200837353 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種旋壓蓋檢測裝置及具該裝置之 測試機台，特別是指一種用以測試半導體元件之自動化測 5 試機台。 【先前技術】BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a spinning cap detecting device and a testing machine having the same, and more particularly to an automated testing machine for testing semiconductor components. [Prior Art]
10 1510 15
在半導體元件的品管檢測過程中，為判定其好壞， 必須經由通電及輪入訊號測試，如圖i所示，係顯示傳統 測試半導體元件的測試機台3’其是包括一作為基礎之載 台3〇，在本例中，载台30上配置有數組測試埠3 1(在此 以一組為例）’以及供應待測半導體元件進入各測試埠31 及輸送測試完畢的半導體元件脫離的輸送裝置32 ;每一 測試埠31上置放有一測試電路板33，-測試電路板33 上原本安裝半導體元件之位置均分別安裝—承載待測半導 體^件的連接器基座33〇,各連接器基座別分別具有複 =電極連接料導體元件的所有對應接觸部。測 式機。3 3設置有一上下移動之機械臂肖以迫緊半導 體元件’ 1每一機械f 34底端連接一上蓋34〇。 目前的測試方法為將待測構件（即前述半導體元件）置 ^連接器基座33"，隨即將上蓋34〇下壓並如圖2所 =㈣上蓋底面341的下延部》⑷將待測半導體元件 ° ^確保其與連接器330腳位之導電連結，接著 雨入測試訊號進行的測試作業。 由於每-測試埠31都配置有一組機械臂Μ，且各測 20 200837353 試琿31均需依賴輸送裝置32，將待測半導體元件送入各 測忒埠〇 1、及輸送測試完畢的半導體元件脫離；為避免 機械# 34行進方向與輸送裝置32之空間配置發生衝突， 因此會採取彼此行進方向垂直配置之設計。㈣，測試璋 5 31沿機台的X軸方向排列，輸送裝置32沿γ方向饋入 及輸出待測元件，機械臂34則沿Ζ方向升降。 如此，不僅測試機台的機構設計無可避免地較為複 >雜，製造成本也相對較高；且因佔用空間較大，在廠房中 亦會造成生產線配置空間的利用效率降低，更進一步，影 10響受測元件的搬運動線規劃。 【發明内容】 因此，本發明之一目的，在於提供一種結構簡單的 自動化檢測裝置及測試機台。 本發明的另一目的，在於提供一種佔用體積小的自 15 動化檢測裝置及測試機台。 本發明的又一目的，在提供一種製造成本低廉的自 動化檢測裝置及測試機台。 於是，本發明之自動化檢測裝置用以供一待測半導 體兀件測試，其包括一基座、一上蓋及一致動裝置。其中 20該基座具有一可供該待測半導體元件置放之置放部；上蓋 是樞設於該基座上，並可相對於該基座呈一可供放置/取 出該待測半導體元件之開啟狀態或一用以迫緊該半導體元 件之閉5狀悲間轉動。致動裝置是用以帶動該上蓋於該開 啟狀態及該閉合狀態間樞轉。 6 200837353 本發明另提供一測試機台，其是用以供一待測半導 體件測式，5玄半導體元件具有複數導電接腳，該測試機 ^是包括—載台、—控制裝置及—運送裝置。其中該載台 是包含：至少一測試埠，該測試埠具有一測試電路板，該 5測試電路板上具有一設於其上之旋壓蓋檢測裝置，用以^ 載待測半導體元件，其中該旋壓蓋檢測裝置具有一基 座，具有一可供該待測半導體元件置放之置放部；一上 >蓋，樞設於該基座上，並可相對於該基座呈一可供放置/ 取出該待測半導體元件之開啟狀態或一用以迫緊該半導體 兀件之閉合狀態間轉動；及一致動裝置，用以帶動該上蓋 於該開啟狀態及該閉合狀態間枢轉。運送裝置則是用以供 該控制裝置控制地放置/取出該半導體元件至該置放部 處。 【實施方式】 ί5 有關本發明之前述及其他技術内容、特點與功效， 在以下配合參考圖式之數個較佳實施例的詳細說明中，將 可清楚的呈現。 如圖3至圖4所示，本發明旋壓蓋檢測裝置* 一較 佳實施例包括一基座5、一樞設於該基座一端的上蓋6、 〇以及一用以驅動該上蓋樞轉的致動裝置7。 基座5具有一頂面50，在頂面5〇上設有一用以供一 半導體元件2置放之置放部51。在置放部51内則設有多 數電極導腳500,供待測半導體元件2之接點2〇與其^ 性連接。在基座5之一側並設有一套筒52。 7 200837353 ^°又有對應於套筒52之軸桿62，用以 設於該套筒52中以可相對#其^ 用以樞 料其广< D 相對於基座5樞轉，使上蓋6相對 該基座5壬—開啟或閉合狀態。在此需說明的是，此樞 轉結：並不限於上述套筒52及軸桿… :該基座5做拇轉之等效結構皆可，由於此種抱轉結1 :知且為該領域具有-般知識者所輕易思及，在此不: M。上蓋6在相對該基座之底面6G具有—追緊部Μ， 用以於閉合狀態時可迫緊待測試半導體元件2。 ίο :閱目3並一併配合圖4’致動裝置7在本較佳實施 括一可連動該軸桿62轉動之齒輪組71及-可驅動該 齒輪組71運轉之馬達72。其中，該齒輪組η之構造可 包括複數齒輪及連接連動該等齒輪之皮帶等習知構造，在 此不再贅述；馬達72料受控制的向對應方向運轉用以 連動該齒輪組71。 _ 請再參閱圖3,當要實際進行測試作業時，首先將上 蓋6如虛線所示旋至上述開啟狀態，使用者將待測半導體 元件2放置於該基座5之置放部51中。接著該馬達η受 控制的驅動該齒輪組71轉動並連動該軸桿62轉動而使該 上蓋6由開啟狀態樞轉至蓋合狀態（如實線所示）。使上蓋 2〇 6底面60之迫緊部61以其底部迫緊該半導體元件2，使 待測半導體元件2向下迫緊，確保其與基座5中之對應接 點20導電連結，接著輸入測試訊號進行測試作業。 參閱圖5，使用本發明自動化檢測裝置4之測試機台 8，包括複數呈直線排列的測試埠3 1，，每一測試璋3丨，上 5 10 15 200837353 置放有一測試電路极 導體元件K立w仏 ，树試電路板％，上原本安裝半 V饈兀仵之位置均分別…文衣千 化檢測裝置4(如圖3所示）、。冑待測半導體元件的自動 在該等測試埠3 1，a | ,n 則方一適當距離處並設有一略呈平 爾運8〇,供—機械臂81可受一 ：：+ 沿軌這80往復位移。在 工制地 盔允人老 本只鈿例中’該控制裝置82例如 為一内含處理器之計曾例* 、 π機衣置，可根據内建程式進行運算 處理’以輸出對靡指八一 ^ ·"*' 7或貧料對該機械臂8丨 程及位置等進行對應的控制。 1 乍動订 皮實際操作時，機械臂81首先受控制裝置82致動， 依序運达待測半導體元件至對應之測試埠3自 測裝置4基座中，一供夂朗同。 + ^ 一 … 併荼閱圖3,此時上蓋6是如虛線所 不位於上述之開啟狀態，以容許待測半導體元件2放置至 基座40之置放部中。接著，由馬達^受控制的驅動齒輪 組^轉動並連動軸桿62轉動而使上蓋6由開啟狀態拖轉 至蓋合狀態（如實線所示），使待測半導體元件2進入受測 狀態。 當然，如熟於此技術者所能輕易理解，測試埠之排 列配置並非侷限於前一實施例，如圖6本案另一較佳實施 例所示，其與前一實施例主要不同處在於：多組測試蜂 31”是呈環狀排列，使測試機台9略呈圓形，機械臂81則 没置於測試機台9中央’並可受控制地旋轉用以放置/取 出半導體元件。 