TW200830435A - Die bonder, method for cutting and attaching thermo-compression bonding tape strip of die bonder and recording medium recording program for the method - Google Patents

Abstract

The present invention relates to a die bonder, which performs conveyance of a thermo-compression bonding tape and transfer and attaching of a cut strip of the thermo-compression bonding tape strip with a simple structure and prevents wrinkling of the thermo-compression bonding tape during the conveyance thereof. The die bonder includes a guide 33 that guides a bonding tape 41, a tape suction chuck 13, a retention substrate 35, and a cutter 60. The tape suction chuck 13 sucks the thermo-compression bonding tape 41 on the guide 33 at an initial position, and draws the tape onto the retention substrate in the longitudinal direction of the tape. The drawn tape 41 is sucked and fixed onto the retention substrate 35 and is cut off with the cutter 60 to form a thermo-compression bonding tape strip. The tape suction chuck 13 sucks the thermo-compression bonding tape strip 23, transfers the same onto a lead frame to attach the thermo-compression bonding tape strip to the lead frame. After the tape is attached, the tape suction chuck 13 returns to the initial position.

Description

200830435 IX. Description of the Invention: The present invention relates to a structure of a wafer bonding apparatus, a method of cutting and adhering a hot-pressed adhesive tape from a hot-pressed adhesive tape for semiconductor wafer bonding in a wafer bonding apparatus, and Program. [Prior Art]

One of the manufacturing steps of the semiconductor device is a wafer bonding step in the wafer bonding step of the semiconductor wafer formed in the previous step on the wafer holder of the lead, the wire frame or the lead frame, and the semiconductor wafer is fixed to the wafer holder or the like. The method used is to form a double-adhesive pressure-sensitive adhesive tape, which is cut into a hot-pressed adhesive tape of a predetermined size to supply: a cymbal seat and a transparent (four) hot-pressed adhesive tape. The tape piece thermally presses the semiconductor wafer to the wafer holder or the like (for example, refer to Patent Document 1). / 丨 丨 ... & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & & The mechanism and the hot-pressed adhesive tape that is formed are formed by cutting the carrier tape cutting mechanism in a direction perpendicular to the long side of the carrier tape. The amount of the carrier tape sent by the carrier tape transport mechanism that sends the carrier tape to the cutting mechanism is determined by the size of the A' heat-pressed adhesive tape. As a conveying mechanism of such a hot-pressed adhesive tape, the following mechanisms have been proposed (for example, refer to Patent Readings i to 3), which are externally connected to each other: one of the rollers is rotationally driven to heat the roller between the rollers. The ballast R is configured to the cutting mechanism, or the claws disposed on the upper and lower sides of the heat-duty adhesive 6 200830435 are used, and the carrier tape is clamped up and down to send the hot-press adhesive tape to the cutting mechanism. The hot-pressed adhesive tape fed to the cutting mechanism by the carrier tape transport mechanism is cut by a carrier tape cutting mechanism to form a thermocompression adhesive tape. The formed hot-pressed adhesive tape sheet is picked up by the carrier tape bonding mechanism by the carrier tape cutting mechanism, sub-transferred to the wafer holder or the like, and then loaded on the wafer holder or the like. As such a carrier tape: the attachment mechanism is used to adsorb or release the spray of the heat-pressure-adhesive tape sheet or the same clip to move up and down, front, back, left, and right (for example, Izumi Patent Documents 1 to 3) . 〃 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In the conventional wafer bonding method described in Patent Document 1 or 3, since the carrier tape transport mechanism and the carrier tape attaching mechanism are assembled by individual structures, the overall structure is complicated and the size is increased. On the other hand, in recent years, in response to the demand for thinning of semiconductor devices, the pressure-carrying tape has also been gradually used. Since the = is low, the carrier tape described in the patent document: =:: 2, when the cutting mechanism is used, the bending load of the belt is caused by the bending of the carrier tape between the surface of the cutting mechanism and the carrier tape. The problem. The reading is performed, and it is impossible to carry out (4) The loading of the adhesive tape The present invention is to provide a hot-pressed adhesive tape capable of being carried out by a simple structure.

V-transfer and wafer bonded device for transfer and pasting of the hot-pressed adhesive tape. Further, another object of the present invention is to prevent wrinkles from occurring when the hot-pressed adhesive tape of the wafer bonding apparatus is transported. The wafer bonding apparatus of the present invention includes a heat-adhesive tape carrier sheet having a predetermined size cut from a thermal f-bonding tape for semiconductor wafer bonding, and a carrier tape bonding mechanism for adhering the thermocompression-bonded V-sheet to a bonding target, and a bonding mechanism for thermally bonding the semiconductor wafer to the bonding object through the pasted hot-pressed adhesive tape sheet, characterized in that: the guiding member for guiding the hot-pressed adhesive tape along the longitudinal direction; The guiding member adsorbs and holds the hot-pressed adhesive tape 2 to hold the substrate; cuts the cutter of the hot-pressed adhesive tape; adsorbs the carrier-carrying collet of the hot-pressed adhesive crucible; and performs the cutter and the carrier tape a control unit for adsorbing the collet and a control unit for holding the adsorption control of the substrate; the control unit has the hot-pressed adhesive f adsorbed on the guide by the carrier tape collet, and is pulled in the lateral direction a carrier tape pulling-out means for cutting the unit length to the holding substrate; adsorbing and fixing the hot-pressed adhesive tape that has been pulled out to the carrier tape adsorption means for holding the φ substrate; and the heat-pressing adhesive to be fixed The belt is cut into hot-pressed load by the cutter a carrier tape cutting device for the sheet; a carrier tape attaching means for transferring the hot-pressed adhesive tape sheet to the bonding object by the carrier tape adsorption collet; and homing the carrier tape adsorption collet to the guide The carrier tape on the lead member is a means of absorbing the collet. Moreover, in the joint device of the present invention, the guide member is adapted to adsorb and hold the hot-press adhesive tape, the control portion performs adsorption control of the guide member, and the carrier tape suction means is to be pulled out. The hot-pressed adhesive tape is adsorbed and fixed to the guiding member; and is also suitable for having the hot-press adhesive tape fixed when the cutting is fixed, so that the carrier-carrying collet clamp is retracted until the cutter does not with the load 8 200830435

The V π adsorption cylinder is the retracting position of the carrier tape suction collet retraction means. A method for cutting and pasting a hot-pressed adhesive tape of a wafer bonding apparatus according to the present invention, comprising: a V-lead for guiding a thermal compression-bonding f for semiconductor wafer bonding along a longitudinal direction, adjacently disposed on the guiding member and adsorbed and held The holding substrate of the hot-pressed adhesive tape, the cutter for cutting the hot-pressed adhesive tape, and the carrier-carrying cartridge clamp for adsorbing the hot-pressed adhesive tape can cut a predetermined size of hot pressing from the hot-pressed adhesive tape Adhesive tape strip for adhering the hot-pressed adhesive tape sheet to the bonding pair; wherein the method has the adsorption of the hot-pressed adhesive tape on the guiding member by the carrier tape adsorption collet And pulling the length of the cutting unit to the carrier tape pulling step on the holding substrate in the longitudinal direction; the carrier tape adsorption step of fixing the hot-pressed adhesive π adsorbed to the holding substrate; The hot-pressed adhesive tape is cut into a carrier tape cutting step of the hot-pressed adhesive tape by the cutter; the hot-pressed adhesive tape is transferred to the bonding object by the carrier tape a carrier tape attaching step; and homing the carrier tape suction collet to the 5-inch guide Adsorption carrier tape cartridge clip homing step. Moreover, in the method of cutting and pasting the hot-press adhesive tape of the cymbal bonding device of the present invention, the guiding member is adapted to adsorb and hold the hot-pressed adhesive tape, and the carrier adsorption step is pulled out. 4 The hot-pressed adhesive tape is adsorbed and fixed to the guiding member; and is also suitable for having the hot-press adhesive tape fixed when the cutting is fixed, so that the carrier adsorption collet is retracted until the cutter does not collide with the carrier-carrying cartridge The carrier tape suction collet retracting step of the retracted position of the inter-gap interference. A recording medium for recording and pasting a hot-press adhesive tape of a wafer bonding apparatus, comprising: a guide member for guiding a thermal-adhesive tape for bonding a semiconductor wafer in a longitudinal direction, adjacently disposed on the recording medium; Guide member 9 200830435 Zero-adsorption holding the holding substrate of the hot-pressed adhesive tape, the cutting tool for cutting the hot-pressed adhesive tape, and the carrier-carrying collet for adsorbing the hot-pressed adhesive tape, can be self-pressed The adhesive tape cuts a hot-pressed adhesive tape of a predetermined size to adhere the hot-pressed adhesive tape to the joint object; and the program has: absorbing the guide on the carrier of the carrier The hot-pressed adhesive tape is pulled out in the longitudinal direction to cut the unit length to the carrier tape drawing program on the holding substrate; and the drawn hot-pressed adhesive tape is adsorbed and fixed to the carrier tape of the holding substrate Adsorbing the private type, the fixed hot-pressed adhesive tape is cut into a carrier tape cutting program of the hot-pressed adhesive tape by the cutter; the hot-pressed adhesive tape piece is clamped by the carrier tape a tape carrier paste program that is moved to the bonding object and pasted; The carrier tape adsorption collet is homaged to the carrier tape adsorption collet on the guide member, and the recording medium of the hot-press adhesive tape cutting and pasting program of the wafer bonding device of the present invention is suitable for the recording medium. The guiding member adsorbs and holds the hot-pressed adhesive tape, and the carrier tape adsorption program adsorbs and fixes the hot-pressed adhesive T that has been pulled out to the guiding member; _ 35 When the pressure-carrying tape is pressed, the carrier tape suction cylinder is retracted to avoid the carrier tape suction retraction program in which the tool does not interfere with the carrier tape suction collet. The invention can exert the effects of hot pressing (four) belt conveyance and transfer and adhesion of the cut hot-pressed adhesive tape sheet by a simple structure. Further, it is also possible to prevent the occurrence of entrapment when the bonding device is transported to the hot-pressed adhesive tape. [Embodiment] Hereinafter, a preferred embodiment of the wafer bonding apparatus of the present invention will be described with reference to the drawings. '10 200830435 [Example 1]

