200832592 九、發明說明 【發明所屬之技術領域】 本發明是有關基板處理裝置及半導體裝置的製造方法 〇 例如，關於有效利用於在製作半導體積體電路裝置（ 以下稱爲1C )的半導體晶圓（以下稱爲晶圓）中形成絕緣 膜、金屬膜、半導體膜等的薄膜或擴散雜質之批次式縱形 擴散· CVD裝置者。 【先前技術】 在基板處理裝置之一例的批次式縱形擴散《CVD裝置 (以下稱爲批次式CVD裝置）中，是複數片的晶圓被收 納於收納容器的狀態下處理。 就以往的收納容器而言，有開放卡匣（open cassette )、及 FOUP( front opening unified pod，以下稱爲箱） 。開放卡匣是形成大略立方體的箱形狀，對向之一對的面 會被開口。箱是形成大略立方體的箱形狀，一個的面會被 開口，且在該開口面可裝脫自如地裝著門。 箱是在密閉晶圓的狀態下搬送。因此，即使在箱周圍 的環境中存在粒子等，箱内的晶圓還是可維持清浄度。因 此’設置有批次式CVD裝置的無塵室内不必將清浄度設 定太高。其結果，可降低無塵室的清浄度維持所要的成本 〇 於是，在最近的批次式CVD裝置中，將箱採用於收 -4 - 200832592 納容器。 使用箱的批次式CVD裝置是在晶圓搬入箱内或晶圓 從箱内搬出的晶圓授受埠具備箱開閉裝置（以下稱爲開箱 器（Pot Opener ))及測繪（mapping )裝置（例如參照專 利文獻1 )。 開箱器可裝著或卸下門來開閉箱的晶圓出入口。測繪 裝置是藉由檢測出箱内的晶圓，來檢測出晶圓是否分別被 保持於各晶圓保持溝（槽）。 〔專利文獻1〕特開2 0 0 3 - 7 8 0 1號公報 【發明內容】 (發明所欲解決的課題） 以往的批次式CVD裝置中，是在從裝置外部（框體 外部）將箱搬入至批次式CVD裝置的框體内或從框體内 搬出箱的搬入搬出部中，無法著脫箱的門。 在搬入搬出部中爲了裝著或卸下箱的門，可考量在搬 入搬出部設置退避可能的開箱器之構成。亦即，從框體外 將箱搬入至框體内，或從框體内將箱搬出至框體外時，藉 由使開箱器從搬入搬出部退避，可確保使箱搬入或搬出的 通路。 然而，在此構成中’爲了使開箱器從搬入搬出部退避 ，會有批次式C V D裝置形成複雜的問題點。 本發明的目的是在於提供一種在將箱搬出入至框體内 外的搬入搬出部中，可裝著或卸下箱的門，且可使構造形 -5- 200832592 成簡單之基板處理裝置及半導體裝置的製造方法。 (用以解決課題的手段） 用以解決上述課題的手段是如其次般。 亦即，一種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係鄰接於上述搬入搬出部而設置，保管上 述收納容器； 開閉裝置，其係進行載置於該載置部之上述收納容器 的上述基板出入口的開閉； 搬送裝置，其係具有保持上述收納容器下面的保持機 構，經由上述開閉裝置的上方，在上述保管室内與外之間 ，搬送藉由該保持機構來保持的上述收納容器；及 昇降機構，其係於上述開閉裝置進行上述收納容器的 開閉時之上述載置部的高度位置、與上述搬送裝置進行上 述收納容器的授受的高度位置之間，進行上述載置部的昇 降。 〔發明的效果〕 若根據上述手段，則藉由設置昇降機構，搬送裝置可 -6 - 200832592 經由開閉裝置的上方來從載置裝置使收納容器搬送至框體 内，因此可順暢交接的同時，可不用使開閉裝置退避，移 動收納容器，且在搬入搬出部中可開閉收納容器的蓋體。 【實施方式】 以下，按照圖面來説明本發明之一實施形態。 在本實施形態中，本發明的基板處理裝置爲批次式 CVD裝置亦即批次式縱形擴散· CVD裝置，如圖1及圖2 所示般構成。 並且，在本實施形態中，收納基板亦即晶圓1的收納 容器爲使用箱2。 箱2是形成大略立方體的箱形狀，如圖3所示，在箱 2的一'個側壁開設有晶圓出入口 3。在晶圓出入口 3作爲 予以閉塞的蓋體之門4會被安裝成可裝著或卸下。在箱2 的下面埋設有複數個的定位孔5。 如圖1、圖2及圖3所示，本實施形態的批次式C V D 裝置1 0是具備作爲框體的一部份之主框體1 1。 主框體1 1的正面壁1 1 a是構成區劃主框體1 1内外的 區劃壁。在該正面壁1 1 a的中間高度開設有使主框體1 1 内外連通的箱搬入搬出口 1 2。箱搬入搬出口 1 2是供以搬 入箱2，或搬出箱2。前遮擋板（front shutter ) 13是在於 開啓或關閉箱搬入搬出口 1 2。 在主框體1 1的正面壁（區劃壁）1 1 a的外側設置有裝 載埠1 4。裝載埠1 4是位於箱搬入搬出口 1 2的大略正下方 200832592 。裝載埠1 4是構成搬入搬出部。裝載埠i 4會將所 的箱2對準於箱搬入搬出口 12。裝載埠14是2個 置。 箱2是在裝載埠14上藉由位於批次式CVD裝 框體外）的工程内搬送裝置（亦稱爲工程間搬送裝 搬入，或從裝載埠1 4上搬出。 就工程内搬送裝置而言，有圖1所示之床走行 搬送車（以下稱爲AGV ) 9、圖8所示之頂棚走行 搬送裝置（後述）等，皆可適用。 在正面壁1 1 a的前面側設有作爲前框體的箱 14A。匣14A是形成可圍繞裝載埠14及該上方空 匣1 4 A的頂棚壁開設有頂棚開口 i 4B，在箱1 4的 開設有正面開口 14C。亦即，裝載埠14可經由正 14C來受取箱2，且亦可經由頂棚開口 14B來受取。 另外，匣14A與主框體1 1是構成批次式CVD 框體。 如圖1所示，在匣1 4 A内設置有後述的控制器 在裝載璋14設置有箱升降機（p〇d elevator) 升降機15是構成在高度與箱搬入搬出口 12的高度 箱2昇降的機構。 箱升降機1 5是具備：昇降驅動裝置16、及藉 驅動裝置1 6來昇降的軸（shaft ) 1 7。水平設置於勒 端的保持台（收納容器載置部）1 8與作爲收納容器 段（亦稱爲收納容器定位具）的複數個支承運丨 被載置 並列設 置外（ 置）來 型構内 型構内 (box ) 間。在 正面壁 面開口 裝置的 ΊΊ。 15。箱 之間使 由昇降 & 17上 定位手 動銷（ -8- 200832592 kinematic pin ) 1 9是被連結於箱升降機1 5。複數根的運 動銷1 9是突設於保持台1 8上面，分別嵌入形成於箱2下 面的各定位孔5，藉此來將箱2定位於保持台1 8。箱升降 機1 5是藉由保持台1 8來由下支撐箱2 ’且在使支承運動 銷1 9嵌入箱2的定位孔5之狀態下令箱2昇降。 亦即，保持台1 8是構成保持箱2下面的保持部’且 構成箱載置部。 在主框體11的正面壁1 1 a的内側設置有構成預載（ Load Lock )室20的密閉框體21。密閉框體21是對應於 裝載埠（Load Port) 14的高度。預載室20是構成可維持 充塡惰性氣體例如氮氣的箱蓋體開閉室。 如圖1所示，在密閉框體2 1分別連接氮氣體供給線 路2 1 A的一端及排氣線路2 1 B的一端。氮氣體供給線路 2 1 A的另一端是連接至氮氣體供給裝置2 1 A ’排氣線路2 1 B 的另一端是連接至排氣裝置2 1 B ’。氮氣體供給線路2 1 A 是對預載室20内供給氮氣體。排氣線路21B是將預載室 20内予以排氣。 另外，控制器77是在於控制氮氣體供給裝置21 A’及 排氣裝置2 1 B ’。 在主框體1 1的正面壁1 1 a，門出入口 2 2會被開設於 預載室20上部所對向的部位。門出入口 22是形成對應於 裝載埠14所載置之箱2的晶圓出入口 3的大小（比晶圓 出入口 3更大）。 在預載室20内設置有作爲收納容器蓋體開閉部（亦 -9- 200832592 稱爲開閉裝置）的開箱器23。開箱器23是在於開啓或 閉被載置於裝載埠1 4之箱2的晶圓出入口 3及正面壁] 的門出入口 22。 開箱器23是具備移動台25及閉合器26。移動台 是可對門出入口 22移動於前後（垂直方向）及上下（ 行方向）。作爲蓋體保持部的閉合器26是藉由移動台 來移動。閉合器26可保持門4，且可阻塞門出入口 22。 亦即，移動台25會使保持門4之狀態的閉合器26 動於前後及上下，藉此開箱器23可開啓或關閉箱2的 圓出入口 3及門出入口 22。 在對向於密閉框體2 1的門出入口 22的部位，設置 作爲基板狀態檢測裝置的測繪裝置27。 測繪裝置27是具備：驅動源的線性促動器28、夾 (holder ) 29、及複數的檢測元件30。夾具29可藉由 性促動器2 8來對箱2的晶圓出入口 3移動於前後方向 複數的檢測元件30是被保持於夾具29。 測繪裝置2 7是藉由各檢測元件3 0來分別檢測出箱 内的晶圓1。藉此，測繪裝置27可檢測出是否晶圓1分 被各1片保持於箱2内的複數個槽。 在主框體1 1内的前側領域形成有箱保管室1 1 b。在 保管室1 1 b内設置有旋轉式箱架3 1。旋轉式箱架3 1是 置於箱保管室1 1 b内的前後方向大略中央部中的上部空 。旋轉式箱架3 1是構成在框體内保管收納容器的保管 關 la 25 平 25 移 晶 有 具 線 〇 2 別 箱 配 間 架 -10- 200832592 旋轉式箱架31是具備支柱32及複數片的架板 柱3 2是垂直立設，在水平面内間歇旋轉。複數片 3 3是在支柱3 2的上中下段的各位置被放射狀支撐 片的架板3 3可分別載置複數個的箱2。 在架板3 3的上面突設有複數個的支承運動銷 承運動銷3 4可嵌入箱2的定位孔5。 在箱保管室1 1 b内設置有箱搬送裝置3 5。箱搬 3 5是構成在裝載埠1 4與旋轉式箱架3 1之間經由箱 出口 12來搬送箱2的搬送裝置。 箱搬送裝置3 5是藉由作爲收納容器昇降機構 降機3 5 a、及作爲收納容器搬送機構的箱搬送機構 構成。箱搬送機構3 5b是具有保持箱的下面之保持 稱爲保持機構）。 箱搬送裝置3 5是藉由箱升降機3 5 a與箱搬送機 的連續動作，在保持台1 8與旋轉式箱架3 1和後述 器42的載置台43之間搬送箱2。 如圖2所示，在主框體1 1内的前後方向大略 中的下部，副框體40繪被構築於後端。 在副框體40的正面壁40a，一對的晶圓搬入 4 1、4 1會在垂直方向排列成上下二段而開設，在上 晶圓搬入搬出口 41、41分別設置有開箱器42、42 搬入搬出口 41可對副框體40内搬入晶圓1，從副丰| 搬出。 開箱器42是具備：載置箱2的載置台43、及 33。支 的架板 。複數 34，支 送裝置 搬入搬 的箱升 35b來 部（亦 構3 5b 的開箱 中央部 搬出口 下段的 。晶圓 匡體40 著脫箱 -11 - 200832592 2的門4之著脫機構4 4。藉由著脫機構4 4來安裝或卸下 被載置於載置台43的箱2的門4，藉此開箱器42可開閉 箱2的晶圓出入口 3。 副框體40是構成預備室45，預備室45是從設置有箱 搬送裝置35及旋轉式箱架31的保管室來隔絶流體。 在預備室45的前側領域設置有晶圓移載機構46。晶 圓移載機構46是具備晶圓移載裝置46a、晶圓移載裝置升 降機46b及鑷子46c。鑷子46c是構成晶圓！的載置部。 晶圓移載裝置46a是使保持晶圓1的鑷子46c在水平面内 旋轉乃至直進。晶圓移載裝置升降機46b是設置於預備室 45内的前方領域右端部。晶圓移載裝置升降機46b是使晶 圓移載裝置46a昇降。 晶圓移載機構46是藉由晶圓移載裝置升降機46b及 晶圓移載裝置46a的連續動作來使鑷子46c所保持的晶圓 1從箱2搬送至載舟（boat )(基板保持具）47，將搬送 的晶圓1裝塡（charging)至載舟47。 並且，晶圓移載機構46是以鑷子46c來保持載舟47 的日日圓1’藉此自載舟47卸下（discharging)，從載舟 47搬送至箱2，而回到箱2。 控制器77是在於控制裝載埠丨4、箱升降機i 5、開箱 器2 3、測繪裝置2 7、旋轉式箱架3 1、箱搬送裝置3 5、開 箱器42、晶圓移載機構46等之批次式CVD裝置内的所有 動作。 在預備室4 5的後側領域設置有用以使載舟4 7昇降的 -12- 200832592 載舟升降機48。 在作爲連結至載舟升降機48的昇降台的連結具之手 臂49水平安裝有加封蓋（sealcap ) 50。加封蓋50是垂直 支撐載舟47，可閉塞後述之處理爐5 1的下端部。 載舟47是具備複數根的保持構件。載舟47是在使複 數片（例如5 0片〜1 2 5片程度）的晶圓1中心一致整列於 垂直方向的狀態下，分別保持於水平。 雖圖示省略，但實際在與晶圓移載裝置升降機46b側 及載舟升降機4 8側呈相反側的預備室4 5的左側端部設置 有清潔氣體供給單元（以下稱爲清潔單元）。清潔單元是 藉由供給風扇及防塵過濾器所構成。清潔單元是在於供給 清浄化後的環境或惰性氣體的清潔空氣（清潔氣體）。 並且，在晶圓移載裝置46a與清潔單元之間設置有刻 槽對準裝置。刻槽對準裝置是構成使晶圓的圓周方向的位 置整合之基板整合裝置。 從清潔單元吹出的清潔空氣是流通至刻槽對準裝置、 晶圓移載裝置46a及載舟47之後，藉由未圖示的管（duct )來吸入。被吸入的清潔空氣是被排氣至主框體1 1的外 部，或被循環至清潔單元的吸入側亦即一次側（供給側） 再度藉由清潔單元來吹出至預備室45内。 在副框體4 0上設置有圖4所示的處理爐5 1。 如圖4所示，處理爐51是具有作爲加熱機構的加熱 器5 2。 加熱器5 2爲圓筒形狀，被支撐於作爲保持板的加熱 -13- 200832592 器基座53，垂直安裝。 在加熱器5 2的内側，與加熱器5 2同心圓狀地配設有 作爲反應管的製程管（process tube) 54。製程管54是由 作爲外部反應管的外管5 5、及設於其内側之作爲内部反應 管的內管5 6所構成。 外管55是例如由石英（Si02 )或碳化矽（SiC)等 的耐熱性材料所形成。外管5 5是内徑比內管5 6的外徑更 大，形成上端閉塞下端開口的圓筒形狀。外管5 5是與內 管5 6同心圓狀地設置。 內管56是例如由石英或碳化矽等的耐熱性材料所形 成。內管56是形成上端及下端開口的圓筒形狀。內管56 的筒中空部是形成處理室5 7。處理室5 7可收容使晶圓1 以水平姿勢多段整列於垂直方向而保持的載舟47。 外管5 5與內管5 6的間隙是形成筒狀空間5 8。 在外管5 5的下方，與外管5 5同心圓狀地配設有岐管 (manifold ) 59。岐管5 9是例如由不鏽鋼所形成。岐管 5 9是形成上端及下端開口的圓筒形狀。岐管5 9是卡合於 外管55及內管56，支撐該等。 岐管59會被加熱器基座53所支撐，藉此製程管54 會形成垂直安裝的狀態。 製程管54及岐管59是形成反應容器。 另外，在岐管5 9與外管5 5之間設有作爲密封構件的 0型環59a。 在加封蓋5 0連接作爲氣體導入部的噴嘴6 0，噴嘴6 0 -14- 200832592 是連通至處理室57内。在噴嘴60連接氣體供給管61。 氣體供給管6 1是在與噴嘴6 0的連接側呈相反的側（ 上流側），經由M F c (質量流控制器）6 2來連接氣體供 給源63。MFC 62是構成氣體流量控制器。氣體供給源63 是在於供給處理氣體、惰性氣體等的所望氣體。 在MFC62是藉由電氣配線C來電性連接氣體流量控 制部64 ’氣體流量控制部64會以所望的時序來控制 M F C 6 2，而使供給的氣體流量能夠形成所望的量。 在岐管5 9設有將處理室5 7内的環境予以排氣的排氣 管6 5。排氣管6 5是配置於筒狀空間5 8的下端部，連通至 筒狀空間5 8。 排氣管65是在與岐管59的連接側呈相反的側（下流 側），經由壓力感側器6 6及壓力調整裝置6 7來連接排氣 裝置6 8。壓力感側器6 6是構成壓力檢測器。排氣裝置6 8 是藉由真空泵等來構成。壓力感側器66、壓力調整裝置 67及排氣裝置68是將處理室57内予以排氣，而使其壓力 能夠形成所定的壓力（真空度）。 在壓力調整裝置67及壓力感側器66是藉由電氣配線 Β來電性連接壓力控制部69。壓力控制部69是根據壓力 感側器66所檢測出的壓力來以所望的時序控制壓力調整 裝置67，而使處理室57内的壓力能夠形成所望的壓力。 加封蓋5 0是從垂直方向下側來抵接於岐管5 9下端。 加封蓋50是構成可將岐管59的下端開口予以氣密地閉塞 之爐口蓋體。 -15- 200832592 加封蓋5 0是例如由不鏽鋼等的金屬所構成，形成圓 盤狀。在加封蓋5 0的上面設有作爲密封構件的〇型環 5 0a。0型環50a是與岐管59的下端抵接。 加封蓋5 0是在與處理室5 7相反的側設置有使載舟旋 轉的旋轉機構7 0。旋轉機構7 0的旋轉軸7 1是貫通加封蓋 50，而連接至載舟47。旋轉軸71是藉由使載舟47旋轉來 令晶圓1旋轉。 在旋轉機構70及載舟升降機48是藉由電氣配線A來 電性連接驅動控制部72。驅動控制部72是以所望的時序 來控制旋轉機構70及載舟升降機48，而使能夠進行所望 的動作。 載舟47是例如由石英或碳化矽等的耐熱性材料所形 成。載舟47是使複數片的晶圓1整列成水平姿勢且彼此 中心一致的狀態，而來保持成多段。 另外，在載舟47的下部，複數片的隔熱板73會以水 平姿勢來配置成多段。隔熱板73是例如使用石英或碳化 矽等的耐熱性材料，形成圓板形狀。隔熱板7 3是構成隔 熱構件。複數片的隔熱板73是使來自加熱器52的熱難以 傳至岐管5 9側。 在製程管54内設置有温度感側器74。温度感側器74 是構成温度檢測器。在加熱器52及温度感側器74是藉由 電氣配線D來電性連接温度控制部7 5。 温度控制部75是根據温度感側器74所檢測出的温度 資訊來整合往加熱器5 2的通電狀況，藉此以所望的時序 -16- 200832592 來控制加熱器5 2，而使處理室5 7内的温度能夠形成所望 的温度分布。 氣體流量控制部64、壓力控制部69、驅動控制部72 及温度控制部75亦構成操作部及輸出入部，電性連接至 控制批次式CVD裝置全體的主控制部76。 氣體流量控制部64、壓力控制部69、驅動控制部72 、温度控制部75及主控制部76是構成控制器77。 其次，針對使用以上構成的批次式CVD裝置時來説 明本發明之一實施形態的1C製造方法。 另外，在以下的説明中，構成批次式CVD裝置的各 部之作動是藉由控制器77來控制。 如圖1〜圖3所示，當工程内搬送裝置經由正面開口 14C或頂棚開口 14B，搬入至裝載埠14時，箱2是被載置 於保持台1 8。 此時，保持台1 8的支承運動銷1 9會被嵌入箱2的下 面的定位孔5，藉此箱2會形成定位於保持台1 8的狀態。 其次，如圖5 ( a )所示，在裝載埠1 4中，箱2會被 移動於開箱器23的方向，而門4會被保持於開箱器23的 閉合器2 6。 一旦閉合器26保持門4，則會藉由移動台25的後退 來使門4從晶圓出入口 3卸下（脫裝）。 然後，如圖5 ( b )所示，閉合器26是在預載室20内 藉由移動台25的下降來從晶圓出入口 3的位置脫離。 一旦晶圓出入口 3被開放，則如圖5 ( b )所示，測繪 -17- 200832592 裝置2 7的夾具2 9會藉由線性促動器2 8來插入至晶圓出 入口 3。測繪裝置2 7的檢測元件3 0是在於測繪箱2内的 晶圓1。 一旦所定的測繪完了，則測繪裝置2 7的夾具2 9會藉 由線性促動器2 8來使從晶圓出入口 3回復到原來的待機 位置。 一旦夾具2 9回復到待機位置，則閉合器2 6會藉由移 動台25的上昇來移動至晶圓出入口 3的位置。 然後，如圖5(a)所示，閉合器26會藉由移動台25 的前進來將門4安裝於晶圓出入口 3 (裝著）。 當藉由該測繪裝置27所讀取的測繪資訊、與有關該 相（δ賈取封象的相）2所預先提供的測繪資訊不同時，所 被發現不同的箱2會從裝載埠14藉由工程内搬送裝置、 例如圖1所示的AGV9來立即搬送至晶圓編成工程或之前 的工程等。 藉此，與將箱2搬入至主框體1 1内、特別是載置台 43或旋轉式箱架3 1後回到搬入搬出部之後返送的情況時 相較之下，可大幅度減少步驟。進而可抑止往載舟47之 晶圓載置時間的増大及晶圓處理開始待機時間的増大。 當藉由前述的測繪裝置27所讀取的測繪資訊、與有 關該箱2所預先提供的測繪資訊一致時，如圖6所示，藉 由保持台1 8來支撐的箱2會利用箱升降機1 5來從裝載埠 14上昇至箱搬入搬出口 12的高度。 具體而言’保持台1 8是上昇至比密閉框體2 1更上方 -18- 200832592 ，亦即可藉由箱搬送機構3 5b來將箱2從下側拾取的高度 〇 一旦箱2上昇至箱搬入搬出口 12的高度，則箱搬入 搬出口 1 2會由前遮擋板1 3來開放。 接著，箱搬送機構35b會潛入箱搬入搬出口 12，如圖 6所示，被保持台18所支撐的箱2是藉由箱搬送裝置35 的箱搬送機構3 5b來從下側拾取。亦即，在保持台丨8與 箱搬送機構之間交接箱2。 藉由箱搬送機構35b來拾取的箱2是從箱搬入搬出口 1 2來搬入至主框體1 1内。亦即’箱2是藉由箱搬送機構 來經由開箱器23或密閉框體2 1的上方來從主框體1 1外 搬入内。另外，亦可跨越開箱器23或密閉框體21來從主 框體1 1外搬入内。 如圖1及圖2所示’被搬入的箱2是藉由箱搬送裝置 3 5來自動地搬送至旋轉式箱架3 1所指定的架板3 3而交接 〇 此時，架板3 3的支承運動銷3 4會被嵌入箱2的下面 的定位孔5，藉此箱2會形成被定位保持於架板3 3的狀態 〇 箱2是暫時被保管於架板3 3。 然後，箱2是藉由箱搬送裝置3 5來從架板3 3搬送至 一方的開箱器42，而移載至載置台43。 此時，開箱器42的晶圓搬入搬出口 41會藉由著脫機 構44來關閉，在預備室45中流通充滿清潔空氣。 -19- 200832592 在預備室4 5充滿作爲清潔空氣的氮氣。在此狀態下 ，預備室4 5的氧濃度是例如2 0 p p m以下，遠比主框體1 1 的内部（大氣環境）的氧濃度更低。 另外，藉由搬送機構35b來從箱搬入搬出口 12搬入 至主框體1 1内的箱2，亦有時會直接被搬送至設置於晶圓 搬入搬出口 41的開箱器42。 被載置於載置台43的箱2是開口側端面會被推壓至 正面壁40a的晶圓搬入搬出口 41開口緣邊部。接著，門4 會藉由著脫機構44來卸下，箱2會開放於晶圓出入口 3。 此時，因爲在裝載埠1 4中已經被測繪，所以有關箱2 内的晶圓1群之測繪可省略。 一旦箱2藉由開箱器42而開放，則晶圓移載裝置46a 會利用鑷子46c經由晶圓出入口 3來從箱2拾取晶圓1。 一旦藉由鑷子46c來拾取晶圓1，則晶圓移載裝置46a會 將晶圓1搬送至刻槽對準裝置（未圖示）。刻槽對準裝置 是在於對準晶圓1位置。位置對準後，晶圓移載裝置46 會藉由鑷子46c來從刻槽對準裝置拾取晶圓1，搬送至載 舟 47。晶圓移載裝置 46會將搬送的晶圓1裝塡（ charging )至載舟 47。 將晶圓1交接至載舟47後的晶圓移載裝置46a會回 到箱2，將其次的晶圓1裝塡至載舟47。 在該一方（上段或下段）的開箱器42之利用晶圓移 載機構46來將晶圓1裝塡至載舟47的作業中，另一方（ 下段或上段）的開箱器42是藉由箱搬送裝置3 5來從旋轉 -20- 200832592 式箱架31搬送移載別的箱2。在該另一方的開箱器42中 是同時進行開箱器42之箱2的開放作業。 一旦被預先指定的片數的晶圓1被裝塡於載舟47，則 藉由爐口遮擋板（shutter )(未圖示）所被關閉的處理爐 5 1的下端部會藉由爐口遮擋板來開放。 接著，保持晶圓1群的載舟47是加封蓋50會藉由載 舟升降機48來上昇，藉此往處理爐51内搬入（載舟載入 )0[Technical Field] The present invention relates to a substrate processing apparatus and a method of manufacturing a semiconductor device, for example, a semiconductor wafer (for example, 1C) which is effectively used in manufacturing a semiconductor integrated circuit device (hereinafter referred to as 1C) Hereinafter, a batch type vertical diffusion/CVD apparatus which forms a film of an insulating film, a metal film, a semiconductor film, or the like, or a diffusion impurity, is referred to as a wafer. [Prior Art] In the batch type vertical diffusion "CVD apparatus (hereinafter referred to as a batch type CVD apparatus) which is an example of a substrate processing apparatus, a plurality of wafers are processed in a state of being received in a storage container. In the conventional storage container, there are an open cassette and a FOUP (front opening unified pod). The open cassette is a box shape that forms a roughly cubic shape, and the opposite side faces are opened. The box is in the shape of a box forming a roughly cubic shape, and one of the faces is opened, and the door can be detachably attached to the open face. The box is transported in a state in which the wafer is sealed. Therefore, even if particles or the like are present in the environment around the tank, the wafer in the tank can maintain the cleanliness. Therefore, the clean room in which the batch CVD apparatus is installed does not have to set the cleanness too high. As a result, the cost of maintaining the clean room of the clean room can be reduced. Therefore, in the recent batch type CVD apparatus, the tank is used in a container of -4 - 200832592. The batch type CVD apparatus using the tank is a wafer transfer apparatus (hereinafter referred to as a “Pot Opener”) and a mapping apparatus (in the case of a wafer loading/unloading in a wafer loading/unloading box). For example, refer to Patent Document 1). The unpacker can be loaded or unloaded to open and close the wafer entry and exit. The surveying device detects whether the wafers are held in the respective wafer holding grooves (grooves) by detecting the wafers in the tank. [Patent Document 1] Japanese Unexamined Patent Publication (KOKAI) No. JP-A No. JP-A-No. The case is carried into the casing of the batch type CVD apparatus or the loading/unloading part of the unloading box from the inside of the casing, and the door of the unboxing cannot be removed. In the loading/unloading unit, in order to attach or detach the door of the box, it is possible to consider a configuration in which the unpacking device is provided in the loading/unloading unit. In other words, when the box is carried into the casing from the outside of the casing, or when the casing is carried out of the casing, the unpacking device is retracted from the loading/unloading portion, thereby ensuring the passage for loading or unloading the casing. However, in this configuration, in order to evacuate the unpacker from the loading/unloading unit, the batch type C V D device may be complicated to form. An object of the present invention is to provide a door that can be loaded or unloaded in a loading/unloading portion that carries a box into and out of a casing, and that can be used as a simple substrate processing apparatus and semiconductor in a configuration of -5 - 200832592 The method of manufacturing the device. (Means for Solving the Problem) The means for solving the above problems are as follows. That is, a substrate processing apparatus characterized by comprising: a storage container that accommodates a plurality of substrates, wherein the substrate entrance and exit are blocked by a lid; and the loading/unloading portion is housed between the inside and the outside of the housing. The storage unit carries the storage container on the loading/unloading unit; the storage chamber is provided adjacent to the loading/unloading unit, and stores the storage container; and the opening and closing device is placed on the storage unit. Opening and closing of the substrate inlet and outlet of the storage container of the mounting portion; the conveying device having a holding mechanism for holding the lower surface of the storage container, and transporting between the storage room and the outside through the upper side of the opening and closing device The storage container that is held by the holding mechanism; and the elevating mechanism is between a height position of the mounting portion when the opening and closing device opens and closes the storage container, and a height position between the transfer device and the storage container The lifting and lowering of the mounting portion is performed. [Effects of the Invention] According to the above-described means, by providing the elevating mechanism, the transport device -6 - 200832592 can transport the storage container from the mounting device to the casing via the upper portion of the opening and closing device, so that the transport can be smoothly transferred. The storage container can be moved without retracting the opening and closing device, and the lid of the storage container can be opened and closed in the loading/unloading portion. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, the substrate processing apparatus of the present invention is a batch type CVD apparatus, that is, a batch type vertical diffusion/CVD apparatus, and is configured as shown in Figs. 1 and 2 . Further, in the present embodiment, the storage container, that is, the storage container of the wafer 1, is the use case 2. The case 2 is in the shape of a box forming a substantially cubic shape, and as shown in Fig. 3, a wafer inlet and outlet 3 is opened in one side wall of the case 2. The door 4, which is the cover to be closed, is mounted to be detachable or detachable at the wafer entrance 3. A plurality of positioning holes 5 are embedded in the lower surface of the case 2. As shown in Fig. 1, Fig. 2, and Fig. 3, the batch type C V D device 10 of the present embodiment is a main casing 1 1 having a part as a casing. The front wall 1 1 a of the main frame body 1 1 is a partition wall constituting the inside and outside of the main frame body 1 1 . A tank loading/unloading port 1 2 that connects the inside and the outside of the main casing 1 1 is opened at an intermediate height of the front wall 1 1 a. The box loading/unloading port 1 2 is for loading the box 2 or moving out of the box 2. The front shutter 13 is for opening or closing the tank loading/unloading port 1 2 . A loading port 14 is provided outside the front wall (division wall) 1 1 a of the main casing 1 1 . The loading 埠1 4 is located directly below the box loading and unloading port 1 2 200832592 . The loading cassette 14 is a loading/unloading unit. The loading 埠i 4 will align the box 2 with the box into the loading and unloading port 12. The loading cassette 14 is set to 2. The case 2 is carried by the in-house transfer device (also referred to as an inter-lab transfer device on the loading cassette 14) or is carried out from the loading cassette 14 in terms of the in-project transfer device. The bed running transport vehicle (hereinafter referred to as AGV) shown in Fig. 1 and the overhead traveling transporting device (described later) shown in Fig. 8 are applicable. The front side of the front wall 1 1 a is provided as the front side. The casing 14A. The crucible 14A is formed with a ceiling opening i 4B formed around the ceiling wall of the loading crucible 14 and the upper space 14A, and a front opening 14C is opened in the casing 14. That is, the loading crucible 14 The box 2 can be taken through the positive 14C, and can also be taken through the ceiling opening 14B. In addition, the crucible 14A and the main frame 1 1 constitute a batch CVD frame. As shown in Fig. 1, within the 匣1 4 A A controller to be described later is provided with a box elevator (p〇d elevator). The elevator 15 is a mechanism for raising and lowering the height box 2 having a height and a tank loading/unloading port 12. The box elevator 15 is provided with: a lifting and lowering device 16, and the shaft (shaft) by the drive unit 1 6 (1). Horizontal setting The retaining table (storage container mounting portion) 18 at the end of the end is placed in a plurality of supporting transports as a storage container segment (also referred to as a storage container locator), and the outer structure is placed side by side. Between the opening of the device on the front wall. 15. Between the boxes made by the lifting & 17 positioning manual pin (-8-200832592 kinematic pin) 1 9 is connected to the box lift 1 5 . 1 9 is protruded from the holding table 18, and is respectively embedded in each positioning hole 5 formed under the box 2, thereby positioning the box 2 on the holding table 18. The box elevator 15 is held by the holding table 18. The box 2 is lifted and lowered by the lower support box 2' and the support movement pin 19 is fitted into the positioning hole 5 of the box 2. That is, the holding table 18 is a holding portion constituting the underside of the holding box 2 and is configured to be placed. A sealed casing 21 constituting a load lock chamber 20 is provided inside the front wall 1 1 a of the main casing 11. The sealed casing 21 corresponds to the height of the load port 14 . The carrier chamber 20 is configured to open and close the lid body capable of maintaining a filling inert gas such as nitrogen. As shown in Fig. 1, one end of the nitrogen gas supply line 2 1 A and one end of the exhaust line 2 1 B are connected to the sealed casing 2 1 . The other end of the nitrogen gas supply line 2 1 A is connected to the nitrogen gas supply. The other end of the device 2 1 A 'exhaust line 2 1 B is connected to the exhaust unit 2 1 B '. The nitrogen gas supply line 2 1 A supplies nitrogen gas to the preload chamber 20. The exhaust line 21B exhausts the inside of the preload chamber 20. Further, the controller 77 is for controlling the nitrogen gas supply device 21 A' and the exhaust device 2 1 B '. At the front wall 1 1 a of the main casing 1 1 , the door entrance 2 2 is opened at a portion opposed to the upper portion of the preload chamber 20. The door entrance/exit 22 is formed to have a size (greater than the wafer entrance/exit 3) corresponding to the wafer inlet/outlet 3 of the tank 2 placed on the loading cassette 14. An unpacker 23 as a storage container lid opening/closing portion (also referred to as an opening and closing device) is provided in the preloading chamber 20. The unpacker 23 is a door entrance/exit 22 for opening or closing the wafer inlet and outlet 3 and the front wall of the tank 2 loaded with the crucible 14. The unpacker 23 is provided with a moving table 25 and a closer 26. The mobile station is movable to the front and rear (vertical direction) and up and down (row direction). The closer 26 as the cover holding portion is moved by the moving table. The closure 26 holds the door 4 and blocks the doorway inlet 22. That is, the mobile station 25 causes the closer 26 holding the state of the door 4 to move forward and backward and up and down, whereby the unpacker 23 can open or close the round entrance 3 and the door entrance 22 of the box 2. A surveying device 27 as a substrate state detecting means is provided at a portion facing the door entrance 22 of the sealed casing 2 1. The surveying device 27 is a linear actuator 28 including a drive source, a holder 29, and a plurality of detecting elements 30. The jig 29 can move the wafer inlet and outlet 3 of the tank 2 to the front-rear direction by the actuator 28, and the plurality of detecting elements 30 are held by the jig 29. The surveying device 27 detects the wafer 1 in the tank by each detecting element 30. Thereby, the mapping device 27 can detect whether or not the wafer 1 is held in a plurality of slots in the tank 2 by one sheet. A tank storage chamber 1 1 b is formed in the front side area in the main casing 1 1 . A rotary case 3 1 is provided in the storage compartment 1 1 b. The rotary box frame 3 1 is an upper space which is placed in the center portion of the box storage chamber 1 1 b in the front-rear direction. The rotary case 3 1 is a storage compartment for storing the storage container in the casing. 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 The slab post 3 2 is erected vertically and intermittently rotated in a horizontal plane. The plurality of sheets 3 3 are a plurality of boxes 2 on which the frame plates 3 3 that are radially supported at the respective positions of the upper, middle, and lower stages of the column 3 2 are placed. A plurality of support motion pins 3 4 are protruded from the top of the frame plate 3 3 to be inserted into the positioning holes 5 of the case 2. A tank conveying device 35 is provided in the tank storage chamber 1 1 b. The tank transporting unit 35 is a transporting apparatus that transports the tank 2 between the loading cassette 14 and the rotary box frame 3 via the tank outlet 12. The tank transporting device 35 is constituted by a container transport mechanism that is a storage container elevating mechanism lowering unit 35a and a storage container transport mechanism. The tank transport mechanism 35b is a hold having a lower surface of the cage, referred to as a holding mechanism. The tank conveying device 35 conveys the tank 2 between the holding table 18 and the rotating frame rack 31 and the mounting table 43 of the later-described device 42 by the continuous operation of the tank elevator 35a and the tank conveyor. As shown in Fig. 2, in the lower portion of the main frame body 1 in the front-rear direction, the sub-frame 40 is constructed at the rear end. In the front wall 40a of the sub-frame 40, a pair of wafer loadings 4 1 and 4 1 are arranged in the vertical direction in two vertical directions, and an unpacker 42 is provided in the upper wafer loading/unloading ports 41 and 41, respectively. 42. The loading/unloading port 41 can carry in the wafer 1 into the sub-frame 40 and carry it out from the sub-Feng | The unpacker 42 is provided with mounting stages 43 and 33 for mounting the box 2. Support plate. In the plural 34, the box for loading and unloading of the feeding device rises 35b (also the lower part of the opening of the center of the unpacking box of the 3bb. The wafer cassette 40 is taken out of the box -11 - the door 4 of the door 4 of 200832592 2 4. The door 4 of the case 2 placed on the mounting table 43 is attached or detached by the detaching mechanism 44, whereby the unpacker 42 can open and close the wafer inlet and outlet 3 of the case 2. The sub-frame 40 is constructed. The preparation chamber 45 and the preparation chamber 45 isolate the fluid from the storage chamber in which the tank conveyance device 35 and the rotary magazine 31 are provided. The wafer transfer mechanism 46 is provided in the front side of the preparation chamber 45. The wafer transfer mechanism 46 The wafer transfer device 46a, the wafer transfer device lifter 46b, and the die 46c are provided. The die 46c is a mounting portion that constitutes the wafer! The wafer transfer device 46a is such that the die 46c holding the wafer 1 is in the horizontal plane. The wafer transfer device lifter 46b is disposed at the right end of the front field in the preparation chamber 45. The wafer transfer device lifter 46b moves the wafer transfer device 46a up and down. The wafer transfer mechanism 46 is by The continuous operation of the wafer transfer device elevator 46b and the wafer transfer device 46a The wafer 1 held by the sub-46c is transported from the tank 2 to a boat (substrate holder) 47, and the transported wafer 1 is loaded to the carrying boat 47. Further, the wafer transfer mechanism 46 is The sundial 1' of the carrying boat 47 is held by the dice 46c, thereby being discharging from the carrying boat 47, transported from the carrying boat 47 to the tank 2, and returned to the tank 2. The controller 77 is in the control loading compartment 4 , in the batch CVD apparatus such as the box elevator i 5 , the box opener 2 3 , the surveying device 27 , the rotary box 3 1 , the box transport device 3 5 , the unpacker 42 , the wafer transfer mechanism 46 , and the like In the rear side of the preparation room 45, a -12-200832592 boat lift 48 is provided for lifting and lowering the boat 47. Horizontally mounted on the arm 49 as a link attached to the lift platform of the boat lift 48 There is a seal cap 50. The capping cover 50 vertically supports the carrying boat 47, and can close the lower end portion of the processing furnace 51 described later. The carrying boat 47 is a holding member having a plurality of loads. The carrying boat 47 is for making a plurality of pieces ( For example, the center of the wafer 1 in the range of 50 to 1 2 5 is uniformly aligned in the vertical direction, and is respectively maintained in Although not shown in the drawings, a cleaning gas supply unit (hereinafter referred to as a cleaning unit) is actually provided at the left end portion of the preliminary chamber 45 on the side opposite to the wafer transfer device elevator 46b side and the boat lifter 48 side. The cleaning unit is constituted by a supply fan and a dust filter. The cleaning unit is a clean air (cleaning gas) for supplying a cleaned environment or an inert gas. Moreover, the wafer transfer device 46a and the cleaning unit are A groove alignment device is provided between them. The groove alignment device is a substrate integration device that constitutes a position for integrating the circumferential direction of the wafer. The clean air blown from the cleaning unit flows into the groove aligning device, the wafer transfer device 46a, and the carrying boat 47, and is sucked by a duct (not shown). The cleaned air to be sucked is exhausted to the outside of the main casing 1 or is circulated to the suction side of the cleaning unit, i.e., the primary side (supply side), and is again blown out into the preliminary chamber 45 by the cleaning unit. The treatment furnace 51 shown in Fig. 4 is provided on the sub-frame 40. As shown in Fig. 4, the processing furnace 51 has a heater 52 as a heating means. The heater 52 is cylindrical in shape and is supported by a heating base 13-200832592 as a holding plate, and is mounted vertically. Inside the heater 52, a process tube 54 as a reaction tube is disposed concentrically with the heater 52. The process pipe 54 is composed of an outer pipe 55 as an external reaction pipe and an inner pipe 56 as an internal reaction pipe provided inside. The outer tube 55 is formed of, for example, a heat resistant material such as quartz (SiO 2 ) or tantalum carbide (SiC). The outer tube 5 5 has a cylindrical shape having an inner diameter larger than the outer diameter of the inner tube 56, and has a cylindrical shape in which the lower end is closed at the lower end. The outer tube 55 is disposed concentrically with the inner tube 56. The inner tube 56 is formed of, for example, a heat resistant material such as quartz or tantalum carbide. The inner tube 56 has a cylindrical shape that forms an upper end and a lower end opening. The hollow portion of the inner tube 56 is formed into a processing chamber 57. The processing chamber 57 can accommodate the carrying boat 47 that holds the wafer 1 in a plurality of stages in a horizontal posture and is vertically aligned. The gap between the outer tube 5 5 and the inner tube 56 is a cylindrical space 58. Below the outer tube 55, a manifold 59 is disposed concentrically with the outer tube 55. The manifold 5 9 is formed, for example, of stainless steel. The manifold 5 9 is a cylindrical shape that forms an upper end and a lower end opening. The manifold 5 9 is engaged with the outer tube 55 and the inner tube 56 to support the same. The manifold 59 is supported by the heater base 53, whereby the process tube 54 is in a vertically mounted state. The process tube 54 and the manifold 59 form a reaction vessel. Further, an O-ring 59a as a sealing member is provided between the manifold 5 9 and the outer tube 5 5 . The nozzle 60 as a gas introduction portion is connected to the sealing cover 50, and the nozzles 6 0 -14 to 200832592 are connected to the inside of the processing chamber 57. The gas supply pipe 61 is connected to the nozzle 60. The gas supply pipe 61 is on the side opposite to the connection side of the nozzle 60 (upstream side), and is connected to the gas supply source 63 via M F c (mass flow controller) 62. The MFC 62 is a gas flow controller. The gas supply source 63 is a desired gas supplied with a processing gas, an inert gas, or