TW200900702A - Apparatus for detecting a probe location in a probe card - Google Patents

Abstract

In an apparatus for detecting the location of a probe in a probe card and measuring a gap distance between the probe and an object, a target unit and a camera unit are installed in the apparatus. The target unit is arranged under a probe card holder to which the probe card is installed, and the camera unit detects a supplementary location of the target unit and measures a supplementary gap distance between the target unit and the object. The gap distance between the probe and the object is measured with reference to the supplementary gap distance. Accordingly, the camera unit firstly detects the location and measures the supplementary gap distance of the target unit, and then secondly detects the location and measures the gap distance of the probe, to thereby prevent detection errors with respect to the probe and accurately measure the gap distance between the probe and the wafer.

Description

200900702

, File: TW4563F IX. Description of the Invention: [Technical Field] The present invention relates to an apparatus for detecting the position of a probe in a probe card, and in particular to a method for correct measurement A gap between the probe in the card and a wafer containing one of the plurality of wafers, and a device for placing the probe in a position where the probe and the wafer are in stable contact with each other. [Prior Art] f) In general, a plurality of wafers are regularly arranged on a semiconductor crystal circle. Prior to the packaging process used to separate the wafers from the wafer, the electrical characteristics of the wafer are inspected on the wafer and the electrical defects are detected from the wafer to improve the operational reliability of the individual wafers. Inspection of the wafer is typically performed by a probe tester comprising a probe card that contacts one of the conductive pads of the wafer. A probe tester for testing a wafer on a wafer typically includes: a probe card; a probe card holder for supporting the probe card; and a collet including the probe of the probe card Wafer. Conventional probe testers typically detect a contact position of a wafer that is in contact with the wafer before the probe is in contact with the wafer, and ensures reliable contact between the probe and the wafer. Degree and precision. Therefore, the probe tester correctly detects the position of the probe of the probe card and aligns the probe with reference to a predetermined position. Figure 1 is a front view showing a conventional device for detecting one of the probe positions in the probe card. 5 200900702

Fiie: TW4563F As shown in Figure 1, camera C is set to & 俾 to enable camera C _ under the probe card: probe card PC, and measured in probe N and contains multiple wafers - = - probe area, distance. A gap between the wafers of the camera C is based on the gap distance between the probe N and the wafer, and a reference distance between one of the two around the probe area is preset to the probe. In the tester. $ insert area. Reference gap When the probe card PC has a different size, the position of the probe card holding ϋ PH is changed, and the gap distance between the probe card replacement sheets is caused by the probe stuck in the needle and the crystal. Change with changes. The type and the positional error caused by the contact thus caused by the pH position of the probe holder is based on the actual gap distance of the contact of the probe card/the drag needle N is far from the reference (4) and accumulates Under the needle 'there is a camera C can not detect the probe card = species:: is generally known as a gap distance measurement error. Therefore, when the camera C cannot measure the probe, the camera C is actually scanned to probe the probe N. The probe area can be manually operated. In addition, the 'micro camera is usually used as the camera in the small scanning area. The measurement in the micro camera can be at a distance.鈥 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The position of the bond probe N is widely known as the position_error. It may be necessary to use a modified phase for scanning-large scan area.

.File: TW4563F machine to correctly measure a gap distance and correctly detect the position of the probe N. However, an improved camera is expensive, thus increasing the manufacturing cost of the semiconductor device. Therefore, when the camera C is designed to scan a large area of the probe card within an estimated cost, the gap distance between the probe and the wafer of the wafer cannot be correctly measured, thereby making the probe N and the wafer It may not be enough to touch each other. In contrast, when the camera C is designed to scan a small area of the probe card within an estimated cost, the position detection error may be generated frequently due to the small scanning area of the camera C, thereby testing the probe. In terms of the operation of the device, manual control is required more frequently. SUMMARY OF THE INVENTION The present invention is directed to a method for correctly measuring a gap between a probe in a probe card and a wafer containing a plurality of wafers, and for placing the probe on the probe and Equipment where the wafers are in stable contact with each other. The invention also relates to a device for minimizing the generation of gap distance measurement errors by compensating for an error caused by a probe card holder and in a camera detection probe card One of the probes is detected in the first measurement relative to one of the probe cards. The present invention also relates to an apparatus for minimizing the occurrence of position detection errors by using a second camera by transmitting probe position data detected by a first camera to a second camera. According to a first aspect of the present invention, there is provided a method for detecting a position of a probe in a probe card and a gap between the probe and an object 7 200900702