由於上述構造中’上蓋僅需作一簡單的旋動，無須 20 200837353 如習知結構，藉由機械臂連動上蓋而佔用莫 機台之體積獲得大幅縮減；I因結使得 =大為降低。尤其，如前述實施例所示製 二間而求设置成直線排列或環狀 β視 5 10 η取出/放置半導體元件2,因此，精由機械臂 u此，較傳統的測試機A 配置更具彈性，從而達成本案之所有目的。 σ 惟以上所述者，僅為本發明之較佳實施例而已當 不能以此限定本發明實施之範圍，即大凡依本發明申請I 利範圍及發明說明内容所作之簡單的等效變化與修飾吻皆 仍屬本發明專利涵蓋之範圍内。 白 【圖式簡單說明】 圖1是習用測試機台之部分結構示意圖； 圖2是一平面示意圖，說明圖〗中的機械臂下壓迫 緊一待測半導體元件； 圖3是一結構示意圖，說明本發明自動化檢測裝置 一較佳實施例； 圖4是一平面示意圖，說明圖3自動化檢測裝置中 的樞轉結構； 圖5是一平面示意圖，說明設置有多數本發明檢測 20 裝置之一測試機台；及 圖6是一平面示意圖，說明本發明測試機台的另一 較佳實施例。 10 200837353 【主要元件符號說明】 2...元件 4...檢測裝置 5、330…基座 6、340…上蓋 7...致動裝置 5 20…接點 30…載台 31、3Γ...測試埠 32…輸送裝置 33、33’…測試電路板 • 34、81...機械臂 50...頂面 5 1...置放部 52…套筒 10 60、341…底面 61...迫緊部 6 2…轴桿 71...齒輪組 7 2...馬達 8、9...測試機台 80...軌道 82...控制裝置 330...連接器 342…下延部分 15 500…電極導腳 11In the quality inspection process of the semiconductor component, in order to judge whether it is good or bad, it is necessary to pass the power-on and turn-in signal test. As shown in FIG. i, the test machine 3' showing the conventional test semiconductor component is included as a basis. In the example of the stage, the stage 30 is provided with an array test 埠 31 (here, a group is taken as an example), and the semiconductor element for supplying the semiconductor element to be tested enters each test 埠 31 and the semiconductor element for the transfer test is detached. The conveying device 32; a test circuit board 33 is placed on each of the test pads 31, and the positions of the test circuit board 33 on which the semiconductor components are originally mounted are respectively mounted - the connector bases 33 carrying the semiconductor components to be tested, each The connector bases each have all of the corresponding contacts of the complex=electrode connection conductor elements. Measuring machine. 3 3 is provided with a mechanical arm that moves up and down to force the semiconductor element '1' to connect a top cover 34〇 to the bottom end of each mechanical f 34 . The current test method is to place the member to be tested (ie, the aforementioned semiconductor component) on the connector base 33", and then press the upper cover 34〇 and press the lower portion of the bottom surface 341 of the upper cover as shown in Fig. 2 (4) to be tested. The semiconductor component ° ^ ensures that it is electrically connected to the pin of the connector 330, and then rains into the test operation of the test signal. Since each test 埠 31 is provided with a set of mechanical arm Μ, and each test 20 200837353 test 珲 31 depends on the transport device 32, the semiconductor component to be tested is sent to each test 1, and the tested semiconductor component is transported. In order to avoid the collision of the direction of travel of the machine #34 with the space configuration of the conveying device 32, a design in which the directions of travel are perpendicular to each other is adopted. (4) The test 璋 5 31 is arranged along the X-axis direction of the machine table, the conveying device 32 feeds and outputs the component to be tested in the γ direction, and the mechanical arm 34 moves up and down in the Ζ direction. In this way, not only the mechanical design of the test machine is inevitably complicated, but also the manufacturing cost is relatively high; and because of the large occupied space, the utilization efficiency of the production line configuration space is also reduced in the factory building, and further, Shadow 10 sounds the moving line plan of the tested component. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an automated detection device and test machine having a simple structure. Another object of the present invention is to provide a self-contained detection device and a test machine having a small footprint. Still another object of the present invention is to provide an automatic detecting device and a testing machine which are inexpensive to manufacture. Therefore, the automatic detecting device of the present invention is used for testing a semiconductor component to be tested, which comprises a base, an upper cover and an actuating device. Wherein the base has a receiving portion for the semiconductor component to be tested; the upper cover is pivotally mounted on the base, and the semiconductor component to be tested is placed and removed relative to the base The open state or a closed 5-shaped inter-segment rotation for pressing the semiconductor element. The actuating device is configured to drive the upper cover to pivot between the open state and the closed state. 6 200837353 The present invention further provides a testing machine for supplying a semiconductor component to be tested, wherein the 5th semiconductor component has a plurality of conductive pins, and the testing machine comprises a carrier, a control device, and a carrier. Device. Wherein the stage includes: at least one test pad, the test pad has a test circuit board having a spin cover detecting device disposed thereon for loading the semiconductor component to be tested, wherein The spinning cap detecting device has a base having a receiving portion for the semiconductor component to be tested; an upper cover is pivoted on the base and can be presented with respect to the base An opening state of the semiconductor component to be tested or a rotation between the closed states for pressing the semiconductor component; and an actuating device for driving the upper cover to pivot between the open state and the closed state . The transport device is for the control device to controlly place/remove the semiconductor component to the placement portion. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. As shown in FIG. 3 to FIG. 4, a preferred embodiment of the present invention comprises a base 5, an upper cover 6 pivoted at one end of the base, and a pivot for pivoting the upper cover. Actuating device 7. The susceptor 5 has a top surface 50 on which a placement portion 51 for placing a semiconductor component 2 is disposed. In the placing portion 51, a plurality of electrode lead pins 500 are provided for the contacts 2 of the semiconductor element 2 to be tested to be connected thereto. A sleeve 52 is provided on one side of the base 5. 