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TW200850073A - Antistatic film and article comprising the same - Google Patents

Antistatic film and article comprising the same Download PDF

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Publication number
TW200850073A
TW200850073A TW96120877A TW96120877A TW200850073A TW 200850073 A TW200850073 A TW 200850073A TW 96120877 A TW96120877 A TW 96120877A TW 96120877 A TW96120877 A TW 96120877A TW 200850073 A TW200850073 A TW 200850073A
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Taiwan
Prior art keywords
film
particles
antistatic film
layer
conductivity
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TW96120877A
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Chinese (zh)
Inventor
Li-Zhang Yang
Zhou Jin
lin-lin Zhang
Wei-Xiang Zhang
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3M Innovative Properties Co
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Priority to TW96120877A priority Critical patent/TW200850073A/en
Publication of TW200850073A publication Critical patent/TW200850073A/en

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Abstract

An antistatic film and an article comprising the same are provided. The film comprising: a base film; a conductive layer disposed on one surface of the base film; a protective layer disposed on the surface of the conductive layer opposite to the base film to protect the conductive layer, wherein the protective layer contains particles used for inhibiting the decrease of surface conductivity of the film and a film-forming polymer, wherein at least a portion of the particles has a particle diameter larger than the thickness of the protective layer.

Description

200850073 九、發明說明: 【發明所屬之技術領域】 ^本發明有關於一種抗靜電膜,尤其關於元器件包裝蓋 二用的透明低污染的抗靜電膜。本發明還關於包含該膜的 5製,例如蓋帶以及包含載帶、所述篕帶和任選的帶包裝 體的系統。 【先前技術】 ,在TL器件包裝領域,元器件通常由製造商開發製造, 亚輸送到另一個製造商或用戶以作進一步處理。例如,在 1〇 一 j固製造薇或“無塵室’’設備製造出半導體晶片後,包裝並 輸迗到另一個製造商或用戶,例如電腦製造商,使製造商 可將其安裝在印刷線路板或類似的裝置上。元器件主要包 括’但不限於存儲晶片、電晶體、連接器、mps、電容器 等。近年來,1C晶片或電容器等晶片性電子部件,以被帶 15 ^裝在載帶中的形式,被提供用於在電路板等上進行表面 安裝。載帶上有容納元器件的凹部。將元器件容納在凹部 :後,蓋帶將相應的凹部密封,形成帶包裝體。在使用時, 帶包裝體的蓋帶剝離’元H件被取出並被安裝在電路基板 上0 20 盍帶必須可以容易地從載帶剝離,並且剝離力要具有 一定的穩錢。如果該剝離力(剥離強度、熱封強度、或 也可以稱爲“剝離強度,,)過低,則蓋帶易脫落。如果剝離 力過強或剝離力波動範圍過大,則用安裝機剝離蓋帶時, 不易穩定地進行剝離操作。此外,靜電會對組裝過程或元 200850073 器件本身造成影響,因此蓋帶被要求具有穩定的抗靜電性 能。而且,爲了檢查元器件,蓋帶被要求具有良好的透明 性。此外,蓋帶表面不能對元器件産生污染。 10 15 蓋帶通常有兩種類型,壓敏型和熱敏型。對於埶敏型 蓋帶’通過在熱敏膠中或膠層表面添加導電劑可獲取導電 性能。-種導電劑是無機導電填料,通過添加導‘ J 得χγ方向的導電性能(χγ方向的導電性指平行於膜表面^ 向的導電性,下同)。由於逾滲理論的限制,爲了達到灯 =向導電’需要添加大量導電填充物(通常重量百分比含 量在30%以上)。這樣會大大降低膜的透光率 ^ ㈣揭示了這種方法;另—種是添加有機鹽類2 方向的導電性’這種方法的缺點是抗靜電性對 >..、、度破感,並且容易對元器件産生污染,美國專利 US5064064等揭示了這種方法。 〜對於壓敏型蓋帶,—種是使用導電聚合物或通過加抗 :电劑來獲得塗層的抗靜電效果,常用的導電聚合物包括 各、聚苯胺等,常用的抗靜電劑包括季錢鹽、脂肪族 =門ΓΓ電劑易存在對元器件污染,對環境濕 二4問74 °另—種方法是通過在基膜上的金屬錢層來 ’通常金屬鍵層可以經由蒸發鍍她賤 =:製造,美國專利US6〇278〇2揭示了這種方法。金 屬士層和基膜_著性通常較差’如果沒有域塗層,神 日而且游離的金屬顆粒會引起元器件污染問題: 、s、利US5441809A揭示了 -種透明的靜電耗散.型 20 200850073 這種蓋㈣雙向拉伸基膜層、真空金屬锻膜導電層 ::‘、'封膠層組成,熱封膠層中加入了防㈣球和導電埴 :。這項發明較好地解決了膜對濕度敏感的問題,並對金 、了保屢仁疋,該發明蓋帶透明性差,對透過 其觀察元器件造成困難,并 σ 、 亚且/、中的熱敏膠層可能會使元 為件受到污染。 f 10 15 20 【發明内容】 明的第一悲樣為提供了 一種抗靜電膜,該膜尤: 適曰用於蓋帶,該膜包括: 基膜; =層’其位於基膜的—個表面上以提供導電性;禾 兩/層,,其位於導電層與基膜相對的表面上以保護基 兒k ’遠保護層包括高分子成人 導電性下降的粒子,其中丄於抑制膜心 層本身厚b J刀拉子的粒徑大於保寄 明的!:態樣為提供了一種製品,其包括如上a 含”二:抗靜電膜。所述製品包括但不限於蓋帶、包 里π #載▼以及任選的帶包裝體的系統等。 -種不是用來描述本發明所公開的每 禋男%方案。下面參照附圖和詳盡的插述, 例描述本發明的實施方案。 /、-也牛 【實施方式】 本發明中,除非特別指出’術語“用於抑制膜表面導電 25 200850073 性下降的粒子,,县扣 的表面導電性下降:声:嶋低保護層引起的抗靜電膜 的、導電或不導電的:=:,該粒子可以是無機或有機 ♦私的、金屬或非金屬的。 5 15 霧产供了 一種抗靜電膜’該膜可以爲透明的、低 電或靜電耗散的薄膜,這種薄膜可 製 備盍Π几靜電包襄袋及其他抗靜電製品。 衣 本么月的膜包括基膜、導電層和保護層。 料制i :、:二用相對透明並且具有良好機械性能的任意材 衣。、用的材料包括但不限於聚 酸酯、赛璐珞、尼龍、聚邓承石反 使用雔對於圖2所示的蓋帶較佳係 :°、 ★丙烯(B〇p”等易撕裂塑膠薄膜。對於基 膜的厚度沒有特別限制,被用 、土 透明。 散用於衣備盍π的基膜較佳係爲 =電層位於基膜的一個表面上(基膜的另—面任選地 =形劑)’是-種提供導電性f的材料,可以是金屬 也可以是金屬氧化物層。常用的金屬包括鎳路合全、 銘等々;常用的金屬氧化物包括氧化姻錫,換雜氧化錫、氧 化鎂等…亥層可經由蒸發鐘或磁控減鑛等方法 層也可以是導電聚合物(如拜耳公司的B吵。η»)是 用碳黑、碳納米管、金屬粉、金屬氧化物等導電粒子填充 的聚合物材料,這種導電層可以經由將這些材料塗布在基 膜上形成。該導電層的表面電阻率應不高於ίχ】〇】。歐姆/平 方,較佳不高於歐姆/平方,最佳不高於ΐχΐ〇5歐姆/平 方0 20 200850073 、保護層位於導電層與錢相對絲面上以對容易 的導電層提供機械上的保護。保護層不能使蓋帶的導電性 $下降太大,以保證整個結構仍舊保持所需的抗靜電性 旎。因此,該保護層含有用於抑制膜表面導電性下降的粒 5子(在本發明中有時簡稱爲‘‘粒子,,)。保護層的厚度較佳 ,不大於12微米’更佳為不大於職米,更較佳為不大於$ U米,還更較佳為不大於2微米,最佳為〇·2_ι微米。所述用 於抑制膜表面導電性下降的粒子的形狀和結構沒有特別限 制可以爲細争刀、片狀、樹枝狀、細絲狀,較佳爲顆粒狀。 1〇所述用於抑制膜表面導電性下降的粒子較佳爲導電或半導 %粒子,包括·金屬粒子、碳黑、碳納米管、導電或半導 電聚合物粒子、塗有導電或半導電材料的聚合物粒子、金 屬氧化物(例如:二氧化鈦、氧化辞等)粒子以及它們各 種混合物的組合。並且,至少部分所述粒子的粒徑大於保 15遵層本身的厚度以便於形成金屬層到塗層表面的Ζ軸方向 (即垂直於蓋帶表面的方向)導電通路,同時也可起代替 增加抗粘性的粒子的作用(如圖3所示)。保護層還包含一 種高分子成膜聚合物。對於聚合物的種類和含量沒有特殊 限制,例如可以是聚氨酯、環氧聚合物、丙烯酸聚合物或 20 者它們的混合物等。 保護層中添加的用於抑制膜表面導電性下降的粒子的 平均粒徑較佳爲50微米以下,更佳為15微米以下,最佳為 10微米以下。用於抑制膜表面導電性下降的粒子占保護層 的重量百分含量較佳爲30%以下,更佳為01到5%,最佳為 200850073 在較低添加量的情況下 0.3到2%。這是因爲 地保持透明性及較低的霧度 b1之膜更好 减K地,添加料抑制膜表 心电性下降的粒子中百萬分之—以上的顆粒粒徑大於膜 f ’更佳係十萬分之一以上的顆粒粒徑大於臈厚,以保證 方向的電導通性能,使抗靜電膜具備靜電耗散或導電 對於保護層中用於抑制膜表面導電性下降的粒子和任 選的聚合物的混合形式沒有特別限制,但必須保證能夠提 供Z方向的電導通性能’使抗靜電膜具備靜電耗散或導 会•匕 Λ 本發明蓋帶用透明低污染抗靜電膜的表面電阻率較佳 歐姆/平方。#其對導電性要求較高時,該 月吴的表面電阻率較佳係小於1χ1〇7歐姆/平方。 保護層中除添加導電性粒子外,還加入增加抗點性的 Μ粒=,該抗祐性粒子與導電填充物可以是一種粒子,也可 以是不同粒子。可用作抗枯性粒子的包括二氧化石夕、二氧 化鈦、碳黑、金屬粉和聚合物微球等,抗钻性粒子的平均 粒徑爲0-15微米,占保護層的重量百分含量爲〇_1〇%。 下面參照附圖進一步描述本發明的具體實施方案。 20 測試方法: 1 )耐磨測試·· 測試儀器·· Taber Abraser 513〇 (耐磨耗試驗機),心】 Industries製造。 使用CS-5磨輪,測定樣品表面在摩擦一定轉數後的表 200850073 :::率,如果表面電阻率高於ΐχΐ〇13歐姆/平方,則認爲 樣口π在該轉數下已經失效。 2 )表面電阻率測試: 測試儀器:Trek 1 52 Φ iin t » , 152電阻率測試儀,TREK, INC·製造。 5 測試符合ESD Sll 1U番淮、日丨丨七、土 . ^ • i i铋準測试方法,在常溫常渴條件 下測量: ” 將開關調到所需的電壓位置(10伏或100伏),用 152P-CR_CE_EX測量探頭持續壓在待測膜表面,此時[⑶ 屏會顯示出測量的表面電阻率。表面電阻率單位是歐 10方。 