TW200908071A - Vertical type heat processing apparatus and vertical type heat processing method - Google Patents

Abstract

Disclosed is a vertical type heat processing apparatus and a vertical type heat processing method, which can prevent fall down of the boat on a boat carrier mechanism to be caused by an external force, such as an earthquake or the like, by employing a simple structure, while taking a form of the two-boat system. The vertical type heat processing apparatus 1 includes a heating furnace 5 having a furnace port 5a, a cover 17 adapted to close the furnace port 5a, a pair of substrate holding tools 4 each adapted to hold multiple substrates W in a multistage fashion and configured to be placed on the cover 17 via a heat insulating mount 19, and a lifting mechanism 18 adapted to raise and lower the cover 17 so as to carry in and carry out each substrate holding tool 4 relative to the heating furnace 5. When one substrate holding tool 4 is in the heating furnace 5, the other substrate holding tool 4 is placed on a substrate-holding-tool table 22 for loading the substrates W thereon. Each substrate holding tool 4 is carried between the-substrate-holding-tool table 22 and the heat insulating mount 19 due to the substrate-holding-tool carrier mechanism 23. To the substrate-holding-carrier mechanism 23, a fall-down prevention member 37 adapted to control each substrate holding tool 4 is provided.

Description

200908071 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a vertical heat treatment apparatus and an upright heat treatment method. This application is based on Japanese Patent Application No. 2-7-33665 filed on February 4, 2007 and Japanese Patent Application No. 19, filed on July 27, 2007. The entire contents of the application are hereby incorporated by reference. [Prior Art] In semiconductor wafer fabrication, various processes (including oxidation, film formation, etc.) are provided to each semiconductor wafer (substrate), and the multi-chip crystal can be processed by a batch method, for example. A circular-vertical heat treatment device (or semiconductor manufacturing device) is used as a device for performing such a program (see, for example, Patent Document 1). The 13⁄4 vertical heat treatment unit is always included; it includes a loading area (transfer area), and the vertical heating furnace has a furnace at ==. In the loading area, the boat (or substrate holding tool) is secured to a lid via a thermal barrier that is adapted to open and close the furnace. The wafer boat is used to receive and hold a plurality of wafers (e.g., 100 to 150 wafers) each having a larger size, such as a 300 mm diameter. In addition, a lifting mechanism disk loading mechanism is provided in the loading area, and the lifting mechanism is configured to move in and out of the boat relative to the heating furnace by raising and lowering the cover, and the loading mechanism It is used to load or transport the wafer between the wafer boat and a carrier (or container) containing a plurality of wafers therein. 127294.doc 200908071 The raft is made of quite expensive quartz. These wafers are also relatively expensive, so the cost of production increases as these processing steps progress. Accordingly, it is necessary to perform the treatment of the components or materials with great care. However, in the above-described batch type semiconductor manufacturing apparatus, the apparatus configuration imposes various restrictions on the soft body and the more general conditions, which makes it difficult to make the apparatus more suitable for the earthquake-proof structure or the earthquake-proof function, and currently cannot adequately cope with the earthquake. Related questions. Thus, when an earthquake occurs and the device experiences a more sway, it tends to cause the boat to tip down and the wafer boat and wafer to break severely, causing complete damage. In order to solve such problems, in the vertical heat treatment apparatus described in the patent document, a structure for attaching and fixing one of the base plate and the heat insulating seat of the substrate holding tool to each other by using a substrate holding fixing member is employed.

Patent Document 1: TOKKYO No. 3378241, KOOH In these vertical heat treatment apparatuses, such apparatuses using the so-called twin boat system are known. The vertical heat treatment apparatus utilizes two crystal boats and includes a boat rig and a B boat carrier mechanism, the boat rig is adapted to place a boat thereon for performing loading of the wafer, and the boat carries The mechanism is adapted to carry the boat between the boat platform and the thermal block. In this vertical heat treatment apparatus, when the wafer boat is moved into the furnace and undergoes a thermal process, the other boat placed on the wafer platform can be used to load the semiconductor wafer. Within it. However, in the vertical heat treatment apparatus using the twin-boat system, replacing the two crystal boats on the crucible, the crucible, or the crucible makes it difficult to achieve connection by using the substrate holding tool fixing member. The substrate holding tool 127294.doc 200908071 is fixed to the structure of the heat insulating seat. Therefore, 4-r- and when there is an external force such as an earthquake, it is fixed on the thermal insulation seat, and the visitor S is placed on the crystal boat platform and the crystal boat can be dropped on the crystal boat. The risk of the monthly review of Luo. Previously, the applicant has applied

The invention relates to a vertical heat treatment device and an ampere-type heat treatment method and an upright heat treatment method. The invention is intended to prevent the boat on the boat and the boat on the wafer boat from being placed on the heat sink. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and therefore, it is an object to provide an upright heat treatment apparatus and an upright heat treatment method which can prevent an earthquake such as an earthquake by using a simple structure in the form of a twin boat system. The external force causes the boat to be placed on the boat carrier mechanism. The present invention relates to a vertical heat treatment apparatus, comprising: a heating furnace having a furnace formed on a bottom portion thereof, each having a plurality of substrates held in a multi-layer manner and a pair of substrates holding the work group a state for loading into a heating furnace to provide a heating process to the substrates; a cover adapted to close the furnace of the heating furnace; a heat insulating seat, # is provided on the cover; a lifting mechanism, The system is adapted to raise and lower the cover; a substrate holding tool machine is disposed adjacent to a position directly below the heating furnace, and a substrate holding tool carrier mechanism is adapted to be in the heat insulation a substrate holding tool for transporting the pair of substrate holding tools between a position on the stand and a position on the machine, wherein an anti-tip member is provided to prevent the substrate from holding the tool from falling over to the substrate holding tool carrier The present invention relates to the above vertical heat treatment apparatus, wherein each substrate holding tool has a bottom plate, a top plate and a pillar, and each pillar is attached to the bottom plate and the top plate 127294.doc.10-200908071 And maintaining and maintaining the substrates in a guest-layer manner, wherein the substrate-holding tool carrier mechanism includes a support member that is adapted to support a bottom surface of the substrate holding tool and wherein the anti-tip is The component includes a restraining member configured to lie against a top surface of one of the bottom plates supported by the support member in a gap. The present invention is the above erect + heat treatment device, wherein the anti-tip component

One step includes a driving unit, and the same is adapted to laterally protrude and retract the limiting member. The present invention is the above vertical heat treatment device, wherein each substrate holding tool has a bottom plate, a top plate and a pillar' Between the bottom plate and the top plate, the substrate is protected by a multi-drawer, 10-hopper-7 port, wherein the substrate is protected.

