200841486 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種發光二極體之支架組件設計，尤 指一種表面黏著型發光二極體之支架組件製造方法及結 構，以供大量生產化之光學透鏡體能一次性地同時組合及 定位於相對應之發光二極體單元者。 【先前技術】 發光二極體（Light Emitting Diode，LED)於近幾 年來已成為一種指標性之照明構件，其具有無須暖燈時 間、反應速度快、體積小、耗電量低、低污染、南度南、 壽命長等之優良特性，已逐漸取代目前所使用之燈具、交 通號誌、廣告招牌或背光模組等之照明。 一般來說，發光二極體之組成，可於一表面黏著型 (Surface Mount Device λ SMD)二極體支架（或可稱引線架） 内，進行固晶、打線及封膠作業，從而構成一表面黏著型 發光二極體，而二極體支架製造流程和固晶作業等之製程 作業，在業界裏通常是如下列之步驟所示： (a)沖壓一金屬板片，令金屬板片中成型有複數個引線 區，而每一引線區中皆可具有二互不連通的金屬支架；即 沖壓作業。' • (b)射出成型絕緣性的膠體，使金屬板片之每一引線區 中分別成型有膠體並同時固接金屬支架，且令膠體成型有 一内凹的功能區，和金屬支架係由功能區中由内而外地延. 伸至膠體外部；即射出作業。藉此，於金屬板片中可構成 為數眾多的表面黏著型二極體支架。 6 200841486 ⑷進行固晶作業，將金屬板片t之每一 1 接有發光二極，曰月，並在 、區为別固 屬支架上… 係固接於谬體之功能區中的-金 _)進行打線作業，將每一發光-搞雕日y々± 導線H導線連接至二金屬^各連接有二 透光!I):二封:作業，將每-膠體之功能區甲填充有一可 =氣樹脂’以覆蓋發光二極體晶片及導線。 =上述之作業步驟’可於金屬板片 地表面點著型發光二極體，且 ^百數里4人夕 脫落/切除，^刀別由孟屬板片上輕易 到大量化生產的H後妓之產^，藉以達 度均句化，因此，合進一:在使發光二極體的發光亮 透鏡dens) w目\步在發先二極體上增設有一光學 俨曰# ，、係，、有聚光效用的光學'物件，合發先_ 4 脰日日片所釋放出之光線，其穿 田巧-極 光之效果，人| 土 尤予透鏡日守，可達到聚 度更加提昇7。 體的發光亮度能夠更加均勾化，亮 在其在習，《:之製程作業中，通常 鏡，進而將全屬出或講貝大量單顆型式的光學透 械手臂，以分別抓取每-顆光學透鏡機台上之機 之金屬板片卜鏡將其先組裝於上述 利用點膠之方極體上’使兩者先相互地結合，再 定，之後，再:’將光學透鏡能和發光二極體相互黏著固 發光二極體1將完成签體流程作業所構成的 惟 、下’從而能加以組裝於產品内。 ’上迷之方式雖可將光學透鏡結合於發光二極體 200841486 . 上，但單顆型式之組裝方式，生產速度較慢，進而無法達 • 到快速生產的目的，對於此段之製程作業來說，將使得生 ' 產效率/盈降低(即產能速度較低），且機台上之定位設計等 也必須設計精準，才能將光學透鏡準確地結合於發光二極 體上’否則將易產生瑕疲品，易增高此段之製程作業上的 瑕疵率，從而造成機台設備之設計、運作上也相對地較為 困難化，對於製造業者來說無疑是一大困擾，從而造成製 程上之不便之處。 ⑩ 緣是本發明人有感上述缺失之可改善，乃特潛心·研 九並配合學理之運用，終於提出一種設計合理且有效改善 上述缺失之本發明。 【發明内容】 本發明之目的，在於提出一種表面黏著型發光二極體 之支架組件製造方法及結構，藉由一板片中能加以形成為 數眾多的光學透鏡體，再使板片結合於一二發光二極體基 板的金屬板片單元上，令大量生產化之光學透鏡體能_次 _ 性地同時組合及定位於相對應之一發光二極體單元上.，以 大幅提昇此段製程作業之生產效率/益，及提昇製程上之 便利性。 為達上述之目的，本發明提供一種表面黏著型發光二 極體之支架組件製造方法.，其包括下列步驟： ,，提供一板片，並將該板片成型有複數個支撐區； 成型複數個光學透鏡體，將上述之板片的每一支撐區 中分別固接有該光學透鏡體； 提供一發光二極體基板，其係包含一金屬板片單元， 200841486 及複數個各形成於該金屬板片單元中的表面黏著型之發 光二極體單元；以及 x 、將上述之板片與上述、之發光二極體基板相互地結 合，使所述之板片結合於所述之金屬板片單元，從而將所 述之光學透鏡體分別組合於相對應之發光二極體單元。 為達上述之目的，本發明並同時提供一種表面黏著型 發光二極體之支架組件結構，包括：一板片，其係具有複 數個支撐區，及複數個分別定位於該等支架區的光學透鏡 體；以及一發光二極體基板.，其係具有一金屬板片單元， 及複數個各形成於該金屬板片單元中的表面黏著型之發 光二極體單元； 其中，上述之板片係結合於上述之金屬板片單元，使 每一光學透鏡體分別組合於相對應之發光二極體單元。 本發明具有之效益：藉由板片中加以形成為數眾多的 光學透鏡體，進而利用板片結合於發光二極體基板的金屬 板片單元上，令大量生產化之光學透鏡體能一次性地同時 •組合及定位於相對應之發光二極體單元上，以大幅提昇此 段製程作業之生產效率/益，及提昇製程上之便利性，進 而也大幅降低此段製程之瑕疵率。 為使能更進一步暸解本發明之特徵及技術内容，請參 閱以下有關本發明之詳細說明與附圖，然而所附圖式僅提 供參考與說明用，並非用來對本發明加以限制者。 【實施方式】 請先參閱第一圖至第三圖所示，本發明係提供一種 「表面黏著型發光二極體之支架組件製造方法及其結 200841486 構」，其巾難造妓係包括下狀㈣： 之支二—係成型她 的支腳12以-體連結於;^/係各成型具有相對設置 該板片1可係為^ p u 使用連續沖壓之技術方可為金屬薄料片’藉以可 12。當然，板片一支撐區11和支腳 加工方式，如以塑膠射出金屬材料，並利用其它之 1和支腳1 2，但最佳以成型所述之支樓區1 沖壓之技術方式，;使用金屬薄料_ 腳12可沖壓呈彎折狀’母支 式中係以彎折為例。 切德在本發明之圖 ~ 2i成型複數個光學透鏡體2，將板片1之每-支 :: 的支腳12各固接有-光學透鏡體2,A俜呈 有聚光效果之光學件。 ，、係具 固接鏡體2可經由以射出成型之方式，從而各 '处之支腳1 2上，或可係經由澆鑄成型之方 :固接於相對應之支腳丄2上。另，光學透鏡體2可： 貝=體、’或可由下而上地凹設形成有凹穴（圖略），進: 使付ί學透鏡體2内部呈—空心、體，而每—光學透鏡體2 成材貝係可由石歸所製成，或可由任何已知光學塑料所夢 jC)提供一發光二極體基板3，其係包含有一金屬 ，片早兀3.0 ’及複數個各形成於該金屬板片單元3 〇 : 白、表面黏著型之發光二極體單元40。 10 200841486 片^—t，所述之金屬板片單元3 0可係為單片式金屬板 個）所構成，其可經過如下列所述之步驟所構成： 個成，業、將一金屬板片3 1形成複數 則線£3 1 1，及每—區3丄1 、 通的金屬支架3 1 2，且-體連結於金屬板片3工。 (二）射出成型作業，係射出絕緣性的膠體41， ^別固接所述之金屬支架312，而每—膠體41的 ^面皆係形成有—内凹的功能區4 1 1，且每一全屬 =3 12係分別由功能區4 i i巾向外延 =卜其中，膠體41之材質可係為如聚鄰苯 s避月文（Polyphthalamide，PPA)，$ 甘〜/ 塑性_。 e PPA)，或其它任何已知之熱 接於^H晶作f ’係將發光二極體晶片4 2分別固 架之功能區411中，其可固接於一金屬支 =實際之需求而設，如—個、三個等之數量，在= 中係以一個為例。 肛口叭 j四）打線作業，係可於每-發:¾二極體晶片4 2 查°連接有二導線4 3 ’且將二導線4 3各連接至互不 連通之金屬支架3 2 2上。 立不 經由上述之步驟，使得金屬板片 Q乃係分職含—谬體4丨、複數 tf夕少—發光二極體晶片42及導線43 王葛* 12乃係由金屬板片3工所成型；另外，在 11 200841486 打線作業之步驟後，係可更進一步具有一步驟： (五）封勝作業’係在每一膠體4 1之功能區4 I 1 脒赤填f有—可透光牲之封膠層4 4，如環氧樹脂、石夕 糊脂’藉以將發光二極體晶片4 再由上述之步驟（五），也係可構成-所述之發光-極體基板3,進而使得每_發光：極體單元4q^：： 步包括一封膠層4 4。 另外’如第四圖所示，上述之金屬板片單元3 〇係 1牛、：步變化，其主要不同處在於：當沖壓成業時可進 --於母-5!線區3 i丄中各形 3 數個以上的金屬支架312，固晶座313係“= 二3=隔相鄰而互不連通，在射出成型 體41係同時固接金屬支架312及固晶座313，且固 :曰=3頂端面係顯露於功能區411中，而發光二極 :::42係可固接於固晶座313的頂端面上，並連接 m至金屬支架312上，之後並可進行上述之封璆 乍業乂而可構成另-種型式之發光二極體基板3。 力當完成上述射出成型作業之步驟後，係可將金屬支 木31 2從金屬板片單元3 〇切斷及適當地彎折，使金屬 ，架=2與金屬板片單元3 〇分離，但此時發光二極體 = 4.Q之謬體4 1仍可繼續支撐於金屬.板片單元3 〇 中（如第四圖）。 (D)接著，如第五圖及第六圖所示，將板片丄與發 光二極體基板3以上、下相互地結合，令板片工結合於金 12 200841486 屬板片單元3 0上，從而使得板片1中之每一光學透鏡體 2可分別組合於相對應之發光二極體單元4 0的發光二 極體晶片4 2上方、處。 … 、 其中，板片1和發光二極體基板3之結合方式，係可 藉由如機械力之外力壓合方式，從而將板片1和發光二極 體基板3以上、下地相互結合。然而為了有效增加板片1 和發光二極體基板3兩者之間的組合性及定位性的目 的，係可於板片1和發光二極體基板3之金屬板片單元3 0上分別成型有如相互對應的定位孔及定位凸點（圖略） 等之設計態樣。 由上述，當板片1和發光二極體基板3相互結合時， 藉由所述之定位凸點能卡入定位孔中，即可令板片1和發 光二極體基板3穩固地定位及組合，同時，進而令每一光 學透鏡體2能準確地組合於發光二極體單元4 0.上。 此外，值得一提的是，本發明之光學透鏡體2的外型 態樣，其係會依照發光二極體單元4 0的外型而設計，在 第二圖中之光學透鏡體2的外型，係依照第四圖中之發光 二極體單元4 0的外型而設計，不同之發光二極體單元4 0的外型，如四方型、多邊型等，當然係可設計出不同外 型態樣之光學透鏡體2，本發明係不加以限制光學透鏡體 2,和發光二極體單元4 0之外型態樣，。 .另外，請再參閱第五圖及第六圖，，每一光學透鏡體2 及每一發光二極體單元4 0可進一步成型有相互組接固 定的第一定位部2 1及第二定位部41 2，如光學透鏡體 2的第一定位部2.1可係為一凸塊，其可由光學透鏡體2 13 200841486 侧緣水平延伸所形成，而第二定位部4 1 2可係為一凹 口，其可由膠體4 1一端面向内凹設所形成，藉以使得第 一龙位部2 l·卡入第二定位部4 1 2，、即凸塊可卡入凹口 中，進一步提供光學透鏡體2和發光二極體單元4 0能穩 固地相互定位及組合。此外，所述之凸塊和凹口也是可互 換地各形成於膠體及光學透鏡體中（圖略），即膠體的頂 端面可向上突伸形成凸塊，而光學透鏡體的底端面可向上 凹設形成凹口，將膠體之凸塊卡入光學透鏡體之凹口中即 可達到相同的目的。 / 另，在本發明之製造方法中，係可進一步包括提供一 點著有黏膠5 0之步驟（E )，其可於該步驟（D)之後， 或可於該步驟（D)之前皆可，係利用黏膠5 0以人工或 機械之方式，各形成於每一發光二極體単元4 0之膠體4 1上/中，進而藉由黏膠5 0供每一光學透鏡體2固著於 膠體4 1上（如第七圖）。 更進一步地細說，若點膠作業係於該步驟（D )之前， 可將黏膠5 0適當地點著於發光二極體單元4 0之膠體 4 1上/内（如功能區4 1 ：Γ中），之後，在黏膠5 0尚未 硬化前，再將板片1和發光二極體基板3相互結合後，進 而使得發光二極體單元4 0與光學透鏡體2組合，當黏膠 5 0硬化時，即可使光學透鏡體2穩固地黏合於發光二極， 體單元40上，避免有脫落之虞。 ， 若點膠作業係於該步驟（D)之後，當板片1和發光 二極體基板3結合之後，即可將黏膠5 0適當地點著於膠 體4 1和光學透鏡體2相結合之適當位置處’黏膠5 0硬 14 200841486 n攸而肸光學透鏡體2穩固地黏合於發光二極體單元 4 U上0 欣^外’值得—提的是，請再參閱第-圖、及第八圖至 示，該步驟（C )所提供之金屬板片單元3 0也 二所::夕數片式金屬板片（即二個以上〕所構成，其可如下 歹J所述之步驟所構成：200841486 IX. Description of the Invention: [Technical Field] The present invention relates to a bracket assembly design of a light-emitting diode, and more particularly to a method and structure for manufacturing a bracket assembly of a surface-adhesive light-emitting diode for mass production The optical lens body can be simultaneously combined and positioned at a time for the corresponding light-emitting diode unit. [Prior Art] Light Emitting Diode (LED) has become an indicator lighting component in recent years, which has no need for warming time, fast response, small size, low power consumption, low pollution, The excellent characteristics of Nandu South and long life have gradually replaced the lighting of the lamps, traffic signs, advertising signs or backlight modules currently used. In general, the composition of the light-emitting diode can be performed in a surface mount device (Surface Mount Device λ SMD) diode holder (or lead frame) for solid crystal bonding, wire bonding and sealing operations, thereby forming a The surface-adhesive light-emitting diodes, and the manufacturing process of the diode-bracket support process and the die-bonding operation, are generally shown in the following steps in the industry: (a) stamping a metal sheet into a metal sheet A plurality of lead regions are formed, and each lead region can have two metal brackets that are not connected to each other; that is, a stamping operation. ' (b) Injection molding an insulating colloid, in which each of the lead plates is formed with a colloid and a metal bracket is fixed at the same time, and the colloid is formed with a concave functional area, and the metal support is functionally The area is extended from the inside out. It extends to the outside of the colloid; that is, the injection operation. Thereby, a plurality of surface-adhesive diode holders can be formed in the metal sheet. 