3) 膜厚控制: 塗層厚度通過增重法測量:裁一定尺寸大小的膜(面 積S),稱重(w〇),塗上塗層後再稱重(W1),缺後通200850073 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to an antistatic film, and more particularly to a transparent, low-pollution antistatic film for use in a component package cover. The invention is also directed to a system comprising the film, such as a cover tape and a system comprising a carrier tape, the tape and optionally a package. [Prior Art] In the field of TL device packaging, components are usually developed and manufactured by the manufacturer, and sub-delivered to another manufacturer or user for further processing. For example, after manufacturing a semiconductor wafer from a Wei or "clean room" device, it is packaged and exported to another manufacturer or user, such as a computer manufacturer, so that the manufacturer can install it on the printing. On a circuit board or similar device. Components mainly include 'but not limited to memory chips, transistors, connectors, mps, capacitors, etc. In recent years, wafer-based electronic components such as 1C chips or capacitors have been mounted on the tape. The form in the carrier tape is provided for surface mounting on a circuit board or the like. The carrier tape has a recess for accommodating components. When the component is housed in the recess: the cover tape seals the corresponding recess to form a package body When in use, the cover tape with the package is peeled off. The element H is taken out and mounted on the circuit board. 0 20 The tape must be easily peeled off from the carrier tape, and the peeling force must have a certain amount of stability. When the peeling force (peel strength, heat seal strength, or "peel strength") is too low, the cover tape is liable to fall off. If the peeling force is too strong or the peeling force fluctuation range is too large, the peeling operation is not easily performed stably when the cover tape is peeled off by the mounter. In addition, static electricity can affect the assembly process or the device itself, so the cover tape is required to have stable antistatic properties. Moreover, in order to inspect the components, the cover tape is required to have good transparency. In addition, the surface of the cover tape does not contaminate the components. 10 15 Cover tapes are usually available in two types, pressure sensitive and thermal. For the sensitized cover tape, electrical conductivity can be obtained by adding a conductive agent to the surface of the heat-sensitive adhesive or the surface of the adhesive layer. The conductive agent is an inorganic conductive filler, and the conductive property in the γ direction is added by the addition of 导 (the conductivity in the γ direction refers to the conductivity parallel to the surface of the film, the same applies hereinafter). Due to the limitations of the percolation theory, a large amount of conductive filler (usually having a weight percentage of more than 30%) is required in order to achieve the lamp = conductivity. This will greatly reduce the light transmittance of the film ^ (4) reveals this method; the other is to add the conductivity of the organic salt in the direction of 2'. The disadvantage of this method is that the antistatic property is >.., And it is easy to cause contamination of components, and such a method is disclosed in US Pat. No. 5,064,064. ~ For pressure-sensitive cover tapes, the use of conductive polymers or the addition of anti-electrical agents to obtain the antistatic effect of the coating, commonly used conductive polymers include, polyaniline, etc., commonly used antistatic agents include the season Money salt, aliphatic = threshold energy is easy to exist for component contamination, the environment is wet 4 4 74 ° Another method is through the metal layer on the base film to 'normal metal bond layer can be plated by evaporation贱 =: Manufacture, U.S. Patent No. 6,278, 2 discloses this method. The metal layer and the base film _ the nature is usually poor 'if there is no domain coating, the gods and free metal particles will cause component contamination problems: s, s, US5441809A reveals a kind of transparent static dissipation. Type 20 200850073 The cover (four) biaxially stretched base film layer, vacuum metal forged film conductive layer:: ', ' sealant layer composition, the heat sealant layer is added with anti-(four) balls and conductive 埴:. The invention better solves the problem that the film is sensitive to humidity, and the gold is protected, the cover tape of the invention is poor in transparency, and it is difficult to observe components through it, and σ, 亚和/, The thermosensitive adhesive layer may cause the components to be contaminated. f 10 15 20 SUMMARY OF THE INVENTION The first sadness of the present invention is to provide an antistatic film, which is particularly suitable for use in a cover tape, the film comprising: a base film; = layer 'which is located in the base film Providing electrical conductivity on the surface; two layers/layers, which are located on the surface of the conductive layer opposite to the base film to protect the base; the distal protective layer comprises particles of reduced conductivity of the polymer adult, wherein the core layer is inhibited The thickness of the thick b J knife puller is larger than that of the guarantee! The invention provides an article comprising the above two "antistatic film. The article includes, but is not limited to, a cover tape, a bag π #载▼, and optionally a system with a package, etc. - It is not intended to describe the per-personal solution disclosed in the present invention. Embodiments of the present invention will be described below with reference to the accompanying drawings and detailed description. /, - also cattle [Embodiment] In the present invention, unless otherwise specified The term "particles used to suppress the decrease in the surface conductivity of the film 25 200850073, the surface conductivity of the county buckle is reduced: sound: the antistatic film caused by the low protective layer, conductive or non-conductive: =:, the particle can be Inorganic or organic ♦ private, metallic or non-metallic. 