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TW200822119A - Method and system for reverse reading in non-volatile memory with compensation for coupling - Google Patents

Method and system for reverse reading in non-volatile memory with compensation for coupling Download PDF

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Publication number
TW200822119A
TW200822119A TW96135144A TW96135144A TW200822119A TW 200822119 A TW200822119 A TW 200822119A TW 96135144 A TW96135144 A TW 96135144A TW 96135144 A TW96135144 A TW 96135144A TW 200822119 A TW200822119 A TW 200822119A
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TW96135144A
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TWI356417B (en
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Nima Mokhlesi
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Sandisk Corp
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Priority claimed from US11/537,556 external-priority patent/US7447076B2/en
Priority claimed from US11/537,548 external-priority patent/US7684247B2/en
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5621Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
    • G11C11/5628Programming or writing circuits; Data input circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5621Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
    • G11C11/5642Sensing or reading circuits; Data output circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0483Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/34Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
    • G11C16/3418Disturbance prevention or evaluation; Refreshing of disturbed memory data

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Read Only Memory (AREA)

Abstract

Shifts in the apparent charge stored by a charge storage region such as a floating gate in a non-volatile memory cell can occur because of electrical field coupling based on charge stored in adjacent (or other) charge storage regions. Although not exclusively, the effects are most pronounced in situations where adjacent memory cells are programmed after a selected memory cell. To account for the shift in apparent charge, one or more compensations are applied when reading storage elements of a selected word line based on the charge stored by storage elements of other word lines. Efficient compensation techniques are provided by reverse reading blocks (or portions thereof) of memory cells. By reading in the opposite direction of programming, the information needed to apply (or select the results of) an appropriate compensation when reading a selected cell is determined during the actual read operation for the adjacent word line rather than dedicating a read operation to determine the information.

Description

200822119 九、發明說明: 【發明所屬之技術領域】 本揭示内容之具體實施例係關於非揮發性記憶體技術。 【先前技術】 半‘體§己憶體裝置已經越來越普遍地用於各種電子裝 置。例如,非揮發性半導體記憶體用於蜂巢式電話、數位 相機、個人數位助理、行動計算裝置、非行動計算裝置及 其他裝置。電可抹除可程式化唯讀記憶體(EEPr〇m)(包括 快閃EEPROM)與電子可程式化唯讀記憶體(epr〇m)係屬於 最流行的非揮發性半導體記憶體。 一種快閃記憶體系統之範例使用NAND結構,其包括在 二個選擇閘極之間串聯配置多個電晶體。該等串聯電晶體 及t»亥荨k擇閘極稱為一 NAND串。圖1係顯示一 NAND串之 一俯視圖。圖2係其一等效電路。圖所示之NAND串包 括在一第一選擇閘極12與一第二選擇閘極22之間串聯的四 個電晶體10、12、14及16。選擇閘極12將該NAND串連接 至位元線端子26。選擇閘極22將該NAND串連接至源極線 端子28。選擇閘極12係藉由經由選擇線Sgd施加適當電壓 至控制閘極20CG來加以控制。選擇閘極22係藉由經由選 擇線SGS施加適當電壓至控制閘極22CG來加以控制。各電 晶體10、12、14及16皆包括一控制閘極與一浮動閘極,其 形成一記憶體單元之閘極元件。例如,電晶體1〇包括控制 閘極10CG及浮動閘極1〇FG。電晶體12包括控制閘極12Cg 與一 于動閘極12FG。電晶體14包括控制閘極14CG與浮動 124907.doc 200822119 閘極14FG。電晶體16包括一控制閘極16C:C}與一浮動閘極 16FG。控制閘極i〇cg係連接至字線WL3,控制閘極12CG 係連接至字線WL2,控制閘極14〇〇係連接至字線WL1,而 控制閘極16CG係連接至字線WL0。 應注意,儘管圖1及2顯示在NAND串内的四個記憶體單 元,但使用四個電晶體僅供作一範例。一 NAND串可能具 有小於四個記憶體單元或四個以上的記憶體單元。例如, 某些NAND串將包括8個記憶體單元、丨6個記憶體單元、32 個圮憶體單元等。本文中的論述不限於在一 NAND串内的 任一特定數量的記憶體單元。使用一 NAND結構的一快閃 記憶體系統之典型架構將包括數個NAND串。在下列美國 專利/專利申請案中提供NAND型快閃記憶體及其操作的相 關範例,其全部内容以引用方式併入本文:美國專利第 5,570,315號、美國專利第5,774,397號、美國專利第 6,〇46,935號、美國專利第5,386,422號、美國專利第 6,456,528號及美國專利申請案序列號〇9/893,277(公告案第 US2003/0002348號)。依據具體實施例還可使用除NAND快 閃記憶體之外的其他類型非揮發性記憶體。 在程式化一 EEPROM或快閃記憶體裝置時,一般施加一 程式化電壓至控制閘極並將位元線接地。將來自通道的電 子注入浮動閘極内。當電子在浮動閘極内累積時,浮動閘 極變成帶負電且記憶體單元之臨限電壓上升,使得記憶體 單元處於一程式化狀態中。單元之浮動閘極電荷及臨限電 壓可指示對應於儲存資料的一特定狀態。關於程式化的更 124907.doc 200822119 多資訊可見於2003年3月5曰申請的美國專利申請案第 10/379,608號’標題為’’自行增壓技術"及2〇〇3年7月29曰申 請的美國專利申請案第1〇/629,068號,標題為,,在程式化記 憶體上的债測,兩申請案全部内容皆以引用方式併入本 文。 Ο Ο 因為基於相鄰浮動閘極内所儲存之電荷之一電場麵合, 可旎會發生儲存於一浮動閘極上之表觀電荷偏移。此浮動 閘極至浮動閘極耦合現象係說明於美國專利第5,867,429號 内,其全部Θ容係以引用形式併入本文。該浮動閘極至浮 動閘極耦合現象在已在不同時間程式化之多組相鄰記憶體 單元之間最突出地發生,但並非全部如此。例如,可程式 化-第-記憶體單元以增加一電荷位準至其浮動閘極,該 電荷位準對應於一組資料。隨後,程式化一或多個相鄰記 憶體單元以增加-電荷位準至其浮動閘極,該電荷位準對 應於組貝料。在程式化該等相鄰記憶體單元之—或多個 口己隐體早70之後’因為在該(等)相鄰記憶體單元上的電荷 係搞合至4第-記憶體單元之效應,從該第—記憶體單元 所讀取之電荷位準可能似乎不同於程式化其的時候。來自 相鄰記憶體單元之耦人可处收w $ & <祸口可此將讀取自一選定記憶體單元之 表觀電荷位準偏移—齡吾 足以引起錯誤讀取儲存資料。 隨著記憶體單元大+ _ J不斷%小,預期臨限電壓之自鈇 式化及抹除分佈也會由於短 卜 …'耘 耦入,田於短通道效應、更大氧化物厚度/ 輕5比k化及更多通道摻雜 殄雜物波動而增加,從而減小相鄰 狀恶之間的可用間隔。 匕效應對於多狀態記憶體比僅使用 124907.doc 200822119 兩狀態之二進制記憶體更 >日日 文加顯者。在字線之間及在位元始 之間的空間減小還合捭 凡線 韌Μ & I 9曰加相郴夺動閘極之間的耦合。該嚀 動閘極至洋動閘極耦合 吁 效應係更大程度涉及多狀態梦 置,口為允許臨限電壓範圍與禁止 " 體狀態之二個不同臨限 义不5 5己憶 歩番由舌1 艮電壓靶圍之間的範圍)比在二進制 裝置中更加狹窄。因此 制 々,卜立鱗时— ,予動閘極至洋動閘極耦合可造成 Ο Ο 【發明内容】 限電壓乾圍偏移至—禁止範圍。 ==於相鄰(或其他)電荷儲存區域内所儲存之 荷健存區域(例如一浮動」揮發性記憶體單元内的-電 …入, 子動閘極)所儲存之表觀電荷偏移。作 官並非全部如此,但在一 ^ ^ 、疋记饫體單元之後程式化相鄰 石己fe體早兀之情形中,哕笙 州 雷r值欲—甘應極為突出。為了解決表觀 ^ ^ ^ 、、泉之儲存疋件所儲存之電荷來讀 “件時轭加一或多個補償。具效率補 二::由:反向頃取記憶體單元之區塊(或其部分)來提 (、。猎由在相反程式化方向上進行讀取 2 際讀取操作期間決定在讀取一 4子線之Λ (或選擇其結果)所需之資::謂施加-適當補償 決定該資訊。 ㈣專η❹-讀取操作來 -具體實施例包括開始於相 〜 弟一組選擇閘極之一第 一子線並結束於相鄰一第二 . ^ ^ ^擇閘極之一最後字線來程 式化耦合至複數個字線之非_ 不 W 非揮發性儲存元件。程式化包括 依據一目標記憶體狀態來改變 交落專儲存70件之選定者之一 124907.doc 200822119 臨限電壓。讀取麵合至該複數個字線之該 元件開始於該最後字線並結束於該 冑㈣儲存 左;从4 _L 予線。讀取該等儲 存兀件包括對於除該最後字線外的各字線,基於在 線施加一或 組選擇閘極之一方向上讀取相鄰各字線之—、" 多個補償。 另一具體實施例包括接收-要_合至複數個字線之— 、、且非揮發性儲存元件内所儲存之資 妒純人…, 仔之貝枓之凊求。該資料係開 Ο Ο 。於輕δ至-弟一字線之儲存元件並結束於輕合至一最後 子線之儲存it件來程式化該組非揮發性儲存元m 字線係相鄰該複數個字線之一第二字線。回應該請^,以 :開始於輕合至該最後字線之儲存元件並結束於麵合至該 第一字線^儲存元件之序列來讀取該組非揮發性儲存^ 件’其中讀取麵合至該第一字線之儲存元件包括基於該第 二字線之儲存元件内所儲存之電荷來施加_或多個補償。 讀取進-步包括在讀取該第—字線之該等储存元件之前, 緩衝來自該第二字線之儲存元件之資料、緩衝來自該第二 字線之儲存元件之資料之後緩衝來自該第一字線之储存元 件之資料、及在緩衝來自該第一字線之儲存元件之資料之 後維持來自該第二字線之儲存元件之緩衝資料。 【實施方式】 透過操縱單元之臨限電壓’記憶體單元可用於健存以類 比或數位形式表示之資料。一印愔辨 貝丁寸β己〖思體早兀之可能臨限電壓 範圍可劃分成表示不同記憶體狀態之多個範圍。例如一 個臨限電壓範圍可用於建立二個記憶體狀態,其係指_ 124907.doc -10- 200822119 輯資料1及〇。一般會建立至少一參考臨限電壓位準,以便 將記憶體單元之臨限電壓記憶體窗口分割成二個範圍。當 藉由施加對應於該參考臨限電壓位準之預定、固定電壓 (例如讀取參考電壓)至其閘極來讀取單元時,其源極/沒極 傳導狀態係藉由比較該傳導與一斷點位準或參考電流來建 • 立。若讀取電流高於該參考電流位準之電流,則決定該單 w 元’’接通”並在一邏輯狀態中。若該電流小於該參考電流位 、 準,則決定該單元’’截止”並在其他邏輯狀態中。在一 ^ NAND型快閃記憶體之一範例中,在抹除記憶體單元之後 電壓臨限值係負數’並定義為邏輯1。在一程式化操作之 後該臨限電壓係正數,並定義為邏輯0。當該臨限電壓係 負數並藉由向控制閘極施加〇 V來嘗試一讀取時,記憶體 單元會接通,指不正儲存邏輯1。當該臨限電壓係正數並 藉由向控制閘極施加〇 V來嘗試一讀取操作時,記憶體單 元不會接通以指示正儲存邏輯〇。 〇 一記憶體單元還可藉由利用兩個以上臨限電壓範圍表示 不同纪憶體狀態來儲存多位元數位資料。臨限電壓窗口可 以及用以解析該等個別狀態200822119 IX. INSTRUCTIONS: TECHNICAL FIELD OF THE INVENTION The specific embodiments of the present disclosure relate to non-volatile memory technology. [Prior Art] Half-thickness devices have become more and more popular for use in various electronic devices. For example, non-volatile semiconductor memory is used in cellular telephones, digital cameras, personal digital assistants, mobile computing devices, inactive computing devices, and other devices. Electrically erasable programmable read only memory (EEPr〇m) (including flash EEPROM) and electronically programmable read-only memory (epr〇m) are among the most popular non-volatile semiconductor memories. An example of a flash memory system uses a NAND structure that includes a plurality of transistors arranged in series between two select gates. The series transistors and the t»海荨k gate are called a NAND string. Figure 1 shows a top view of a NAND string. Figure 2 is an equivalent circuit thereof. The NAND string shown in the figure includes four transistors 10, 12, 14 and 16 connected in series between a first selection gate 12 and a second selection gate 22. Select gate 12 connects the NAND string to bit line terminal 26. Select gate 22 connects the NAND string to source line terminal 28. The selection gate 12 is controlled by applying an appropriate voltage to the control gate 20CG via the selection line Sgd. The selection gate 22 is controlled by applying an appropriate voltage to the control gate 22CG via the selection line SGS. Each of the transistors 10, 12, 14 and 16 includes a control gate and a floating gate which form a gate element of a memory cell. For example, the transistor 1A includes a control gate 10CG and a floating gate 1〇FG. The transistor 12 includes a control gate 12Cg and a movable gate 12FG. The transistor 14 includes a control gate 14CG and a floating 124907.doc 200822119 gate 14FG. The transistor 16 includes a control gate 16C:C} and a floating gate 16FG. The control gate i〇cg is connected to the word line WL3, the control gate 12CG is connected to the word line WL2, the control gate 14 is connected to the word line WL1, and the control gate 16CG is connected to the word line WL0. It should be noted that although Figures 1 and 2 show four memory cells within a NAND string, the use of four transistors is for illustrative purposes only. A NAND string may have less than four memory cells or more than four memory cells. For example, some NAND strings will include 8 memory cells, 丨6 memory cells, 32 memory cells, and the like. The discussion herein is not limited to any particular number of memory cells within a NAND string. A typical architecture of a flash memory system using a NAND structure would include several NAND strings. A related example of a NAND-type flash memory and its operation is provided in the following U.S. Patent/Patent Application, the entire disclosure of which is incorporated herein by reference in its entirety, U.S. Patent No. 5,570,315, U.S. Patent No. 5,774,397, U.S. Patent No. 6, U.S. Patent No. 5,386,422, U.S. Patent No. 6,456,528, and U.S. Patent Application Serial No. 9/893,277, the disclosure of which is incorporated herein. Other types of non-volatile memory other than NAND flash memory can also be used in accordance with specific embodiments. When programming an EEPROM or flash memory device, a stylized voltage is typically applied to the control gate and the bit line is grounded. The electrons from the channel are injected into the floating gate. When electrons accumulate in the floating gate, the floating gate becomes negatively charged and the threshold voltage of the memory cell rises, causing the memory cell to be in a stylized state. The floating gate charge and threshold voltage of the cell may indicate a particular state corresponding to the stored data. For more information on the stylization of 124907.doc 200822119, more information can be found in US Patent Application No. 10/379,608, filed March 5, 2003, entitled ''Self-pressurization Technology'" and July 29, 2 U.S. Patent Application Ser. Ο Ο Because the electric charge is based on one of the charges stored in the adjacent floating gates, the apparent charge shift stored on a floating gate can occur. This floating gate-to-floating gate coupling phenomenon is described in U.S. Patent No. 5,867,429, the entire disclosure of which is incorporated herein by reference. This floating gate-to-floating gate coupling phenomenon occurs most prominently between sets of adjacent memory cells that have been programmed at different times, but not all. For example, the programmable-first-memory unit can be added to add a charge level to its floating gate, which corresponds to a set of data. Subsequently, one or more adjacent memory cells are programmed to add a charge level to their floating gate, which corresponds to the group of bakes. After stylizing the adjacent memory cells - or a plurality of mouths and hidden bodies early 70 'because the charge system on the adjacent memory cells is coupled to the 4th-memory unit, The level of charge read by the first memory cell may appear to be different from when it was programmed. The coupled person from the adjacent memory unit can receive w $ &< the scam can read the apparent charge level offset from a selected memory unit - enough to cause erroneous reading of the stored data. As the memory cell is large + _ J is continuously small, it is expected that the self-suppressing and erasing distribution of the threshold voltage will also be due to short... '耘 coupled, field in short channel effect, larger oxide thickness / light 5 is increased by k-like and more channel doping dopant fluctuations, thereby reducing the available interval between adjacent evils. The 匕 effect for multi-state memory is more than just using the binary memory of the two states 124 > The reduction in space between word lines and at the beginning of the bit also corresponds to the coupling between the line toughness & I 9 plus the phase-shifted gate. The slamming gate to the eccentric gate coupling effect system is more involved in multi-state dreaming, and the mouth is allowed to limit the voltage range and the prohibition " body state is not the same. The range between the target range of the voltage from the tongue 1 is more narrow than in the binary device. Therefore, when the system is 々, 卜立鳞 -, the pre-action of the gate to the eclipse can be caused by 极 Ο [Inventive content] The voltage-limited dry-circle is offset to the forbidden range. == Apparent charge shift stored in the storage area (eg, a floating, volatile gate) stored in an adjacent (or other) charge storage region . Not all of the officials are like this, but in the case of a ^ ^ , after the carcass unit is programmed to be adjacent to the stone body, the state of the state is very prominent. In order to solve the apparent ^ ^ ^, and the stored charge of the spring storage element to read "the yoke plus one or more compensation. The efficiency of the second:: by: reverse the memory block of the memory unit ( Or part of it) (.. Hunting is performed by reading in the opposite stylized direction. During the 2nd reading operation, it is decided to read the 4th sub-line (or select the result): - Appropriate compensation determines the information. (4) Dedicated η ❹ - read operation - The specific embodiment includes starting with a first sub-line of one of the gates and ending with a second one. ^ ^ ^ One of the last word lines of the pole is programmed to couple to a plurality of word lines that are not _ non-volatile storage elements. Stylization includes changing one of the selected ones of the 70 pieces of the special storage according to a target memory state 124907. Doc 200822119 threshold voltage. The component that reads the surface to the plurality of word lines starts at the last word line and ends at the 胄 (4) storage left; from 4 _L to the line. Reading the storage elements includes Each word line outside the last word line is based on an online application of one or a group of selected gates Reading -, " multiple compensations of adjacent word lines in the direction. Another embodiment includes receiving - to - combining to a plurality of word lines - and storing the information in the non-volatile storage element Pure person..., 仔 之 。 。 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 。 。 。 。 。 。 。 。 。. The non-volatile storage element m word line is adjacent to one of the plurality of word lines and the second word line. The response should be ^, to: start to lightly connect to the storage element of the last word line and end to face to the first a sequence of storage elements to read the set of non-volatile storage devices, wherein the storage elements that are read to the first word line include charges stored in the storage elements based on the second word line Applying _ or multiple offsets. The read-in step includes buffering data from the storage elements of the second word line, buffering storage from the second word line, prior to reading the storage elements of the first word line After the component data, buffer the data from the storage element of the first word line, and buffer The buffer data from the storage element of the second word line is maintained after the data of the storage element of the first word line. [Embodiment] The threshold voltage through the manipulation unit 'memory unit can be used for storing in analogy or digital form. The data represented by the 。 愔 贝 贝 β 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 〖 State, which refers to _ 124907.doc -10- 200822119 data 1 and 〇. Generally, at least one reference threshold voltage level is established to divide the threshold voltage memory window of the memory unit into two ranges. By reading a predetermined, fixed voltage (eg, reading a reference voltage) corresponding to the reference threshold voltage level to its gate to read the cell, its source/no-pole conduction state is compared by conducting the conduction Breakpoint level or reference current is built. If the current is higher than the current of the reference current level, it is determined that the single w element is 'on' and in a logic state. If the current is less than the reference current level, the unit is determined to be ''off. "And in other logical states." In one example of a NAND type flash memory, the voltage threshold is negative 'after the erase of the memory cell' and is defined as a logic one. The threshold voltage is positive after a stylized operation and is defined as a logic zero. When the threshold voltage is negative and a read is attempted by applying 〇 V to the control gate, the memory cell is turned "on" and the logic 1 is stored. When the threshold voltage is positive and a read operation is attempted by applying 〇 V to the control gate, the memory cell does not turn on to indicate that the logic 正 is being stored. 〇 A memory unit can also store multi-bit digital data by using two or more threshold voltage ranges to represent different memory states. a threshold voltage window can be used to resolve the individual states

