TW200927358A - Pb-free solder alloy - Google Patents

Abstract

The present invention is provided to prevent the generation of whiskers via a lead (Pb)-free solder alloy. To achieve this objective, the present invention provides a Pb-free solder alloy including tin (Sn) as a first element and either boron (B) or beryllium (Be) as a second element.

Description

200927358 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a solder alloy containing no lead (hereinafter, referred to as a lead-free solder alloy), which is particularly concerned with the transmission of inclusions (Be) or collar (B) without generation. Lead-free solder alloy for whiskers. [Prior Art] The splicing is a technique of joining two or more elements together by using a solder having a melting point of 45 〇t or less. In soldering, only the solder melts and the base material is not melted. The conventional solder used in soldering is an alloy of lead (Pb) and tin (Sn). Most of these Pb-Sn solders include 63% by weight of tin and have a eutectic composition of tin and Pb and a melting point of 183 ° C, which does not thermally destroy electronic parts. In addition, the Pb-Sn solder has excellent wettability for ball grid arrays (BGA) electrodes or printed circuit board (PCB) substrates, thus reducing the number of soldering failures. However, electronic devices using these 卩1)_311 solders have been deactivated, and the Pb included in these solders can pollute the environment. It is increasingly difficult to use Pb-Sn solder due to the increased restrictions on the use of Sun. Therefore, the use of lead-free solder without errors has recently been used. Adding Ag, Ox, Zn, In, Ni, Cr, Fe, c〇, Ge to an alloy of Sn_Ag substrate, Sn-Cu substrate, Sn-Bi substrate, Sn-Zn substrate or each of the above materials The compound obtained by p or by is the main representative of lead-free solder alloy. The Sn-3Ag-0.5Cu compound obtained by adding Cu to the Sn_Ag substrate is better in solderability, has stronger solder joint strength, and has higher fatigue resistance, so it has recently been used for reporting more. The rS:_3A (d) compound can also be used as a solder alloy for (four) entanglement: bumps and balls. 0 block ^ When using Sn_Ag_Cu based error-free alloy for a long time, it tends to form on the surface of bismuth tin. When the solder is different from the material and its components are scaled to each other, the crystal limb is pure and secret.

Sensitive to heat and humidity. When these whiskers are formed on the surface of 3, a short circuit occurs in the circuit. Therefore, the durability of the package and the flip-chip package is reduced. SUMMARY OF THE INVENTION C species does not contain errors (four) and can prevent the generation of whiskers. According to the aspect of the present invention, a tin-free alloy is provided, which is composed of tin (Sn) as a component and as a second component. Or wrinkle_T ^ One of the second components of the lead-free solder alloy is 0.001% to 〇4% by weight..., the remaining components of the gas solder alloy include the first component and inevitable impurities (inevitable impurities) The second component of the gold solder alloy is 0.0033⁄4 to 0.53⁄4 by weight. The remaining components of the 'error-free tin-tin alloy include the first component and the unavoidable impurities. The error-free solder alloy further includes copper (Cu) as the third component. The third component accounts for 0.1% to 5.0% by weight. The second component of the lead-free solder alloy is 〇〇〇1% to 〇4% by weight 6 200927358

