200919964 九、發明說明： 【發明所屬之技術領域】 本發明係相關於一種電容 可以達成製程簡化及微小化， 二係有關於 可能性，且更可以減少因！、， 及降低故障 更τ以減乂因運送過程中之衝撞所造成 產品之一種電容開關模組。 良 【先前技術】 近來隨著諸如蜂巢式電話的越來越多行 用了觸控螢幕，此類行動步署沾並^ 衣置白抓 的方々“ 订動羞置的普及流行程度以令人驚訝 的方式爆升。由於觸控螢蓋 用，作為觸控感”的個猶置市場中的普遍應 ㈣α應益的一個組件部份之電容開關模組，其 、暴亦因而成長’且其應用並未被限制僅止於家用電器領 域-驾知之機械式開關系統相較之下，電容開關有兑多 :面的優點’包括視覺設計，優良的構造，半永久性的壽 于用I*生等奴著電谷開關市場的啟動，電容開關模組 之市场㈣之成長’而客戶對於電容開關模組之技術性需 长亦有增長》回應於電容感應器積體電路（1〇客戶對於產 f方便性及可靠度的更多要求，其模組化之施行已成為必 須不過，由於其需要包含了其他額外製程以及各式組件 的表面黏著兀件以⑲，surface聊⑽七device)製程因 此必須要投入大量的時間及成本。 更特定而言，習知之模組化包含了（1)觸控感應器1C 及RC零件之印刷電路板（PCB) SMD，（2)電源供應及信號 5151-9779-PF 5 200919964 輸出之導接腳的插入，⑶觸控感應器外部的塑膠覆蓋 及觸控感應器Ic的模製(m〇lding)，以及⑷框架及墊片 、置，、所而要的零件包括了觸控感應器IC及RC跫 導接腳’塑膠蓋，以及框架。在由觸控感應器零件: 、 '應零件的情況之中，前述製造程序必須要 ^觸控感應器零件製造商及最終產品製造商兩者分別進 1 +該個客戶即為諸如蜂巢式電話等產*的最終製 造商，此客戶利用觸控感應器零件來製造最終產品。特別 地’框架的插置應由最終產品製造商來執行。因此，盆所 增加的處理時間及成本便被加之於最終產品製造商，亦即 客戶’的身上。 為解決jtb問題，觸控感應器零件製造商便利用將應 用於觸控感應器中的電容開關模組化，而為最終產品製造 商進行投人，以節省其處理時間及製造成本。依此方式所 開發出來的電容開關模組的一個實例被揭示於韓國 登錄第528680號案中。 圖1係為韓國專利登錄第52868〇號案中所揭示之— 習知電容感應開關之分解立體圖。參考圖i，冑然其中並 未’、"員示仁可供感應根據與人體之接觸而變動其電容的L 感應器1C，以及主動及被動元件，全皆被安裝在一 Μ 的底面上，此構成了電容感應開關10，而此些元件係與多 個輸入及輸出# 23a’ 23b及23C相連接。由導電體：： 像所構成的感應表面21係形成於PCB 20的上表面。此外， 在PCB 20 @上表面上亦安裝有一或更多個發光二極體 5151-977 9-PF 6 200919964 (LED) 25其可發光以供使用者辨識電容感應開關的 操作狀態。上述構造方式之PCB 20係被安裝於一外殼50 中，其係朝上開口。可均勻擴散UD 25所產生μ t 種擴散樹脂材料(未顯示)被充填於PCB 20的上部。此外， 具有殼體構形且開口朝下的-感應片60纟其一上表面中 形成有,、透光性的—個發光表面62。多個固定件6"皮形 成於感應片60的下端以將感應片60固定於PCB 20上。 對應於固定件6卜多個安裝孔26被形成於PCB 20上。依 照此種構造，感應片60可利用將感應片60的固定件61 插：於PCB 20的安裝孔26中’並利用，例如，軟焊而將 固疋件61與安裝孔26互相固定且與2。電性連接。 此外，具上述構造的電容感應開關模組則具有以下的 某些缺點。首先，若在感應與採用此電容感應開關 模組的產品的蓋子之間出現了空間，則由於空氣間隙之 故，其靈敏度即可能劣化，因而導致出現故障的可能性。 匕人，電谷感應開關模組在其運送期間可能會遭受某 =衝彳里。當PCB 20被安裝於具有整體性構造的外殼50上 並以祕知（未顯不）加以固定時，外部衝撞便可能會直接施 加於安裝在PCB 20上的諸如感應Ic，主動及被動元件等 兄脆弱電子元件上。在此種情況下，雖然其製造過程的情 兄正$，但此電容感應開關模組於運送過程之後真正被使 用時’便可能會發生產品的不良。 、第一，由於包含了觸控感應器1C，主動及被動元件等 的所需元件全皆被分開安裝於PCB 20之上，因此便必須 5151-9779~pf 200919964 要進行導接腳插入程序以 致徊&制β η知镇製的程序，其因而使得 玉 程複雜化，並因而使得元件的微型化變得困難。 【發明内容】 二匕，本發明係著眼於上述問題，且本發明之一目的 供一種電容開關模組’即便在電容開關模組之感 二片：應用此電容開關模組之產品的蓋子之間存在有空 障狀避免因空氣間隙而導致靈敏度之劣化以及故 本發月之另-目的係在於提供一種電容開關模組，直 ::減少因運送期間施加於其上之外部衝撞所造成之； 良產品。 组，立：、月之又另-目的係在於提供-種電容開關模 、、'，，、°以利用省略導接腳< # # & 程，並亦達成其尺寸之縮小。 展 依據本發明之-要點，上述及其他目的可利用提供一 谷：關模組而達成，其包含有一基底’其被形成為可 維持-中空空間並朝向其上及下側開放的一殼體；—電容 感應器ic晶片，其利用模製而形成以便整體性地包含一 感應器1C以供感應電容，一主動元件，—被動元件：及 信號輸入與輸出接腳，其並被承納於基底的尹空空間内. 以及一金屬片，其被安裝於電容感應器ic晶片之較上200919964 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a capacitor that can achieve process simplification and miniaturization, and the second system has possibilities, and can reduce the cause! And, to reduce the fault, more τ to reduce the capacitance switch module of the product caused by the collision during transportation. Good [Prior Art] Recently, with more and more lines such as cellular phones, touch screens have been used, and such action steps have been made and the white spots of the clothes have been set. Surprisingly, the method of bursting is used. As a touch-sensitive cover, it is generally a component of the capacitive switch module that is generally used in the market. The application is not limited to the field of household appliances - the mechanical switch system of the driver knows that the capacitive switch has more than one: the advantages of the surface 'including visual design, excellent construction, semi-permanent life with I* Waiting for the start of the electricity valley switch market, the growth of the capacitive switch module market (4) and the customer's technical needs for the capacitive switch module have also grown. Response to the capacitive sensor integrated circuit (1〇 customer for production f Convenience