The tool carrier mechanism includes a ritual IA and a cymbal member adapted to support one of the base plates of the substrate holding tool, the visor and wherein the anti-tip member includes a top plate pressing member, the system is configured to The back of your/textor element is extended upwards and adapted to press the top plate of the substrate holding tool. The present invention is the above-mentioned vertical heat-receiving (four), wherein each substrate is maintained and has a bottom plate, a top plate and a pillar' each pillar is disposed between the bottom plate and the top plate and is adapted to hold the substrates in a multi-layer manner, wherein The substrate holding tool carrier mechanism includes a supporting part adapted to support the bottom surface of the bottom plate of the substrate of the substrate (4), wherein a limiting groove is formed in a top surface of the bottom plate of the substrate holding tool, and wherein the substrate The anti-tip component includes a restriction strip configured to be opposed to the restriction recess under a small gap. The present invention is the above vertical heat treatment apparatus, wherein each substrate holding tool 127294 .doc -11 - 200908071 Eight-piece & top plate and struts, each strut being disposed between the bottom plate and the top plate and adapted to hold the substrates in a multi-layer manner, wherein the substrate holding tool carrier mechanism includes a support member And adapted to support a bottom surface of the bottom plate of the substrate holding tool, wherein a pair of parallel transverse holes are formed in both side portions of the bottom plate of the substrate holding tool, and The anti-tip member includes a restriction strip that is configured to be inserted into the transverse holes, respectively. The present invention is the above vertical heat treatment device, wherein each substrate holding tool has a bottom plate, a top plate and a training, each of which The branch (4) is disposed between the bottom plate and the top plate and is adapted to hold the substrates in a multi-layer manner, wherein the substrate holding tool carrier includes a reading component, and the substrate is held by the bottom plate.纟中—a contralateral groove is formed in both sides of the bottom plate of the substrate holding tool, and wherein the anti-tip member includes a restriction strip that is configured to be inserted into the side grooves, respectively. The above-mentioned vertical heat treatment device, wherein each of the substrate holding tools has a bottom plate, a purchase and a practice, and each of the branches (4) is disposed between the bottom plate and the top plate and is adapted to hold the substrates in a multi-layer manner, wherein the substrate holds the tool The mechanism includes a cutting part adapted to support a bottom plate of the substrate holding tool - a bottom m upright hole is formed in the bottom plate of the substrate holding tool 'and wherein the anti-tip component is limited by The protrusion consists of the restriction abrupt # ^ & * the large outcrop protrudes from the top surface of the support part and is configured to fit in the upright hole at a small clearance. The invention relates to the above-mentioned vertical heat treatment device, wherein each substrate is maintained and has a m-plate and a pillar' each pillar is disposed between the bottom plate and the top plate and is adapted to hold the substrates in a multi-layer manner, wherein the substrate is 127294.doc • 12- 200908071 The A-plate is formed into a shape of a soil, which is adapted to support the bottom surface of the substrate of the substrate. The vertical hole is formed in the bottom plate of the substrate* and the middle cookware. And wherein the anti-dumping component is formed by a plurality of restricted outlets from the top surface of the cutting component = opposite to the wall of the annular bottom plate at a smaller gap. The invention is an upright heat treatment method comprising the following steps : After a thermal insulation seat 'in-adjustment to close-heating furnace-furnace cover 2 to place: multi-layer * type to hold a plurality of substrates - substrate holding tool, <-,, ': after the board is raised蒋士女_ A, inside; in the heating Inwardly, the Y-soil holding tools are loaded into the heating furnace, and the heating process is performed; during the heating process for the substrate: 'loading other substrates on another substrate to be placed on the substrate| a substrate holding tool; and by using the -substrate protection ', the carrier mechanism' is replaced with the 2 substrate holding tool placed on the substrate holding tool machine, and the muscle is discharged from the heating after the heat program Heating the substrate holding tool on the mold, wherein the substrate holding tool carrier mechanism includes an anti-tip member, whereby each substrate holding member can be carried, and the anti-tip member can prevent the tool from falling over and the other A substrate holding tool is dumped. The present invention is the above-mentioned vertical heat treatment method, wherein each substrate holding tool has a bottom plate, a top plate and a pillar, and each pillar is disposed between the bottom plate and the top plate and is configured to hold the substrates in a multi-layer manner for 6 weeks, wherein The substrate holding tool carrier mechanism includes a selection component adapted to support the floor-bottom of the bottom plate of the substrate, and wherein the anti-tip component includes a limit of 127294.doc •13·200908071 burdock, two The configuration is configured to face a top surface of one of the bottom plates supported by the support member under a gap. The present invention is the above-described erect & ampere heat treatment method, wherein the anti-tip member further includes a drive single opening, 〇 + octave adjustment to laterally project and retract the restricting member. And the U is the above-mentioned vertical heat treatment device, wherein each of the substrate holding tools has a bottom and a top plate and a pillar, and the pillars are disposed between the bottom plate and the top plate and are adapted to be multi-turned.

Maintaining the substrates in a uniform manner, wherein the substrate holding tool carrier mechanism is adapted to support a bottom surface of the substrate of the substrate ', temple', and wherein the anti-tip component includes a top plate pressing The part 'is arranged to extend upwardly behind the support part to press the top plate of the substrate holding tool. The present invention is the above-mentioned vertical type ^ ^ ^ ^ ^ ^ θ . fly,,, processing method, wherein each substrate Keeping and having a bottom plate, a top plate 盥* such as /, a pillar, each pillar is disposed between the bottom plate and the top plate and adapted to - a multi-layer tool carrier mechanism package = equal substrate 'where the substrate is kept The bottom part of the tool is adapted to read the substrate board 捭, _ < bottom surface, wherein the - limiting groove is formed on the bottom plate of the substrate holding tool, and wherein the anti-dumping part sentence A restriction strip is included, which is used by the group. The core is used for the above-mentioned vertical crucible with the confinement groove and has a U 5 U method, wherein each substrate holds the tool/, has a bottom plate, a top plate and a pillar, i "〆4c - The pillars are arranged between the bottom plate and the top plate of the bottom plate and are adapted to be - multi-layered U-top and loaded with a spoon and a red bowl. The substrate protection mechanism includes - a part, which is adapted to support Selecting the substrate 127294.doc • 14· 200908071 to maintain a bottom surface of the bottom plate of the tool, wherein a pair of parallel transverse holes are formed in both side portions of the bottom plate of the substrate holding tool, and wherein the anti-tip member includes a restriction strip, The invention is configured to be inserted into the horizontal holes. The present invention is the above vertical heat treatment method, wherein each substrate holding tool has a bottom plate, a top plate and a pillar, and each pillar is disposed between the bottom plate and the top plate And adapting to hold the substrates in a multi-layer manner, wherein the substrate holding tool carrier mechanism includes a support member adapted to support a bottom surface of the bottom plate of the substrate holding tool, wherein the pair of side grooves are shaped In the two sides of the bottom plate of the substrate holding tool, and wherein the anti-tip member includes a restriction strip s which are respectively configured to be inserted into the side grooves. The present invention is the above vertical heat treatment method, wherein Each of the substrate holding tools has a bottom plate, a top plate and a pillar, and each of the pillars is disposed between the bottom plate and the top plate and is adapted to hold the substrates in a multi-layer manner, wherein the substrate holding tool carrier mechanism includes a support component. The bottom surface of the bottom plate of the substrate holding tool is adapted to be formed in the bottom plate of the substrate holding tool, and wherein the anti-tip component is protruded by a restriction into the restricted dog product system. The top of the branch part protrudes upward and is configured to fit into the upright hole in a small gap. The present invention is the above vertical heat treatment method, wherein each substrate is maintained and has a bottom plate and a pillar Each of the pillars is disposed between the bottom plate and the top plate and is adapted to hold the substrates in a layered manner, wherein the substrate holding tool carrier mechanism includes The base plate is formed by the base plate to form the annular shape H, and the bottom plate of the substrate holding tool is composed of a plurality of limiting protrusions 127294.doc •15-200908071 ν八山Still supported from the support and configured to face up against a small area. The inner circumferential wall of the annular bottom plate and thus the vertical heat treatment method according to the present invention can be used in a double In the form of the crystal boat system, by using one or two = rationally, it is prevented from being formed on the crystal boat carrier mechanism (ie, the US-plate-holding tool carrier mechanism) due to an earthquake such as an earthquake. MODE FOR CARRYING OUT THE INVENTION The present invention will be described based on a specific example of a yoke, which is considered to be the most exemplified in the present invention. The 'longitudinal section view of the vertical heat treatment device of the example, Fig. 2 is: the schematic view of the vertical heat treatment device - the manned area - the structure - the plan view" and Figure 3 is a schematic display - A perspective view of one of the states of the fixed-boat in a thermal blockFigure 4 is a perspective view showing a state in which the boat is fixed on the heat insulating seat by using a carrier mechanism, and Figure 5 shows - in which the two can be engaged with each other - the locking member and the member to be locked. A perspective view. As shown in Figures 1 and 2, a semiconductor manufacturing apparatus, a 10 - vertical heat treatment apparatus, is mounted in a clean room. The heat treatment apparatus 丨 includes a housing 2 which constitutes a complete outer housing of the apparatus. Within the outer casing 2, a handling and storage area Sa and a loading area Sb are provided, which are used to carry and store the carrier (or container) 3, each carrier comprising a plurality of semiconductor B rounds ( Or a substrate W, and the loading area Sb is provided as a working area 127294.doc • 16-200908071 (or a transfer area). The transport and storage area ~ is separated from the loading area (9) by a partition wall 6. A heating furnace 5 and a pair of wafer boats (or substrate holding tools) 4' are disposed in the outer casing 2, the heating furnace has an itching 5a formed at the bottom portion thereof, and each of the crystal boat systems is adapted to maintain a plurality of crystal boats therein The wafers W are configured to be carried into the furnace 5 to provide a heating process to the wafers w. Each of the wafer boats 4 can hold a plurality of sheets (e.g., about 1 inch) in a straight cubic direction at a predetermined pitch. 