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TW200833450A - Solder paste composition and solder precoating method - Google Patents

Solder paste composition and solder precoating method

Info

Publication number
TW200833450A
TW200833450A TW96104673A TW96104673A TW200833450A TW 200833450 A TW200833450 A TW 200833450A TW 96104673 A TW96104673 A TW 96104673A TW 96104673 A TW96104673 A TW 96104673A TW 200833450 A TW200833450 A TW 200833450A
Authority
TW
Taiwan
Prior art keywords
solder
paste composition
solder paste
dam
bump
Prior art date
Application number
TW96104673A
Other languages
Chinese (zh)
Other versions
TWI387504B (en
Inventor
Hitoshi Sakurai
Yoichi Kukimoto
Original Assignee
Harima Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Chemicals Inc filed Critical Harima Chemicals Inc
Publication of TW200833450A publication Critical patent/TW200833450A/en
Application granted granted Critical
Publication of TWI387504B publication Critical patent/TWI387504B/en

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

To provide a solder paste composition, which suppresses breakage of a bump and forms a bump with high yield and uniform height by a solder precoat method using a dam. The solder precoat method using a solder paste composition 5 is carried out as follows: a dam 4 is formed around electrodes 2 on a substrate 1; an opening surrounded by the dam 4, in which the electrodes 2 are positioned, is filled with the solder paste composition 5; and the solder paste composition 5 put in the opening is heated and adhered to the surfaces of the electrodes 2, so that a solder bump 6 is formed. The solder paste composition contains solder powder, and the particle size distribution of the solder powder is as follows: particles having < 10 μm diameter is ≥ 16%; and the total of particles having < 10 μm diameter and particles having ≥ 10 μm and < 20 μm is ≥ 90%.
TW96104673A 2005-08-11 2007-02-08 Solder paste composition and solder precoating method TWI387504B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005233111A JP4249164B2 (en) 2005-08-11 2005-08-11 Solder paste composition

Publications (2)

Publication Number Publication Date
TW200833450A true TW200833450A (en) 2008-08-16
TWI387504B TWI387504B (en) 2013-03-01

Family

ID=37848030

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96104673A TWI387504B (en) 2005-08-11 2007-02-08 Solder paste composition and solder precoating method

Country Status (2)

Country Link
JP (1) JP4249164B2 (en)
TW (1) TWI387504B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8661659B2 (en) 2009-04-30 2014-03-04 Showa Denko K.K. Method of producing circuit board
TWI778132B (en) * 2017-09-21 2022-09-21 日商田村製作所股份有限公司 Flux and Solder Paste

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5461850B2 (en) * 2009-02-24 2014-04-02 株式会社Ｕａｃｊ Method for producing corrosion-resistant inner surface tin-coated copper pipe
JP2013094836A (en) * 2011-11-02 2013-05-20 Mitsubishi Materials Corp Solder paste for precoat and method of manufacturing the same
KR20150128310A (en) * 2014-05-09 2015-11-18 삼성전기주식회사 flux for solder paste, solder paste and manufacturing method of solder bump
WO2017179704A1 (en) * 2016-04-15 2017-10-19 三菱マテリアル株式会社 Method for forming solder bump
TWI606565B (en) * 2016-08-31 2017-11-21 金寶電子工業股份有限公司 Package structure and manufacturing method thereof
CN109530977B (en) * 2017-09-21 2021-11-19 株式会社田村制作所 Flux and solder paste

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8661659B2 (en) 2009-04-30 2014-03-04 Showa Denko K.K. Method of producing circuit board
TWI778132B (en) * 2017-09-21 2022-09-21 日商田村製作所股份有限公司 Flux and Solder Paste

Also Published As

Publication number Publication date
TWI387504B (en) 2013-03-01
JP2007044740A (en) 2007-02-22
JP4249164B2 (en) 2009-04-02

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees