TW200844117A - Process for forming films and films formed by the process - Google Patents
Process for forming films and films formed by the process Download PDFInfo
- Publication number
- TW200844117A TW200844117A TW096146568A TW96146568A TW200844117A TW 200844117 A TW200844117 A TW 200844117A TW 096146568 A TW096146568 A TW 096146568A TW 96146568 A TW96146568 A TW 96146568A TW 200844117 A TW200844117 A TW 200844117A
- Authority
- TW
- Taiwan
- Prior art keywords
- amine
- group
- film
- curing agent
- organic
- Prior art date
Links
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- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- ZCIHMQAPACOQHT-ZGMPDRQDSA-N trans-isorenieratene Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/c1c(C)ccc(C)c1C)C=CC=C(/C)C=Cc2c(C)ccc(C)c2C ZCIHMQAPACOQHT-ZGMPDRQDSA-N 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- SNSYZGMYZQAMIL-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]-lambda4-sulfane Chemical compound C(C1CO1)OCCCS(OC)(OC)OC SNSYZGMYZQAMIL-UHFFFAOYSA-N 0.000 description 1
- NRZWQKGABZFFKE-UHFFFAOYSA-N trimethylsulfonium Chemical compound C[S+](C)C NRZWQKGABZFFKE-UHFFFAOYSA-N 0.000 description 1
- OGJDNTCMTVTFAS-UHFFFAOYSA-N trioctylborane Chemical compound CCCCCCCCB(CCCCCCCC)CCCCCCCC OGJDNTCMTVTFAS-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229960002703 undecylenic acid Drugs 0.000 description 1
- 238000010977 unit operation Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 235000013618 yogurt Nutrition 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
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- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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Abstract
Description
200844117 九、發明說明: 【發明所屬之技術領域】 本發明提供-種用於形成薄膜之方法,其係採用有機爛 烷胺錯合物。可在多種基板上製備具有適用於電子應用之 介電特性的薄膜。 【先前技術】 ^ 待解決之問題 用於形成薄膜之大多數當前方法採用紫外線(uv)、電子 € 束卜束)、離子束或x射線照射來固化薄膜。此等方法對於 固化在深度方面或陰影區域方面具有侷限性,且亦需要存 在適當輻射源及相關方法基礎結構,其可為相當昂貴的。 其他非光化學方法通常需要加熱來固化薄膜。加熱需要供 相,其安裝'操作及維護為昂貴的,且可能由於分別在加 熱及冷卻步驟期間之熱膨脹及收縮而在固化方面產生問 題。另外,熱固化方法不能用於熱敏性物品。 解決方案200844117 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention provides a method for forming a film using an organic rotamamine complex. Films having dielectric properties suitable for electronic applications can be prepared on a variety of substrates. [Prior Art] ^ Problem to be Solved Most current methods for forming thin films use ultraviolet (uv), electron beam, ion beam or x-ray irradiation to cure the film. These methods have limitations in terms of depth in terms of depth or shaded areas, and also require the presence of appropriate radiation sources and associated method infrastructure, which can be quite expensive. Other non-photochemical methods typically require heat to cure the film. Heating requires a phase, which is expensive to install and maintain, and may cause problems in curing due to thermal expansion and shrinkage during the heating and cooling steps, respectively. In addition, the heat curing method cannot be used for heat sensitive articles. solution
Q " 本文所描述之此方法係關於一種用於一系統中之以有機 硼烷胺為主之錯合物的新用途,該系統係 .以溫以下之低溫度下在表面上產生聚合物或聚:::: , 物薄膜。在此狀況下,系統係定義為用以產生薄膜之介 質,且不限於薄膜。本文之系統含有基料及固化劑。如本 文所使用,區別於系統之基料係定義為一或多種以薄膜形 式被轉移至表面之系統的成份。固化劑為基料曝露於其而 使薄膜固化之介質。固化薄膜之方法係定義為表面上之薄 127115.doc 200844117 膜藉由聚合及/或交聯而經歷數量平均分子量淨增加之方 法。系統為反應性的且可在周圍條件下快速地固化。雖然 本文所描述之方法可用以在諸如塑膠、陶瓷、玻璃、金 屬、紙張或木材之固體表面上形成相對較厚的薄膜(例 如’大於!〇,_奈米至幾毫米),但其亦可用於產生諸如當 前為微電子學而製之薄膜(例如,1〇赠1〇,〇〇〇除 了作為-種柔和、快速及穩固之周圍方法以外,本文所描 述之方法之特徵還在於可與各種各樣之表面一起使用之關 鍵優點。此外,該方法蚀用左姓雜+ 万泛使料放穩t而仍允許在周圍條件 下快速地固化薄膜之系統。 本文所描述之方法利时機钱化學來提供—種在周圍 條件下在包括低能塑膠之表面上形成薄膜之獨特、容易且 低成本的方法,而無需熱源或輻射源(諸如。該 方法允許在各種表面上產生廣泛範圍之聚合物及聚合物複 合物薄膜,以用於控制諸如表面紋理、外觀、黏著、釋 放、可塗漆性、細胞黏著、摩擦、蛋白質吸附、pH值回 應、反應性及電子、離子、光子或聲子傳送之傳導性的特 性。該方法可用於包括製造半導體、A電裝置、光子裝 置、有機電子器件及諸如電晶體與發光二極體之顯示㈣ 應用中,且可用於製造介電塗層。 【發明内容】 該方法係關於形成固化薄膜 放未固化薄膜且固化以形成固 一包含以下組份之系統:(i)自 。該方法係藉由在表面上置 化薄膜來執行。該方法使用 由基可聚合單體、募聚物或 127115.doc 200844117 聚。物,(11)有機硼烷胺錯合物,(iH)胺反應性化合物及 (iv)氧。根據該方法,系統之成份可以任何比例分布於諸 如基料及獨立容裝固化劑(含有額外系統成份)之多組份系 、先中;、、、:而,其限制條件為成份(ii)及(iii)在固化系統之前 係獨立儲存。 、 該方法可包含將基料以未固化薄膜之形式置放於表面 上,且接著在包括室溫及室溫以下之低溫度(諸如,低於 l〇〇C)下將基料曝露至固化劑以固化薄膜。成份(iv)氧可 明確存在於系統中,或成份(iv)可隱含存在於環境中,諸 如自然存在於空氣中。系統可施用於任何表面或表面組 合。本發明之此等及其他特徵可參考詳細說明而清楚瞭 解。 ’、 【實施方式】 如上文所述,根據本發明之方法利用有機硼烷化學之多 功能性,且更精確言之,利用有機硼烷胺錯合物所提供之 c 多功能性,該等錯合物具有空氣穩定性,而在曝露至胺反 應性化合物時為極有效之自由基聚合引發劑。此使得一定 範圍之不飽和單體、寡聚物及聚合物能夠實際上瞬時固 , 化。藉由此方法,可藉由許多種完善建立之方法將基料置 , 放於表面上,該等方法包括旋塗、輥塗、幕塗、喷塗、噴 墨塗覆、模塗、浸塗、溶劑洗鑄、氣相沈積,或諸如 Langmuir-Blodgett薄膜裝配之液-液沈積技術。在將基料曝 露至適當固化劑後,所得基料未固化薄膜即可在表面上在 周圍條件下快速地固化。固化劑可為液體、氣體、固體或 127115.doc 200844117 其混合物。 在混合基料成份與固化劑後即發生固化。基料薄膜在表 面上沈積可為物理性的,例如吸附,或其可涉及與表面开3 成共價鍵,例如接枝。與(例如)自揮發以乾燥薄膜之溶劑 來沈積染料、顏料或完全聚合聚合物之純物理方法相反, 本文所描述之方法為固化期間系統經由自由基聚合(諸 如,自單體或大分子單體流體聚合為聚合物薄膜)而經歷 平均分子量增加之反應性方法。在此方面,此方法類似於 基於輻射或熱固化之技術,但此系統所提供之優點在於其 不需要光引發劑或光源或熱源,且此方法提供許多本文所 提及之其他優點。 系統包含⑴自由基可聚合單體、募聚物或聚合物,(ii) 有機蝴烧胺錯合物,(iii)胺反應性化合物及(iv)氧。在一 些狀況下,同一化合物可用於⑴及(iii)兩者,只要該化合 物具有由丙烯酸及甲基丙烯酸所例示之官能基即可。成份 ⑴_(iv)分布於基料與固化劑之間,使得成份(Η)及(丨⑴之一 處於基料中且成份(ii)及(iH)中之另一者處於固化劑中,且 成份(ii)與(iii)在固化之前不在成份(iv)存在下組合。儘管 成份(W)氧固有地存在於空氣中,但可有意將氧自基料' 固化劑或處理環境中排除或引入至基料、固化劑或處理環 境。 舉例而言,該方法可藉由以下步驟來執行:使用包含⑴ 自由基可聚合單體、寡聚物或聚合物及(丨丨)有機棚烧胺錯 合物之基料在表面上形成未固化薄膜,且接著在(iv)氧存 127115.doc 200844117 在下將基料曝路至包含(ni)胺反應性化合物之固化劑以固 化而在表面上形成固化薄膜。 或者,该方法可藉由以下步驟來執行··使用包含(丨丨)有 機硼烷胺錯合物之基料在表面上形成未固化薄膜,且接著 在氧(iv)存在下將基料曝露至包含⑴自由基可聚合單體、 养♦物或聚合物及(iii)胺反應性化合物之固化劑以固化而 在表面上形成固化薄膜。 或者,該方法可藉由以下步驟來執行··使用包含成份 (Π1)胺反應性化合物之基料在表面上形成未固化薄膜,接 著在氧(iv)存在下將基料曝露至包含成份⑴及(ii)之固化劑 以固化而在表面上形成固化薄膜。在此實施例中,薄膜可 作為之後被置放、經由官能化步驟(諸如選擇性底塗、uv 或電暈處理用以在表面上產生胺反應性位點)被置放、或 經由基板處理(其中成份(iii)固有地或作為添加劑存在於基 板中)期間之自裝配方法被原位置放之基料被置放於表面 上。 或者,在系統以單一封裝存在的情況下,成份(ii)與⑴D 可藉由存在於諸如乳液之多相系統的獨立相中而相互隔 離,或經由囊封成份(ii)及(iii)中之至少一者而相互隔離。 此處,由於成份(ii)與(iii)處於獨立相,因此無必要在不存 在(IV)氧的情況下儲存及處理基料。基料係以未固化薄膜 之2式置放於表面上,接著藉由曝露至包含諸如去乳化劑 或办劑之化學試劑的固化劑,或藉由曝露至諸如剪切、照 射加熱、冷卻、加壓或減壓之物理過程以在氧存在 127115.doc 200844117 下使成份(ii)與(iii)相互混合而固化。 在本發明之任何實施例中,除另有所述外,成份⑴及 (iv)可與-或多種其他可選成份(v)_起包括於基料中,或 包括於固化劑中,$包括於兩者中。並且,在任何實施例 中,成份⑴及(Hi)可由具有自由基可聚合基團及胺反應性 基團兩者之單一成份組成。 系統用以製備固化薄膜所在之表面不受限制。實例包括 玻璃表面、金屬表面、石英表面、陶瓷表面、矽表面、有 機表面、剛性聚合物表面、可撓性彈性體表面,或其複合 表面。表面亦可為冷凍液體(諸如,冰或乾冰),以產生自 立式薄膜模板或貼花膜,其可藉由允許表面在已產生固化 薄膜之後溶融而被轉印至另—表❼表面亦可為液體表面 (諸如,水、庚烷、石夕油或汞),其限制條件為基料保持所 要薄膜特徵直1固化A分進行而賦予薄膜穩定性或固化完 成為止。較佳地,基料在施用至液體表面時不擴展或溶解 於液體表面巾。固化薄膜之所得特性不受特定限制。舉例 而3,系統可經調配以得到可為剛性、可撓性、透明、半 透明、不透明、彈性體、非晶系、半晶質、液晶、熱塑 性、熱SH1、熱或電絕緣、熱或電半傳導性或導熱性或導 電性的固化薄膜。 基料可藉由許多種完善建立之方法被置放或形成於表面 上’該等方法包括刷塗、輥塗、幕塗、喷塗、噴墨塗覆、 模塗、旋塗、浸塗、溶劑澆鑄、氣相沈積,或諸如 Langmuir_Blodgett薄膜裝配之液_液沈積技術。系統之成份 127115.doc -11 - 200844117 包括⑴自由基可聚合單體、震乎斗 烧奸人物,...、 g物或聚合物,⑼有機蝴 说胺錯合物’㈣胺反應性化合物及(iv)氧。如下 地描述此等成份。 旧 自由基可聚合單體、募聚物或聚合物 成份⑴可為有機化合物或諸如有機矽化合物之有機金屬 化合物。在任-狀況下,其可為含有不飽和性且能夠經歷 自由基聚合之單一單體、募聚物或聚合物。亦可使用單 體、券聚物及聚合物之混合物。在許多狀況下,較佳的是 使用單體、寡聚物及聚合物之混合物以賦予物理特性(諸 如黏度、揮發性、關於未固化狀態之可處理性及離析之基 板濕潤、玻璃轉移溫度、硬度或溶解度)與表面特性(諸如 固化狀怨之親水性或疏水性)之所要組合。當成份⑴為有 機化合物時,所選化合物將視固化產物之用途而定。美國 專利6,762,260(2004年7月13曰)中描述了一些合適有機化 合物,包括諸如以下各物之有機化合物:丙烯酸2_乙基己 酉旨、甲基丙細酸2 -乙基己酉旨、丙稀酸甲g旨、甲基丙浠酸曱 酯、新戊二醇二丙烯酸酯、新戊二醇二曱基丙烯酸酯、丙 烯酸縮水甘油酯、甲基丙烯酸縮水甘油酯、丙稀酸烯丙 酯、甲基丙烯酸烯丙酯、丙烯酸硬脂醯基酯、曱基丙稀酸 硬脂醯基酯、甲基丙烯酸四氫糠酯、丙烯酸異冰片基酯、 曱基丙烯酸異冰片基酯、丙烯酸己内酯、丙烯酸全氟丁 酉旨、甲基丙烯酸全氟丁S旨、丙稀酸lH,lH,2H,2H-+tl$ 酯、甲基丙烯酸111,111,211,211-十七氟癸酯、四氫全氟丙烯 酸酯、丙烯酸苯氧乙酯、曱基丙烯酸苯氧乙酯、雙酚A丙 127115.doc -12- 200844117 烯酸酯、雙酚A二甲基丙烯酸酯、乙氧基化雙酚a丙烯酸 醋、乙氧基化雙酚A甲基丙烯酸酯、六氟雙酚A二丙烯酸 酉曰、六氟雙紛A二甲基丙烯酸g旨、二乙二醇二丙浠酸|旨、 二乙二醇二甲基丙烯酸酯、二丙二醇二丙烯酸酯、二丙二 _ 醇二甲基丙烯酸酯、聚乙二醇二丙烯酸酯、聚乙二醇二甲 基丙烯酸酯、聚丙二醇二丙烯酸酯、聚丙二醇二甲基丙烯 酸酉旨、三羥曱基丙烷三丙烯酸酯、三羥甲基丙烷三甲基丙 & 烯酸酯、乙氧基化三羥甲基丙烷三丙烯酸酯、乙氧基化三 •甲基丙烧三甲基丙烯酸酯、異戊四醇三丙婦酸酯、異戊 四醇三甲基丙烯酸酯、異戊四醇四丙烯酸酯、異戊四醇四 甲基丙烯酸酯、3- 丁烯酸甲酯、碳酸烯丙基甲酯、焦碳酸 一稀丙酯、乙醯乙酸烯丙酯、鄰苯二甲酸二烯丙酯、衣康 酸一甲酯、碳酸二烯丙酯、偏二氟乙烯或其組合。其他適 用有機化合物包括藉由使諸如羥基丙烯酸酯之異氰酸酯反 應性丙烯酸酯單體、募聚物或聚合物與異氰酸酯官能預聚 Q 物反應而製備的丙烯酸酯絨尖染色聚胺基甲酸酯預聚物。 一類每分子具有平均至少一個自由基可聚合基團且具有 傳送電子、離子、電洞及/或聲子之能力的傳導性單體、 摻雜物、养聚物、聚合物及大分子單體亦適用。舉例而 . 言,可參考美國專利5,929,194(1999年7月27曰),其描述 了諸如4,4’4’’-參[N-(3(2-丙烯醯氧基乙氧基)苯基)_N•苯胺 基]三苯胺、4,4,4"-參[N_(3(苯甲醯氧基苯基)_N_苯胺基]三 苯胺之各種自由基可聚合電洞傳送化合物的製備,及由其 製成之電致發光裝置的製備。應注意丙烯酸系官能基字首 127115.doc -13· 200844117 丙烯醯基-與丙烯基_在本文中可互換使用,同樣曱基丙烯 酸官能基字首甲基丙烯醯基_與甲基丙烯基_可互換使用。 一類每分子具有平均至少一個自由基可聚合基團且展現 可用於光學及光子應用中之範圍内之折射率的單體、寡聚 物、聚合物及大分子單體亦適用。㈣包括具有諸如以下 之鹵化重複單元的單體、寡聚物、聚合物及大分子單體: 四氟乙稀、四貌乙稀六氟丙稀偏二氣乙烯、乙烯四氟乙 稀:丙婦酸十五氟辛酉旨、甲基丙稀酸十五敦辛醋、丙稀酸 九氟戊醋、甲基丙婦酸九氣戍醋、丙稀酸三氣乙醋、甲基 丙烯酸广a乙醋、甲基丙烯酸1>3_二氯丙冑、甲基丙烯酸 對:漠苯醋、α-溴丙烯酸苯酯及甲基丙烯酸五溴苯醋。其 他適用化合物包括具有高折射率(相對於普通聚合物)之化 合物’諸如聚醚醚酮mf I W (PEEK)及聚醚醯亞胺之丙烯酸酯或甲 基丙烯酸酯官能大分子單體。 當將有機石夕化合物用作成份⑴時,所選化合物亦視固化 產物之用途而定。有機石夕化合物可包含平均具有至少一個 :由基可聚合部分之有機矽烷或有機聚矽氧 :物可為單體的、寡聚的、聚合的,《可為單體及/或 =二聚合物之混合物。此等自由基可聚合化合物 類通常被稱為大分子單體。有輪合物 ,”二為:J基團中可含有單官能或多官能單元。此允 構之丘平物+ n卞構之/刀枝聚合物、各種架 二備!= 聚合網路。單體及寡聚物可為通常用 以製備加成或縮合可 ^ 化聚&物之任何單體或寡聚物,或 127115.doc -14- 200844117 其可為用於其他類型之固化反應的單體或寡聚物,其限制 條件為其含有至少一個自由基可聚合基團。 合適的有機矽單體包括具有一般對應於式R”nSi(〇R”,)4 n 之結構的化合物,其中n具有〇至4之範圍内的值;且其中 R"或R’’’基團中之至少一者含有自由基可聚合基團。r"及 R’’’基團可獨立地為氫1素原子;或有機基團,包括烧 基、鹵烧基、芳基、鹵芳基、稀基、块基、丙稀酸醋官能 ( 基及甲基丙烯酸酯官能基。R"及R,,,基團亦可含有其他有 機s肖b基,包括縮水甘油基、胺基、趟基、氰酸酯基、異 氰基、酯基、羧酸基、羧酸鹽基、琥珀酸酯基、酐基、巯 基、硫崎基、疊氮化合物基、麟酸基、㈣Μ 基及經基。 自由基可聚合有機⑦單體之代表性實例包括諸如以下之 化合物:3_曱基丙烯醯氧基丙基三甲氧基矽烷、3_甲某丙 稀醯氧基甲基三甲氧基石夕烧、3-甲基丙婦酿氧基丙基二乙 I t基矽烷、3_丙烯醯氧基丙基三甲氧基矽烷、3_丙烯醯氧 基曱基三甲氧基矽烷、3·甲基丙烯醯氧基丙基三甲基矽 烧、3-丙烯醯氧基丙基三乙氧基石夕炫、3_丙稀醯氧基丙基 • 二甲基矽烷、乙烯基三甲氧基矽烷、烯丙基三甲氧基矽 . 烧、卜己稀基三甲氧基石夕烧、肆_(稀丙氧基錢)、肆_(3_ 丁婦基-1-氧基)石夕烧、#_(3_ 丁烯基小氧基)甲基石夕炫、二_ (3-丁稀基-卜氧基)二甲基石夕烧及3· 丁稀基+氧基三甲基石夕 烷。其他實例包括上文所例示之三烷氧基石夕燒之二-烧氧 基官能類似物(諸如,3_甲基丙稀酿氧基丙基甲基二甲氧基 127115.doc -15- 200844117 石夕烧)、上权I道氧基官能類似物(諸如,3_甲基丙稀酿 氧基丙基二甲基甲氧基矽烷)。此類亦包括此等單體之鹵 矽烷前驅物,諸如3-甲基丙烯醯氧基丙基三氯矽烷、^曱 基丙烯醯氧基丙基甲基二氣石夕烧及3_甲基丙稀醯氧基丙基 二甲基氣石夕烧。此等有機梦化合物之較佳自由基可聚合部 分為其中雙鍵相對於官能基位於終端位置、内部位置i兩 個位置處之脂族不飽和基團。有機矽化合物之最佳自由基 可聚合部分為丙烯酸酯基團或甲基丙烯酸酯基團。 當自由基可聚合單體、寡聚物或聚合物為有機矽組份 時,該組份可為具有線性、分枝、超分枝或樹脂質結構之 有機聚矽氧烷。該化合物可為均聚的或共聚的。有機聚矽 氧烧之自由基可聚合部分可為不飽和有機基團,諸如具有 2-12個碳原子之烯基,其由乙烯基、烯丙基、丁烯基或己 烯基例示。不飽和有機基團亦可包含由乙炔基、丙炔基或 丁快基所例示之具有2-12個碳原子之炔基。不飽和有機基 團可在寡聚或聚合聚醚部分上具有自由基可聚合基團,諸 如稀丙氧基氧基伸烧基)基團或其_素取代類似物。自 由基可聚合有機基團可含有由諸如丙烯醯氧基甲基及丙烯 醯氧基丙基之丙烯醯氧基烷基與諸如甲基丙烯醯氧基甲基 及甲基丙烯醯氧基丙基之曱基丙烯醯氧基烷基所例示的丙 烯酸酯官能基或甲基丙烯酸酯官能基。不飽和有機基團可 相對於聚合物主鏈位於終端位置、側接位置或終端及側接 位置兩處。单體、券聚及聚合有機秒化合物之較佳自由基 可5^合部分為丙稀酸s旨基團及甲基丙稀酸g旨基團。 127115.doc -16- 200844117 任何剩餘秒鍵結有機基團可為無脂族不飽和性之單價有 機基團。單價有機基團可具有卜20個碳原子,較佳為丨_1〇 個碳原子,且由以下基團例示:烷基,諸如甲基、乙基、 丙基、戊基、辛基、十一基及十八基;環烷基,諸如環己 基;芳基,諸如苯基、甲苯基、二甲苯基、苄基及2_苯乙 基;烷氧基聚(氧基伸烷基)基團,諸如丙氧基聚(氧基伸乙 基)、丙氧基聚(氧基伸丙基)、丙氧基-聚(氧基伸丙基)_共_ 聚(氧基伸乙基)基團、其函素取代類似物;氰基官能基, 包括諸如氰基乙基及氰基丙基之氰基烷基;咔唑基,諸如 3-(N-咔唑基)丙基;芳基胺基官能基,諸如二苯胺 基)苯基·3_丙基;及鹵化烴基,諸如3,3,3_三氟丙基、3-氯 丙基、二氯苯基及6,6,6,5,5,4,4,3,3-九氟己基。 自由基可聚合有機矽化合物之稠度方面可自在25。〇下具 有0.001 Pa.s之黏度的流體至膠狀物之間變化。自由基可 聚合有機矽化合物亦可為在高溫下或藉由施加剪切而變得 可流動之固體。 成份⑴包括具有下式之有機聚矽氧烷流體: (a) R13SiO(R12Si〇)a(R1R2si〇)bsiR13 , (b) R32R4SiO(R32Si〇)c(R3R4si〇)dSiR32R4,或 (C)此等流體之組合。 在此等式中,下標a具有零至2〇5〇〇〇之平均值,下標b具 有1至20,000之平均值,下標〇具有零至2〇,〇〇〇之平均值, 且下標d具有零至20,〇〇〇之平均值。各…基團獨立地為單 價有機基團。R2基團獨立地為不飽和單價有機基團。汉3基 127115.doc -17- 200844117 團可與R1基團相同。各R4獨立地為不飽和有機基團。 合適R1基團為包括以下基團之單價有機基團:丙烯酸官 能基,諸如丙烯醯氧基甲基、丙烯醯氧基丙基、甲基丙烯 醯氧基甲基、甲基丙烯醯氧基丙基;烷基,諸如甲基、乙 基、丙基,及丁基,烯基,諸如乙烯基、烯丙基及丁稀 基;炔基,諸如乙炔基及丙炔基;芳族基團,諸如苯基、 甲苯基及二甲苯基;氰基烷基,諸如氰基甲基、氰基乙基 及氰基丙基;鹵化烴基,諸如3,3,%三氟丙基、3_氯丙 基、二氯苯基及6,6,6,5,5,4,4,3,3-九氟己基;烯氧基聚(氧 基伸烷基)基團,諸如烯丙氧基(聚氧基伸乙基)、烯丙氧基 聚(氧基伸丙基)及烯丙氧基-聚(氧基伸丙基)_共_聚(氧基伸 乙基)基團;烷氧基聚(氧基伸烷基)基團,諸如丙氧基(聚 氧基伸乙基)、丙氧基聚(氧基伸丙基)及丙氧基-聚(氧基伸 丙基)-共-聚(氧基伸乙基)基團;_素取代之烷氧基聚(氧基 伸烷基)基團,諸如全氟丙氧基(聚氧基伸乙基)、全氟丙氧 基聚(氧基伸丙基)及全氟丙氧基-聚(氧基伸丙基)_共-聚(氧 基伸乙基)基團;烷氧基,諸如甲氧基、乙氧基、正丙氧 基、異丙氧基、正丁氧基及乙基己氧基;胺基烷基,諸如 3-胺基丙基、6-胺基己基、Π-胺基十一基、3-(N-烯丙基 胺基)丙基、N-(2-胺基乙基)_3_胺基丙基、N-(2-胺基乙基)_ 3-胺基異丁基、對-胺基苯基、2-乙基吡啶及3-丙基咣咯 基;環氧基烷基,諸如3-縮水甘油氧基丙基、2-(3,4,_環氧 基$衣己基)乙基及5,6-¾乳基己基;醋官能基,諸如乙酿氧 基曱基及苯曱醯氧基丙基;羥基官能基,諸如羥基及2-經 127115.doc -18- 200844117 基乙基;異氰酸酯及遮蔽異氰酸酯官能基,諸如3 _異氰酸 酯基丙基、參-異三聚氰酸3-丙酯、胺基甲酸丙基_第三丁 酯及胺基甲酸丙基乙酯基團,·醛官能基,諸如十一駿及丁 醛基團;酐官能基,諸如3-丙基琥珀酸酐及3_丙基順丁烯 二酸酐基團;羧酸官能基,諸如3_羧基丙基及2_羧基乙 基;咔唑基,諸如3-(N-咔唑基)丙基;芳基胺基官能基, 諸如4-(N,N-二苯胺基)苯基_3_丙基;及魏酸之金屬鹽,諸 如3 -魏基丙基及2 -羧基乙基之辞、納或_鹽。 R2基團由以下基團例示··烯基,諸如乙烯基、烯丙基及 丁烯基,炔基,諸如乙炔基及丙炔基;及丙烯酸官能基, 諸如丙烯醯氧基丙基及甲基丙烯醯氧基丙基。如所述汉3基 團可與R1基團相同。R4基團由以下基團例示:烯基,諸如 乙烯基、烯丙基及丁烯基;炔基,諸如乙炔基及丙炔基; 烯氧基聚(氧基伸烷基)基團,諸如烯丙氧基(聚氧基伸乙 基)、烯丙氧基聚(氧基伸丙基)及烯丙氧基-聚(氧基伸丙 基)-共-聚(氧基伸乙基)基團;及丙烯酸官能基,諸如丙烯 釓氧基甲基、丙浠醯氧基丙基、甲基丙烯醯氧基甲基及甲 基丙烯醯氧基丙基。 適於用作成份⑴之一些代表性有機聚矽氧烷流體包括: 甲基丙烯醯氧基丙基_二甲基矽烷基封端聚二甲基矽氧 烷、甲基丙烯醯氧基甲基_二甲基矽烷基封端聚二甲基 矽氧烷、α,ω-丙烯醯氧基丙基_二甲基矽烷基封端聚二甲基 矽氧烷、α,ω-丙烯醯氧基甲基_二甲基矽烷基封端聚二甲基 矽氧烷,側接丙烯酸酯官能聚合物及曱基丙烯酸酯官能聚 127115.doc -19- 200844117Q " This method described herein relates to a new use of an organoborane-based complex in a system which produces a polymer on the surface at a low temperature below temperature. Or poly::::, film. In this case, the system is defined as a medium for producing a film, and is not limited to a film. The system herein contains a binder and a curing agent. As used herein, a binder that is distinct from the system is defined as one or more components of the system that are transferred to the surface in the form of a film. The curing agent is a medium to which the binder is exposed to cure the film. The method of curing the film is defined as being thin on the surface 127115.doc 200844117 The film undergoes a method of net increase in the number average molecular weight by polymerization and/or crosslinking. The system is reactive and can cure rapidly under ambient conditions. Although the methods described herein can be used to form relatively thick films on solid surfaces such as plastic, ceramic, glass, metal, paper or wood (eg, 'greater than! 