〇 to 15 )) wafer w. In the loading area ,, a loading operation for the wafers can be performed between each of the wafer boats 4 and the respective carriers 3, and can be compared with the heating furnace (5) Performing the loading and unloading operations for the respective boat 4. The furnace 5a of the heating furnace 5 is The state is provided by a cover 17 to be closed. The hot seat 19 is provided on the cover 17. Under the cover 17, a rotating mechanism 20' is provided which is adapted to rotate the cover 17 and the heat insulating seat 19. Further adapted to rise The lifting mechanism 18 that is high and lowers the cover 17 is attached to the cover 17. In the loading area Sb, a machine is provided adjacent to the heating furnace 5 at a position directly below the heating furnace 5. 22, by using a boat carrier The mechanism transports the wafer boats 4 between the heat insulating seat 19 and the machine table 22. Each of the carriers 3 is composed of a plastic container which can contain and transport a plurality of pieces in a multi-layer manner in a straight cubic direction with a predetermined space. For example, approximately 13^25 wafers] each wafer has a predetermined size, for example, -300 mm straight only while maintaining the wafers arranged in the horizontal direction. Each carrier 3 has a cover that can be separated therefrom (not shown) The cover is adapted to hermetically close a wafer take-out opening formed in a front surface of one of the carriers 3. 127294.doc 17 200908071 - The transfer cassette 7 is provided in a front surface of the outer casing 2, Used to actuate a handling robot by an operator or In and out of the vehicle 3. A door is provided to the transport cassette 7 so that it can be slidably opened and closed in a straight cubic direction. Within the transport and storage area, a support is provided near the transport cassette 7 A machine table 9' of each carrier 3 and a sensor mechanism 1G for opening and closing the cover of the carrier 3 to (4) the position and number of wafers of the wafers is provided behind the machine table 9. Above the machine table 9 and at At the upper portion of the partition wall 6, a storage rack 11 is provided for storing a plurality of carriers 3 thereon. A loading station 12 is provided on the partition wall 6 in the loading and storage area Sa, and the table 12 is It is used to support each of the carriers 3 to prepare for loading the wafer. A carrier mechanism 13 is provided in the handling and storage area Sa for use in the machine table 9, the storage rack 11 and the passenger station 12 Carry each carrier 3 in between. The handling and storage area Sa has an atmosphere that is cleaned by a fan passing unit (not shown). The loading zone Sa is also cleaned by a fan filter unit provided on one side thereof and maintained under a positive pressure atmosphere or an inert gas atmosphere (e.g., composed of a gas). In the isolation (4), an opening (not shown) is formed for moving from the side of the carrying and storing area to the side of the loading table 3 of the loading table 12 to contact the opening, so that the internal space of each load is The internal space of the loading area is connected. - Door 1 $7 is provided to open and close the opening of the partition wall 6 from the side of the loading area Sb. The openings provided in the partition wall 6 are formed to have substantially the same size as one of the take-out openings of the carrier 3, so that the wafers can be passed through. The loading and unloading of the cover 15' provides a cover for opening and closing each of the carriers 3 127294.doc • 18· 200908071 and a closing mechanism (not shown) and a for opening from the loading area % side and Close the door opening and closing mechanism (not shown). By the lid opening and the mechanism, the door opening and closing mechanism, the lid and the door can be respectively moved to open to the loading area sb. In this case, the cover and door 15 are respectively H such that they can be offset (or retracted) upwards or downwards to avoid interference with wafer loading. Below the loading station 12, a notch alignment mechanism 16 is positioned for aligning the notches provided in the individual perimeters of the wafers in a direction to match their crystal orientations. A notch alignment mechanism 15 as described below is provided to face the loading area sb and is configured to align a notch of the individual crystals to be transported by the loading mechanism 24 from each of the carriers 3 on the loading station 12. At an upper portion on the rear side of the loading region Sb, an upright heating furnace 5 is positioned which has a furnace 5& at its bottom portion, as described above. In the loading area Sb, the boat 4 is placed on the cover 17 via the heat insulating seat 19. The wafer boat 4 is made of, for example, quartz in which a plurality of wafers (e.g., about 1 to 150 wafers) are loaded in a plurality of layers in a vertical direction at a predetermined interval. In order to carry in and out of the boat 4 with respect to the heating furnace 5 and to open and close the furnace 5a', an elevator mechanism 18 for raising and lowering the cover 17 is provided. As described above, on the top portion of the cover holder 7, the heat insulating seat (heat blocking member) 19 is placed for suppressing the heat radiation generated by the furnace 5a when the cover 17 is closed using the cover 17. The boat 4 is placed on the top portion of the heat insulating seat 19. The heating furnace 5 mainly comprises a reaction vessel and a heating unit (heater) provided around the reaction vessel. Connecting a gas introduction system and an exhaust system to the reaction vessel, the gas introduction system is adapted to introduce a process gas and/or an inert gas (for example, N2) into the reaction vessel, and the row is 127294.doc -19 - 200908071 The gas system includes a vacuum pump that evacuates the interior of the reaction vessel to a predetermined degree of vacuum. The rotation mechanism 20 adapted to rotate the respective boat 4 via the heat insulating seat 19 is provided to the cover 17. In the vicinity of the furnace 5a, a baffle 21 is arranged to be moved (or pivoted) as needed in the horizontal direction to selectively open and close the crucible 5a. The shutter 21 is for closing the furnace 5a when the wafer boat 4 which has undergone the heating process is removed from the heating furnace 5 after the cover 17 has been opened. The baffle 21 includes a baffle drive mechanism (not shown) that is adapted to pivot the baffle 21 in a horizontal direction to open and close the baffle. On one side of the loading area S b (ie, on the side of the fan filter unit 14), a wafer machine (also referred to as a boat platform or substrate holding tool machine) 22 is provided for supporting the crystal thereon. The boat 4 is ready to be loaded into the boat w. Although the boat platform 22 may be a single unit, the preferred machine base 22 includes two stations, namely a first machine (or loading station) 22a and a second machine (or spare station) 22b. It is arranged along the fan filter unit 4, as shown in Figure 2. Between the lower portion of the loading area sb and between the first machine 22a and the second machine 22b, a boat carrier mechanism (or substrate holding tool carrier mechanism) 23' is provided to adjust the boat Between the machine table 22 and the heat insulating seat 19 on the cover 17, more specifically, the first machine bed or the second machine table 22b of the boat machine table 22 and the heat insulating seat 19 on the cover 17 in a lowered position. The wafer boat 4 is carried between and between the first machine 22a and the second machine 22b. Further, in the passenger area Sb, a manned mechanism 24 is provided which is adapted to be clearly between the respective carriers 3 on the carrier 12 and the wafer boat 4 on the boat table 22 at the loading station. Between the carrier 3 and the notch alignment mechanism on the 12, between the notch 127294.doc -20-200908071 alignment mechanism 16 and the wafer boat 4 on the first machine m of the boat machine 22, and in the The wafers 4 are loaded between the empty carriers 3 on the wafer loading stage 12 after the heating process on the machine 22a. As shown in Fig. 3, each of the boats 4 includes a top plate 4a and a bottom plate. And a plurality of (for example, one) pillars 4C, each of which is provided on the top plate and the bottom door. As shown in Fig. 4, in each of the pillars 4c, at a predetermined interval, similar to - the comb is formed for - The multi-layered approach maintains the indentation of the wafers. The two (left and right) pillars on the front side are positioned to define a slightly wider workspace to facilitate the placement and removal of the wafers through the space thus provided. The boat carrier mechanism 23 includes an arm adapted to support a single boat 4 in a vertical direction and can extend and contract in a horizontal direction. Specifically, the boat carrier mechanism 23 includes a first arm 23a that is pivotable in a horizontal direction and a flat and generally U-shaped second arm that is rotatable and movable (hand) 23b in a straight cube. Supporting to pivot as needed in a horizontal direction at one of the distal ends of the first arm 23a and configured to support a bottom surface of the boat 4 (ie, a bottom surface of the bottom plate 4b); a drive unit 23c, It is used to drive both the first arm 23a and the second arm 23b; and a lifting mechanism 23d, which is adapted to raise and lower all the components. In this configuration, the first arm 23a is synchronized with The horizontal pivotal movement of the arm 23b enables the transport of the boats in a horizontally linear direction. Due to such extension and contraction of the arms, the area in which the boat 4 is to be carried can be minimized, thereby reducing the width of the device. And a length. On a top surface of one of the second arms 23b, a support member 6 is provided for supporting the bottom surface of the bottom plate 4b of the boat 4 at a plurality of points. Preferably, the support members are 127294.doc -21, 200908071 6 0 is formed of, for example, a heat resistant resin and configured to be used at multiple points ( For example, three points support the bottom surface of the boat 4. The loading mechanism 24 includes a horizontally movable base 24a and a plurality of (for example, five) thin plate-shaped loading arms 24b provided on the base 24a. Each arm of 24b is used to place a semiconductor wafer thereon and is configured to advance and retract as needed with respect to the base 24a. For the five loading arms 24b, preferably four other The spacing