200902414 九、發明說明： 【發明所屬之技術領域】 架之半導體基板用貯 本發明係關於設有載置基板等之棚 藏庫。 【先前技術】 在衣w+v體基板之工廠等， .— 有吩會使用保管基板及收 、-内基板之谷器用之複數棚架之 ^ ^ 臧厍。在此種工廠中，將 衣ie線構築於潔淨室内等在潔參200902414 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a storage for mounting a substrate or the like. [Prior Art] In the factory of the w+v substrate, etc., there is a case where a plurality of scaffoldings for storing the substrate and the inner and outer substrates are used. In such a factory, the clothing line is built in a clean room, etc.
寻隹冻淨吼圍中實施製造步驟之情 形頗多。為了潔淨地保持保管於 ^ S於貝丁臧庫之基板等，例如設 有對貯藏庫内之棚架間送風，以 人掉堆積於基板等之灰塵 等之設備。專利文獻丨係揭示向 门下方吹出潔淨空氣，而潔 淨地保持棚架所保管之標線片之設備。 但’如專利文獻丨所示般由 田上万送風之情形，氣流難以 達到貯藏庫内之棚架間。 因此，有人考慮如圖2所示，經由導管92〇及風量調整快 門921將來自上方之氣流引導至貯藏庫_内之棚架裝置 91〇。風量調整快門921係用於均勻地保持送至棚架裝置 91〇内之棚架9丨1彼此之間之風量。藉此等之構成，也有使 來自上方之氣流均勻地到達棚架911彼此之間之情形。 [專利文獻1]曰本特開2006-4 1027號公報（圖15) 【發明内容】 [發明所欲解決之問題] 仁，依據圖2之構成，需要導管及風量調整快門等追加 之工事，而有設備規模過大之虞。又，增加排列於垂直方 129604.doc 200902414 向之棚架911之數時，僅依賴風量調整快門921，難以在頂 棚20 1至地板202之全領域，均勻地維持風量。 本發明之目的在於提供可一面抑制設備之規模，一面均 勻地將氣流引導向棚架間之半導體基板用貯藏庫。 [解決問題之技術手段] 本發明之半導體基板用貯藏庫係包含：頂板；側板，其 係以與前述頂板共同劃定内包空間之方式配置於前述頂板 之下方；棚架裝置，其係具有關於垂直方向所排列之複數 棚架’且被配置於前述内包空間内；及第1氣流產生機 構，其係以關於水平方向經由空間與前述棚架裝置相對向 之方式被固定於前述側板，於前述内包空間内產生由前述 側板流向前述棚架裝置之氣流；在前述棚架裝置，形成使 與础述側板之間之空間與由前述棚架彼此所夾之空間連通 之1或複數開口；關於全部前述開口，確保在前述内包空 間内，沿著連結前述第i氣流產生機構至前述開口之直線 路徑之氣體流路。 :據本發明之半導體基板用貯藏庫，氣流產生機構係與 棚架裳置相對向而被固定於側板’來自氣流產生機構之氣 流可不必經由導管及風量調整快^直接料棚架裝置之 :1 一1^匕’不需要導管及風量調整快門等之追加工事， 二 抑制叹備全體之規模，—面均勻地引導氣流。又， 口之=構成中，所謂確保沿著連結氣流產生機構至各開 開口之之氣體之流路，係表示在氣流產生機構至各 。又置可能妨礙氣流之通過之構件等。因此，來 129604.doc 200902414 自氣流產生機構之氣流可毫無㈣地料開口，確 置於棚架上之基板等之送風。 ’、載 又，在本發明中，最好在前述頂板固定有㈣述内卜There are many cases in which the manufacturing steps are implemented in the search for frozen nets. In order to cleanly store the substrate or the like stored in the baking tray, for example, it is provided with a device that blows air between the scaffoldings in the storage, and deposits dust on the substrate or the like. The patent document discloses a device that cleans the air below the door and cleans the reticle held by the scaffold. However, as shown in the patent document, the airflow is difficult to reach the scaffolding in the storage. Therefore, it has been considered to guide the airflow from above to the scaffolding device 91 in the storage container via the duct 92 and the air volume adjusting shutter 921 as shown in Fig. 2 . The air volume adjustment shutter 921 is for uniformly maintaining the air volume between the scaffolds 9丨1 sent to the scaffolding device 91. With this configuration, there is also a case where the airflow from above is uniformly reached between the scaffoldings 911. [Patent Document 1] JP-A-2006-4107 (FIG. 15) [Disclosure] [Problems to be Solved by the Invention] According to the configuration of FIG. 2, additional work such as a duct and an air volume adjustment shutter is required. And there is a huge scale of equipment. Further, when the number of the scaffoldings 911 arranged in the vertical direction 129604.doc 200902414 is increased, the shutter 921 is adjusted only by the air volume, and it is difficult to uniformly maintain the air volume in the entire area from the ceiling 20 1 to the floor 202. SUMMARY OF THE INVENTION An object of the present invention is to provide a storage substrate for a semiconductor substrate which can uniformly guide a gas flow between scaffolds while suppressing the scale of the apparatus. [Means for Solving the Problems] The storage substrate for a semiconductor substrate of the present invention