200830649 九、發明說明： 【發明所屬之技術領域】 本發明係關於在ic封裝等電子零件上所設的設置有電極 之連接裝置’尤其係關於適於由含鍚合金所形成之電極反 •覆地接觸之連接裝置。 . 【先前技術】 在以下專利文獻1中’揭示有具備複數個螺旋狀之彈性 臂之連接裝置。於1C封裝等電子零件之底面上，設有複數 • 個球狀之突出電極，各突出電極壓製於彈性臂上，並且突 出電極與彈性臂以一對一之關係分別連接。 專利文獻1中所記載之螺旋狀之彈性臂呈向電子零件突 出之立體形狀，在將電子零件設置於連接裝置上時，彈性 臂被突出電極按壓而受損變形，並且彈性臂在此時之彈性 回復力之作用壓製於上述突出電極上。 [專利文獻1]日本專利特開2004-234872號公報 【發明内容】 垂 [發明所欲解決之問題] 專利文獻1中記載之螺旋狀之彈性臂係由銅等導電性材 ^ 料所形成。進而，為了降低該彈性臂與突出電極之接觸阻 力’一般亦採用以鍍敷等方式在彈性臂之最表面上形成金 層。 然而’形成於彈性臂之表面上的金層因難以氧化，故其 表面能量維持於較高狀態。因此，若由含錫合金而形成之 上述突出電極壓接於彈性臂上，則金會擴散至突出電極 123323.doc 200830649 内’由此易生成金與錫之金屬間化合物。尤其在突出電極 接觸到彈性臂之狀態下，若周圍溫度達到loot：以上或 150°C以上，則會促進金屬間化合物之生成。例如，在含 錫之焊料與接觸元件相接觸之狀態下，若在15(rc之環境 ' 中經過300個小時，則上述金屬間化合物之厚度會達到5〇 • μπι左右。 □此例如，若將具有上述彈性臂之連接裝置用於Ic等 翁 電子令件之私查用裝置，並且反覆地安裝設有含錫的突出 1極之電子零件，進而對各個電子零件進行加熱檢查，則 在彈丨生#之表面上易堆積上述金屬間化合物以及與該化合 物相關之錫合金。當該金屬間化合物以及錫合金氧化時， 彈卜#之表面之電阻會增大，因而作為接觸元件之功能將 大幅度下降。 又由於錫與金之金屬間化合物較硬，故堆積於彈性臂 上之金屬間化合物易對突出電極造成損傷。 • 本發明係為了解決上述先前之問題研製而成者，其目的 在於提供一種連接裝置，即使含錫電極反覆地接觸，亦不 έ在接觸元件上堆積金屬間化合物，且可使接觸元件表面 . 之接觸電阻亦較低。 . • [解決問題之技術手段] 本發明係一種連接裝置，其係於底部設置有具有複數個 電極之電子零件者，其特徵在於：設有複數個連接部，該 複數個連接部連接由含锡合金所形成之上述電極，且於各 ' ° 又置有具有彈力且被上述電極壓接之導電性彈 123323.doc 200830649 性臂，上述彈性臂具有導電性之芯部與被覆層，該被覆層 覆蓋於上述芯部之表面，使得上述彈性臂與上述電極之接 觸電阻降低’上述被覆層藉由鉑族金屬層所形成。 在本發明中，由於設置於彈性臂表面上之被覆層係鉑族 金屬層，故與電極之接觸電阻小。並且，在含錫合金所形 成之電極接觸到彈性臂時，鉑族金屬層難以向電極内擴 散，因而在彈性臂表面與電極之間難以形成金屬間化合 物0 本發明之上述鉑族金屬層之膜厚為〇1 μιη以上、2 以 下。更好的是〇·5 μπι以下。若鉑族金屬層之膜厚在上述範 圍内則鉑無金屬層可充分發揮使與電極之接觸電阻降低 之功能。 本么月亦可在上述鉑族金屬層之表面上形成厚度為〇〇6 μπι以下之金層。 於彈性臂之最表面上形成金層，藉此可使與電極之接觸 電阻更小。X，若金層之膜厚在上述範圍Μ，則雖然金向 :極内擴散，但因擴散而形成之錫與金之金屬間化合物之 Η甚微，故不會產生先前堆積較多之情形。 本發明中，上述芯部係由銅或銅合金與鎳或鎳合金之至 少一者而形成。 又’本發㈣於上述連接部上反覆進行具有上述電極之 上述電子零件的安裝與脫離之檢查中有效。此時，有效的 是’於安裝有上述電子零件之狀態下溫度升高，以進行電 子零件之内部電路之檢查。 123323.doc 200830649 在將本發明之連接裝置用於檢查時，即使含錫合金所形 成之電極反覆地接觸到彈性臂，亦可防止金屬間化合物堆 積於彈性臂上。 本發明較佳係上述鉑族金屬層係鈀鍍敷層，藉此可實現 無電解鍍敷層。使用鈀時，可在彈性臂之表面上有效地形 成薄的被覆層。 [發明之效果] 本發明之連接裝置在與電極之接觸電阻小、且含錫合金 所形成之電極反覆地接觸時，在彈性臂之表面與電極之間 難以堆積金屬間化合物。因此可延長連接部之壽命。 【實施方式】 圖1係本發明實施形態之連接裝置之部分剖面圖，圖2係 連接部之放大剖面圖，圖3係連接部之平面圖，圖4係表示 連接部之彈性臂與突出電極之接觸狀態的剖面放大圖。 圖1所示之連接裝置1具有基台10。基台之平面形狀為 四方形，於基台10之4邊上分別形成有大致垂直豎起之侧 壁部10a。由4邊之侧壁部i〇a所包圍之區域為凹部，其底 4 10b之上表面為支持面12。於上述支持面12上，設置有 連接片15。連接片15在可撓性之基材片μ之表面上設有複 數個連接部20。 如圖2所示，於上述基材片16上，形成有複數個通孔 (through hole) 16a，於各通孔16a之内周面上以鐘敷等手段 而形成有導電層17。於基材片16之表面上，形成有與上述 導電層17導通之表側的連接焊盤17a，於基材片16之背面 123323.doc 200830649 上，形成有與上述導電層17導通之背侧的連接焊盤⑺。 上述連接部20係對薄導電性金屬板進行衝壓而形成且經 鐘敷處理者，各個連接部20藉由導電性黏接劑等而接人: 上述連接焊盤17a之表面。或者，連接部2〇使用銅或=等 導電性材料於鍍敷製程中形成。例如， 之另外的薄片之表面上，於鑛敷製程中形成有複二 = 部20,且使上述薄片與基材片16重合，並將各個連接㈣ 以導電性黏接劑等而接合於上述連接焊盤。 ® 各連接部20在設置於基材片16上之後，被施加外力而形 成為立體形狀。此時，利用加熱處理而去除内部之殘留應 力後，連接部20可於立體形狀時發揮彈力。 如圖2所示，在基材片16之背面側，形成有個別連接於 上述連接焊盤17b之導電性材料之凸塊電極18。如圖1所 示，若將連接片丨5設置於基台10之底部1〇b之表面即支持 面12上，則上述凸塊電極18連接於在上述支持面12上所設 _ 之導電部。 上述支持面12上之連接部20之排列間距例如為2瓜瓜以 下或者i 以下。連接部20之外形尺寸之最大值亦為2 mm以下或者1 mm以下。 如圖2及圖3所示’連接部20係由支持部以與彈性臂22一 體地連續而形成。彈性臂22形成為螺旋形狀，彈性臂22之 捲旋起始端即基部22a與支轉部21—體化。彈性臂以之捲 旋結束端即前端部22b位於螺旋之中心部。如圖2所示，構 成連接部20之支持部21連接於上述連接焊盤17&，彈性臂 123323.doc -10- 200830649 22之鈾端部22b以離開支持面12之方式而立體成形。 如圖4之剖面圖所示，彈性臂22具有芯部3〇及覆蓋該芯 部30之表面全周之被覆層33。芯部3〇之導電層31之周圍全 周係由彈性層32所覆蓋者。導電層31係銅或含銅合金之單 層。銅合金較佳係使用具有高導電性與高機械強度之cu、 • Si、Νι之科森（Corson)合金。科森合金例如係cu-Ni_si-Mg，其中使用Cu為96·2質量％、州為3 〇質量％、以為〇·65 質量％、Mg為0·15質量％。 ® 彈性層32係具有導電性且發揮高機械強度及高彎曲彈性 係數之金屬材料，且係Ni層或含Ni之合金層。犯合金使用 Ni-X合金（其中，X係P、w、Mn、Ti、仏中之任一種以 上）。彈性層32藉由電解鍍敷，或無電解鍍敷而形成於導電 層31之周圍。彈性層32較佳係以無電解鍍敷法而形成之 Ni-P合金。在Ni_P合金中，使磷（p)之濃度為1〇 at%以上、 30 at%以下，藉此，至少一部分會成為非晶f，由此可獲 _ #高彈性係數及高拉伸強度。或者，彈性層32由Ni-W合金 所形成。此時，使鎢（W)之濃度為10 at%以上、3〇以 下藉此，至少一部分會成為非晶質，由此可獲得高彈性 • 係數及高拉伸強度。 ‘ 圖4中，上述彈性層32之剖面積較、佳係芯部30之剖面積 之20%以上、80〇/〇以下。若為上述範圍，則芯部⑽可發揮 導電性與彈性該雙方之功能。又，於圖4之剖面圖中，+、々 部30之厚度尺寸及寬度尺寸均為i㈣以上、1〇〇叫以下二 被覆層33係使與電子零件之突出電極之接觸電阻降低 123323.doc •11· 200830649 者，其藉由電阻率低於構成芯部3〇之導電性材料之全屬材 料而形成。於本實施形態中，被覆層33係鉑族金屬声。亦 即，被覆層33細⑻、Pt (銘)、Ir (銥”如⑻、灿 覆層33時， 被覆層3 3， (錄）、0以鐵）中之任-者。在由該等翻族金屬層而形成被 本地形成薄的被覆層33。 