200903696 九、發明說明 【發明所屬之技術領域】 本發明係關於，讓檢測器電氣性接觸被檢查體的電極 墊以測定該被檢查體的電氣特性之技術。 【先前技術】 在半導體晶圓（以下稱晶圓）上形成1C晶片後，爲 了調查該1C晶片的特性，是在晶圓狀態下用檢測裝置來 進行檢測器測試。茲簡單說明該檢測裝置的晶圓流程，首 先從收納有複數片的晶圓之載具用搬運機構取出晶圓，對 該晶圓進行：被稱爲預對準步驟之對準步驟、以及被稱爲 Ο C R步驟之用來取得形成於晶圓上的例如ID等的步驟。 接著’將晶圓搬入檢測裝置本體內，將該晶圓裝載於晶圓 夾頭（可在X、Y、Z方向移動且可繞Z軸旋轉），藉由 例如設於晶圓夾頭的下攝影機、以與該晶圓夾頭相對向的 方式設於檢測裝置本體的上方之上攝影機，分別對形成於 晶圓上的電極墊和設於晶圓夾頭的上方之檢測器卡的檢測 器進行攝影，以進行讓該電極墊和檢測器正確地對準之精 細對準步驟。然後’讓檢測器（例如探針）和晶圓的1C 晶片的電極墊接觸，藉由從該探針將既定的電氣訊號供應 給電極墊，以進行上述電氣特性的檢查。 該電氣特性的檢查，爲了針對多方面的內容來進行， 必須花費長時間。因此’爲了提昇產能，期望能儘量減少 檢測裝置本體的待機時間（未進行檢查的時間）。於是， -4- 200903696 在上述的搬運機構，將搬入臂（從載具取出未檢查的晶圓 而將其搬入檢測裝置本體內）和搬出臂（從檢測裝置本體 將檢查完畢的晶圓取出再送回載具）設置成可獨立進退， 在晶圓的檢查中，將未檢查的晶圓從載具取出，對該晶圓 事先進行上述的預對準步驟和OCR步驟，從檢測裝置本 體內將檢查完畢的晶圓取出後馬上將未檢查的晶圓搬入檢 測裝置本體內，如此來儘量縮短進行晶圓交換時之檢測裝 置本體的待機時間。 此外，在這種檢測裝置，爲了減少裝置的設置面積（ foot space)，例如習知的檢測裝置，是對1個搬運裝置 設置複數台（例如2台）的檢測裝置本體，對該2台的檢 測裝置本體，用1個共通的搬運機構來搬運晶圓。具體而 言，舉例說明在2台的檢測裝置本體內都已經進行晶圓檢 查的情形，例如從載具取出1片晶圓，對該晶圓進行上述 預對準步驟及OCR步驟後，將該晶圓和一方檢測裝置本 體內的檢查完畢的晶圓進行交換。接著將檢查完畢的晶圓 送回載具，取出未檢查的晶圓同樣地進行預對準步驟和 OCR步驟，將該晶圓和另一方檢測裝置本體內的檢查完 畢的晶圓進行交換。在這種構造之檢測裝置，對於2台檢 測裝置本體，由於是用1個共通的搬運機構來搬運晶圓， 可減少1個搬運機構的設置空間，而能減少檢測裝置的設 置面積。 然而，在將一方的檢測裝置本體內的晶圓交換後至將 另一方的檢測裝置本體內的晶圓交換的期間，必須進行對 -5- 200903696 於載具的存取、上述的預對準步驟或OCR步驟’因此須 花費長時間。因此，例如在一方的檢測裝置本體內檢查結 束而進行該一方檢測裝置本體內的晶圓的交換時’若另一 方檢測裝置本體的檢查也結束的情形，直到該另一方檢測 裝置本體的晶圓進行交換的漫長時間爲止’該另一方檢測 裝置本體都處於待機狀態，因此造成產能降低。 另一方面，已知有一種手法，是在搬入臂和搬出臂分 別設置驅動機構以使其能個別獨立地移動，並由不同的臂 來進行晶圓朝載具的搬出入和晶圓朝檢測裝置本體的搬出 入。具體而言，搬出臂從載具取出晶圓，從搬出臂將晶圓 交接給搬入臂，再用搬入臂將晶圓搬入檢測裝置本體內。 因此，在搬入臂對檢測裝置本體進行存取的期間，搬出臂 可將下個晶圓從載具取出，如此可縮短晶圓的搬運時間， 進而縮短檢測裝置本體的待機時間。然而，在這個構造， 如上述般必須在搬入臂和搬出臂分別設置驅動裝置，會檢 測裝置的成本變高，且臂的動作順序會變複雜。 在專利文獻1記載著具備複數個臂之基板搬運手段， 但針對上述檢測裝置之具體的臂的動作順序等，並沒有任 何的探討。 此外’在進行上述精細對準時’在檢測裝置本體內必 須確保晶圓夾頭的移動區域，隨著晶圓之大口徑化，其移 動區域變大，勢必造成裝置的大型化。再者，若晶圓夾頭 的移動區域變大，其移動時間會變長，對準所需的時間也 會變長。又基於提高產能的要求，是將裝載部（loader) -6- 200903696 設計 裝載 大， 該裝 頭、 ，由 積變 進行 2台 的交 臂的 003 1 【發 種檢 求裝 基板 ，讓 成可搬入複數個載具 部，但在追求高產能 而存在著取捨的關係 習知之謀求高產能的 置，是在裝載部的兩 檢測器卡等）。然而 於在裝載部的兩側設 大，又設有夾持部（ 晶圓的交接，且能沿 的擺臂（在夾持部和 接），因此晶圓的搬 移動軌跡，因此尙無 [專利文獻1 ]日本ί ，第6圖） [專利文獻2]日本特 明內容】 本發明是有鑑於上述 測裝置，藉由提高晶 置的小型化而藉由該 本發明的檢測裝置， 裝載於基板裝載台（ 前述被檢查晶片的電 ，或使複數個檢查部具有共通的 時，勢必造成裝置的佔有面積增 〇 檢測裝置如專利文獻2所記載。 側連接2台檢查部（含有晶圓夾 並未針對檢查部本身謀求小型化 置檢查部，會造成裝置的佔有面 可在其和搬入裝載部的載具之間 裝載部的長邊方向進退自如）及 左右的檢查部之間分別進行晶圓 運效率不高，又因爲必須確保擺 法解決讓裝置全體小型化的課題 宇開200 1 -250767號公報（段落 公平6-663 65號公報（第1圖） 事情而構成者，其目的是提供一 圓的搬運效率來提昇產能，並謀 小型化來獲得高產能。 是將配置有多數個被檢查晶片之 可在水平方向及給垂方向移動） 極墊接觸檢測器卡的檢測器來進 200903696 行被檢查晶片的檢查之檢測裝置，其特徵在於：係具備： 用來裝載載具（收納有複數個基板）之裝載埠、 具備檢測器卡（在下面形成有檢測器）之複數個檢測 裝置本體、 可繞鉛垂軸旋轉及可昇降且用來在前述裝載埠和前述 檢測裝置本體之間進行前述基板的交接之基板搬運機構、 用來對前述檢測裝置本體及前述基板搬運機構輸出控 制訊號之控制部； 前述基板搬運機構係具備彼此可獨立進退之至少3個 基板保持構件； 前述控制部輸出控制訊號以進行以下控制：藉由前述 基板搬運機構從載具接收至少2片基板，利用空的基板保 持構件將該至少2片基板和複數個檢測裝置本體內的檢查 完畢的基板依序進行交換。 前述基板搬運機構，爲了進行基板的對準可具備預對 準機構，其係包含：用來讓從前述基板保持構件接收的基 板進行旋轉的旋轉部、對前述旋轉部上之包含基板周緣部 的區域照射光並接收通過該區域的光之檢測部。 本發明之檢測裝置係具備：用來裝載載具（收納有複 數個基板）之裝載埠、具備檢測器卡（在下面形成有檢測 器）之複數個檢測裝置本體、用來在前述裝載埠和前述檢 測裝置本體之間進行基板的交接之基板搬運機構；且在前 述基板搬運機構設置彼此可獨立進退之至少3個基板保持 構件。此外，由於藉由基板搬運機構從載具接收至少2片 200903696 基板，可利用空的基板保持構件將該至少2片基板和複數 個檢測裝置本體內的檢查完畢的基板依序進行交換。因此 可縮減檢測裝置本體的待機時間，而能提高產能。 【實施方式】 [第1實施形態] 本發明的第1實施形態之檢測裝置，如第1圖至第3 圖所示係具備··用來進行基板之晶圓W (配置有多數個被 檢查晶片）的交接之裝載部1、用來對晶圓W進行檢測之 檢測裝置本體2。首先，針對裝載部1及檢測裝置本體2 的全體配置作簡單的說明。 裝載部1係具備：分別用來搬入第i載具C1及第2 載具C2(收納複數片的晶圓w之搬運容器）之第1裝載 培1 1及第2裝載埠1 2、配置於裝載埠Μ、12之間的搬 運室10。在第1裝載埠11及第2裝載埠12設有分別用 來裝載載具C1、C2之第1裝載台13及第2裝載台14’ 第丨、2裝載台13、14配置成在Y方向互相分離，且第1 載具C1及第2載具C2的交接口（前面的開口部）是互 相對向。又在前述搬運室1 〇設有晶圓搬運機構（基板搬 運機構）3 ’其是藉由基板保持構件（臂3 〇 )來進行晶圓 w的搬運。 檢測裝置本體2具有構成檢測裝置本體2的外裝部分 之框體22，該框體22是在X方向與裝載部1相鄰。該框 體22，係透過分隔壁2〇沿γ方向分割成2半，一方的分 -9 - 200903696 割部分和另一方的分割部分，分別相當於用來區隔出第1 檢查部2 1 A及第2檢查部2 1 B的外裝體。 第1檢查部21A係具備：基板裝載台之晶圓夾頭4A 、具備攝影機（在晶圓夾頭4A的上方區域沿Y方向（連 結裝載埠11、12的方向）之攝影單元之對準橋台5A、設 於頂板201 (構成框體22的頂部）之檢測器卡6A。第2 檢查部21B也是同樣的，具備晶圓夾頭4B、對準橋台50 及檢測器卡6B。 接著詳細說明裝載部1。第1裝載埠11及第2裝載 埠1 2彼此對稱且具有相同的構造，因此以第4圖爲代表 來說明第1裝載埠11的構造。裝載部1,如第3圖及第4 圖所示，係藉由分隔壁20a來和前述搬運室10區隔。在 該分隔壁20a設有：開閉器S、將該開閉器S和第1載具 C 1的交接口以一體的方式進行開閉之未圖示的開閉機構 。第1裝載台13，係藉由設於第1裝載台13的下方側之 未圖示的旋轉機構’來分別朝順時針方向及反時針方向進 行9 0度的旋轉。 亦即’該第1裝載台13，例如從檢測裝置的正面側 (圖中X方向右側），將密閉型的載具C1 (被稱爲hoop )以前面的開口部朝檢測裝置側（X方向左側）的方式， 用無麈室內之未圖示的自動搬運車（AGV)裝載於第1裝 載台1 3時’該第1裝載台i 3會朝順時針方向旋轉9 〇度 ’使開口部和前述的開閉器S相對向，又同樣的將第1載 具C1從第1裝載台13搬出時’使第1載具C1朝反時針 -10- 200903696 方向旋轉9〇度。 在第1載具C1和晶圓搬運機構3之間進行之晶圓w 的交接’係讓第1載具C1的開口部面對開閉器S側’藉 由開閉機橇201)將開閉器S和第1載具C2的交接口以一 體的方式打開，使搬運室10和第1載具C1內連通後’讓 晶圓搬運機構3相對於第1載具C1進行進退移動。 晶圓搬蓮機構3，如第5圖所示，係具備：搬運基台 35、讓該搬運基台35繞鉛垂軸旋轉之旋轉軸3a、用來讓 該旋轉軸3a昇降之昇降機構3b。在該搬運基台35上， 將前端部具有矩形缺口的臂部3 0 (包括：上段臂部3 1、 中段臂部32、下段臂部33共3個）設置成進退自如，各 個臂部3 0互相獨立進退，而發揮搬運晶圓w的功能。旋 轉軸3 a的旋轉中心，設定在第1載具c 1和第2載具C2 的中間，亦即設定在其與第1載具C1的距離和其與第2 載具C2的距離相等的位置。晶圓搬運機構3，可在上位 置（在其與第1載具C1或第2載具C2之間進行晶圓W 的交接）和下位置（在其與第1檢査部21A或第2檢查 部2 1 B之間進行晶圓W的交接）之間進行昇降。 在該搬運室10內的下方，在不干涉上述晶圓搬運機 構3的動作（旋轉及昇降）的位置，例如從該晶圓搬運機 構3的旋轉中心偏離第2裝載台14側的位置，設置用來 進行晶圓W的預對準之預對準機構39。該預對準機構39 係具備：用以裝載晶圓W且能繞鉛垂軸旋轉的旋轉裝載 台5 00、由發光感測器及受光感測器（將包含裝載於旋轉 -11 - 200903696 裝載台500上的晶圓W的周緣部的區域從上下方挾持 之檢測部（光感測器3 7 )、將旋轉裝載台5 0 0及光感 器27從下方支承之基座501。該旋轉裝載台500，爲了 該旋轉裝載台500進入臂部30的前端之缺口部內，其 度尺寸比該缺口部的開口細小。雖未圖示出，在裝載部 附設有控制器，其根據來自光感測器3 7的檢測訊號來 測出晶圓W的方向基準部（缺口、定向平面等）和晶 W的中心位置，根據該檢測結果來讓旋轉裝載台5〇〇旋 以使缺口等朝向既定的方向。 以下簡單的說明，藉由預對準機構3 9 (由光感測 37和旋轉裝載台500所構成）來進行之晶圓w方向的 整（預對準）。首先，藉由晶圓搬運機構3將晶圓W 載於晶圓搬運台500上，藉由旋轉裝載台5〇〇使晶圓 旋轉’且從光感測器3 7的發光部透過包含晶圓w的周 部（端部）的區域朝受光部照光。藉由該光感測器37 讀取晶圓W的外周緣的軌跡，藉此掌握晶圓w的方向 中心位置。接著，旋轉裝載台5 0 0旋轉而使旋轉裝載 5 〇 〇上的晶圓W朝既定的方向後，將晶圓w交接給晶 搬運機構3，藉此調整晶圓w的方向。然後，例如將晶 W裝載於第1檢查部2 1 A的晶圓夾頭4 A時，調整晶圓 運機構3的位置以修正晶圓W的偏心。如此般進行晶 W的方向及偏心的調整。 又’雖圖示省略，爲了辨別晶圓W的表面上之個 識別用的標識等的ID ’例如在搬運室1 〇內，設有例如 ) 測 使 寬 1 檢 圓 轉 器 調 裝 W 緣 來 和 台 圓 圓 搬 圓 體 由 -12- 200903696 攝影機等構成之OCR機構（匣），例如在上述的預對準 步驟之後，可取得上述的ID。 接著詳細說明檢測裝置本體2。在該檢測裝置本體2 的框體22之裝載部1側的側壁，形成有朝橫方向（γ方 向）延伸之帶狀的搬運口 22a，俾在第丨檢查部21A和第 2檢查部21 B之間進行晶圓W的交接。該第丨檢查部2 j a 和第2檢查部2 1 B ’對於通過晶圓搬運機構3的旋轉中心 且與連結第1裝載埠1 1和第2裝載埠〗2的直線正交的水 平線H L ’關於晶圓W的交接位置、晶圓w表面的攝影位 置及檢測器卡6Α的設置位置等都呈左右對稱，且構造相 同，爲了避免重複說明’僅針對第1檢查部21Α，參照第 3圖、第6圖及第7圖來作說明。 檢査部21Α具備基台23，在該基台23上，從下至上 依序設有Υ載台24和χ載台25。該Υ載台24，係沿著 延伸於Υ方向的導軌，例如藉由滾珠螺桿等朝Υ方向驅 動；該X載台25 ’係沿著延伸於X方向的導軌，例如藉 由滾珠螺桿等朝X方向驅動。在X載台25及Υ載台24 ，分別設置組裝有編碼器的馬達’在此予以省略。 在X載台25上’設有Ζ移動部26(藉由未圖示之組 裝有編碼器的馬達來朝ζ方向驅動），在該Ζ移動部26 ，設有可繞Ζ軸旋轉（在0方向移動）之基板裝載台（晶 圓夾頭4Α)。因此該晶圓夾頭4Α’可在X、Υ、Ζ、0方 向移動。X載台25、γ載台24、Ζ移動部26係構成驅動 部，以將晶圓夾頭4Α在交接位置（用來在其和晶圓搬運 -13- 200903696 機構3之間進行晶圓W的交接）、後述之晶圓W表面的 攝影位置、接觸檢測器卡6A的探針29的接觸位置（檢 査位置）之間進行驅動。 在晶圓夾頭4A之移動區域的上方，檢測器卡6A是 以可拆裝的方式安裝於頂板20 1。關於檢測器卡6a的安 裝構造及其交換方法，容後詳述。在檢測器卡6A的上面 側形成有電極群，爲了使該電極群和未圖示的測試頭之間 形成電氣導通，在檢測器卡6A的上方設置波哥針（p0g0 pin)單元28，在單元28的下面，對應於檢測器卡6A的 電極群的配置位置而形成有多數個電極部（波哥針28a ) 。通常未圖示的測試頭是位在該波哥針單元2 8的上面， 在本例中，測試頭是配置在與檢測裝置本體2不同的位置 ，波哥針單元2 8和測試頭是用未圖示的纜線來連接。 此外，在檢測器卡6A的下面側，例如在檢測器卡6A 的全面，對應於晶圓W的電極墊的排列設有檢測器（例 如相對於晶圓W表面垂直延伸的垂直針，亦即線材探針 )。作爲檢測器，也可以是：相對於晶圓W的表面朝斜 下方延伸之金屬線構成的探針29、形成於可撓性膜之金 突塊電極等。在本例的檢測器卡6A，可和晶圓W表面的 被檢查晶片（1C晶片）的所有電極墊同時接觸，因此藉 由接觸一次就能完成電氣特性的測定。 在前述Z移動部26的晶圓夾頭4A的分隔壁20側的 側方位置，透過固定板4 1 a固定著探針29攝影用的第1 攝影手段（視野朝上的微型攝影機4 1 )。該微型攝影機 -14- 200903696 41，係包含CCD攝影機之高倍率的攝影機’以對探針29 的針尖及檢測器卡6A的對準標記進行放大拍攝。該微型 攝影機4 1位於晶圓夾頭4 A之X方向的大致中間酃的位 置。微型攝影機41，爲了在對準時調查探針29的排列方 向及位置，係拍攝特定的探針29 (例如X方向兩端的探 針29及Y方向兩端的探針29 )，又爲了定期觀察各探針 29的狀態，係依序拍攝所有的探針29 ° 又在固定板41a上，以鄰接於微型攝影機41的方式 固定著微型攝影機42 (用來在更廣的區域拍攝探針29的 排列）。在固定板41a上設置標的44(相對於微型攝影 機41的聚焦面，可藉由進退機構43朝與光軸交叉的方向 進退）。該標的44，可藉由微型攝影機41及後述的微型 攝影機45來進行影像辨識，例如是在透明玻璃板上蒸鍍 對準用的被攝體之圓形金屬膜（例如直徑1 40 // m的金屬 膜）。第7(a) ( b )圖分別槪略顯示，晶圓夾頭4 A和 微型攝影機4 1及微型攝影機42的位置關係之俯視圖及側 視圖。在第7圖中，省略前述標的44及進退機構43的圖 示。 在晶圓夾頭4A和檢測器卡6 A之間的區域之框體22 的內壁面的X方向兩側（外側和內側），設有順沿γ方 向的導軌47。沿著該導軌47，如第8圖所示，攝影單元 (對準橋台5 A )可在後述的標準位置及攝影位置之間沿 Y方向移動。 在對準橋台5 A，例如沿著X方向，設有複數個（例 -15- 200903696 如3個）以等間隔排成一列之基板攝影用的第2攝影手段 (視野朝下的微型攝影機45) 。3個微型攝影機45中央 的微型攝影機45’係位於X方向的晶圓夾頭4A的移動範 圍的中央’兩端的微型攝影機45，其偏離中央的微型攝 影機4 5的距離’是與晶圓夾頭4 a的中心和晶圓w最外 部的被檢查晶片的距離相同或較短（例如晶圓W直徑的 1/3的距離）。微型攝影機45，係包含CCD攝影機之高 倍率的攝影機’以對晶圓W表面進行放大拍攝。在該微 型攝影機45的側方之對準橋台5A，設有用來以更廣的視 野來確認晶圓W之低倍率攝影機46。關於低倍率攝影機 46，除第2圖以外係省略其圖示。 上述對準橋台5A的停止位置（標準位置），是在晶 圓夾頭4 A和晶圓搬運機構3之間進行晶圓W的交接時， 晶圓W接觸檢測器卡6A時，以及藉由前述第1攝影手段 (微型攝影機4 1 )進行探針29的拍攝時，爲了避免干涉 晶圓夾頭4A及晶圓搬運機構3而使對準橋台5A退避的 位置。又前述攝影位置，係藉由對準橋台5A的微型攝影 機45及低倍率攝影機46來拍攝晶圚W表面時的位置。 藉由微型攝影機45及低倍率攝影機46來拍攝晶圓W表 面時，對準橋台5A是固定於攝影位置，並藉由移動晶圓 夾頭4 A來進行。 該攝影位置，如第9圖的下側所示，是比檢測器卡 6A的中心位置偏向Y軸方向的內側（檢測裝置本體2的 中心側），其理由在以下作說明。 -16- 200903696 如前所述，微型攝影機41設於晶圓夾頭4a的側面 (Y軸方向外側）’用該微型攝影機41來拍攝探針29時 ，如第9圖的中段所不’晶圓夾頭4A的Y軸方向之移動 行程D2 (晶圓夾頭4A的中心位置〇 1的移動範圍）是比 檢測器卡6 A的中心位置0 2偏向Y軸方向的內側。另一 方面，如第9圖的上段所示，接觸時（晶圚w和探針2 9 接觸時）之晶圓夾頭4 A的移動行程D 1，由於在檢測器卡 6 A的下面形成多數個探針2 9 (可同時與晶圓w接觸）， 故其距離非常短。因此，若對準橋台5 A的攝影位置對準 檢測器卡6A的中心位置02，藉由微型攝影機45拍攝晶 圓W表面時之晶圓夾頭4 A的移動行程d 3會跑到前述移 動行程D 1的右側。 於是，將對準橋台5 A的攝影位置朝γ軸方向的外側 偏移’使移動行程D2、D3重疊，以縮短包含晶圓夾頭 4A的移動行程D1-D3的區域（可移動範圍之可動行程 D 4 )，亦即縮短檢測裝置本體2的Y軸方向長度。又即 使移動行程D2、D3不在相同範圍，只要將對準橋台5A 的攝影位置比檢測器卡6 A的中心位置Ο 2更偏向Y軸方 向的內側即可。 如第2圖所示，在檢測裝置，設有由例如電腦所構成 的控制部1 5，該控制部i 5具備由程式、記憶體、CPU所 構成的資料處理部等，該程式所含的步驟群是控制成：當 載具c搬入裝載淳Η (12)後，對晶圓w進行檢査，然 後將晶圓W送回載具C，再將載具c搬出而進行一連串 -17- 200903696 的動作。該程式（也包含和處理參數的輸入操作及顯示有 關的程式），例如收容於磁片、光碟片、MO (光磁碟） 、硬碟等的記憶媒體1 6，並安裝於控制部1 5。 接著說明上述檢測裝置的作用。首先，藉由無塵室內 的自動搬運中（AGV )，從裝載埠U (〗2 )之與檢測裝 置本體2的相反側將載具C搬入該裝載埠1 1。這時載具 C的交接口是朝向檢測裝置本體2，藉由旋轉裝載台13 ( 1 4 )使其與開閉器S相對向。然後裝載台1 3前進而將載 具C朝開閉器S側推，而將載具c的蓋子和開閉器S打 開。 接著’從載具C內取出晶圓w，將其搬運至檢查部 21A(21B)，關於接下來的作用說明，是在2片晶圓W1 、W2分別在第1檢查部21A及第2檢查部21B完成檢查 的狀態下，將後續的晶圓W3及W4從載具C取出，而進 行一連串步驟的情形。 首先如第10圖所示’上段臂部31進入第2載具C2 內’接收晶圓W3後向後退。接著，同樣的中段臂部32 進入弟2載具C2内’接收晶圓W4後向後退。然後，晶 圓搬運機構3下降至下位置，且旋轉至臂部31(32)可 對旋轉裝載台500進行存取的方向。接著，如第11圖所 不’上段臂部3 1朝旋轉裝載台5 0 0側伸出直到上段臂部 3 1上的晶圓W3位於旋轉裝載台500的上方位置，然後晶 圓搬運機構3稍下降以將晶圓W3裝載於旋轉裝載台500 上。接著，旋轉裝載台500旋轉，同時藉由光感測器37 -18- 200903696 對包含晶圓W3周緣部的區域照光，並接收通過該包含周 緣部的區域的光。根據該光感測器3 7的檢測結果，以缺 口方向對應於第1、第2檢查部21A、21B當中搬入該晶 圓W3的檢查部21A(21B)的方式’調整曰曰圓W3的方向 ，並檢測出偏心，而進行預對準。接著晶圓搬運機構3上 昇以接收晶圓W 3。同樣的’晶圓W 4也是’以缺口方向 對應於搬入該晶圓W4的檢查部2 1 A ( 2 1 B )的方式，進 行晶圓W 4的方向調整及偏心檢測。又藉由目lj述之未圖示 的OCR機構，取得形成於晶圓W3、W4表面的ID。 接著’進行第1檢查部2 1A內的晶圚W1和晶圓搬運 機構3上的晶圓W3的交換。在後述的實施例中說明的第 4 9 ( 1 )圖，槪略顯示這時的晶圓搬運機構3的一連串的 動作。當晶圓W1的檢查結束時’晶圓夾頭4A如第1 2圖 所示，移動至靠近分隔壁2〇之交接位置。接著’晶圓夾 頭4A之真空夾頭解除，晶圓夾頭4A內的昇降銷向上昇 ，而使晶圓W1向上昇。接著，空的下段臂部3 3進入晶 圓夾頭4A上，晶圓搬運機構3上昇而接收晶圓W1，向 後退。此外，晶圓搬運機構3梢向下降，上段臂部31進 入晶圓夾頭4A上，在先前的預對準是判斷晶圓W3的中 心位置偏移的情形，爲了修正晶圓W3的偏心，利用未圖 示之前述昇降銷及上段臂部3 1的協同作用，將晶圓W3 裝載於晶圓夾頭4 A上。 接著，如第13圖所示，將晶圓W3交接給第1檢查 部2 1 A後變空的上段臂部3 1進入第2檢查部2 1 B，從晶 -19- 200903696 圓夾頭4B同樣的接收檢查完畢的晶圓W2，向後退後， 中段臂部32進入晶圓夾頭4B上，將檢查前的晶圓贾4從 中段臂部32交接給晶圓夾頭4B。 然後’晶圓搬運機構3上昇’將晶圓w 1及晶圓W 3 送回例如第1載具C1，對於接下來的晶圓w (晶圓W5、 W6)也是同樣的’將2片從載具c取出後，進行同樣的 處理。 另一方面’在第1檢查部21A，晶圓W3交接給晶圓 夾頭4A後’藉由設於晶圓夾頭4A的微型攝影機41來拍 攝檢測器卡6A的探針29。具體而言，例如是拍攝在X方 向離最遠的兩端的探針29及在Y方向離最遠的兩端的探 針2 9 ’藉此掌握檢測器卡6 A的中心和探針2 9的排列方 向。這時，藉由設於晶圓夾頭4A的微型攝影機42，找出 目標位置附近的區域’然後藉由微型攝影機4 1來檢測出 目標探針29的針尖位置。這時對準橋台5 a，係退避至第 8圖所示的標準位置。 接著’對準橋台5 A移動至晶圓W3的攝影位置（參 照第8圖）’並使標的4 4 (參照第6圖）突出於晶圓夾 頭4 A側的微型攝影機4 1和對準橋台5 A側的微型攝影機 45之間的區域，以兩攝影機41、45的焦點及光軸與標的 4 4的標記一致的方式對準晶圓夾頭4 a的位置，而進行所 謂兩攝影機41、45的定原點。 接著讓標的44退避後，使晶圓夾頭4A位於對準橋 台5A的下方側，並移動晶圓夾頭4A而讓對準橋台5A的 -20- 200903696 3個微型攝影機45的任一個可拍攝形成於晶圓W3上的複 數個特定點。在這時也是，根據微型攝影機4 6的拍攝結 果將晶圓夾頭4A誘導到晶圓W上的目標區域附近。在本 例如前述’由於3個微型攝影機4 5彼此的間隔設定成晶 圓W3直徑的1/3，即使要藉由這些微型攝影機45來依序 拍攝晶圓W全面’朝X方向之晶圓W3的移動距離（爲 了讓X載台25移動所需之滾珠螺桿的驅動量），如第14 圖所示’在一端側的微型攝影機45與晶圓W3的一端（ 朝圖中的周緣的左端）重疊的位置、另一端側的微型攝影 機45與晶圓W3的另一端側重疊的位置之間，晶圓夾頭 4A的中心部移動的距離爲L 1，比起晶圓W3的直徑，只 要大致1 /3的距離即可。因此即使晶圓W3上的特定點位 於晶圓W3的周緣部，晶圓夾頭4A在X方向的移動距離 依然很小。 根據如此般進行各攝影後之晶圓夾頭4A的位置及進 行前述定原點時的晶圓夾頭4A的位置，在控制部1 5側 可計算出，爲了讓晶圓W3上的各電極墊和檢測器卡6A 的各探針2 9接觸之晶圓夾頭4 A的座標。接著讓晶圓夾 頭4A移動至計算的接觸座標位置，使晶圓W3上的各電 極墊和檢測器卡6A的各探針29同時接觸。接著從未圖 示的測試頭透過波哥針單元2 8及檢測器卡6A將既定的 電氣訊號送往晶圓W3上的各1C晶片的電極墊’藉此進 行各1C晶片的電氣特性檢查。然後，和前述的晶圓W1 同樣的，讓晶圓夾頭4B移動至交接位置’藉由晶圓搬運 -21 - 200903696 機構3從晶圓夾頭4B搬出晶圓W3。對於搬入第2檢查 部2 1 B之晶圓W4，也是同樣的進行檢查。 依據上述實施形態，是在晶圓搬運機構3設置3個臂 部30(31〜33)，藉由該晶圓搬運機構3從載具C接收2 片未檢查的晶圓W。因此’可將晶圓w依序搬運至2台 檢查部2 1，可縮短檢查部2 1的待機時間’而能提昇檢測 裝置的產能。因此，例如在搬運晶圓W1及晶圓W2時（ 在檢測裝置開始進行晶圓W的檢查時）也是’能將晶圓 W依序搬運至2台檢查部2 1，而能使檢查部2 1的檢查提 早開始，結果可提昇產能。又例如即述例般’在進彳了晶圓 W的交換時，在檢查部21檢查晶圓W的期間，可對未檢 查的晶圓W進行預對準步驟等，當檢查結束後可馬上交 換晶圓W，而能進一步縮短檢查部2 1的待機時間。 又如習知例般，不須區別將晶圓W搬運至檢查部2 1 的臂部和從檢查部2 1回收晶圓W的臂部，利用3個臂部 3〇當中未搬運晶圓W (空的）臂部33來回收檢查完畢的 晶圓W。亦即，在上述例子，在第1檢查部21A，由於在 下段臂部33未裝載晶圓W，可藉由該下段臂部3 3來接收 晶圓W1，又取代該晶圓W1而在第1檢查部21A搬入上 段臂部3 1上的晶圓W3，因爲該上段臂部3 1上已不存在 晶圓W，在第2檢查部21B可藉由上段臂部21B來接收 檢查完畢的晶圓W2。因此，如上述般可提昇晶圓W的搬 運效率（縮短晶圓W的搬運時間）。如此般藉由利用空 的臂部3 3，只要使臂部3 3的數目比待搬運的晶圓W片數 -22- 200903696 多1個，即可進行複數片晶圓w的交換，因此可抑制晶 圓搬運機構3的大型化。 此外’藉由設置：用來以相對向的方式裝載2個載具 C之第1及第2裝載埠11、12、在裝載埠π、12的中間 位置具有旋轉中心之晶圓搬運機構3、沿著裝載埠n、j 2 的排列而配置且互相對稱（在晶圓W的交接時之晶圓夾 頭4A、4B的位置，在晶圓w攝影時之晶圓夾頭4A、4B 的移動區域及檢測器卡6 A、6 B的位置，相對於前述水平 線HL(參照第2圖）互相對稱）之第1及第2檢查部 21A、21B;又在前述載具C和檢查部21A (或21B)的 晶圓夾頭4A (或4B )之間藉由晶圓搬運機構3來直接進 行晶圓W的交接。因此，可謀求裝置的小型化，又在第1 及第2檢查部21A、21B可並行晶圓W的檢查，又能在載 具C和晶圓夾頭4A、4B之間進行直接搬運，因此基板的 檢查效率、搬運效率提昇，而能謀求產能的提昇。 此外，在對準橋台5 A ( 5 B )，沿X方向將3個微型 攝影機45例如以晶圓W直徑的1/3的間隔來排列，如前 述般在藉由該等攝影機4 5拍攝晶圓W的表面時，晶圓夾 頭4A ( 4B )的移動區域變小。 然而，相對於上述進行一次接觸的情形，例如在進行 多次接觸的情形，如第1 5圖所示’接觸時晶圓夾頭4 A 之移動行程D 1 ’的中心位置，是與檢測器卡5 0的中心位 置02大致一致。此外，由於對準橋台5A的攝影位置是 對準該移動行程D 1 ’的中心位置（檢測器卡5 0的中心位 -23- 200903696 置02) ’晶圓W攝影時的移動行程D3，，是與接觸時的 移動行程D 1 ’成爲相同範圍。這時，由於探針2 9的排列 區域狹窄’爲了拍攝該探針29所需的晶圓夾頭4A的移 動行程D2’相當短’包含移動行程D1，〜D3’之晶圓夾頭4A 的可動行程D4’’和使用前述檢測器卡6A時之可動行程 D4大致相同程度’而能將其長度抑制成最小限制。 然而，在此狀態下（接觸時的移動行程D1’和晶圓W 攝影時的移動行程D 3 ’的中心位置對準的狀態），若要拍 攝對應於晶圓W全面區域而形成之探針29，必須包含拍 攝探針29時的移動行程D2而使晶圓夾頭4A的可動行程 D4’變大，結果造成檢測裝置本體2變大。於是，在本實 施形態’如上述般、是將檢測裝置本體2特定成一次接觸 的檢測器卡6 A，並使拍攝探針2 9時的移動行程D 2和拍 攝晶圓W時的移動行程D 3之晶圓夾頭4 A的中心位置一 致，如此可縮短晶圓夾頭4 A之可動行程D 4，而將檢測裝 置本體2小型化。 [第1實施形態的變形例] 接著，參照第16圖、第17圖來說明上述第1實施形 態的變形例。 在本例，晶圓搬運機構3，係具備用來進行晶圓W的 預對準之預對準機構39。該預對準機構39係具備：貫穿 搬運基台35內而能昇降且旋轉的軸部36a、設於該軸部 的頂部且通常嵌合於搬運基台35表面的凹部而與該表面 -24- 200903696 形成同一面之旋轉載台（夾頭部36)。該夾頭部36，其 設定位置對應於退縮到一半的狀態之臂部3 0上的晶圓W 的中心位置’以將各段的臂部3 0上的晶圓W從該臂部3 0 稍舉起而進行旋轉。 預對準機構3 9係具備：用來檢測藉由夾頭部3 6進行 旋轉的晶圓W的周緣之由發光感測器和受光感測器所構 成的檢測部（光感測器3 7、3 8 )。該光感測器3 7、3 8， 係透過搬運基台3 5固定於臂部3 〇的移動區域外側的位置 ’在本例中’由於預對準的對象（晶圓w )是下段臂部 3 3上的晶圓W及中段臂部3 2上的晶圓W，故將其高度設 定成：在被夾頭部3 6舉起的各晶圓W的周緣的上下，且 在進行晶圓W的存取時不會干涉晶圓w的程度。 關於本實施形態之包含藉由預對準機構39來調整晶 圓W方向（預對準）的作用，舉下段臂部3 3上的晶圓W 爲例在以下作簡單的說明。在本例中，預對準以外的步驟 是和前述例子相同，故省略其說明。 首先’例如下段臂部3 3進入載具C內，接收晶圓W 後向後退至進行預對準的位置。接著，如第1 8圖所示， 用夾頭部3 6將下段臂部3 3上的晶圓W稍舉起，使晶圓 W旋轉’並從光感測器3 8的發光部透過包含晶圓W的周 緣部（端部）的區域朝受光部照光。接著，根據該光感測 器3 8的檢測結果，以缺口方向對應於第1、第2檢查部 21A、21B當中搬入該晶圓W的檢查部21A(21B)的方 式，讓夾頭部3 6停止，或讓夾頭部3 6下降，再將晶圓w -25- 200903696 交接至下段臂部33上，藉此調整晶圓W的方向。然後， 例如在檢查部2 1 A ( 2 1 B )的晶圓夾頭4 A裝載晶圓W時 ，爲了修正晶圓W的偏心而調整晶圓搬運機構3的位置 。如此般進行晶圓W的方向及偏心之調整。又在第1 6圖 省略光感測器3 7、3 8的圖示。 依據本實施形態，除了上述第1實施形態的效果外， 尙可獲得以下的效果。亦即，由於在晶圓搬運機構3組合 用來進行預對準之夾頭部3 6等的預對準機構3 9，當晶圓 搬運機構3取出晶圓W後，不須移動至預對準機構39之 設置場所，因此可提昇晶圓W的搬運效率（縮短晶圓W 的搬運時間）。再者，不須另外安排預對準機構3 9的設 置空間，因此能抑制裝置的設置面積。 在此，針對用來交換檢測器卡6A的機構及波哥針單 元28的周邊部，參照第19圖至第21圖來作說明。 在頂板2 0 1，設有一對朝Y方向延伸的導軌8 0，以 將檢測器卡6A導引於：用來進行晶圓W檢査的檢查位置 (波哥針單元28的正下方位置）和框體22外部（與分隔 壁20相反側的側方部）的交換位置之間。托盤82的端部 嵌合於該導軌80，該托盤82，可和固定於托盤82上的卡 保持具81 —起沿著導軌80在Y方向移動。檢測器卡6A 被固定（clamp )在該卡保持具81，托盤82設有未圖示 的拆裝機構等’藉由相對於托盤82使檢測器卡6A和卡 保持具81朝既定方向旋轉，使檢測器卡6A和卡保持具 8 1以一體的方式進行拆裝。 -26- 200903696 另一方面，波哥針單元2 8，是藉由設於頂板2 0 1的 開口部之昇降部8 3，而在第1 9圖所示之接觸檢測器卡 6Α的位置、和第20圖所示之上方位置之間進行昇降。因 此，在進行檢測器卡6Α的交換時，讓波哥針單元2 8上 昇後，如第2 1圖所示將托盤8 2拉到交換位置，讓檢測器 卡6 A或檢測器卡6 A和卡保持具8 1朝既定方向旋轉後， 將檢測器卡6A取下。接著，將新的檢測器卡6A裝載於 托盤82，將其位置設置成朝向既定方向，以與取下時相 反的路徑透過托盤82沿導軌80導引至檢查位置，再使波 哥針單元28下降。 此外，將檢測器卡6A交換時之卡保持具81的移動 區域和對準橋台5 A的移動區域分成上下，以避免互相干 涉。在檢測器卡6 A交換時，對準橋台5 A例如設定在第2 圖所示的實線位置。如此般，由於對準橋台5A和檢測器 卡6A不會干涉，不論對準橋台5A的位置如何都能進行 檢測器卡6 A的交換。又由於將頂板2 0 1和檢測器卡6 A 的交換機構（導軌80等）一體化，可打開頂板201進行 維修。又在第2檢查部21B也是，同樣的設有檢測器卡 6B的交換機構。 此外，除了上述檢測器卡6A的交換方法以外，也能 採用以下的手段。亦即，例如第2 2圖所示，具備可在檢 查位置和交換位置之間沿水平方向擺動之搬運台90a，且 藉由可昇降的交換構件90，使位於檢查位置之檢測器卡 6 A下降，然後讓交換構件9 0擺動到框體2 2外側而在交 -27- 200903696 換位置將檢測器卡6A取出，藉此進行檢測器卡6A的交 換。然而，在這個情形，必須打開頂板20 1，且進一步使 交換構件90退避到外側才能進行維修，因此利用第1 9圖 至第21圖的交換機構的方式較爲有利。 [第1實施形態的應用例] 接著，參照第23圖至第26圖來說明上述第1實施形 態的應用例。爲了避免圖示的繁雜化，將關於前述預對準 機構3 9的記載予以省略。以下的例子也是同樣的。 在第23圖的例子，將第1實施形態之檢測裝置本體 2配置於裝載部1的兩側（X軸方向）。晶圓搬運機構3 的臂部2 0數目是3個也可以，但這時晶圓搬運機構3是 4個檢查部共用，因此可讓晶圓搬運機構3具有5個（ 4 +1 )的臂部，將4片晶圓W用晶圓搬運機構3取出而依 序搬入4個檢查部。如此般，對於複數台的檢查部，能讓 晶圓搬運機構3具備複數個臂部，來進行複數片晶圓W 的搬運。如此般藉由將本發明適用於具備複數台的檢查部 之檢測裝置，可進一步提昇晶圓W的搬運效率，又能提 高檢測裝置的產能。又在這個情形，能將比臂部數目少1 片的晶圓W從載具c取出。又在第2 4圖的例子，是將第 1實施形態的檢測裝置本體2和裝載部1設置2組，且以 各檢測裝置本體2側相鄰接的方式來排列。 又在第2 5圖的例子，是將第1實施形態之檢測裝置 300，以檢測裝置本體2側相對向的方式在X方向隔著間 -28- 200903696 隔設置2台，用這2台構成1組，而在Y方向隔著間隔 配置2組。該檢測裝置3 00間的空間，例如在無塵室內， 可作爲用來搬運載具C之未圖示的搬運手段的移動空間， 或作爲用來交換檢測器卡6Α、6Β的空間。 又在弟26圖的例子，在進行晶圓夾頭4Α、4Β的溫 度調整的情形’在沿X方向排列之2台檢測裝置3 00之 間，相對於其分離區域的中心，以點對稱的方式設置冷卻 器等的調溫器60、60，將該調溫器60和檢測裝置300用 調溫媒體流路6 1的連接。若採用這種配置，可縮小無塵 室內之檢測裝置3 0 0的設置空間。 [第2實施形態] 本實施形態，如第2 7圖所示’是將檢查部2 1的方向 改變90度，以對準橋台5Α、5Β的移動方向與前述移動 方向垂直的方式將檢測裝置本體2連接於裝載部1，除此 以外的構造是和第1實施形態相同。因此，這時也是，第 1檢查部21Α及第2檢查部21Β，以前述水平線HL爲中 心呈相對稱。在該檢測裝置’如前述第2 2圖所示是藉由 擺動方式來進行檢測器卡6 A的交換，這時如前述般檢測 器卡6A的交換構件90和對準橋台5a會產生干涉，因此 如第2 8圖所示’在進行檢測器卡6 a的交換時，使對準 橋台5A退避到接近裝載部〗側的退避位置。