and more reliability requirements, its modular implementation has become a must, because it needs to include other additional processes and surface adhesive components of various components to 19, surface chat (10) seven device) process This is necessary to invest a lot of time and cost. More specifically, the conventional modularization includes (1) printed circuit board (PCB) SMD of touch sensor 1C and RC parts, (2) power supply and signal 5151-9779-PF 5 200919964 output guide The insertion of the foot, (3) the plastic cover on the outside of the touch sensor and the molding of the touch sensor Ic, and (4) the frame and the spacer, the set, and the required parts include the touch sensor IC And RC guide pin 'plastic cover, as well as frame. In the case of touch sensor parts: , 'in the case of parts, the aforementioned manufacturing process must be ^ touch sensor parts manufacturer and final product manufacturer respectively into 1 + the customer is such as honeycomb phone The final manufacturer of the production*, who uses touch sensor parts to make the final product. In particular, the insertion of the frame should be performed by the final product manufacturer. Therefore, the increased processing time and cost of the basin is added to the final product manufacturer, the customer. To solve the jtb problem, touch sensor component manufacturers have facilitated the modularization of capacitive switches used in touch sensors to invest in final product manufacturers to save processing time and manufacturing costs. An example of a capacitive switch module developed in this manner is disclosed in Korean Registration No. 528680. Fig. 1 is an exploded perspective view of a conventional capacitive sensing switch disclosed in Korean Patent Registration No. 52,868. Referring to Figure i, there is no ', " member of the L sensor 1C for sensing the capacitance according to contact with the human body, and active and passive components, all mounted on the bottom surface of a raft This constitutes the capacitive sensing switch 10, and these components are connected to a plurality of input and output #23a' 23b and 23C. An inductive surface 21 composed of an electrical conductor:: image is formed on the upper surface of the PCB 20. In addition, one or more light-emitting diodes 5151-977 9-PF 6 200919964 (LED) 25 are also mounted on the upper surface of the PCB 20 @ for illumination to allow the user to recognize the operational state of the capacitive sensing switch. The PCB 20 of the above construction is mounted in a casing 50 which is open upward. The μt type of diffusion resin material (not shown) which can be uniformly diffused by the UD 25 is filled in the upper portion of the PCB 20. Further, an inductive sheet 60 having a casing configuration and having an opening facing downward is formed with a light-transmitting surface 62 in an upper surface thereof. A plurality of fixing members 6" are formed on the lower end of the sensing piece 60 to fix the sensing piece 60 to the PCB 20. A plurality of mounting holes 26 corresponding to the fixing member 6 are formed on the PCB 20. According to this configuration, the sensing piece 60 can be inserted into the mounting hole 26 of the PCB 20 by using the fixing member 61 of the sensing piece 60, and the fixing member 61 and the mounting hole 26 can be fixed to each other by, for example, soldering. 