6 200841486 (4) For the die-fixing operation, each of the metal plates t is connected with a light-emitting diode, and the moon is in the area, and the area is a solid support. The gold is fixed in the functional area of the carcass. _) Perform the wire-laying operation, connect each illuminating-engraving day y々± wire H wire to two metal ^ each connection has two light transmission! I): two seals: work, fill each functional area of the colloid Can be = gas resin 'to cover the LED chip and wire. = The above-mentioned operation steps can be used to illuminate the LEDs on the surface of the metal plate, and ^4 people fall off/cut off in a hundredths of a mile, and the knife is easily removed from the Meng plate to the mass production H. The production ^, by means of the degree of sentence, so, together: in the light-emitting diodes of the bright lens dens) w mesh \ step on the first diode to add an optical 俨曰 #,, system, The optical 'objects with concentrating effect, the light released by the Japanese _ 4 脰 日 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The brightness of the body can be more uniform, bright in its practice, ": the process of the process, usually the mirror, and then will be all out or speak a large number of single-type optical penetrating arms to capture each - The metal plate mirror on the optical lens machine is assembled on the above-mentioned square body using the dispensing 'the two are first combined with each other, and then, then: 'the optical lens can be The light-emitting diodes are adhered to each other by the solid-state light-emitting diodes 1 to complete the process of the labeling process, so that they can be assembled in the product. 'The above-mentioned method can combine the optical lens with the light-emitting diode 200841486. However, the single-type assembly method has a slow production speed, and thus cannot achieve the purpose of rapid production. For the process of this section, Said, it will make the production efficiency / profit reduction (that is, the production speed is low), and the positioning design on the machine must also be designed accurately, in order to accurately integrate the optical lens on the light-emitting diode 'otherwise it will be easy to produce瑕 fatigue, easy to increase the rate of processing in this section of the process, resulting in relatively difficult design and operation of the machine equipment, which is undoubtedly a major problem for the manufacturers, resulting in inconvenience in the process Where. The reason why the inventor felt that the above-mentioned deficiency can be improved is that the present invention has been put forward in a rational and effective manner to improve the above-mentioned deficiency. SUMMARY OF THE INVENTION The object of the present invention is to provide a method and a structure for manufacturing a bracket assembly for a surface-adhesive light-emitting diode, which can be formed into a plurality of optical lens bodies in a plate, and then the plate is combined into one On the metal plate unit of the two-light-emitting diode substrate, the mass-produced optical lens body can be simultaneously combined and positioned on one of the corresponding light-emitting diode units to greatly improve the process of the segment. Productivity/benefit, and ease of process. In order to achieve the above object, the present invention provides a method for manufacturing a bracket assembly for a surface-adhesive light-emitting diode, which comprises the steps of: providing a plate and molding the plate with a plurality of support regions; An optical lens body, wherein each of the support regions of the above-mentioned plate is fixed to the optical lens body; a light-emitting diode substrate is provided, which comprises a metal plate unit, 200841486 and a plurality of each formed in the optical lens body a surface-adhesive light-emitting diode unit in the metal plate unit; and x, the above-mentioned plate and the above-mentioned light-emitting diode substrate are mutually coupled, and the plate is bonded to the metal plate a sheet unit, wherein the optical lens bodies are respectively combined into corresponding light emitting diode units. In order to achieve the above object, the present invention also provides a structure of a surface mount type