〇, _ nanometers to a few millimeters), they can also be used In order to produce a film such as that currently made for microelectronics (for example, 1 〇 1 〇, in addition to being a soft, fast and stable surrounding method, the method described herein is also characterized by various The key advantages of using all kinds of surfaces together. In addition, the method uses a left-handed-and-small-sleeve material to stabilize the film while still allowing the film to be rapidly cured under ambient conditions. Chemistry provides a unique, easy, and low-cost method of forming a film on a surface including low energy plastics under ambient conditions without the need for a heat source or source of radiation (such as this method allows for the production of a wide range of polymers on a variety of surfaces) And polymer composite films for controlling such as surface texture, appearance, adhesion, release, paintability, cell adhesion, friction, protein adsorption pH response, reactivity, and conductivity of electron, ion, photon, or phonon transport. The method can be used to fabricate semiconductors, A-electric devices, photonic devices, organic electronic devices, and such as transistors and light-emitting diodes. Displayed in (4) applications, and can be used to make dielectric coatings. SUMMARY OF THE INVENTION The method relates to forming a cured film by placing an uncured film and curing to form a system comprising the following components: (i) from the system. This is carried out by depositing a film on the surface. This method uses a polymerizable monomer, a polymer or a 127115.doc 200844117 polymer, (11) an organoborane amine complex, (iH) amine reactivity. a compound and (iv) oxygen. According to the method, the components of the system can be distributed in any proportion in a multi-component system such as a binder and a separately contained curing agent (containing additional system components), first, and the like: The conditions are that components (ii) and (iii) are stored separately prior to the curing system. The method may comprise placing the substrate on the surface in the form of an uncured film, and then at room temperature and room temperature, The base is exposed to a curing agent to cure the film at a lower temperature (such as below 1 〇〇 C). The component (iv) oxygen may be clearly present in the system, or the component (iv) may be implicitly present in the environment. Such as naturally occurring in the air. The system can be applied to any surface or combination of surfaces. These and other features of the present invention can be clearly understood by reference to the detailed description. ', [Embodiment] As described above, the method according to the present invention Utilizing the versatility of organoborane chemistry, and more precisely, utilizing the versatility provided by organoborane amine complexes, these complexes have air stability and are exposed to amine reactive compounds It is an extremely effective radical polymerization initiator, which enables a range of unsaturated monomers, oligomers and polymers to be virtually instantaneously solidified. By this method, a number of well-established methods can be used. The base material is placed on the surface, and the methods include spin coating, roll coating, curtain coating, spray coating, inkjet coating, die coating, dip coating, solvent washing, vapor deposition, or a film such as Langmuir-Blodgett. assembly Liquid-liquid deposition technology. After the base material is exposed to a suitable curing agent, the resulting base uncured film is rapidly cured on the surface under ambient conditions. The curing agent can be a liquid, a gas, a solid or a mixture of 127115.doc 200844117. Curing occurs after mixing the binder components with the curing agent. The base film may be physically deposited on the surface, such as by adsorption, or it may involve a covalent bond to the surface, such as grafting. In contrast to purely physical methods of, for example, volatilizing a solvent that dries a film to deposit a dye, pigment, or fully polymerized polymer, the methods described herein are via a free radical polymerization (such as from a monomer or macromolecule) during curing. The bulk fluid is polymerized into a polymeric film) and undergoes a reactive method of increasing the average molecular weight. In this regard, this method is similar to radiation or thermal curing based technology, but the advantage provided by this system is that it does not require a photoinitiator or source or heat source, and this method provides many of the other advantages mentioned herein. The system comprises (1) a free-radically polymerizable monomer, a polymer or a polymer, (ii) an organic amine amine complex, (iii) an amine-reactive compound, and (iv) oxygen. In some cases, the same compound can be used for both (1) and (iii) as long as the compound has a functional group exemplified by acrylic acid and methacrylic acid. The components (1) to (iv) are distributed between the binder and the curing agent such that one of the components (Η) and (丨) is in the binder and the other of the components (ii) and (iH) is in the curing agent, and Ingredients (ii) and (iii) are not combined in the presence of component (iv) prior to curing. Although the component (W) oxygen is inherently present in the air, the oxygen may be intentionally excluded from the binder's curing agent or treatment environment or Incorporating into a binder, curing agent or treatment environment. For example, the method can be carried out by using (1) a radical polymerizable monomer, an oligomer or a polymer, and an organic sulfonamide The binder of the complex forms an uncured film on the surface, and then the substrate is exposed to a curing agent containing the (ni) amine-reactive compound to cure on the surface under (iv) oxygen storage 127115.doc 200844117 Forming a cured film. Alternatively, the method can be carried out by the following steps: forming an uncured film on the surface using a base comprising (丨丨) an organoborane amine complex, and then in the presence of oxygen (iv) Exposing the base to contain (1) radical polymerizable monomer The curing agent of the medicinal substance or polymer and (iii) the amine reactive compound forms a cured film on the surface by curing. Alternatively, the method can be carried out by the following steps: using an amine-reactive compound containing a component (Π1) The base material forms an uncured film on the surface, and then the base material is exposed to a curing agent containing the components (1) and (ii) in the presence of oxygen (iv) to cure to form a cured film on the surface. In this embodiment, The film can be placed afterwards, via a functionalization step (such as selective primer, uv or corona treatment to create an amine reactive site on the surface), or processed via a substrate (wherein component (iii) The self-assembly method during the intrinsic or in the presence of the additive in the substrate is placed on the surface by the substrate placed in the original position. Alternatively, in the case where the system is present in a single package, components (ii) and (1)D can be used by Existing in separate phases of a multiphase system such as an emulsion, or isolated from each other, or by at least one of encapsulating components (ii) and (iii). Here, since components (ii) and (iii) are alone Phase, so it is not necessary to store and process the base in the absence of (IV) oxygen. The base is placed on the surface as an uncured film, followed by exposure to contain such as demulsifying agents or a curing agent for the chemical agent of the agent, or by mixing the ingredients (ii) and (iii) in the presence of oxygen at 127115.doc 200844117 by exposure to a physical process such as shearing, irradiation heating, cooling, pressurization or depressurization. And in any embodiment of the present invention, components (1) and (iv) may be included in the binder or included in the curing agent, and/or other optional components (v), unless otherwise stated. In the above, $ is included in both. Also, in any embodiment, the components (1) and (Hi) may be composed of a single component having both a radical polymerizable group and an amine reactive group. The surface on which the system is used to prepare the cured film is not limited. Examples include glass surfaces, metal surfaces, quartz surfaces, ceramic surfaces, tantalum surfaces, organic surfaces, rigid polymer surfaces, flexible elastomer surfaces, or composite surfaces thereof. The surface may also be a chilled liquid (such as ice or dry ice) to produce a free-standing film template or decal, which may be transferred to another surface by allowing the surface to melt after the cured film has been produced. The liquid surface (such as water, heptane, lycopene or mercury) is limited in that the binder maintains the desired film characteristics and the film is stabilized or cured. Preferably, the binder does not expand or dissolve in the liquid surface towel when applied to the surface of the liquid. The properties obtained by curing the film are not particularly limited. For example, the system can be formulated to provide rigidity, flexibility, transparency, translucency, opacity, elastomer, amorphous, semi-crystalline, liquid crystal, thermoplastic, thermal SH1, thermal or electrical insulation, heat or A cured film that is electrically semiconductive or thermally conductive or electrically conductive. The binder can be placed or formed on the surface by a number of well established methods including brushing, roller coating, curtain coating, spray coating, inkjet coating, die coating, spin coating, dip coating, Solvent casting, vapor deposition, or liquid-liquid deposition techniques such as Langmuir_Blodgett film assembly. The composition of the system 127115.doc -11 - 200844117 includes (1) free radical polymerizable monomer, shocking characters, ..., g or polymer, (9) organic amine amine complex '(tetra) amine reactive compound And (iv) oxygen. These components are described as follows. The old radical polymerizable monomer, polymer or polymer component (1) may be an organic compound or an organometallic compound such as an organic cerium compound. In any case, it can be a single monomer, polymer or polymer that contains unsaturation and is capable of undergoing free radical polymerization. Mixtures of monomers, vesicles and polymers can also be used. In many cases, it is preferred to use a mixture of monomers, oligomers, and polymers to impart physical properties (such as viscosity, volatility, handleability with respect to uncured state, and substrate wetting, glass transition temperature, Hardness or solubility) is combined with surface characteristics such as hydrophilicity or hydrophobicity of the cure. When component (1) is an organic compound, the selected compound will depend on the use of the cured product. Some suitable organic compounds are described in U.S. Patent 6,762,260 (July 13, 2004), including organic compounds such as 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, Acrylic acid, propyl methacrylate, neopentyl glycol diacrylate, neopentyl glycol dimercapto acrylate, glycidyl acrylate, glycidyl methacrylate, acrylic acid acryl Ester, allyl methacrylate, stearyl acrylate, stearyl thioglycolate, tetrahydrofurfuryl methacrylate, isobornyl acrylate, isobornyl methacrylate, acrylic acid Caprolactone, perfluorobutyl acrylate, perfluorobutyl methacrylate, 1H, 1H, 2H, 2H-+tl$ ester, methacrylate 111, 111, 211, 211-heptadecafluoroquinone Ester, tetrahydroperfluoroacrylate, phenoxyethyl acrylate, phenoxyethyl acrylate, bisphenol A 127115.doc -12- 200844117 enoate, bisphenol A dimethacrylate, ethoxylate Bisphenol a acrylate, ethoxylated bisphenol A methacrylate, hexafluorobisphenol A dipropylene Acid bismuth, hexafluoro bis-A methacrylic acid, diethylene glycol dipropanoic acid, diethylene glycol dimethacrylate, dipropylene glycol diacrylate, dipropylene glycol Acrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, polypropylene glycol diacrylate, polypropylene glycol dimethacrylate, trishydroxypropyl propane triacrylate, trimethylol Propane trimethyl propyl & enoate, ethoxylated trimethylolpropane triacrylate, ethoxylated tri-methyl propyl trimethacrylate, pentaerythritol tripropionate, Pentaerythritol trimethacrylate, isoprene tetraol tetraacrylate, isopentaerythritol tetramethacrylate, methyl 3-butenoate, allyl methyl carbonate, mono-propyl propyl carbonate, Allyl acetate, allyl propionate, monomethyl itaconate, diallyl carbonate, vinylidene fluoride or a combination thereof. Other suitable organic compounds include acrylate tip dyed polyurethane preprepared by reacting an isocyanate reactive acrylate monomer such as a hydroxy acrylate, a merging polymer or a polymer with an isocyanate functional prepolymerized Q. Polymer. a class of conductive monomers, dopants, agglomerates, polymers, and