As shown in FIG. 1 and FIG. 2, the wafer bonding apparatus 1A includes a carrier tape bonding mechanism 100, and a hot-pressed adhesive tape 23 of a predetermined size is cut out from a thermocompression adhesive tape 41 for semiconductor wafer bonding, and heat is applied. The adhesive tape carrier sheet 23 is adhered to the lead frame 22 of the bonding object or the bonded semiconductor wafer 24; the bonding mechanism 200 thermally bonds the semiconductor wafer 24 to the lead frame 22 through the pasted heat-adhesive tape carrier sheet 23. The frame feeder 17 supplies the lead frame u to the carrier tape attaching mechanism 1 and the bonding mechanism 200; and the wafer holder μ holds the cut wafer. Hereinafter, the direction in which the lead frame 22 is conveyed is the X direction, the direction perpendicular to the x direction in the horizontal plane is the Y direction, and the up and down direction is the Z direction. The carrier tape bonding mechanism 100 is provided with a carrier tape bonding head 11 that can move the carrier tape adsorption chuck 13 of the semiconductor wafer bonding heat-adhesive tape carrier sheet 23 to the lead frame 22 in a movable direction, and is hot pressed. The adhesive tape 41 is cut to form a cutter 60 that is supplied to the hot-pressed adhesive tape piece 23 of the carrier tape bonding head 11, and a guide roller 33 that guides the hot-pressed adhesive tape tape conveyed from the spool 67 to the cutter 6〇 and When the hot-pressed adhesive tape 41 is cut, the holding substrate 35 of the pressure-sensitive adhesive tape 41 is suction-fixed. ^ ' The V-adhesive head 11 can be moved freely in the χγ plane on the carrier tape bonding table 40, and has a front end driving mechanism 39 for the carrier tape sticking arm 12 to the private movement. The loading of the front end of the tape attaching arm 12 is as follows: the tube is lost 13 and is configured to be movable in the χγζ direction by the carrier and the Z-direction driving mechanism 39. The cymbal 1 piece 33, the holding base plate 35, and the cutter 6 are fed along the frame. π 200830435 The device 17 is disposed on the opposite side of the carrier tape attaching head 11. The guide member 33 guides the thermocompression adhesive tape 41 wound around the reel 67 toward the holding substrate 35 in the longitudinal direction (i.e., the X direction). The holding substrate 35 is sucked and held by the hot-pressed adhesive tape 41 when the hot-pressed adhesive tape 41 conveyed by the guide 33 is cut. The cutter 6 is disposed on the opposite side of the carrier 3 to the carrier tape 3 of the holding substrate 35 and cuts the thermocompression adhesive tape 41 between the guide 3 3 and the holding substrate 35 as The pressure-carrying tape piece 23 is heat-pressed. The bonding mechanism 200 is provided with a bonding head 14 that can move the bonding die holder 16 of the lead frame 22 to the lead frame 22 by the thermal compression-carrying tape piece 23 which is bonded to the wire 22 by the semiconductor wafer 24, and is movable in the XYZ direction. Similarly to the carrier tape attaching head 11, the bonding head 14 is movable in the χγ plane, and has a z-direction motor that moves the tip end of the engaging arm 15 in the z direction inside the bonding head 14. The engaging cylinder & 16 at the front end of the engaging arm 15 is configured to be movable in the χγζ direction by the movement of the joint head 14 in the γ direction and the z direction motor. The frame feeder 17 is provided with two groove-shaped guide rails that are disposed to extend in the direction of the wafer bonding apparatus 1 and are arranged in the opposite direction, and a lead frame transporting mechanism (not shown). Further, at one end of the frame feeder 17, there is provided a frame loader 2 for supplying the lead frame 22 to the frame feeder 17, and at the other end, a lead frame 22 for joining the social wafer is taken out from the frame feeder 17. The frame unloader 2 1 〇 wafer holder 18 is disposed along the frame feeder 17 on the opposite side of the bonding head 。. The wafer holder 18 is provided with a wafer push-up unit 19. The wafer push-up 7G 19 series will hold the semiconductor wafer 24 held in the wafer holder 18 up to 12 200830435 and the conductor wafer 24 is pushed up and has a height difference with other semiconductor wafers 24 to enable the bonding collet 16 to A device that adsorbs the one semiconductor wafer 24. The detailed structure and control system of the tape carrier bonding mechanism 100 of the wafer bonding apparatus 1 described above will be described with reference to Figs. 3 and 4 . The direction of XYZ in Figs. 3 and 4 is the same as the direction of χγζ illustrated in Figs. 1 and 2 . The same portions as those described with reference to Figs. 1 and 2 are denoted by the same reference numerals, and their description will be omitted. As shown in FIG. 3 and FIG. 4, the tape carrier bonding mechanism

The head 11, the guide member 33, and the holding substrate 35 are attached to the carrier tape. The dressing arm 12 is provided with a carrier tape holding pin 13 at the front end. As shown in FIG. 3 and FIG. 4, the guide member 33 is guided to guide heat in the longitudinal direction. [The guide surface of the adhesive V 41 has a fixed guide pin 34a and an adjustment guide pin $乜, which is similar to each guide lock 34a. The guide plate is installed on the top of the 34c. The adjustment guide pin 34c' is configured to be movable in the width direction of the thermocompression adhesive tape 41 in accordance with the width of the hot-pressed adhesive tape 4丨 to be conveyed. As shown in Fig. 4, the two fixing pins W and the adjustment guide lock 34e are disposed on both sides of the heat (four) carrier tape 41 in the conveying direction, and the hot-pressing adhesive tape 41 can be guided in the longitudinal direction. Further, the width of the carrier to be formed by the guides 34a, 34e is based on the width of the gap required for the transfer of the heat transfer tape 41 on the (4) adhesive tape guide. Each of 'a, C and the guide plate 34b constitutes a carrier path. As shown in Fig. 3 and Fig. 4(a), on the side of the tomb &; the direction of the transfer, the width and the long side direction of the carrier tape ▼ 堙 ▼ 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 41 Each of the vents 42 has a groove facing the guide knives 5. Each of the grooves (10) is formed by connecting a plurality of through holes 42 to communicate with the vent holes 42. The plurality of 13 200830435 vents 42 are attached. The inside or outside of the guide member 33 is connected to the ventilation pipe 45. The ventilation pipe 45 is provided with a pilot ventilation main valve 48 for blocking the ventilation of the ventilation pipe. 2 = connected to the pilot venting switching valve 51. The venting venting system is connected to the vacuum device 55 and the blower 57 by an air pipe, and the venting main valve 48 and the vacuum device 55 or the blower 57 can be switched. In the embodiment, the 'guided ventilation switching μ 51 series three-way valve, the end connection ^ 引 ventilation main valve 48, the other end is connected to the vacuum skirt and the other end of J 3 ' Dan is connected to the blower 57. 3 (a), the holding substrate 35 is adjacent to the drawing direction of the hot-pressed adhesive tape 41 provided on the guide 33. The height of the guiding surface of the hot-pressed adhesive tape 4i of the 35 and the guiding surface of the guiding member 33 is approximately the same height; the guiding member 33 and the holding substrate 35 For example, a small gap of about several micrometers is provided between the adsorption holes 43 and the grooves 43a of the substrate 35.

