TW200926394A - Molding methods to manufacture single-chip chip-on-board USB device - Google Patents

Abstract

A low-profile Universal-Serial-Bus (USB) device includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a USB controller chip and a flash memory chip, or a single-chip (combined USB controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The low-profile USB device is optionally used as a modular insert that is mounted onto a metal case to provide a USB assembly having a plug shell similar to a standard USB male connector.

Description

200926394 IX. INSTRUCTIONS: The patent application of the present invention is part of the US Patent Application "Single-Chip Multi-Media Card/Secure Digital (MMC/SD) Controller Reading Power-On Boot Code from Integrated Flash Memory for • User Storage" The continuation case (CIP), whose application was August 28, 2006. 曰, case number: 11/309,594. This U.S. patent application is another continuation (CIP) of another US patent original "Single-Chip USB Controller Reading Power-On Boot Code from Integrated Flash Memory for User Storage", and its application number is 2003 12 On March 3, the case number is: 10/707,277, and the approved registration has been obtained. The US patent number is: 〇 7,103,684. The patent application of the present invention is also a partial continuation (CIP) of the US patent application "Low-Profile USB Device", and its application is April 21, 2005, and the case number is 11/112,501. The patent application of the present invention is also a partial continuation (CIP) of the U.S. patent application "Universal-Serial-Bus (USB) Flash-Memory Device with Metal Wrap Formed over Plastic Housing", whose application date is April 12, 2005. The case number is: 10/907,700. The patent application of the present invention is also a partial continuation (CIP) of the US Patent Application "Flash © Memory Controller for Electronic Data Flash Card", and its application is August 23, 2006, and the case number is ll/466,759. This U.S. patent application is another partial continuation (CIP) of another US patent "Electronic Data Storage Medium with Fingerprint Verification Capability". The application date is January 6, 2000, and the case number is: 09/ 478,720 ° The patent application of the present invention is also a partial continuation (CIP) of the US Patent Application "Highly Integrated Mass Storage Device with an Intelligent Flash Controller", and its application is January 20, 2004, and the case number is 10/761,853. . 200926394 The patent application of the present invention is also a partial continuation (CIP) of the US Patent Application "System and Method for Controlling Flash Memory", which is filed on February 26, 2004, with the case number: 10/789,333. The invention patent application and the US patent application "Narrow * Universal-Serial-BUS (USB) Flash-Memory Card with

Straight Sides Using a Ball Grid-Array (BGA) Chip is also a related case, and its application date is March 24, 2006, and the case number is: 10/907, 204. [Technical Field of the Invention] The present invention relates to a A portable electronic device, in particular, a portable® electronic device that utilizes a Universal-Serial-Bus (USB) specification. [Prior Art] As technology advances in various fields, it can be aggregated to allow small, Portable memory cards have a large capacity. Flash memory technologies such as those manufactured by Electrically-Erasable Programmable Read-Only Memory (EEPROM) can store 125 Mb or more. The high-wafer, small-sized flash memory card is designed to have a connector that can be inserted into a specific card reader, for example, a compact flash memory card (CompactFlash, CF), and a secure digital memory card (Secure-Digital, ® SD ), Memory Stick (MS), or other standardized formats used. In recent years, the flash memory card sold Both include a universal serial bus connector that can be plugged into a host system's universal serial bus connector, such as a personal computer (PC), without the need for a specific card reader. Universal serial bus flash memory cards can be used to replace floppy disks. A universal serial bus flash memory card can have more than 10 floppy disk memory capacity, and the area is not the largest. The stamp is large. Please refer to Figure 24(A), which shows a conventional flash memory card with a conventional common sequence 200926394 bus bar connector. The flash memory chip i2 can be a mMb non-volatile. (n. please latile) the chip, or may have other valleys. The controller chip 14 includes a flash memory controller that can generate signals to access the memory location of the flash memory chip 12. The controller chip also includes a The universal serial bus interface controller is connected by a universal serial bus to continuously transfer data to the flash memory chip 12, and from the flash memory chip 12 The data is continuously transmitted. The common general-purpose serial bus connector 2 is fixed to a motherboard 1 , which is a small circuit board having a wafer 12 and a crucible fixed thereto, and the motherboard 10 can utilize multiple layers. Printed circuit board (PHnted_Circuit B〇ard, printed circuit board) technology. A plastic case (not shown) can cover the motherboard 10. The universal serial bus bar connector 20 includes a small connector substrate 16, usually a substrate made of white ceramic, black rigid plastic, or other strong material. The connector substrate 16 is formed with four or more metal contact points 18, metal contact points. 18 transmits the generated universal sequence bus signal, or receives the signal 9 through the controller chip 14, the universal sequence bus signal includes electronic, ground, and continuous different data D+, D- 通用 public common sequence bus connection The device 20 includes a metal casing to wrap around the connector substrate 16, and the metal casing contacts the three sides of the connector substrate 16, and the upper side of the connector substrate 16 There is a metal contact 18, and there is a large gap between the top of the metal casing and 8200926394. The upper and lower sides of the metal casing are provided with holes 15' and the universal serial bus connector 2 is a type A universal Serial Bus Connector - See Figure 24(B), which shows a female universal serial bus socket connector 22 'The parent universal serial bus socket connector 22 can be used as a pc or other host system One of the integral parts may be connected to a host system by the electric gauge line 21. The other connector substrate 26 includes four gold-like contact points 28' for electrical connection to the four metal contacts of the common-purpose serial bus connector 20 shown in Figure 24(A) ( Eiectr丨cal contact). The connector substrate 26 is covered by a metal casing, but there is still a small gap between the metal casing and the connector substrate 26 on the lower three sides. The fixed function can be provided by the metal springs 24 on the upper and lower sides of the metal casing'. Please refer to Figures 25(A) and 25(B), when the common sequence is converged in Figure 25(A). When the row connector 20 is turned over and inserted into the female universal serial bus socket connector 22 in FIG. 25(B), the metal spring 24 is fixed in the hole 15 of the common-purpose serial bus connector 20. . See Figures 25(A) and 25(B), both of which are cross-sectional views to highlight the connection between the common-purpose serial bus connector and the female universal serial bus socket connector. The female universal serial bus socket connector 22 is on the left side, and the common universal serial bus connector 20 is inserted from the right side, and the common universal serial bus connector 20 is turned over with respect to the view angle of the 24th (A) diagram. of. Metal 9 200926394 Contact FIG. 18 is the lower surface of the connector substrate 16 formed on the common-purpose serial bus connector 2, and the metal contact 28 is formed on the female common-strip bus connector 22 The upper surface of the connector substrate 26, therefore, when the common-common serial bus connector 2 is inserted into the female universal serial bus socket connector 22, the metal contact points face each other so that the circuit is connected, such as the 25th ( B) As shown in the figure. The metal spring 24 is formed on the metal casing of the female universal serial bus socket connector 22, which covers the connector substrate 26, and fits in the hole 15 of the metal casing of the common-purpose serial bus connector 20. Helps to secure the connectors together. Referring to Figure 26, there is shown a small universal serial bus connector for use with a conventional universal serial bus flash memory card. The volume of the common-purpose serial bus connector 2〇 shown in Fig. 25 and the % diagram is larger, especially the metal casing is cumbersome, and the manufacturing cost is increased. Therefore, the common sequence can be made by β. The bus bar connector 30 is integrated with the motherboard 32 to reduce cost. The motherboard 32 is a printed circuit board having a flash memory chip 12 and a controller chip 14 fixed thereto, the motherboard 32 extending to be sufficient to accommodate the common universal serial row connector 3G and having a metal The contact point (4) is at the end 36 of the motherboard 32. The end 36 of the motherboard 32 includes a common general-purpose serial bus connector. The width and thickness of the connector 36 are designed to conform to the connector base 200926394 board 16 in Figure 24(a). The motherboard 32, but for the metal contact 38, is provided with an opening covering the bottom and sides of the common-purpose serial bus connector 30 to the end 36 to simulate - The metal casing of the common-purpose serial busbar connector in Figure 24(A). Referring to Figures 27(A) and 27(B), there are shown cross-sectional views of the conventional small universal serial bus connector inserted into a standard female universal serial bus socket connector. The motherboard 32 has a common universal busbar connector © 30 formed at the end 36, which is turned from the perspective of Figure 26, which