200850131 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱模組，特別係指一種對電子元哭 件散熱之散熱模組。 【先前技術】 如今，在電腦產業中，為將微處理晶片等發熱電子元 件產生之熱量有效散發，通常採財法係將散熱模組緊密 地貼设於發熱電子兀件溢熱表面，以協助發熱電子元件 熱，保證發熱電子元件在適當溫度下運作。 月 傳統之散熱模組包括-基座、複數熱導性結合於基座 之散熱、以及連接散熱鰭片和基座之複數“〔執 管，該等熱管之蒸發段與基座結合，冷凝段則穿設於：片、 ^此類散熱模組工作時，-部分熱量直接從基座^至 ”，另-部分熱量籍由熱管傳輸至散熱_片。㈣ ,〔L熱管只有-冷凝段穿設於鰭片内，= 傳輸過來之熱量㈣中地料至鰭片與冷凝段所接 :;:!，然後再逐步地散佈至整個鰭片。在此過程中， ::::鰭片之一部分輻射至鰭片之其他部分，從而導致 …、曰片各口P分受熱不均勻，使銬 匕 換埶，由此，·^句9 犯有效舁周圍空氣進行 換…由此，该類散熱杈組之散熱效率有限。 為克服上述缺點，業界設 廳觸號其中—實_所揭民國專利第 熱管呈“S”形，豆包括_、*& z畎…衩組之 /、匕括連接鰭片底部且結合至底板之 7 200850131 發段、—穿設於鰭片中部之冷凝段、及—結合於鰭片頂 .部之另一冷凝段。該散熱模組熱管均勻地分佈於鰭片表 面，一部分熱量由底板直接傳導至鰭片下部；由蒸發段所 傳輪之另一部分熱量先經由一冷凝段傳輪至鰭片中部，然 ，剩餘之熱量再經由另一冷凝段傳輸至鰭片頂部。由於熱 ^之傳熱速率較快’熱量可幾乎同時到達鰭片之上部、中 ^及下部，使鰭片各部分受熱均勻，進而有效地將熱量 政佈至周圍空氣。因此，該散熱模組相比于傳統之散熱模 組效率有所提高。 …、 但是，由於上述散熱模組之熱管呈“ s，’形，其蒸發 段只=單向將熱量通過二冷凝段傳輸至鰭片，底板所積累 之熱置不能迅速散發出去，進而使該散熱模組之散埶效 受到限制。 【發明内容】 …$鑒於此，有必要提供一種帶有雙向之熱管且散熱效 率較高之散熱模組。 一種散熱模組，用於對電 電子元器件接觸之第一散熱器 第二散熱器、及連接第一和第 述至少一熱管包括一結合至第 段兩端同侧相向回彎而出之第 冷凝段與第二散熱器結合，第 散熱器之間。 子元器件散熱，其包括一盘 、一設置於第一散熱器上之 二散熱之至少一熱管，所 一散熱器之蒸發段及從蒸發 一和第二冷凝段，其中第_ 二冷;旋段爽設於第* —和第二 200850131 與習知技術相比，本發明散熱模組中熱 =:由-蒸發段同側回彎而出，-和二： 二方向分別傳輸至第-和第二冷凝段，進而再傳導；Γ 和第二散熱器。對於熱傳輸而言，雙向無疑比單向 效率。由此，本發明散熱模組之散熱效率較高。/、有 【實施方式】 本發明之散熱模組是用於對安裝於電路板（圖未 之中央處理器等發熱電子元器件（圖未示）進行散敎。 請參閱圖！和圖2,示出了本發明之散熱模组，並 一弟一散熱器10、一設置於第一散熱器1〇上方 _ 器2〇、-夹置於第-散熱器料第二散熱器2二:熱 導熱板30、以及連接第—散熱器1()和第二散❹2 熱管 40。 — 所述第一散熱器10包括一底板12及設置於 之複數散熱鰭片14。所述底板12包括一矩形之板體120上 該板體12G由導熱性良好之金屬材料製成，其下表面與電 子兀器件接觸以吸收其產生之熱量；該板體12〇上表面= 設有平行于其長邊之二凹槽122，該二凹槽122左右對稱幵， 用於嵌入熱管40相應之部分。該板體12〇四角處分別水平 向外延伸出四扣耳124，每一扣耳124均設有—通孔126， 以供螺杆件（圖未示）穿設而將底板12固定於電路板上。 所述散熱鰭片14熱導性結合於板體12〇上方，每一散熱鰭 200850131 片14均包括一矩形之片體140。該片體140垂直於底板12, 其上、下二對邊分別同向垂直彎折出二折邊142，複數相應 β之折邊142通過焊接而將散熱鰭片14固定成一體，從而分 別形成散熱鰭片14之上、下表面。其中，所述散熱鰭片14 之下表面通過焊接固定於底板12上表面，散熱鰭片14之 上表面則與導熱板30熱導性結合。該片體140上、下對邊 靠近該片體140 —側之部分分別設有相互對應之二半圓形 缺口 144,上邊缺口 144之圓心與下邊相應缺口 144之圓心 r 分別位於平行於片體140短邊之二直線上。每一缺口 144 之内緣與折邊142同向垂直延伸出一半環形之結合片 148，複數相應之結合片148相互連接組成四半圓筒形凹槽 146。位於散熱鰭片14下部之二凹槽146與底板12相應之 二凹槽122配合，形成二圓筒形通道，供熱管40相應之部 分穿設。 所述導熱板30平行於底板12而設置於第一散熱器10 I 上方，該導熱板30面積小於底板12之面積，其底面與第 一散熱器10散熱鰭片14頂部對應位置處設有二凹槽302, 該二凹槽302與位於第一散熱器10上部相應之二凹槽146 組成二圓筒形通道，以收容熱管30相應之部分。該導熱板 30下表面通過焊接與第一散熱器10散熱鰭片14上表面熱 導性結合，其上表面與第二散熱器20相接觸。 所述第二散熱器20設置於導熱板30上方，其包括複 數與導熱板30結合之散熱鰭片22及與散熱鰭片22相配合 之一蓋板24。每一散熱鰭片22包括一與第一散熱器10之 10 200850131 片體140等大之矩形片體22〇,該片體22〇上邊開設有二半 圓形缺口 226，該二缺口 224與第一散熱器1〇之缺口 相互對應，該二缺口 224之圓心與第一散熱器1〇相應缺口 144之圓心位於平行於片體22〇短邊之二直線上。所述片體 220之上、下對邊及缺口 224之内緣分別同向垂直彎折出二 折邊222及二半環形之結合片226。複數相應之折邊 和結合片226通過焊接而將散熱鰭片22固結為一體。複數 相應之折邊222連接組成散熱鰭片22之上、下表面，嗦下 表面通過焊接結合於導熱板3〇上表面。複數結合片226Χ = 應地連接成散熱鰭片22之二凹槽228。所述蓋板24平行於 導熱板30，其由熱導性良好之金屬材料製成。該蓋板％ $-矩形之板體挖去：凹槽242而形成。該板體面積大於 導熱板30面積，其下表面通過焊接結合於散熱鰭片22之 上表面。該二凹槽242平行地開設於板體下表面，其與散 ί 熱鰭片22之二凹槽228配合，形成容置熱管3〇相應部八 之二圓筒形通道。 77 所述二熱管4〇形狀及功能均相同。每一熱管4〇包括 一平直之瘵發段42及由該蒸發段42兩端同側相向回彎而 出之平直之第一冷凝段44和第二冷凝段46。該蒸發段C 和第-冷凝段44及第二冷凝段44相互平行且位於^平 面。蒸發段42與第一冷凝段44之間之回彎部分形成第一 絕熱段45，蒸發段42與第二冷凝段46之間之回彎部分形 成第二絕熱段47。所述第-絕熱段45和第二絕熱段二: 位於第一冷凝段44和第二冷凝段46所形成之平面内，节 11 200850131 弟一系巴熱段45進一步白枯· 一希古不^ ^ • ^ /匕栝垂直于瘵發段42之第一羊吉 段452及由該第一平直段Λ *山Fi如 • # 、志， 52兩知冋側延伸出之二弧形之 弟一連接段454，該二第一連接段454 之自由末端分別與蒗 ^又42和弟-冷凝段44連接，從而將蒸發段 : =熱量從左側傳輸至第—冷凝段44。 之 包括一垂直于蒸發段42之第一 …杈47 π m 罘一十直& 472及由該第二平直 & 472兩端同側延伸出之 端分別連接至蒸發段42及二凝： 、"又 ' 所吸收之另一部分熱量從右侧傳輸至第 二冷凝段46。