200911008 九、發明說明： 【發明所屬之技術領域】 本發明係與微機電元件有關，特別是指一種矽晶電容 式麥克風。 5【先前技術】 一般電容式麥克風主要包含有一背板與一振動膜，早 期所使用振動膜材料為多孔性鐵氟龍化合物(Teflon)，但是 由於此類材質應力大且控制不易，造成感度分佈範圍過 寬’且駐極電荷易受温度影響而造成感度衰減的缺失。 ίο 為解決上述問題’有業者發展出利用半導體製程與矽 微細加工技術所製作的矽晶電容式麥克風，振動膜之材質 是以石夕或矽的化合物所製成，其主要目的在於可以使振動 膜具有較低且易控制的固有内應力（intrinsie stress)，藉以提 面振動膜的靈敏度。此外，矽晶電容式麥克風可藉由穩壓 I5 1C提供電荷來源，感度具有不受溫度影響的穩定性。 如美國專利公告編號第5，146,435號專利案「Acoustic transducer」以及美國專利公告編號第5,490,220號專利案 「Solid state condenser and microphone devices」；上述兩案 之結構主要包含有一平坦振動膜(membrane)以及一背板 2〇 (backplate);其中該振動膜的結構邊界係為四邊固定者，其 結構上能夠具有較高的内應力；然而，此等結構對於聲波 的靈敏度容易受到製程變異的影響而不容易掌握。 如美國專利公告編號第5,870,482號專利案揭露有一種 「Miniature silicon condenser microphone」；其主要係運用 4 200911008 $臂樑(camilever)結構，可以使振動膜的應力降低，以提高 靈敏度，但是，由於此案之結構於實際可變電容的面積較 小，故其所能產生的訊號也較小，具有訊號較弱的缺點。 再者’一般麥克風在設計上要求振動膜的自然共振頻率必 5須大於麥克風所需要的聲音頻率，但是此種結構之振動膜 的自然共振頻率相較一般設計要求為偏低，不容易達到一 般的設計要求，具有設計不易的缺點。另外，此案之振動 膜具有皺摺結構而容易產生應力集中的問題，具有造成振 動膜使用壽命縮短的缺點。 10 請參閱第一圖及第二圖，其係為一種習知矽晶電容式 麥克風1之結構示意圖。矽晶電容式麥克風1包含有一基 板2、一背板3以及一振動膜4。背板3設於基板2且具有 多數皺摺結構5,振動膜4設於背板3之皺摺結構5並與基 板2相隔預定距離；藉此，透過振動膜4的振動位移以達 15到偵測聲波變化之目的。然而，由於背板3與振動膜4的 連接處在結構性較為薄弱，當振動膜4於鬆弛狀態(rdease) 時，背板3以及振動膜4的連接處容易因高頻振動而造成 斷裂；換言之，此種結構在製程上，具有不良率高的缺點。 再請參閱第三圖，由於基板2與振動膜4之間的間隙極小， 20振動膜4上所帶有的電荷容易與基板2形成感應電容6的 問題而有待克服。 請參閱第四圖，其係為另一種習知矽晶電容式麥克風7 之結構示意圖。一矽晶電容式麥克風7包含有一振動膜8， 其係透過一懸臂9設於矽晶電容式麥克風7之基板，使振 200911008 動膜8，無法限制振動膜8於水平而懸臂9僅供支撐振 8 十方向的作動，使得振動膜 果不佳賴树料電子《，减收音效 待改所陳’習知石夕晶電容式麥克風具有上述缺失而有 【發明内容】 明之主要目的在於提供—種矽晶電容式麥克風， 特^夠降低振動膜應力’並兼具有低雜訊以及高靈敏度的 15 纽目的在於提供―卿晶電容式麥克風， 八於衣程上容易製作，具有提高良率的特色。 為達成上述目的，本發明揭露—㈣晶電容式麥克 風，包含有一基板(substmte)、一振動膜(diaphragm)、一背 板(backplate)以及多數電極(electr〇de);其中，該基板係具 有一腔體(chamber);該振動膜係具有一作 二 連接部，該作用區且遮蔽該腔體之開σ，各該連接部= 該作用區向外側延伸’該等連接部係相隔預定距離且分別 设於該基板；該背板係設於該基板且具有多數穿孔該等 穿孔係對應於該振動膜’該背板遮蔽該振動臈開放側且與 該振動膜相隔預定距離；該等電極係佈設於該背板。/、 藉此’本發明之石夕晶電容式麥克風能夠降低振動膜應 20 200911008 力，防止該振動膜因高頻發生 膜;能沿其垂直料作動，並== ：；ΙΠ： ：：：：：^ 製作，具有提高良率的特色㈣谷式麥克風於製程上容易 f 【實施方式】 … 》了詳細說明本發明之構造及特點所在，兹舉以下較 佳實施例並配合圖式說明如后，其中： 10 第五圖係本發明第—較佳實施例之結構示意圖。 第六圖係本發明第-較佳實施例之振動膜的頂側視 圖。 第七圖係本發明第一較佳實施例之等效電路圖。 第八圖係本發明第二較佳實施例之結構示意圖。 15 第九圖係本發明第二較佳實施例之振動膜的頂側視 V,.： 圖 〇 第十圖係本發明第三較佳實施例之振動膜的頂側視 圖。 請參閱第五圖至第七圖，係顯示本發明第一較佳實施 20例之矽晶電容式麥克風10，其包含有一基板(substrate)20、 一振動膜(diaphragm)30、一背板(backplate)40以及多數電極 (electrode)50。 基板20具有一腔體(chamber)22，以供聲波穿過。 振動膜30係具有一作用區32以及至少三連接部34， 7 200911008 連接部34係用以使振動膜3〇與基板2〇形成電性連接，於 本實施例中，連接部34之數量係為四，作用區32係遮蔽 腔體22鄰近振動膜3〇之開口，連接部34係自作用區& 向外側延伸呈平直狀且彼此相隔一預設距離，並於作用區 5 32與各連接部34相鄰處會形成一階部36，此外，每一連 接部34會分別貼抵於基板20上。 背板40係設於基板2〇上，以遮蔽振動膜3〇之開放侧 並與振動膜30相隔一預定間距，背板4〇上具有多數穿孔 42對應於振動膜3G之作用區32，用以作為振動膜％ 1〇時聲波傳遞之音孔，此外，背板⑼上另佈設有多數電極 50，用以當振動膜3〇之作用區32振動而產生位移時，可 將此物理性振動轉換為電子訊號。 15 經由上述結構’當聲波進入石夕晶電容式麥克風10時 振動膜3G會因聲波而產生位移，由於階部36會相對振! 膜1 形成限轉用，使振細3G無法於其水平方向作售 並只能沿其垂直方向作動’故可使物雌振紐過振動! 30 ^實地轉換為電子訊號，以提高石夕晶電容式麥克風1 2音效果’同時，此種結構設計可以降低振動膜3〇應力 2保振軸30在垂直方向具有較佳之錄度。再者，自 接。卩34對基板2G形成電性導接的效果，能夠防止者 與基板20之間形成寄生電容，進而達到降低雜窗 於制ί:。另外以製程的角度考量，⑦晶電容式麥克風1丨 :王上較容易製作’能夠降低振動膜3G受到製程變異纪 衫響，具有提高良率的特色。 20 200911008 結構所提供切晶電容式麥克風1G透過上述 费動祕^有娜低振動臈應力’防止振動膜3G因高頻 ==裂;再者’連接部34限制振動膜C = t Λ 用者，具有低雜訊以及高靈敏度㈣色。 具有提電容式麥克風"於製程上容易製作， 請參閱第八圖及第九圖，其係為本發明第二較佳實施 ι〇 ί之式麥克風12，其結構大致與第—較佳實施例 二，夕曰曰电谷式麥克風12包含有一基板6〇、一振動膜7〇、 一背板8〇以及多數電極90 ;差異處在於，振動膜70且有 1用JI 72以及至少三連接部74 ;本實施例中，連接部 4數量係為四；作用區72係遮蔽腔體&鄰近振動膜％ 15 ^ 口’連接部74係自作用區72向外侧延伸，本實施例 、第-實施例差異處在於，該等連接部％係呈凹凸起伏狀 且彼此相隔-預定距離，此外，連接部％係分別設於基板 60且局部貼抵於基板60。藉此，本實施例之連接部％的 彀計，同樣可以等效形成與第一較佳實施例中階部36的效 果。 請參閱第十圖，其係顯示本發明第三較佳實施例矽晶 電谷式麥克風之振動膜100’其結構大致與第一較佳實施例 同，差異處在於，振動膜100具有一作用區102以及三連 接部104;即連接部104的數量係與前述較佳實施例所揭露 者不同。藉此，本實施例同樣可以達到與上述較佳實施例 200911008 相同之功致。 綜上所陳，本發明之矽晶電容式麥克風透過上述壯 二i能夠降低振動膜應力’防止振動膜因高頻振動而i ;，再者，該等連接部限制振動膜只能沿其垂直方向 將振祕之電荷進行導接，她於制者，具有 謹咖°科，她鍋電容式 麥克風於製程上容易製作，具有提高良率的特色。 ^明於前揭諸實施例中所揭露的構成元件及方法步 驟’僅係為舉舰明，並_來_本案 之 範圍仍應以申請專利範圍為準，其他蓉 _ 代或變化，減為本案之申請科或步踢的替 200911008 【圖式簡單說明】 第一圖係習知矽晶電容式麥克風之結構示意圖。 第二圖係第一圖A之放大圖。 第三圖係習知矽晶電容式麥克風之等效電路圖。 5 第四圖係另一習知矽晶電容式麥克風之結構示意圖。 第五圖係本發明第一較佳實施例之結構示意圖。 第六圖係本發明第一較佳實施例之振動膜的頂側視 圖。 第七圖係本發明第一較佳實施例之等效電路圖。 1〇 第八圖係本發明第二較佳實施例之結構示意圖。 第九圖係本發明第二較佳實施例之振動膜的頂側視 圖。 第十圖係本發明第三較佳實施例之振動膜的頂側視 圖。 11 200911008 【主要元件符號說明】 5 f 10 10 梦晶電容式麥克風 20 基板 22 腔體 30 振動膜 32 作用區 34 連接部 36 階部 40 背板 42 穿孔 50 電極 12 砍晶電容式麥克風 60 基板 62 腔體 70 振動膜 72 作用區 74 連接部 80 背板 90 電極 100 振動膜 102 作用區 104 連接部 12200911008 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to microelectromechanical components, and more particularly to a twin crystal condenser microphone. 5 [Prior Art] Generally, a condenser microphone mainly includes a back plate and a diaphragm. The diaphragm material used in the early stage is a porous Teflon compound, but the stress distribution is large due to such materials, and the sensitivity distribution is caused. The range is too wide' and the electret charge is susceptible to temperature and the loss of sensitivity is lost. Ίο In order to solve the above problems, a manufacturer has developed a twin-crystal condenser microphone made by using a semiconductor process and a micro-machining technology. The material of the diaphragm is made of a compound of Shi Xi or 矽, and its main purpose is to enable vibration. The film has a low and easily controllable intrinsie stress, which is used to enhance the sensitivity of the diaphragm. In addition, the twin crystal condenser microphone can provide a source of charge by regulating the voltage I5 1C, and the sensitivity has stability independent of temperature. For example, U.S. Patent No. 5,146,435, "Acoustic transducer" and U.S. Patent No. 5,490,220, "Solid state condenser and microphone devices"; the structures of the above two cases mainly include a flat membrane and a backboard; wherein the structural boundary of the diaphragm is a four-sided fixture, and the structure can have a high internal stress; however, the sensitivity of the structures to sound waves is susceptible to process variation. Easy to master. A "Miniature silicon condenser microphone" is disclosed in U.S. Patent No. 5,870,482; the main use of the 4 200911008 $camilever structure can reduce the stress of the diaphragm to improve sensitivity, but The structure of the case is small in the area of the actual variable capacitor, so the signal it can generate is also small, and has the disadvantage of weak signal. Furthermore, the general microphone requires that the natural resonance frequency of the diaphragm must be greater than the sound frequency required by the microphone, but the natural resonance frequency of the diaphragm of this structure is lower than the general design requirements, and it is not easy to reach the general level. The design requirements have the disadvantage of being difficult to design. Further, the vibrating membrane of this case has a wrinkle structure and is liable to cause stress concentration, and has a disadvantage of shortening the service life of the vibrating membrane. 