200830512 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種指紋辨識器封裝構造 (fingerprint sensor package)，特別係有關於—種指紋辨 識器之薄膜封裝構造。 【先前技術】 按，指紋辨識器封裝構造能附加裝設於各式之電子200830512 IX. Description of the Invention: [Technical Field] The present invention relates to a fingerprint sensor package, and more particularly to a film package structure for a fingerprint reader. [Prior Art] According to the fingerprint identifier package structure, it can be attached to various types of electronics.
產品，例如行動電話、筆記型電腦、個人數位助理器 (PDA，或稱掌上型電腦）等等，用以辨認使用者之指紋。 目前指紋辨識器已可利用+導體製程製作並加以封 裝不同於傳統的iC封裝，指紋辨識器晶片應具有一 外露的感測區’方可辨識指紋。然以往的指紋辨識器封 裝構造係採用傳統基板與模封的封I技術，機械固定斑 電性連接之介面皆位於基板之底面，不易控制指紋辨識 之水平面。 第1圖係為一種習知指紋辨識器封裝構造之截面示 意圖帛2圖係為該指紋辨識器封裝構造之底面示意 圖。如第1與2圖所示，一種指紋辨識器封裝構造1〇〇 ^要包含一基S U0、一指紋辨識器晶y 12〇、複數個 :線130以及一封膠體14〇。該指紋辨識器晶片⑵之 一主動面121上係形成有—感測區123。其中，該指紋 辨識器晶片120之背面122係黏貼在該基板ιι〇之上表 面111 ’並以該些銲線13G電性連接該指紋辨識器晶片 120之單側銲塾至該基板110。該封膠體14〇係形成於 5 200830512 該基板110之上表面111，以密封該些銲線130與該指 紋辨識器晶片1 20之部份，但必須顯露該感測區123。 該基板110之下表面112係設有複數個如錫球之外接端 子150’該些外接端子15〇係可進行對外之機械結合與 電性連接。因此’該指紋辨識器封裝構造1 00在應用時 係表面接合（SMT)至一外部印刷電路板，其機械結合方 向與電性連接路徑皆在該基板n〇之下表面112，習知 表面接口方式會增加封裝外形厚度，並且在指紋辨識的 使用上施加於該指紋辨識器晶片120的外應力傳遞至 該基板110，會引起該些外接端子15〇電性連接斷路之 問題。 ,證號1243437號「薄型觸滑式指紋辨識器 封裝構造」揭示一種指紋辨識器封裝構造，將以一模封 之保護層包覆W之背面’―軟性電路板係壓設於該晶 片其中-侧邊上的導電元件。其技術手段係為先封膝再 於晶片之單侧邊壓貼一軟板，會有溢膠污染感測區之 虞，且無法沿用既有捲帶式傳輸的封裝製 【發明内容】 備 本發明之主要目的係在於提供一種指紋辨識 膜封裝構造，可使具有單側凸塊之指紋辨識器晶片亦； 均句熱壓纟，並提供薄膜兩側與晶片凸塊接合的平： 性，以利封膠體之形成與指紋辨識水平面的控制。衡 本發明的目的及解決其技術問題是採用以 案來實現的。依據本發明，一種 u方 種私紋辨識器之薄膜封裝Products, such as mobile phones, notebook computers, personal digital assistants (PDAs, or palmtops), etc., are used to identify the user's fingerprints. Currently, fingerprint readers can be fabricated and packaged using a +conductor process. Unlike a conventional iC package, the fingerprint reader chip should have an exposed sensing area to identify the fingerprint. However, the conventional fingerprint identifier packaging structure adopts the conventional substrate and the sealed sealing technology, and the interface of the mechanically fixed plaque connection is located on the bottom surface of the substrate, and it is difficult to control the horizontal plane of fingerprint recognition. Figure 1 is a schematic cross-sectional view of a conventional fingerprint reader package construction. Figure 2 is a bottom schematic view of the fingerprint identifier package construction. As shown in Figures 1 and 2, a fingerprint identifier package structure 1 要 ^ includes a base S U0 , a fingerprint recognizer crystal y 12 〇, a plurality of lines 130 and a colloid 14 〇. An active surface 121 of the fingerprint identifier chip (2) is formed with a sensing region 123. The back surface 122 of the fingerprint identifier wafer 120 is adhered to the upper surface 111 ′ of the substrate ι and is electrically connected to the substrate 110 of the fingerprint identifier wafer 120 by the bonding wires 13G. The encapsulant 14 is formed on the upper surface 111 of the substrate 110 to seal portions of the bonding wires 130 and the fingerprint identifier wafer 120, but the sensing region 123 must be exposed. The lower