劃分成所需記憶體狀態之數目 之多個電壓斷點位準。例如, 四個臨限電壓範圍,其裘元 124907.doc 200822119 利申請案第10/461,244號"用於記憶體系統之循軌單元"說 明用於多狀態快閃記憶體單元之各種資料編碼方案,二者 全部内容均以引用形式併入本文。 π存在許多方法以在-讀取或驗證操作期間測量_記憶體 • I %之傳導電流。在—範例中,-記憶體單元之傳導電流 係根據感測放大器中的一專用電容器的放電速率來測量。 ‘ 纟另—範例中m憶體單元之傳導電流允許(或盎法 〇 料)包括該記憶體單元之财腳串釋放位元線電荷。在一 , 段時間之後測量位元線上的電荷以查看其是否已放完電。 用於快閃EEPROM系統的另-類型記憶體單元利用一非 傳導介電材料來代替一傳導浮動間極,以採用一非揮發性 方式來儲存電荷。此類單元係說明於Chan等人的文章中, 標題為,,真正的單電晶體氧化物_氮化物_氧化物eepr〇m裝 置”,IEEE電子裝置學報,第肌_8卷,第3號,i98#3 月第93至95頁。由氧化石夕、氮化石夕及氧化石夕(,,〇n〇,,)形 (J 成之一三層介電質係夾置與一傳導控制閘極與在記憶體單 元通道上的一半傳導基板表面之間。藉由將電子從單元通 道注入氮化物内來程式化單元,在氮化物中於一限制區域 内捕獲並儲存該等電子。此儲存電荷接著採用一可偵測方 式來改變一部分單元通道的臨限電壓。藉由將熱電洞注入 氮化物中來抹除單元。還參閱N〇zaki等人的,,用於半導體 碟片應用之具有MONOS記憶體單元之EEPROM,, (IEEE固態電路期刊,第26卷,第4號,1991年4月,第497 至501頁),其說明採用一分離閘極組態之類似單元,其中 124907.doc -12- 200822119 一摻雜多晶矽閘極延伸於一部分記憶體單元通道上以形成 一分離選擇電晶體。前述兩文章全部内容係以引用方式併 入本文。在William D. Brown與Joe E. Brewer所編輯之”非 揮發性半導體記憶體技術”(IEEEA版社,1998年)的第^ 2 即中所提及的程式化技術還在該節中說明可應用於介電電 荷捕獲裝置。還可使用此段落中所述之該等記憶體單元。 因而’本文所述之技術還適用於不同記憶體單元之介電區 域之間的輕合。 另一在各單元内儲存二個位元之方案已由Eitan等人說明 於"NROM ·· —種新型區域化捕獲,2位元非揮發性記憶體 單元"(IEEE電子裝置學報,第21卷,第u號,2〇〇〇年11 月,第543至545頁)。一 ΟΝΟ介電層橫跨源極與汲極擴散 之間的通道而延伸。一資料位元之電荷係在與汲極相鄰的 介電層中加以區域化,而另一資料位元之電荷係在與源極 相鄰的介電層中加以區域化。藉由單獨讀取在介電質内的 空間分離電荷儲存區域之二進制狀態來獲得多狀態資料儲 存。還可使用此段落中所述之該等記憶體單元。 圖3說明一範例性NAND串50之陣列1〇〇,例如圖所 不該等串。沿各行,一位元線27係耦合至用於NAND串50 之位元線選擇閘極之一沒極端子26。沿各列NAND串,一 源極線29可連接該等NAND串之該等源極線選擇閘極之所 有源極端子2 8。 記憶體單元陣列100係劃分成大量記憶體單元之區塊。 如同快閃EEPROM系統,區塊係抹除單位並可稱為一抹除 124907.doc -13- 200822119 區塊或實體區塊。各區塊可包括一起抹除的最小數目記憶 體單元。在圖3中,一區塊(例如區塊30)包括連接至一組乓 同字線WL0至WLi的所有單元。各區塊一般劃分成若干 頁。一頁一般係一最小的程式化或讀取單位,但可在一單 一操作中程式化或讀取一頁以上。在另一實施方案中,該 等個別頁可劃分成多個片段且該等片段可包含作為一基本 程式化操作一次寫入的最少數目單元。一般將一或多頁資 p 料儲存於一列記憶體單元内。一頁可儲存一或多個區段的 資料,其大小一般由一主機系統來定義。一區段包括使用 者資料與管理資料。管理資料一般包括從區段之使用者資 料已經計算的一錯誤校正碼(ECC)。控制器之一部分(如下 述)在將資料程式化在陣列内時計算ECC,並還在從該陣列 • 讀取資料時檢查其。或者,該等ECC及/或其他管理資料係 儲存於不同於其所屬之使用者資料之該等頁或區塊内的頁 或甚至不同區塊内。 〇 使用者資料之一區段通常係512個位元組,對應於磁碟 機中通常使用的-區段之大小。管理資料一般係一額外的 16至20位元組。較大數目的頁形成一區塊,(例如)從8頁直 至32、64或更多頁,不論何處皆如此。在某些具體實施例 中,一列NAND串包含一區塊。 在-具體實施例中記憶體單元係藉由在該等源極及位元 線正在洋動時升高P井至-抹除電壓(例如2G伏特)持續足夠 時期並將-選定區塊之字線接地來加以抹除。因而將一強 電場施加至選定記憶體單元之穿随氧化物層,並隨著該等 124907.doc -14· 200822119 子動閘極之電子被發射至基板側而抹除該等選定記憶體單 兀之資料。隨著電子從浮動開極傳送至#區域,J斷降 =選Μ元之臨限電μ 1等禁止抹除之單元使其字線 δ又疋至-㈣條件。由於電容性麵合’也將該等未選定字 線、位元線、選擇線及共同源極線升高至抹除電壓的一明 顯部分’從而禁止抹除該等未選定單元。抹除可在整個記 憶體陣列、分離區塊或其他單元之單位上執行。 各記憶體單元區塊包括一組形成行的位元線與一組形成 列的字線。在-具體實施例中,將該等位元線劃分成奇數 位7G線與偶數位元線。沿著一共同字線並連接至奇數位元 線的記憶體單元係在一時間處程式化,而沿著一共同字線 並連接至偶數位元線的記憶體單元係在另一時間處程式化 (”奇/偶程式化”)。在另一具體實施例中,沿用於區塊内所 有位元線的一字線來程式化記憶體單元("全部位元線程式 化”)。在其他具體實施例中,可將該等位元線或區塊分解 成其他分組(例如左及右,兩個以上分組等)。 圖4說明一記憶體裝置110,其具有讀取/寫入電路用於 並聯讀取及程式化一頁記憶體單元。記憶體裝置1丨〇可包 括一或多個記憶體晶粒或晶片112。記憶體晶粒i 12包括二 維記憶體單元陣列100、控制電路120及讀取/寫入電路 130A及130B。在一具體實施例中,各個周邊電路存取記 憶體陣列100係以一對稱方式實施於該陣列之相對側上, 使得將各侧上的存取線及電路之密度減半。該等讀取/寫 入電路130A及130B包括多個感測區塊200,其允許並聯讀 124907.doc -15- 200822119 取或程式化—頁播雜苗- U體早7^。記憶體陣列100可經由列解 碼器14GA及14GB藉由字線以及經由行解碼器142纽142B 藉由位元線來定址。在一典型具體實施例中,一控制器 144係包括於與一或多個記憶體晶粒工相同的記憶體裝置 110(例如-可移除儲存卡或封裝)内。指令及資料係經由線 132在主機與控制器144之間以及經由線134在該控制器與 一或多個記憶體晶粒112之間傳送。該控制器可在一具體A plurality of voltage breakpoint levels divided into the number of desired memory states. For example, four threshold voltage ranges, which are known as the multi-state flash memory unit, are described in the application No. 10/461,244 "Tracking Units for Memory Systems" The coding scheme, both of which are incorporated herein by reference. There are many ways for π to measure the _ memory • I % conduction current during a read or verify operation. In the example, the conduction current of the memory cell is measured according to the discharge rate of a dedicated capacitor in the sense amplifier. ‘ 纟 — — — — — 范例 范例 范例 m m m m m m m 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导 传导The charge on the bit line is measured after a period of time to see if it has been discharged. Another type of memory cell for a flash EEPROM system utilizes a non-conductive dielectric material in place of a conductive floating interpole to store charge in a non-volatile manner. Such a unit is described in the article by Chan et al., entitled, True Single Crystal Oxide_Nitride_Oxide eepr〇m Device, IEEE Transactions on Electronics, Journal _8, No. 3 , i98#3, pp. 93-95. From the oxidized stone eve, the nitrite and the oxidized stone eve (,, 〇n〇,,) shape (J is a three-layer dielectric system sandwich and a conduction control The gate is between the surface of the conductive substrate on the channel of the memory cell. The cell is programmed by injecting electrons from the cell channel into the nitride, and the electrons are captured and stored in the nitride in a restricted region. The stored charge is then changed in a detectable manner to change the threshold voltage of a portion of the cell channel. The cell is erased by injecting a thermal hole into the nitride. See also N〇zaki et al. for semiconductor disc applications. EEPROM with MONOS memory cell, (IEEE Solid State Circuits, Vol. 26, No. 4, April 1991, pages 497 to 501), which illustrates a similar unit using a separate gate configuration, 124907 .doc -12- 200822119 A doped polysilicon gate A part of the memory cell channel is formed to form a separate selection transistor. The foregoing two articles are incorporated herein by reference. "Non-volatile semiconductor memory technology" edited by William D. Brown and Joe E. Brewer The stylization technique mentioned in (2) of IEEEA Edition, 1998, is also described in this section for application to dielectric charge trapping devices. The memory cells described in this paragraph can also be used. Thus, the technique described herein is also applicable to the light coupling between the dielectric regions of different memory cells. Another scheme for storing two bits in each cell has been described by Eitan et al. - A new type of regionalized capture, 2-bit non-volatile memory unit " (Journal of IEEE Transactions on Electronics, Vol. 21, No. 5, November, pp. 543-545). The electrical layer extends across the channel between the source and the drain diffusion. The charge of one data bit is localized in the dielectric layer adjacent to the drain, and the charge of the other data bit is Regionalization in the dielectric layer adjacent to the source Multi-state data storage is obtained by separately reading the binary states of the spatially separated charge storage regions within the dielectric. The memory cells described in this paragraph can also be used. Figure 3 illustrates an exemplary NAND string 50. The array is 1 〇〇, such as a string of pixels. Along the rows, a bit line 27 is coupled to one of the bit line select gates for the NAND string 50 without the terminal 26. NAND strings along each column, A source line 29 can be connected to all of the source terminals 28 of the source line selection gates of the NAND strings. The memory cell array 100 is divided into blocks of a plurality of memory cells. Like a flash EEPROM system, a block erase unit can be referred to as a wipe or block. 124907.doc -13- 200822119 Block or physical block. Each block may include a minimum number of memory cells that are erased together. In Figure 3, a block (e.g., block 30) includes all of the cells connected to a set of pong-word lines WL0 through WLi. Each block is generally divided into pages. A page is typically a minimal stylized or read unit, but can be programmed or read more than one page in a single operation. In another embodiment, the individual pages can be divided into a plurality of segments and the segments can include a minimum number of cells that are written once as a basic stylized operation. One or more pages of material are typically stored in a column of memory cells. A page can store data for one or more segments, the size of which is generally defined by a host system. One section includes user data and management materials. The management data typically includes an error correction code (ECC) that has been calculated from the user data for the segment. One part of the controller (described below) calculates the ECC when the data is programmed into the array and also checks it when reading data from the array. Alternatively, the ECC and/or other management materials are stored in pages or even different blocks within the pages or blocks of the user data to which they belong.一个 One of the sections of user data is usually 512 bytes, corresponding to the size of the section that is commonly used in the drive. Management data is generally an additional 16 to 20 bytes. A larger number of pages form a block, for example from 8 pages to 32, 64 or more pages, wherever they are. In some embodiments, a column of NAND strings includes a block. In a particular embodiment, the memory cell is raised by the P-well to the erase voltage (eg, 2 GV) for a sufficient period of time and the selected block word by the time when the source and bit lines are moving. Wire the ground to erase it. Thus, a strong electric field is applied to the pass-through oxide layer of the selected memory cell, and the selected memory cell is erased as the electrons of the 124907.doc -14·200822119 sub-gate are emitted to the substrate side.兀 兀 。. As the electrons are transferred from the floating open to the # region, J is degraded = the unit that prohibits erasing such as the 临 之 限 μ 使其 使其 使其 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止 禁止Since the capacitive facets also raise the unselected word lines, bit lines, select lines, and common source lines to a distinct portion of the erase voltage, the erase of the unselected cells is inhibited. Erasing can be performed on the entire array of memory arrays, detached blocks, or other units. Each memory cell block includes a set of bit lines forming a row and a set of word lines forming a column. In a particular embodiment, the bit lines are divided into odd bit 7G lines and even bit lines. Memory cells along a common word line and connected to odd bit lines are programmed at one time, while memory cells along a common word line and connected to even bit lines are programmed at another time. ("odd/even stylized"). In another embodiment, the memory cells ("all bit threading" are programmed along a word line for all bit lines within the block. In other embodiments, such The bit line or block is decomposed into other groups (eg, left and right, more than two groups, etc.). Figure 4 illustrates a memory device 110 having read/write circuits for parallel reading and staging a page. The memory unit 1 can include one or more memory dies or wafers 112. The memory dies i 12 include a two-dimensional memory cell array 100, a control circuit 120, and a read/write circuit 130A. And 130B. In one embodiment, each peripheral circuit access memory array 100 is implemented in a symmetric manner on opposite sides of the array such that the density of access lines and circuitry on each side is halved. The equal read/write circuits 130A and 130B include a plurality of sensing blocks 200 that allow parallel reading of 124907.doc -15-200822119 fetch or stylize-page seedlings - U body early 7^. Memory array 100 Can be used by column decoders 14GA and 14GB by word lines and via lines The code 142 142 142B is addressed by a bit line. In a typical embodiment, a controller 144 is included in the same memory device 110 as one or more memory dies (eg, removable) Within the memory card or package, instructions and data are transferred between the host and controller 144 via line 132 and between the controller and one or more memory dies 112 via line 134. The controller can be specific

Ο 貝她例中包括一選用RAM記憶體丨3丨以輔助資料傳送。 控制電路120與該等讀取/寫入電路13〇八及13〇B一起協作 以在記憶體陣列100上執行記憶體操作。控制電路12〇包括 一狀態機122、一晶片上位址解碼器124及一功率控制模組 126。狀態機122提供記憶體操作之晶片級控制。晶片上位 址解碼器124在該主機或一記憶體控制器所使用之位址與 該等解碼器140八、1403、142八及1426所使用之硬體位址 之間提供一位址介面。功率控制模組126控制在記憶體操 作期間向該等字線及位元線供應的功率及電壓。一選用 RAM記憶體1 33係在一具體實施例中提供用以辅助記憶體 操作。 圖5係一個別感測區塊200之一方塊圖,該區塊係劃分 成一核心部分(稱為一感測模組210)與一共同部分220。在 一具體實施例中,存在用於各位元線的一分離感測模組 210與用於一組多個感測模組210之一共同部分220。在一 範例中,一感測區塊將包括一共同部分220與八個感測模 組2 10。在一群組内的各感測模組將經由一資料匯流排2〇6 124907.doc -16- 200822119 與相關聯共同部分進行通信。如需詳情,請參閱2004年12 月29曰申請的美國專利申請案第11/〇26,536號,標題”非揮 發性記憶體及用於感測放大器集之共用處理方法,,,其全 部内容以引用方式併入本文。 感測模組210包含感測電路204,其決定在一連接位元線 中的一傳導電流是否高於或低於一預定臨限位準。感測模 ' 組210還包括一位元線鎖存器2〇2,其係用於在連接位元線 上設定一電壓條件。例如,鎖存於位元線鎖存器202内的 一預定狀態將會造成將連接位元線拉至一指定程式化禁止 之狀態(例如Vdd)。 /、同邛刀220包括一處理器212、一組資料鎖存器214與 一耦合於該組資料鎖存器214與資料匯流排134之間的 ”面216。處理器212執行計算。例如,其功能之一係決定 儲存於感測記憶體單元内的資料並將所決定資料儲存於該 組資料鎖存器内。該組資料鎖存器214係用於儲存在一讀 υ #操作期間處理ϋ212所決定之資料位元。其還用於儲存 在一程式化操作期間從該資料匯流排134匯入的資料位 凡。所匯入的資料位元表示試圖程式化於記憶體内的寫入 資料。I/O介面216在資料鎖存器214與資料匯流排134之間 提供一介面。 在讀取或感測期間,該系統之操作受圖4之狀態機122控 制,該«機控制經由字線向定址單元供應不同的控制閘 極電壓。隨著其逐步遍及對應於該記憶體所支援之各種記 憶體狀態的各種預定義控制閘極電壓,感測模組21〇將在 124907.doc •17- 200822119 該些電壓之一電壓處跳脫並經由匯流排206從感測放大器 210向處理器212提供一輸出。此時,處理器212藉由考量 忒感測杈組之該(等)跳脫事件以及關於經由輸入線208來自 該狀態機之施加控制閘極電壓的資訊來決定所產生的記憶 m大態m針對記憶體狀態來計算二進制編碼並將該 等產生貧料位元儲存於資料鎖存器214内。在該核心部分 之另一具體實施例中,位元線鎖存器2〇2服務於雙重任 ◎ 務,同時作為一用於鎖存感測模組210之輸出之鎖存器並 還作為上述位元線鎖存器。 在程式化或驗證期間,欲程式化資料係從資料匯流排 134而儲存於該組資料鎖存器214内的。受該狀態機控制的 程式化操作包含一系列程式化電壓脈衝,其係施加至該等 定址記憶體單元之控制閘極。各程式化脈衝之後進行一讀 回(驗證)來決定是否已將該單元程式化至所需記憶體狀態 目標臨限電壓。處理器212監控與所需記憶體狀態相關之 Q 碩回記憶體狀態。當該等二狀態一致時,處理器212設定 位元線鎖存器202,以便引起將該位元線拉至一指定程式 化禁止之條件(例如Vdd)。此舉禁止耦合至該位元線之單 兀受到進一步程式化,即使在其控制閘極上出現程式化脈 衝。在其他具體實施例中,該處理器最初載入位元線鎖存 器202,而該感測電路在該驗證程式期間將其設定為一禁 止值。 資料鎖存器堆疊214包含對應於感測模組的一資料鎖存 器堆疊。在一具體實施例中,每個感測模組21 〇存在三個 124907.doc -18- 200822119 資料鎖存器。在一此音# + & 存器俜你 千(仁不要求)中,該等資料鎖 仔益係實靶為一移位暫 UΜ^ ^ * 风付财储存於其内的平行資 科轉換成φ列f料用於 ^ , θ ^ 十匯机排134,且反之亦鈇。在 較佳具體實施例中,對岸 [、、、在 所古次μ u + w 17 '"體早70之讀取/寫入區塊的 所有1料鎖存器可以係 社起以形成一區塊移位暫存 阳,以使得可藉由串聯傳送 ^ ^ ^ 寻I來輸入或輸出一資料區塊。特 Ο Ο 欠次…:取/寫人模組庫係調適成使得其資料鎖存器組 之貝科鎖存器將資料依序移入或移出該資料匯流排,如 同其係-用於整個讀取/寫入區塊之移位暫存器之部分。 -般而言,並聯操作_ w之記憶體單元。因而,一對應 數目的感測模組21G係並聯操作的。在—具體實施例中, 一頁控制器(未顯示)方便地提供控制及時序信號至該等並 聯操作感測模組。針對關於感測模組21〇及其操作之詳 情,請參閱2005年4月5曰申請的美國專利申請案序列號 11\〇99,133,標題為”非揮發性記憶體之讀取操作期間的耦 白補損,其全部内谷係以引用形式併入本文。關於非揮 發性儲存裝置之各種具體實施例之結構及/或操作之額外 資訊可見於(1)2004年3月25日公告的美國專利申請公告案 第2004/0057287號,”非揮發性記憶體及減小源極線偏壓 錯誤之方法’’;(2)2004年6月10日公告的美國專利申請公告 案第2004/0109357號,”非揮發性記憶體及改良感測之方 法’’;(3)2004年12月16曰申請的美國專利申請案第 11 / 015,19 9號’標題為”改良記憶體感測電路及用於低電壓 操作之方法’’,發明人尺狂111-人(11^11。6〇1以;(4)2005年4月5 124907.doc •19- 200822119 日申請的美國專利中請案11/G99,133,標題為,,在非揮發性 記憶體之讀取操作期間的耦合補償”,發明人Jian Chen; 及(5)2005年12月28曰申請的美國專利申請案第1 1/321,953 號,枯題為用於非揮發性記憶體之參考感測放大器,,,發 月人 Siu Lung Chan 與 Raui_Adrian Cernea。上面直接所列 專利文件之所有五個專利文件全部内容係以引用形式併入 本文。 〇 具體實施例中,資㈣沿—共同字線而程式化至記 憶體早7L。該字線可稱為一選定字線。一區塊之剩餘字線 係稱為未選定字線。該選定字線可具有一或兩個相鄰字 線。若該選定字線具有兩個相鄰字線,則在汲極側的相鄰 子線係稱為汲極側相鄰字線而在源極側的相鄰字線係稱為 源極側相鄰字線。例如,若圖2之WL2係選定字線,則 WL1係源極側相鄰字線而WL3係汲極側相鄰字線。 在一成功程式化程序結束時,該等記憶體單元之臨限電 Ο |適#時應處於詩已程式化記憶體單元之-或多個臨限 電壓刀佈内或在用於已抹除記憶體單元之一臨限電壓分佈 内。圖6說明當每個記憶體單元儲存兩位元的資料時用於 一記憶體群組之臨限電壓分佈。圖6顯示用於已抹除記憶 體單元之一第一臨限電壓分佈E與用於已程式化記憶體單 70之三個臨限電壓分佈A、B&C。在一具體實施例中,在 E刀佈中的臨限電壓係負數而在A、6及c分佈中的臨限電 壓係正數。 圖6之各不同臨限電壓範圍對應於該組資料位元之預定 124907.doc -20- 200822119 值。程式化於記憶體單元内的資料與單元臨限電壓位準之 間的特定關係取決於該等單元所採用之資料編碼方案。在 一具體實施例中,使用一格雷碼指派將資料值指派至臨限 電壓範圍’使得若一浮動閘極之臨限電壓錯誤地偏移至其 相鄰物理狀態,則只會影響一位元。不過,在其他具體實 施例中’不使用格雷編碼。一範例指派,,1 1 ”至臨限電壓範 •圍E(狀態E),”10,,至臨限電壓範圍A(狀態A),”〇〇,,至臨限 電壓範圍B(狀態B)而,,〇1,,至臨限電壓範圍C(狀態C)。儘管 圖6顯不四種狀態,但依據本揭示内容之具體實施例還可 與其他二進制或多狀態結構一起使用,包括該等包括多於 或少於四種狀態之結構。 圖6顯示三個讀取參考電壓Vra、Vrb及Vrc,用於從記憶 體單兀讀取資料。藉由測試一給定記憶體單元之臨限電壓 疋否超過或低於Vra、Vrb及Vrc,該系統可決定該記憶體 單兀所處之狀態。若一記憶體單元由於Vra施加至其控制 〇 閘極而傳導,則該記憶體單元係在狀態E中。若一記憶體 單元在Vrb及Vrc處傳導,但在Vra處不傳導,則該記憶體 單元係在狀態A中。若記憶體單元在Vrc處傳導,但在Vra 及Vrb處不傳導,則記憶體單元係在狀態B中。若記憶體單 το在Vra、Vrb或Vrc處不傳導,則記憶體單元係在狀態◦ 中。圖6還顯示三個驗證參考電壓Vva、vvb及vvc。當將 記憶體單元程式化至狀態A時,該系統測試該等記憶體單 凡疋否具有一大於或等於Vva之臨限電壓。當將記憶體單 疋程式化至狀態B時,該系統將測試該等記憶體單元是否 124907.doc -21 - 200822119 具有一大於或等於Vvb之臨限電壓。當將記憶體單元程式 化至狀態C時,該系統將決定該等記憶體單元是否具有一 大於或等於Vvc之臨限電壓。 圖6還描述一完整序列程式化技術。在完整序列程式化 中’將記憶體單元從抹除狀態E直接程式化至該等程式化 狀態A、B或C之任一者。可先抹除一群欲程式化記憶體單 元’使得所有記憶體單元均在抹除狀態E中。接著將一系 Ο Ο 列程式化電壓脈衝施加至該等選定記憶體單元之該等控制 閘極以將该等記憶體單元直接程式化成狀態A、B或c。儘 官正在將某些記憶體單元從狀態E程式化至狀態A,但正 在將其他圮憶體單元從狀態E程式化至狀態6及/或從狀態E 至狀態C。 圖7 „兒明一程式化多狀態記憶體單元之兩遍式技術之一 範例A等多狀態記憶體單^針對二不同頁:-下部頁與 -上部頁來儲存資料。描述四種狀態。對於狀態E,兩頁 =儲存一 ”1"。對域態A,下部頁儲存一 0而上部頁儲存 :卜對於狀態B’二頁均儲存G。對於狀態c,下部頁儲 子1而上。頁儲存0。儘管將特定位元圖案指派給該等狀態 之各狀態,但可指派不同位元圖案。 在第一遍程式化中,單元之臨 丨良電壓位準根據欲程式化 ;下邏輯頁内的位元而設定。 限雷懕H 右4位疋係一邏輯1,則臨 電£不會變化,因為其由於 ^ m φ ^ 文干寻候已抹除而處於適當 狀悲中。然而,若欲程式化 臨限仿唯/ 旳位70係一邏輯〇,則單元之 F位準係增加至狀態A,如箭 頌〇〇所不。從而結束該第 124907.doc -22- 200822119 一遍程式化。 在一第二遍程式化中,單元之臨限電壓位準係根據欲程 式化於上邏輯頁内的位元而設定。若上邏輯頁位元將儲存 一邏輯1,則不發生任何程式化,由於取決於下部頁位元 之程式化,該單元處於該等狀態E或A之一中,該等狀態 均攜帶一上部頁位元1。若該上部頁位元欲成為一邏輯〇,In her case, she included a RAM memory 丨3丨 to assist in data transmission. Control circuit 120 cooperates with the read/write circuits 13A and 13B to perform memory operations on memory array 100. The control circuit 12A includes a state machine 122, an on-chip address decoder 124, and a power control module 126. State machine 122 provides wafer level control of memory operations. The on-chip address decoder 124 provides an address interface between the address used by the host or a memory controller and the hardware address used by the decoders 140, 1403, 142, and 1426. The power control module 126 controls the power and voltage supplied to the word lines and bit lines during the memory gymnastics. An optional RAM memory 1 33 is provided in a particular embodiment to aid in memory operation. FIG. 5 is a block diagram of an additional sensing block 200 that is divided into a core portion (referred to as a sensing module 210) and a common portion 220. In one embodiment, there is a separate sensing module 210 for each of the plurality of sensing modules 210 and a common portion 220 for a plurality of sensing modules 210. In one example, a sensing block will include a common portion 220 and eight sensing modules 2 10 . Each of the sensing modules within a group will communicate with the associated common portion via a data bus 2 〇 6 124907.doc -16 - 200822119. For more information, please refer to U.S. Patent Application Serial No. 11/26,536, filed on Dec. 29, 2004, entitled "Non-Volatile Memory and Common Processing Methods for Sensing Amplifier Sets," The sensing module 210 includes a sensing circuit 204 that determines whether a conduction current in a connected bit line is higher or lower than a predetermined threshold level. The sensing mode group 210 is also A bit line latch 2〇2 is included for setting a voltage condition on the connected bit line. For example, a predetermined state latched in the bit line latch 202 will cause the bit to be connected. The line is pulled to a specified stylized inhibit state (eg, Vdd). The same boring tool 220 includes a processor 212, a set of data latches 214 and a coupled to the set of data latches 214 and data bus 134. Between the sides 216. Processor 212 performs the calculations. For example, one of its functions is to determine the data stored in the sensing memory unit and store the determined data in the data latch of the group. The set of data latches 214 is used to store the data bits determined by the process 212 during a read υ # operation. It is also used to store data bits that are imported from the data bus 134 during a stylized operation. The data bits that are imported represent the write data that is attempting to be programmed into the memory. I/O interface 216 provides an interface between data latch 214 and data bus 134. During reading or sensing, the operation of the system is controlled by state machine 122 of Figure 4, which supplies different control gate voltages to the addressing unit via word lines. As it gradually passes through various predefined control gate voltages corresponding to the various memory states supported by the memory, the sensing module 21 will trip at one of the voltages of 124907.doc • 17- 200822119 An output is provided from the sense amplifier 210 to the processor 212 via the bus 206. At this time, the processor 212 determines the generated memory m state by considering the (equivalent) trip event of the 忒 sensing group and the information about the applied control gate voltage from the state machine via the input line 208. The binary code is calculated for the memory state and the resulting poor bit bits are stored in the data latch 214. In another embodiment of the core portion, the bit line latch 2 〇 2 serves the dual task and serves as a latch for latching the output of the sensing module 210 and also as described above. Bit line latch. During stylization or verification, the data to be stylized is stored in the data latch 214 from the data bus 134. The stylized operation controlled by the state machine includes a series of stylized voltage pulses applied to the control gates of the addressed memory cells. A readback (verification) is performed after each stylized pulse to determine if the unit has been programmed to the desired memory state target threshold voltage. Processor 212 monitors the Q-back memory state associated with the desired memory state. When the two states are identical, the processor 212 sets the bit line latch 202 to cause the bit line to be pulled to a condition that specifies a program inhibit (e.g., Vdd). This prohibits the single 耦合 coupled to the bit line from being further programmed, even if stylized pulses appear on its control gate. In other embodiments, the processor is initially loaded with bit line latch 202, and the sensing circuit sets it to a disable value during the verification routine. The data latch stack 214 includes a data latch stack corresponding to the sense module. In one embodiment, each of the sensing modules 21 has three 124907.doc -18-200822119 data latches. In the case of a sound #+ & 存俜你千(仁不需要), the data locks the target is a shift temporarily UΜ^ ^ * The wind is saved in parallel. The φ column f material is used for ^, θ ^ 十汇机排排134, and vice versa. In a preferred embodiment, all of the 1-block latches of the read/write block on the opposite side [, , in the ancient order μ u + w 17 '" body early 70 can be formed to form a The block shift is temporarily stored so that a data block can be input or output by serially transmitting ^^^. Special Ο 欠 ......: The fetch/write module library is adapted so that the data latches of the data latch group move the data in or out of the data bus in the same way as the system - for the entire read The portion of the shift register of the block is fetched/written. In general, parallel operation _ w memory unit. Thus, a corresponding number of sensing modules 21G are operated in parallel. In a particular embodiment, a one-page controller (not shown) conveniently provides control and timing signals to the parallel operational sensing modules. For a detailed description of the sensing module 21 and its operation, please refer to U.S. Patent Application Serial No. 11/99,133, filed on Apr. 5, 2005, entitled "Non-Volatile Memory Read Operation Coupling white compensation, all of which are incorporated herein by reference. Additional information regarding the structure and/or operation of various embodiments of non-volatile storage devices can be found in (1) Announcement, March 25, 2004 U.S. Patent Application Publication No. 2004/0057287, "Non-Volatile Memory and Methods of Reducing Source Line Bias Errors"; (2) US Patent Application Publication No. 2004, published on June 10, 2004 /0109357, "Non-Volatile Memory and Methods of Improved Sensing"'; (3) US Patent Application No. 11 / 015, 19 9, filed December 16, 2004, entitled "Improved Memory Sense" Measuring circuit and method for low-voltage operation '', the inventor's ruler mad 111-person (11^11.6〇1; (4) April 2005 5 124907.doc •19-200822119 Medium 11/G99, 133, titled, during the read operation period of non-volatile memory "Coupling compensation", inventor Jian Chen; and (5) U.S. Patent Application Serial No. 1 1/321,953, filed on December 28, 2005, which is incorporated herein by reference. , Siu Lung Chan and Raui_Adrian Cernea. All five patent documents of the above-listed patent documents are hereby incorporated by reference in their entirety herein in the entirety of The memory is 7L early. The word line can be referred to as a selected word line. The remaining word lines of a block are referred to as unselected word lines. The selected word line can have one or two adjacent word lines. The line has two adjacent word lines, and the adjacent ones on the drain side are referred to as the drain side adjacent word lines and the adjacent word lines on the source side are referred to as the source side adjacent word lines. For example, if WL2 in Figure 2 is a selected word line, then WL1 is the adjacent source line on the source side and WL3 is the adjacent word line on the drain side. At the end of a successful stylization program, the threshold of the memory cells Electric Ο | 适# should be in the poemized memory unit - or multiple threshold voltage knives or In the threshold voltage distribution for one of the erased memory cells. Figure 6 illustrates the threshold voltage distribution for a memory bank when each memory cell stores two bits of data. Figure 6 shows The first threshold voltage distribution E of one of the erased memory cells and the three threshold voltage distributions A, B&C for the programmed memory cell 70. In a specific embodiment, in the E-knife The threshold voltage in the middle is negative and the threshold voltage in the distribution of A, 6 and c is positive. The different threshold voltage ranges in Figure 6 correspond to the predetermined 124907.doc -20- 200822119 values of the data bits. The specific relationship between the data programmed into the memory unit and the cell threshold voltage level depends on the data encoding scheme used by the units. In a specific embodiment, assigning a data value to a threshold voltage range using a Gray code assignment such that if a threshold voltage of a floating gate is erroneously shifted to its neighboring physical state, only one bit is affected . However, in other embodiments, Gray coding is not used. An example assignment, 1 1 ” to the threshold voltage range • E (state E), “10, to the threshold voltage range A (state A), “〇〇,, to the threshold voltage range B (state B) And, 〇1, to the threshold voltage range C (state C). Although Figure 6 shows four states, embodiments in accordance with the present disclosure may also be used with other binary or multi-state structures, including These include more or less than four states of structure. Figure 6 shows three read reference voltages Vra, Vrb, and Vrc for reading data from a memory cell. By testing a given memory cell Whether the threshold voltage is higher or lower than Vra, Vrb and Vrc, the system can determine the state of the memory unit. If a memory unit is conducted because Vra is applied to its control gate, the memory The unit is in state E. If a memory unit conducts at Vrb and Vrc but does not conduct at Vra, then the memory unit is in state A. If the memory unit is conducted at Vrc, but at Vra and If Vrb is not conducted, the memory unit is in state B. If the memory is single το in Vra, Vrb or V If rc is not conducting, the memory unit is in state 。. Figure 6 also shows three verification reference voltages Vva, vvb, and vvc. When the memory unit is programmed to state A, the system tests the memory sheets. Whether or not there is a threshold voltage greater than or equal to Vva. When the memory unit is programmed to state B, the system will test whether the memory unit is 124907.doc -21 - 200822119 has a greater than or equal to Vvb The threshold voltage. When the memory cells are programmed to state C, the system will determine if the memory cells have a threshold voltage greater than or equal to Vvc. Figure 6 also depicts a complete sequence stylization technique. In the complete sequence stylization, 'program the memory unit directly from the erase state E to any of the stylized states A, B or C. You can erase a group of memory cells to make all memory The cells are all in erased state E. A series of programmed voltage pulses are then applied to the control gates of the selected memory cells to program the memory cells directly into states A, B or c. Do Some memory cells are being programmed from state E to state A, but other memory cells are being programmed from state E to state 6 and/or from state E to state C. Figure 7 One of the two-pass technology of the multi-state memory unit, the multi-state memory such as A, is for two different pages: the lower page and the upper page to store data. Describe four states. For state E, two pages = store a "1". For domain A, the lower page stores a 0 and the upper page stores: Bu stores G for both states B'. For state c, the lower page stores 1 The page stores 0. Although a particular bit pattern is assigned to each state of the states, different bit patterns can be assigned. In the first pass of the stylization, the unit's voltage level is intended to be programmed; Set in the logical page. In the limit of thunder H, the right 4 digits are a logic 1, then the power will not change, because it is in the proper shape because ^ m φ ^ However, if you want to program the threshold imitation / 旳 70 70 a logical 〇, then the F level of the unit is added to the state A, as the arrow does not. Thus the end 124907.doc -22- 200822119 Stylized once. In a second pass of stylization, the threshold voltage level of the unit is set according to the bit to be programmed in the upper logical page. If the upper logical page bit will store a logic 1, then No stylization takes place, due to the stylization of the lower page bits, the unit is in this class One of the states E or A, such a state carry the upper page bit 1. If the upper page bit to be logic into a square,