10 Referring to the first and second figures, it is a schematic structural view of a conventional twin crystal condenser microphone 1. The twin crystal condenser microphone 1 includes a substrate 2, a back plate 3, and a diaphragm 4. The back plate 3 is disposed on the substrate 2 and has a plurality of wrinkle structures 5, and the vibrating film 4 is disposed on the wrinkle structure 5 of the back plate 3 and spaced apart from the substrate 2 by a predetermined distance; thereby, the vibration displacement of the vibrating film 4 is up to 15 The purpose of detecting changes in sound waves. However, since the connection between the back plate 3 and the diaphragm 4 is structurally weak, when the diaphragm 4 is in a relaxed state, the connection between the back plate 3 and the diaphragm 4 is liable to be broken due to high frequency vibration; In other words, such a structure has a disadvantage of high defect rate in the process. Referring again to the third figure, since the gap between the substrate 2 and the diaphragm 4 is extremely small, the problem that the charge on the diaphragm 4 is likely to form the induction capacitor 6 with the substrate 2 needs to be overcome. Please refer to the fourth figure, which is a schematic structural diagram of another conventional twin crystal condenser microphone 7. A crystal condenser microphone 7 includes a diaphragm 8 which is disposed on the substrate of the twin crystal condenser microphone 7 through a cantilever 9 to vibrate the diaphragm 11 of the 200911008. The diaphragm 8 cannot be restricted to the horizontal and the cantilever 9 is only supported. The vibration of the vibrating 8 in the direction of the tenth makes the vibrating membrane not good for the tree material electronic, and the sound effect is to be changed. The conventional Shi Xijing condenser microphone has the above-mentioned defects. [Inventive content] The main purpose of the invention is to provide - A kind of twin crystal condenser microphone, which can reduce the vibration of the diaphragm, and has low noise and high sensitivity. The 15th purpose is to provide the "Qingjing condenser microphone", which is easy to manufacture on the machine and has improved yield. Features. In order to achieve the above object, the present invention discloses a (four) crystal condenser microphone comprising a substrate, a diaphragm, a backplate, and a plurality of electrodes; wherein the substrate has a chamber having a second connecting portion that shields the opening σ of the cavity, each of the connecting portions = the active portion extending outwardly 'the connecting portions are separated by a predetermined distance and Separatingly disposed on the substrate; the backing plate is disposed on the substrate and has a plurality of perforations corresponding to the vibrating membrane. The backing plate shields the open side of the vibrating crucible and is spaced apart from the vibrating membrane by a predetermined distance; It is laid on the backboard. /, by this invention, the Shi Xijing condenser microphone can reduce the diaphragm 20 200911008 force, prevent the diaphragm from generating a film due to high frequency; can move along its vertical material, and == :;;ΙΠ: ::: ::^ Production, with the characteristics of improving the yield. (4) The valley microphone is easy to process on the process. [Embodiment] ... The detailed description of the structure and features of the present invention is as follows. After that, the fifth figure is a schematic structural view of the first preferred embodiment of the present invention. Figure 6 is a top plan view of a diaphragm of a first preferred embodiment of the present invention. The seventh drawing is an equivalent circuit diagram of the first preferred embodiment of the present invention. Figure 8 is a schematic view showing the structure of a second preferred embodiment of the present invention. 