200821806 九、發明說明： 【發明所屬之技術領域】 方法本::J:麵1i’涉及-種散熱裝置組合的製造 發敎曰片者;垃種保證散熱裝置同時與電路板上的多個 七熱曰曰片都緊密接觸的製造方法。 ^夕 【先前技術】 隨著半導體技術的發展，晶片的 愈來愈強，但是晶片功耗 ：，以：其： 達到上百瓦的水準，對散熱提出了 曰片功耗甚至 _片的散熱能力，首先要求散細 *果要扣 能力，再者要求散熱器與晶片之叫供較強的散熱 要保§豆放熱裝置能夠和晶片良好接觸。 、呔而 一塊電路板上往往設有多個sH 、 裝製造時其外部尺寸户/ 一〜A曰曰 由於這些晶片在封 時其底部的焊锡層厚度也不:致i此路板 的r:;的尺寸範圍==高 ，、Τ日日片的頂面高度為8± 〇.3 面高度為6± 0. 2mm，那麼兩晶片的頂面^的頂 2. 5-的範圍内發生變化，可見如果使：:在h 5〜 散熱裝置同時為電路板上的多 :;：，的板式 致麵置僅能與電路板上的部分；=熱:二容易導 上的所有曰H 發生變形從而與電路板 路接觸，麵 如中國大陸專利9921撕.6所揭示的散熱裝置，其是 5 200821806 材質的元件套接裝設在現用_材質的散執 裝置的散的尚導齡能來提高現用_材質的散熱 也比採’亚且讀採用銅18元件互相套接的設計 裝置較為廉價。但是這種設計的銅材 貝件疋利用一肩部與在呂材質的散熱 =定到散熱裝置上，然後再—體裝設到 ㈣=散熱裝置並不具有與晶片高度變化相適應的 如果用在对多個晶片的電路板上，也 二 平板式散熱裝置i僅能與電路板上的部分晶片接觸： 緣是，本發明人有感上述缺失之可改善， 計合理且有效改善上述缺失之本發明。 _ π 【發明内容】 本發明的目的在於提供—種保證散熱裝置同時盘電路 t的多個發熱⑼都緊密接觸的製造方法，其能保證散 心衣置以適當的壓力同_接在多個發熱 晶片的散熱效果。 徒回 為了貫現上述目的，本發明提供一種散熱裳置組合的 ，造方法，該製造方法包括以下步驟：準備—電路板及一 散熱裝置’該電路板上設有兩發熱晶片；該散熱裝置包括 一主體及-調節組件，魅體包括—基座及由該基座向上 突伸出的若干散熱鰭片，該基座上還預先固設有一銅柱， 並開設有-通孔；該組件設有—底座，其巾該底座的 外周面與該主體的通孔内周面之間呈間隙配合，從而可上 了活動地裝設到該主體基座的通孔内；先將該主體裝設到 該，路板上，使該銅柱的底面貼接到一發熱晶片上；在該 調節組件底座的外周面塗上焊接材料後，再將該調節組件 200821806 表e又到该主體的通孔内一 用在主體和調節組件上 力辽衣置細加適當壓力作 接;最後將上述由電t反; r-起一，=== 柱底面與-發熱晶果再的銅 内上下滑動進行調節從而與另^貼$體通孔 I f r-n ^ 义…、日日片貼接’可以箭法200821806 IX. Description of the invention: [Technical field to which the invention pertains] Method: J: Face 1i' involves the manufacture of a hair dryer for a combination of heat dissipating devices; the seeding ensures that the heat sink is simultaneously with a plurality of seven on the circuit board The manufacturing method in which the hot crepe sheets are in close contact. ^夕 [Previous technology] With the development of semiconductor technology, the wafer is getting stronger and stronger, but the power consumption of the chip: to: It reaches the level of hundreds of watts, and the heat dissipation of the chip is proposed for the heat dissipation. The ability, first of all, requires the ability to loosen the thickness of the fruit, and the heat sink and the chip are required to provide a strong heat dissipation to ensure that the bean heat release device can be in good contact with the wafer.呔 呔 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块 一块The size range == high, the top surface height of the day is 8 ± 〇.3 The height of the surface is 6 ± 0. 2mm, then the top surface of the two wafers ^ is changed within the range of 5. It can be seen that if:: in h 5 ~ the heat sink is at the same time for the circuit board: ::, the plate-type surface can only be with the part on the circuit board; = heat: two easy to guide all 曰H deformation Therefore, it is in contact with the circuit board, and the surface is as disclosed in the Chinese Patent No. 9921, the heat sink disclosed in the Chinese Patent No. 9921, which is a component of the 5 200821806 material that is installed in the _ material of the scatter device. The heat dissipation of the current _ material is also cheaper than that of the design device that uses the copper 18 components to be nested. However, the copper shell of this design utilizes the heat dissipation of one shoulder and the material of Lu to the heat sink, and then the body is mounted to (4) = the heat sink does not have the same height change as the wafer. On a circuit board of a plurality of wafers, the two flat heat sinks i can only be in contact with a part of the wafer on the circuit board: the edge is that the inventors are aware that the