The 'pressure surface of the hot-pressed adhesive tape 41 is provided with a plurality of vents 43 connected to the ventilating pipe 46 inside or outside the holding substrate 35, and the venting pipe 46 is provided for blocking the ventilation. The air flow of the shield substrate venting valve 49. The holding substrate venting main valve 49 is connected to the holding substrate through-and-roll switching valve 52 by an air pipe, and the holding substrate vent switching valve 52 is connected to the vacuum device 55 and the blower 57 by an air pipe, and can switch and hold the substrate venting main valve 49. It is connected to the vacuum device 55 or the blower 57. In the present embodiment, the holding substrate vent switching valve 52 is the same as the pilot vent switching valve 51, and is a two-way valve. 200830435 As shown in Fig. 3 and Fig. 4(a), the page-mounting arm 12 is mounted on the carrier 1 (four) head table 40 from η in the χ γ direction. In the carrier tape bonding head u Φ War ▼ paste head There is a servo motor for driving in the Y direction, and it is possible to control the carrier tape viscosity by its rotation angle. The ΧΥ direction drives the driving direction of the heart and the moving head ", and the peace of mind = the motor can also be mounted on the X of the carrier tape U: side: head work... carry the tape adhesive movement / movement amount control. In addition, the drive in the χ γ direction is driven by the position detection cry::: “Achieve the χ γ direction and then feedback control the general motor. Placed on the carrier tape stick 11 , An I right

The direction shifting t clothing has a driving mechanism 39 for moving the front end of the affixing arm 12 toward the Z direction. The two-direction driving mechanism 39 is rotated by the motor to the carrier tape sticking arm 12 and the front end... the center of rotation of the head 11 ζ ζ 附 Attached collet 13 moves in the z direction; as long as the direction of the private carrier carrying the adsorption collet 13 rotates around the center of rotation, and along the ^ affixed arm 12 equals the vertical guide of the upper and lower priests * gonggong adhesive head u When the piece is linearly moved in the up and down direction, it can also be moved by the magnetic force in the lower direction of the stomach. The electromagnetic force is applied to the upper and lower sides ==. The carrier tape is attached to the adhesive arm 12, or the carrier tape is attached to the U. Since the cam or the like is attached to the servo motor of the movement a and is moved upward and downward: since the movement is configured in this manner, the front end of the carrier (four) arm 12 can be moved freely in the direction of the grazing. Repeatedly viscous = 1 on the side of the hot-bonded tape on the front end of the arm 12, and the carrier-carrying collet 13 for adsorbing heat is installed. The carrier tape suction collet 13 has a flat adsorption surface with a heat-adhesive tape 41 attached thereto. Fig. 4 (b) is a plan view of the carrier tape suction collet 13 as viewed from the side of the adsorption surface. As shown in Fig. 4 (b), the adsorption surface of the carrier tape suction chuck 13 is provided with the same vent hole 44 and groove 44a as the adsorption surface of the holding substrate 35. Each of the vent holes 44 is connected to the vent pipe 47 through an air passage provided in the carrier tape attaching arm 12, and the vent pipe 47 is provided with a suction collet vent main valve 5 that blocks the flow of air from the vent pipe 47. The adsorption Jingqi ventilation main valve 50 is connected to the adsorption collet ventilating switching valve 53 by an air pipe, and the adsorption collet ventilating switching valve 53 is connected to the vacuum device 55 and the blower 57 by an air pipe, and can switch the adsorption collet The venting main valve 50 is connected to the vacuum device 55 or the blower 57. In the present embodiment, the suction collet ventilation switching valve 53 is the same as the pilot ventilation switching valve 5, and is a three-way valve. X, the carrier tape cartridge & U-system is detachably configured to be replaceable according to the width of the hot-pressed adhesive tape 41 or the size of the hot-pressed adhesive tape door to be formed.

As shown in Fig. 4 (4), the cutter 60 is held on the side of the guide member 33 and the holding substrate 35. The cutter 60 is provided with a knife base end to which the knife 65 is attached. ^: ^ direction (four) knife base end 63 of the knife base 5 Η. A servo motor for driving in the Z direction is attached to the base end of the blade (1), and can be moved in the Z direction. The driving of the knife base end 63 is not limited to the servo motor. The gentleman ▲ tenth bank can also be driven, for example, by a > flying cylinder. The blade 65 is attached to a position where the leading end can enter the gap between the guide η 保持 holding substrate 35 and cut the hot-pressed adhesive tape 41 and the length larger than the width of the hot-pressed adhesive tape 41. Further, it is also possible to have a guide member-side end surface on the substrate holding side of the guide member 33, and a surface on the side of the guide member 33 of the foraging 65 and a surface on the substrate side of the guide member 33 θ knife 65 To cut 16 200830435 hot-pressed adhesive tape 41. As shown in FIG. 3, the wafer bonding apparatus w bonding mechanism 1 of the present embodiment performs a carrier tape bonding head U, a z-direction driving mechanism 39, a knife base end 8, and a bow' 藉 by a control unit 71 having a CPU. The main valve 仏, the holding substrate venting main valve 49, the adsorption tube venting main valve 2 引 venting switching valve 51, the holding substrate venting switching valve 52, and the adsorption tube venting switching valve 53 are respectively transmitted through the carrier tape bonding head driving interface π, Z direction drive mechanism interface 79, knife base end drive interface 8〇, guide ventilation start valve interface 8 maintain substrate ventilation total wide interface 82, adsorption cartridge clamp ventilation her reading interface 83, guiding ventilation switching wide interface 84, Maintaining the substrate venting: The valve interface 85 and the suction collet venting switching valve interface 86 are connected to the data busbar 73, respectively. Further, the data bus bar 73 is connected to the control unit 71, and the control unit 71 can control each device. Further, a memory unit 75 in which a control program or data is stored in advance is connected to the data sink 73. In the present embodiment, the vacuum device 55 and the blower 57 are connected to another control unit (not shown) for control, and the operation state of each device can be input to the control unit 71 through the data bus 73, and the control unit 71 can coordinate with other control units. The control of each machine of the wafer bonding apparatus 10 is performed. However, these devices can also be connected to the control unit 71 through the respective interfaces to constitute an integrated control unit.

In the above, the configuration of the wafer bonding apparatus 10 of the present embodiment will be described. The cutting and attaching operation of the hot-pressed adhesive-type film 2 of the wafer bonding apparatus 1 of the present embodiment will be described with reference to the following description. Fig. 5 is a flowchart showing the operation of the embodiment, and Fig. 6 to Fig. 18 are diagrams showing the operation of the operation state.

As shown in Fig. 6, in the initial state before the start of the operation of the wafer bonding apparatus ι of the present embodiment, the carrier adsorption tube "13 has its adsorption surface attached to the vent hole 42 on the side of the carrier 33 in the carrier-carrying direction. The upper side of the self-guide member μ is raised toward the upper side in the Ζ direction, and is raised, for example, to a position of about 〇2_, and the hot-pressed adhesive tape 41 is placed on the adsorption surface of the carrier tape carrier 13 and the guide member/ The state between the adsorption faces of 3. In the initial state, the guide ventilation total _ 48 shown in FIG. 3, the holding substrate venting total valve 49, and the suction collet venting main valve 5 (the M system are all in a closed state, in each vent hole 42, the sputum and each sputum 42a' 43a' 44a has no air flow; the hot-pressed adhesive tape 4 wound on the reel 67 passes through the carrier path formed by the fixed guide pin, the adjustment guide pin, and the guide plate 34b, toward the long side. The direction (i.e., the χ direction) extends and is gathered at a reference position whose front end is located near the end surface of the guide member 33 on the side of the holding substrate 35 and the thermocompression adhesive tape 41 covers the guiding surface of the guide member Μ The vent hole 42 and the groove 42a. Here, the reference position is the position of the blade 65 in the longitudinal direction of the carrier tape. Further, in the initial state, the blade base 63 of the tool 6 is in the raised position and is at the edge. Between the guide member 33 and the holding substrate 34, a state in which the carrier tape is adhered to the space in which the f 12 can move is ensured. Next, after the operation of the wafer bonding apparatus 1 is started, as shown in step sun of FIG. 5, the control unit 71 Confirming whether the carrier tape suction collet 13 is located at the initial position on the guide member 33, when the carrier tape is sucked When the collet u is not at the initial position, the 'output command causes the carrier tape sticking head' to drive the servo motor and the z-direction drive mechanism 39 to move the carrier tape cartridge 18 200830435 to the guide member 33. The initial position from the control unit 71 is transmitted through the carrier tape driving surface 79 through the two-way driving mechanism boundary, and the bonding head 11 and the Z-direction driving mechanism 39 are used as control signals to make the carrier tape run M.丨 amp amp amp amp 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏 黏The portion 71 outputs an instruction to drive the carrier tape adsorption collet 13 at the front end of the carrier tape attachment arm i2.