• ‘ File: TW4563F is off the device. The device can include a target unit and a camera unit. The target unit is disposed under a probe card holder, and the probe card is inserted into the probe card holder, and the camera unit detects one of the target units to replenish the position and measures a position between the target unit and the object. Supplement the gap distance. The gap distance between the probe and the object is measured with reference to the supplemental gap distance. In an exemplary embodiment, the camera unit includes: a first camera for detecting a complementary position, measuring a complementary gap distance, and detecting a position of the probe; and a second camera for measuring the complementary gap distance and detecting The gap distance between the needle and the f-piece. In an exemplary embodiment, the second camera measures the supplemental gap distance by using the complementary position of the target unit detected by the first camera, and is measured by using the position of the probe detected by the first camera. The gap distance between the probe and the object. In an exemplary embodiment, the second camera detects the complementary position of the target unit, and before the second camera measures the gap distance between the probe and the object, the relative position of one of the second cameras is relative to the difference The first camera CJ changes, the difference being between the data of the complementary locations of the target unit detected by the first and second cameras. In an exemplary embodiment, the target unit is disposed below the probe card holder adjacent the probe of the probe card. In an exemplary embodiment, the target unit includes: a target box disposed under the probe card holder and having a through hole at a bottom portion thereof; and a target block disposed in the target box and configured to pass through The holes are exposed, and the first and second cameras can detect the target block through the through holes. 8 200900702

1 ' File: TW4563F According to an exemplary embodiment of the present invention, the first and second cameras first detect a position and measure a first gap distance of a target unit, and then detect the position and measure a second gap of a probe. Distance to avoid detection errors with respect to the probe and to correctly measure the second gap distance between the probe and the wafer. Therefore, the probe of the probe card can be stably contacted with the wafer by the device. In order to make the above description of the present invention more comprehensible, the following detailed description of the preferred embodiments, together with the accompanying drawings, will be described in detail below: The present invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Conversely, to those skilled in the art, the following The embodiments are presented in order to provide a thorough and complete representation of the disclosure so as to fully convey the scope of the present invention. The accompanying drawings, for clarity of illustration, the various layers and regions may be exaggerated in size. When placed on another element or layer 11, "connecting I to another element or layer" or "coupled to another element or layer" can be placed directly on another element or layer, connected or coupled To the other element or layer, or several intervening elements or interposers may be present. In contrast, when an element or layer π is placed directly on another element or layer, π is directly connected to another element or layer. Or "directly coupled to another element or layer" does not have an intervening element or an intervening layer between another element or another layer. Like reference numerals correspond to similar elements. In this document, the term "and/or" includes any or all combinations of one or more related items.

'FiIe: TW4563F First J 3' and other terms are used to describe different components, components, regions, layers and/or sections. These components, leases, zones, layers and/or sections should not be restricted. For these names. These name ports ^ distinguish between a component, component, region, layer or section and another zone, layer or section. Therefore, the following first component, component, and reverse: factory-space related such as "bottom", "below", "below", "above", above, and similar words are used to describe the illustration. n and =: component or feature relationship. In addition, the spatially related terminology includes, in addition to the position of (5), and θ, the device usage order or the operation is different. For example, if the device is flipped, the original component is "below" or underneath. Another element or another feature of J is a change in orientation to the element "on" an element or another feature. Therefore, the word "below" can be used to cover the orientation above. The skirt can be oriented in the other direction (rotate 90. or face other orientations), the description of the description. The term "singular" and "singular" are used in the plural. In addition, when the use of "in the specification" is used to specify the specified features, things, steps, operating characteristics, or the existence of the pieces 'but does not exclude one or more additional, temple signs, things, v. The existence of operations, components, and/or components. Unless otherwise defined, all names used herein are 200900702.