light-emitting diode assembly, comprising: a plate having a plurality of support regions, and a plurality of opticals respectively positioned in the support regions a lens body; and a light-emitting diode substrate having a metal plate unit, and a plurality of surface-adhesive light-emitting diode units each formed in the metal plate unit; wherein the plate is The optical sheet unit is combined with the above-mentioned metal plate unit, and each optical lens body is separately combined with the corresponding light-emitting diode unit. The invention has the advantages that a plurality of optical lens bodies are formed in the sheet, and the sheet is bonded to the metal sheet unit of the light-emitting diode substrate, so that the mass-produced optical lens body can be simultaneously used at one time. • Combine and position on the corresponding LED unit to greatly improve the production efficiency/benefit of this process and improve the convenience of the process, thus greatly reducing the defect rate of this process. The detailed description of the present invention and the accompanying drawings are to be understood as the [Embodiment] Please refer to the first to third figures. The present invention provides a method for manufacturing a bracket assembly for a surface-adhesive light-emitting diode and a structure thereof. Shape (4): Branch 2 - Forming her legs 12 to be connected to the body; ^ / system has a relative setting of the plate 1 can be used as ^ pu using continuous stamping technology can be a thin metal sheet ' Borrowing can be 12. Of course, the plate-supporting area 11 and the processing method of the legs, such as plastic material, and using the other 1 and the legs 12, but preferably to form the technical means of stamping the branch area 1; Using a thin metal material _ The foot 12 can be stamped in a bent shape. The female branch is exemplified by bending. In the figure of the present invention, Chede forms a plurality of optical lens bodies 2, and the legs 12 of each of the plates 1 are fixed to the optical lens body 2, and the A俜 is optically condensed. Pieces. The attachment lens body 2 can be attached to the corresponding leg 2 by means of injection molding so that the legs 1 2 of each of the legs can be formed by casting. In addition, the optical lens body 2 can be: shell = body, 'or can be recessed from the bottom up to form a recess (not shown), into: the interior of the lens body 2 is hollow, body, and each optical The lens body 2 can be made of stone, or a light-emitting diode substrate 3 can be provided by any known optical plastic, which comprises a metal, the sheet is 3.0 及 and a plurality of The metal plate unit 3 is a white, surface-adhesive light-emitting diode unit 40. 10 200841486 The film ^-t, the metal plate unit 30 can be composed of a single-piece metal plate, which can be formed by the following steps: The sheet 3 1 forms a plurality of lines of £3 1 1 and a metal bracket 3 1 2 per zone, and the body is connected to the metal sheet. (2) The injection molding operation is to inject the insulating colloid 41, and the metal support 312 is not fixed, and each of the faces of the colloid 41 is formed with a concave functional area 41, and each A full genus = 3 12 series are respectively extended from the functional area 4 ii towel = bu, wherein the material of the colloid 41 can be, for example, polyphthalamide (PPA), $ gan ~ / plastic _. e PPA), or any other known heat is connected to the ^H crystal f' system to fix the LED array 42 in the functional area 411, which can be fixed to a metal branch = actual demand For example, the number of one, three, etc., is one in =. Anal mouth j4) wire-laying operation, can be connected to each of the 3⁄4 diode wafers 4 2 to connect two wires 4 3 ' and connect the two wires 4 3 to the metal brackets 3 2 2 