between the loading arms can be based on a change in the vertical direction of a center loading arm. A separate advancement and retraction of the center piece feed type loading arm and the other four loads can be performed on the base 24a in an independent relationship. The base 24a can also be moved in a straight cubic direction by actuating a lifting mechanism 24c provided on the other side outside the loading area. In order to prevent the wafer boat 4 placed on the heat insulating seat 19 from being tilted by an external force such as an earthquake, the hooks 25 (locking parts) are provided at the bottom plate 4b of each of the boat 4, while providing locking for respectively locking or engaging the locking members 25. A groove (to be locked) 26 to an upper portion of the insulation seat 9. As shown in FIGS. 5 to 9, when the wafer boat 4 is positioned just above the heat insulating seat by using the boat carrier mechanism 23, the boat 4 and the heat insulating seat 19 can be rotated by a rotating mechanism 2 at a predetermined angle ( For example, 90 degrees) the thermal insulation seat 19 is rotated to engage and separate from each other. As shown in FIGS. 3 to 5, each of the boat 4 has a bottom plate having an annular shape 'and the heat insulating seat 19 has a plurality of (for example, four) columns 19a, each of which is adapted to be circumferentially oriented at an appropriate interval. Supporting the bottom surface of the bottom plate 4b. More specifically, the heat insulator 19 includes a disc-shaped base 19b; a plurality of posts 19a extending upward from the base 19b; and a plurality of heat shields 19c along the posts 19a in a straight cubic direction Each spacer 19j is configured in a multi-layer manner using a suitable space of 127294.doc • 22-200908071. The components are formed, for example, of quartz. Each of the columns 19a has a cylindrical shape and has a top end member 19e integrally formed with the column and closing its open end. In order to prevent damage or breakage of the columns m due to the difference between the internal pressure and the external pressure, a hole W is appropriately provided in the side faces of the respective columns 19a for communicating the internal space of the column with the outside. In each column! At the top end of 9a or in each of the top end members 19e, an anti-shock surface % and a position portion 19h' are provided on the bottom surface of the bottom plate (10) of each of the wafer boats 4 on the mounting surface, and the positioning parts are mounted The face 19g extends upwardly and is adapted to contact the inner circumference of the bottom plate to clamp the bottom plate 4b. In order to facilitate the fitting or engagement of the positioning members i9h with respect to the inner circumference of the bottom plate 4b, it is preferred to provide an inclined surface (9) to one of the top edges of the positioning member 195h. Further, in order to support the annular bottom plate of the wafer boat 4, the diameter of a circle which is circumscribed on the individual columns (10) which are disposed inwardly in a proper space along the circumference of the bottom plate is designed to be smaller than the outer diameter of the bottom plate 4b. Because &, after placing the wafer boat 4 on the top end of each column 19a of the heat insulating seat 19, the second arm 23b of the boat carrier mechanism 23 will never interfere with the columns 19a while still supporting the bottom plate of the boat* The bottom of 4b. As shown in FIGS. 5 to 8, as the parts to be locked, each of the locking grooves 26 is formed on the outer side (four) of each of the columns 19a, and at the same time - provides a [section] at a position corresponding to each of the lock grooves 26. Each of the hooks is hooked to the bottom surface of the base plate as a locking member configured to lock or engage each of the locking recesses 26. Each of the hooks 25 includes an upright member 25a and a horizontal member 25b which extends downwardly from the bottom surface of the bottom plate 4b and which protrudes radially inward from the crotch end of the upright member 25a. Each locking groove % is configured such that 127294.doc 200908071 is to be rotated by the rotation mechanism 2 when the wafer boat 4 is carried by the boat carrier mechanism 23 and is held just above the insulation seat 19 At an angle, the horizontal part 25b of each corresponding hook 25 can enter the locking groove 26 in the circumferential direction. It will be appreciated that each of the locking recesses 26 is designed to have a width and a depth that does not interfere with the insertion of the horizontal part 25b of each corresponding hook 25 into the recess 26. In this case, after stopping the rotation of the heat insulating seat 19 at a position permitting locking between the respective hooks 25 and the respective locking grooves 26, the boat 4 is further lowered by actuating the boat carrier mechanism 23 The boat 4 is placed on the column 19a of the heat-insulating seat. At this time, it is preferable to design the width of each locking groove % so as not to contact the locking groove 26 with the horizontal part 25b of each corresponding hook 25, because this design can control or prevent the occurrence of unwanted particles (see Fig. 6). . It is also preferred that the end of each horizontal part 25b and the bottom surface of each of the locking recesses respectively form a curved surface which is centered at the center of rotation of the heat insulating seat 19. As the rotating mechanism 2, for example, the above-mentioned τ〇κκγ〇 can be applied. That is, as shown in Fig. 1A, a fixing member 27 having a shaft hole is provided at the bottom portion of the cover opening. Around the fixing member 27, a rotary cylinder 28 having a cylindrical shape having a bottom portion is rotatably provided via bearings or magnetic fluid seals (not shown) disposed at the upper and lower portions. A rotating shaft 29 is provided to the rotating cylinder 28 to be freely inserted through the shaft hole of the fixing member 27. One of the upper end portions of the rotating shaft freely extends through the center portion of the cover 17, and the rotating machine % is attached to the upper side of the rotating shaft 9. Score. The rotating machine 3 is positioned to define a gap with respect to the top surface of the cover I?, and the heat insulating seat 19 is placed on the rotating machine 30, wherein the base 19b of the heat insulating seat 19 is fixed to the base through the fixing member Rotary machine 127294.doc •24·200908071 Table 30. A motor 32 for rotating the cylinder 28 is connected to the rotating cylinder 28 via a timing belt %. In order to automatically control the rotating heat insulating seat 19 to each of the hooks 25 and each Corresponding to the position where the locking grooves are engaged or disengaged with each other, a preferred rotating mechanism includes a sensor 34 and a control unit 35 for detecting in the rotation direction of the heat insulating seat 19. a starting point, and the control unit (4) is used to control the rotation of the heat insulating seat 19, so that the heat insulating seat 19 can obtain a detection signal between the hooks 25 and the locking groove 26 based on a detecting signal sent from the sensor 34. The position for enabling the engagement or the position enabling the separation. The outer circumferential portion of one of the rotating cylinders 28 - the member to be detected (or the pusher) 36 protrudes outwardly and is used for the detecting member 36 The sensor 34 is located under the cover 。. The control unit is systemized to control The wafer boat 4 is continuously rotated by the heat insulating cylinder 19 during the heating process. ▲ In order to prevent the wafer boat 4 from being dumped during the transfer of the wafer boat 4 to be transported by the boat carrier mechanism 23, etc., in the second The anti-tip member 37 is provided at the top portion of the arm 23b. As shown in Figs. 4 and 15 to 23, the anti-tip member 37 is provided above the second arm 23b so that it can be at the member 37 and the second arm 23b&gt piM , a bottom plate 4b of the boat 4 is held from above and below. As shown in Fig. 2, the anti-tip member 37 is located on the side of the base portion 1 (behind the branch member 60) on the top surface of the second arm 23b. And including a limiting member 37& which is configured to extend on the surface of the bottom plate 4b of the wafer boat 4 supported by the supporting member 6A, at the same time The anti-tip member 37 is composed of a base and a limiting member 37a, and the base is fixed to the second arm by a fixing member (for example, a screw 61). Doc -25- 200908071 200908071

The top surface of the base portion' has a flat and generally u-shaped shape that extends forwardly from the base 37b. The restricting member 37a of the second arm 23b and the supporting members 6 are configured to define a space therebetween, wherein the bottom plate of the boat 4 can be horizontally inserted in a non-contact relationship. The restricting member 37a corresponds to the second arm 23b to form a straight and generally u-shaped shape. In the base portion of one of the restricting members 37 & a notch 37c is formed so as not to interfere with one of the strut members (see Fig. 4). In addition, the left and right arm portions of the restraining members 37 & which are simultaneously extended forward are configured to define a space therebetween so as not to interfere with the pillars 4c. Similar to the arms 23a, 23b of the boat carrier mechanism 23, the anti-tip member 37 is formed, for example, by a knot. In order to prevent the wafer boats 4 placed on the boat platform 22 from being tilted due to an external force such as an earthquake, the following structure is employed. That is, as shown in Figs. 2, 11, 12 and 14 to 15 , a boat positioning mechanism (or substrate holding tool positioning mechanism) 38 for positioning each of the boat 4 is provided to the boat table 22. The boat positioning mechanism 38 includes a pair of rollers 38b that can be actuated by the cylinder - in the boat

The machine table 22 is closer to each other in the diametrical direction and spaced apart. On the other hand, in the inner circumference ±4 of the bottom plate 4b of the boat 4, a dome-shaped positioning and engaging recess 40 are provided to face each other. Each of the positioning and engaging recesses is in contact with the set (4) to engage the respective rollers when the rollers 38 are extended or spaced apart from each other. Each of the positioning and engaging recesses 40 is opened to define a predetermined angle θ, such as 12 degrees. Therefore, even if the boat 4 is placed on the boat platform 22 and slightly deviated from an appropriate position, the boat 4 can be properly repositioned due to such an open configuration. On the wafer boat table 22, an Xensen _^4 114 4 day Japanese boat gripping mechanism (or substrate holding tool gripping mechanism) 42 is provided for gripping the boat to prevent it from falling over.舟舟抓127294.doc -26· 200908071 Holding mechanism 41 packs of circular disc-shaped gripping parts 41a 3 8 b One of the upper parts is combined with each corresponding rolling drum 38b to engage and position 1 into the gripping part仏Is configured to correspond to the top surface of the bottom surface 4b of the wafer boat 4 when the corresponding f, 5 groove 40 is in the grip part 仏 and the crystal boat machine 22 (more specifically, the boat machine mouth The bottom plate 4b is gripped between a top surface.