surface 112 of the substrate 110 is provided with a plurality of external terminals such as solder balls. The external terminals 15 are externally mechanically and electrically connected. Therefore, the fingerprint identifier package structure 100 is surface-bonded (SMT) to an external printed circuit board when applied, and the mechanical bonding direction and the electrical connection path are both on the lower surface 112 of the substrate, the conventional surface interface. The method increases the thickness of the package and the external stress applied to the fingerprint reader wafer 120 to the substrate 110 during the use of fingerprint recognition causes a problem that the external terminals 15 are electrically disconnected. , No. 1243437 "Thin-type slide-slip fingerprint reader package structure" discloses a fingerprint identifier package structure, which is covered with a protective layer of a protective layer - a flexible circuit board is pressed into the wafer - Conductive elements on the sides. The technical means is to first seal the knee and then press a soft board on one side of the wafer, which may overflow the sensing area of the glue, and cannot be used for the packaging of the existing tape and reel. [Summary] The main object of the invention is to provide a fingerprint identification film package structure, which can also make a fingerprint identifier wafer having a single-sided bump; the uniform pressure is pressed, and the film is bonded to the wafer bumps on both sides of the film: The formation of the sealant and the control of the fingerprint identification level. The purpose of the present invention and solving the technical problems thereof are achieved by the use of the case. According to the present invention, a film package of a U-type private pattern recognizer
200830512 構造包含一指紋辨識器晶片、複數個凸塊、複數個虛 凸塊、一電路薄膜以及一封膠體。該指紋辨識器晶片 一主動面上係形成有一感測區。該些凸塊係設置於該 動面上並位於該感測區之一侧端。該些虛擬凸塊係設 於該主動面上並位於該感測區之另一相對側端。該電 薄膜係具有-貫通開口，以顯露該感測區，該電路薄 包含有複數個引腳與複數個虛擬引腳，該些引腳之内 係接合至該些凸塊，該些虛擬引腳之内端係接合至該 虛擬凸塊，其中該些引腳之外端係' E合在該電路薄族 同一側。該封膠體係密封該些凸塊與該些虛擬凸塊。 本發明的目的及解決其技術問題還可採用以下技 措施進一步實現。 在前述的指紋辨識器之薄膜封裝構造中，該些 引腳係可為無電性傳遞功能且較短於該些引腳。 /在前述的指紋辨識器之薄膜封裝構造中，該封 係可為一點塗膠體（potting resin)。 在前述的指紋辨識器之薄膜封裝構造中，該電 膜之該貫通開口係可為-槽孔，該電路薄膜之開口 係小於該指紋辨識器晶片之主動面之-長度但大 感測區之長度，並且句Γ雷政α时 亚且該電路潯膜之開口寬度係大於 紋辨識器晶片之主動面之感測區之一寬度。 在前述的指紋辨識器之薄膜封裳構造中，該電 膜係可為-薄膜覆晶（⑽）封裝之楼帶。 在前述的指紋辨識器之薄膜封裳構造中，該電 擬 之 主 置 路 膜 端 些 之 術 擬 體 薄 度 該 指 薄 薄 200830512 膜係可為一捲帶承載封裝（TCP)之捲帶。 在前述的指紋辨識器之薄膜封裝構造中， 之外端係可連接有一外接指。 在前述的指紋辨識器之薄膜封裝構造中， 指係可為多排交錯排列。 在前述的指紋辨識器之薄膜封裝構造中， 指係為同一直線排列。 (, 在前述的指紋辨識器之薄膜封裝構造中， 指之排列方向係可與該感測區為平行。 在前述的指紋辨識器之薄膜封裝構造中， 指之排列方向係可與該感測區為垂直。 在前述的指紋辨識器之薄膜封裝構造中， 與該些虛擬凸塊係可為金凸塊或結線凸塊。 【實施方式】 本發明之第一具實體實施例，揭示一種指 ί 之薄膜封裝構造。第3囷係為該指紋辨識器之 構把之頂面不意圖。第4圖係為該指紋辨識器 裝構造於虛擬引腳處之局部頂面示意圖。第5 指紋辨識器之薄膜封裝構造之截面示意圖。 請參閱第3、4及5圖，該指紋辨識器之薄 造200主要包含一指紋辨識器晶片21〇、複 220、複數個虛擬凸塊23〇、一電路薄膜24〇 膠體250。 如第5圖所示，該指紋辨識器晶片21〇係 每：一引腳 該些外接 該些外接 該些外接 該些外接 該些凸塊 紋辨識器 薄膜封裝 之薄膜封 圖係為該 膜封裝構 數個凸塊 以及一封 具有一主 8 200830512 動面211’在該主動面2ιι上係形成有一感測區2i2， 用以辨識指紋。在該主動面211上另形成有複數個銲# 2 1 3 ’作為對外傳輪的電極。 。該些凸塊22 0係設置於該主動面211上並位於該感 ΛΙ區212之一側端’其係接合於該些銲墊213之上方並 犬出於該主動面211，具有電性傳輸的功能。