that are not connected to each other on. Without the above steps, the metal plate Q is divided into four parts, the body is 4 丨, the plural tf is less - the light-emitting diode chip 42 and the wire 43 Wang Ge * 12 is made of sheet metal 3 Forming; In addition, after the step of 11 200841486 wire-laying operation, the system can further have a step: (5) The sealing operation is in the functional area of each colloid 4 1 I 1 脒 赤 f 有 透 透The sealing layer 4 4 , such as an epoxy resin or a sapphire paste, is used to form the light-emitting diode substrate 4 by the above step (5). Further, each illuminating: the polar body unit 4q^:: step includes a glue layer 44. In addition, as shown in the fourth figure, the above-mentioned metal sheet unit 3 is a one-step change, and the main difference is that it can be entered when the stamping is completed--in the mother-5! line area 3 i丄Three or more metal brackets 312 are formed in each of the three shapes, and the solid crystal holders 313 are "= two 3 = adjacent to each other and are not connected to each other. The injection molded body 41 is simultaneously fixed to the metal bracket 312 and the solid crystal holder 313, and is solid. The top surface of the 曰=3 is exposed in the functional area 411, and the light-emitting diode:::42 series can be fixed to the top end surface of the solid crystal holder 313, and the m is connected to the metal bracket 312, and then the above can be performed. The sealing device can form another type of light-emitting diode substrate 3. After completing the above-mentioned injection molding operation, the metal branch 31 2 can be cut from the metal plate unit 3 Properly bent to separate the metal, frame = 2 from the sheet metal unit 3, but the body 4 1 of the light-emitting diode = 4.Q can continue to be supported in the metal sheet unit 3 ( As shown in the fourth figure) (D) Next, as shown in the fifth and sixth figures, the plate 丄 and the light-emitting diode substrate 3 are combined with each other and below, so that the plate cutter The combination of the gold 12 200841486 is on the plate unit 30, so that each of the optical lens bodies 2 in the plate 1 can be respectively combined on the corresponding LED body 4 of the corresponding LED unit 40, Wherein, the combination of the plate 1 and the light-emitting diode substrate 3 can be combined with the light-emitting diode substrate 3 above and below by a force pressing method such as mechanical force. However, in order to effectively increase the combination and positioning between the board 1 and the LED substrate 3, the sheet 1 and the sheet unit 30 of the LED substrate 3 can be respectively separated. The design forms such as positioning holes and positioning bumps (not shown) corresponding to each other. When the board 1 and the LED substrate 3 are coupled to each other, the positioning bump can be engaged by the positioning bumps. In the positioning hole, the plate 1 and the light-emitting diode substrate 3 can be stably positioned and combined, and at the same time, each optical lens body 2 can be accurately combined on the light-emitting diode unit 40. It is worth mentioning that the appearance of the optical lens body 2 of the present invention In this case, the appearance of the optical lens body 2 in the second figure is in accordance with the appearance of the light-emitting diode unit 40 in the fourth figure. The design, different appearances of the LED unit 40, such as a square shape, a polygonal type, etc., of course, can design different optical appearances of the optical lens body 2, the present invention does not limit the optical lens body 2 And the light-emitting diode unit 40 is in a different form, and, in addition, referring to the fifth and sixth figures, each of the optical lens body 2 and each of the light-emitting diode