200848544 九、發明說明： 【發明所屬之技術領域】 本發明係提供-種不錢化物之無電鑛金浴，尤指可讓 鑛金洛中的金離子穩定的正向沉齡金屬騎表面，而供鑛 金物在浴帽定且快速的完賴金，並财良好的鑛金 強度。 【先前技術】 按，鑛金係利用在電子構件上，例如：印刷電路板、陶 竞積體電路㈠C)、Ιτ◦和IC卡的表面上，可改良化 學抗性、氧化抗性與物理性質例如金屬導電性、焊接性質、 熱壓黏合性質與其他連接性質；岐年來，f職品日^輕 、薄、短、小的設計需求，導致半導體封裝的C p s ( Chip Scale pa(：ks ge)化以及通訊多層200848544 IX. Description of the invention: [Technical field to which the invention pertains] The present invention provides an electroless gold bath for a non-consumable compound, especially a positive-aged metal riding surface which can stabilize the gold ions in the mine Jinluo, and The gold deposits are fixed in the shower cap and quickly complete the gold, and the good gold strength of the mine. [Prior Art] According to the mineral gold system, on the surface of electronic components, such as printed circuit boards, ceramic competing circuits (1) C), Ιτ◦ and IC cards, chemical resistance, oxidation resistance and physical properties can be improved. For example, metal conductivity, soldering properties, thermocompression bonding properties and other bonding properties; for the past few years, the product requirements of light, thin, short, and small, resulting in semiconductor package C ps (Chip Scale pa (: ks ge ) and communication multilayer
Integrated Circuit)的技術開發越來 越受到重視，而黃金H膜是金凸塊（GQld Bump) 封裝與通訊基板金細線路（Gold Thin 17 * 1 丄丄丄i il r 1 1 Hi )的關鍵技術’因此，各先進國家也都積極從事黃金薄膜技 術開發研究、特性探討及用途開發的研究，$而，' 國内產業 界的鍍膜製程技術與特化添加劑，目前卻皆以歐、美、日等 國家輸入為主；在目前工業上常用的黃金電鍍浴可分為以下 5 200848544 幾種：（1)酸性氰化物黃金鍍膜浴；鹼性氰化物黃 金鍍膜洛；（3)鹼性無氰鍍黃金鍍膜浴；但，c N離子會 與衣私中的光阻反應，又因驗性無氰鑛黃金鍍膜浴，除了無 氰化的毒性問題外，亦可崎紐賊黃金浴無法鍍出的合 金艘膜。 則目前所使用的鍍金方式中有『取代型鍍金』，係經由 基底金屬的置換來沉積金，因此對金的沉積會伴隨著發生基 底的溶解（侧或浸姓），對於傳統的取代型錢金浴，其取 代反應速率不受控制，因而緊接在反應起始之後的取代反應 速率特別·速，由於這接在反應起始之後的快速反應 速率，會在取代金賴中形成許多的缺陷，且此等缺陷區會 連接與蓄積’使得在金鑛膜下面的基底金屬會沿著深度或橫 向受到過度地侧或腐钮，所以在使用此類型的取代型鑛金 浴來鑛金時，基底的晶粒邊界或其他構纖弱之處的部位會 優先溶解（敍刻或浸姓）。另一方面，在使用自催化性無電 鍍金浴’緊接在將要電賴㈣浸沒麵金浴巾之後，會因 為在積底與金之騎發生的取代反躺使金沉積，且隨^還 原劑的作用會被作為催化劑的沉積金所起n此種類型= 鑛膜具有不足的黏著性且在耐用性檢驗中傾向於剝離，在進 行焊接之柄能雜足_焊接m料在焊接強 度檢驗中SJ為基材料的暴露而傾向於具有不良的料性質。 6 200848544 再請參閱第五、六、七圖所示，係為傳統基材齡方式 之側視圖、傳統基材鍍金方式之實施例側視圖、傳統基材鍍 金方式之實際測試圖，傳統的鍍金浴為在基材A上佈局有底 材B，且底材B為金屬材質，在置入鍍金浴中進行鍍金作業 時，若在底材B外側未設有隔離層a i，則金離子附著在底 材B上，會因沒有適當的依靠，則底材6上的鍍金形狀會形 成不穩的半圓隆起狀（如第七圖所示），是以，在傳統的鍍 金方式中，都會在基材A上的底材B外侧周邊，利用氧化鋁 構成隔離層A 1，並可在底材b的上方形成鍍金空間A工工 ，而在鍍金的過程中才會使金離子游離而填入鍍金空間八工 1内堆宜成方正的鑛金形狀，之後再利用化學藥劑將隔離 層A 1從基材A上除去，即完成底材B上的鍍金作業，惟傳 統的鑛金作業方式卻存在諸多的缺失，如： (1) 基材A上的底材3外側周邊必須設置隔離層A丄，才 可以鍍出完整的鍍金層c，則其事前的隔離層八工準 備工作，變得更為耗時、費工、提高製造成本，也不 符合經濟效益。 (2) 基材A的底材b周邊之隔離層a 1，會在底材b上方 形成鑛金空間A 1 1，供金離子進入鍍金空間A 1 1 内’並堆叠形成鍍金層C，但鍍金後必須將隔離層A 1予以除去，鍍金作業相當繁瑣不便。 7 200848544 上述背贿纽細金作 事後移除隔雜® 、，Λ >、 須事先預置隔離層、 麻煩與不便，實需予 目標 以改Γ 致造讀師_顧與不便，實 所在此即為本發明人與從事此行業者所亟欲改善之 【發明内容】 ^狀有篮於上述缺失，乃搜集相關資料，經由多 及考量，紅縣於此行業累狀多年縫，經由不 轉及做，崎物_物·祖不含= 物之無電鍍金浴的發明專利者。 本發明之主要目的乃在於雜金浴為包含至少一種以上 的水溶性金化合物、至少—種以上的金錯合劑、至少—種以 上的還原劑、至少—種以上的金屬離子或缝，可為鑛· 中之加速劑以及至少-種以上的縣化合物或其鹽類，且在 錢金浴中含量為5 5〜3 5 0克/升，峨基化合物可由： 草酸、丙二酸、丁二酸、谓二酸、戊二酸、乳酸、甘醇酸 、葡萄糖酸、檸檬酸、蘋果酸、酒石酸及其鹽類組群中選出 ’以增加金麟子的活潑性，即可快速在基材的金屬底材表 面進行鍍金，並在鍍金位置完整成型。 本發明之次要目的乃在於該鍍金浴之浴劑中不含氰化物 ，且pH值之範圍係在7 · 〇〜8 · 5之間，為屬於中性至 弱鹼性的浴劑，是為低毒性的無電鍍金浴，且因為不通電， 200848544 所以具有高安定性以及高沉積速率，可以形成良好的鍍金功 月b並可促使金離子穩定的附著在錢金物表面，具高附著性 、不易脫落，其鍍金厚度均勻，成品良率高。 【實施方式】 為達成上述目的及功效，本發明所採用之技術手段及其 構造，茲繪圖就本發明之較佳實施例詳加說明其特徵與功能 如下，俾利完全瞭解。 