換言之， 該指紋辨識器晶片2 1 〇僅單侧邊具有電性傳輸的設計。 Γ 該些虛擬凸塊23 0係設置於該主動面2 11上並位於 該感測區2 1 2之另一相對側端。該些虛擬凸塊23 〇係可 與該些凸塊220具有相同材質，如金，譬如該些凸塊 220與該些虛擬凸塊23〇係可為金凸塊或結線凸塊，當 然’於其他實施例當中，虛擬凸塊23 〇係可與該些凸塊 220具有不相同材質。然該些虛擬凸塊230不具有電性 傳輸的功能。該些虛擬凸塊23 0之設置目的係在於提供 該指紋辨識器晶片2 1 〇對該電路薄膜240之另一侧機械 〇 接合。 如第3及4圖所示，該電路薄膜240係具有一貫通 開口 241，以顯露該感測區212，該電路薄膜24〇包含 有複數個引腳242與複數個虛擬引腳243，該些引腳242 之内端242A係接合至該些凸塊22〇,該些虛擬引腳243 之内端243A係接合至該些虛擬凸塊230，其中該些引 腳242之外端242B係匯合在該電路薄膜240之同一側 244。其中，該些虛擬引腳243係可為無電性傳遞功能 且較短於該些引腳242，以不影響該些引腳242之外端 9 200830512 2 42B之線路佈局。再如第3圖所示，每一引腳242之 外端242B係可連接有一外接指245。較佳地，該些外 接指245係可為多排交錯排列。在本實施例中，該些外 接指245之排列方向係可與該感測區2 1 2為平行。The 200830512 construction includes a fingerprint reader chip, a plurality of bumps, a plurality of dummy bumps, a circuit film, and a gel. A sensing area is formed on an active surface of the fingerprint identifier wafer. The bumps are disposed on the moving surface and located at one side of the sensing region. The dummy bumps are disposed on the active surface and located at opposite opposite ends of the sensing region. The electrical film has a through-opening to expose the sensing region, the circuit thin includes a plurality of pins and a plurality of dummy pins, and the pins are connected to the bumps, and the dummy leads The inner end of the leg is coupled to the dummy bump, wherein the outer ends of the pins are combined on the same side of the circuit family. The encapsulation system seals the bumps and the dummy bumps. The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. In the thin film package construction of the fingerprint reader described above, the pins are electrically non-transferable and shorter than the pins. / In the aforementioned film package construction of the fingerprint reader, the seal may be a potting resin. In the film encapsulation structure of the fingerprint identifier, the through opening of the electric film may be a slot, and the opening of the circuit film is smaller than the length of the active surface of the fingerprint identifier chip but the large sensing area The length and the width of the opening of the circuit are greater than the width of one of the sensing regions of the active surface of the pattern disc. In the film seal structure of the fingerprint reader described above, the film may be a strip of a film-coated (10) package. In the film-seal structure of the fingerprint reader described above, the thin film of the main film of the motor is thin and thin. The 200830512 film system can be a tape-reel package (TCP) tape. In the film package structure of the fingerprint reader described above, an external finger may be connected to the outer end. In the aforementioned thin film encapsulation structure of the fingerprint reader, the finger lines may be staggered in a plurality of rows. In the thin film encapsulation structure of the fingerprint reader described above, the fingers are arranged in the same straight line. (In the thin film encapsulation structure of the fingerprint reader, the direction of the arrangement may be parallel to the sensing area. In the thin film encapsulation structure of the fingerprint