可於電解鑛敷製程中成膜。然而，若由Pd形成 則可以無電解鑛敷法㈣成，故可高效率低成200830649 IX. Description of the Invention: [Technical Field] The present invention relates to an electrode-providing connecting device provided on an electronic component such as an ic package, particularly for an electrode which is suitable for being formed of a bismuth-containing alloy. Ground contact connection device. [Prior Art] In the following Patent Document 1, a connecting device having a plurality of helical elastic arms is disclosed. On the bottom surface of the electronic component such as the 1C package, a plurality of spherical protruding electrodes are provided, each protruding electrode is pressed on the elastic arm, and the protruding electrode and the elastic arm are respectively connected in a one-to-one relationship. The spiral elastic arm described in Patent Document 1 has a three-dimensional shape that protrudes toward an electronic component. When the electronic component is placed on the connecting device, the elastic arm is pressed and deformed by the protruding electrode, and the elastic arm is at this time. The effect of the elastic restoring force is pressed on the above protruding electrodes. [Problem to be Solved by the Invention] The spiral elastic arm described in Patent Document 1 is formed of a conductive material such as copper. Further, in order to reduce the contact resistance between the elastic arm and the protruding electrode, a gold layer is generally formed on the outermost surface of the elastic arm by plating or the like. However, the gold layer formed on the surface of the elastic arm is difficult to oxidize, so its surface energy is maintained at a high level. Therefore, if the protruding electrode formed of the tin-containing alloy is pressed against the elastic arm, the gold will diffuse into the protruding electrode 123323.doc 200830649, thereby easily forming an intermetallic compound of gold and tin. In particular, in the state where the protruding electrode is in contact with the elastic arm, if the ambient temperature reaches a loot: or more or 150 ° C or more, the formation of an intermetallic compound is promoted. For example, in the state where the tin-containing solder is in contact with the contact member, the thickness of the intermetallic compound may reach about 5 〇 • μπι in 300 (the environment of rc). □ For example, if A connecting device having the above-mentioned elastic arm is used for a private inspection device of an Ic et al., and an electronic component having a tin-containing protruding pole is repeatedly mounted, and then each electronic component is subjected to a heating inspection, and then the bomb is fired. The above-mentioned intermetallic compound and the tin alloy associated with the compound are easily deposited on the surface of the twins. When the intermetallic compound and the tin alloy are oxidized, the surface resistance of the bomb is increased, and thus the function as a contact element will be Since the intermetallic compound of tin and gold is hard, the intermetallic compound deposited on the elastic arm is liable to damage the protruding electrode. The present invention has been developed to solve the above problems. It is to provide a connecting device that does not deposit an intermetallic compound on the contact member even if the tin-containing electrode is repeatedly contacted, and can make the contact element The contact resistance of the surface is also low. [Technical means for solving the problem] The present invention is a connecting device which is provided with an electronic component having a plurality of electrodes at the bottom, and is characterized in that a