200829343 九、發明說明： 【發明所屬之技術領域】 ，本發明涉及-種具有薄膜圖案層的基板的製造方法。 【先前技術】 光微影法及噴 目鈾製造薄膜圖案層的方法主要包括 墨法。 當採用光微影法時，需在一個基板上塗敷一層光阻材 料層。根據預計形成的薄膜圖案層，製作多個光罩，在一 鲁個基板反復進行塗敷光阻層，採用該光罩對該光阻層進行 曝光及顯影，-直到圖案層完成。但是，該光微影法需要 使用大型設備，其製造成本相應增加。 參照圖7,噴墨法通常包括如下步驟：將適量的墨水填 充在由基板300上的多個擒騰3〇4圍成的多個收容空間 中；固化墨水而形成薄膜圖案層314。 但是，如圖7所示，由於墨水與擋牆3〇4的接觸角較 Φ】故^產生與擋牆接觸處墨水面較高。待墨水乾燥後， 產生，膜圖案層314厚度不均勻的狀況，而需進-步處理 以使得表面平坦。其製造時間相應增加。 【發明内容】 制生有鑒於此，有必要提供一種具有薄膜圖案層的基板的 ‘造方法，該薄膜圖案層具有較高的表面平坦度。 種具有薄膜圖案層的基板的製造方法，其步驟如下： 、Y提供預成型的基板，其具有多個具有排斥墨水性能 的擋牆，該多個擋牆間形成多個收容空間；將含有可固化 200829343 成分的墨水分別填充在該多個收容空間中，其中收容於各 也容空間的墨水體積大於其所對應的收容空間的容積；固 化墨水而使該墨水中的可固化成分在該收容空間中形成薄 膜圖案層。 一種具有薄膜圖案層的基板的製造方法，其步驟如下·· 提供一預成型的基板，其具有多個具有排斥墨水性能 的擋牆，該多個擋牆間形成多個收容空間；將含有可固化 成为的墨水分別填充在該多個收容空間中，並使各收容空200829343 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method of manufacturing a substrate having a thin film pattern layer. [Prior Art] The photolithography method and the method of producing a thin film pattern layer by uranium injection mainly include an ink method. When photolithography is used, a layer of photoresist is applied to a substrate. A plurality of photomasks are formed according to the film pattern layer to be formed, and a photoresist layer is repeatedly applied to one substrate, and the photoresist layer is exposed and developed by the photomask until the pattern layer is completed. However, this photolithography method requires the use of large equipment, and the manufacturing cost thereof is correspondingly increased. Referring to Fig. 7, the ink jet method generally includes the steps of: filling an appropriate amount of ink into a plurality of housing spaces surrounded by a plurality of tabs 3? 4 on a substrate 300; curing the ink to form a thin film pattern layer 314. However, as shown in Fig. 7, since the contact angle of the ink with the retaining wall 3〇4 is larger than Φ, the ink surface at the contact with the retaining wall is higher. After the ink is dried, a condition in which the thickness of the film pattern layer 314 is uneven is generated, and further processing is required to make the surface flat. Its manufacturing time has increased accordingly. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a method of fabricating a substrate having a thin film pattern layer having a high surface flatness. A method for manufacturing a substrate having a thin film pattern layer, the steps of which are as follows: Y provides a pre-formed substrate having a plurality of retaining walls having ink repellent properties, and a plurality of receiving spaces are formed between the plurality of retaining walls; The ink of the curing component 200829343 is filled in the plurality of accommodating spaces, wherein the volume of the ink contained in each of the accommodating spaces is larger than the volume of the corresponding accommodating space; and the curable ink is solidified to make the curable component in the accommodating space A thin film pattern layer is formed in the middle. A method for manufacturing a substrate having a thin film pattern layer, the steps of which are as follows: · providing a pre-formed substrate having a plurality of retaining walls having ink repellent properties, wherein the plurality of retaining walls form a plurality of receiving spaces; The solidified ink is filled in the plurality of accommodating spaces, and each of the accommodating spaces is filled
間中的墨水的可固化成份的體積與該收容空間的容積大致 相同，其中收容於各收容空間的墨水體積大於其所對應的 收夺工間的谷積，固化墨水而使該墨水中的可固化成分在 該收容空間中形成薄膜圖案層。 相較於先w技術，所述的薄膜圖案層的製造方法，將 過里墨水填充至兩擋牆間形成的收容空間中，由於液體的 ，面張力特性’過量墨水會在各收容空間的開口上形成_ 鼓起的液面而不至於溢出。而於墨水乾燥固化後，墨水中 :固化成份留在收容空間中而形成薄臈圖案層，該薄膜圖 :層的㊣度與難的高度是大致相近。此製料達到所需 求’解決—般噴墨式薄膜製程所造成的薄膜 圖案層不均勻的狀況。 【實施方式】 下面將結合附圖對本發明作進—步的詳μ明。 閱圖1到圖6’提供了一種其上具有薄_ 曰 ⑺如，^色層）基板100的製造方法。該方法兰 200829343 驟如下：提供一預成型的基板Π，其具有多個擋牆104， 讀多個擋牆104間形成多個收容空間106;將含有可固化成 分的墨水112 (例如，彩色溶液）分別填充在該多個收容空 間106中，其中收容於各收容空間的墨水112體積大於其 所對應的收容空間106的容積；固化收容空間106中的墨 水112以便該墨水112中的可固化成分在該收容空間106 中形成薄膜圖案層。 如圖1所示，所提供的預成型的基板11包括一個基板 馨100、多個形成在基板100上的擋牆104，以及由該多個擂 牆104圍成的多個收容空間106。該多個擋牆104以預計的 圖案排列並具有大致平坦的上表面1042。該多個收容空間 106由該多個擋牆104限定而成。相鄰的擋牆104由一個收 容空間106分割開。該基板100材料選用玻璃。當然，基 板材料也可選用石英玻璃、石夕晶圓、金屬或聚合物樹脂等。 該多個擋牆104通常由聚合物樹脂製成。另外，該多個擋 _牆104可以由黑色樹脂或類似物製成以用作黑色矩陣。 如圖2及圖3所示，該預成型的基板11的製造方法具 體包括以下步驟：提供一個基板100;在該基板100上塗佈 一層光阻材料層202;利用一個光罩200曝光該光阻材料層 202 ;以及，顯影該光阻材料層202，形成多個擋牆104。 在本實施例中，該光阻材料層202由負型光阻材料形 成。或者，可以使用正型光阻材料，但是此時的光罩設計 不同。該光阻材料層202是利用某種方法形成在基板100 上，例如，旋轉塗佈法、喷射塗佈法、裂縫式塗佈法等。 200829343 該光罩200根據擋牆104的預計形成的圖案製成。使用該 羌罩200對該光阻材料層202曝光，然後對光阻材料層202 進行顯影。因此，該擋牆104以預計的圖案形成在基板1〇〇 上。另外，該擋牆104可以由單層或多層結構組成，例如， 該擔牆104可以包括由無機材料製成的底層和由有機材料 製成的上層。 或者，該預成型的基板11可以通過塑性成型的方法製 得，從而該基板100與該擋牆104爲一體成型。 擋牆104應具有一定的排斥墨水性能。例如，墨水112 及擋牆104之間的接觸角應大於15度且小於90度，優選 爲大於20度且65度。在此範圍内，墨水112可較好的收 容於收容空間106中。 如圖4所示，通過一喷墨裝置110將該墨水112填充 在收容空間106中。該喷墨裝置110可選用熱泡式喷墨裝 置（Thermal Bubble Ink Jet Printing Apparatus)或壓電式喷墨 裝置（Piezoelectric Ink Jet Printing Apparatus) 〇 如圖5所示，爲達到收容空間106中的墨水112的可 固化成份體積與該收容空間106的容積大致相同，可將過 量墨水112填充至該收容空間106中。由於液體的表面張 力特性，過量墨水112會在收容空間106的開口 108上形 成一鼓起的液面而不至於溢出。通常，該墨水的可固化成 份體積與該對應的收容空間的容積之比在65%-135%的範 圍，優選的，在80%-120%的範圍。而較爲理想的狀況之 一是，可固化成分體積與其收容空間106的容積基本相 200829343 等。過1墨水112的體積由可固化成份在墨水内所佔的百 :分比來決定’如可固化成份在墨水内所佔的百分比約爲 〇3%此犄過里墨水112的體積約爲收容空間106的容積 的三倍，即過量墨水112的高度Η是擔牆的高度h的三倍: 收容空間106的容積可由以下確定：&收容空間遍中基 2的表面積乘以擋牆的高度h所得的值爲收容空間1〇6的 谷積。墨水112體積的確定方法與收容空間1〇6體積的確 定方法相似，在此不再累贅。當然’過量墨水ιΐ2的體積 可超過收容空間106的容積的兩倍。 該多個收容空間106可以一個接一個地進行墨水ιΐ2 的填充，或者通過多個喷墨頭同時進行墨水112的填充。 此外，該多個收容空間106可以分別填充不同的墨水，例 如根據需要進行紅綠藍墨水填充。 +如圖6所示，固化收容空間106中的墨水112而形成 薄膜圖錢114。該固化主要通過—抽真空裝置一加熱 裝置，一曝光裝置或三者的任意組合進行。墨水ιΐ2中的 大部分溶劑被蒸發掉，可固化成份留在收容空間1〇6中， 這些成分在固化過程中可能會發生交聯的情況。因此，該 薄膜圖案層114與擋牆104的上表面1〇42基本齊平。 因此，在固化墨水112之後，收容空間1〇6中薄膜圖 案層114的體積等於或小於在同一位置的墨水112的可固 化成分的體積。該體積可能因固化過程所導致的密度變化 而減小。由於該可固化成份體積與該收容空間1〇6的容積 的差小於35%，優選地，小於2〇%，因此，收容空間⑽ 200829343 中薄膜圖案層114的體積與收容空間106的體積之比在 50%至135%的範圍。優選地，收容空間106中薄膜圖案層 114的體積與收容空間106的體積之比在70%至120%的範 圍。另外，該薄膜圖案層114的厚度大致相近於擋牆104 的高度。薄膜圖案層114的厚度與擋牆104的高度之比在 50%至135%的範圍，優選地，在70%至120%的範圍。 該薄膜圖案層114具有平坦的表面並具有與擋牆104 的高度h大致相近的高度。通常，無需更多的流程對薄膜 ® 圖案層114的表面進行處理，從而縮短了製造時間。 該基板100可適用於彩色濾光片及有機曝光裝置。此 外，根據需要，該擋牆104可以從該基板100部分地移除。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟習本案技藝 之人士援依本發明之精神所作之等效修飾或變化，皆應涵 _蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1是具有擋牆的預成型的基板的剖面示意圖。 圖2至圖3是圖1所示的預成型的基板的製造方法的 示意圖。 圖4,圖5及圖6是使用圖1所示的預成型的基板製造 具有薄膜圖案層的基板的方法的示意圖。 圖7是具有薄膜圖案層的傳統基板的剖面示意圖。 【主要元件符號說明】 11 200829343 預成型的基板 11 基板 100 擋牆 104 收容空間 106 喷墨裝置 110 墨水 112 薄膜圖案層 114 光罩 200 光阻材料層 202 擋牆的上表面 1042 12The volume of the curable component of the ink is substantially the same as the volume of the accommodating space, wherein the volume of the ink contained in each accommodating space is larger than the volume of the corresponding retracting work, and the ink is solidified to make the ink The curing component forms a thin film pattern layer in the accommodating space. Compared with the prior art, the method for manufacturing the thin film pattern layer fills the ink into the accommodating space formed between the two barrier walls. Due to the liquid, the surface tension characteristic 'excess ink will be in the opening of each accommodating space. The _ swelled liquid level is formed on the surface without overflowing. After the ink is dried and solidified, the cured component remains in the accommodating space to form a thin enamel pattern layer, and the film has a positiveness similar to that of the hard layer. This material material achieves the desired condition to solve the problem of uneven film pattern layer caused by the ink jet film process. [Embodiment] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. 1 to 6' provide a method of manufacturing a substrate 100 having a thin 曰(7), such as a color layer. The method of the method 200829343 is as follows: providing a pre-formed substrate raft having a plurality of retaining walls 104, forming a plurality of receiving spaces 106 between the plurality of retaining walls 104; and containing an ink 112 of a curable composition (for example, a color solution) Filled in the plurality of accommodating spaces 106, wherein the volume of the ink 112 accommodated in each of the accommodating spaces is larger than the volume of the accommodating space 106 corresponding thereto; the ink 112 in the accommodating space 106 is solidified to form a curable component in the ink 112. A thin film pattern layer is formed in the accommodating space 106. As shown in FIG. 1, the preformed substrate 11 is provided to include a substrate 100, a plurality of retaining walls 104 formed on the substrate 100, and a plurality of receiving spaces 106 surrounded by the plurality of walls 104. The plurality of retaining walls 104 are arranged in a desired pattern and have a generally flat upper surface 1042. The plurality of receiving spaces 106 are defined by the plurality of retaining walls 104. Adjacent retaining walls 104 are separated by a receiving space 106. The substrate 100 is made of glass. Of course, the base material can also be selected from quartz glass, Shixi wafer, metal or polymer resin. The plurality of retaining walls 104 are typically made of a polymer resin. In addition, the plurality of barrier walls 104 may be made of black resin or the like to serve as a black matrix. As shown in FIG. 2 and FIG. 3, the method for manufacturing the pre-formed substrate 11 specifically includes the steps of: providing a substrate 100; coating a layer of photoresist material 202 on the substrate 100; and exposing the light by using a mask 200. a resistive material layer 202; and developing the photoresist material layer 202 to form a plurality of retaining walls 104. In the present embodiment, the photoresist layer 202 is formed of a negative