代表檢 測器卡6 A的交換區。如第2 9圖所示，這個構造的檢測 裝置也是’和前述第2 3圖同樣的，能將檢測裝置本體2 -29- 200903696 排列於裝載部1的兩側（X軸方向）。這時也是，同樣的 能將臂部20的數目增加成5個。 又在上述實施形態中，也可以如第30(a) ( b )圖 所示設置：將檢測裝置本體2的側面的2個搬運口 22a獨 立開閉的開閉器1 2 0。 具體而言，搬運口 22a的周圍，在裝載部丨側被樹脂 製的密封體123包圍，藉由昇降機構並透過昇降軸122來 使開閉器1 2 0昇降，藉此進行搬運口 2 2 a的開閉。在本例 中，只要在除了搬運晶圓W以外的時間都用密封體！ 2 3 來封閉搬運口 22a，即可減少檢查部21A、21B彼此間、 或是檢查部2 1 A、2 1 B和裝載部1之間的環境氣氛互相的 影響。因此’在檢查部21A、21B內，例如在—方的檢查 部21A(21B)進行晶圓W的檢查時，在另一方的檢查部 2 1 B ( 2 1 A )進行維修（例如交換檢測器卡6 )的情形，進 行檢查中的環境氣氛不會受進行維修的環境氣氛的影響。 此外’即使檢查部2 1 A、2 1 B內各自的溫度、濕度等的環 境改變的情形’仍能在維持該環境或減少環境互相影響的 狀態下，進行晶圓w的檢查。 [其他變形例] 在以上的例子’如前述第7圖所示，是在晶圓夾頭 4A設有微型攝影機41和微型攝影機42各1台，但也能 像第3 1圖所示’以從兩側（X軸方向）夾持微型攝影機 41和微型攝影機42的方式，進一步設置複數台（例如2 -30- 200903696 台）的微型攝影機70。該等微型攝影機70,是和前述微 型攝影機4 1同樣的用來確認探針2 9的針尖。 在前述構造中’在拍攝探針2 9時能縮小晶圓夾頭4 a 在X軸方向移動的區域’結果可縮小檢測裝置本體2的 大小。第3 2圖顯示，設置1個微型攝影機41的情形，拍 攝檢測器卡6A ( 6B )的X方向兩端的探針29、29時的 晶圓夾頭4 A ( 4 B )的中心的移動行程d 1 0。第3 3圖顯示 ’如第3 1圖所示設置3個微型攝影機的情形，拍攝檢測 器卡6 A ( 6 B )的X方向兩端的探針2 9、2 9時的晶圓夾 頭4 A ( 4 B )的中心的移動行程d 2 0。可明顯看出，後者 的移動行程D 2 0比前者的移動行程d 1 0大幅縮短。在第 3 1圖是省略標的4 4和進退機構4 3的圖示。 又由於各攝影機（微型攝影機41和微型攝影機70) 所拍攝的探針29的區域不同’在拍攝複數個探針29時可 減少晶圓夾頭4A的移動量。200903696 IX. [Technical Field] The present invention relates to, A technique in which the detector electrically contacts the electrode pad of the object to be inspected to determine the electrical characteristics of the object to be inspected. [Prior Art] After forming a 1C wafer on a semiconductor wafer (hereinafter referred to as a wafer), In order to investigate the characteristics of the 1C chip, The detector is tested with a detector in the wafer state. Briefly explain the wafer flow of the test device, First, the wafer is taken out from a carrier transport mechanism that stores a plurality of wafers. On the wafer: An alignment step called a pre-alignment step, And a step called Ο C R step for acquiring, for example, an ID or the like formed on the wafer. Then, the wafer is carried into the body of the detecting device. Load the wafer on the wafer chuck (available at X, Y, Moving in the Z direction and rotating around the Z axis), By, for example, a lower camera located on the wafer chuck, Provided on the camera above the body of the detecting device in such a manner as to face the wafer chuck, Photographing the electrode pads formed on the wafer and the detectors of the detector card disposed above the wafer chuck, respectively A fine alignment step is performed to properly align the electrode pads and detectors. Then 'contact the detector (eg probe) with the electrode pads of the 1C wafer of the wafer, By supplying a predetermined electrical signal from the probe to the electrode pad, To perform the above inspection of electrical characteristics. Inspection of the electrical characteristics, In order to carry out for a variety of content, It must take a long time. Therefore, in order to increase production capacity, It is desirable to minimize the standby time of the detecting device body (the time when the inspection is not performed). then, -4- 200903696 In the above handling mechanism, The loading arm (removing the uninspected wafer from the carrier and carrying it into the body of the detecting device) and the carrying arm (taking the inspected wafer from the detecting device body and returning it to the carrier) are set to be independently advanced and retractable. In the inspection of the wafer, Unloading the unchecked wafer from the carrier, Performing the above pre-alignment step and OCR step on the wafer in advance, Immediately after taking out the inspected wafer from the inside of the detecting device, the uninspected wafer is carried into the detecting device body. In this way, the standby time of the detecting device body during wafer exchange is minimized. In addition, In this detection device, In order to reduce the foot space of the device, For example, a conventional detecting device, It is a detecting device body in which a plurality of (for example, two) sets are provided for one transporting device. For the two detection device bodies, The wafer is transported by a common transport mechanism. in particular, For example, a case where wafer inspection has been performed in the body of two detection devices, For example, taking one wafer from the carrier, After performing the above pre-alignment step and OCR step on the wafer, The wafer is exchanged with the inspected wafer in the body of one of the detecting devices. The returned wafer is then returned to the carrier. The unchecked wafer is taken out and the pre-alignment step and the OCR step are performed in the same manner. The wafer is exchanged with the wafer that has been inspected in the other body of the detection device. In the detection device of this configuration, For two detectors, Because the wafer is handled by a common transport mechanism, It can reduce the installation space of one transport mechanism. It can reduce the setting area of the detecting device. however, During the exchange of the wafers in one of the detection device bodies to the exchange of the wafers in the other detection device body, Access to the vehicle must be performed on -5- 200903696, The above pre-alignment step or OCR step' therefore takes a long time. therefore, For example, when the inspection of the inside of one of the detection device bodies is performed and the wafers in the body of the detection device are exchanged, the inspection of the other detection device body is completed. Until the other party detects that the wafer of the device body is exchanged for a long time, the other detecting device body is in a standby state. As a result, the production capacity is reduced. on the other hand, There is a known method, The driving mechanism is separately disposed on the loading arm and the carrying arm so that they can move independently and independently. The wafer is carried in and out of the carrier and the wafer is carried out to the main body of the detecting device by different arms. in particular, The carrying arm removes the wafer from the carrier. Handing over the wafer from the carrying arm to the carrying arm, The loading arm is then used to carry the wafer into the body of the detecting device. therefore, While the loading arm accesses the detecting device body, Move the arm to remove the next wafer from the carrier. This can shorten the handling time of the wafer, Further, the standby time of the detecting device body is shortened. however, In this structure, As described above, it is necessary to separately provide a driving device for the loading arm and the carrying arm. The cost of the inspection device becomes higher, And the order of movement of the arms becomes complicated. Patent Document 1 describes a substrate transporting means including a plurality of arms. However, in order to operate the specific arm of the above detection device, There is no discussion. Further, in the case of performing the above fine alignment, it is necessary to ensure the moving area of the wafer chuck in the body of the detecting device. With the large diameter of the wafer, The moving area becomes larger, It is bound to cause an increase in the size of the device. Furthermore, If the moving area of the wafer chuck becomes larger, Its movement time will become longer, The time required for alignment will also become longer. Based on the requirement to increase production capacity, Is loading the loader -6- 200903696 design, The head, , 003 1 of the intersection of two sets of extensions by the integrative test Let it be moved into a plurality of vehicles, However, in the pursuit of high production capacity, there is a trade-off relationship. It is the two detector cards in the loading section, etc.). However, it is large on both sides of the loading section, There is also a clamping portion (transfer of the wafer, And can swing along the arm (in the clamping part and connect), Therefore, the moving track of the wafer, Therefore, there is no [Patent Document 1] Japanese ί , (Fig. 6) [Patent Document 2] Japanese Patent Description The present invention is directed to the above-described measuring device, By the miniaturization of the crystal by the detection device of the present invention, Loaded on a substrate loading station (the aforementioned wafer to be inspected, Or when a plurality of inspection departments are common, The area occupied by the device is inevitably increased. The detecting device is described in Patent Document 2. Two inspection units are connected to the side (the wafer holder is not included, and the inspection unit itself is not required to be miniaturized. The occupant surface of the device can be moved forward and backward between the carrier and the carrier loaded into the loading unit, and the wafer transportation efficiency between the left and right inspection units is not high. In addition, it is necessary to ensure that the problem of the miniaturization of the entire device is solved by Yukai No. 200 1 -250767 (paragraph 6-663, 65 (1) Its purpose is to provide a round handling efficiency to increase productivity. And seek miniaturization to achieve high production capacity. It is a detector that is equipped with a plurality of inspected wafers that can be moved in the horizontal direction and in the vertical direction. The pole pad contacts the detector card to enter the 200903696 inspection of the inspected wafer. It is characterized by: The system has: a loading magazine for loading a carrier (containing a plurality of substrates), a plurality of detecting device bodies having a detector card (a detector is formed below), a substrate transport mechanism that is rotatable about a vertical axis and that is movable up and down and that is used to transfer the substrate between the loading cassette and the detecting device body, a control unit for outputting a control signal to the detecting device body and the substrate carrying mechanism; The substrate transport mechanism includes at least three substrate holding members that can advance and retreat independently of each other; The control unit outputs a control signal to perform the following control: Receiving at least two substrates from the carrier by the substrate transport mechanism, The at least two substrates and the inspected substrates in the plurality of detecting device bodies are sequentially exchanged by the empty substrate holding member. The aforementioned substrate transport mechanism, A pre-alignment mechanism may be provided for alignment of the substrate, Its system contains: a rotating portion for rotating the substrate received from the substrate holding member, A detecting portion that irradiates light to a region including the peripheral edge portion of the substrate on the rotating portion and receives light passing through the region. The detecting device of the present invention has: a loading magazine for loading a carrier (containing a plurality of substrates), a plurality of detecting device bodies having a detector card (a detector is formed below), a substrate transport mechanism for transferring a substrate between the loading cassette and the body of the detecting device; Further, at least three substrate holding members that can independently advance and retreat are provided in the substrate transfer mechanism. In addition, Since at least two 200903696 substrates are received from the carrier by the substrate handling mechanism, The at least two substrates and the inspected substrates in the plurality of detecting device bodies can be sequentially exchanged by the empty substrate holding member. Therefore, the standby time of the detecting device body can be reduced, And can increase production capacity. [Embodiment] [First Embodiment] A detection device according to a first embodiment of the present invention As shown in Figs. 1 to 3, the loading unit 1 is provided with a wafer W for carrying out a substrate (a plurality of wafers to be inspected are arranged). The detecting device body 2 for detecting the wafer W. First of all, The overall arrangement of the loading unit 1 and the detecting device body 2 will be briefly described. The loading unit 1 has: 2. The first loading unit 1 1 and the second loading unit 1 for carrying in the i-th carrier C1 and the second carrier C2 (transporting container for storing a plurality of wafers w), respectively. Configured on the loading port, 12 between the transport rooms 10. The first loading cassette 11 and the second loading cassette 12 are respectively provided for loading the carrier C1. The first loading stage 13 and the second loading stage 14' of C2 are 2 loading station 13, 14 configured to be separated from each other in the Y direction, The interface (front opening) of the first carrier C1 and the second carrier C2 are opposite to each other. Further, the transfer chamber 1 is provided with a wafer transfer mechanism (substrate transfer mechanism) 3' for transporting the wafer w by the substrate holding member (arm 3 〇). The detecting device body 2 has a frame body 22 constituting an exterior portion of the detecting device body 2, The frame 22 is adjacent to the loading unit 1 in the X direction. The frame 22, It is divided into two halves in the γ direction through the partition wall 2〇. The division of one side -9 - 200903696 The division part and the division part of the other side, Each corresponds to an exterior body for separating the first inspection unit 2 1 A and the second inspection unit 2 1 B. The first inspection unit 21A includes: Wafer chuck 4A of the substrate loading table, With a camera (in the upper area of the wafer chuck 4A in the Y direction (connected load 埠 11, Alignment abutment 5A of the photographing unit of the direction of 12) A detector card 6A is provided on the top plate 201 (which forms the top of the frame 22). The second inspection unit 21B is also the same. With wafer chuck 4B, The abutment 50 and the detector card 6B are aligned. Next, the loading unit 1 will be described in detail. The first loading port 11 and the second loading port 1 2 are symmetrical to each other and have the same structure. Therefore, the structure of the first loading cassette 11 will be described with reference to Fig. 4 . Loading section 1, As shown in Figures 3 and 4, It is separated from the aforementioned transfer chamber 10 by the partition wall 20a. The partition wall 20a is provided with: Shutoffer S, An opening and closing mechanism (not shown) that opens and closes the interface between the shutter S and the first carrier C 1 in an integrated manner. The first loading station 13, The rotation mechanism (not shown) provided on the lower side of the first loading table 13 is rotated by 90 degrees in the clockwise direction and the counterclockwise direction, respectively. That is, the first loading station 13, For example, from the front side of the detection device (the right side of the X direction in the figure), The sealed type carrier C1 (referred to as hoop) is such that the front opening portion faces the detection device side (the left side in the X direction). When the first loading station 13 is mounted on the first loading station 13 by an automatic transport vehicle (AGV) (not shown) in the interior of the room, the first loading station i 3 is rotated clockwise by 9 degrees to open the opening and the aforementioned shutter. S is opposite, When the first carrier C1 is carried out from the first loading stage 13 in the same manner, the first carrier C1 is rotated by 9 degrees in the direction of the counterclockwise -10-200903696. The transfer of the wafer w between the first carrier C1 and the wafer transfer mechanism 3 is performed such that the opening of the first carrier C1 faces the shutter S side, and the shutter S is opened by the shutter Slider 201. The interface