5 15 The fog is supplied with an antistatic film. The film can be a transparent, low-electric or static-dissipative film that can be used to prepare several electrostatic bags and other antistatic products. The film of the moon comprises a base film, a conductive layer and a protective layer. Material i:,: Use any material that is relatively transparent and has good mechanical properties. The materials used include, but are not limited to, polyacrylate, cellophane, nylon, and poly Dengcheng. The cover tape shown in Figure 2 is preferably: °, ★ propylene (B〇p) and other easily tearable plastic film. The thickness of the base film is not particularly limited and is used, and the soil is transparent. The base film which is used for the preparation of 盍π is preferably such that the electric layer is located on one surface of the base film (the other side of the base film is optionally = shape) ") is a kind of material that provides conductivity f, which may be a metal or a metal oxide layer. Commonly used metals include nickel, yttrium, and yttrium; commonly used metal oxides include oxidized alkaloids, and tin oxides are replaced. , magnesium oxide, etc., the layer can be passed through the evaporation clock or magnetron reduction or other methods. The conductive polymer (such as Bayer's B. η») is oxidized with carbon black, carbon nanotubes, metal powder, metal. a conductive material filled with conductive particles, such a conductive layer can be formed by coating these materials on a base film. The surface resistivity of the conductive layer should not be higher than χ 欧姆 。 ohm ohm ohm ohm ohm ohm ohm ohm ohm In ohms/square, the best is not higher than ΐχΐ〇5 ohms M/square 0 20 200850073 The protective layer is located on the conductive layer and the opposite side of the wire to provide mechanical protection for the easy conductive layer. The protective layer does not reduce the conductivity of the cover tape too much to ensure that the entire structure remains The antistatic property required. Therefore, the protective layer contains particles 5 for suppressing a decrease in conductivity of the surface of the film (sometimes referred to simply as ''particles in the present invention). The thickness of the protective layer is preferably not More than 12 micrometers is more preferably not more than the working rice, more preferably not more than $ U meters, still more preferably not more than 2 micrometers, most preferably 〇·2_ι micrometers. The above is used to suppress the decrease in conductivity of the membrane surface. The shape and structure of the particles are not particularly limited and may be finely knives, flakes, dendrites, filaments, preferably in the form of particles. 1) The particles for suppressing the decrease in conductivity of the surface of the film are preferably electrically conductive or Semi-conductive % particles, including · metal particles, carbon black, carbon nanotubes, conductive or semi-conductive polymer particles, polymer particles coated with conductive or semi-conductive materials, metal oxides (eg, titanium dioxide, oxidized, etc.) particles And it a combination of various mixtures, and at least a portion of the particles have a particle size greater than the thickness of the layer 15 to facilitate formation of a conductive path from the metal layer to the x-axis direction of the coating surface (ie, perpendicular to the surface of the cover tape), At the same time, it can also act as a substitute for increasing the anti-adhesive particles (as shown in Fig. 3.) The protective layer further comprises a polymer film-forming polymer. There is no particular limitation on the kind and content of the polymer, such as polyurethane or epoxy. a polymer, an acrylic polymer, or a mixture thereof, etc. The average particle diameter of the particles added to the protective layer for suppressing the decrease in conductivity of the surface of the film is preferably 50 μm or less, more preferably 15 μm or less, and most preferably 10 microns or less. The particles for suppressing the decrease in conductivity of the surface of the film account for 30% or less by weight of the protective layer, more preferably 01 to 5%, most preferably 200850073, 0.3 in the case of a lower addition amount. To 2%. This is because the film maintains transparency and the film with lower haze b1 is better than K, and the particles in which the additive inhibits the electrocardiographic degradation of the film are more than one millionth - the particle size of the particles is larger than the film f'. More than one hundred thousandth of the particles have a particle size larger than the thickness to ensure the electrical conductivity of the direction, so that the antistatic film has static dissipative or conductive particles for suppressing the decrease of the surface conductivity of the film in the protective layer and optionally The mixed form of the polymer is not particularly limited, but it must be ensured to provide electrical conductivity in the Z direction. 