k * File: TW4563F (including technical and scientific names) has the same meaning as the ordinary knowledge in the technical field to which the present invention pertains. Furthermore, unless explicitly defined in the text, a name such as that defined in a general dictionary should be considered to be consistent with the meaning of the relevant technical background and is not to be interpreted as idealized or overly formal. 2 is a front view showing a device for detecting the position of a probe in a probe card according to an exemplary embodiment of the present invention, and FIG. 3 is a portion of a portion A of FIG. Enlarged image. Figure 4 is a view showing a process for detecting one of the probe positions in a probe card by using the device shown in Figure 2. Referring to Figures 2, 3 and 4, a device 900 (hereinafter referred to as a location device) for detecting one of the probe positions in a probe card can include a target unit 100 and a camera unit 200. The target unit 100 can be disposed under a probe card holder PH, the probe card PC is housed in the probe card holder PH, and the camera unit 200 can be disposed at one of the bottom portions of the device and facing the probe card Holder PH and the bottom surface of the I probe card PC. The target unit 100 can include a target box 110 and a target block 120 and is disposed adjacent to one of the probe cards PC. That is, the target unit 100 is disposed on the bottom surface of the probe card holder PH which is most adjacent to the probe N of the probe card PC. The target box 110 secures the target block 120 and ensures that the target block 120 is to be placed under the probe card holder PH. A through hole 111 is formed through one of the bottom plates of the target box 110, and the target block 120 is disposed in the target box 110 200900702

File: On the backplane in TW4563F. Therefore, the target block 120 can provide a certain amount of the replacement of the probe card PC to the camera 200 via the through-hole (1) target block 12G, and the camera unit measures the fingerprint by the block. The error caused by the replacement of %. More specifically, the target block 12 is below the target block 120 and the wafer. = The probe N is set to the end of the tip of the probe and the gate of the wafer // the gap is larger than the gap and smaller than the second gap and the target gap. When the first-to-wafer approaching the wafer, the target block 120 can block the end of the probe N-spot from being touched. Thus, in device 900, the physical gap of the wafer. It may be necessary to be larger than the second camera single it2GG can be moved from the 1-position (below the probe card holder PH) to the ^-) and from the first to the probe card pc, or from the second position 1 position-position (the camera unit 200 may be attached by the additional drive position. That is, the probe card holder PH and the probe card pc; = flatly moving to and from the target unit 100 (located in the camera unit 200) In the probe card with - and (yuan) (10) ^ - one of the first camera optical angle macro:: and its middle t - a camera 210 is a large angle - the micro camera 2 camera 220 has The small optical first camera 210 can detect the position between the target unit and the wafer of the target unit, measure the distance between the target (five) gap, and detect the position of the probe N.

200900702 ' 'File:TW4563F set. The second camera 220 can measure the first gap distance and a second gap distance between the probe N and the wafer. The first camera 210 can scan a large area under the target unit 100 and detect the position of the target unit 100 (hereinafter referred to as the first location data of the target unit 100), thereby completing a first scan of the first camera 210. Then, the first camera 210 can scan a large area under the probe N and detect the position of the probe N, thereby completing a second scan of the first camera 210. The second camera 220 can correctly measure the first gap distance of the target unit 100 based on the position of the target unit 100 detected by the first camera 210 located below the target unit 100. In an exemplary embodiment, the second camera 220 can also detect the location of the target unit 100 (hereinafter referred to as the second location data of the target unit 100), and the first and second location data of the target unit 100 are compared with each other. . Therefore, the relative position of the second camera 220 relative to the first camera 210 is determined by referring to the position of the target unit 100. Once the relative positions of the first and second cameras 210 and 220 are determined relative to the position of the target unit 100 in the above process, the same relative positions of the first and second cameras 210 and 220 are maintained in the device 900. Therefore, when the probe N is detected by the camera unit 200, the relative positions of the first and second cameras 210 and 220 are still maintained under the probe card PC, thereby improving the detection accuracy of the probe N by using the camera unit 200. . When an old camera is replaced with a new camera for servicing by the device 900, the relative position determined by the first and second cameras in the old camera is the actual relative position of the first and second cameras in the new camera. Different, and 13 200900702