above-mentioned defects can be improved, and the above-mentioned missing is reasonable and effective. this invention. _ π [ SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturing method for ensuring that a plurality of heats (9) of the disk circuit t are in close contact at the same time as the heat sink device, which can ensure that the center of the clothes is placed at a proper pressure and is connected to a plurality of heats. The heat dissipation effect of the wafer. In order to achieve the above object, the present invention provides a heat-dissipating combination, the manufacturing method comprising the steps of: preparing a circuit board and a heat dissipating device, wherein the heat generating device is provided on the circuit board; The utility model comprises a main body and an adjusting component, the glamour body comprises a pedestal and a plurality of heat dissipating fins protruding upward from the pedestal, the pedestal further pre-fixing a copper post and opening a through hole; the component The base is provided with a gap between the outer peripheral surface of the base and the inner peripheral surface of the through hole of the main body, so as to be movably mounted in the through hole of the main body base; Provided on the road board, the bottom surface of the copper pillar is attached to a heat generating wafer; after the welding material is applied to the outer circumferential surface of the adjusting component base, the adjusting component 200821806 is further connected to the main body The inside of the hole is used on the main body and the adjusting component to set up the appropriate pressure to make the connection; finally, the above is reversed by the electric t; r-starts, === the bottom of the column and the copper inside the heating crystal fruit slide up and down Make adjustments and attach to the body through hole I f rn ^ 义..., 日片片接接, can be arrowed
地適應不同板上發熱晶片與另—發熱晶片之間^言 度虽的呈異，保證散熱裝置同時與電路板 = 片都緊密接觸，從而達到理想的散熱效果。 又熱曰曰 為使能更進一步瞭解本發明之特徵及技術内容，請灸 閱以下有關本發明之詳細說明與附圖，“_圖式僅提 供參考與說並非絲對本發明加以限制者。 【實施方式】 請參閱第-圖至第五圖，本發明提供—種散熱裝置組 合的製造方法，該製造方法包括以下步驟·· 準備-電路板1及-散熱跋置2，該散熱裝置2包括 -主體3及-調節組件5，該電路板丨上設有兩個發熱晶 片10、12及四個鎖固孔14 ;該主體3是由鋁材製成的， 其包括一基座30及由該基座3〇向上突伸出的若干散熱鰭 片32，該基座30的四角各裝設有一固定元件34，該基座 30的中部對應電路板1上的發熱晶片12開設有一圓形通 孔36，該通孔36具有一圓環形的内周面邶，而在該基座 30的一侧還對應電路板1上的發熱晶片1〇預先固設有— 銅柱40 ;該调節組件5是由銅材製成的，其包括一圓形底 7 200821806 Ϊ50及由該底座50向上突伸出的若干散熱鰭片52,該調 即組件5底座5G也具有—圓環形的外周面％，其中該底 ^ 5〇的外徑是略小於通孔36的内徑，該調節組件5底座 的外周面54與該主體3通孔36的内周面38之間呈間 =、配合’因而該調節組件5可上下活動地裝設到該主體3 基座30的通孔36内，並且還可以由上至下貫穿通過該通 先將四固疋元件34的-端對應穿插到該電路板！的四 =固孔14 Θ ’從而將該主體3裝設到該電路板i上，使主 =3上的銅柱40的底面貼接到發熱晶片1〇的頂面，再從 电路板1的背面為四固定元件34與鎖固 上焊接材料； η受口处土 在周即組件5底座50的外周面54或該主體3的通 1 =\内=Μ塗上谭接材料（如錫膏）後，再將該調 &又到该主體3的通孔36内’使該調節組件5 底座50的底面初步貼接到發熱晶片12的頂面； 使用-夾持在電路板ljL下兩側的加壓裝置（圖未示） 刀別施加適當壓力作用在主體3和調節組件5上，使主體 3的銅柱40和調節级件5底应从r-片10、12緊密相貼接； 的底面分別與兩發熱晶 狀罟/八Τ由5路板1、主體3及調節組件5組成的散埶 “;!：與力』壓裝置—起放入到焊接爐（圖未示）中進行 彳焊接材料冷卻凝固後再拆除加㈣置，即 板卜調節組件5與主體3焊接成為: r η日’從而使主體3的鋼柱4〇及調節組件5 -冋日讀兩發熱晶片10、12保持良好接觸。 200821806 採用這種製造方法的優越性在於當主體3的銅柱4〇 底面與务熱晶片1 〇貼接後，再通過加入可以在主體3通孔 36内上下滑動進行調節的調節組件5與另一發熱晶片12 =接^保證焊接完成後該主體3的銅柱4〇及調節組件5 =與發熱晶片10、12保持良好的接觸，達到理想的散 上述實施方式僅是本發明散熱裝置組合的擊造方、去中 的一種，射以在其基礎上作出適#_更。糾：該主 體3不與發熱晶片1G_面貼接，而通過在該主體上再加 圖未示）及一調節組件（圖未示）來達到為發 熱曰曰片10散熱的目的；該主體3上也可以不予頁先固設一銅 柱40,而改為直接用主體3基座3〇的底面與發埶晶片ι〇 =相貼接。另外#電路板上設有n(n>2)個需要提高散熱 月b力的發熱電子元件時，還可以通過在主體3上設置卜丄 個與發熱，子元件相對應的通孔（圖未示）及調節組件（圖 ，不）’使每—調節組件分騎應與相應的發熱晶片相貼 來達到同時為多個發熱電子元件散熱的效果。 