the like. In the MFC 62, the gas flow rate control unit 64 is electrically connected to the gas flow rate control unit 64. The gas flow rate control unit 64 controls the M F C 6 2 at a desired timing to form a desired amount of gas flow. An exhaust pipe 65 for exhausting the environment in the processing chamber 57 is provided in the manifold 59. The exhaust pipe 615 is disposed at a lower end portion of the cylindrical space 58 and communicates with the cylindrical space 58. The exhaust pipe 65 is on the side opposite to the side where the manifold 59 is connected (downstream side), and the exhaust device 6 is connected via the pressure sensor 6 6 and the pressure adjusting device 67. The pressure sensing side unit 66 is a pressure detector. The exhaust unit 618 is constituted by a vacuum pump or the like. The pressure sensor 66, the pressure adjusting device 67, and the exhaust device 68 exhaust the inside of the processing chamber 57 so that the pressure can be set to a predetermined pressure (degree of vacuum). The pressure adjusting device 67 and the pressure sensing device 66 are electrically connected to the pressure control unit 69 by electric wiring. The pressure control unit 69 controls the pressure adjusting device 67 at a desired timing based on the pressure detected by the pressure sensing unit 66, so that the pressure in the processing chamber 57 can form a desired pressure. The cover 50 is abutted from the lower side in the vertical direction to the lower end of the manifold 59. The sealing cover 50 is a mouthpiece cover that can hermetically close the lower end opening of the manifold 59. -15- 200832592 The sealing cover 50 is made of, for example, a metal such as stainless steel, and is formed in a disk shape. A 〇-shaped ring 50a as a sealing member is provided on the upper surface of the sealing cover 50. The 0-ring 50a abuts against the lower end of the manifold 59. The sealing cover 50 is provided with a rotating mechanism 70 for rotating the carrier on the side opposite to the processing chamber 57. The rotating shaft 71 of the rotating mechanism 70 is connected to the carrying boat 47 by penetrating the cover 50. The rotary shaft 71 rotates the wafer 1 by rotating the carrier 47. The rotation control unit 70 and the boat lift 48 are electrically connected to the drive control unit 72 by the electric wiring A. The drive control unit 72 controls the rotation mechanism 70 and the boat lift 48 at a desired timing to enable the desired operation. The carrier 47 is formed of, for example, a heat resistant material such as quartz or tantalum carbide. The carrying boat 47 is in a state in which the wafers 1 of the plurality of sheets are arranged in a horizontal posture and are aligned with each other, and are held in a plurality of stages. Further, in the lower portion of the carrying boat 47, a plurality of heat insulating plates 73 are arranged in a plurality of stages in a horizontal posture. The heat insulating plate 73 is formed of a heat-resistant material such as quartz or tantalum carbide to form a disk shape. The heat shield 7 3 constitutes a heat insulating member. The plurality of heat shields 73 prevent heat from the heater 52 from being transmitted to the side of the manifold 59. A temperature sensor side 74 is disposed in the process tube 54. The temperature sensor side 74 is a temperature detector. The heater 52 and the temperature sensor side 74 are electrically connected to the temperature control unit 75 by the electric wiring D. The temperature control unit 75 integrates the energization state of the heater 52 based on the temperature information detected by the temperature sensor 74, thereby controlling the heater 52 by the desired timing-16-200832592, and causing the processing chamber 5 to be processed. The temperature within 7 can form the desired temperature profile. The gas flow rate control unit 64, the pressure control unit 69, the drive control unit 72, and the temperature control unit 75 also constitute an operation unit and an input/output unit, and are electrically connected to the main control unit 76 that controls the entire batch CVD apparatus. The gas flow rate control unit 64, the pressure control unit 69, the drive control unit 72, the temperature control unit 75, and the main control unit 76 constitute a controller 77. Next, a 1C manufacturing method according to an embodiment of the present invention will be described with reference to a batch type CVD apparatus having the above configuration. Further, in the following description, the operations of the respective units constituting the batch type CVD apparatus are controlled by the controller 77. As shown in Figs. 1 to 3, when the in-project conveying device is carried into the loading cassette 14 via the front opening 14C or the ceiling opening 14B, the box 2 is placed on the holding table 18. At this time, the supporting movement pin 19 of the holding table 18 is inserted into the positioning hole 5 below the case 2, whereby the case 2 is formed in a state of being positioned at the holding table 18. Next, as shown in Fig. 5(a), in the loading cassette 14, the box 2 is moved in the direction of the unpacker 23, and the door 4 is held in the closer 26 of the unpacker 23. Once the closer 26 holds the door 4, the door 4 is detached (disassembled) from the wafer entry and exit 3 by the retraction of the moving table 25. Then, as shown in Fig. 5 (b), the closer 26 is detached from the position of the wafer inlet and outlet 3 by the lowering of the moving table 25 in the preload chamber 20. Once the wafer entry and exit 3 is opened, as shown in Fig. 5(b), the jig 2 9 of the survey -17-200832592 device 27 is inserted into the wafer exit 3 by the linear actuator 28. The detecting element 30 of the surveying device 27 is the wafer 1 in the mapping box 2. Once the predetermined survey is completed, the clamps 29 of the surveying device 27 are returned from the wafer access 3 to the original standby position by the linear actuators 28. Once the clamp 29 returns to the standby position, the closer 62 moves to the position of the wafer inlet and outlet 3 by the rise of the moving table 25. Then, as shown in Fig. 5(a), the closer 26 mounts the door 4 to the wafer inlet/outlet 3 (mounted) by the advancement of the moving table 25. When the mapping information read by the mapping device 27 is different from the mapping information previously provided in relation to the phase (the phase of the δ 取 封), the box 2 that is found to be different will be borrowed from the loading cassette 14 The in-engine transfer device, for example, the AGV 9 shown in Fig. 1, is immediately transferred to the wafer or the previous project. Thereby, the step can be greatly reduced as compared with the case where the tank 2 is carried into the main casing 1 1 , in particular, after the mounting table 43 or the rotary frame 3 1 is returned to the loading/unloading portion. Further, it is possible to suppress the increase in the wafer mounting time to the boat 47 and the increase in the wafer processing start standby time. When the mapping information read by the aforementioned mapping device 27 coincides with the mapping information previously provided by the box 2, as shown in FIG. 6, the box 2 supported by the holding station 18 utilizes the box elevator. 15 5 is raised from the loading cassette 14 to the height of the tank loading/unloading port 12. Specifically, the holding table 18 is raised above the sealing frame 2 1 by -18-200832592, and the height of the box 2 picked up from the lower side by the box conveying mechanism 35b is raised once the box 2 is raised. When the height of the tank loading/unloading port 12 is reached, the tank loading/unloading port 12 is opened by the front shutter 13 . Then, the tank transport mechanism 35b is submerged into the tank loading/unloading port 12. As shown in Fig. 6, the tank 2 supported by the holding table 18 is picked up from the lower side by the tank transport mechanism 35b of the tank transporting device 35. That is, the tank 2 is transferred between the holding table 8 and the tank transport mechanism. The tank 2 picked up by the tank transport mechanism 35b is carried into the main casing 1 1 from the tank loading/unloading port 1 2 . That is, the case 2 is carried out from the outside of the main casing 1 1 via the unloader 23 or the upper side of the sealed casing 2 1 by the tank transport mechanism. Further, it may be carried in from the outside of the main casing 1 1 across the unpacker 23 or the sealed casing 21. As shown in Fig. 1 and Fig. 2, the box 2 that has been carried in is automatically transported to the frame plate 3 designated by the rotary box frame 3 by the box conveying device 35, and is handed over. At this time, the shelf plate 3 3 The support movement pin 34 is inserted into the positioning hole 5 at the lower side of the case 2, whereby the case 2 is formed in a state of being held by the frame plate 3, and the case 2 is temporarily stored in the frame plate 3 3 . Then, the tank 2 is transported from the deck plate 3 to one of the unpackers 42 by the tank transporting device 35, and transferred to the placing table 43. At this time, the wafer loading/unloading port 41 of the unpacker 42 is closed by the offline structure 44, and the cleaning chamber is filled with the clean air. -19- 200832592 In the preparation room 4 5 is filled with nitrogen as clean air. In this state, the oxygen concentration of the preliminary chamber 45 is, for example, 20 p p m or less, which is much lower than the oxygen concentration inside the main casing 1 1 (atmospheric environment). Further, the tank 2 carried into the main casing 1 1 from the tank loading/unloading port 12 by the conveying mechanism 35b may be directly conveyed to the unpacker 42 provided in the wafer loading/unloading port 41. The case 2 placed on the mounting table 43 is an opening edge portion of the wafer loading/unloading port 41 where the opening side end surface is pressed to the front wall 40a. Then, the door 4 is detached by the detaching mechanism 44, and the box 2 is opened to the wafer inlet and outlet 3. At this time, since the drawing has been mapped in the loading port 14, the mapping of the wafer 1 group in the box 2 can be omitted. Once the bin 2 is opened by the unpacker 42, the wafer transfer device 46a picks up the wafer 1 from the bin 2 via the wafer access port 3 using the dice 46c. Once the wafer 1 is picked up by the die 46c, the wafer transfer device 46a transports the wafer 1 to the groove alignment device (not shown). The groove alignment device is positioned to align the wafer 1. After the alignment, the wafer transfer device 46 picks up the wafer 1 from the groove alignment device by the die 46c and transports it to the boat 47. The wafer transfer device 46 charges the transferred wafer 1 to the carrying boat 47. The wafer transfer device 46a after the wafer 1 is transferred to the carrying boat 47 is returned to the tank 2, and the next wafer 1 is attached to the carrying boat 47. In the operation of the unpacker 42 of the one (upper or lower stage) by the wafer transfer mechanism 46 to mount the wafer 1 to the carrying boat 47, the opener 42 of the other (lower or upper stage) is borrowed. The other transport box 2 is transported from the rotary -20-200832592 box frame 31 by the tank transport device 35. In the other unpacker 42 of the other side, the opening operation of the box 2 of the unpacker 42 is simultaneously performed. Once the pre-specified number of wafers 1 are mounted on the carrying boat 47, the lower end portion of the processing furnace 51 that is closed by a furnace mouth shutter (not shown) is passed through the mouth of the furnace. The shutter is open. Next, the carrier boat 47 holding the wafer group 1 is lifted by the boat lifter 48, and is carried in the processing furnace 51 (loading the boat) 0
在此，說明有關利用處理爐51在晶圓1上藉由CVD 法來形成薄膜的方法。 另外，在以下的説明中，構成處理爐5 1的各部之動 作是藉由控制器77來控制。 一旦複數片的晶圓1被裝塡（wafer charge)於載舟 4 7，則如圖4所示，保持複數片的晶圓1之載舟4 7會藉 由載舟升降機48來舉起’搬入至處理室57(載舟載入） 〇 在此狀態下，加封蓋50是形成隔著〇型環50a來密 封岐管5 9的下端之狀態。 處理室5 7内是藉由排氣裝置6 8來排氣，而使能夠形 成所望的壓力（真空度）。此時’處理室57内的壓力是 以壓力感側器66來測定’根據該被測定的壓力，回饋控 制壓力調整裝置67 ° 又，處理室57内是藉由加熱器52來加熱，而使能夠 形成所望的温度。此時’以處理室5 7内能夠形成所望的 -21 - 200832592 温度分布之方式，根據温度感側器7 4所檢測出的温度資 訊，回饋控制往加熱器5 2的通電狀況。 接著，藉由旋轉機構70來旋轉載舟47，藉此旋轉晶 圓1。 其次，從氣體供給源63供給且以MFC 62來控制成所 望的流量之氣體會流動於氣體供給管6 1而由噴嘴60來導 入至處理室5 7内。 所被導入的氣體會上昇於處理室57内，從內管56的 上端開口流出至筒狀空間58而由排氣管65排出。 氣體是在通過處理室5 7内時與晶圓1的表面接觸。 此時，在晶圓1的表面上藉由熱 CVD反應來堆積（ deposition)薄膜。 一旦經過所被預先設定的處理時間，則會從氣體供給 源63經由氣體供給管61來供給惰性氣體，處理室57内 會被置換成惰性氣體，且處理室5 7内的壓力會被恢復成 常壓。 然後，加封蓋50會藉由載舟升降機48而下降，岐管 59的下端會被開□，且處理完成晶圓1會在保持於載舟 47的狀態下從岐管59的下端搬出至製程管54的外部（載 舟卸載）。 載舟卸載的處理完成晶圓1會藉由晶圓移載裝置46a 來從載舟47取出（wafer discharge )，回到預先被搬送至 開箱器42的空箱2。 一旦所定片數的處理完成晶圓1被收納，則門4會藉 -22- 200832592 由開箱器42來裝著於箱2的晶圓出入口 3。 將晶圓出入口 3閉塞的箱2會藉由箱搬送裝置3 5來 自動地搬送至旋轉式箱架3 1所指定的架板3 3而交接。 箱2會暫時地被保管。然後，一旦前遮擋板1 3開啓 ，則箱搬送裝置3 5會將箱2從架板3 3搬送至箱搬入搬出 口 1 2，在箱升降機1 5的保持台1 8上潛入箱搬入搬出口 1 2而交接。 另外，收納處理完成晶圓1的箱2有時會從開箱器4 2 藉由箱搬送裝置35來直接地搬送至箱搬入搬出口 12。 一旦在保持台1 8上交接箱2，則前遮擋板1 3會關閉 。並且，箱升降機15的軸17會藉由昇降驅動裝置16來 下降至裝載埠1 4上。 下降至裝載埠14上的箱2會藉由工程内搬送裝置、 例如圖1所示的AGV9來搬送至所定的工程。 若根據上述實施形態，則可取得其次的效果。 1 )在箱會藉由工程内搬送裝置來搬入的裝載埠設置測繪 裝置，藉此可立即從裝載埠返送被發現藉由測繪裝置所讀 取的實際測繪資訊與所預先提供的測繪資訊不同之箱。因 此，相較於在框體内的開箱器設置測繪裝置的以往情況時 ’可省略將箱搬入框體内後回到裝載埠後返送的費時費工 ，該部份可縮短從晶圓處理開始時期被發現不同的時間點 延遲。 2 )在抓住收納容器的上部時，收納容器搬送部的操作（ handling )部需要昇降機能（伸縮機能）及夾持（grip ) -23- 200832592 機能（水平方向伸縮機能）。爲了使收納容器搬送部的操 作部具有各種的機能，收納容器搬送部本身需要強度，因 此收納容器搬送部會大型化。並且，因爲構造會形成複雜 ，所以成本高或容易發生不良情況。而且，在夾持不當時 ，使收納容器落下的情況亦多。甚至’夾持所造成之 收納容器搬送時間的長期化、操作部的大型化所造成之保 管架的大型化、需要上抓取的空間等所造成之裝置高度 變高等、缺點多。 該點，藉由在裝載埠的上方設置箱搬入搬出口，且設 置使由下保持箱的保持台昇降於裝載埠與箱搬入搬出口之 間的箱升降機，可利用箱搬送裝置來由下側拾取箱，因此 相較於抓住箱的上部來進行操作時，可使操作構造形成簡 單且小型。因此，可謀求CVD裝置的小型輕量化、單純 化、高速化、安全化及空間的活用化。 3 )藉由在利用箱升降機來昇降的保持台設置支承運動銷 ，可將保持台作爲有關各處的箱載置部的搬送基準。因此 ，可謀求搬送基準的統一化。 4)藉由分成箱升降機及箱搬送裝置，可與裝載埠之箱的 昇降動作同時，使箱搬送裝置作動至箱交接位置之前待機 。亦即，可同時並行處理，因此可使總搬送時間縮短。 5 )由於箱升降機可使保持台上昇至藉由箱搬送裝置來從 下側拾取箱的高度，因此與操作箱的上部時比較之下，可 安全地交接箱。 6 )由於可在使用惰性氣體來清浄化位於裝載埠的箱内的 -24- 200832592 晶圓之預載室内進行測繪，因此可防止汚染及自然氧化膜 形成。 圖7是表示本發明的第二實施形態之批次式CVD裝 置的側面剖面圖。 本實施形態與上述實施形態主要相異的點是開箱器只 設置於裝載埠的點。 亦即，如圖7所示，裝載埠14是設置於形成預備室 45的副框體40的正面壁（區劃壁）40a，在該正面壁40a 設置有開箱器83。在形成開箱器83的預載室80之密閉框 體8 1的背面壁8 1 a開設有晶圓搬入搬出口 9 1，且設置有 開閉該晶圓搬入搬出口 9 1的門機構92。 設置於預備室45内的晶圓移載機構46是構成基板搬 送裝置。當門機構92開放晶圓搬入搬出口 9 1時，晶圓移 載機構46是在箱2與載舟47之間搬送晶圓1。 載舟升降機48是將載舟47搬入至鄰接於預備室45 的處理爐51的處理室57，或將載舟47從處理室51搬出 〇 在鄰接於預備室45的頂棚面之保管室1 lb設置有保 管架31A及箱搬送裝置35。 在主框體11的正面壁lla中面向於保管室lib的部 位開設有箱搬入搬出口 1 2。前遮擋板1 3是在於開啓或關 閉箱搬入搬出口 1 2。 與第一實施形態的開箱器4 2同樣，在預載室8 〇設置 有測繪裝置84。測繪裝置84可對門出入口 82移動於前後 -25- 200832592 (垂直方向）及上下（平行方向）。 其次，說明以上構成的開箱器的作用。 另外，控制器77是在於控制以下的作動。 如圖7所示，工程内搬送裝置經由正面開口 i 4C或頂 棚開口 14B，搬入裝載埠14時，箱2是被載置於箱升降 機1 5的保持台1 8。 此時’突設於保持台1 8的支承運動銷1 9會被嵌入箱 2的下面的定位孔5，藉此箱2是形成被定位於保持台18 的狀態。 其次’在裝載瑋1 4中，箱2會被移動於開箱器83的 方向。開箱器83的閉合器86會保持門4。 一旦保持門4，則閉合器8 6會藉由移動台8 5的後退 來將門4從晶圓出入口 3及門出入口 82卸下。然後，閉 合器86會藉由移動台85來下降於預載室80内，藉此自 晶圓出入口 3及門出入口 82的位置脫離。 一旦晶圓出入口 3被開放，則測繪裝置84的檢測元 件會被插入至晶圓出入口 3 (參照圖5 ( b ))。測繪裝置 8 4會藉由檢測元件來測繪箱2内的晶圓1。 一旦所定的測繪完了，則測繪裝置8 4會使檢測元件 從晶圓出入口 3恢復至原本的待機位置。 然後，閉合器86會隨著移動台85的上昇來移動至晶 圓出入口 3的位置。然後，閉合器86會藉由移動台85的 前進來將門4安裝於晶圓出入口 3及門出入口 82。 當藉由該測繪裝置所讀取的實際測繪資訊、與有關該 -26- 200832592 箱2所預先提供的測繪資訊不同時，所被發現不同的箱2 會從裝載埠14藉由工程内搬送裝置、例如圖1所示的 AGV9來立即搬送至晶圓編成工程或之前的工程等。 當藉由前述的測繪裝置所讀取的實際測繪資訊、與有 關該箱2所預先提供的測繪資訊一致時，箱升降機1 5會 使藉由保持台1 8所支撐的箱2從裝載埠1 4上昇至箱搬入 搬出口 1 2的高度。 