' 則偏移臨限電壓。若該第一遍導致單元保持於抹除狀態E 中’則在該第二遍中,程式化該單元,使得將臨限電壓增 / 加至狀態C内,如箭頭254所示。若該單元由於該第一遍程 式化已程式化至狀態A,則該記憶體單元係在該第二遍中 進一步程式化,使得將臨限電壓增加至狀態B内,如箭頭 252所示。該第二遍之結果係將該單元程式化至指定儲存 一邏輯Π0Π用於上部頁之狀態,而不改變用於下部頁之資 圖8Α至8C揭示一種程式化非揮發性記憶體之程序,其 ◎ 針對任一特定記憶體單元,藉由在寫入至前頁之相鄰記憶 體單元之後相對於一特定頁寫入至該特定記憶體單元以減 小浮動閘極至洋動閘極耦合。在本文中此技術可稱為最後 優先模式(last first mode ; LM)程式化。在圖8八至8c之範 例中,使用四種資料狀態,各單元儲存每錢體單元兩個 位元資料。抹除狀態E儲存資料丨丨,狀態A儲存資料〇ι, 狀態B儲存資料1〇,而狀態C儲存資料00。還可使用資料 至物理貧料狀態之其他編碼。各記憶體單元儲存兩邏輯頁 資料之邛刀。出於參考目的,該些頁係稱為上部頁與下 124907.doc -23- 200822119 部頁’但可給予其他標籤。狀態A係編碼以儲存位元0用於 上部頁並儲存位元1用於下部頁,狀態Β係編碼以儲存位元 1用於上部頁並儲存位元〇用於下部頁,而狀態C係編碼以 儲存位元〇用於兩頁。用於一字線WLn處記憶體單元之下 部頁資料係如圖8 A所示在一第一步驟中加以程式化且用於 該等單元之上部頁係如圖8(:所示在一第二步驟中加以程式 化。若該下部頁資料將保留資料1用於一單元,則在該第 ρ、 一步驟期間該單元之臨限電壓保留在狀態E處。若該下部 頁資料欲程式化至〇,則該記憶體單元之臨限電壓係升高 至狀態B’。狀態B,係一中間狀態β,其具有一低於Vvb之 驗證位準V v b ’。 在一具體實施例中,在程式化記憶體單元之下部頁資料 之後’將會相對於其下部頁而程式化在相鄰字線WLn+1處 的相鄰記憶體單元。例如,在圖!至3中WL2處記憶體單元 之下部頁可在WL1處記憶體單元之下部頁之後加以程式 Q 化。在程式化記憶體單元12之後記憶體單元1〇之臨限電壓 從狀態E升高至狀態β,之情況下,浮動閘極耦合可升高記 憶體單元12之表觀臨限電壓。在WLn處的記憶體單元上的 累積搞合效應將會加寬用於該等單元之臨限電壓之表觀臨 限電壓分佈,如圖8B所示。可在程式化感興趣字線之上部 頁時補救該臨限電壓分佈之表觀加寬,如圖8C所示。' Then offset the threshold voltage. If the first pass causes the cell to remain in the erased state E, then in the second pass, the cell is programmed to increment/add the threshold voltage to state C, as indicated by arrow 254. If the unit has been programmed to state A due to the first pass, the memory unit is further programmed in the second pass such that the threshold voltage is increased to state B as indicated by arrow 252. The result of the second pass is that the unit is programmed to store a logic Π0 for the state of the upper page, without changing the program for the lower page. Figures 8A to 8C disclose a program for stylizing non-volatile memory. ◎ For any particular memory cell, the floating gate to the oceanic gate coupling is reduced by writing to the particular memory cell relative to a particular page after writing to the adjacent memory cell of the previous page . This technique can be referred to as last first mode (LM) stylization in this paper. In the example of Figures 8-8c, four data states are used, and each cell stores two bit data per cell unit. Erasing state E stores data, state A stores data 〇ι, state B stores data 1 〇, and state C stores data 00. Other codes for the physical to lean state can also be used. Each memory unit stores the file of two logical page data. For reference purposes, the pages are referred to as the upper page and the lower page 124907.doc -23-200822119 page but other labels may be given. State A is coded to store bit 0 for the upper page and store bit 1 for the lower page, state coded to store bit 1 for the upper page and store bit 〇 for the lower page, while state C is The code is used to store bits 〇 for two pages. The data of the lower page of the memory unit for the word line WLn is programmed in a first step as shown in FIG. 8A and used for the upper page of the unit as shown in FIG. 8 (: In the second step, the program is programmed. If the lower page data retains the data 1 for a unit, the threshold voltage of the unit remains in the state E during the ρ and 1 steps. If the lower page information is to be programmed As a result, the threshold voltage of the memory cell is raised to state B'. State B is an intermediate state β having a verification level Vvb' lower than Vvb. In a specific embodiment, After the page data under the stylized memory unit, 'the adjacent memory cells at the adjacent word line WLn+1 will be programmed relative to their lower page. For example, the memory at WL2 in Figures! to 3 The lower page of the cell can be programmed to be Q after the lower page of the memory cell at WL1. In the case where the threshold voltage of the memory cell 1 is raised from the state E to the state β after the staging memory unit 12, Floating gate coupling can raise the apparent threshold of memory unit 12 The cumulative effect on the memory cells at WLn will broaden the apparent threshold voltage distribution for the threshold voltages of the cells, as shown in Figure 8B. The word lines of interest can be programmed The upper page remedies the apparent broadening of the threshold voltage distribution as shown in Figure 8C.

圖8C描述程式化WLn處單元之上部頁之程序。若一記憶 體單元係在抹除狀態E中且其上部頁位元欲保持在丨處,則 該屺憶體單元保持在狀態E中。若該記憶體單元係在狀態E 124907.doc -24- 200822119 Ο Ο 中且其上部頁資料位元欲程式化至0,則該記憶體單元之 臨限電壓係升高至用於狀態Α之範圍内。若該記憶體單元 過去在一中間臨限電壓分佈B,内且其上部頁資料欲保持 1 ’則該記憶體單元係程式化至最終狀態B。若該記憶體單 元係在一中間臨限電壓分佈B,内且其上部頁資料欲變成資 料〇 ’則該記憶體單元之臨限電壓係升高至在用於狀態c之 範圍内。圖8A至8C所示之程序降低浮動閘極耦合之效 應,因為僅相鄰記憶體單元之上部頁程式化會影響一給定 記憶體單元之表觀臨限電壓。用於此技術之一替代性狀態 =碼之範例係在上部頁資料係1時從中間㈣B,移動至狀 心C並在上邛頁負料係0時移動至狀態B。儘管圖8八至8C 提供-關於四種資料狀態與兩個資料頁的範例,但該等概 心可應用於具有多於或少於四種狀態及不同頁數之實施方 案0Figure 8C depicts the procedure for stylizing the upper page of the unit at WLn. If a memory cell is in erase state E and its upper page bit is intended to remain at the frame, then the memory cell remains in state E. If the memory unit is in state E 124907.doc -24- 200822119 Ο 且 and its upper page data bit is to be programmed to 0, then the threshold voltage of the memory unit is raised to the state Within the scope. If the memory cell has been in an intermediate threshold voltage distribution B and its upper page data is to remain 1 ', the memory cell is programmed to final state B. If the memory cell is within an intermediate threshold voltage distribution B and its upper page data is to become a material ’ ', the threshold voltage of the memory cell is raised to be within the range for state c. The procedure shown in Figures 8A through 8C reduces the effect of floating gate coupling because only the top page stylization of adjacent memory cells affects the apparent threshold voltage of a given memory cell. An alternative state for this technique = the code example is moved from the middle (four) B to the center C at the upper page data system 1 and to the state B when the upper page is negative. Although Figures 8-8 through 8C provide examples of four data states and two data pages, the concepts can be applied to embodiments with more or less than four states and different page counts.

4你一碩取或驗證程序之一迭代 期間各種#號之行為。Q 一 丁乃圖9之程序之各迭代表示用於各單 凡δ己憶體之·—早一咸測接从 心、呆作。若該等記憶體單元係二進制 記憶體單元,則可執行圖 口y之耘序一次。若該等記憶體單 兀係多狀態記憶體單元,θ + 具有四種狀態(例如Ε、A、Β及 C),則可針對各記憶體罩 ,, Λ 兀執仃圖9之程序三次(三個感測 才呆作)。 一般而言,在該等讀敗 ^ ^ ^ ^ 及驗證操作期間,該選定字線係 連接至一讀取參考電壓,/ 卞 ^ ^ ιν . ^ , 一位準係指定用於各讀取及驗證 知作,以便决疋相關記憮 w 一 〜體早7〇之一臨限電壓是否已到達 124907.doc • 25 - 200822119 此位準。在施加字線電壓之後,測量該記憶體單元之傳導 電流,以決定是否回應施加至該字線之電壓接通該記憶體 單元。若測量該傳導電流大於一特定值,則假定該記憶體 單元接通且施加至該字線之電壓大於該記憶體單元之臨限 電壓。若測量該傳導電流不大於該特定值,則假定該記憶 體單元不接通且施加至該字線之電壓不大於該記憶體單元 之臨限電壓。 存在許多方法以在一讀取或驗證操作期間測量一記憶體 單元之傳導電流。在一範例中,一記憶體單元之傳導電流 係根據感測放大器中的一專用電容器的放電速率來測量。 在另一範例中,選定記憶體單元之傳導電流允許(或無法 允許)包括該記憶體單元之NAND串釋放位元線電荷。在一 段時間之後測量位元線上的電荷以查看其是否已放電。 圖9顯示在Vss(大約0伏特)開始的信號SGD、WL_unsel、 WLn+1、WLn、SGS、Selected BL、BLCLAMP及 Source。 SGD係汲極側選擇閘極之閘極選擇線。SGS係源極側選擇 閘極之閘極選擇線。WLn係選定用於讀取/驗證之字線。 WLn+Ι係至WLn之汲極側相鄰字線之未選定字線。 WL_unsel表示除該没極側相鄰字線外的其他未選定字線。 Selected BL係選定用於讀取/驗證之位元線。Source係用於 該等記憶體單元之源極線(參見圖3)。BLCLAMP係一類比 信號’其在從該感測放大充電時設定該位元線之值。應 注意,描述兩種形式的SGS、Selected BL及BLCLAMP。 一組該些信號 SGS (B)、Selected BL (B)及 BLCLAMP (B) 124907.doc -26- 200822119 描述用於一記憶體單元陣列之一讀取/驗證操作,其藉由 決定位元線是否已放電來測量一記憶體單元之傳導電流。 另一組該些信號 SGS (C)、Selected BL (C)及 BLCLAMP (C)描述用於一記憶體單元陣列之一讀取/驗證操作,其藉 由感測放大器内的一專用電容器之放電速率來測量一記憶 體單元之傳導電流。 首先,將關於 SGS (B)、Selected BL (B)及 BLCLAMP (B)來論述該等感測電路及記憶體單元陣列之行為,該等 感測電路及記憶體單元陣列涉及藉由決定位元線是否已放 電來測量一記憶體單元之傳導電流。在圖9之時間tl,SGD 係升高至Vdd(例如大約3·5伏特),該等未選定字線 (WL—unsel)係升高至Vread(例如大約5.5伏特),該汲極側 相鄰字線(WLn+Ι)係升高至VreadX,該選定字線WLn係升 高至Vcgr(例如,圖6、7及8A至8C之Vra、Vrb或Vrc)用於 一讀取操作或一驗證位準(例如圖11之Vva、Vvb或Vvc)用 於一驗證操作,而BLCLAMP (B)係升高至一預充電電壓以 預充電選定位元線Selected BL (B)(例如,至大約0.7 V)。 該些電壓Vread及VreadX用作傳遞電壓,因為其引起該等 未選定記憶體單元接通(無論物理狀態或臨限電壓)並用作 傳遞閘極。在時間t2,BLCLAMP (B)係降低至Vss,故 NAND串可控制位元線。同樣在時間t2,源極側選擇閘極 由於升高SGS (B)至Vdd而接通。此提供一路徑以消耗位元 線上的電荷。若選定用於讀取之記憶體單元之臨限電壓大 於Vcgr或施加至選定字線WLn之驗證位準,則該選定記憶 124907.doc -27- 200822119 體單元不會接通且該位元線不會放電,如信號線26〇所 示。若選定用於讀取之記憶體單元之臨限電壓小於^訂或 小於施加至選定字線WLn之驗證位準,則選定用於讀取之 記憶體單元會接通(傳導)且該位元線電壓會消耗,如信號 線262所示。在時間12之後及在時間〇之前的某時間點(由 特定實施方案來決定),該感測放大器將決定該位元線是 否已消耗一足夠數量。在12與13之間,升高BLCLAMp (b) 以使感測放大器測量所評估的BL電壓,然後降低。在時間 t3,該等所示信號將會降低至Vss(或用於備用或恢復之另 一值)。應注意,在其他具體實施例中,可改變該等信號 之某些仏號之時序(例如偏移施加至相鄰者之信號)。4 You are one of the master or verification programs that iterate during the various ## acts. Q I Ding is the iteration of the program of Fig. 9 for the use of each of the δ ** recalls. If the memory cells are binary memory cells, the order of the interface y can be performed once. If the memory is a multi-state memory cell and θ + has four states (such as Ε, A, Β, and C), then the program of Figure 9 can be executed three times for each memory mask ( Three senses are staying). In general, during the read failure ^ ^ ^ ^ and the verify operation, the selected word line is connected to a read reference voltage, / 卞 ^ ^ ιν . ^ , a standard is specified for each read and Verify the knowledge, so as to decipher the relevant record 一 w ~ one body 7 临 one of the threshold voltage has reached 124907.doc • 25 - 200822119 This level. After the word line voltage is applied, the conduction current of the memory cell is measured to determine whether the voltage applied to the word line is turned on to turn on the memory cell. If the measured conduction current is greater than a particular value, it is assumed that the memory cell is turned "on" and the voltage applied to the word line is greater than the threshold voltage of the memory cell. If the measured conduction current is not greater than the specific value, it is assumed that the memory cell is not turned on and the voltage applied to the word line is not greater than the threshold voltage of the memory cell. There are many ways to measure the conduction current of a memory cell during a read or verify operation. In one example, the conduction current of a memory cell is measured based on the rate of discharge of a dedicated capacitor in the sense amplifier. In another example, the conduction current of the selected memory cell allows (or is not allowed to) the NAND string release bit line charge including the memory cell. The charge on the bit line is measured after a period of time to see if it has been discharged. Figure 9 shows signals SGD, WL_unsel, WLn+1, WLn, SGS, Selected BL, BLCLAMP and Source starting at Vss (about 0 volts). The SGD system selects the gate selection line of the gate on the drain side. The source side of the SGS system selects the gate selection line of the gate. WLn is selected for the word line for reading/verification. WLn+ is tied to the unselected word line of the adjacent word line on the drain side of WLn. WL_unsel indicates other unselected word lines except the adjacent word line on the non-polar side. Selected BL is the bit line selected for reading/verification. Source is used for the source lines of these memory cells (see Figure 3). BLCLAMP is an analog signal that sets the value of the bit line when charging from the sense amplification. It should be noted that two forms of SGS, Selected BL, and BLCLAMP are described. A set of these signals SGS (B), Selected BL (B), and BLCLAMP (B) 124907.doc -26- 200822119 describes a read/verify operation for a memory cell array by determining bit lines Whether it has been discharged to measure the conduction current of a memory cell. Another set of these signals SGS (C), Selected BL (C), and BLCLAMP (C) are described for one read/verify operation of a memory cell array that is discharged by a dedicated capacitor within the sense amplifier. Rate to measure the conduction current of a memory cell. First, the behavior of the sensing circuits and memory cell arrays will be discussed with respect to SGS (B), Selected BL (B), and BLCLAMP (B). The sensing circuits and memory cell arrays are related to determining bit bits. Whether the line has been discharged to measure the conduction current of a memory cell. At time t1 of Figure 9, the SGD is raised to Vdd (e.g., about 3.5 volts), and the unselected word lines (WL-unsel) are raised to Vread (e.g., about 5.5 volts), the drain side phase The adjacent word line (WLn+Ι) is raised to VreadX, and the selected word line WLn is raised to Vcgr (eg, Vra, Vrb or Vrc of FIGS. 6, 7, and 8A to 8C) for a read operation or a The verify level (eg, Vva, Vvb, or Vvc of Figure 11) is used for a verify operation, and BLCLAMP (B) is boosted to a precharge voltage to precharge the selected bit line Selected BL (B) (eg, to approximately 0.7 V). The voltages Vread and VreadX are used as the transfer voltage because they cause the unselected memory cells to be turned on (regardless of physical state or threshold voltage) and used as a transfer gate. At time t2, BLCLAMP (B) is reduced to Vss, so the NAND string can control the bit line. Also at time t2, the source side selection gate is turned on by raising SGS (B) to Vdd. This provides a path to consume the charge on the bit line. If the threshold voltage of the memory cell selected for reading is greater than Vcgr or the verify level applied to the selected word line WLn, the selected memory 124907.doc -27-200822119 body unit will not be turned on and the bit line Will not discharge, as shown by signal line 26〇. If the threshold voltage of the memory cell selected for reading is less than or less than the verify level applied to the selected word line WLn, the memory cell selected for reading is turned on (conducted) and the bit is turned on. The line voltage is consumed as indicated by signal line 262. After time 12 and at some point prior to time ( (as determined by the particular implementation), the sense amplifier will determine if the bit line has consumed a sufficient amount. Between 12 and 13, BLCLAMp (b) is raised to cause the sense amplifier to measure the evaluated BL voltage and then decrease. At time t3, the signals shown will be reduced to Vss (or another value for standby or recovery). It should be noted that in other embodiments, the timing of certain apostrophes of the signals may be changed (e.g., the signal applied to the neighbors by the offset).