macromonomers having an average of at least one free radical polymerizable group per molecule and having the ability to transport electrons, ions, holes, and/or phonons Also applicable. For example, reference is made to U.S. Patent 5,929,194 (July 27, 1999) which describes, for example, 4,4'4''-para [N-(3(2-acryloxyethoxy)) Phenyl)_N•anilino]triphenylamine, 4,4,4"-parade [N_(3(benzylideneoxyphenyl)_N-anilino]triphenylamine of various free radical polymerizable hole transport compounds Preparation, and preparation of electroluminescent devices made therefrom. It should be noted that the acrylic functional group prefix 127115.doc -13· 200844117 acryl fluorenyl- and propylene groups are used interchangeably herein, likewise thiol acrylate functionality The radical methacryl fluorenyl _ is used interchangeably with methacryl yl. A class of monomers having an average of at least one free radical polymerizable group per molecule and exhibiting a refractive index in the range of optical and photonic applications. Oligomers, polymers, and macromonomers are also suitable. (iv) include monomers, oligomers, polymers, and macromonomers having halogenated repeating units such as: tetrafluoroethylene, tetramorphic six Fluoropropene partial ethylene ethylene, ethylene tetrafluoroethylene: fiprotic acid fifteen fluocinolone, methyl propyl acid fifteen Citric vinegar, hexafluoropentaacetic acid acrylic acid, methyl acetoacetic acid ninth vinegar vinegar, triethyl acetal acrylate, methacrylic acid wide a vinegar, methacrylic acid 1>3_dichloropropionate, A Base acrylic acid: benzene vinegar, phenyl acrylate and pentyl bromide methacrylate. Other suitable compounds include compounds with high refractive index (relative to common polymers) such as polyetheretherketone mf IW (PEEK And acrylate or methacrylate functional macromonomer of polyether oxime. When organic cerium compound is used as component (1), the selected compound is also determined depending on the use of the cured product. The invention comprises an average of at least one: an organic decane or an organopolyoxyl which may be a monomer, an oligomeric, polymeric, "may be a mixture of monomers and/or = dipolymers. Equal-radical polymerizable compounds are generally referred to as macromonomers. There are carrageenes," two are: J groups may contain monofunctional or polyfunctional units. This allows for the formation of mounds + n卞/Knife polymer, various racks and spares! = Polymer network. Monomers and oligomers can be Any monomer or oligomer commonly used to prepare addition or condensation, or 127115.doc -14- 200844117 which may be a monomer or oligomer for other types of curing reactions, The restriction is that it contains at least one radical polymerizable group. Suitable organic germanium monomers include compounds having a structure generally corresponding to the formula R"nSi(〇R",) 4 n wherein n has a 〇 to 4 a value within the range; and wherein at least one of the R" or R''' groups contains a free radical polymerizable group. The r" and R''' groups may independently be a hydrogen atom; or an organic group Groups include alkyl, haloalkyl, aryl, haloaryl, dilute, block, acetoacetate functional groups and methacrylate functional groups. R" and R,,, groups may also contain other organic s-b groups, including glycidyl, amine, sulfhydryl, cyanate, isocyano, ester, carboxylic acid, carboxylate , succinate group, anhydride group, sulfhydryl group, thiosyl group, azide group, linonic acid group, (tetra) fluorenyl group and thiol group. Representative examples of the radical polymerizable organic 7 monomer include compounds such as 3-mercaptopropenyloxypropyltrimethoxydecane, 3-methyl acetoxymethyltrimethoxyxanthine, 3-methylpropene oxypropyldiethyl I t-decane, 3-propenyloxypropyltrimethoxydecane, 3-propenyloxymercaptotrimethoxydecane, 3·methylpropene oxime Oxypropyl trimethyl sulfonium, 3-propenyl methoxy propyl triethoxy sulphur, 3 propyl methoxy propyl dimethyl decane, vinyl trimethoxy decane, allyl Trimethoxy oxime. Burning, dipyridyl trimethoxy sulphur, 肆 _ (lean propoxyoxy), 肆 _ (3 _ _ _ -1- -1- oxy), _ _ (3_ butene Alkyloxy)methylxanthene, bis(3-butylenyl-p-oxy)dimethylcarbazide and 3·butylphosphonium+oxytrimethylstroxane. Other examples include the above described exemplified bis-oxyalkyl functional analogs (such as 3-methylpropenyloxypropylmethyldimethoxy 127115.doc -15- 200844117) Shixia), an oxo-functional analog such as 3-methylpropenyloxypropyldimethylmethoxynonane. Such also includes halohalogen precursors of such monomers, such as 3-methylpropenyloxypropyltrichloromethane, decyl propylene methoxy propyl methyl dichasite, and 3-methyl Propylene methoxypropyl dimethyl gas smoldering. Preferred radical polymerizable moieties of these organic dream compounds are aliphatic unsaturated groups in which the double bond is located at the terminal position and the internal position i with respect to the functional group. The most preferred radical of the organic hydrazine compound is a acrylate group or a methacrylate group. When the radical polymerizable monomer, oligomer or polymer is an organic oxime component, the component may be an organic polyoxane having a linear, branched, hyperbranched or resinous structure. The compound can be homopolymerized or copolymerized. The organic polyfluorene free radical polymerizable moiety may be an unsaturated organic group such as an alkenyl group having 2 to 12 carbon atoms, which is exemplified by a vinyl group, an allyl group, a butenyl group or a hexenyl group. The unsaturated organic group may also contain an alkynyl group having 2 to 12 carbon atoms as exemplified by an ethynyl group, a propynyl group or a butyl group. The unsaturated organic group may have a radical polymerizable group such as a diloxypropoxyalkylene group or a pharmaceutically acceptable analog thereof on the oligomeric or polymeric polyether moiety. The radical polymerizable organic group may contain an acryloxyalkyl group such as a propylene methoxymethyl group and an acryloxypropyl group, and a methoxymethyl group such as methacryloxymethyl group and methacryloxypropyl group. An acrylate functional group or a methacrylate functional group exemplified by the mercapto acryloxyalkyl group. The unsaturated organic group can be located at the end position, the side position, or both the terminal and the side position relative to the polymer backbone. The preferred free radicals for the monomer, the merging, and the polymeric organic quaternary compound are the acrylic acid s group and the methyl acrylate acid group. 127115.doc -16- 200844117 Any remaining second bonded organic group can be a monovalent organic group free of aliphatic unsaturation. The monovalent organic group may have 20 carbon atoms, preferably 丨_1 〇 one carbon atom, and is exemplified by an alkyl group such as methyl, ethyl, propyl, pentyl, octyl, and ten. a base and an octadecyl group; a cycloalkyl group such as a cyclohexyl group; an aryl group such as a phenyl group, a tolyl group, a xylyl group, a benzyl group and a 2-phenylethyl group; an alkoxy poly(oxyalkylene) group , such as propoxy poly(oxyethyl), propoxy poly(oxypropyl), propoxy-poly(oxypropionyl)-co-poly(oxyethyl) group, a substituted analog; a cyano functional group, including a cyanoalkyl group such as a cyanoethyl group and a cyanopropyl group; a carbazolyl group such as a 3-(N-carbazolyl)propyl group; an arylamino functional group , such as diphenylamino)phenyl-3-propyl; and halogenated hydrocarbon groups such as 3,3,3-trifluoropropyl, 3-chloropropyl, dichlorophenyl and 6,6,6,5,5 , 4, 4, 3, 3-nonafluorohexyl. The consistency of the radical polymerizable organic hydrazine compound is self-contained at 25. The fluid with a viscosity of 0.001 Pa.s is changed between the gums and the gel. The radical polymerizable organic hydrazine compound may also be a solid which becomes flowable at a high temperature or by application of shear. Component (1) comprises an organopolyoxane fluid having the formula: (a) R13SiO(R12Si〇)a(R1R2si〇)bsiR13, (b) R32R4SiO(R32Si〇)c(R3R4si〇)dSiR32R4, or (C) a combination of fluids. In this equation, the subscript a has an average value of zero to 2〇5〇〇〇, the subscript b has an average value of 1 to 20,000, the subscript 〇 has an average value of zero to 2〇, and The subscript d has an average value of zero to 20, 〇〇〇. Each group is independently a monovalent organic group. The R2 group is independently an unsaturated monovalent organic group. Han 3 Ji 127115.doc -17- 200844117 The group can be the same as the R1 group. Each R4 is independently an unsaturated organic group. Suitable R1 groups are monovalent organic groups including the following: acrylic functional groups such as propylene methoxymethyl, acryloxypropyl, methacryloxymethyl, methacryloxypropyl Alkyl; such as methyl, ethyl, propyl, and butyl, alkenyl, such as vinyl, allyl and butyryl; alkynyl, such as ethynyl and propynyl; aromatic group, Such as phenyl, tolyl and xylyl; cyanoalkyl, such as cyanomethyl, cyanoethyl and cyanopropyl; halogenated hydrocarbyl, such as 3,3,% trifluoropropyl, 3-chloropropane , dichlorophenyl and 6,6,6,5,5,4,4,3,3-nonafluorohexyl; alkenyloxy poly(oxyalkylene) group, such as allyloxy (polyoxyl) Base ethyl), allyloxy poly(oxypropyl) and allyloxy-poly(oxypropenyl)-co-poly(oxyethyl) groups; alkoxy poly(oxyalkylene) a group such as propoxy (polyoxyethyl), propoxy poly(oxypropyl) and propoxy-poly(oxypropenyl)-co-poly(oxyethyl) Group; _-substituted alkoxy poly Oxyalkylene group, such as perfluoropropoxy (polyoxyethyl), perfluoropropoxy poly(oxypropyl), and perfluoropropoxy-poly(oxypropyl) a poly(oxyethyl) group; an alkoxy group such as methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy and ethylhexyloxy; aminoalkyl, Such as 3-aminopropyl, 6-aminohexyl, fluorenyl-aminoundecyl, 3-(N-allylamino)propyl, N-(2-aminoethyl)-3-amino Propyl, N-(2-aminoethyl)-3-aminoisobutyl, p-aminophenyl, 2-ethylpyridine and 3-propylphosphonyl; epoxyalkyl, such as 3-glycidoxypropyl, 2-(3,4,-epoxy(hexyl)ethyl) and 5,6-3⁄4lacylhexyl; vinegar functional groups such as ethoxylated fluorenyl and phenylhydrazine a methoxyl group; a hydroxy functional group such as a hydroxy group and a 2- to 127115.doc -18- 200844117 ethyl group; an isocyanate and a masking isocyanate functional group such as a 3-isocyanatepropyl group, a para-isocyanate 3 -propyl ester, propyl methacrylate - butyl ester and propyl ethyl carbamate group, aldehyde function Bases such as eleven and butyraldehyde groups; anhydride functional groups such as 3-propyl succinic anhydride and 3-propyl maleic anhydride groups; carboxylic acid functional groups such as 3-carboxypropyl and 2-carboxyl a carbazolyl group such as 3-(N-carbazolyl)propyl; an arylamino functional group such as 4-(N,N-diphenylamino)phenyl-3-yl propyl; Metal salts such as 3-di-propylpropyl and 2-carboxyethyl, rhodium, or y-salt. The R2 group is exemplified by the following groups: alkenyl groups such as vinyl, allyl and butenyl, alkynyl groups such as ethynyl and propynyl; and acrylic functional groups such as acryloxypropyl and a Alkyl methoxypropyl. The Han 3 group can be the same as the R1 group. The R4 group is exemplified by alkenyl groups such as vinyl, allyl and butenyl; alkynyl groups such as ethynyl and propynyl; alkenyloxy poly(oxyalkylene) groups such as alkenyl Propoxy (polyoxyethyl), allyloxy poly(oxypropyl) and allyloxy-poly(oxypropionyl)-co-poly(oxyethyl) groups; and acrylic acid Functional groups such as propylene methoxymethyl, propyloxypropyl, methacryloxymethyl and methacryloxypropyl. Some representative organopolyoxane fluids suitable for use as component (1) include: methacryloxypropyl propyl dimethyl dimethyl alkyl terminated polydimethyl siloxane, methacryloxymethyl methyl _Dimethyl decyl terminated polydimethyl siloxane, α, ω-propylene methoxy propyl dimethyl dimethyl alkyl terminated polydimethyl siloxane, α, ω propylene oxy Methyl-dimethyl decyl terminated polydimethyl siloxane, flanked by acrylate functional polymer and thiol acrylate functional poly 127115.doc -19- 200844117
合物,諸如聚(丙浠醯氧基丙基-甲基石夕燒氧基)_聚二甲基 矽氧烷共聚物及聚(甲基丙烯醯氧基丙基-甲基石夕烧氧基)_ ^一甲基碎氧烧共聚物;及具有多個丙稀酸@旨官能基或甲 基丙烯酸酯官能基之遠螯(telechelic)聚二甲基石夕氧烧,諸 如經由多丙烯酸酯單體或多甲基丙烯酸酯單體MichaelM 成至胺封端聚二甲基石夕氧烧而形成的組合物。此等官能化 反應可預先或原位進行。a compound such as poly(propenyloxypropyl-methyl oxalate alkoxy)-polydimethyl methoxy hydride copolymer and poly(methacryloxypropyl propyl-methyl sulphur oxide a methicone-based oxy-oxygenated copolymer; and a telechelic polydimethyl-enriched gas having a plurality of acrylates/functional or methacrylate functional groups, such as via polyacrylic acid A composition formed by ester monomer or polymethacrylate monomer MichaelM to an amine terminated polydimethyl oxalate. These functionalization reactions can be carried out in advance or in situ.