一旦箱2被上昇至箱搬入搬出口 12的高度，則前遮 擋板1 3會開放箱搬入搬出口 1 2。 接著，箱搬送裝置3 5的箱搬送機構3 5 b會拾取藉由 保持台1 8所支撐的箱2。 箱搬送機構3 5 b會將拾取後的箱2從箱搬入搬出口 1 2 搬入至主框體11内。 箱搬送裝置35會將搬入後的箱2搬送至保管架31A ，自動地交接至所被指定的架板3 3 A。 箱2會暫時地被保管於架板3 3。 然後，以和前述相反的程序，箱搬送裝置3 5及箱升 降機1 5會將箱2從保管架3 1 A搬送至裝載埠1 4。 此時，在預備室45中有清潔空氣流通充滿著。 其次，在裝載埠14中，箱2會被移動於開箱器8 3的 方向。開箱器8 3的閉合器8 6是在保持門4。 一旦保持門4，則閉合器86會藉由移動台85的後退 來將門4從晶圓出入口 3卸下。然後，閉合器86會藉由 移動台85來下降於預載室80内，從晶圓出入口 3及門出 -27- 200832592 入口 82的位置脫離。 一旦晶圓出入口 3被開放，則晶圓搬入搬出口 91會 藉由門機構92來開放。 此時，箱内的晶圓的測繪已經完成，所以可省略。 一旦晶圓出入口 3及晶圓搬入搬出口 9 1被開放，則 晶圓移載裝置46a會藉由鑷子46c來將晶圓1從箱2經由 晶圓出入口 3或門出入口 82及晶圓搬入搬出口 9 1拾取。 晶圓移載裝置4 6 a會將拾取後的晶圓1搬送至刻槽對準裝 置。刻槽對準裝置是在於使晶圓1對準刻槽。刻槽對準後 ，晶圓移載裝置46a會將晶圓1從刻槽對準裝置藉由鑷子 46c拾取。晶圓移載裝置46a會將拾取後的晶圓1搬送至 載舟47，裝塡（charging)至載舟47。 將晶圓1交接至載舟47的晶圓移載裝置46a會回到 箱2，將其次的晶圓1裝塡至載舟47。 另外，亦可不在保管架3 1 A進行暫時保管箱2的步驟 ，晶圓移載裝置46a藉由鑷子46c來將晶圓1從箱2直接 搬送。亦即，測繪完了，測繪裝置的檢測元件會從晶圓出 入口 3回復到原來的待機位置後或測繪中使晶圓搬入搬出 口 91開放。晶圓移載裝置46a是在晶圓搬入搬出口 91插 入鑷子46c來從箱2拾取晶圓1。 由於以後的步驟是與上述實施形態同樣，因此省略説 明。 若利用本實施形態’則只要將開箱器設置於裝載埠即 可，因此可寄與空間效率提升（台面面積縮小化）、生產 -28- 200832592 能力提升（可減少箱的移動範圍）。 圖8是表示本發明的第三實施形態之批次 置的側面剖面圖。 本實施形態與上述第二實施形態相異的點 住箱的上部來操作的點、設置一即使在箱内晶 是可接受來自頂棚走行型構内搬送裝置（以下^ 的箱之箱平台機構的點。 亦即，如圖8所示，抓住箱的上部來操作 置（以下稱爲抓取式箱搬送裝置）100是在鄰 45的頂棚面之保管室lib中與保管架31A —起 抓取式箱搬送裝置100是具備：箱升降機 箱升降機101來昇降的箱搬送機構102、及藉 構1 0 2來移動的夾持部1 0 3。夾持部1 0 3可伸 持突設於箱2的上面之帽簷部6。 箱平台機構105是具備：將開設於裝載埠 開口部1 06予以開閉之滑板1 07。箱平台機構 口部1 06開啓的狀態下，使箱2經由頂棚開口 部106來從OHT1 10載置於裝載埠14的保持台 另一方面，當滑板107關閉開口部106味 是使箱2載置於滑板1 07 ( —時爲保管架的任務 然後，從滑板107來使箱2載置於裝載埠 台18時，在箱搬送機構102舉起箱2的狀態 機構105會使滑板107滑動來開啓開口部106 搬送機構1 02會操作箱2，通過操作後的開口 ί 式 CVD裝 是構成可抓 圓搬送中還 Β爲 ΟΗΤ) 的箱搬送裝 接於預備室 設置。 101 、藉由 由箱搬送機 縮由上來夾 1 4正上的 1 〇 5是在開 14Β及開口 18° 宇，ΟΗΤ1 10 :)° 1 4的保持 下，箱平台 。接著，箱 那1 〇 6來載 -29- 200832592 置於裝載埠1 4的保持台1 8。 其次，說明以上構成的抓取式箱搬送裝置1 00及箱平 台機構105的箱操作步驟。 另外，測繪箱内的晶圓之測繪步驟等的其他步驟是與 前述第二實施形態同樣，因此該等的步驟説明省略。 如圖8所示，OHT1 10是經由頂棚開口 14B及開口部 1 06，將箱2直接供給至裝載埠1 4上。 此時，保持台1 8的支承運動銷1 9會被嵌入箱2的下 面的定位孔5，藉此箱2是形成被定位於保持台1 8的狀態 〇 在裝載埠1 4中，測繪裝置是在於測繪箱内的晶圓（ 參照第一實施形態及第二實施形態）。 在該測繪步驟中，當藉由測繪裝置所讀取的實際測繪 資訊、與有關該箱2所預先提供的測繪資訊不同時，所被 發現不同的箱2會從裝載埠14藉由OHT110來立即搬送 至晶圓編成工程或之前的工程等。 當藉由測繪裝置所讀取的實際測繪資訊、與有關該箱 2所預先提供的測繪資訊一致時，前遮擋板1 3會開放箱搬 入搬出口 1 2，箱升降機1 0 1會使箱搬送機構1 02下降至箱 搬入搬出口 1 2的對向位置。 接著，箱搬送機構102會使夾持部103潛入箱搬入搬 出口 1 2，而使移動於箱2的正上。 其次，箱搬送機構1 〇 2會使夾持部1 〇 3下降。夾持部 1 0 3會伸長至下方，而從上夾持箱2的帽簷部6。 -30- 200832592 一旦夾持箱2的帽簷部6，則夾持部1 0 3會縮短至上 方而吊起箱2，且箱升降機1 0 1會使箱搬送機構1 〇2上昇 至與箱搬入搬出口 12對應的高度。 箱搬送機構1 02會將吊起後的箱2從箱搬入搬出口 1 2 搬入至主框體11的箱保管室lib内。 抓取式箱搬送裝置100會將所被搬入的箱2搬送至保 管架31A，自動交接至所被指定的架板33A。 箱2會暫時被保管。 然後，以和前述相反的程序，抓取式箱搬送裝置100 會從保管架3 1 A將箱2搬送至裝載埠1 4。 例如，在測繪步驟中當別的箱2藉由OHT 1 1 0搬送而 來時，箱平台機構1 0 5會藉由滑板1 〇 7來從Ο Η T 1 1 0接受 該箱2，以滑板1 〇7暫時保管。 亦即，如圖8假像線所示，箱平台機構1 〇5是使滑板 1 〇 7滑動來關閉開口部 1 〇 6，而藉由滑板 1 〇 7來接受 ΟΗΤ1 1〇的箱2。亦即，滑板107是一時發揮保管架的任 務。 然後，從滑板1 07移動箱2至裝載埠1 4的保持台1 8 時’在箱搬送機構1 02從滑板1 07舉起箱2的狀態下，箱 平台機構105會使滑板107滑動而開啓開口部106。接著 ’箱搬送機構1 02會使舉起後的箱2通過開口部1 06來載 置於裝載埠1 4的保持台1 8。 若根據本實施形態，則除了前述第二實施形態的效果 以外’還可取得其次的效果。 -31 - 200832592 在測繪步驟中當箱藉由OHT搬送而來時，箱平台機 構會藉由該滑板來從OHT接受該箱，藉此可暫時保管。 圖9是表示本發明的第四實施形態之批次式c V D裝 置的側面剖面圖。 本實施形態與上述第一實施形態相異的點是具備抓住 箱2的帽簷部6來搬送的箱搬送裝置（以下稱爲抓取式箱 搬送裝置）2 0 0的點。 亦即，如圖9所示，抓取式箱搬送裝置2 0 0是設置於 箱保管室1 1 b。抓取式箱搬送裝置200是可在抓住帽簷部 6的狀態下，經由箱搬入搬出口 1 2，在保持台1 8與箱保 管室1 1 b内之間搬送箱2。 抓取式箱搬送裝置200是具備：箱升降機201、藉由 箱升降機201來昇降的箱搬送機構202、及藉由箱搬送機 構202來移動的夾持部203。就夾持部203而言，有伸縮 於水平方向來抓住帽簷部6的型態、及未具備伸縮於水平 方向的機構，形成大略]的字型，僅鉤於帽簷部的鉤型態 、以及具備伸縮於鉛直方向的機構的型態。 抓取式箱搬送裝置200是藉由控制器77來控制。 其次，數例説明以上構成的抓取式箱搬送裝置的運用 方法。 在以下的説明中，控制器77是在於控制抓取式箱搬 送裝置200、箱升降機15、前遮擋板13等的作動。 圖10是表示運用方法的第一例。 如圖1 0 ( a )所示，箱升降機1 5是藉由昇降驅動裝置 -32- 200832592 1 6來使軸1 7伸長，使支撐箱2的保持台1 8上昇至箱2的 底面比基準高度204更高的位置。與前述的箱升降機15 的動作同時，箱升降機2 0 1會以夾持部2 0 3的高度能夠形 成與帽簷部6的高度同高度之方式來使箱搬送機構202、 夾持部203昇降。 另外，基準高度204是箱搬入搬入口 12(參照圖9) 的下端的高度，至少密閉框體2 1的上端的高度位置以上 的高度位置。比預載室20的上端的高度位置更高的高度 位置° 前遮擋板1 3係開放箱搬入搬出口 1 2 (參照圖9 )。 如圖1 0 ( b )所不’箱搬送機構2 0 2會伸長，從箱保 管室1 1 b内經由箱搬入搬出口 1 2，水平移動至位於主框體 1 1外的夾持部2 0 3 ’藉此使夾持部2 0 3換在帽簷部6之下 〇 如圖1 〇 ( C )所示，一旦箱升降機2 0 1使箱搬送機構 202上昇’則夾持部203會從保持台18上吊起箱2。 如圖10 ( d )所示，抓取式箱搬送裝置200會使箱搬 送機構202縮短，而令箱2搬入至箱保管室1 lb内。 另一方面’箱升降機15會藉由昇降驅動裝置16來使 軸17縮短，而令保持台18下降至裝載璋14上。 然後，抓取式箱搬送裝置200會將箱2搬送至旋轉式 箱架3 1，交接至予以指定的架板3 3。 若根據該第一例，則夾持部203只要鉤到帽簷部6即 可。因此，夾持部203不需要伸縮於水平方向及鉛直方向 -33- 200832592 的機構，其構造及作動形成簡單。其結果，可謀求低成本 化、省空間化或運用時間的縮短化。 圖11是表示運用方法的第二例。 如圖1 1 ( a )所示，箱升降機1 5是藉由昇降驅動裝置 1 6來使軸1 7伸長，使支撐箱2的保持台1 8上昇至箱的底 面比基準高度204更下的位置，亦即帽簷部6比基準高度 204更上的位置。 與前述的箱升降機15的動作同時，箱升降機201是 以夾持部203的高度能夠形成與帽簷部6的高度同高度之 方式來使箱搬送機構202、夾持部203昇降。 前遮擋板1 3係開放箱搬入搬出口 1 2 (參照圖9 )。 如圖1 1 ( b )所示，箱搬送機構202會伸長，從箱保 管室1 1 b内經由箱搬入搬出口 1 2，水平移動至位於主框體 1 1外的夾持部203，藉此使夾持部203換至帽簷部6之下 〇 如圖π ( C )所示，一但箱升降機201使箱搬送機構 202上昇，則夾持部203會從保持台18上吊起箱2。 如圖1 1 ( d )所示，抓取式箱搬送裝置200會使箱搬 送機構202縮短，令箱2搬入至箱保管室1 lb内。 另一方面，箱升降機1 5會藉由昇降驅動裝置1 6來使 軸17縮短，而令保持台18下降至裝載埠14上。 然後，抓取式箱搬送裝置200會將箱2搬送至旋轉式 箱架3 1，交接至予以指定的架板3 3。 相較於第一例，雖需要藉由箱升降機2 0 1來使箱2昇 -34- 200832592 降於保持台1 8與箱搬入搬出口 1 2的高度之間的動作及動 作時間的點較差，但在此第二例中，同樣只要夾持部203 鉤到帽簷部6即可。因此，夾持部2 0 3不需要伸縮於水平 方向及鉛直方向的機構，其構造及作動形成簡單。其結果 ，可謀求低成本化、省空間化或運用時間的縮短化。 圖12及圖13是表示運用方法的第三例。 如圖1 2 ( a )所示，箱升降機1 5會藉由昇降驅動裝置 1 6來使軸1 7伸長，令支撐箱2的保持台1 8上昇至帽簷部 6形成基準高度204正下的位置。與前述箱升降機15的動 作同時，箱升降機201會以夾持部203的高度能夠形成對 向於箱搬入搬出口 12的高度之方式來使箱搬送機構202、 夾持部203昇降。 前遮擋板1 3係開放箱搬入搬出口 1 2 (參照圖9 )。 如圖12 ( b )所示’一旦箱搬送機構202潛入箱搬入 搬出口 12，則夾持部203會位於帽簷部6的正上方。 如圖12 ( c )所示，一旦箱升降機201使箱搬送機構 2 0 2下降，則夾持部2 0 3會下降至帽簷部6。夾持部2 0 3 是伸長於水平方向。 如圖12 ( d )所示，夾持部2 0 3是縮短於水平方向， 換至帽簷部6之下。 如圖13 ( a)所示，一旦箱升降機201使箱搬送機構 2 02上昇，則夾持部2 0 3會從保持台1 8之上吊起箱2。箱 升降機201是使箱搬送機構202至少上昇至箱2的底面比 基準高度更上的局度。 -35- 200832592 如圖1 3 ( b )所示，抓取式箱搬送裝置2 0 0會使箱搬 送機構202縮短，而令箱2搬入至箱保管室lib内。 另一方面，箱升降機1 5會藉由昇降驅動裝置i 6來使 軸1 7縮短，而令保持台1 8下降至裝載埠1 4上。 然後，抓取式箱搬送裝置200會將箱2搬送至旋轉式 箱架3 1，交接至予以指定的架板3 3。 若根據此第三例，則相較於第一例、第二例，雖需要 藉由箱升降機201來使箱2昇降於保持台1 8與箱搬入搬 出口 1 2的高度之間的動作及動作時間、及需要在夾持部 203水平方向伸縮的機構的點較差，但因爲夾持部203不 需要伸縮於鉛直方向的機構，其構造及作動形成簡單。其 結果，可謀求低成本化、省空間化或運用時間的縮短化。 第四實施形態是具備位於裝載埠的箱升降機及抓取式 箱搬送裝置，因此在裝載埠之保持台的昇降動作中，抓取 式箱搬送裝置可進行將其他的箱搬送至旋轉式箱架或副框 體的開箱器等其他的動作。因此，可提升抓取式箱搬送裝 置的操業率。 並且’藉由分成相升降機及抓取式箱搬送裝置，可與 裝載埠之箱的上昇動作同時，使抓取式箱搬送裝置作動至 箱交接位置前，而使待機。亦即，可同時並行處理，因此 可使總搬送時間縮短。 同樣，藉由同時實施抓取式箱搬送裝置的上昇與箱升 降機的下降，箱的交接時間亦可縮短。 另外，第四實施形態的運用方法可適用於前述第一實 - 36- 200832592 施形態及第二實施形態。適用時，可取得與前述第一實施 形態及第二實施形態同樣的效果。 圖1 4是表示開箱器的較佳實施例的側面剖面圖。 圖15是其分解立體圖。 如圖1 4所示，在密閉框體2 1的上面壁連接氮氣體供 給線路2 1A的一端，在密閉框體21的下面壁連接排氣線 路2 1 B的一端。氮氣體供給線路2 1 A是將氮氣體2 1 C從 吹出口往下吹出至預載室20内。排氣線路2 1 B是對預載 室20内進行排氣。 如圖14及圖1 5所示，在預載室2 0内的上端部，格 柵（Louver) 21D會被鋪設於與氮氣體供給線路21A的吹 出口對向的位置。格柵2 1 D是構成使從氮氣體供給線路 2 1 A的吹出口吹出的氮氣體2 1 C的流向偏向的偏向具。格 柵21D是朝門出入口 22傾斜。藉由此傾斜，格柵21 D可 使氮氣體流朝門出入口 22偏向。 其次，說明以上構成的開箱器的作用及效果。 由於氮氣體供給線路2 1 A會被連接至預載室20的上 端，排氣線路21B會被配置於下端，因此預載室20内的 氮氣體流是形成下流。下流的氮氣體2 1 C可有效地排出預 載室2 0内的塵埃及有機物等的異物。亦即，下流的氮氣 體2 1 C可防範異物附著於晶圓1，或侵入箱2。就預載室 20内的異物而言，有發自預載室20内所設置的移動台25 、閉合器2 6、及測繪裝置2 7的塵埃及有機物等。 格柵21D會使氮氣體21C偏向門出入口 22，引導至 -37- 200832592 箱2内。往該箱2内之氮氣體2 1 C的流動是在於防止來自 預載室20内下部之對流所造成異物的巻入。 例如，可實施其次的運用方法。 藉由工程内搬送裝置來從裝載埠1 4搬出箱2時，利 用格柵21D來引導氮氣體21C至箱2内，藉此利用氮氣體 21C來強制性清靜（置換）箱2内的環境（空氣及異物等 )。然後，在箱2的晶圓出入口 3藉由開箱器23來裝著 門4。 若根據此運用方法，則可在箱2内更封入氮氣體2 1 C ，因此可防止箱2内的汚染及自然氧化膜形成。 例如，即使副框體40内未形成氮氣體環境，還是可 在箱2内封入氮氣體21C。 並且，在晶圓出入口 3裝著門4以前對箱2内的晶圓 1實施測繪時，可在測繪完成箱2封入氮氣體2 1 C的狀態 下，送至其次工程。 另外’此開箱器的較佳實施例亦可適用於第一實施形 態〜第四實施形態。適用時可取得前述的效果。 圖1 6是表示箱升降機的較佳實施例的立體圖。 圖1 7是表示其作用狀態的立體圖。 如圖1 6所示，在箱升降機1 5設置有罩蓋3 〇 〇。罩蓋 3〇〇是具備：水平配置的頂板301、及垂直配置，上端邊 被固定於頂板3 0 1的前端邊之前板3 0 2。頂板3 0 1是被固 定於昇降驅動裝置16的軸17。前板302是形成可被覆裝 載埠1 4的橫寬、及比軸丨7的衝程更大的高度（參照圖i 7 -38- 200832592 昇降驅動裝置16、軸17可爲1個，但最好是所定的 間隔設置2個以上。藉此，可在載置箱的狀態下使頂板 3 〇 1安定地昇降。 在頂板3 0 1中，三角形的逃逸孔3 0 3會被開設於裝載 埠1 4上的保持台1 8所對向的部位。在逃逸孔3 03的三角 形頂點分別突設有運動銷1 9。因此，頂板3 0 1是構成保持 箱2下面的保持部，且構成箱載置部。 另外，亦可將頂板3 01表現成保持部，罩蓋3 00表現 成固定於保持部者。 又，罩蓋3 00並非一定要固定於保持部者。例如，亦 可在罩蓋3 00設驅動裝置，按照保持部、昇降機構的作動 來進行昇降。 其次，說明以上構成的箱升降機的作用及效果。 雖箱2的圖示省略，但實際從圖1 6的狀態來移行至 圖1 7的狀態時，頂板3 01會從保持台1 8上拾取箱2。此 時，頂板3 01的運動銷1 9是在箱2下面的定位孔5分別 嵌合於保持台1 8的運動銷1 9的外側。 另外，在通常的待機時，頂板3 0 1是位於比保持台1 8 更下方，對門出入口 2 2，保持台1 8會迴避前後時的干渉 〇 從圖1 7的狀態移行至圖1 6的狀態時，頂板3 0 1會將 箱2交接至保持台1 8上。 被覆箱升降機15的罩蓋300是在於抑止來自箱升降 -39- 200832592 機15的粒子飛散。特別是藉由頂板3 01來使箱2上昇至 箱搬入搬出口 1 2附近的狀態’由於昇降驅動裝置1 6及軸 17等會從裝置正面由正面開口 14C露出，因此會使粒子 飛散至裝置外。但，藉由罩蓋3 00 ’可抑止如此的粒子飛 散。 被覆箱升降機15的罩蓋300可抑止因爲昇降驅動裝 置1 6及軸1 7露出於作業空間所造成作業者的危險。 例如，可藉由罩蓋3 00來阻止作業者以手動來將箱2 從匣14Α的正面開口 14C (參照圖1 )裝載至裝載埠14時 之對昇降驅動裝置1 6及軸1 7的接觸。 圖1 8是表示箱升降機的更佳實施例的立體圖。 圖1 9是表示其作用狀態的立體圖。 本實施例與上述實施例相異的點是罩蓋3 00具有一對 的側板304、3 04的點。一對的側板3 04、3 04是分別直角 固定於前板3 02的左右兩端邊。亦即，除了有開箱器23 的側以外，設於三側面。 若根據本實施例，則罩蓋3 00不僅箱升降機15的前 方，也覆蓋左右側方，因此可更提升粒子飛散防止效果及 安全性確保效果。 另外，設置圖1 6〜圖1 9所示的箱升降機之實施例亦 可適用於第一實施形態〜第四實施形態。適用時可取得前 述的效果。 另外，本發明並非限於上述實施形態，只要不脫離其 主旨範圍，亦可實施各種變更。 -40- 200832592 例如，若考量箱保管室的密閉性或防止粒子飛散至裝 置外#’則最好是設置前遮擋板13，或箱搬入搬出口 12 形成小開口尺寸。但，亦可無前遮擋板1 3。 又，亦可使箱搬入搬出口 12擴大成最大限度，實質 將比開箱器2 3及密閉框體2 1更上方的區劃壁幾乎全部開 口。 例如，至箱搬送裝置3 5存取可能的高度位置爲止藉 由箱升降機1 5來使保持台1 8 (頂板3 0 1 )預先上昇，在 該位置從Ο Η T接受箱，使保持台1 8下降不進行門4的開 閉動作，藉由箱搬送裝置3 5來從保持台1 8接受箱。 一旦如此運用，則ΟΗΤ的下降範圍少爲保持台i 8上 昇的部份即可。又，由於保持台1 8從OHT接受箱後，不 必使箱搬送裝置3 5上昇至存取可能的高度位置，因此該 部份可縮短搬送時間。 例如，抓取式箱搬送裝置亦可採用於第一實施形態及 第二實施形態。 第三實施形態的第二區劃壁及箱平台機構亦可採用於 第一實施形態及第二實施形態。 測繪裝置亦可將第一實施形態適用於第二實施形態、 第三實施形態及第四實施形態，或將第二實施形態、第三 實施形態及第四實施形態適用於第一實施形態。 在上述實施形態中雖是針對適用於批次式CVD裝置 時來敘述’但本發明並非限於此，亦可適用於擴散裝置或 退火裝置及氧化裝置等的基板處理裝置全部。 -41 - 200832592 基板並非限於晶圓，亦可爲光罩或印刷配線基板、液 晶面板、光碟及磁碟等。 附記理想的實施態樣。 (1 ) 一種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係鄰接於上述搬入搬出部而設置，保管上 述收納容器； 開閉裝置，其係進行載置於該載置部之上述收納容器 的上述基板出入口的開閉； 搬送裝置，其係具有保持上述收納容器下面的保持機 構，經由上述開閉裝置的上方，在上述保管室内與外之間 ，搬送藉由該保持機構來保持的上述收納容器；及 昇降機構，其係於上述開閉裝置進行上述收納容器的 開閉時之上述載置部的高度位置、與上述搬送裝置進行上 述收納容器的授受的高度位置之間，進行上述載置部的昇 降。 (2 ) —種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 -42- 200832592 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係鄰接於上述搬入搬出部而設置，保管上 述收納容器； 開閉裝置，其係設於上述保管室，進行載置於該載置 部之上述收納容器的上述基板出入口的開閉； 搬送裝置，其係經由上述開閉裝置的上方，在上述保 管室内與外之間，搬送上述收納容器； 昇降機構，其係於上述開閉裝置進行上述收納容器的 開閉時之上述載置部的高度位置、與上述搬送裝置進行上 述收納容器的授受的高度位置之間，進行上述載置部的昇 降；及 控制器，其係於上述保管室内與外之間在上述昇降機 構使上述載置部上昇至可搬送上述收納容器的高度位置之 狀態下，控制上述昇降機構及上述搬送裝置，而使能夠在 上述搬送裝置與上述載置部之間進行上述收納容器的授受 〇 (3 ) —種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 開閉裝置，其係進行載置於該載置部之上述收納容器 -43- 200832592 的上述基板出入口的開閉； 保管架，其係設於上述框體内，保管上述收納容器； 搬送裝置，其係設於上述框體内，經由上述開閉裝置 的上方，在上述載置部與上述保管架之間，搬送上述收納 容器；及 昇降機構，其係使上述載置部上昇至上述搬送裝置可 存取的位置。 (4 )如上述（1 )之基板處理裝置，其中，具備上述收納 容器開閉時之包圍上述基板出入口及上述開閉裝置的開閉 室，該開閉室可在内部充塡惰性氣體。 (5 )如上述（1 )之基板處理裝置，其中，在上述開閉室 具備基板狀態檢測裝置。 (6)如上述（4)之基板處理裝置，其中，具備：對上述 開閉室供給惰性氣體的氣體供給線路、及將上述開閉室予 以排氣的排氣線路， 上述氣體供給線路係設置於與上述開閉裝置之卸下上 述蓋體時的退避方向呈相反的側，上述排氣線路係設置於 與上述開閉裝置之卸下上述蓋體時的退避方向相同的側。 (7 )如上述（6 )之基板處理裝置，其中，上述開閉室係 於上述氣體供給線路與上述基板出入口之間具備格柵（偏 向具）。 (8) —種半導體裝置的製造方法，係使用上述（1)的基 板處理裝置的製造方法，其特徵係具有： 將上述收納容器搬入上述搬入搬出部，在上述載置部 -44- 200832592 載置上述收納容器之步驟； 上述開閉裝置會從載置於上述載置部的上述收納容器 的上述基板出入口卸下上述蓋體之步驟； 上述開閉裝置會在載置於上述載置部的上述收納容器 的上述基板出入口安裝上述蓋體之步驟； 在上述蓋體卸下安裝時之上述載置部的高度位置、與 上述搬送裝置進行上述收納容器的授受的高度位置之間， 上述昇降機構會使上述載置部上昇之步驟； 上述搬送裝置會經由上述開閉裝置的上方來將上述保 持機構所保持的上述收納容器搬入至上述保管室内之步驟 ;及 在處理室内處理上述基板之步驟。 (9 ) 一種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係鄰接於上述搬人搬出部而設置，保管上 述收納容器； 開閉裝置，其係進行載置於上述載置部之上述收納容 器的上述基板出入口的開閉； 區劃壁，其係區劃上述保管室之内與外； 開口，其係設於比上述開閉裝置更上方的上述區劃壁 -45- 200832592 ，在上述保管室之内與外之間進行上述收納容器的搬入搬 出； 搬送裝置，其係設於上述保管室内，經由上述開口來 從上述載置部搬送上述收納容器；及 昇降機構，其係使上述載置部上昇至上述搬送裝置可 存取於上述載置部所載置的上述收納容器之位置。 (10)如上述（9)之基板處理裝置，其中，具備在上述 載置部上方對向於該載置部而設置的第二區劃壁、及設於 該第二區劃壁的第二開口、及進行該第二開口的開閉之第 二開閉裝置。 (1 1 )如上述（1 0 )之基板處理裝置，其中，上述第二開 閉裝置的上面，係於閉塞上述第二開口時形成可載置上述 收納容器。 (12) 如上述（9)之基板處理裝置，其中，具備進行上 述開口的開閉之第二開閉裝置。 (13) 如上述（1)之基板處理裝置，其中，具備： 預備室，其係設置有在上述開閉裝置卸下上述收納容 器的上述蓋體時，在上述收納容器與基板保持具之間搬送 上述基板的基板搬送裝置； 處理室，其係鄰接於該預備室而設置，處理被保持於 上述基板保持具的上述基板；及 保管室，其係鄰接於上述預備室而設置，設置有上述 保管架及上述搬送裝置。 (1 4 ) 一種半導體裝置的製造方法，其特徵係具有： -46- 200832592 將收納容器搬入搬入搬出部，在載置部載置該收納容 器之步驟； 上述開閉裝置會從被載置於上述載置部的上述收納容 器的基板出入口來卸下蓋體之步驟； 基板狀態檢測裝置會檢測出上述收納容器内的基板配 列狀態之步驟； 從±述盍體卸下安裝時之上述載置部的高度至上述開 閉裝置上方的高度、亦即在上述載置部與上述搬送裝置之 間進行上述收納容器的授受的高度，使上述載置部上昇之 步驟； 上述搬送裝置會保持上述收納容器，而從上述載置部 來搬送至保管架之步驟；及 在處理室内處理上述基板之步驟。 (1 5 ) —種基板處理裝置，其特徵係具備： 收納容器’其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部’其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部’其係於該搬入搬出部載置上述收納容器； 開閉裝置’其係進行載置於上述載置部之上述收納容 器的上述基板出入口的開閉； 昇降機構’其係於上述開閉裝置之可開閉上述收納容 器的高度位置、與跨越上述開閉裝置的上方而可搬送上述 收納容器的高度位置之間，進行上述載置部的昇降；及 -47- 200832592 搬送裝置’其係於與可搬送上述收納容器的高度之上 述載置部之間，進行上述收納容器的授受。 (1 6 ) —種基板處理裝置，其特徵係具備： 收納容器’其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部’其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 開閉裝置’其係進行載置於該載置部之上述收納容器 的上述基板出入口的開閉； 開閉室，其係包圍上述開閉裝置；及 昇降機構’其係於上述開閉裝置之可開閉上述收納容 器的高度位置、與上述載置部所載置的上述收納容器的至 少一部份形成比上述開閉室的上端更高的高度位置之間， 進行上述載置部的昇降。 (17) 如上述（16)之基板處理裝置，其中，具備覆蓋上 述載置部的下部之罩蓋，該罩蓋係按照上述昇降機構的作 動來進行昇降。 (18) 如上述（17)之基板處理裝置，其中，上述罩蓋係 配置於上述載置部的前側。 (19) 如上述（17)之基板處理裝置，其中，上述罩蓋係 除了有上述開閉裝置的側以外，設於三側面。 (20) —種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 -48- 200832592 蓋體來阻塞； 搬入搬出部’其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部’其係於該搬入搬出部載置上述收納容器； 昇降機構’其係設於該載置部的下方，進行該載置部 的昇降；及 罩蓋’其係設成可覆蓋上述載置部的下部，按照上述 昇降機構的作動來進行昇降。 (21) —種基板處理裝置，其特徵係具備： 收納容器，其係收納複數的基板，基板出入口會藉由 蓋體來阻塞； 搬入搬出部，其係於框體内與外之間進行該收納容器 的搬入搬出； 載置部，其係於該搬入搬出部載置上述收納容器； 保管室，其係設於上述框體内，保管上述收納容器； 開閉裝置，其係進行載置於該載置部之上述收納容器 的上述基板出入口的開閉； 搬送裝置，其係具有保持上述收納容器下面的保持機 構，經由上述開閉裝置的上方，在上述保管室内與外之間 ，搬送該保持機構所保持的上述收納容器； 昇降機構，其係於上述開閉裝置進行上述收納容器的 開閉時之上述載置部的高度位置、與上述搬送裝置進行上 述收納容器的授受的高度位置之間’進行上述載置部的昇 降；及 -49 - 200832592 控制器，其係於一面藉由上述保持機構來保持上述收 納容器下面，一面由上述昇降機構使上述載置部上昇至可 搬送上述收納容器的高度位置之狀態下，控制上述昇降機 構及上述搬送裝置，而使能夠在上述搬送裝置與上述載置 部之間進行上述收納容器的授受。 (22 ) —種半導體裝置的製造方法，係使用上述（1 6 )的 基板處理裝置的製造方法，其特徵係具有： 將上述收納容器搬入上述搬入搬出口’在上述載置部 載置上述收納容器之步驟； 在上述蓋體卸下安裝時之上述載置部的高度位置、與 上述載置部所載置的上述收納容器的至少一部份形成比上 述開閉室上端更高的高度位置之間，上述昇降機構會使上 述載置部上昇或下降之步驟；及 在處理室内處理上述基板之步驟。 (23)如上述（16)之基板處理裝置，其中，具備控制器 ，其係於上述昇降機構使上述載置部上昇至可搬送上述收 納容器的高度之狀態下，控制上述昇降機構及上述搬送裝 置，而使能夠在上述搬送裝置與上述載置部之間進行上述 收納容器的授受。 (24 ) —種半導體裝置的製造方法，係使用上述（16 )的 基板處理裝置的製造方法，其特徵係具有： 將上述收納容器搬入上述搬入搬出部，在上述載置部 載置上述收納容器之步驟； 上述昇降機構會使上述載置部上昇或下降之步驟；及 -50- 200832592 在處理室内處理上述基板之步驟。 【圖式簡單說明】 圖1是表示本發明的第一實施形態之批次式CVD裝 置的部份省略立體圖。 圖2是側面剖面圖。 圖3是表示主要部的側面剖面圖。 圖4是表示反應爐的縱剖面圖。 圖5是用以說明開箱器的作用之各部份省略側面剖面 圖’（a )是表示門的卸下前，（b )是表示測繪時。 圖6是表示箱搬入時之部份省略側面剖面圖。 圖7是表示本發明的第二實施形態之批次式CVD裝 置的側面剖面圖。 圖8是表示本發明的第三實施形態之批次式CVD裝 置的側面剖面圖。 圖9是表示本發明的第四實施形態之批次式c V D裝 置的側面剖面圖。 圖1 〇是表不其運用方法的第一例的各側面圖。 圖1 1是表示其運用方法的第二例的各側面圖。 圖1 2是表示其運用方法的第三例的各側面圖。 圖1 3是表示接續第三例的各側面圖。 圖1 4是表示開箱器的較佳實施例的側面剖面圖。 圖15是其分解立體圖。 圖1 6是表示箱升降機的較佳實施例的立體圖。 -51 - 200832592 圖1 7是表示其作用狀態的立體圖。 圖1 8是表示箱升降機的較佳實施例的立體圖。 圖1 9是表示其作用狀態的立體圖。 