The remaining components of the Be's error-free solder alloy include the first component, the third component, and the unavoidable impurities. The second component of the lead-free solder alloy is 0.003% to 0.5% by weight - the remaining components of the B' front solder alloy include the first component, the third component, and the unavoidable impurities. The lead-free solder alloy further includes silver (Ag) as the fourth component. The second component of the lead-free solder alloy is 〇〇〇1G/. To the weight of Be, the remaining components of the error-free solder alloy include the first... 组 The group of impurities and the first, second, third, 丄 = not: one of the groups of impurities. The second component of the lead-free solder alloy is 3% to 5% by weight of the B'-free scale tin alloy, and the remaining components including the first, fourth, and unavoidable impurities and the first, second, and Third, one of the fourth component and the group of unavoidable impurities. [Embodiment] As described above, the conventional Sn_Ag_Cu-based error-free tin-tin is disadvantageous in that whiskers are generated on the surface thereof. However, the reason for the generation of whiskers has not been clearly revealed. The inventors of the present invention have noticed that Pb-Sn solder is bonded to the Cu-formed * liner (on the bonding surface * between the solder and the Cu liner - Cu diffuses faster than Sn) In other words, copper (Cu) diffuses faster than tin (Sn) (the main component of antimony tin) between the solder and the Cu lining, and diffuses in the grain boundary direction of the solder. An intermetallic compound having a composition of Cu6Sn5 is formed in the solder. 200927358 The inventors of the present invention believe that the whisker can remove the compressive stress applied to the Sn of Tanxi by the intermetallic compound, the whisker It is a single crystal having a whisker shape and is grown from the surface of the Sn-coated solder. Therefore, the inventors of the present invention attempted to reduce the amount of compressive stress generated in Sn by inserting metal to prevent diffusion between metals. The atoms are small enough to enter the gap site within the Sn crystal structure to prevent whiskers from forming.

Be (Be) or boron (B) can be used as a metal having a small atom. The lead-free antimony-tin alloy according to the present invention is a Sn-based multi-element (mu-element au〇y) including Sn as a main ion. Therefore, the lead-free solder alloy according to the present invention may comprise at least 8% by weight of Sn. As described above, the main object of the present invention is to prevent the generation of whiskers in a lead-free solder alloy. The inventors of the present invention have particularly noticed that the combination of # Sn-based solder and Οι pads to Be or B can prevent the formation of compressive stress in the Sn crystal as a diffusion and diffusion. Therefore, the niobium-tin alloy according to the present invention includes % as the first component and Be or B as the second component. Therefore, the Sn-free alloy in the tin-free alloy according to the present invention is referred to as a Sn-based alloy. The error-free solder alloy according to the present invention may comprise from 1% to the weight of the feedstock or from 0.003% to 0.5% by weight of b. In this case, and including less than 〇%% b read the county gamma noisy tin f ς: a sufficient amount Be or Β (as a second component) inserted into Sn (which is the gap between the first phase and the second 200927358 Therefore, as described above, the effect of preventing the growth of the intermetallic compound between Sn and Cu is preferable, and as described below, "whiskers are not generated even under severe conditions such as thermal shock test, hot hydrostatic test, and the like. And 'and' the lead-free solder alloy according to the present invention includes more than 0.4% by weight of Be• or more than 0.5% by weight of B, and Be or B inserted into the gap position of Sn is saturated, resulting in an increase in production cost and Reduce economic efficiency. The error-free solder alloy may further include Cu as the third component. In this case, Cu may be included in a weight of 0.1% to 5.0°/〇. Therefore, when the ratio to Cu is less than 0.1°/❶, the weight is compared. The mechanical strength of the lead-free solder alloy can be enhanced, and the wettability can be improved compared with the case where the Cu ratio exceeds 5.0% by weight. The lead-free solder alloy further includes silver (Ag) as the fourth component. Here, it may include 1.0 to 3.0% by weight. Ag. In this case, the ratio to Ag Compared with 1.0% by weight, the thermal shock tolerance of the lead-free solder alloy can be significantly improved, and the drop tolerance can be improved compared with the case where the ratio of Ag exceeds 3.0% by weight. It can be prepared in various forms such as a ball, a cream, a bar, a wire, etc. The invention will now be described in more detail with reference to the accompanying drawings in which exemplary embodiments of the invention are illustrated. The invention is not to be considered as limiting, but rather to provide a thorough understanding of the invention. (First Embodiment) The error-free solder alloy according to the first embodiment is a §n_Be-cu triple alloy. In the first embodiment First, a Be-Cu alloy is prepared, Sn is melted in a furnace, and the Be-Cu alloy is melted in a furnace to produce a melt. The temperature of the melt is maintained at a temperature between 600 ° C and 650 t for a period of time. The melt flows out of the furnace and is cast into a strip-shaped Sn-Be-Cu solder alloy sample. After polishing the comb shape of the JIS2-type Cu-based surface, the Tamura-Kaken flux EC is used. -19S-8 is applied to C U-based polishing surface. Thereafter, the prepared Sn-Be-Cu solder alloy sample was dissolved in a fUsed silica tube in a predetermined amount, and the Cu-based digest was introduced into the synthetic melting tube for 3 seconds. Dip soldering was performed. Next, the dip soldered substrate was immersed in ethyl acetate, and then the flux residue was removed by ultrasonic cleaning to prepare an experimental sample. Table 1 below shows the ratio of Sn, and Qi in the experimental samples prepared according to the first embodiment. The unit number shown in Table i is % by weight, and the quantity is the ratio of the ingredients inserted into the melt. Except for the components described in the specification, the impurity may further include a very small amount of impurities f such as (Ni) or cobalt (Co). The line recorded in Table 1 "just after preparation" indicates whether the whiskers were produced on the experimental samples immediately after preparation, and the "thermal shock" - line indicates 曰