接著’將關於SGS (C)、Selected BL (C)及 BLCLAMP (C)論述該等感測電路及記憶體單元陣列之行為,其藉由 其釋放感測放大器中一專用電容器電荷之速率來測量一記 憶體單元之傳導電流。在圖9之時間tl,SGD係升高至 Vdd(例如,大約3.5伏特),該等未選定字線(WL—係 升兩至Vread(例如,大約5.5伏特),該汲極側相鄰字線 (WLn+Ι)係升高至Vreadx,該選定字線WLn係升高至 Vcgr(例如,圖^之乂^、Vrb或Vrc)用於一讀取操作或一 驗證位準(例如,圖11之Vva、Vvb或Vvc)用於一驗證操 作’並升高BLCLAMP (C)。在此情況中,該感測放大器保 持位元線電壓恆定,不管NAND串正在進行的操作,故該 感測放大器測量正在流動的電流,同時位元線”箝位”至該 電壓。因此,BLCLAMP (C)在tl上升且從tl至t3不會變 124907.doc -28- 200822119 化。在時間tl之後及在時間t3之前的某時間點(由特定實施 方案决疋)’ S亥感測放大器將決定在該感測放大器中的電 容器是否已消耗一足夠數量。在時間13,該等所示信號將 會降低至Vss(或用於備用或恢復之另一值)。應注意,在其 他具體實施例中,可改變該等信號之某些信號之時序。 . 圖10係說明用於從非揮發性記憶體單元(諸如依據圖6、 . 7或8A至8C程式化的該等記憶體單元)中讀取資料之一具體 實施例之一流程圖。圖10在系統位準提供讀取程序。在步 〇 驟3〇0 ’接收一要讀取資料之請求。在步驟302,回應該要 讀取資料之請求,執行一讀取操作用於一特定頁。在一具 體實施例中,當程式化一頁資料時,該系統將還產生用ς 錯誤校正碼(ECC)之額外位元並連同該資料頁一起寫入該 等ECC位元。ECC技術在此項技術中為人所熟知。所使用 的ECC程序可包括此項技術中所習知之任一適當ecc程 序。當從一頁讀取資料時,在步驟3〇4,該等Ecc位元將 〇 t用於決定資料中是否存在任何錯誤。該ECC程序可由該 控制器、該狀態機或在系統中的別處執行。若在資料中不 存在任何錯誤,則在步驟3〇6,向使用者報告資料。若在 步驟304發現-錯誤,則在步驟3〇8,決定該錯誤是否可校 正。該錯誤可能由於浮動閘極至浮動問極麵合或其他原因 所引起。各種ECC方法有能力校正_组資料中的_預定數 目錯誤。若該ECC程序可校正該資料,則在步驟31〇,使 用該ECC程序來校正該f料並在步驟312向使用者報告所 校正之資mc程序無法校正該資料,則在 124907.doc -29- 200822119 314執行一資料恢復程序。在某些具體實施例中,在步驟 314之後執行一ECC程序。下面說明關於資料恢復程序之 更多細節。在恢復資料之後,在步驟316報告該資料。在 步驟318,若欲在步驟32〇讀取或結束額外頁,則該程序迴 路返回至步驟302。應注意,圖15之程序可與使用全部位 元線程式化或奇/偶位元線程式化所程式化之資料一起使 用。 圖11係說明一用於執行一頁讀取操作之程序(圖10之步 驟302)之一具體實施例之一流程圖。圖丨丨之程序可執行用 於一頁,該頁包含一區塊之所有位元線、僅一區塊之奇數 位元線、僅一區塊之偶數位元線或一區塊之其他位元線子 集。在步驟340,將讀取參考電壓Vra施加至與該頁相關聯 之適當字線。在步驟342,感測與該頁相關聯之該等位元 線以基於施加Vra至其控制閘極來決定該等已定址記憶體 單元是否接通。傳導的位元線指示該等記憶體單元已接 通;因此該等記憶體單元之臨限電壓低於Vra(例如在狀態 E)。在步驟344,將用於該等位元線之感測之結果儲存於 用於該等位元線的適當鎖存器(例如,鎖存器2〇2)。在步驟 346,將讀取參考電壓Vrb施加至與讀取中頁相關聯之字 線。在步驟348,如上述感測該等位元線。在步驟35〇,將 該等結果儲存於用於該等位元線之適當鎖存器内。在步驟 352,將讀取參考電壓Vrc施加至與該頁相關聯之該等字 線。在步驟354,感測該等位元線以決定哪些記憶體單元 接通,如上述。在步驟356,將該感測步驟之結果儲存於 124907.doc •30- 200822119 用於該等位元線之適當鎖存器内。在步驟358,決定用於 各位元線之該等資料值。例如,若一記憶體單元在Vra處 傳導,則該記憶體單元係在狀態E中。若一記憶體單元在 Vrb及Vrc而非在Vra處傳導,則該記憶體單元係在狀態a 中。若記憶體單元在Vrc而非在Vra及Vrb處傳導,則記憶 體早元係在狀悲B中。右記憶體单元在Vra、Vrb或Vrc下不 傳導,則記憶體單元係在狀態C中。在一具體實施例中, 該等資料值係由處理器212來決定。在步驟360,處理器 2 12將該等決定資料值儲存於用於各位元線之適當鎖存器 (例如’鎖存器2 14)内。在其他具體實施例中,可採用不同 次序發生感測該等各種位準(Vra、Vrb及Vrc)。 步驟340至344可包括在Vcgr=Vra且VreadX=Vread下,執 行圖9所示之操作。步驟346至350可包括在Vcgr=VrbaNext, the behavior of the sensing circuits and memory cell arrays will be discussed with respect to SGS (C), Selected BL (C), and BLCLAMP (C), which are measured by the rate at which a dedicated capacitor charge in the sense amplifier is released. The conduction current of a memory cell. At time t1 of Figure 9, the SGD is raised to Vdd (e.g., about 3.5 volts), the unselected word lines (WL - two rises to Vread (e.g., about 5.5 volts), the bucker side adjacent words The line (WLn+Ι) is raised to Vreadx, and the selected word line WLn is raised to Vcgr (eg, 乂^, Vrb, or Vrc) for a read operation or a verify level (eg, 11 of Vva, Vvb or Vvc) is used for a verify operation 'and raises BLCLAMP (C). In this case, the sense amplifier keeps the bit line voltage constant, regardless of the ongoing operation of the NAND string, so the sense The amplifier measures the current being flowed while the bit line is "clamped" to this voltage. Therefore, BLCLAMP (C) rises at tl and does not change from t1 to t3 to 124907.doc -28- 200822119. After time t1 and At some point prior to time t3 (determined by the particular implementation), the S-sampling amplifier will determine if the capacitor in the sense amplifier has consumed a sufficient amount. At time 13, the signals shown will Reduce to Vss (or another value for standby or recovery). It should be noted that in other specific embodiments The timing of certain signals of the signals may be changed. Figure 10 illustrates the use of non-volatile memory cells (such as those memory cells programmed according to Figures 6, .7 or 8A through 8C). A flow chart of one of the specific embodiments of the reading data. Figure 10 provides a reading program at the system level. In step 3〇0', a request to read data is received. In step 302, the response should be read. Request for data, performing a read operation for a particular page. In a specific embodiment, when staging a page of material, the system will also generate additional bits for error correction code (ECC) along with the The data pages are written together with the ECC bits. ECC techniques are well known in the art. The ECC programs used may include any suitable ecc program as is known in the art. At step 3〇4, the Ecc bits are used to determine if there is any error in the data. The ECC program can be executed by the controller, the state machine, or elsewhere in the system. If there is any error, then in step 3〇6, to the user If the error is found in step 304, then in step 3〇8, it is determined whether the error is correctable. The error may be caused by floating gate to floating pole face or other reasons. Various ECC methods have the ability to correct The number of _ in the group data is incorrect. If the ECC program can correct the data, then in step 31, the ECC program is used to correct the material and in step 312, the user is notified that the corrected mc program cannot be corrected. For this information, a data recovery procedure is performed at 124907.doc -29- 200822119 314. In some embodiments, an ECC procedure is performed after step 314. More details on the data recovery procedure are explained below. After the data is restored, the data is reported at step 316. At step 318, if an additional page is to be read or terminated at step 32, the program loops back to step 302. It should be noted that the procedure of Figure 15 can be used with data that is stylized using all-bit threading or odd/even bit threading. Figure 11 is a flow chart showing one embodiment of a program for performing a one-page read operation (step 302 of Figure 10). The program of Figure 可执行 can be executed for one page, which includes all bit lines of one block, odd bit lines of only one block, even bit lines of only one block or other bits of one block A subset of meta lines. At step 340, the read reference voltage Vra is applied to the appropriate word line associated with the page. At step 342, the bit lines associated with the page are sensed to determine whether the addressed memory cells are turned "on" based on applying Vra to their control gates. The conductive bit lines indicate that the memory cells are turned on; therefore, the threshold voltage of the memory cells is lower than Vra (e.g., in state E). At step 344, the results of the sensing for the bit lines are stored in appropriate latches (e.g., latches 2〇2) for the bit lines. At step 346, the read reference voltage Vrb is applied to the word line associated with the page being read. At step 348, the bit line is sensed as described above. At step 35, the results are stored in appropriate latches for the bit lines. At step 352, the read reference voltage Vrc is applied to the word lines associated with the page. At step 354, the bit lines are sensed to determine which memory cells are turned "on" as described above. At step 356, the result of the sensing step is stored in 124907.doc • 30-200822119 for the appropriate latch of the bit line. At step 358, the data values for the individual lines are determined. For example, if a memory cell is conducted at Vra, the memory cell is in state E. If a memory cell is conducted at Vrb and Vrc instead of at Vra, the memory cell is in state a. If the memory unit is conducted at Vrc rather than at Vra and Vrb, then the memory is in the early B. The right memory unit is not conducting under Vra, Vrb or Vrc, and the memory unit is in state C. In a specific embodiment, the data values are determined by processor 212. At step 360, processor 22 stores the decision data values in appropriate latches (e.g., 'latch 2 14') for each bit line. In other embodiments, the various levels (Vra, Vrb, and Vrc) may be sensed in different orders. Steps 340 through 344 may include performing the operations illustrated in Figure 9 at Vcgr = Vra and VreadX = Vread. Steps 346 to 350 may be included in Vcgr=Vrba

VreadX=Vread下,執行圖9所示之操作。步驟352至356可 包括在Vcgr=Vrc且VreadX=Vread下,執行圖9所示之操 作。 在頃取操作期間’浮動閘極耗合可能會引起錯誤。因為 與儲存在一相鄰記憶體單元之浮動閘極或其他電荷儲存區 域(例如,介電電荷儲存區域)之電荷相關聯之電場耦合, 儲存在一記憶體單元之浮動閘極上之電荷可能經歷一表觀 偏移。儘管理論上來自一記憶體陣列内任一記憶體單元之 洋動閘極上之電荷的電場可耦合至該陣列内任一其他記情 體單元之浮動閘極,但該效應對於相鄰記憶體單元更加突 出且顯著。相鄰記憶體單元可包括在相同位元線上的相鄰 124907.doc -31- 200822119 記憶體單元、在相同字線上的相鄰記憶體單元或同時在一 相鄰位元線與相鄰字線上因而在一 对《綠方向上彼此相鄰 的相鄰記憶體單元。當讀取一纪愔 w 一 田口貝取〇己隐體早疋之記憶體狀態 時,該表觀電荷偏移可能造成錯誤。Under VreadX=Vread, the operation shown in FIG. 9 is performed. Steps 352 through 356 may include performing the operations shown in Fig. 9 at Vcgr = Vrc and VreadX = Vread. The floating gate lag during the capture operation may cause an error. Because of the electric field coupling associated with the charge stored in a floating gate or other charge storage region (e.g., a dielectric charge storage region) of an adjacent memory cell, the charge stored on the floating gate of a memory cell may experience An apparent shift. Although theoretically the electric field from the charge on the oceanic gate of any memory cell in a memory array can be coupled to the floating gate of any other semaphore cell in the array, the effect is for adjacent memory cells. More prominent and significant. Adjacent memory cells may include adjacent 124907.doc -31 - 200822119 memory cells on the same bit line, adjacent memory cells on the same word line, or both adjacent bit lines and adjacent word lines Thus in a pair of adjacent memory cells adjacent to each other in the green direction. This apparent charge shift may cause an error when reading the memory state of the 一 愔 一 田 田 田 〇 〇 隐 隐 隐 。 。 。 。 。 。 。 。 。 。 。 。 。

浮動閘極耦合之效應在一目標記憶體單元之後程式化相 鄰該目標記憶體單元之—記憶體單元之情形中極為突出, 但其效應還可在其他情形中看到。放置在_相鄰記憶體單 元之浮動閘極上之-電荷或該電荷之—部分將會透過電場 耦合有效地耦合至該目標記憶體單元,從而造成該目標記 憶體單元之臨限電壓之一表觀偏移。在程式化之後,一記 憶體單元之表觀臨限電壓可偏移至此一程度,使得在按期 望施加讀取參考電壓用於—在其曾希望程式化之記憶體狀 態中的一記憶體單元下,其不會接通與截止(傳導)。 一般而言,從相鄰於源極側選擇閘極線之字線(WL〇)起 程式化多列記憶體單元。其後遍及該等單元串按字線 (WL1、WL2、WL3等)依序進行程式化,使得在完成前面 字線(WLn)之程式化(將該等字線之各單元置於其最終狀 態)之後,在一相鄰字線(WLn+Ι)内程式化至少一資料頁。 此程式化之圖案由於浮動閘極耦合造成程式化後記憶體單 元之一臨限電壓之表觀偏移。對於除了一 NAND串之最後 字線外的每一欲程式化字線,在完成感興趣字線之程式化 之後會程式化一相鄰字線。添加至相鄰、稍後程式化字線 上之記憶體單元之浮動閘極之負電荷升高感興趣字線上的 記憶體單元之表觀臨限電壓。 124907.doc -32- 200822119 圖12圖形解釋浮動閘極至浮動閘極耦合之概念。圖12描 述相鄰浮動閘極372與374,其係在相同NAND串上。浮動 閘極372及374位於NAND通道/基板376上方,該NAND通 道/基板具有源極/汲極區域3 78、3 80及3 82。在浮動閉極 Γ Ο 3 72上方的係其所連接的控制閘極3 84與部分字線WLn。在 浮動閘極374上方的係其所連接的控制閘極386與部分字線 WLn+Ι。儘管浮動閘極372可能受到來自多個其他浮動閘 極之耦合的影響,但對於簡化,圖12僅顯示來自一相鄰記 憶體單元之效應。圖12顯示三個耦合成分,其係從浮動閘 極372相鄰者提供至該浮動閘極:1«1、1>2及(^。成分『1係相 鄰浮動閘極(372與374)之間的耦合比率,並作為該等相鄰 汁動閘極之電容除以浮動閘極327至其周圍所有其他電極 之所有電容性耦合之和來計算。成分r2係浮動閘極372與 汲極側相鄰控制閘極386之間的耦合比率,並作為浮動閘 極372與控制閘極386之電容除以浮動閘極327至其周圍所 有其他電極之所有電容性麵合之和來計算。成分心係控制 閘極麵合比率並作為浮動閘極374與其對應控制閘極⑽之 間的電容除以浮動閘極372至其周圍所有其他電極之所有 電容性麵合之和而計算。 圖13顯示在程式化一列記憶體單元(例如’ WLn)的相鄰 列(WLn+Ι)之前(實曲線)與之後(虛曲線)該列記憶體單元之 表觀臨限電壓分佈。各分佈係由於添加負電荷至相鄰字線 之該等記憶體單元之浮動閘極而加寬。因為浮動閘極麵 合’在脱州上的一猶後程式化記憶體單元之負電荷將會 124907.doc • 33 - 200822119 升鬲在連接至相同位元線之WLn上的一記憶體單元之表觀 臨限電壓。分佈400及402分別表示在程式化相鄰字線 WLn+Ι之前及之後在狀態A中的一選定字線WLn之單元。 分佈404及406分別表示在程式化WLn+1之前及之後在狀態 B中的WLn之單元。分佈408及41〇分別表示在程式化 WLn+Ι之後在狀態C中的WLn之單元。因為該等分佈被加 寬,故可能錯誤地讀取記憶體單元為在一相鄰狀態中。在 各分佈上之d丨思體單元可能具有在一對應讀取比較點上 方之一表觀臨限電壓。例如,在施加參考電壓Vrb時,程 式化至狀態A之特定記憶體單元可能因為其表觀臨限電壓 偏移而無法充分傳導。該些單元可能錯誤地讀取為在狀態 B中,從而引起讀取錯誤。該稍後程式化單元還可影響連 接至不同位元線之WLn之記憶體單元(諸如連接至相鄰位 元線之該等記憶體單元)的表觀臨限電壓。 圖14圖形描述可用於解決圖π所示之某些表觀臨限電壓 偏移之一讀取技術。圖15係一說明此技術之流程圖。當在 字線WLn上讀取資料時,還會讀取字線WLn+1之資料(步 驟420),且若在字線WLn+Ι上的資料已干擾在WL上的資 料,則用於WLn之讀取程序可補償該干擾。例如,當讀取 字線WLn時,可決定字線WLn+Ι處記憶體單元之狀態或電 荷位準資訊,以便選擇適當讀取參考電壓用於讀取字線 WLn之個別記憶體單元。圖11之程序可用於讀取WLn+Ι。 圖14描述個別讀取參考電壓,其用於基於在字線WLn+Ι處 的一相鄰記憶體單元之狀態來讀取WLn。一般而言,使用 124907.doc -34- 200822119 該等標稱讀取參考電壓Vra、Vrb及Vrc之不同偏移量(例 如,〇 V、0·1 V、〇·2 V、0.3 V)且在不同偏移量下的感測 之結果選擇作為在一相鄰字線上之一記憶體單元之狀態之 一函數。在一具體實施例中,字線WLn處的該等記憶體單 凡係使用該等不同讀取參考電壓之各讀取參考電壓(包括 偏移量)來感測。對於一給定記憶體單元,在該等讀取參 4電壓之一適當者冑的感測結果可基於在字線WLn+Ι處的 €、 一相鄰記憶體單元之狀態來加以選擇。 在某些具體實施例中’用於WLn+1之讀取操作決定在 WLn+l處所儲存之實際資料,而在其他具體實施例中,用 於WLn+1之讀取操作僅決定該些單元之電荷位準,其可能 或不可能精確地反映WLn+丨處所儲存之資料。在某些具體 實施例中,用於讀取WLn+1之該等位準及/或位準數目可 能並不與用於讀取WLn之該等位準及/或位準數目確切相 同。在一些實施方案中,浮動閘極臨限值之某近似值可足 O f用於WLn校正目的。在-具體實施例中,在跑+1處的 讀取結果可儲存於在各位元線處的鎖存器214内,以在讀 取WLn時使用(步驟422)。 可在未補償任何耦合效應之標稱讀取參考電壓位準 vra、Vrb及Vrc處針對感興趣字線WLn首先執行一讀取操 作(步驟424)。在該等標稱參考位準處的讀取結果係儲存於 用於以前決定WLn+1處相鄰單元在狀態E中的記憶體單元 之位元線之適當鎖存器内(步驟426)。對於其他位元線,忽 略資料並維持該WLn+i資料。在步驟428,接著使用該等 124907.doc -35- 200822119 讀取參考電壓之一第一組偏移量來執行一讀取操作用於字 線WLn。該讀取程序可在圖u之程序中使用+ 0·1 v)' Wbi + (U v)及Vrcl (Vrc + 01 V)。在步驟 ΟThe effect of the floating gate coupling is extremely prominent in the case of staging the memory cell adjacent to the target memory cell, but the effect can be seen in other situations. The portion of the charge or the charge placed on the floating gate of the adjacent memory cell will be effectively coupled to the target memory cell through the electric field coupling, thereby causing one of the threshold voltages of the target memory cell. Observed offset. After stylization, the apparent threshold voltage of a memory cell can be shifted to such an extent that a read reference voltage is applied as desired for a memory cell in a memory state in which it was desired to be programmed. Next, it will not turn on and off (conducted). In general, a multi-column memory cell is programmed from a word line (WL 〇) that selects a gate line adjacent to the source side. Subsequent to the string of words, the word lines (WL1, WL2, WL3, etc.) are sequentially programmed to complete the stylization of the preceding word lines (WLn) (the units of the word lines are placed in their final state) After that, at least one data page is programmed in an adjacent word line (WLn+Ι). This stylized pattern causes an apparent shift in the threshold voltage of one of the memory cells after stylization due to the floating gate coupling. For each word line to be programmed except for the last word line of a NAND string, an adjacent word line is programmed after completion of the stylization of the word line of interest. The negative charge of the floating gate of the memory cell added to the adjacent, later stylized word line increases the apparent threshold voltage of the memory cell on the word line of interest. 124907.doc -32- 200822119 Figure 12 graphically illustrates the concept of floating gate to floating gate coupling. Figure 12 depicts adjacent floating gates 372 and 374 that are tied to the same NAND string. Floating gates 372 and 374 are located above NAND channel/substrate 376 having source/drain regions 3 78, 3 80 and 382. Above the floating closed-end Γ Ο 3 72 is a control gate 3 84 to which it is connected and a partial word line WLn. Above the floating gate 374 is a control gate 386 to which it is connected and a portion of the word line WLn+1. Although floating gate 372 may be affected by coupling from a plurality of other floating gates, for simplicity, Figure 12 only shows the effect from an adjacent memory cell. Figure 12 shows three coupling components that are supplied from the neighboring floating gate 372 to the floating gate: 1«1, 1>2 and (^. Component "1 series adjacent floating gates (372 and 374) The coupling ratio between the two is calculated as the sum of the capacitances of the adjacent juice gates divided by the sum of all capacitive couplings of the floating gate 327 to all other electrodes around it. Component r2 is the floating gate 372 and the drain The coupling ratio between the side adjacent control gates 386 is calculated as the sum of the capacitance of the floating gate 372 and the control gate 386 divided by the capacitive sum of the floating gate 327 to all other electrodes around it. The heart system controls the gate face ratio and is calculated as the sum of the capacitance between the floating gate 374 and its corresponding control gate (10) divided by the sum of all capacitive faces of the floating gate 372 to all other electrodes around it. The apparent threshold voltage distribution of the column of memory cells before (real curve) and after (dummy curve) of a column of memory cells (eg, 'WLn). Negative charge to the floating of the memory cells of adjacent word lines The gate is widened. Because the floating gate is combined with the negative charge of a post-Jesus stylized memory cell on Dezhou, 124907.doc • 33 - 200822119 is raised on WLn connected to the same bit line. Apparent threshold voltages for a memory cell. Distributions 400 and 402 represent cells of a selected word line WLn in state A before and after staging adjacent word lines WLn+1, respectively. Distributions 404 and 406 represent The unit of WLn in state B before and after stylizing WLn+1. Distributions 408 and 41〇 represent the units of WLn in state C after stylized WLn+Ι, respectively, because the distribution is widened, It is possible to erroneously read the memory cells in an adjacent state. The dsian cells on each of the distributions may have an apparent threshold voltage above a corresponding read comparison point. For example, when a reference voltage is applied At Vrb, a particular memory cell that is programmed to state A may not be sufficiently conductive due to its apparent threshold voltage offset. These cells may be erroneously read as being in state B, causing a read error. Post-stylized units can also affect the connection Apparent threshold voltages of memory cells connected to WLn of different bit lines, such as those connected to adjacent bit lines. Figure 14 graphical depiction can be used to solve some of the tables shown in Figure π One of the techniques for reading the threshold voltage offset. Figure 15 is a flow chart illustrating the technique. When reading data on the word line WLn, the data of the word line WLn+1 is also read (step 420). And if the data on the word line WLn+Ι has interfered with the data on the WL, the reading procedure for WLn can compensate for the interference. For example, when the word line WLn is read, the word line WLn+Ι can be determined. The state or charge level information of the memory cells to select an appropriate read reference voltage for reading individual memory cells of word line WLn. The program of Figure 11 can be used to read WLn+Ι. Figure 14 depicts an individual read reference voltage for reading WLn based on the state of an adjacent memory cell at word line WLn+1. In general, use 124907.doc -34- 200822119 to read the different offsets of the reference voltages Vra, Vrb, and Vrc (for example, 〇V, 0·1 V, 〇·2 V, 0.3 V) and The result of the sensing at different offsets is selected as a function of the state of one of the memory cells on an adjacent word line. In one embodiment, the memory at word line WLn is sensed using respective read reference voltages (including offsets) of the different read reference voltages. For a given memory cell, the sensing result of one of the read reference voltages can be selected based on the state of the adjacent memory cell at the word line WLn+1. In some embodiments, the read operation for WLn+1 determines the actual data stored at WLn+1, while in other embodiments, the read operation for WLn+1 determines only those units. The level of charge, which may or may not accurately reflect the data stored at WLn+丨. In some embodiments, the number of levels and/or levels used to read WLn+1 may not be exactly the same as the number of levels and/or levels used to read WLn. In some embodiments, an approximation of the floating gate threshold may be sufficient for WLn correction purposes. In a particular embodiment, the read result at run +1 can be stored in latch 214 at each bit line for use in reading WLn (step 422). A read operation may first be performed for the word line of interest WLn at the nominal read reference voltage levels vra, Vrb, and Vrc that do not compensate for any coupling effects (step 424). The read results at the nominal reference levels are stored in appropriate latches for the bit lines used to previously determine the memory cells of the adjacent cells in state E at WLn+1 (step 426). For other bit lines, ignore the data and maintain the WLn+i data. At step 428, a read operation is then performed for the word line WLn using the first set of offsets of one of the reference voltages, 124907.doc - 35 - 200822119. The reader can use + 0·1 v) ' Wbi + (U v) and Vrcl (Vrc + 01 V) in the program of Figure u. In the step Ο