is inserted from the right into the female universal serial bus socket connector 22. The metal contact 38 is Located on the lower surface of the common-purpose serial bus connector 3', the plastic outer casing 34 has an opening on the lower surface of the common-purpose serial bus connector 30 to expose the contact point 38, so when inserted The electrical connection to the metal contact 28 of the upper surface of the connector substrate 26 of the female universal serial bus socket connector 22 can be made as shown in Figure 27(B). The plastic housing 34 is adapted to fill the gap between the upper edge of the metal housing of the motherboard 32 and the female universal serial bus socket connector 22. However, there is no plastic housing 34. Any holes are provided 'so that' when the male universal serial bus connector 30 is inserted into the female universal serial bus socket connector 22, simply push the metal spring 24 slightly. The plastic housing 34 is formed along the thin edge of the motherboard 32 to facilitate filling between the connector substrate 26 and the edge of the metal housing 11 200926394 of the female serial bus socket connector 22, ie The gap above and below the plane is (as shown in Figure 27(B)). Although the small universal serial bus connector 30 is cheaper and smaller than the standard universal serial bus connector, it has an undesired thickness, and the use of a metal casing can reduce the size of the plug end, but in the conventional In the manufacturing process, the universal serial bus 1C is fixed on a printed circuit board on the same side as the metal contact point, and the manufactured host is relatively thick. Therefore, there is a real need for a flat, small, common universal busbar arrangement that has an ultra-thin handle thickness, thereby allowing an ultra-thin universal serial busbar device to be combined with a pocket carrier, such as a keyring and Pocket tools and the like, therefore, there is a need for a method of making such a small universal serial busbar arrangement. SUMMARY OF THE INVENTION The present invention is directed to a lightweight, short, small, universal serial busbar assembly in which the thickness of the handle structure of the universal serial busbar assembly is substantially the same as the thickness of the plug structure of the conventional serial And being small coplanar with the small (half height) thickness of the plug structure of the universal serial busbar arrangement. The thickness of the small plug structure is determined by a plug receiving space between the metal contact point and the metal casing of the standard female universal serial bus socket connector, and the plug structure further has a width 'the width and the The width of the space received by the corresponding plug defined by the standard female universal serial bus socket connector is the same, so 'between the plug structure and the standard female universal serial bus socket connection 12 200926394, there is just right (firm The size of the space is matched to reduce the overall thickness of the universal serial busbar device to the thickness of the plug structure. A printed-brush circuit board assembly is provided that includes metal contact points formed on a first-surface (above) of a printed circuit board, and all of the ic components (eg, a universal serial bus controller chip, flash memory) A wafer or the like is attached to the opposite surface of the printed circuit board. Next, a housing is molded over the element (that is, overlying the lower surface of the printed circuit board assembly), the housing including a plug portion extending to a point of contact with the metal to Providing the required thickness of the plug structure; and a handle portion to cover the IC component. The housing has a flat surface parallel to the printed circuit board and extending along the entire length of the universal serial busbar assembly (eg, from the front edge of the plug structure up to the trailing edge of the handle structure), thus the handle The thickness of the structure is actually the same as the thickness of the plug structure, which is necessary to ensure and securely connect to a standard female universal serial bus socket connector, thus creating a flat, small (thin) ©, structure It can be easily carried in the user's pocket or combined with a tool (utiuty _).

For the purposes of the present invention, passive components are attached to the printed circuit board by one or more standard surface mount techniques (SMT), one or more integrated circuit dies ( For example, the _ general-purpose serial bus controller 1C die and a flash memory die are fixed by a chip-on-board (COB). In the manufacturing process of the SMT 13 200926394, the SMT package passive components (eg, capacitors, oscillators, and light-emitting diodes) are fixed on the contact pads disposed on the printed circuit board, and then utilized. Conventional lead-free reflow soldering (solder refI〇w) - technology to connect the leads of passive components to the contact pads. In the next COB manufacturing process, the 1C die is mounted on the printed circuit board by conventional die bonding (out of the squeaking) technique, followed by conventional techniques, such as Wire bonding technology is connected to the corresponding contact pad by a circuit. After the COB process is completed, the outer casing is formed by plastic molding technology on the passive component and the IC die. By combining SMT and COB manufacturing techniques to fabricate small universal serial bus devices, the present invention provides several advantages over conventional manufacturing methods that utilize only SMT technology. First, COB technology is utilized to secure the universal serial bus controller. And the flash memory, which is usually occupied by the SMT package controller and the flash memory device, can be greatly reduced in size, so that the universal serial bus device is manufactured. The foot size can be effectively miniaturized' (in other words, a device with a shorter length and a thinner width). Second, the height of the 1C die can be greatly increased. Reducing, so that the stacked memory arrangement 'can greatly increase the memory capacity of the universal serial busbar device without increasing the pin size of the universal serial busbar device. Moreover, the overall manufacturing cost can be Unpackaged controllers and flash memory devices reduce '(in other words, to reduce the cost associated with the 200926394 SMT package that provides the controller and flash memory device). Moreover, the molded case is more traditional than the reverse The method provides a high moisture-proof and waterproof effect, and has a higher anti-collision effect. Therefore, compared with those manufacturing methods using only the conventional SMT manufacturing method, the COB and the SMT are combined according to the present invention, thereby providing a Lower cost but higher quality 'and smaller size memory products. ❹

In accordance with an embodiment of the present invention, a small universal serial bus arrangement employs a single-chip (four)/flash die comprising a control circuit and one or more flash block mass storage circuits. Connected to each other by a bus. The controller circuit includes an input/output (1/〇) interface circuit for transmitting and receiving commands and data to/from the host; and a flash memory controller for transmitting and receiving data through the internal bus To/from the flash to store a large number of blocks. By combining the controller and the flash memory circuit without the need for external pins, it is possible to reduce the area required for the controller and the flash memory device to occupy the printed circuit board. Therefore, according to the present, This helps to further miniaturize the formation of the universal serial busbar arrangement. According to another object of the present invention, the short and thin general-purpose serial busbar device described above is used as a -module component (m〇dular e〇mp_t) in the structure of a larger universal serial busbar assembly. For example, in the case of the embodiment, the short and thin universal serial busbar device is fixed in the casing, completely enclosing the universal serial busbar device, and the money is provided by a plug shell in the universal The serial bus is arranged and plugged around the circumference of the week 15 200926394, (for s, so the metal contact points formed on the universal serial busbar device are used by the front channel defined by the full metal casing to be used in another specific In an embodiment, the universal serial busbar arrangement is secured in a smaller - (semi) metal housing that encloses only the plug portion of the universal serial busbar assembly. In each particular embodiment, the plastic Portions are combined to securely connect the universal serial busbar assembly to the metal casing. A depression is formed on the metal casing using a crimping tool In order to fix the small-sized universal serial busbar device in an appropriate position, the present invention can manufacture a low-cost, high-quality, high-capacity universal serial busbar device with a beautiful outer casing design, which can be easily and conveniently The combination of short, thin and light universal serial bus devices is like an core component. In order to give your reviewers a better understanding and understanding of the structure, features and effects of the present invention, The detailed description of the drawings and the preferred embodiments is as follows: Φ [Embodiment] Please refer to FIG. 1(A) and FIG. 1(B) for showing a small size according to the first embodiment of the present invention. A general-purpose serial bus arrangement device generally includes a printed circuit board assembly (printed circuit board assembly) 110 and a plastic fixed to the printed circuit board assembly i 1〇. The outer casing 150. Referring to the upper portion of the first (A) diagram, the printed circuit board assembly 110 includes a printed circuit board (printed circuit board) m, and the printed circuit board is packaged a printed circuit board handle