ί ί 生 受 受 受 受 受 受 受 受 受 受 受 受 受 受 受 受 受 受 受 受 受 受 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备 制备At the temperature of another 8 叱, it is maintained 'timely, no interference' below __ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ As indicated in the table below, "not found" indicates that no whiskers are produced in the prepared experimental sample, "found, indicating that whiskers are produced in the prepared experimental sample. [Table 1] Experimental Sn Be Cu Immediately after preparation, thermal shock hot hydrostatic test without JL4JL first experiment 99.9833 0.0005 0.0162 No discovery found after Ding----- Lu Zhao second experiment 99.967 0.001 0.032 No discovery found no third experiment 99.484 0.020 0.496 Nothing found and found no fourth experiment 94.804 0.200 4.996 No discovery No undiscovered No depletion is found. Congratulations to the fifth experiment 94.604 0.400 — 4.996 -----—_L Nothing found No found 1 Nothing is not found Figure 1A Figure 1D is a scanning electron SEM (SEM) of the surface of the sample prepared immediately after the first experiment, the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the surface of the sample without interference at f temperature. Fig. 2A to Fig. 2D are respectively subjected to the same conditions as the first experimental conditions, and the surface of the sample prepared according to the second experiment _彳 is subjected to a thermal shock test. Scanning electron microscope (SEM) images of the surface of the sample, the surface of the sample subjected to the hot hydrostatic test, and the surface of the sample without interference at normal temperature. Figures 3A and 3D are respectively under the same conditions as the first experimental conditions, according to the The surface of the sample just prepared, the sample table subjected to the thermal shock test: the surface of the sample subjected to the hot hydrostatic test and the scanning electron microscope (SEM) image of the surface of the sample which is not disturbed at normal temperature. Fig. 4A to Fig. 40 The surface of the sample just prepared according to the fourth experiment was subjected to thermal shock test under the same conditions as the first experimental conditions. 11 200927358 Π: The surface of the sample subjected to the hot hydrostatic test and the sample at normal temperature without interference. Surface electron microscope (SEM) image. nr] 2 to 5D are the same as the first experimental conditions, the sample surface just prepared by the main five experiments, subjected to thermal shock test 2 product 面 surface I is subjected to thermal static Scanning electron microscopy (Sem) image of the surface of the sample of the handle m and the surface of the sample without interference at room temperature. e The data sheet J and Figure 1 5D are shown in The ratio of 铍_ on the surface of the just-prepared Sn-Be-Cu triple alloy is less than that of the % by weight, and = :=:rre-cu triple alloy surface, the surface of = 2 μ ° ° gold, at room temperature without interference On the surface of the triple alloy.