7 200837353 ^° There is a shaft 62 corresponding to the sleeve 52 for being disposed in the sleeve 52 so as to be pivotable relative to the base 5 to pivot the upper cover 6 with respect to the base 5 - open or closed state. It should be noted that the pivoting knot is not limited to the sleeve 52 and the shaft. The base 5 can be used as the equivalent structure of the thumb, because the clutch 1 is known and The field is easy to think of by the general knowledge, here is not: M. The upper cover 6 has a catching portion 相对 opposite to the bottom surface 6G of the base for pressing the semiconductor component 2 to be tested in the closed state. Ίο: Reading 3 and FIG. 4' with the actuating device 7 in the preferred embodiment includes a gear set 71 that can rotate the shaft 62 and a motor 72 that can drive the gear set 71 to operate. The configuration of the gear set η may include a plurality of gears and a conventional structure such as a belt connecting the gears, and the details are not described herein; the motor 72 is controlled to operate in a corresponding direction for interlocking the gear set 71. _ Referring to FIG. 3, when the actual test operation is to be performed, the upper cover 6 is first rotated to the above-mentioned open state as indicated by a broken line, and the user places the semiconductor component 2 to be tested in the placement portion 51 of the susceptor 5. Then, the motor η is controlled to drive the gear set 71 to rotate and interlock the shaft 62 to rotate to pivot the upper cover 6 from the open state to the closed state (as indicated by the solid line). The pressing portion 61 of the bottom surface 60 of the upper cover 2〇6 presses the semiconductor element 2 with its bottom portion, and the semiconductor element 2 to be tested is pressed downward to ensure that it is electrically connected with the corresponding contact 20 in the base 5, and then input. Test the signal for the test operation. Referring to FIG. 5, a test machine 8 using the automatic detecting device 4 of the present invention includes a plurality of test 埠 3 1, which are arranged in a line, and each test 璋 3 丨, upper 5 10 15 200837 353 is placed with a test circuit pole conductor element K Li w仏, the tree test board%, the original installation of the half V馐兀仵 position are respectively... Wenyi Qianhua detection device 4 (shown in Figure 3).自动 The semiconductor component to be tested is automatically at the appropriate distance 该3 1, a | , n at a suitable distance and is provided with a slightly flat shovel 8 〇, for the mechanical arm 81 to receive a :: + along the rail 80 reciprocating displacement. In the case of a factory helmet, the control device 82 is, for example, a processor containing a processor*, a π machine, and can be operated according to a built-in program to output a pair of fingers. Bayi ^ ·"*' 7 or poor material controls the robot arm 8 stroke and position. 