由於熱量可從雙方向分別傳輪至第一= 44和第二冷凝段46，基 』主弟冷旋& 糾摆科… ，，、、士奴42所積畜之熱量可迅速地得 釋放’攸而使熱管40具有-較高之傳熱效率。 二熱管40所處平面相互平行，且 位置一—對應。所述每—二40各^刀之 U和底板12。請-併灸_ 3 1千面垂直於散熱鰭片 將二熱管4。之二J段裝該散熱模組時，首先 二_ 又42肷入第一散熱器10底板12之 一凹t 122内；然後，將二埶管 自由末端相對于蒸發段42略微向上提：二疑段46之 焊接成-體之第—散熱器1〇 ::離，再將已 設入熱管40之第二冷凝段46、政ϋ片14攸一側垂直穿 .^ 焚杈46洛發段42、第一和第-頌 熱段45、47所圍設出之空 “-、、、巴 —也t n 由於熱官40具有彈性， 在放熱鰭片14穿設過程中，埶总 一 形變，使熱管40之第二冷凝;、4B6 4呈^弟二絕熱段47發生 罘令旋& 46具有一向下移動之趨勢， 12 200850131 從而與散熱鰭片14之上表面發生干 . π “山 十以，直至该二第二冷凝 •二肷入散熱鰭片14上部之二凹槽146 Θ，使第二絕埶 ，47恢復形變，第二冷凝段46恢復至原有位置。此時了 ，熱鰭片i4之下表面與底板12上表面緊㈣觸而將敎管 〇之二蒸發段42收容於散熱鰭片14下部之凹槽146和底 板12之凹槽m配合形成之二圓筒形通道内。埶管仞之 二第一絕熱段45位於第—散熱器1Q之 段47位於第一散熱器1〇之 ^ 、，巴*、，、 ^ 表@熱鰭片i 4之上表面，使導熱板3 〇 之H 302與散熱，鰭片14上部之二凹槽146配合形成之 -：同型通這容置二熱管3〇之二第二冷凝段I隨後，使 體之第_散熱器2〇之散熱轉片22之： ==之二第一冷凝段44之下半部分，再將散熱趙 片22沿熱管40之第一洽怒沪4/1人一 22之下表面内移動，直至散熱錯片 一 …板30之上表面完全貼合，此時熱管4〇 弟冷’旋& 44對應嵌入於散熱鰭片22之二凹槽228 内；最後，將第二散埶哭α 。 赭 …抑20之盍板24下表面貼設於散熱 ，片一上表面’使該蓋板24之二凹槽242與散熱鰭片22 之7凹槽228所形成之二圓筒形空間將二熱管4〇之二第一 冷凝段44收容於立φ。# ^ 、/、中由此，戎政熱模組完成了組裝過程。 τ上所述，本發明散熱模组每一熱管40之二冷凝段 料、46由:蒸發段42同侧相向回彎而出，其中第一冷凝段 二結合於第二散熱器2〇頂部’第二冷凝段从失置於第一和 弟二散熱器1〇、20之間，底板12所吸收之熱量一部分直接 13 200850131 傳導至散熱鰭片14、22，另一邱八刼θ、木上 • 。、 另部分熱夏破熱管40之蒗發段 42所吸收後分別籍由二冷凝 ^ & . Q破#又44、46從二方向傳輸 和第二散熱器1〇、20，其散熱效率較單 = 且，由賴管觀第—和第二冷凝段分別' 性 良好之盍板24和導熱板3()結合， 24和導熱板_輸至每—散熱鰭片14、22， =板 散熱器10、20能充分進行散熱。 乐— 綜上所述，本發明確已符合發明專利 提出專利申請。惟，以上节去描盔士於 逐依去 ^ 亥者僅為本發明之較佳實施例， 自不能以此限制本案之中請專利範圍。舉凡熟悉本案技藏 =人士援依本發明之精神所作之等效修飾或變化，皆應^ 盍於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱模組之立體組合圖。 圖2係本發明散熱模組之立體分解圖。 圖3係本發明散熱模組第一散熱器與熱管之立體組裝 圖 ° 又 【主要元件符號說明】 第一散熱器 10 底板 12 板體 120 凹槽 122，146,228,242 302 扣耳 124 通孔 126 散熱鰭片 14,22 片體 140,220 14 200850131 折邊 結合片 蓋板 熱管 第一冷凝段 第一平直段 第二冷凝段 第二平直段 142,222 缺口 144,224 148,226 第二散熱器 20 24 導熱板 30 40 蒸發段 42 44 第一絕熱段 45 452 第一連接段 454 46 第二絕熱段 47 472 第二連接段 474 15200850131 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for dissipating heat from an electronic element crying device. [Prior Art] Nowadays, in the computer industry, in order to effectively dissipate the heat generated by heat-generating electronic components such as micro-processing wafers, it is common for the financial method to closely attach the heat-dissipating module to the heat-generating surface of the heat-generating electronic component to assist The heat of the electronic components is hot, ensuring that the hot electronic components operate at the appropriate temperature. The conventional heat dissipation module includes a base, a plurality of heat conduction combined with the heat dissipation of the base, and a plurality of "heating fins and a base connected" (the tube, the evaporation section of the heat pipes is combined with the base, the condensation section Then it is worn in: piece, ^ When the heat dissipation module works, part of the heat is directly from the base to the "," and the other part of the heat is transferred from the heat pipe to the heat dissipation film. (4), [L heat pipe only - the condensation section is placed in the fin, = the heat transferred (4) the ground material to the fin and the condensation section: ::!, and then gradually spread to the entire fin. During this process, :::: one part of the fin is radiated to other parts of the fin, resulting in ..., the P part of the bracts is unevenly heated, so that the 铐匕 铐匕 埶 埶The surrounding air is