了此茜要使用在官能度及/或自由基可聚合基團之性質 方面不同之有機聚矽氧烷流體的混合物。舉例而言,相對 於具有類似聚合度(DP)之二·官能甲基丙烯醯氧基丙基-二 甲基矽烷基封端聚二甲基矽氧烷,經由使用藉由N_(甲基) 〃丁基一甲基矽烷基封端聚二甲基矽氧烷與兩莫耳當量 之三經甲基丙烧三·丙烯酸醋之Michael加成反應而製備的 四官能遠整聚二甲基錢貌作為組合物之成份⑴,可獲得 快得多的交聯效率及降低的溶膠含量。然而,r官能甲基 丙烯醯乳基丙基_二甲基㈣基封端聚二甲基石夕氧烧之組 合物亦產生較低模數的彈性體薄膜。因此,具有不同結構 之成份⑴的組合可能相當適用。用於製備此等有機聚石夕氧 烧流體之方法為已知的’且包括相應有機函切院之水解 及縮合或環狀聚二有機矽氧烷之平衡。 成份⑴可為包括以 5 · 下各物之有機矽氧烷樹脂:含有 R 3Si〇i/2單元及错一 及Sl〇4/2早兀之mQ樹脂;含有]^Si〇3/2單 及R52Si〇2/2單元之3/2早凡 ^ x 树知,含有R53si〇1/2單元及R5Si0 早兀之MT樹脂;含有 有R山。…皁元、R5si〇3 2單元及 127115.doc •20- 200844117 R 2Si〇2/2單tl之MTD樹脂;或其組合。此等有機矽氧烷樹 月曰中之各R基團代表單價有機基團。單價有機基團R5可具 有1-20個碳原子,或者1-1〇個碳原子。 代表R5基團之合適單價有機基團的一些實例包括:丙烯 酸S曰g能基,諸如丙烯醯氧基烷基;曱基丙烯酸酯官能 基,諸如甲基丙烯醯氧基烷基;氰基官能基;及單價烴基 團。單價烴基團包括:烷基,諸如甲基、乙基、丙基、戊 基、辛基、十一基及十八基;環烷基,諸如環己基;烯 基,諸如乙烯基、烯丙基、丁烯基及己烯基;炔基,諸如 乙炔基、丙炔基及丁炔基;芳基,諸如苯基、曱苯基、二 曱笨基、苄基及2-苯乙基;_化烴基,諸如3,3,3_三氟丙 基、3-氣丙基、二氯苯基及6,6,6,5,5,4,4,3,3_九氟己基;及 氰基官能基,包括諸如氰基乙基及氰基丙基之氰基烷基。 R5基團亦可包含:烷氧基聚(氧基伸烷基)基團,諸如丙 氧基(聚氧基伸乙基)、丙氧基聚(氧基伸丙基)及丙氧基-聚 (氧基伸丙基)-共-聚(氧基伸乙基)基團;齒素取代之烷氧基 聚(氧基伸烷基)基團,諸如全氟丙氧基(聚氧基伸乙基)、 全氟丙氧基聚(氧基伸丙基)及全氟丙氧基-聚(氧基伸丙基)_ 共-聚(氧基伸乙基)基團;烯氧基聚(氧基伸烷基)基團,諸 如烯丙氧基聚(氧基伸乙基)、烯丙氧基聚(氧基伸丙基)及 烯丙氧基-聚(氧基伸丙基)-共-聚(氧基伸乙基)基團;烷氧 基’諸如甲氧基、乙氧基、正-丙氧基、異丙氧基、正-丁 氧基及乙基己氧基;胺基烷基,諸如3-胺基丙基、6-胺基 己基、11-胺基十一基、3-(N-烯丙基胺基)丙基、N-(2-胺 127115.doc -21 - 200844117It is desirable to use a mixture of organopolyoxane fluids that differ in the nature of the functionality and/or free radical polymerizable groups. For example, by using a di-functional methacryloxypropyl-dimethyl decyl-terminated polydimethyl siloxane having a similar degree of polymerization (DP), by using N_(methyl) Tetrafunctional far-polydimethylphenol prepared by the addition reaction of 〃butyl-methyl-methyl-alkyl-terminated polydimethyl siloxane with two molar equivalents of Michael methacrylate As a component of the composition (1), a much faster crosslinking efficiency and a reduced sol content can be obtained. However, the r-functional methacryloyl propyl propyl-dimethyl(tetra)-terminated polydimethyl-osin-oxygenated composition also produces a lower modulus elastomer film. Therefore, a combination of components (1) having different structures may be quite suitable. The methods used to prepare such organic polyoxo-fired fluids are known and include the equilibrium of the corresponding organic digestion and condensation or cyclic polydiorganosiloxane. The component (1) may be an organic oxirane resin comprising the following: an mQ resin containing R 3Si〇i/2 unit and the wrong one and S1〇4/2 early; containing] ^Si〇3/2 single And R52Si〇2/2 unit 3/2 early Fan ^ x know, including R53si〇1/2 unit and R5Si0 early MT resin; contains R mountain. ...sapons, R5si〇3 2 units and 127115.doc • 20- 200844117 R 2Si〇2/2 single ttl MTD resin; or a combination thereof. Each of the R groups in the organic oxime tree sorghum represents a monovalent organic group. The monovalent organic group R5 may have 1 to 20 carbon atoms, or 1 to 1 carbon atoms. Some examples of suitable monovalent organic groups representing the R5 group include: an acrylic acid S-g-energy group, such as an acryloxyalkyl group; a mercapto acrylate functional group, such as a methacryloxyalkyl group; a cyano function a base; and a monovalent hydrocarbon group. The monovalent hydrocarbon group includes: an alkyl group such as methyl, ethyl, propyl, pentyl, octyl, undecyl and octadecyl; a cycloalkyl group such as a cyclohexyl group; an alkenyl group such as a vinyl group, an allyl group , butenyl and hexenyl; alkynyl, such as ethynyl, propynyl and butynyl; aryl, such as phenyl, indolyl, diphenyl, benzyl and 2-phenylethyl; Hydrocarbyl groups such as 3,3,3-trifluoropropyl, 3-apropylpropyl, dichlorophenyl and 6,6,6,5,5,4,4,3,3-nonafluorohexyl; Base functional groups including cyanoalkyl groups such as cyanoethyl and cyanopropyl. The R5 group may also comprise: an alkoxy poly(oxyalkylene) group such as propoxy (polyoxyethyl), propoxy poly(oxypropyl) and propoxy-poly (oxy) a propyl-co-poly(oxyethyl) group; a acyl-substituted alkoxy poly(oxyalkylene) group, such as perfluoropropoxy (polyoxyethyl), perfluoro Propoxy poly(oxypropyl) and perfluoropropoxy-poly(oxypropenyl)-co-poly(oxyethyl) groups; alkenyloxy poly(oxyalkylene) groups, Such as allyloxy poly(oxyethyl), allyloxy poly(oxypropyl) and allyloxy-poly(oxypropionyl)-co-poly(oxyethyl) groups; Alkoxy' such as methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy and ethylhexyloxy; aminoalkyl such as 3-aminopropyl, 6 -aminohexyl, 11-aminoundecyl, 3-(N-allylamino)propyl, N-(2-amine 127115.doc -21 - 200844117
基乙基)-3-胺基丙基、Ν-(2•胺基乙基)-3_胺基異丁基、對_ 胺基苯基、2-乙基η比啶及丙基σ比咯基團;受阻胺基烷 基’諸如四甲基六氫吡啶基氧基丙基;環氧基烷基,諸如 3-縮水甘油氧基丙基、2_(3,4,_環氧基環己基)乙基及5,6-環 氧基己基;酯官能基,諸如乙醯氧基甲基及苯甲醯氧基丙 基;羥基官能基,諸如羥基及2_羥基乙基;異氰酸酯及遮 蔽異氰酸酯官能基,諸如3_異氰酸酯基丙基、參_異三聚氰 酸3-丙酯、胺基甲酸丙基·第三丁酯及胺基甲酸丙基乙酯基 團,搭官能基,諸如十一醛及丁醛基團;酐官能基,諸如 3丙基琥珀酸酐及3 -丙基順丁浠二酸酐基團;羧酸官能 基’諸如3-羧基丙基、2-羧基乙基及ίο-羧基癸基;咔唑 基’諸如3-(Ν-咔唑基)丙基;芳基胺基官能基,諸如4_ (Ν,Ν-二苯胺基)苯基_3_丙基;及羧酸之金屬鹽,諸如弘羧 基丙基及2 -魏基乙基之辞、鈉及鉀鹽。 有機矽氧烷樹脂可含有平均1-40莫耳百分比之諸如不飽 矛有機基團之自由基可聚合基團。不飽和有機基團可為烯 基、炔基、丙烯酸酯官能基、甲基丙烯酸酯官能基或此等 基團之組合。不飽和有機基團在有機矽氧烷樹脂中之莫耳 百分比在本文中係視為⑴樹脂中含有矽氧烷單元之不飽和 基團之莫耳數與(ii)樹脂中矽氧烷單元之總莫耳數之比乘 以係數100。可用作成份⑴之合適有機矽氧烷樹脂的一些 特定實例為Mf *丙”氧基甲基Q樹脂、㈣“基Q樹脂、 氧基甲基 τ苯基Τ樹脂、MDTU㈣酿氧基丁樹脂、π 稀基rjp笨基 127115.doc -22- 200844117Base ethyl)-3-aminopropyl, hydrazine-(2•aminoethyl)-3-aminoisobutyl, p-aminophenyl, 2-ethyl η-pyridine and propyl σ ratio a thiol group; a hindered aminoalkyl group such as tetramethylhexahydropyridyloxypropyl; an epoxyalkyl group such as 3-glycidoxypropyl, 2_(3,4,-epoxy ring) Ethyl)ethyl and 5,6-epoxyhexyl; ester functional groups such as ethoxymethyl and benzyl methoxy propyl; hydroxy functional groups such as hydroxy and 2-hydroxyethyl; isocyanate and masking Isocyanate functional groups, such as 3-isocyanatopropyl, 3-propyl isopropyl isocyanate, propyl methacrylate, and propyl propyl carbamate groups, pendant functional groups, such as Decylaldehyde and butyraldehyde groups; anhydride functional groups such as 3-propyl succinic anhydride and 3-propyl cis-butane phthalic anhydride groups; carboxylic acid functional groups such as 3-carboxypropyl, 2-carboxyethyl and ίο- Carboxyfluorenyl; oxazolyl 'such as 3-(indolylcarbazolyl)propyl; arylamino functional group, such as 4-(indolyl-diphenylamino)phenyl-3-yl propyl; and carboxylic acid Metal salts such as hydroxypropyl and 2-wei The ethyl speech, the sodium and potassium salts. The organodecane resin may contain an average of 1 to 40 mole percent of a radical polymerizable group such as an unsaturated organic group. The unsaturated organic group can be an alkenyl, alkynyl, acrylate functional, methacrylate functional group or a combination of such groups. The molar percentage of the unsaturated organic group in the organodecane resin is herein considered to be (1) the number of moles of the unsaturated group containing a siloxane unit in the resin and (ii) the siloxane unit in the resin. The ratio of the total number of moles is multiplied by a factor of 100. Some specific examples of suitable organic siloxane oxide resins useful as component (1) are Mf*propenyloxymethyl Q resin, (iv) "based Q resin, oxymethyl τ phenyl hydrazine resin, MDTU (tetra) oxybutylene resin, π Rare base rjp stupid base 127115.doc -22- 200844117
樹脂、TT 月旨、TT甲基丙烤酿氧基丙基 才封月旨、T苯基τ’Resin, TT, TT, methyl propylene, oxypropyl, phenyl thiophene
基丙稀酿氧基甲基4士I Η匕 rr-i笼A —— 樹月曰、T ‘T甲基W酿氧基丙基樹脂、丁丁苯基丁甲基丙締酿氧 基甲基樹脂及TT笨基T甲基内稀酿氧基丙基此„匕 树月曰,其中Μ、D、T及Q具 有如下文所定義之含義。 八 本文所使用之符號]yj、D、τ乃主 了及Q代表包括有機矽流體、 树月旨及其固化產物之平古她 # 人 為石夕氧燒之結構單元的官能基。 根據聚氧j工章中ρ途 + > 建之理解來使用該等符號。Μ代表 車官能單元RdiO"2 ; d代表-官处里__ D 一 '衣一吕月匕早兀R2Si02/2 ; τ代表 二官能單元RSiOh2 ;且d代表官处留一 代表四B月匕早疋SiOw ;其中及代 表單價原子或基團,諸如下 如下文所描述之R5。下文展示此等 單元之結構式。Propylene oxymethyl 4 II Η匕rr-i cage A —— Shuyue T, T 'T methyl W ethoxypropyl resin, butyl butyl butyl methyl propyl ethoxymethyl resin and TT Stupid T-methyl intrinsic oxypropyl 此 匕 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 D D D And Q represents the functional group of the structural unit including the organic hydrazine fluid, Shuyue and its solidified product, Pinggu. #人为石夕氧烧. According to the understanding of the construction of ρ途+ > These symbols: Μ represents the car functional unit RdiO"2; d represents - official office __ D a 'yiyi Luyue 匕 early R2Si02/2; τ represents the difunctional unit RSiOh2; and d represents the official one to represent four B The ruthenium is 疋 SiOw; and represents and represents a monovalent atom or group, such as R5 as described below. The structural formula of these units is shown below.
01 cis-irm) R ό I ) -si—R(D) o ο 一 Is-ο— i I T I ( o 卜 ) •ο—si—ο-Q)I ( ο ο 製備此等有機矽氧烷樹脂之方法為已知的,包括藉由用 含有烯基之封端試劑來處理藉由矽石水溶膠封端方法而產 生之樹脂共聚物來製得樹脂,如美國專利2,676,182(1954 年4月20日)中所描述。此方法涉及在酸性條件下使石夕石水 命膠與諸如二甲基氣⑦烧之可水解三有機⑦烧、諸如六甲 基二矽氧烷之矽氧烷或其混合物反應,接著回收具有厘及 Q單元之共聚物。共聚物通常含有約2-5重量百分比之羥 基。接著可藉由使共聚物與足以在產物中提供3_3〇莫 127115.doc -23- 200844117 分比之不飽和有機基團之量的含有不飽和有機基團之封端 劑反應及與無脂族不飽和性之封端劑反應來製備含有小於 2重量百分比之矽鍵結羥基的有機矽氧烷樹脂。一些合適 的封端劑包括矽氮烷、矽氧烷及矽烷,且較佳封端劑描述 於美國專利4,584,355(1986年4月22日)、美國專利 4,585,836(1986年4月29日)及美國專利4,591,622(1986年5 月22日)中。可使用單一封端劑或封端劑之混合物來製備 此等有機矽氧烷樹脂。01 cis-irm) R ό I ) -si—R(D) o ο I Is-ο- i ITI ( o Bu) • ο—si—ο-Q)I ( ο ο Preparation of these organic decane resins The method is known, which comprises preparing a resin by treating a resin copolymer produced by a vermiculite hydrosol capping process with an alkenyl-containing capping agent, as in U.S. Patent 2,676,182 (1954) (December 20). This method involves the hydrolysis of Shishishi aquatic glue with a hydrolyzable triorgano 7-burning such as dimethyl benzene, such as hexamethyldioxane under acidic conditions. Or a mixture thereof, followed by recovery of a copolymer having a PCT unit. The copolymer typically contains from about 2 to about 5 weight percent of a hydroxyl group. This can be followed by providing the copolymer with sufficient 3 to 3 〇 127115.doc -23 - 200844117 reacting an unsaturated organic group-containing blocking agent in an amount relative to the unsaturated organic group and reacting with a non-aliphatic unsaturation blocking agent to prepare a less than 2 weight percent ruthenium-bonded hydroxyl group Organic oxirane resins. Some suitable blocking agents include decazane, decane and decane, and are preferred. The capping agent is described in U.S. Patent No. 4,584,355 (April 22, 1986), U.S. Patent No. 4,585,836 (Aug. 29, 1986), and U.S. Patent No. 4,591,622, issued May 22, 1986. Or a mixture of blocking agents to prepare such organodecane resins.
C 另一類型的可用作成份⑴之有機矽化合物為藉由使具有 聚合主鏈之有機化合物與有機聚矽氧烷共聚而形成的組合 物,其中每分子併有平均至少一個自由基可聚合基團。一 些合適的有機化合物包括:以烴為主之聚合物,諸如聚異 丁烯、聚丁二烯及聚異戍二烯;聚烯烴,諸如聚乙烯、聚 丙烯及聚乙烯聚丙烯共聚物;聚苯乙烯;苯乙烯丁二烯; 及丙烯腈丁二烯苯乙烯;聚丙烯酸酯;聚醚,諸如聚氧化 乙烯或聚氧化丙烯;聚酯,諸如聚對苯二甲酸乙二酯或聚 對苯二甲酸丁:8旨;聚醯胺;聚碳酸自旨;聚醯亞胺.聚 脲;聚甲基丙婦酸醋;聚嗟吩…t聚苯胺;聚乙 炔;聚伸苯基伸乙稀基;聚乙稀π比咬;及部分氟化或全氟 化聚合物,諸如聚四氟乙稀;氟化橡膠;終端不飽和煙. 烯烴,及聚烯烴。有機化合物可為此等 的共聚物,包括含有多有機官能基、多有 ==燒與有機化合物之組合的聚 : 構之重…排列可自無規的、接枝的變化為實際上= 127115.doc -24- 200844117 的。 除了具有平均至少一個自由基可聚合基團以外,成份⑴ 了 /、有物理轉移溫度、帶有具有物理轉移溫度之有機官能 基,或在自聚合或交聯後形成具有物理轉移溫度(亦即, 玻璃轉移或熔融轉移)之粒子使得組合物在使用條件下在 達到特定溫度時經歷由軟化或黏度非線性降低標記之改 變。此等材料特別可用於囊封經引入熱量而釋放之活性 牛例而。,成份⑴之以有機聚石夕氧燒為主之型式可為 有機官能聚石夕氧躐。躐可為未交聯有機官能聚石夕氧躐、交 聯有機官能聚矽氧蠟或蠟之組合。諸如此等蠟之聚矽氧蠟 可購得且描述於美國專利6,620,515(2〇〇3年9月16日)中。 田有機g月匕聚矽氧蠟具有至少一個諸如丙烯酸酯或曱基丙 =酸酯基團之自由基可聚合基團日夺,該蠟可在用作成份⑴ 時可用以料相變。成份⑴亦可包含上文所描述之有機化 口物、有機矽化合物及/或有機聚矽氧烷化合物中之任何 者的混合物。 抑成伤(1)之#代表性實例包括丙烯酸及甲基丙稀酸有機 單體彳“b單體及大分子單體。並且,亦可包括(甲基) 丙烯酉夂S切氧燒線性聚合物、樹脂及共聚物作為成份 ()/、特別可用於调整諸如表面能、模數、熱穩定性、 抗濕性及疏水平衡之特性。 有機硼烷胺錯合物(ii) 有機硼烧胺錯合物(ii)為有機硼烧與可使錯合物在周圍 條件下·、疋之合適胺化合物之間形成的錯合物。錯合物 127115.doc -25- 200844117 (ii)應能夠藉由引入胺反應性化合物及/或藉由在氧存在下 加熱來引發成份⑴之聚合或交聯。實例為由三烷基硼烷及 各種胺化合物形成之炫基硼烧胺錯合物。可用於形成成份 (Π)之三烷基硼烷的實例包括式BR"3之三烷基硼烷,其中 R"代表含有1至20個碳原子之直鏈及分支鏈脂族或芳族烴 基。一些實例包括三乙基硼烷、三-正-丁基硼烷、三_正_ 辛基硼烷、三_第二-丁基硼烷、三-十二基硼烷及苯基二乙 基獨烧。C. Another type of organic ruthenium compound usable as the component (1) is a composition formed by copolymerizing an organic compound having a polymerized main chain with an organopolysiloxane, wherein an average of at least one radical polymerizable group per molecule group. Some suitable organic compounds include: hydrocarbon-based polymers such as polyisobutylene, polybutadiene and polyisoprene; polyolefins such as polyethylene, polypropylene and polyethylene polypropylene copolymers; polystyrene Styrene butadiene; and acrylonitrile butadiene styrene; polyacrylate; polyether, such as polyethylene oxide or polypropylene oxide; polyester, such as polyethylene terephthalate or polyterephthalic acid D: 8; polyamine; polycarbonate; polyimine; polyurea; polymethyl acetoacetate; polyporphyrin ... t polyaniline; polyacetylene; polyphenylene thiophene; Ethylene π ratio biting; and partially fluorinated or perfluorinated polymers such as polytetrafluoroethylene; fluorinated rubber; terminally unsaturated fumes. Olefin, and polyolefin. The organic compound may be a copolymer of such a kind, including a polyorganofunctional group containing a combination of a plurality of == burn-and-organic compounds; the arrangement may be self-regular, the change of grafting is actually = 127115 .doc -24- 200844117. In addition to having an average of at least one radical polymerizable group, the component (1) has / has a physical transfer temperature, has an organic functional group having a physical transfer temperature, or has a physical transfer temperature after self-polymerization or crosslinking (ie, The particles of the glass transfer or melt transfer cause the composition to undergo a change in the mark by the softening or viscosity non-linearity reduction at the specified temperature under the conditions of use. These materials are particularly useful for encapsulating active cattle that are released by the introduction of heat. The composition of the component (1), which is mainly composed of organic polyox, can be an organofunctional polysulfide. The hydrazine may be a combination of an uncrosslinked organofunctional polyoxoquinone, a crosslinked organofunctional polyoxyxide wax or a wax. Polyxime waxes such as such waxes are commercially available and are described in U.S. Patent 6,620,515 (September 16, 2003). The field organic polyfluorene wax has at least one radical polymerizable group such as an acrylate or mercaptopropionate group, and the wax can be used as a phase change when used as the component (1). Component (1) may also comprise a mixture of any of the above-described organic physicochemicals, organic hydrazine compounds and/or organopolyoxyalkylene compounds. Representative examples of the inhibitory injury (1) include acrylic acid and methacrylic acid organic monomer 彳 "b monomer and macromonomer. Also, may include (meth) propylene sulfonium S oxyalkylation linear Polymers, resins and copolymers are used as components ()/, especially for adjusting properties such as surface energy, modulus, thermal stability, moisture resistance and hydrophobic balance. Organoboraneamine complex (ii) Organic boron burning The amine complex (ii) is a complex formed between the organic boron and the suitable amine compound which can make the complex under ambient conditions. The complex 127115.doc -25- 200844117 (ii) should The polymerization or cross-linking of the component (1) can be initiated by introducing an amine-reactive compound and/or by heating in the presence of oxygen. Examples are leucoboramine complexes formed from trialkylboranes and various amine compounds. Examples of the trialkylborane which can be used to form the component (Π) include a trialkylborane of the formula BR", wherein R" represents a linear or branched aliphatic or aromatic group having from 1 to 20 carbon atoms. Hydrocarbyl group. Some examples include triethylborane, tri-n-butylborane, tri-n-octylborane, three Two - butyl borane, tris - dodecyl diethyl borane and phenyl group alone burn.
一類描述於2006年7月13日申請之同在申請中之公開申 請案WO 2006/073695中的有機矽官能硼化合物亦可用作有 機硼烷胺錯合物之有機硼烷組份,該申請案之標題為 "Organosilicon Functional Boron Amine Catalyst Complexes and Curable Compositions Made Therefrom-J. ^ m ^ ^ ^ 本申請案相同的受讓人。通常,&等化合物由具有含有: 少-個梦原子之有_官能有機㈣部分的錯合物租成, 且石夕原子係以切原子基團、切氧料聚物基團或 乳炫聚合物基團之形式存在於錯合物之有 ㈣分中。如同在中請中之中請案中所陳述,#中== 矽B旎硼胺催化劑錯合物為具有下式之化合物: 、 R6 严 R7^BT^N—R10 R8 、R11 由以下各基團組 其中B代表蝴;R6、R7及以為獨立地選自 127115.doc -26- 200844117 成之群的基團·氫,環烧基,在主鏈上具有工至2〇個碳原 子=直鏈或分支鏈燒基,烧基芳基,有機石夕烧基團,有機 夕氧烷基團’能夠充當至硼原子之共價橋的伸烷基,能夠 充田至硼原子之共價橋的二價有機矽氧烷基團及其齒素取 代同系物,其限制條件為R6、R7或R8基團中之至少一者 . 纟有—或多個石夕原子,且含石夕基團係共價鍵結至删;R9、An organogermanium-functional boron compound of the type disclosed in WO 2006/073695, which is hereby incorporated by reference in its entirety in its entirety, in The title of the case is "Organosilicon Functional Boron Amine Catalyst Complexes and Curable Compositions Made Therefrom-J. ^ m ^ ^ ^ The same assignee of this application. In general, a compound such as & is rented from a complex having a _ functional organic (four) moiety containing: a few dream atoms, and the diarrhea atom is a cleavage atom group, an oxidative polymer group or a milk The form of the polymer group is present in the (4) part of the complex. As stated in the request, the #中==矽B旎boramine catalyst complex is a compound of the formula: R6, R6^BT^N-R10 R8, R11 from the following groups Group B, where B represents a butterfly; R6, R7, and a group selected from the group consisting of 127115.doc -26- 200844117, hydrogen, cycloalkyl, having up to 2 carbon atoms in the main chain = straight A chain or branched chain alkyl group, an alkyl group, an organic group, an organooxo group can act as an alkyl group to a covalent bridge of boron atoms, and can cohere to a covalent bridge of boron atoms. a divalent organic oxoalkyl group and a dentate-substituted homolog thereof, the restriction condition being at least one of the R6, R7 or R8 groups. 纟- or a plurality of shixi atoms, and containing a group Covalent bond to delete; R9,
Rio及Rii為產生能夠錯合狀胺化合物或聚胺化合物的基 p 團,且其中R6、R7或R8基團中之兩個或兩個以上與R9、 ㈣或Rl 1基團中之兩個或兩個以上為使得其可組合形成雜 環結構,其限制條件為兩個組合基團之原子數總和不超過 11個。必要時可參考同在巾請中之申請案以獲得額外細 節。 可用於與有機硼烷化合物形成有機硼烷胺錯合物(ii)之 胺化合物的一些實例包括有機胺化合物,諸如1,3_丙二 胺、1,6-己二胺、甲氧基丙胺、吡啶及異佛爾酮二胺。可 C 用於形成有機硼烷胺錯合物之胺化合物的其他實例描述於 美國專利6,777,512(2〇〇4年8月17曰)以及美國專利 6’806,330(2004年 10月 19 日)中。 . 含石夕胺化合物亦可用以形力包括諸如以下之胺基石夕烧的 . #機硼烷胺錯合物:3-胺基甲基三甲氧基矽烷、3_胺基丙 基一甲氧基矽烷、3-胺基甲基三乙氧基矽烷、3_胺基丙基 三乙氧基矽烷、2-(三曱氧基矽烷基乙基)吡啶、胺基丙基 矽烧三醇、3_(間-胺基苯氧基)丙基三甲氧基石夕院、3·胺基 丙基—異丙基甲氧基矽烷、胺基苯基三甲氧基矽烷、弘胺 127115.doc -27- 200844117 基丙基參(甲氧基乙氧基乙氧基)矽烷、N-(2-胺基乙基)-3-胺基甲基三曱氧基矽烷、N_(2-胺基乙基)-3·胺基丙基三甲 氧基矽烷、N-(6-胺基己基)胺基曱基三甲氧基矽烷、N-(2-胺基乙基)-11-胺基十一基三甲氧基矽烷、(胺基乙基胺基 甲基)苯乙基三甲氧基矽烷、Ν-(2·胺基乙基)-3-胺基丙基甲 基二甲氧基矽烷、Ν·(2-胺基乙基)-3-胺基異丁基甲基二甲 氧基石夕烧及(3-三曱氧基石夕烧基丙基)二伸乙基-三胺。 胺官能有機聚矽氧烷亦可用於形成包括上文式(a)及(b) 中所描述之有機矽化合物及先前被描述為有機聚矽氧烷樹 脂之彼等化合物的有機硼烷胺錯合物(ii)。此服從於以下 規定:分子含有至少一個胺官能基,諸如胺基丙基、胺 基甲基、2-胺基乙基、6-胺基己基、11-胺基十一基、3-(N-烯丙基胺基)丙基、n-(2-胺基乙基)-3-胺基丙基、N-(2- 胺基乙基)-3-胺基異丁基、對-胺基苯基、2_乙基吡啶及3_ 丙基σ比嘻。 特定實例包括:終端及/或侧接胺官能聚二曱基矽氧烷 寡聚物及聚合物,聚二甲基矽氧烷與聚(3,3,3_三氟丙基-甲 基矽氧烷)之終端及/或側接胺官能無規、接枝及嵌段共聚 物及共养聚物,聚二甲基矽氧烷與聚(6,6,6,5,5,4,4,3,3_九 氟己基_甲基矽氧烷)之終端及/或側接胺官能無規、接枝及 甘欠段共聚物及共寡聚物,及聚二甲基矽氧烷與聚苯基甲基 矽氧烷之終端及/或側接胺官能無規、接枝及嵌段共聚物 及共寡聚物。適用化合物之其他實例包括樹脂質胺官能矽 氧烷(諸如,先前被描述為有機聚矽氧烷樹脂之胺官能化 127115.doc -28- 200844117 合物)以及胺官能聚倍半矽氧烷。 亦可用於形成有機硼烷胺錯合物(U)之其他含氮化合物 包括N-(3 -二乙氧基碎烧基丙基)-4,5 -二氫u米嗤、脈美丙芙 三乙氧基矽烧、類似於上文所述之式(&)及(b)之式的石夕氧 烷及先前被描述為有機聚矽氧烷樹脂之彼等化合物(其中 至少一個基團為咪唑、脒或脲基官能基)。當胺化合物為 聚合物時,分子量不受限制,但其應達到維持足夠高之硼 濃度以允許組合物聚合的程度。舉例而言,在兩份系統 中,含有有機硼烷引發劑之部分可經單體或視情況經待囊 封之活性成份稀釋,或其可單獨由引發劑錯合物組成。 必要時,系統可藉由將有機硼烷胺錯合物以物理方式戋 以化學方式附著至固體粒子來穩定。此提供一種用以控制 反應時間以及使液相有機硼烷胺錯合物穩定以防在儲存期 間明顯與組合物其餘部分分離之方式。舉例而言,化學附 著可藉由以含有胺基之縮合反應性化合物(諸如胺基丙基 二甲氧基矽烷)預處理諸如經研磨矽石、沈澱矽石、碳酸 鈣或硫酸鋇之固體粒子來執行。儘管可能需要控制粒子大 小及粒子大小分布以賦予所要特性,但粒子大小不受固有 限制,且可在離散奈米粒子(亦即奈米直徑)至聚結或稠合 結構至大到毫米(mm)大小之範圍内。預處理之後進行與有 機硼烷化合物之錯合,或使用具有縮合反應性之預製有機 硼烷胺錯合物直接處理固體粒子。當固體粒子含有表面官 能基時,諸如具有固有胺反應性之表面處理劑或雜質的添 加d而要適當的預防措施以避免被附著之有機硼烷胺錯合 127115.doc -29- 200844117 物的過早解錯合。含有胺反應性物質之固體粒子可在有機 職胺錯合物附著之前經純化 百械 糾人仏 A言,有機硼烷胺 錯曰物之附著可在無氧環境中執行。Rio and Rii are group p groups capable of producing a miscible amine compound or polyamine compound, and wherein two or more of the R6, R7 or R8 groups are combined with two of the R9, (4) or Rl 1 groups. Or two or more such that they can be combined to form a heterocyclic structure, which is limited to a total of no more than 11 atomic numbers of the two combined groups. If necessary, refer to the application in the same towel for additional details. Some examples of amine compounds which can be used to form the organoborane amine complex (ii) with an organoborane compound include organic amine compounds such as 1,3-propylenediamine, 1,6-hexanediamine, methoxypropylamine. , pyridine and isophorone diamine. Other examples of amine compounds which can be used to form organoborane amine complexes are described in U.S. Patent No. 6,777,512 (Aug. 17, 2014) and U.S. Patent No. 6, 806,330 (October 19, 2004). The ceramide compound may also be used to form a force including, for example, the following amine ketone. #机硼胺胺化合物: 3-aminomethyltrimethoxydecane, 3-aminopropyl-methoxy Basear, 3-aminomethyltriethoxydecane, 3-aminopropyltriethoxydecane, 2-(trimethoxydecylalkylethyl)pyridine, aminopropyl aryl triol, 3_(m-aminophenoxy)propyltrimethoxy sylvestre, 3·aminopropyl-isopropylmethoxy decane, aminophenyl trimethoxy decane, and rhodamine 127115.doc -27- 200844117 propyl methoxy(methoxyethoxyethoxy)decane, N-(2-aminoethyl)-3-aminomethyltrimethoxy decane, N-(2-aminoethyl) -3·Aminopropyltrimethoxydecane, N-(6-aminohexyl)aminomercaptotrimethoxydecane, N-(2-aminoethyl)-11-aminoundecyltrimethoxy Base decane, (aminoethylaminomethyl) phenethyltrimethoxydecane, Ν-(2.aminoethyl)-3-aminopropylmethyldimethoxydecane, Ν·(2 -aminoethyl)-3-aminoisobutylmethyldimethoxy zeoxime and (3-trimethoxy oxalate) Diethyl-triamine. The amine functional organopolyoxane can also be used to form organoborane amines comprising the organotelluric compounds described in the above formulas (a) and (b) and their compounds previously described as organopolyoxyalkylene resins. Compound (ii). This is subject to the following regulation: the molecule contains at least one amine functional group such as aminopropyl, aminomethyl, 2-aminoethyl, 6-aminohexyl, 11-aminoundecyl, 3-(N -allylamino)propyl, n-(2-aminoethyl)-3-aminopropyl, N-(2-aminoethyl)-3-aminoisobutyl, p-amine Phenyl phenyl, 2-ethyl pyridine and 3- propyl σ 嘻. Specific examples include: terminal and/or pendant amine functional polydimethoxy methoxy olefin oligomers and polymers, polydimethyl methoxy oxane and poly(3,3,3-trifluoropropyl-methyl hydrazine Terminal and/or pendant amine functional random, grafted and block copolymers and co-polymers, polydimethyloxane and poly(6,6,6,5,5,4, Terminal and/or pendant amine functional random, grafted and condensed copolymers and co-oligomers of 4,3,3_nonafluorohexyl-methyloxane, and polydimethyloxane Terminal and/or pendant amine functional random, grafted and block copolymers and co-oligomers with polyphenylmethyl oxane. Other examples of suitable compounds include the resinous amine functional oxane (such as the amine functionalization 127115.doc -28-200844117 previously described as an organopolysiloxane resin) and the amine functional polysesquioxane. Other nitrogen-containing compounds which may also be used to form the organoborane amine complex (U) include N-(3-diethoxycalcylpropyl)-4,5-dihydro-u-indole, maimethofol Triethoxy oxime, a compound similar to the above formulas (&) and (b) and the compounds previously described as organopolyoxyalkylene resins (at least one of which The group is an imidazole, hydrazine or ureido functional group). When the amine compound is a polymer, the molecular weight is not limited, but it should be such that a sufficiently high boron concentration is maintained to allow the composition to polymerize. For example, in both systems, the portion containing the organoborane initiator can be diluted with the monomer or, optionally, the active ingredient to be encapsulated, or it can be composed solely of the initiator complex. If necessary, the system can be stabilized by physically attaching the organoborane amine complex to the solid particles chemically. This provides a means to control the reaction time and to stabilize the liquid phase organoborane amine complex against significant separation from the remainder of the composition during storage. For example, chemical attachment can be carried out by pretreating solid particles such as ground vermiculite, precipitated vermiculite, calcium carbonate or barium sulfate with a condensation-reactive compound containing an amine group such as aminopropyl dimethoxydecane. To execute. Although it may be necessary to control particle size and particle size distribution to impart desired properties, particle size is not inherently limited and can range from discrete nanoparticle (ie, nanometer diameter) to coalesced or fused structure to large to millimeters (mm). ) within the size range. The pretreatment is followed by a mismatch with the organoborane compound, or the solid particles are directly treated using a pre-formed organoborane amine complex having condensation reactivity. When the solid particles contain surface functional groups, such as surface treatment agents with inherent amine reactivity or the addition of impurities d, appropriate precautions should be taken to avoid the adhesion of the attached organoborane amines 127115.doc -29- 200844117 Premature resolution. The solid particles containing the amine-reactive substance can be purified before the attachment of the organo-amine complex. Aster, the attachment of the organoborane amine can be carried out in an oxygen-free environment.