with the first carrier C2 is opened in an integrated manner, After the transfer chamber 10 and the first carrier C1 are communicated with each other, the wafer transfer mechanism 3 is moved forward and backward with respect to the first carrier C1. Wafer moving mechanism 3, As shown in Figure 5, The system has: Moving abutment 35, a rotating shaft 3a for rotating the conveying base 35 about a vertical axis, An elevating mechanism 3b for elevating and lowering the rotating shaft 3a. On the transport base 35, An arm portion 30 having a rectangular notch at the front end portion (including: Upper arm 3 1 Middle arm 32, The lower arm portion 33 has a total of three) and is set to move forward and backward freely. Each arm 30 moves forward and backward independently of each other. It functions as a wafer w. Rotating the center of rotation of the shaft 3 a, Set between the first carrier c 1 and the second carrier C2, That is, it is set at a position equal to the distance from the first carrier C1 and the distance from the second carrier C2. Wafer handling mechanism 3, The upper position (the transfer of the wafer W between the first carrier C1 and the second carrier C2) and the lower position (between the first inspection unit 21A or the second inspection unit 21B) Lifting is performed between the transfer of the wafer W. Below the inside of the transfer chamber 10, At a position that does not interfere with the operation (rotation and elevation) of the wafer transfer mechanism 3, For example, the position from the center of rotation of the wafer transfer mechanism 3 is shifted from the second loading stage 14 side. A pre-alignment mechanism 39 for pre-aligning the wafer W is provided. The pre-alignment mechanism 39 is provided with: a rotary loading station 500 for loading the wafer W and rotating around the vertical axis, a light-emitting sensor and a light-receiving sensor (a detecting portion (photosensor 3 7) that holds a region including a peripheral portion of the wafer W mounted on the loading table 500 on the rotating -11 - 200903696 from above and below, The susceptor 501 is supported by the rotary loading table 500 and the photosensor 27 from below. The rotary loading station 500, In order for the rotary loading table 500 to enter the notch portion of the front end of the arm portion 30, The size is smaller than the opening of the notch. Although not shown, A controller is attached to the loading unit. It measures the direction reference portion of the wafer W based on the detection signal from the photo sensor 37 (gap, Orientation plane, etc.) and the center position of the crystal W, Based on the detection result, the rotary loading table 5 is rotated to make the notch or the like face in a predetermined direction. The following simple instructions, The wafer w direction (pre-alignment) is performed by the pre-alignment mechanism 39 (consisting of the light sensing 37 and the rotating loading table 500). First of all, The wafer W is carried on the wafer transfer table 500 by the wafer transfer mechanism 3, The wafer is rotated by the rotation of the loading table 5, and the light-emitting portion of the photodetector 37 is transmitted through the region including the peripheral portion (end portion) of the wafer w toward the light-receiving portion. The trajectory of the outer circumference of the wafer W is read by the photo sensor 37, Thereby grasping the direction center position of the wafer w. then, Rotating the loading table 500 rotation, and rotating the wafer W on the 5 〇 朝 in a predetermined direction, The wafer w is transferred to the crystal transport mechanism 3, Thereby adjusting the direction of the wafer w. then, For example, when the crystal W is mounted on the wafer chuck 4 A of the first inspection unit 2 1 A, The position of the wafer transport mechanism 3 is adjusted to correct the eccentricity of the wafer W. The direction and eccentricity of the crystal W are adjusted in this manner. Also, although the illustration is omitted, In order to discriminate the ID of the identification or the like on the surface of the wafer W, for example, in the transfer chamber 1 ,, There is an OCR mechanism (匣) consisting of, for example, a measuring width 1 rounding device for adjusting the W edge and a circular round moving body, such as a -12-200903696 camera. For example, after the pre-alignment step described above, The above ID can be obtained. Next, the detecting device body 2 will be described in detail. On the side wall of the mounting portion 1 side of the casing 22 of the detecting device body 2, A belt-shaped conveying port 22a extending in the lateral direction (γ direction) is formed, The wafer W is transferred between the second inspection unit 21A and the second inspection unit 21B. The second inspection unit 2 ja and the second inspection unit 2 1 B ' are horizontal lines HL ' orthogonal to the straight line connecting the first loading cassette 1 1 and the second loading cassette 2 to the center of rotation of the wafer transport mechanism 3 . Regarding the transfer position of the wafer W, The photographing position of the surface of the wafer w and the position of the detector card 6 are all bilaterally symmetrical. And the same structure, In order to avoid repeated explanations, 'only for the first inspection unit 21Α, Refer to Figure 3, Figures 6 and 7 are for illustration. The inspection unit 21A includes a base 23, On the base 23, From the bottom to the top, the loading table 24 and the loading table 25 are provided in sequence. The loading platform 24, Follow the guides that extend in the direction of the Υ, For example, driven by a ball screw or the like in the direction of the yoke; The X stage 25' is along a guide rail that extends in the X direction. For example, it is driven in the X direction by a ball screw or the like. On the X stage 25 and the Υ stage 24, The motor in which the encoder is assembled separately is omitted here. The X stage 25 is provided with a moving portion 26 (driven by a motor equipped with an encoder (not shown) in the ζ direction), In the moving part 26, There is a substrate loading table (crystal collet 4 Α) that can rotate around the yoke axis (moving in the 0 direction). Therefore, the wafer chuck 4Α' can be in X, Oh, Oh, 0 direction moves. X stage 25, γ stage 24, The moving portion 26 constitutes a driving portion. In order to transfer the wafer chuck 4 at the transfer position (for transferring the wafer W between the wafer carrier and the wafer handling mechanism), The photographing position of the surface of the wafer W to be described later, The contact position (inspection position) of the probe 29 contacting the detector card 6A is driven. Above the moving area of the wafer chuck 4A, The detector card 6A is detachably mounted to the top plate 201. Regarding the mounting structure of the detector card 6a and its switching method, Details are detailed later. An electrode group is formed on the upper side of the detector card 6A. In order to form electrical conduction between the electrode group and a test head not shown, A Bogeo pin (p0g0 pin) unit 28 is disposed above the detector card 6A, Below unit 28, A plurality of electrode portions (Bogota pins 28a) are formed corresponding to the arrangement positions of the electrode groups of the detector card 6A. A test head, usually not shown, is located above the Bogota unit 28. In this case, The test head is disposed at a different position from the detecting device body 2, The Bogota needle unit 28 and the test head are connected by a cable (not shown). In addition, On the lower side of the detector card 6A, For example, in the full range of the detector card 6A, An array of electrode pads corresponding to the wafer W is provided with a detector (for example, a vertical needle extending perpendicularly to the surface of the wafer W, That is, the wire probe). As a detector, can also be: a probe 29 formed of a metal wire extending obliquely downward with respect to a surface of the wafer W, A gold bump electrode or the like formed on the flexible film. In the detector card 6A of this example, Simultaneously contacting all of the electrode pads of the wafer to be inspected (1C wafer) on the surface of the wafer W, Therefore, the measurement of electrical characteristics can be completed by one contact. On the side of the partition wall 20 side of the wafer chuck 4A of the Z moving portion 26, The first photographing means for photographing the probe 29 (the microcamera 4 1 with the field of view facing upward) is fixed to the fixing plate 4 1 a. The miniature camera -14- 200903696 41, A camera that includes a high magnification of a CCD camera is used to magnify and photograph the tip of the probe 29 and the alignment mark of the detector card 6A. The micro camera 4 1 is located at a position substantially in the middle of the X-direction of the wafer chuck 4A. Mini camera 41, In order to investigate the arrangement direction and position of the probe 29 at the time of alignment, Shooting a specific probe 29 (for example, the probe 29 at both ends in the X direction and the probe 29 at both ends in the Y direction), In order to periodically observe the state of each probe 29, Shoot all the probes 29 ° in sequence and on the fixed plate 41a. The micro camera 42 (for arranging the probes 29 in a wider area) is attached adjacent to the micro camera 41. A target 44 is provided on the fixed plate 41a (relative to the focal plane of the micro camera 41, The advancing and retracting mechanism 43 can advance and retreat in a direction crossing the optical axis. The target 44, Image recognition can be performed by the micro camera 41 and a micro camera 45 which will be described later. For example, a circular metal film (for example, a metal film having a diameter of 1 40 // m) for aligning a subject is vapor-deposited on a transparent glass plate. Figures 7(a) (b) are shown separately, A top view and a side view of the positional relationship between the wafer chuck 4 A and the micro camera 4 1 and the micro camera 42. In Figure 7, The illustration of the aforementioned target 44 and the advancing and retracting mechanism 43 is omitted. In the X direction (outside and inside) of the inner wall surface of the frame 22 of the region between the wafer chuck 4A and the detector card 6 A, A guide rail 47 is provided along the γ direction. Along the guide rail 47, As shown in Figure 8, The photographing unit (aligning the abutment 5 A ) is movable in the Y direction between a standard position and a photographing position which will be described later. At the alignment abutment 5 A, For example, along the X direction, There are a plurality of (for example, -15-200903696, three) second imaging means for photographing substrates arranged at equal intervals (microcamera 45 with a field of view facing downward). The micro camera 45' at the center of the three micro cameras 45 is a micro camera 45 located at the center of the moving range of the wafer chuck 4A in the X direction, The distance 'the distance from the central micro camera 45' is the same or shorter than the distance between the center of the wafer chuck 4a and the wafer to be inspected at the outermost surface of the wafer w (for example, a distance of 1/3 of the diameter of the wafer W) . Mini camera 45, A camera that includes a high magnification of a CCD camera is used to take a magnification shot of the surface of the wafer W. Aligning the abutment 5A on the side of the micro camera 45, A low magnification camera 46 for confirming the wafer W with a wider field of view is provided. Regarding the low magnification camera 46, The illustration is omitted except for the second drawing. The above-mentioned alignment position (standard position) of the abutment 5A, When the wafer W is transferred between the wafer chuck 4 A and the wafer transport mechanism 3, When the wafer W contacts the detector card 6A, And when the probe 29 is imaged by the first imaging means (micro camera 4 1 ), In order to avoid interference with the wafer chuck 4A and the wafer transfer mechanism 3, the alignment abutment 5A is retracted. The aforementioned photographing position, The position at the time of photographing the surface of the wafer W is obtained by aligning the micro camera 45 of the abutment 5A and the low magnification camera 46. When the wafer W surface is photographed by the micro camera 45 and the low magnification camera 46, The alignment abutment 5A is fixed to the photographing position. This is done by moving the wafer chuck 4 A. The location of the photography, As shown on the lower side of Figure 9, The inner side of the detector card 6A is biased toward the inner side in the Y-axis direction (the center side of the detecting device body 2), The reason for this is explained below. -16- 200903696 As mentioned earlier, The micro camera 41 is provided on the side surface (outside in the Y-axis direction) of the wafer chuck 4a. When the probe 29 is photographed by the micro camera 41, As shown in the middle of Fig. 9, the movement stroke D2 of the wafer chuck 4A in the Y-axis direction (the movement range of the center position 〇1 of the wafer chuck 4A) is biased toward the center position 0 2 of the detector card 6A. The inside of the Y-axis direction. on the other hand, As shown in the upper section of Figure 9, The movement stroke D 1 of the wafer chuck 4 A at the time of contact (when the wafer w is in contact with the probe 2 9) Since a plurality of probes 2 9 are formed under the detector card 6 A (which can simultaneously contact the wafer w), Therefore, the distance is very short. therefore, If the photographing position of the alignment abutment 5 A is aligned with the center position 02 of the detector card 6A, The movement stroke d3 of the wafer chuck 4A when the surface of the wafer W is photographed by the micro camera 45 goes to the right side of the aforementioned movement stroke D1. then, The photographing position of the alignment abutment 5 A is shifted toward the outer side in the γ-axis direction to make the movement stroke D2 D3 overlaps, To shorten the area including the movement strokes D1-D3 of the wafer chuck 4A (the movable stroke D 4 of the movable range), That is, the length of the detecting device body 2 in the Y-axis direction is shortened. Even if the travel is D2 D3 is not in the same range, It suffices that the photographing position of the alignment abutment 5A is more toward the inner side of the Y-axis direction than the center position Ο 2 of the detector card 6A. As shown in Figure 2, In the detection device, There is a control unit 15 composed of, for example, a computer. The control unit i 5 is provided with a program, Memory, The data processing unit of the CPU, etc. The program group included in the program is controlled to: When the carrier c is loaded into the loading magazine (12), Check the wafer w, The wafer W is then returned to the carrier C, Then, the carrier c is carried out and a series of actions -17-200903696 are performed. The program (which also contains the program related to the input operation and display of the processing parameters), For example, it is housed in a magnetic sheet, CD, MO (optical disk), Memory media such as hard disk 1 6, And installed in the control unit 15. Next, the action of the above detecting device will be described. First of all, With automatic handling (AGV) in a clean room, The carrier C is carried into the loading cassette 1 from the side opposite to the detecting device body 2 from the loading magazine U (> 2). At this time, the interface of the carrier C is directed toward the detecting device body 2, It is opposed to the shutter S by rotating the loading table 13 (14). Then the loading