【主要元件符號說明】 1 :晶圓（基板） 2 z箱（收納容器） 3 :晶圓出入口 4 :門（蓋體） 5 :定位孔 6 :帽簷部 10 :批次式CVD裝置（基板處理裝置） 1 1 :主框體 11a:正面壁（區劃壁） 1 1 b :箱保管室 12:箱搬入搬出口（收納容器搬入搬出口） 1 3 :前遮擋板（開閉體） 1 4 :裝載璋（收納容器搬入搬出部） 14A :箱 14B :頂棚開口 14C :正面開口 1 5 :箱升降機（收納容器載置部昇降機構部） 1 6 :昇降驅動裝置 17 :軸 -52- 200832592 1 8 :保持台（收納容器載置部） 1 9 :支承運動銷 20 :預載室 2 1 :密閉框體（區劃壁） 2 1 A :氮氣體供給線路 2 1 B :排氣線路 21A’ ：氮氣體供給裝置 2 1 B ’ ：排氣裝置 22 :門出入口（開口部） 23 :開箱器（收納容器蓋體開閉部） 2 5 :移動台 26 :閉合器 27 :測繪裝置（基板狀態檢出部） 28 :線性促動器 29 :夾具 3 〇 :檢測元件 3 1 :旋轉式箱架（保管架） 3 2 :支柱 3 3 :架板 3 4 :支承運動銷 3 5 :箱搬送裝置（收納容器搬送部） 3 5a :箱升降機（收納容器昇降機構） 3 5b :箱搬送機構（收納容器搬送機構） 40 :副框體 -53- 200832592 40a:正面壁（區劃壁） 41:晶圓搬入搬出口 42 :開箱器（收納容器蓋體開閉部） 43 :載置台 44 :著脫機構 45 :預備室 46 :晶圓移載機構 46a :晶圓移載裝置 46b :晶圓移載裝置升降機 4 6 c :攝子 47 :載舟（基板保持具） 48 :載舟升降機 49 :臂 5 〇 :加封蓋 5 1 :處理爐 5 2 :加熱器 53 :加熱器基座 5 4 :製程管 5 5 :外管 5 6 :內管 5 7 :處理室 5 8 :筒狀空間 5 9 :岐管 6 0 :噴嘴 -54- 200832592 6 1 :氣體供給管here, A method of forming a thin film on the wafer 1 by the CVD method using the processing furnace 51 will be described. In addition, In the following description, The operations of the respective units constituting the processing furnace 51 are controlled by the controller 77. Once a plurality of wafers 1 are wafer charged on the boat 4 7, Then as shown in Figure 4, The wafer 7 of the wafer 1 holding the plurality of sheets is lifted by the boat lifter 48 and moved into the processing chamber 57 (loaded in the boat) 〇 In this state, The sealing cover 50 is in a state in which the lower end of the manifold 59 is sealed via the 〇-shaped ring 50a. The inside of the processing chamber 57 is exhausted by the exhaust device 68. This enables the formation of the desired pressure (vacuum). At this time, the pressure in the processing chamber 57 is measured by the pressure sensor 66. According to the measured pressure, Feedback control pressure adjustment device 67 ° again, The inside of the processing chamber 57 is heated by the heater 52. It is able to form the desired temperature. At this time, the temperature distribution of the desired -21 - 200832592 can be formed in the processing chamber 57. According to the temperature information detected by the temperature sensor 74, The feedback controls the energization to the heater 52. then, Rotating the boat 47 by the rotating mechanism 70, Thereby, the crystal 1 is rotated. Secondly, The gas supplied from the gas supply source 63 and controlled to a desired flow rate by the MFC 62 flows into the gas supply pipe 61 and is introduced into the processing chamber 57 by the nozzle 60. The introduced gas will rise in the processing chamber 57. The upper end opening of the inner tube 56 flows out to the cylindrical space 58 and is discharged by the exhaust pipe 65. The gas is in contact with the surface of the wafer 1 while passing through the processing chamber 57. at this time, A film is deposited on the surface of the wafer 1 by a thermal CVD reaction. Once the pre-set processing time has elapsed, The inert gas is supplied from the gas supply source 63 via the gas supply pipe 61. The inside of the processing chamber 57 is replaced with an inert gas. And the pressure in the process chamber 57 is restored to normal pressure. then, The cap 50 will be lowered by the boat lift 48. The lower end of the manifold 59 will be opened. Further, the processed wafer 1 is carried out from the lower end of the manifold 59 to the outside of the process tube 54 (the boat is unloaded) while being held in the carrier 47. The wafer 1 is unloaded, and the wafer 1 is taken out from the carrier 47 by the wafer transfer device 46a. Returning to the empty box 2 previously transported to the unpacker 42. Once the number of processed wafers is completed, the wafer 1 is stored. Then, the door 4 is attached to the wafer inlet and outlet 3 of the tank 2 by the unpacker 42 by -22-200832592. The case 2 in which the wafer inlet/outlet 3 is closed is automatically transferred to the frame plate 3 designated by the rotary box frame 3 by the tank conveying device 35 and delivered. The box 2 will be temporarily kept. then, Once the front shield 1 3 is opened, Then, the tank transporting device 35 transports the tank 2 from the rack plate 3 3 to the tank loading/unloading port 1 2, It is transferred to the tank loading/unloading port 1 2 on the holding table 18 of the box elevator 15 and delivered. In addition, The tank 2 storing the processed wafer 1 may be directly transported from the unpacker 4 2 to the tank loading/unloading port 12 by the tank conveying device 35. Once the box 2 is transferred on the holding station 18, The front shutter 1 3 will close. and, The shaft 17 of the box elevator 15 is lowered onto the loading cassette 14 by the lifting drive unit 16. The box 2 descending onto the loading cassette 14 will be transported by the in-house transfer device, For example, the AGV 9 shown in Fig. 1 is transported to a predetermined project. According to the above embodiment, Then you can get the second effect. 1) The surveying and mapping device is installed in the loading magazine that the container will carry in by the in-house conveying device. Thereby, the actual surveying information which is found by the surveying device and the previously provided surveying information can be returned from the loading cassette. Therefore, Compared with the previous situation in which the surveying device is installed in the box opener in the frame, the time-consuming labor required to return the box to the frame and return it to the loading port can be omitted. This part shortens the time delays that are found at different times from the start of wafer processing. 2) When grasping the upper part of the storage container, The operation (handling) of the storage container transport unit requires an elevator (flexible function) and a grip (grip) -23-200832592 (horizontal expansion function). In order to have various functions of the operation unit of the storage container transport unit, The storage container transfer unit itself requires strength. Therefore, the storage container transport unit is enlarged. and, Because the structure will be complicated, Therefore, the cost is high or it is prone to bad conditions. and, In the case of improper clamping, There are also many cases in which the storage container is dropped. Even the long-term transfer time of the storage container caused by the gripping, The enlargement of the pipe holder caused by the enlargement of the operation unit, The height of the device caused by the space to be grabbed, etc. There are many disadvantages. That point, By placing a box above the loading cassette and moving it into the outlet, Further, a box lifter for lifting and lowering the holding table of the lower holding box between the loading cassette and the loading and unloading port of the box is provided. The box transport device can be used to pick up the box from the lower side. Therefore, when operating compared to the upper part of the box, The operating structure can be made simple and small. therefore, It is possible to reduce the size and weight of the CVD apparatus. Simple, High speed, Safety and space utilization. 3) by supporting the moving pin in the holding table that is lifted and lowered by the box elevator, The holding table can be used as a transport standard for the box mounting portion in each place. Therefore, It is possible to unify the transport standard. 4) By dividing into a box elevator and a box conveying device, Simultaneously with the lifting movement of the box Stand by before moving the tank transfer unit to the box transfer position. that is, Can be processed in parallel at the same time, Therefore, the total transfer time can be shortened. 5) Since the box elevator can raise the holding table to the height of the box picked up from the lower side by the box conveying device, Therefore, when compared with the upper part of the operation box, It can be safely handed over to the box. 6) Because the inert gas can be used to clean and purify the pre-loading room of the -24-200832592 wafer in the box containing the crucible, Therefore, contamination and formation of a natural oxide film can be prevented. Fig. 7 is a side sectional view showing a batch type CVD apparatus according to a second embodiment of the present invention. The point that the present embodiment differs from the above embodiment mainly is that the unpacker is provided only at the point where the magazine is loaded. that is, As shown in Figure 7, The loading cassette 14 is a front wall (division wall) 40a provided in the sub-frame 40 forming the preliminary chamber 45, An opener 83 is provided on the front wall 40a. A wafer loading/unloading port 9 is opened in the rear wall 8 1 a of the sealed casing 8 1 forming the preloading chamber 80 of the unpacker 83. Further, a door mechanism 92 that opens and closes the wafer loading/unloading port 9 1 is provided. The wafer transfer mechanism 46 provided in the preliminary chamber 45 constitutes a substrate transfer device. When the door mechanism 92 opens the wafer loading and unloading port 9 1 , The wafer transfer mechanism 46 transports the wafer 1 between the tank 2 and the carrying boat 47. The boat lift 48 is a processing chamber 57 that carries the carrying boat 47 into the processing furnace 51 adjacent to the preliminary chamber 45. The loading boat 47 is carried out from the processing chamber 51. The storage rack 31A and the tank conveying device 35 are provided in the storage chamber 1 lb adjacent to the ceiling surface of the preliminary chamber 45. A box loading/unloading port 1 2 is opened in a portion of the front wall 11a of the main casing 11 facing the storage chamber lib. The front shutter 13 is to open or close the box into and out of the port 1 2 . Similar to the unpacker 4 2 of the first embodiment, A surveying device 84 is provided in the preload chamber 8A. The surveying device 84 can move the door entrances and exits 82 to the front and rear sides -25 - 200832592 (vertical direction) and up and down (parallel directions). Secondly, The function of the above-described opener is explained. In addition, The controller 77 is controlled by the following actions. As shown in Figure 7, The in-project conveying device passes through the front opening i 4C or the ceiling opening 14B, When loading into loading 埠14, The tank 2 is a holding table 18 that is placed on the box elevator 15. At this time, the supporting movement pin 19 protruding from the holding table 18 is inserted into the positioning hole 5 below the case 2, Thereby, the tank 2 is formed in a state of being positioned on the holding table 18. Secondly, in loading 玮1 4, The box 2 will be moved in the direction of the unpacker 83. The closer 86 of the unpacker 83 holds the door 4. Once the door 4 is held, Then, the closer 8 6 removes the door 4 from the wafer inlet and outlet 3 and the door inlet and outlet 82 by the retreat of the moving table 85. then, The shutter 86 is lowered into the preload chamber 80 by the mobile station 85. Thereby, the position from the wafer entrance 3 and the door entrance 82 is separated. Once the wafer entrance 3 is opened, Then, the detecting element of the mapping device 84 is inserted into the wafer inlet and outlet 3 (refer to Fig. 5 (b)). The surveying device 84 will map the wafer 1 in the tank 2 by means of the detecting element. Once the survey has been completed, Then, the mapping device 84 returns the detecting element from the wafer inlet and outlet 3 to the original standby position. then, The closer 86 moves to the position of the crystal inlet and outlet 3 as the moving table 85 rises. then, The closer 86 mounts the door 4 to the wafer entrance 3 and the door entrance 82 by the advancement of the mobile station 85. When the actual mapping information read by the mapping device, When it is different from the mapping information provided in advance for the -26-200832592 box 2, The box 2 that is found to be different will be transported from the loading cassette 14 by the in-house transfer device, For example, the AGV 9 shown in Fig. 1 is immediately transferred to a wafer forming project or a previous project. When the actual mapping information read by the aforementioned mapping device, When it is consistent with the mapping information provided in advance by the box 2, The box lifter 15 raises the height of the tank 2 supported by the holding table 18 from the loading port 14 to the tank loading and unloading port 1 2 . Once the tank 2 is raised to the height at which the tank is moved into the outlet 12, Then, the front cover baffle 13 will open the box to move into and out of the port 1 2 . then, The tank transport mechanism 3 5 b of the tank transport unit 35 picks up the tank 2 supported by the holding table 18. The tank transport mechanism 35b carries the picked-up box 2 from the tank into the carry-out port 1 2 into the main casing 11. The box transport device 35 transports the loaded box 2 to the storage rack 31A. Automatically hand over to the designated shelf 3 3 A. The case 2 is temporarily stored in the shelf 3 3 . then, In the opposite procedure to the foregoing, The tank transport unit 35 and the tank lifter 15 transport the tank 2 from the storage rack 3 1 A to the loading cassette 14 . at this time, In the preparation room 45, there is a flow of clean air. Secondly, In the loading cassette 14, The box 2 will be moved in the direction of the unpacker 8 3 . The closer 8 6 of the unpacker 8 3 is at the holding door 4. Once the door 4 is held, Then, the closer 86 removes the door 4 from the wafer inlet and outlet 3 by the retreat of the moving table 85. then, The closer 86 is lowered into the preload chamber 80 by the mobile station 85. From the wafer entrance and exit 3 and the door -27- 200832592 The position of the entrance 82 is detached. Once the wafer entrance 3 is opened, Then, the wafer loading/unloading port 91 is opened by the door mechanism 92. at this time, The mapping of the wafers in the box has been completed. So it can be omitted. Once the wafer inlet and outlet 3 and the wafer loading and unloading port 9 1 are opened, Then, the wafer transfer device 46a picks up the wafer 1 from the case 2 via the wafer inlet/outlet 3 or the door inlet/outlet 82 and the wafer loading/unloading port 9 1 by the die 46c. The wafer transfer device 46a transports the picked wafer 1 to the groove alignment device. The groove alignment device consists in aligning the wafer 1 with the groove. After the groove is aligned, The wafer transfer device 46a picks up the wafer 1 from the groove alignment device by the die 46c. The wafer transfer device 46a transfers the picked wafer 1 to the carrying boat 47. Charging to the boat 47. The wafer transfer device 46a that transfers the wafer 1 to the carrier 47 will return to the tank 2, The next wafer 1 is mounted to the carrying boat 47. In addition, The step of temporarily storing the box 2 may be omitted from the storage rack 3 1 A. The wafer transfer device 46a directly transfers the wafer 1 from the tank 2 by the die 46c. that is, The surveying is over, The detecting element of the surveying device is returned from the wafer inlet/outlet 3 to the original standby position or the wafer loading/unloading port 91 is opened during the mapping. The wafer transfer device 46a inserts the wafers 1 from the cassette 2 by inserting the cassettes 46c into the wafer loading/unloading port 91. Since the subsequent steps are the same as in the above embodiment, Therefore, the explanation is omitted. According to the present embodiment, it is only necessary to install the unpacker on the loading cassette. Therefore, space efficiency can be improved (the table area is reduced), Production -28- 200832592 Capacity improvement (can reduce the range of movement of the box). Fig. 8 is a side sectional view showing a batch of a third embodiment of the present invention. In the present embodiment, a point different from the above-described second embodiment, which is operated at the upper portion of the box, A point is set even if the crystal inside the box is acceptable from the ceiling transport type internal transport device (the box mechanism of the box below). that is, As shown in Figure 8, The operation of the upper portion of the box (hereinafter referred to as the grab box transport device) 100 is carried out in the storage chamber lib of the ceiling surface of the adjacent chamber 45 together with the storage rack 31A. The grab box transport device 100 is provided with: Box lifter 101 lifts the box transport mechanism 102, And the clamping portion 1 0 3 that is moved by the 1 0 2 . The grip portion 1 0 3 can extend over the cap portion 6 projecting from the upper surface of the case 2. The box platform mechanism 105 is provided with: The skateboard 107 opened and closed in the loading port opening 106. Box