identifier, the direction of the arrangement may be related to the sensing. In the film encapsulation structure of the fingerprint identifier, the virtual bumps may be gold bumps or junction bumps. [Embodiment] A first physical embodiment of the present invention discloses a finger薄膜 The film package structure. The third line is the top view of the fingerprint identifier. Figure 4 is a partial top view of the fingerprint identifier installed at the virtual pin. 5th fingerprint identification Referring to Figures 3, 4 and 5, the thinner 200 of the fingerprint identifier mainly comprises a fingerprint reader chip 21, a complex 220, a plurality of virtual bumps 23, and a circuit. The film 24 is made of a colloidal body 250. As shown in FIG. 5, the fingerprint reader chip 21 is provided with a film seal for externally connecting the externally attached embossed film packages. The picture is The film package has a plurality of bumps and a main surface 8 200830512 moving surface 211 ′. The sensing surface 2 i 2 is formed on the active surface 2 ι to identify a fingerprint. The active surface 211 is further formed with a plurality of solders. # 2 1 3 ' serves as an electrode of the outer transfer wheel. The bumps 22 are disposed on the active surface 211 and are located at one side end of the sensation area 212 and are attached to the pads 213 The dog has the function of electrical transmission for the active surface 211. In other words, the fingerprint identifier wafer 2 1 has only one side having an electrical transmission design. Γ The virtual bumps 23 0 are disposed on the active The two sides of the sensing area 2 1 2 are located on the opposite side of the sensing area 2 1 2 . The virtual bumps 23 can have the same material as the bumps 220 , such as gold, such as the bumps 220 and the The dummy bumps 23 may be gold bumps or wire bumps. Of course, in other embodiments, the dummy bumps 23 may have different materials from the bumps 220. However, the dummy bumps 230 It does not have the function of electrical transmission. The purpose of these virtual bumps is set in The fingerprint identifier wafer 2 1 is mechanically bonded to the other side of the circuit film 240. As shown in FIGS. 3 and 4, the circuit film 240 has a through opening 241 to expose the sensing region 212. The circuit film 24A includes a plurality of pins 242 and a plurality of dummy pins 243. The inner ends 242A of the pins 242 are bonded to the bumps 22, and the inner ends 243A of the dummy pins 243 are bonded. To the dummy bumps 230, the outer ends 242B of the pins 242 are merged on the same side 244 of the circuit film 240. The dummy pins 243 can be electrically non-transferd and shorter than the These pins 242 are not affected by the line layout of the outer ends 9 200830512 2 42B of the pins 242. As shown in Fig. 3, an external finger 245 can be connected to the outer end 242B of each pin 242. Preferably, the external fingers 245 are staggered in multiple rows. In this embodiment, the alignment directions of the external fingers 245 may be parallel to the sensing region 212.