photoresist material. Alternatively, a positive photoresist material can be used, but the reticle design is different at this time. The photoresist layer 202 is formed on the substrate 100 by a certain method, for example, a spin coating method, a spray coating method, a slit coating method, or the like. 200829343 The reticle 200 is made according to the intended pattern of the retaining wall 104. The photoresist layer 202 is exposed using the mask 200, and then the photoresist layer 202 is developed. Therefore, the retaining wall 104 is formed on the substrate 1 in a desired pattern. Further, the retaining wall 104 may be composed of a single layer or a multi-layer structure, for example, the stud wall 104 may include a bottom layer made of an inorganic material and an upper layer made of an organic material. Alternatively, the preformed substrate 11 may be formed by a plastic forming method such that the substrate 100 and the retaining wall 104 are integrally formed. Retaining wall 104 should have some ink repellent properties. For example, the contact angle between the ink 112 and the retaining wall 104 should be greater than 15 degrees and less than 90 degrees, preferably greater than 20 degrees and 65 degrees. Within this range, the ink 112 can be better accommodated in the accommodating space 106. As shown in Fig. 4, the ink 112 is filled in the accommodating space 106 by an ink jet device 110. The inkjet device 110 may be a Thermal Bubble Ink Jet Printing Apparatus or a Piezoelectric Ink Jet Printing Apparatus, as shown in FIG. 5, in order to reach the ink in the accommodating space 106. The curable component volume of 112 is substantially the same as the volume of the receiving space 106, and excess ink 112 can be filled into the receiving space 106. Due to the surface tension characteristics of the liquid, the excess ink 112 forms a swelled liquid level on the opening 108 of the accommodating space 106 without overflowing. Typically, the ratio of the curable component volume of the ink to the volume of the corresponding containment space is in the range of from 65% to 135%, preferably in the range of from 80% to 120%. One of the more desirable conditions is that the volume of the curable component is substantially the same as the volume of the accommodating space 106, such as 200829343. The volume of 1 ink 112 is determined by the ratio of the curable component in the ink. 'If the percentage of the curable component in the ink is about 3%, the volume of the ink 112 is about to contain. Three times the volume of the space 106, that is, the height Η of the excess ink 112 is three times the height h of the wall: The volume of the accommodating space 106 can be determined as follows: & the space area of the accommodating space throughout the base 2 multiplied by the height of the retaining wall The value obtained by h is the grain product of the containment space of 1〇6. The method of determining the volume of the ink 112 is similar to the method of determining the volume of the accommodating space of 1 〇 6 and is no longer burdensome. Of course, the volume of excess ink ι 2 can exceed twice the volume of the accommodating space 106. The