2. Electrical connection. Further, the capacitive sensing switch module having the above configuration has some of the following disadvantages. First, if a space appears between the sensing and the cover of the product using the capacitive sensing switch module, the sensitivity may be deteriorated due to the air gap, thereby causing a possibility of malfunction. Deaf, the electric valley sensor switch module may suffer from some = during the transport. When the PCB 20 is mounted on the housing 50 having a monolithic construction and is fixed (not shown), the external impact may be directly applied to the mounted components such as the sensing Ic, active and passive components, etc. Brother is vulnerable to electronic components. In this case, although the manufacturing process is positive, the capacitive sensing switch module may be defective when it is actually used after the transportation process. First, since the touch sensor 1C is included, all the required components of the active and passive components are separately mounted on the PCB 20, so the 5151-9779~pf 200919964 must be inserted into the program. The procedure of 徊 & β 知 镇 ,, which thus complicates the jade process and thus makes the miniaturization of components difficult. SUMMARY OF THE INVENTION The present invention is directed to the above problems, and one of the objects of the present invention is to provide a capacitive switch module 'even in the capacitive switch module: the cover of the product to which the capacitive switch module is applied There is a space barrier to avoid the deterioration of sensitivity due to the air gap. Therefore, another purpose is to provide a capacitor switch module that reduces: due to an external collision applied to it during transportation. ; good products. Group, stand: month, and another - the purpose is to provide a kind of capacitor switch mode, ',,, ° to use the omission of the guide pin <##&, and also achieve its size reduction. According to the present invention, the above and other objects are achieved by providing a valley module comprising a substrate which is formed as a housing which can maintain a hollow space and open toward the upper and lower sides thereof. Capacitive sensor ic chip, which is formed by molding to integrally include an inductor 1C for sensing capacitance, an active component, a passive component: and a signal input and output pin, which are accepted by Inside the Yin space of the substrate. And a metal piece, which is mounted on the upper surface of the capacitive sensor ic chip.
部份，並與電容感應器ic晶片之信號輸入接 以作為一感應端。 連接 5151-9779-PF 8 200919964 電令開關模組更包含有連接至 持電容感應器土底以支 日日片之一下方部份的一蓋， 在相對於基底所維拉沾以便可以 -π维持的一個預定間隙内移動。 該電容開關模組更可包含有橫越基 水平安裝的-安裝片1中金屬片係安置於安裝片：間而 導電性塾片可被安裝而與金屬片之上表面 將一接觸輸入信號傳送 λ 較佳者係以彈性材料製成。 墊片之 該電容開關模組更可包含有由基底之—下 伸出之複數個的延伸突出。 刀 一其下蓋及基底兩者其中之任一具有一連接突出，而另 貝J具有垂直方向而形 互相接合。 设犬出 該電容開關模組更可包含有間置於金屬片及導電性 塾片之間以增進|7 ς }) Θώ 曰進及靈破度之詳細調整的一絕緣帶。於 此’該絕緣帶可為一種雙面黏性帶的形態。 、 。如上所述’依據本發明實施例之電容開關模組可以省 略取終產品製造商，亦即電容開關模組使用客戶所需進行 的框架插入程序。此外’產製電容開關模組的感應器部件 製造商的製程亦得以簡化。亦即是說，簡化的製程對製造 商與客戶兩者都是有利的。更特定而纟，由於作為感應電 極的金屬# ’作為框架的基底，以及電容感應器IC晶片 全皆整體結合製造，整個製程及構造便可以大為簡化，因 而’0加了市場接嗳度。再者，透過為感應器部件製造商及Part of it is connected to the signal input of the capacitive sensor ic chip as a sensing terminal. Connection 5151-9779-PF 8 200919964 The electric switch module further includes a cover connected to the bottom of the capacitive sensor to support the lower part of the day and the sun, so that it can be -π with respect to the base Move within a predetermined gap maintained. The capacitive switch module may further comprise a horizontally mounted horizontal mounting plate. The metal piece of the mounting piece 1 is disposed on the mounting piece: and the conductive cymbal piece can be mounted to transmit a contact