The number of whiskers in the flat area of the flat butterfly is small. Therefore, the root whistle flute a heart ^ degree 'early triple alloy and the alloy whistle provided a difficult wire / Me-01 = Table 1, the ratio of Be is at least % 1% weight = no crystal found in the experiment must. Therefore, it is preferred to contain a quantity of Be of Sn_Be_Cu triple alloy. 4〇〇1/. Heavy (second embodiment) alloy according to the second real wire solder alloy is Sn_Be_Cu_Ag triple 12 200927358 In the second embodiment, firstly, Be-Cu man a must be two uu alloy, Sn is melted in the furnace 'and The Be-Cu alloy and silver (Ag are turned into a turn to produce a melt. The temperature is maintained at the temperature of the refined product - the period is (4). After 650 650 ° C, the melt flows out of the furnace and is cast into the strip. (bar-shaped) Sn-Be-Cu-Ag solder alloy sample. The strip-shaped Sn_Be-Cu_Ag solder alloy sample was processed as in the first experiment to prepare an experimental sample. Table 2 below shows the preparation according to the first embodiment. The ratio of sn, Be, Cu, and Ag in the experimental sample. The unit number shown in Table 2 is % by weight, and the quantity is the ratio of the component inserted into the melt. In addition to the components described in Table 2, in the melt It may further include a very small amount of impurities such as p, Ni, Co ° Table 2 also indicates whether the test sample immediately after preparation, thermal shock test, hot hydrostatic test and non-interference at normal temperature under the same conditions in Table 1 The surface produces whiskers. [Table 2] After the preparation of Sn Ag Cu Be, the thermal shock hot hydrostatic test 4 was prepared without interference at room temperature. The sixth experiment 98.900 1.000 0.097 0.003 1 No undetected undiscovered, No. 7 experiment 98.300 1.000 0.679 0.021 No undiscovered It was found that the eighth experiment was not found. 96.900 3.000 0.097 0.003 No discovery was found. No ninth experiment was found. 94.00 3.00 2.88 0.12 No discovery was found. No discovery was found. Figures 6A to 6D are respectively under the same conditions as the first experimental conditions. 'According to the surface of the sample prepared just after the sixth experiment, subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the image of the sem of the sample on the surface of the sample at room temperature. 1Γ! 2 to 7D knife is attached to the surface of the sample according to the seventh experiment _ injury, the surface of the sample subjected to thermal shock test, the surface of the sample subjected to Qian Jingshui, and at room temperature under the same conditions as the first experimental conditions. Scanning electron microscope (SEM) image of the surface of the sample without interference.

8A to 8D are the same as the first experimental conditions, the surface of the sample prepared according to the eighth experiment, the surface of the sample α subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the room temperature Scanning electron microscope (SEM) image of the surface of the sample without interference. 9A to 9D are respectively the sample surface prepared according to the ninth experiment under the conditions of the first experimental condition, (4) the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the interference at room temperature. Scanning electron microscope (SEM) image of the sample surface. As seen in Table 2 and FIGS. 6A to 9D, 'the whisker is generated from the surface of the Sn-Be-Cu triple alloy which has just been prepared according to the second embodiment, the surface of the triple alloy subjected to the thermal shock test, and subjected to hot still water. The surface of the triple alloy tested and the surface of the triple alloy at room temperature without interference. (Third Embodiment) The lead-free solder alloy according to the third embodiment is a Sn-B-Cu triple alloy. In the second embodiment, Sn is melted in a furnace, and boron (b) and copper (Cu) are melted in a synthesis furnace to produce a melt. The temperature of the melt is maintained at 600 for a period of time. After (: and 650 ° C, the melt flows out from the melting furnace 200927358 and is cast into the strip shape Sn_B_Cu. The sample processing strip ^n_B = product 'to prepare the experimental sample. 忏 kick. Under the gold sample, 3 shows according to the The ratio of the sample B and Cu prepared in the three examples is shown in Table 3. The ratio of the components of the nail: η, ^ inserted into the melt is shown in Table 3. In addition to the amount of the compound described in Table 3, a minimum amount may be included. Impurities, such as ρ, milk, 2, and 2, whether or not whiskers are produced on the surface of the sample just prepared under the same conditions as in Table 1. Experimental experiment of limb m interference Sn B Cu Tenth experiment 99.989 o.ool 0.010 Eleventh experiment 99.987 0.003 0.010 Twelfth experiment 98.5 0.5 1.0 Nothing found after preparation immediately No thermal shock was found. No hot hydrostatic test was found. No findings were found.