portion 112 at the end of the printed circuit board (1) 200926394, and a printed circuit board plug portion 114 at the end of the printed circuit board η. The printed circuit board 1U is actually a planar substrate having - The opposite two faces are respectively an upper surface (first) 116 and a lower surface (second) 118. Four metal contact points 120 are formed on the upper surface 116 of the plug portion ι14, and the metal contact points 120 are generally used. The printed circuit board U1 is formed according to a conventional printed circuit board process technology, and thus the metal contact point 12〇' IC chip 丨3〇 and © Π5, and The passive components 142, 144, and 140 are interconnected by a pre-defined network including conductive traces 131 and 136 and other conductive structures sandwiched between conductive materials (eg, FR4). Between the multilayer structure and the adhesive. In accordance with one aspect of the present invention, a passive component is secured to the lower surface 118 using one or more standard Surface Mount Technology (SMT) and directly encapsulates the circuit board using a wafer (Chip 〇n B〇ard, The ❹COB) technique fixes one or more integrated circuit (integrate), ic) dies (eg, controller IC die 130 and flash memory die 135). As described in FIG. 1(B), in the SMT manufacturing process, the passive components such as capacitor 142, oscillator 144, and a Ught Emitting Diode (LED) 146 are fixed to be disposed under The contact pads on the surface 118 (this section will be detailed later) 'and then fixed on the contact pad using conventional lead-free reflow soldering (Yang 1 (^1^#丨0)) technique. In order to make the 81 ^ The 200926394 process is easy to implement, and each passive component is packaged in any of a variety of known (preferably lead-free) SMT packages (eg, BaU GHd Array (BGA)) or thin small outline packages (Thin Small Outline). Package, tsop). Conversely, the IC dies 130 and 135 are unpackaged, and the semiconductor 'wafer' is attached to the lower surface 118 and electrically connected to the corresponding contact pads using conventional C〇B techniques. For example, as shown in the first (B) diagram, the control 1C die 130 is connected to the printed circuit board 111 by a bonding wire 〇6〇_丨 formed by a conventional technique, and similarly, Flash memory 1C die 135 is then electrically connected to the wire using wire bond 160-2 Printed circuit board U1. Passive components 142, 144 and 146, 1C die 130 and 135, and metal contacts 12A can be interconnected by conductive lines or metal lines (con ve/metai traces m and 130). Conductive lines or metal lines (10) This (9) ~ / cut (five) traces 131 and 136 are formed on the printed circuit board 111 using conventional techniques, some of which are simply drawn in dotted lines in the third (A) diagram. © Outside shouting 15〇 contains molded plastic, so virtually all plastic used to form the outer casing 150 is located below the printed circuit board U1 (that is, on one side of the printed circuit board), the housing 15 A peripheral wall 151 extends downward (in other words, perpendicular to the printed circuit board ηι), and a lower surface 152 extends parallel to the printed circuit board ill. According to the above discussion (1: 〇11 discussi〇n purposes), The peripheral wall 151 is partially surrounded by the handle portion 112' of the printed circuit board 1U and is referred to as a handle surface portion ι51_1; and the peripheral wall ι51 200926394 is partially enclosed by the plug portion 114 of the printed circuit board 1U, below It is the plug surface portion 151-2. The same 'the lower surface 152 partially covers the handle portion U2 of the printed circuit board U1, hereinafter referred to as the handle surface portion ^2"; * and the lower surface I52 partially covers the printing The plug portion 114 of the circuit board 111, hereinafter referred to as the plug surface portion 152-2. Please refer to the figure (A) of the general-purpose serial busbar device 1 . The handle structure 102 is composed of the handle surface portion 151_丨, the handle surface portion ί52 ι, © and the handle portion exposed to the printed circuit board. 112 is defined by the upper surface 116; likewise, the plug structure 1〇5 of the universal serial busbar device 1 is composed of the plug surface portion 151_2, the plug surface portion 152 2, and the exposure to the printed circuit board The upper surface 116 of the plug portion 114 is defined. Referring to Figures 2(A) and 2(B), the thickness T1 and width W1/W2 of the plug portion 1〇5 are selected to produce a just (firm) standard female universal serial bus socket connection. The interior of the device 22 (described above). Please refer to ® Figure 2(A) ' at the metal contact point 28 (in other words, the lower surface of the connector substrate 26) and the height H between the lower wall 23 A surrounding the metal casing is in accordance with the general sequence The standard setting of the row is approximately 2.5 mm. The thickness τ 1 is then set, for example, to 2.4 mm to ensure that the plug structure 105 just meets the area 25 A below the inner common busbar socket connector 22 (in other words, there is no significant up and down swing). And the plug structure 1Q5 has metal contact points 120 to ensure electrical connection to the metal contact 28 (as described in Figure 2(B)) 200926394. Similarly, the width w/wi between the metal casing side walls 23B_ and 23B-2 is approximately 12 〇 mm + / - 0.1 mm according to the general sequence busbar standard; and the width of the plug structure 1 〇 5 W2 (that is, between - the width between the outermost surfaces of the side walls 151-2A and 15UB) is set to, for example, 12 mm, so as to further ensure that the plug structure 1〇5 just fits the parent general-purpose serial bus socket The lower portion 25A of the interior of the connector 22. Please note that the plug structure 105 is hereinafter referred to as "small (1〇w_pr〇file), and "half-height"" where the plug structure 1〇5 is only inserted into the parent universal serial bus The lower portion 25A of the receptacle connector 22 (i.e., the side regions 25B-1 and 25B-2 and the upper region 25C are typically filled by a metal housing of a standard common serial busbar header connector, rather than by the small The plug structure 1〇5 is filled.) As shown in Fig. 1(B), according to another object of the present invention, the housing 15 includes a flat surface 152 parallel to the printed circuit board 1U, bounded by a single side Therefore, the first thickness T1 of the plug structure 105 (that is, the thickness measured from the printed circuit board upper surface 116 and the flat surface 152 adjacent to the metal contact 12〇) is substantially The second thickness Η of the handle portion 1 () 2 is the same (i.e., the thickness measured from the printed circuit board upper surface 116 and the flat surface 152 adjacent to the 3535 •). The figure shows the 'general sequence busbar device 1〇〇 the entire length actually The upper is flat (that is, from the rear edge 151-1A to the front edge 151_1B). The word "real 20 200926394 horizontal flat 60 means that the flat table & 152 is the same with the universal sequence The uppermost side surfaces of the entire length of the bus bar device 100 are parallel. In the particular embodiment shown in Figures 1(A) and 1(B), the uppermost side surface of the universal serial busbar device 100 is defined by the upper surface 116 of the printed circuit board lu, It is parallel to the flat surface 152 along the entire length of the universal serial busbar device 100. Similarly, the term "actually flat" is also in the specific embodiment described above, wherein the outer casing comprises a thin-walled structure that is in or in contact with the upper surface of the printed circuit board. In an embodiment, the thickness T2 of the handle structure 102 may be slightly different (for example, 5% from the thickness T1 of the plug structure 105). According to one of the objects of the present invention, the general-purpose serial busbar device 1 The so-called "flat" is achieved by fixing all IC dies (wafers) and other electronic components of the universal serial busbar device 100 on the lower surface 118 of the printed circuit board U1 (ie, the opposite of the metal contact 120). The other side) is used for this purpose, so that the overall minimum thickness of the universal serial busbar device 100 is determined by the thickness T1 in the plug structure 105 and the female universal serial bus socket connector 22 (eg, Between 2(B), the thickness τι must be maintained as a good one, because this arrangement must give the metal contact 120 on the uppermost surface, the plug surface portion 151-2, and the plug cover. The portion 152_2 can be extended to a predetermined distance below the printed circuit board 111 to provide the necessary thickness T. Therefore, by the 1C die 130 and 135 and the passive component 21 200926394 111 the lower surface 118, (for example: The capacitor 142) is only fixed to the printed circuit board and the total thickness of the universal serial busbar device 100 is reduced. Therefore, if the 1C die and the passive component are fixed to the upper surface 116, the universal sequence busbar is caused. The total thickness of the structure must be the thickness T1 plus the thickness of Ic extending above the printed circuit board iH (if a protective wall is added in this manner). According to another aspect of the invention, 1(A) and 帛i(8) diagrams * Body embodiment 'The upper surface 116 of the printed circuit lu is entirely exposed to the upper surface 116 of the universal serial busbar device 100, thus, so as to have a maximum thickness The universal structure busbar device 100' having the same thickness T1 of the plug structure 105 is formed on the upper surface 116 because the metal contact point 12 is defined, and the upper surface 116 defines a higher thickness T1 of the desired plug structure. The overall height of the universal serial busbar device can be reduced by exposing the upper surface 116 (that is, any point on the printed circuit board surface 