'The antistatic film is provided with static electricity dissipation or conduction. 表面 Surface resistance of the transparent low-pollution antistatic film for the cover tape of the present invention The rate is preferably ohms/square. # When the conductivity requirement is high, the surface resistivity of the month is preferably less than 1χ1〇7 ohm/square. In addition to the conductive particles, a protective layer is added to the protective layer. The anti-allergic particles and the conductive filler may be one type of particles or different particles. It can be used as anti-drying particles including cerium dioxide, titanium dioxide, carbon black, metal powder and polymer microspheres. The average particle diameter of the anti-drilling particles is 0-15 microns, which accounts for the weight percentage of the protective layer. It is 〇_1〇%. Specific embodiments of the present invention are further described below with reference to the accompanying drawings. 20 Test methods: 1) Abrasion test··Testing instrument·· Taber Abraser 513〇 (Abrasion resistance testing machine), heart] manufactured by Industries. Using the CS-5 grinding wheel, the surface of the sample after a certain number of revolutions is measured. The ratio of the surface of the sample is higher than ΐχΐ〇13 ohm/square. If the surface resistivity is higher than ΐχΐ〇13 ohm/square, the sample π is considered to have failed at this number of revolutions. 2) Surface resistivity test: Test instrument: Trek 1 52 Φ iin t », 152 resistivity tester, manufactured by TREK, INC. 5 Test conforms to ESD Sll 1U Fan Huai, Nikki VII, Earth. ^ • ii铋 quasi-test method, measured under normal temperature and thirst conditions: ” Adjust the switch to the desired voltage position (10 volts or 100 volts) With the 152P-CR_CE_EX measuring probe continuously pressed on the surface of the film to be tested, at this time [(3) screen will show the measured surface resistivity. The surface resistivity unit is Euro 10 square. 3) Film thickness control: Coating thickness through weight gain Method measurement: cut a certain size of the film (area S), weigh (w〇), apply the coating and then weigh (W1), after the lack of pass

過增重UW=Wl-W〇)、樣品面積(s)和塗層的平=密= 15 ( D)計算塗層厚度(T): 山X T= _〇A/rW0)Overweight gain UW=Wl-W〇), sample area (s) and coating flat = density = 15 (D) Calculate coating thickness (T): Mountain X T = _〇A/rW0)

D*S 4) 老化試驗: 2〇 將所有待測樣品放入,95%濕度的老化箱中,放置 一周、兩周、三周及四周後測試樣品的表面電阻率變化 況0 月 將所有待測樣品放入60°C的烘箱中,放置一周、 β、兩周、 二周及四周後測试樣品的表面電阻率變化情況。 11 200850073 /主·除非特別指日月,本發明中所用濃度均爲重量百分比濃 度。二氧化矽的粒徑爲D50粒徑(D5〇也叫中位粒徑或中值粒 ^D50常用來表示粉體的平均粒度),資料由供應商提供。 5 g氧化鈦和妷黑的粒徑爲平均粒徑,資料由刮板細度計測 得。 原料: 雙組分聚氨酯(拜耳材料科技貿易(上海)有限公司,中 國上海) 10碳黑(立邦塗料(中國)有限公司,中國上海) 二氧化鈦(PPG塗料(天津)有限公司,中國天津) 一氧化矽(德固賽(中國)投資有限公司,中國上海) 製備實施例: 15 50微米厚的BOPP薄膜經過金屬化處理,透光率70%左 右,表面電p且率在1χ1〇3歐姆/平方到1χΐ〇4歐姆/平方之間, 在鍍金屬的一面塗上聚氨酯塗層,塗層厚度在0·3到15微米 之間。聚氨酯塗層中含有〇.3%到3%的用於抑制膜表面導電 性下降的粒子。 ^ 20 實施例1 : ★圖1所示爲本發明一種實施方案的透明低污染抗靜電 薄膜1的橫截面示意圖。基膜2爲雙向拉伸的Β0ΡΡ薄膜(也 可以是聚丙烯、聚乙烯、聚碳酸酯、賽璐珞、尼龍、、聚酯 25等),在基膜2的一個面上有一層導電層3,該導電層3爲金 12 200850073 ,卞 w s3相對於基膜的另-面是—層保護 來純導電層3的,該賴層中含有用 =卩㈣表面導電性下降的粒子5 ’粒子5主要用於提供z :向上的電導通性。該薄膜具有透明性好,低污 及水久抗靜電的性能。 實施例2 : 10 15 20 圖2所示爲本發明一種實施方案的蓋帶6的横截面示意 圚。 蓋帶6包含基膜2、導電層3、保護層4、離形劑層7和條 =膠點劑層8。基膜2爲雙向拉伸的B〇pp_,厚度爲观 2。在基膜2的一個面上有一層導電層3,該導電層3爲金屬 :導電層3的相對於基膜的另一面上有一層保護層4, 及保遵層4是用來保護導電層3的,該保護層是含有用於抑 制膜表面導電性下降的粒子5的聚氨g旨塗層,粒子5主要用 於提供Z方向上的電導通性。保護層4中也含有抗枯性填充 物9’該抗枯性填充物9和粒子5可以是同一種物f (見圖^ 也可以是不同種物質(見圖2)。在保護層4相對於導電層3 的外面塗一層條狀膠粘劑層8,該膠粘劑可以是壓敏型膠^點 劑也可以是熱敏型膠粘劑。在基膜2的相對於導電層3的另 -面塗有離形劑7。撕裂刻槽是沿著條狀膠魅劑方向 的,取出元器件時可以沿該撕裂刻槽撕開蓋帶,從而取 元器件。 13 25 200850073 實施例3 ·· 。。本發明的蓋帶6可以被用於載帶/蓋帶系統丨钟用於元 益件封裝。圖4所示爲包含載帶15和蓋帶6的载帶/蓋帶系統 透視圖。載帶15有一對長邊16、一個或多個凹部Η。元器 5件18可以被放在凹部17中。將元器件18放入載帶凹部π 之後二將蓋帶6通過載帶的長邊16與載㈣上從而蓋住凹部 Π。Λ4樣就可以在載帶15和蓋帶6之間裝載元器件μ。爲了 打開现可6,轉移7〇益件,盍帶最終會被從載帶/蓋帶系統 14中剝離。如圖4所示,蓋帶6的中間部分13 (位於兩條撕 10裂刻槽12之間)被剝離掉,蓋帶6的外延19在中間部分13被 剝離掉之後還繼續保持與載帶15相粘。在蓋帶中間部分Η 被剝離以後,被繞成一卷2〇然後廢棄或可重復利用。 實施例4 : 15…一 50〇/〇濃度的雙組分聚氨酯溶液中摻入〇加%的平均粒 徑爲5微米的二氧化鈦,將此均勻懸浮液塗布到蒸發鍍鋁的 雙向拉伸聚丙烯薄膜的錢銘面上。此蒸發锻銘的雙向拉伸 聚丙烯薄膜的鍍鋁面的表面電阻率是1><1〇6歐姆/平方。塗布 後的薄膜置入100°C的烘箱烘烤15分鐘以便聚氨酯充分交 20聯。烘烤後的聚氨酯塗層厚度在0·9到1.0微米之間,表面電 阻率在ixiO^UxU)8歐姆/平方之間。此薄膜置入52。〇95% 相對濕度的老化箱老化一個月,表面電阻率衰減至丨χ 1〇9到 1Χ1012歐姆/平方。此保護塗層可以通過3〇〇轉的耐磨測試。 25 貫施例5 : 14 200850073 …50%濃度的雙組分聚氨s旨溶液中掺人03加%的平均粒 徑爲5微米的碳黑以及〇6〜%的1)5〇粒徑爲6微米的二氧化 石夕,攪拌均勻後將此懸浮液塗布到蒸發鑛紹的雙向拉伸聚 丙烯薄膜的鑛銘面上。此蒸發細呂的雙向拉伸聚丙婦薄膜 5,難面的表面電阻率是1χ1()6歐姆/平方。塗布後的薄膜以 :分鐘ίο米的速度通過6米長1〇(rc的烘箱以便聚氨酷充分 父聯。烘烤後的聚氨酯塗層厚度在1〇到12微米之間,表面 電阻率在1X107到1χ109歐姆/平方之間。此薄膜置入52艺 95%相對濕度的老化箱老化—個月,表面電阻率衰減至 ίο 1x107到1χΐ〇10歐姆/平方。此保護塗層可以通過300轉的耐 磨測試。 貫施例6 : ~ 50%濃度的雙組分聚氨酯溶液中摻入〇 6wt%的〇5〇粒 15徑爲6微米的二氧化矽,攪拌均勻後將此懸浮液塗布到蒸發 錢紹的雙向拉伸聚丙烯薄膜的鑛铭面上。此蒸發鑛紹的雙 向拉伸聚丙烯薄膜的鍍鋁面的表面電阻率是1><1〇6歐姆/平 方。塗布後的薄膜以每分鐘1〇米的速度通過6米長1〇〇它的 供箱以便聚氨酉旨充分交聯。烘烤後的聚氨醋塗層#度在1〇 20到1,2微米之間,表面電阻率在1X107到lxio10歐姆/平方之 間此溥膜置入52 c 95%相對濕度的老化箱老化一個月,表 面電阻率衰減至lx107到lxl〇u歐姆/平方。此保護塗層可以 通過300轉的耐磨測試。 25 實施例7 ·· 15 200850073 微来::濃/的聚氨酷溶液中摻入2.〇wt%的平均粒徑爲10 '、、厌將此均勻懸浮液塗布到蒸發鑛銘的雙向拉伸 =烯薄膜的肋面上。此蒸發鍍銘的雙向拉伸聚丙烯薄 、、=鑛銘面的表面電阻率是lxlG6歐姆/平方。