TW200822821A - Method for fabricating punch type leadless IC packages - Google Patents

Abstract

Disclosed is a method for fabricating punch type leadless IC packages. Basically, on a leadframe, a plurality of chip are disposed, electrical connection, and a plurality of encapsulants. Next, a half-punching step is performed prior to a plating step. Therein, a plurality of indentations are created in a plurality of lead of the leadframe along the outer sides of the encapsulants. And then, a plated layer is formed in the indentations. Finally, a full punching step is performed to cut off the leads along the indentations to separate the encapsulants. By the half-punching step before the plating step, the method will solve conventional problems of cracking, dropping-off, and burr of the leads caused during the full punching step, and also increase plated area of the leads.

Description

200822821 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to singulation of semiconductor packaging technology, and more particularly to a method of manufacturing a punching type. .,,, and external pin package construction [Prior Art] In the current semiconductor package manufacturing technology, it is quite common and consistently to integrate a plurality of carrier units on a substrate for a packaging process. After most of the packaging process is completed, the cell separation is performed to separate a plurality of semiconductor package structures. For example, using a lead frame as a US material to make an external lead-free package structure (leadless IC handsome (4) is also: This is the final separation of the monomer at the end of the process. The known separation type has no external pin seal structure can enter - What is punehing t (four) and sawing type. In the blanking type external package structure, a plurality of (four) systems are formed separately, and the method of punching the lead frame (4) can be achieved. The effect of the monomer ^° is _ type is that the sealant continuously covers all the carriers, and the single-page, ancient, and singular sawing cutter cuts the sealant and the pin at the same time, which affects the wear of the cutter. It is large and time consuming. The first figure does not have a conventional punching type external lead package structure which is separated by a single action, and the lead frame 110 is fixed on a table 11 of a punching device. The squeegee and the squeegee are cut into 12 times, and the lead 1 of the lead frame 110 is cut off, and the sealing body 130 of the pre-cut shape is not used. Referring to FIG. 2,

The conventional ramming type I ..., 1 " 5 foot package structure 100 mainly comprises a portion of the lead frame 110, a day 120, and a gel 13 〇. The wafer 12 is placed on the lead frame 110 and electrically connected to the pins ill by a plurality of bonding wires 121. The encapsulant forms the encapsulant 130, which seals the wafer 12 and bonds the pins 1 1 i, but the upper surface of the pins u should be slightly exposed for punching. The surface under these pins must also be exposed for surface bonding. Before the blanking, a plating layer 14 is formed on the upper surface and the lower surface of the pins to avoid rusting of the pins and to facilitate soldering.

Pick up. However, as shown in FIG. 1, in the conventional blanking process, the punching force of the punching knife U on the pins 111 causes the pin 1U to be easily peeled off by the sealing body 130, and even falls. occur. Further, as shown in Fig. 2, there is a burr phenomenon on the punched faces of the pins 111, which easily scratches the human body or electronic components. SUMMARY OF THE INVENTION The main object of the present invention is to provide a manufacturing method of a blanking type external lead package structure, which is used to solve the problem that a conventional one-way blanking process causes a blanking type external lead package structure. Problems such as peeling, falling and burrs of the foot can improve the process yield and increase the plating area of the pins. The object of the present invention and solving the technical problems thereof are mainly achieved by the following technical solutions. SUMMARY OF THE INVENTION In accordance with the present invention, a method of manufacturing a blanking type outer legless skirting structure is disclosed. First, a lead frame having a plurality of carrier units is provided, each of which is formed with a plurality of (10), and a dambar is formed between adjacent carrier units. A plurality of wafers are then placed to the leadframe and the wafers are electrically connected to the pins in a suitable manner. Thereafter, a plurality of encapsulants are separately formed on the corresponding carriers: to combine the pins but to expose the plugging rods. After the sealant, enter = 6 200822821 Half-punching step, forming a plurality of semi-recessed openings along the periphery of the sealant on the pins. Thereafter, an electrical process is performed to form an "electrode ore layer" on the pins that includes the exposed surfaces of the semi-concave notches. Finally, a full blanking step is performed to cut the pins along the semi-concave notches and separate into individual encapsulants. Another disclosure of the blanking type external lead package made by the above process

In the aforementioned manufacturing method, the upper surface of the pins. The semi-recessed portions may be formed on the lower surface of the pins in the foregoing manufacturing method. The semi-recessed openings can be formed in the aforementioned manufacturing method, and the wires are electrically connected to the pins. In the foregoing manufacturing method, the thickness of the one-half to two-half of the thickness of the pins may be about the same as in the foregoing manufacturing method.