= 39 is lowered toward the guide surface of the guide member 33. As shown in Fig. 7, = Zha, the Z-direction drive mechanism 39 is actuated, and the carrier tape suction collet η is lowered to start the carrier tape pulling-out step. As shown in step S1G3 of Fig. 5, the control unit 71 outputs a command for switching the suction collet vent switching valve 53 shown in Fig. 3 to the side of the vacuum device 55: the command is transmitted to the suction through the suction collet venting switching valve interface 86. The collet ventilating switching valve 53 serves as a control signal, and the absorbing collet venting switching valve 53 operates, and the absorbing collet venting switching valve 53 is switched to the vacuum device 55 side. Next, as shown in step S104 of Fig. 5, the control unit 71 outputs an instruction to open the suction collet venting total valve 50. The command is transmitted to the suction cylinder clamp main valve 5〇 through the suction cylinder clamp main valve interface 83 as a control signal, and the suction cylinder clamp main valve 50 is actuated, and the suction cylinder clamp main valve 5 is opened. As a result, as shown in Fig. 7, the vacuum device 55 communicates with the venting pipe 47, and the air is sucked from the vent hole 44 and the groove 44a provided in the carrier tape suction collet 13, and the adsorption surface of the carrier tape suction collet 13 is sucked. The hot-pressed adhesive tape 41 is adsorbed. As shown in step S105 of Fig. 5, the control unit 71 outputs a command for switching the pilot ventilation switching valve 51 shown in Fig. 3 to the side of the blower 57. The command 19 200830435 is transmitted to the pilot ventilation switching valve 5 i through the pilot ventilation switching valve interface 84 as a control signal, and the pilot ventilation switching valve 5 i operates, and the pilot ventilation switching valve 51 is switched to the blower 57 side. . Next, as shown in step sl6 of FIG. 5, the control unit 71 outputs an instruction to open the pilot venting valve 48. The command is transmitted to the pilot venting valve 48 through the pilot venting valve interface 8 1 as a control signal, and the venting master valve 48 is actuated, and the pilot venting valve 48 is opened. As a result, as shown in FIG. 7, the air blower 57 communicates with the vent pipe 45, and the air is blown out from the vent hole 42 and the groove 42a provided in the guide surface of the guide 33. The carrier tape suction collet 13 at the leading end of the tape application arm 12 as shown in step S107 of Fig. 5 is raised in the Z direction by the z direction driving mechanism 39. As shown in Fig. 8, according to this command, the z-direction drive mechanism 39 operates, and the carrier tape suction collet 13 rises. The rising southness of the carrier tape collet 13 is sufficient as long as it can ensure the height of the gap between the guide member 33 and the holding substrate 35 when the hot-pressing adhesive tape is pulled out, for example, 〇1 to 〇.2^^. According to the type, rigidity, or various parts of the hot-pressed adhesive 胄41

The height is changed by the size or the like. As shown in FIG. 8, when the carrier tape suction collet U adsorbs the hot-press adhesive tape 41 and rises, air is blown from the vent hole 42 and the groove 42a of the guide member 33, so that the hot-press adhesive tape 41 is easily self-guided. Piece = peeling of the lead. As shown in the step of FIG. 5, the control unit outputs a command for moving the carrier tape toward the longitudinal direction of the hot-pressed adhesive tape 41 (ie, the χ direction) to the holding substrate 35. As shown in FIG. According to the command, the feeding motor for driving the tape carrier head U is operated, and the carrier 13 between the carrier tapes 20200830435 12 is moved to the longitudinal direction of the heat-adhesive tape 41 to the holding substrate. 3 5 on. Artware private

The amount of movement of the 戟f pasting head 11 in the longitudinal direction of the carrier tape (i.e., the X direction) is precisely controlled by the servo motor. As shown in FIG. 9, the carrier tape suction T and the attachment clamp 13 of the front end of the carrier tape sticking arm 12 are moved to the holding substrate 35 under the core of the makeup energy which adsorbs the heat-pressure adhesive tape 41 on the adsorption surface thereof. on. The hot-adhesive tape is pulled out to the holding substrate 35 by the carrier tape suction roller at the front end of the adhesive arm 12 by the action/loading. When pulled out, the hotsburg adhesive tape 41 is guided by the horse guides 34a, 34c and the guide plates 3 of the guide member 33, and the direction of the long side of the belt Straight pulled out. Next, the front end of the hot-pressed adhesive tape 41, i.e., the white-nosed j-p, is moved from the blade reference position of the blade 65 toward the longitudinal direction of the carrier tape by the moving distance of the carrier tape collet 13.

In this manner, since the hot-pressed adhesive tape 41 is pulled out and conveyed in the longitudinal direction, no compressive force acts on the hot-pressed adhesive tape 41 during the conveyance. Therefore, it is possible to prevent the hot-pressed adhesive tape 41 from being wrinkled due to the bending of the hot-pressed adhesive tape 41 during conveyance, and it is possible to convey the hot-pressed adhesive tape 41 smoothly in the longitudinal direction. Further, since the hot-pressed adhesive tape 41 does not warp due to the compressive force during conveyance and the accuracy of the amount of movement of the carrier tape suction collet 13 is high, it is possible to improve the hot-pressed adhesive tape 4! Accuracy and improve the transport dimensional accuracy of the hot-pressed adhesive tape. Further, since the hot-pressed adhesive tape 41 is guided by the guide pins 34a, 34c and the guide plate 34b, the gap between the guide pins 34a, 34c and the hot-pressed adhesive tape 41 is narrowed. The precision is improved, and the resistance of the hot-pressed adhesive tape is increased due to the increase of the resistance of the hot-press adhesive tape through the guide pins 34a, 34c and the guide plate 34b, so that the direction accuracy during the transportation can be improved smoothly. The hot-pressed adhesive tape 4 j is conveyed in the longitudinal direction. 21 200830435 As shown in Fig. 5, the adhesive head (4) and the larger Μ9 and Fig. 9 show that the control unit is configured to move the carrier tape to the longitudinal direction of the carrier tape adsorption collet 41, and the workpiece is loaded with the knife 160. The moving distance of the long side direction of the belt 41 and the cutting unit of the length of the one piece of the hot-pressed adhesive tape piece 23 formed by cutting are selected to be t 仗 and again. Next, as shown in step S11 of FIG. 5, after the second unit reaches the unit length, the command to stop the carrier tape sticking head 'moving direction' is output. According to the instruction, the carrier tape sticking head 11 is stopped. Under the condition that the carrier tape sticking head 11 stops moving in the X direction, the hot-pressed adhesive tape is folded from the reference position of the blade edge of the blade 65: the heat-adhesive force is pulled out in the longitudinal direction of the carrier ▼ (ie, the X direction). The length of the length of the carrier tape 23 is cut. Then, when the carrier-carrying collet 13 is stopped in the X direction, the carrier tape pulling-out step is completed. After the end of the field loading step, the carrier tape adsorption step begins. As shown in step S111 of Fig. $, the batch also has a command to switch the holding substrate ventilation switching valve 52 shown in Fig. 3 to the side of the vacuum device 55. The command is transmitted to the holding substrate vent switching valve 52 through the holding substrate vent switching valve interface 85 as a (four) signal, and the substrate vent switching valve 52 is operated, and the substrate vent switching valve 52 is held to be switched to the vacuum device 55 side. Next, as shown in step S112 of Fig. 5, the control unit 71 outputs an instruction to turn on the holding substrate venting total valve 49. The command is transmitted to the holding substrate venting main valve 49 as a control signal by maintaining the total substrate ventilation width μ, and the substrate venting main valve 49 is actuated to keep the substrate venting _49 open. As described above, the vacuum device 55 communicates with the vent pipe 46, and the air is sucked from the vent hole 43 and the groove 43a provided in the holding substrate 35. In the state where the adsorption surface of the carrier carrying chuck 13 3 is carried out in 22 200830435, the hot-pressed adhesive tape 41 is adsorbed on the adsorption surface, and the hot-pressed adhesive tape 41 and the holding substrate are, for example, about 0.1 to 0.2 mm. The gap.