exchanged... Therefore, the heat dissipation efficiency of the heat dissipation group is limited. In order to overcome the above shortcomings, the industry has a hallmark in which the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The base plate 7 200850131, the condensing section through the middle of the fin, and the other condensation section of the top of the fin. The heat pipe of the heat dissipation module is evenly distributed on the surface of the fin, and a part of the heat is directly transmitted from the bottom plate to the lower portion of the fin; another part of the heat transmitted by the evaporation section is first transferred to the middle of the fin through a condensation section, and the remaining The heat is transferred to the top of the fin via another condensation section. Since the heat transfer rate is faster, the heat can reach the upper, middle and lower parts of the fin almost simultaneously, so that the fins are evenly heated, thereby effectively distributing the heat to the surrounding air. Therefore, the heat dissipation module has an improved efficiency compared to the conventional heat dissipation module. ..., however, since the heat pipe of the above heat dissipation module is in the shape of "s,", the evaporation section only transmits heat to the fin through the two condensation sections in one direction, and the heat accumulated by the bottom plate cannot be quickly dissipated, thereby making the The heat dissipation module is limited in effectiveness. [Inventive content] ...$ In view of this, it is necessary to provide a heat dissipation module with a bidirectional heat pipe and high heat dissipation efficiency. A heat dissipation module for electrical and electronic components The first heat sink contacting the second heat sink, and connecting the first and the at least one heat pipe comprise a first condensation portion coupled to the opposite side of the first end of the first section and the second heat sink is combined with the second heat sink, the first heat sink The heat dissipation of the sub-component includes a disk, at least one heat pipe disposed on the first heat sink, and an evaporation section of the heat sink and the first and second condensation sections, wherein the second Cold; the spin section is set in the * - and the second 200850131. Compared with the prior art, the heat module of the present invention has a heat =: the - evaporation section is bent back on the same side, - and two: the two directions are respectively transmitted to the first - And the second condensation section, and then Conduction; 第二 and the second heat sink. For heat transfer, the two-way is undoubtedly more efficient than the one-way efficiency. Therefore, the heat dissipation module of the present invention has high heat dissipation efficiency. [Embodiment] The heat dissipation module of the present invention is It is used to dissipate heat-generating electronic components (not shown) mounted on a circuit board (not shown in the figure. See Figure! and Figure 2, showing the heat-dissipating module of the present invention. The heat sink 10 is disposed above the first heat sink 1 _ 2 〇, - is placed on the first heat sink 2 