116 becomes the highest point of the universal serial busbar device 100) As described in FIG. 1(A), in particular, according to the special microstrip of the universal serial busbar device, the peripheral wall 151 extends and covers the periphery of the peripheral edge of the printed circuit board ln, and the periphery The upper edge of the wall 151 is coplanar with the upper surface n6 of the printed circuit board m. By covering the peripheral side edge of the printed circuit board 1U, the peripheral wall 15 1 prevents foreign objects from being inserted into the printed circuit board. And between the outer casings 〇5〇, thus 'preventing the printed circuit board assembly 11 from being misplaced from the outer casing 15 2009 22394 from 0. FIG. 3 is a diagram showing the manufacture of the universal sequence according to another embodiment of the present invention. A flow chart of the method of the busbar device 1〇0. For the novel method, in summary, a printed circuit board panel is fabricated using known techniques (block 210), and a passive component is secured to the printed circuit board panel using SMT technology (block 225/220) The 1C die is die bonded (block 236/246) and wire bonded (block 238/248) using known c〇B techniques; then, the plastic melted knee is formed to form a molded case at The passive component and the IC die (block 240/250); then the printed circuit board panel is singulated (cut) into a separate universal serial bus arrangement (block 25〇/26〇); the independent universal sequence The busbar device prints (box 26〇/27〇); then the general sequence busbar device is tested, packaged, and shipped (blocks 270/280). This approach offers several advantages over traditional manufacturing methods that only utilize SMT technology. The first - 'Using COB technology to fix the universal serial bus + row controller and flash memory' is usually a lot of space occupied by these devices. Significantly reduced, the general-purpose serial busbar device can be significantly miniaturized in pin size. Second, by performing the wafer polishing method described below, the height of the die can be greatly reduced, thereby facilitating the memory arrangement of the stack, as described below with respect to Figure 18. Compared to the traditional manufacturing method, the molded case also provides excellent moisture and water resistance and a higher impact resistance. SMT system compared to standard universal serial bus memory card 23 200926394

Process of Manufacturing The process described herein for combining COB and SMT (plus a molding process) is less expensive. For the SMT process alone, the list of raw materials, such as flash memory and controller chips, is also manufactured using the COB process, so the cost of all (10) processes is spread over the package memory chip and controller chip. on. Therefore, according to the method of the present invention in combination with the c〇b and smt processes, it is possible to provide a lower cost and higher quality (in other words, more trustworthy) than the conventional method using only the SMT process, and © A memory product with a smaller volume. The flow chart shown in FIG. 3 will be described in detail below by referring to FIG. 4(A) to FIG. 17(B). Please refer to the upper part of FIG. 3, the manufacturing method is met by the requirements (filingabillof) The beginning of the material, including the manufacture of printed circuit board panels (block 210), the fabrication of passive (separate) components (block 212), such as resistors, capacitors, diodes, light-emitting diodes, and oscillators, all utilizing SMT The process encapsulates and manufactures the supply of Ic wafers (or individual lc dies). 4(A) and 4(B) are diagrams showing one of the printed circuit board panels 3 provided in the block 21 process described in FIG. 3, respectively, in accordance with a specific embodiment of the present invention. T〇) The lower view of the square 210. The mark "tx," is used herein to indicate the state of the printed circuit board panel during manufacture, such as "to" is a starting state, and continuously higher numbers (eg, "tl", 12, and T3) indicates the amount of the external circuit made by the printed circuit board panel 300. The printed circuit board panel 3〇〇(10) includes, for example, a printed circuit, as shown in Figures 4(A) and 4(B). (1) The long two-leaf wide four-pair substrates of the marked area each have the features described in Figures WA) and 帛1(8), and Figure 4(A) shows the surface ι6 on each printed circuit board (1). (For example: the upper surface 116 of the panel (1)-1 includes the metal contact point 12". The 4th (8) figure shows that the lower surface of each printed circuit board iii is 1]8, please note that each printed circuit board 111 (for example: printing) The lower surface 118 of the circuit board 111-1) includes a plurality of contact pads 119 arranged in a predetermined pattern to facilitate the COB process, which will be described in detail below. As shown in Fig. 4(A) Outside the two columns of printed circuit boards m, the panel 300 (to) includes end edge regions 31〇 a side edge region to surround the P brush circuit board U1, and a command center region 34 is disposed between the two columns of printed circuit boards 111. The marked cutting line is along the edge of each of the regions © 'Scratch or partially cut on the printed circuit board panel 3〇〇(t〇) but not through the panel material (uncut), for example, the end cutting line is from the relevant printed circuit board!! The end edge region is segmented; the side cut line 321 is the side edge region 20 separated from the associated printed circuit board lu, and the central cut line 341 is segmented from the associated printed circuit board i1. The cutting lines 331 of the printed circuit board are formed along the side edges between adjacent printed circuit boards 111, while the edges of the panels are provided by those who are well-known in the art. Features to facilitate the manufacturing process' and will remove the panel of the edge during the singulation process (described below) - Please note that the printed circuit board for the universal serial busbar device manufactured using only the SMT manufacturing process must be It is wider than the printed circuit board 111, because sufficient space is required to fix the packaged flash memory device, and therefore, the printed circuit board panel only by the SMT manufacturing method usually includes only 12 printed circuit boards arranged in a 2x6 substrate. However, by fixing the flash memory by the COB method, the invention facilitates making the printed circuit board 111 narrower, and therefore, each printed circuit board panel 300 (to) can be arranged in an array of 18 printed circuit boards. By forming a 2x9 substrate, by increasing the number of printed circuit boards 111 per printed circuit board panel, the present invention can provide the time and cost of a shorter manufacturing process. Fig. 5 is a view for explaining an SMT process for fixing a passive component on a printed circuit board 111-1 according to the block 22''''''''' In the first step of the SMT process, a lead-free solder paste is printed on the contact pads 119-1, 119-2, and 119-3. In the embodiment of the present invention, the contact pad is Corresponding to the SMT components 142, 144, and 146, using a conventional stencil to suit the design and layout of the printed circuit board U11

After dispensing the solder paste, the panel is transported to a conventional pick-and-place machine' and the SMT 26 200926394 components 142, 144, and 146 are respectively secured to the contact according to conventional techniques. On the pads 91-1, 119_2, and 119-3, when the process of fixing the pick-and-place components is completed, the printed circuit board panel is then passed through an infrared lead-free reflow soldering oven for oven under a correct temperature data. Group (IR-reflow 〇ven set), when the oven temperature range reaches the highest peak, the solder on each contact pad on the PC board is completely melted, and the melted solder connects the pins of all passive components to The PC board is soldered on the wire. Figure 6 shows a printed circuit board panel 3 〇〇 ( 11 ) sub-assembled Qin Shi capsule, wherein each printed circuit board ιιι (for example: printed circuit board ιιιι) includes passive components 142, 144, and 146, It is fixed on the printed circuit board 111 by the completed SMT process. Figure 7 is a simplified view of a completed or fabricated semiconductor wafer 400 (t0) according to block 214 illustrated in Figure 3. The wafer 400 (t〇) includes a plurality of 1C 430 formed on a semiconductor substrate 4〇1 according to a conventional photolithographic manufacturing technique, ^ in the example described below, the wafer 400 (tl) includes an IC 430, and the ic 430 includes a universal sequence bus control circuit. In a related procedure, a wafer (not shown) similar to wafer 400 (tl) is manufactured including a flash memory circuit' and in another alternative embodiment (this section will be described in detail below), The 1C 430 can include both a universal sequence bus controller circuit and a flash memory circuit. In each case, these wafers will be processed as described below, see Figures 8(A), 8(B), and 8(C). 27 200926394 Figures 8(A), 8(B) and 8(C) are based on block 242' described in Figure 3 'The substrate 401 is subject to ' during a back-grinding process on a wafer' A grinding process 'in order to reduce the initial thickness TW1 of each 1C 430 as a whole. • Wafer 400 (tl) is first fixed on the tape facing down (that is, the substrate layer 404 (t0) is facing the other side of the tape), which is pre-applied to a metal or plastic ring frame (Fig. Not shown), then the ring frame/wafer assembly is loaded into a vacuum chuck (not shown) having a very horizontal, flat surface and a specific wafer 400 (t0) diameter larger diameter. Next, the substrate layer is ground, as shown in FIG. 8(B), until the wafer 400 (t0) has a pre-designed thickness τW2, which is smaller than the starting thickness TW1 (eg, 8th) (A) shown in the figure). In the process, dewaxing water (de-i〇nizedwate〇) is used to clean the wafer. At the end of the mechanical polishing process, the wafer 4 is rinsed with more deionized water, followed by high speed. Rotate to air dry the wafer 4〇〇(u). ❹Please refer to Section 8(C)® 'Next' to cut the wafer into small pieces and divide the 1C 430 along the predefined edge area, in order to The block 244 is shown in Fig. 3 to manufacture Ic crystal #13(). After the back grinding process is completed, the tape on the front side of the wafer lion (tl) is removed, and the wafer is fixed (7)) with one tape. The ring frame on it, this time contacting the tape with the back side of the latest wafer, and then loading the ring wafer to a die cutter (such as a machine), which is pre-designed - Correct grain size data, 28 200926394 χ-axis and γ-axis scribes (scribe ianes), width, wafer thickness and expectationsΟ