units 40 can be further shaped. The first positioning portion 2 1 and the second positioning portion 41 2 fixed to each other, such as the first positioning portion 2.1 of the optical lens body 2, may be a bump which may be horizontally extended by the side edge of the optical lens body 2 13 200841486 The second positioning portion 4 1 2 can be formed as a notch, which can be formed by the inner end of the colloid 4 1 facing downward, so that the first dragon portion 2 l· is engaged with the second positioning portion 4 1 2 , that is, the bump can be snapped into the recess, further providing the optical lens body 2 and the light emitting diode unit 40 to be stably Position and combine with each other. In addition, the bumps and the notches are also interchangeably formed in the colloid and the optical lens body (not shown), that is, the top end surface of the colloid can protrude upward to form a bump, and the bottom end surface of the optical lens body can be upward. The recess is formed to form a recess, and the bump of the colloid is caught in the recess of the optical lens body to achieve the same purpose. In addition, in the manufacturing method of the present invention, the step (E) of providing the adhesive 50 may be further provided, which may be after the step (D), or may be before the step (D). The adhesive 50 is formed on the colloid 4 1 of each of the light-emitting diodes 40 by manual or mechanical means, and is fixed to each optical lens body 2 by the adhesive 50. On the colloid 4 1 (as shown in the seventh figure). More specifically, if the dispensing operation is before the step (D), the adhesive 50 can be properly positioned on/in the colloid 4 1 of the LED unit 40 (eg, the functional area 4 1 : After the adhesive 50 is not hardened, the plate 1 and the light-emitting diode substrate 3 are combined with each other, thereby further combining the light-emitting diode unit 40 with the optical lens body 2, as the adhesive When the 50 is hardened, the optical lens body 2 can be firmly adhered to the light-emitting diodes, and the body unit 40 can be prevented from falling off. After the dispensing operation is performed after the step (D), after the sheet 1 and the LED substrate 3 are combined, the adhesive 50 can be appropriately placed on the combination of the colloid 4 1 and the optical lens body 2. Appropriate position 'viscose 5 0 hard 14 200841486 n攸 and the optical lens body 2 firmly adheres to the light-emitting diode unit 4 U 0 欣 ^外's worthwhile - please refer to the figure - and 8 to the figure, the metal plate unit 30 provided in the step (C) is also composed of two: a plurality of sheet metal sheets (ie, two or more), which can be as described in the following step J. Composition:
")冲壓成型作業’將-第-金屬板片3 1 a形 ‘數個第一引線區3工丄a，及每一第一引線區3 a中皆連結具有一固晶座3 1 2 a。， (2)沖壓成型作業，將一第二金屬板片3 &形 稷數個第二引線區3 2丄a，及每一第二引線區3 1 a中白具有複數個互不連通的金屬支架3 2 2 a，其數量係依實際需求而成型，可為二個/四丄 個等之數量。 、 (3)結合作業，將第一金屬板片3丄a及第二金 ，板=3 2 a相互結合，使每一第一引線區3丄13及 母—第二引線區3 2 1 a各對應結合，令条一固晶座3 12 a與每一金屬支架3 2 2 a間隔相鄰，而互不連 (4)射出成型作業，如同之前所述的方式，射出 絕緣性的膠體4 1，而膠體4 1係同時固接固晶座,3工 2 a及金屬支架3 2 2 a，每一谬體4丄的一端面也係 形成有-内凹的功能區4 1 1，且固晶^ 3 1 2 a的頂 端面係顯露於功能區41 1中，每一金屬支架3 2 2 / 也係由功能區4 1 1中向外延伸至膠體4丄外部。其 15 200841486 中:固晶座3 1 2 a的底端面係可顯露於 :外’即固晶座3l2a相對的兩端面(頂、底;= 为別顯露於功能區41工中及膠體41外。 、 固接广Γ1 業’係在固晶座312 a的頂端面上 !=極晶片42，其數量可依實際需求而 :又如可设三個不同發光顏色之晶片（如r、g、b)， 友此孟屬支&322a之數量即可為六個的設置。 上夂打線:t業’係可在每一發光二極體晶片4 2 雇口連接有二¥線4 3，骑二導線4 3各連接至相對 應之二金屬支架322a上。 經由上述之步驟，也係可構成另一種型式之二 極體基板3，使得今ji知；g 。π x 二朽传遷片早凡3 〇中具有複數個發光 版早兀4 0，而每-發光二極體單元4 〇乃係分 谬體41、複數個金屬支架3 2 2 a、—固晶座 ^ 1 2 a、—個以上的發光二極體晶片42及導線4 ^Γ^-Vn2 3 2 2 孟屬板片早兀3 0之第一及第二金屬板片3工a、 a所成型’此外’在打線作業之步驟後，係可更 具有一步驟： (7)封膠作業，係在每—膠體4丄之功能區4 η L填充有-可透紐之封膠層44，如環氧樹脂、石夕 ♦或任何已知之熱塑性樹脂，藉 42及導線43。 . 片 再由上述之步驟⑺，也射構成所述之發光二極 肢基板3，而使得每一發光二極體單元4 〇更進—步包 16 200841486 括一封膠層4 4。 據此，經由上述之步驟即可構成本發明之支架纟且件、锋 、構，以包括有上述之板片1及發光二極體基板3，而板片 1中係具有所述之支撐區1 1、支腳1 2和光學透鏡哗 2，發光二極體基板3則具有所述之金屬板片單元3 發光二極體單元4 0。