惟以上所述僅為本發明之較佳實施例，非意欲偈限本 ，明之專利賴·，故舉凡運用本發㈣明#及圖式内 容所為之等效變化，均同理皆包含於本發明之權利保護範 圍内’合予陳明。 【圖式簡單說明】 圖是本發明的散熱裝置組合的立體分解圖； 第二圖是本發_散歸置組合的立體組合圖； 200821806 第三圖是本發明的散熱裝置組合的側視圖； 第四圖是本發明的散熱裝置組合的俯視圖； 第五圖是第四圖的A-A剖視圖。 【主要元件符號說明】 1電路板 10發熱晶片 12發熱晶片 14鎖固孔 散熱裝置 主體 30基座 32散熱鰭片 34固定元件 36通孔 38内周面 40銅柱 調節組件 50底座 52散熱鰭片 54外周面 10It adapts to the difference between the heating chips on the different boards and the other heating chips, ensuring that the heat sink is in close contact with the board and the sheet, thus achieving the desired heat dissipation effect. In order to further understand the features and technical contents of the present invention, please refer to the following detailed description of the invention and the accompanying drawings, which are to be construed as merely limiting the invention. EMBODIMENT OF THE INVENTION Referring to the first to fifth figures, the present invention provides a method of manufacturing a heat sink assembly, the method comprising the steps of: preparing - a circuit board 1 and a heat sink 2, the heat sink 2 comprising - a main body 3 and an adjustment assembly 5, the circuit board is provided with two heat generating wafers 10, 12 and four locking holes 14; the main body 3 is made of aluminum, which comprises a base 30 and The pedestal 3 is provided with a plurality of heat dissipating fins 32. The pedestal 30 is provided with a fixing component 34 at a corner of the pedestal 30. The middle portion of the pedestal 30 has a circular pass corresponding to the heat generating chip 12 on the circuit board 1. a hole 36 having a circular inner peripheral surface 邶, and a heat-generating wafer 1 on the circuit board 1 on one side of the base 30 is pre-fixed - a copper post 40; The assembly 5 is made of copper and includes a circular bottom 7 200821806 Ϊ 50 and The heat sink fins 52 projecting upwardly from the seat 50, the base 5G of the assembly 5 also has a ring-shaped outer peripheral surface %, wherein the outer diameter of the bottom plate is slightly smaller than the inner diameter of the through hole 36. The outer peripheral surface 54 of the base of the adjusting assembly 5 and the inner peripheral surface 38 of the through hole 36 of the main body 3 are interposed and matched. Thus, the adjusting assembly 5 can be mounted up to the through hole of the base 30 of the main body 3 36, and can also be inserted from the top to the bottom through the first end of the four solid elements 34 to the circuit board! 4 = solid hole 14 Θ ', thereby mounting the main body 3 to the circuit board i, the bottom surface of the copper post 40 on the main = 3 is attached to the top surface of the heat-generating wafer 1 , and then from the back of the circuit board 1 to the four fixing elements 34 and the locking welding material; The circumference of the outer peripheral surface 54 of the base 5 of the assembly 5 or the passage 1 = \ inner = Μ of the main body 3 is coated with a tanned material (such as solder paste), and then the adjustment is again applied to the through hole 36 of the main body 3. 