More clearly and anciently, the BA 欠 〇 〇 〇 〇 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 包括 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥It can be moved on the J疋42. In this manner, the boat 4 is placed on the top plate 44. The plate 42 and the top plate 44 are separated into a ring shape. The it bead bearing 43 is composed of a plurality of small balls 43b held by the brackets. Since the pin 45 and the protruding plate 45 protruding from either of the top plate and the fixing plate are formed in the other of the top plate 44 and the fixing plate 42, the pin 45 can be loosely fitted to the control hole # therein, The top plate 44 is moved in the horizontal direction within a predetermined range. Further, a plurality of spring ties are provided between the top plate 44 and the fixed plate 42 to return the center of the top plate 44 to a position corresponding to the center of the boat table 22. The heart, in the boat platform 22, and particularly in the first machine table, provides a top plate fixing mechanism for fixing the top plate 4 after the wafer boat 4 has been positioned, so that it is horizontal during loading of the boat 4 The direction does not shift the top plate 44. The top plate securing mechanism 48 includes a frame 49 having a generally u-shaped cross section and an air cylinder 50. The frame 49 includes an upper member 493 and a lower member 49b. The upper member 49a is fixed to a bottom surface of the top plate 44, and the fixed plate "and the ball bearing" is interposed between the upper member 49a and the lower member 49b with a predetermined gap. The air cylinder 50 is provided to the lower portion 49b of the frame 49 and includes a extendable 127294.doc -27-200908071 extended pressing member 50a configured to be used to press the part 5& The parts are interposed between 49a to fix the fixing plate 42 and the ball bearing 43 °. Further, each of the boat platforms 22 includes an adapter plate 5 1 for fitting the pair of left and right cylinders 38a, 38b, And a guide rail 53 is provided to each of the adapter plates 51. The guide rail 53 is adapted to support a movable body 52 such that it can be moved as desired in the horizontal direction. Each of the rollers 3 is rotatably supported around an axis of an upper end portion of a post 54 extending upward from the movable body 52. A disc-shaped gripping member 413 is provided to one of the upper ends of the respective rollers 38b. Since each of the rollers 38b will contact the bottom plate of the wafer boat 4 after the heating process, it is preferable that the roller 38b is formed of a heat-resistant resin. On one side of each of the boat platforms 22, a sensor 55 is provided for detecting the presence or absence of the boat, and will be executed when the sensory 55 detects that the boat 4 is placed on the machine. A positioning operation. Next, the operation of the vertical heat treatment apparatus and the vertical heat treatment method as described above will be explained. First, one of the wafer boats 4 in which the plurality of wafers w are held therein and placed on the cover 17 via the heat insulating seat 19 and the heat insulating seat 19 are carried into the heating furnace 5 by the raising of the cover 17 The furnace 5a of the heating furnace 5 is then closed by a cover 17. Thereafter, the wafers W are subjected to a heating process at a predetermined temperature and at a predetermined temperature for a predetermined period of time while being heated by the rotating mechanism 20 via the heat insulating seat 19 Rotate the boat 4 within 5. During the heating process, the wafer W is loaded onto another 3 boat 4 placed on the first machine a of the boat platform 22. In this case, since the loading mechanism μ transfers the wafer 127294.doc 28-200908071 to the release station, it is placed in the empty carrier 3 on the planting table, and the wafers have undergone the previous heating process. And carrying people on the boat 4. Thereafter, the unprocessed wafers W are loaded onto the empty boat 4 from the other carrier 3 storing the unprocessed crystals W, and then carried on the manned table 12. Once the heating process in the heating furnace 5 is completed, the cover 17 is lowered to carry the wafer boat 4 out of the heating furnace 5 to the outside of the loading area. Subsequently, the boat carrier machine m is horizontally adjacent to the boat 4 (see Fig. 6) so that the bottom plate 4b of the boat is placed at a position between the second arm (or hand) 2π and the restricting member. Thereafter, due to the rise of the second arm 23b, the wafer boat 4 is supported by the support members 6 () when the wafer boat 4 is raised to a pre-positioning position (see Fig. 7). In this case, after the heat insulating seat 19 is rotated at a predetermined angle (for example, 90 degrees) by actuating the rotating mechanism 2, each of the hooks 25 and the corresponding locking groove % are respectively configured to be separated therebetween. Location (see Figure 8). Further increasing the boat 4 until a higher predetermined level (at which the hooks do not interfere with the columns of the insulator), so that the boat 4 can be carried out to the second machine 22b of the boat platform 22 ( See Figure 9). In this manner, the boat 4 can be placed on the second machine 22b. During the transfer of the boat 4, at a predetermined gap, the restricting members 37 & of the anti-tip member 37 are opposed to the top surface of the bottom plate 4b of the wafer boat 4 supported by the supporting members 6 of the second arm 23b. Thus, even if the boat 4 will start tilting due to a force such as an earthquake or any other shaking, the tilt can be suppressed or prevented, thus preventing the boat 4 from tipping. Further, the boat 4 placed on the hole of the second machine 2 can be firmly positioned by the positioning mechanism 38 and held securely by the disc-shaped dumping preventing portion 41a, thereby preventing the crystal from being more femalely The boat 4 dumped. I27294.doc • 29· 200908071 Similarly, the boat 4 placed on the first machine table 22a can also be fixedly positioned by the positioning mechanism 38 and firmly held by the disc-shaped dumping preventing part 41 a to prevent The boat 4 is dumped. Then, after the restriction of the dump preventing portion 41a is released, the wafer boat 4 on the first machine table 22a is transported to a position above the heat insulating seat 19 on the cover 17, while still being the second arm 23b of the boat carrier mechanism 23. To support it. Subsequently, the boat 4 is lowered onto the heat insulating seat 19 by actuating the boat carrier mechanism 23, and just before the boat 4 is fixed to the heat insulating seat 19, the heat insulating seat 19 is rotated by the rotating mechanism 20 (for example) 9 The twist 'in order to obtain a position where each hook 25 and each corresponding locking groove 25 can be locked to each other. Thereafter, the boat 4 can be placed on the heat insulating seat 19. In this manner, once the wafer boat 4 is fixed to the heat insulating seat 19, the wafer boat 4 can be carried into the heating furnace 5 by raising the cover η, and then the heating process can be started. During the heating process, the other wafer boat 4 placed on the second machine 22b is transported to the first machine table 22a by the boat carrier mechanism 23. Thus, the carrier 3 that transfers the heat-treated wafer from the wafer boat 4 to the loading station 12 by the loading mechanism 24 is continuously executed, and then the unprocessed wafer is loaded from the other carrier 3 on the loading table 12 to On the boat 4, this increases the yield. In this manner, according to the vertical heat treatment apparatus 1 of the present embodiment, the hooks 25 and the locking recesses 25 are provided to the bottom portion of the boat 4 and the upper portion of the heat insulating seat 19, so that the hooks 25 and Each of the corresponding locking grooves % can be locked and separated from each other by rotating the heat insulating seat 19 at a predetermined angle due to the rotating mechanism 20 while the boat 4 is positioned just above the heat insulating seat 19 by the boat carrier mechanism 23. Therefore, in the case of adopting a so-called twin boat system form, the apparatus can use this simple structure to prevent the crystal placed on the heat insulating seat 9 127294.doc -30- 200908071 The boat 4 may be dumped due to an external force such as an earthquake. In this case, each of the boat 4 includes an annular bottom plate, and the heat insulating seat 19 includes a plurality of columns 19a' which are used for the bottom surface of the floor bottom 4b along the circumferential direction thereof in a proper space. Each of the locking recesses (i.e., the recessed portions to be locked) 26 is provided in the outer side of each of the posts 19a' and the hooks (i.e., the L-shaped latching portions) 25 are provided to the bottom surface of the bottom plate 4b such that Each of the hooks 25 can lock each of the corresponding locking grooves 26 as desired. Thus, both the locking and the release between the heat insulating seat 19 and the boat 4 can be ensured and promoted by using this simple structure. The rotating mechanism 20 includes a sensor 34 and a control unit 35 for detecting a starting point in the rotation direction of the heat insulating seat 19, and the control unit π is used for transmitting based on the sensor 34. The detection signal controls the rotation of the thermal insulator 19 between the individual hooks 25 and the locking recess 26 to be in a position for enabling engagement or a position for enabling separation. Thus, both the