可將成份(u)預附著至整體(亦即,連續而非顆粒)表面, 其:將成份⑼預施用至表面,接著曝露至成份㈣。舉例 而言,可依賴表面與錯合物之間的強相互作用或反應性而 將具有烧氧基石夕燒基之與等莫耳量之三乙基蝴貌錯合的有 機職胺錯合物(諸如,3-胺基丙基三乙氧基石夕幻預附著 至諸如金或玻璃之表面。預附著可以覆蓋表面之全部或一 部分之未固化薄膜的形式(例如,作為一般處理或底塗)來 選擇性地執行。如前文所描述,成份⑴可與成份⑼或成 份(iii) 一起施用。為控制基板上之薄膜形成及黏著,可能 而要在、、且σ物中使用低與高表面能烷基硼烷胺錯合物之組 合0 具有胺反應性基團之胺反應性化合物(Ui) 可聚合組合物可含有胺反應性化合物(iii),其能夠在與 有機硼烷胺錯合物(ii)混合且(例如)在氧化環境中曝露至氧 時引發薄膜固化。胺反應性化合物可以液體、氣體或固體 形式傳遞。胺反應性化合物可為小分子、單體、募聚物、 聚合物或其混合物,亦可由諸如水性溶劑或非水性溶劑之 載劑或由填充劑粒子稀釋或承載。成份(iii)之存在允許在 低於有機硼烷胺錯合物(ii)之離解溫度的溫度(包括室溫及 室溫以下)下快速地發生薄膜固化。為防止氧存在下之過 早固化,可使成份(ii)與(iii)物理隔離或化學隔離直至即將 127115.doc •30- 200844117 需要固化之時。舉例而t,組合物可被製備為兩種獨立溶 液將其相、繼施用至表面。系、统之剩餘成份可以任何方式 分布於兩種溶液之間,只要(咐與(iii)在氧存在下彼此精 細接觸即可。 舉例而言,包含成份⑴及(ii)之第一溶液(例如,本文中 之基料)與包含成份(iii)之第二溶液(例如,本文中之固化 劑)皆具有空氣穩定性,但在以未固化薄膜之形式將基料 沈積於表面上之後,薄膜在於周圍條件下曝露至第二溶液 時快速地固化。或者,成份(ii)與(iii)或此兩者可經囊封或 以獨立相經傳遞。此可藉由防止成份(ii)與(iii)精細混合地 以固體形式引入成份(Π)與(iii)中之一者或兩者來實現。固 化未固化薄膜可藉由以下步驟來啟動:(幻將其加熱至高於 固相組份或囊封物之軟化溫度,或(b)引入固相之增溶劑, 由此允許成份(ii)與(iii)混合。 另一方法包括使用諸如乳液之雜相液體,其中成份(H) 及(iii)存在於包含基料之獨立液相中。接著可(諸如)藉由 剪切或加熱破壞乳液,或以化學方式藉由將薄膜曝露至可 使成份(ii)與(iii)相互接觸且反應之化合物來使未固化薄膜 固化。 一些可在氧存在下快速地引發基料固化之具有胺反應性 基團之胺反應性化合物(iii)的實例包括:無機酸;路易斯 酸(Lewis acid);羧酸;羧酸衍生物,諸如酐及琥珀酸酯; 羧酸金屬鹽;異氰酸酯;醛;環氧化物;酸氣化物;及磺 醯氯。一些合適的胺反應性化合物包括乙酸、丙烯酸、甲 127115.doc -31 - 200844117 基丙烯酸、聚丙烯酸、聚甲基丙烯酸、甲基丙烯酸酐、十 一碳烯酸、油酸、月桂酸、月桂酸酐、檸康酸酐、抗壞血 酸(維生素c)、異佛爾酮二異氰酸酯單體或寡聚物、異氰 酸甲基丙烯醯基酯、乙醯乙酸2-(甲基丙烯醯基氧基)乙 酯、十一碳烯醛及十二烷基琥珀酸酐。 胺反應性化合物可為具有胺反應性基團之有機矽或有機 聚矽氧烷。一些實例包括有機矽烷,諸如3_異氰酸酯基丙 基二甲氧基矽烷、夂異氰酸酯基甲基三甲氧基矽烷及3-縮 水甘油氧基丙基2甲氧基石夕烧。可使料具㈣反應性基 團之其他有機石夕化合物包括··三乙氧基石夕院基丙基破拍酸 酐;丙基琥珀酸酐官能化線性、分枝、樹脂質及超分枝有 機聚石夕氧烧;甲基琥ί白酸酐官能化線性、分枝、樹脂質及 超分枝有機聚矽氧烷;環己烯基酐官能線性、樹脂質及超 分枝有機聚矽氧烷;羧酸官能化線性、分枝、樹脂質及超 分枝有機聚矽氧烷,諸如羧基癸基封端寡聚或聚合聚二甲 ϋ I矽氧烷;及醛官能化線性、分枝、樹脂質及超分枝有機 聚矽氧⑥’諸如十一碳烯醛封端寡聚或聚合聚二甲 烷。 & - 美國專利6,777,512描述了可用作成份_之含矽化合 #勿’包括在曝露至濕氣時釋放酸之某些化合物。美國專利 6,777,5 12亦描述了可用作成份(m)之被稱為解錯合劑的其 他胺反應性化合物。 儘管此技術之顯著優點為快速周圍固化而無需輕射源, 但該方法亦可用以(諸如咖^束源下使用現有輕射方 127115.doc -32- 200844117 法以加速反應、使得能夠在陰影區域或深截面中固化,或 賦予對基板之改良黏著來產生薄膜。在此等狀況下,可適 宜地包括能夠在曝露至諸如光酸產生劑之紫外線輻射時產 生胺反應性基團的化合物。此等化合物之一些實例包括含 有[SbFW平衡離子之鎖鹽。在此實施例中,可適宜地視情 況包括諸如異丙基噻噸酮之光敏化化合物。 在一些狀況下,可能需要將胺反應性化合物附著至固體 粒子。固體粒子可具有諸如導電性或導熱性之特性,或可 使所得薄膜更適用於後續施用之鐵電特性。胺反應性基團 之附著可藉由許多已知表面處理原位或預先完成。一些表 面處理方法包括(例如)以縮合反應性化合物預處理以下各 物·固體粒子’諸如經研磨或沈殿石夕石、碳酸約、碳黑、 碳奈米粒子、矽奈米粒子、硫酸鋇、二氧化鈦、氧化鋁、 氮化硼、銀、金、鉑、鈀及其合金;或皁金屬,諸如鎳、 鋁、銅及鋼。此後進行經預處理固體粒子與具有胺反應性 i/ 基團之化合物的反應,或使用具有可水解部分之胺反應性 化合物直接處理經預處理固體粒子。在此等狀況下,較佳 為附著有胺反應性化合物之粒子具有與聚合介質類似之密 * 度以有助於粒子分散於系統中。 • 可用於附著之縮合反應性化合物的一些實例包括異氰酸 酉曰基甲基二乙氧基矽烷、異氰酸酯基丙基三乙氧基矽烷、 異氰酸酯基甲基三甲氧基矽烷、異氰酸酯基丙基三甲氧基 矽烷、三乙氧基矽烷基十一醛、縮水甘油氧基甲基三甲氧 基石夕燒、縮水甘油氧基丙基三甲氧基石夕烧、3_(三乙氧基石夕 127115.doc -33- 200844117 烷基)甲基琥珀酸酐、3_(三乙氧基矽烷基)丙基琥珀酸酐及 2-(4-氯磺醯基苯基)乙基三曱氧基矽烷。胺反應性化合物 附著至固體粒子亦可藉由在有助於形成酸鹼錯合物、氫鍵 結錯合物或酸式鹽之條件下使酸官能化合物與具有適當表 • 面S能基之填充劑混合來實現。 • 二顆粒填充劑可購得,其係經被稱為潤滑劑之表面處 理劑預處理,或可獲得時具有含有胺反應性基團之雜質 ( (諸如羧酸)。以此方式,可將成份(iii)與額外成份以經處 理填充劑之形式一起傳遞。在此情況下,填充劑上之有機 侧燒fee錯5物與胺反應性基團之間的反應可幫助潤滑劑自 填充劑粒子之表面移除。潤滑劑對於濃縮形式粒子之穩定 性而言係所必需的,但其可能干擾填充劑之目標功能。成 份(u)與胺反應性潤滑劑之反應可有效地自粒子表面移除 潤滑劑,藉此活化粒子。典型實例為、經脂肪酸處理之銀填 充劑粒子,其中脂肪酸潤滑劑干擾粒子間的接觸,該接觸 (; 為在最終形式中建立導電性所需要的。 為達成穩定性,亦可能有利的為使用含有胺反應性基團 之填充劑與相對於胺化合物呈惰性之填充劑的組合。舉例 • 而言,當成份(ii)與(Hi)保持於獨立溶液中時,相對於胺化 纟物呈惰性之填充劑可與成份⑻組合,而具有胺反應性 基團之填充劑可封裝於與成份(ii)分開之容器中。在該狀 況下,成份(i)可與調配物之任一部分或與一個以上部分包 括在、一起。或者,可將胺反應性化合物(Hi)在允許其以氣 相傳遞至含有組合物剩餘部分之反應容器的條件下引入。 127115.doc -34- 200844117 在本發明之實施例中,可將成份(iii)預附著至整體(亦 即連績而非顆粒)表面,其中將成份(iii)預施用至表面, 接著曝露至成份⑼。舉例而言,可依賴表面與錯合物之 間的強相互作用或反應性而將具有絲基㈣基之胺反應 口物(諸如,3_異氰基丙基三甲氧基矽烷)預附著至諸 如孟或玻璃之表面。預附著可以所要薄膜形式,或作為一 =理或底塗來選擇性地進行,其限制條件為將系統剩餘 、、、 至夕者置放於所要薄膜中。如先前所描述,在 此清況下,成份⑴可與成份⑴)或與成份(iii)或與此兩種成 伤起%肖。為控制基板上之薄膜形成及黏著,可能需要 在系統中使用低與高表面能胺反應性化合物之組合。 可用於成份(iii)中之胺反應性基團之一些代表性及較佳 實例包括㈣、酐、異氰酸§|、駿及環氧化物。封端異氛 酸酯可用於需要使用熱量來快速地引發聚合而非周圍聚合 之狀況中。 口 Μ (ίν) 氧可以任何稀釋、轉或純形式存在,且可以大氣空氣 之形式隱含存在,或明確弓丨人系統或處理環境中。儘管並 非必需’但在-些狀況下可能需要藉由控制儲存成份及執 仃本發明之方法之氣氛的壓力及/或品質來增加、減少或 消除基料中或固化劑中或其成份⑴、⑼或(iii)中之自然存 在之氧含量。氧含量之明確控制可藉由任何已知方法來執 包括控制包括氧氣、壓縮空氣、富含氧之空氣、氬 礼、虱氣、虱氣及二氧化碳之各種類型之氣體的壓力及/ 127115.doc -35- 200844117 或文爭化、氧儲存、氧產生及/或氧釋放物質。用於 本的之氧包括所有氧同位素。氧可以氣體、液體或 一、入但較佳係以氣相引入。最佳地,氧源為空 氣。 可選成份 本文之糸統中可包括一或多種可選成份,諸如染料;顏 料;界面活性劑;水;濕潤劑;包括普通有機水性溶劑、 離子液體及超臨反、〜 . I /瓜體之洛劑;稀釋劑;增塑劑,·聚合 聚物,机鉍改質劑;黏著促進劑;交聯劑;聚合 物、交聯劑與可用於提供薄膜二次固化之催化劑的組合; 能夠在混合至組合物中時增量、軟化、增強、勤化、改質 黏度或降低揮發性之聚合物;增量及增強填充劑’·傳導性 填充劑丨㈣劑;摻雜劑;量子點,諸如砸化鑛之奈米粒 子’共聚早體’諸如有機丙烯酸酯及有機甲基丙烯酸酯; 剌定劑;氮丙啶穩定劑;空隙減少劑;固化改質劑, 諸如氫S昆及受阻胺;自由其3丨欢如 _ k 又,妝,目由暴%發劑,諸如有機過氧化物及 臭氧化物;酸受體;抗氧化劑;氧淨化劑;氧海、绵;氧釋 氧產生劑;熱穩定劑;阻燃劑’·石夕烧化劑;泡床穩 定劑;助熔劑;及乾燥劑。 h 表面 施用薄膜之基板表面不受限制。儘管基板在使用條件下 可為固體或液體’但在許多狀況下’需要直接在固體基板 之表面上固化賴。根據本發明之複合物品可為被安置或 施用至單一基板或多個基板之間的可固化組合物。基板可 127115.doc -36 - 200844117 為有機、熱塑性、熱固十生、金屬、陶瓷或其他合適的無機 材料基板可為夕層基板,諸如用於印刷電路板中之基 板,其中在複合物品之可固化薄膜與基板之間需要改良黏 著。基板之-些特定實例包括:石夕、二氧化石夕(及石夕之各 種熱及物理生長氧化物表面)、鍺、砷化鎵、銦、氮化 銦、鼠化砍,及在電子1#巾被稱為半導體或化合物半導 體之/、他基板石夕石、氧化|呂、氧化_、玻璃、金、銷、 fComponent (u) may be pre-attached to the overall (i.e., continuous rather than particulate) surface by pre-applying component (9) to the surface followed by exposure to component (iv). For example, depending on the strong interaction or reactivity between the surface and the complex, an organoamine complex having an alkoxylated group and a molar amount of a triethylanthene can be mismatched. (such as 3-aminopropyltriethoxylate pre-attached to a surface such as gold or glass. Pre-attachment can cover all or part of the surface in the form of an uncured film (eg, as a general treatment or primer) Alternatively, component (1) can be applied together with component (9) or component (iii) as described above. To control film formation and adhesion on the substrate, it is possible to use low and high surfaces in , and σ. Combination of alkoxyboramine complexes 0 Amine-reactive compound (Ui) having an amine-reactive group The polymerizable composition may contain an amine-reactive compound (iii) which is capable of being mismatched with an organoborane amine (ii) mixing and, for example, initiating film solidification upon exposure to oxygen in an oxidizing environment. The amine reactive compound can be delivered in liquid, gaseous or solid form. The amine reactive compound can be a small molecule, a monomer, a chelating agent, Polymer or The mixture may also be diluted or supported by a carrier such as an aqueous or non-aqueous solvent or by filler particles. The presence of component (iii) allows a temperature below the dissociation temperature of the organoborane amine complex (ii) ( Film curing occurs rapidly at room temperature and below. To prevent premature curing in the presence of oxygen, component (ii) can be physically or chemically isolated from (iii) until 127115.doc •30- 200844117 is required At the time of curing, for example, t, the composition can be prepared as two separate solutions, which are applied successively to the surface. The remaining components of the system can be distributed between the two solutions in any manner as long as (咐 and (iii) ) in fine contact with each other in the presence of oxygen. For example, a first solution comprising components (1) and (ii) (eg, a binder herein) and a second solution comprising component (iii) (eg, herein) The curing agent) is air-stable, but after depositing the binder on the surface in the form of an uncured film, the film is rapidly cured when exposed to the second solution under ambient conditions. Ii) and (iii) or both may be encapsulated or delivered in separate phases. This may be introduced into the components (Π) and (iii) in a solid form by preventing the fine mixing of components (ii) and (iii). Either or both. Curing the uncured film can be initiated by: (heating it to a softening temperature above the solid phase component or encapsulation, or (b) introducing a solid phase solubilizer This allows component (ii) to be mixed with (iii). Another method involves the use of a heterophase liquid such as an emulsion wherein components (H) and (iii) are present in a separate liquid phase comprising the binder. The uncured film is cured by shearing or heating to destroy the emulsion, or chemically by exposing the film to a compound which can bring the components (ii) and (iii) into contact with each other and react. Some examples of the amine-reactive compound (iii) having an amine-reactive group capable of rapidly initiating curing of the binder in the presence of oxygen include: a mineral acid; a Lewis acid; a carboxylic acid; a carboxylic acid derivative such as Anhydrides and succinates; metal carboxylates; isocyanates; aldehydes; epoxides; acid vapors; Some suitable amine-reactive compounds include acetic acid, acrylic acid, 127115.doc-31 - 200844117-based acrylic acid, polyacrylic acid, polymethacrylic acid, methacrylic anhydride, undecylenic acid, oleic acid, lauric acid, and lauric anhydride. , citraconic anhydride, ascorbic acid (vitamin c), isophorone diisocyanate monomer or oligomer, methyl methacrylate isocyanate, 2-(methylpropenyl methoxy) ethyl acetate , undecenal aldehyde and dodecyl succinic anhydride. The amine-reactive compound may be an organic hydrazine or an organic polyoxyalkylene having an amine-reactive group. Some examples include organodecanes such as 3-isocyanatepropyldimethoxydecane, guanidinium isocyanatomethyltrimethoxydecane and 3-glycidoxypropyl 2methoxylate. Other organic compounds of the reactive group of the material (4) include: · triethoxy oxalate propyl hydride; propyl succinic anhydride functionalized linear, branched, resinous and super-branched organic polymerization Shixi oxygen burning; methyl succinic anhydride functionalized linear, branched, resinous and super-branched organopolyoxyalkylene; cyclohexenyl anhydride functional linear, resinous and super-branched organopolyoxyalkylene; Carboxylic acid functionalized linear, branched, resinous, and hyperbranched organopolyoxyalkylenes, such as carboxyl thiol-terminated oligomeric or polymeric polydimethyl hydrazines; and aldehyde functionalized linear, branched, resin Qualitative and hyperbranched organopolyoxy 6' such as undecyl alkenyl terminated oligomeric or polymeric polymethane. & - U.S. Patent 6,777,512 describes certain compounds which can be used as ingredients. U.S. Patent 6,777,5,12 also describes other amine-reactive compounds known as disintegrating agents which can be used as component (m). Although the significant advantage of this technology is fast ambient curing without the need for a light source, this method can also be used (such as using the existing light shot 127115.doc -32-200844117 method to accelerate the reaction, enabling shadows) Curing in a region or deep section, or imparting improved adhesion to the substrate to produce a film. Under such conditions, a compound capable of producing an amine-reactive group upon exposure to ultraviolet radiation such as a photoacid generator may be suitably included. Some examples of such compounds include a lock salt containing [SbFW counterion. In this embodiment, a photosensitizing compound such as isopropylthioxanthone may be suitably included as appropriate. In some cases, an amine reaction may be required. The compound is attached to the solid particles. The solid particles may have properties such as electrical conductivity or thermal conductivity, or the resulting film may be more suitable for subsequent application of ferroelectric properties. Adhesion of amine reactive groups may be handled by many known surfaces. In situ or pre-finished. Some surface treatment methods include, for example, pretreatment of the following substances with solid reactants with condensation-reactive compounds Such as by grinding or slabs, carbonic acid, carbon black, carbon nanoparticles, strontium nanoparticles, barium sulfate, titanium dioxide, aluminum oxide, boron nitride, silver, gold, platinum, palladium and their alloys; or soap a metal such as nickel, aluminum, copper, and steel. Thereafter, the pretreated solid particles are reacted with a compound having an amine reactive i/ group, or the pretreated solid particles are directly treated using an amine reactive compound having a hydrolyzable moiety. Under such conditions, it is preferred that the particles to which the amine-reactive compound is attached have a similar degree of density as the polymerization medium to facilitate dispersion of the particles in the system. • Some examples of condensation-reactive compounds that can be used for attachment include Isocyanatomethyldiethoxydecane, isocyanatopropyltriethoxydecane, isocyanate methyltrimethoxydecane, isocyanatopropyltrimethoxydecane, triethoxydecyl eleven Aldehyde, glycidoxymethyltrimethoxy sulphate, glycidoxypropyltrimethoxy sulphur, 3_(triethoxy xi 127115.doc -33- 200844117 alkyl) methyl sulphate Peric anhydride, 3-(triethoxydecyl)propyl succinic anhydride, and 2-(4-chlorosulfonylphenyl)ethyltrimethoxy decane. The amine reactive compound can also be attached to the solid particles. It is achieved by mixing an acid functional compound with a filler having an appropriate surface S energy group under conditions which facilitate the formation of an acid-base complex, a hydrogen bond complex or an acid salt. It is pretreated by a surface treatment agent called a lubricant, or when it is obtained, it has an impurity containing an amine reactive group (such as a carboxylic acid). In this way, the component (iii) and the additional component can be obtained. It is delivered together in the form of a treated filler. In this case, the reaction between the organic side-burning compound and the amine-reactive group on the filler helps the lubricant to be removed from the surface of the filler particles. The agent is necessary for the stability of the concentrated form of the particles, but it may interfere with the intended function of the filler. The reaction of the component (u) with the amine reactive lubricant effectively removes the lubricant from the particle surface, thereby activating the particles. Typical examples are fatty acid-treated silver filler particles in which the fatty acid lubricant interferes with the contact between the particles, which is required to establish electrical conductivity in the final form. For stability, it may also be advantageous to use A combination of a filler containing an amine-reactive group and a filler inert to the amine compound. For example, when components (ii) and (Hi) are kept in separate solutions, they are present relative to the aminated chemical. An inert filler may be combined with component (8), and a filler having an amine reactive group may be encapsulated in a separate container from component (ii). In this case, component (i) may be combined with any portion of the formulation or Included with more than one moiety, or alternatively, the amine-reactive compound (Hi) can be introduced under conditions which allow it to be passed in the gas phase to the reaction vessel containing the remainder of the composition. 