塗布後的薄膜 2分鐘10米的速度通過6米長i⑼。C的烘箱以便聚氨醋充 刀又聯烘烤後的聚氨酯塗層厚度在丨〇到丨.2微米之間,表 面電阻率在lxl〇、,Jlxl〇9歐姆/平方之間。此薄膜置入饥 95%相對濕度的老化箱老化一個月,表面電阻率衰減至 10 ixwmxu)1。歐姆/平方。此保護塗層可以通過5〇〇轉的耐 磨測試。 實施例8 : 50%濃度的雙組分聚氨s旨溶液中掺人G.6wt_平均粒 徑爲5微米的礙黑以及2.〇wt%的D5〇粒徑爲6微米的二氧化 15石夕,檀拌均勻後將此懸浮液塗布到蒸發鑛銘的雙向拉伸聚 丙烯薄膜的鑛銘面上。此蒸發鑛銘的雙向拉伸聚丙婦薄膜 的鍍鋁面的表面電阻率是1χ1〇δ歐姆/平方。塗布後的薄膜以 每分鐘10米的速度通過6米長1〇(rc的供箱以便聚氨酉旨充分 交聯。烘烤後的聚氨酯塗層厚度在0.9到1.2微米之間,表= 20電阻率在ιχ1〇7到ΐχ1〇9歐姆/平方之間。此薄膜置入52〇c 95%相對濕度的老化箱老化一個月,表面電阻率衰減至 歐姆/平方。此保護塗層可以通過300轉的耐 磨測試。 ' 如上所述,本發明抗靜電膜及其製品,例如蓋帶,具 16 200850073 2很多優點。例如’本發明蓋帶在低濕度 性能沒有下降。由於保護層耐磨擦,因而可以對導:穴 導電::導電顆粒形成的導電通路在保護層= 層在盍可兩邊,蓋帶中間區域沒有膠粘層,也沒有小二子D*S 4) Aging test: 2〇 Put all the samples to be tested into the 95% humidity aging box, and set the surface resistivity of the test samples after one week, two weeks, three weeks and four weeks. The sample was placed in an oven at 60 ° C, and the surface resistivity of the test sample was measured after one week, β, two weeks, two weeks, and four weeks. 11 200850073 / Main · Unless otherwise specified, the concentrations used in the present invention are all percentage by weight. The particle size of cerium oxide is D50 particle size (D5 〇 is also called median particle size or median particle ^D50 is commonly used to indicate the average particle size of the powder), and the data is provided by the supplier. The particle size of 5 g of titanium oxide and niobium is the average particle size, and the data is measured by a scraper fineness meter. Ingredients: Two-component polyurethane (Bayer MaterialScience Trading (Shanghai) Co., Ltd., Shanghai, China) 10 Carbon Black (Nippon Paint (China) Co., Ltd., Shanghai, China) Titanium Dioxide (PPG Coating (Tianjin) Co., Ltd., Tianjin, China) Yttrium Oxide (Degussa (China) Investment Co., Ltd., Shanghai, China) Preparation Example: 15 50 μm thick BOPP film is metallized, the light transmittance is about 70%, and the surface electric conductivity is 1χ1〇3 ohm/ Between square and 1 ohm/square, the metallized side is coated with a polyurethane coating with a thickness between 0 and 3 microns. The polyurethane coating contains 3% to 3% of particles for suppressing the decrease in conductivity of the surface of the film. ^ 20 Embodiment 1: Fig. 1 is a schematic cross-sectional view showing a transparent low-pollution antistatic film 1 according to an embodiment of the present invention. The base film 2 is a biaxially stretched Β0 ΡΡ film (which may also be polypropylene, polyethylene, polycarbonate, cellophane, nylon, polyester 25, etc.), and has a conductive layer 3 on one side of the base film 2, which The conductive layer 3 is gold 12 200850073, and 卞w s3 is layer-protected with respect to the other side of the base film to the pure conductive layer 3, and the layer contains particles 5 'particle 5 with reduced conductivity on the surface of 卩 (4). Used to provide z: upward electrical conductivity. The film has good transparency, low stain and long-term antistatic properties. Embodiment 2: 10 15 20 Fig. 2 shows a cross-sectional schematic view of a cover tape 6 according to an embodiment of the present invention. The cover tape 6 comprises a base film 2, a conductive layer 3, a protective layer 4, a release agent layer 7, and a stripe = glue layer 8. The base film 2 is B〇pp_ which is biaxially stretched, and has a thickness of 2. On one side of the base film 2, there is a conductive layer 3, the conductive layer 3 is a metal: the conductive layer 3 has a protective layer 4 on the other side of the base film, and the protective layer 4 is used to protect the conductive layer. In the third layer, the protective layer is a coating of a polyammide containing particles 5 for suppressing the decrease in conductivity of the surface of the film, and the particles 5 are mainly used for providing electrical conductivity in the Z direction. The protective layer 4 also contains an anti-dry filler 9'. The anti-dry filler 9 and the particle 5 may be the same substance f (see Fig. 2 or different substances (see Fig. 2). A strip of adhesive layer 8 is applied on the outer surface of the conductive layer 3. The adhesive may be a pressure sensitive adhesive or a heat sensitive adhesive. The base film 2 is coated on the other side of the conductive layer 3. Shape agent 7. The tearing groove is in the direction of the strip of adhesive, and when the component is taken out, the cover tape can be torn along the tearing groove to take the component. 13 25 200850073 Example 3 ··· The cover tape 6 of the present invention can be used for a carrier tape/cover tape system 丨 bell for the element package. Figure 4 shows a perspective view of the carrier tape/cover tape system including the carrier tape 15 and the cover tape 6. 