200829145 九、發明說明： 【發明所屬之技術領域】 本木係關於種政熱糸統’特別是指一種包含改良型熱 導管與平板式蒸發器之散熱系統。 ^ 【先前技術】 熱管理在各領域中都是-個必需面對而具挑戰性的課 題’如凍土的穩定、電子設備冷卻與太空飛行器等等。如何 祕地從熱_除或供齡熱沈（Heatsink)如散熱片 馨等，已經成為最近各領域技術發展的主要障礙之一。‘ 、在眾多熱管理的方法中’熱導管(HeatPipe)是一種常 被應用的手段。熱導管是一種雙相熱傳導裝置，可以高效率 且有效的料熱能。請參考第一圖，其為一習用之熱導管裝 置的示意圖。在第一圖中，該熱導管丨主要是由管殼^、毛 細結構(Wiek Strueture) 12和端蓋13組成，其内部是維持 在-低壓狀態，並置入適量的低沸點液體m，這種液體因 其低_故料蒸發。毛細結獅—毛細多補料構成，並 鲁，附於内管壁。熱導管一端為蒸發端⑸，另外一端為冷凝 端一 152，當熱導管一端受熱時，毛細管中的液體迅速蒸發成 為高屢蒸氣182 ’該蒸氣182在壓力差的趨動下流向另一 端，並聯放錢量並錄凝結成㈣⑻，液體再沿該毛 細多孔材料靠著毛細力的作用流回蒸發端，如此循環不止， 熱暈即可由熱導管之一端被傳至另外一端。這種循環是快速 進彳亍的，熱量可以被源源不斷地傳導開來。 過去幾十年來熱導管（HeatPipe)已經成功的解決許多 工程上的問題，然而近來電子封裝晶片尺寸愈來愈小，、^所 200829145 消耗之功養大，使得現今電子機構散編㈣題日益嚴重， 造成現階段轉管理賴’已無法再翻於下—代微處理^ 的散熱與_量之S求，故發展絲傳量鱗管是刻不容= 的。 ^ 傳統的熱導管構造其毛細結構分佈於整個熱導 緣，其孔隙大小有-定舰制，其若是太小雖然可以择 加毛細力，但同時也增加了液體流動的阻力，這個矛盾造^ 了停統熱導管紐能提昇上的-個障礙，同時毛細力的=制 也造成熱導管長度的_ :另外，由於傳統解管的毛細社 構配置於整個熱導管内緣，熱加熱於熱導管時蒸發發生於= 侧’當熱負荷過大時’毛細結構内容易產錢泡而造成乾化 (Dry0ut)，而導致熱傳導的中斷。 為克服上述傳統熱導管之缺陷，近年來業界發展出一改 良之環路型熱導管，其係將蒸汽與冷凝物通道設計為一環 路。請參考第二圖，其為一習用之環路型熱導管裝置的示意 圖。在第二圖中，該熱導管2包括蒸發器21、冷凝區23、 補償室25、蒸汽通道231和泠凝物通道233 ;其中該蒸發器 21為一圓管，其內部包括有一管壁21〇、主毛細結構2ιι、 次毛細結構212、和冷凝物引道214，而其管壁210向内為 一鋸齒狀，在和該主毛細結構211相接處形成一組軸向的蒸 斤引道213，該冷凝物通道233延伸插入蒸發器内部的該主 毛細結構211，並有一開口和包覆其周圍的冷凝物引道214 相通’該冷凝區23則和一如散熱片之熱沈93接觸或靠近。 ¥遺蒸發為21和一外部熱源91接觸或靠近時，其會吸 收其熱能，而導致其内部儲存的冷凝物262蒸發為蒸汽261， 200829145 亚因為一勤差延該蒸汽通道23ι流出，而到達該冷凝區232 時，受到該熱沈93的影響而放出熱能而再度凝結成冷凝物 262 ’在該瘵發器21内部的主毛細結構如中原有的冷凝 物262蒸發後形成的孔洞空間，會產生毛細力而吸引該冷凝 區232凌結之冷凝物262經由該冷凝物通道回到蒸發器 21，亚經由間隔排列的該次毛細結構212與冷凝物引道叫， 均勻且有效率的散布至該主毛細結構211巾，再次受到該外 部熱源91的影響而蒸發，而形成一循環。而該補償室25則 用以儲存多餘的冷凝物262，用以調結整個環路系統中於不 同的外部熱源91的強度下所需之工作流體量的多寡。 上述之環路型熱導管係將傳統熱導管之蒸汽通道和冷 凝物通道分開，可減少工作流體之流阻，而有效提昇熱導^ 之導熱效能與傳輸距離，但由於其必需為設計為一迴路，在 空間的安排上較不便利，同時其蒸發器為圓型，對於如電 子晶片等平面熱源，仍需轉接金屬來連接傳導，而增加其熱 阻，影響熱傳導之效能^ ^ 為改進以上既有之熱導管之缺失，同時進一步提昇散熱 裝置之效能，發明人乃本諸孜孜矻矻及精勤修習之求好精 神，復以累積多年之專業知識與製造設計經驗相互輔佐，歷 經多方巧思及試作後，而成就此一「改良型熱導管散熱系統」 之貫用發明。 200829145 【發明内容】 厶b 月& 本發明欲提供—概齡統，用明轉統之熱導管效 亚進一步滿足產業對於臂丈熱系統於空間安排之需求。 …根律本發明的構想，提出一種散熱系統，其包括_蒸發 ™及〜嘁裝置，其中該冷凝裝置尚包括蒸汽通道、凝結區 和田冷T通逼，其中該蒸汽通道有—端與該蒸發器相 ^ 、以傳达來自該蒸發器的一蒸汽，該凝結區域則輿該墓200829145 IX. INSTRUCTIONS: [Technical field to which the invention pertains] The present invention relates to a heat treatment system, particularly to a heat dissipation system including an improved heat pipe and a flat plate evaporator. ^ [Prior Art] Thermal management is a challenging and challenging subject in every field, such as the stability of frozen soil, electronic equipment cooling and spacecraft. How to secretly remove heat from hotsinks such as heat sinks, such as heat sinks, has become one of the main obstacles to the development of technology in various fields. ‘In many thermal management methods, HeatPipe is a commonly used method. The heat pipe is a two-phase heat transfer device that provides high efficiency and efficient heat transfer. Please refer to the first figure, which is a schematic view of a conventional heat pipe device. In the first figure, the heat pipe 丨 is mainly composed of a casing, a capillary structure (Wiek Strueture) 12 and an end cover 13, and the inside thereof is maintained at a low pressure state, and an appropriate amount of a low boiling liquid m is placed therein. The liquid evaporates because of its low content. The capped lion is composed of multiple capillaries and is attached to the inner wall. One end of the heat pipe is an evaporation end (5), and the other end is a condensation end 152. When one end of the heat pipe is heated, the liquid in the capillary tube evaporates rapidly