127115.doc -34- 200844117 In an embodiment of the invention, component (iii) may be pre-attached to the overall (i.e., continuous rather than particulate) surface, wherein component (iii) is pre-applied to the surface and subsequently exposed to component (9). For example, an amine reaction port having a silk group (tetra) group (such as 3-isocyanopropyltrimethoxydecane) can be pre-attached to the strong interaction or reactivity between the surface and the complex. For example, the surface of Meng or glass. The pre-adhesion may be carried out in the form of a desired film, or alternatively as a remedy or a primer, with the proviso that the system remains, and, until the evening, placed in the desired film. As described, in this case, the component (1) may be combined with the component (1)) or the component (iii) or both. To control film formation and adhesion on the substrate, it may be desirable to use a combination of low and high surface energy amine reactive compounds in the system. Some representative and preferred examples of the amine-reactive groups which can be used in component (iii) include (iv), anhydrides, isocyanate §|, and epoxides. The blocked isocyanate can be used in situations where heat is required to rapidly initiate polymerization rather than surrounding polymerization. Mouth ί (ίν) Oxygen can be present in any form of dilution, conversion or purity, and can exist in the form of atmospheric air, or in a clear system or treatment environment. Although not necessarily required, it may be necessary to increase, reduce or eliminate the binder or its constituents (1) in the binder or by controlling the pressure and/or quality of the atmosphere of the method of the invention. The naturally occurring oxygen content in (9) or (iii). The explicit control of the oxygen content can be controlled by any known method including controlling the pressure of various types of gases including oxygen, compressed air, oxygen-enriched air, argon, helium, neon and carbon dioxide and / 127115.doc -35- 200844117 Or arbitrage, oxygen storage, oxygen production and / or oxygen release substances. The oxygen used herein includes all oxygen isotopes. Oxygen can be introduced as a gas, a liquid, or preferably, in a gas phase. Optimally, the oxygen source is air. Optional Ingredients The system herein may include one or more optional ingredients such as dyes; pigments; surfactants; water; wetting agents; including common organic aqueous solvents, ionic liquids, and super-reverse, ~. I / melons Lozenge; thinner; plasticizer, polymerizer, oxime modifier; adhesion promoter; crosslinker; polymer, crosslinker and a combination of catalysts that can be used to provide secondary curing of the film; Increment, soften, enhance, diligently, modify viscosity or reduce volatile polymer when mixed into the composition; increase and enhance filler '·conductive filler 四 (4) agent; dopant; quantum dot , such as strontium ore nanoparticles 'copolymer early body' such as organic acrylate and organic methacrylate; chelating agent; aziridine stabilizer; void reducing agent; curing modifier, such as hydrogen S Kun and blocked Amine; free of its 3 丨 如 k _ k again, makeup, mesh by the hair agent, such as organic peroxides and ozonide; acid receptors; antioxidants; oxygen scavengers; oxygen sea, cotton; oxygen release Agent; heat stabilizer; flame retardant'· Xi burnt agent; Bed foam stabilizer; flux; and a desiccant. h Surface The surface of the substrate to which the film is applied is not limited. Although the substrate may be solid or liquid under the conditions of use' in many cases' need to cure directly on the surface of the solid substrate. The composite article according to the present invention may be a curable composition that is placed or applied to a single substrate or between a plurality of substrates. The substrate can be 127115.doc -36 - 200844117 is an organic, thermoplastic, thermosetting, metal, ceramic or other suitable inorganic material substrate can be a base substrate, such as a substrate used in a printed circuit board, wherein in a composite article Improved adhesion is required between the curable film and the substrate. Some specific examples of the substrate include: Shi Xi, dioxide dioxide (and various thermal and physical growth oxide surfaces of Shi Xi), tantalum, gallium arsenide, indium, indium nitride, ratification, and in electronics 1 #巾 is called semiconductor or compound semiconductor /, his substrate Shi Xishi, oxidation | Lu, oxidation _, glass, gold, pin, f
C 絶錢銀鋼、不鏽鋼、陽極化鋼、铭、陽極化铭、禱 銘欽* _ 3銅及其氧化物;建築構造材料,諸如C. Supreme silver steel, stainless steel, anodized steel, Ming, anodized, prayer, Ming Qin* _ 3 copper and its oxides; building materials, such as
各種形式之混凝土、碌持七 A 今塊或石塊,電路板;聚乙烯、聚丙 沐、聚苯乙炸、間賴命f u現、本乙烯、聚對苯二甲酸丁二酯、 聚碳酸酯、聚鄰苯二甲酼险·取—丄 τ I ,聚苯硫醚;環氧樹脂;雙- 馬來醯亞胺三嗪樹脂;氟聚人 4^ ^ ^ 弗物,诸如聚四氣乙浠、天麸 橡膠、乳膠橡膠、聚放_ ^ ^ V夕乳、鼠聚矽氧、壓敏性膠帶及黏著 劑,及纖維素聚合物,諸如 居如’木材、紙張及天然聚合物。 在需要形成自立式薄腔^妹 寻膜(老如,作為貼花膜用於轉印)之 狀況下,可將基料施用s 7 ^ 、 了叶她用至可熔融或可昇華固體(諸如,冰 或乾冰)之基板表面上J j , 或诸如水、油或液體有機聚矽氧 烧之液體基板表面上,直阳 /、限制條件為表面不溶解所要薄 膜’或在其他方面有指壤勝 貝溥膜固化。在此等情況下,可便利 地藉由將系統之成份m视 (u)及至基板中(如由丙烯酸或聚丙稀 酸溶解於水或冰中所你丨七 所例不)來引入系統之成份(iii)。 方法 如先前所論述,可叙# M数種組合來裝配上文所描述之系 127115.doc -37· 200844117 統’且以許多方式來施用以在表面上產生聚合薄膜。成份 (11)與(iii)係相互隔離直至在已將未固化薄膜沈積於表面上 之後。接著在(IV)氧存在下使成份(ii)與(iii)彼此曝露後即 在適當位置固化薄膜,而無需外部加熱或輻射。固化劑可 為液體、蒸氣或固體,且因此曝露可經由廣泛範圍之執行 分批、半連續或連續製造方法的單元操作來實現。固化劑 可含有省略成份,且固化劑可在形成未固化薄膜之前或之 後引入,例如固化劑可在基料含有成份(iii)而不含(ii)時含 有成份(11);或者,固化劑可在基料含有成份不含⑴〇 時含有成份(iii)。 或者’在系統作為單一封裝系統存在之情況下,成份 (11)與(111)藉由存在於諸如乳液之多相系統的獨立相中而相 互隔離,或經由囊封成份(ii)與(iii)中之至少一者而相互隔 離。將未固化薄膜置放至所關注表面i,接著藉由曝露至 諸如去乳化劑或溶劑之化學劑,或諸如剪切、照射、加 熱、冷卻、加壓或減壓之物理過程以在(iv)氧存在下使成 份(ii)與(iii)相互接觸而顯影。 舉例而言,可以未固化薄膜之形式將包含成份⑴及(ii) 之基料沈積於所關注表面上。沈積方法可簡單如與刷塗、 輥塗、幕塗、噴塗、噴墨塗覆、模塗或旋塗、浸塗、溶劑 澆鑄、氣相沈積或諸如Langmuir_Blodgett薄膜裝配之液-液 沈積技術。接著藉由曝露至富含成份(iii)之環境來固化所 得未固化薄膜,諸如藉由浸於包含成份(iii)之固化劑浴 中、藉由穿過蒸氣空間含有成份(iii)之腔室、藉由穿過具 127115.doc •38- 200844117 有成份(in)之固體粒子的流體化床,或藉由在成份(iv)存 在下以包含成份(iii)之溶液來塗飾未固化薄膜,或接著曝 f至成份(iv)。在此等多封裝系統中,將基料曝露至固化 d之方法可以數種方式來完成,諸如經由浸沒整個基板、 朴又於/谷中曝路至蒸氣腔室,或如在使用固化劑過喷 薄膜中選擇性地進行。 可(例如)藉由相繼固化在表面上形成一個以上層,其中 /方法包§ · 1)在表面上形成基料之未固化薄膜;及2)將 V驟1)之產物曝露至固化劑。根據需要,可將此方法重複 許多次。或者,可在步驟丨)中於表面上形成基料之兩個或 兩個以上獨立未固化薄膜。在步驟2)中,可將所得多層總 成曝露至固化劑以形成固化薄膜。對本申請案而言,詞語 ” 一”及”該”各指代一或多個。 該方法之優點包括:薄膜在包括室溫(例如,25。〇及室 溫以下之低溫度下快速固化,而無需輻射源或熱源;對有 機基板之極佳黏著;及用以製造低介電常數薄膜至傳導性 薄膜之範圍内之多種固化薄膜的多功能性。此方法使得薄 膜能夠在周圍條件下快速固化及對低能量基板黏著。本文 所描述之方法的另一益處在於:其可用以在諸如塑膠、陶 瓷、玻璃、金屬、紙張或木材之固體表面上形成相對較厚 的薄膜(例如,大於1〇,〇〇〇奈米至幾毫米),其亦可用於產 生諸如當前為微電子學而製之薄膜(例如,10 nm至10,000 nm) °藉由使用諸如LangmUir_Bi〇dgett薄膜裝配之單層沈 積技術,厚度可與分子單層一樣低。本文所描述之方法可 127115.doc -39- 200844117 用以固化彈性體或剛性有機矽氧烷材料。藉由該方法所形 成之薄膜適用於多種應用,但尤其適用於諸如半導體、顯 示器、轉導器、致動器及感應器之電子應用、用於金屬、 織物、紙張及塑膠之工業塗料,及用於醫療裝置及生物材 料之塗料。 系統之製備 因為系統之成份可以各種方式分布於本文所描述之封裝 中,所以成份之相對量可廣泛地變化。舉例而言,在多封 裝系統中,固化劑可含有較大過量的成份以允許藉由在連 績或半連續方法中經過固化劑來固化薄膜之多個樣本(包 各系統之剩餘成份及表面)。然而,僅固化一薄膜所需要 之固化劑量可小數百倍。在單一封裝系統中,以下濃度範 圍可用以固化薄膜。 A. 0.1至50重量份之自由基可聚合有機矽單體、募聚物或 聚合物(i); (j 0·1至50重畺份之有機硼烧胺錯合物(ii),其足以固化 組合物,其量視錯合物之分子量及每分子之硼原子數 而定; C· 〇·1至50重量份之胺反應性化合物(iii); • · 〇·⑼〇 1至無窮大重量份之氧(iv);及 & 0至50重量份之可選成份(v);上述量係以組合物之總 重量計。在任何狀況下,系統可經按比例調節以容納 任何適宜質量或容積。成份(iv)之範圍基本上為無限制 的,因為氧(iv)可存在於諸如空氣之任何環境中。 127115.doc 200844117 ㈣率可藉由引人額外胺化合物以增加基料中 胺基Ί原子的莫耳比來控制。待添加之有效量視成份 ⑻之胺’比而^ ’且亦視可與成份⑴或可添加至系統之 4何可k成伤起引入之任何殘餘酸性雜質的量而定。然 而’幸父佳為總胺棚卜 攸·別比保持足夠低,以允許發生固化。合 適的胺:硼比將小於丨〇·】,々土 ^ … , ' -1或者小於4:1。當胺反應性成份 已經存在於系統中時,例如當殘餘叛酸存在於填充劑粒子 上時’可添加較高含量之胺化合物以中和或部分地中和胺 反應性基團,以降低固化速率。胺化合物可含有單官能或 多官能胺基’且其可為第一胺、第二胺及/或第三胺。必 要時’胺化合物可含有自由基可聚合基團,或諸如可水解 基團之另-官能基。胺化合物在性質上可為單體的、寡聚 的或聚a# A合物上之胺基可承載於有機、有機石夕或有 機聚夕氧烧化合物上。 用途及應用 隨後固化薄膜可直接使用’或經歷後處理或反應步驟。 詳言之’固化薄膜可用以使表面選擇性地接受後續化學接 枝、結合染色或著色。作為一實例,該方法可用以選擇性 地底塗聚烯烴以用於在固化薄膜上進行後續反應,在此狀 況下其可藉由簡單地將先前經歷本文所描述之方法的基 板浸至漆中,或藉由對整個表面進行喷射塗漆來進行。固 化薄膜可為離散的、連續的或半連續的。固化薄膜可自施 用,膜之表面突出。在一些狀況下,固化所施加之壓力或 熱里可用以蝕刻薄膜低於原表面之水平面。如在經由本文 127115.doc •41 - 200844117 所描述之方去在木材燃燒的過程巾將影像燒人纖維素基板 中。 實例 陳述以下貝例,以便向一般技術者說明本發明。除非另 有扣疋、否則有機聚矽氧烷聚合物及樹脂之數量平均分子 量(Μη)為藉由使用聚苯乙烯校正標準之凝膠滲透層析法而 里測的值。除非另有特定敍述,否則藉由凝膠滲透層析法 (GPC)所为析之樣本的多分散性指數在12_2 2之範圍内。 在所有以下貝例中’除了應注意使用氬手套箱的情況以 外,成份(IV)氧之含量不受控制,且其隱含地充足地存在 於進行該等實例之環境的周圍空氣中,以及以如在儲存及 處理期間自然地溶解於成份中之小得多的含量程度存在。 比較實例1 使用一旋塗器(EC101-DT,Headway Research,Inc.)在 15 00 rpm下持續20秒而將在乙酸丨_甲氧基丙酯中稀釋至 25%固體之羥基封端3_甲基丙烯醯氧基丙基苯基倍半矽氧 烧TPh〇.3T甲基丙料氧基丙基〇 7樹脂的溶液旋塗至1〇() mm直徑之 清潔矽晶圓(型號 P<100>,來自 Exsil,Inc.,Providence, R.I·, U.S.A)上。接者將此薄膜之新塗表面面向下置放於含 有85 g(填充小於杯之總容積的1/5)乙酸之1品脫塑膠杯的 頂部上。晶圓由杯之90 mm直徑的外緣來支撐。在大約5秒 之後,自杯提起晶圓。所得薄膜展示薄膜曝露至頂部空間 中之乙酸蒸氣處之區域内相對於周邊之在杯外緣以外之較 小區域無變色。當以庚烷或異丙醇來沖洗薄膜之一部分 127115.doc -42· 200844117 時,曝露區域中之薄膜厚度顯著減小,如由薄膜之干涉色 之永久改變所指示。 實例1 在一小瓶中,使在乙酸1-甲氧基_2_丙酯中稀釋至25〇/〇固 體之1.007 g羥基封端3-甲基丙烯醯氧基丙基苯基倍半矽氧 烧TPh〇3Tu丙㈣樹脂與包含與等莫耳量之丨,3-丙二 胺錯合之三乙基硼烧的〇·〇7〇 g催化劑組合。使用一旋塗器 (EC101-DT,Headway Research,Inc.)在 1500 rpm下持續 20 秒而將組合物旋塗至100 mm直徑之清潔矽晶圓上。所得薄 膜呈現為稍有霧度。 接著在1500 rpm下持續20秒而將含有辛甲基三矽氧烷中 3.8重量%丙烯酸之第二溶液旋塗至此未固化薄膜上。所得 固化薄膜有霧度且由於薄膜在與丙烯酸溶液膠泥接觸時固 化而稍微不均勻;然而,薄膜良好地固化,如藉由用刮刀 刮擦及與戴手套手指接觸且未見到薄膜轉印至手套來確 認。在室溫下24小時後藉由施用3M Scotch Magic膠帶且手 動地摩擦膠帶襯底以確保充分接觸壓力持續5秒來確認對 基板之黏著。接著在被估計為大約1〇〇吋/分鐘之速率下以 9〇°角度用手剝離膠帶,從而指示對矽晶圓之良好黏著。 實例2 在一小瓶中,使在乙酸丨_甲氧基_2_丙酯中被稀釋至25〇/。 固體之1.050 g羥基封端3_曱基丙烯醯氧基丙基苯基倍半矽 氧烧TPhG.3Tw丙…樹脂與包含與13莫耳當量之弘 甲氧基丙胺錯合之三_正_ 丁基硼烷的〇〇75 g催化劑組合。 127115.doc -43 · 200844117 使用一 Headway旋塗器在2000 rpm下持續20秒而將組合物 旋塗至100 mm直徑之清潔矽晶圓上。接著將此薄膜之新塗 表面面向下置放於含有85 g(填充小於杯之總容積的1/5)乙 酸之1品脫塑膠杯的頂部上。晶圓由杯之9〇 mm直徑的外緣 來支撐。在大約5秒之後,自杯提起晶圓。 所得薄膜展示薄膜曝露至頂部空間十之乙酸蒸氣處之區 域内相對於周邊之在杯外緣以外之較小區域的不同變色。 周邊上之材料可被塗抹去,但外緣内部之材料經良好地固 化成無霧度薄膜,其對於庚烷之重複沖洗呈現穩定性。在 至下24小時之後,當固化薄膜用3m Scotch Magic膠帶摩 擦持續5秒,接著在被估計為大約1〇〇吋/分鐘之速率下以 9〇°角度用手剝離時耐分層且未展示變色(此將指示薄膜厚 度改變),從而指示對矽晶圓之良好黏著。 實例L多層化薄膜 藉由第一次旋塗(2500 rpm持續20秒)而在1〇〇 mm矽晶圓 上產生多層化薄膜,其為含有稀釋至25%固體之3·764邑羥 基封端3-甲基丙浠醯氧基丙基苯基倍半石夕氧烧TPh〇 j甲基丙稀 酿氧基丙基 m Π— k 0.7¼¾及包含與1.3莫耳當量之3_甲氧基丙胺錯合之 一-正-丁基硼烷之〇·416 g催化劑的溶液。利用一精細絨尖 染色微吸管(Samco #235,Samco Scientific Corp·,San Fernando, C A)將8-10微升之去離子水滴施配至此薄膜上, k而形成具有明顯正接觸角之珠粒,其在傾斜至一角度時 滾離薄膜。接著藉由以類似於實例2中所描述之方式在丙 烯酸杯上翻轉晶圓而將薄膜曝露至丙烯酸蒸氣持續4〇秒。 127115.doc -44- 200844117 所得薄膜藉由被曝露至蒸氣之中心區域之變色指示固化反 應在曝露之後,將另一 8- 1 0微升之水滴施配至薄膜上。 此時’小液滴以低得多的接觸角擴展於薄膜表面上,從而 確_聚合丙烯酸存在於表面上。接著在相同條件下藉由將 額外里之第一溶液旋塗至薄膜上來沈積第三層。所得薄膜 表面展不在水小液滴測試中具有與最初所觀測類似之非濕 潤仃為的拒水性。此實例說明此方法之一實施例,其產生 具有親水特性與疏水特性之交替層的固化多層薄膜,且其 中親水性層可受到保護以免受水影響。 比較實例2 在2200 rpm下將組成與比較實例1相同之溶液旋塗至具 有一氧化矽之原生表面的mm矽晶圓上歷時2〇秒。 比較實例3 在一小瓶中’使比較實例!中所使用之2 〇〇3 g溶液與包 含與1.3莫耳當量之3_甲氧基丙胺錯合之三_正·丁基硼烷的 0.052 g催化劑混合。在22〇〇 rpm下將此溶液旋塗至具有二 氧化矽之原生表面的3〇〇 mm矽晶圓上歷時2〇秒。 實例4 以與實例3相同之方式來製備薄膜,但以實例2中所描述 之方式將薄膜曝露至冰醋酸蒸氣持續3〇秒來固化薄膜。 比較實例4 在2200 rpm下將包含在甲苯中稀釋至1〇%固體之弘甲基 丙稀酉氧基丙基苯基倍半石夕氧燒TPh 甲基丙稀酿氧基丙基Various forms of concrete, holding seven A pieces or stones, circuit boards; polyethylene, polypropylene, polystyrene, fried, present, ethylene, polybutylene terephthalate, polycarbonate , poly(phthalic acid), take - 丄τ I, polyphenylene sulfide; epoxy resin; bis-maleimide triazine resin; fluoropolymer 4^ ^ ^ 弗物, such as poly four gas浠, gluten rubber, latex rubber, _ ^ ^ V yoghurt, murine polyoxyn, pressure sensitive tape and adhesive, and cellulosic polymers, such as the like 'wood, paper and natural polymers. In the case where it is necessary to form a self-supporting thin cavity film (for example, as a decal film for transfer), the base material can be applied to s 7 ^ , and the leaf can be used to melt or sublimate solids (such as , ice or dry ice) on the surface of the substrate J J , or on the surface of a liquid substrate such as water, oil or liquid organic polyoxygenated oxygen, straight yang /, the restriction is that the surface does not dissolve the desired film ' or otherwise Shengbei film curing. In such cases, it is convenient to introduce the components of the system by looking at the composition of the system m (u) and into the substrate (as in the case of acrylic acid or polyacrylic acid dissolved in water or ice). (iii). Methods As previously discussed, a number of combinations can be assembled to assemble the above described system 127115.doc -37.200844117 and applied in a number of ways to produce a polymeric film on the surface. The components (11) and (iii) are isolated from each other until after the uncured film has been deposited on the surface. Subsequent exposure of components (ii) and (iii) to each other in the presence of (IV) oxygen cures the film in place without external heating or radiation. The curing agent can be a liquid, a vapor or a solid, and thus the exposure can be accomplished via a wide range of unit operations that perform batch, semi-continuous or continuous manufacturing methods. The curing agent may contain an omission component, and the curing agent may be introduced before or after the formation of the uncured film, for example, the curing agent may contain the component (11) when the binder contains the component (iii) without (ii); or, the curing agent The component (iii) may be contained when the base contains components containing no (1) hydrazine. Or 'in the case where the system is present as a single package system, components (11) and (111) are isolated from each other by being present in separate phases of a multiphase system such as an emulsion, or via encapsulating components (ii) and (iii) At least one of them is isolated from each other. The uncured film is placed on the surface i of interest, followed by exposure to a chemical such as a deemulsifier or solvent, or a physical process such as shearing, irradiation, heating, cooling, pressurizing or depressurizing at (iv The components (ii) and (iii) are brought into contact with each other in the presence of oxygen to develop. For example, a base comprising components (1) and (ii) can be deposited onto the surface of interest in the form of an uncured film. The deposition method can be as simple as brushing, roll coating, curtain coating, spray coating, inkjet coating, die coating or spin coating, dip coating, solvent casting, vapor deposition or liquid-liquid deposition techniques such as Langmuir_Blodgett film assembly. The resulting uncured film is then cured by exposure to an environment rich in component (iii), such as by immersing in a bath of the curing agent comprising component (iii), through a chamber containing component (iii) through the vapor space. Varnishing the uncured film by passing through a fluidized bed having 127115.doc •38- 200844117 solid particles (in) or by a solution containing component (iii) in the presence of component (iv), Or then expose f to component (iv). In such multi-package systems, the method of exposing the base to cure d can be accomplished in several ways, such as by immersing the entire substrate, immersing the substrate in a vapor chamber, or over-spraying with a curing agent. The film is selectively carried out. One or more layers may be formed on the surface, for example, by sequential curing, wherein the method comprises: § 1) forming an uncured film of the substrate on the surface; and 2) exposing the product of V to 1) to the curing agent. This method can be repeated many times as needed. Alternatively, two or more separate uncured films of the binder may be formed on the surface in step 丨). In step 2), the resulting multilayer assembly can be exposed to a curing agent to form a cured film. For the purposes of this application, the terms "a" and "the" refer to one or more. Advantages of the method include: rapid curing of the film at low temperatures including room temperature (for example, 25 Å and below room temperature without the need for a radiation source or heat source; excellent adhesion to an organic substrate; and fabrication of a low dielectric The versatility of a variety of cured films ranging from constant film to conductive film. This method enables the film to cure rapidly under ambient conditions and adhere to low energy substrates. Another benefit of the method described herein is that it can be used Forming a relatively thick film (eg, greater than 1 〇, 〇〇〇 nanometer to a few millimeters) on a solid surface such as plastic, ceramic, glass, metal, paper, or wood, which can also be used to produce, for example, current microelectronics Thin films (eg, 10 nm to 10,000 nm) can be as low in thickness as monolayers by using a single layer deposition technique such as LangmUir_Bi〇dgett film assembly. The method described herein can be 127115.doc -39 - 200844117 Used to cure elastomers or rigid organic siloxane materials. The film formed by this method is suitable for many applications, but is especially suitable for semi-conductive applications. Electronic applications for displays, transducers, actuators and sensors, industrial coatings for metals, fabrics, paper and plastics, and coatings for medical devices and biomaterials. The manner is distributed throughout the package described herein, so the relative amounts of the ingredients can vary widely. For example, in a multi-package system, the curing agent can contain a large excess of ingredients to allow for a continuous or semi-continuous process. The curing agent is used to cure multiple samples of the film (including the remaining components and surface of each system). However, the curing dose required to cure only one film can be hundreds of times smaller. In a single package system, the following concentration ranges can be used to cure the film. A. 0.1 to 50 parts by weight of a radically polymerizable organic fluorene monomer, a merging polymer or a polymer (i); (j 0·1 to 50 parts by weight of an organic boron amide compound (ii), It is sufficient to cure the composition in an amount depending on the molecular weight of the complex and the number of boron atoms per molecule; C·〇·1 to 50 parts by weight of the amine-reactive compound (iii); • · 〇·(9)〇1 to no Large parts by weight of oxygen (iv); and < 0 to 50 parts by weight of optional ingredient (v); the above amounts are based on the total weight of the composition. In any case, the system can be adjusted to accommodate any Suitable mass or volume. The range of component (iv) is essentially unlimited, as oxygen (iv) can be present in any environment