematic views of a substrate processing tool having the features of the embodiment; and 4A-4B are respectively a sectional view of the module and 5A-5B is another sectional view of the module and substrate transport device of another embodiment; 47 200922852 Fig. 6 is another part of the processing tool connected to another embodiment An elevational view of the module; Figures 7A-7B are another partial perspective and cross-sectional view of the compartment module of another embodiment; 8A-8D is a different embodiment of the valve module of another embodiment BRIEF DESCRIPTION OF THE DRAWINGS FIG. 9 is a schematic cross-sectional view of a portion of a module of another embodiment; FIG. 10A is an exploded perspective view of a compartment module of another embodiment, and FIG. Fig. 11A-11B shows another section of the module in different positions. A partial cross-sectional view of a portion of the substrate, a cross-sectional view of the module at different positions; and 12A-12B are another cross-sectional view of the module of another embodiment; A partial cross-sectional view of a module of another embodiment; 14A, 14B shows a load lock chamber of two configurations of an embodiment; and FIG. 14C shows a top view of a load lock chamber of an embodiment;

Figures 14D and 14E show a front view of a load lock chamber of two configurations of an embodiment; Fig. 15 is a load lock chamber having the features of the embodiment; and Fig. 15A '15B shows a door drive system of an embodiment. Part 16; Figure 16 shows a cross-sectional view of a processing system having the features of the embodiment; Figure 16A is a top surface of the load lock chamber of the embodiment shown in Figure 16 1SI · Group, Figures 16B and 16C A front view of two configurations of the load lock chamber of the embodiment shown in Fig. 16; 48 200922852 Fig. 17 is an isometric view of the load lock chamber having the features of the embodiment; Fig. 18 is an embodiment An isometric view of the load lock chamber/door interface; Figure 19 shows a cross-sectional view of the load lock chamber/door interface of the door of the embodiment in a first position; Figure 20 shows a door of an embodiment in a second Sectional view of the load lock chamber/door interface; Fig. 21 is another sectional view of the load lock chamber/door interface of Fig. 20; Fig. 22 is a load lock chamber mold having the characteristics of the embodiment A schematic perspective view of a portion of the set; Figures 23A-23C show a load lock chamber of an embodiment Fig. 24 is a view showing the features of the embodiment; Fig. 25 is a view showing the processing tool and the related flow chart of an embodiment; and Fig. 26 is a view showing the productivity of the substrate in an embodiment. [Main component symbol description] 10 substrate processing module 12, 13 valve 14 compartment 14A, 14B substrate maintenance compartment 16, 18 substrate transport opening 20, 22 top and bottom cover 22A, 22B support frame 24A, 24B substrate cooling surface 26 gap 27 Cooling block 30 Skeleton frame 32, 34 Top and bottom cover 36A, 36B Vacuum port 49 200922852 37A, 37B Exhaust port 38A, 38B, 39A, 39B Mating interface 40A, 40B Vacuum control valve 42A, 42B Exhaust Valve 42VB Valve body 44A Diffuser 54 Air cylinder 100 Load lock chamber module 114A, 114B Load lock chamber 120A, 120B Cooling chuck 121A, 121B Extension 124A Contact surface 150A, 152A Radiation fin 152A Heat sink 600 Normal pressure Front end 605 loading 埠 module 610 loading interlocking vacuum chamber 620 vacuum rear end 625 transport compartment 630 processing station 640 loading 埠 650 匣 box 650A, 650B 埠 port 651 diffuser / filter 660 micro environment 690 semiconductor tool station 691 control 710 substrate processing tool 712 tool interface 718 transport module 750, 760, 770 interface 780 substrate transport device 100 1, 1002 conduit 10100 loading interlocking chamber 10130, 10120 atmospheric pressure loading interlocking chamber door 10140 first loading interlocking chamber 50 200922852 10150 second loading interlocking chamber 10160, 10161 vacuum loading interlocking chamber door 10200, 10210 driving module 10200A , 10210A Upper drive actuator 10200B , 10210B Lower drive drive 10230 Seal contact surface 20100 Load lock chamber 20101 Normal pressure interface 20102 Vacuum interface 20120 Normal pressure door 20125 Door drive unit 20130 Door inlay 20330 Outside recess 20340 Inner groove Opening 20350 outer peripheral portion 20360 inner groove portion 20400 rear surface 50110 substrate transfer device 50111 upper arm portion 50112, 50113 front arm portion 50116, 50118 substrate transport opening 50450, 50451 heating element 50455 line 50460 elbow joint 50650A, 50650B mouth 50710 vacuum chamber 50720 front end module 50721 carrier 50725 loading 埠50790 processing tool 51

Claims (1)

