TW200903179A - Method for manufacturing patterned thin-film layer - Google Patents
Method for manufacturing patterned thin-film layer Download PDFInfo
- Publication number
- TW200903179A TW200903179A TW096124614A TW96124614A TW200903179A TW 200903179 A TW200903179 A TW 200903179A TW 096124614 A TW096124614 A TW 096124614A TW 96124614 A TW96124614 A TW 96124614A TW 200903179 A TW200903179 A TW 200903179A
- Authority
- TW
- Taiwan
- Prior art keywords
- ink
- pattern layer
- ultraviolet light
- partition wall
- substrate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000010409 thin film Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000005192 partition Methods 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 16
- 239000010408 film Substances 0.000 claims description 14
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000976 ink Substances 0.000 abstract description 66
- 230000001678 irradiating effect Effects 0.000 abstract description 3
- 230000000903 blocking effect Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Optical Filters (AREA)
Description
200903179 九、發明說明: 【發明所屬之技術領域】 本發明涉及一種薄膜圖案層製造方法 【先前技術】 光微影法及喷 目兩製造薄膜圖案層之方法主要包括 墨法。 光微影法:藉由於預備塗敷所需薄膜之 塗敷光阻材料,將具有預定圖案之光罩設於光阻 進㈣光及顯影,或加上㈣製程,㈣成具有預設圖案 之涛膜圖案層。該光微影法需要複雜之製程,並且,材料 之使用效率較低而造成製造成本高。 喷墨法,此處以製備彩色濾光片為例說明。用喷墨法 製造彩色濾光片主要包括以下步驟:如圖工⑷所示,提供 -基板^與設置於基板42上之複數行列分佈之分_ 44,該複數分隔牆44之側面44a限定複數收容空間46, 提供一紫外光線48,該紫外光線48垂直於所述基板42的 表面照射。如圖1(b)、(c)所示,使用一噴墨裝置5〇,該噴 墨裝置50具有喷墨孔52,該噴墨頭52將形成薄膜材料之 墨水54R、54G、54B噴入該複數收容空間46内,墨水54R、 54G、54B被固化後於該基板42上形成預定之薄膜圖案 層,其中’墨水54R、54G、54B分別為紅、綠、藍色墨水。 使用喷墨法製造彩色濾光片能夠一次形成薄膜圖案層。由 於製程大量簡化,材料使用經濟,因此成本大幅降低。
Proceedings of the 2005 IEEE (第 258 至 260 頁)於 2005 6 200903179 年 11 月公開了 標題為 “The Fluid Property Dependency on