input signal to the upper surface of the metal piece. λ is preferably made of an elastic material. The capacitive switch module of the spacer may further comprise a plurality of extended protrusions extending from the bottom of the substrate. The knife has a connection projection of either of its lower cover and the base, and the outer shell J has a vertical direction and is joined to each other. The dog switch module may further include an insulating tape interposed between the metal piece and the conductive cymbal to enhance the detailed adjustment of the |7 ς }) 曰 曰 and the rupture. Here, the insulating tape may be in the form of a double-sided adhesive tape. , . As described above, the capacitive switch module according to the embodiment of the present invention can omit the frame insertion process required by the customer of the final product manufacturer, that is, the capacitive switch module. In addition, the manufacturer of the sensor components of the capacitive switch module has been simplified. That is to say, a simplified process is beneficial to both the manufacturer and the customer. More specifically, since the metal #' as the inductive electrode is used as the base of the frame, and the capacitive sensor IC chip is all integrated, the entire process and structure can be greatly simplified, so that the market has been added. Furthermore, through the manufacturer of sensor components and
5151-9779-PF 9 200919964 客戶所達成的產品微型化及製程簡化，亦更易於滿足更多 此類客戶的需求。在此，製程的簡化不只代表僅止於製程 的改進，其亦表示電容開關模組的製造，可利用省卻許多 包括外購及人工的次要程序，而得以機械化及自動化。因 此，額外地，微型化的產品亦可容許遠為更多種類的設 汁，並更可容許進入更多新且不同的產業領域。 近來，ic產業及其他產業領域亦變得更有競爭力。雖 然其因而亦拌隨著更低價格的遞增的競爭性，但客戶則要 求更夕的技術創新。依據本發明之電容開關模組，真正具 備了競爭力而可以其較低價格，簡化的構造與製程，以及 使用上方便性的增進而符合客戶的各種需求。此外，其微 型化亦有助於其進入各種市場。 此外，依據本發明，電容開關模組靈敏度之劣化亦可 避免因而降低了故障率。另外，因外部衝撞所產生的不 良亦可免於發生。 本發明前述及其他之目的，特徵及其他優點在配合所 附圖式而加以詳細說明後已可更易於理解。 【實施方式] 、下將配合圖式詳細說明本發明之— 例。在以下之說明文字之中，由於所有圖式之中相二 ‘唬係指相同的元件，因此相同元件的說明將不予重覆。 圖2係為依據本發一第一實施例之—電容開關模組之5151-9779-PF 9 200919964 The product miniaturization and process simplification achieved by the customer is also easier to meet the needs of more such customers. Here, the simplification of the process is not only representative of the improvement of the process, but also means that the manufacture of the capacitor switch module can be mechanized and automated by eliminating many secondary processes including outsourcing and labor. Therefore, in addition, miniaturized products can also allow for far more types of juices, and more allow access to more new and different industries. Recently, the ic industry and other industrial sectors have become more competitive. Although it is also increasingly competitive with lower prices, customers are demanding technological innovation. The capacitive switch module according to the present invention is truly competitive and can meet the various needs of customers with its low price, simplified construction and process, and improved convenience in use. In addition, its miniaturization also helps it enter various markets. Moreover, according to the present invention, the deterioration of the sensitivity of the capacitive switch module can be avoided and the failure rate can be reduced. In addition, the damage caused by external impact can be avoided. The above and other objects, features and other advantages of the present invention will become more <RTIgt; [Embodiment] The present invention will be described in detail with reference to the drawings. In the following description, since the same reference numerals are used in the drawings, the description of the same elements will not be repeated. 2 is a capacitor switch module according to a first embodiment of the present invention.