Exceeding the depth of the cut. Then, according to the width of the XY scribe line, a cutter of a proper width is selected, the cutting process is started, the first line of the x-axis of the wafer is cut into small pieces, and the deionized water is rinsed at an appropriate angle and pressed at the cutting. The periphery of the knife and the wafer contact point to wash and wash away the dust that is cut as the saw blade rotates along the cutting path. Depending on the grain size and the cutting width distance, the cutting process will index the second cutting lane. After all the χ-axis cutting passes have been cut, the wafer chuck is rotated 90 degrees to align the γ-axis cutting lane. For cutting. The cutting action is repeated until all the cutting passes of the γ_ axis are completed. Figure 9 is a block 246, as described in Figure 3, illustrating the use of a die bonding process to secure the IC die 13A shown in Figure 8(C) and the printed circuit board of the printed circuit board panel. View of the flash memory ic die on the 11M. The die bonding process is performed on the printed circuit board panel 3 (see Fig. 6)' which is performed after the SMT process is completed. The die bonding process generally includes fixed control of the H IC die 13 〇 to the lower surface region mA, the lower surface region 118 is surrounded by the junction (4) 119·5; and the fixed flash memory 1C die 135 to the lower surface region 118Β. The lower surface area i(10) is located between the two rows of contact ports 119-5. In a particular embodiment, an operator loads the Ic die 13 and 135 onto a die bonder machine in accordance with conventional techniques, and the operator places the multi-printed circuit board face 3〇〇 (8) is also loaded to the magazine of the die bonder. 29 200926394 The die bonder picks up the first printed circuit board panel 300 (tl)' from the bottom track of the cassette The selected printed circuit board panel is transported from the transport device track to the eP〇xy dispensing target area of the die bond (DB) epoxide, which automatically reduces the bad mouth to be ready So that the die bonder picks up the second block (new underlying block) in one cycle under the die bonding operation. In the dispersion target area of the die bond (DB) epoxide (ep〇xy package), the 自动 box automatically distributes the die attach epoxide, using a pre-designed write Write pattern and quickly transfer the correct nozzle size to the target area U8A and Π8Β of each printed circuit board ln of the printed circuit board panel 300 (tl) when all the printed circuit boards lu complete the ring After the oxyhalide distribution procedure, the printed circuit board panel is transported to a die attach target area, and at the input stage, the cassette is loaded with a second printed circuit board panel to the empty die attach epoxide. Distributing the target area, in the target area of the die attach, the picked-up® robot arm and the metal ring (collet) (having a rectangular ring around the tip, so the vacuum can generate a suction force from the center) picks up an IC crystal The particles 13 are bonded to the lower surface region 118A, wherein the epoxide has been dispensed in the lower surface region n8A for bonding, and then the procedure is performed to place the 1C die 135 to the lower surface region 118B' when printing All of the printed circuit boards 111 on the board panel complete the die attach process, and then the printed circuit board panel is transported to a snap cure region, wherein the printed circuit board panel 30 200926394 passes - has a heating The chamber of the element dissipates the heat to a temperature suitable for thermally curing the epoxide. After curing, the printed circuit board panel is transported into the empty slot of the service box (sl〇t) waiting for the output of the die to the outPut rack. After receiving the new panel, the box raises a slot ready to receive the next panel during the second cycle of the program, and the die bonder will repeat these steps until all printed circuits in the input box The board panel is executed. For stacked die products, stacking more than one © I memory die can be repeated for the same panel. Figure 10 is a top plan view of the printed circuit board panel 300 (t2) after the die bonding process is completed. Figure 11 is a block diagram showing the use of a wire bonding process to connect the 1C die 130 and 135 to the corresponding contact pads 119-5 and 119-6, respectively, in accordance with block 248 depicted in Figure 3. The wire bonding process is performed as follows: after all the cassettes of the printed circuit board panel 300 (t2) (see FIG. 10) complete the operation of the wafer bonding operation, an operator transports the printed circuit board panel 300 (t2) to a nearby wire bonder (WB), and loaded with a printed circuit board panel 300 (t2) to the wire box input frame (magazjne plus rack), which is pre-prepared with a correct program It is good to implement this particular universal sequence bus arrangement. All 1C pads 119-5 and 119-6 and the coordinates of the printed circuit board gold fingers are predetermined and programmed in the wire bonding machine, when the printed circuit board panel of the attached die is loaded to the wire bonding area After that, the operator 31 200926394 issued a request for the wire machine to use the optical image (〇ptical visi〇n) to confirm the first wire bond pin of the first memory die of the first printed circuit board on the panel. (Wlre The position of the bond pin), once the first pin is green, the wire can automatically complete the entire wire bonding process for the remaining panels in the same product type 'for multiple flash layers stacked die' the printed circuit board The panel can be returned to the wire bonding machine to perform a wire bonding process for the second stack. Fig. 12 is a top view showing the printed circuit board panel 3 ( t3 ) after the wire bonding process is completed. 13(A) and 13(B) are simplified cross-sections of a printed circuit board panel 300 (t3) using a molding process to form a molded outer casing layer according to block 250' illustrated in FIG. Side view. As shown in the figure (3), after the wire bonding process is completed, the universal sequence bus bar panel 3〇〇(〇) is loaded to a mold machine 450, which includes a mold machine 450. A cover plate 452' is secured over the lower surface U6 of the printed circuit board panel 3(t3) and defines a chamber 456 for placement on the 1C wafer, bond wires, and passive components Above, these ICs: wafers, bonding wires, and passive components are attached to the lower/upper surface 116. Please note that no molding material is used on the upper surface 118/116. Here, the method of transfer molding is selected because of the accuracy and low cycle time of the transfei molding tooling. The granulated molding material is preheated and loaded with a pot or a chamber (not shown), as described in paragraph 32 of the i3(b), 200926394, 'then utilizing a piston (not shown) Passing the molding material from the POT through a channel known as a spruce and runner system into the mold cavity 456, causing the molten material to form a molding layer 458 to encapsulate all 1C wafers and passively An element and covering all exposed areas on the lower surface 116/118. The model (m〇ld) remains closed because the molding material is filled and fills all of the vacancies of the master mold 456. During this process, the wall of the cover plate 452 is heated to a temperature above the melting point of the molding material so that the material can flow more rapidly throughout the master mold 456. Molding machine 450 remains closed until the curing reaction of the molding material is completed. The injection molding process is followed by a cooling cycle, and the molding of the molding layer 458 begins to solidify and harden. Once the molding layer 458 has sufficient hardness, the 'ejector pins push the printed circuit board panel 300 (t4) (as shown in FIG. 14) from the molding machine, as described in FIG. The mold layer 458 forms a uniform planar square on the printed circuit board panel 3 (t4), ie, the smooth upper surface 459. Figure 15 is a simplified cross-sectional side view of a singulation process for dividing the printed circuit board panel 300 (t4) into a separate universal serial busbar assembly in accordance with block 260 of Figure 3. The printed circuit board panel 3 (t4) is loaded to a cutting machine (not shown) which is preset with a singulation routine including a predetermined cutting position. The operator aligns the cutting blade with the first cutting line as the starting point (for example, the end cutting line 3丨丨"), and the coordinates of the position of the 33200926394 position are stored in the memory of the cutting machine, and then the cutting The machine starts to automatically cut (single) 'general sequence bus bar panel 30〇( t4 ) according to a preset singular routine, for example, along the cutting lines 3 i , - 341-1, 341-2 And 311-2, then along the side cutting line and the printed circuit board cutting line (see Figure 4 (A)) to form a separate universal serial bus device. Figure 16 (A) and 16 ( B) The figure is a top view of a general-purpose serial busbar device 1 显示 displayed after the singulation process is completed. Ο 17(A) and 17(B) are blocks according to FIG. 270, after performing a printing process, displaying a lower upper view of the singular general-purpose serial bus device 1 。