locking and the release between the heat insulating seat 19 and the boat 4 can be further ensured and promoted. According to the feature 5, since the boat carrier mechanism 23 includes the anti-tip member 337 for controlling or preventing the boat 4 from falling over, the boat 4 can be safely controlled so as not to fall during or during the transfer of the boat 4. Therefore, in the case of adopting a so-called twin boat system, the apparatus can employ this simple structure to prevent the boat 4 placed on the boat carrier mechanism 23 from being dumped and/or destroyed by an external force such as an earthquake. In this case, the boat carrier mechanism 23 includes the support members 6〇, each for supporting the bottom surface of the bottom plate 4b of the wafer boat 4, and the anti-tip member 37 includes a restriction member 37a configured to A predetermined gap is opposite to the top surface of the bottom plate 4b supported by the support members 60. This further simplifies the structure of 127294.doc -31 200908071 and reduces production costs. In addition, the boat gripping mechanism 41 also provides for holding or holding the boat 4 placed on the boat platform 22 to prevent the boat 4 from tipping over. Therefore, it is possible to more safely prevent the wafer boat 4 that has been transported to the boat table 22 from falling over. Therefore, in the case of adopting a so-called twin boat system form, the apparatus can use this simple structure to effectively prevent the boat 4 which can be placed on the boat platform 22 from being dumped due to an external force such as an earthquake. In this case, the boat platform 22 includes a boat positioning mechanism 38 adapted to position the boat 4 by relatively extending or separating the extendable drum 38b to engage it with the corresponding positioning and engagement grooves. 4〇, each groove is provided in the inner circumferential portion of the annular bottom plate of the boat 4. In addition, the boat gripping mechanism 41 includes a boat gripping member 4u, each of which is configured to use α in the boat positioning mechanism 38; and when the cartridge is extended or spaced apart from each other, and the bottom plate 4b of the boat 4 The top surface is opposite, and the base 4 is grasped between itself and the boat platform 22. Therefore, the positioning of the boat 4 can be simultaneously performed and the tilting of the boat 4 placed on the boat table 22 due to an external force such as an earthquake can be prevented. This configuration can be obtained only by modifying the rolling passes of the day/day boat positioning mechanism 38, thereby simplifying the structure and reducing costs. According to the above-mentioned state, the state of the wafer boat 4 can be effectively prevented from being dumped due to an earthquake or the like in all cases where the boat 4 is placed on the heat sink W, the boat platform 22 and the boat carrier mechanism 23. Or destroyed. Figure 13 is an illustration of a key portion of an enlarged view of the enemy's large section showing an alternative to the insulating seat 19. In the alternative embodiment shown in FIG. 13, a female screw hole 42 is provided in the top end member 19e of each column, and the female screw hole 42 is adapted to fit. A U-foot screw is used to fix the bottom plate of the boat 4 127294.doc • 32- 200908071 4b to the top end member 19e. Each of the fixing screws 41 engages the female screw hole 42 after the respective V-shaped D grooves 40 of the bottom plate 4b. Thus, one of the heads 41 of the fixing screws 41 is fastened to the top surface of the bottom plate 4b, whereby the bottom plate is fixed to the respective posts 19 & The use of this heat insulating seat 19' as a whole can be used as a single crystal boat system by fixing the heat insulating seat 19 to the boat 4 using the fixing screws 4. Otherwise, it can also be used as a twin boat system by removing the attachment screws 4 1 . Figure 1 is a side view of another phantom of the boat anti-tip component of the boat carrier mechanism. The boat carrier mechanism 23 includes a branch member 60, each adapted to support the bottom surface of the bottom plate 4b of the boat 4, and the anti-tip member includes a limiting member 37a and a driving unit 62, the limiting member being configured Opposite the top surface of the bottom plate of the boat 4 supported by the support members 6〇 under a pre-clamping gap, the 6-Hail drive unit is adapted to laterally protrude and retract the restriction member. For example, as the drive unit 62, An air cylinder can be applied. Thus, in use, the restraining member 37a can project forwardly from the base, and when not in use, it can be retracted (i.e., returned or pulled to its waiting position). This restriction member 37a never interferes with the boat 4 during the wafer boat 4 transfer operation. Of course, according to this embodiment, the same effects as the previous embodiment can be obtained. Figures 1 7 and 18 show the crystal, respectively. A side view of another example of the boat anti-tip component of the boat carrier mechanism. In the embodiment shown in Figure 17, the boat carrier mechanism 23 includes support members 6〇, each adapted to support the bottom plate of the boat 4 a bottom surface, and the anti-tip component 37 includes a top plate pressed zero 63, which is configured to extend upwardly and adjust behind the support members 60 to press the top plate 4a of the boat 4. In this case, the top plate pressing member 63 is comprised of a post 63a and I27294.doc 33 - 200908071 consisting of a hole 63b extending upward from the top surface of the base of the second arm 23b and provided in the top plate 4a. The through hole 63b, the end of the post 63a can be inserted from below. The hole 63b' adds a hanging portion: c to the top plate 4a so as to protrude horizontally from the top plate 4a. In this manner, the hole 63b is formed upright in the hanging portion 63c. The preferred hole 6 is slightly larger than the column. The diameter of 63a is formed to facilitate insertion of the insertion post 63a therein. According to this embodiment, when the wafer boat 4 is supported by the support members 6, the column (4) can be inserted through the hole (4) of the top plate cymbal from below, thereby further In the embodiment shown in Fig. 18, the top plate pressing member 63 is composed of a post 63a and a top portion restricting member (4) which faces upward from the top of the base of the second arm coffee. Extending the top portion restraint is provided on the post 63a The top end is configured to oppose the top surface of the top plate 43 of the boat 4 at a predetermined gap. The top portion restriction 63d is designed to extend horizontally from the top end of the post 63a at the top plate erosion. For example, when the wafer boat 4 is supported by the support members 60, the top portion (4) provided at the top end of the column can be opposed to the top surface of the top plate 4a, thereby preventing the boat 4 from falling over. Figures 23 through 23 show plan and side views, respectively, of other examples of the boat anti-rolling member of the boat carrier mechanism. Similar drawings in the drawings are by similar reference. The digits are specified, so the details are not described below, and the month is not described. In the specific embodiment shown in Fig. 19, the boat G includes a bottom plate 4b, a top plate 4a and a blunt plate, and t It is provided at the bottom plate and in a multi-layer manner to hold the wafers. The boat carrier 127294.doc -34- 200908071 The mechanism 23 includes a second support arm 23 (or support member) for supporting the bottom surface of the bottom plate 4b of the boat 4. In the top surface of the bottom plate of the wafer boat 4, a pair of parallel restricting grooves 65 are formed. The anti-tip member 37 includes a pair of restraining strips 37a (which are identical to the restraining members described above), each configured to fit within the respective restricting recesses 65 against a relatively small gap. Each of the restriction strips 373 forms a thin plate. Although the pair of restriction strips 37a are depicted in the drawings, the anti-tip components can be configured to have a generally flat U-like form. On the other hand, the restriction grooves 65 correspond to the restriction strips 37a. A pair of parallel grooves are formed. A small gap is also provided between each side of each of the restricting grooves 65 and each side of each of the corresponding restricting strips 373. According to this embodiment, when the boat is shaken due to an earthquake or the like The side faces of the respective restricting grooves 65 will contact and engage the corresponding side faces of the respective restricting strips 37a, and the bottom surface of the restricting recesses 65 will contact and engage the bottom surface of the restricting strips 37a. Therefore, it is possible to safely prevent the boat 4 from falling over. In the embodiment shown in Fig. 20, a pair of parallel transverse holes are formed "in both side portions of the bottom plate 4b of the boat, and the anti-tip member 37 includes restriction strips 37a" which are respectively configured to be inserted The transverse holes are "inner. The transverse holes are formed to have a rectangular cross section through which the corresponding thin plate-like restraining strips 37a can be loosely inserted. Between the inner walls of the transverse holes 66 and the respective restricting strips' Provide - small gap. Based on this specific For example, when the boat 4 is shaken due to an earthquake or the like, the inner walls of the respective lateral holes 66 will contact