200922852 X. Patent application scope: 1. A substrate processing tool, characterized in that: at least one isolation compartment is formed to maintain a structure of a control atmosphere; at least two substrate supports are arranged in each of the at least one isolation compartment, each of which At least two substrate supporting structures are stacked on each other for gripping the opposite substrate; and a cooling unit communicatively coupled to the at least two substrate supports, wherein the at least two substrate supporting and cooling units are activated to be disposed at the at least two Simultaneous conductive cooling of each of the opposing substrates on the substrate support. 2. The substrate processing tool of claim 1, wherein the at least one compartment comprises at least two isolated compartments each for maintaining a control atmosphere, the at least two compartments being superposed on each other. 3. The substrate processing tool of claim 2, wherein the first of the at least two isolated compartments is for transporting the substrate along the first direction and the second of the at least two isolated compartments The plurality of substrates are used to transport the substrate along the second direction, wherein the first and second directions are different from each other. 4. The substrate processing tool of claim 2, wherein each of the at least two isolated compartments is for providing bi-directional substrate transport. 5. The substrate processing tool of claim 1, wherein the at least one isolated compartment comprises an exhaust port and a vacuum port, the substrate processing tool additionally having a normal pressure control module for coupling Exhaust and/or pumping of the controlled atmosphere in at least one isolated compartment at the mouth of the exhaust and vacuum 埠 52 200922852. 6. The substrate processing tool of claim 1, wherein the at least one isolated compartment comprises an exhaust port, the substrate processing tool additionally having a plurality of interchangeable exhaust modules, each for coupling to An exhaust vent, wherein each of the plurality of interchangeable exhaust modules has an exhaust shape that is different from another plurality of interchangeable exhaust modules. 7. The substrate processing tool of claim 1, wherein the at least two substrate support systems are adjustable relative to the frame according to a predetermined distance between the at least two substrate supports. 8. The substrate processing tool of claim 1, wherein the at least two substrate supports are fixed relative to the frame. 9. A semiconductor processing tool, characterized by: - a frame constituting at least one compartment, the compartment having an opening and a sealing surface along a circumference of the opening; a door as a sealing surface to seal the opening; and a frame At least one driver on one side of the door is substantially parallel to a transfer plane of the substrate passing through the opening, the at least one driver having an actuator at least partially disposed at a front end of the sealing surface, and the drive actuator is coupled to the door to move the door Between the sealed states; wherein at least one of the drivers is disposed on an outer side of the substrate transfer region to transfer the substrate through the opening 53 200922852 into and out of the chamber. 10. The semiconductor processing tool of claim 9, wherein the drive link is coupled to the actuator by a drive link disposed on a front side of the sealing surface and substantially parallel to the sealing surface. 11. The semiconductor processing tool of claim 9, wherein the actuator has a modular assembly that is detachably mounted to the frame. The semiconductor processing tool of claim 9, wherein the actuator has - or two movable shafts for moving the door away from the sealing surface away from the sealed state ^ 14. The semiconductor processing tool of the item, wherein the sealing surface is removable from the frame. 15. A semiconductor processing tool comprising: a frame to a y-chamber having a recess and a >'-a hole in the recess for accessing at least - a grab room; a CD-shaped Lit frame, a detachable insert rear portion, the insert portion has an inner groove portion designed to fit the edge portion and has a single structure with the outer peripheral portion, and is provided at least partially Cooperating with at least one opening; at least one door connected to the frame for covering at least one opening, the at least one door having a door sealing portion to form an interface with the outer peripheral edge portion to seal the at least one opening; and at least one inlay provided in the concave portion The portion of the sealing portion surrounds each of the at least one opening, the at least the inlaid portion sealing material is different from the inlaid portion, and is designed to form a sealing portion between the inlaid portion and the frame to form an interface with the aged portion. 16. The semiconductor processing tool described in claim 5, wherein the control system is controlled by the atmosphere, and the (4) (4) department is used to control the atmosphere to isolate and control the atmosphere. A semiconductor processing tool according to claim 15, wherein the outer peripheral portion extends beyond the periphery of the at least one door. , gossip ... as in the middle of the material _ 15 rhyme of the semiconductor plus king tools, The apertures are sized to provide a minimum clearance for at least a portion of the delivery of the substrate to the substrate. The tool, wherein the module is driven, the semiconductor according to claim 15 is coupled to at least a device disposed outside the substrate transfer region to transfer the substrate through the at least orifice. 