另外，金屬板片單元3 〇及發光一 極體單元4 0當然係具有於上述中之構造。") Stamping forming operation 'The first-metal sheet 3 1 a' is a plurality of first lead regions 3, and each of the first lead regions 3 a is connected with a solid crystal holder 3 1 2 a. (2) a press forming operation, a second metal plate 3 & a plurality of second lead regions 3 2 丄 a, and each of the second lead regions 3 1 a has a plurality of mutually disconnected The metal brackets are 3 2 2 a, the number of which is formed according to actual needs, and can be two or four. (3) combining operation, combining the first metal plate 3丄a and the second gold, the plate=3 2 a, so that each of the first lead regions 3丄13 and the mother-second lead region 3 2 1 a Correspondingly, the strip-solid crystal holders 3 12 a are spaced apart from each metal bracket 3 2 2 a, and are not connected to each other (4), and the injection molding operation, as in the manner described above, is performed to inject the insulating colloid 4 1, while the colloid 4 1 is simultaneously fixed to the solid crystal holder, 3 working 2 a and the metal bracket 3 2 2 a, and an end surface of each of the crucibles 4 is also formed with a concave functional area 41 1 . The top surface of the solid crystal ^ 3 1 2 a is exposed in the functional area 41 1 , and each metal support 3 2 2 / also extends outward from the functional area 41 1 to the outside of the colloid 4 . In its 15 200841486: the bottom end face of the solid crystal seat 3 1 2 a can be exposed to: the outer side of the opposite side of the solid crystal seat 3l2a (top and bottom; = not exposed in the functional area 41 and outside the colloid 41固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定 固定b), the number of friends and the 322a can be set to six. The upper line: t industry's can be connected to each of the LEDs 4 2 hiring 2 ¥ 4 3, The two wires 4 3 are respectively connected to the corresponding two metal brackets 322a. Through the above steps, another type of diode substrate 3 can also be formed, so that the current g; π x dynasty transfer piece In the early 3rd, there are a plurality of illuminating plates as early as 40, and each of the illuminating diode units 4 is a scorpion body 41, a plurality of metal brackets 3 2 2 a, a solid crystal seat ^ 1 2 a, More than one light-emitting diode chip 42 and wire 4 ^Γ^-Vn2 3 2 2 Meng's plate is as early as 30, the first and second metal plate 3 work a, a formed 'in addition' in the line Homework After the event, there is one more step: (7) Sealing operation, in the functional area of each colloid 4 η L is filled with a sealant layer 44, such as epoxy resin, Shi Xi ♦ Or any known thermoplastic resin, by means of 42 and a wire 43. The sheet is further formed by the above step (7) to form the light-emitting diode substrate 3, so that each of the light-emitting diode units 4 is further advanced. The package 16 200841486 includes a glue layer 4 4 . Accordingly, the above-mentioned steps can be used to form the support member, the front member, the structure, and the cover plate 1 and the light-emitting diode substrate 3, and The plate 1 has the support region 1 1 , the leg 12 and the optical lens 哗 2, and the illuminating diode substrate 3 has the metal plate unit 3 illuminating diode unit 40. The sheet metal unit 3 and the light-emitting unit unit 40 are of course of the above construction.