plurality of accommodating spaces 106 may fill the ink ΐ 2 one by one, or simultaneously fill the ink 112 by a plurality of ink jet heads. Further, the plurality of accommodating spaces 106 may be filled with different inks, for example, filled with red, green, and blue inks as needed. As shown in Fig. 6, the ink 112 in the accommodating space 106 is solidified to form a thin film image 114. The curing is mainly carried out by means of a vacuuming device, a heating device, an exposure device or any combination of the three. Most of the solvent in the ink ΐ 2 is evaporated, and the curable component remains in the accommodating space 1 〇 6 , and these components may crosslink during the curing process. Therefore, the thin film pattern layer 114 is substantially flush with the upper surface 1〇42 of the retaining wall 104. Therefore, after the ink 112 is cured, the volume of the film pattern layer 114 in the accommodating space 1 〇 6 is equal to or smaller than the volume of the curable composition of the ink 112 at the same position. This volume may decrease due to density changes caused by the curing process. Since the difference between the volume of the curable component and the volume of the receiving space 1〇6 is less than 35%, preferably less than 2%, the ratio of the volume of the thin film pattern layer 114 to the volume of the receiving space 106 in the receiving space (10) 200829343 is In the range of 50% to 135%. Preferably, the ratio of the volume of the thin film pattern layer 114 in the receiving space 106 to the volume of the receiving space 106 is in the range of 70% to 120%. In addition, the thickness of the thin film pattern layer 114 is substantially similar to the height of the retaining wall 104. The ratio of the thickness of the film pattern layer 114 to the height of the retaining wall 104 is in the range of 50% to 135%, preferably in the range of 70% to 120%. The film pattern layer 114 has a flat surface and has a height substantially similar to the height h of the retaining wall 104. In general, no more processes are required to process the surface of the film ® pattern layer 114, thereby reducing manufacturing time. The substrate 100 can be applied to color filters and organic exposure devices. In addition, the retaining wall 104 can be partially removed from the substrate 100 as needed. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or changes in accordance with the spirit of the present invention. It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of a preformed substrate having a retaining wall. 2 to 3 are schematic views showing a method of manufacturing the preformed substrate shown in Fig. 1. 4, 5 and 6 are schematic views of a method of manufacturing a substrate having a thin film pattern layer using the preformed substrate shown in Fig. 1. Figure 7 is a schematic cross-sectional view of a conventional substrate having a thin film pattern layer. [Main component symbol description] 11 200829343 Preformed substrate 11 Substrate 100 Retaining wall 104 Containing space 106 Inkjet device 110 Ink 112 Thin film pattern layer 114 Photomask 200 Photoresist material layer 202 Upper surface of retaining wall 1042 12