station 13 advances and pushes the carrier C toward the shutter S side. The cover of the carrier c and the shutter S are opened. Then 'take out the wafer w from the carrier C, Carry it to the inspection unit 21A (21B), Regarding the next role description, Is on 2 wafers W1, In the state where the first inspection unit 21A and the second inspection unit 21B have completed the inspection, Subsequent wafers W3 and W4 are taken out from the carrier C, And a series of steps. First, as shown in Fig. 10, the upper arm portion 31 enters the second carrier C2 to receive the wafer W3 and then retreats. then, The same middle arm portion 32 enters the middle 2 carrier C2 and is retracted after receiving the wafer W4. then, The wafer handling mechanism 3 is lowered to the lower position, And rotated to the direction in which the arm portion 31 (32) can access the rotary loading station 500. then, As shown in Fig. 11, the upper arm portion 3 1 protrudes toward the rotary loading table 500 side until the wafer W3 on the upper arm portion 3 1 is positioned above the rotary loading table 500. Then, the wafer transport mechanism 3 is slightly lowered to load the wafer W3 on the rotary loading table 500. then, The rotary loading station 500 rotates, At the same time, the area including the peripheral portion of the wafer W3 is illuminated by the photo sensor 37 -18- 200903696, And receiving light passing through the area including the peripheral portion. According to the detection result of the photo sensor 37, The direction of the gap corresponds to the first Second inspection unit 21A, In the 21B, the manner in which the inspection portion 21A (21B) of the wafer W3 is carried in is adjusted to adjust the direction of the circle W3. And detected eccentricity, Pre-alignment is performed. The wafer handling mechanism 3 is then raised to receive the wafer W3. The same "wafer W 4 is also" in a manner that the notch direction corresponds to the inspection portion 2 1 A ( 2 1 B ) carried in the wafer W4. The direction adjustment and eccentricity detection of the wafer W 4 are performed. Also, by the OCR mechanism not shown in the figure, Obtained on the wafer W3, ID of the W4 surface. Next, the wafer W1 in the first inspection unit 2 1A and the wafer W3 on the wafer transfer mechanism 3 are exchanged. The 4th (9) diagram explained in the embodiment to be described later, A series of operations of the wafer transfer mechanism 3 at this time are briefly displayed. When the inspection of the wafer W1 is completed, the wafer chuck 4A is as shown in FIG. Move to the intersection of the partition wall 2〇. Then the vacuum chuck of the wafer chuck 4A is released. The lift pins in the wafer chuck 4A are rising, The wafer W1 is raised upward. then, The empty lower arm portion 3 3 enters the wafer collet 4A, The wafer transport mechanism 3 rises to receive the wafer W1, Backward. In addition, The wafer handling mechanism 3 is lowered, The upper arm portion 31 enters the wafer chuck 4A, In the previous pre-alignment, it is judged that the center position of the wafer W3 is shifted. In order to correct the eccentricity of the wafer W3, Using the synergistic effect of the aforementioned lift pin and the upper arm portion 3 1 not shown, The wafer W3 is loaded on the wafer chuck 4A. then, As shown in Figure 13, The upper arm portion 3 1 that has been emptied after the wafer W3 is transferred to the first inspection portion 2 1 A enters the second inspection portion 2 1 B, From the crystal -19- 200903696 round collet 4B receives the inspected wafer W2, After going backwards, The middle arm 32 enters the wafer chuck 4B, The wafers 4 before inspection are transferred from the middle arm portion 32 to the wafer chuck 4B. Then, the "wafer transfer mechanism 3 is raised", and the wafer w1 and the wafer W3 are sent back to, for example, the first carrier C1. For the next wafer w (wafer W5, W6) is the same. After taking two pieces out of the carrier c, Do the same. On the other hand, in the first inspection unit 21A, After the wafer W3 is transferred to the wafer chuck 4A, the probe 29 of the detector card 6A is photographed by the micro camera 41 provided on the wafer chuck 4A. in particular, For example, the probe 29 at the farthest end in the X direction and the probe 2 9 ' at the farthest ends in the Y direction are taken to grasp the center of the detector card 6 A and the arrangement direction of the probe 29. At this time, By the micro camera 42 provided on the wafer chuck 4A, The area near the target position is found. Then, the position of the tip of the target probe 29 is detected by the micro camera 41. At this time, the abutment 5 a is aligned. Retreat to the standard position shown in Figure 8. Then, 'the alignment abutment 5 A moves to the photographing position of the wafer W3 (refer to FIG. 8)' and the target 4 4 (refer to FIG. 6) protrudes from the micro camera 4 1 on the wafer chuck 4 A side and is aligned. The area between the micro cameras 45 on the abutment 5 A side, Taking two cameras 41, The focus and optical axis of 45 are aligned with the position of the wafer 4 4 in a manner consistent with the marking of the target 4 4 , And the so-called two cameras 41, The origin of 45. Then let the target 44 back off, The wafer chuck 4A is placed on the lower side of the alignment abutment 5A. The wafer chuck 4A is moved to allow any of the three micro cameras 45 of the aligning abutment 5A to capture a plurality of specific points formed on the wafer W3. At this time too, The wafer chuck 4A is induced to the vicinity of the target area on the wafer W in accordance with the shooting result of the micro camera 46. In the present invention, for example, the interval between the three micro cameras 4500 is set to 1/3 of the diameter of the crystal W3, Even if the micro-cameras 45 are used to sequentially capture the moving distance of the wafer W in the X direction toward the wafer W3 (the amount of driving of the ball screw required to move the X stage 25), As shown in Fig. 14, the position where the micro camera 45 on one end side overlaps with one end of the wafer W3 (to the left end of the periphery in the drawing) Between the position where the other end side micro-camera 45 overlaps the other end side of the wafer W3, The center of the wafer chuck 4A moves by a distance of L 1, Compared to the diameter of the wafer W3, Just about 1/3 of the distance. Therefore, even if a specific point on the wafer W3 is located at the peripheral portion of the wafer W3, The moving distance of the wafer chuck 4A in the X direction is still small. The position of the wafer chuck 4A after each photographing and the position of the wafer chuck 4A when the originating point is performed are performed as described above. It can be calculated on the side of the control unit 15 In order to make the electrode pads on the wafer W3 and the probes 9 of the detector card 6A contact the coordinates of the wafer chuck 4 A. The wafer chuck 4A is then moved to the calculated contact coordinate position. Each of the electrode pads on the wafer W3 is brought into contact with each of the probes 29 of the detector card 6A. Then, the test head which is not shown is sent to the electrode pads of the respective 1C wafers on the wafer W3 through the Bogota unit 28 and the detector card 6A, thereby performing electrical characteristic inspection of each 1C wafer. then, Same as the aforementioned wafer W1, Moving the wafer chuck 4B to the transfer position 'by wafer transfer -21 - 200903696 The mechanism 3 carries the wafer W3 from the wafer chuck 4B. For loading the wafer W4 of the second inspection unit 2 1 B, The same is done for inspection. According to the above embodiment, Three arm portions 30 (31 to 33) are provided in the wafer transport mechanism 3, The wafer transport mechanism 3 receives two unchecked wafers W from the carrier C. Therefore, the wafer w can be sequentially transported to two inspection units 2 1, The standby time of the inspection unit 21 can be shortened, and the throughput of the detection device can be increased. therefore, For example, when the wafer W1 and the wafer W2 are transported (when the inspection device starts the inspection of the wafer W), the wafer W can be sequentially transported to the two inspection units 2 1, The inspection of the inspection unit 21 can be started early, As a result, productivity can be increased. For example, when the wafer W is exchanged, While the inspection unit 21 inspects the wafer W, Pre-alignment steps can be performed on the unchecked wafer W, etc. The wafer W can be exchanged immediately after the inspection is completed. Further, the standby time of the inspection unit 21 can be further shortened. As is customary, It is not necessary to distinguish between the arm portion of the inspection unit 2 1 and the arm portion of the wafer W from the inspection unit 2 1 . The wafer W that has been inspected is recovered by transporting the wafer W (empty) arm portion 33 among the three arm portions. that is, In the above example, In the first inspection unit 21A, Since the wafer W is not loaded on the lower arm portion 33, The wafer W1 can be received by the lower arm portion 3 3, In place of the wafer W1, the wafer W3 on the upper arm portion 31 is carried into the first inspection portion 21A. Because the wafer W is no longer present on the upper arm portion 31, The second inspection unit 21B can receive the inspected wafer W2 by the upper arm portion 21B. therefore, As described above, the transport efficiency of the wafer W can be improved (the transport time of the wafer W can be shortened). So by using the empty arm 3 3, As long as the number of arms 3 3 is one more than the number of wafers to be transported -22- 200903696, It is possible to exchange a plurality of wafers w, Therefore, it is possible to suppress an increase in size of the crystal transport mechanism 3. In addition' by setting: The first and second loading cassettes 11 for loading two carriers C in a relatively opposed manner, 12. Loading 埠π, a wafer handling mechanism 3 having a center of rotation in the middle of 12; Along the loading 埠n, The arrangement of j 2 is arranged and symmetrical to each other (the wafer chuck 4A at the time of the transfer of the wafer W, 4B location, Wafer chuck 4A when wafer w is photographed, 4B moving area and detector card 6 A, 6 B position, The first and second inspection units 21A that are symmetrical with respect to the horizontal line HL (see FIG. 2), 21B; Further, the wafer W is directly transferred between the carrier C and the wafer chuck 4A (or 4B) of the inspection portion 21A (or 21B) by the wafer transfer mechanism 3. therefore, It is possible to reduce the size of the device. In addition, the first and second inspection units 21A, 21B can check the wafer W in parallel, Also in the carrier C and the wafer chuck 4A, Direct handling between 4B, Therefore, the inspection efficiency of the substrate, Increased handling efficiency, And can seek to increase production capacity. In addition, On the alignment abutment 5 A ( 5 B ), The three micro cameras 45 are arranged in the X direction at intervals of 1/3 of the diameter of the wafer W, for example. When the surface of the wafer W is photographed by the cameras 45 as described above, The moving area of the wafer chuck 4A (4B) becomes small. however, In the case of making one contact with respect to the above, For example, in the case of multiple contacts, As shown in Fig. 15, the center position of the movement stroke D 1 ' of the wafer chuck 4 A at the time of contact, It is substantially coincident with the center position 02 of the detector card 50. In addition, Since the photographing position of the alignment abutment 5A is the center position of the moving stroke D 1 ' (the center position of the detector card 50 - 23103994, 02), the moving stroke D3 when the wafer W is photographed, , It is the same range as the movement stroke D 1 ' at the time of contact. At this time, Since the arrangement area of the probe 29 is narrow, the moving stroke D2' of the wafer chuck 4A required for photographing the probe 29 is relatively short, including the movement stroke D1, The movable stroke D4'' of the wafer chuck 4A of the ?D3' is substantially the same as the movable stroke D4 when the detector card 6A is used, and the length can be suppressed to the minimum limit. however, In this state (the state in which the movement stroke D1 at the time of contact is aligned with the center position of the movement stroke D 3 ' at the time of photographing of the wafer W), To take a probe 29 formed corresponding to the full area of the wafer W, It is necessary to include the movement stroke D2 when the probe 29 is photographed to make the movable stroke D4' of the wafer chuck 4A large. As a result, the detecting device body 2 becomes large. then, In the present embodiment, as described above, Is a detector card 6 A that specifies the detecting device body 2 to be in one contact, And the center position of the wafer chuck 4 A at the time of the shooting probe 2 9 and the movement stroke D 3 at the time of taking the wafer W are the same, This can shorten the movable stroke D 4 of the wafer chuck 4 A, The detecting device body 2 is miniaturized. [Modification of First Embodiment] Next, Referring to Figure 16, Fig. 17 is a view showing a modification of the first embodiment described above. In this case, Wafer handling mechanism 3, A pre-alignment mechanism 39 for pre-aligning the wafer W is provided. The pre-alignment mechanism 39 is provided with: a shaft portion 36a that can be moved up and down and rotated through the conveyance base 35, A rotary stage (clip head 36) provided on the top of the shaft portion and generally fitted to the concave portion on the surface of the conveyance base 35 and having the same surface as the surface -24-200903696. The clip head 36, The set position corresponds to the center position ' of the wafer W on the arm portion 30 in the state of being retracted to half, and the wafer W on the arm portion 30 of each segment is slightly lifted from the arm portion 30 to be rotated. . The pre-alignment mechanism 3 9 system has: a detecting portion (light sensor 37) for detecting a periphery of the wafer W rotated by the chuck portion 36 by a light-emitting sensor and a light-receiving sensor 3 8). The light sensor 37, 3 8, The position is fixed to the outside of the moving region of the arm portion 3 by the transporting base 35. In this example, the pre-aligned object (wafer w) is the wafer W and the middle arm on the lower arm portion 3 3 . Wafer W on part 3 2, Therefore, set its height to: Up and down the circumference of each wafer W lifted by the chuck portion 36 Moreover, the extent of the wafer w is not interfered when the wafer W is accessed. The present embodiment includes the effect of adjusting the direction of the wafer W (pre-alignment) by the pre-alignment mechanism 39, Taking the wafer W on the lower arm portion 3 3 as an example will be briefly described below. In this case, The steps other than pre-alignment are the same as the previous examples. Therefore, the description is omitted. First, for example, the lower arm portion 3 3 enters the carrier C, After receiving the wafer W, it is retracted to a position where pre-alignment is performed. then, As shown in Figure 18, Lifting the wafer W on the lower arm portion 3 3 with the chuck portion 36, The wafer W is rotated erected, and a region including the peripheral portion (end portion) of the wafer W is irradiated from the light-emitting portion of the photo sensor 38 toward the light-receiving portion. then, According to the detection result of the photo sensor 38, The gap direction corresponds to the first Second inspection department 21A, The mode in which the inspection unit 21A (21B) of the wafer W is carried in 21B, Let the clip head 3 6 stop, Or let the clip head 3 6 fall, Transfer the wafer w -25- 200903696 to the lower arm portion 33, Thereby, the direction of the wafer W is adjusted. then, For example, when the wafer chuck 4A of the inspection unit 2 1 A ( 2 1 B ) is loaded with the wafer W, The position of the wafer transfer mechanism 3 is adjusted in order to correct the eccentricity of the wafer W. The direction and eccentricity of the wafer W are adjusted in this manner. In the first picture, the photo sensor is omitted. 