plurality of connecting portions are provided The plurality of connecting portions are connected to the electrode formed of a tin-containing alloy, and each of the '° is provided with a conductive elastic ball 123323.doc 200830649 elastic arm which is elastically pressed by the electrode, and the elastic arm has conductivity a core portion and a coating layer covering the surface of the core portion such that contact resistance between the elastic arm and the electrode is lowered. The coating layer is formed of a platinum group metal layer. In the present invention, The coating layer on the surface of the elastic arm is a platinum group metal layer, so the contact resistance with the electrode is small. Moreover, when the electrode formed of the tin-containing alloy contacts the elastic arm, the platinum group metal layer is difficult to diffuse into the electrode, and thus is elastic. It is difficult to form an intermetallic compound between the arm surface and the electrode. The film thickness of the platinum group metal layer of the present invention is 〇1 μm or more and 2 or less. More preferably, 5 μπι or less. When the film thickness of the platinum group metal layer is within the above range, the platinum metal-free layer can sufficiently exhibit a function of lowering the contact resistance with the electrode. This month, a thickness can also be formed on the surface of the platinum group metal layer. It is a gold layer of μ6 μπι or less. A gold layer is formed on the outermost surface of the elastic arm, thereby making the contact resistance with the electrode smaller. X, if the film thickness of the gold layer is within the above range, although the gold direction : In-pole diffusion, but the intermetallic compound of tin and gold formed by diffusion is very small, so there is no case where the previous accumulation is large. In the present invention, the core is made of copper or copper alloy and nickel or Further, at least one of the nickel alloys is formed. Further, the present invention is effective in the inspection of mounting and detaching the electronic component having the electrode on the connecting portion. In this case, it is effective to install the electronic component. The temperature rises in the state to check the internal circuit of the electronic component. 123323.doc 200830649 When the connecting device of the present invention is used for inspection, even if the electrode formed of the tin-containing alloy repeatedly contacts the elastic arm, the intermetallic compound can be prevented from being accumulated on the elastic arm. The present invention is preferably a platinum group metal layer-based palladium plating layer, whereby an electroless plating layer can be realized. When palladium is used, a thin coating layer can be effectively formed on the surface of the elastic arm. [Effects of the Invention] When the contact device of the present invention has a small contact resistance with an electrode and the electrode formed of the tin-containing alloy is in contact with each other, it is difficult to deposit an intermetallic compound between the surface of the elastic arm and the electrode. Therefore, the life of the connecting portion can be extended. 1 is a partial cross-sectional view of a connecting device according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of the connecting portion, FIG. 3 is a plan view of the connecting portion, and FIG. 4 is a view showing a resilient arm and a protruding electrode of the connecting portion. An enlarged view of the section of the contact state. The connecting device 1 shown in Fig. 1 has a base 10. The plane shape of the base is square, and the side wall portions 10a which are substantially vertically erected are formed on the four sides of the base 10, respectively. The area surrounded by the side wall portion i〇a of the four sides is a concave portion, and the upper surface of the bottom portion 4 10b is the support surface 12. On the support surface 12, a connecting piece 15 is provided. The connecting piece 15 is provided with a plurality of connecting portions 20 on the surface of the flexible substrate sheet μ. As shown in Fig. 2, a plurality of through holes 16a are formed in the base material sheet 16, and a conductive layer 17 is formed on the inner peripheral surface of each of the through holes 16a by means of a bell or the like. On the surface of the substrate sheet 16, a connection pad 17a on the front side which is electrically connected to the conductive layer 17 is formed, and on the back surface 123323.doc 200830649 of the substrate sheet 16, a back side which is electrically connected to the conductive layer 17 is formed. Connection pad (7). The connecting portion 20 is formed by pressing a thin conductive metal plate and is subjected to a clocking treatment. Each of the connecting portions 20 is connected to the surface of the connecting pad 17a by a conductive adhesive or the like. Alternatively, the connecting portion 2 is formed using a conductive material such as copper or = in the plating process. For example, on the surface of the other sheet, a double portion 20 is formed in the ore-laying process, and the sheet is overlapped with the substrate sheet 16, and each of the joints (4) is bonded to the above by a conductive adhesive or the like. Connect the pads. ® After each of the connecting portions 20 is placed on the base material sheet 16, an external force is applied to form a three-dimensional shape. At this time, after the internal residual stress is removed by the heat treatment, the connecting portion 20 can exert an elastic force in a three-dimensional shape. As shown in Fig. 2, on the back side of the base material sheet 16, bump electrodes 18 each having a conductive material connected to the connection pads 17b are formed. As shown in FIG. 1, when the connecting tab 5 is disposed on the surface of the bottom portion 1b of the base 10, that is, the supporting surface 12, the bump electrode 18 is connected to the conductive portion provided on the supporting surface 12. . The arrangement pitch of the connecting portions 20 on the support surface 12 is, for example, 2 or less. The maximum size of the outer shape of the connecting portion 20 is also 2 mm or less or 1 mm or less. As shown in Figs. 2 and 3, the connecting portion 20 is formed by the support portion so as to be continuous with the elastic arm 22. The elastic arm 22 is formed in a spiral shape, and the base end portion 22a of the elastic arm 22 is integrally formed with the branch portion 21. The elastic arm is wound at the end, that is, the front end portion 22b is located at the center of the spiral. As shown in Fig. 2, the support portion 21 constituting the connecting portion 20 is connected to the above-described connection pad 17& and the uranium end portion 22b of the elastic arm 123323.doc -10- 200830649 22 is formed in a three-dimensional manner away from the support surface 12. As shown in the cross-sectional view of Fig. 4, the elastic arm 22 has a core portion 3A and a coating layer 33 covering the entire circumference of the surface of the core portion 30. The periphery of the conductive layer 31 of the core 3 is covered by the elastic layer 32. The conductive layer 31 is a single layer of copper or a copper-containing alloy. The copper