l; 如第5圖所示，該封膠體250係密封該些凸塊220 與該些虛擬凸塊230。在本實施例中，該封膠體250係 可為一點塗膠體（potting resin)。此外，該指紋辨識器 晶片2 1 0係可結合在一底座2 6 0上，以供機械結合。 請特別參閱第4圖，該電路薄膜240之該貫通開口 2 4 1係可為一槽孔。此外，在本實施例中，該電路薄膜 240係可為一薄膜覆晶（C0F)封裝之捲帶。該電路薄膜 2 4 0之開口長度L 〇係小於該指紋辨識器晶片2 1 〇之主 動面211之一長度Lc，但大於該感測區212之長度， 以使得該些引腳242之内端242A與該些虛擬弓|腳243 之内端243A貼附在該電路薄膜240之介電載賊上。或 者，該電路薄膜240之開口長度l〇亦可小於成等於該 感測區212之長度（這樣感測區212會被該電路薄膜24〇 阻擔，這樣可以運作嗎？）。並且，該電路薄嫉24〇之 開口寬度Wo係大於該指紋辨識器晶片2丨〇之主動面 211之感測區212之一寬度Ws。 因此，本發明之指紋辨識器之薄膜封裝構造 用於封裝具有單側電性傳輸之指紋辨識器晶片2丨〇，亦 能以凸塊接合方式進行接合，並提供薄膜24〇兩側與晶 片凸塊接合的平衡性’以利封膠冑250之形成與指紋辨 10 200830512 識水平面的控制。 本發明之第二具體實施例揭示另一種指紋辨 薄膜封裝構造。請參閱第6及7圖，該指紋辨識 膜封裝構造300包含一指紋辨識器晶片310、複 塊3 20、複數個虛擬凸塊330、一電路薄膜340 封膠體350。在該指紋辨識器晶片310之一主動 上係形成有一感測區3 1 2。該些凸塊3 20係設置 動面3 1 1上並位於該感測區3 1 2之一側端；該些 塊3 3 0係設置於該主動面3 11上並位於該感測區 另一相對側端。該電路薄膜 340係具有一貫 3 4 1，以顯露該感測區3 12。此外，該電路薄膜 含有複數個引腳342與複數個虛擬引腳343，該 342之内端342A係接合至該些凸塊320,該些虛 343之内端343A係接合至該些虛擬凸塊330,其 引腳342之外端3MB係匯合在該電路薄膜34〇 侧344。該封膠體350係密封該些凸塊32〇與該 凸塊3 3 0。在本實施例中，該電路薄膜3 4 〇係可 帶承載封裝（TCP)之捲帶，而使該些引腳3 42 342A與該些虛擬引腳343之内端343A為懸空於 開口 341。此外，至少一引腳342之外端342b 接有一外接指345，可排列在同一直線。在本實缺 該外接指3 4 5之排列方向係可與該感測區3丨2為 因此，在上述的指紋辨識器之薄膜封裝構 中，利用該些虛擬凸塊330與該電路薄膜34〇之 識器之 器之薄 數個凸 以及一 面311 於該主 虛擬凸 3 12之 通開口 340包 些引腳 擬引腳 中該些 之同一 些虛擬 為一捲 之内端 該貫通 係可連 L例中， 7垂直。 造 300 虛擬引 200830512 腳3 43之内端343A在單一側邊的機械接合，使得 具有單侧凸塊之指紋辨識器晶片3 1 〇亦能進行接令 提供該電路薄膜340兩侧與該晶片31〇凸塊接合的° 性，更有利該封膠體350之形成與指紋辨識水平面 以上所述，僅是本發明的較佳實施例而已，並 本發明作任何形式上的限制，雖然本發明已以較佳 〇 例揭露如上，然而並非用以限定本發明，任何熟悉 技術者，在不脫離本發明之技術範圍内，所作的任 單修改、等效性變化與修飾，均仍屬於本發明的技 圍内。 【圖式簡單說明】 1圖：習知指紋辨識器封裝構造之截面示意圖。 2圖：習知指紋辨識器封裝構造之底面示意圖。 3圖•依據本發明之第一具體實施例，一種指紋 器之薄膜封農構造之頂面示意圖。 4圖·依據本發明之第一具體實施例，該指紋辨 之薄膜封裝構造之局部頂面示意圖。 5圖：依據本發明之第一具體實施例，該指紋辨 之薄膜封袭構造之截面示意圖。 6圖：依據本發明之第二具體實施例，另-種指 識器之薄BS； 存膜封裝構造之頂面示意圖。 7圖：依據本發明 之第二具體實施例，該指紋辨 之薄膜封I構造之截面示意圖。 原本 ，並 平衡 的控 非對 實施 本項 何簡 術範 第 第 第 第 第 第 第 辨識 識器 識器 紋辨 識器 12 200830512 【主要元件符號說明】 100指紋辨識器封裝構造 112下表面 121主動面 150外接端子 213銲墊 242引腳 243虛擬引腳 245外接指 110基板 111上表面 120指紋辨識器晶片 122背面 123感測區 130銲線 140封膠體As shown in FIG. 5, the encapsulant 250 seals the bumps 220 and the dummy bumps 230. In this embodiment, the encapsulant 250 can be a potting resin. In addition, the fingerprint identifier wafer 210 can be bonded to a base 220 for mechanical bonding. Referring to FIG. 4 in particular, the through opening 24 1 of the circuit film 240 can be a slot. In addition, in the embodiment, the circuit film 240 can be a film-coated (COF) packaged tape. The opening length L 〇 of the circuit film 240 is less than the length Lc of the active surface 211 of the fingerprint identifier chip 2 1 ,, but is greater than the length of the sensing region 212, so that the inner ends of the pins 242 The inner end 243A of the 242A and the virtual bow|foot 243 is attached to the dielectric thief of the circuit film 240. Alternatively, the opening length l〇 of the circuit film 240 may be less than or equal to the length of the sensing region 212 (so that the sensing region 212 is blocked by the