、明苓閱第一、二、二、四圖所示，係為本發明之鍍金方 式側視圖、較佳實施例之側視圖、錄金後之側視圖、錢金後 之貫際測試圖’由@中所示可以清楚看出，本發明之無電鑛 金浴係包括： (i)氯化金、亞硫酸金、硫代硫酸金或其混合物之水 溶性金化合物等，其實際金含量為3 · 〇〜7 . 0克/升，並為金離子的來源之還原劑。 (1 1 )至少-種以上選自以下的金錯合劑：亞硫酸鹽、 磷酸鹽等’藉以抑制金離子的活動力，而錯合劑 在鑛金浴中，其含量為5〜8(3克4。 (111)至種以上選自以下的還原劑：葡萄糖酸、抗 壞血酸及其鹽類等，利用還原劑之惰性而減少金 離子的活潑性，而還原劑在鑛金浴中，其含量為 1〜6 0克/升。 9 200848544 1 v )至少一種以上選自以下的金屬離子或元素，可為 :錯、錫、銦嗜，等，成為鍍金洛中的加速 劑，而加速劑在鍍金浴中，其含量為0 · 〇丄〜 5毫克/升。 (v)至/—種以上選自以下的緩基化合物或其鹽類： 草酸、丙二酸、丁二酸、丁烯二酸、戊二酸、乳 酸、甘醇酸、葡萄糖酸、檸檬酸、蘋果酸、酒石 酸及其鹽類，而絲化合物或其鹽類在錢金浴中 ，其含量為5 5〜3 5 0克/升。 i )並可包括至少一種以上之安定劑，該鍍金浴安定 劑係可為：聚乙烯基σ比咯烷銅、聚乙二醇、聚丙 一醇或其共聚合物。 利用上述各種物質、料解，依預定的比例混製成鑛金 浴之洛劑’其ρ Η值之細係在7 .◦〜8 . 5之間，乃介 於中性至碰性⑽，為低#_職他物f _雜形少 且對⑹兄產生污染現象亦較少，並利用其中之幾基化合物 及其鹽類’做駿金浴的沉翻m以可以穩定鑛金浴中 的金離子’而增加其附著在鑛金物表面的正向沉積速度，亦 使金離子在鍍金物表面形成良好的鍍金效果。 而在上述的鑛金浴中為可添加入安定劑，且安定劑可為 :聚乙烯基吼略細、聚乙二醇、聚丙二醇或其共聚合物等 10 200848544 蚊劑錢金浴中含量，射為0·1〜2 5毫克 f佳實關之溫度與配方，上述之攸浴·礎配方 中’可以取用： 基礎配方：The technology development of Integrated Circuit is getting more and more attention, and the gold H film is the key technology of gold bump (GQld Bump) package and communication substrate gold thin wire (Gold Thin 17 * 1 丄丄丄i il r 1 1 Hi ) 'Therefore, all advanced countries are also actively engaged in the research and development of gold thin film technology, characteristics and research on the development of applications. $And, 'The domestic coating process technology and special additives are now in Europe, America and Japan. The country is mainly input; the gold plating bath commonly used in the industry can be divided into the following 5 200848544 several types: (1) acid cyanide gold coating bath; alkaline cyanide gold coating Luo; (3) alkaline cyanide plating Gold coating bath; however, c N ion will react with the photoresist in the clothing, and because of the non-cyanide gold coating bath, in addition to the non-cyanide toxicity problem, it can also be coated with the golden thief gold bath. Alloy film. In the current gold plating method, there is a “substituting gold plating”, which deposits gold through the replacement of the base metal, so the deposition of gold is accompanied by the dissolution of the substrate (side or dip), for the traditional replacement type money. In the gold bath, the rate of substitution reaction is uncontrolled, so the rate of substitution reaction immediately after the start of the reaction is particularly fast, and many defects are formed in the substituted gold matrix due to the rapid reaction rate after the initiation of the reaction. And the defect areas will be connected and accumulating 'so that the base metal under the gold ore film will be excessively laterally or rotted along the depth or lateral direction, so when using this type of substituted gold bath to mine gold, The grain boundaries of the substrate or other weakened parts of the structure will preferentially dissolve (synthesis or dip). On the other hand, after using the autocatalytic electroless gold bath, immediately after the gold bath towel that will be immersed in the (4) immersion surface, gold will be deposited due to the substitution of the bottom and the gold ride, and with the reducing agent The role will be used as a catalyst for the deposition of gold. n This type = mineral film has insufficient adhesion and tends to peel off in the durability test, the handle can be mixed in the welding _ welding m material in the welding strength test SJ tends to have poor material properties for exposure to the base material. 