❹ Figure 10A to Figure 10D are respectively on the surface of the sample with the aid of the first aid. (SEn at normal temperature is not shown in Figure 1 1A to Figure 11D, respectively, in the dish flute a Jga.., according to the eleventh experiment Preparation; conditions of the same condition test sample surface, the surface of the sample subjected to thermal shock measurement without interference, under the condition of normal temperature, FIG. 12A to FIG. 12D are respectively under the same condition as the first experimental condition 15 200927358, according to Scanning electron microscopy (SEM) images of the surface of the sample just prepared in the twelfth experiment, the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the surface of the sample without interference at normal temperature. And as seen in Figs. 10A to i2D, the whiskers are generated on the surface of the Sn-B-Cu triple alloy which has just been prepared according to the second embodiment. However, in the tenth experiment in which the ratio of B is less than 0.003% by weight, the crystal Must be produced on the surface of a Sn-B-Cu triple alloy subjected to thermal shock testing, subjected to hot static water measurement

Test the surface of the triple alloy, on the surface of the triple alloy without interference at room temperature. It was found in the tenth experiment that the average length of whiskers was 3.0 μm, and the number of whiskers per unit area (mm 2 ) was 5. ^ Although in the tenth experiment, whiskers were generated after severe conditions, the length of the whiskers was significantly lower than the length of the whiskers in the comparative experiment described below, and the number of whiskers per unit area was small. Therefore, the Sn_Be_Cu triple alloy according to the third embodiment provides a better effect than the conventional alloy. In Table 3, no whiskers were found in the eleventh and twelfth experiments in which the ratio of yttrium was at least 0.003% by weight. Thus, it is preferred to include a Sn~Be-Cu double alloy containing at least 〇 (10) by weight of ruthenium. (Comparative Experiment) The lead-free solder alloy according to the comparative experiment was a Sn-Cu double alloy and a Sn-Ag-Cu triple alloy. Sn-Cu ingots and Sn-Ag-Cu ingots of N〇n-ferrous Metal Ind Co., Ltd. were used in the comparative experiments. Experimental samples were prepared using the Sn-Cu ingot and the Sn-Ag-Cu ingot according to the same method as in the first embodiment. The proportional units shown in Table 4, 200927358, are % by weight. Table 4 also indicates whether whiskers were generated on the surface of the test sample immediately after preparation, after the thermal shock test, after the hot water test, and after the interference at normal temperature under the same conditions as in Tables i to 3.

17 200927358 FIG. 16A to FIG. 16D are respectively the surface of the sample prepared according to the fourth comparative experiment, the surface of the sample subjected to thermal shock, the surface of the sample subjected to the hot hydrostatic test, and the room temperature at the same conditions as the first experimental conditions, Scanning electron microscope (SEM) image of the dried sample surface. 17A to 17D are respectively measured on the surface of the sample prepared according to the fifth comparative experiment, the surface of the sample subjected to thermal shock, the surface of the sample subjected to the hot hydrostatic test, and the conditions under the same conditions as the first experimental conditions. Scanning electron microscope (SEM) image of the surface of the sample at room temperature*, ,, and interference. 18A to 18D are the same conditions as the first experimental conditions, the surface of the sample just prepared according to the sixth comparative experiment, the surface of the sample subjected to thermal shock, the surface of the sample subjected to the hot hydrostatic test, and the temperature at room temperature, Scanning electron microscope (SEM) images of the surface of the interfering sample. As shown in Table 4 and Figures 13A to 18D, whiskers were generated on all surfaces not containing Be or 5 based solder alloy. In the first, tenth and first to sixth comparative experiments, the surface of the sample prepared by the whisker heat shock test, the surface of the sample subjected to the hot hydrostatic test, and the surface of the sample prepared at room temperature without interference are shown in Table 5 The average length of the whiskers produced by the age and the whiskers per unit area. Test