includes: a top plate; a side plate disposed below the top plate so as to define an inner packaging space together with the top plate; and a scaffolding device having a plurality of scaffolds arranged in a vertical direction and disposed in the inner bag space; and a first airflow generating mechanism fixed to the side plate via a space facing the scaffolding device in a horizontal direction, a flow of air flowing from the side plate to the scaffolding device is generated in the inner bag space; and the scaffolding device is formed with one or a plurality of openings for communicating a space between the side plates and the space sandwiched by the scaffolds; The opening ensures a gas flow path along a linear path connecting the ith airflow generating means to the opening in the inner package space. According to the storage substrate for a semiconductor substrate of the present invention, the airflow generating mechanism is fixed to the side plate opposite to the scaffolding skirt. The airflow from the airflow generating mechanism can be adjusted without the need of a conduit and a wind volume. 1 1 1 匕 'There is no need for catheters and air volume adjustment shutters, etc., and the second is to suppress the scale of the sigh, and the surface is evenly guided. Further, in the configuration of the mouth, it is assumed that the flow path of the gas that connects the airflow generating means to each of the opening openings is shown in the airflow generating means. A member or the like that may hinder the passage of the airflow is also provided. Therefore, 129604.doc 200902414 The airflow from the airflow generating mechanism can be free from (4) ground opening, and the air is placed on the substrate on the scaffold. In the present invention, it is preferable to fix (4) the inside of the top plate.
間内產生向下方之氧A 礼机之第2亂流產生機構。依據此 成’被對棚架間之送風吹掉之灰塵等會被向下方之氣流運 走因此可抑制—旦被吹掉之灰塵等又回到棚架上之基 板·#，以保持基板等之潔淨。 又在本么明中，最好在前述側板，固定有關於垂直方 向之位置係互異之複數前述第}氣流產生機構。依據此構 成’即使棚帛增加也配置複數氣流產生機構，故可更均勻 地將氣流引導至棚架間。 又，在本發明中，前述第1氣流產生機構也可包含產生 由前述側板流向前述棚架裝置之氣流之第i風扇。前述第1 氣流產生機構也可包含開口於前述内包空間之第i吸氣口 與經由空間與前述棚架裝置相對向之第i送風口。前述第1 氣流產生機構也可包含送風導件，其係設置於前述第1送 風口使由&述第1風扇所產生之氣流在垂直方向擴散。 又在本發明中’前述第2氣流產生機構也可包含產生 向下方之氣流之第2風扇。前述第2氣流產生機構也可包含 開口於前述頂板上方之第2吸氣口與開口於前述内包空間 之第2送風口。 【實施方式】 以下’ 一面參照圖式，一面說明有關本發明之合適之實 施型態。圖1係表示一實施型態之貯藏庫〖〇〇。圖丨（a)及圖 129604.doc 200902414 1(b)係表示貯藏庫100之内部構成，包含局部貯藏庫1〇〇之 剖面。圖1(b)之剖面係沿著圖1(a)之B_B線之剖面。 貝丁藏庫1 00设置於構築有半導體製造線之潔淨室内。在 此製造線中’例如設置有對半導體基板施以各種製造處理 之裝置、及在此等裝置間搬送基板之裝置。基板係在被收 谷於各種容器之狀態被搬送。貯藏庫i00係在此製造線 中’ 一時地保管收容基板之容器丨2〇。 貝丁藏庫100具有頂板103、2塊側板104及2塊側板105。2 塊側板104係在圖l(a)中互相對向地配置於貯藏庫1〇〇之左 右’ 2塊側板105係在圖1(b)中互相對向地配置於貯藏庫1〇〇 之左右。側板1 04係沿著垂直方向由潔淨室内之頂棚2〇1延 伸至地板202。側板1 〇5係由頂板} 〇3延伸至地板2〇2。頂板 1〇3、側板104及105劃定貯藏庫ι〇〇之内面1〇9所圍成之内 包空間。又’在頂板1 03與頂棚2〇 1之間形成空間。在此空 間中，填充著由地板面排出之循環空氣。在地板2〇2，設 置有將貯藏庫100内之氣體排出至潔淨室外之排氣口（未圖 示）。又’在圖1 (a)中’側板1 〇4及i 05也可為潔淨室之外 壁。也就是說’例如圖1 (a)之右側之側板1 〇4之右方也可為 潔淨室之外部。 在貯藏庫1 00之内部設置2個棚架裝置π 〇。此等棚架裝 置110係在水平方向被配置成互相對向。棚架裝置11()具有 配置於垂直方向之複數個棚架111。在各棚架111上載置複 數之容器120。在棚架裝置11〇之圖1(a)中左右方向之兩端 形成開口 11 0a。棚架111彼此所夾之空間係通過此等兩端 129604.doc 200902414 之開口 110a而連通至貯藏庫1 〇〇内之空間。在圖丨（a)中位於 左側之棚架裝置11 0之左端之開口 1丨〇a係與左側之側板1 相對向’位於右側之棚架裝置11〇之右端之開口 11〇a係與 右側之側板104相對向。 又，在貯藏庫100,形成進出庫埠（未圖示），在貯藏庫 100内設置有容器120之搬入搬出之搬送裝置（未圖示）。此 搬送裝置係經由上述進出庫埠將容器i 2 〇之搬入貯藏庫丨〇 〇 内而載置於棚架111上，並將棚架U1上之容器12〇經由進 出庫埠搬出至貯藏庫100外。容器12〇由貯藏庫1〇〇外之別 的搬送裝置被載置於進出庫埠，或由此被搬出。 在側板104固定有複數之送風裝置1〇2(第i氣流產生機 構）。在側板1〇4,沿著垂直方向排列著2個送風裝置1〇2。 送風裝置102在内部具有風扇與過濾器（均未圖示）。送風裝 置102之送風口面向棚架裝置⑽而形成，吸氣口向貯藏庫 _内開口。送風裝置1()2係在水平方向（圖1⑷之左右方 向)被配置於與棚架裝置11〇對向之位置。