into a high-frequency vapor 182 '. The vapor 182 flows to the other end under the pressure difference, and is connected in parallel. The amount of money is recorded and condensed into (4) (8), and the liquid flows back to the evaporation end along the capillary porous material by capillary action, so that the heat can be transmitted from one end of the heat pipe to the other end. This cycle is fast-moving, and heat can be continuously transmitted. Heat Pipe has successfully solved many engineering problems in the past few decades. However, the size of electronic package wafers has become smaller and smaller, and the consumption of 200829145 has become more and more serious, making the current electronic organization's scattered (four) problems more and more serious. , at this stage of the transfer management Lai 'can no longer turn to the next - generation micro-processing ^ heat and _ amount of S seeking, so the development of silk volume tube is not allowed =. ^ The traditional heat pipe structure has its capillary structure distributed throughout the thermal guide edge. Its pore size is - fixed. If it is too small, it can increase the capillary force, but it also increases the resistance of liquid flow. The thermal barrier can improve the upper obstacle, while the capillary force system also causes the length of the heat pipe _: In addition, since the traditional decompression capillary structure is disposed at the inner edge of the entire heat pipe, the heat is heated to heat. Evaporation of the conduit occurs on the = side 'when the thermal load is too large', the capillary structure tends to produce bubbles and cause dry (Dry0ut), which leads to the interruption of heat conduction. In order to overcome the drawbacks of the above conventional heat pipes, in recent years, the industry has developed a modified loop type heat pipe which designs a steam and condensate passage as a loop. Please refer to the second figure, which is a schematic diagram of a conventional loop type heat pipe device. In the second figure, the heat pipe 2 includes an evaporator 21, a condensing zone 23, a compensation chamber 25, a steam passage 231, and a condensate passage 233; wherein the evaporator 21 is a circular tube having a tube wall 21 inside. The main capillary structure 2, the secondary capillary structure 212, and the condensate channel 214, and the tube wall 210 is inwardly serrated, forming a set of axial steaming guides at the junction with the primary capillary structure 211. 213, the condensate passage 233 extends into the main capillary structure 211 inside the evaporator, and has an opening communicating with the condensate passage 214 surrounding the envelope. The condensation zone 23 is in contact with a heat sink 93 such as a heat sink. Or close. When the evaporation is 21 and an external heat source 91 is in contact with or close to it, it absorbs its heat energy, and causes the condensate 262 stored therein to evaporate into steam 261, 200829145 because the steam channel 23ι flows out and arrives. When the condensation zone 232 is affected by the heat sink 93, the heat energy is released and recondensed into the condensate 262. The main capillary structure inside the hair conditioner 21, such as the original condensate 262, evaporates and forms a hole space. The condensate 262 that generates the capillary force to attract the condensation zone 232 is returned to the evaporator 