such as air. 127115.doc 200844117 (d) rate can be increased by introducing additional amine compounds The molar ratio of the amine-based ruthenium atom in the feed is controlled. The effective amount to be added depends on the amine of the component (8), and can also be introduced as the component (1) or can be added to the system. Depending on the amount of any residual acidic impurities, however, 'Lucky' is the total amine shed. Don't keep it low enough to allow curing to occur. Suitable amine: boron ratio will be less than 丨〇·], alumina ^ ... , ' -1 or less than 4:1. When an amine reactive component is already present in the system, such as when residual tickic acid is present on the filler particles, a higher level of amine compound can be added to neutralize or partially neutralize the amine reactive group to reduce curing. rate. The amine compound may contain a monofunctional or polyfunctional amine group ' and it may be a first amine, a second amine and/or a third amine. The amine compound may contain a radical polymerizable group or an additional-functional group such as a hydrolyzable group, if necessary. The amine compound may be a monomeric, oligomeric or polya-based amine group which may be supported on an organic, organic or organic agglomerated compound. Uses and Applications Subsequent curing of the film can be used directly or after a post-treatment or reaction step. In particular, a cured film can be used to selectively accept subsequent chemical grafting, bond dyeing or coloration. As an example, the method can be used to selectively coat a polyolefin for subsequent reaction on a cured film, in which case it can be simply dipped into the lacquer by a substrate that has previously been subjected to the methods described herein, Or by spraying the entire surface. The cured film can be discrete, continuous or semi-continuous. The cured film can be applied by itself and the surface of the film is protruded. In some cases, the pressure or heat applied by the curing may be used to etch the film below the level of the original surface. The image is burned into the cellulose substrate as described in 127115.doc • 41 - 200844117. EXAMPLES The following examples are set forth to illustrate the invention to the general practitioner. The number average molecular weight (?n) of the organopolyoxyalkylene polymer and the resin is a value measured by gel permeation chromatography using a polystyrene calibration standard unless otherwise impounded. The polydispersity index of the sample analyzed by gel permeation chromatography (GPC) is in the range of 12-2 2 unless otherwise specifically stated. In all of the following examples, the oxygen content of the component (IV) is not controlled except for the case where an argon glove box is to be used, and it is implicitly sufficiently present in the ambient air of the environment in which the examples are carried out, and It exists in a much smaller amount of content which is naturally dissolved in the ingredients during storage and handling. Comparative Example 1 Hydroxylation of 35% solids in 丨-methoxypropyl acetate was carried out using a spin coater (EC101-DT, Headway Research, Inc.) at 150 rpm for 20 seconds. A solution of methacryloxypropyl phenyl sesquiterpene oxide TPh〇.3T methyl propyloxypropyl hydrazine 7 resin was spin-coated onto a 1 mm (mm) diameter clean enamel wafer (Model P<100>, from Exsil, Inc., Providence, RI, USA). The new coated surface of the film was placed face down on top of a 1 pint plastic cup containing 85 g of acetic acid (filled less than 1/5 of the total volume of the cup). The wafer is supported by the outer edge of the 90 mm diameter of the cup. After about 5 seconds, the wafer is lifted from the cup. The resulting film exhibiting film was exposed to a small portion of the area other than the outer edge of the cup relative to the periphery of the acetic acid vapor in the headspace without discoloration. When one portion of the film is washed with heptane or isopropanol 127115.doc -42· 200844117, the thickness of the film in the exposed area is significantly reduced, as indicated by the permanent change in the interference color of the film. Example 1 1.007 g of hydroxy-terminated 3-methylpropenyloxypropylphenyl sesquiterpene oxide diluted to 25 Å/〇 solid in 1-methoxy-2-prop-acetate in a vial The TPh〇3Tu-C (4) resin is combined with a ruthenium-ruthenium catalyst containing triethylboron which is mismatched with a molar amount of ruthenium and 3-propanediamine. The composition was spin coated onto a 100 mm diameter clean enamel wafer using a spin coater (EC101-DT, Headway Research, Inc.) at 1500 rpm for 20 seconds. The resulting film exhibited a slight haze. Next, a second solution containing 3.8 wt% of acrylic acid in octylmethyltrioxane was spin-coated onto the uncured film at 1500 rpm for 20 seconds. The resulting cured film is hazy and slightly uneven due to curing of the film upon contact with the acrylic solution cement; however, the film cures well, such as by scraping with a doctor blade and touching the gloved finger and no film transfer is observed Gloves to confirm. Adhesion to the substrate was confirmed 24 hours after room temperature by applying 3M Scotch Magic tape and manually rubbing the tape substrate to ensure sufficient contact pressure for 5 seconds. The tape was then peeled off by hand at an angle of about 9 〇 at a rate of about 1 〇〇吋/min to indicate good adhesion to the enamel wafer. Example 2 In a vial, it was diluted to 25 Å in 丨-methoxy-2-propyl acetate. Solid 1.050 g hydroxy-terminated 3_mercapto propylene methoxy propyl phenyl sesquiterpene oxy-oxygen TPhG.3Tw propyl... resin with three _ positive _ containing gram of equimolar methoxypropylamine 〇〇75 g catalyst combination of butylborane. 127115.doc -43 · 200844117 The composition was spin coated onto a 100 mm diameter clean enamel wafer using a Headway spin coater at 2000 rpm for 20 seconds. The new coated surface of the film was then placed face down on top of a 1 pint plastic cup containing 85 g (filled less than 1/5 of the total volume of the cup) of acetic acid. The wafer is supported by the outer edge of the 9 mm diameter of the cup. After about 5 seconds, the wafer is lifted from the cup. The resulting film exhibited different discoloration of the film exposed to a small area outside the outer edge of the cup relative to the periphery in the region of the acetic acid vapor in the headspace. The material on the periphery can be applied, but the material inside the outer edge is well cured into a haze-free film which is stable to repeated washing of heptane. After the last 24 hours, the cured film was rubbed with a 3 m Scotch Magic tape for 5 seconds, then peeled off by hand at a rate of about 1 〇〇吋 / min at a 9 〇 angle and resistant to delamination and not shown. Discoloration (this will indicate a change in film thickness) indicating good adhesion to the germanium wafer. Example L Multilayer Film A multilayer film was produced on a 1 〇〇mm 矽 wafer by a first spin coating (2500 rpm for 20 seconds), which is a 3·764 邑 hydroxyl terminated dilution containing 25% solids. 3-methylpropoxypropyl phenyl sesquiterpene oxide TPh〇j methyl propyl oxypropyl m Π — k 0.71⁄43⁄4 and contains 3 methoxy groups with 1.3 molar equivalents The propylamine is mismatched with a solution of one-n-butylborane and 416 g of catalyst. 8-10 microliters of deionized water droplets were applied to the film using a fine pile tip dyeing micropipette (Samco #235, Samco Scientific Corp., San Fernando, CA) to form beads with significant positive contact angles. It rolls off the film when tilted to an angle. The film was then exposed to acrylic acid vapor for 4 seconds by flipping the wafer over the acrylic cup in a manner similar to that described in Example 2. 127115.doc -44- 200844117 The resulting film is indicated by a discoloration exposure to the central region of the vapor. After the exposure, another 8-100 microliter of water droplets are applied to the film. At this time, the small droplets spread over the surface of the film at a much lower contact angle, so that the acrylic polymer was present on the surface. A third layer is then deposited by spin coating the additional first solution onto the film under the same conditions. The surface spread of the resulting film did not have water repellency similar to that originally observed in the water droplet test. This example illustrates an embodiment of this method that produces a cured multilayer film having alternating layers of hydrophilic and hydrophobic properties, and wherein the hydrophilic layer can be protected from water. Comparative Example 2 A solution having the same composition as in Comparative Example 1 was spin-coated at 2200 rpm onto an mm crucible wafer having a native surface of antimony oxide for 2 seconds. Comparative Example 3 In a vial 'Make a comparison example! The 2 〇〇 3 g solution used in the mixture was mixed with 0.052 g of a catalyst containing tri-n-butylborane which was mismatched with 1.3 moles of 3-methoxypropylamine. This solution was spin coated onto a 3 〇〇 mm 矽 wafer having a native surface of ruthenium dioxide at 22 rpm for 2 sec. Example 4 A film was prepared in the same manner as in Example 3 except that the film was exposed to glacial acetic acid vapor for 3 sec. in the manner described in Example 2 to cure the film. Comparative Example 4: Dimethyl propyl methoxy propyl phenyl sesquiterpene oxylate TPh methyl propyl ethoxylated propyl group diluted to 1% by weight in toluene at 2200 rpm
〇.85丄 0.1 5 W 脂的溶液旋塗至具有二氧化矽之原生表面的3〇〇mm矽晶圓 127115.doc -45- 200844117 上歷時20秒。 實例5 在此實例中,使來自比較實例4之2.011 g溶液與0.014 g 催化劑(與莫耳當量之3_甲氧基丙胺錯合之三士 丁基 蝴烧)此σ。以與比較實例4相同之方式來製備所得混合物 之薄膜’但以類似實例2中所描述之方式經由將薄膜曝露 至冰醋酸蒸氣持續3 〇秒來固化薄膜。 參考實例-介電常數之測試 使用J.A· W〇〇llam Co·,Inc M-2〇〇〇D光譜橢偏儀來量測 薄膜厚度。使用2_參數Cauchy模型擬合50〇_1〇〇〇 nm之波 長範圍内之光譜。 使用一平行板電容器堆疊方法在i MHz下量測介電常 數,其中測試薄膜係位於晶圓之二氧化矽表面與藉由濺塗 鋁薄膜而產生之上板之間。將Keithley 59〇 cv阻抗增益相 分析器及Hewlett Packard HP-4194A阻抗/增益相分析器連 接Signatone Corp之連接至6吋晶圓樣本台。 樣本 厚度(A) 折射率 介電常數 比較實例2 7900 1.56 ^ ^ 3.38 ±0.17 比較實例3 7995 1.55 ~ 3.56 ±0.18 實例4 8216 1.55 3.63 士 0.18 比較實例4 2210 1.56 3.37±0.16 實例5 2289 1.56 ~ 3.25 士 0·16 此表中之結果確認根據本文所描述之方法的系統固化不 會引入既定樹脂之折射率或介電常數的顯著改變。 127115.doc -46- 200844117 情況下,可在本文所描述 在不脫離本發明之基本特徵# 之化合物、組合物及方法方面進行其他變化。本文特定說 明之本發明之實施例僅為例示性的,且不意欲作為對其除 附加申睛專利範圍中所定義以外之範轉的限制。’、 127115.doc 47-A solution of 〇.85丄 0.1 5 W grease was spin-coated onto a 3 〇〇mm 矽 wafer having a native surface of cerium oxide 127115.doc -45- 200844117 for 20 seconds. Example 5 In this example, 2.011 g of the solution from Comparative Example 4 was subjected to this σ with 0.014 g of a catalyst (three butyl butyl which was mismatched with a molar equivalent of 3-methoxypropylamine). The film of the resulting mixture was prepared in the same manner as in Comparative Example 4, but the film was cured in the same manner as described in Example 2 by exposing the film to glacial acetic acid vapor for 3 sec. Reference Example - Dielectric Constant Test The film thickness was measured using a J.A. W〇〇llam Co., Inc M-2〇〇〇D spectroscopic ellipsometer. The 2_parameter Cauchy model was used to fit the spectrum over a wavelength range of 50 〇 1 〇〇〇 nm. The dielectric constant is measured at i MHz using a parallel plate capacitor stacking method in which the test film is placed between the ceria surface of the wafer and the upper plate produced by sputtering an aluminum film. A Keithley 59 〇 cv impedance gain phase analyzer and a Hewlett Packard HP-4194A impedance/gain phase analyzer were connected to a 6-inch wafer sample station by Signatone Corp. Sample Thickness (A) Comparison of Refractive Index Dielectric Constant Example 2 7900 1.56 ^ ^ 3.38 ±0.17 Comparative Example 3 7995 1.55 ~ 3.56 ±0.18 Example 4 8216 1.55 3.63 ± 0.18 Comparative Example 4 2210 1.56 3.37 ± 0.16 Example 5 2289 1.56 ~ 3.25士 0·16 The results in this table confirm that system curing according to the methods described herein does not introduce significant changes in the refractive index or dielectric constant of a given resin. 127115.doc -46- 200844117 In other instances, other variations can be made in the compositions, compositions, and methods described herein without departing from the essential characteristics of the invention. The embodiments of the invention are specifically described herein, and are not intended to be limiting of the scope of the invention as defined in the appended claims. ’, 127115.doc 47-
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| TWI464055B (en) * | 2011-11-07 | 2014-12-11 | Creating Nano Technologies Inc | Method for manufacturing film |
| CN106457756A (en) * | 2014-05-19 | 2017-02-22 | 富士胶片株式会社 | Method for manufacturing quantum-dot-containing laminate, quantum-dot-containing laminate, backlight unit, liquid crystal display device, and quantum-dot-containing composition |
| TWI709399B (en) * | 2017-01-18 | 2020-11-11 | 日商大金工業股份有限公司 | Containers for administering, storing, transporting, or delivering proteins or protein-containing compositions, as well as devices for manufacturing proteins or protein compositions |
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| ES2562632T3 (en) * | 2009-06-26 | 2016-03-07 | Basf Se | Paint coating system and production procedure of a multilayer paint coating |
| ES2562104T3 (en) * | 2009-06-26 | 2016-03-02 | Basf Se | Dissociation procedure of an organoborane-amine complex |
| WO2010149733A1 (en) * | 2009-06-26 | 2010-12-29 | Basf Se | System and method for curing a composition |
| CN102458691B (en) * | 2009-06-26 | 2014-09-17 | 巴斯夫欧洲公司 | Method of forming cured coating composition on automobile component |
| SG176838A1 (en) * | 2009-06-26 | 2012-02-28 | Basf Se | Method of curing a coating composition comprising a radical curable compound and an organoborane-amine complex |
| WO2012051487A1 (en) | 2010-10-15 | 2012-04-19 | Dow Corning Corporation | Silicon-containing materials with controllable microstructure |
| CN103409835B (en) * | 2013-08-05 | 2015-07-29 | 江苏瑞泰科技有限公司 | The production method of thin dawn polyphony thioether short fiber |
| WO2016028783A1 (en) | 2014-08-18 | 2016-02-25 | Lord Corporation | Method for low temperature bonding of elastomers |
| CN106497413A (en) * | 2015-09-07 | 2017-03-15 | 南通市乐佳涂料有限公司 | A kind of " water-water " colorful environment protection multifunctional coating and preparation method thereof |
| CN111133074B (en) | 2017-07-28 | 2023-01-03 | 艾利丹尼森公司 | Pressure sensitive adhesives and articles having hyperbranched silsesquioxane cores and methods of making the same |
| US10995240B2 (en) * | 2018-07-20 | 2021-05-04 | Palo Alto Research Center Incorporated | All-in-one fast curing acrylic structural adhesive |
| CN111384268B (en) * | 2018-12-29 | 2021-06-18 | Tcl科技集团股份有限公司 | Preparation method of quantum dot light-emitting diode and quantum dot ink |
| CN111057523B (en) * | 2019-11-14 | 2021-03-16 | 浙江巨化新材料研究院有限公司 | Medium-high temperature heat pump mixed working medium |
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| WO2006073696A1 (en) * | 2005-01-04 | 2006-07-13 | Dow Corning Corporation | Siloxanes and silanes cured by organoborane amine complexes |
| WO2007040794A1 (en) * | 2005-09-21 | 2007-04-12 | Dow Corning Corporation | Ambient lithographic method using organoborane amine complexes |
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- 2007-11-21 WO PCT/US2007/024327 patent/WO2008085234A1/en not_active Ceased
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI464055B (en) * | 2011-11-07 | 2014-12-11 | Creating Nano Technologies Inc | Method for manufacturing film |
| CN106457756A (en) * | 2014-05-19 | 2017-02-22 | 富士胶片株式会社 | Method for manufacturing quantum-dot-containing laminate, quantum-dot-containing laminate, backlight unit, liquid crystal display device, and quantum-dot-containing composition |
| TWI709399B (en) * | 2017-01-18 | 2020-11-11 | 日商大金工業股份有限公司 | Containers for administering, storing, transporting, or delivering proteins or protein-containing compositions, as well as devices for manufacturing proteins or protein compositions |
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