platform mechanism When the mouth 1 06 is open, The case 2 is placed on the holding table of the loading cassette 14 from the OHT 1 10 via the ceiling opening portion 106, on the other hand, When the slide 107 closes the opening 106, the taste is placed on the slide 107 (the task of the storage rack is then, When the box 2 is placed on the loading platform 18 from the slider 107, The box transport mechanism 102 raises the state of the box 2. The mechanism 105 slides the slide 107 to open the opening 106. The transport mechanism 102 operates the box 2, Through the operation of the opening ί type CVD device is configured to be able to capture the round and the transfer of the box is installed in the spare room. 101, By the box conveyor, the 1 正 5 is open at 14 Β and the opening is 18 °. ΟΗΤ1 10 : ) ° 1 4 keep, Box platform. then, The box 1 〇 6 comes -29- 200832592 placed on the loading 1 1 4 holding table 18. Secondly, The box operation steps of the above-described grasping type box conveying device 100 and the box platform mechanism 105 will be described. In addition, The other steps of the mapping step of the wafer in the survey box are the same as in the second embodiment described above. Therefore, the description of these steps is omitted. As shown in Figure 8, The OHT1 10 is through the ceiling opening 14B and the opening portion 106. The tank 2 is supplied directly to the loading cassette 14. at this time, The supporting motion pin 19 of the holding table 18 is inserted into the positioning hole 5 below the box 2, Thereby, the tank 2 is formed in a state of being positioned at the holding table 18 〇 in the loading cassette 14 The surveying device is a wafer in the surveying box (refer to the first embodiment and the second embodiment). In the mapping step, When the actual mapping information read by the surveying device, When it is different from the mapping information provided in advance by the box 2, The containers 2 that are found to be different are immediately transported from the loading cassette 14 by the OHT 110 to the wafer forming project or the previous project. When the actual mapping information read by the surveying device, When consistent with the mapping information provided in advance for the box 2, The front shutter 1 3 will open the box and move into the exit 1 2, The box elevator 1 0 1 lowers the tank transport mechanism 102 to the opposite position of the tank loading and unloading port 1 2 . then, The tank transport mechanism 102 causes the grip portion 103 to sneak into the tank to carry in and out the port 1 2, And move to the top of the box 2. Secondly, The cassette transport mechanism 1 〇 2 lowers the grip portion 1 〇 3 . The clamping part 1 0 3 will stretch to the bottom, The cap portion 6 of the upper case 2 is clamped from above. -30- 200832592 Once the brim portion 6 of the box 2 is clamped, Then, the clamping portion 1 0 3 is shortened to the upper side and the box 2 is lifted. Further, the tank elevator 1 0 1 raises the tank transport mechanism 1 〇 2 to a height corresponding to the tank loading/unloading port 12. The tank transport mechanism 102 transports the hoisted box 2 from the tank to the unloading port 1 2 into the tank storage room lib of the main casing 11. The grab box transport apparatus 100 transports the carried box 2 to the tube holder 31A. Automatically handed over to the designated shelf 33A. Box 2 will be temporarily kept. then, In the opposite procedure to the foregoing, The grab box transport apparatus 100 transports the tank 2 from the storage rack 3 1 A to the loading cassette 14 . E.g, When the other box 2 is transported by OHT 1 1 0 in the mapping step, The box platform mechanism 1 0 5 will accept the box 2 from the Ο Η T 1 1 0 by means of the skateboard 1 〇 7 Keep it temporarily with the skateboard 1 〇7. that is, As shown in the false line in Figure 8, The box platform mechanism 1 〇 5 is to slide the slider 1 〇 7 to close the opening 1 〇 6, The box 2 of ΟΗΤ1 1〇 is accepted by the skateboard 1 〇 7 . that is, The slide 107 is a task for playing the storage rack at one time. then, When the box 1 is moved from the skateboard 107 to the holding table 18 of the magazine 1 4, when the box transport mechanism 102 lifts the box 2 from the slider 107, The box platform mechanism 105 slides the slider 107 to open the opening 106. Next, the box transport mechanism 102 causes the lifted box 2 to be placed on the holding table 18 of the loading cassette 14 through the opening 106. According to this embodiment, Further, in addition to the effects of the second embodiment described above, the second effect can be obtained. -31 - 200832592 When the box is transported by OHT in the mapping step, The box platform mechanism will accept the box from the OHT by the skateboard. This can be temporarily stored. Fig. 9 is a side cross-sectional view showing a batch type c V D device according to a fourth embodiment of the present invention. The point of the present embodiment that differs from the above-described first embodiment is a point that includes a box transport device (hereinafter referred to as a grab box transport device) 200 that transports the brim portion 6 of the case 2 and transports it. that is, As shown in Figure 9, The grab box transporting device 200 is installed in the tank storage chamber 1 1 b. The grab box transporting device 200 is in a state in which the cap portion 6 is grasped. Move in and out of the box 1 2, The tank 2 is transported between the holding table 18 and the tank holding chamber 1 1 b. The grab box conveying device 200 is provided with: Box lift 201, a box transport mechanism 202 that is lifted and lowered by the box elevator 201, And a nip portion 203 that is moved by the tank transport mechanism 202. In terms of the clamping portion 203, Stretching in the horizontal direction to grasp the shape of the brim portion 6, And does not have a mechanism that is stretched in the horizontal direction, Form a rough font, Hook type only hooked to the brim, And a type of mechanism that is stretched in the vertical direction. The grab box transport device 200 is controlled by a controller 77. Secondly, A few examples illustrate the operation of the above-described grasping box conveying device. In the following description, The controller 77 is for controlling the grab box transport device 200, Box lift 15, The operation of the front shutter 13 or the like. Fig. 10 is a view showing a first example of the operation method. As shown in Figure 10 (a), The box lift 15 is extended by the lifting drive -32- 200832592 1 6 , The holding table 18 of the support box 2 is raised to a position where the bottom surface of the box 2 is higher than the reference height 204. Simultaneously with the aforementioned action of the box elevator 15, The box elevator 201 will form the box transport mechanism 202 in such a manner that the height of the grip portion 203 can be formed at the same height as the height of the brim portion 6. The clamping portion 203 is raised and lowered. In addition, The reference height 204 is the height of the lower end of the tank loading/unloading port 12 (refer to FIG. 9). At least the height position above the height position of the upper end of the casing 2 1 is sealed. A height position higher than the height position of the upper end of the preloading chamber 20. The front shielding plate 13 is an open box loading/unloading port 1 2 (see Fig. 9). As shown in Figure 10 (b), the box transport mechanism 2 0 2 will elongate. From the box protection room 1 1 b, move into the outlet 1 2 via the box, Moving horizontally to the nip portion 2 0 3 ' located outside the main frame body 1 1 thereby changing the nip portion 2 0 3 under the brim portion 6 as shown in Fig. 1 (C), Once the tank lifter 2020 raises the tank transport mechanism 202, the gripping section 203 lifts the tank 2 from the holding deck 18. As shown in Figure 10 (d), The grab box transporting device 200 shortens the tank transport mechanism 202. The box 2 is carried into the storage compartment 1 lb. On the other hand, the box lifter 15 will shorten the shaft 17 by the lifting drive unit 16, The holding table 18 is lowered onto the loading cassette 14. then, The grab box transport device 200 transports the tank 2 to the rotary rack 3 1 Hand over to the designated shelf 3 3 . According to the first example, Then, the grip portion 203 is only required to be hooked to the brim portion 6. therefore, The clamping portion 203 does not need to be stretched in a horizontal direction and a vertical direction -33 - 200832592, Its structure and actuation are simple to form. the result, Cost-effective, Space saving or shortening of operating time. Fig. 11 is a view showing a second example of the operation method. As shown in Figure 1 1 (a), The box lifter 15 is configured to elongate the shaft 17 by means of the lifting drive unit 16. The holding table 18 of the support box 2 is raised to a position lower than the reference height 204 of the bottom surface of the box, That is, the position of the brim portion 6 is higher than the reference height 204. Simultaneously with the operation of the aforementioned box elevator 15, The box lifter 201 is configured such that the height of the grip portion 203 can be equal to the height of the brim portion 6, so that the tank transport mechanism 202, The clamping portion 203 is raised and lowered. The front shutter 13 is an open box loading/unloading port 1 2 (see Fig. 9). As shown in Figure 1 1 (b), The box transport mechanism 202 will elongate, From the box protection room 1 1 b, move into the outlet 1 2 via the box, Moving horizontally to the clamping portion 203 located outside the main frame body 1 1 Thereby, the clamping portion 203 is replaced under the brim portion 6 as shown in Fig. π ( C ), Once the box elevator 201 raises the tank transport mechanism 202, Then, the clamping portion 203 lifts the case 2 from the holding table 18. As shown in Figure 1 1 (d), The grab box transporting device 200 shortens the tank transport mechanism 202. The box 2 is carried into the storage compartment 1 lb. on the other hand, The box lifter 15 will shorten the shaft 17 by means of the lifting drive unit 16. The holding table 18 is lowered onto the loading cassette 14. then, The grab box transport device 200 transports the tank 2 to the rotary rack 3 1 Hand over to the designated shelf 3 3 . Compared to the first case, It is necessary to lower the movement of the box 2 liter -34- 200832592 by the box elevator 20 1 to the height between the holding stage 18 and the height of the box loading/unloading port 1 2, and the operating time is poor. But in this second case, Also, as long as the grip portion 203 is hooked to the brim portion 6. therefore, The clamping portion 2 0 3 does not need to be stretched in a horizontal direction and a vertical direction. Its structure and actuation are simple to form. the result , Cost-effective, Space saving or shortening of operating time. 12 and 13 show a third example of the operation method. As shown in Figure 1 2 (a), The box lifter 15 will elongate the shaft 17 by means of the lifting drive 16 The holding table 18 of the support box 2 is raised to a position where the brim portion 6 is formed directly below the reference height 204. Simultaneously with the operation of the aforementioned box elevator 15, The tank elevator 201 will cause the tank transport mechanism 202 to form a height corresponding to the tank loading/unloading port 12 at a height of the grip portion 203. The clamping portion 203 is raised and lowered. The front shutter 13 is an open box loading/unloading port 1 2 (see Fig. 9). As shown in Fig. 12 (b), once the box transport mechanism 202 is sneaked into the box and moved into the port 12, Then, the clamping portion 203 is located directly above the brim portion 6. As shown in Figure 12 (c), Once the box elevator 201 lowers the tank transport mechanism 2 0 2, Then, the clamping portion 220 will descend to the brim portion 6. The nip portion 2 0 3 is elongated in the horizontal direction. As shown in Figure 12 (d), The clamping portion 2 0 3 is shortened in the horizontal direction, Change to under the brim 6 . As shown in Figure 13 (a), Once the box elevator 201 raises the tank transport mechanism 2 02, Then, the gripping portion 203 lifts the tank 2 from above the holding table 18. The box elevator 201 is such that the tank transport mechanism 202 rises at least to the bottom of the tank 2 above the reference height. -35- 200832592 As shown in Figure 13 (b), The grab box transporting device 200 will shorten the tank transport mechanism 202. The box 2 is carried into the storage compartment lib. on the other hand, The box lifter 15 will shorten the shaft 17 by the lifting drive i6, The holding table 18 is lowered to the loading port 14 . then, The grab box transport device 200 transports the tank 2 to the rotary rack 3 1 Hand over to the designated shelf 3 3 . According to this third example, Compared to the first case, The second case, It is necessary to move and move the tank 2 between the holding table 18 and the height of the tank loading/unloading port 1 by the tank elevator 201, and the operation time, And the mechanism that needs to be stretched in the horizontal direction of the nip portion 203 is poor, However, since the clamping portion 203 does not need to be stretched in the vertical direction, Its structure and actuation are simple to form. the result, Cost-effective, Space saving or shortening of operating time. The fourth embodiment is provided with a box lifter and a grab box transporting device located in the loading cassette. Therefore, in the lifting operation of the holding table of the loading device, The grab box transport device can perform other operations such as transporting another box to the rotary box or the box opener of the sub-frame. therefore, It can improve the operating rate of the grab box transport device. And by dividing into a phase lift and a grab box transfer device, Simultaneously with the ascending action of the box Before the grab-type box conveying device is actuated to the box transfer position, And make standby. that is, Can be processed in parallel at the same time, Therefore, the total transfer time can be shortened. same, By simultaneously implementing the rise of the gripper box transport device and the drop of the tank lifter, The handover time of the box can also be shortened. In addition, The operation method of the fourth embodiment can be applied to the first embodiment and the second embodiment. When applicable, The same effects as those of the first embodiment and the second embodiment described above can be obtained. Figure 14 is a side cross-sectional view showing a preferred embodiment of the unpacker. Fig. 15 is an exploded perspective view thereof. As shown in Figure 14. One end of the nitrogen gas supply line 2 1A is connected to the upper wall of the sealed casing 2 1 . One end of the exhaust line 2 1 B is connected to the lower wall of the sealed casing 21. The nitrogen gas supply line 2 1 A blows the nitrogen gas 2 1 C downward from the air outlet into the preload chamber 20. The exhaust line 2 1 B exhausts the inside of