6 200848544 Please refer to the fifth, sixth and seventh figures, which are the side view of the traditional substrate age, the side view of the traditional substrate gold plating method, the actual test chart of the traditional substrate gold plating method, the traditional gold plating In the bath, the substrate B is laid on the substrate A, and the substrate B is made of a metal material. When the gold plating operation is performed in the gold plating bath, if the isolation layer ai is not provided outside the substrate B, the gold ions are attached. On the substrate B, the gold-plated shape on the substrate 6 will form an unstable semi-circular shape due to the lack of proper reliance (as shown in the seventh figure). Therefore, in the conventional gold plating method, the base will be On the outer side of the substrate B on the material A, the separator A 1 is made of alumina, and the gold plating space A is formed above the substrate b, and the gold ions are freed and filled with gold plating during the gold plating process. The space inside the eight work 1 should be in the form of a square gold deposit, and then the chemical layer is used to remove the barrier layer A 1 from the substrate A, that is, the gold plating operation on the substrate B is completed, but the traditional gold mining operation mode exists. Many missing, such as: (1) Substrate 3 on substrate A A peripheral must set the isolation layer Shang, can complete a plated gold plating layer c, then its preparation work in advance of the eight-station isolation layer becomes more time-consuming, labor costs, increase manufacturing costs, is not cost-effective. (2) The spacer layer a 1 around the substrate b of the substrate A forms a gold deposit space A 1 1 above the substrate b for gold ions to enter the gold plating space A 1 1 'and stacks to form a gold plating layer C, but After the gold plating, the isolation layer A 1 must be removed, and the gold plating operation is rather cumbersome and inconvenient. 7 200848544 After the above-mentioned bribery of the new gold, the removal of the barriers®, Λ >, the pre-set isolation layer, trouble and inconvenience, the need to change the target to create a reader _ care and inconvenience, the real place This is the inventor's and the people who are engaged in this industry. [The content of the invention] ^There are baskets in the above-mentioned shortcomings, which are collected related materials. Through many considerations, Hong County has been entangled in this industry for many years. Turned and made, the object of the invention of the anti-electroplating gold bath of the object. The main purpose of the present invention is that the mixed gold bath is composed of at least one water-soluble gold compound, at least one or more gold-type complexing agents, at least one or more kinds of reducing agents, at least one or more kinds of metal ions or slits. Accelerator in mine · and at least one kind of county compound