430,使用該些參考值之結果係儲存用於在狀態A中在 WLn+Ι處具有相鄰記憶體單元之記憶體單元内之位元線。 忽略用於其他位元線之資料。接著在圖丨丨之程序中使用讀 取參考位準 Vra2 (Vra + 0·2 V)、Vrb2 (Vrb + 〇 2 ”及力^ (Vrc + 0·2 V),在一第二組偏移量下在步驟432執行一讀取 操作。在步驟434,將該等結果儲存於用於在狀態在 WLn+丨處具有相鄰者之記憶體單元之位元線之鎖存器内。 忽略用於其他位元線之資料。在步驟436,在圖u之程序 内使用參考位準 Vra3 (Vra + 〇.3 v)、Vrb3 (Vrb + 〇 3 ^及 13〇^ + ().3¥),在—第三組偏移量下,執行—讀取操 作用於字線WLn。在步驟438,將該等結果儲存用於在 WLn+Ι的相鄰單元在狀態c中之記憶體單元之該等位元 線。在某些具體實施例中,在Vra不使用任何偏°移量,^ 為在狀態E與狀態A之間的更大自然邊界。此類具體實施 例係如圖14所示’纟中一單—讀取參考電壓^係描述在 狀態A位準。其他具體實施例還可使用用於此位準之偏移 量。圖此程序可用於恢復資料(例如,圖1Q之步驟314)或 作為一初始讀取程序(例如,步驟3〇2)。 該等標稱讀取參考電壓之不同偏移量可選擇作為在相鄰 字線上-記憶體單元之狀態之-函數。例如,_組偏移量 值可包括-0 V偏移量,其對應於在狀態E中的一相鄰單 124907.doc -36- 200822119 元、一0·1 V偏移量,其對應於在狀態A中的一相鄰單元、 一 0.2 V偏移量,其對應於在狀態B中的一相鄰單元、及一 〇·3 V偏移量,其對應於在狀態c中的一相鄰單元。該等偏 移量值將會依據實施方案而變化。在一具體實施例中,該 . #偏移量值等於由於-相鄰單元程式化至-對應狀態所產 生之表觀臨限電壓偏移數量。例如,〇·3 V可表示在程式 • 化WLn之後將在WLn+l的一相鄰單元程式化至狀態c時在 ^ WLn的一單元的表觀臨限電壓偏移。該等偏移量值不需要 對於每一參考電壓相同。例如,用於該Vrb參考電壓之該 等偏移量值可能係〇 V、Ο」ν、〇·2 乂及〇 3 V,而用於該 Vrc參考電壓之該等偏移量可能係〇 ν、〇15 ν、〇·25 ν及 〇·35 V。此外,偏移量增量不一定對於每一狀態相同。例 如,在一具體實施例中的一組偏移量可分別包括〇 V、〇. i V、0·3 V及0·4 V用於在狀態E、a、之相鄰單元。 另一用以補償浮動閘極耦合效應之技術提供補償給相鄰 〇 一選定記憶體單元之一記憶體單元,以便減小該相鄰記憶 體單元在该選定記憶體單元上的耦合效應。一此類具體實 施例包括在驗證程序期間設定用於稍後施加補償至相鄰記 憶體單元之所需條件。在此類具體實施例中,施加至 WLn+1之傳遞電壓(另外稱為Vread)從在選定字線中相互作 用的一典型值(例如)6 V減小至(例如)3 V。比較在程式化/ 驗證操作之驗證相位期間所使用之電壓,該補償由在WLn 上執行的讀取操作期間施加更高電壓至WLn+1所組成。該 補償可包括一變化/差量。AVread = {[Vread(在WLn讀取期 124907.doc -37- 200822119 間的WLn+l)]-[Vread(在WLn驗證期間的WLn+l)]}。在驗 證期間使用一較低Vread值之優點在於允許稍後在讀取操 作期間施加標稱Vread值,同時維持所需AVread。要不是 在驗證期間使用小於標稱Vread值之值,允許施加足夠 △Vread的在讀取期間的Vread必要值就不會係(例如)6 + 3=9 V,其將會係一可能引起讀取干擾條件之較大電壓。此類 稍後補償設定之一範例在圖9中描述為施加VreadX至汲極 側相鄰字線,同時其他未選定字線接收Vread。在許多先 前技術裝置中,所有未選定字線均會接收Vread。在圖9之 具體實施例中,除了汲極側相鄰者,所有未選定字線均會 接收Vread,同時沒極側相鄰者接收VreadX。 對於將記憶體單元從源極侧程式化至汲極側之驗證程 序,保證在寫入字線WLn時,在字線WLn+l上的所有記憶 體單元係在抹除狀態(例如,狀態E)(應注意:此對於完整 序列係真實的,但對於LM模式係不真實的。請參閱上述 解釋)。字線WLn+l將會接收一電壓位準VreadX,其中 VreadX=Vread4(如下述)。在一具體實施例中,Vread4等 於3.7 V。在另一具體實施例中,VreadX=Vread。在其他 具體實施例中,還可使用其他值。在不同實施方案中,可 基於裝置特性、實驗及/或模擬來決定不同Vread4或 VreadX 值。 在一具體實施例中,所需補償AVread之數量可按如下計 算: 124907.doc -38- 200822119 l^Vread - {/^VTn +1)-^—— 1+(rl)(Cr) 其中AVTn+l係在WLn之程式化/驗證時間與當前時間之 間汲極側相鄰者記憶體單元之臨限電壓變化。AVTn+l及 r 1係本方法所減輕之字線至字線寄生耗合之根本原因。 AVread係用以抵抗此效應之補償。 圖1 6係說明一用於使用前述技術來執行一初始讀取操作 (步驟302)或恢復資料(步驟3 14)之程序之一具體實施例之 ^ ' 一流程圖。圖16所示之程序適用於上面相對於圖11所述之 完整序列程式化,其中一邏輯頁之二位元係儲存於各單元 内並將一起讀取並報告。在步驟450,執行一用於相鄰字 線WLn+Ι之讀取操作。此可包括用於相鄰字線的圖11之程 序。在步驟452,將該等結果儲存於適當鎖存器内。 在步驟454,針對感興趣字線WLn,執行一讀取程序。 此可使用VreadX=Vreadl(圖9)來執行圖11之程序。在一具 體實施例中,Vreadl=Vread。因而,所有未選定字線(參 〇 見圖9之WL—unsel及WLn+Ι)接收Vread。此提供最大補 償,由於該補償係藉由在讀取操作期間現在在WLn+Ι上所 使用之Vread值與在程式化/驗證之驗證階段期間更早些所 使用之Vread值之間的差異來決定。補償值compC可按如 下定義·· compC=Vread 1 -Vreadp=5.5-3=2.5 v,其中 Vreadp 係在程式化/驗證期間所使用的Vread值。步驟454之該等 結果係在步驟456儲存於以前決定在WLn+Ι相鄰單元在狀 態C中(在步驟450)之記憶體單元之位元線之適當鎖存器 124907.doc -39· 200822119 内。因此,最大補償CompC係用於其汲極側相鄰者由於從 狀態E程式化至狀態C而經歷最高臨限電壓變化之單元。應 注意,該些汲極側相鄰者在WLn之程式化/驗證期間以前 在狀態E中,但現在在狀態C中。在所有情形下所需補償的 係在WLn寫入時間與WLn當前讀取時間之間所經歷的在 WLn+Ι上沒極側相鄰者之狀態變化。對於其他汲極側相鄰 者當前未偵測到在狀態C之位元線,忽略此WLn讀取之資 料,該WLn讀取使用在WLn+Ι上的Vreadl。 在步驟458,在汲極側相鄰者字線WLn+Ι接收Vread2 (VreadX=Vread2)下,針對WLn執行一讀取程序;其中比 較Vreadl,Vread2值更靠近在程式化驗證期間所使用的 Vreadp。遞送適用於汲極側相鄰者現在在狀態B中之更小 補償。一補償之範例係 compB=Vread2-Vreadp=4.9-3 = 1.9 V。因而,Vread2與Vreadp相差compB。在步驟460,將步 驟458之該等結果儲存用於在狀態B中在WLn+Ι處具有相鄰 記憶體單元之記憶體單元之位元線。忽略用於其他位元線 之資料。 在步驟462,在字線WLn+Ι接收Vread3情況下,針對 WLn執行一讀取程序。(VreadX=Vread3),其中比較 Vread2,Vread3在值上更靠近在程式化期間所使用之 Vreadp。遞送適用於汲極側相鄰者現在在狀態A中之一更 小補償數量。一補償數量之範例係compA=Vread3-Vreadp = 4.3-3 = 1.3 V。因而,Vread3 與 Vreadp相差 compA。在步驟 464,將步驟462之該等結果儲存用於在狀態A中在WLn+1 124907.doc -40- 200822119 處具有相鄰§己彳思體單元之記憶體單元之位元線。忽略用於 其他位元線之資料。 在步驟466,針對WLn執行一讀取程序,同時字線 WLn+Ι 接收 Vread4 (Vreadx=Vread4),其中 νΓ_4 與在程 式化期間所使用之Vreadp值相等。此不遞送任何適合於汲 • 極側相鄰者現在在狀態E中之單元之補償,由於其係在程 式化/驗證時間。該補償數量係 〇 =〇·0 V。在步驟468,將步驟466之該等結果儲存用於在狀 ,態E中在WLn+1處具有相鄰記憶體單元之記憶體單元之位 几線。忽略用於其他位元線之資料。在圖16之程序中,相 鄰位元線將會接收四個電壓。然而,讀取中WLn之各選定 記憶體單元只在一對應於其在WLn+丨處相鄰單元之狀態之 適當電壓處感測時使用或選擇該等結果。在不同實施方案 中,可基於裝置特性、實驗及/或模擬來決定不同 VreacU、Vread2、Vread3 及 Vread4之值。針對關於圖“之 〇 技術之更多資訊,請參閱Nima Mokhlesi的美國專利申請 案第1 1/384,057號,標題為”具有用於麵合補償之非揮發性 儲存之讀取操作”,其全部内容係以引用形式併入本文。 在涉及存取一非揮發性記憶體系統之典型操作中,主機 裝置將會請求可能跨越多個字線之多頁資料。傳統上,記 憶體系統以將資料程式化至多個記憶體字線之相同次序來 攸邊等字線讀取資料。字線一般開始於相鄰源極側選擇間 極之字線並結束於相鄰汲極側選擇閘極之字線而程式化, 但還可使用相反次序。回到圖3,包含連接至字線wl〇至 124907.doc -41- 200822119 WLi之早元的實體區瑜 兒將攸子線WL0開始程式化。在針對 字線WL0完成程式化該等 。一 寺。己^體早兀之後,程式化將會進 行至字線WL1、WL2等,处 、、σ果於子線WLi。當接收一請求 以從此實體區塊讀取所有 士 斤有貝枓時,讀取操作將會以與程式 化插作相同之方i ;隹^ 式進仃。碩取將會開始於字線WL0並隨後 依序進行直至到達字線WLi。 圖1 7係描述依據传用__V、夕An、上丄 尿使用或夕個補償之此類傳統技術讀取 —實體㈣區塊之方法之—流程圖。在圖17之範例中,一 貫體區塊包含四個字線並假定程式化開始於字線㈣並社 束於字線WL3。在步驟5〇〇’針對字線wu執行一讀取操 作。㈣取字線WL1時不使用任何補償,由於此讀取操作 僅執仃用以獲取可用於更精㈣取字線wL〇之資料或 位準貝机。在一具體實施例中,針對字線和執行讀取操 作係依據圖U之技術來執行。在針對字線和執行讀取择 ,之後,在步驟502儲存該等結果(資料值或電荷位準資 讯)。在一具體實施例中,步驟5〇2對應於圖丨1之步驟 360 ° 在儲存針對字線WL1之結果之後,在步驟5〇4使用一或 多個補償來讀取WL0。讀取自WLG之該等f料值係在牛驟 5〇6儲存於該等適當資料鎖存器214。在步驟5〇6針對^線 WL0執行讀取操作並儲存該等資料值之後,在步驟5〇/, 向主機報告來自字線WL0之資料。 在一具體實施例中,步驟504(及如下述步驟514、5 可包括在選定字線處執行若干子讀取。 524) 體實施例 124907.doc -42- 200822119 中’在步驟5G4(5 14、524)施加-或多個補償包括對應於圖 15之步驟424、428、432及436,執行四個子讀取(各包括 三個感測操作,假定四種狀態記憶體單元)。在另一具體 實施例中,步驟504(514、524)包括對應於圖16之步驟 454、458、462及466,執行四個子讀取(各包括三個感測 操作’假定四種狀態記憶體單元)。 • 在其他具體實施例中,可使用其他用於施加一或多個補 冑之技術。例如,可在某些具體實施例中,藉由施加一位 元線特定補償來使用-單一子讀取。相對於圖15及16所示 之以位兀線|主補償,一位元線特定補償可個㈣定址各 記憶體單元,使得各記憶體單元並行於一讀取中共同字線 之各其他記憶體單元同時接收其適當補償。一組條件係施 加該等字線’同時各位元線係基於在相鄰字線上該位元線 之相鄰記憶體單元之狀態來設定。依此方式,可使用一單 一子讀取。例如,用於決定在一施加讀取參考電壓下一單 〇 元是否傳導或非傳導之跳脫點電壓可基於用於該位元線之 WLn+Ι相鄰單元之狀態而裁剪用於各位元線。諸如積分時 間與預充電電壓之其他參數還可用於提供位元線特定補 償,使得可利用-單-子讀取。在一具體實施例中,可使 用該些各種參數之裁剪組合。 在步驟510,執行針對字線WL2之一讀取操作。在一具 體實施例中,步驟510同樣可包括執行圖n所示之讀取方 法。在讀取字線WL2時不使用任何補償,由於此讀取操作 僅執行用以獲取可用於更精確讀取字線wli之資料或電荷 124907.doc -43- 200822119 位準資訊。在步驟512儲存讀取自字線和之資料值或電 荷位準資汛。在一具體實施例中,步驟5 12對應於圖丨1之 步驟660。在儲存用於字線脱2之該等資料值或電荷位準 資訊之後’在步驟514,針對字線wu執行使用一或多個 補、償之-讀取操作。在步驟516所決定之該等資料值係在 步驟516儲存於適當資料鎖存器内並在步驟518向主機裝置 • 報告。 〇 在步驟52G ’針對字線机3執行-讀取操作,其可包括 執行圖11之方法。在步驟522,針對字線WL3 ,將該等資 料值或電荷位準資訊儲存於適當鎖存器内。在步驟m 針對字線WL2執行-讀取操作,其包括一或多個補償。用 於子線WL2之肖等資料值係在步驟526而健存於適當資料 鎖存器内並在步驟528向主機裝置報告。在步驟53〇,針對 字線机3執行一讀取操作。在圖17之範例中,字線wu係 用於該記憶體系統的最後一個欲程式化及言賣取字線。因此 〇 纟字線WL3處不使用任何補償。該等資料值係在步驟352 儲存用於字線WL3並在步驟534向主機報告。 如圖17所示’該些㈣㈣化字線之㈣次序進行讀取 之傳統技術在讀取除最後字線外的各選定字線時必須在相 鄰字線處進行額外讀取操作。例如,為了讀取字線机 必須先讀取字線WL1以確定其資料狀態或電荷位準資訊, 以便在讀取字線WL0時施加適當補償。在步㈣^取丄 線WL1以獲得其實際資料以供主機參照之前,必須=行: 用於子線WL2之讀取操作。該些額外讀取操 _ 、N加可能 124907.doc -44- 200822119 會由於要求更長時間來完成讀取操作而影響系統效能。 圖1 8係描述在某些具體實施例中在此類記憶體系統所必 須感測操作數目的一表格。在圖1 8中,描述一丨6字線實體 或抹除區塊。行550依次序列出實體區塊之字線,頁之頂 部之子線WL 15,即相鄰實體區塊之汲極側選擇閘極之字 線以及頁之底部之字線WL0,即相鄰用於該實體區塊之源 極側選擇閘極之字線。用於該等字線之該等記憶體單元之 Ο Ο 程式化序列係描述於行552内。程式化該實體區塊開始於 字線WL0並其後依序進行至字線WU5。用於讀取該實體 資料區塊之序列係描述於行554内。先讀取字線wl〇,隨 後字線WL1,並其後依序進行至字線和5。行別說明何 謂執行各字線讀取操作所必須。例如,為了讀取字線 WL0,必須先讀取字線和,如行…所示。在讀取字線 和以決定其資料值或電荷位準資訊之後,使用來自字線 WL1之貝訊來項取字線WL()以施加—適當補償(或 結果)。 订558提出各㈤取操作所必須之感測操作與子讀取㈣ :數目二再次參考字線WL〇’例如,在先讀取字線㈣ ^ ^ 呆作(假疋一四狀態記憶體單元)。使用 頃取參考位準vra執杆一 、 ^ ^ ^ 第一感測操作,使用第二讀取泉 考電壓位準Vrb^ " 一弟二感測操作並使用第三讀取參考 電壓位準Vrc執行一筮一 4 ^ ^ . 第一感測刼作。該些三個感測操作包 含在字線WL1處的一子綠 ^ .^ A 于靖取。在碩取字線WL 1之後,感姐 趣子線WL0係使用來自 " 子線WL 1之 > 料來讀取以施加或選 124907.doc -45- 200822119 擇在適當補償處的該等結果。讀取字線WL0涉及12個感測 操作’其對應於在字線冒“處的四個子讀取。一第一子讀 取包括在位準Vra、vrb及Vrc處的三個感測操作。一第二 子讀取包括在讀取參考位準Vra加上一第一偏移量、Vrb加 上一第一偏移量及Vrc加上一第一偏移量處的三個感測操 作。一第三子讀取包括在位準Vra加上一第二偏移量、Vrb 加上一第二偏移量及Vrc加上一第二偏移量處的三個感測 操作。最後’第四子讀取將包括在位準Vra加上一第三偏 移量、Vrb加上一第三偏移量及Vrc加上一第三偏移量處的 另外三個感測操作。或者,在一使用圖丨6所示之技術之方 案中’可使用在感測感興趣字線時施加不同vread位準至 相鄰字線。在此類技術中,該第一子讀取將會包括在字線 WL1接收Vreadl時在該等位準Vra、Vrb及Vrc處的三個感 測操作。一第二子讀取還會包括在字線WL1將接收Vread2 時施加讀取參考電壓位準Vra、Vrb及Vrc。該第三子讀取 將會包括在字線WL1接收Vread3時在該等Vra、Vrb及Vrc 位準處的三個感測操作。最後’第四子讀取將同樣包括在 子線WL1接收Vread4時施加讀取參考電壓位準yra、Vrb及 Vrc至字線WL0。總體上可看出,為了讀取實體區塊之各 字線,必須總計15個感測操作。此點對於除了欲讀取區塊 之最後字線外的該區塊之各字線。圖丨8在方框6丨〇中提出 感測操作總數。可看出’為了利用圖丨5或丨6之補償方案之 一來讀取一 16字線實體區塊,必須總數228個感測操作。 若在感興趣字線處的一單一子讀取下利用位元線特定補 124907.doc -46- 200822119 償,則可減小感測操作數目,但當讀取一選定字線時,讀 取將會包括用於相鄰子線的額外讀取。再次查看字線 WL0,仍會執行讀取字線WL1,但讀取WL0只會包括i個 子讀取(3個感測操作)。讀取所有16個字線時的感測操作總 數將會係93,如圖18所示。 Ο Ο 依據本揭不内容之具體實施例尋求減小用於跨越多個字 線之讀取操作的感測操作數目,例如回應一從一實體或抹 除區塊要求資料之請求的一讀取操作。圖19係一類似於圖 斤示之表秸併入依據—具體實施例之一反向讀取技 術。字線则至机15係列於行570内。該程式化序列開始 於字線WL0並結束於和5,如行572内所示。 订574提出項取序列,其開始於字線乳丄$並結束於字線 k擇並吻取该等字線以完成讀取序列574之方式係 1於行576内。料料字線之各字線,當選㈣於讀取 2 ’不必讀取任何其他字線以完成一補償技術。已知施加 ,選擇-適當讀取補償之該等結果用於選定字線所 二=:線?資訊。藉由反向讀取,可從該字線之已經 執订只貝5貝取操作中唯拉洙 … 取。例如,當在該序列之第16子個線^料„’藉此避免重複讀 WL0用於讀取時,可#取#作期間選擇字線 料。此對比圖18之行556内個執行的WL1讀取操作之資 線鶴,必技術,其中為了讀取字 字線WL1的讀取。 ' ,接者在-稍後時間重複在 在行5 7 8内提出成、丨 4㈣作之數目。當讀取字線WL15時, 124907.doc -47· 200822119 Ο Ο 執仃一子讀取及三個感測操作,由於WL15沒有任何稍後 程式化的相鄰者。接著讀取字線臀以斗。已知從字線 之記憶體單元所讀取之資料,然後在讀取字線WL14時維 持(例如,資料鎖存器214)。因此,需要12個感測操作的在 字線WL14處的四個子讀取係精確讀取字線所必需之全 4。將此與圖18對比’在圖18中讀取字線乳^先要求讀 取WL15 ’因而要求一額外子讀取及三個感測操作。方框 580提出在使用圖19之技術時感測操作總數。比較使用圖 18之技術的228 ’全部要求183個感測操作。藉由將感測操 作數目攸228減小至183 ’獲得讀取非揮發性記憶體系統時 的效能改良。若在感興趣字線處的一單一子讀取時利用位 元線特定補償,則感測操作總數將會係48。各字線將會使 用三個感測操作以一子讀取來加以讀取。此也會提供超過 傳統技術之改良,從而將感測操作數目從Μ減小至%。 圖叫W完整序肋式化、上下部頁程式化及最 後優先模式(LM)程式化所程式化之單元的一讀取序列。感 測操作及子讀取之數目可能對於上下部頁讀取或LM讀取 而不同,但習知此項技術者會明白此點。儘管出於示範目 的相料完整序列程式化單元來呈現大多數論述,但本揭 不内谷同樣適用於其他單元程序。 =㈣依據1於反向讀取一實體記憶體單元區塊之具 體實施例之方法之一流程圖。出於示範目的說明一四字線 =悲記憶、體系統,但所揭示技術可適用於具有其他數目 子線及記憶體狀態的系統。在步驟6〇〇讀取欲針對該實體 124907.doc -48- 200822119 區塊而程式化的最後字線WL3。因為,最後字線不具有一 稍後程式化的相鄰字線,則不使用任何補償且可施加圖u 之方法。蚊用於說3之該等資料值係儲存於各對應位元 線之鎖存器(例如,鎖存器214)内。該等資料值係在步驟 604處缓衝,以稍後向該主機裝置報告,如下文所述。使 用一或多個補償,在步驟6〇6針對字線WL2執行一讀取操 ’ # °可在一具體實施例中基於用於字線WL3在步驟_決 定的該等資料值來執行補償子讀取(例如,圖15或16)並選 ㈣於各位元線之適當讀取結果。或者,可施加—或多個 以位70線為主補償用於各位元線並利用一單一子讀取。在 步驟608,將從適當子讀取之資料值或在使用位元線補償 時來自單一子讀取之資料儲存於各位元線之資料鎖存器 内。在-具體實施例中,在步驟6G8,在步驟6()2處所共用 之該等資料值係使用該等WL2值來取代。如圖15及_ 示,可在步驟606處的該等子讀取之間或作為其部分來執 〇 <于步驟608。在一利用圖15之技術之具體實施例中,步驟 606及608可包括執行圖15之步驟似至438。在一利用圖η 所示不同Vread值之具體實施例中,步驟6〇6及6〇8可包括 執行圖16之步驟454至468。在該等鎖存II内儲存用於字線 WL2之資料值之後,在步驟61〇處緩衝該等資料值。 在步驟612,使用補償子讀取或位元線補償,針對字線 1執行項取操作。因為在步驟606讀取過字線WL2, 文貝取予線WL3不而要碩取字線WL2。在步驟6〇8儲存於 各位π線之鎖存器内的該等值可用以選擇適當讀取結果或 124907.doc •49- 200822119 軛加適當位疋線補償。在步驟614,將用於字線之該 等資料值儲存於該等資料鎖存器内。在-具體實施例中, 覆寫在步驟608儲存於該等鎖存器内的資料。在儲存用於 子線WL1之該等資料值之後,在步驟616處緩衝該等資料 值。在步驟618,利用補償子讀取或位元線補償,針對字 線WL0執行一讀取操作。在步驟62〇處將用於字線處 記憶體單元的該等資料值儲存於適當鎖存器内。在步驟 ^ 622,緩衝在步驟620處儲存的該等資料值。在步驟624, 向该主機或請求方裝置報告在步驟604、610、6 16及622處 所緩衝之資料。 圖21係說明一種用於向主機或請求方裝置報告資料之方 法之一流程圖,如在圖20之步驟624所執行。在步驟63〇重 新排序在步驟604、610、616及622處所緩衝之資料。重新 排序該資料可包括先放置來自字線WL〇之資料,隨後來自 字線WL1之資料,來自字線WL2之資料,最後來自字線 (j WL3之資料。該資料係以與在步驟604、610、616及622程 式化其之相反序列來放置於緩衝器内。一般而言,主機裝 置將以資料之程式化次序期待資料。因而,該資料被重新 排序以與該程式化序列一致。在步驟632,向該主機裝置 '報告來自字線WL0之資料。在步驟634,向該主機裝置報 告來自字線WL1之資料。在步驟636,向該主機裝置報告 來自字線WL2之資料,並最後在步驟638,向該主機裝置 報告來自字線WL3之資料。 缓衝該等資料值並將其向該主機報告可根據實施方案而 124907.doc -50- 200822119 ’欠化例如,可在讀取各個別字線之後向該主機報告來自 各字線之資料。例如,在讀取字線WL3並將資料值儲存於 该等鎖存器之後,可立即向該主機報告資料。在此具體實 把例中在步驟604緩衝該等資料值可能非必要。該主機 裝置將會以相反程式化次序接收該資料並在必要時重新排 序該資料。用於緩衝該資料之記憶體位置及類型可根據具 Μ實施例而變化。在一具體實施例中,該資料係緩衝於控 制器144内的一記憶體(例如RAM13 1)(圖4)内或可供控制器 144存取。該控制器可重新排序該資料並將其向該主機報 告。在另一具體實施例中,該資料係緩衝於在控制電路 12〇内的一記憶體内(諸如RAM 133)或可供控制電路12〇存 取。該控制電路或控制器可重新排序該資料用以由該控制 器遞送至該主機。 在一些實施方案中,緩衝與一實體區塊相關聯之大量資 料可能不實際或合乎需要。因此,在一具體實施例中’將 〇 Λ體區塊劃分成讀取區塊用以減小在-次需要緩衝之資料 量及因此用於緩衝之記憶體大小。該記憶體系統可反向讀 ㈣實體區塊(讀取區塊)之-部分,緩衝該資料並向該主 機裝置報告資料。該記憶體系統可在報告該資料時讀取該 實體區塊之下一讀取區塊,並在其位置内緩衝來自下一讀 取區塊之資料。必要時可儘可能多地執行此程序,直至已 讀取並報告該主機裝置所請求之整個實體區塊。依據不同 具體實施例,可來利用將該實體區塊劃分成個別讀取區塊 之各種大小及方式。 124907.doc -51 - 200822119 圖22係說明依據一具體實施例利用讀取區塊之一表格。 說明一 16字線實體區塊,但是可以一類似方式劃分其他大 小的實體區塊。在行650内從WL1 5至WL0所列之該等字線 係開始於字線WL0並其後依序進行至字線WL15來加以程 式化,如行652所示。已將圖21之實體區塊劃分成四個個 別讀取區塊。讀取區塊1包括字線WL0、WL1、WL2及 WL3。讀取區塊2包括字線WL4、WL5、WL6及WL7。讀取 區塊3包括字線WL8、WL9、WL10及WL11。讀取區塊4包 括字線WL12、WL13、WL14及WL15。還可使用更多或更 少的讀取區塊,包括不同數目的字線。 在行654内提出用於讀取該實體區塊之序列。當接收到 一要求資料(包括該實體區塊)之請求時,該記憶體系統開 始讀取並報告個別讀取區塊。該讀取序列開始於讀取區塊 1内的字線WL3。字線WL3係最後程式化用於此讀取區塊 者。在行656内提出用於讀取該選定字線之該等個別操 作。為了讀取字線WL3,先讀取其相鄰汲極側字線WL4。 可從字線W L 4之該等單元讀取實際資料值或電荷位準資 訊。當讀取字線WL4時,不利用任何補償。如行㈣内所 示可使用單一子讀取及三個感測操作(假定一四狀態 裝置)°在讀取字線WL4之後,讀取字線低3。在使用圖 15或16所不之一字線補償方案時,讀取字線包括四個 子謂取及12個感測操作。將基於在字線乳4處的對應相鄰 記憶體單元之狀態之用於各子讀取之該等資料值將被選擇 用於個別位元線。可在_具體實施例中替代性施加一適當 124907.doc -52- 200822119 位兀線補償。在讀取字線WL3之後,該讀取序列進行至字 線WL2。讀取字線WL2僅包括四個子讀取及以個感測操 作。不需在字線WL3處的一額外讀取操作之效能,由於已 知來自子線WL3之資料。在讀取字線WL2之後,該讀取序 列進行至字線WL1及字線WL〇。在讀取讀取區塊i並緩衝 資料之後,可向該主機裝置報告該資料。報告該資料可包 括重新排序該資料以開始於字線WL〇並結束於WL3,如圖 21所示。 在已向該主機裝置報告來自讀取區塊之資料之後,可讀 取讀取區塊2。在一具體實施例中,讀取讀取區塊2可在正 在報告來自讀取區塊1之資料時開始。來自讀取區塊2之資 料可在將其從緩衝記憶體報告給主機時替換來自讀取區塊 1之資料。讀取讀取區塊2開始於字線WL7,其包括第一讀 取字線WL8以便決定在讀取字線WL7時可使用之資料值或 電荷位準資訊。讀取讀取區塊2之剩餘部分如相對於讀取 區塊1所述進行,緩衝來自各字線之資料。可開始於來自 字線WL4之資料,接著字線WL5,接著字線WL6,並最後 字線WL7,重新排序資料並將其報告給該主機。 在從讀取區塊2讀取並報告資料之後,該記憶體系統將 會在字線WL11處開始從讀取區塊3讀取資料,如行654中 所示。讀取字線WL11將包括先讀取字線WL12w在讀取 WL11時施加補償,如行656所示。在基於來自字線 之資料讀取字線WL11並選擇該等適當值之後,將該資料 緩衝於記憶體系統内。讀取以一類似於已說明之方式接著 124907.doc -53- 200822119 進行至字線WL10、WL9及WL8。該記憶體系統將會開始 於字線WL8並結束於字線WL11來重新排序資料並將此資 料報告給該主機裝置。 在讀取讀取區塊3之後’該記憶體系統繼續讀取讀取區 塊4。Ί買取Ί買取區塊4開始於子線WL1 5 ’如行6 5 4内所干。 因為字線WL15係最後程式化者,故不必讀取任何其他字 線。在讀取字線WL15之後,使用來自WL15之資料來讀取 字線WL 14以施加一適當補償。在從讀取區塊4之剩餘字線 ^ 1 之各字線讀取並緩衝資料之後,可開始於字線WL12並結 束於字線WL15來重新排序資料並將其報告給該主機裝 置。圖22之讀取區塊劃分在使用一字線補償方案時利用總 計192個感測操作,如660處所示。若使用一位元線補償方 案,則使用57個感測操作。如查看圖18時可看出,圖22之 讀取區塊技術提供更少數目的感測操作,同時保持所需緩 衝記憶體大小縮小。 Q 圖23係描述一種使用個別讀取區塊以一反向方式讀取非 揮發性記憶體之方法之一流程圖。圖23之具體實施例係利 用四個讀取區塊之範例性條件而提出,如圖22先前所示。 然而,其他具體實施可包括不同數目的讀取區塊。在步驟 ’針對”二讀取區塊之第—字線執行一讀取操作。 該第一字線係指針對該第二讀取區塊欲程式化之第一字 線參考圖22,步驟70〇將會包括讀取字線肌4。在步驟 7^00處的δ買取#作不包括制任何補償子讀取(或位元線補 秘)因為°亥項取操作係目的用以獲得可在讀取源極侧相 124907.doc -54- 200822119 鄰字線時使用的資訊。在步驟702,將用於讀取區塊二之 第一字線之該等資料值(或電荷位準資訊)儲存於該等資料 鎖存器内。在步驟704,針對該第一讀取區塊執行一反向430. The result of using the reference values is a bit line stored in a memory cell having adjacent memory cells at WLn+Ι in state A. Ignore data for other bit lines. Then use the read reference level Vra2 (Vra + 0·2 V), Vrb2 (Vrb + 〇2 ” and force ^ (Vrc + 0·2 V) in the program of the figure, in a second set of offsets. A read operation is performed at step 432. At step 434, the results are stored in a latch for a bit line of a memory cell having a neighbor at a state of WLn+丨. For other bit lines, in step 436, the reference levels Vra3 (Vra + 〇.3 v), Vrb3 (Vrb + 〇3 ^ and 13〇^ + ().3¥) are used in the program of Figure u. At the third set of offsets, an execution-read operation is used for the word line WLn. At step 438, the results are stored for the memory cell of the adjacent cell of WLn+Ι in state c. Equipotential lines. In some embodiments, no offset is used at Vra, and ^ is a larger natural boundary between state E and state A. Such a specific embodiment is shown in Figure 14. '纟中单-read reference voltage^ is described in state A. Other embodiments may also use offsets for this level. This procedure can be used to recover data (eg, Step 314) of Figure 1Q or as an initial read procedure (e.g., step 3〇2). The different offsets of the nominal read reference voltages may be selected as the state of the memory cells on adjacent word lines. a function. For example, the _ group offset value may include a -0 V offset, which corresponds to a neighboring order 124907.doc -36 - 200822119 yuan in state E, a 0. 1 V offset, It corresponds to an adjacent cell in state A, a 0.2 V offset, which corresponds to an adjacent cell in state B, and a 〇·3 V offset, which corresponds to state c. An adjacent unit. The offset values will vary depending on the implementation. In a specific embodiment, the #offset value is equal to the table resulting from the stylization to the corresponding state of the adjacent unit. The number of threshold voltage offsets. For example, 〇·3 V can represent the apparent threshold voltage of a unit at WLn when a neighboring unit of WLn+1 is programmed to state c after WLn is programmed. Offset. The offset values need not be the same for each reference voltage. For example, the offset values for the Vrb reference voltage can be The system 〇V, Ο"ν, 〇·2 乂 and 〇3 V, and the offsets for the Vrc reference voltage may be 〇ν, 〇15 ν, 〇·25 ν, and 〇·35 V. The offset increments are not necessarily the same for each state. For example, a set of offsets in a particular embodiment may include 〇V, 〇.i V, 0·3 V, and 0.4 V for respectively. In the state E, a, adjacent cells. Another technique for compensating for the floating gate coupling effect provides compensation to one of the adjacent memory cells of a selected memory cell in order to reduce the adjacent memory cell The coupling effect on the selected memory cell. One such specific embodiment includes setting the conditions required to apply compensation to adjacent memory cells later during the verification procedure. In such embodiments, the pass voltage applied to WLn+1 (also referred to as Vread) is reduced from a typical value (e.g., 6 V) that interacts in a selected word line to, for example, 3 V. The voltage used during the verify phase of the stylization/verification operation is compared, which is composed of applying a higher voltage to WLn+1 during a read operation performed on WLn. The compensation can include a change/difference. AVread = {[Vread (WLn+1 in WLn read period 124907.doc -37-200822119)] - [Vread (WLn+l during WLn verification)]}. The advantage of using a lower Vread value during verification is to allow the nominal Vread value to be applied later during the read operation while maintaining the desired AVread. If a value less than the nominal Vread value is used during verification, the necessary value of Vread during the read that is allowed to apply sufficient ΔVread will not be (for example) 6 + 3 = 9 V, which would cause a possible read. Take the larger voltage of the interference condition. An example of such a later compensation setting is depicted in Figure 9 as applying VreadX to the drain side adjacent word line while other unselected word lines receive Vread. In many prior art devices, all unselected word lines receive Vread. In the particular embodiment of Figure 9, except for the drain side neighbors, all unselected word lines will receive Vread while the non-polar side neighbors receive VreadX. For the verification procedure of staging the memory cell from the source side to the drain side, it is guaranteed that all memory cells on the word line WLn+1 are erased when writing the word line WLn (eg, state E) ) (Note: This is true for the complete sequence, but not true for the LM mode. See above for explanation). Word line WLn+1 will receive a voltage level VreadX, where VreadX = Vread4 (as described below). In one embodiment, Vread4 is equal to 3.7 volts. In another embodiment, VreadX = Vread. Other values may also be used in other embodiments. In various embodiments, different Vread4 or VreadX values can be determined based on device characteristics, experiments, and/or simulations. In a specific embodiment, the amount of AVread required to be compensated can be calculated as follows: 124907.doc -38- 200822119 l^Vread - {/^VTn +1)-^—— 1+(rl)(Cr) where AVTn +l is the threshold voltage change of the memory cell of the left-side neighbor between the stylized/verified time of WLn and the current time. AVTn+l and r 1 are the root causes of the parasitic consumption of the word line to word line reduced by the method. AVread is used to compensate for this effect. Figure 16 illustrates a flow diagram of one embodiment of a procedure for performing an initial read operation (step 302) or restoring data (step 3 14) using the techniques described above. The procedure shown in Figure 16 applies to the complete sequence stylization described above with respect to Figure 11, in which the two-bit system of a logical page is stored in each unit and will be read and reported together. At step 450, a read operation for the adjacent word line WLn+1 is performed. This may include the procedure of Figure 11 for adjacent word lines. At step 452, the results are stored in the appropriate latches. At step 454, a read procedure is performed for the word line of interest WLn. This can be done using VreadX = Vreadl (Figure 9) to perform the procedure of Figure 11. In a specific embodiment, Vreadl = Vread. Thus, all unselected word lines (see WL-unsel and WLn+Ι in Figure 9) receive Vread. This provides maximum compensation since the compensation is due to the difference between the Vread value currently used on WLn+Ι during the read operation and the Vread value used earlier during the verification phase of the stylization/verification. Decide. The compensation value compC can be defined as follows·· compC=Vread 1 -Vreadp=5.5-3=2.5 v, where Vreadp is the Vread value used during stylization/verification. The results of step 454 are stored in step 456 as appropriate latches 124907.doc -39. 200822119 which were previously determined to be in the bit line of the memory cell of WLn+Ι neighboring cell in state C (at step 450). Inside. Therefore, the maximum compensation CompC is used for the unit whose neighboring side neighbors experience the highest threshold voltage change due to staging from state E to state C. It should be noted that the bungee-side neighbors were in state E before the stylization/verification period of WLn, but are now in state C. In all cases, the required compensation is the state change of the neighboring side of the WLn+Ι on the WLn+Ι between the WLn write time and the WLn current read time. For other bungee-side neighbors, the bit line in state C is not currently detected, and the data read by WLn is ignored. The WLn reads Vreadl used on WLn+Ι. At step 458, a read program is executed for WLn at the drain side neighbor word line WLn+1 receiving Vread2 (VreadX = Vread2); wherein Vreadl is compared, the Vread2 value is closer to the Vreadp used during the stylized verification. . Delivery is suitable for smaller compensation of the bungee side neighbors now in state B. An example of compensation is compB=Vread2-Vreadp=4.9-3 = 1.9 V. Thus, Vread2 differs from Vreadp by compB. At step 460, the results of step 458 are stored for bit lines of memory cells having adjacent memory cells at WLn+Ι in state B. Ignore data for other bit lines. At step 462, a read procedure is performed for WLn in the case where word line WLn+1 receives Vread3. (VreadX=Vread3), where Vread2 is compared, Vread3 is closer in value to Vreadp used during stylization. The delivery is suitable for the bungee side neighbors now having a smaller compensation amount in one of the states A. An example of a compensation amount is compA=Vread3-Vreadp = 4.3-3 = 1.3 V. Thus, Vread3 differs from Vreadp by compA. At step 464, the results of step 462 are stored for the bit line of the memory cell having the adjacent § 彳 彳 body unit at WLn+1 124907.doc -40 - 200822119 in state A. Ignore data for other bit lines. At step 466, a read routine is executed for WLn, while word line WLn+Ι receives Vread4 (Vreadx = Vread4), where ν Γ 4 is equal to the Vreadp value used during the characterization. This does not deliver any compensation for units that are now in the state E of the pole side neighbors, since they are tied to the programming/verification time. The number of compensations is 〇 = 〇 · 0 V. At step 468, the results of step 466 are stored for the bit lines of the memory cells having adjacent memory cells at WLn+1 in state E. Ignore data for other bit lines. In the procedure of Figure 16, the adjacent bit line will receive four voltages. However, each selected memory cell of the WLn in the read uses or selects the result only when sensing at an appropriate voltage corresponding to its state at the adjacent cell at WLn+丨. In various embodiments, the values of different VreacU, Vread2, Vread3, and Vread4 can be determined based on device characteristics, experiments, and/or simulations. For more information on the technology of the figure, please refer to U.S. Patent Application Serial No. 1 1/384,057 to Nima Mokhlesi, entitled "Reading Operation with Non-Volatile Storage for Face Compensation", all of which The content is incorporated herein by reference. In a typical operation involving accessing a non-volatile memory system, the host device will request multiple pages of data that may span multiple word lines. Traditionally, memory systems have been used to Stylize to the same order of multiple memory word lines to read the data lines such as the edge of the word line. The word line generally begins with the adjacent source side selects the word line of the interpole and ends with the word of the adjacent gate on the adjacent drain side. The line is stylized, but the reverse order can also be used. Returning to Figure 3, the physical area containing the early element connected to the word line wl〇 to 124907.doc -41- 200822119 WLi begins to program the scorpion line WL0. After the stylization of the word line WL0 is completed, a temple. After the body is completed, the stylization will proceed to the word lines WL1, WL2, etc., and σ is on the sub-line WLi. When receiving a request from this The physical block reads all the pounds have In the case of Bessie, the read operation will be the same as the stylized plug; the master will start at word line WL0 and then proceed sequentially until the word line WLi is reached. The description is based on the method of using the traditional technique of transmitting __V, eve An, upper urinary urinary use or eve compensation, the method of the physical (four) block-flow chart. In the example of Fig. 17, the consistent body block contains four The word lines are assumed to be stylized starting at word line (4) and converged on word line WL3. At step 5 〇〇 'a read operation is performed for word line wu. (4) No compensation is used when word line WL1 is taken, due to this read The fetch operation is only performed to obtain data or level bins that can be used to finer (d) the fetch line wL. In a specific embodiment, the word line and the read operation are performed according to the technique of FIG. After the reading is performed for the word line and the reading is performed, the results (data value or charge level information) are stored in step 502. In a specific embodiment, step 5〇2 corresponds to step 360 of Figure 1. After storing the result for the word line WL1, one or more compensations are used to read W in step 5〇4. L0. The f-values read from the WLG are stored in the appropriate data latch 214 at step 5. 6 after performing a read operation on the line WL0 and storing the data values in step 5. In step 5, /, the data from word line WL0 is reported to the host. In a specific embodiment, step 504 (and steps 514, 5 as follows may include performing several sub-reads at the selected word line. 524) Embodiment 124907.doc -42- 200822119 'In step 5G4 (5 14, 524) application - or multiple compensations comprising steps 424, 428, 432 and 436 corresponding to Figure 15, performing four sub-reads (each comprising three One sensing operation, assuming four state memory cells). In another embodiment, step 504 (514, 524) includes four sub-reads (each comprising three sensing operations) corresponding to steps 454, 458, 462, and 466 of FIG. unit). • In other embodiments, other techniques for applying one or more supplements may be used. For example, in some embodiments, a single sub-read can be used by applying a one-line specific compensation. Compared with the bit line|main compensation shown in FIGS. 15 and 16, one bit line specific compensation can be (4) address each memory unit, so that each memory unit is parallel to a common memory of a common word line in a read. The body unit receives its appropriate compensation at the same time. A set of conditions applies the word lines ' while the bit lines are set based on the state of adjacent memory cells of the bit line on adjacent word lines. In this way, a single sub-read can be used. For example, a trip point voltage for determining whether a single cell is conductive or non-conducting after applying a read reference voltage may be tailored for each bit based on the state of the WLn+Ι neighboring cell for the bit line. line. Other parameters such as integration time and pre-charge voltage can also be used to provide bit line specific compensation so that a single-sub-read can be utilized. In a specific embodiment, a combination of the various parameters can be used. At step 510, a read operation for one of word lines WL2 is performed. In a specific embodiment, step 510 can also include performing the read method illustrated in Figure n. No compensation is used when reading word line WL2, since this read operation is only performed to obtain information or charge 124907.doc -43- 200822119 level information that can be used to more accurately read word line wli. At step 512, the data value or the charge level information read from the word line is stored. In a specific embodiment, step 51 corresponds to step 660 of FIG. After storing the data values or charge level information for word line deselection 2, at step 514, one or more complement, reimbursement-read operations are performed for word line wu. The data values determined at step 516 are stored in the appropriate data latches in step 516 and reported to the host device in step 518.进行 Performing a read operation for word line machine 3 at step 52G', which may include performing the method of FIG. At step 522, the data value or charge level information is stored in the appropriate latch for word line WL3. A read operation is performed for word line WL2 at step m, which includes one or more compensations. The data values for the sub-line WL2 are stored in the appropriate data latches in step 526 and reported to the host device in step 528. At step 53A, a read operation is performed for the word line machine 3. In the example of Figure 17, the word line wu is used for the last stylized and sold word line of the memory system. Therefore, no compensation is used at the 纟 纟 word line WL3. The data values are stored in step 352 for word line WL3 and reported to the host at step 534. The conventional technique of reading in the (four) order of the (four) (four) word lines as shown in Fig. 17 must perform an additional read operation at the adjacent word lines when reading the selected word lines other than the last word line. For example, to read a word line machine, word line WL1 must first be read to determine its data state or charge level information to apply appropriate compensation when word line WL0 is read. Before step (4) ^ takes the line WL1 to obtain its actual data for the host to refer to, it must = line: for the read operation of the sub-line WL2. These additional read operations _, N plus may 124907.doc -44- 200822119 will affect system performance due to the requirement to complete the read operation for a longer time. Figure 18 is a table depicting the number of operations that must be sensed in such a memory system in some embodiments. In Figure 18, a 丨6 word line entity or erase block is described. The row 550 sequentially sorts out the word lines of the physical block, and the sub-line WL 15 at the top of the page, that is, the word line of the drain side selection gate of the adjacent physical block and the word line WL0 at the bottom of the page, that is, adjacent to The source side of the physical block selects the word line of the gate. The 程式 程式 stylized sequence of the memory cells for the word lines is depicted in row 552. Styling the physical block begins at word line WL0 and thereafter proceeds to word line WU5. The sequence for reading the physical data block is depicted in line 554. The word line wl 先 is read first, followed by the word line WL1, and then sequentially proceeds to the word line and 5. The line description explains what is necessary to perform each word line read operation. For example, to read word line WL0, the word line sum must be read first, as shown by line... After reading the word line sum to determine its data value or charge level information, the word line WL() is taken from the word line WL1 to apply - appropriate compensation (or result). 558 proposes the sensing operation and sub-reading necessary for each (5) fetch operation (4): the number 2 refers to the word line WL 〇 ' again, for example, the word line is read first (4) ^ ^ Stays (false one-four state memory unit ). Use the reference level vra to stick a ^, ^ ^ ^ first sensing operation, use the second reading spring test voltage level Vrb^ " a second two sensing operation and use the third read reference voltage level Vrc performs one-to-one 4^^. The first sensing action. The three sensing operations are included in a sub-green at the word line WL1. After the word line WL 1 is taken, the sorcerer line WL0 is read using the "sub-line WL 1> material to apply or select 124907.doc -45-200822119 at the appropriate compensation. result. The read word line WL0 involves 12 sensing operations 'which correspond to four sub-reads at the word line. A first sub-read includes three sensing operations at the levels Vra, vrb, and Vrc. A second sub-read includes three sensing operations at a read reference level Vra plus a first offset, Vrb plus a first offset, and Vrc plus a first offset. A third sub-read includes three sensing operations at a level Vra plus a second offset, Vrb plus a second offset, and Vrc plus a second offset. The four sub-reads will include three additional sensing operations at level Vra plus a third offset, Vrb plus a third offset, and Vrc plus a third offset. In a solution using the technique shown in FIG. 6, 'a different vread level can be applied to sense adjacent word lines when sensing the word line of interest. In such techniques, the first sub-read will be included in Three sense operations at word levels Vra, Vrb, and Vrc when word line WL1 receives Vreadl. A second sub-read will also include applying a read reference when word line WL1 will receive Vread2. The voltage levels Vra, Vrb, and Vrc. The third sub-read will include three sensing operations at the Vra, Vrb, and Vrc levels when word line WL1 receives Vread 3. Finally, the fourth sub-read It will also be included to apply the read reference voltage levels yra, Vrb and Vrc to the word line WL0 when the sub-line WL1 receives Vread 4. As can be seen in general, in order to read the word lines of the physical block, a total of 15 senses must be used. Operation. This point is for each word line of the block except the last word line of the block to be read. Figure 8 presents the total number of sensing operations in block 6丨〇. It can be seen that 'in order to utilize Figure 5 Or one of the compensation schemes of 丨6 to read a 16-word line physical block, a total of 228 sensing operations must be used. If a single sub-read at the word line of interest is used, the bit line is specifically supplemented with 124907.doc -46- 200822119 compensates, the number of sensing operations can be reduced, but when reading a selected word line, the reading will include additional reads for adjacent sub-lines. Looking at word line WL0 again, still executing Read word line WL1, but reading WL0 will only include i sub-reads (3 sensing operations). When reading all 16 word lines The total number of sensing operations will be 93, as shown in Figure 18. Ο 寻求 In accordance with a specific embodiment of the present disclosure, it is sought to reduce the number of sensing operations for read operations across multiple word lines, such as responding to a slave A physical or erased block requires a read operation of the request for data. Figure 19 is a cross-reading technique similar to the one shown in the figure - a specific example of the reverse reading technique. The series is in line 570. The stylized sequence begins at word line WL0 and ends at and 5, as shown in line 572. 574 proposes a sequence of items that begins at the word line and ends at word line k. The manner in which the word lines are kissed to complete the read sequence 574 is within line 576. Each word line of the material word line is selected (4) for reading 2' without having to read any other word lines to complete a compensation technique. It is known that the results of the application, selection-appropriate reading compensation are used to select the word line two =: line? News. By reverse reading, it can be taken from the word line that has been bound by only 5 贝. For example, when the 16th sub-line of the sequence is used to avoid repeated reading of WL0 for reading, the word line can be selected during ##. This is performed in line 556 of Figure 18. The WL1 read operation of the line crane, must technology, in order to read the word line WL1 read. ', the receiver at - later time repeated in the line 5 7 8 proposed, 丨 4 (four) for the number. When the word line WL15 is read, 124907.doc -47· 200822119 Ο 仃 performs one sub-reading and three sensing operations, since WL15 does not have any later stylized neighbors. Then reads the word line buttocks It is known that the data read from the memory cells of the word line is then maintained (e.g., data latch 214) while the word line WL14 is being read. Therefore, 12 sense operations are required at word line WL14. The four sub-reads are all necessary to accurately read the word line. This is compared with Figure 18. 'Reading the word line in Figure 18 first requires reading WL15' and thus requires an extra sub-read and three Sensing operation. Block 580 presents the total number of sensing operations when using the technique of Figure 19. Comparing the requirements of 228' using the technique of Figure 18 183 sensing operations. Improved performance when reading a non-volatile memory system by reducing the number of sensing operations 攸 228 to 183 '. If a single sub-read at the word line of interest utilizes bits For the specific compensation of the line, the total number of sensing operations will be 48. Each word line will be read by one reading using three sensing operations. This will also provide an improvement over conventional techniques, which will sense The number of operations is reduced from Μ to %. The picture is called a complete sequence of ribs, upper and lower page stylization, and a read sequence of the unit programmed by the last priority mode (LM) stylization. Sensing operation and sub-reading The number may differ for upper and lower page reads or LM reads, but those skilled in the art will appreciate this. Although for the purposes of the demonstration, the complete sequence of stylized units is presented for most of the discussion, but this is not The inner valley is also applicable to other unit programs. = (d) A flow chart of a method for reading a physical memory unit block in reverse according to 1. For a demonstration purpose, a four-word line = sad memory, body System, but the technology disclosed is applicable For systems with other numbers of sub-wires and memory states. At step 6, read the last word line WL3 to be programmed for the entity 124907.doc -48 - 200822119 block. Because the last word line does not have A later programmed word line, no compensation is applied and the method of Figure u can be applied. The mosquito is used to say that the data values of 3 are stored in the latches of the corresponding bit lines (for example, locks) The data values are buffered at step 604 for later reporting to the host device, as described below. Using one or more compensations, a step is performed for word line WL2 at step 6〇6. The read operation '#° may be performed in a specific embodiment based on the data values determined for the word line WL3 at step _ (for example, FIG. 15 or 16) and selected (four) for each of the bit lines. Read the results as appropriate. Alternatively, one or more of the bits 70 can be applied for the main line compensation for each bit line and with a single sub-read. At step 608, the data from the appropriate sub-read or the data from the single sub-read when the bit line compensation is used is stored in the data latch of each bit line. In a particular embodiment, at step 6G8, the data values shared at step 6() 2 are replaced with the WL2 values. As shown in Figures 15 and _, it may be executed between or as part of the sub-reads at step 606. <at step 608. In a particular embodiment utilizing the technique of FIG. 15, steps 606 and 608 can include performing the steps of FIG. 15 to 438. In a particular embodiment utilizing the different Vread values shown in Figure η, steps 6〇6 and 6〇8 may include performing steps 454 through 468 of Figure 16. After the data values for word line WL2 are stored in the latches II, the data values are buffered at step 61. At step 612, a item fetch operation is performed for word line 1 using compensator read or bit line compensation. Since the word line WL2 is read in step 606, the word line WL3 is not required to be the word line WL2. The value stored in the latch of each π line in step 6〇8 can be used to select the appropriate read result or 124907.doc •49- 200822119 yoke plus appropriate bit line compensation. At step 614, the data values for the word lines are stored in the data latches. In a particular embodiment, the data stored in the latches in step 608 is overwritten. After storing the data values for the sub-line WL1, the data values are buffered at step 616. At step 618, a read operation is performed on word line WL0 using compensator read or bit line compensation. The data values for the memory cells at the word line are stored in the appropriate latches at step 62. At step ^ 622, the data values stored at step 620 are buffered. At step 624, the data buffered at steps 604, 610, 6 16 and 622 is reported to the host or requester device. Figure 21 is a flow diagram illustrating one method for reporting data to a host or requestor device, as performed at step 624 of Figure 20. At step 63, the data buffered at steps 604, 610, 616, and 622 is reordered. Reordering the data may include first placing data from the word line WL, followed by data from the word line WL1, data from the word line WL2, and finally from the word line (j WL3 data. The data is in step 604, 610, 616, and 622 stylize their opposite sequences for placement in the buffer. In general, the host device will expect data in a stylized order of the data. Thus, the data is reordered to conform to the stylized sequence. Step 632, reporting the data from the word line WL0 to the host device. In step 634, reporting the data from the word line WL1 to the host device. In step 636, reporting the data from the word line WL2 to the host device, and finally At step 638, the data from word line WL3 is reported to the host device. Buffering the data values and reporting them to the host may be according to an implementation. 124907.doc -50 - 200822119 'Under normalization, for example, can be read Each individual word line then reports data from each word line to the host. For example, after reading word line WL3 and storing the data value in the latches, the data can be immediately reported to the host. It may not be necessary to buffer the data values in step 604 in this embodiment. The host device will receive the data in the reverse stylized order and reorder the data if necessary. The memory location for buffering the data and The type may vary depending on the embodiment. In one embodiment, the data is buffered within a memory (e.g., RAM 13 1) (Fig. 4) within controller 144 or accessible to controller 144. The controller can reorder the data and report it to the host. In another embodiment, the data is buffered in a memory (such as RAM 133) or available to control circuitry 12 within control circuitry 12A. The control circuit or controller may reorder the data for delivery by the controller to the host. In some embodiments, buffering a large amount of data associated with a physical block may not be practical or desirable. Therefore, in one embodiment, the memory block is divided into read blocks to reduce the amount of data that needs to be buffered in the current time and thus the memory size used for buffering. The memory system can be reversed. Reading (d) the portion of the physical block (read block), buffering the data and reporting the data to the host device. The memory system can read a read block below the physical block when the data is reported. And buffering the data from the next read block in its location. If necessary, the program can be executed as much as possible until the entire physical block requested by the host device has been read and reported. According to different embodiments, The various sizes and manners of dividing the physical block into individual read blocks can be utilized. 124907.doc -51 - 200822119 Figure 22 illustrates a table utilizing one of the read blocks in accordance with an embodiment. Line physical blocks, but other sizes of physical blocks can be divided in a similar manner. The word lines listed from WL1 5 through WL0 in row 650 begin at word line WL0 and then sequentially proceed to word line WL15 for programming, as shown at line 652. The physical block of Figure 21 has been divided into four individual read blocks. The read block 1 includes word lines WL0, WL1, WL2, and WL3. The read block 2 includes word lines WL4, WL5, WL6, and WL7. The read block 3 includes word lines WL8, WL9, WL10, and WL11. The read block 4 includes word lines WL12, WL13, WL14, and WL15. More or fewer read blocks can also be used, including a different number of word lines. A sequence for reading the physical block is proposed in line 654. Upon receiving a request for a request for material (including the physical block), the memory system begins to read and report individual read blocks. The read sequence begins with reading word line WL3 within block 1. Word line WL3 is the last stylized for this read block. These individual operations for reading the selected word line are presented in line 656. In order to read the word line WL3, its adjacent drain side word line WL4 is read first. The actual data value or charge level information can be read from the units of word line W L 4 . When the word line WL4 is read, no compensation is utilized. A single sub-read and three sensing operations (assuming a four-state device) can be used as shown in row (4). After reading word line WL4, the read word line is lower by three. When using the word line compensation scheme of Figure 15 or 16, the read word line includes four sub-predicates and 12 sensing operations. The data values for each sub-read based on the state of the corresponding adjacent memory cells at word line 4 will be selected for the individual bit lines. An appropriate 124907.doc -52 - 200822119 bit line compensation can be alternatively applied in the specific embodiment. After reading word line WL3, the read sequence proceeds to word line WL2. The read word line WL2 includes only four sub-reads and one sensing operation. The performance of an additional read operation at word line WL3 is not required since the data from sub-line WL3 is known. After the word line WL2 is read, the read sequence proceeds to the word line WL1 and the word line WL〇. After reading the block i and buffering the data, the data can be reported to the host device. Reporting the data may include reordering the data to begin at word line WL and ending at WL3, as shown in FIG. Reading block 2 can be read after the data from the read block has been reported to the host device. In a specific embodiment, the read read block 2 can begin when the data from the read block 1 is being reported. The material from the read block 2 can replace the data from the read block 1 when it is reported from the buffer memory to the host. The read read block 2 begins with word line WL7, which includes a first read word line WL8 to determine the data value or charge level information that can be used when reading word line WL7. The remainder of the read read block 2 is as described with respect to read block 1, buffering the data from each word line. The data from word line WL4 can be started, followed by word line WL5, followed by word line WL6, and last word line WL7, reordering the data and reporting it to the host. After reading from the read block 2 and reporting the data, the memory system will begin reading data from the read block 3 at word line WL11, as shown in line 654. Reading word line WL11 will include the first read word line WL12w applying a compensation when reading WL11, as shown by row 656. After the word line WL11 is read based on the data from the word line and the appropriate values are selected, the data is buffered in the memory system. The reading proceeds to word lines WL10, WL9 and WL8 in a manner similar to that already described, followed by 124907.doc -53-200822119. The memory system will begin at word line WL8 and end at word line WL11 to reorder the data and report this information to the host device. After reading the read block 3, the memory system continues to read the read block 4. ΊBuy Ί buy block 4 begins on the sub-line WL1 5 ’ as done in line 654. Since the word line WL15 is the last stylized person, it is not necessary to read any other word lines. After reading word line WL15, the data from WL15 is used to read word line WL 14 to apply an appropriate compensation. After reading and buffering the data from the word lines of the remaining word lines ^ 1 of the read block 4, the word line WL12 can be started and terminated at the word line WL15 to reorder the data and report it to the host device. The read block partitioning of Figure 22 utilizes a total of 192 sensing operations when using a word line compensation scheme, as shown at 660. If a one-line compensation scheme is used, 57 sensing operations are used. As can be seen by looking at Figure 18, the read block technique of Figure 22 provides a smaller number of sensing operations while maintaining the required buffer memory size reduction. Q Figure 23 is a flow chart showing a method of reading non-volatile memory in a reverse manner using individual read blocks. The embodiment of Figure 23 is presented with exemplary conditions for four read blocks, as previously shown in Figure 22. However, other implementations may include different numbers of read blocks. Performing a read operation on the first word line of the 'reading' two read block. The first word line pointer refers to the first word line to be programmed for the second read block, and FIG. 〇 will include reading the word line muscle 4. The δ buy # at step 7^00 does not include any compensator reading (or bit line complement) because the ° item is used for the purpose of the system. Information used in reading the source side phase 124907.doc -54 - 200822119 adjacent word line. In step 702, the data value (or charge level information) for reading the first word line of block 2 will be used. Stored in the data latches. At step 704, a reverse is performed for the first read block