second heat sink 2 2: the heat conductive plate 30, and the connection first heat sink 1 () and The second heat sink 2 is provided with a heat sink 40. The first heat sink 10 includes a bottom plate 12 and a plurality of heat dissipation fins 14 disposed thereon. The bottom plate 12 includes a rectangular plate body 120. The plate body 12G has good thermal conductivity. Made of a metal material, the lower surface of which is in contact with the electronic crucible device to absorb the heat generated therefrom; the upper surface of the upper surface of the plate body 12 is provided with two grooves 122 parallel to the long sides thereof, and the two grooves 122 are bilaterally symmetrically It is used to embed the corresponding part of the heat pipe 40. The plate body 12 is horizontally extended at four corners Four lugs 124 are provided, and each of the lugs 124 is provided with a through hole 126 for the screw member (not shown) to be fastened to fix the bottom plate 12 to the circuit board. The heat dissipating fin 14 is thermally coupled. Above the plate body 12〇, each heat-dissipating fin 200850131 piece 14 includes a rectangular piece body 140. The piece body 140 is perpendicular to the bottom plate 12, and the upper and lower two opposite sides are respectively bent perpendicularly to the two folded sides 142. The plurality of corresponding fins 142 are fixed to the heat dissipating fins 14 by welding, thereby forming upper and lower surfaces of the fins 14, respectively, wherein the lower surface of the fins 14 is fixed to the bottom plate 12 by soldering. On the upper surface, the upper surface of the heat dissipation fin 14 is thermally conductively coupled to the heat conducting plate 30. The upper and lower sides of the sheet body 140 are disposed adjacent to the side of the sheet body 140 respectively with two semicircular notches 144 corresponding to each other. The center of the upper edge notch 144 and the center r of the corresponding lower notch 144 of the lower edge are respectively located on two straight lines parallel to the short side of the sheet body 140. The inner edge of each notch 144 extends perpendicularly with the flange 142 to a half-annular bond piece 148. The plurality of corresponding bond pieces 148 are interconnected to form a four-half cylindrical groove 146. Two recesses 146 located at the lower portion of the fins 14 cooperate with the corresponding recesses 122 of the bottom plate 12 to form a two-cylindrical passage for the corresponding portion of the heat pipe 40 to pass through. The heat conducting plate 30 is disposed above the first heat sink 10 I in parallel with the bottom plate 12 . The heat conducting plate 30 has an area smaller than the area of the bottom plate 12 , and the bottom surface thereof is disposed at a position corresponding to the top of the heat sink fin 14 of the first heat sink 10 . The groove 302 forms a two-cylindrical channel with two corresponding grooves 146 located at the upper portion of the first heat sink 10 to receive a corresponding portion of the heat pipe 30. The lower surface of the heat conducting plate 30 is thermally conductively bonded to the upper surface of the heat sink fin 14 of