the preload chamber 20. As shown in Figure 14 and Figure 15, In the upper end of the preload chamber 20, The Louver 21D is placed at a position facing the air outlet of the nitrogen gas supply line 21A. The grid 2 1 D is a deflector that deflects the flow of the nitrogen gas 2 1 C blown from the outlet of the nitrogen gas supply line 2 1 A. The grid 21D is inclined toward the door entrance 22 . By tilting, The grid 21 D deflects the flow of nitrogen gas toward the door inlet and outlet 22 . Secondly, The function and effect of the above-described unpacker will be described. Since the nitrogen gas supply line 2 1 A is connected to the upper end of the preload chamber 20, The exhaust line 21B is disposed at the lower end. Therefore, the flow of nitrogen gas in the preload chamber 20 is a downstream flow. The downstream nitrogen gas 2 1 C can effectively discharge foreign matter such as dust and organic matter in the pre-chamber 20 . that is, The downstream nitrogen gas 2 1 C prevents foreign matter from adhering to the wafer 1, Or intruding into the box 2. Regarding the foreign matter in the preload chamber 20, There is a mobile station 25 provided in the preloading chamber 20, Closer 2 6, And the dust and Egyptian organic matter of the surveying and mapping device 27. The grid 21D biases the nitrogen gas 21C toward the door inlet and outlet 22, Boot to -37- 200832592 in box 2. The flow of the nitrogen gas 2 1 C into the tank 2 is to prevent the intrusion of foreign matter caused by convection from the inside and the lower portion of the preload chamber 20. E.g, The second method of application can be implemented. When the box 2 is carried out from the loading cassette 1 by the in-project conveying device, The grid 21D is used to guide the nitrogen gas 21C into the tank 2, Thereby, the atmosphere (air, foreign matter, etc.) in the tank 2 is forcibly cleaned (replaced) by the nitrogen gas 21C. then, The door 4 is housed in the wafer inlet and outlet 3 of the tank 2 by the unpacker 23. According to this application method, Then, the nitrogen gas 2 1 C can be further enclosed in the tank 2, Therefore, contamination inside the tank 2 and formation of a natural oxide film can be prevented. E.g, Even if a nitrogen gas atmosphere is not formed in the sub-frame 40, It is also possible to enclose the nitrogen gas 21C in the tank 2. and, When mapping the wafer 1 in the tank 2 before the wafer entrance 3 is mounted with the door 4, In the state where the nitrogen gas 2 1 C is sealed in the surveying and completing box 2, Send to the next project. Further, the preferred embodiment of the unpacker can be applied to the first embodiment to the fourth embodiment. The aforementioned effects can be obtained when applicable. Figure 16 is a perspective view showing a preferred embodiment of the box elevator. Fig. 17 is a perspective view showing the state of action thereof. As shown in Figure 16. The cover lifter 15 is provided with a cover 3 〇 〇. Cover 3〇〇 has: Horizontally configured top plate 301, And vertical configuration, The upper end side is fixed to the front end side of the top plate 301 to the front plate 3 0 2 . The top plate 301 is a shaft 17 that is fixed to the elevation drive unit 16. The front plate 302 is formed to have a lateral width that can be coated with the carrier 14 And a height greater than the stroke of the axle 7 (refer to Figure i 7 -38-200832592 lifting drive 16, The shaft 17 can be one. However, it is preferable to set more than two intervals. With this, The top plate 3 〇 1 can be lifted and lowered stably in the state in which the box is placed. In the top plate 310, The escape hole 3 0 3 of the triangle is opened at the portion where the holding table 18 on the loading port 14 is opposed. A moving pin 19 is protruded from the triangular apex of the escape hole 303, respectively. therefore, The top plate 301 is a holding portion that constitutes the underside of the holding box 2, And constitute a box mounting portion. In addition, The top plate 3 01 can also be represented as a holding portion. The cover 300 appears to be fixed to the holder. also, The cover 300 does not necessarily have to be fixed to the holder. E.g, A drive can also be provided on the cover 300. Follow the maintenance department, The lifting mechanism is operated to raise and lower. Secondly, The function and effect of the above-described box elevator will be described. Although the illustration of box 2 is omitted, However, when actually moving from the state of Fig. 16 to the state of Fig. 17, The top plate 3 01 picks up the box 2 from the holding table 18. at this time, The moving pin 19 of the top plate 3 01 is fitted to the outside of the moving pin 19 of the holding table 18 by the positioning holes 5 under the case 2, respectively. In addition, During normal standby, The top plate 3 0 1 is located below the holding table 18, Door entrance 2 2, The holding table 18 will avoid the dryness before and after the 渉 移 When moving from the state of Fig. 17 to the state of Fig. 16, The top plate 3 0 1 will transfer the box 2 to the holding table 18. The cover 300 of the covered box elevator 15 is intended to suppress scattering of particles from the machine 15 of the box lift-39-200832592. In particular, the case 2 is raised to the vicinity of the case loading/unloading port 1 2 by the top plate 301. Since the elevation driving device 16 and the shaft 17 are exposed from the front surface of the device, the front opening 14C is exposed. This will cause the particles to fly out of the device. but, Such a particle scattering can be suppressed by the cover 3 00 '. The cover 300 of the covered box elevator 15 can suppress the danger of the operator due to the exposure of the lifting and lowering drive unit 16 and the shaft 17 to the work space. E.g, The cover 300 can prevent the operator from manually contacting the box 2 from the front opening 14C (see Fig. 1) of the cassette 14 to the loading and lowering drive unit 16 and the shaft 17 when the cassette 14 is loaded. Figure 18 is a perspective view showing a more preferred embodiment of the box elevator. Fig. 19 is a perspective view showing the state of action thereof. The point that this embodiment differs from the above embodiment is that the cover 300 has a pair of side plates 304, 3 04 points. a pair of side panels 3 04, 3 04 is fixed at right angles to the left and right ends of the front plate 3 02. that is, Except for the side of the unpacker 23, Set on three sides. According to this embodiment, Then, the cover 3 00 is not only in front of the box lift 15, Also covers the left and right sides, Therefore, the particle scattering prevention effect and the safety ensuring effect can be further enhanced. In addition, The embodiment of the box elevator shown in Figs. 16 to 17 can be applied to the first to fourth embodiments. The above effects can be obtained when applicable. In addition, The present invention is not limited to the above embodiment. As long as it does not deviate from its scope, Various changes can also be implemented. -40- 200832592 For example, It is preferable to provide the front shield 13 if the airtightness of the storage compartment or the scattering of the particles to the outside of the apparatus is prevented. Or the box is moved into the outlet 12 to form a small opening size. but, There is also no front cover 1 3 . also, It is also possible to expand the box into the outlet 12 and expand it to the maximum. In essence, almost all of the partition walls above the unpacker 2 3 and the closed frame 2 1 are opened. E.g, Until the tank conveyance device 35 accesses the possible height position, the tank lifter 15 is used to raise the holding table 18 (top plate 3 0 1 ) in advance. In this position, accept the box from Ο Η T, The holding table 18 is lowered without opening and closing the door 4, The tank is received from the holding table 18 by the tank conveying device 35. Once used, Then, the range of the drop of the cymbal is less than the portion that keeps the rise of the i 8 . also, Since the holding station 18 receives the box from the OHT, It is not necessary to raise the tank transport device 35 to a possible height position for access. Therefore, this part can shorten the transfer time. E.g, The grasping box conveying device can also be applied to the first embodiment and the second embodiment. The second partition wall and the box platform mechanism of the third embodiment can also be applied to the first embodiment and the second embodiment. The mapping apparatus can also be applied to the second embodiment, Third embodiment and fourth embodiment, Or the second embodiment, The third embodiment and the fourth embodiment are applied to the first embodiment. In the above embodiment, the description is applied to a batch CVD apparatus, but the present invention is not limited thereto. It can also be applied to all of the substrate processing apparatuses such as the diffusion device, the annealing device, and the oxidation device. -41 - 200832592 The substrate is not limited to wafers. It can also be a photomask or a printed wiring substrate, LCD panel, Discs and disks, etc. The ideal implementation of the note. (1) A substrate processing apparatus, Its characteristics are: Storage container, It accommodates a plurality of substrates, The substrate entrance and exit is blocked by the cover; Move in and out, The storage container is carried in and out between the inside and outside of the casing; Placement, Disposing the storage container on the loading/unloading unit; Storage room, It is provided adjacent to the loading/unloading unit, Storing the storage container; Opening and closing device, Opening and closing the substrate inlet and outlet of the storage container placed on the mounting portion; Transport device, It has a holding mechanism that holds the underside of the storage container. Via the above opening and closing device, Between the above storage room and outside, Carrying the storage container held by the holding mechanism; And lifting mechanism, It is a height position of the mounting portion when the opening and closing device performs opening and closing of the storage container, Between the height position at which the storage container is transferred and received by the transport device, The elevation of the above mounting portion is performed. (2) a substrate processing device, Its characteristics are: Storage container, It accommodates a plurality of substrates, The substrate entrance and exit is blocked by the cover; Move in and out, It is carried out between the inside and outside of the casing to carry out the loading and unloading of the storage container -42-200832592; Placement, Disposing the storage container on the loading/unloading unit; Storage room, It is provided adjacent to the loading/unloading unit, Storing the storage container; Opening and closing device, It is installed in the above storage room. Opening and closing the substrate inlet and outlet of the storage container placed in the mounting portion; Transport device, It passes through the upper side of the above-mentioned opening and closing device, Between the above-mentioned inside and outside, Transfer the storage container; Lifting mechanism, It is a height position of the mounting portion when the opening and closing device performs opening and closing of the storage container, Between the height position at which the storage container is transferred and received by the transport device, Carrying out the elevation of the above mounting portion; And controller, In the state between the storage compartment and the outside, when the lifting mechanism raises the mounting portion to a height position at which the storage container can be transported, Controlling the lifting mechanism and the conveying device, Further, the substrate handling device (3) can be performed between the transfer device and the mounting portion. Its characteristics are: Storage container, It accommodates a plurality of substrates, The substrate entrance and exit is blocked by the cover; Move in and out, The storage container is carried in and out between the inside and outside of the casing; Placement, Disposing the storage container on the loading/unloading unit; Opening and closing device, Opening and closing the substrate inlet and outlet of the storage container -43-200832592 placed on the mounting portion; Safekeeping rack, It is provided in the above-mentioned frame body. Storing the above storage container; Transport device, It is provided in the above-mentioned frame body. Via the above opening and closing device, Between the mounting portion and the storage rack, Transfer the above storage container; And lifting mechanism, This raises the placement portion to a position accessible by the transfer device. (4) The substrate processing apparatus according to (1) above, among them, An opening and closing chamber that surrounds the substrate inlet and outlet and the opening and closing device when the storage container is opened and closed, The opening and closing chamber can be filled with an inert gas inside. (5) The substrate processing apparatus according to (1) above, among them, A substrate state detecting device is provided in the opening and closing chamber. (6) The substrate processing apparatus according to (4) above, among them, have: a gas supply line for supplying an inert gas to the opening and closing chamber, And an exhaust line for exhausting the above-mentioned opening and closing chamber, The gas supply line is provided on a side opposite to a retracting direction when the lid body is detached from the opening and closing device. The exhaust line is provided on the same side as the retracting direction of the opening and closing device when the cover is removed. (7) The substrate processing apparatus according to (6) above, among them, The opening and closing chamber is provided with a grille (bias) between the gas supply line and the substrate entrance and exit. (8) A method of manufacturing a semiconductor device, A method of manufacturing the substrate processing apparatus according to (1) above, Its characteristics are: Carrying the storage container into the loading/unloading unit, a step of placing the storage container on the mounting portion -44 - 200832592; The opening and closing device removes the cover from the substrate inlet and outlet of the storage container placed on the mounting portion; The opening and closing device attaches the cover to the substrate inlet and outlet of the storage container placed on the mounting portion; a height position of the mounting portion when the cover body is detachably mounted, Between the height position at which the storage container receives and receives the storage container, The step of raising the loading portion by the lifting mechanism; The conveying device carries the step of loading the storage container held by the holding mechanism into the storage chamber via the upper side of the opening and closing device; And the step of processing the substrate in the processing chamber. (9) A substrate processing apparatus, Its characteristics are: Storage container, It accommodates a plurality of