送風裝置ι〇2與 棚架農置11G之間隔僅離著特定距離以。側板_與棚架農 置"〇之間，並未設置妨礙沿著由送風裝置1〇2至棚架裝置 110之直線路彳f之氣流之通過之構料^在送風裝置⑽之 送風口’設置有使來自送風裝置102内之風扇之氣流向垂 直方向擴散之送風導件（未圖示）。 送風t置102之風扇旋轉時來白 ^ ^ w ^ 术自吸軋口之氣流經由過 >慮器由送風口向棚架驻@ 门棚糸裝置110被吹出。此氣流被設置於送 風裝置1 0 2之送風口夕技旧增▲ I風v件向垂直方向擴散，到達棚 129604.doc 10 200902414 架裝置110之各開口 110a。 在頂板1G3，設置有複數之送風裝置⑻⑷氣流產生機 才）。送風裝置101在内部具有風扇與過渡器（均未圖示 送風裝置HH之吸氣口向頂棚2()1與頂板1Q3之間之空間開 口’送風口向貯藏庫1〇〇内之空間開口。送風裝置ι〇ι係藉 使風扇旋轉，由頂板1()3與頂棚加之間之空間吸入循環: 氣’並經由過遽器將其向下方排出。藉此，使其產生向； 方之氣流。來自送風裝置101之氣流向下方流過棚架裝置 11 〇彼此之間之空間而到達地 ，〃 而，由設置於地板 排氧口向潔淨室外排出，再〆 丹度成< 馮循％空軋由頂棚 被供應。 精以上之構成’可由送風裝置102將氣流均勻地至 棚架111上之容器12〇。送風裝置102起作用時，會產生由 各达風裝置102流向棚架裝置⑽之各開nma之氣流。在 此，由送風裝置102之送風口至 主開口 11〇a之直線路徑沒有 妨礙氣流之通過之障礙物，故 令卜 故來自达風裝置102之氣流可 笔無阻滞地到達各開口叫⑻⑷之黑箭號）。 到達開口 noa之氣流成為由棚架⑴彼此之間流向他方 之開口 11 Oa之氣流（圖1⑷之白 ^ 展點線刖旒）。精此氣流除 去附著在載置於棚架11丨上之 奋态120之灰塵等。到達他方 開口 110a之氣流與由送風裝 扳置l〇UlL向下方之氣流（圖1(a) 之白底貫線前號）合流。藉此 , 稭此，由容器120被除去之灰塵等 不會回到棚架1 1 1而向下方妯 被運走。而’經由設置於地板 202之排氣口，將灰塵等排出於潔淨室外。 129604.doc 200902414 以下’-面參照圖2，—面說明以往構成。在圖2中，白 底箭號表示氣流方向。在以往構成之一例之貯藏庫9〇〇 中，在頂板903設置有送風裝置9〇1。另一方面，在側板 9〇4並未設置有送風裝置。因此，在貯藏庫9〇〇内會產生向 下方之氣流，但此氣流難以到達棚架裝置91〇内之棚架 間。 〆、 因此，需在貯藏庫900設置導管92〇及風量調整快門 921。導皆920沿著垂直方向設置於棚架裝置91〇與側板9叫 之間。氣流由導管920之上端藉送風裝置9〇1流入。在導管 920,在面向棚架裝置91〇之表面形成複數開口。在各開= 設有風量調整快門921。風量調整快門921係構成可變更各 開口之開口面積等。 依據以上之構成，在貯藏庫9〇〇中，氣體由設置於頂板 9〇3之送風裝置9〇1經由導管92〇被引導向棚架裝置“ο。來 自導f 920之氣流藉風量調整快門92丨均勻地到達棚架裝置 9仞之棚架911間。 但，依據此種以往構成，異於上述之實施型態，由於需 要導管920及風量調整快門921，故會使設備之規模變得過 大，成本也增大。另一方面，依據上述之實施型態，可藉 小於以往構成之規模實現可對棚架u丨間之空間均勻地送 風之構成。例如，以棚架裝置至側板之距離加以比較時， 在圖1(a)中為dl ’對此，在圖2中，為大於“之们。由於有 導管920及風量調整快門92丨存在，相對於在某構成例中， d2=50〇 mm，本發明之發明人確認：dl== 1〇〇 mm。此係由 129604.doc -12- 200902414 於在棚架裝置910與側板904之間需要4〇〇 mm程度之多餘 之空間作為設置導管920之空間所致。 、 又，在以往構成中，無論有風量調整快門921，棚架數 增加時，欲均勾送風至下方之棚架911也相當困難:、對 此，依據上述之實施型態，可藉沿著垂直方向排列之2個 送風裝置102均勻地對棚架丨丨丨間之各空間送風。 另外，在以往構成中，由設於上方之送風裝置9〇1至下 方之棚架911之距離較大，故為對全部之棚架9ιι均勻送 :，需要較多之送風裝置901。對此，故上述之實施型 態’可由正橫方向直接對棚架褒置11〇側面之開口 送 風’故可在側板104固定較少數之送風裝置1〇2而均勻地對 全部之棚架111送風。相對於在某以往構成中，需要7個送 風裝置’在如上述之實施型態般在側板固定送風裝置之情 形，在頂板言U個，在2塊側板各設】個合計言免5個送風裝^ B寺，本發明之發明人確認可㈣地對全部之棚架送風。、 <變形例> 以上，係關於本發明之合適之實施型態之說明，但本發 明並不限定於上述之實施型態’在解決問題之技術手段所 記載之内容之限度内，可施行種種之變更。 例如，在上述之實施型態4，在側板104與棚架裝置11〇 之間並未設置妨礙沿著由送風裝置102至棚架裝置110之直 線路徑之氣流之通過之構件等。但也可沿著由送風裝置 102至棚架裝置110之直線路徑設置引導氣流之引導構件。 又’在上述之實施型態中’貯藏庫1〇〇内之底面為潔淨 129604.doc 13 200902414 室之地板202之地板面。但，也可在貯藏庫1〇〇之下方設置 半導體製造裝置等別種裝置，使貯藏庫1〇〇内之底面為此 裝置之上面，或另行配置分隔貯藏庫100與下方之裝置之 地板。 又’在上述之實施型態中，由頂板1 〇3及側板丨〇4、i 〇5 等劃定貯藏庫100之内包空間。但也可利用構成潔淨室之 頂棚2 0 1及外壁劃定貯藏庫1 〇 〇之内包空間。 【圖式簡單說明】 圖1(a)、（b)係表示本發明之一實施型態之貯葳 卿'渾之内部 構成之包含局部剖面之圖。 圖2係表示以往之貯藏庫之内部構成之包含局The second turbulence generating mechanism that generates the oxygen concentrating machine below. According to this, the dust that is blown off by the air blown between the scaffolds is carried away by the downward airflow, so that it is possible to suppress the dust that has been blown off and return to the substrate on the scaffold to keep the substrate, etc. Clean. Further, in the present invention, it is preferable that a plurality of the first airflow generating means for mutually different positions in the vertical direction are fixed to the side plate. According to this configuration, even if the shed is provided with a plurality of airflow generating mechanisms, the airflow can be guided more evenly between the scaffoldings. Further, in the invention, the first airflow generating means may include an i-th fan that generates a flow of air flowing from the side plate to the scaffolding device. The first airflow generating means may include an i-th air inlet opening that opens into the inner bag space and an i-th air supply port that faces the scaffolding device via the space. The first airflow generating means may include a blowing guide that is disposed in the first air blowing port to diffuse the airflow generated by the first fan in the vertical direction. Further, in the present invention, the second airflow generating means may include a second fan that generates a downward flow of air. The second airflow generating means may include a second air inlet opening that is open above the top plate and a second air inlet opening that opens into the inner bag space. [Embodiment] Hereinafter, a suitable embodiment of the present invention will be described with reference to the drawings. Figure 1 is a diagram showing an embodiment of a storage reservoir. Figure (a) and Figure 129604.doc 200902414 1(b) shows the internal structure of the storage 100, including a section of the partial storage. The section of Fig. 1(b) is a section along the line B-B of Fig. 1(a). Bedding Library 100 is installed in a clean room with a semiconductor manufacturing line. In the manufacturing line, for example, a device that performs various manufacturing processes on the semiconductor substrate and a device that transports the substrate between the devices are provided. The substrate is transported in a state of being trapped in various containers. The storage i00 is in this manufacturing line. The container 收容 2 收容 of the storage substrate is temporarily stored. The Bedding storage 100 has a top plate 103, two side plates 104, and two side plates 105. The two side plates 104 are arranged opposite to each other in the storage compartment 1' in the first side of the storage compartment 1' In FIG. 1(b), they are arranged opposite to each other in the vicinity of the storage. The side panel 104 is extended from the ceiling 2〇1 of the clean room to the floor 202 in the vertical direction. The side panels 1 〇 5 are extended from the top panel 〇 3 to the floor 2 〇 2 . The top plate 1〇3, the side plates 104 and 105 define the inner space enclosed by the inner surface 1〇9 of the storage 〇〇. Further, a space is formed between the top plate 103 and the ceiling 2〇1. In this space, the circulating air discharged from the floor surface is filled. On the floor 2〇2, an exhaust port (not shown) for discharging the gas in the storage 100 to the clean room is provided. Further, in Fig. 1 (a), the side plates 1 〇 4 and i 05 may be the outer walls of the clean room. That is, for example, the right side of the side panel 1 〇 4 on the right side of Fig. 1 (a) may be the outside of the clean room. Two scaffolding devices π 设置 are placed inside the storage compartment 100. These scaffolding devices 110 are arranged to face each other in the horizontal direction. The scaffolding device 11 () has a plurality of scaffolding 111 disposed in the vertical direction. A plurality of containers 120 are placed on each of the scaffoldings 111. Openings 11 0a are formed at both ends of the scaffolding device 11 in Fig. 1(a) in the left-right direction. The space sandwiched by the scaffolding 111 is communicated to the space in the storage compartment 1 through the openings 110a of the two ends 129604.doc 200902414. In the figure (a), the opening 1丨〇a of the left end of the scaffolding device 110 on the left side is opposite to the side panel 1 of the left side, and the opening 11〇a and the right side of the right side of the scaffolding device 11〇 on the right side. The