* File: TW4563F The second camera of the new camera detects the probe of the probe card pc (4). The deviation of the relative position in the new camera can cause the measurement error. Therefore, when the camera replacement is performed, the relative positions of the first and second cameras 210 and 220 are correctly determined by referring to the target unit i, and the actual relative position of the second camera 210 and 220 may be based on the first A relative positional change determined by the first cameras 210 and 220. Therefore, the second camera 22G can be prevented from missing the probe N due to the __ error. ^ That is, the relative positions of the second and second cameras 21 〇 and 22 系 are changed with respect to the target unit 1 each time the camera unit 200 is replaced, and the two cameras 220 can be based on the probe of the probe N Position (which is the gap distance of the first camera 21. The positive phase reading pin Ν distance between the wafer and the second camera 220 can include a day i, a small area - correct scan, thus: can not be _, Unless the target unit

L A camera 210 is transmitted. Therefore, the first machine is set up to hold the PH and the probe card PC; the mTa 21, 0 is described in the position of the probe and the probe N is transmitted to the second: machine 22: will be the first '70 10将When the probe card PC is mounted on the chuck, it can be placed around the chuck and set; the needle card can be probe card K: the bottom surface is adjacent, in which the card holder is the circumference The surface is placed on the chuck.曰曰 Round tie clip - The position of the probe N in the probe card below is in the above device _ 14 200900702

* * File: The TW4563F probe card PC is placed in the probe card holder PH, and the camera 200 detects the target unit under the probe card holder PH. Also, the first camera 21 of the camera unit 200 scans a large area under the target unit 1 to "measure the position of the target unit 1" and the number between the target sheet, 100 and the wafer on the chuck. A gap distance.兀Because one of the micro cameras used to scan a small area is used as the second camera 220, the location data of the target unit 100 needs to be transmitted to the camera 220', so that the position of the target unit (10) can be increased by the first camera. When the position of the target unit 100 is detected by the first camera 210, the second camera 220 can correctly measure the first-gap distance of the target unit 1 from the wafer. That is, the first camera 21 scans the area under the target unit 100 and transmits the position of the target unit 100 to the second camera 22, and the second camera 22 is detected based on the first camera 21 The position of the target unit 00 is used to correctly measure the distance between the target unit and the crystal. In addition, the first camera 220 also detects the position of the target unit 1 (which has been represented from the second position data of the target unit 1), and the first unit and the second position data of the target unit 1 are compared with each other. . The relative position of the second camera 22 〇 relative to the first camera 210 is referenced to the position of the target unit 1 而, and then the camera unit 200 is moved to the second position under the probe card A by the driving unit to cause the camera unit 200 Set under the needle card N of the probe card. The first camera 210 scans a large area below the probe N, 15