5151-9779-PF 10 200919964 分解立體圖β去· rs λ » , >考圖2，在習知技術中作為框架的一個基 底140係為向上及向下開口的中空立方殼體形態…片安 裝片144被水平安褒在基底140的中^空間之内。安裝片 144的四邊其中的兩個反對邊上形成有凹陷處，其因而與 基底14G# Θ壁共同形成了可穿透的槽σ 143。-金屬 片130、具有一感應電極的一突出件132通過可穿透槽口 143而被固定。因此’金屬片13〇在被置於安裝月⑷上 才Ρ被安裝起來。-電容感應器積體電路(1C)晶片150被 置入於基底140相對於安裝片144的一個下方空間内。在 此，金屬片130的突屮姓_ 1 q 9 # rta 幻犬出件132係與電容感應器IC晶片15〇 的一輸入接腳電性遠接。彳六械· α ^5151-9779-PF 10 200919964 Exploded perspective view β·· rs λ » , > Figure 2, a substrate 140 as a frame in the prior art is a hollow cubic shell form that opens upwards and downwards... The 144 is horizontally mounted within the middle space of the substrate 140. The two opposing sides of the four sides of the mounting tab 144 are formed with depressions which in turn form a penetrable groove σ 143 with the base 14G# wall. The metal piece 130, a protruding piece 132 having a sensing electrode, is fixed by the penetrable notch 143. Therefore, the metal piece 13 is mounted on the installation month (4). - Capacitive sensor integrated circuit (1C) The wafer 150 is placed in a lower space of the substrate 140 with respect to the mounting piece 144. Here, the sudden name _ 1 q 9 # rta of the metal piece 130 is electrically connected to an input pin of the capacitive sensor IC chip 15A.彳六械· α ^
^ 連接依據此—實施例，電容感應器IC 晶片15G係被製作成—個8接腳雙排封裝（⑽）1C，其8 支接腳匕#例如’—電壓供應（v剛接腳，—接地（G剛 接腳，-輸出接腳，—靈敏度調整接腳，而其四輸入接腳 155則被截短以便與金屬片的突出件有效地接觸。不過， 本發明並不受限於此一實施例。當電容感應器ic晶片15〇 被安裝起來並固定於金屬片13〇上時，其四輸入接腳155 即與金屬⑽0的突出件132電性連接，其係朝向輸出接 腳155而延伸。由於電容感應器Ic晶片15〇係利用模製 而整合性地包括了一感應器Ic’_主動元件一被動元 件，與信號輸入及輸出接腳，習知技術所執行的接腳插入 程序與樹脂模製程序即得以省卻。因&，其整個的製 得以簡化，並且元件尺寸的縮減即得以達成。同時，多個 的延伸突ώ 149由基底14G的—下方部份之處延伸而出。 5151-977 9-PF 11 200919964 在此’延伸突出149具有與電容感應器Ic晶片ι5〇的導 接線實質上相同的長度。因此，依據本發明之電容開關模 組，當被應用於一產品上而被插置於—片印刷電路板⑽) 時，電容開關模組與PCB之間的附接，在導接線被軟焊之 前即被增強’因而增進了使用者的方便。除此之外，在電 容感應器1C晶片15〇的一個較下方部份之處安裝了一個 下蓋160’以便將電容感應器IC晶片15〇封閉起來。下蓋 160的四邊其中的兩反對邊上分別設置有—連接件162。 在每一連接件162上沿垂直方向形成有-槽口 164,以便 在基底14G的-外壁上所形成的—㈣突出148得以釣入 槽口 164内。下蓋160的連接件162具有對應於在基底14〇 的外壁亡所形成之一導引凹m 146的相對形狀。依據圖 式下蓋I60的底部166被圓滑化以便電容感應器IC晶 片150的導接線得以通過此些圓滑化部份。不過，本發明 之下蓋1 60並不限於此種構造，其依據電容感應器丨c晶 片150的導接線的位置而可以具有其他各種型態的底部 166於此，开> 成於連接件162上的槽口 164要比鎖定突 出148稍U長些。以此種構造，即便沿朝向電容感應器^ c 晶片150的方向而對下蓋16〇的底部166施加衝撞由於 下蓋I 60移動而維持相對於基底】4〇的一個小間隙，其衝 撞便可以在間隙中被吸收而不致於直接傳送到電容感應 器I c曰曰片1 5 0上。其結果’在運送期間對電容開關模組 所施加之衝擊便得以被釋放掉。 此外’一導電墊片110亦被安裝在金屬片130上方基^ Connection According to this embodiment, the capacitive sensor IC chip 15G is fabricated into an 8-pin double-row package ((10)) 1C, and its 8 pins 匕#, for example, - voltage supply (v just pin, - Grounding (G just pin, - output pin, - sensitivity adjusting pin, and its four input pin 155 is truncated to effectively contact the protruding piece of the metal piece. However, the present invention is not limited thereto In one embodiment, when the capacitive sensor ic chip 15 is mounted and fixed on the metal piece 13, its four-input pin 155 is electrically connected to the protruding piece 132 of the metal (10) 0, which is directed toward the output pin 155. Since the capacitive sensor Ic chip 15 is integrally molded by molding, it includes an inductor Ic'_active component-passive component, and signal input and output pins, pin insertion performed by the prior art. The program and the resin molding process are eliminated. Because of &, the entire system is simplified, and the reduction in component size is achieved. At the same time, a plurality of extension protrusions 149 are extended from the lower portion of the substrate 14G. And out. 