3 8 icon. According to this embodiment, In addition to the effects of the first embodiment described above, 尙 The following effects can be obtained. that is, Since the wafer handling mechanism 3 combines the pre-alignment mechanism 3 9 for pre-aligning the chuck portion 36 and the like. After the wafer transport mechanism 3 takes out the wafer W, It is not necessary to move to the setting place of the pre-alignment mechanism 39, Therefore, the transport efficiency of the wafer W can be improved (the transport time of the wafer W can be shortened). Furthermore, There is no need to separately arrange the setting space of the pre-alignment mechanism 39. Therefore, the installation area of the device can be suppressed. here, For the mechanism for exchanging the detector card 6A and the peripheral portion of the Bogota unit 28, The description will be made with reference to Figs. 19 to 21 . On the top plate 2 0 1, A pair of guide rails 80 extending in the Y direction are provided, To guide the detector card 6A to: The inspection position (the position immediately below the Boeing needle unit 28) for performing the wafer W inspection is between the outside of the casing 22 (the side portion opposite to the partition wall 20). The end of the tray 82 is fitted to the guide rail 80, The tray 82, It can be moved in the Y direction along the guide rail 80 together with the card holder 81 fixed to the tray 82. The detector card 6A is clamped to the card holder 81, The tray 82 is provided with a detachable mechanism or the like (not shown). By rotating the detector card 6A and the card holder 81 in a predetermined direction with respect to the tray 82, The detector card 6A and the card holder 8 1 are detachably attached in an integrated manner. -26- 200903696 On the other hand, Bogo needle unit 2 8, It is by the lifting portion 8 3 provided at the opening of the top plate 210. And in the position of the contact detector card 6Α shown in FIG. Lift up and down between the upper position shown in Figure 20. Therefore, When performing the exchange of the detector card 6Α, After the Bogota needle unit 2 8 is raised, Pull the tray 8 2 to the exchange position as shown in Figure 2 After the detector card 6 A or the detector card 6 A and the card holder 8 1 are rotated in a predetermined direction, The detector card 6A is removed. then, Loading a new detector card 6A on the tray 82, Set its position to be in a given direction, Guided along the guide rail 80 to the inspection position through the tray 82 in a path opposite to the removal. The Bogota unit 28 is lowered again. In addition, The moving area of the card holder 81 and the moving area of the alignment abutment 5 A when the detector card 6A is exchanged are divided into upper and lower sides. To avoid interfering with each other. When the detector card 6 A is exchanged, The alignment abutment 5 A is set, for example, at a solid line position as shown in FIG. So, Since the alignment abutment 5A and the detector card 6A do not interfere, The exchange of the detector card 6 A can be performed regardless of the position of the alignment abutment 5A. Further, since the exchange mechanism (rail 80, etc.) of the top plate 210 and the detector card 6 A is integrated, The top plate 201 can be opened for maintenance. Also in the second inspection unit 21B, The same switching mechanism is provided with the detector card 6B. In addition, In addition to the above-described method of switching the detector card 6A, The following means can also be used. that is, For example, as shown in Figure 2, There is a transfer table 90a that can swing horizontally between the inspection position and the exchange position, And by the exchangeable member 90, Detecting the detector card 6 A at the inspection position, Then, the exchange member 90 is swung to the outside of the frame 2 2 and the detector card 6A is taken out at the position of the exchange -27-200903696. Thereby, the exchange of the detector card 6A is performed. however, In this situation, The top plate 20 1 must be opened Further, the exchange member 90 is further retracted to the outside for maintenance. Therefore, it is advantageous to use the switching mechanism of Figs. 19 to 21. [Application example of the first embodiment] Next, An application example of the first embodiment described above will be described with reference to Figs. 23 to 26 . In order to avoid the complexity of the illustration, The description of the pre-alignment mechanism 39 will be omitted. The following examples are the same. In the example of Figure 23, The detecting device main body 2 of the first embodiment is disposed on both sides (X-axis direction) of the loading unit 1. The number of the arm portions 20 of the wafer transport mechanism 3 is three, and At this time, the wafer transport mechanism 3 is shared by four inspection units. Therefore, the wafer handling mechanism 3 can have five (4 +1 ) arms. Four wafers W are taken out by the wafer transfer mechanism 3 and sequentially carried into four inspection sections. So, For the inspection department of a plurality of stations, The wafer handling mechanism 3 can have a plurality of arms. The processing of a plurality of wafers W is performed. Thus, the present invention is applied to a detecting device having an inspection unit having a plurality of stages. The handling efficiency of the wafer W can be further improved. It also increases the productivity of the test unit. In this case again, The wafer W which is one piece less than the number of arms can be taken out from the carrier c. In the example of Figure 24, The detection device main body 2 and the loading unit 1 of the first embodiment are provided in two groups. Further, the detection device bodies 2 are arranged adjacent to each other. In the example of Figure 25, The detecting device 300 of the first embodiment is Two sets of 280-200903696 are arranged in the X direction so that the detecting device body 2 side faces each other. Use these 2 sets to form a group, Two groups are arranged at intervals in the Y direction. The space between the detection devices 300, For example, in a clean room, It can be used as a moving space for transporting a transport means (not shown) of the carrier C. Or as a means of exchanging detector cards, 6 inches of space. In the example of the brother 26, In the wafer chuck 4 4 Β temperature adjustment situation 'between 2 detection devices 300 arranged in the X direction, Relative to the center of its separation area, a thermostat 60 such as a cooler is provided in a point symmetrical manner, 60, The thermostat 60 and the detecting device 300 are connected by the temperature regulating medium flow path 61. If this configuration is used, It can reduce the installation space of the clean room detection device 300. [Second Embodiment] In the present embodiment, As shown in Fig. 27, the direction of the inspection unit 2 1 is changed by 90 degrees. To align the abutment 5Α, The detecting device body 2 is connected to the loading portion 1 in such a manner that the moving direction of the cymbal is perpendicular to the moving direction. The other structure is the same as that of the first embodiment. therefore, At this time too, The first inspection unit 21Α and the second inspection unit 21Β, The horizontal line HL is symmetrical with respect to the center. In the detecting device', as shown in the above 2nd figure, the exchange of the detector card 6A is performed by the swinging method. At this time, as described above, the exchange member 90 of the detector card 6A and the alignment abutment 5a interfere with each other. Therefore, as shown in Fig. 28, when the exchange of the detector card 6a is performed, The alignment abutment 5A is retracted to the retracted position on the side closer to the loading unit. Represents the exchange area of the detector card 6 A. As shown in Figure 29, The detecting device of this configuration is also 'the same as the aforementioned Fig. 2, The detecting device bodies 2 -29 to 200903696 can be arranged on both sides (X-axis direction) of the loading unit 1. At this time too, Similarly, the number of arms 20 can be increased to five. In the above embodiment, It can also be set as shown in Figure 30(a) (b): The shutter 1b that opens and closes the two transport ports 22a on the side surface of the apparatus main body 2 is opened. in particular, Around the port 22a, The side of the loading portion is surrounded by a sealing body 123 made of resin. The shutter 1 2 0 is lifted and lowered by the lifting mechanism and through the lifting shaft 122. Thereby, the opening and closing of the conveying port 2 2 a is performed. In this case, As long as the sealing body is used in addition to the wafer W! 2 3 to close the port 22a, The inspection unit 21A can be reduced, 21B between each other, Or the inspection department 2 1 A, The environmental atmosphere between the 2 1 B and the loading unit 1 affects each other. Therefore, in the inspection unit 21A, In 21B, For example, when the inspection unit 21A (21B) performs inspection of the wafer W, In the case where the other inspection unit 2 1 B ( 2 1 A ) performs maintenance (for example, exchanging the detector card 6), The atmosphere in which the inspection is conducted is not affected by the atmosphere in which the maintenance is performed. In addition, even the inspection unit 2 1 A, 2 1 respective temperature in B, The situation of environmental changes such as humidity can still maintain the environment or reduce the influence of the environment. The inspection of the wafer w is performed. [Other Modifications] In the above example, as shown in the aforementioned seventh figure, A micro camera 41 and a micro camera 42 are provided in the wafer chuck 4A. However, it is also possible to hold the micro camera 41 and the micro camera 42 from both sides (X-axis direction) as shown in Fig. 31. Further, a plurality of micro cameras 70 (for example, 2 -30 to 200903696) are provided. The miniature cameras 70, It is the same as the aforementioned micro camera 4 1 for confirming the tip of the probe 29. In the foregoing configuration, the area where the wafer chuck 4a moves in the X-axis direction can be reduced when the probe 29 is photographed, and the size of the detecting device body 2 can be reduced. Figure 3 2 shows that When one micro camera 41 is set, Shooting the probe 29 at both ends of the X-direction detector card 6A (6B), At 29 o'clock, the movement of the center of the wafer chuck 4 A ( 4 B ) is d 1 0. Figure 3 3 shows the situation of setting up three miniature cameras as shown in Figure 31. Shoot the probes at both ends of the detector card 6 A ( 6 B ) in the X direction. 2 9 o'clock wafer holder 4 A ( 4 B ) center of the movement stroke d 2 0. It is obvious that The latter movement stroke D 2 0 is significantly shortened compared to the former movement stroke d 1 0. In Fig. 31, there is shown an illustration of the omitted 4 4 and the advancing and retracting mechanism 4 3 . Further, since the areas of the probes 29 taken by the respective cameras (the micro camera 41 and the micro camera 70) are different, the amount of movement of the wafer chuck 4A can be reduced when a plurality of probes 29 are taken.
如第3 4圖所示’對於由微型攝影機4 1和微型攝影機 42所構成的第i攝影單元2丨〇 ,隔著晶圓夾頭上的晶 圓W裝載區域且以晶圓夾頭4 a ( 4 b )的中心爲中心而形 成點對稱的方式，配置與該第1攝影單元210的構造相同 的弟2攝影單元2n亦可。在本例中，第丨攝影單元21〇 的微型攝影機4 1和第2攝影單元2丨丨的微型攝影機4丨在 /軸方向分開’因此晶圓夾頭4a(4b)之X方向的移動 仃程變小，又由於兩微型攝影機41、4 1在Y方向隔著晶 夾"貝4A ( 4B )直徑的距離，故晶圓夾頭4A ( 4B )之Y -31 - 200903696 方向的移動行程，比起只有1個第1攝影單元2 01的情形 變成大致1半，而能縮小檢測裝置本體2的大小。在第 34(b)圖，爲了明確顯示其配置關係’雙方（紙面內面 及外側）的第1攝影單元2 1 0和第2攝影單元2 1 1是用實 線表示。 此外，以從兩側夾持這2台微型攝影機41和微型攝 影機42的方式，分別設置2台第3 1圖所示的微型攝影機 70亦可。 關於前述的檢測器卡6A，除了進行一次接觸的情形 以外，也可以是：以對應於依晶圓W的直徑而分割成2 個區域電極墊群的方式設置探針29，分2次來進行晶圓 W和探針29的接觸的情形；或是以對應於沿晶圓W的周 方向分割成4個區域的電極墊群的方式設置探針29，依 序讓晶圓W接觸該4個分割區域的情形。在這種情形， 是藉由旋轉晶圓夾頭4 A，來進行探針2 9和晶圓W的接 觸。在本發明的檢測裝置，較佳爲藉由1次〜4次的接觸 來完成晶圓W的檢查。 在上述例子，是使用3個微型攝影機45，但也能是2 個或4個，這時較佳爲，若微型攝影機45的數目有η個 ，則彼此的間隔爲晶圓W直徑的1 /η。 在上述各例子，臂部30數目有3個，同時進行2片 或3片晶圓W的搬運，來縮短搬運晶圓W所需的時間， 但即使臂部3 0數目比3個少的情形（例如1個），可按 照搬入各檢查部2 1的方向，藉由預對準機構3 9來調整晶 -32- 200903696 圓w的方向並修正偏心。 又，在檢測裝置本體2之各晶圓W的處理（精細對 準和電氣特性的評價試驗）是按照設定時間來完成時，如 上述般對各晶圓W依序進行處理，但例如預定搬運之第1 檢查部21A或第2檢查部21B的晶圓w處理發生問題等 而造成拖延，而導致下個預定在該預定搬運的第1檢查部 2 1 A或第2檢查部2 1 B進行處理的晶圓W無法搬運時等 的情形’由於如前述般在晶圓搬運機構3設有預對準機構 3 9 ’如以下所說明可更搬運場所，不拖延而繼續進行處理 〇 關於這種狀況，具體而言舉例如下。亦即爲了在第1 檢查部2 1 A進行處理，晶圓搬運機構3在下位置保持著 未處理的晶圓W，但第1檢查部2 1A內之晶圓W的處理 尙未完成，另一方面，在第2檢查部21B內的晶圓W處 理已完成的情形。 藉由晶圓搬運機構3保持的晶圓W，如前述般，晶圓 搬運機構3從第1載具C1搬出晶圓W接著下降時，是按 照預定的搬運場所（第1檢查部2 1 A )，來事先調整晶圓 W的方向。於是，如前述般，當晶圓W的搬運場所變更 的情形，爲了變成對應於變更場所（第2檢査部2 1 B )的 方向，和從載具C取出時同樣的，改變晶圓W的方向， 再將晶圓W搬入變更場所的第2檢查部2 1 B。如此般， 可按照實際進行晶圓W處理所需的時間來隨時變更搬運 場所，可節省檢測裝置本體2未進行處理之待機時間。 -33- 200903696 接著說明，位於波哥針單元28上方之測試器100的 絞鏈機構的一例。第3 5圖係顯示在檢測裝置本體2上設 置測試器1 〇 〇的狀態之俯視圖。在各測試器1 0 0的側面， 連接著L字型的旋動用板101。在旋動用板101之從測試 器1 00延伸出的部分之間，設有驅動構件1 03 (藉由馬達 1 0 2繞水平軸旋動）。在各板1 ο 1設有：能和驅動構件 103連結之連結構件104 (藉由未圖示的驅動部朝Y方向 進退）。將一方的連結構件1 04朝驅動構件1 03前進而和 驅動構件1 03連結，使另一方的連結構件1 04後退而成爲 解除連結狀態，藉由共同驅動部之馬達1 02，使一方的測 試器1〇〇及另一方的測試器100在接觸波哥針單元28的 位置和離開波哥針單元2 8的位置之間進行開閉。 第3 6圖、3 7圖顯示晶圓搬運機構3的一例。這些圖 是顯示，從載具C 1 ( C2 )依序取出晶圓W後搬入檢查部 21A、21B，進行檢查後再送回載具Cl (C2)的一連串的 流程。縱方向代表時間的流程，左端欄顯示處理狀態。在 左端欄中，「LotStart」代表開始進行包含從載具搬出晶 圓、檢查之一連串的流程，「Waf. 1 Start」代表用測試器 檢查Waf.l’ 「Waf. 1 End」代表結束Waf. 1的測試器檢查 。從左端起算第2欄及右端欄分別爲S t a g e 1、2，亦即代 表晶圓夾頭4 A、4 b的狀態；「W a f. 1」代表W a f · 1裝載於 該晶圓夾頭；「Alignment」代表從拍攝晶圓w及探針29 到計算接觸位置爲止的狀態；「T e s t」代表檢查晶圓的狀 態。「Waf.l」等的編號’是指載具Cl ( C2)內的晶圓的 -34- 200903696 取出順序。 從左端起算第3欄、第4欄及第5欄，分別代表 UpperArm (上段臂部 31) 、MiddleArm (中段臂部 32) 及Lower Arm (下段臂部33 )的狀態；Carrier代表將所保 持的晶圓交接至載具Cl (C2)內。 因此，各行是顯示，在某個時間帶晶圓夾頭4A、4B 的狀態、各臂部3 1〜3 3的保持狀態，亦即顯示順序程式的 排程的各步驟。第3 6圖就是顯示裝置的流程。依時間順 序來作說明，首先控制部 1 5 (參照第 2圖）產生「 Lots tart」的指示’藉由晶圓搬運機構3的上段臂部3 1及 中段臂部32分別將Waf.2及Waf.l從例如載具C1取出。 接著將Waf.l交接至載台1，以進行對準，並將Waf.2交 接至載台2。 然後對Waf. 1進行檢查，並對Waf.2進行對準，這時 3個臂部31〜3 3變成空的，因此載具C1會去接收接下來 的Waf.3、Waf.4。結果在上段臂部31保持Waf.4，在中 段臂部32保持Waf.3。接著開始進行Waf.2的檢查，然 後先檢查的Waf. 1的檢查完成。這時，下段臂部33變成 空的狀態，藉由該下段臂部33來從載台1接收Waf.l， 並將中段臂部32上的Waf.3交接至該載台1。 接著，對該Waf. 3進行對準，並將下段臂部3 3上的 Waf. 1送回載具C1 ’用變空的中段臂部3 2從載具C內接 收接下來的Waf.5。接著開始進行載台1上之Waf.3的檢 查，接下來完成載台2上之Waf.2的檢查。用變空的下段 -35- 200903696 臂部33來接收該Waf.2 ’將上段臂部3 1所保持的Waf.4 交接至載台2。對該Waf.4開始進行對準’並將下段臂部 33上的Waf.2送回載具C1 ’用變空的上段臂部31從載具 C1內接收接下來的Waf.6。接著對Waf.4開始進行檢查。 到此是關於開始檢查Waf·4爲止的說明。接下來同樣的進 行晶圓的搬運、檢查。 根據以上說明可知，在本例中，3個臂31〜33中， 是藉由上段臂部31及中段臂部3 2來進行從載具C 1到載 台1、2之晶圓搬運，藉由下段臂部33來進行從載台1、 2至載具C1之檢査完畢的晶圓搬運。 第3 6圖的下部之框內的步驟，代表在載台1發生問 題，經由操作員的對應來解除該問題的狀態。「 StagelAssist發生」及「StagelAssist解除」分別相當於 該問題發生及解除。框內的步驟，係接續於之前的 Waf. 10 Start的步驟。第37圖係接續於第36圖的步驟， 由於這些步驟群很長，故將圖式分割成2個。第37圖中 「StagelError發生」（隔離），代表載台1發生操作員 無法對應的問題’將該載台1從系統的運用隔離的狀態。 