The sixth comparative experiment 18 to the third comparative experiment of Sn-Cu solder &Sn; Sn_Ag-Cu solder alloy compared to the significantly shorter and significantly less number of prisoners

❹ 200927358 As seen in Table 5, the whiskers of the solder alloys of the first and tenth experiments were compared with the first alloy and the fourth to sixth experiments. Xing + Add Be bite b a small amount of Be (ie less than _1% ^ compared with the experiment, even when even a very small amount of B (ie less than the heavy Be) added to Sn or when 'can prevent Significant 〇^/〇 weight B) generated by whiskers, added to Sn As described above, whiskers can also be prevented according to the present invention.谇tin alloy, even if the conditions are poor, but the present invention specifically shows and describes the invention, in the case of the invention: shape = and range solder = the solder alloy of the invention can be used in various machines and electronic instruments The above invention provides a lead-free solder alloy capable of preventing the generation of whiskers. While the invention has been particularly shown and described with reference to the exemplary embodiments of the embodiments of the invention Various modifications were made to the details. $ [Simple Description of the Drawings] Figures 1A to 1D are the surface of the sample which has been prepared according to the first experiment, the surface of the sample subjected to the thermal shock test, the surface subjected to the hot hydrostatic test, and the sample without interference at room temperature. Scanning electron microscope (SEM) image of the surface. 2Α to 2D are respectively the surface of the sample prepared according to the second experiment, the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the interference at room temperature under the same conditions as the first experimental conditions, respectively. Scanning electron microscope (SEM) image of the sample surface. Φ Φ Figure 3A to Figure 3D are the surface of the sample prepared immediately after the second experiment, the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the room temperature under the same conditions as the first experimental conditions, respectively. Scanning electron microscope (SEM) image of the surface of the sample without interference. 4A to 4D are respectively the surface of the sample prepared according to the fourth experiment, the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the interference at room temperature under the same conditions as the first experimental conditions, respectively. Scanning electron microscope (SEM) image of the sample surface. 5A to 5D are respectively the sample surface prepared according to the fifth experiment, the surface of the sample subjected to thermal shock, the surface of the sample subjected to the secret water test, and the sample without interference at normal temperature under the same conditions as the first experimental conditions. Scanning electron microscopy (SEM) s of the surface. ',, Fig. 6A to Fig. 6D are respectively the surface of the sample prepared by the sixth experiment under the same conditions as the first experimental condition, the surface of the sample subjected to the thermal shock test subjected to the thermal shock test, and the room temperature under normal temperature. A scanning electron microscope (SEM) image of the surface of the interference. ..., τ ^ to Figure 7D are respectively the sample surface prepared according to the seventh experiment, the surface of the sample subjected to thermal shock 2 200927358, the surface of the sample subjected to the hot hydrostatic test, and the room temperature under the same conditions as the first experimental conditions. Scanning electron microscope (SEM) image of the surface of the sample without interference. Fig. 8A to Fig. 8D are respectively rooted under the same conditions as the first experimental conditions, the surface of the sample prepared by the first experiment, the surface of the sample subjected to the thermal shock test, the surface of the test piece of the secret side, and the temperature of the neonate The scanning electron beam mirror of the sample table φ without interference ( _ then.... Fig. = to Fig. 9D are respectively the sample surface prepared according to the ninth experiment and the sample table subjected to the second = under the first experiment, Scanning electron microscopy (Sem) images of the surface of the sample subjected to the hot hydrostatic test and the surface of the interfering sample, and .2, respectively, = 2 Γ are the surface of the sample taken under the same condition as the first experimental condition. Scanning electron microscope with interference surface..., bottom: Γ Γ = other conditions that are the same as the first experimental conditions ❹ :=?矣The surface and location of the sample subjected to hot hydrostatic testing; = surface reading electron microscope candle μ ) ι , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , - To _===) picture. [Scanning electron microscopy of the surface of the sample (10), the surface of the sample subjected to thermal shock 200927358, the surface of the sample subjected to the thermostatic phase test, and the surface of the sample without interference at normal temperature according to the conditions of the first comparative test (10). SEM) picture. 14A to 14D are respectively under the same conditions as the first experimental conditions, the surface of the sample just prepared according to the second comparative experiment, the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the room temperature. Scanning electron microscope (SEM) image of the surface of the sample without interference. 15A to 15D are respectively the surface of the sample prepared according to the third comparative experiment, the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the absence of the normal temperature under the same conditions as the first experimental conditions. A scanning electron microscope (SEM) image of the surface of the interfering sample. 16A to 16D are the surface of the sample just prepared according to the fourth comparative experiment, the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the room temperature under the same conditions as the first experimental conditions, respectively. Scanning electron microscope (SEM) image of the surface of the sample without interference. 17A to 17D are the surface of the sample which has just been prepared according to the fifth comparative experiment, the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the absence of the normal temperature under the same conditions as the first experimental conditions, respectively. A scanning electron microscope (SEM) image of the surface of the interfering sample. 18A to 18D are the surface of the sample which has just been prepared according to the sixth comparative experiment, the surface of the sample subjected to the thermal shock test, the surface of the sample subjected to the hot hydrostatic test, and the absence of the normal temperature under the same conditions as the first experimental conditions, respectively. A scanning electron microscope (SEM) image of the surface of the interfering sample. [Main component symbol description] None. twenty two