21 via the condensate passage, and is subdivided and arranged by the condensate of the secondary capillary structure 212, uniformly and efficiently distributed to The main capillary structure 211 is again evaporated by the external heat source 91 to form a cycle. The compensation chamber 25 is used to store excess condensate 262 for adjusting the amount of working fluid required for the strength of the different external heat sources 91 throughout the loop system. The above-mentioned loop type heat pipe separates the steam passage and the condensate passage of the conventional heat pipe, can reduce the flow resistance of the working fluid, and effectively improve the heat conduction performance and the transmission distance of the heat conduction, but since it must be designed as one The circuit is inconvenient in space arrangement, and its evaporator is round. For planar heat sources such as electronic wafers, it is still necessary to transfer metal to connect conduction, and increase its thermal resistance, affecting the efficiency of heat conduction. The above-mentioned lack of heat pipes and the further improvement of the efficiency of the heat sink, the inventor is the spirit of the enthusiasm and intensive practice, complemented by accumulated years of professional knowledge and manufacturing design experience, through multiple methods After thinking about the trial, the invention of the "modified heat pipe cooling system" was achieved. 200829145 SUMMARY OF THE INVENTION The present invention is intended to provide an age-based system that further meets the industry's need for spatial arrangement of the arm-heating system. The present invention proposes a heat dissipation system comprising an evaporation module and a helium device, wherein the condensation device further comprises a steam passage, a condensation zone and a field cooling T, wherein the steam passage has an end and the evaporation a phase to convey a vapor from the evaporator, and the condensation zone licks the tomb
Si:端相連，用以凝結1^汽為-冷凝物，諺冷凝 ⑽^則，現於該蒸汽通道，並連接該凝結區域與該蒸發 益:/亥^|物是藉由該冷凝物通道而返回到該蒸發器、，並於 該祕器中藉由-外部熱源而將該冷凝物轉化為蒸汽。、 一，佳的’本發明所提供之散熱系統，其中該蒸發器更包 結構，該冷凝區域形成的該冷凝物可齡該毛細結 構/、有的毛細力而被帶回該蒸發器。 補=的^發明所提供之散熱系統，其中該蒸發器包括 結構相鄰，·儲存部分該冷凝物。 W土的，本發明所提供之散熱系统，其該墓 族 一蒸f道’其與該毛細結構_並與該蒸汽通 =集該毛細結構及其本身中產生的蒸汽並傳送 平板树贿提供讀齡备射絲發器為一 較佳的，本㈣峨供之散齡、％， 該平板狀殼額部是分佈於靠_外部熱社 200829145 二，較佳的，本發明所提供之散熱系統，其中該蒸汽引道於 該平板狀殼室内部是分佈於靠近該外部熱源之一側，並延伸 於該毛細結構之間。 、，較佳的，本發明所提供之散熱系統，其中該毛細結構於 該平板狀殼室内部是分佈於該平板狀殼室上下兩側。 ▲較制，本制所提供之散熱祕，其中該蒸汽引道於 該平板狀殼室内部是分佈於該毛細結構與殼室外緣之間，並 延伸於並延伸於該毛細結構之間。 -立ίϊϊ ’ ί發騎提供之散熱系統，其中該蒸汽引道為 、束灶ΐ、·Γ 括—组平行排_縱向直線通路、一橫向 縱向Ui匯集通路、，其中該橫向連結通路橫向穿過該組 連結通路與該蒸=通’而_通路’用以連通該橫向 -立trr愤供之散齡統，其f該蒸汽引道為 路；射該連結通路穿過該_形通路 道。…隹木通路則用以連賴連結通路與該蒸汽通 -圓ίΐ的本發_触之散m其巾概汽通道為 根據本發明_想，提出一種散埶㈣“紅 裝置與一蒸發器；其中該冷凝裝置為其包括一冷凝 一内管、-凝結區域和—外管内^官結構，其包括 該凝結區域與_管連通，於傳送—蒸汽， 該外管則環繞於今内其々k °…、/_L ，、中’旋結為一冷凝物， ⑽内’外_該凝結區域連通，用以傳送 200829145 —外部熱源，其包括一毛細 通，藉由复革，士私引運，其中該毛細結構與該外管連 構相鄰，該冷凝物；該補償賴與該毛細結 連，亚延伸於該毛細結構之，用以及才目 身中承^外部熱輔蝴汽。處細㈣及其本 平板騎提供之散齡統，其情蒸發器為- 該平本巧所提供之散熱系統，其找毛細結構縣 上土-又至内部是分佈於靠近該外部熱源之一側。 該平本發贿提供《散熱細，其中該航引道於 ί袖:室内部是分佈於靠近該外部熱源之-側，並延伸 於該毛細結構之間。 兮亚，麵’本發顺提供之散齡統，其巾該毛細結構於 千板 ^ 殼室内部是分佈於該平板狀殼室上下兩側。 、，車乂仫的，本發明所提供之散熱系統，其中該蒗汽引道於 該平板狀殼室畴是分條細結構與殼餅緣之間，並 延伸於並延伸於該毛細結構之間。 一較佳的，本發明所提供之散熱系統，其中該蒸汽引道為 立體、’、。構’其包括—組放射狀排列的向^通路和—匯集通 路，该匯集通路係用以連通該向心通路與該内管。 車乂么的’本發8綺提供之散齡統，其巾該蒸汽引道為 -立體結構，其包括_組平行湖的縱向直_路、一橫向 連、、^通路和匯集通路，其中該橫向連結通路橫向穿過該組 縱向直線通路而將其連通，該酿通路顧以連通該橫向連 200829145 結通路與該内管。 