Forging or electrolytic key. The system is a chemical power. In the aforementioned manufacturing method, the electrical fault, tin Μ, is one of them. In the first embodiment of the present invention, the 3G diagram reveals a blanking type without external pins, and the reference to the third to fourth figures is made in the process. A manufacturing method of a package structure, first, as shown in Figs. 3A and 4, a schematic view of the top and bottom surfaces. The wire frame 210 has a plurality of carrier units 2^: lead frame 210, the guide

'Each body unit 2l〇A 7 200822821 is formed with a plurality of pins 211, and a blocking rod 212 is formed between adjacent carrier units 21〇a to connect the pins. 211. In this embodiment, at least one wafer holder 213 may be additionally formed in each of the carrier units 210A. Generally, the lead frame 210 is made of an all-metal material and has a thickness of about 〇.2 house meters (mm). However, the pins 211 do not have the length of a conventional I, j or seagull-shaped outer pin. Each pin 211 has an upper surface 211A and a lower surface 2 11B. As shown in FIG. 3B, a plurality of wafers 220 are disposed to the leadframe 210, and one of the wafers 22 can be adhered to the wafer holders 213 of the leadframe 210 by a known die bonding technique. In addition, in different types of lead frames, the pins are also available for die bonding. The wafers 220 are electrically connected to the pins 211. As shown in Fig. 3c, a plurality of bonding wires 22 are formed by a wire bonding technique, and the wafers 220 are electrically connected to the upper surface 211A of the pins 2 through the bonding wires 221. In addition, the electrical interconnection of the wafer 220 and the lead frame 21 can be achieved by techniques such as internal pin bonding and flip chip bonding. Thereafter, as shown in Fig. 3D, a stamper, a printing or dispensing method 212 can be utilized. In other words, each carrier 210A, with a knot

220, sealing the pins 211 to form a plurality of sealing bodies 230 to correspond to the plurality of pins 211 but exposing the blocking rods 2^2. In other words, the unit 210A can correspond to a sealant 23〇. The ? 蚵 corresponds to a large portion of the upper surface 211 of the wafer on the carrier unit 210A. However, in the embodiment of the present invention, the wire rod 21G blocking rod 212, the pin 2 ι 211B, the lower surface of the cymbal holder 213, and the upper surface 2 11A of the pin 211 are not sealed. The colloid is covered by 23 inches. As shown in Fig. 3E, a half-punching step is performed after the formation of the sealant 23 is formed. The lead frame 21 is fixed to the stage of the punching apparatus. A plurality of semi-concave notches 211C are formed on the outer circumferences of the plurality of punching knives 22 along the outer periphery of the encapsulants, and it is noted that

The semi-recessed notch 2iic formed after the half-punching process is not limited in shape and may be concave or U-shaped or other geometric shapes. In the embodiment, the two semi-recessed notches 211C are formed on the upper surface 211A of the pins 211. The recesses, 1 1 r , <n? a notch 21 lc have a depth of about one-tenth of the thickness of the pins 211. That is, the pins 211 cannot be cut in the half-punching step to facilitate plating. As shown in Fig. 3F, a plating step is performed which forms a plating layer 2: the pins 211 include the semi-concave notches 2uc exposed surfaces. In the embodiment of the present invention, the pins 211 are available for the plating layer 240 to form an exposed surface comprising the plugging rod 212 exposed outside the sealing bodies 230, the lower surface 2UB of the pin 211, and the wafer holder. The lower surface of 213 and some of the upper surface 2ua and the semi-recessed notch 2iic of the pin 211. In addition, the electrical forging step can be chemical electricity (four) is other ways of electrolytic electricity. The material of the electroplating crucible 240 may be selected from one of tin, tin-hetero, and tin. Finally, as shown in the figure, a full blanking step is performed, and the lead frame 2 1 which is sealed by electroplating is fixed on the stage 3 1 of another punching device, and the stage has a punching channel to provide The full stroke of the punching knife 32. And the 200802221 uses the punching knives 32 to cut the pins 211 along the semi-recessed notches 211C to separate into individual sealing bodies 230. In this embodiment, the pins 211 are combined with the sealing bodies 230 to be separated from the blocking rods 212. The invention is not limited to the type of blanking apparatus'. The blanking apparatus used in the half blanking step and the full blanking step may be the same or different. As shown in Fig. 5, a plurality of punching types can be obtained by the full blanking step.