or its salt, and the content in the money gold bath is 5 5~3 50 g / liter, the mercapto compound can be: oxalic acid, malonic acid, dibutyl Select from the group of acid, diacid, glutaric acid, lactic acid, glycolic acid, gluconic acid, citric acid, malic acid, tartaric acid and its salts to increase the activity of Jinlinzi, which can be quickly applied to the substrate. The surface of the metal substrate is gold plated and fully formed in the gold plated position. The secondary object of the present invention is that the bath of the gold plating bath does not contain cyanide, and the pH range is between 7 · 〇 and 8 · 5 , which is a neutral to weakly alkaline bath. It is a low toxicity electroless gold bath, and because it is not energized, it has high stability and high deposition rate, which can form a good gold plating function b and promote the stable adhesion of gold ions to the surface of gold and gold. It is not easy to fall off, its gold plating thickness is uniform, and the finished product yield is high. [Embodiment] In order to achieve the above object and effect, the technical means and the structure of the present invention will be described in detail with reference to the preferred embodiments of the present invention. As shown in the first, second, second and fourth figures of the present invention, it is a side view of the gold plating method of the present invention, a side view of the preferred embodiment, a side view after the gold recording, and a cross-test test chart of Qian Jinhou. It can be clearly seen from the middle of @ that the electroless gold bath system of the present invention comprises: (i) a gold salt of gold chloride, gold sulfite, gold thiosulfate or a mixture thereof, and the actual gold content thereof is 3 · 〇~7 . 0 g / liter, and a reducing agent for the source of gold ions. (1 1 ) at least one or more kinds of gold complexing agents selected from the group consisting of sulfites, phosphates, etc. 'to inhibit the activity of gold ions, and the amount of the wrong agent in the gold bath is 5 to 8 (3 g) 4. (111) to a reducing agent selected from the group consisting of gluconic acid, ascorbic acid and salts thereof, wherein the activity of the gold ion is reduced by the inertness of the reducing agent, and the reducing agent is in the gold bath, and the content thereof is 1 to 60 g/l. 9 200848544 1 v ) at least one metal ion or element selected from the group consisting of: wrong, tin, indium, etc., becomes an accelerator in gold plating, and the accelerator is in a gold plating bath. Medium, its content is 0 · 〇丄 ~ 5 mg / liter. (v) to / or more than a slow-acting compound or a salt thereof selected from the group consisting of oxalic acid, malonic acid, succinic acid, butenedioic acid, glutaric acid, lactic acid, glycolic acid, gluconic acid, citric acid , malic acid, tartaric acid and its salts, and the silk compound or its salt in the gold bath, the content of 5 5~3 50 g / liter. i) and may include at least one stabilizer, which may be: polyvinyl σ-rheptane copper, polyethylene glycol, polypropanol or a copolymer thereof. Using the above-mentioned various substances and materials, the