circuit film 24, can it work?). Moreover, the opening width Wo of the circuit 嫉 24 大于 is greater than the width Ws of one of the sensing regions 212 of the active surface 211 of the fingerprint reader chip 2 . Therefore, the thin film encapsulation structure of the fingerprint identifier of the present invention is used for encapsulating the fingerprint identifier wafer 2 having single-sided electrical transmission, and can also be bonded by bump bonding, and provides both sides of the film 24 and the wafer convex. The balance of the block joints is used to control the formation of the sealant 250 and the fingerprint. A second embodiment of the present invention discloses another fingerprinting film package construction. Referring to FIGS. 6 and 7, the fingerprint identification film package structure 300 includes a fingerprint identifier wafer 310, a plurality of blocks 30, a plurality of dummy bumps 330, and a circuit film 340 encapsulant 350. A sensing region 3 1 2 is actively formed on one of the fingerprint reader wafers 310. The bumps 3 20 are disposed on the moving surface 3 1 1 and located at one side end of the sensing area 3 1 2; the blocks 3 30 are disposed on the active surface 3 11 and located in the sensing area One opposite side. The circuit film 340 has a constant 341 to reveal the sensing region 312. In addition, the circuit film includes a plurality of pins 342 and a plurality of dummy pins 343. The inner end 342A of the 342 is bonded to the bumps 320, and the inner ends 343A of the dummy 343 are bonded to the dummy bumps. 330, the outer end 3MB of the lead 342 is merged on the side 344 of the circuit film 34. The encapsulant 350 seals the bumps 32 and the bumps 300. In this embodiment, the circuit film 34 can be carried with a tape carrying package (TCP), such that the pins 3 42 342A and the inner ends 343A of the dummy pins 343 are suspended from the opening 341. In addition, at least one of the pins 342 has an external finger 345 connected to the outer end 342b, which can be arranged in the same straight line. In the present invention, the arrangement direction of the external fingers 345 can be compared with the sensing area 3丨2. Therefore, in the thin film encapsulation of the fingerprint identifier, the dummy bumps 330 and the circuit film 34 are utilized. a thin number of convexities of the device of the device and a side 311 of the opening 340 of the main virtual convex 3 12 are included in the pin-like pins, and the same virtual one is the inner end of the volume. In the L case, 7 is vertical. The mechanical engagement of the inner end 343A of the foot 300 43 on the single side is made so that the fingerprint discriminator chip 3 1 具有 having the one-sided bump can also be provided to provide the circuit film 340 on both sides and the wafer 31 The formation of the ridge bumps, which is more advantageous for