As shown in step S113 of Fig. 5, the control unit 71 outputs a command to lower the carrier tape suction collet 13 attached to the leading end of the carrier tape 12 to the suction surface of the holding substrate 35 by the z-direction driving mechanism 39. According to this command, the Z-direction drive mechanism 39 operates and the carrier tape suction collet 13 is lowered. After the π adsorption cartridge central portion 13 is lowered to the adsorption surface of the holding substrate 35, as shown in the figure, the hot-pressed adhesive tape 41 is adsorbed and fixed to the suction surface of the holding substrate 35. Further, the carrier tape suction collet 13 can hold the heat-adhesive tape between the holding substrate 35 and the carrier tape suction collet 13 by lowering the suction surface of the holding substrate h. As shown in step S114 of FIG. 5 and FIG. 11, the control unit 71 outputs a command for switching the pilot ventilation switching valve 5 to the side of the vacuum device 55. According to the command, the pilot vent switching valve 5 is switched to the side of the vacuum device 55, and the air is sucked from the vent hole 42 and the groove 42a of the guiding surface of the guiding member 33, and the hot-pressing adhesive tape 4 1 on the lead surface It is adsorbed and fixed to the guiding surface. When the hot-pressed adhesive tape 41 is adsorbed and fixed to the holding substrate 35 and the guide member 33, the carrier tape adsorption step is completed. After the carrier tape adsorption step is completed, the carrier tape cutting step is started. As shown in step S115 of Fig. 5, the control unit 71 outputs a command for lowering the knife base end 63 of the tool 6〇. As shown in Fig. i2, according to this command, the servo motor in the z direction of the blade base end 63 is actuated, and the base end 63 of the blade is lowered. The position of the base end 63 of the knife is controlled by controlling the rotation angle of the servo motor. By controlling the position of the base end 63 of the blade 63, the position of the blade edge 65 63 200830435 mounted in the z-direction of the blade base end 63 is controlled. . As shown in steps s丨丨6 and 丨2 of Fig. 5, the blade base end 63 is lowered to the position where the blade edge of the blade 65 cuts the hot-pressed adhesive tape 41, and the blade 65 cuts off the hot-pressed adhesive tape 41. Since the front end of the hot-pressed adhesive tape 41 is pulled from the position of the blade 65 (ie, the reference position) toward the longitudinal direction of the carrier tape by the length of the heat-adhesive tape carrier 23 to the holding substrate 35, It is convenient to maintain the adsorption surface of the substrate 35 to form the hot dust adhesive tape sheet 23. Further, the position of the longitudinal direction of the carrier tape at the front end of the hot-pressed adhesive tape 41 after cutting is the position of the blade 65 (i.e., the reference position). As shown in step S117 of Fig. 5, after the end of the hot-pressing adhesive tape 41 is completed, the control unit 71 outputs a command for raising the base end 63 to the initial position, as shown in Fig. 13, according to the command, the base of the blade 63 is raised to the initial position, and the carrier tape cutting step is completed. In the present embodiment, during the carrier tape cutting step, the carrier f adsorption clamp 13 is held by the suction cylinder clamp ventilation switching valve 53 on the vacuum device 5 5 side, and the adsorption cylinder clamp ventilation main valve 5 is opened. In the state, the king adsorbs the state of the hot-pressed adhesive tape 41, but can also temporarily close the adsorption sing-and-snap venting main valve 50 to carry out the carrier-cutting step, and then re-open the suction-clamping ventilation after the end of the carrier-cutting step. Valve 5〇. After the carrier tape cutting step is completed, the tape loading step is started. As shown in step S118 of Fig. 5 and Fig. 14, the control unit 71 outputs a command for switching the holding substrate ventilation valve 52 to the blower side. According to this command, the substrate ventilating switching valve 52 is held to be switched to the blower side, and air is blown from the vent hole 43 and the groove 43a of the adsorption surface of the holding substrate 35, and the heat-adhesive tape 41 is no longer adsorbed by the adsorption surface of the holding substrate 35. As shown in step SU9 of Fig. 5, the control unit 71 outputs a command for raising the carrier tape cartridge 13 after the holding of the substrate 35 to the heat-pressing adhesive tape 24 200830435. As shown in Fig. 14, according to this command, the Z-direction drive mechanism 39 of the carrier tape attaching head 11 operates, and the carrier tape suction collet rises.

= = in step S120 of Fig. 5, the control unit 71 rotates the command to close the holding of the substrate venting main valve 49. As shown in Fig. 15, according to this command, the substrate venting total valve 49 is closed, and the air is stopped from the vent holes 43 and 43a of the suction surface. Further, the control unit η outputs an instruction to close the bow guide ventilation total valve 48 as shown in step sm of Fig. 5 . As shown in Fig. 15, according to the command, the guide venting total valve 48 is closed, and the venting hole 42 of the guide member 33 and the groove 42a are sucked and fixed to the hot-pressed adhesive tape 41. As shown in step S122 of Fig. 5, the control unit 71 rotates a command to move the carrier tape suction collet 13 to the bonding position 23a of the thermocompression adhesive tape piece 23 on the lead frame 22. As shown in FIG. 15 and FIG. 4, according to the command, the servo drive motor for the direction drive is mounted on the carrier tape attachment head, and the carrier tape suction collet 13 is moved to the adhesive tape of the hot-press adhesive tape piece 23. position. In this movement, since the carrier tape suction collet 13 moves over the lead frame 22 over the frame feeder 17 on the upper side in the z direction of the surface of the holding substrate 35, not only the movement in the XY direction but also the movement can be performed by The z-direction drive mechanism % causes the carrier tape adsorption cartridge 1 13 to further rise in the z direction. The positional control in the XY direction of the carrier tape cartridge when moving is performed by the rotational position control of the XY-producing servo motor mounted on the carrier tape sticking 11, and the position control in the Z direction is performed by The rotational position control of the servo motor of the z-direction drive mechanism 39 is performed. 25 200830435 As shown in step s 123 of Fig. 5, when the position of the carrier tape cartridge 3 reaches the predetermined pasting position 23a on the lead frame, the control unit 71 outputs a command to stop the movement of the carrier tape cartridge 13 . Next, as shown in step S124 of Fig. 5, according to the command, the χγ direction and the Z direction movement of the carrier tape suction collet 13 are stopped. As shown in step S125 of Fig. 5, the control unit 71 outputs a command for lowering the carrier tape suction collet 13 onto the lead frame 22. As shown in FIG. 6, according to the command, the z-direction drive mechanism 39 is operated, and the carrier tape suction collet 13 is lowered in the state in which the hot-press adhesive tape piece 23 is adsorbed on the adsorption surface, and then the wire guide 22 is lowered. After the carrier tape suction collet 13 is lowered to the lead frame 22, the hot-pressed adhesive tape piece 23 is adhered to the lead frame 22. As shown in step S126 of Fig. 5, the control unit 71 outputs a command for switching the suction collet vent switching valve 53 to the blower side. As shown in Fig. 17, according to the command, the suction collet ventilation switching valve 53 is switched to the blower side, and the air is blown from the vent hole 44 and the groove 44a of the adsorption surface of the carrier adsorption collet 13 to carry out the adsorption of the cylinder 13 The adsorbing surface no longer adsorbs the hot-pressed adhesive tape piece 23. As shown in step S127 of Fig. 5, the control unit 71 outputs a command for raising the carrier tape suction collet 13. As shown in Fig. 1A, according to the command, the z-direction drive mechanism 39 operates, and the carrier tape suction collet 13 rises in the z direction. After the carrier tape suction collet 13 is raised to a predetermined height, as shown in step S128 of Fig. 5, the control unit 71 outputs a command to close the suction collet pinch total valve 5〇. According to this instruction, the suction collet venting total valve 50 is closed, and the air is stopped from being blown out from the vent hole 44 and the groove 44a of the adsorption surface of the absorbing clamp 13 . Empty 26 200830435 After the gas is stopped from the blowing of the carrier tape collet 13, the tape loading step is completed. After the tape loading step is completed, the carrier tape suction chuck is returned to the homing step. As shown in step S129 of Fig. 5, the control unit 71 outputs a command for returning the carrier tape cartridge 13 to the initial position. As shown in Fig. 18, according to the command, the XY-direction drive servo motor attached to the carrier tape attaching head 11 operates, and the carrier tape suction collet 13 is moved to the initial position. In this movement, since the carrier tape suction collet 13 moves over the frame feeder 17 to the guide member 33, not only the movement in the χγ direction but also the Z-direction drive mechanism 39 allows the carrier tape to be sucked by the Z-direction drive mechanism 39. Η Further rise in the z direction. When moving, the positional control in the χ γ direction of the carrier tape suction collet 13 is performed by the rotation position control of the 伺服 γ direction drive servo motor mounted on the yam bond head 11 to perform the position control in the Z direction by z. The rotational position control of the servo motor of the direction drive mechanism 39 is performed. Next, after the carrier tape suction collet 13 is returned to the initial position, the carrier tape suction collet homing step is completed. As described above, the process of pulling the hot-pressed adhesive tape 2 from the initial position by pulling the cut-off unit length from the initial position to the holding substrate 35 is repeated, and the hot-pressed adhesive has been pulled out. The tape 41 is adsorbed on the holding substrate 35, and the adsorption step of the surface is cut off by the cutter 60 to cut the hot-pressed adhesive tape 41 into a hot-pressed adhesive tape piece 23; 13 ^ With the hot-pressed adhesive tape piece 23 transferred to the lead frame 22 and adhered to the carrier tape zero-sticking step, with this X and stop the carrier tape adsorption collet 13 adsorption on the hot-pressed adhesive tape and make it ^ From the * ^, straight % to the initial position of the carrier tape adsorption collet homing step, this is the case of the hot-pressed adhesive tape 23 length (ie, the length of the cut unit) 27 200830435 one by one to transfer hot pressing The adhesive tape 41 is applied to the cutter 60 and cut into a heat-pressed adhesive tape sheet 23 to be adhered to the lead frame 22.