Claims (1)

200927358 X. Patent application scope: 1. A non-error welding alloy, comprising: tin (Sn) as the first component; and boron (B) or beryllium (Be) as the second component. 2. The lead-free solder alloy of claim i, wherein the second component of the lead-free solder alloy is 〇〇〇1% to 〇4% by weight of the lead-free solder alloy of Be' The remaining ingredients include the first component and the unavoidable impurities. 3. The lead-free solder alloy of claim 3, wherein the second component of the lead-free solder alloy is 〇〇〇3% to 5% by weight of B, the said lead-free solder alloy The remaining ingredients include the first component and the unavoidable impurities. 4. The lead-free solder alloy described in claim 1 further comprises copper (Cu) as the second component. 5. The lead-free solder alloy of claim 4, wherein the third component comprises from 0.1% to 5.0% by weight. 8. The gold-free L-media gold as described in claim 4 or 5, wherein the second component of the lead-free solder alloy is 0.001%^0.4% by weight of Be, the lead-free The remaining components of the solder alloy include the first component, the third component, and unavoidable impurities. 7. The gold-free L-welding gold as described in claim 4 or 5, wherein the second component of the lead-free solder alloy is 0° 003 ^ 0.5. /. At a weight B, the remaining components of the lead-free solder alloy include the first component, the third component, and unavoidable impurities. 23 200927358 8. The uncoated tin gold as described in item 1 or 4 of the patent application, including silver (Ag) as the fourth component. 9. The lead-free solder alloy of claim 8, wherein the second component of the lead-free solder alloy is 〇〇〇1 to 〇4% by weight of the above-mentioned lead-free bismuth tin alloy The remaining components include the first component, the fourth component, and a group of unavoidable impurities and the first component, the second component, the third component, the fourth component, and unavoidable impurities One of the groups. 10. The lead-free solder alloy of claim 8, wherein the second component of the error-free solder alloy is 0.003% to 0.5% by weight of B', and the remaining components of the lead-free solder alloy include a group of the first component, the fourth component, and an unavoidable impurity, and a group of the first component, the second component, the third component, the fourth component, and an unavoidable impurity one of them. 24 200927358 VII. Designated representative map: (1) The representative representative of the case is as follows: Figure 1 (2) The symbol of the symbol of the representative figure is simple: None. 8. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention: None.