mixture is mixed into a mineral gold bath in a predetermined proportion. The fineness of the ρ Η value is between 7. ◦ and 8.5, which is neutral to the susceptibility (10). Low #_职他物物 f _ less heterogeneous and less polluting phenomenon to (6) brother, and use some of the base compounds and their salts to make the sinking of the gold bath to stabilize the gold bath The gold ion' increases the positive deposition rate attached to the surface of the gold ore, which also makes the gold ion form a good gold plating effect on the surface of the gold plating. In the above-mentioned ore gold bath, a stabilizer may be added, and the stabilizer may be: polyethylene ruthenium, polyethylene glycol, polypropylene glycol or a copolymer thereof, etc. 10 200848544 Mosquito money gold bath content , shooting for 0·1~2 5 mg f Jiashiguan temperature and formula, the above mentioned bath and foundation formula 'can be used: basic formula:
亞硫酸金 亞硫酸鈉 實際金含量） 再者，本發明鑛金純佳實施例之基礎配方用量、鍛金Sodium sulfite, sodium sulfite, actual gold content) Further, the basic formula dosage and forging gold of the pure gold embodiment of the present invention
---------- 上述之亞硫酸金，今屬" J局至屬離子來源；且亞硫酸鈉、硫---------- The above-mentioned gold sulfite, which belongs to the current source of the J Bureau; and sodium sulfite, sulfur
硫代硫酸鈉 抗壞血酸 磷酸氫二鈉 磷酸二氫鈉 pH 代硫酸鈉，則可為人h ^ . 、， 、3 ϋ蜊，抗壞血酸係可為還原劑；磷酸氫 一鈉、填酸一氣納，乃^p、+ )了為緩衝劑溶液；而羧基化合物（有 羧基化合物 未添加 機酸）係包括：甘醇酸、葡萄糖酸、檸檬酸、蘇酸、酒石 檸檬酸/酒石酸。、 添加量 ^s_ 鍍浴狀態 6 0天後仍未析出 11 200848544 甘醇酸 8 0 · 0克/升 6 0天後仍未析出 葡萄糖酸 8 0 · 0克/升 6 0天後仍未析出 擰檬酸 8 0 . 0克/升 6 0天後仍未析出 蘋果酸 8 CK 0克/升 6 0天後仍未析出 酒石酸 8 CK 0克/升 6 0天後仍未析出 檸檬酸/蘋果酸 5 0 · 0/5 0 · 0克/升 6 0天後仍未析出 檸檬酸/酒石酸 5 0 · 0/5 0 · 0克/升 6 0天後仍未析出 綜合上述各項配方料劑，予以調和成鍍金浴後，在鍍金 浴溫度為1 4 0°F時，其蘋果酸之添加量的多寡及其沉積速 率的變化情況： 藥浴溫度（1 40°F) 蘋果酸添加量（克/升） 沉積速率（微米/小時） 4 0 1.20 6 0 1.34 8 0 1.32 10 0 1.28 15 0 1.01 藥浴溫度（1 4 0°F) 檸檬酸添加量（克/升） 沉積速率（微米/小時） 4 0 1.14 12 200848544 6 0 8 0 1 00 15 0 羧基化合物 未添加 藥浴溫度（1 4 0°F) ---- 1.34 〜---- _ 1.62 ----________ 1.78 -----———_ 1.65 添加量（克/升） 沉積速率（微米/小時） 0 6 8 葡萄糖酸 8〇.〇 8 0 擰檬酸 8 0.0 6 2 蘋果酸 8〇.〇 酒石酸 8 0.〇 ·〇/50·〇 0 · 9 6 摔樣酸/频果酸 1.38 擰檬酸/酒石酸5 〇 · 〇 / 5 〇 π ~~—-— ____* ^ 丄· ^ ^ 而鑛金浴之㈣巾辟纽物，且p Η值之翻係在中 性至弱驗性（7.◦〜8.5)之間，是為低毒性的 金洛γ且因為不通電，所以具有高安定性以及高沉積* 可以形成良好的鍍金功能，請同時參閱第_、二、」 ，當欲鑛金物之基材i上具有需鍍金之底材^，鑛金^ 底材1 1表面上之金屬可為金、㉗、叙、銀或其具有金、之 、纪、銀等物質之合金’且鑛金浴之溫度可為！ 1〇、匈 13 200848544 * i 8 Q F ’以當進行錢金浴時’即可供金離子附著，而基材丄 ^底材1 1麵金浴中進行鑛金時，可不需在底材11周邊 。又置離物，即可直接將基材工與底材Η 一同置入錢金浴 I鍍金㈣不需通電，則使底材丨丨與鑛金浴中的洛劑成 分產生化學還化’促使鑛金科的金離子快速流動，具 有良好的安定性，不致在錢金浴中分散四溢，並可穩定、快 f' t正向沉積、附著在底材11表面，以在底材11上方堆 且^厚度均勻的鑛金層2(如第四圖所示），並具有良好的 鍍金效果，在基材1的後續加工作業中，鑛金層2不易由底 材11表面剝離。 /且若齡物之基上的雜u上因設計需要，而必 須在底材11外側周邊設置隔離層3時，可設置較少部份的 健離層3，減少隔離層3原料氧切的使用量，即可在鑛 ( 金作業進行時，以隔離層3在底材1 1上所形成的鑛金如 3 1 ί、金離子蚊且快速的聚集在齡空間3丨的底材1 1表面上’並且持續而穩定的往上堆疊，⑽成均勻厚度的 鍍至層2 ’則可在鑛金作業後快速將隔離層3予以去除，即 能快速且穩定的完成鍵金作業之鑛金層2，而鑛金層2之較 佳尺寸比例值則為： 見度：高度二 2〇"m ·· l//m〜2 0"m 據上述齡浴巾的各觀舰加，並配合賊化合物的 14 200848544 s加鑛4中的金軒移動速度，且能敎的聚結在 基材1上續金之底材1 1表面，快速且敎的完成鍍金之 加工作業，即可得到良好比例值之齡層2，_讓錢金層 2具有浦著性’可以在後續的加卫作業中不會剝離。 再者’上述較佳實施例中的鑛金浴，因添加各種料劑及 配合幾基化合物，岐使鑛金財的絲子軸速度加快， 且具有良㈣沉積穩定性，俾❹i麵金物之紐i上的底 材11表面’形成完整鑛金層2之實施方式，非因此即偈限 本發明之專利範圍，僅需使鑛金浴中具有縣化合物，即可 搭配其他的鍍金料劑之特性，可使鍍金浴在不通電的情況下 ’具=含氰化物、齡浴保射性至弱驗性的低毒性鑛浴 ，其安定性高、沉積速率快，並有高附著性、正向沉積良好 以能形成厚度均勻的鑛金層2，故舉凡運用本發明說明書及 圖式内容所為之簡祕飾及等效結構變化，均應同理包含於 本發明之專利範圍内，合予陳明。 