較佳的’本發騎提供之散熱系統，发节引 -立體結構，其包括—組明心·排^切軌引運為 結通路和―難通路，射該連結通路穿過=== 將其f，而該匯集通路咖以連通該連結===而 與一外部冷凝裝置相接。 該以£域與 凝裝 _Si: the ends are connected to condense the vapor into a condensate, and the condensate (10) is present in the vapor passage, and is connected to the condensation zone and the evaporation benefit: / Returning to the evaporator, the condensate is converted to steam by an external heat source in the trap. The heat dissipation system provided by the present invention, wherein the evaporator is further structured, and the condensate formed in the condensation region can be brought back to the evaporator at the age of the capillary structure/and the capillary force. The heat dissipation system provided by the invention of the invention, wherein the evaporator comprises a structure adjacent to the storage portion of the condensate. W, the heat dissipation system provided by the present invention, the tomb of the tomb is steamed, and the capillary structure _ and the steam pass = the steam generated in the capillary structure and itself and the flat plate bribe is provided The age-prepared hair-splitting device is a preferred one, and the (four) 峨 is provided for the age of the stencil, and the flat-shaped shell forehead is distributed on the external heat society 200829145. Preferably, the heat dissipation provided by the present invention is provided. The system, wherein the steam channel is distributed inside the flat shell chamber on a side of the outer heat source and extends between the capillary structures. Preferably, the heat dissipation system provided by the present invention, wherein the capillary structure is distributed on the upper and lower sides of the flat shell chamber inside the flat shell. ▲Comparatively, the heat dissipation secret provided by the system, wherein the steam channel is distributed between the capillary structure and the outer edge of the shell inside the flat shell, and extends between and extends between the capillary structures. - 立 ϊϊ ' ί 骑 提供 提供 提供 提供 ί , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Passing through the group of connecting passages and the steaming passages and the passages for communicating the horizontal-standing trr anger supply, wherein the steam approach is a road; and the connecting passage passes through the _shaped passage . ...the rafter passage is used to connect the connection passage with the steam passage-circle ΐ ΐ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Wherein the condensing device comprises a condensation inner tube, a condensation zone and an outer tube inner structure, wherein the condensation zone is connected to the tube to transmit steam, and the outer tube surrounds the present °..., /_L , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Wherein the capillary structure is adjacent to the outer tube, the condensate; the compensation is connected to the capillary, sub-extended to the capillary structure, and the external heat-supporting butterfly is used in the body. (4) The scattered age system provided by the flat plate rider, the evaporator of the condition is - the heat dissipation system provided by the flat body, which is located on the upper side of the capillary structure and is distributed to the side of the external heat source. The flat bribe provides "fine heat, which is the way to the waist: room The portion is distributed on the side close to the external heat source and extends between the capillary structures. 