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TW200834081A - Assembly for controlling the horizontal level of an electrical tester, electrical tester having the assembly, and method of controlling the horizontal level of an electrical tester using the assembly - Google Patents

Assembly for controlling the horizontal level of an electrical tester, electrical tester having the assembly, and method of controlling the horizontal level of an electrical tester using the assembly

Info

Publication number
TW200834081A
TW200834081A TW097105022A TW97105022A TW200834081A TW 200834081 A TW200834081 A TW 200834081A TW 097105022 A TW097105022 A TW 097105022A TW 97105022 A TW97105022 A TW 97105022A TW 200834081 A TW200834081 A TW 200834081A
Authority
TW
Taiwan
Prior art keywords
assembly
substrate
electrical tester
horizontal level
controlling
Prior art date
Application number
TW097105022A
Other languages
Chinese (zh)
Other versions
TWI355496B (en
Inventor
Jun-Tae Hwang
Bae-Hwan Kim
Original Assignee
Phicom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phicom Corp filed Critical Phicom Corp
Publication of TW200834081A publication Critical patent/TW200834081A/en
Application granted granted Critical
Publication of TWI355496B publication Critical patent/TWI355496B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
    • F16B5/02—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of fastening members using screw-thread
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • H10P74/27—

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

An electrical tester includes a first substrate, a second substrate and an assembly for controlling the horizontal level of the first substrate. The first substrate has a first face making contact with an object, and a second face opposite to the first face. The second substrate is arranged to face the second face of the first substrate. The assembly is inelastically combined between the first substrate and the second substrate. Thus, the horizontal level of the first substrate may be readily controlled by adjusting the inelastic combination between the first substrate and the second substrate.
TW097105022A 2007-02-13 2008-02-13 Assembly for controlling the horizontal level of a TWI355496B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070014714A KR100862887B1 (en) 2007-02-13 2007-02-13 Flatness control assembly, electrical inspection apparatus comprising the same and flatness control method using the same

Publications (2)

Publication Number Publication Date
TW200834081A true TW200834081A (en) 2008-08-16
TWI355496B TWI355496B (en) 2012-01-01

Family

ID=39690244

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097105022A TWI355496B (en) 2007-02-13 2008-02-13 Assembly for controlling the horizontal level of a

Country Status (3)

Country Link
KR (1) KR100862887B1 (en)
TW (1) TWI355496B (en)
WO (1) WO2008100053A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6590840B2 (en) * 2014-03-06 2019-10-16 テクノプローベ エス．ピー．エー． High flatness probe card for electronic device test equipment
TWI551844B (en) * 2015-06-26 2016-10-01 創意電子股份有限公司 Brightness calibration method and optical detection system
KR101951254B1 (en) * 2017-06-19 2019-02-22 리노공업주식회사 A probe card
KR102855297B1 (en) 2020-11-24 2025-09-03 현대자동차주식회사 Manufacturing method of support for catalyst of fuel cell

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100984769B1 (en) * 2003-12-12 2010-10-01 동부일렉트로닉스 주식회사 Flatness adjustment of the head plate of the prober system
KR100603513B1 (en) * 2004-09-15 2006-07-20 임현철 Electrode device of high frequency heat therapy
KR200380247Y1 (en) 2005-01-06 2005-03-29 주식회사 유림하이테크산업 Probe card for testing semiconductor
KR100675487B1 (en) * 2005-06-02 2007-01-30 주식회사 파이컴 Probe card

Also Published As

Publication number Publication date
TWI355496B (en) 2012-01-01
KR20080075607A (en) 2008-08-19
WO2008100053A1 (en) 2008-08-21
KR100862887B1 (en) 2008-10-13

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