15 has a pair of long sides 16, one or more recesses Η. The element 5 member 18 can be placed in the recess 17. After the component 18 is placed in the carrier tape recess π, the cover tape 6 is passed through the long side of the carrier tape 16 With the load (4) and thus covering the recess Π. Λ 4 can load the component μ between the carrier tape 15 and the cover tape 6. In order to open the current 6, transfer 7 〇 件, 盍Will eventually be stripped from the carrier tape/cover tape system 14. As shown in Figure 4, the intermediate portion 13 of the cover tape 6 (between the two tear 10 slits 12) is peeled off, and the extension of the cover tape 6 is 19 After the intermediate portion 13 is peeled off, it continues to remain adhered to the carrier tape 15. After the intermediate portion of the cover tape is peeled off, it is wound into a roll of 2 turns and then discarded or reusable. Example 4: 15...50〇 The bismuth concentration of the two-component polyurethane solution is doped with 〇% by weight of titanium dioxide having an average particle diameter of 5 μm, and this uniform suspension is applied to the surface of the evaporating aluminum-plated biaxially oriented polypropylene film. The surface resistivity of the aluminized surface of the biaxially oriented polypropylene film of Forging is 1><1〇6 ohm/square. The coated film is placed in an oven at 100 ° C for 15 minutes so that the polyurethane is fully crosslinked. The baked polyurethane coating has a thickness between 0. 9 and 1.0 microns and a surface resistivity between ixiO^UxU and 8 ohms/square. This film is placed in 52. The aging chamber of 〇95% relative humidity is aged for one month, and the surface resistivity is attenuated to 丨χ1〇9 to 1Χ1012 ohm/square. This protective coating can be tested for wear resistance by 3 turns. 25 Example 5: 14 200850073 ... 50% concentration of two-component polyurethane s solution containing 03% by weight of carbon black with an average particle size of 5 microns and 〇6~% of 1)5〇 particle size 6 micron of silica dioxide, after stirring evenly, the suspension was applied to the mineral inscription of the biaxially oriented polypropylene film of the evaporated ore. This evaporating fine biaxially stretched polypropylene film 5, the surface resistivity of the difficult surface is 1 χ 1 () 6 ohm / square. The coated film passes through a 6-meter-long 1 〇 oven at a speed of ίο m (the rc oven is used to make the polyurethane a full parent. The thickness of the polyurethane coating after baking is between 1 〇 and 12 μm, and the surface resistivity is 1×107. Between 1 χ 109 ohms/square. This film is placed in a aging oven with a 95% relative humidity of aging. The surface resistivity is attenuated to ίο 1x107 to 1 χΐ〇 10 ohms/square. This protective coating can pass 300 rpm. Abrasion test. Example 6: ~ 50% concentration of two-component polyurethane solution was mixed with wt6wt% 〇5〇 granules with a diameter of 6 microns of cerium oxide. After stirring, the suspension was applied to evaporation. The surface of the biaxially oriented polypropylene film of Qian Shao. The surface resistivity of the aluminized surface of the biaxially oriented polypropylene film of this evaporation mine is 1><1〇6 ohm/square. At a speed of 1 metre per minute, it passes through a box of 6 meters long and is used for the purpose of fully cross-linking the polyurethane. The baked polyurethane coating # degrees between 1 〇 20 and 1, 2 μm, The surface resistivity is between 1X107 and lxio10 ohms/square. This ruthenium film is placed into an aging of 52 c 95% relative humidity. After aging for one month, the surface resistivity is attenuated to lx107 to lxl〇u ohms/square. This protective coating can pass the 300 rpm abrasion test. 25 Example 7 ·· 15 200850073 Micro-:: Concentrated / Polyurethane Solution The average particle size of the 〇wt% is 10', and the uniform suspension is applied to the biaxial stretching of the evaporating mineral = the rib surface of the olefin film. The surface resistivity of the thin, and = mineral inscription is lxlG6 ohms/square. The coated film is passed through a 6-meter-long i (9) C. oven in a 6-meter-long i (9) C oven for the polyurethane coating. The thickness is between 2.2 μm and the surface resistivity is between lxl〇, Jlxl〇9 ohm/square. The film is placed in an aging box with a 95% relative humidity for one month, and the surface resistivity is attenuated to 10 ixwmxu)1. Ohm/square. This protective coating can pass the 5 rpm abrasion test. Example 8: 50% concentration of two-component polyamine s solution in which a G.6wt_average particle size of 5 μm is impregnated and 2. 〇wt% of D5〇6 nm has a diameter of 6 μm. Shi Xi, after the sandalwood is evenly mixed, the suspension is applied to the mineral inscription of the biaxially oriented polypropylene film of Evaporation. The surface resistivity of the aluminized surface of the biaxially stretched polypropylene film of this evaporating mineral is 1 χ 1 〇 δ ohm/square. The coated film was passed at a speed of 10 meters per minute through a length of 6 meters (the rc box was used for the polyurethane to fully crosslink. The thickness of the baked polyurethane coating was between 0.9 and 1.2 microns, and the table = 20 resistance The ratio is between ιχ1〇7 and ΐχ1〇9 ohm/square. The film is aged in a aging tank of 52〇c 95% relative humidity for one month, and the surface resistivity is attenuated to ohm/square. This protective coating can pass 300 rpm. Abrasion resistance test. As described above, the antistatic film of the present invention and its articles, such as a cover tape, have many advantages of 16 200850073 2. For example, the cover tape of the present invention does not have a decrease in low humidity performance. Therefore, it can be conductive: the conductive path formed by the conductive particles is in the protective layer = the layer is on both sides, the middle part of the cover tape has no adhesive layer, and there is no small two.