Ο 讀取。反向讀取該第一讀取區塊將先包括基於該第二讀取 區塊之第一字線使用補償來讀取該第一讀取區塊之最後字 線。該最後字線之各位元線將會基於從讀取該第二讀取區 塊之第一字線所決定之資訊來儲存來自適當子讀取之資料 等。在讀取該第-讀取區塊之最後字線之後,將讀取該第 -讀取區塊之第=至最後字線並基於該第一讀#區塊之最 後字線之先前讀取來選擇該資料值。此將繼續,直至已讀 取欲程式化的該第一讀取區塊之第一字線。再次參考圖 22 ’步驟7G4將包括讀取字線WL3,接著字線饥2,接著 字線WL1並最後字線WL〇 在步驟706,該記憶體系統將 會緩衝讀取自該第-讀取區塊之資料。在—具體實施例 中,緩衝將會包括在步驟704已讀取來自該第一讀取區塊 之各個別字線之資料之後緩衝其。在緩衝該資料並讀取該 第一讀取區塊之各字線之後,該記憶體系統將會重新排序 該資料以對應於將該資料程式化至該讀取區塊之次序。再 次參考圖22,此將會包括重新排序該資料以開始於來自字 線WL0之資料並結束於來自字線和之資料。在步驟而 已經重新排序該資料之後,在步驟7〇8該記憶體系統向該 主機裝置報告該第一讀取之資料。 在步驟710,針對該第三讀取區塊之第一字線執行一讀 取操作。再次參考圖22,步驟71G將會包括讀取讀取區塊3 124907.doc -55- 200822119 之字線WL8。用於讀取區塊3之第一字線之讀取操作不會 包括補償。在步驟712,讀取自讀取區塊3之第一字線之該 等資料值係儲存於該等鎖存器内。在步驟7丨4,執行用於 该第二讀取區塊之一反向讀取操作。此反向讀取操作將會 先包括基於在步驟710讀取讀取區塊3之第一字線所決定之 資訊,利用補償讀取讀取區塊之最後字線。再次參考圖 22 ’執行步驟714可包括讀取字線WL7(使用來自WL8之資 料),隨後字線WL6(使用來自WL9之資料),字線WL5(使 用來自WL6之資料)並最後字線WL4(使用來自WL5之資 料)。在步驟716,緩衝來自反向讀取讀取區塊二之資料。 同樣緩衝該資料可包括在讀取讀取區塊2之各個別字線之 後緩衝該資料。在已讀取各字線並緩衝該資料之後,該記 十思體系統還將在步驟71 6重新排序讀取區塊2之資料。在重 新排序該資料之後,在步驟718向該主機裝置報告該資 料。再次參考圖22 ’步驟718可包括報告來自字線WL4之 資料,接著來自字線WL5之資料,接著來自字線冒!^之資 料,並以來自字線WL7之資料結束。 在步驟720,執行用於該第四讀取區塊之第一字線的一 讀取操作。同樣地,此可包括讀取字線WL12,如圖22中 用於字線WL11之行内所示。在步驟722,用於該第四讀取 區塊之第一字線之該等資料值係儲存於該等資料鎖存器 内。在步驟724,針對讀取區塊1及2如所述執行用於該第 二碩取區塊之一反向讀取操作。此將會包括讀取該第三讀 取區塊之最後字線以先加以程式化。在步驟726,該記憶 124907.doc -56- 200822119 Ο Ο 體系統將會以最初程式化資料之次序來緩衝並重新排序資 料。在步驟728,向該主機裝置報告所重新排序資料。在 步驟730,執行該第四讀取區塊之一反向讀取。因為該第 四讀取區塊係最後讀取區塊並包括欲針對該實體區塊加以 私式化的最後字線,故不必讀取讀取區塊4外面的任何字 線。在圖22之具體實施例中反向讀取讀取區塊4可包括讀 取字線WL15,接著字線WL14,接著字線WLn,並以字 線WL12結束。在步驟732緩衝來自該等個別字線之資料。 還在步驟732,該記憶體系統將會重新排序該資料以從來 自字線WL12之資料開始並以來自字線WL15之資料結束。 在步驟734接著向主機裝置報告該重新排序資料。 在-具體實施例中,依次利用從主機裝置所請求之資料 之私限大小以決定是否執行反向讀取操作及執行程度。圖 24描述利用二個此類臨限值之—具體實施例。在步驟 谓,從該主機裝置接收一要讀取資料之請求。在步驟 :42’該記憶體系統決定所請求資料之大小。在步㈣4, 該記憶體系統將該請求資料之大小與_第—臨限值進 較。若該請求資料大小小於該第_臨 行任何反向讀取操作。古亥主機 '"貝厂,、,則不執 妨“ 機震置將會已經請求一小量眘 料並為了有效率地處理該 、 ^ 貝枓,該記憶體系統將會体读取 Read. Reversing the first read block will include first reading the last word line of the first read block based on the first word line of the second read block. The bit lines of the last word line will store data from the appropriate sub-reads based on information determined from reading the first word line of the second read block. After reading the last word line of the first read block, the first to last word lines of the first read block are read and based on the previous read of the last word line of the first read # block To select this data value. This will continue until the first word line of the first read block to be programmed is read. Referring again to Figure 22, step 7G4 will include reading word line WL3, followed by word line hunger 2, then word line WL1 and last word line WL 〇 at step 706, the memory system will buffer read from the first read Block information. In a particular embodiment, the buffering will include buffering the data from the respective word lines of the first read block after step 704 has been read. After buffering the data and reading the word lines of the first read block, the memory system will reorder the data to correspond to the order in which the data is programmed into the read block. Referring again to Figure 22, this will include reordering the data to begin with data from word line WL0 and ending with data from the word line. After the data has been reordered in steps, the memory system reports the first read data to the host device in step 7〇8. At step 710, a read operation is performed for the first word line of the third read block. Referring again to Figure 22, step 71G will include reading the word line WL8 of the read block 3 124907.doc -55 - 200822119. The read operation for reading the first word line of block 3 does not include compensation. At step 712, the data values read from the first word line of the read block 3 are stored in the latches. At step 7丨4, a reverse read operation for one of the second read blocks is performed. This reverse read operation will first include reading the last word line of the read block using the compensation based on the information determined by reading the first word line of the read block 3 at step 710. Referring again to FIG. 22 'Execution step 714 may include reading word line WL7 (using data from WL8), followed by word line WL6 (using data from WL9), word line WL5 (using data from WL6), and last word line WL4 (Use data from WL5). At step 716, the data from the reverse read read block 2 is buffered. Also buffering the data may include buffering the data after reading the respective word lines of the read block 2. After the word lines have been read and the data has been buffered, the tenth system will also reorder the data of the read block 2 in step 71. After reordering the data, the data is reported to the host device at step 718. Referring again to Figure 22, step 718 can include reporting data from word line WL4, followed by data from word line WL5, followed by information from word line and ending with data from word line WL7. At step 720, a read operation for the first word line of the fourth read block is performed. Likewise, this can include reading word line WL12 as shown in the row for word line WL11 in FIG. In step 722, the data values for the first word line of the fourth read block are stored in the data latches. At step 724, a reverse read operation for one of the second getter blocks is performed as described for read blocks 1 and 2. This will include reading the last word line of the third read block to be stylized first. At step 726, the memory 124907.doc -56-200822119 Ο 系统 system will buffer and reorder the data in the order of the original stylized data. At step 728, the reordered material is reported to the host device. At step 730, a reverse read of one of the fourth read blocks is performed. Since the fourth read block is the last read block and includes the last word line to be privateized for the physical block, it is not necessary to read any word lines outside the read block 4. In the embodiment of Fig. 22, the reverse read read block 4 may include a read word line WL15 followed by a word line WL14 followed by a word line WLn and ending with a word line WL12. The data from the individual word lines are buffered at step 732. Also in step 732, the memory system will reorder the data to begin with data from word line WL12 and end with data from word line WL15. The reordering material is then reported to the host device at step 734. In a particular embodiment, the amount of privacy of the data requested from the host device is utilized in turn to determine whether to perform a reverse read operation and a degree of execution. Figure 24 depicts a specific embodiment utilizing two such thresholds. In the step, a request to read data is received from the host device. At step : 42' the memory system determines the size of the requested data. In step (4) 4, the memory system compares the size of the requested data with the _first-threshold value. If the requested data size is smaller than the first reverse read operation. Guhai host '"Bei factory,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