and engage the corresponding restricting strips 37a, thereby safely preventing the boat 4 from falling over. In the specific embodiment shown in FIG. - the opposite side groove 67 is formed in both sides of the bottom plate 4b of the boat, and the anti-tip member 37 includes a restraining strip 127294.doc • 35- 200908071 37a, which are respectively configured to drag and drop The side grooves 67 are formed to have a U-shaped surface, which is inserted into each of the corresponding thin plate-shaped restriction strips 3 7 a. A small gate weight is provided between each inner wall of each of the m-shaped side grooves 67 and each corresponding restriction strip 37a. According to this specific embodiment, when the boat 4 is shaken due to the earthquake睥, long time 丨々 切 切 切 , , , , , 久 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切 切In the embodiment shown in Fig. 22, a plurality of upstanding apertures are formed in the bottom plate 4b of the wafer boat 4, and the anti-tip member 37 Formed by the restraining projections 7' each of the restraining projections protrudes upward from the tribute of the hand (or the branch part) 23b and is configured to fit within each of the upright holes (10) with a small gap. Each of the upright holes 68 is formed to have a circular transverse cross section. Preferably, the upright holes 68 are provided at two (i.e., left and right) points of the bottom plate of the wafer boat 4. Although the figures are erect The hole 68 is a through hole, but it may not extend through the bottom plate 4b, but may sink into the top surface of the bottom plate (the partial flattening holes define protrusions 70 to form a cylindrical shape. According to this embodiment, When the boat 4 is shaken due to an earthquake or the like, the inner circumferential wall of each of the upright holes (9) of the bottom plate 4b of the boat 4 will contact and engage the side of each corresponding protrusion 70 extending upward from the hand 23b, thereby safely preventing The boat 4 is dumped. In the embodiment shown in Fig. 23, 'the bottom plate of the boat 4 is formed to have a meandering shape' and the anti-tip member 37 includes a plurality of (for example, three) restricting protrusions 7 1 , each from the supporting member 23b. The top surface projects upwardly and is configured to oppose the inner circumferential wall 4e of the annular bottom plate 4b with a smaller gap. Each of the restricting projections 7 1 is formed in a cylindrical shape and arranged at an equal interval along the circumferential direction 127294.doc • 36 - 200908071. According to this embodiment, when the boat 4 is shaken due to an earthquake or the like, the inner circumferential wall 4e of the bottom plate 4b of the boat 4 will contact and engage the sides of the plurality of restriction projections 71 extending upward from the hand 23b, Safely prevent the boat 4 from falling over. As described above, the specific embodiments of the present invention have been shown and described, but the present invention is not limited to the specific embodiments, and various modifications of the design are possible without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal cross-sectional view schematically showing an upright vertical heat treatment apparatus according to a specific embodiment of the present invention. Figure 2 is a plan view schematically showing a configuration of one of the loading regions of the vertical heat treatment apparatus. Fig. 3 is a perspective view showing a state in which a boat is fixed on a heat insulating seat. Figure 4 is a sticky view - a shoulder is not - a strong force that can be placed on the thermal insulation by a carrier mechanism. Fig. 5 is a view showing one of the states in which a locking part and a to-be-locked part can be locked to each other. Fig. 6 is a view showing a state in which - #山, in which the boat is placed on the heat insulating tube. Figure 7 is a diagram of the turn-over, ‘‘, and only—the one that raises the boat to a predetermined level when carrying the boat from the insulation. Fig. 8 is a perspective view showing a state in which _ π, π π π π π π π π π π π π π π π π π π π π π 127294.doc -37- 200908071 Figure 9 shows a diagram of the state in which it is raised from the adiabatic money to a level of position and then laterally. Fig. 10 is a view schematically showing a rotating mechanism of the heat insulating seat. Figure η is a plan view schematically showing a positioning mechanism of a boat on a boat platform. Figure 12 is an enlarged cross-sectional view taken along the line Α_Α of the figure ". Figure 13 is an enlarged cross-sectional view of a key portion showing an alternative to the insulating seat. Fig. 14(b) is a schematic cross-sectional view showing an example of one of the boat platforms. Figure 15 is a side elevational view showing one example of a boat anti-tip component of the boat carrier mechanism. Fig. 16 is a side elevational view showing another example of the boat anti-tip member of the boat carrier mechanism. Figure 17 is a side elevational view showing another example of the boat anti-tip member of the boat carrier mechanism. Figure 18 is a side elevational view showing another example of the boat anti-tip member of the boat carrier mechanism. Fig. 19(a) is a plan view showing another example of the boat anti-tip member of the boat carrier mechanism, and Fig. 19(b) is a side view thereof. Fig. 20(a) is a plan view showing still another example of the boat anti-tip member of the boat carrier mechanism, and Fig. 20(b) is a side view thereof. — Figure 2 1 (a) is a plan view showing still another example of the boat anti-tip component of the boat carrier mechanism, and Figure 21 (b) is a side view thereof. 127294.doc •38· 200908071 Figure 22(4) shows a plan view of a boat anti-tip component of the boat carrier mechanism, and Figure 22(b) shows a side view. Fig. 23 (4) is a plan view showing an example of the boat anti-tip member of the boat carrier mechanism, and Fig. 23 (b) is a side view thereof. [Main component symbol description] Another and another 1 vertical heat treatment device 2 Housing 3 Carrier 4 Substrate holding tool / wafer boat 4a Top plate 4b Base plate 4c Post 4d Groove 5 Heating furnace 5a 埠6 Isolation wall 7 Transfer 埠8 Door 9 Machine 10 Sensor mechanism 11 Storage rack 12 Loading table 13 Vehicle mechanism 15 Door 127294.doc -39· 200908071 16 Notch alignment mechanism 17 Cover 18 Lifting mechanism 19 Insulation seat 19a Column 19b Disc-shaped base 19c heat shield 19e top part 19f hole 19g mounting surface 19h positioning part 19i inclined surface 19j spacer 20 rotating mechanism 21 baffle 22 substrate holding tool machine / boat table 22a first machine (or loading table) 22b Second machine (or standby) 23 substrate holding carrier mechanism 23a first arm 23b second arm 23c drive unit 23d lifting mechanism 24 loading mechanism 127294.doc -40- 200908071 24a horizontally movable base 24b thin plate Inlet arm 24c Elevating mechanism 25 Hook 25a Upright part 25b Horizontal part 26 Locking groove 27 Fixing part 28 Rotating cylinder 29 Rotating shaft 3 0 Rotary table 31 Fixing part 32 Motor 33 Timing belt 34 Sensor 35 Control unit 36 To-be-detected part 37 Anti-tip part 37a Restricting piece 37b Base 37c Notch 38 Boat positioning mechanism 38a Cylinder 38b Roller 127294.doc -41 - 200908071 40 V-shaped positioning and engaging recess 41 Crystal boat gripping mechanism / solid 41a Disc-shaped gripping part 42 Crystal boat gripping mechanism / solid 43 Ball bearing 43a Ring bracket 43b Small ball 44 Top plate 45 Pin 46 Control Hole 47 Spring 48 Top plate fixing mechanism 49 Frame 49a Upper part 49b Lower part 50 Air cylinder 50a Extensible pressing part 51 Adapter plate 52 Movable body 53 Guide rail 54 Column 55 Sensor 60 Support 61 Screw 127294.doc 42- 200908071 62 Drive unit 63 Top plate press part 63a Column 63b Sub L 63c Suspension part 63d Top part limiter 65 Restriction groove 66 Cross hole 67 Side groove 68 Upright hole 70 Restriction protrusion 71 Restriction protrusion Sa Handling and storage area Sb Loading area W wafer 127294.doc -43 -

Claims (1)

200908071 X. Patent application scope: 1. An upright heat treatment device comprising: a heating furnace having a furnace formed on a bottom portion thereof; ^ maintaining a support for the substrate, each being adjusted in a multi-layer manner Substrate and configured to be carried into the furnace to perform a heating process on the substrate; a cover adapted to close the furnace of the furnace; a thermal block mounted to the cover a lifting mechanism adapted to raise and lower the cover; a substrate holding tool machine disposed adjacent to a position directly below the heating furnace; and a substrate holding guard carrier mechanism, And a substrate holding tool for transporting the pair of substrate protection tools between the position on the heat sink and the position on the machine, wherein the anti-tip system is adapted to prevent each substrate from holding the tool The substrate holding tool carrier mechanism is provided. 2. The vertical heat treatment apparatus of claim 1, wherein the u substrate holder has a bottom plate, and the top plate and the pillars are disposed between the bottom plate and the top plate and are adapted to hold the substrates in a multi-layer manner. The plate holding tool carrier mechanism includes a support member that is adapted to support the bottom surface of the substrate holding tool * ^ A A - plate, and wherein the anti-tip member includes a limiting member, 1 ~ "...^, occupies the top surface of the bottom plate supported by the support part under the gap. 3. The upright step of claim 2, wherein the anti-tip component is 127294.doc 200908071 unit is adapted to laterally project and retract the limit-step comprising a driver. 