In the wafer bonding apparatus 10 of the present embodiment, the hot-pressed adhesive tape 41 can be pulled out by the movement of the carrier tape suction collet 13 and the cut hot-press adhesive tape piece 23 can be transferred and pasted to the lead frame 22 Therefore, the mechanism for forming the self-heating adhesive tape 41 to form the hot-pressed adhesive tape sheet 23 and the bonding mechanism for adhering the formed hot-press adhesive tape carrier 23 to the lead frame 22 are not constituted by individual mechanisms. It consists of one institution. Thereby, the effect of transferring and adhering the hot-pressed adhesive tape 41 and the cut-off heat-adhesive tape carrier U by the simple structure can be exhibited. In the wafer bonding apparatus i 1 of the present embodiment, the thermal compression bonding tape 41 is adsorbed by the carrier tape suction chuck 13 and the cutting unit length is pulled out from the initial position to the holding substrate 35, thereby being oriented in the longitudinal direction. Since the hot-pressed adhesive tape is conveyed, the compressive force does not act on the hot-pressed adhesive tape 41 at the time of conveyance. Therefore, it is possible to prevent the heat-pressure-carrying tape 41 from being bent due to the bending of the hot-pressed adhesive tape 41, and it is impossible to carry it, and to smoothly transport the hot-pressed adhesive tape 4 to the longitudinal direction. ...々, Ύ 附 附 附 13 13 13 13 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 13 13 13 13 13 13 13 13 The servo motor is controlled and the precision of its movement is high. Therefore, it can be used for high-pressure and pressure-adhesive "41 pull-out length precision, and improve the effect of carrying the transfer size accuracy of the carrier tape. Further, since the length of the hot-pressed adhesive tape piece 23 (i.e., the length of the cutting unit 28 200830435) is pulled out during the carrier tape drawing step, the dimensional accuracy can be improved, and the dimensional accuracy can be improved. The formed hot-press adhesive has improved precision and improved joint quality. M16t " in the direction of the long side of the guide pin 33 of the hot-pressed adhesive tape 4 1 fixed guide pin 3 ^ 51 ... Zyor Ma Ma adjustment guide pin 34c, and guide plate 34b female clothing on the carrier tape adsorption The upstream side of the transport direction of the initial position of the cylinder &

And a carrier tape path is formed, which is pulled by the carrier tape, L, the finely-carrying and the thermal-adhesive tape 41 i adsorbed by the carrier 13 through the carrier tape. Therefore, even if you want to reduce the gap between the carrier tape and the hot-pressed adhesive crucible 41, so that the hot-sand carrier can be transported straight to the long-side direction | 41, it will not be blocked by the hot-pressed adhesive tape passing through the carrier tape. = increase causes hot pressing and viscosity (4) 41 to cause wrinkle, and can improve the direction accuracy of hot pressing and bonding T 41 when transporting q||This, 彳 play to improve the angular accuracy of the pressure-carrying adhesive tape 4i and the blade 65' The effect of the shape accuracy of the formed hot-pressed adhesive tape sheet 23 is formed.

As described above, in the wafer bonding apparatus of the present embodiment, the transfer and adhesion of the hot-pressed adhesive tape 41 and the cut-off heat-pressure-adhesive tape 23 can be prevented and prevented by a simple structure. The hot-pressed adhesive tape 41 conveys the effect of occurrence of wrinkling. In the present embodiment, the vent holes 42, 43, 44 and the grooves 42a 43a, 44a provided in the guide 33, the holding substrate 35, and the carrier suction collet 13 are respectively transmitted through the respective valves 48, 49, 50. The switching valves 51, 52, 53 are connected to the vacuum device 55 and the blower 57, and each of the vent holes 42 and 43 are switched by opening and closing of the respective valves 48, 49, 50 and the switching valves 51, 52, 53. 44, the air, the blowing, and the stop of the air in each of the grooves 42a, 43a, 44a, but the air vents 42, 43, 44 and the air 29 2930435 of each of the grooves 42a, 43a, 44a are attracted, blown, and stopped. It is not limited to the configuration of this embodiment. [Embodiment 2] Another embodiment of the wafer bonding apparatus of the present invention will be described with reference to the drawings. The same portions as those of the above-described embodiments are denoted by the same reference numerals, and their description will be omitted. In the wafer bonding apparatus 1 of the present embodiment, the heat-adhesive tape carrier sheet 23 having a smaller size than that of the embodiment described above is cut and adhered to the wire guide 22. Therefore, the hot-pressed adhesive tape 41 is pulled out to the holding substrate 35 for a short length, and the vent hole 43 and the groove 43a for adsorbing and fixing the thermocompression adhesive tape 41 pulled up to the holding substrate 35 are tied to the groove 43a. Shorter pull out the range corresponding to long-term production. Therefore, the number of the vent holes 43 and the grooves 43a is also smaller than that of the embodiment described above. Other features are the same as those described above. Hereinafter, the cutting and sticking operation of the heat-adhesive tape carrier sheet 23 of the wafer bonding apparatus i of the present embodiment will be described with reference to the drawings. Fig. 19 is a flowchart showing the operation of the wafer bonding apparatus 10 of the present embodiment, and Fig. 2 to Fig. _ are diagrams showing the operation of the operation. The carrier tape drawing step and the carrier tape adsorption step in steps S201 to S214 of Fig. 19 are the same as those of the embodiment described above. At the stage after the end of the carrier tape adsorption step, as shown in FIG. 20, the vent holes 42 and 43 of the guide member and the holding substrate 35 are both connected to the true device 55' of the hot-pressing adhesive tape 41 shown in FIG. The adsorption is fixed to the guide member 33 and the plate 35 is held. Further, the carrier tape suction collet 13 is lowered to a state in which the adsorption surface of the substrate 0 is held. After the tape loading step is completed, the carrier tape suction collet retraction step begins. 30 200830435 As shown in step S215 of Fig. 19, the control unit 71 outputs a command for switching the adsorption cylinder ventilation switching valve 53 shown in Fig. 3 to the blower side. According to the continuation command, the suction collet ventilating switch 53 switches to the blower side, and as shown in Fig. η, the air is blown out from the vent hole and the groove of the carrier tape collet 13 . As shown in step S216 of Fig. 19 and Fig. 21, the control unit "outputs a command to raise the carrier tape cartridge u by the z-direction driving mechanism" in the z direction. According to this command, the z-direction drive mechanism % of the carrier tape attaching head u operates, and the carrier tape suction collet 13 #卜 4% 3 rises. At this time, since the air is blown out from the vent hole 44 and the groove of the adsorption surface of the mu-clip η, the carrier-carrying collet 13 can be easily separated from the hot-pressed adhesive tape and rises. Step S217 and FIG. 99 grab-up 0 22, the control unit 71 outputs a command to close the suction collet venting main valve 5Q shown in Fig. 3. According to the instruction, the suction collet ventilating total chamber 50 is closed, and the suction cartridge is stopped from the carrier. The vent hole 44 of the adsorption surface and the groove 44a blow air. As shown in step S218 of FIG. 19 and FIG. 22, the control unit 71 outputs a finger that causes the suction collet 13 to retreat from the holding substrate 35 to the retracted position... The tool 60 does not interfere with the carrier tape collet 13 and the retracted position is 'the direction in which the hot-pressed adhesive tape is pulled out, and may be retracted from the γν of the holding substrate 35. According to this command, the servo motor is driven in the direction in which the tape carrier 11 is driven, and the carrier tape collet 13 is moved to the U position. The competition is due to the fact that the party is not only moving in the direction but also borrowing. The moving mechanism 39 causes the carrier tape suction collet 13 to further increase in the direction of the weir. When moving, the carrier tape cartridge is controlled by the position of the XY direction of the ampere, and the zipper is driven by the servo motor in the UUY direction of the carrier tape, and the position control is performed in the z direction. This is performed by the rotational position control of the servo motor of the z-direction drive mechanism 39. When the carrier tape collet 13 is moved to the retracted position, the carrier tape collet retracting step ends. After the carrier tape collet retracting step is completed, the carrier tape cutting step is started. 1: Steps S219 to 221 of 9 show that the blade base end 63 is lowered by the same action as the previous embodiment, and the blade edge 65 cuts off the hot-pressed adhesive tape 41 to form a thermocompression adhesive tape. 23, the knife base end 63 is again raised to the initial position, and the carrier tape cutting step is completed. As shown in Figs. 23 and 24, during the carrier cutting step, the carrier tape suction collet 13 is retracted to the retracted position. ’