substrates, The substrate entrance and exit is blocked by the cover; Move in and out, The storage container is carried in and out between the inside and outside of the casing; Placement, Disposing the storage container on the loading/unloading unit; Storage room, It is provided adjacent to the moving and unloading unit, Storing the storage container; Opening and closing device, Opening and closing the substrate inlet and outlet of the storage container placed on the mounting portion; Zoning wall, It is zoned inside and outside the above-mentioned storage room; Opening, It is provided on the above-mentioned partition wall -45-200832592 which is higher than the above-mentioned opening and closing device, Carrying in and carrying out the storage container between the inside and outside of the storage compartment; Transport device, It is installed in the above storage room. Transferring the storage container from the mounting portion via the opening; And lifting mechanism, The loading portion is raised to a position at which the conveying device can access the storage container placed on the mounting portion. (10) The substrate processing apparatus according to (9) above, among them, Providing a second partition wall provided on the mounting portion above the mounting portion, And a second opening disposed in the second partition wall, And a second opening and closing device that opens and closes the second opening. (1 1 ) The substrate processing apparatus according to the above (10), among them, Above the second opening and closing device, When the second opening is closed, the storage container can be placed. (12) The substrate processing apparatus according to (9) above, among them, A second opening and closing device that opens and closes the opening is provided. (13) The substrate processing apparatus according to (1) above, among them, have: Preparation room, It is provided with the cover body in which the opening and closing device detaches the storage container. a substrate transfer device that transports the substrate between the storage container and the substrate holder; Processing room, It is disposed adjacent to the preparation room, Processing the substrate held on the substrate holder; And the storage room, It is disposed adjacent to the preparation room described above, The storage rack and the transport device described above are provided. (1 4) A method of manufacturing a semiconductor device, Its characteristics are: -46- 200832592 Move the storage container into the loading/unloading unit. a step of placing the storage container on the placing portion; The opening and closing device removes the cover from the substrate inlet and outlet of the storage container placed on the mounting portion; The substrate state detecting device detects the state of the substrate arrangement in the storage container; Removing the height of the above-mentioned mounting portion from the mounting body to the height above the opening and closing device, That is, the height of the storage container is transferred between the placement unit and the transfer device. a step of raising the above-mentioned placing portion; The conveying device holds the storage container. And the step of transporting from the loading unit to the storage rack; And the step of processing the substrate in the processing chamber. (1 5 ) a substrate processing device, Its characteristics are: The storage container is configured to accommodate a plurality of substrates. The substrate entrance and exit is blocked by the cover; The loading/unloading unit is configured to carry in and out the storage container between the inside and the outside of the casing; a mounting unit that mounts the storage container on the loading/unloading unit; The opening and closing device is configured to open and close the substrate inlet and outlet of the storage container placed on the mounting portion; The elevating mechanism' is attached to the height position of the opening and closing device to open and close the storage container, Between the height position at which the storage container can be transported over the upper side of the opening and closing device, Carrying out the lifting and lowering of the mounting portion; And -47-200832592 the transport device is disposed between the mounting portion and the height at which the storage container can be transported. The receiving and receiving of the storage container is performed. (1 6 ) a substrate processing device, Its characteristics are: The storage container is configured to accommodate a plurality of substrates. The substrate entrance and exit is blocked by the cover; The loading/unloading unit is configured to carry in and out the storage container between the inside and the outside of the casing; Placement, Disposing the storage container on the loading/unloading unit; The opening and closing device is configured to open and close the substrate inlet and outlet of the storage container placed on the mounting portion; Opening and closing room, It surrounds the above-mentioned opening and closing device; And the elevating mechanism' is attached to the height position of the opening and closing device to open and close the storage container, At least a portion of the storage container placed on the mounting portion is formed at a height position higher than an upper end of the opening and closing chamber. The lifting and lowering of the mounting portion is performed. (17) The substrate processing apparatus according to (16) above, among them, a cover that covers a lower portion of the mounting portion, The cover is raised and lowered in accordance with the operation of the above-described lifting mechanism. (18) The substrate processing apparatus according to (17) above, among them, The cover is disposed on a front side of the mounting portion. (19) The substrate processing apparatus according to (17) above, among them, The cover is provided on the side of the opening and closing device, Set on three sides. (20) a substrate processing device, Its characteristics are: Storage container, It accommodates a plurality of substrates, The substrate entrance and exit will be blocked by the cover body of -48- 200832592; The loading/unloading unit is configured to carry in and out the storage container between the inside and the outside of the casing; a mounting unit that mounts the storage container on the loading/unloading unit; The lifting mechanism' is disposed below the mounting portion, Carrying out the lifting and lowering of the placing portion; And a cover ' is disposed to cover a lower portion of the mounting portion, The lifting is carried out in accordance with the actuation of the lifting mechanism described above. (21) a substrate processing device, Its characteristics are: Storage container, It accommodates a plurality of substrates, The substrate entrance and exit is blocked by the cover; Move in and out, The storage container is carried in and out between the inside and outside of the casing; Placement, Disposing the storage container on the loading/unloading unit; Storage room, It is provided in the above-mentioned frame body. Storing the above storage container; Opening and closing device, Opening and closing the substrate inlet and outlet of the storage container placed on the mounting portion; Transport device, It has a holding mechanism that holds the underside of the storage container. Via the above opening and closing device, Between the above storage room and outside, Transferring the storage container held by the holding mechanism; Lifting mechanism, It is a height position of the mounting portion when the opening and closing device performs opening and closing of the storage container, The elevation of the placement portion is performed between the height position of the storage container and the conveyance device; And -49 - 200832592 controller, It is held on the one side by the above holding mechanism to hold the above-mentioned receiving container. The loading unit is raised by the elevating mechanism to a position where the storage container can be transported to a height position. Controlling the above-described lifting mechanism and the above conveying device, Further, the storage container can be transferred between the transfer device and the mounting portion. (22) A method of manufacturing a semiconductor device, A method of manufacturing the substrate processing apparatus according to the above (16), Its characteristics are: a step of loading the storage container into the loading/unloading port and placing the storage container on the placing portion; a height position of the mounting portion when the cover body is detachably mounted, At least a portion of the storage container placed on the mounting portion is formed at a height position higher than an upper end of the opening and closing chamber. The step of raising or lowering the loading portion by the lifting mechanism; And the step of processing the substrate in the processing chamber. (23) The substrate processing apparatus according to (16) above, among them, With controller, The lifting mechanism is configured to raise the loading portion to a height at which the receiving container can be transported. Controlling the lifting mechanism and the conveying device, Further, the storage container can be transferred between the transfer device and the placing portion. (24) A method of manufacturing a semiconductor device, A method of manufacturing the substrate processing apparatus according to (16) above, Its characteristics are: Carrying the storage container into the loading/unloading unit, a step of placing the storage container on the mounting portion; The step of raising or lowering the loading portion by the lifting mechanism; And -50- 200832592 the step of processing the above substrate in the processing chamber. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially omitted perspective view showing a batch type CVD apparatus according to a first embodiment of the present invention. Figure 2 is a side cross-sectional view. Fig. 3 is a side cross-sectional view showing the main part. Fig. 4 is a longitudinal sectional view showing a reaction furnace. Figure 5 is a side cross-sectional view showing the function of the unpacker, and the side sectional view is omitted. (a) is before the door is removed. (b) is the time when mapping is indicated. Fig. 6 is a partially omitted side sectional view showing the case when the case is carried in. Fig. 7 is a side sectional view showing a batch type CVD apparatus according to a second embodiment of the present invention. Fig. 8 is a side cross-sectional view showing a batch type CVD apparatus according to a third embodiment of the present invention. Fig. 9 is a side cross-sectional view showing a batch type c V D device according to a fourth embodiment of the present invention. Fig. 1 is a side view showing the first example of the method of operation. Fig. 11 is a side view showing a second example of the operation method. Fig. 12 is a side view showing a third example of the operation method. Fig. 13 is a side view showing a third example continued. Figure 14 is a side cross-sectional view showing a preferred embodiment of the unpacker. Fig. 15 is an exploded perspective view thereof. Figure 16 is a perspective view showing a preferred embodiment of the box elevator. -51 - 200832592 Fig. 1 7 is a perspective view showing the state of action. Figure 18 is a perspective view showing a preferred embodiment of the box elevator. Fig. 19 is a perspective view showing the state of action thereof. [Main component symbol description] 1 : Wafer (substrate) 2 z boxes (storage containers) 3 : Wafer access 4 : Door (cover) 5 : Positioning hole 6 : Hat top 10 : Batch CVD device (substrate processing device) 1 1 : Main frame 11a: Front wall (division wall) 1 1 b : Box storage room 12: Box loading and unloading (receiving container loading and unloading) 1 3 : Front shield (opening and closing body) 1 4 : Loading 璋 (receiving container loading and unloading unit) 14A : Box 14B: Ceiling opening 14C : Front opening 1 5 : Box lifter (lifting mechanism of storage container mounting section) 1 6 : Lifting drive 17 : Axis -52- 200832592 1 8 : Holding table (storage container mounting unit) 1 9 : Supporting the motion pin 20: Preload chamber 2 1 : Closed frame (division wall) 2 1 A : Nitrogen supply line 2 1 B : Exhaust line 21A’ : Nitrogen supply unit 2 1 B ’ : Exhaust device 22 : Door entrance (opening) 23 : Unpacking device (opening and closing part of storage container cover) 2 5 : Mobile station 26 : Closer 27 : Mapping device (substrate status detection unit) 28 : Linear actuator 29 : Fixture 3 〇 : Detection element 3 1 : Rotary frame (storage rack) 3 2 : Pillar 3 3 : Shelf 3 4 : Supporting motion pin 3 5 : Box conveying device (storage container conveying unit) 3 5a : Box lift (storage container lifting mechanism) 3 5b : Box conveying mechanism (storage container conveying mechanism) 40 : Sub-frame -53- 200832592 40a: Front wall (division wall) 41: Wafer loading and unloading 42 : Unpacking device (opening and closing part of storage container cover) 43 : Mounting table 44: Take off the mechanism 45 : Preparation room 46 : Wafer transfer mechanism 46a: Wafer transfer device 46b: Wafer Transfer Device Lift 4 6 c : Photograph 47: Loading boat (substrate holder) 48 : Truck lift 49 : Arm 5 〇 : Plus cover 5 1 : Treatment furnace 5 2 : Heater 53 : Heater base 5 4 : Process tube 5 5 : Outer tube 5 6 : Inner tube 5 7 : Processing room 5 8 : Cylindrical space 5 9 : 岐管6 0 : Nozzle -54- 200832592 6 1 : Gas supply pipe
62 ： MFC 63 :氣體供給源 64 :氣體流量控制部 65 :排氣管 66 :壓力感側器 67 :壓力調整裝置 68 :真空排氣裝置 6 9 :壓力控制部 70 :旋轉機構 71 :旋轉軸 72 :驅動控制部 73 :隔熱板 74 :温度感側器 75 :温度控制部 76 :主控制部 77 :控制器 3 1 A :保管架 3 3 A :架板 80 :預載室、 8 1 :密閉框體 81a :背面壁 82 :門出入口 8 3 :開箱器 -55 200832592 84 :測繪裝置 8 5 :移動台 8 6 :閉合器、 9 1 :晶圓搬入搬出口 92 :門機構 1〇〇 :抓取式箱搬送裝置 1 〇 1 :箱升降機 102 :箱搬送機構 1 〇 3 :夾持部 1 〇 5 :箱平台機構 1 〇 6 :開口部 107 :滑板 110 :頂棚走行型構内搬送裝置（OHT) 200 :抓取式箱搬送裝置 201 :箱升降機 202 :箱搬送機構 2 0 3 :夾持部 204 :基準高度 3 0 0 :罩蓋 3 0 1 :頂板、 3 02 :前板 3 03 :逃逸孔 3 04 :側板 -56-62 : MFC 63 : gas supply source 64 : gas flow rate control unit 65 : exhaust pipe 66 : pressure sensor side 67 : pressure adjusting device 68 : vacuum exhaust device 6 9 : pressure control unit 70 : rotating mechanism 71 : rotating shaft 72: drive control unit 73: heat shield 74: temperature sensor side 75: temperature control unit 76: main control unit 77: controller 3 1 A: storage rack 3 3 A: shelf 80: preload chamber, 8 1 : Sealing frame 81a: Back wall 82: Door opening and closing port 8 3 : Unpacking device - 55 200832592 84 : Mapping device 8 5 : Mobile station 8 6 : Closer, 9 1 : Wafer loading and unloading port 92 : Door mechanism 1〇 〇: Grab-type box conveying device 1 〇1: Box elevator 102: Box conveying mechanism 1 〇3: Clamping unit 1 〇5: Box platform mechanism 1 〇6: Opening portion 107: Skateboard 110: Ceiling traveling type internal conveying device (OHT) 200 : Grab-type box conveying device 201 : Box elevator 202 : Box conveying mechanism 2 0 3 : Clamping portion 204 : Reference height 3 0 0 : Cover 3 0 1 : Top plate, 3 02 : Front plate 3 03 : escape hole 3 04 : side panel -56-