4. 5. 6. The vertical heat treatment apparatus of claim 1 wherein each of the substrate holding tools has a bottom plate, a top plate and a pillar, and each pillar is disposed between the bottom plate and the top plate and is adapted to be held in a multi-layer manner The substrate holding the substrate carrier mechanism includes a __ binding component adapted to support: a bottom surface of the bottom plate of the soil holding tool and wherein the anti-tip component includes a top plate pressing part, Arranged to extend upwardly and adjust behind the support member to press the top plate of the substrate holding tool. The vertical heat treatment device of item 1, wherein the substrate is maintained and the plates, a top plate and the pillars are respectively disposed on the bottom plate and are adapted to hold the substrates in a multi-layer manner, wherein the substrate is maintained The tool carrier mechanism includes a branch member adapted to support one of the bottom surfaces of the substrate and the substrate, wherein a limiting recess is formed on the bottom plate of the substrate holding and bottom ... 0 ” In the top surface, and wherein the anti-dumping & strip is configured to oppose the limiting groove at a small gap. 丨 τ τ 2 seeking: i the vertical heat treatment device, wherein Each of the substrate holding tool tops: the two top plates and the pillars are disposed between the bottom plate and the page plate to hold the substrates in a multi-layer manner, wherein the substrate holding tool carrier mechanism package - The bottom plate of the substrate holding tool: the support 1 is formed at the base "mold and m2, and the towel-to-parallel transverse hole anti-tip component includes a majority: the side portion, and wherein the restriction strip is Configured separately for insertion U1294.doc 200908071 § Hai inside the cross hole. The vertical heat treatment device, wherein each substrate is held and the bottom plate, the lower plate and the pillar are disposed on the bottom plate and adapted to maintain the substrates in a multi-layer manner, wherein the base = tool carrier mechanism The utility model comprises: a support part, which is adapted to the bottom surface of the bottom plate of the support fixture, wherein the opposite side groove is formed in two sides of the bottom plate of the substrate red protection device, and wherein the anti-tip component comprises a majority The restriction strips are respectively arranged in the side grooves of the configuration.直 8 凊 凊 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项 项Wherein the substrate holding tool carrier mechanism comprises a branch member adapted to support the bottom surface of the bottom plate of the base plate, wherein the upright hole is formed: 4 the bottom plate of the substrate holding tool, and wherein The anti-tip component is comprised of a restraining projection that is raised upwardly from the (4) part and configured to fit within the upright hole at a smaller gap. 9. The vertical heat treatment apparatus of claim 1, wherein each of the substrate holding tools has a bottom plate, a top plate and a pillar, and each of the pillars is disposed between the bottom plate and the top plate and is adapted to hold the substrates in a multi-layer manner. Wherein the substrate holding tool carrier mechanism comprises: a supporting part adapted to = a bottom surface of the bottom plate of the substrate holding tool, wherein the bottom plate of the substrate holding tool forms an annular shape, and wherein the anti-dumping component is It consists of a number of limiting protrusions, 127294.doc 200908071, with the tops of the limiting protrusions protruding upwards and configured to oppose the inner circumferential wall of the bottom plate of the (4) part. Heart, (4) and the ring ίο. A vertical heat treatment method, which comprises the following steps: : by - insulation seat, in one adjustment to close - one of the furnaces of the furnace 2, placed: a multi-layer way to maintain more Substrate-substrate holding', then rising to the cover to hold the substrate and moving into the beta furnace; 8 loading into the furnace to perform a heating process on the substrates; During the heating process of the substrate, the other substrate is loaded onto the substrate-on-substrate holding tool machine, and the substrate is placed on the holding tool machine by using the substrate holding tool carrier mechanism. The other substrate holding tool is replaced by the heating mold substrate holding tool placed in the heating furnace, wherein the substrate holding tool carrier mechanism includes an anti-dip to transport the substrate holding members, and at the same time By the anti-tip component: an upright heat treatment method in which the substrate holding tool is tilted and the other substrate holding tool is tilted. The substrate is maintained. The tr-bottom plate, a top plate and the pillars' pillars are disposed between the bottom plate and the top plate and are adapted to hold the substrate board holding tool carrier mechanism including parts in a multi-layer manner, which is suitable for the 127294.doc 200908071 remote substrate holding tool a bottom surface of the bottom plate, and wherein the anti-tip member includes a restraining member configured to be opposed to a top surface of one of the bottom plates supported by the support member under a gap. 12. The method of claim 1, wherein the anti-tip component further comprises a drive unit adapted to laterally project and retract the constraining member. The vertical heat treatment method of claim 10, wherein each substrate holding tool/, having a bottom plate, a top plate and a pillar, each pillar is disposed between the bottom plate and the top plate and adapted to hold the substrates in a multi-layer manner, Wherein the substrate holding tool carrier mechanism comprises a support member adapted to hold the bottom surface of the bottom plate of the JL with the soil plate, and the anti-tip component of the towel comprises - the top plate pressing the part 'the system is set to The support member extends rearwardly and is adapted to press the base plate of the substrate holding fixture. For example, the vertical heat treatment method of MH), wherein each substrate is maintained and a top plate and a pillar are disposed, and each pillar is disposed between the bottom plate and the top plate and is adapted to hold the substrates in a manner of _ ^ ― The substrate holding tool carrier mechanism includes a bottom portion of the substrate red-protecting device as a branch-bottom surface, wherein a limiting groove 俜 is formed in a top surface of the bottom plate of the substrate red-protecting device, and wherein the anti-rolling member A limit strip is included, the limit groove being opposite. And maintaining the substrate between the substrate and the substrate in a manner that the substrate is held between the substrate and the substrate of the top plate Wherein the base 127294.doc 200908071 board holding tool carrier mechanism includes a support member adapted to support the bottom surface of the base plate of the substrate holding tool, wherein the pair of parallel transverse holes are formed on the substrate (four) The two sides of the bottom plate, and wherein the anti-tip member includes a plurality of restraining strips, each configured to be inserted into the transverse holes. 16. The method of claim 1, wherein each of the substrate holding tools has a bottom plate, and the top plate and the pillars are disposed between the bottom plate and the top plate and are adapted to hold the substrates in a multi-layer manner, wherein The substrate holding tool carrier mechanism includes a support member adapted to support: a bottom surface of the substrate holding tool, wherein the opposite side groove is shaped, and the substrate holds the two sides of the bottom plate of the tool and wherein the substrate The anti-roll 1 4 piece includes a plurality of limit strips that are configured to be inserted into the side grooves, respectively. ' 17. For example: the vertical heat treatment method of item 1,, wherein each substrate is maintained and the top plate of the top plate is attached to the bottom plate and the plate is secured to the plate. The substrate is held in a multi-layer manner, wherein the substrate/carrier mechanism includes a support member adapted to support: (4): a bottom surface of the bottom plate of the tool, wherein the upright hole is formed"~, the holding tool In the bottom plate, and wherein the anti-tip component is composed of a τ protrusion: the restraining protrusion is larger from the vertical hole 2 of the supporting part and configured to be adapted to the smaller gap a straight vertical heat treatment method, wherein each substrate is held and the m-top plate and the pillar are disposed, and the pillars are disposed between the bottom plate and the top plate of the J27294.doc 200908071 and are adapted to hold the substrates in a multi-layer manner, wherein The substrate holding tool carrier mechanism includes a support member adapted to support a bottom surface of the bottom plate of the substrate holding tool of the substrate holding tool and the anti-dumping member is bound by the plurality of protruding protrusions Part of the support to form a plurality of annular restricting projection is formed with an annular bottom plate of the system at a small gap composition, and the top surface of each projection with opposing inner peripheral wall of the plate by the configuration. 127294.doc