:靜電劑’因而不易對元器件造成污染,不管採= 作4膠粘層還是埶斂膦从这_,ρ i敏I 〃、、彡作爲㈣層’也不會影響剝離穩定 於本發明的導電保護層可以做得很薄,而且 ==,較小且含量低,因此可保持薄膜很好的透 ^ 可大於4〇%,通常大於5〇%;霧度可低於30%, 通常低於15%)。因此,用本發明的薄膜製成的蓋帶且有卓 越的綜合性能,其不僅符合光學,電學方面的性能要求, 而且Μ度不敏感,剝離力敎,清潔無污染,質量易控。 仏:本^明已經在某些實施方案和實施例中進行了描 15 20 ^仁疋本領域技術人員應當理解爲本發明從具體公開的 κ加方案延及到其他備選實施方案和/或本發明的用途和 』而易見的改進及等價内$。另夕卜’本發明並不受此處的 較佳貫施方案的具體公開内容的限制。而是,申請人意指 本發明的範圍只受後附權利要求的限制,並且此處所公開 方法和材料對於本領域技術人員是顯而易見的變化都將落 在申明人的發明的範圍内。上述實施例僅係為了方便說明 而舉例而已,本發明所主張之權利範圍自應以申請專利範 圍所述為準,而非僅限於上述實施例。 17 200850073: The electrostatic agent' is therefore not easy to cause contamination of the components, regardless of whether the 4 adhesive layer or the fluorene phosphine from this _, ρ i sensitive I 〃, 彡 as the (four) layer ' does not affect the peeling stability of the present invention The conductive protective layer can be made very thin, and ==, small and low in content, so that the film can maintain a good permeability of more than 4%, usually more than 5%, and the haze can be less than 30%, usually low. At 15%). Therefore, the cover tape made of the film of the present invention has excellent comprehensive performance, which not only meets optical and electrical performance requirements, but also has insensitivity to twist, peeling force, cleanness, no pollution, and easy quality control. The present invention has been described in certain embodiments and examples. It will be understood by those skilled in the art that the present invention extends from the specifically disclosed κ addition scheme to other alternative embodiments and/or The use of the invention and the improvements that are readily apparent and equivalent within $. In addition, the present invention is not limited by the specific disclosure of the preferred embodiments herein. Rather, the Applicant intends that the scope of the present invention is limited only by the scope of the appended claims, and that variations of the methods and materials disclosed herein will be apparent to those skilled in the art. The above-described embodiments are merely examples for the convenience of the description, and the scope of the claims is intended to be limited to the above-described embodiments. 17 200850073

Γ圖式簡單說明J 圖i是本發明抗靜電膜的横截面示意圖。 圖2是作爲本發明製品 意圖。 種只施方案的盍帶的横截面示 種實施方案的蓋帶的橫截面 圖3是作爲本發明製品的另一 示意圖。 的 主 要元件符號說明 條狀膠粘劑層8 載帶15 抗粘性填充物9 長邊16 撕裂刻槽1 〇 凹部17 撕裂刻槽11 元器件18 撕裂刻槽12 外延19 中間部分13 一卷20 載帶/蓋帶系統14BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of an antistatic film of the present invention. Figure 2 is intended as a product of the present invention. Cross-section of an embodiment of the entrainment of the entrainment of the embodiment of the invention. Fig. 3 is another schematic view of the article of the present invention. Main component symbol description strip adhesive layer 8 carrier tape 15 anti-adhesive filler 9 long side 16 tear groove 1 〇 recess 17 tear groove 11 component 18 tear groove 12 extension 19 intermediate portion 13 roll 20 Carrier/cover tape system 14

抗靜電薄膜1 基膜2 導電層3 保護層4 粒子5 蓋帶6 離形劑層7 18Antistatic film 1 Base film 2 Conductive layer 3 Protective layer 4 Particle 5 Cover tape 6 Release agent layer 7 18

Claims (1)

200850073 十、申請專利範圚 基臈 種抗靜電膜,其包括·· 15 導J層’其位於基臈的一個表面上以提供導電性,·和 莫雨展4 #位於導電層的與基助對的表面上以保護 ==護層包括高分子成膜聚合物和用於抑制膜表 ·*«居太| +的粒子’其中至少—部分粒子的粒徑大於保 濩層本身厚度。 2·如申請專利範圍第丨項所述之抗靜電膜 阻率爲lxlO4到1χ10"歐姆/平方。 、 ^ 3·如申請專利範圍第丨項所述之抗靜電膜 保護層的厚度不大於12微米。 一 4.如申請專利範圍第3項所述之抗靜電膜 保護層的厚度不大於5微米。 5·如申請專利範圍第4項所述之抗靜電膜 保護層的厚度不大於2微米。 6·如申請專利範圍第5項所述之抗靜電膜 保護層的厚度爲〇·2-1微米。 7·如申請專利範圍第1項所述之抗靜電膜 其表面電 其中所述 其中所述 其中所述 其中所述 其中以所 述粒子的總數計,粒徑大於膜厚的粒子的數量占百萬分 一以上。 8.如申請專利範圍第7項所述之抗靜電膜,其中以所 述粒子的總數計,粒徑大於膜厚的粒子的數量占十萬分之 一以上。 20 200850073 9·如申請專利範圍第1項所述之抗靜電膜,其中所述 粒子選自金屬粒子、碳黑、碳納米管、導電或半導電聚合 物粒子、塗了導電或半導電材料的聚合物粒子、金屬氧化 物粒子及它們的各種混合物的組合。 5 ι〇·如申請專利範圍第1項所述之抗靜電膜,其中基於 保護層的總重量,所述用於抑制膜表面導電性下降的粒子 的含量爲30 wt%以下。 H.如申請專利範圍第1〇項所述之抗靜電膜,其中基 於保護層的總重量,所述用於抑制膜表面導電性下降的粒 10 子的含量爲0.1-5 wt%。 如申請專利範圍第u項所述之抗靜電膜,其中基 於保邊層的總重量’所述用於抑制膜表面導電性下降的粒 子的含量爲0.3-2 wt0/。。 15 20 ㈣1\如/請專利範圍第1項所述之抗靜電膜,其中所述 用:曰遇包含增加抗祕的粒子,該抗㈣粒子與所述 表面導電性下降的粒何以是―種粒子,也可 以疋不同粒子。 導二Π專利範圍第1項所述之抗靜電膜,其中所述 導電層爲導匕::圍第1項所述之抗靜電膜,其中所述 巾明專利乾圍第}項所述之抗靜電膜,其中所述 20 200850073 及U::選“黑、碳納米管、金屬粉、金屬氧化物、 〃此5物的粒子填充的聚合物材料層。 is·如巾請專利範圍第㈣所述之抗靜電膜,其中所述 ¥電3的表面電阻率不高於lxl〇1G歐姆/平方。 19·如中μ專利圍第18項所述之抗靜電膜,其中所 述導電層的表面電阻率不高於1><1〇7歐姆/平方。200850073 X. Applying for a patent anti-static film, including 15 layers of J layer 'on a surface of the base to provide conductivity, · and Mo Yuzhan 4 # located in the conductive layer and the base The surface of the pair is protected by a protective layer comprising a polymer film-forming polymer and a particle for suppressing the film surface. The particle diameter of at least part of the particle is larger than the thickness of the layer itself. 2. The antistatic film resistivity as described in item bis of the patent application is lxlO4 to 1χ10" ohms/square. ^3· The thickness of the antistatic film protective layer as described in the scope of the patent application is not more than 12 μm. A 4. The thickness of the antistatic film protective layer as described in claim 3 is not more than 5 μm. 5. The thickness of the antistatic film protective layer as described in claim 4 is not more than 2 μm. 6. The thickness of the antistatic film protective layer as described in claim 5 is 2-1·2-1 μm. 7. The surface of the antistatic film according to claim 1, wherein the surface of the antistatic film has a particle size greater than a film thickness, wherein the number of the particles is greater than the total thickness of the particles. More than one point. 