InitailStart、InitialEnd ’在該順序表的情形，是在As shown in Fig. 34, 'for the i-th image unit 2 consisting of the micro camera 4 1 and the micro camera 42, the area is loaded via the wafer W on the wafer chuck and the wafer chuck 4 a ( The center of 4 b ) is a point-symmetric system centered on the center, and the second image capturing unit 2 n having the same structure as that of the first imaging unit 210 may be disposed. In this example, the micro camera 4 1 of the second photographing unit 21 and the micro camera 4 of the second photographing unit 2 are separated in the /axis direction. Therefore, the movement of the wafer chuck 4a (4b) in the X direction is performed. The process is small, and because the two miniature cameras 41, 4 1 are separated by the distance of the crystal clip "B 4A ( 4B ) diameter in the Y direction, the movement of the wafer chuck 4A ( 4B ) in the direction of Y -31 - 200903696 In comparison with the case where only one first photographing unit 201 is used, it becomes substantially one and a half, and the size of the detecting device body 2 can be reduced. In the 34th (b)th view, the first photographing unit 2 1 0 and the second photographing unit 2 1 1 in order to clearly show the arrangement relationship 'both sides (inside and outside the sheet) are indicated by solid lines. Further, two micro cameras 70 shown in Fig. 3 may be provided so as to sandwich the two micro cameras 41 and the micro cameras 42 from both sides. In addition to the case where the contact is made once, the probe card 6A may be provided with the probe 29 so as to be divided into two area electrode pad groups in accordance with the diameter of the wafer W, and may be performed twice. a case where the wafer W is in contact with the probe 29; or a probe 29 is provided in such a manner as to correspond to an electrode pad group divided into four regions along the circumferential direction of the wafer W, and the wafer W is sequentially brought into contact with the four The case of dividing the area. In this case, the contact of the probe 29 and the wafer W is performed by rotating the wafer chuck 4 A. In the detecting device of the present invention, it is preferable to complete the inspection of the wafer W by one to four times of contact. In the above example, three micro cameras 45 are used, but it is also possible to use two or four. In this case, preferably, if the number of the micro cameras 45 is n, the interval between the two is 1 / η of the diameter of the wafer W. . In each of the above examples, the number of the arm portions 30 is three, and two or three wafers W are simultaneously transported to shorten the time required to transport the wafer W. However, even if the number of the arm portions 30 is smaller than three, (for example, one), the direction of the circle -32 - 200903696 circle w can be adjusted and the eccentricity can be corrected by the pre-alignment mechanism 39 in the direction in which the inspection unit 21 is carried. Further, when the processing (fine alignment and evaluation of electrical characteristics) of each wafer W of the apparatus main body 2 is completed in accordance with the set time, the wafers W are sequentially processed as described above, but for example, predetermined transportation is performed. The wafer w processing of the first inspection unit 21A or the second inspection unit 21B causes a problem such as a delay, and the next inspection unit 2 1 A or the second inspection unit 2 1 B scheduled to be transported next is scheduled to be performed. In the case where the processed wafer W cannot be transported, etc., the pre-alignment mechanism 3 9 ' is provided in the wafer transfer mechanism 3 as described above, and the place can be further transported as described below, and the processing is continued without delay. The conditions are specifically as follows. That is, in order to perform the processing in the first inspection unit 2 1 A, the wafer transfer mechanism 3 holds the unprocessed wafer W at the lower position, but the processing of the wafer W in the first inspection unit 2 1A is not completed, and the other On the other hand, the processing of the wafer W in the second inspection unit 21B is completed. As described above, when the wafer transport mechanism 3 carries the wafer W from the first carrier C1 and then descends, the wafer transport mechanism 3 follows the predetermined transport location (the first inspection unit 2 1 A). ), to adjust the direction of the wafer W in advance. Then, when the transportation place of the wafer W is changed, the wafer W is changed in the same direction as when the carrier C is taken out in the direction corresponding to the changed position (second inspection unit 2 1 B ). In the direction, the wafer W is carried into the second inspection unit 2 1 B of the changed place. In this manner, the transportation place can be changed at any time in accordance with the time required for actually performing the wafer W process, and the standby time in which the detection device main body 2 is not processed can be saved. -33- 200903696 Next, an example of a hinge mechanism of the tester 100 located above the Bogota unit 28 will be described. Fig. 5 is a plan view showing a state in which the tester 1 〇 is placed on the detecting device body 2. An L-shaped rotation plate 101 is connected to the side surface of each tester 100. Between the portions of the rotation plate 101 extending from the tester 100, a drive member 103 (rotated by a motor 1 0 2 about a horizontal axis) is provided. Each of the plates 1 ο 1 is provided with a connecting member 104 (which is movable in the Y direction by a driving unit (not shown)) that can be coupled to the driving member 103. One of the connecting members 104 is advanced toward the driving member 103 and connected to the driving member 030, and the other connecting member 104 is retracted to be disconnected, and the test is performed by the motor 102 of the common driving unit. The tester 100 of the other side and the tester 100 of the other side open and close between a position contacting the Bogota unit 28 and a position away from the Bogota unit 28. An example of the wafer transport mechanism 3 is shown in Figs. 3-6 and 37. These figures show a series of processes in which the wafers W are sequentially taken out from the carrier C 1 (C2) and then carried into the inspection units 21A and 21B, and then returned to the carrier C1 (C2). The vertical direction represents the flow of time, and the left end column shows the processing status. In the left column, "LotStart" represents the beginning of a process that involves moving the wafer out of the carrier and checking one of the series. "Waf. 1 Start" means checking the Waf.l' with the tester. "Waf. 1 End" means ending the Waf. 1 tester check. From the left end, the second column and the right end column are respectively Stage 1, 2, which means the state of the wafer chuck 4 A, 4 b; "W a f. 1" represents the W af · 1 loaded on the wafer holder. Head; "Alignment" represents the state from the wafer w and probe 29 to the calculation of the contact position; "T est" represents the state of the wafer. The number "Waf.l" or the like refers to the order of -34-200903696 taken out of the wafer in the carrier Cl (C2). Columns 3, 4, and 5 from the left end represent the states of the UpperArm (upper arm 31), MiddleArm (middle arm 32), and Lower Arm (lower arm 33); the carrier representative will maintain The wafer is transferred to the carrier Cl (C2). Therefore, each row is a step of displaying the state in which the wafer chucks 4A, 4B are held at a certain time and the holding state of each of the arm portions 3 1 to 3 3, that is, the schedule of the display sequence program. Figure 36 is the flow of the display device. In the chronological order, first, the control unit 15 (see FIG. 2) generates an instruction of " Lots tart". By the upper arm portion 31 and the middle arm portion 32 of the wafer transport mechanism 3, Waf. 2 and The Waf.l is taken out from, for example, the carrier C1. Waf.l is then handed over to stage 1 for alignment and Waf.2 is handed over to stage 2. Then, the Waf. 1 is inspected and the Waf. 2 is aligned, at which time the three arms 31 to 3 3 become empty, so the carrier C1 will receive the next Waf. 3, Waf. As a result, Waf.4 is held in the upper arm portion 31, and Waf.3 is held in the middle arm portion 32. Then start the inspection of Waf.2, and then check the Waf. 1 check. At this time, the lower arm portion 33 is in an empty state, the lower arm portion 33 receives the Waf.l from the stage 1, and the Waf.3 on the middle arm portion 32 is transferred to the stage 1. Next, the Waf. 3 is aligned, and the Waf. 1 on the lower arm portion 3 3 is sent back to the carrier C1 'to receive the next Waf.5 from the carrier C with the empty intermediate arm portion 3 2 . Next, the inspection of Waf. 3 on the stage 1 is started, and then the inspection of the Waf. 2 on the stage 2 is completed. The Waf.2 is received by the lower portion -35-200903696 arm portion 33 to transfer the Waf.4 held by the upper arm portion 3 1 to the stage 2. The Waf.4 is initially aligned and the Waf.2 on the lower arm 33 is returned to the carrier C1' to receive the next Waf.6 from the carrier C1 with the empty upper arm 31. Then start checking for Waf.4. This is the description about starting the inspection of Waf·4. Next, the wafer is transported and inspected in the same manner. As can be seen from the above description, in the present example, the wafers from the carrier C 1 to the stages 1 and 2 are transported by the upper arm portion 31 and the middle arm portion 32 in the three arms 31 to 33. The inspection of the wafers from the stages 1 and 2 to the carrier C1 is performed by the lower arm portion 33. The step in the lower frame of Fig. 3 represents a problem in the stage 1, and the state of the problem is released by the operator's correspondence. "StagelAssist" and "StagelAssist Release" are equivalent to the occurrence and removal of this problem. The steps in the box are continued from the previous Waf. 10 Start steps. Figure 37 is a continuation of the steps of Figure 36. Since these steps are very long, the pattern is divided into two. In Fig. 37, "StagelError occurs" (isolation), which indicates that the operator 1 cannot respond to the problem of the stage 1. The stage 1 is isolated from the operation of the system. InitailStart, InitialEnd ’ in the case of the sequence table is
Stagel發生錯誤，爲了解除該錯誤而進行初始化（初始化 是操作員用開關來進行，其處理是進行內部資料的初始化 、載台關係的初始化）。該初始化開始用「lnitailStart」 代表，其結束用「InitialEnd」代表。又「IfWaf 9 Tested 」及「If Waf. 9 Untested」代表，Waf · 9檢查後的情形及 -36- 200903696 未檢查的情形。第37圖的「Stagei/2 表’載台1、2連續進行清淨化，清淨 圓：NPW來硏磨（polish)探針的針尖。 第38圖及第39圖’是在用來實施 的順序之裝置（例如第1實施形態的裝 機構3的臂部數目爲2個時的順序。從 當檢查部2 1 ( 2 1 B )發生問題的情形， 生問題而成晶圓無法搬入該載台，之後 除時，或是在檢查部2 1 ( 2 1 B )進行探 圓搬運機構3的臂部數目爲3個的情形 產能更高。 第4 0圖顯示第2圖的控制部1 5 & 代表CPU，152代表用來進行檢測裝置 程式，1 5 3代表收容有在檢查部2 1 B ( 的選單之選單收容部，154代表用來設 或運轉模式、或進行與運轉有關的各ί 1 5 5代表匯流排。操作部1 5 4例如是由 所構成，第4 1圖顯示其操作畫面的一音[； 第41圖，160代表用來設定連續 出模式之一）的軟開關。將該開關1 60 運用。 亦即，將對應於一個批次之載具C 出，當最後的未檢查晶圓例如用中段臂 該中段臂部32裝載前述未檢查晶圓的 同時Cleaning」代 化是使用專用的晶 第36圖、第37圖 置）中，晶圓搬運 這些順序可看出， 例如載台1或2發 當該載台的問題解 針的清淨化時，晶 比數目爲2個時的 5構造的一例。1 5 1 的一連串的動作之 2 1 B )進行的檢查 定檢測裝置的參數 重操作之操作部， 觸控面板等的畫面 $分的一例。 批次功能（晶圓取 接通可進行以下的 1內的晶圓依序取 部32取出時，在 狀態下，將對應於 -37- 200903696 下個批次之載具C2內的先頭未檢查晶圓例如用上段臂部 31取出。簡單的說’在第36圖中若Waf. 9相當於載具C1 內的最後晶圓’則waf. 1 0相當於載具C2內的先頭未檢查 晶圓。 亦即所進行的運用’是在晶圓搬運機構3的一個臂部 裝載上一批次（例如載具C1)的晶圓時，在該晶圓搬入 檢查部之前將下一批次（例如載具C 2 )的晶圓用其他臂 部取出。若進行這樣的運用’在連續處理不同批次時可獲 得局產能。 當並未設定這種連續批次功能時，在晶圓搬運機構3 的臂部上將上一批次（載具）的晶圓搬入檢查部後，再將 下一批次（載具）的晶圓取出。 161代表用來設定連續搬入功能（載台搬運模式之— )的軟開關。將該開關161接通可進行以下的運用。亦即 ’當一個載具內的晶圓裝載於晶圓夾頭4 A、4 B的一方時 ’若另一方的晶圓夾頭是空的，將另一載具內的晶圚搬入 該空的晶圓夾頭。即使一個載具之最後的未檢查晶圓在一 方的晶圓夾頭上進行檢查’另一載具之先頭的未檢查晶圓 仍可搬入另一方的晶圓夾頭上。 1 62代表用來設定載具分配功能之軟開關。將該開關 162接通時’會出現將對2個裝載埠12、13分配檢查部 的畫面，而進行該分配。例如將裝載於裝載埠丨2上的載 具內的晶圓搬運至第1檢查部21A，將裝載於裝載埠13 上的載具內的晶圓搬運至第2檢查部21B，以這種方式進 -38- 200903696 行分配。 1 63代表用來設定批次分配功能之軟開關。將該開關 163接通時，從裝載於一個裝載埠12(13)之載具會依序 將晶圓搬運至空的晶圓夾頭。該功能例如可適用於裝載埠 12、13雙方’也能透過其他的畫面而將該功能僅適用於 一方的裝載淳。 1 64代表用來設定檢查部的選單之軟開關。將該開關 164接通時’會出現選單設定畫面，可對各檢查部設定選 單。在檢查部21A、21B，可設定共用的選單，也能設定 不同的選單。作爲選單的設定例，例如包括：晶圓夾頭溫 度的設定’設定成檢查晶圓上所有的晶片或一部分的晶片 (例如僅檢查判定成不良的晶片）等等。 1 65代表用來設定連續檢查功能之軟開關。將該開關 1 65接通時’會出現詳細設定畫面，決定檢查部的順序後 ，依照該順序將晶圓從2個檢查部2 1 A ( 2 1 B )的一方搬 運至另一方。例如晶圓在檢查部21A檢查後，不送回載 具而在檢查部2 1 B進行檢查。在這個情形，例如在檢查部 2 1 A是對所有的晶片進行檢查，在檢查部2 1 B僅對在檢查 部2 1 A判斷爲不良的晶片進行檢查。又在這個情形，例 如在檢查部2 1 B可對不良的晶片予以標記。也可以是在檢 查部2 1 A以第1溫度進行檢查’在檢查部2 1 B以第2溫 度進行檢查。又當將開關1 6 5斷開時’晶圓僅在一方的檢 查部進行檢查。 1 6 6代表用來設定晶_夾頭代替功能的軟開關。若將 -39 - 200903696 該開關166接通，當一方的檢查部21A(21B)發生異常 時，可藉由另一方的檢查部21B(21A)來進行代替處理 〇 在本發明，對2個檢查部21A、21B可使用共通的測 試器，在2個晶圓夾頭4A、4B上裝載晶圓’藉由前述測 試器來同時進行檢查。這時，例如是採用：設置與檢測裝 置本體2不同的共通測試器’將檢測器卡6A、6B各個和 測試器用纜線來連接。 在此說明，裝載於第2圖、第3圖及第5圖等記載的 對準橋台5A、5B之第2攝影手段的較佳例。先前的例子 如第14圖等所示，係設有3個高倍率攝影機之微型攝影 機4 5，在以下的例子是設置2個微型攝影機。對準橋台 5 A、5 B由於構造相同，僅針對一方的對準橋台5 A來作 說明。在以下的說明，爲方便說明’以X方向（參照第2 圖）爲左右方向。 在對準橋台5A，如第42圖所示，對於將該對準橋台 5 A左右2等分的中心線3 0 0，以對稱的方式設置微型攝 影機301、302和微型攝影機401、402。微型攝影機301 、3 02 ’如第2圖所示，比微型攝影機401、402更接近第 1檢查部21A及第2檢查部21B的邊界（水平線HL)側 。微型攝影機301、302和中心線3 00的距離1例如爲 73mm ’微型攝影機401、402和中心線3 00的距離Γ例如 爲 4 5 mm。 依據此構造，如以下所說明可縮小晶圓夾頭4A的移 -40- 200903696 動區域。爲了進行晶圓W和探針29的對準的作業之一， 是藉由微型攝影機301、302來觀察晶圓W的左右兩端部 分的對準標記，或在檢查後可能會看到晶圓W上的針跡 ，因此可能會讓晶圓W的左右兩端部位位在微型攝影機 30 1、302的正下方。第43圖顯示在進行這種操作時之晶 圓夾頭4A移動的樣子。如第43(a)圖所示，在對準橋 台5 A的下方位置，以對準橋台5 A的中心線3 0 0和晶圓 W的中心C重疊的方式來設置晶圓W。若要用微型攝影 機3 01來拍攝晶圓W的左側區域，如第43 ( b )圖所示， 以晶圓W的左端位於微型攝影機3 0 1正下方的方式讓晶 圓夾頭4A朝X方向移動。這時相對於第43 ( a )圖，晶 圓夾頭4A的移動量爲Ml。若是3 00mm的晶圓W，則Ml 爲 7 7 mm ° 第44圖顯示X方向之晶圓W全體的移動量。如第 4 4圖所示，以晶圓W的中心C位於對準橋台5 A的中心 線3 00的狀態爲基準，相對於該基準狀態，晶圓W朝左 側區域及右側區域移動的量分別爲Μ 1。本例中由於是使 用300mm的晶圓W，Ml爲77mm，晶圓W全體的移動量 爲 15 4mm。 第45圖顯示在對準橋台5A安裝1個微型攝影機301 的情形，在這個情形，是先讓晶圓W的中心位於微型攝 影機3 0 1的正下方後，讓晶圚夾頭4 A朝X方向移動以使 晶圓W的左右兩端部分別位於微型攝影機3 0 1的正下方 ，因此第45圖所示之晶圓W移動至左側區域及右側區域 -41 - 200903696 的量M2，是相當於該晶圓W的半徑。本例中，由於是使 用3 00mm的晶圓w，M2爲150mm，晶圓W全體的移動 量爲3 00mm。 再者’爲了求出晶圓W上的理想座標（以晶圓中心 爲原點之各晶片的電極墊的座標）和晶圓夾頭4A的驅動 系統的實際座標（朝X、Y方向移動既定量時的馬達的編 碼器的脈衝數）的關係，係藉由拍攝晶圓W上的複數點 來進行。這時，例如包括：晶圓W的中心、沿著分割線 (分別朝X方向及Y方向延伸而通過晶圓W的直徑）而 設於晶片緣部之4個對準標記共合計5點，對這5點的對 準用標記由微型攝影機3 0 1、3 0 1分擔來進行拍攝，比起 僅使用1個微型攝影機的情形，晶圓夾頭4A的移動量較 少，且移動所需的時間變短。An error occurs in Stagel, and initialization is performed in order to cancel the error (initialization is performed by the operator using a switch, and the processing is to initialize the internal data and initialize the stage relationship). The initialization starts with "lnitailStart" and ends with "InitialEnd". Also, "IfWaf 9 Tested" and "If Waf. 9 Untested" represent the situation after Waf · 9 inspection and -36- 200903696 unchecked. Figure 37 "Stagei/2 table" stage 1, 2 continuous cleaning, clear circle: NPW to polish the probe tip. Figure 38 and Figure 39 are in the order used for implementation The device (for example, the order of the number of the arm portions of the mounting mechanism 3 of the first embodiment is two. When a problem occurs in the inspection unit 2 1 ( 2 1 B ), the wafer cannot be loaded into the stage. In the case of the following, when the number of the arm portions of the rounding transport mechanism 3 is three in the inspection unit 2 1 ( 2 1 B ), the capacity is higher. Fig. 40 shows the control unit 1 5 & of Fig. 2 On behalf of the CPU, 152 stands for the test device program, 1 5 3 stands for the menu house containing the check unit 2 1 B (the menu is used to set or operate the mode, or for each operation related to the operation) 1 5 5 represents a bus bar. The operation unit 1 5 4 is constituted by, for example, a picture showing a sound of its operation screen [Fig. 41, 160 represents a soft switch for setting one of the continuous output modes). The switch 1 60 is applied. That is, the carrier C corresponding to one batch is output, when the last unchecked wafer, for example In the middle arm, the middle arm 32 is loaded with the unchecked wafer, and the cleaning is performed using a dedicated crystal 36, 37, and the order of wafer handling can be seen, for example, the stage 1 or In the case of the cleaning of the problem of the stage, the number of the crystal structures is two, and the number of the crystal structures is two. 1 5 1 A series of actions 2 1 B) Checking the parameters of the detection device The operation unit of the re-operation, the screen of the touch panel, etc. The batch function (when the wafer is turned on and the wafer sorting unit 32 in the following 1 can be taken out, in the state, the head in the carrier C2 corresponding to the next batch of -37-200903696 is not checked. The wafer is taken out, for example, by the upper arm portion 31. Simply saying that, in Fig. 36, if Waf. 9 corresponds to the last wafer in the carrier C1, then waf. 1 0 corresponds to the first unchecked crystal in the carrier C2. The application "is performed when a wafer of the previous batch (for example, the carrier C1) is loaded on one arm of the wafer transport mechanism 3, and the next batch is taken before the wafer is carried into the inspection portion ( For example, the wafer of the carrier C 2 ) is taken out by other arms. If such an operation is performed, the local production capacity can be obtained when continuously processing different batches. When the continuous batch function is not set, the wafer handling mechanism The wafer of the previous batch (carrier) is carried into the inspection unit on the arm of 3, and the wafer of the next batch (carrier) is taken out. 161 represents the function of setting the continuous loading function (stage conveying mode). Soft switch of -). The switch 161 is turned on to perform the following operations. That is, when a carrier When the wafer is loaded on one of the wafer chucks 4 A, 4 B 'If the other wafer chuck is empty, the wafer in the other carrier is carried into the empty wafer chuck. Even one The last unchecked wafer of the carrier is inspected on one of the wafer chucks. The unchecked wafer at the head of the other carrier can still be loaded onto the other wafer chuck. 