alloy is preferably a Corson alloy having high conductivity and high mechanical strength of cu, • Si, and Νι. The Corson alloy is, for example, cu-Ni_si-Mg, wherein Cu is 96.2% by mass, the state is 3 〇% by mass, 〇·65 mass%, and Mg is 0.15% by mass. ® The elastic layer 32 is a metal material which is electrically conductive and exhibits high mechanical strength and high bending elastic modulus, and is a Ni layer or an alloy layer containing Ni. The alloy is Ni-X alloy (wherein X is one of P, w, Mn, Ti, or yttrium). The elastic layer 32 is formed around the conductive layer 31 by electrolytic plating or electroless plating. The elastic layer 32 is preferably a Ni-P alloy formed by electroless plating. In the Ni_P alloy, the concentration of phosphorus (p) is 1 〇 at% or more and 30 at% or less, whereby at least a part becomes amorphous f, whereby a high elastic modulus and a high tensile strength can be obtained. Alternatively, the elastic layer 32 is formed of a Ni-W alloy. In this case, the concentration of tungsten (W) is 10 at% or more and 3 Å or less, whereby at least a part thereof becomes amorphous, whereby a high elasticity coefficient and a high tensile strength can be obtained. In Fig. 4, the cross-sectional area of the elastic layer 32 is 20% or more and 80 Å/〇 or less of the sectional area of the preferred core portion 30. When it is in the above range, the core portion (10) functions as both of conductivity and elasticity. Further, in the cross-sectional view of Fig. 4, the thickness dimension and the width dimension of the + and the dam portion 30 are both i (four) or more, and the first two coating layers 33 are used to reduce the contact resistance with the protruding electrode of the electronic component. 123323.doc • 11·200830649, which is formed by a material having a lower specific resistance than a conductive material constituting the core 3〇. In the present embodiment, the coating layer 33 is a platinum group metal sound. That is, when the coating layer 33 is fine (8), Pt (Ming), Ir (铱) such as (8), and the cover layer 33, the coating layer 3 3, (recorded), 0 is iron, etc. The metal layer is turned over to form a thin coating layer 33 formed locally. The film can be formed in the electrolytic ore coating process. However, if it is formed of Pd, it can be formed by electroless ore method (4), so that it can be efficiently and efficiently formed.
-上賴覆層33形成為覆蓋芯部3〇之全周。圖5係將圖惰 示之彈性臂22之剖面進一步放大而成者。上述被覆層％之 膜厚tl為0.1㈣以上、2 μιη以下，較佳係〇 $㈣以下。若 為該範圍，則可降低與電子零件之突'出電極之接觸電阻， 且可低成本地構成。亦即，被覆層33係用以使表面之接觸 電阻降低者，相對於彈性臂之膜厚而言，被覆層33之膜厚 為1/1®以下’進而為l/loo以下。 如圖2所示，在連接裝置1上設置有電子零件40。電子零 件40係1C封裝等，IC裸晶等各種電子元件密封於本體部41 内。於本體部41之底面41a上’設有複數個突出電極42, 各個突出電極42與本體部41内之電路導通。本實施形態之 電子零件40之上述突出電極42為球形。又，突出電極“亦 可為圓錐台形等。 上述突出電極42係由含錫之導電性合金所形成。亦即， 由不含鉛之焊料所形成，且係錫鉍合金或錫銀合金。 實施形態之連接裝置1係電子零件40檢查用之連接裝 置’如圖1所示，作為被檢查物之電子零件40安裝於基台 123323.doc •12- 200830649 ίο之凹部内。此時，電子零件40被定位成，將其底面4ia 上所設之各個突出電極42設置於上述連接部20之上。於基 台10上設有未圖示之按壓用蓋體，當該蓋體覆蓋於基台1〇 上時，電子零件40受到該蓋體向箭頭ρ方向之按壓。於該 按壓力之作用下，各個突出電極42按壓在彈性臂22上，立 體形狀之彈性臂22被壓壞，使得突出電極42與彈性臂22個 別導通。 將連接裝置1用於所謂預燒（bum in)檢查時，在將周圍溫 度設定為150°C左右之狀態下，從外部檢查用之電路經過 連接部20向突出電極42供給電流，以檢查電子零件之本 體部4 1内之電路是否斷線。或者，從連接部2〇向突出電極 42供給特定之信號，以進行本體部41内之電路之動作測 試。 已檢查結束之電子零件40從連接裝置1上取下，其次， 將應檢查之電子零件40設置於連接裝置i内，並以同樣之 方法進行檢查，再重複該檢查。因此，於連接部2〇之彈性 臂22上’會逐個接觸到新的電子零件40之突出電極42。 如圖4所示，彈性臂22在由導電性金屬所形成之芯部儿 之表面上形成有被覆層33，該被覆層33係以pt為代表之鉑 族金屬層。在將含錫之突出電極42壓接於由鉑族金屬層所 形成之被覆層33時，鉑族金屬難以向突出電極42内擴散， 故在被覆層33與突出電極42之接觸部難以生成鉑族金屬與 錫之金屬間化合物。 彈性臂22之表面之金屬是否向突出電極42内擴散而生成 123323.doc -13- 200830649 金屬間化合物，主要依存於以下2個條件： 们條件為，覆盍彈性臂22之金屬之表面能量。當彈性 臂22之表面為金層時，由於金難以氧化，故表面能量高， 因此，右含錫之突出電極42接觸到金層，則因上述表面能 量而使金與錫易結合，其結果使得金向突出電極42内擴 散。與此相對，以Pd為代表之鉑族金屬由於在表面形成極 薄之氧化膜，因此表面能量穩定，pd等難以向突出電極42 内擴散。並且，氧化膜極薄，因隨道效應而不會妨礙電流 之通過，故亦不會導致彈性臂22之表面電阻降低。 另一個條件為，舞性臂22之表面硬度。彈性臂22與突出 電極‘42接觸時的金屬間化合物之生成係金屬之熱擴散，與 溫度及兩構件之接觸面積雙方成比例。若彈性臂22之表面 為金層，則由於表面硬度低，故與突出電極42之接觸面積 變大，易產生金屬之勢擴散，且易生成並堆積錫與金之金 屬間化合物。與此相對，銘族金屬層之硬度高，例如pd之 維氏硬度為440〜550 Hv左右，Ru之維氏硬度為650〜700 Hv 左右。與作為含金之合金的AuCo (160 Ην左右）、AuNi (170〜300 Hv左右）、Auln (210 Hv左右）相比，上述維氏硬 度足夠高。因此，當彈性臂22之表面上的被覆層33為鉑族 金屬層時，由於表面硬度高，故按壓突出電極42時之接觸 面積不會變大，因而鉑族金屬難以向突出電極42内擴散， 在彈性臂與突出電極之間難以生成金屬間化合物。 當被覆層33為鉑族金屬層時，與金層不同，難以生成金 屬間化合物。因此，可將彈性臂22之表面之接觸電阻始終 123323.doc -14 - 200830649 保持較低，故對突出電極42造成之損傷亦變小。又，亦難 以產生因金屬間化合物而對突出電極42造成損傷之現象。 圖6表示上述連接裝置之變形例。圖6係放大表示變形例 之彈性臂22A的剖面之一部分。該彈性臂22A之作為芯部 的彈性層32之表面之被覆層34為2層結構。於彈性臂22八之 表面上，以與圖5所示之相同厚度tl而形成有Pd等鉑族金 屬層34a進而，於該表面上形成有金層34b。金層34b較 鉑族金屬層34a之膜厚充分薄，其厚度丨2為〇 〇6 μιη以下。 具有該厚度t2之金層3仆非常薄，且在其下方形成有硬 度兩的鉑族金屬層34a，故與突出電極42之接觸面積變 小，因而難以生成錫與金之金屬間化合物。又，由於金層 34b非常薄，故即使生成金屬間化合物，其量亦非常少， 所以因金屬間化合物而對突出電極42造成之損傷亦較少。 圖7係表示本發明之第2實施形態者，其係彈性臂22b之 放大面圖。5亥彈性臂22B之芯部僅由Ni或Ni合金所形 成，例如由Ni-P之非晶質合金所形成。而且，於其外周面 上形成有圖5所示之被覆層33或圖6所示之被覆層34。該彈 性臂22B係以Ni或Ni合金為主體而構成，故整體之剛性與 %曲彈性係數較南，並且表面之接觸電阻亦變低。 【圖式簡單說明】 圖1係本發明之實施形態的連接裝置之部分剖面圖。 圖2係上述連接裝置之連接部之部分放大剖面圖。 圖3係將連接部之平面放大後的放大平面圖。 圖4係表示彈性臂與突出電極之接觸部的放大剖面圖。 123323.doc -15· 200830649 圖5係表示彈性臂之被覆層的放大剖面圖。 圖6係表示彈性臂之被覆層之變形例的放大剖面圖。 圖7係表示本發明第2實施形態之被覆層之放大剖面圖。 【主要元件符號說明】The upper cladding layer 33 is formed to cover the entire circumference of the core portion 3〇. Fig. 5 is a view in which the cross section of the elastic arm 22 which is shown in the figure is further enlarged. The film thickness t1 of the coating layer % is 0.1 (four) or more and 2 μm or less, and preferably 〇 $ (four) or less. If it is in this range, the contact resistance with the electrode of the electronic component can be reduced, and it can be constructed at low cost. That is, the coating layer 33 is used to lower the contact resistance of the surface, and the film thickness of the coating layer 33 is 1/1 or less and further less than 1/loo with respect to the film thickness of the elastic arm. As shown in FIG. 2, an electronic component 40 is provided on the connection device 1. The electronic component 40 is a 1C package or the like, and various electronic components such as an IC bare crystal are sealed in the main body portion 41. A plurality of protruding electrodes 42 are provided on the bottom surface 41a of the main body portion 41, and each of the protruding electrodes 42 is electrically connected to a circuit in the main body portion 41. The protruding electrode 42 of the electronic component 40 of the present embodiment has a spherical shape. Further, the protruding electrode "may be a truncated cone shape or the like. The protruding electrode 42 is formed of a conductive alloy containing tin, that is, a solder containing no lead, and is a tin-bismuth alloy or a tin-silver alloy. The connection device 1 of the form is a connection device for inspection of the electronic component 40. As shown in Fig. 1, the electronic component 40 as the inspection object is mounted in the recess of the base 123323.doc • 12-200830649 ί. At this time, the electronic component 40 is positioned such that each of the protruding electrodes 42 provided on the bottom surface 4ia is provided on the connecting portion 20. The base 10 is provided with a pressing cover (not shown), and the cover is covered on the base. When the upper surface is mounted, the electronic component 40 is pressed by the cover body in the direction of the arrow ρ. Under the action of the pressing force, the respective protruding electrodes 42 are pressed against the elastic arm 22, and the three-dimensional elastic arm 22 is crushed to make the protrusion The electrode 42 is electrically connected to the elastic arm 22. When the