, and then performing the singularized general-purpose serial bus device 1 Print process, one of the specified company LOGO, universal serial bus LOG O, R〇Hs LOGO, numerical value, storage capacity value, or other relevant information is printed on the surface 152' of the outer casing 15 and/or the upper surface 116 of the printed circuit board m. After the printing process is completed, The universal serial bus bar device 100 is placed in the baking oven to cure the fixed ink. Please refer to the block 280' at the bottom in FIG. 3, which is the last step in the process of the method of the present invention, which includes testing, packaging, And transporting the separate universal serial busbar device. Please refer to the 17th (Α) and 17th (Β) diagrams, and then visually inspect the printed universal sequence busbar device and comply with the prescribed electronic test. General sequence sinks that are excluded from inspection or / and electronic testing 34 200926394 The rowing device will be removed from the product as a defective product, and the excellent memory card that has passed the test is packaged in a custom-designed custom-made box. Finally, the package will be shipped to the customer in the correct procedure according to the documents of the I. In the above example, the unpackaged controller and the flash memory die are used, except for the reduction. In addition to the overall manufacturing cost (that is, reducing the packaging cost associated with controllers and flash memory devices that have been completed by SMT), the present invention provides an additional advantage of expanding the universal serial busbar arrangement. Recalling the capacity without increasing its overall volume. For example, Figure 18 is a simplified cross-sectional side view showing a general-purpose serial busbar device 5 of a stacked memory, wherein the first flash memory chip 5354 It is fixed to the lower surface 518 and the first flash memory chip 535] is connected to the printed circuit board 511 by the first bonding wire 560 according to the above method. Since the height D (thickness) of the 1C die is smaller than that of the packaged flash memory device, and because the thickness T1 of the universal serial bus bar device 500 is a fixed specification, for example: 2.0 mm, to ensure that the symbol is exactly © Plug-in structure 1〇5 inner lower region 25A of the female common serial bus socket connector 22 (refer to FIG. 2(B)), a second flash memory chip in a stacked memory array of the present invention 535-2 is fixed to the first flash memory chip 535-1, and the second flash memory chip 535_2 is connected to the printed circuit board 511 by the second bonding wire 560_2. In another alternative embodiment (not shown), the second flash memory chip 535-2 can also be connected to the contact point at the first flash memory chip 535-1 by the associated bonding wire. The memory arrangement 35 200926394 substantially increases the memory capacity of the universal serial bus, but does not increase the pin size (ie, thickness T1, length and width) of the small universal serial bus device 5 (10). </ RTI> Figure 19 is a simplified cross-sectional side view of a small universal serial busbar 1_&amp;&lt;&gt;&gt; This small universal serial bus arrangement _ is different from that described in the previous embodiment, which uses a single crystal controller / © flash memory die 630 instead of separate a general-purpose serial bus controller and a flash memory chip, by which the single crystal controller/flash memory die (four) is connected to a printed audio 611 by means of a bonding wire as a feature, such as 2, the single crystal controller/flash memory die 630 includes a controller circuit 631 and one or more flash block mass storage circuits 635 1 , 635-2, and 635-3, Connected by - busbars (4). The controller circuit 631 includes an -input/output (10) interface circuit anode for facilitating transmission and reception of the data to/from the host (not included in the circle) to which the universal serial bus device is inserted. The controller circuit 63 i $ includes a flash memory controller 634 'to transmit and receive the transmitted data through the __ or more internal flash bus 638 to/from the flash mass storage block 635 1 , 635 2 . And 6353. Since the internal flash bus 638 is internal to the single crystal controller/flash die 63〇, the interface to the flash mass storage block 635", 635 2, and 635 3 does not require an internal pin. In the embodiment, the flashing mass storage block milk small 36 200926394 635-2, and 635-3 is not random access, instead, an instruction and an address address are transmitted as data through the internal flash convergence. Row 638 - to specify a data block to be transmitted from the flash mass storage blocks 635-1, 635-2, 635-3, therefore, the mass storage blocks 635-1, 635-2, 035-3 are addressable blocks A large amount of storage, rather than a random access memory (RAM). In another embodiment, the flash mass storage blocks 635-1, 635-2, 635-3 are by controller circuit 631. And the 632 flash micro-controllers are gathered together to map and indicate data transaction to the selected flash mass storage block 635 1 635 2, 635-3. Because of this fast Flash microcontroller 631 (c〇mr〇ller (3) (1) is to perform memory management, fast flashing The storage block 635_丨, 635 2 '635 3 is shown as a single, continuous memory to the internal host'. Details regarding the single crystal controller/flash die 630 used in the applicant's US patent 7, 1 〇 3, 684, which is hereby incorporated by reference in its entirety herein in its entirety in its entirety in its entirety in its entirety, in its entirety, Two examples of the general-purpose serial bus assembly that can be used as a modular unit and incorporated into a universal serial bus assembly will be described in the next paragraph. Figure 21 shows a small universal serial bus arrangement. An exploded perspective view of the ι〇〇 includes an all-metal housing 730 fixed to the small universal serial busbar device 10G t (which may be replaced by any of the above-described embodiments) 37 200926394 when assembling the small universal serial manifold The row device 100 is fixed to a substrate carrier 710, so the small universal serial busbar device '. is composed of a rear end plate 7 13 and a front end plate 715 supported by a bottom plate '711, wherein the front end plate 715 includes fixing tabs 717'. Next, the universal serial bus bar device 1 and the substrate will be utilized. The subassembly formed by the carrier 710 slides over a front channel 735 until the fixing portion 717 is engaged in the fixing groove 737 (as shown in FIG. 22(A)), and the front channel 735 is the metal casing 730 The perimeter wall 731 is defined. The recessed portion (small recessed hole) 738 is formed by a clamping tool (cHmping t〇〇1) pressed against the side of the universal serial busbar device 1 to fix the universal serial busbar device. Hey in the right place. A distal end portion 72 includes a plastic plug structure 721 which, when inserted into the channel 733 after the metal shell 730, is depressed on the universal sequence wake-up device 1A. A metal covering portion 723 is formed in the plastic plug structure 721' when the end portion 72 is fully inserted, the metal covering cover portion 723 covers the metal housing 730 after the passage 733 (as shown in Fig. 22(B) ). (4) The tab 729 extends upward from the plug structure 721. When the end portion 720 is entirely inserted, the plastic tab 729 is engaged in the recess (small recess) 739 formed in the metal casing 730 (as shown in Fig. 22(8) The wide portion can be fixed so that the end portion 72 can be fixed to the metal casing 73. The first and second views of the universal serial busbar assembly are assembled before and after the assembly. Please note that the metal casing 73 has a height. Η, corresponding 38 200926394 to the internal height HI of the standard female universal serial bus socket connector 22 (please refer to the description in Figure 2(A)). Since the height of the metal casing 73〇 is greater than the general sequence convergence The row of devices 1 〇〇, the metal contact 12 〇 is usable by the front channel 735 defined by the metal outer casing 730, such that the metal casing 73 can function as a standard common common serial bus connector. A), 23(B) and 23(C) are diagrams showing another embodiment of a universal sequence busbar assembly 800 that includes a half metal casing 830 as a Similar on The specific embodiment just mentioned, but is lighter and smaller than the specific embodiment described above, because the metal casing 83 has only half the length of the metal casing 730. Similar to the universal serial busbar assembly 700, the assembly The universal sequence bus bar assembly 8 is fixed by the universal serial bus bar device 100A in a substrate carrier 8 j 〇, so the universal sequence bus bar device 1 〇〇A is composed of one at a rear end The bottom plate 8n is supported by a bottom plate 8n between the plate 813 and a front end plate 815. The front end plate 815 includes an E1 fixed tab 817e. Then, the subassembly slides over a front channel 835 until the fixing portion 817 is engaged. The fixing groove 837 (as shown in the figure (b)) and the front channel 835 are defined by the peripheral wall 831 of the metal casing 83. A terminal portion 820 includes a plastic plug structure 821 when the metal is inserted. When the casing 830 is followed by the passage 833, the plastic plug structure 821 is pressed down on the universal serial busbar device 100A. A metal covering portion 823 is formed in the plastic insert 39 200926394 head structure 821, when the end portion 82 is the entire Upon entry, the metal cover 823 covers the metal housing 830 after the channel 833 (as shown in Figure 23(C)). The plastic tab 829 extends upwardly from the plug structure μ1 when the end portion 82 is completely covered. When inserted, the plastic tab 829 is engaged in the fixing hole 839 formed in the metal casing 83 (as shown in FIG. 23(C)), so that the end portion 820 can be fixed to the metal casing. The above description of the preferred embodiments of the present invention is intended to be understood by those skilled in the art and Other equivalent modifications or adaptations which are not to be construed as a departure from the spirit of the invention are intended to be included in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1(A) and 1(B) are perspective views and cross-sectional side views of a general-purpose serial busbar device showing an exemplary embodiment in accordance with an embodiment of the present invention. 