速地項取該請求資料並將其提供給該主機裝置。 L 750執行一使用補償之標準讀取操作.__ 乂驟 中,將會如圖15或圖16所示來執在在—具體實施例 作。例如,若該請求資料之大=步::5。執行的操 對應於一字線或更小,則 124907.doc -57- 200822119 該記憶體系統可讀取適當相鄰字線,如圖丨5之步驟420或 圖16之步驟450所示。在讀取該相鄰字線之後,將會利用 補償子讀取來讀取該選定字線,如圖15之步驟422至43 8或 圖15之步驟452至468所示。還可使用位元線補償。若該請 求資料之大小對應於一個以上的字線,則圖15及圖16之個 別效能可用於讀取該等多個字線。 若該請求資料之大小大於該第一臨限值,則在步驟 、 746,该記憶體系統將會比較該請求資料之大小與一第二 臨限值。該第二臨限值大小係大於該第一臨限值。若該請 求貧料之大小係大於該第一臨限值,但小於該第二臨限 值’則在步驟752執行一或多個讀取區塊之一反向讀取操 作例如,可在步驟752執行包含該請求資料之讀取區塊 (例如讀取區塊1)之一反向讀取。若該請求資料之大小大於 該第二臨限值,則可在步驟748執行用於一或多個實體區 塊之一反向讀取操作。 Q 可利用圖24中所揭示技術之各種變更。例如,若該請求 資料不大於該第一臨限值,則可在所有情況中執行至少一 讀取區塊之一反向讀取。該主機可稍後請求該資料且讀取 並緩衝其以免摘後讀取可能較有效率。在此情況中,在步 驟752反向讀取一或多個讀取區塊可能始終包括反向讀取 至少二讀取區塊。另一具體實施例可利用—單一臨限值。 在此情況中,若該請求資料小於一第一臨限值大小,則該 記憶體系統可執行圖15及16所示之標準讀取操作,而不進 行反向讀取。在另-類似具體實施例中,若該請求資料小 124907.doc -58 - 200822119 於4第一臨限值大小,則該記憶體系統可開始於該請求字 ,,接著以相反程式化方向繼續至實體區塊之結束來反向 '只體區塊。另一選項可包括在開始反向讀取之前在程 弋匕方向上移動右干字線。在使用一臨限值之情況下,若 孩明求貝料之大小大於該臨限值大小,則該記憶體系統可 反向讀取該(等)對應實體區塊。 出於例示及說明目的,已呈現前述詳細說明。並不希望 徹底詳盡或將本發明限於所揭示的精確形式。在以上教導 的啟發下,可進行許多修改及變更。所述具體實施例係選 擇以便最清楚地說明本發明之原理及其實際應用,從而使 其他習知此項技術者能在各種具體實施例中並採用適合於 所預期特定用途之各種修改來最佳地利用本發明。希望本 發明之範疇係由隨附申請專利範圍來加以定義。 【圖式簡單說明】 圖1係一 NAND串之俯視圖。 圖2係圖1之NAND串之一等效電路圖。 圖3係一 NAND快閃記憶體單元陣列之一方塊圖。 圖4係一非揮發性記憶體系統之一方塊圖。 圖5係一感測區塊之一具體實施例之一方塊圖。 圖6描述一組範例性臨限電壓分佈與一完整序列程式化 程序。 圖7描述一組範例性臨限電壓分佈與一上部頁/下部頁程 式化程序。 圖8A至8C描述一組範例性臨限電壓與一兩遍式程式化 124907.doc -59- 200822119 程序。 間特定信號行為之一時序 圖9係解釋在讀取/驗證操作期 圖0 圖10係用於讀取非揮發性記憶體之 程圖。 一具體實施例之〆 流 圖11係用於執行一用於非揮發性記憶體之讀取操作之〆 具體實施例之一流程圖。 Ο Ο 圖12係㈣在二個相鄰記憶體單元之間電容耗合之一方 塊圖。 圖13係說明浮動閘極搞合之效應之—組範例性臨限電壓 分佈。 圖14係說明一用於補償浮動閘極耦合之一技術之之一組 範例性臨限電壓分佈。 圖15係用於使用圖14之技術補償浮動閘極搞合之一流程 圖。 圖16係用於使用另一技術補償浮動閘極柄合之一流程 圖。 圖1 7係說明依據先前技術使用補償讀取一組記憶體單元 之一次序之一流程圖。 圖1 8係說明依據先前技術使用補償讀取一組記憶體單元 之一表格。 圖19係說明依據一具體實施利使用補償讀取一組記憶體 單元之一表格。 圖20係依據一具體實施例用於使用補償讀取一組記憶體 124907.doc -60- 200822119 早元之一流程圖。 圖川系依據一具體實施例用於向一主機報告資料之流程 圖。 圖22係說明依據一具體實施例使用讀取區塊在補償下讀 取一組記憶體單元之一表格。 圖23係依據一具體實施利用於使用讀取區塊讀取一組記 憶體單元之一流程圖。The quick item takes the request data and provides it to the host device. The L 750 performs a standard read operation using compensation. The __ step will be implemented as shown in Fig. 15 or Fig. 16. For example, if the request data is large = step::5. The operation performed corresponds to a word line or smaller, then 124907.doc -57- 200822119 The memory system can read the appropriate adjacent word lines, as shown in step 420 of Figure 5 or step 450 of Figure 16. After reading the adjacent word line, the selected word line will be read using the compensator read, as shown in steps 422 through 43 8 of Figure 15 or steps 452 through 468 of Figure 15. Bit line compensation can also be used. If the size of the request data corresponds to more than one word line, the individual performance of Figures 15 and 16 can be used to read the plurality of word lines. If the size of the request data is greater than the first threshold, then at step 746, the memory system will compare the size of the request data with a second threshold. The second threshold size is greater than the first threshold. If the size of the requested lean material is greater than the first threshold, but less than the second threshold, then performing one of the one or more read blocks in step 752 to perform a reverse read operation, for example, in steps 752 performs a reverse read of one of the read blocks (eg, read block 1) containing the requested data. If the size of the request profile is greater than the second threshold, then a reverse read operation for one of the one or more physical blocks may be performed at step 748. Q can utilize various variations of the techniques disclosed in FIG. For example, if the request profile is not greater than the first threshold, then one of the at least one read block can be reverse read in all cases. The host can request this material later and read and buffer it to avoid post-fetch readings that may be more efficient. In this case, reading one or more read blocks in reverse at step 752 may always include reverse reading at least two read blocks. Another embodiment may utilize a single threshold. In this case, if the request data is smaller than a first threshold size, the memory system can perform the standard read operation shown in Figs. 15 and 16 without performing reverse reading. In another embodiment, if the request data is 124907.doc -58 - 200822119 at the first threshold value of 4, the memory system can start with the request word, and then continue in the opposite stylized direction. To the end of the physical block to reverse the 'body block only. Another option may include moving the right stem word line in the direction of the run before starting the reverse read. In the case of using a threshold, if the size of the bedding material is greater than the threshold value, the memory system can reversely read the corresponding physical block. The foregoing detailed description has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in light of the above teachings. The specific embodiments are chosen to best explain the principles of the invention and the embodiments of the embodiments of the invention The present invention is preferably utilized. It is intended that the scope of the invention be defined by the scope of the appended claims. [Simple diagram of the diagram] Figure 1 is a top view of a NAND string. 2 is an equivalent circuit diagram of one of the NAND strings of FIG. 1. Figure 3 is a block diagram of a NAND flash memory cell array. Figure 4 is a block diagram of a non-volatile memory system. Figure 5 is a block diagram of one embodiment of a sensing block. Figure 6 depicts a set of exemplary threshold voltage distributions and a complete sequence stylization program. Figure 7 depicts an exemplary set of threshold voltage distributions and an upper page/lower page programming procedure. Figures 8A through 8C depict a set of exemplary threshold voltages and a two-pass stylized program 124907.doc -59 - 200822119. Timing of a specific signal behavior Figure 9 is an explanation of the read/verify operation period. Figure 0 Figure 10 is a diagram for reading non-volatile memory. 〆 Flow of a Specific Embodiment FIG. 11 is a flow chart of a specific embodiment for performing a read operation for non-volatile memory. Ο Ο Figure 12 is a block diagram of (iv) the capacitance of two adjacent memory cells. Figure 13 is a set of exemplary threshold voltage distributions illustrating the effects of floating gates. Figure 14 illustrates an exemplary set of threshold voltage distributions for one of the techniques for compensating for floating gate coupling. Fig. 15 is a flow chart for compensating the floating gate using the technique of Fig. 14. Figure 16 is a flow diagram for compensating a floating gate handle using another technique. Figure 17 is a flow diagram illustrating one of the sequences of reading a set of memory cells using compensation in accordance with the prior art. Figure 18 illustrates a table for reading a set of memory cells using compensation in accordance with the prior art. Figure 19 illustrates a table for reading a set of memory cells using compensation in accordance with a particular implementation. Figure 20 is a flow diagram for reading a set of memories 124907.doc - 60 - 200822119 early using compensation in accordance with an embodiment. Figure 3 is a flow diagram for reporting data to a host in accordance with a specific embodiment. Figure 22 illustrates a table of reading a set of memory cells under compensation using a read block in accordance with an embodiment. Figure 23 is a flow diagram of one of the steps for reading a set of memory cells using a read block in accordance with one embodiment.