5151-977 9-PF 11 20091 9964 where the 'extension protrusion 149 has substantially the same length as the conductive wire of the capacitance sensor Ic wafer ι5〇. Therefore, the capacitance switch module according to the present invention is inserted into a piece when applied to a product. In the case of a printed circuit board (10), the attachment between the capacitive switch module and the PCB is enhanced before the soldering wire is soldered, thereby increasing user convenience. In addition, the capacitive sensor 1C wafer 15 A lower cover 160' is mounted on a lower portion of the crucible to enclose the capacitive sensor IC chip 15. The two opposite sides of the lower cover 160 are respectively provided with a connecting member 162. A notch 164 is formed in the vertical direction of the connecting member 162 so that the (four) projection 148 formed on the outer wall of the base 14G can be caught in the notch 164. The connecting member 162 of the lower cover 160 has a corresponding position on the base 14. The outer wall of the crucible forms a relative shape of the guiding recess m 146. According to the drawing, the bottom 166 of the lower cover I60 is rounded so that the guiding wires of the capacitive sensor IC wafer 150 can pass through the rounded portions. Under the invention 1 60 is not limited to this configuration, and may have other various types of bottom portions 166 depending on the position of the conductive wires of the capacitance sensor 丨c wafer 150, and the notch 164 formed on the connecting member 162 is It is slightly longer than the locking protrusion 148. With this configuration, even if a collision is applied to the bottom portion 166 of the lower cover 16A in the direction toward the capacitive sensor 150, the substrate is maintained relative to the substrate due to the movement of the lower cover I60. A small gap of the crucible, the collision can be absorbed in the gap without being directly transmitted to the capacitive sensor Ic plate 150. The result is that the impact on the capacitive switch module during the transport is Can be released. In addition, a conductive spacer 110 is also mounted on the base of the metal piece 130.
5151-9779-PF 12 200919964 私、内部空間142 t，以將-觸控輸入信號安全地 %运至作為—感應電極蓋的金屬片130。據此，即便在電 容開關模組的金屬片13〇與產品的外蓋之間存在有一個於 氣間隙，金屬片130與外蓋仍可以互相近接接觸，因而避 免了可此因空氣間隙所導致的靈敏度的衰退劣化以及故 障形。導電性墊片11 0可利用彈性材料製作，例如，利 用將諸如碳導電粒子散佈在橡膠上以使其具導電性而形 成的導電橡膠。一般而言’墊片的安裝係由被提供以電容 開關模組的客戶來執行。因此，依據本發明之實施例，由 於’部了塾片的安裝程序，客戶的滿意度將可大幅提升。 一絕緣帶120可以選擇性地被間插於金屬片13〇與導 電性墊片11 0之間。絕緣帶！ 2()的主要功能是改進ESD (靜 電放電）’且因其係獨立於電容感應器IC晶片15〇的靈敏 度調整接腳之外’絕緣帶12〇因此可利用其厚度之調整而 被用來精細地調整靈敏度。在絕緣帶12〇為雙面黏性帶形 〜、的清況之中，金屬片j 3 〇與導電性墊片j j 〇之間的附接 即得以增強。5151-9779-PF 12 200919964 The private and internal space 142 t is used to safely transport the touch input signal to the metal piece 130 as the sensing electrode cover. Accordingly, even if there is an air gap between the metal piece 13 of the capacitive switch module and the outer cover of the product, the metal piece 130 and the outer cover can still be in close contact with each other, thereby avoiding the air gap caused thereby. The deterioration of sensitivity is degraded as well as faulty. The conductive spacer 110 can be made of an elastic material, for example, a conductive rubber formed by dispersing a conductive particle such as carbon on a rubber to make it electrically conductive. In general, the mounting of the shim is performed by a customer who is provided with a capacitive switch module. Therefore, according to the embodiment of the present invention, the satisfaction of the customer can be