the first heat sink 10 by soldering, and the upper surface thereof is in contact with the second heat sink 20. The second heat sink 20 is disposed above the heat conducting plate 30 and includes a plurality of heat dissipating fins 22 combined with the heat conducting plate 30 and a cover plate 24 matching the heat dissipating fins 22. Each of the heat dissipating fins 22 includes a rectangular body 22〇 which is larger than the first heatsink 10, 10,050,131, and 140. The upper surface of the body 22 is provided with two semi-circular notches 226, and the two notches 224 and The gaps of the heat sinks 1 are corresponding to each other, and the center of the two notches 224 and the center of the corresponding recess 144 of the first heat sink 1 are located on two straight lines parallel to the short sides of the sheet 22 . The upper edge of the sheet body 220, the lower side and the inner edge of the notch 224 are respectively bent perpendicularly to the two-folded edge 222 and the two-half annular joint piece 226. The plurality of corresponding flanges and bonding sheets 226 are integrally bonded by heat-dissipating fins 22 by welding. The corresponding flange 222 is connected to form an upper surface and a lower surface of the heat dissipation fin 22, and the lower surface is joined to the upper surface of the heat conduction plate 3 by welding. The plurality of bond pads 226 Χ = are connected to form two recesses 228 of the heat sink fins 22. The cover plate 24 is parallel to the heat conducting plate 30 and is made of a metal material having good thermal conductivity. The cover plate % $-the rectangular plate body is cut out: the groove 242 is formed. The plate body area is larger than the area of the heat conducting plate 30, and the lower surface thereof is bonded to the upper surface of the heat radiating fin 22 by welding. The two recesses 242 are parallelly formed on the lower surface of the plate body, and cooperate with the two recesses 228 of the heat-dissipating fins 22 to form two cylindrical passages for accommodating the corresponding portions of the heat pipe 3〇. 77 The shape and function of the two heat pipes are the same. Each of the heat pipes 4 includes a straight burst section 42 and a straight first condensation section 44 and a second condensation section 46 which are bent back from opposite sides of the evaporation section 42. The evaporation section C and the first condensation section 44 and the second condensation section 44 are parallel to each other and are located on the plane. The return portion between the evaporation section 42 and the first condensation section 44 forms a first insulation section 45, and the return portion between the evaporation section 42 and the second condensation section 46 forms a second insulation section 47. The first adiabatic section 45 and the second adiabatic section 2 are located in a plane formed by the first condensation section 44 and the second condensation section 46, and the section 11 200850131 is a part of the Bajia section 45 further white and dry. ^ ^ • ^ /匕栝 The first Yangji section 452 perpendicular to the burst section 42 and the two curved sections extending from the first straight section