2(A) and 2(B) are diagrams showing a standard female universal serial bus socket connector and a plug structure of the universal sequence bus device in Fig. 1, respectively, when separated and combined A schematic view of the end of the section. Figure 3 is a flow chart showing a method of manufacturing the universal serial busbar device in a second (eight) and a second (b) diagram according to another embodiment of the present invention. • Figures 4(A) and 4(B) are top and bottom views showing the method of using a printed circuit board • panel in Figure 3. Figure 5 is a schematic view of a surface mount technology (SMT) process for securing a passive component on a printed circuit board according to the method described in the third lap / 200926394. The figure is the top view of the printed circuit board panel shown in Figure 4(B) after completion of the SMT process. Figure 7 is a simplified view showing a semiconductor wafer including the method used by Ic in Figure 3. 8(A), 8(By, and 8(c) are simplified cross-sectional side views showing the wafer polishing and wafer dicing process in Fig. 7 for fabricating IC dies. The figure is a method according to Fig. 3 for describing a view of a die shown in Fig. 8(C) by a die bonding process to fix the die shown in Fig. 8(C) on a printed circuit board. A top view of the printed circuit board panel in Fig. 4(B) after the die bonding process is completed. Fig. 11 is a view of the method according to Fig. 3, illustrating the use of a wire bonding process to connect the first 8 (C) in the figure (C) to the corresponding contact pads of the germanium provided on the printed circuit board. Figure 12 is a view of the printed circuit board panel in the figure after the completion of the wire bonding process 13(A) and 13(B) are diagrams illustrating the use of a molding process to form a molded circuit in the fourth (B) drawing according to the method described in FIG. A simplified cross-sectional side view of the panel. Figure 14 shows the printed circuit 200926394 in Figure 4(b) when the molding process is completed. Above view of the panel. Fig. 15 is a singular process for dividing the printed circuit board panel in the 4(B) diagram into a separate universal busbar device according to the method described in FIG. Simplified cross-sectional side view. Figures 16(A) and 16(B) are top views below the general-purpose serial busbar arrangement after completion of the singulation process described in Figure 3. Section 17 (A) FIG. 17 and FIG. 17(B) are diagrams showing the general sequence busbar device in FIG. 16(A) after the execution of a printing process is completed according to the method described in FIG. Figure 18 is a simplified cross-sectional side view showing a general-purpose serial busbar device including stacking memory in accordance with another embodiment of the present invention. Figure 19 is a further perspective view of the present invention. A specific embodiment for displaying a simplified cross-sectional side view of a single wafer universal serial busbar arrangement. Fig. 20 is a block diagram showing a flash microcontroller ic~ pellet having a flash flashing mass storage block. According to another embodiment of the present invention, An exploded perspective view of a universal serial busbar assembly having an all-metal housing. Figures 22(A) and 22(B) are views showing the assembled front view of the universal serial busbar assembly described in Fig. 21. And rear view. Figures 23(A), 23(B) and 23(C) are diagrams showing a universal serial busbar assembly having a half metal casing in accordance with another embodiment of the present invention. 200926394 Stereoscopic exploded view, pre-assembled front view, and post-assembly view. Figure 24(A) shows a conventional flash memory card with a universal serial bus connector. 'Figure 24(B) shows one Female universal serial bus socket connector. Fig. 25(A) and Fig. 25(B) are cross-sectional views showing the connection state between the common-purpose serial bus connector and the female universal serial bus socket connector. Figure 26 is a diagram showing a conventional 序列 universal serial bus flash memory card utilizing a small universal serial bus connector. Figures 27(A) and 27(B) are cross-sectional views showing when the conventional small universal serial bus connector is inserted into a standard female universal serial bus socket connector. [Main component symbol description] 10, 32 motherboard 100, 100A universal sequence busbar device q 102 handle structure 105 plug structure 110 printed circuit board assembly 111, 111-1 printed circuit board 112 handle portion 114 plug portion 116 upper surface (the first a) 118 lower surface (second) 43 200926394 118A '118B lower surface area 119, 119-1, 119-2, 119-3 contact pad 119-5, 119-6 contact pad * ^ 12, 14 wafer '12 fast Flash memory chip 120 metal contact 130, 135 1C die 0 130 control 1C die 131, 136 conductive trace or metal trace 135 flash memory die 14 controller die 142, 144, 146 passive component 142 capacitor 144 oscillation 〇 146 illuminating diode 150 plastic housing 151 peripheral wall 151-1 handle surface portion 151-1A rear edge 151-1B front edge 151-2A' 151-2B side wall 44 200926394 151- 2 plug surface portion 152 down / flat surface 152- 1 handle/plug surface part" 152-2 plug cover part '16 connector base 160-1' 160-2 wire 18 metal contact point 0 20 common sequence bus bar connector 21 cable 22 female universal sequence Row socket 23 A lower wall 23B-1, 23B-2 side wall 24 metal spring 25A lower area 〇 25B-1, 25B-2 side area 25C upper area 26 connector substrate 28 metal contact point • 210 manufacturing printed circuit board panel • 212 manufacturing Passive component 214 fabricating wafer 45 200926394 220 SMT process for passive components 242 wafer backgrinding process 244 wafer dicing process - 246 die bonding and stacking process '248 wire bonding process 250 molding process 260 singulation process 0 270 printing Process 280 Test, Package, and Shipment 30 Common Universal Bus Bar Connector 300 Printed Circuit Board Panel 310 End Edge Areas 311, 311-1, 311-2 End Cut Line 320 Side Edge Area 321 321 Side Cut Line 331 Printed Circuit Board Cut Line 34 plastic housing 340 central area '341, 341-1, 341-2 central cutting line * 36 end 38 metal contact point 46 200926394

400 semiconductor wafer 401 semiconductor base 430 multi 1C - · 450 molding machine 452 cover 456 female mold 458 molding layer 0 459 smooth upper surface 500 universal sequence busbar device 511 printed circuit board 518 lower surface 535-1 first fast Flash memory chip 535-2 second flash memory chip 560-1 first bonding wire Q 560-2 second bonding wire 600 general sequence bus bar device 611 printed circuit board 630 single chip controller / flash memory crystal Grain * 631 controller circuit / flash microcontroller ' 6321 / 0 interface circuit 634 flash memory controller 47 200926394 635-1, 635-2, 635-3 flash memory mass storage circuit 638 bus 660 wire bond - 700 Universal Sequence Busbar Assembly 710 Carrier 711 Base Plate 713 Rear End Plate 0 715 Front End Plate 717 Fixing Tab 720 End Piece 721 Plastic Plug Structure 723 Metal Cover 729 Plastic Tab 730 Metal Case 731 731 Peripheral Wall 733 Rear Channel (opening) 735 rear channel (opening) 737 fixing groove 738/739 (please confirm) recessed portion (small recessed hole) 800 universal sequence bus bar assembly 810 substrate carrier 48 200926394 811 bottom plate 813 rear end plate 815 front end plate • 817 Fixed tab' 820 end piece 821 plastic plug structure 823 metal cover U 829 plastic tab 830 metal shell 831 peripheral wall 833 rear channel 835 front channel 837 fixing groove 839 fixing hole 〇 49

Claims (1)

200926394 X. Application for Patent Park: 1. A small universal serial busbar device, comprising: a printed circuit board assembly (printed circuit board assembly (PCBA), comprising: a printed circuit board (PCB) The method includes a printed circuit board handle portion and a printed circuit board plug portion, the printed circuit board having opposite first and second surfaces; and a plurality of metal contact points disposed on the printed circuit board plug portion a first surface; at least one passive component secured to the second surface of the handle portion of the printed circuit board; at least one unpackaged integrated circuit (IC) die secured to the handle portion of the printed circuit board a second surface; and a plurality of conductive traces formed on the printed circuit board, such that each conductive circuit is connected to at least one associated metal contact, the at least one 1C die, And the at least one passive component; and a one-piece molded housing formed on the second surface of the printed circuit board assembly The at least one passive component and the at least one IC die are covered by the molded case, so that 'the entire first surface of the printed circuit board is exposed to the outside. 2. If f, please (4) A small feedstock busbar 50 as described in item i 2009 2009394, wherein the molded housing includes a flat surface extending parallel to the printed circuit board and extending from the printed circuit board handle portion to the printed circuit a plate plug portion having a first thickness measured between the first surface of the printed circuit board and the flat surface of the metal contact S and the first surface of the printed circuit board and adjacent to the Ic crystal The second thickness measured between the flat surfaces of the granules is substantially the same. 3A small universal serial bus sluice device as described in item 2 of the patent of the first aspect, wherein the first thickness The range is between i 95 mm and 2 G5. 