圖24係用於使用臨限請求資料大小讀取一組記憶體單元 之一流程圖。 Ο 【主要元件符號說明】 10 電晶體/記憶體單元 10CG 控制閘極 10FG 浮動閘極 12 第一選擇閘極/電晶體/記憶體單元 12CG 控制閘極 12FG 浮動閘極 14 電晶體 14CG 控制閘極 14FG 浮動閘極 16 電晶體 16CG 控制閘極 16FG 浮動閘極 20CG 控制閘極 22 第二選擇閘極 124907.doc • 61 _ 200822119 22CG 控制閘極 26 位元線端子/汲極端子 27 位元線 28 源極線端子 29 源極線 30 區塊 50 NAND 串 100 二維記憶體單元陣列 1 110 記憶體裝置 112 記憶體晶粒 120 控制電路 122 狀態機 124 晶片上位址解碼器 126 功率控制模組 130Α 讀取/寫入電路 羞 130Β ϋ 讀取/寫入電路 131 選用RAM記憶體 132 線 133 選用RAM記憶體 134 線/資料匯流排 140Α 列解碼器 140Β 列解碼器 142Α 行解碼器 142Β 行解碼器 124907.doc -62- 200822119 144 控制器 200 感測區塊 202 位元線鎖存器 204 感測電路 206 貧料匯流排 208 輸入線 210 感測模組 212 處理器 214 資料鎖存器 216 I/O介面 220 共同部分 250 箭頭 252 箭頭 254 箭頭 260 信號線 262 信號線 372 相鄰浮動閘極 374 相鄰浮動閘極 376 NAND通道/基板 378 源極/汲極區域 380 源極/>及極區域 382 源極/汲極區域 384 控制閘極 386 控制閘極 124907.doc -63- 200822119 400 分佈 402 分佈 404 分佈 406 分佈 408 分佈 410 分佈 550 行 552 行 554 行 556 行 558 行 560 行/方框 570 行 572 行 574 行 576 行 578 行 580 方框 650 行 652 行 654 行 656 行 658 行 124907.doc -64-Figure 24 is a flow diagram for reading a set of memory cells using a threshold request data size. Ο [Main component symbol description] 10 Transistor/memory unit 10CG Control gate 10FG Floating gate 12 First selection gate / transistor / memory unit 12CG Control gate 12FG Floating gate 14 Transistor 14CG Control gate 14FG Floating Gate 16 Transistor 16CG Control Gate 16FG Floating Gate 20CG Control Gate 22 Second Select Gate 124907.doc • 61 _ 200822119 22CG Control Gate 26 Bit Line Terminal / 汲 Terminal 27 Bit Line 28 Source Line Terminal 29 Source Line 30 Block 50 NAND String 100 Two-Dimensional Memory Cell Array 1 110 Memory Device 112 Memory Die 120 Control Circuit 122 State Machine 124 On-Chip Address Decoder 126 Power Control Module 130 Α Read The fetch/write circuit is shy 130Β 读取 The read/write circuit 131 selects the RAM memory 132 line 133 selects the RAM memory 134 line/data bus 140 Α column decoder 140 Β column decoder 142 解码 row decoder 142 Β row decoder 124907. Doc -62- 200822119 144 Controller 200 Sensing Block 202 Bit Line Latch 204 Sensing Circuit 206 Poor Material Bus 208 Input Line 210 Sensing Module 212 Processor 214 Data Latch 216 I/O Interface 220 Common Part 250 Arrow 252 Arrow 254 Arrow 260 Signal Line 262 Signal Line 372 Adjacent Floating Gate 374 Adjacent Floating Gate 376 NAND Channel /Substrate 378 Source/Drain Region 380 Source/> and Polar Region 382 Source/Drain Region 384 Control Gate 386 Control Gate 124907.doc -63- 200822119 400 Distribution 402 Distribution 404 Distribution 406 Distribution 408 Distribution 410 Distribution 550 Line 552 Line 554 Line 556 Line 558 Line 560 Line/Box 570 Line 572 Line 574 Line 576 Line 578 Line 580 Box 650 Line 652 Line 654 Line 656 Line 658 Line 124907.doc -64-

Claims (1)

200822119 十、申請專利範圍: 1. -種操作非揮發性儲存之方法,其包含: 開始於相鄰一第一組選擇閉極之一第一字線並結束於 相鄰一第二組選擇閘極之—最後字線來程式化搞合至複 “字線之非揮發性儲存元件,該程式化包括依據一目 ^ «狀態來改變該等儲存元件之敎者之一臨 壓;以及 电 、 ▲開始於該最後字線並結束於該第-字線來讀取麵合至 该複數個字線之該等非揮發性儲存元件,該讀取包括對 於除了该最後字線外的各字線,基於在該第二組選擇閘 極之一方向上讀取相鄰該各字線之-字線來施加-或多 個補償。 月长員1之方法’其中對於除該最後字線外的各字 線,施加一或多個補償包括: 基於該第二組選擇閘極之該方向上來讀取相鄰該各字 線之該字線’對於該各字線之各儲存元件執行複數個子 讀取並選擇該等子讀取之一者之一結果。 3·如請求項2之方法,其巾對於除該最後字料的各字線 執行複數個子讀取包括: ,由施加一第—組讀取參考電壓至該各字線並感測該 各字線之該等料元件之—料來執行―第―子. 以及 唄, 藉由施加-第二組讀取參考電壓至該各字線並感測該 各子線之該等料元狀-料來執行—第二子讀取。 124907.doc 200822119 4.如請求項3之方法,其中選擇該等子讀取之一者之一結 果包括: 選擇該第一子讀取之一結果用於該各字線之各儲存元 件’该各字線具有在該相鄰字線上的一相鄰記憶體單元 在該讀取相鄰該各字線之該字線期間決定為在一第一物 理狀態;以及 選擇該第二子讀取之一結果用於該各字線之各儲存元 件,该各字線具有在該相鄰字線的一相鄰記憶體單元在 該讀取相鄰該各字線之該字線期間決定為在一第二物理 狀態。 5·如請求項2之方法,其中對於除該最後字線外的各字線 執行複數個子讀取包括: 藉由施加一組讀取參考電壓至該各字線,施加一第— 電壓至相鄰該各字線之該字線,並在施加該組讀取參考 電壓及該第一電壓時感測該各字線之該等儲存元件之一 傳‘來執行一第一子讀取;以及 猎由施加該組讀取參考電壓至該各字線,施加一第二 電壓至相鄰該各字線之該字線,並在施加該組讀取參考 電壓及該k電壓時感測該|字線之該等儲#元件之一 傳導來執行一第二子讀取。 月求項5之方法,其中選擇該等子讀取之一者之一結 果包括: 選㈣第_子讀取之—結果用於該各字線之各儲存元 件’該各字線具有在該相鄰字線的—相鄰記憶體單元在 124907.doc 200822119 5亥項取相鄰该各字後之該字绩地 At 予踝之β子線期間決定為在一第一物理 狀態; 選擇該第二子讀取之-結果用於該各字線之各儲存元 件’該各字線具有在該相鄰字線的—相鄰記憶體單元在 該讀取相鄰該各字線之該字線期間決定為在—第二物理 狀態。200822119 X. Patent application scope: 1. A method for operating non-volatile storage, comprising: starting with a first word line adjacent to a first group of selected closed poles and ending with a second group of selected gates The pole-final word line is programmed to fit into the non-volatile storage element of the complex word line. The stylization includes one of the latter to change the storage elements according to the status of the head «the status; and the power, ▲ Beginning at the last word line and ending at the first word line to read the non-volatile storage elements that face the plurality of word lines, the reading including for each word line except the last word line, Applying - or multiple compensations based on reading the word line adjacent to each of the word lines in the direction of one of the second set of select gates. Method of Mooncake 1 'where words other than the last word line a line, applying one or more compensations includes: reading the word line adjacent to the word lines in the direction of the second set of selection gates to perform a plurality of sub-reads for each of the storage elements of the word lines Select one of the results of one of these sub-reads. 3 The method of claim 2, wherein the performing a plurality of sub-reads for each word line other than the last word comprises: reading a reference voltage from the first group to the word lines and sensing the word lines The material elements are configured to perform - the first sub- and the 呗, by applying - the second set of reading reference voltages to the word lines and sensing the material-like materials of the sub-lines The method of claim 3, wherein the method of selecting one of the sub-reads comprises: selecting a result of the first sub-read for each of the Each of the word lines of the word line has a neighboring memory cell on the adjacent word line that is determined to be in a first physical state during the reading of the word line adjacent to the word line; Selecting a result of the second sub-read for each storage element of the word lines, the word lines having an adjacent memory cell at the adjacent word line in the adjacent adjacent word lines The word line period is determined to be in a second physical state. 5. The method of claim 2, wherein Performing a plurality of sub-reads on each of the word lines outside the last word line includes: applying a set of read reference voltages to the word lines, applying a first voltage to the word lines adjacent to the word lines, and Applying the set of read reference voltages and the first voltage to sense one of the storage elements of the word lines to perform a first sub-read; and hunting by applying the set of read reference voltages to the respective a word line, applying a second voltage to the word line adjacent to the word lines, and sensing one of the memory elements of the | word line when the set of read reference voltages and the k voltage are applied Performing a second sub-read. The method of claim 5, wherein selecting one of the sub-reads results comprises: selecting (four) the _ sub-reading - the result is for each storage element of the word lines 'The word lines have the adjacent memory cells in the adjacent word lines. The period of the adjacent memory cells is determined by the period of 124907.doc 200822119. a first physical state; selecting the second sub-reading - the result is for each storage element of the word lines The word lines having a word line in the adjacent - second physical state - adjacent memory cell is determined during which the word lines of the word line adjacent to the reading. 7 ·如請求項1之方法, 揮發性儲存元件係一 包含: 其中耦合至該複數個字線之該等非 記憶體裝置之部分,該方法進一步 開始於來自耦合至該最後字線之非揮發性儲存元件之 資料並結束於來自耦合至該第一字線之非揮發性儲存元 件之資料,將來自該複數個非揮發性儲存元件之資料臨 .時儲存於該記憶體裝置内。 8.如請求項7之方法,其進一步包含: 以-開始於來自麵合至該第一字線之非揮發性儲存元7. The method of claim 1, the volatile storage component one comprising: a portion of the non-memory devices coupled to the plurality of word lines, the method further beginning with non-volatile from coupling to the last word line The information of the storage element ends with data from the non-volatile storage element coupled to the first word line, and the data from the plurality of non-volatile storage elements is stored in the memory device. 8. The method of claim 7, further comprising: starting with a non-volatile storage element from the first word line 件之資料並結束於來自耦合至該最後字線之非揮發性儲 存兀*件之資料之序列,將來自耦合至該複數個字線之該 等非揮發性儲存元件之資料提供至該記憶體裝置之一輸 出0 9.如請求項7之方法,其中: 耦合至該複數個字線之該等非揮發性儲存元件係形成 於一或多個記憶體晶片上;以及 臨時儲存來自該複數個非揮發性儲存元件之資料包括 在該一或多個記憶體晶片處緩衝該資料。 124907.doc 200822119 ι〇·如請求項7之方法,其中·· =至該複數個字線之該等非揮發性儲存元件係形成 力、一’夕個記憶體晶片上’該-或多個記憶體晶片係與 ::同晶片上的一控制器進行通信;以及 儲存來自該複數個非揮發性儲存元件之資料包括 &quot;亥不同晶片處緩衝該資料。 Π·如請求項7之方法,其中·· Ο Ο :時儲存來自該複數個非揮發性儲存元件之資料包括 以。己诫體裝置之一隨機存取記憶體内緩衝該資料。 12·如請求項^ i ·, 線,補卜 ,,/、中對於除該最後字線外的各字 、、、補饧施加一或多個補償包括: 在基於讀取相鄰該各字線之該字線來施加至少一以位 兀“主補償用於麵合至該各字線之各健存元件時,執 仃一早一子讀取。 13. 如明求項丨2之方法,其中施加至少一 用於各儲存元件包括: u為主補償 控:-感測模組用於讀取該各儲存元件之一積分時 間、一預充電電壓及一斷點電壓之至少一者。 14. 如請求項1之方法,其進一步包含: 在讀取各字線之儲存元件之後並在讀取另—字線之儲 ^件之前’將用於該各字線之各儲存元件之資料值儲 子於與該各儲存元件之一位元線相關聯多 鎖存器内; 及夕個貝枓 在儲存用於該各字線之各儲存元件之該等資料值之 124907.doc 200822119 後:在—不同記憶體内緩衝該等資料值。 1 5 ·如請求項i 4之方法,其中: 儲存用於該各字線之各綠六― 各儲存疋件之資料值包括對於除 该取後字線外的各字線,太 在5亥一或多個資料鎖存器内覆 寫來自一相鄰字線之一先 疋刖靖取儲存70件之一或多個資 \少似貝 緩衝口亥等貝料值包括對於除該最後字線外的各字線,And the information from the non-volatile storage elements coupled to the plurality of word lines is provided to the memory The method of claim 7, wherein: the non-volatile storage element coupled to the plurality of word lines is formed on one or more memory chips; and temporarily storing from the plurality of Information on the non-volatile storage element includes buffering the data at the one or more memory wafers. The method of claim 7, wherein the non-volatile storage elements of the plurality of word lines form a force, and the one or more memory chips are The memory chip is coupled to: a controller on the same wafer; and storing data from the plurality of non-volatile storage elements including buffering the data at different wafers. The method of claim 7, wherein: Ο Ο : storing data from the plurality of non-volatile storage elements includes . One of the corpus callosum devices buffers the data in random access memory. 12. If the request item ^ i ·, line, complement, , /, applies one or more compensations for each word, , and complement except the last word line, including: The word line of the line applies at least one of the "main compensation" for each of the memory elements that are surface-to-faced to the word lines, and performs the reading one morning and one time. 13. As shown in the method of claim 2, The at least one of the storage elements is included: u is a primary compensation control: the sensing module is configured to read at least one of an integration time, a pre-charge voltage, and a breakpoint voltage of the storage elements. The method of claim 1, further comprising: reading data values of the storage elements for the word lines after reading the storage elements of the word lines and before reading the other word line storage elements The bank is associated with a bit line associated with one of the storage elements; and after the storage of the data values for the storage elements of the word lines, 124907.doc 200822119: Buffering these data values in different memories. 1 5 · As in the method of claim i 4, The data values stored for each of the green word lines of the word lines include, for each word line except the taken word line, overwritten in one or more data latches. One of the adjacent word lines first stores one of the 70 pieces or a plurality of materials, such as a shell buffer, and the like, for each word line except the last word line. 儲存該等資料值與來自-相鄰字線之先前讀取儲存元件 之資料值。 月東項1之方法’其中程式化耗合至該複數個字線之 該等非揮發性儲存元件包括藉由完整序列程式化來程式 化該等非揮發性儲存元件。 π如請求t之方法’其中程式㈣合至該複數個字線之 :專非揮發性儲存元件包括使用上部頁/下部頁程式化來 程式化該等非揮發性儲存元件。 ◎ 之方法’其中程式化輕合至該複數個字線之 °亥等非揮發性儲存元件包括使用最後優先模式程式化來 程式化該等非揮發性儲存元件。 19·:明求項1之方法,其中該等非揮發性儲存元件係多狀 態非揮發性儲存元件。 20.如請求項丨之方法,其中該等非揮發性儲存元件係一 NAND快閃記憶體系統之部分。 21· —種非揮發性記憶體系統,其包含·· 一第一組選擇閘極; 124907.doc 200822119 一第二組選擇閘極; 後數個字線,其包括相鄰該S-組選擇閘極之-第一 字線與相鄰該第二組選擇閘極之一最後字線; 複數個非揮發性儲存元件,其係搞合至該複數個字 線;以及 官理電路’其與該複數個非揮發性儲存元件通信,該 管理電路藉由依據-目標記憶體狀態改變該等儲存元件 之選定者之-臨限電壓’開始於該第—字線並結束於該 最後字線來程式化該等儲存元件,該管理電路開始於該 最後字線並結束於該第—字線來讀取該等非揮發性儲存 元件,該管理電路基於在該第二組選#閘極之一方向上 讀取相㈣各字線之-字線㈣取除該最後字線外的各 字線時施加一或多個補償。 22.如請求項21之非揮發性記憶㈣統,其巾該管理電路在 讀取除該最後字線外的各字線時施加一或多個補償之方 式為: 基於在該第二組選擇閘極之一方向上讀取相鄰該各字 線之鑲子線,執行複數個子讀取並選擇該等子讀取之一 者之一結果用於該各字線之各儲存元件。 23·如請求項22之非揮發性記憶體系統,其中該管理電路執 行複數個子讀取用於除該最後字線外的各字線包括: 藉由施加一第一組讀取參考電壓至該各字線並感測該 各字線之該等儲存元件之一傳導來執行一第一子讀取; 以及 124907.doc 6- 200822119 精由施加-第二組讀取參考電壓至該各字線並感測該 各字線之該等儲存元件之—傳導來執行—第二子讀取。 24.如請求項23之非揮發性記憶體系統,其中該管理電路選 擇該等子讀取之一者之一結果包括·· 冑擇該第—子讀取之-結果用於該各字線之各錯存元 件’該各字線具有在該相鄰字線上的—相鄰記憶體軍元 • 在該讀取相鄰該各字線之該字線期間決定為在—第 理狀態;以及 物 Γ 冑擇該第二子讀取之—結果用於該各字線之各館存_ 件,該各字線具有在該相鄰字線的一相鄰記憶體單=疋 該讀取相鄰該各字線之該字線期間&amp;定為在:在 狀態。 乐一物理 25. 如請求項22之非揮發性記憶體系統,其中該管理電 行複數個子讀取用於除該最後字線外的各字線包括路執 藉由施加一組讀取參考電壓至該各字線,施加—第— 〇 至相鄰該各字線之該字、線,並在施加該組讀取參= 電壓及該第一電壓時感測該各字線之該等儲存元件之 傳導來執行一第一子讀取;以及 藉由施加該組讀取參考電壓至該各字線,施加一第一 電壓至相鄰該各字線之該字線,並在施加該組讀取參〜 電壓及該第二電壓時感測該各字線之該等儲存元件考 傳導來執行一第二子讀取。 26. 如請求項25之非揮發性記憶體系統,其中該管理電 擇該等子讀取之一者之一結果包括: ”、 124907.doc 200822119 選擇該第一子讀取之一結果用於該各字線之各儲存元 件,該各字線具有在該相鄰字線的一相鄰記憶體單元2 該讀取相鄰該各字線之該字線期間決定為在一第— 狀態;以及 s 選擇該第二子讀取之-結果用於該各字線之各儲存元 件,該各字線具有在該㈣字線的—㈣記憶體單 該讀取相鄰該各字線之該字線期間決定為在一第二 狀態。 一理 Ο Ο 27.如請求項21之非揮發性記憶體系統,其中該管理電路. 開始於來自輕合至該最後字線之非揮發性儲存元件之 貢料並結束於來自麵合至該第-字線之非揮發性儲存元 件之資料,將來自該複數個非揮發性儲存元件之資料臨 時儲存於一記憶體内。 、 28·如請求項27之非揮發性記憶體系統,其進一步包人. 一輸出: 3 其中該管理電路以一開妒於忠占*人 闻始於來自耦合至該第一字線之 非揮發性健存元件之杳袓 件之貝#並結束於來自麵合至該最後字 線之非揮發性儲存元件 遵叙相1 千之貝科之序列’將來自麵合至該 複數個子線之該等非揮菸松 — 们生儲存兀件之資料提供至該輸 irj 〇 29·如請求項27之非揮發性記憶⑽統,其中: 搞合至該複數個字綠 、λ 个^ ^ ^荨非揮發性儲存元件係形成 於一或多個記憶體晶片上;以及 該管理電路臨時儲在冰 自該複數個非揮發性儲存元件 124907.doc 200822119 30. 31.Ο 32. Ο33. 34. 之資料包括在該—或多個記憶體晶片處緩_資料。 如請求項27之非揮發性記憶體系統,其中:輕合至該複數個字線之該等非揮發性儲存元件係形成 於一或多個記憶體晶片上; 該管理電路之至少一部分係在一不同晶片上;以及 =管理電路臨時儲存來自該複數個_發性儲存元件 之資料包括在該不同晶片上的一。己U體處緩衝該資料。 如請求項27之非揮發性記憶體系統,其進_步包含: 一隨機存取記憶體; S · 該管理電路臨時儲存來自該複數個非揮發性 之資料包括在該隨機存取記憶體内緩衝該資料。 如請求項21之非揮發性錢、體系統,其中該管 讀取除該最後字線外的各字線時 4夕個補償之方 只4肩7 · 在基於讀取相鄰該各字線之該字線,施加至少一 元線為主補償用於耗合至該各字線之各儲存 一單一子讀取。 π矾仃 如請求項32之非揮發性記憶體系統, 丹〒該管理電路施 加至少一以位元線為主補償用於各儲存元件包括·控制一感測模組用於讀取該各蚀六一1省存兀件之一積分瞎 間、一預充電電壓及一斷點電壓之至少—者 、 如請求項21之非揮發性記憶體系統, 進一步包含: 一或多個資料鎖存器,其與該各儲 相關聯; …之-位7L線 124907.doc 200822119 ^胃㈣㈣㈣取各字線之儲存㈣之後並在讀 取另一字線之儲存元件之前,將用於該各字線之各儲存 凡件之貧料值㈣於與該各儲存元件相關聯之該一 個資料鎖存器内; 35 Ο 36. u 37. 38. 39. 其中該管理電路在健存用於該各字線之各儲存元件之 该專資料值之後’在—不同記憶體内緩衝該等資料值。 如請求項34之非揮發性記憶體系統,其中·· 該管理電路儲存用於該各字線之各儲存元件之資料值 包括對於除該最後字線外的各字線,在該—或多個資料 鎖存器内覆寫來自-相鄰字線之—先前讀取儲存元件之 一或多個資料值;以及 該管理電路緩衝該等資料值包括對於除該最後字線外 的各字線,儲存該等資料值與來自—相鄰字線之先前讀 取儲存元件之資料值。 如請求項21之非揮發性記憶體系統,其中該管理電路使 用το整序列程式化來程式化耦合至該複數個字線之該等 非揮發性儲存元件。 如請求項21之非揮發性記憶體系統,其中該管理電路使 用上部頁/下部頁程式化來程式化耦合至該複數個字線之 該等非揮發性儲存元件。 如請求項21之非揮發性記憶體系統,其中該管理電路使 用最後優先模式程式化來程式化耦合至該複數個字線之 該等非揮發性儲存元件。 如請求項21之非揮發性記憶體系統,其中該等非揮發性 124907.doc -10 - 200822119 儲存元件係多狀態非揮發性儲存元件。 40. 如請求項21之非揮發性記憶體系統,其中該管理電路包 括一控制器與一狀態機之至少一者。 41. 如請求項21之非揮發性記憶體系統,其中該複數個非揮 發性儲存元件係一 NAND快閃記憶體系統之部分。 〇 〇 124907.docThe data values are stored with the data values of the previously read storage elements from the adjacent word lines. The method of month 1 wherein the non-volatile storage elements that are stylized to the plurality of word lines comprise programmatically program the non-volatile storage elements by a complete sequence. π is the method of requesting t where the program (4) is coupled to the plurality of word lines: the non-volatile storage element includes programming the non-volatile storage elements using the upper page/lower page stylization. ◎ Method </ RTI> wherein the non-volatile storage elements such as the hexagrams that are programmed to be lightly coupled to the plurality of word lines include stylized the non-volatile storage elements using a last priority mode stylization. 19. The method of claim 1, wherein the non-volatile storage elements are multi-state non-volatile storage elements. 20. The method of claim 1, wherein the non-volatile storage elements are part of a NAND flash memory system. 21 - a non-volatile memory system comprising: a first set of select gates; 124907.doc 200822119 a second set of select gates; a plurality of subsequent word lines including adjacent ones of the S-group selection a gate-first word line and a last word line adjacent to the second set of select gates; a plurality of non-volatile storage elements that are coupled to the plurality of word lines; and a government circuit Transmitting, by the plurality of non-volatile storage elements, the management circuit starts at the first word line and ends at the last word line by changing a threshold value of a selected one of the storage elements according to a target memory state Staging the storage elements, the management circuit begins at the last word line and ends at the first word line to read the non-volatile storage elements, the management circuit is based on one of the second group of selected gates Reading up the phase (4) word line - word line (4) Apply one or more compensations when removing each word line except the last word line. 22. The non-volatile memory (four) system of claim 21, wherein the management circuit applies one or more compensations when reading word lines other than the last word line: based on the second group selection Reading the adjacent sub-word lines in one direction of the gate, performing a plurality of sub-reads and selecting one of the sub-reads results for each of the storage elements of the word lines. 23. The non-volatile memory system of claim 22, wherein the managing circuit performs a plurality of sub-reads for each word line other than the last word line comprises: applying a first set of read reference voltages to the Each word line senses one of the storage elements of the word lines to conduct a first sub-read; and 124907.doc 6-200822119 fine-applies-the second set of read reference voltages to the word lines And sensing the conduction of the storage elements of the word lines to perform - the second sub-read. 24. The non-volatile memory system of claim 23, wherein the management circuit selects one of the sub-reads as a result comprises: selecting the first-sub-read-result for the word lines Each of the erroneous elements 'the word lines having adjacent memory cells on the adjacent word lines - is determined to be in a state of symmetry during the reading of the word lines adjacent to the word lines; The object selects the second sub-read - the result is used for each of the word lines of the word lines, the word lines having an adjacent memory in the adjacent word line = 疋 the read phase The word line period &amp; adjacent to the word line is determined to be in the state. The non-volatile memory system of claim 22, wherein the management circuit performs a plurality of sub-reads for each of the word lines except the last word line, including a way to apply a set of read reference voltages Up to the word lines, applying - the first to the words and lines adjacent to the word lines, and sensing the storage of the word lines when the set of read reference voltages and the first voltage are applied Conducting a first sub-read of the component; and applying a set of read reference voltages to the word lines, applying a first voltage to the word line adjacent to the word lines, and applying the set The storage elements that sense the word lines are sensed to perform a second sub-read when reading the voltages and the second voltages. 26. The non-volatile memory system of claim 25, wherein the one of the management switches selects one of the sub-reads comprises: ", 124907.doc 200822119 Selecting one of the first sub-read results for Each of the word lines of the word lines, the word lines having an adjacent memory cell 2 of the adjacent word line during the reading of the word line adjacent to the word lines is determined to be in a first state; And s selecting the second sub-read - the result is for each storage element of the word lines, the word lines having - (4) memory lines in the (four) word line, the reading of the adjacent word lines The word line period is determined to be in a second state. Ο 27. The non-volatile memory system of claim 21, wherein the management circuit begins with a non-volatile storage element from the light-bonded to the last word line. The tribute ends with data from the non-volatile storage element that is bonded to the first word line, and temporarily stores the data from the plurality of non-volatile storage elements in a memory. 27 non-volatile memory system, which further envelops people. Output: 3 wherein the management circuit begins with a loyalty from the non-volatile storage component coupled to the first word line and ends with the face-to-face The non-volatile storage element of the word line follows the sequence of the 1 000 Becker's to provide the information from the non-smoke-small-storage pieces that are integrated into the plurality of sub-lines to the input irj 〇29 The non-volatile memory (10) system of claim 27, wherein: the plurality of words green, λ ^ ^ ^ ^ non-volatile storage elements are formed on one or more memory chips; and the management The circuit is temporarily stored in ice from the plurality of non-volatile storage elements 124907.doc 200822119 30. 31.Ο 32. Ο33. 34. The data is included in the data storage of the memory chip or the plurality of memory chips. Non-volatile memory system, wherein: the non-volatile storage elements that are coupled to the plurality of word lines are formed on one or more memory chips; at least a portion of the management circuit is on a different wafer ; and = management circuit Pro Storing data from the plurality of semaphore storage elements includes buffering the data on the different wafers. The non-volatile memory system of claim 27 includes: The memory is temporarily stored from the plurality of non-volatile data including buffering the data in the random access memory. For example, the non-volatile money and body system of claim 21, wherein the tube reads When the word lines except the last word line are removed, only 4 shoulders are compensated for the 4th bit. 7. Based on the word line reading the adjacent word lines, at least one element line is applied as the main compensation for the consumption. Each of the word lines stores a single sub-read. π, as in the non-volatile memory system of claim 32, the management circuit applies at least one bit line as the main compensation for each storage element including: controlling a sensing module for reading the respective etches A non-volatile memory system, such as the non-volatile memory system of claim 21, further comprising: one or more data latches; , which is associated with the respective stores; ... - 7L line 124907.doc 200822119 ^ stomach (four) (four) (four) after the storage of each word line (four) and before reading the storage elements of another word line, will be used for the word lines The poor value of each stored item (4) is in the one data latch associated with the storage element; 35 Ο 36. u 37. 38. 39. wherein the management circuit is used for the word The data values of the storage elements of the line are then buffered in different memory sources. The non-volatile memory system of claim 34, wherein: the management circuit stores data values for each of the storage elements of the word lines, including - or more for each word line except the last word line The data latch overwrites one or more data values of the previously read storage element from the adjacent word line; and the management circuit buffers the data values including the word lines except for the last word line And storing the data values and the data values of the previously read storage elements from the adjacent word lines. A non-volatile memory system as claimed in claim 21, wherein the management circuit is programmed to modulate the non-volatile storage elements coupled to the plurality of word lines using a τ. The non-volatile memory system of claim 21, wherein the management circuit uses upper page/lower page programming to program the non-volatile storage elements coupled to the plurality of word lines. The non-volatile memory system of claim 21, wherein the management circuit is programmed with a last priority mode to program the non-volatile storage elements coupled to the plurality of word lines. The non-volatile memory system of claim 21, wherein the non-volatile 124907.doc -10 - 200822119 storage element is a multi-state non-volatile storage element. 40. The non-volatile memory system of claim 21, wherein the management circuit comprises at least one of a controller and a state machine. 41. The non-volatile memory system of claim 21, wherein the plurality of non-volatile memory elements are part of a NAND flash memory system. 〇 〇 124907.doc
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