The outer lead package structure 200 is implemented by the above-described half blanking step between the sealing step and the plating step and before the full blanking step to reduce the bonding position of the pin 211 and the sealing body 23 when the full blanking step is performed. Destructive punching stress. Therefore, it is possible to prevent the pins 211 from being cracked at the interface with the sealing body 23, and there is no problem that the pin is peeled off and the pins are dropped due to the I-known full-punching, and the 5-foot burrs are further solved. problem. Moreover, as shown in Fig. 6, the electric money layer _ in the semi-recessed notch 211C can increase the plating area of the pin 2 ιιι: cut side edge in the product 'reduce the rust of the pin 2 ι and the butt welding of the plate The bonding ability of the ball or solder paste. In the first embodiment of the present invention, the above-mentioned two-stage punching method is also disclosed, and the punched type external lead package structure is formed. For example, the fifth and the field of the punched external lead package structure 2 〇〇 mainly include a plurality of pins 211, a y ... conductor - an electric ore layer 240. Every _ cited day. a first body 230 and a first two-section blank formed on the outside of the sealant have a first face 2: a face 2UD and a second face 211E' 211 Γ The sidewall of one of the semi-recessed notches 211C formed by the half-punching step is covered by the dry space (as shown in the second figure of FIG. 3E) and is not covered by the second layer 211E of the plating layer 240 by the aforementioned full-blown 200822821 The exposed end face of the pin formed by the cutting step. In this embodiment, the first slice 211D of the pins 2 ι is connected to the upper surface 2nA of the corresponding pin 211. In a different embodiment, the first slice 211D of the pins 211 may also be connected to the lower surface of the corresponding pin 211. The wafer 220 is disposed on the wafer holder 213 of the lead frame 210 and electrically connected to the pins 211 by a wire bonding technique or a flip chip bonding method for forming a plurality of bonding wires 221 . The encapsulant 230 is formed on the lead frame 21A and joined to the pins 2ι. Preferably, the pins 211 may also have a surface 211A and a lower surface 2ΠΒ slightly protruding from the side of the sealing body 23〇. The plating layer 240 is formed on at least the first cut surface 2UD of the pins 211, and may be formed on the upper surface 211 of the pin 211 slightly protruding from the side of the sealant 230. Surface 211B and the lower surface of wafer holder 213. In a second embodiment of the invention, another method of fabricating a blanked external lead package construction is disclosed. The packaging steps before the half-punching step, such as lead frame supply, die bonding and encapsulation, etc., are substantially the same as in the first embodiment, and will not be described again. After that, half the punching step is performed. As shown in FIG. 7A, before the half-punching step, a plurality of wafers 320 are disposed on a lead frame 31A, and are electrically connected to the plurality of pins η of the lead frame 31 by a plurality of bonding wires 321! . A sealant 330 is formed on the corresponding carrier unit of the lead frame 31 to bond the pins 311 but expose the plurality of plug bars 312 of the lead frame 31. In the semi-punching step, the lead frame 31 can be reversely fixed to the stage 31 of a punching device, and a plurality of punching blades 42 are used to form a plurality of outer peripheral edges 331 along the sealing bodies 33. The semi-recessed notch 311C is on the pins 311. In the embodiment of the present invention, the lead frame - ▼, the hard stone: Μ, the meat 13⁄4 flat recessed notch 311C is formed on the lower surface sub of the pins 311. As shown in FIG. 7B, an electro-recording step is performed after the half-punching, which forms an electric clock layer 340, and the pins 311 include the exposed surfaces of the semi-concave notches, that is, the pins 311 Part of the upper surface 3UA, the lower surface Ha, and the semi-recessed notches 311C. As shown in FIG. 7C, a full blanking step is performed, and the lead frame 31 can be placed in the positive direction on the stage 51 of the punching apparatus, and the plurality of punching blades 52 are used along the semi-recessed notches. The pin buckles are cut and separated into individual sealants 330. Therefore, the semi-concave notch of the present invention can be formed on the upper surface or the lower surface of the lead to solve the ice plume A 丄 white. This solution causes the punching type without external lead package fabrication in the process of early-stage blanking > a series of pin peeling, drop and burrs, etc. _, 曰 to improve the process yield, but also increase the plating area of the pin. The present invention is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the preferred embodiments as the invention Any changes and modifications made by the invention within the scope of the invention are covered by the technical scope of the present invention. [Simple diagram of the diagram] Figure 知 shows the schematic diagram of the cross-section of the blanking package structure when punching out. Fig. 2 is a schematic cross-sectional view showing a conventional punched-out external lead package structure. 3Α to 3G图: According to the first embodiment of the present invention, the cross-sectional illustration of the blanking and packaging structure in the manufacturing process t 12 200822821. Fig. 4 is a top plan view of a lead frame used in the blanking type of the agricultural structure according to the present invention. Figure 5 is a cross-sectional view showing the blanked outer package structure in accordance with a first embodiment of the present invention. Figure 1 is a side elevational view of the blanked outer lead package construction in accordance with a first embodiment of the present invention. 7A to 7C are cross-sectional views showing another blanking type outer package structure in the two blanking steps of the manufacturing process in accordance with the second embodiment of the present invention. [Description of main component symbols] 11 Stage 12 Punching knife 21 Stage 22 Punching knife 31 Stage 32 Punching knife 41 Stage 42 Punching knife 51 Stage 52 Punching knife 100 Blanking type external lead package Structure 110 Lead frame 111 Pin 120 Wafer 121 Bond wire 130 Sealant 140 Plating layer 2 〇〇 Blanking no external lead package structure 210 Lead frame 210 Α Carrier unit 211 Pin 211 Α Upper surface 211 Β Lower surface 211C Semi-recessed notch 211D The first surface 211 Ε second cutting surface 13 200822821 212 blocking rod 220 wafer 230 sealing body 240 plating layer 310 lead frame 3 11B lower surface 312 blocking rod 320 wafer 330 sealing body 340 plating layer 213 wafer bearing 221 welding line 231 outer circumference Edge 311 pin 311C semi-recessed notch 321 bonding wire 331 outer peripheral edge 311A upper surface