'Making the bottom surface of the base 50 of the adjusting assembly 5 to be initially attached to the top surface of the heat-generating wafer 12; using - pressing the pressing device on both sides of the circuit board ljL (not shown) Appropriate pressure is applied to the main body 3 and the adjusting assembly 5 so that the copper post 40 of the main body 3 and the bottom of the adjusting step 5 should be closely attached from the r-pieces 10, 12; the bottom surface and the two heating crystals/eight goss respectively The divergent ";!: and force" pressure device consisting of 5-way plate 1, main body 3 and adjustment assembly 5 is placed in a welding furnace (not shown) for cooling and solidification of the welding material, and then removed (4). That is, the plate adjusting member 5 is welded to the main body 3 to become: r η ′′ so that the steel column 4〇 of the main body 3 and the regulating unit 5 are kept in good contact with the two heat generating wafers 10 and 12. 200821806 The advantage of adopting such a manufacturing method is that after the bottom surface of the copper post 4 of the main body 3 is attached to the heat-receiving wafer 1 ,, the adjustment component 5 and the other which can be adjusted by sliding up and down in the through hole 36 of the main body 3 are added. A heat-generating wafer 12 is connected to ensure that the copper pillars 4 of the main body 3 and the adjusting component 5 are in good contact with the heat-generating wafers 10, 12 to achieve a desired dispersion. The above embodiment is only a combination of the heat-dissipating device of the present invention. Strike the party, go to one of them, shoot on the basis of making the appropriate #_ more. Correction: the main body 3 is not attached to the surface of the heat-generating wafer 1G_, but by adding a figure (not shown) and an adjusting component (not shown) to achieve heat dissipation for the heat-generating chip 10; 3, it is also possible to fix a copper pillar 40 without first pressing the sheet, and instead directly attach the bottom surface of the base 3 of the main body 3 to the hairpin wafer ι〇=. In addition, when n (n>2) heat-generating electronic components that need to increase the heat-dissipation b-force are provided on the circuit board, it is also possible to provide a through-hole corresponding to the heat-generating and sub-components on the main body 3 (Fig. Show) and adjustment components (figure, no) 'Let each-adjustment component to be attached to the corresponding heat-generating wafer to achieve the effect of simultaneously dissipating heat from multiple heat-generating electronic components. However, the above description is only a preferred embodiment of the present invention, and it is not intended to limit the present invention. The patents of the present invention are based on the equivalent changes of the present invention and the contents of the drawings. Within the scope of the protection of the invention, 'combined with Chen Ming. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is an exploded perspective view of a heat sink assembly of the present invention; FIG. 2 is a perspective assembled view of a heat sink assembly of the present invention; The fourth view is a plan view of the heat sink assembly of the present invention; and the fifth diagram is a cross-sectional view taken along line AA of the fourth diagram. [Main component symbol description] 1 circuit board 10 heat generating chip 12 heat generating chip 14 locking hole heat sink main body 30 base 32 heat sink fin 34 fixing element 36 through hole 38 inner peripheral surface 40 copper pillar adjusting component 50 base 52 heat sink fin 54 outer peripheral surface 10