After the carrier tape cutting step is completed, the carrier tape bonding step is started. As shown in step S222 of Fig. 19 and Fig. 25, the control unit 71 outputs a command to cause the carrier tape suction collet 13 to come onto the thermocompression adhesive tape piece 23 which is adsorbed and fixed to the holding substrate 35. According to this command, the servo motor mounted on the carrier tape attaching head u is operated, and the carrier tape suction chuck 13 is moved to the heat-adhesive tape 23 . In this movement, not only the movement in the χ γ direction but also the yoke direction driving mechanism 39 can move the carrier tape suction collet 13 in the ζ direction to a predetermined height position on the heat-adhesive tape carrier sheet 23. The positional control in the XY direction of the carrier tape suction collet 13 during movement is performed by the rotational position control of the servo motor mounted in the XY direction of the carrier tape bonding head 11, and the positional control in the Z direction is by the z direction. The rotational position control of the servo motor of the drive mechanism 39 is performed. After the carrier tape collet 13 is adsorbed and fixed on the holding substrate 35, the hot pressing 32 200830435 is stuck on the baffle 23, as shown in step S223 of Fig. 19, the 71 私 尸 尸 尸 , , , , , , , , The suction collet 13 is driven by the Z direction to drop the person ~ ah Fu j 9 曰 7. According to the command, the z-mechanism 39 of the tape-carrying head u is operated, and the carrier-carrying collet 13 is held toward the holding substrate = [the station-loading piece 23 is lowered. After the carrier tape suction collet 13 is lowered to the hot-pressed adhesive tape piece 23, as shown in step S224 of FIG. 19 and FIG. 26, the control unit 71 outputs the suction collet ventilating switching valve 53 shown in FIG. 】 buckle. According to the command, the suction collet ventilating switching valve 5 3 # technical portion 71 rotates the instruction to open the suction collet venting main valve 50 shown in Fig. 3. According to the instruction, the suction cylinder clamp main valve 5 is opened, the air is sucked from the vent hole 44 and the groove 4 of the adsorption surface of the carrier suction collet 13, and the carrier adsorption collet 13 adsorbs the hot-press adhesive tape. Slice 23. As shown in step S226 of Fig. 19 and Fig. 27, the control unit 71 outputs a finger _7 that switches the holding substrate vent switching valve 52 shown in Fig. 3 to the blower side. According to this command, the substrate ventilating switching valve 52 is switched to the blower side, and air is blown from the vent hole 43 and the groove 43a of the holding surface of the holding substrate 35, and the heat-adhesive tape carrier 23 is no longer adsorbed by the adsorption surface of the holding substrate 35. As shown in step S227 of Fig. 19 and Fig. 27, the control unit 71 outputs a command to raise the carrier T chuck 13 to rise. According to this command, the Z-direction drive mechanism 39 of the carrier tape attaching head i 1 operates, and the carrier tape suction cylinder clamp 3 rises in the z direction. After the carrier tape suction collet 13 is raised, as in the previous embodiment, as shown in steps S228 to S236 of Fig. 19, the carrier tape suction collet 13 is 33.

~ Load ▼ paste steps. Carrier tape adhesion Hot-pressed adhesive tape 23 Ming 谟 $ spectrum one pressure adhesive tape 23 gas total valve 48, 49, _

After the initial position, the carrier tape suction collet homing step ends. In the present embodiment, in addition to the effects similar to those of the above-described embodiment, after the step is completed, the hot-pressed adhesive tape piece 23 of the size of the suction collet can be cut and removed, and the effect of making a smaller stick can be exhibited. In the present embodiment, the vent holes 42, 43, 44 and the grooves 42a, 43a, 44a provided in the guide 33, the holding substrate 35, and the carrier tape collet 13 are respectively transmitted through the respective main valves 48, 49, 50 and each of the switching valves 51, 52, 53 are connected to the vacuum device 55 and the blower 57, and each of the vent holes 42 is opened by the opening and closing of the respective valves 48, 49, 50 and the switching valves 51, 52, 53, 43, 44 attracting, blowing, and stopping the air with each of the grooves 42a, 43a, 44a, but the air can be sucked, blown, and stopped by the respective vents 42, 43, 44 and the grooves 42a, 43a, 44a. It is not limited to the configuration of this embodiment. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing the structure of a wafer bonding apparatus according to an embodiment of the present invention. Fig. 2 is a plan view showing the construction of the wafer bonding melon which is not in the embodiment of the present invention. Fig. 3 is a view showing the structure of a wafer bonding apparatus according to an embodiment of the present invention 34 200830435 η and a control system. Fig. 4 is a plan view showing a wafer bonding crack and an explanatory view of an embodiment of the present invention. Fig. 5 is a flow chart showing the movement of the wafer bonding apparatus according to the embodiment of the present invention. Fig. 6 is an operation explanatory view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention, showing an initial state. Fig. 7 is an operation explanatory view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention, showing the tape carrier suction collet lowering and the hot pressing adhesive tape. Fig. 8 is an operation explanatory view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention, showing that the carrier tape suction chuck is used to adsorb the hot-pressed adhesive tape and the self-guided bow member is pulled up to the hot-pressed adhesive tape. Fig. 9 is a view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention, showing that the carrier tape suction chuck is attached to the heat-resistant adhesive tape and pulled out to the holding substrate. Fig. 10 is an operation explanatory view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention, showing the adsorption operation of the hot-pressed adhesive tape holding the substrate. Fig. 11 is a view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention. Fig. 11 is a view showing the operation of the wafer bonding apparatus in which the carrier tape suction chuck is lowered and adsorbed on the carrier tape suction collet to the holding substrate. Fig. 12 is an operation explanatory view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention, showing that the hot-pressed adhesive tape is cut by a cutter. Fig. 13 is a view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention. 35 Operation of 200830435 The explanatory drawing shows the upward movement of the tool to the initial position. Fig. 14 is a view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention, showing the rising operation of the carrier tape adsorption holding substrate on which the heat-pressure-adhesive tape sheet is adsorbed. Fig. 15 is a view showing the operation and operation of the wafer bonding apparatus according to the embodiment of the present invention, showing the movement of the carrier tape suction chuck to the lead frame. Fig. 16 is a view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention, showing the adhesion of the hot-pressed adhesive tape lead frame by the carrier tape suction collet. Fig. 17 is an operation explanatory view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention, showing that the suction of the carrier tape and the carrier tape suction cylinder by the carrier tape are stopped. Fig. 18 is a view showing the operation of the wafer bonding apparatus according to the embodiment of the present invention, and a plan view showing that the carrier tape suction chuck is returned to the initial position. Fig. 19 is a flow chart showing the operation of the wafer bonding apparatus according to another embodiment of the present invention. Fig. 20 is an operation explanatory view showing the operation of the wafer bonding apparatus according to another embodiment of the present invention, showing that the carrier tape suction chuck is lowered and the hot-press adhesive tape adsorbed on the carrier tape suction cylinder is adsorbed to the holding substrate. Fig. 21 is an operation explanatory view showing the operation of the wafer bonding apparatus according to another embodiment of the present invention, and shows an operation of raising the carrier tape suction chuck. Fig. 22 is an operation explanatory view showing the operation of the wafer bonding apparatus according to another embodiment of the present invention, and shows an operation of moving the carrier tape suction collet to the retracted position. 36. Fig. 23 is an operation explanatory view showing the operation of the wafer bonding apparatus according to another embodiment of the present invention, showing that the hot-pressed adhesive tape is cut by a cutter. Fig. 24 is an operation explanatory view showing the operation of the wafer bonding apparatus according to another embodiment of the present invention, showing the upward movement of the tool to the initial position. Fig. 25 is a view showing the operation of the wafer bonding apparatus according to another embodiment of the present invention. The illustration shows that the carrier tape suction chuck is moved above the heat-adhesive tape carrier which is adsorbed and fixed to the holding substrate. Fig. 26 is a view showing the operation of the wafer bonding apparatus according to another embodiment of the present invention, showing that the carrier tape is lowered, and the hot-pressed adhesive tape which is adsorbed and fixed to the holding substrate is adsorbed to the carrier adsorption tube. The action of the clip. Fig. 27 is an operation explanatory view showing the operation of the wafer bonding apparatus according to another embodiment of the present invention, showing an operation of raising the carrier tape suction chuck of the heat-adhesive pressure-sensitive adhesive tape sheet from the holding substrate. [Main component symbol description] 10 Wafer bonding device 11 Carrier tape bonding head 12 Carrier tape bonding arm 13 Carrier tape suction chuck 14 Bonding head 15 Engagement arm 16 Bonding collet 17 Frame feeder 37 200830435