Ink Jetting Characteristics”之論文中提到工業噴墨製程如 噴墨法製造彩色濾光片之製程中,噴墨墨水需具有適應於 育墨製程之粘性(viscosity) (surface tension)。因此,可選 擇粘性與表面張力較強之喷墨墨水來增強墨水與基板以及 墨水與分隔牆之間之潤濕性;當然也可以采用圖1(a)中所 示之對基板及分隔牆照射紫外線的方法。在圖1所示的製 程中,紫外光線48可以使空氣中之新增臭氧或原有之臭氧 分離出活性氧,使表面上附著之較不親水性之污染物質分 解去除’而使基板42表面與墨水54R、54G、54B之間之 潤濕性提升;另,當基板42或分隔牆44為有機系材料時, 紫外光線48還可以破壞該有機材料表面之不飽和鍵,而使 親水性之官能性加入,使其與墨水54R、54G、54β之間之 潤濕性更强。 “在傳統的製程中,由於該紫外光線48垂直於所述分隔 片回44之頂部表面44b照射,使得分隔牆44之頂部表面4仙 v、墨K 54R、54G、54B潤濕性能較強,而分隔牆44之側 面44a與墨水54R、54G、54β之潤濕性能相對較弱。當某 收谷工間42内之墨水噴出量過大而使液面高出分隔牆 44之頂部表面44b時’比如54R、54G之液面高出分隔牆 44之頂部表面44b,可能會由於墨水54R、54〇與分隔牆 44之間之潤濕性過強而使墨水54R沿著分隔牆料頂部表 面44b向與墨水54R相鄰之墨水54(}方向流動而與墨水 54G發生混色,影響所述薄膜圖案層之品質。 200903179 【發明内容】 有黎於此有必要提供—種可提高薄膜圖案層品質之 薄膜圖案層製造方法。 、 一種薄膜圖案層製造方法,包括以下步驟:提供一美 板,其表面具有複數分隔牆’該複數分隔牆間形成複數: 容空間,b提供—光罩與—紫外光源,λ中,所述光罩設置 於所述紫外光源與所述分隔牆之間,所述光罩包括複數用 於遮擔分_之頂部表面之遮光部與複數可透過光線至收 容空間之透光部;所述料光源發出料光線對所述複數 分隔牆之側面及基板表面進行照射;填充墨水至該複數收 谷空間内,及固化墨水以形成薄獏圖案層。 所述之薄膜圖案層製造方法中,在紫外光源與分隔於 之間設置光罩’使分隔牆頂部表面免於紫外光照射,從: 可以使分隔牆頂部表面與墨水之間具有較弱潤濕性 少了當某-收容空間内之墨水溢出至分隔牆頂部表面時向 與之相鄰之收容空間流動之趨勢,從而減少相鄰收容空間 内墨水之混色’提高薄膜圖案層之品質。 【實施方式】 下面將結合附圖對本發明實施例作進—牛 …、 明。 乂 #、’'田說 本發明第一實施例提供一種薄膜圖案層製造方法, 方法包括以下步驟: 彳 、 1)提供-基板’其表面具有複數分隔牆,該複數分^ 蹁間形成複數收容空間。 阳 200903179 2) 提供一光罩與一紫外光源,其中,所述光罩設置於 所述紫外光源與所述分隔牆之間,所述光罩包括複數用於 遮擋分隔牆之頂部表面之遮光部與複數可透過光線至收容 空間之透光部。 3) 所述紫外光源發出紫外光線透過所述透光部對複 數分隔牆之側面及基板表面進行照射。 4) 填充墨水至該複數收容空間内。 5) 固化墨水以形成薄膜圖案層。 下面將結合附圖對上述方法進行詳細說明: δ月麥閱圖2(a),在步驟1)中,提供一表面設置有呈行 歹J排佈之衩數分隔牆王〇4之基板1 〇2,各分隔牆丨〇4分別 具有複數側面l〇4a與一頂部表面1〇4b,該複數分隔牆1〇4 之複數侧面l〇4a限定複數收容空間1〇7,該複數收容空間 107通常成陣列式排列。一般地,該頂部表面1〇4b與基板 102表面平行,所述侧面1〇乜與基板1〇2所成角度㊀大於 9〇度。可以理解,該複數收容空間1〇7還可以馬賽克方式 或不規則方式排列等,並不限於本實施例。 在步驟2)中,提供一曝光光源6〇與一光罩2〇〇,該光 罩2〇〇設置於該曝光光源6〇與該基板1〇2之間。