the formation of the sealant 350 and the fingerprint recognition level, are merely preferred embodiments of the present invention, and the present invention imposes any form limitation, although the present invention has The preferred embodiments are disclosed above, but are not intended to limit the invention, and any modifications, equivalent changes and modifications made by those skilled in the art without departing from the scope of the invention are still Inside. [Simple description of the diagram] 1 Figure: A schematic cross-sectional view of a conventional fingerprint identifier package structure. 2: Schematic diagram of the bottom surface of the conventional fingerprint identifier package structure. 3 is a top plan view of a film-sealing structure of a fingerprint device in accordance with a first embodiment of the present invention. 4 is a partial top plan view of the fingerprint-recognizing thin film encapsulation structure in accordance with a first embodiment of the present invention. Figure 5 is a cross-sectional view of the fingerprint-removed film encapsulation structure in accordance with a first embodiment of the present invention. Figure 6 is a top plan view of a thin film BS of another type of identifier according to a second embodiment of the present invention; Figure 7 is a cross-sectional view showing the structure of the fingerprint-finished film seal I in accordance with a second embodiment of the present invention. Originally, and balanced control, the implementation of this item, the first, the first identification, the identification device, the identification device 12 200830512 [main symbol description] 100 fingerprint identifier package structure 112 lower surface 121 active surface 150 external terminal 213 pad 242 pin 243 virtual pin 245 external finger 110 substrate 111 upper surface 120 fingerprint reader wafer 122 back 123 sensing area 130 bonding wire 140 sealing body
Ο 2 12感測區 2 3 0虛擬凸塊 241貫通開口 242B外端 244侧 2 00指紋辨識器之薄膜封裝構造 2 1 0指紋辨識器晶片 211主動面 220凸塊 240電路薄膜 242A內端 243A内端 250封膠體 260底座 300指紋辨識器之薄膜封裝構造 310指紋辨識器晶片 311主動面 320凸塊 340電路薄膜 342Α内端 343Α内端 350封膠體 Lo 開口長度 Lc晶片長度 312感測區 330虛擬凸塊 341貫通開口 342B外踹 344側Ο 2 12 sensing area 2 3 0 virtual bump 241 through opening 242B outer end 244 side 2 00 fingerprint identifier thin film package structure 2 1 fingerprint identifier wafer 211 active surface 220 bump 240 circuit film 242A inner end 243A End 250 encapsulant 260 base 300 fingerprint encapsulation film encapsulation structure 310 fingerprint reader wafer 311 active surface 320 bump 340 circuit film 342 Α inner end 343 Α inner end 350 encapsulant Lo opening length Lc wafer length 312 sensing area 330 virtual convex Block 341 penetrates the opening 342B and the outer side 344
Wo 開口寬度 342引腳 343虛擬引腳 345外接指Wo opening width 342 pins 343 dummy pins 345 external fingers
Ws 晶片感測區寬度 13Ws chip sensing area width 13