8. The antistatic film according to claim 7, wherein the number of particles having a particle diameter larger than a film thickness accounts for more than one part per 100,000 based on the total number of the particles. The antistatic film of claim 1, wherein the particles are selected from the group consisting of metal particles, carbon black, carbon nanotubes, conductive or semiconductive polymer particles, coated with a conductive or semiconductive material. A combination of polymer particles, metal oxide particles, and various mixtures thereof. The antistatic film according to claim 1, wherein the content of the particles for suppressing the decrease in conductivity of the surface of the film is 30 wt% or less based on the total weight of the protective layer. The antistatic film according to claim 1, wherein the content of the particles for suppressing the decrease in conductivity of the surface of the film is 0.1 to 5 wt% based on the total weight of the protective layer. The antistatic film according to the invention of claim 5, wherein the content of the particles for suppressing the decrease in conductivity of the surface of the film is from 0.3 to 2 wt% based on the total weight of the edge layer. . The antistatic film of claim 1, wherein the use of the anti-static film comprises particles which increase the anti-secret property, and the anti-(four) particles and the particles whose surface conductivity is decreased are Particles can also lick different particles. The antistatic film of the first aspect of the invention, wherein the conductive layer is a conductive layer: the antistatic film according to item 1, wherein the towel is described in the article Antistatic film, wherein the 20 200850073 and U:: select "black, carbon nanotubes, metal powder, metal oxide, 聚合物 粒子 5 粒子 聚合物 聚合物 聚合物 聚合物 is is is is is is is is is is is is is 如 如 如 如The antistatic film, wherein the surface resistivity of the electricity source 3 is not higher than 1 x 1 〇 1 G ohm / square. The antistatic film of the above-mentioned Item No. 18, wherein the conductive layer The surface resistivity is not higher than 1 < 1 〇 7 ohms/square. …20· b申請專利範圍第19項所述之抗靜電膜,其中所 述導電層的表面電阻率不高於1><1〇5歐姆/平方。 21_如申請專利範圍第丨項所述之抗靜電膜,其中所述 成膜聚合物選自聚氨酯,環氧樹脂,丙烯酸聚合物及它們 的混合物。 10 22.如申請專利範圍第丨項所述之抗靜電膜,其中所述 用於抑制膜表面導電性下降的粒子的平均粒徑爲5〇微米以 下。 15 23·如申请專利範圍第22項所述之抗靜電膜,其中所 述用於抑制膜表面導電性下降的粒子的平均粒徑爲15微米 以下。 24.如申請專利範圍第23項所述之抗靜電膜,其中所 述用於抑制膜表面導電性下降的粒子的平均粒徑爲1〇微米 20 以下。 25·一種製品,其包括如申請專利範圍第1至24項中任 意一項所述的抗靜電膜。 26·如申請專利範圍第25項所述之製品,所述製品爲 蓋帶。 21 200850073 括: 27.如申請專利範圍第26項所述 之製品,其結構還包 膠枯層,其分別設置在與導電層相對 面的鄰近相對的長邊的部分上; 保濩層表 撕裂刻槽’其分別沿著所述相 置在抗靜雷胺“嗅、 料的長邊的方向直接設 ^包胰的保護層那一側;以及 離形劑層,其設置在與導電層相對的那個基膜表面 上 28· 如申請專利範圍第27項所述之製 層爲壓敏膠層。 品,其中的膠粘 品,其還ί申請專利範圍第26至28項中任一項所述的製 29, 包括載帶。 包裝體 _如申請專利範圍第29項所述之製品,其還包括帶The antistatic film of claim 19, wherein the conductive layer has a surface resistivity of not more than 1 < 1 〇 5 ohm/square. The antistatic film of claim 2, wherein the film-forming polymer is selected from the group consisting of polyurethanes, epoxy resins, acrylic polymers, and mixtures thereof. The antistatic film according to claim 2, wherein the particles for suppressing the decrease in conductivity of the surface of the film have an average particle diameter of 5 μm or less. The antistatic film according to claim 22, wherein the particles for suppressing the decrease in conductivity of the surface of the film have an average particle diameter of 15 μm or less. The antistatic film according to claim 23, wherein the particles for suppressing the decrease in conductivity of the surface of the film have an average particle diameter of 1 μm or less. An article comprising an antistatic film according to any one of claims 1 to 24. 26. The article of claim 25, wherein the article is a cover tape. 21 200850073 includes: 27. The article of claim 26, wherein the structure further comprises an adhesive layer, which is respectively disposed on a portion adjacent to the opposite long side opposite to the conductive layer; a slit groove' which is disposed along the side of the protective layer which is directly disposed in the direction of the long side of the anti-static amine "smell and material"; and a release agent layer which is disposed on the conductive layer The surface of the base film is opposite. The layer as described in claim 27 is a pressure-sensitive adhesive layer. The product, wherein the adhesive is further applicable to any of the patent scopes 26 to 28. The article 29, comprising the carrier tape. The package body as claimed in claim 29, further comprising a tape
TW96120877A 2007-06-08 2007-06-08 Antistatic film and article comprising the same TW200850073A (en)

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