一般地, 所述曝光光源60為紫外光源,本實施例曝光光源6〇發出 紫外光線109。所述光罩200包括一透光部2〇此及透光部 200b表面之複數遮光部2〇〇a,所述複數遮光部所形 成之圖案與複數分隔牆104在基板102表面所形成之圖案 相對應。所述遮光部200a用於遮擋曝光光源6〇發出之射 200903179 向分隔牆104頂部表面10仆部分之光線,所述透光部2〇〇b ‘之作用為透過所曝光光源60發出之射向組成收容空間1〇7 .之基板1〇2及分隔牆1〇4侧面l〇4a部分之光線。於圖2(a) 中,所述光罩200與分隔牆隔開一段距離,可以理解, 所述光罩200還可以相接觸設置,並不限於本實施例。 在步驟3)中,所述曝光光源6〇以垂直於所述基板1〇2 表面之方向發出紫外光線1〇9,由於光罩2〇〇之遮光部2〇以 之遮擋,所述紫外光線1〇9僅射向基板1〇2表面以及分隔 牆104之側面104b。可以理解,所述曝光光源6〇之曝光 光線亦可以與基板1〇2表面成其他角度,並不限於本實施 例之與基板1〇2表面之垂直關係。 如圖2(b)與(c)所示,在步驟4)中,利用一噴墨裝置 300將所需薄膜材料之墨水1〇8填充至收容空間搬内以 形成墨水層110,其中,該喷墨裝置3〇〇包括至少一個噴 墨頭302與設置於該喷墨頭302之至少一個喷墨孔3〇4, 墨水108藉由該噴墨孔3〇4噴出。 在步驟5)中,利用一固化裝置(圖未示)對該複數墨水 層110加以固化,以形成薄膜圖案層。該固化裝置可為— 加”,、咸置或糸外線曝光裝置或一抽真空裝置或上述裝置 之其中任意兩種或三種之組合。本實施例之墨水層110以 間隔排列之紅色墨水層贿、綠色墨水層110C^藍色墨 水層110B為例進行說明。 需要說明,步驟3)中對基板102表面及分隔牆1〇4側 面104a…射|外光線1〇9之目的為增強基板丨⑽表面及分 200903179 隔檣104侧面104a與墨水1〇8之間之潤濕性,以使墨水 108更好地附著於其上。另夕卜’所述分隔牆遍的材料可 以為包含有對紫外光敏感材料,當紫外光照射於其上時, 所述紫外綠感材料與墨水1()8之_性能增強,從:使 分隔牆104側面104a與墨水108之潤濕性能更強。 一本實施例中,所述曝光光源60優選為低壓直管式紫外 光源。另,所述曝光光源60之波長優選小於32〇奈米^與 此波長範圍相適應’所述光罩删之材料一般采用鉻、樹 :材料等,所述分隔牆1〇4之材料可以為樹脂光阻材料 寺,可使分隔牆104之側面104a經過紫外光線照射後,呈 現較好之與墨水108之潤濕性。 相對於先前技術,本方法在曝光光源6〇與分隔牆⑽ 木用了光罩200,使分隔牆1〇4之側面忉“受到照射,而 分隔牆1G4之頂部表面獅由於光罩之遮光部勒 之遮擋而未受到照射,從而使側面職與墨水而之潤濕 性更強’墨水108在分隔牆1〇4側面1〇4a之附著更牢固, 同時也避免由於頂部表自1Q4b潤濕性增強而發生之相鄰 墨水層混色。 該基板102之材料可以選自玻璃、石英玻璃 '石夕晶圓 (wafer)、金屬以及塑膠等,本實施例中,該基板搬係— 玻璃基板。該喷墨裝置3〇〇可以為熱泡式喷墨裝置 式喷墨裝置等。 膜圖 請參閱圖3,為根據第一實施例之製造方法形成之薄 案層雇,該薄臈圖㈣1〇〇每一列之墨水層11〇為 11 200903179 同種顏色’每一行中之墨水層110按不同顏色間隔排列, 如按照紅色墨水層110R、綠色墨水層110G與藍色墨水層 110Β之排列順序間隔排列。當然,所述墨水層11〇還可以 為其他排列方式,並不限於本實施例。 請參閱圖4 ’係本發明第二實施例基板與分隔牆結 構。如圖4所示,分隔牆206設置於基板102表面且分隔 牆206之側面208與基板1〇2所成角度Θ〗為90度。 請麥閱圖5,係本發明第三實施例之基板與分隔牆結 構。如圖5所示’基板202及分隔牆204之結構與圖4中 之基板102及分隔牆206之結構基本相同,不同之處在於 該基板202與分隔牆204為一體結構,該基板2〇2與分隔 片回204之材料選自玻璃、石英玻璃、金屬與塑膠。 