15 is a top side view of a vibrating membrane according to a second preferred embodiment of the present invention. Fig. 10 is a top side view of a vibrating membrane according to a third preferred embodiment of the present invention. Referring to FIG. 5 to FIG. 7 , a twin crystal condenser microphone 10 according to a first preferred embodiment of the present invention includes a substrate 20 , a diaphragm 30 , and a back plate ( Backplate) 40 and a majority of electrodes 50. The substrate 20 has a chamber 22 for sound waves to pass through. The diaphragm 30 has an active area 32 and at least three connecting portions 34, 7 200911008. The connecting portion 34 is used to electrically connect the diaphragm 3〇 with the substrate 2〇. In the embodiment, the number of the connecting portions 34 is For example, the action area 32 is an opening of the shielding cavity 22 adjacent to the diaphragm 3, and the connecting portion 34 is straight from the active area & outwardly and spaced apart from each other by a predetermined distance, and is in the active area 5 32 A first-order portion 36 is formed adjacent to each of the connecting portions 34. Further, each of the connecting portions 34 is respectively attached to the substrate 20. The back plate 40 is disposed on the substrate 2 to shield the open side of the diaphragm 3 from the diaphragm 30 by a predetermined interval, and the back plate 4 has a plurality of holes 42 corresponding to the action area 32 of the diaphragm 3G. The sound hole is transmitted as a sound wave when the diaphragm is 1 〇, and a plurality of electrodes 50 are additionally disposed on the back plate (9) for vibrating the action area 32 of the diaphragm 3 to generate a physical vibration. Convert to electronic signal. 15 Through the above structure 'When the sound wave enters the Shi Xijing condenser microphone 10, the diaphragm 3G will be displaced by the sound wave, and the step 36 will be relatively vibrated! The film 1 is used for the limit rotation, so that the vibration 3G cannot be horizontally It can only be moved along its vertical direction, so it can make the female vibrate through the vibration! 30 ^ Converted to electronic signal in the field to improve the performance of Shi Xijing condenser microphone. 2 At the same time, this structural design can be reduced. The diaphragm 3 stress-preserving shaft 30 has a better recording in the vertical direction. Furthermore, it is self-contained. The 卩34 has an effect of electrically conducting the substrate 2G, and it is possible to prevent a parasitic capacitance from being formed between the substrate and the substrate 20, thereby reducing the number of miscellaneous windows. In addition, from the perspective of the process, the 7-crystal condenser microphone 1 丨: Wang Shang is easier to make 'can reduce the vibration film 3G is subject to process variation, and has the characteristic of improving yield. 20 200911008 The structure provides a tangential condenser microphone 1G through the above-mentioned sneak peeks, there is a low vibration 臈 stress, 'the diaphragm 3G is prevented from high frequency == cracking; and the 'connecting portion 34 limits the diaphragm C = t Λ With low noise and high sensitivity (four) color. It is easy to manufacture with a condenser microphone. Please refer to the eighth and ninth drawings, which are the second preferred embodiment of the present invention. The structure of the microphone 12 is substantially the same as the first embodiment. For example, the 曰曰 曰曰 electric microphone 12 includes a substrate 6 〇, a diaphragm 7 〇, a back plate 8 〇, and a plurality of electrodes 90; the difference is that the diaphragm 70 has a JI 