、 上述本發明不含氰化物之無電鑛金浴於實際使用時 具有下列各項優點，如： … (一）鍍金財添加縣化合物，而供鑛金物之基材丄上的 底材11在進入錢金浴中，即可快迷的於底材i丄表 面正向沉積鑛金層，且不需在底材11的周邊設置隔 離層3 ’便可完整成形厚度均句之錢金層，錢全作業 200848544 /丨、而翅埋隔離層 間、降低製造縣、更符合轉^顿金的作業時 (二）Γ:Γ添嫩物，觸她至弱驗性的低 毋冷’並使金離子具有高安定性、高沉積速率 ，且金離子的_性高、正咐積良好，因此可以在 基材1的底材1 ；!上形成厚度均勻的鑛金層。 故，本發明為主要針騎金浴做研發、創新，而可在鑛 金冷中添加縣化合物’啸升麵子的義毅，而能快 速、穩定的正向沉積在底材表面之為主要保護重點，乃僅使 鑛金浴為巾性至祕性之低纽，並财高紋性、高沉積 速率、高附著性錢金厚度均勻之優勢，惟，以上所述僅為貝 本發明之触實闕而已，_此即触本翻之專利範圍 ，故舉凡朝本發明書簡式内容所為之簡易修飾及等 效結構變化’職_包含於本剌之專·_，合 明。 綜上所述’本發日壯述之不含氰化物之無魏金浴在實 際運用、實施時，為確實能達到其功效及目的，故本發明誠 為μ用f生優異之發明，為符合發明專利之申請要件，羡依 法提出申請，❾審委早日賜准本案，以保障發明人之辛苦 研發’絲鈞局審委有任何稽疑，請不吝來函指示，發明 人疋當竭力配合，實感德便。 16 200848544 【圖式簡單說明】 第一圖係為本發明之鍍金方式側視圖。 第二圖係為本發明之鍍金方式較佳實施例之側視圖。 第三圖係為本發明鍍金後之侧視圖。 第四圖係為本發明鍍金後之實際測試圖。 第五圖係為傳統基材鍍金方式之側視圖。 第六圖係為傳統基材鍍金方式之實施例側視圖。 第七圖係為傳統基材鍍金方式之實際測試圖。 【主要元件符號說明】 1、 基材 1 1、底材 2、 鍍金層 3、 隔離層 31、鍍金空間 A、基材 17 200848544 A 1、隔離層 A 1 1、鍍金空間 B、 底材 C、 鑛金層 18Sodium thiosulfate ascorbate hydrogen phosphate disodium phosphate sodium dihydrogen phosphate pH sodium sulfate, which can be human h ^ . , , , 3 ϋ蜊, ascorbic acid can be a reducing agent; monosodium hydrogen phosphate, acid-gas, sodium ^p, + ) is a buffer solution; and the carboxyl compound (having a carboxyl compound without adding an organic acid) includes: glycolic acid, gluconic acid, citric acid, threonine, tartaric acid citrate/tartaric acid. Adding amount ^s_ plating bath state still does not precipitate after 6 days. 2008 200848544 Glycolic acid 8 0 · 0 g / liter After 6 days, gluconic acid is still not precipitated 80 0. 0 g / liter No precipitation after 60 days After the citric acid 8 0. 0 g / liter 60 days after the malic acid was not precipitated 8 CK 0 g / liter 60 days after the tartaric acid was not precipitated 8 CK 0 g / liter 60 days after the precipitation of citric acid / apple Acid 5 0 · 0/5 0 · 0 g / liter After 6 days, no citric acid / tartaric acid was precipitated 5 0 · 0/5 0 · 0 g / liter After 60 days, the above formulas were not precipitated. After adjusting to a gold-plated bath, the amount of malic acid added and its deposition rate change when the temperature of the gold plating bath is 140 °F: medicated bath temperature (1 40 °F) amount of malic acid added (g / liter) deposition rate (micron / hour) 4 0 1.20 6 0 1.34 8 0 1.32 10 0 1.28 15 0 1.01 medicated bath temperature (1 40 °F) citric acid addition (g / liter) deposition rate (micron / hour ) 4 0 1.14 12 200848544 6 0 8 0 1 00 15 0 The carboxy compound is not added to the bath temperature (1 40 °F) ---- 1.34 ~---- _ 1.62 ----________ 1.78 ---- -————_ 1.65 Addition amount (g/L) Deposition rate (μm/hr) 0 6 8 Gluconic acid 8〇.〇8 0 Lemon acid 8 0.0 6 2 Malic acid 8〇.〇酒酸8 0.〇·〇/50·〇 0 · 9 6 Icing acid/frequency fruit acid 1.38 citric acid/tartaric acid 5 〇· 〇 / 5 〇π ~~—-- ____* ^ 丄· ^ ^ And the gold bath of the mine (four) towel, and p The devaluation is between neutral and weak (7.