side plates 104 are opposed to each other. Further, in the storage 100, an entrance/exit magazine (not shown) is formed, and a storage device (not shown) for loading and unloading the container 120 is provided in the storage 100. The conveying device carries the container i 2 into the storage compartment through the above-described loading and unloading, and is placed on the scaffold 111, and the container 12 on the scaffold U1 is carried out to the storage 100 via the inlet and outlet. outer. The container 12 is placed in or out of the magazine by another conveying device other than the storage unit 1 or is carried out therefrom. A plurality of air blowing devices 1〇2 (i-th airflow generating mechanism) are fixed to the side plate 104. In the side plates 1〇4, two air blowing devices 1〇2 are arranged in the vertical direction. The air blowing device 102 has a fan and a filter inside (none of which is shown). The air supply port of the air blowing device 102 is formed facing the scaffolding device (10), and the air inlet port is opened to the inside of the storage container. The air blowing device 1 () 2 is disposed at a position facing the scaffolding device 11 in the horizontal direction (the right and left directions in Fig. 1 (4)). The distance between the air supply unit ι〇2 and the scaffolding farm 11G is only a certain distance. Between the side panel_and the scaffolding farmer", there is no means for obstructing the passage of the airflow through the straight line 彳f from the air blowing device 1〇2 to the scaffolding device 110. The air supply port of the air blowing device (10) A blowing guide (not shown) for diffusing the airflow from the fan in the air blowing device 102 in the vertical direction is provided. When the fan of the air supply t-set 102 rotates, the airflow from the suction port is blown out by the air supply port to the scaffolding station@door shed device 110 via the > The air flow is set to the air supply port of the air blowing device 110, and the wind is diffused in the vertical direction to reach the opening 110a of the rack device 129604.doc 10 200902414. In the top plate 1G3, a plurality of air blowing means (8) (4) air flow generating means are provided. The air blowing device 101 has a fan and a transition device therein (the air opening of the air blowing device HH is not shown, and the space opening between the ceiling 2 (1) and the top plate 1Q3 is opened to the space in the storage compartment 1). The air blowing device ι〇ι is used to make the fan rotate, and the space between the top plate 1 () 3 and the ceiling is sucked into the circulation: the gas 'is discharged downward through the damper, thereby causing the airflow to be generated; The airflow from the air blowing device 101 flows downward through the space between the scaffolding device 11 and the ground to reach the ground, and is discharged to the clean room by the oxygen outlet provided on the floor, and then the temperature is reduced to < Feng Xun% The air-rolling is supplied from the ceiling. The above-mentioned composition 'can be uniformly distributed by the air blowing device 102 to the container 12 on the scaffolding 111. When the air blowing device 102 is activated, the air reaching device 102 flows to the scaffolding device (10). Here, the air flow of the nma is opened. Here, the straight path from the air supply opening of the air blowing device 102 to the main opening 11〇a does not obstruct the passage of the