greatly improved due to the installation procedure of the defective film. An insulating tape 120 can be selectively interposed between the metal piece 13A and the conductive pad 110. Insulation tape! The main function of 2() is to improve ESD (electrostatic discharge)' and because it is independent of the sensitivity of the capacitive sensor IC chip 15〇, the 'insulation tape 12' can be used to adjust its thickness. Finely adjust the sensitivity. In the case where the insulating tape 12 is a double-sided adhesive tape, the attachment between the metal piece j 3 〇 and the conductive spacer j j 即 is enhanced.
因此，依據本發明之實施例，由於具有電極蓋功能的 金屬片130亦係作為感應端，因此專用的感應電極即屬非 必要。此外，基底140因其係與金屬片13〇及電容感應器 I C曰曰片1 5 〇整體性地形成，因此而得以作為依習知技術作 法而^引電谷感應開關所需之框架。在習知之電容感應開 關模組之中’作為電極蓋的的部件係形成於一空白PcB 上。不過，依據本發明之實施例，改良之電容感應器J C 5151-9779-PF 13 200919964 曰曰片150利用將金屬片130設置於電容感應器1C晶片150 的上方部份，並透過突出件1 32而將金屬片】電性地 連接至電奋感應态Ic晶片15〇的短輸入接腳⑸而可以 發揮感應端的功能。 如同前述，習知之電容感應開關模組係透過（1)觸控 感應器1C與RC部件的PCBSMD，⑵電源供應及信號輸: 之導接腳之插人，（3)觸控感應器IG外部 控感應器1C模製，及⑷框架及塾片的插置等步驟而製： 出來在此，其所需要的部件包括觸控感應器J C及RC部 件’導接腳，塑膠蓋，以及框架。不㉟，依據本發明之實 施例三習知方法之主要程序及部件可以被簡化。首先，第 一及第二程序，即（1)觸控感應器1C與Rc部件的PCB _’以及⑺電源供應及信號輸出之導接腳之插人，利用 使用改良之電谷感應器J c晶片i 5 0而皆可以被省略掉。 換言之，”知⑽程序之故，接腳之插人，其覆蓋及模 製’因應用了改良之電容感應器IC晶片150而皆可以完 成，不需額外的程序。此外，習知技術的第三及第四道程 序’亦即’⑶觸控感應器1C外部的塑膠覆蓋及觸控感應 器1C的模製，及⑷框架及塾片的插置，利用將金屬片 130，基底14G，以及電容感應n Ic晶片15G等建構形成 整體而可以達成。以導電性材料製作而成的金屬片13〇, 不只作為感應電極的功能，利用其亦被插入於基底14〇的 一個上方空間之内並與基底⑷連結，亦提升了電容感應 裔1C晶片150及基底140。再者’透過已被執行以釋放施 5151-9779-pp 200919964 加於電谷感應器i c晶片部件上 千上之衝才里效果並改進其可靠 度，形成於基底140十的洞孔 助金屬片13〇與IC晶片15〇之^即可以被設計來輔 155之門…古 部所形成的短輸入接腳 1 ΰ b之間的更為有效的連結。 圖^為依據本發-第二實施例之—電容開關模組之 :體圖。㈣3與圖2相比較，此第二實施例之最大 異特徵係在於第一實施例中所採用之下蓋的省略。此種 til以Ϊ依據產品之表面構造之中，其下蓋的省略乃係 更有其好處的情況之中加以考量。據此，W 2中所提供之 穿透槽口 143,導引用之凹陷146，以及敎突出148，全 皆未顯示於圖3之中。因此，依據顯現於圖3中之第二實 施例，安裝片144即需要被設置於一個相對較低的位置。 另外’供電容感應器IC…5〇之導接腳穿透通過其中 的貫穿孔200，係被形成於安裝片144的四個角落。 雖然以上已依據說明性質之實施例而說明本發明，但 顯然在不偏離於本發明精神的情況下，習於本技藝者皆可 以理解’其各種修改變動仍屬可能。因此，本發明係揭示 於除後列之申請專利範圍之中。 【圖式簡單說明】 圖1係為韓國專利登錄第52868〇號案中所揭示之一 習知電容感應開關之分解立體圖； 圖2係為依據本發一第一實施例之一電容開關模組之 分解立體圖；及 5151-9779-PF 15 200919964 圖3係為依據本發一第二實施例之一電容開關模組之 分解立體圖。 【主要元件符號說明】 110 墊片 120 絕緣帶 130 金屬片 132 突出件 140 基底 142 基底内部空間 143 可穿透槽口 144 安裝片 146 導引凹陷 148 鎖定突出 149 延伸突出 150 電容感應器1C晶片 1 55 短輸入接腳 160 下蓋 162 連接件 164 槽口 166 下蓋底部 5151-9779-PF 16Therefore, according to the embodiment of the present invention, since the metal piece 130 having the function of the electrode cover is also used as the sensing end, a dedicated sensing electrode is unnecessary. Further, since the substrate 140 is integrally formed with the metal piece 13A and the capacitance sensor I C plate 15 5 , it can be used as a frame required for the electric induction switch by the conventional technique. In the conventional capacitive sensing switch module, the component as the electrode cover is formed on a blank PcB. However, in accordance with an embodiment of the present invention, the improved capacitive sensor JC 5151-9779-PF 13 200919964 is formed by placing the metal piece 130 on the upper portion of the capacitive sensor 1C wafer 150 and through the protruding member 1 32. The metal piece is electrically connected to the short input pin (5) of the 15C of the electro-sensing Ic chip to function as a sensing end. As mentioned above, the conventional capacitive sensing switch module transmits (1) the touch sensor 1C and the RC component PCBSMD, (2) the power supply and the signal input: the insertion of the lead pin, and (3) the touch sensor IG external Controlling the sensor 1C molding, and (4) inserting the frame and the cymbal, etc.: The components required here include