Λ *山Fi如•#,志,52 A connecting section 454, the free ends of the two first connecting sections 454 are respectively connected to the 又^42 and the condensing section 44, thereby transferring the evaporation section: = heat from the left side to the first condensing section 44. The first 杈47 π m 罘一直直& 472 perpendicular to the evaporation section 42 and the ends extending from the same side of the second straight & 472 are respectively connected to the evaporation section 42 and the second condensation : , , and another part of the heat absorbed is transferred from the right side to the second condensation section 46 . Since the heat can be transferred from the two directions to the first = 44 and the second condensing section 46, the heat of the stagnation of the squadron of the squadron can be quickly released. 'The heat pipe 40 has a higher heat transfer efficiency. The planes of the two heat pipes 40 are parallel to each other, and the positions are one-corresponding. The U and the bottom plate 12 of each of the four 40 knives. Please - and moxibustion _ 3 1 thousand faces perpendicular to the heat sink fins 2 heat pipes 4. When the J segment is equipped with the heat dissipating module, firstly, the second and second 42 are inserted into a recess t 122 of the bottom plate 12 of the first heat sink 10; then, the free end of the second tube is slightly raised relative to the evaporating section 42: The welding of the suspected section 46 is the first of the body - the radiator 1〇:: away, and then the second condensation section 46 which has been placed in the heat pipe 40, and the side of the political sheet 14 is vertically worn. ^ Burning 46 Luofa section 42. The space surrounded by the first and the first heat-heating sections 45, 47 "-,,, and the bar - also tn. Because the heat officer 40 has elasticity, during the process of the heat-releasing fins 14, the twist is always deformed. The second heat of the heat pipe 40 is condensed; the 4B6 4 is in the second heat insulating section 47, and the twisting & 46 has a downward moving tendency, 12 200850131 thus drying with the upper surface of the heat radiating fin 14. π "Mountain ten So that the second condensing and the second condensing into the upper portion of the fins 14 of the heat dissipating fins 14 146 恢复, the second squeezing 47 is restored and the second condensing section 46 is restored to the original position. At this time, the lower surface of the hot fin i4 is tightly contacted with the upper surface of the bottom plate 12, and the two evaporation sections 42 of the heat sink fins are received in the groove 146 at the lower portion of the heat dissipation fin 14 and the groove m of the bottom plate 12 are formed. Inside the two cylindrical channels. The first adiabatic section 45 of the second tube is located at the upper surface of the first heat sink 1Q, and the surface of the front surface of the heat sink i 4 3 HH 302 and heat dissipation, the two grooves 146 on the upper part of the fin 14 are formed together: the same type of the second heat condensing pipe I accommodating the second heat condensing pipe I, and then the first _ radiator 2 The heat-dissipating fins 22 are: == bis, the lower half of the first condensing section 44, and then the heat-dissipating photographic film 22 is moved along the lower surface of the first arrogant Shanghai 4/1 person-22 of the heat pipe 40 until the heat dissipation is wrong. The upper surface of the plate 30 is completely fitted. At this time, the heat pipe 4's cold 'spin & 44 is correspondingly embedded in the two recesses 228 of the heat radiating fins 22; finally, the second one is crying.