connection device 1 is used for a so-called bum in inspection, the external inspection circuit is passed through the connection portion 20 while the ambient temperature is set to about 150 °C. The protruding electrode 42 is supplied with electricity To check whether the circuit in the main body portion 41 of the electronic component is broken, or to supply a specific signal from the connecting portion 2 to the protruding electrode 42 to perform an operation test of the circuit in the main body portion 41. The component 40 is removed from the connecting device 1. Next, the electronic component 40 to be inspected is placed in the connecting device i, and the inspection is performed in the same manner, and the inspection is repeated. Therefore, the elastic arm 22 at the connecting portion 2 The upper part will contact the protruding electrode 42 of the new electronic component 40 one by one. As shown in FIG. 4, the elastic arm 22 is formed with a coating layer 33 on the surface of the core formed of the conductive metal, and the covering layer 33 is A platinum group metal layer represented by pt. When the tin-containing protruding electrode 42 is pressure-bonded to the coating layer 33 formed of the platinum group metal layer, the platinum group metal is hard to diffuse into the protruding electrode 42, so that the coating layer 33 is present. It is difficult to form an intermetallic compound of a platinum group metal and tin at a contact portion with the protruding electrode 42. Whether or not the metal of the surface of the elastic arm 22 diffuses into the protruding electrode 42 generates 123323.doc -13- 200830649 intermetallic compound, mainly The following two conditions: The condition is that the surface energy of the metal of the elastic arm 22 is covered. When the surface of the elastic arm 22 is a gold layer, since the gold is difficult to oxidize, the surface energy is high, and therefore, the protruding electrode of the right tin is contained. When 42 is in contact with the gold layer, gold and tin are easily bonded due to the surface energy, and as a result, gold is diffused into the protruding electrode 42. In contrast, the platinum group metal represented by Pd forms extremely thin oxidation on the surface. The film is so stable that the surface energy is stable, and it is difficult for pd or the like to diffuse into the protruding electrode 42. Further, since the oxide film is extremely thin, the passage of the current does not hinder the passage of the current, so that the surface resistance of the elastic arm 22 is not lowered. Another condition is the surface hardness of the dancing arm 22. The thermal diffusion of the metal of the intermetallic compound when the elastic arm 22 is in contact with the protruding electrode '42 is proportional to the temperature and the contact area between the two members. If the surface of the elastic arm 22 is a gold layer, since the surface hardness is low, the contact area with the protruding electrode 42 becomes large, the metal potential is easily diffused, and an intermetallic compound of tin and gold is easily formed and deposited. On the other hand, the hardness of the metal layer of the Ming family is high, for example, the Vickers hardness of pd is about 440 to 550 Hv, and the Vickers hardness of Ru is about 650 to 700 Hv. The Vickers hardness is sufficiently high as compared with AuCo (about 160 Ην), AuNi (about 170 to 300 Hv), and Auln (about 210 Hv) which are alloys containing gold. Therefore, when the coating layer 33 on the surface of the elastic arm 22 is a platinum group metal layer, since the surface hardness is high, the contact area when the protruding