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Claims (1)

200822821 Patent application: The manufacturing method of β-type punching type: The f-wire frame is provided, and the f-frame is provided. The ❹(4) element is formed with a plurality of pins; the warfare is early: a plurality of wafers are The lead frame 'electrically connects the wafers to the pins; : forming a plurality of sealing bodies on the cutting unit to combine the pins; Φ In the case of the eccentric recessed/middle cutting step, a plurality of + concave notches are formed on the outer edges along the outer circumference of the sealing body; an electroplating step is performed to form a smear-dip notch exposed surface 丄-semi-full blanking The steps are separated into individual sealants along the semi-recesses. - Bowing, 2, as in the manufacturing scope of the patent application, the punching type without external lead package is formed by the rod between the adjacent carrier units - block:, wide) The sealant is formed by exposing the punched type of externally sealed pin-shaped structure according to the above-mentioned method, wherein the semi-concave notches are formed in the chatter As described in the scope of claim 1, the manufacturing and manufacturing of the vehicle U has no outer lead package structure. The f-four missing system is formed on the pins 5, as in the manufacturing method of the patent application scope i, wherein the cymbal H is a package structure, and the two dies are electrically connected by a plurality of bonding wires. 200822821 Connect to these pins. 6. The manufacturing method of the patent application scope is as follows: wherein: the thickness of the 1-foot package is one-third to one-half. A lame foot 7. The manufacturing method of the punching type described in item (i) of the fourth item, wherein the above-mentioned key step is chemical electroplating. ^矿 or 8, as in the scope of the patent application, the manufacturer of the *Ganshi 4 Τ 式 无 无 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚 引脚. Private tin - 9, a punched external lead package structure, including a plurality of pins of the lead frame 'each pin is punched to form a first slice and a second slice; In two stages: two turns are placed on the lead frame and electrically connected to the leads; and 〃, /, is formed on the lead frame and combined with the bows; the 〆 plating layer, which is at least The first type of the first aspect is connected to the lower surface of the corresponding pin, as described in the ninth aspect of the invention. . 11. If the towel (4) Fan® item 9 has no outer (10) sealing edge, the first cutting surface is connected to the upper surface of the corresponding pin. 12. The blanking type external lead package structure as described in claim 9 wherein each of the leads has a slight protrusion on a side surface of the sealant. 16 200822821 ~, r萩 type external lead package structure 'where the electric ore layer is also formed on the protruding upper surface of the pins. 14. The method of claim 9, wherein the wafer is electrically connected to the pins by wire bonding or flip chip bonding. 15. The punching type of the outer casing described in the above-mentioned patent application (4), wherein the lead frame has a wafer holder for the wafer. Further, a blanking type external lead structure according to the fifteenth aspect of the invention, wherein the plating layer is formed on a lower surface of the wafer holder. 17. A method of manufacture as claimed in claim 1 of the patent application. The trim type has no external lead package construction. ^冲冲 17