18 Wafer holder 19 wafer push-up unit 20 frame loader 21 frame unloader 22 lead frame 23 hot-pressed adhesive tape piece 23a pasting position 24 semiconductor wafer 3 1 hot-pressed adhesive tape transfer device 33 guide 34a fixed guide Pin 34b Guide plate 34c Adjusting guide pin 35 Holding substrate 39 Z-direction drive mechanism 40 Carrier-attachment head table 41 Hot-pressed adhesive tape 42, 43, 44 Vents 42a, 43a, 44a Grooves 45, 46, 47 Venting piping 48 Guided venting valve 49 Maintaining the basement venting valve 50 absorbing the nipple venting total valve 51 Guided venting switching valve 38 200830435 52 Maintaining the substrate venting switching width 53 Adsorption cartridge venting switching valve 55 Vacuum device 57 Blower 60 Tool 61 Knife base End guide 63 Knife base 65 Knife edge 67 Reel 71 Control part 73 Data bus 75 Memory part 77 Carrier tape drive interface 79 Z direction drive mechanism interface 80 Knife base drive mechanism interface 81 Guided ventilation master valve interface 82 Maintaining the substrate venting total valve interface 83 Adsorption collet venting total valve interface 84 Guided venting switching valve interface 85 Maintaining substrate venting switching Interface 86 adsorption collet engagement mechanism 200 to switch the vent valve mechanism 100 the adhesive strip 39

Claims (1)

200830435 X. Patent application scope: 1_, a wafer bonding apparatus, which is provided with a hot-pressed adhesive tape piece of a predetermined size from a hot-press adhesive tape for semiconductor wafer bonding, and adheres the hot-pressed adhesive tape piece to a joint object. a carrier tape bonding mechanism and a bonding mechanism for thermally bonding the semiconductor wafer to the bonding object through the bonded pressure-sensitive adhesive tape sheet, wherein: the method comprises: guiding the thermal compression bonding along a longitudinal direction a guiding member for carrying the tape; a holding Φ substrate disposed adjacent to the guiding member and adsorbing and holding the hot-pressed adhesive tape; cutting the tool of the hot-pressed adhesive tape; adsorbing the carrier tape of the hot-pressed adhesive tape a collet; and a control unit for performing the operation control of the cutter and the carrier tape collet, and the adsorption control of the holding substrate; the control portion has: the hot pressing on the guide member adsorbed by the carrier tape suction collet a carrier tape, and pulling the length of the cutting unit to the carrier tape pulling means on the holding substrate; and absorbing and fixing the hot-pressed adhesive tape that has been pulled out to the holding substrate; a carrier tape cutting device that is cut into a hot-pressed and viscous ▼ piece by the cutter; 'transferring the hot-pressed adhesive tape piece to the joint by the carrier tape adsorption collet a carrier tape attaching means for adhering the object; and a carrier tape adsorption cylinder for homing the carrier tape adsorption collet to the guide member 40 200830435 homing means. 2. The wafer bonding apparatus of claim 1, wherein the guiding member adsorbs and holds the hot-pressed adhesive tape; the control portion performs adsorption control of the guiding member; the carrier tape adsorption means The hot-pressed adhesive tape that has been pulled out is adsorbed and fixed to the guiding member. 3. The wafer bonding apparatus according to claim 1 or 2, wherein the control unit has: • such as & when the fixed pressure-sensitive adhesive tape is cut, the carrier tape suction clamp is retracted to The tool does not collide with the carrier tape suction collet at the retracted position where the carrier is in interference with the carrier cartridge. 4. A method for cutting and pasting a hot-pressed adhesive tape for a wafer bonding apparatus, the device comprising a guiding member for guiding a thermal compression bonding tape for semiconductor wafer bonding along a longitudinal direction, adjacently disposed on the guiding member and adsorbed and held The holding substrate of the hot-pressed adhesive tape, the cutter for cutting the hot-pressed adhesive tape, and the yoke adsorption collet which adsorbs the hot-pressed _ < station load f, can cut a predetermined size from the hot-press adhesive tape The hot-pressed adhesive tape is used to adhere the hot-pressed adhesive tape to the joint object; and the method comprises: adsorbing the hot-press adhesive tape on the guide member by using the adhesive cartridge And pulling the length of the cutting unit to the carrier tape pulling step on the holding substrate in the longitudinal direction; the carrier tape adsorption step of adsorbing and fixing the hot-pressed adhesive tape that has been pulled out to the holding substrate; The hot-pressed adhesive tape is cut into a carrier tape cutting step of the hot-pressed adhesive tape 41 200830435 by the cutter; the hot-pressed adhesive tape is transferred to the joint object by the carrier tape adsorption collet Adhesive tape carrier pasting step; and causing the carrier tape to be sucked Homing collet onto the tape guide member adsorption collet homing step. 5. The method according to claim 4, wherein the guiding member adsorbs and holds the hot-pressed adhesive tape; the carrier tape adsorption step is pulled out. The hot-pressed adhesive tape is adsorbed and fixed to the guiding member. 6. The method of cutting and pasting a hot-pressed adhesive tape of a wafer bonding apparatus according to claim 4 or 5, which has the following method: when the heat-pressed adhesive tape is fixed, the carrier-carrying collet is clamped The carrier tape suction collet retraction step of retracting to the retracted position where the tool does not interfere with the carrier tape collet. 7. A recording medium in which a hot-press adhesive tape cutting and pasting program for recording a wafer bonding apparatus is provided, the device having a guide member for guiding a heat-adhesive tape for semiconductor wafer bonding along a longitudinal direction, adjacently disposed thereon a guiding member adsorbs and holds the holding substrate of the hot-pressed adhesive tape, and a cutter for cutting the hot-pressed adhesive tape; and a carrier tape adsorption collet for adsorbing the hot-pressed adhesive tape, wherein the adhesive tape can be self-adhesive Cutting a hot-pressed adhesive tape of a predetermined size to adhere the hot-pressed adhesive tape to the joint object; wherein the program has: adsorbing the heat on the guide by the carrier tape collet Press-bonding tape, pull the cutting unit length in the direction of the longitudinal direction to the carrier tape on the holding substrate 42 200830435; program the carrier tape of the holding and holding the hot-pressed adhesive tape An adsorption program; the hot-pressed adhesive tape to be fixed is cut into a carrier-cutting program of the hot-pressed adhesive tape by the cutter; and the hot-pressed adhesive tape is transferred by the carrier-carrying collet a tape carrier attaching program to the bonding object and pasted; And a carrier absorbing cartridge clamp homing program for locating the carrier tape collet to the guide. 8. The recording medium of the hot-pressed adhesive tape cutting and pasting program of the wafer bonding apparatus recorded in the seventh aspect of the patent application, wherein the guiding member adsorbs and holds the hot-pressed adhesive tape; the carrier adsorption program The hot-pressed adhesive tape that has been pulled out is adsorbed and fixed to the guiding member. 9. The recording medium of the hot-pressed adhesive tape cutting and pasting program of the wafer bonding apparatus recorded in the seventh or eighth aspect of the patent application, wherein the program* has: the heat-pressed adhesive tape which has been fixed at the cutting At this time, the carrier tape suction collet is retracted to the carrier tape suction collet retraction program in which the tool does not interfere with the carrier tape suction cylinder. ^^一,图: 如次页 43