綜合上述之說明，本發明在板片1中加以形成為數田 多的光學透鏡體2，進雨利用板片1'結合於济φ I 7又…~·-極靜貧 板3的金屬板片單元3 〇上，令大量生產化之光學透铲ς 2能-次性地同時組合及定位於相對應之發光二極二： 元4 0上，以大幅提昇此段製程作業之生產效率/只_早 提昇4程上之便利性，進而也大幅降低此段製程之瑕= 率。 其次，本發明之光學透鏡體2係叫膠之 制 成，其具有耐高溫之特性，約可超過咖。C以上之^衣 進而避免因受溫度之影響，使得光 :皿’ 而降低發光二極體單元40之出Ί x貝變， 之影響，使光學透鏡體2聚光: 為實:體時’係可提昇發光二二 光效果§為空心體時，其是比較容你 之水 元4 0之聚光效果。 牛低叙先一極體單 淮以上所述僅為本發明，之 7 … . 即拘限本發明之專利範 =可仃貧施例，非因此 式内容所為之等效結構變化說明書及圖 理皆包含於本發明之範 17 200841486 圍内，合予陳明。 【圖式簡單說明】 第一圖為本發明之步驟流程圖、 、 第二圖為本發明中板片成型光學透鏡之立體示意圖。 第三圖為本發明中發光二極體基板之立體示意圖。 第四圖為本發明中發光二極體基板之另一實施例的立體 示意圖。 第五圖為本發明中板片、光學透鏡體和發光二極體基板之 立體分解示意圖。 第六圖為本發明中板片、光學透鏡體和發光二極體基板之 立體組合不意圖。 第七圖為本發明中板片、光學透鏡體和發光二極基板之平 面分解示意圖。 第八圖為本發明中發光二極體基板之再一實施例的立體 分解示意圖。 第九圖為本發明中發光二極體基板之再一實施例的立體 組合示意圖。 第十圖為本發明中發光二極體單元之再一實施例的剖視 示意圖。 【主要元件符號說明】. , * ,. 板片1 支撐區 11 支腳 12^ 光學透鏡體 2 第一定位部 21 18 200841486 發光二極體基板 3 金屬板片單元 30 金屬板片1 金屬支架 312 第一金屬板片 3 1 a 固晶座 312a 第二引線區 321a 發光二極體單元 40 ® 膠體4 1 第二定位部 4 1 2 > 發光二極體晶片.4 2 封膠層 4 4 黏膠5 0 引線區 311、 固晶座 313 第一引線區 3 11a 弟二金屬板片 32a 金屬支架 322a 功能區 411 1 導線 4 3 19According to the above description, the present invention is formed in the sheet 1 as a plurality of optical lens bodies 2, and the rain-incorporating sheet 1' is bonded to the metal sheet of the φ I 7 and... On the unit 3, the mass-produced optical oscillating shovel 2 can be combined and positioned simultaneously on the corresponding illuminating diode 2: element 40 to greatly improve the production efficiency of this section of the process. _ Increase the convenience of 4 steps early, and thus greatly reduce the 瑕 = rate of this process. Next, the optical lens body 2 of the present invention is called a rubber, which has a high temperature resistance property and can exceed the coffee. In addition to the influence of temperature, the light of the above-mentioned clothing is prevented from being affected by the temperature, so that the light of the light-emitting diode unit 40 is reduced, and the optical lens body 2 is concentrated: The system can enhance the effect of the light-emitting two-two light § when it is a hollow body, it is a concentrated light effect of the water element of your water. The above description of the invention is based on the invention, and the invention is limited to the invention, and the invention is not limited to the invention. They are all included in the scope of the invention in the context of the model of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a flow chart of the steps of the present invention, and the second figure is a three-dimensional view of the sheet forming optical lens of the present invention. The third figure is a schematic perspective view of the light-emitting diode substrate of the present invention. The fourth figure is a perspective view of another embodiment of the light-emitting diode substrate of the present invention. The fifth figure is a perspective exploded view of the sheet, the optical lens body and the light-emitting diode substrate in the present invention. The sixth drawing is not intended to be a three-dimensional combination of a plate, an optical lens body, and a light-emitting diode substrate in the present invention. Figure 7 is a plan view showing the plane of the sheet, the optical lens body and the light-emitting diode substrate in the present invention. Figure 8 is a perspective exploded view showing still another embodiment of the light-emitting diode substrate of the present invention. Fig. 9 is a perspective view showing a three-dimensional combination of still another embodiment of the light-emitting diode substrate of the present invention. Figure 11 is a cross-sectional view showing still another embodiment of the light-emitting diode unit of the present invention. [Main component symbol description]. , * ,. Plate 1 Supporting area 11 Leg 12^ Optical lens body 2 First positioning portion 21 18 200841486 Light-emitting diode substrate 3 Metal plate unit 30 Metal plate 1 Metal bracket 312 First metal plate 3 1 a solid crystal seat 312a second lead region 321a light emitting diode unit 40 ® colloid 4 1 second positioning portion 4 1 2 > light emitting diode chip. 4 2 sealing layer 4 4 sticky Glue 5 0 lead area 311, solid crystal holder 313 first lead area 3 11a second metal plate 32a metal support 322a functional area 411 1 wire 4 3 19