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TW200833203A - Electronic device with flip module having low height - Google Patents

Electronic device with flip module having low height

Info

Publication number
TW200833203A
TW200833203A TW096126686A TW96126686A TW200833203A TW 200833203 A TW200833203 A TW 200833203A TW 096126686 A TW096126686 A TW 096126686A TW 96126686 A TW96126686 A TW 96126686A TW 200833203 A TW200833203 A TW 200833203A
Authority
TW
Taiwan
Prior art keywords
electronic device
pcb
top surface
module
low height
Prior art date
Application number
TW096126686A
Other languages
English (en)
Inventor
Hakan Bygdo
Per Holmberg
Original Assignee
Sony Ericsson Mobile Comm Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Ericsson Mobile Comm Ab filed Critical Sony Ericsson Mobile Comm Ab
Publication of TW200833203A publication Critical patent/TW200833203A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
TW096126686A 2007-01-22 2007-07-20 Electronic device with flip module having low height TW200833203A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/625,426 US7965520B2 (en) 2007-01-22 2007-01-22 Electronic device with flip module having low height

Publications (1)

Publication Number Publication Date
TW200833203A true TW200833203A (en) 2008-08-01

Family

ID=38925672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096126686A TW200833203A (en) 2007-01-22 2007-07-20 Electronic device with flip module having low height

Country Status (6)

Country Link
US (1) US7965520B2 (zh)
EP (1) EP2127504B1 (zh)
CN (1) CN101611658B (zh)
AT (1) ATE513452T1 (zh)
TW (1) TW200833203A (zh)
WO (1) WO2008090399A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8804368B2 (en) * 2009-04-30 2014-08-12 Sony Corporation Downward-facing optical component module
GB2477358A (en) * 2010-02-02 2011-08-03 Thales Holdings Uk Plc RF testing an integrated circuit assembly during manufacture using a interposed adaptor layer which is removed after test to attach the IC to a BGA
US20120170230A1 (en) * 2010-12-30 2012-07-05 Research In Motion Limited Combining printed circuit boards
CN106659032A (zh) * 2015-10-29 2017-05-10 小米科技有限责任公司 电子设备的金属壳体和电子设备
CN105338772A (zh) * 2015-11-24 2016-02-17 小米科技有限责任公司 电子设备的前壳组件和金属前壳结构

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
US5608262A (en) * 1995-02-24 1997-03-04 Lucent Technologies Inc. Packaging multi-chip modules without wire-bond interconnection
US5617297A (en) * 1995-09-25 1997-04-01 National Semiconductor Corporation Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards
US5650755A (en) * 1996-03-18 1997-07-22 Motorola, Inc. Voltage controlled oscillator module assembly
US6197614B1 (en) * 1999-12-20 2001-03-06 Thin Film Module, Inc. Quick turn around fabrication process for packaging substrates and high density cards
US20010033478A1 (en) * 2000-04-21 2001-10-25 Shielding For Electronics, Inc. EMI and RFI shielding for printed circuit boards
US6734539B2 (en) * 2000-12-27 2004-05-11 Lucent Technologies Inc. Stacked module package
US6544047B2 (en) * 2001-03-30 2003-04-08 Intel Corporation Dual-swiping interconnection clip, and hook and slot arrangement for printed circuit board (PCB) attachment
JP2002314031A (ja) * 2001-04-13 2002-10-25 Fujitsu Ltd マルチチップモジュール
DE10142655A1 (de) 2001-08-31 2003-04-03 Epcos Ag Bauelementanordnung
JP2004118694A (ja) * 2002-09-27 2004-04-15 Toshiba Corp コンビｉｃカードの実装方法
JP2005026263A (ja) 2003-06-30 2005-01-27 Nec Compound Semiconductor Devices Ltd 混成集積回路
KR100851683B1 (ko) 2003-07-02 2008-08-11 지멘스 악티엔게젤샤프트 전자파간섭으로 방해받는 전자 장치들의 전자 컴포넌트들 및/또는 회로들 차폐
US7076870B2 (en) * 2004-08-16 2006-07-18 Pericom Semiconductor Corp. Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank
CA2580057A1 (en) * 2004-09-16 2006-03-30 Cirque Corporation A contactless card reader integrated into a touchpad
US7545029B2 (en) * 2006-08-18 2009-06-09 Tessera, Inc. Stack microelectronic assemblies

Also Published As

Publication number Publication date
EP2127504A1 (en) 2009-12-02
ATE513452T1 (de) 2011-07-15
CN101611658A (zh) 2009-12-23
EP2127504B1 (en) 2011-06-15
CN101611658B (zh) 2011-09-14
US7965520B2 (en) 2011-06-21
US20080174972A1 (en) 2008-07-24
WO2008090399A1 (en) 2008-07-31

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