◦~8.5), it is a low toxicity Jinluo γ and because of no electricity, it has high stability and high deposition* can form a good gold plating function. , please also refer to the _, 2,", when the substrate i of the mineral gold material has a substrate to be gold plated ^, the metal on the surface of the substrate 1 1 may be gold, 27, Syria, silver or its An alloy with gold, metal, silver, silver, etc.' and the temperature of the gold bath can be! 1〇, Hungary 13 200848544 * i 8 QF 'When the gold bath is used, it is available for gold ions to be attached, and when the substrate is 1^ substrate 1 1 gold bath for mineral gold, it is not necessary to use the substrate 11 Surroundings. If you leave the object, you can directly put the substrate worker and the substrate into the gold bath I (gold). The gold ion of the ore family has a fast flow, has good stability, does not disperse in the money gold bath, and can be stably and quickly deposited and adhered to the surface of the substrate 11 to be above the substrate 11. The gold ore layer 2 having a uniform thickness (as shown in the fourth figure) has a good gold plating effect, and the gold layer 2 is not easily peeled off from the surface of the substrate 11 in the subsequent processing of the substrate 1. / If the impurity on the base of the age is required for design, and the spacer layer 3 must be provided on the outer side of the substrate 11, a smaller portion of the barrier layer 3 may be provided to reduce the oxygenation of the separator 3 The amount of use can be used in the mine (the gold deposit formed on the substrate 1 by the barrier layer 3, such as 3 1 ί, gold ion mosquitoes and quickly gathered in the space of the 3 丨 substrate 1 1 On the surface 'and continuous and stable stacking up, (10) into a uniform thickness of the layer 2 ' can be quickly removed after the gold deposit operation, that is, the gold can be quickly and stably completed Layer 2, and the preferred size ratio of the gold layer 2 is: Visibility: height 2 2 〇 "m ·· l//m~2 0"m According to the above-mentioned bath towels, and match The thief compound's 14 200848544 s plus mine 4 in the Jin Xuan moving speed, and can be agglomerated on the substrate 1 to renew the gold substrate 1 1 surface, fast and awkward to complete the gold-plated processing operations, you can get good The ratio of the age of the layer 2, _ let the money layer 2 have the ability to 'can be stripped in the subsequent reinforcement operations. In the gold bath of the embodiment, due to the addition of various materials and compounding of several base compounds, the speed of the filament shaft of the gold and gold is accelerated, and the deposition stability of the fine (four) is good, and the substrate on the gold surface of the 俾❹i surface is used. 11 surface 'formation of the complete gold layer 2, not limited to the scope of the patent of the invention, only need to make the mineral compound in the gold bath, can be combined with the characteristics of other gold-plating materials, can make gold-plated bath In the absence of electricity, the low-toxic mineral bath with cyanide, age-bearing bath-to-weakness, high stability, fast deposition rate, high adhesion, good positive deposition, can form The mineral gold layer 2 with uniform thickness, so that the simple decoration and equivalent structural changes made by using the specification and the contents of the present invention should be included in the patent scope of the present invention and combined with Chen Ming. The invention discloses that the cyanide-free electroless gold bath has the following advantages in practical use, such as: (1) the gold-plated compound is added to the county compound, and the substrate 11 on the substrate of the ore-bearing gold material enters the money gold bath. In, you can quickly get to the bottom of the substrate i The surface is positively depositing the gold layer, and the isolation layer 3' is not required to be provided around the substrate 11. The thickness of the gold layer can be completely formed. The money is fully operational 200848544 /丨, and the wing is buried between the layers, and the manufacturing county is lowered. More in line with the operation of the transfer of gold (2) Γ: Γ add tenderness, touch her to the weak low 毋 cold 'and make gold ions have high stability, high deposition rate, and gold ion _ The high and positive hoarding is good, so a uniform gold layer can be formed on the substrate 1 of the substrate 1. Therefore, the invention is developed and innovated for the main needle riding gold bath, and can be used in the mine gold cold. Adding the county compound 'Yisheng face's Yiyi, and the rapid and stable positive deposition on the surface of the substrate is the main protection focus, only the mineral gold bath is the towel to the secret low, and the high grain The advantages of uniformity, high deposition rate, and high adhesion density of gold and gold, but the above is only the touch of the invention of Beben, and this is the patent scope of the invention. The simple modification and the equivalent structural change of the 'employment _ are included in this special _, Heming. In summary, the invention does not contain the cyanide-free Weijin bath in the actual application, in order to achieve its efficacy and purpose, so the invention is the invention of μ excellent use of In accordance with the application requirements of the invention patent, the application shall be filed according to law, and the trial committee will grant the case as soon as possible to protect the inventor's hard work. The Chairman of the Board of Directors has any doubts. Please do not hesitate to give instructions to the inventor. Real sense of virtue. 16 200848544 [Simple description of the drawings] The first figure is a side view of the gold plating method of the present invention. The second drawing is a side view of a preferred embodiment of the gold plating method of the present invention. The third figure is a side view of the gold plating of the present invention. The fourth figure is the actual test chart after gold plating of the present invention. The fifth figure is a side view of the conventional substrate gold plating method. The sixth figure is a side view of an embodiment of a conventional substrate gold plating method. The seventh picture is the actual test chart of the traditional substrate gold plating method. [Description of main component symbols] 1. Substrate 1 1, substrate 2, gold plating layer 3, isolation layer 31, gold plating space A, substrate 17 200848544 A 1, isolation layer A 1 1 , gold plating space B, substrate C, Gold layer 18