4. A small universal serial busbar device as described in claim 2, wherein the molded casing comprises a peripheral wall extending perpendicular to and perpendicular to The flat table 'and wherein the peripheral wall is aligned with the peripheral edge of the printed circuit board. 5. As described in the patent (4) μ, a small (four) material busbar device, where the "------------------- The bonding wires extend between the at least -1 C die and the corresponding contact pads to be electrically connected to the conductive traces. The contact pads are disposed on the second surface of the printed circuit board. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ pad. 7. For the towel, please refer to (4) (4) 6-material material-type material busbar arrangement device, wherein the at least one passive component comprises at least one resistor, a capacitor, 51 200926394 a vibrating disc, and a light-emitting diode Zhao. 8. A small general-purpose serial busbar device as described in Item 5 of the patent application scope, wherein at least one IC die includes a specific crystal grain and a germanium-ic die, the first IC: the die contains A universal sequence bus control circuit, the first 1C day particle comprises a flash memory circuit. 9. If the patent application scope is 8th, the small-scale (four) poetry bus ❹ ❹ V A V-IC die contains a plurality of flash memory dies, and the arrangement of the stack is set, therefore, the first fast The flash memory die is fixed on the second surface of the printed circuit board, and the first flash memory die is fixed on the surface of the first flash memory die. A small general-purpose serial bus as described in claim 9 wherein the first-flash memory die is connected to the circuit board by a plurality of bonding wires, and the second fast The flash memory die is connected to the first flash memory die and the printed circuit board by a second plurality of bonding wires. A small general-purpose serial busbar device according to claim 5, wherein the Φ 5 , 〉' IC die comprises a single chip controller / flash die, the single chip controller / flash die The controller circuit and one or more flash block mass storage circuits are connected to each other by a bus bar. 12. A universal serial bus assembly comprising: a small device comprising: 52 200926394 a printed circuit board assembly (BA) comprising a printed circuit board (printe (j Circuit Board, PCB) having a plurality of metal contact points on the first surface and the second surface, the first surface and the second surface are disposed on the first surface, the at least one passive component is fixed on the second surface, and the at least one unpackaged integrated circuit (1C a die s fixed to a second surface of the handle portion of the printed circuit board and a plurality of conductive traces formed on the printed circuit board such that each of the conductive trace circuitry is coupled to at least one associated metal a contact point, the 1C die, and the passive component; and a single piece molded case formed on the first surface of the printed circuit board assembly, such that the at least one passive component and the at least one The ic die is covered by the molded case, so that the entire first surface of the printed circuit board is actually exposed; and a metal case Fixedly connected to the small device, such that the metal contact point can be used via a front channel defined by the metal casing. 13. A universal serial bus bar assembly according to claim 12, wherein the component The method further includes: a substrate carrier for carrying the small device between the rear end plate and the front end plate, at least a portion of the substrate carrier being inserted into the metal casing, thus The front end plate is in fact aligned with the front passage defined by the metal outer casing; and 53 200926394 an end piece that is inserted into one of the rear passages of the metal outer casing, wherein the end piece includes a plastic plug structure, downwardly Pressing on the back of the universal serial busbar device' and a metal cover is used to cover the metal casing after the passage. 14 A universal serial busbar assembly as described in claim 13 wherein the metal casing extends to The entire length of the small device, so that the entire small device is disposed in the metal casing. A general-purpose serial bus bar set Q of the item 13 wherein the metal casing is shorter than the small device, so that a part of the small device extends outward from the rear of the metal casing. The universal serial bus bar assembly of claim 13 , wherein the metal casing comprises a recessed portion that is pressed against the at least one small device and the end member for fixing the end piece and the small device in the metal casing 17. A universal serial bus bar assembly according to claim 12, wherein the molded casing comprises a flat surface extending parallel to the printed circuit board and extending the entire length of the printed circuit board; And a first thickness measured between the first surface of the printed circuit board and the planar surface adjacent to the metal contact point, and between the first surface of the printed circuit board and adjacent to the The second thickness 'measured between the flat field surfaces of at least one 1C die is substantially the same. 54 200926394 ... a universal sequenced dragon row assembly as described in item 12 of the scope of the invention, wherein at least the -1C grain extends through the plurality of tan lines to and between the at least one 1 C grain (d), electrically connected to the conductive line, and the contact system is disposed on the second surface of the printed circuit board. 19. The universal serial busbar assembly of claim 18, wherein at least one of the passive components comprises a wire that is soldered to a corresponding contact disposed on a second surface of the printed circuit board. .通用 Ο 振 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如A general-purpose serial bus bar member as described in claim 18, wherein at least the IC die includes - the first die and the second IC die SC die comprises - a universal sequence bus control circuit The second 1C particle comprises a flash memory circuit. Z. A universal serial bus assembly as described in claim 21, wherein at least one Ic die comprises a plurality of flash memory grains arranged in a stacked arrangement. Therefore, the first-flash memory crystal The granules are fixed on the second surface of the printed circuit board, and a second flash memory die is fixed on the surface of the first flash memory die. A general-purpose serial bus group according to item 22 of the patent scope of the patent, wherein the first flash memory die is made by the first-multiple bonding wires 55 200926394 circuit board H flash memory crystal The granules are connected to the first-flash memory die and the printed circuit board by a second plurality of bonding wires. A general-purpose serial bus assembly as described in claim i.8, wherein the 乂1C die includes a single-chip controller/flash die, the single-chip controller/flash die inclusion&gt;丨ί ^ . 3 controller circuit and one or more flash blocks mass storage circuits are connected to each other by a bus bar. Ο 25. A method of making a universal serial busbar apparatus comprising the steps of: manufacturing a printed circuit board comprising opposing first and second surfaces, a plurality of metal contact points disposed on the first surface a plurality of first contact pads disposed on the second surface and a plurality of second contact pads disposed on the second surface and a plurality of conductive lines formed on the printed circuit board Each of the conductive circuit is connected to at least one associated metal contact, a first contact pad and a second contact pad; using a surface mount technique to adhere at least one passive component to the first contact pad; a Chip-on-Board (COB) technology for adhering at least one unpackaged 1C die on the second contact pad; and forming a one-piece molded case on the second surface of the printed circuit board, thus At least one passive component and the at least one 1C die are covered by the molded housing such that 'actually the entire first surface of the printed circuit board is exposed. 56 200926394 A method for manufacturing a universal serial busbar device according to claim 25, wherein the at least passive component is adhered to the following steps: printing a solder paste on the first contact pad; At least - the component is on the first contact pad; and reflow soldering (REFL 〇 Wing) the solder paste so that the at least one component can be fixedly soldered to the first contact pad. 27. A method of fabricating a universal serial bustling device as described in claim 25, further comprising: grinding a wafer comprising the at least one 1 C die. Thus, the thickness of the wafer during the polishing process Thus reduced, the wafer is then diced to provide at least one 1C die. The method of manufacturing a universal serial busbar device according to claim 27, wherein the bonding at least one 1C die comprises bonding the at least one IC die to the second surface of the printed circuit board and bonding The at least one IC die to the second contact pad. A method of manufacturing a universal serial busbar device according to claim 25, wherein the manufacturing the printed circuit board comprises forming a printed circuit board panel, the printed circuit board panel comprising at least one of the printed circuit board arrays In two rows; and the method further comprises singulating the printed circuit board panel after forming the one-piece molded housing, such that the molded housing includes a one-sided side wall extending and perpendicular to the printed circuit The plate, such that the peripheral wall is aligned with the peripheral edge of the printed circuit board. 57