airflow, so that the airflow from the air reaching device 102 can be pen-free. Arbitrarily reaching each opening ⑷ the black arrow). The airflow reaching the opening noa becomes the airflow flowing from the scaffolding (1) to the other side of the opening 11 Oa (the white point of the Fig. 1 (4). This airflow removes the dust attached to the strenuous body 120 placed on the scaffolding 11 raft. The airflow reaching the other opening 110a merges with the downward airflow (the white end of the white line of Fig. 1(a)) which is pulled downward by the air supply device. Thereby, the dust or the like which is removed by the container 120 does not return to the scaffold 1 1 1 and is transported downward. On the other hand, dust or the like is discharged to the outside of the clean room through the exhaust port provided on the floor panel 202. 129604.doc 200902414 Hereinafter, the conventional configuration will be described with reference to Fig. 2 . In Figure 2, the white arrow indicates the direction of the airflow. In the storage 9 of the conventional configuration, the top plate 903 is provided with a blower 9〇1. On the other hand, the air supply means is not provided in the side plates 9A4. Therefore, a downward flow of air is generated in the magazine 9 ,, but this airflow is difficult to reach the scaffolding in the scaffolding device 91. Therefore, it is necessary to provide the duct 92 and the air volume adjusting shutter 921 in the storage 900. The guide 920 is disposed between the scaffolding device 91 and the side plate 9 in a vertical direction. The airflow flows from the upper end of the duct 920 by the air device 9〇1. At the conduit 920, a plurality of openings are formed in the surface facing the scaffolding device 91. At each opening = an air volume adjustment shutter 921 is provided. The air volume adjustment shutter 921 is configured to change the opening area of each opening and the like. According to the above configuration, in the storage chamber 9, the gas is guided to the scaffolding device by the air blowing device 9〇1 provided on the top plate 9〇3 via the duct 92. ο. The air flow amount adjusting shutter from the guide f 920 92丨 evenly reaches the scaffolding 911 of the scaffolding device 9. However, according to the above-described conventional configuration, since the catheter 920 and the air volume adjusting shutter 921 are required, the scale of the device becomes If the size is too large, the cost is also increased. On the other hand, according to the above-mentioned embodiment, it is possible to realize a configuration in which the air can be evenly distributed to the space between the scaffolds by a scale smaller than the conventional configuration. For example, the scaffolding device is used to the side plates. When the distance is compared, it is dl ' in Fig. 1(a), and in Fig. 2, it is larger than "the one." Since the duct 920 and the air volume adjusting shutter 92 are present, the inventors of the present invention confirmed that dl == 1 〇〇 mm with respect to d2 = 50 〇 mm in a certain configuration example. This is due to the need for an extra space of about 4 mm between the scaffolding device 910 and the side panels 904 as a space for the conduit 920 to be provided by 129604.doc -12-200902414. Further, in the conventional configuration, regardless of the air volume adjustment shutter 921, when the number of scaffolds is increased, it is quite difficult to hook the wind to the scaffolding 