72 and at least three connections. In the present embodiment, the number of the connecting portions 4 is four; the active portion 72 is a shielding cavity & the adjacent vibrating membrane % 15 ^ mouth 'the connecting portion 74 extends from the active region 72 to the outside, this embodiment, the first The difference in the embodiment is that the % of the connecting portions are undulating and spaced apart from each other by a predetermined distance, and the connecting portions % are respectively provided on the substrate 60 and partially adhered to the substrate 60. Thereby, the trick of the joint portion % of the present embodiment can also be equivalently formed with the effect of the step portion 36 of the first preferred embodiment. Referring to FIG. 10, a vibrating film 100' of a twin crystal microphone of the third preferred embodiment of the present invention is substantially the same as the first preferred embodiment. The difference is that the diaphragm 100 has a function. The number of the regions 102 and the three connecting portions 104; that is, the number of the connecting portions 104 are different from those disclosed in the foregoing preferred embodiments. Thereby, this embodiment can also achieve the same function as the above-described preferred embodiment 200911008. In summary, the twin crystal condenser microphone of the present invention can reduce the vibration film stress through the above-mentioned strong second i', preventing the vibration film from being vibrated by high frequency; and further, the connecting portions limit the diaphragm only along the vertical direction thereof. The direction will guide the sensible charge. She is a manufacturer, and she has a condenser microphone. Her pot condenser microphone is easy to make on the process and has the characteristics of improving yield. The components and method steps disclosed in the foregoing embodiments are only for the sake of the ship, and the scope of the case should still be based on the scope of the patent application, and other The application section or step kick of this case is 200911008 [Simple description of the diagram] The first figure is a schematic diagram of the structure of the conventional crystal condenser microphone. The second figure is an enlarged view of the first figure A. The third figure is an equivalent circuit diagram of a conventional twin crystal condenser microphone. 5 The fourth figure is a schematic structural view of another conventional twin crystal condenser microphone. Figure 5 is a schematic view showing the structure of a first preferred embodiment of the present invention. Figure 6 is a top plan view of a diaphragm of a first preferred embodiment of the present invention. The seventh drawing is an equivalent circuit diagram of the first preferred embodiment of the present invention. 1A is a schematic view showing the structure of a second preferred embodiment of the present invention. Figure 9 is a top plan view of a diaphragm of a second preferred embodiment of the present invention. Figure 10 is a top plan view of a diaphragm of a third preferred embodiment of the present invention. 11 200911008 [Key component symbol description] 5 f 10 10 Dream crystal condenser microphone 20 Substrate 22 Cavity 30 Vibration film 32 Interaction area 34 Connection part 36 Step 40 Back plate 42 Perforation 50 Electrode 12 Chopped condenser microphone 60 Substrate 62 Cavity 70 diaphragm 72 active area 74 connection 80 back plate 90 electrode 100 diaphragm 102 active area 104 connection 12