1 When the actual operation of the squeegee is performed, the robot arm 81 is first actuated by the control device 82, and sequentially transports the semiconductor component to be tested to the pedestal of the corresponding test 埠3 self-test device 4, one for the same. + ^ a ... and referring to Fig. 3, at this time, the upper cover 6 is not in the above-described open state as a broken line to allow the semiconductor element 2 to be tested to be placed in the placement portion of the susceptor 40. Then, the driving gear set controlled by the motor is rotated and the shaft 62 is rotated to cause the upper cover 6 to be pulled from the open state to the closed state (as indicated by the solid line), so that the semiconductor component 2 to be tested enters the state to be tested. Of course, as is well understood by those skilled in the art, the arrangement of the test cartridges is not limited to the previous embodiment. As shown in another preferred embodiment of the present invention, the main difference from the previous embodiment is that: The plurality of sets of test bees 31" are arranged in a ring shape so that the test machine table 9 is slightly rounded, and the mechanical arm 81 is not placed in the center of the test machine 9' and can be controlled to rotate for placing/removing semiconductor components. In the above structure, the upper cover only needs to be simply rotated, and it is not necessary to use the structure of 2008. The structure of the machine is greatly reduced by interlocking the upper cover with the mechanical arm; I is greatly reduced due to the knot. As shown in the foregoing embodiment, the two devices are arranged to be arranged in a straight line or in a ring shape, and the semiconductor element 2 is taken out/placed. Therefore, the mechanical arm is more flexible than the conventional test machine A configuration. Therefore, all the objects of the present invention are achieved. σ 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Simple equivalent changes and modified kisses are still covered by the patent of the present invention. White [Simple description of the drawings] Figure 1 is a partial schematic view of a conventional test machine; Figure 2 is a schematic plan view of the figure The mechanical arm is pressed down to press a semiconductor component to be tested; FIG. 3 is a schematic structural view showing a preferred embodiment of the automatic detecting device of the present invention; FIG. 4 is a schematic plan view showing the pivoting structure in the automatic detecting device of FIG. 5 is a plan view showing a test machine provided with a majority of the test 20 devices of the present invention; and FIG. 6 is a plan view showing another preferred embodiment of the test machine of the present invention. 10 200837353 [Main component symbol description 2...Component 4...Detection device 5,330...Base 6,340...Upper cover 7...Actuation device 5 20...Contact 30...Tack 31, 3Γ...Test埠32...Transport Device 33, 33'...test circuit board 34,81...mechanical arm 50...top surface 5 1...placement portion 52...sleeve 10 60,341...bottom surface 61...tightening portion 6 2...shaft 71...gear set 7 2...motor 8,9...test Machine tracks 80 ... 82 ... 330 ... connected to the control device 342 ... 15500 ... extension part of the electrode 11 the leads