electrode 42 is pressed does not become large, and thus the platinum group metal is difficult to diffuse into the protruding electrode 42. It is difficult to form an intermetallic compound between the elastic arm and the protruding electrode. When the coating layer 33 is a platinum group metal layer, unlike the gold layer, it is difficult to form an intermetallic compound. Therefore, the contact resistance of the surface of the elastic arm 22 can be kept low at all times 123323.doc -14 - 200830649, so that the damage to the protruding electrode 42 is also small. Further, it is also difficult to cause damage to the protruding electrode 42 due to the intermetallic compound. Fig. 6 shows a modification of the above connecting device. Fig. 6 is an enlarged view showing a part of a cross section of the elastic arm 22A of the modification. The coating layer 34 on the surface of the elastic layer 32 as the core portion of the elastic arm 22A has a two-layer structure. On the surface of the elastic arm 22, a platinum group metal layer 34a such as Pd is formed at the same thickness t1 as that shown in Fig. 5, and a gold layer 34b is formed on the surface. The gold layer 34b is sufficiently thinner than the platinum group metal layer 34a, and has a thickness 丨2 of 〇6 μmη or less. The gold layer 3 having the thickness t2 is very thin, and the platinum group metal layer 34a having two hardnesses is formed under the second layer, so that the contact area with the protruding electrode 42 is small, so that it is difficult to form an intermetallic compound of tin and gold. Further, since the gold layer 34b is very thin, even if an intermetallic compound is formed, the amount thereof is extremely small, so that the damage to the protruding electrode 42 due to the intermetallic compound is also small. Fig. 7 is a perspective view showing a second embodiment of the present invention, which is an elastic arm 22b. The core of the 5H elastic arm 22B is formed only of Ni or a Ni alloy, for example, an amorphous alloy of Ni-P. Further, a coating layer 33 shown in Fig. 5 or a coating layer 34 shown in Fig. 6 is formed on the outer peripheral surface thereof. Since the elastic arm 22B is mainly composed of Ni or a Ni alloy, the overall rigidity and the % flexural modulus are relatively south, and the contact resistance of the surface is also low. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial cross-sectional view showing a connecting device according to an embodiment of the present invention. Fig. 2 is a partially enlarged cross-sectional view showing the connecting portion of the above connecting device. Fig. 3 is an enlarged plan view showing an enlarged plane of the connecting portion. Fig. 4 is an enlarged cross-sectional view showing a contact portion between a resilient arm and a protruding electrode. 123323.doc -15· 200830649 Fig. 5 is an enlarged cross-sectional view showing a coating layer of a resilient arm. Fig. 6 is an enlarged cross-sectional view showing a modification of the coating layer of the elastic arm. Fig. 7 is an enlarged cross-sectional view showing a coating layer according to a second embodiment of the present invention. [Main component symbol description]
1 連接裝置 10 基台 12 支持面 15 連接片 16 基材片 20 連接部 21 支持部 22 彈性臂 30 芯部 31 導電層 32 彈性層 33 被覆層 34 被覆層 34a 鉑族金屬層 34b 金層 40 電子零件 42 突出電極 I23323.doc -16-1 Connecting device 10 Base 12 Support surface 15 Connecting piece 16 Substrate sheet 20 Connecting part 21 Support part 22 Elastic arm 30 Core part 31 Conductive layer 32 Elastic layer 33 Covering layer 34 Coating layer 34a Platinum group metal layer 34b Gold layer 40 Electron Part 42 protruding electrode I23323.doc -16-