200900702 File: TW4563F is used to detect the position of the probe N, and the second camera 220 is based on the position data of the probe N detected by the first camera 210 and the relative position determined by the first and second cameras 210 and 220. The second gap distance between the probe N and the wafer is correctly measured. In an exemplary embodiment, the probe card holder PH may be spaced a small distance from the probe card PC, and one of the flatness of the target unit 100 may be different from the flatness of the probe N, thus the target unit 100 and the crystal The first gap distance between the circles may be different than the second gap distance between the probe N and the wafer. However, the first and second gap distances may be substantially similar to each other because the positional error of the probe card holder PH is not accumulated to the preset reference gap distance of the probe N. Therefore, although the second camera 220 measures the second gap distance of the probe N based on the target unit 100 that is prioritized over the first gap distance measured by the second gap distance, the second camera 220 can sufficiently measure the second of the probe N The gap distance is used to avoid the gap distance measurement error caused by the misalignment between the scanning area and the probe area. According to an exemplary embodiment of the present invention, the first and second cameras first detect a position and measure a first gap distance of one of the target units, and then secondly detect the position and measure a second gap distance of one of the probes to avoid Regarding the detection error of the probe, and correctly measuring the second gap distance between the probe and a wafer. Therefore, the probe of a probe card can be stably contacted with the wafer by a device. Moreover, a camera unit includes: a first camera for scanning a large area to detect the position of the probe and the target unit; and a second camera for sweeping 16 200900702

• File: TW4563F Traces a small area by which the first and second gap distances of the target unit and the probe are correctly measured by using the position data of the target unit and the probe. Therefore, the gap distance and position between the target unit and the probe can be easily and correctly measured and detected by the device. Moreover, the position of the target unit is detected by both the first and second cameras, and the relative position of the first and second cameras can be correctly detected with reference to the position of the target unit. Therefore, the second camera can correctly detect the position of the probe by using the position of the probe detected by the first camera and the relative position of the first and second cameras. In addition, the camera unit includes a first camera for scanning a large area and a second camera for scanning a small area, and the position data of the target unit and the probe detected by the first camera is transmitted to the second camera. The position detection error is avoided when the second camera separately measures the first and second gap distances between the target unit and the probe. In view of the above, the present invention has been disclosed in a preferred embodiment, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. 17 200900702

' ^ File: TW4563F [Simple description of the diagram] Figure 1 is a cross-sectional view showing a conventional device for detecting the position of a probe in a probe card. Figure 2 is a front elevational view of a device for detecting the position of a probe in a probe card in accordance with an exemplary embodiment of the present invention. Fig. 3 is a partially enlarged view of a portion A in Fig. 2. Figure 4 is a view showing a process for detecting one of the probe positions in a probe card by using the device shown in Figure 2. f'. [Main component symbol description] 100: Target unit 110: Target box 111: Through hole 120: Target block 200: Camera unit 210: First camera (: 220: Second camera 9 0 0: Device 18

Claims (1)

200900702 'File:TW4563F X. Scope of Application·· 1. A device for detecting the position of a probe in a probe card and measuring a gap between the probe and an object The method includes: - the target unit is disposed under the probe card holder, the probe is installed in the probe card holder; and - the camera is single, and the target unit is used to detect the position and is used for measurement a complementary gap distance between the target unit and the object, and the gap distance between the probe and the object is measured with reference to the complementary "gap distance." The device, wherein the early sputum comprises: a first-camera m-replenishment position, measuring the replenishment distance, and detecting the position of the probe; and a furnace second camera' to measure the supplemental gap distance and The device of the present invention, wherein the second device is used by the target unit detected by the first camera. Position to measure the complement Filling the gap distance, and measuring the gap distance between the probe and the object by using the position of the probe detected by the first = phase, as described in item 3 of the patent scope a device, wherein the second pair of positions measures the supplemental position of the target unit, and one of the second cameras is associated with the 19th 200900702* FiIe measured between the probe and the object by the first camera : TW4563F Before the gap distance, a change is made with respect to the first camera by a difference between the data of the complementary positions of the target unit detected by the first and second cameras. The device of claim 1, 2, 3 or 4, wherein the target unit is disposed under the probe card holder, wherein the probe card holder and the probe card are probed 6. The device of claim 5, wherein the target unit comprises: a target box disposed under the probe card holder, the target box having a through hole in a bottom portion And a target block, set in the target box, and By exposure of the through hole to the outside, so that the first and the second camera detects the target block through the through hole. .Y 20