1 62 represents the assignment of the carrier. Soft switch of function. When the switch 162 is turned on, 'the screen for assigning the inspection unit to the two loading cassettes 12 and 13 will appear, and the allocation will be performed. For example, the crystal loaded in the carrier loaded on the cassette 2 The wafer is conveyed to the first inspection unit 21A, and the wafer loaded in the carrier mounted on the magazine 13 is transported to the second inspection unit 21B, and is distributed in the manner of -38-200903696 in this manner. The soft switch of the secondary distribution function. When the switch 163 is turned on, the carrier is sequentially transported from the carrier loaded on one loading cassette 12 (13) to the empty wafer chuck. This function can be applied, for example, to loading.埠12,13 both sides can also use this function only for one of the other pictures. 1 64 represents a soft switch for setting the menu of the inspection unit. When the switch 164 is turned on, the menu setting screen will appear, and a menu can be set for each inspection unit. In the inspection units 21A and 21B, a common menu can be set. As a setting example of the menu, for example, the setting of the wafer chuck temperature is set to check all the wafers or a part of the wafer on the wafer (for example, only the wafer determined to be defective), etc. 1 65 represents a soft switch for setting the continuous check function. When the switch 1 65 is turned on, 'the detailed setting screen will appear, and after determining the order of the inspection unit, the wafer will be taken from the two inspection units 2 1 A in this order ( 2 One of the 1 B) is transported to the other party. For example, after the inspection by the inspection unit 21A, the wafer is inspected by the inspection unit 2 1 B without returning the carrier. In this case, for example, in the inspection unit 2 1 A, all the wafers are inspected, and in the inspection unit 2 1 B, only the wafers judged to be defective in the inspection unit 21 A are inspected. Also in this case, for example, the defective wafer can be marked at the inspection portion 2 1 B. The inspection unit 2 1 A may perform the inspection at the first temperature. The inspection unit 2 1 B may perform the inspection at the second temperature. When the switch 165 is turned off, the wafer is inspected only in one of the inspection units. 1 6 6 represents a soft switch used to set the crystal_clip replacement function. When the switch 166 is turned on at -39 - 200903696, when an abnormality occurs in one of the inspection units 21A (21B), the other inspection unit 21B (21A) can perform the replacement processing. In the present invention, two inspections are performed. The portions 21A and 21B can simultaneously mount the wafers on the two wafer chucks 4A and 4B using a common tester. The inspection is performed simultaneously by the aforementioned tester. At this time, for example, a common tester different from the detecting device body 2 is provided, and each of the detector cards 6A, 6B and the tester are connected by a cable. Here, a preferred example of the second imaging means mounted on the alignment abutments 5A, 5B described in Figs. 2, 3, and 5 will be described. The former example is a micro camera 45 having three high-magnification cameras as shown in Fig. 14, and in the following example, two micro cameras are provided. The alignment abutments 5 A, 5 B are identical in construction, and are explained only for one alignment abutment 5 A . In the following description, for convenience of explanation, the X direction (see Fig. 2) is the left-right direction. In the alignment abutment 5A, as shown in Fig. 42, the micro cameras 301, 302 and the micro cameras 401, 402 are disposed in a symmetrical manner with respect to the center line 300 of the alignment abutment 5A which is equally divided into two. As shown in Fig. 2, the micro cameras 301 and 3 02' are closer to the boundary (horizontal line HL) side of the first inspection unit 21A and the second inspection unit 21B than the micro cameras 401 and 402. The distance 1 between the micro cameras 301, 302 and the center line 300 is, for example, 73 mm. The distance 微型 between the micro cameras 401, 402 and the center line 300 is, for example, 4 5 mm. According to this configuration, the movement of the wafer chuck 4A can be reduced as explained below. In order to perform the alignment of the wafer W and the probe 29, the alignment marks of the left and right end portions of the wafer W are observed by the micro cameras 301, 302, or the wafer may be seen after the inspection. The stitches on W may cause the left and right end portions of the wafer W to be positioned directly below the micro cameras 30 1 and 302. Fig. 43 shows how the wafer chuck 4A moves when this operation is performed. As shown in Fig. 43(a), at a position below the alignment abutment 5A, the wafer W is disposed such that the center line 300 of the alignment abutment 5A overlaps with the center C of the wafer W. To use the micro camera 3 01 to capture the left side of the wafer W, as shown in Fig. 43 (b), the wafer chuck 4A is facing X as the left end of the wafer W is located directly below the micro camera 310. Move in direction. At this time, with respect to Fig. 43 (a), the amount of movement of the wafer chuck 4A is M1. In the case of a wafer W of 300 mm, M1 is 7 7 mm. Fig. 44 shows the amount of movement of the entire wafer W in the X direction. As shown in FIG. 4, the amount of movement of the wafer W toward the left side region and the right side region with respect to the reference state is based on the state in which the center C of the wafer W is located at the center line 300 of the alignment abutment 5A. For Μ 1. In this example, since 300 mm of wafer W is used, Ml is 77 mm, and the total amount of movement of the wafer W is 15 4 mm. Fig. 45 shows a case where one micro camera 301 is mounted on the alignment abutment 5A. In this case, the center of the wafer W is placed immediately below the micro camera 310, and the wafer chuck 4 A is directed to X. The direction is moved so that the left and right end portions of the wafer W are located directly below the micro camera 310, so that the wafer W shown in Fig. 45 is moved to the amount M2 of the left region and the right region -41 - 200903696, which is equivalent The radius of the wafer W. In this example, since the wafer w of 300 mm is used, M2 is 150 mm, and the total amount of movement of the wafer W is 300 mm. Furthermore, in order to obtain the ideal coordinates on the wafer W (the coordinates of the electrode pads of the wafers with the wafer center as the origin) and the actual coordinates of the drive system of the wafer chuck 4A (the movement in the X and Y directions is predetermined) The relationship between the number of pulses of the encoder of the motor at the time of measurement is performed by capturing a plurality of points on the wafer W. In this case, for example, the center of the wafer W and the four alignment marks provided on the edge of the wafer along the dividing line (the diameters of the wafer W extending in the X direction and the Y direction, respectively) are combined to form a total of five points. The alignment marks of the five points are shared by the micro cameras 3 0 1 and 301, and the amount of movement of the wafer chuck 4A is small and the time required for the movement is smaller than when only one micro camera is used. Shortened.
第46圖至第48圖顯示微型攝影機401、402的使用 方法。在第46圖，係拍攝晶圓W的4點E1〜E4來求出各 個的座標位置，並求取連結E1、E3這2點的直線及連結 E2、E4這2點的直線的交點，該交點成爲晶圓w的中心 點（中心座標）C。連結El、E3 ( E2、E4 )的直線長度 成爲晶圓W的直徑。就算是公稱300mm的晶圓W，實際 上晶圓W的直徑與3 00mm稍有誤差，爲了正確地製作出 晶圓W上的晶片地圖（各電極墊的座標），必須掌握晶 圓W的中心座標和直徑。又在晶圓上的座標系（所謂理 想座標系）各晶片的電極墊的登記位置，係以相對於晶圓 W的中心座標之相對位置來儲存，因此必須求出晶圓W -42- 200903696 的中心座標。 第46圖中的E2、E3’隔著既定的距離，藉由使晶圓 W朝Y方向移動，E2、E3間的線段會朝Y方向移動，該 線段和晶圓W周緣的交點爲E1、E4。在本例，如第47 ( 0( b )圖所示，藉由微型攝影機401、402來依序拍攝 晶圓W的第47圖中的下半部的左右，以求出E2、E3的 位置。接著晶圓W朝Y方向移動，而如第48(a) ( b ) 圖所示，藉由微型攝影機401、402來依序拍攝晶圓w的 第4 8圖中的上半部的左右，以求出E 1、E4的位置。 另一方面，當微型攝影機只有1個時，必須依序將夾 頭移動至對應於晶圓W上的4點的位置，在本例中，e i 、E3 (或E2、E4 )這2點構成的組能藉由微型攝影機 4 0 1、4 0 2的切換而大致同時確認，在進行E 1、E 3的確認 後，只要讓晶圓夾頭4A朝Y方向移動1次即可。因此能 在短時間進行晶圓W的周緣位置4點的攝影。又在使用2 個微型攝影機401、402的情形，較佳爲相對於前述中心 線300設成左右對稱。其理由在於，在藉由微型攝影機 401、402來分擔晶圓W的左右區域的攝影時，相對於中 心線3 00晶圓夾頭4 A的移動區域爲左右對稱，若和藉由 微型攝影機3 0 1、3 02拍攝晶圓W時的移動區域重疊，結 果晶圓夾頭4A的移動區域比非對稱的情形更小。當然， 微型攝影機401、402的配置也可以是，相對於前述中心 線3 0 0呈非對稱。 微型攝影機3 0 1、3 02，係在光學系統的光路上設置 -43- 200903696 變倍機構，藉由控制變倍機構以獲得：倍率梢低於當 倍率攝影機使用時之倍率的視野（中間視野）。當作 率攝影機使用時之倍率’是程度高到能確認電極墊上 跡的倍率，例如視野內僅存在1個電極墊的倍率。# 操作員確認電極墊上的針跡時，用微型攝影機401. 看不到針跡，用微型攝影機3 1 0、3 02只能逐—確認 墊而須花費長時間，而藉由中間視野一次就能看到複 電極墊，因此能高效率地確認是否有針跡。又在前述 攝晶圓W上的對準用5點時，也能使用此中間視野。 基於上述說明，藉由使用2組的微型攝影機及微 影機的組合，在對於探針29進行晶圓W的對準時之 夾頭4 A的移動量，比1組的情形少，能謀求產能的 及裝置的小型化。又在裝置規格是屬於晶圓夾頭的移 較小的情形，用1組的微型攝影機和微型攝影機的組 法觀察整體晶圓，因此也適用於這種裝置規格。 [實施例] 關於前述第1實施形態所說明之晶圓W交換時 圓搬運機構3的動作順序，將臂部30數目爲3個的 (本發明）和2個的情形（習知例）作比較。關於 3 0數目以外的裝置等等，是採用相同的構造。 如前述般，當臂部3 0數目爲3個的情形，可不 過匣C和預對準機構39而對第1檢查部21A及第2 部21B連續依序搬運晶圓W，但在臂部30爲2個的 作高 高倍 的針 查後 402 電極 數個 之拍 型攝 晶圓 提昇 動量 合無 之晶 情形 臂部 須透 檢查 情形 -44 - 200903696 ，在第1檢查部21A搬入晶圓W後，在朝第2檢查部 2 1 B搬運晶圓W前，必須對匣C或預對準機構3 9進行存 取。第4 9圖係示意顯示這時的晶圓搬運機構3的動作。 第4 9圖中，左側（1 )是顯示臂部3 0數目爲3個的情形 ，右側（2 )是顯示臂部30數目爲2個的情形。在（i ) ，從上段側至下段側以（A )〜（F )的順序進行晶圓w的 處理（搬運）：在（2 ) ’從上段側至下段側以（a )〜（g )的順序進行晶圓W的處理（搬運）。這時晶圓搬運機 構3的動作，在以下的例子是在2個晶圓夾頭4A、4b分 別進行晶圓W1、W2的檢查，針對該晶圓w 1、W2和後 續之未檢查的晶圓W 3、W 4交換時的流程作具體說明。 如第4 9 ( 1 )圖所示’當臂部3 0數目爲3個的情形 ，例如分別藉由上段臂部3 1 ( U p p e r )及中段臂部3 2 ( Middle )來搬運未檢查的晶圓W3及晶圓W4 ( A )。這時 在晶圓夾頭4A之晶圓W1的檢查結束前，是對該晶圓W3 、W4進行前述的預對準步驟和OCR步驟。接著，當在晶 圓夾頭4A的檢查結束時’例如用下段臂部33 ( L0wer ) 來回收檢查完畢的晶圓W1(B)。然後，將上段臂部31 的晶圓W3裝載於該晶圓夾頭4A ( C )。接著，將在晶圓 夾頭4B之檢查完畢的晶圓W2用上段臂部3 1予以回收（ D)，將中段臂部32的晶圓W4裝載於晶圓夾頭4B(e) 。結果在晶圓搬運機構3回收檢查完畢的晶圓wi、W2， 在晶圓夾頭4A、4B裝載未檢查的晶圓W3、W4而進行檢 查（F)。如此般在晶圓搬運機構3設置3個臂部30，可 -45- 200903696 在該等臂部30保持2片未檢查的晶圓’並依序將晶圓W 搬運至第1檢查部21A和第2檢查部21B。 另一方面，當臂部30數目爲2個的情形’如第49( 2 )圖所示，例如藉由上段臂部3 1來搬運未檢查的晶圓 W3 ( a )。這時也是，在晶圓夾頭4A之晶圓W1的檢查 結束前，是對該晶圓W 3進行前述的預對準步驟和0 c R 步驟。接著，當在晶圓夾頭4A的檢查結束時，用下段臂 部3 3來回收檢查完畢的晶圓W1 ( b )。然後，將上段臂 部3 1的晶圓W3裝載於晶圓夾頭4A ( c )。接著，讓晶 圓搬運機構3上昇至上位置（爲了進行其與載具C之交接 )，將晶圓W1送回載具C，並將後續的晶圓W4例如用 上段臂部3 1取出（d )。接著，對該晶圓W4進行預對準 (Prealign)步驟和OCR步驟（對OCR匣進行存取）（e )。然後，將在晶圓夾頭4B之檢查完畢的晶圓W2回收 (f)，將上段臂部31的晶圓W4裝載於晶圓夾頭4B ( g )。 關於上述晶圓搬運機構3的流程，第5 0圖槪略顯示 搬運未檢查的晶圓w 1、W2時的經過時間。上段側顯示臂 部30數目爲3個的例子（1)，下段側顯示臂部30數目 爲2個的例子（2)。在第50圖，左端的「3個臂部」或 「2個臂部」項目的右側項目（「1 st/2nd Wafer」、「1st Wafer」' 「2nd Wafer」、「3rd Wafer」），分別是顯示 對第幾片的晶圓W進行處理，其更右側的項目顯示對晶 圓W進行處理的內容。 -46 - 200903696 在第50圖中’對應於前述步驟（a)〜（F) 、（a) 〜（g ) ’係賦予相同的英文字母。圖中，橫軸代表經過時 間。在第50圖顯示出，在上述第49圖中省略圖示之預對 準步驟。在圖中’ 「Shutter」代表讓設於檢查部21的搬 運口 22a的未圖不的開閉器打開的步驟；「Alignment」 代表在檢查部2 1進行的精細對準步驟；「wafer Load」代 表朝檢查部21搬入晶圓w的步驟；「Wafer取出」代表 從載具C取出晶圓w的步們；「Front ( Rear ) Stage」 代表晶圓夾頭4A ( 4B )。 由第50圖可知，藉由將臂部30數目由2個增加成3 個，可提高晶圓W的搬運效率而使搬運晶圓w所需的時 間變得極短’可縮短從開始動作至第2片晶圓W2搬入結 束所需的時間、以及從開始搬入第1片晶圓W1至第2片 晶圓W 2搬入結束所需的時間。因此可知，藉由將臂部3 〇 數目增加爲3個’可提高檢測裝置的產能。又關於臂部 30數目爲2個的例子’是將晶圓wi、W2、W3分段顯示 。又在前述第4 9圖所說明之進行晶圓w交換的情形，如 第5 0圖的最下段所示，必須花費多餘的時間以將晶圓w 1 送回（收容於）載具C。 【圖式簡單說明】 第1圖係顯示本發明的第1實施形態之檢測裝置一例 的全體之槪略立體圖。 第2圖係顯示上述檢測裝置的一例之槪略俯視圖。 -47- 200903696 第3圖係顯示上述檢測裝置的一例之縱截面圖。 第4圖係顯示上述檢測裝置的裝載埠的一例的立體圖 〇 第5圖係顯示上述檢測裝置的晶圓搬運機構的一例之 槪略圖。 第6圖係顯示上述檢測裝置的檢查部的一例之立體圖 〇 第7(a) ( b )圖係顯示上述檢査部的—例之槪略圖 〇 第8圖係顯示上述檢查部的對準橋台的位置之俯視圖 〇 第9圖係顯示上述檢查部的晶圓夾頭的移動行程一例 之槪略圖。 第1 0圖係顯示上述檢測裝置的作用的一例之俯視圖 〇 第1 1圖係顯示上述檢測裝置的作用的一例之俯視圖 〇 第1 2圖係顯示上述檢測裝置的作用的一例之俯視圖 〇 第1 3圖係顯示上述檢測裝置的作用的一例之俯視圖 〇 第1 4圖係顯示藉由第2攝影手段來拍攝晶圓上的特 定點時之晶圓夾頭的移動範圍之俯視圖。 第1 5圖係顯示習知之使用多數次接觸用的檢測器卡 -48- 200903696 時的晶圓夾頭的移動行程的槪略圖。 第1 6圖係顯示第1實施形態的變形例之檢測裝置的 縱截面圖。 第17 (a) (b)圖係顯示上述變形例的晶圓搬運機 構的槪略圖。 第1 8圖係顯示上述變形例的檢測裝置的作用之俯視 圖。 第1 9圖係顯示上述檢查部的檢測器卡的交換機構的 —例之檢測器卡的側視圖。 第2 0圖係顯示上述檢測器卡的交換機構的一例之檢 測器卡的側視圖。 第21圖係顯示上述檢測器卡的交換機構的一例之檢 測器卡的側視圖。 第22圖係顯示習知檢測器卡的交換機構的一例之檢 測器卡的側視圖。 第23圖係顯示上述檢測裝置的其他構成例之俯視圖 〇 第24圖係顯示上述檢測裝置的其他構成例之俯視圖 〇 第2 5圖係顯示上述檢測裝置的配置的一例之俯視圖 〇 第2 6圖係顯示上述檢測裝置的配置的一例之俯視圖 〇 第27圖係顯示上述檢測裝置的其他構成例之俯視圖 -49 - 200903696 第28圖係顯示上述檢測裝置的檢查部的對準橋台的 位置的俯視圖。 第2 9圖係顯示上述檢測裝置的其他構成例之俯視圖 〇 第3 0 ( a )( b )圖係顯示上述檢測裝置的開閉器的 一例之槪略圖。 第3 1 ( a )( b )圖係顯示上述檢查部的其他例之槪 略圖。 第32圖係顯示上述第！實施形態的微型攝影機的移 動行程之俯視圖。 第33圖係顯示上述其他構成例的微型攝影機的移動 行程之俯視圖。 第3 4(a) ( b )圖係顯示上述檢查部的其他例之槪 略圖。 第3 5(a) ( b )圖係顯示上述檢測裝置本體的檢測 器卡進行交換時的樣子之俯視圖。 第3 6圖係顯示上述實施形態所使用的晶圓搬運機構 之晶圓搬運順序的說明圖。 第3 7圖係顯示上述實施形態所使用的晶圓搬運機構 之晶圓搬運順序的說明圖。 第3 8圖係顯示晶圓搬運機構具備2個臂部時的晶圓 的搬運順序之說明圖。 第3 9圖係顯示晶圓搬運機構具備2個臂部時的晶圓 -50- 200903696 的搬運順序之說明圖。 第4 0圖係顯示上述實施形態所使用的控制部的構成 的一例之構成圖。 第4 1圖係顯示控制部所使用的操作畫面的一部分的 說明圖。 第42圖係顯示本發明的實施形態之對準橋台的其他 例之俯視圖。 第43(a) (b)圖係顯示使用上述對準橋台時的晶 圓夾頭的移動樣子的說明圖。 第4 4圖係顯示使用上述對準橋台時的X方向的晶圓 W全體的移動量之說明圖。 第45圖係顯示在對準橋台安裝1個微型攝影機時的 X方向的晶圓W全體的移動量之說明圖。 第46圖係顯示上述對準橋台的微型攝影機的使用方 法之說明圖。 第47(a) (b)圖係顯示上述對準橋台的微型攝影 機的使用方法之說明圖。 第48(a) ( b )圖係顯示上述對準橋台的微型攝影 機的使用方法之說明圖。 第49 ( 1 ) ( 2 )圖係顯示本發明的實施例之晶圓搬 運機構的動作順序的一例之槪略圖。 第50(1) (2)圖係在上述實施例實際花費的晶圓 搬運機構的移動、處理等的時間以時序顯示的槪略圖。 -51 - 200903696 【主要元件符號說明】 1 :裝載部 2 :檢測裝置本體 3 :晶圓搬運機構 4 A、4 B :晶圓夾頭 5A、5B :對準橋台 6A、6B :檢測器卡 10 :搬運室 1 1 :第1裝載埠 12 :第2裝載埠 2 1 A、2 1 B :檢查部 2 9 :探針 3 0 :臂部 3 1 :上段臂部 3 2 :中段臂部 3 3 :下段臂部 3 6 :夾頭部 3 7、3 8 :光感測器 41 :微型攝影機 4 5 :微型攝影機 -52-Figures 46 through 48 show the use of the miniature cameras 401, 402. In Fig. 46, four points E1 to E4 of the wafer W are taken to obtain respective coordinate positions, and a line connecting two points E1 and E3 and a line connecting two points E2 and E4 are obtained. The intersection becomes the center point (center coordinate) C of the wafer w. The length of the straight line connecting El and E3 (E2, E4) becomes the diameter of the wafer W. Even if it is a nominal 300mm wafer W, the diameter of the wafer W is slightly different from that of 300mm. In order to correctly create the wafer map on the wafer W (the coordinates of each electrode pad), it is necessary to grasp the center of the wafer W. Coordinates and diameter. Further, the registration position of the electrode pads of each wafer on the wafer (the so-called ideal coordinate system) is stored at a relative position with respect to the center coordinates of the wafer W. Therefore, the wafer W-42-200903696 must be obtained. Center coordinates. In E21 and E3' in Fig. 46, by moving the wafer W in the Y direction with a predetermined distance, the line segment between E2 and E3 moves in the Y direction, and the intersection of the line segment and the periphery of the wafer W is E1. E4. In this example, as shown in Fig. 47 (0(b), the left and right of the lower half of Fig. 47 of the wafer W are sequentially photographed by the micro cameras 401 and 402 to find the positions of E2 and E3. Then, the wafer W is moved in the Y direction, and as shown in Fig. 48(a)(b), the upper and lower portions of the fourth half of the wafer w are sequentially photographed by the micro cameras 401 and 402. In order to find the position of E 1 and E 4. On the other hand, when there is only one micro camera, the chuck must be sequentially moved to a position corresponding to 4 points on the wafer W, in this example, ei , The group consisting of two points E3 (or E2, E4) can be confirmed substantially simultaneously by the switching of the micro cameras 4 0 1 and 4 0 2, and after the confirmation of E 1 and E 3 is performed, the wafer chuck 4A is required. It is only necessary to move once in the Y direction. Therefore, it is possible to photograph four points of the peripheral position of the wafer W in a short time. In the case where two micro cameras 401 and 402 are used, it is preferable to set the center line 300 with respect to the center line 300. The reason is that the left and right sides of the wafer W are shared by the micro cameras 401 and 402, and the wafer chuck 4 A is moved relative to the center line 300. The area is bilaterally symmetrical, and if the moving area when the wafer W is photographed by the micro cameras 3 0 1 and 3 02 overlaps, the moving area of the wafer chuck 4A is smaller than that of the asymmetrical case. Of course, the micro camera 401, The configuration of 402 may be asymmetric with respect to the center line 300. The micro cameras 3 0 1 and 3 02 are provided with a -43-200903696 zoom mechanism on the optical path of the optical system, by controlling the zoom mechanism To obtain: the field of view is lower than the field of view when the magnification camera is used (intermediate field of view). The magnification used when the camera is used is a degree that is high enough to confirm the magnification of the electrode pad, for example, there is only one electrode in the field of view. The magnification of the pad. # When the operator confirms the stitch on the electrode pad, the pinch is not visible with the micro camera 401. The micro camera 3 1 0, 3 02 can only confirm the pad one by one, and it takes a long time. The composite electrode pad can be seen once in the middle field of view, so that it is possible to efficiently confirm whether or not there is a stitch. This intermediate field of view can also be used when the alignment on the wafer W is 5 points. When the combination of the two sets of the micro-camera and the lithography machine is used, the amount of movement of the chuck 4 A when the wafer W is aligned with the probe 29 is smaller than that of the one set, and the productivity and the size of the apparatus can be reduced. Further, in the case where the device specification is a case where the movement of the wafer chuck is small, the entire wafer is observed by a group method of a group of micro cameras and micro cameras, and thus is also applicable to such device specifications. In the order of operation of the wafer transfer mechanism 3, the number of the arm portions 30 is three (the present invention) and two (the conventional example) are compared. Regarding devices other than the number of 30, etc., the same configuration is employed. As described above, when the number of the arm portions 30 is three, the first inspection portion 21A and the second portion 21B can be sequentially and sequentially transported by the wafer C and the pre-alignment mechanism 39, but in the arm portion. 30 is a high-powered needle after two shots. The number of shots of the wafer is increased by a number of shots. The wafer is lifted by the momentum. The arm is required to pass through the inspection. -44 - 200903696. The wafer is loaded into the first inspection unit 21A. Thereafter, before the wafer W is transported to the second inspection unit 2 1 B, it is necessary to access the crucible C or the pre-alignment mechanism 39. Fig. 49 is a view schematically showing the operation of the wafer transfer mechanism 3 at this time. In Fig. 49, the left side (1) is a case where the number of the arm portions 30 is three, and the right side (2) is a case where the number of the arm portions 30 is two. In (i), the processing (transport) of the wafer w is performed in the order of (A) to (F) from the upper side to the lower side: (2) '(a) to (g) from the upper side to the lower side The processing (transportation) of the wafer W is performed in the order. In this case, in the following example, the wafers W1 and W2 are inspected in the two wafer chucks 4A and 4b in the following examples, and the wafers w1 and W2 and the subsequent unchecked wafers are inspected. The flow when W 3 and W 4 are exchanged will be specifically described. As shown in Figure 4 9 (1), when the number of arms 30 is three, for example, unsupervised is carried by the upper arm 3 1 (U pper ) and the middle arm 3 2 ( Middle ), respectively. Wafer W3 and wafer W4 (A). At this time, before the inspection of the wafer W1 of the wafer chuck 4A is completed, the aforementioned pre-alignment step and OCR step are performed on the wafers W3 and W4. Next, when the inspection of the wafer chuck 4A is completed, the inspected wafer W1 (B) is recovered by, for example, the lower arm portion 33 (L0wer). Then, the wafer W3 of the upper arm portion 31 is loaded on the wafer chuck 4A (C). Next, the wafer W2 that has been inspected in the wafer chuck 4B is collected by the upper arm portion 31 (D), and the wafer W4 of the middle arm portion 32 is placed on the wafer chuck 4B (e). As a result, the wafers wi and W2 that have been inspected are collected by the wafer transport mechanism 3, and the unprocessed wafers W3 and W4 are loaded on the wafer chucks 4A and 4B to be inspected (F). As described above, the three arm portions 30 are provided in the wafer transport mechanism 3, and the two unchecked wafers can be held in the arm portions 30 at -45-200903696, and the wafer W is sequentially transported to the first inspection portion 21A and The second inspection unit 21B. On the other hand, when the number of the arm portions 30 is two, as shown in Fig. 49 (2), the unchecked wafer W3 (a) is carried by the upper arm portion 31, for example. At this time, before the inspection of the wafer W1 of the wafer chuck 4A is completed, the aforementioned pre-alignment step and 0 c R step are performed on the wafer W 3 . Next, when the inspection of the wafer chuck 4A is completed, the inspection wafer W1 (b) is recovered by the lower arm portion 3 3 . Then, the wafer W3 of the upper arm portion 3 1 is loaded on the wafer chuck 4A (c). Next, the wafer transport mechanism 3 is raised to the upper position (in order to perform the transfer with the carrier C), the wafer W1 is returned to the carrier C, and the subsequent wafer W4 is taken out, for example, by the upper arm portion 31 (d ). Next, the wafer W4 is subjected to a prealignment step and an OCR step (access to OCR匣) (e). Then, the wafer W2 that has been inspected by the wafer chuck 4B is collected (f), and the wafer W4 of the upper arm portion 31 is loaded on the wafer chuck 4B (g). Regarding the flow of the above-described wafer transfer mechanism 3, Fig. 50 shows the elapsed time when the unchecked wafers w1 and W2 are transported. The upper stage side shows an example (1) in which the number of the arm portions 30 is three, and the lower stage side shows an example (2) in which the number of the arm portions 30 is two. In Figure 50, the right side of the "3 Arms" or "2 Arms" items at the left end ("1 st/2nd Wafer", "1st Wafer", "2nd Wafer", "3rd Wafer"), respectively It is shown that the wafer W of the first piece is processed, and the item on the right side shows the content of processing the wafer W. -46 - 200903696 In the 50th figure, the same English letters are assigned to the above steps (a) to (F) and (a) to (g). In the figure, the horizontal axis represents the elapsed time. In Fig. 50, the pre-alignment step shown in the above-mentioned Fig. 49 is omitted. In the figure, "Shutter" represents a step of opening an unillustrated shutter provided in the conveyance port 22a of the inspection unit 21; "Alignment" represents a fine alignment step performed by the inspection portion 21; "wafer Load" represents The step of loading the wafer w into the inspection unit 21; "Wafer extraction" represents the step of taking out the wafer w from the carrier C; "Front ( Rear) Stage" represents the wafer chuck 4A (4B). As can be seen from Fig. 50, by increasing the number of the arm portions 30 from two to three, the transportation efficiency of the wafer W can be improved, and the time required to transport the wafer w can be extremely short. The time required for the completion of the loading of the second wafer W2 and the time required for the loading of the first wafer W1 to the second wafer W2 are completed. Therefore, it can be seen that the productivity of the detecting device can be increased by increasing the number of the arm portions 3 为 to three. Further, the example in which the number of the arm portions 30 is two is shown in sections of the wafers wi, W2, and W3. Further, in the case where the wafer w is exchanged as described in the above-mentioned Fig. 49, as shown in the lowermost portion of Fig. 50, it takes an extra time to return (accommodate) the wafer w1 to the carrier C. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view showing an entire example of a detecting device according to a first embodiment of the present invention. Fig. 2 is a schematic plan view showing an example of the above-described detecting device. -47- 200903696 Fig. 3 is a longitudinal sectional view showing an example of the above-described detecting device. Fig. 4 is a perspective view showing an example of a loading cassette of the above-described detecting device. Fig. 5 is a schematic view showing an example of a wafer conveying mechanism of the detecting device. Fig. 6 is a perspective view showing an example of an inspection unit of the above-described detection device. Fig. 7(a)(b) is a schematic view showing an example of the inspection unit. Fig. 8 is a view showing an alignment abutment of the inspection unit. The top view of the position 〇 Fig. 9 is a schematic diagram showing an example of the movement stroke of the wafer chuck of the inspection unit. FIG. 1 is a plan view showing an example of the operation of the above-described detecting device. FIG. 1 is a plan view showing an example of the operation of the detecting device. FIG. 1 is a plan view showing an example of the action of the detecting device. 3 is a plan view showing an example of the operation of the above-described detecting device. FIG. 14 is a plan view showing a moving range of the wafer chuck when a specific point on the wafer is captured by the second imaging means. Fig. 15 is a schematic diagram showing the movement of the wafer chuck when the detector card for most contact is used -48-200903696. Fig. 16 is a longitudinal sectional view showing a detecting device according to a modification of the first embodiment. Fig. 17 (a) and (b) are schematic views showing the wafer transfer mechanism of the above modification. Fig. 18 is a plan view showing the action of the detecting device of the above modification. Fig. 19 is a side view showing an example of a detector card of the exchange mechanism of the detector card of the inspection unit. Fig. 20 is a side view showing the detector card of an example of the exchange mechanism of the above detector card. Fig. 21 is a side view showing the detector card of an example of the exchange mechanism of the above detector card. Fig. 22 is a side view showing a detector card of an example of a switching mechanism of a conventional detector card. Fig. 23 is a plan view showing another configuration example of the detecting device. Fig. 24 is a plan view showing another configuration example of the detecting device. Fig. 25 is a plan view showing an example of the arrangement of the detecting device. A plan view showing an example of the arrangement of the above-described detection devices, and a plan view showing another configuration example of the above-described detection device - 49 - 200903696 Fig. 28 is a plan view showing the position of the alignment abutment of the inspection portion of the detection device. Fig. 29 is a plan view showing another configuration example of the above-described detecting device. Fig. 3(a)(b) shows a schematic diagram showing an example of the shutter of the detecting device. The third (a) (b) diagram shows a schematic view of another example of the above-described inspection unit. Figure 32 shows the above! A plan view of the movement stroke of the miniature camera of the embodiment. Fig. 33 is a plan view showing the movement stroke of the micro camera of the other configuration example described above. The figure 3(a)(b) shows a schematic view of another example of the above-described inspection unit. Fig. 3(a)(b) is a plan view showing a state in which the detector card of the detecting device body is exchanged. Fig. 3 is an explanatory view showing a wafer transfer procedure of the wafer transfer mechanism used in the above embodiment. Fig. 3 is an explanatory view showing a wafer transfer procedure of the wafer transfer mechanism used in the above embodiment. Fig. 3 is an explanatory view showing a procedure for transporting wafers when the wafer transport mechanism has two arms. Fig. 3 is an explanatory view showing the conveyance order of the wafer -50-200903696 when the wafer conveyance mechanism has two arms. Fig. 40 is a block diagram showing an example of the configuration of the control unit used in the above embodiment. Fig. 4 is an explanatory diagram showing a part of an operation screen used by the control unit. Fig. 42 is a plan view showing another example of the alignment abutment according to the embodiment of the present invention. Fig. 43 (a) and (b) are explanatory views showing the movement of the wafer chuck when the above-described alignment abutment is used. Fig. 4 is an explanatory view showing the amount of movement of the entire wafer W in the X direction when the alignment abutment is used. Fig. 45 is an explanatory view showing the amount of movement of the entire wafer W in the X direction when one micro camera is mounted on the alignment abutment. Fig. 46 is an explanatory view showing the method of using the above-described micro-camera for aligning the abutment. Fig. 47 (a) and (b) are explanatory views showing the use of the above-described micro camera of the alignment abutment. Fig. 48(a)(b) is an explanatory view showing a method of using the micro camera of the above-described alignment abutment. The 49th (1) and (2) drawings are schematic views showing an example of the operation sequence of the wafer transfer mechanism according to the embodiment of the present invention. The 50th (1)th (2th) diagram is a schematic diagram showing the time series of the movement, processing, and the like of the wafer transport mechanism actually spent in the above embodiment. -51 - 200903696 [Description of main component symbols] 1 : Loading unit 2 : Detection device main body 3 : Wafer transfer mechanism 4 A, 4 B : Wafer chuck 5A, 5B : Alignment abutment 6A, 6B : Detector card 10 : Transfer chamber 1 1 : First load cassette 12 : Second load cassette 2 1 A, 2 1 B : Inspection unit 2 9 : Probe 3 0 : Arm portion 3 1 : Upper arm portion 3 2 : Middle arm portion 3 3 : lower arm 3 6 : clip head 3 7 , 3 8 : photo sensor 41 : micro camera 4 5 : micro camera - 52-