2 〇 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 21. A device comprising: a first compartment having a first cooling surface in a first compartment; a first substrate supported, fixedly disposed within the first compartment and designed to support the first substrate; and a first clamp The head is at least partially disposed in the first chamber, the first chuck has a second cooling surface disposed substantially opposite the first cooling surface, and the second substrate support is derived from the first chuck, and the second substrate supports Designed to support the second substrate; wherein the first chuck is movable between a loading position and a cooling position, wherein the second cooling surface substantially contacts the surface of the first substrate when in the cooling position, and the first cooling surface The surface is substantially in contact with the surface of the second substrate. 22. The device of claim 21, further comprising a second compartment, the second compartment comprising: a third cooling surface disposed in the second compartment; the third substrate support, fixedly disposed in the second compartment And a second chuck disposed at least partially in the second chamber, the second chuck having a fourth cooling surface disposed on the opposite side of the third cooling surface, the second chuck having a derivative a fourth substrate support for supporting the fourth substrate; wherein the second chuck is movable between a loading position and a cooling position, wherein the fourth cooling surface is substantially in contact when in the cooling position The surface of the third substrate, and the third cooling surface is substantially in contact with the surface of the fourth substrate. 56 200922852 23. The apparatus of claim 22, wherein the compartment system is designed such that the first and second collets are substantially opposite one another. 24. The device of claim 22, wherein the first and the collet are independently movable independently of each other. Grab 2 rooms and 5 grandchildren = please refer to the agricultural equipment mentioned in item 22 of the patent scope, in which the first and the first are separated from each other. 26. The device of claim 21, wherein the support is disposed between the second cooling table and the third substrate support. " - Grab the scope of the 2nd room. The scope of the 21st item includes the interface of the board, which is used to join the first collet and transfer from the first base and the second 8A as claimed in item 21 of the patent application. The device has a fluid channel design as a flow-relative-first-to-first substrate and a second substrate core system for transferring the phase 29. As described in claim 21 The device wherein the surface copper is conductively cooled relative to the first and second substrates. 57. The apparatus of claim 21, further comprising a fluid passage disposed substantially between the first substrate support and the second substrate support, the fluid channel being designed to facilitate the first and second substrates The fluid flow is used to promote the thermal barrier as a convective heat transfer between the first and second substrates. The device of claim 21, wherein the fluid channel is formed in the first substrate support. 32. A device comprising: a frame forming an isolated compartment for supporting at least one substrate, the isolated compartment comprising a chamber wall; and at least one heating element incorporated in the chamber wall for heating the wall of the compartment The compartment wall system is designed to maximize the ratio of the wall surface area of the compartment to the volume of the isolated compartment, thereby facilitating optimal heat transfer between the chamber wall and the gas in the isolated compartment. 33. The device of claim 32, wherein the wall of the isolated compartment is designed to conform to a path through the substrate of the isolated compartment to maintain a minimum clear distance between the substrate and the wall. 34. The device of claim 32, wherein the wall is additionally designed to maintain an initial gas temperature of the gas in the isolated chamber during the pumping cycle to reduce the temperature of the gas during aeration due to adiabatic expansion. Maintain above the predetermined range of 58 200922852 to minimize particle generation in the isolated compartment. 35. The apparatus of claim 32, further comprising a vacuum system for pumping air into the isolated compartment. 36. The apparatus of claim 32, further comprising at least one venting valve for maximizing gas volumetric flow into the isolated compartment, wherein ψf the volumetric flow of the gas has a low average gas flow rate to Minimize the generation of particles during the exhaust cycle of the isolated compartment. 37. The apparatus of claim 36, wherein the isolated compartment is designed such that a pumping cycle and an exhaust cycle occur during a processing time of a substrate in a processing module coupled to the isolated compartment. 38. The device of claim 32, wherein the internal volume of the isolated compartment is designed to reduce the exhaust cycle time of the isolated compartment to a minimum of one. 39. The device of claim 32, further comprising a substrate processing device disposed in the isolated compartment. 40. The apparatus of claim 32, further comprising an exhaust source designed to heat the gas introduced into the isolated compartment to a predetermined temperature. 59