综上所述,本發明確已符合發明專利之要件,爰依法 提出專利申請。惟,以上所述者僅為本發明之較佳實^方 式,本發明之範圍並不以上述實施方式為限,舉凡熟習本 案技藝=人士援依本發明之精神所作之等效㈣或變化, 皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 立圖1係先前技術之一種薄膜圖案層製造方法之流程示 圖2(a)至圖2(c)係本發明第— 圖案層製造方法之示意圖。 實施例提供之 一種薄膜 薄膜 圖3係根據圖2所示之薄膜圖案層製造方法 圖案層之戴面示意圖。 所製造之 12 200903179 圖4係本發明第二實施例提供之基板與分隔牆結構之 .截面示意圖 圖5係本發明第三實施例提供之基板與分隔牆結構之 截面示意圖。 【主要元件符號說明】 薄膜圖案層 100 基板 102,202 分隔牆 104,204,206 側面 104a 頂部表面 104b 收容空間 107 墨水 108 紫外光線 109 墨水層 110 藍色墨水層 110B 綠色墨水層 110G 紅色墨水層 110R 光罩 200 遮光部 200a 透光部 200b 喷墨裝置 300 喷墨頭 302 喷墨孔 304 曝光光源 60 13
Claims (1)
- 200903179 十、申請專利範圍 1.一種薄膜圖案層製造方法,包括以下步驟: 提供一基板’其表面具有複數分隔牆’該複數分隔牆間 形成複數收容空間; 提供一光罩與一紫外光源,其中,所述光罩設置於所述 紫外光源與所述分隔牆之間,所述光罩包括複數用於遮 擔分隔牆之頂部表面之遮光部與複數可透過光線至收容 空間之透光部; 紫外光源發出紫外光線透過所述透光部對複數分隔牆之 側面及基板表面進行照射; 填充墨水至該複數收容空間内;及 固化墨水以形成薄膜圖案層。 2. 如申請專利範圍第i項所述之薄膜圖案層製造方法,其 中’所述光罩之材料為路。 3. 如申明專利圍第工項所述之薄膜圖案層製造方法,其 中,所述分隔牆之材料為樹脂光阻材料。 4.如申請專利範圍第 中,所述紫外始 中,所述紫外来.綠夕且人. 項所述之薄膜圖案層製造方法,其14 200903179 8. 如申請專利範圍第}項 中,所述之填充墨水之錢圖案層製造方法,其 充至收容空間内,該噴墨妒=用—噴墨裝置將墨水填 置於喷墨頭上之至少括至少-個喷墨頭與設 9. 專利範圍第8項所述艺膜 中,所述之噴墨裝置係埶 木層衣k方去,其 置。 、式貝墨裝置或壓電式噴墨裝 1〇二專利麵1項所述之薄膜圖案層之… 法,其中’所述之固化步驟係利 :衣‘方 空裝置、或-曝光裝置、或上述装置之二抽真 之任意组合固化墨水。 种或三种 比如申請專利範圍第K)項所述之薄膜圖案 去’其中’所述之曝光裝置係一紫外線曝光袭i二化方 15
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|---|---|---|---|---|
| CN104723695A (zh) * | 2015-02-12 | 2015-06-24 | 汪广才 | Uvled固化光源、应用该光源的喷绘设备及其驱动控制方法 |
| CN104723695B (zh) * | 2015-02-12 | 2017-03-08 | 汪广才 | Uvled固化光源、应用该光源的喷绘设备及其驱动控制方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7838202B2 (en) | 2010-11-23 |
| US20090011142A1 (en) | 2009-01-08 |
| TWI410753B (zh) | 2013-10-01 |
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