赭 抑 抑 抑 抑 抑 抑 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 The first condensation section 44 of the heat pipe 4 is accommodated in the vertical φ. # ^ , /, 中中, The Qizheng Thermal Module completed the assembly process. As described above, the condensing section material 46 of each heat pipe 40 of the heat dissipation module of the present invention is bent back by the same side of the evaporation section 42, wherein the first condensation section 2 is coupled to the top of the second heat sink 2' The second condensation section is lost between the first and second radiators 1〇, 20, and the heat absorbed by the bottom plate 12 is directly transmitted to the heat dissipation fins 14, 22, and another Qiu Bagua θ, on the wood. • . In addition, some of the hot summer heat-breaking tubes 40 are absorbed by the entangled section 42 and are respectively condensed by two condensing ^ & . Q broken # 44, 46 from the two directions and the second radiator 1 〇, 20, the heat dissipation efficiency is better Single = and, by the view of the reliance - and the second condensing section, respectively, the combination of the good-quality slab 24 and the heat-conducting plate 3 (), 24 and the heat-conducting plate _ are transmitted to each of the heat-dissipating fins 14, 22, = plate heat dissipation The devices 10 and 20 can sufficiently dissipate heat. Le - In summary, the present invention has indeed filed a patent application in accordance with the invention patent. However, in the above section, it is only the preferred embodiment of the present invention that the helmet is used for the purpose of the invention. It is not possible to limit the scope of the patent in this case. Anyone familiar with the technology of the case = equivalent modifications or changes made by the person in accordance with the spirit of the present invention shall be within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat dissipation module of the present invention. 2 is an exploded perspective view of the heat dissipation module of the present invention. 3 is a three-dimensional assembly diagram of the first heat sink and the heat pipe of the heat dissipation module of the present invention. [Main component symbol description] First heat sink 10 bottom plate 12 plate body 120 groove 122, 146, 228, 242 302 lug 124 through hole 126 heat sink fin Sheet 14, 22 sheet 140, 220 14 200850131 Folding joint sheet cover heat pipe first condensation section first straight section second condensation section second straight section 142, 222 notch 144, 224 148, 226 second radiator 20 24 heat conducting plate 30 40 evaporation section 42 44 first insulation section 45 452 first connection section 454 46 second insulation section 47 472 second connection section 474 15