911 below: according to the above-described embodiment, The two air blowing devices 102 arranged in the vertical direction uniformly blow air to the respective spaces between the scaffoldings. Further, in the conventional configuration, since the distance from the upper air blowing device 9〇1 to the lower scaffolding 911 is large, it is necessary to uniformly feed all the scaffoldings 9 ι : a large number of air blowing devices 901 are required. In this regard, the above-described embodiment can directly supply air to the opening of the side of the scaffolding 11 from the lateral direction. Therefore, a small number of air blowing devices 1〇2 can be fixed to the side plate 104 to uniformly cover all of the scaffolding 111. Air supply. In the case of a conventional configuration, seven air blowing devices are required. In the case where the air blowing device is fixed to the side plate as in the above-described embodiment, U is provided on the top plate, and each of the two side plates is provided with a total of five air supply. With the installation of the temple, the inventors of the present invention confirmed that the wind can be blown to all the scaffolds. <Modifications> The above is a description of a suitable embodiment of the present invention, but the present invention is not limited to the above-described embodiment, and is within the limits of the contents described in the technical means for solving the problem. Various changes are implemented. For example, in the above-described embodiment 4, a member or the like that hinders the passage of the airflow along the straight path from the air blowing device 102 to the scaffolding device 110 is not provided between the side plate 104 and the scaffolding device 11'. However, it is also possible to provide a guiding member for guiding the air flow along a straight path from the air blowing device 102 to the scaffolding device 110. Further, in the above-described embodiment, the bottom surface of the storage compartment 1 is the floor surface of the floor 202 of the clean room 129604.doc 13 200902414. However, it is also possible to provide a semiconductor manufacturing apparatus or the like below the storage unit so that the bottom surface of the storage compartment 1 is the upper surface of the apparatus or the floor separating the storage 100 and the apparatus below. Further, in the above-described embodiment, the inner space of the storage 100 is defined by the top plate 1 〇 3 and the side plates 4, i 〇 5 and the like. However, it is also possible to use the ceiling 20 1 and the outer wall constituting the clean room to define the inner space of the storage 1 〇 。. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 (a) and (b) are views showing a partial cross section of an internal structure of a storage type of an embodiment of the present invention. Figure 2 is a diagram showing the internal structure of the conventional storage.
D σΐ面之 【主要元件符號說明】 100 貯藏庫 101， 102 送風裝置 103 頂板 104, 105 側板 110 棚架裝置 110a 開口 111 棚架 900 貯藏庫 901 送風裝置 903 頂板 904 側板 129604.doc 200902414 910 棚架裝置 911 棚架 920 導管 921 風量調整快門 129604.doc - 15-D σΐ面 [Main component symbol description] 100 Storage 101, 102 Air supply device 103 Top plate 104, 105 Side plate 110 Scaffolding device 110a Opening 111 Scaffolding 900 Storage 901 Air supply device 903 Top plate 904 Side plate 129604.doc 200902414 910 Scaffolding Device 911 Shelving 920 Catheter 921 Air Volume Adjustment Shutter 129604.doc - 15-