the touch sensor JC and the RC component 'guide pin, plastic cover, and frame. The main procedures and components of the conventional method according to the third embodiment of the present invention can be simplified. First, the first and second programs, that is, (1) the PCB _' of the touch sensor 1C and the Rc component, and (7) the insertion of the power supply and the signal output pin, use the improved electric valley sensor J c The wafer i 50 can be omitted. In other words, "the knowledge of (10) program, the insertion of the pin, its coverage and molding 'can be completed by the application of the improved capacitive sensor IC chip 150, no additional procedures are required. In addition, the conventional technology The third and fourth procedures 'i.e.' (3) the plastic cover outside the touch sensor 1C and the molding of the touch sensor 1C, and (4) the insertion of the frame and the cymbal, using the metal piece 130, the base 14G, and The capacitance-inducing n Ic chip 15G and the like can be integrally formed, and the metal piece 13 made of a conductive material can be inserted not only into the upper space of the substrate 14 but also as a function of the sensing electrode. The connection with the substrate (4) also enhances the capacitive sensing 1C wafer 150 and the substrate 140. In addition, the transmission has been performed to release the application of the 5151-9779-pp 200919964 to the electric valley sensor ic chip component. The effect and improvement of the reliability, the hole-shaped metal-assisted sheet 13〇 formed on the substrate 140 and the IC chip 15 can be designed to complement the gate of the 155... The short input pin formed by the ancient part 1 ΰ b More effective link Figure 2 is a body diagram of a capacitor switch module according to the present invention - a second embodiment. (4) 3 Compared with Figure 2, the maximum different feature of this second embodiment is the cover used in the first embodiment. This kind of til is considered in the surface structure of the product, and the omission of the lower cover is considered to be more advantageous. Accordingly, the penetration notch 143 provided in W 2 is guided. The recesses 146, as well as the tabs 148, are not shown in Fig. 3. Therefore, according to the second embodiment shown in Fig. 3, the mounting tabs 144 need to be placed at a relatively low position. The through-holes 200 through which the lead-in pins of the capacitance sensor ICs 5 are penetrated are formed at the four corners of the mounting piece 144. Although the invention has been described above on the basis of illustrative embodiments, it is apparent that It will be understood by those skilled in the art that the various modifications may be made without departing from the spirit of the invention. Therefore, the present invention is disclosed in the scope of the appended claims. Figure 1 is a Korean patent FIG. 2 is an exploded perspective view of a conventional capacitive switch module according to a first embodiment of the present invention; and 5151-9779-PF 15 200919964 3 is an exploded perspective view of a capacitive switch module according to a second embodiment of the present invention. [Main component symbol description] 110 spacer 120 insulating tape 130 metal piece 132 protruding piece 140 base 142 base internal space 143 penetrating groove Port 144 Mounting tab 146 Guide recess 148 Locking projection 149 Extension projection 150 Capacitive sensor 1C Wafer 1 55 Short input pin 160 Lower cover 162 Connector 164 Notch 166 Lower cover bottom 5151-9779-PF 16