兮亚,面的本发顺 provides the age of the body, the towel of the towel is distributed in the interior of the shell The heat dissipation system provided by the present invention is provided in the upper and lower sides of the flat shell chamber. The heat transfer system provided by the present invention, wherein the flat steam chamber is between the thin strip structure and the shell edge, and Extendingly and extending between the capillary structures. Preferably, the heat dissipation system provided by the present invention, wherein the steam channel is a three-dimensional, ', 'structure' includes a set of radially arranged channels and a collecting passage for connecting the centripetal passage and the inner tube. The 绮 乂 ' 本 本 本 本 本 本 , , , , , 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该a longitudinal straight path of the lake, a transverse connection, a passage, and a collection passage, wherein the transverse connection passage communicates transversely through the set of longitudinal straight passages, the brewing passage connecting the transverse connection 200829145 junction passage and the Inner tube. The preferred 'this hair ride provides the scattered The system, the singularity-three-dimensional structure, which includes a group of hearts, rows, and tracks, which are transported as a junction path and a "difficult path", and the link path is passed through === to be its f, and the collection path is connected The connection === and is connected to an external condensing device.
置為^^/本發_提供之賴紐，料該外部冷 圖示說明，俾 本案之功效與目的，可藉由下列實施例與 有更深入之了解。、 【實施方式】 本發:月將可由以下的實施例說明而得到充分瞭解，使得 熟習本技蟄之人士可以據以完成之，然本發明之實施並非可 由下列實例而被限制其實施型態。 請參考第三圖UKb) ’其為本案散熱系統之第—實施 例的示思圖’第二圖（a)為該實施例的一側向視圖，第三 圖(b)則為該實施例的俯視圖。在第三圖（a) (b)中，一 散熱系統3包^§一蒸發器31和一熱導管33。其中該蒸發器 31為一平板狀殼槽310，通常為一導熱良好的金屬合金所製 成，其是用以與一外部熱源91靠近或接觸而承受其熱能， 其包括一毛細結構（Wick Structure〉311、一蒸汽引道313 和一補償室（CompensationChamber) 315，並於抽真空後注 入一低壓下易蒸發的液體以作為一冷凝物362 ;該蒸汽引道 11 200829145 =為Γ組相通的管道’其分佈於該毛細結構311和靠近該 ϋ的殼槽壁之間’並以延伸於該毛細結構311之間，通^ 2冲立體管路結構，用以收集該冷凝物362受熱後產 該—熱導管33為—管中管結構，與該蒸發器31相連，包 括一内官331、一外管333及一凝結區域335。該内管如 讀該蒸汽361 ;該凝結區域335係與該内管 τ端相連’並#近或接觸例如散熱片等之一外部敎 沈” vxieat Sink),可使來自於該内管之一蒸汽361放出^ 362。繼333職繞於該;; ΓηΓί通該f结區域335與蒸發器3卜並與該毛細結構 所4，其是作為—冷凝物的通道，可讓該凝結區域奶 ^^冷凝物362通過該外管33而回到該蒸發器Μ，而 又將於該蒸發器31中受熱而蒸發為一蒸汽 轉’猶魏帽由餘與氣相藉的交 持續將斟部熱㈣的熱能傳導至該外部熱沈 967 ^ 31 f 31f 中_ ^針對不同的外部熱源％的熱貞荷來調結整個系統 中的=物數量與氣_力，翻最佳的熱傳導效能。 处麟ί述的循環中’其是依靠該外部熱源91所提供的熱 構311本身所具有的毛細力來驅動整個系統， ===毛細結構311上冷凝物362受熱蒸發後，該毛細 晴殘㈣孔隙將會因毛細力的作__對該外 吕333的冷凝物362產生拉力，使其不斷進入該毛細結構 12 200829145 311，而因為該冷凝物362受熱後於蒸？丨道幻產― 313 g 内邛要尚，而使該蒸汽361則會因為該 罢 而經由該蒸汽W道313匯集而往該内管331移動，=… 該内管331抵達該凝結區域335中後受該外部執 心362物細31 _㈣ 在於f賴__差财於:其毛細結構只存 絲㈣發盗3Γ内而非分稀於整個敎導管，得^ :毛::可：:隙非常小的結構，以增加系統的= 的流動’此結構可有效的阻 :篇與診更進-步的，由於^ ^ 流之流阻了以的， 徑愈小愈奸，可有效增:系統的2以結構，此孔隙半Set as ^ ^ / this hair _ provide the Lai New Zealand, the external cold icon description, 俾 The effectiveness and purpose of the case, can be more deeply understood by the following examples. [Embodiment] The present invention will be fully understood by the following examples, so that those skilled in the art can complete the present invention. However, the implementation of the present invention may not be limited by the following examples. . Please refer to the third figure UKb) 'which is the first part of the heat dissipation system of the present invention - the second figure (a) is a side view of the embodiment, and the third figure (b) is the embodiment Top view. In the third (a) and (b), a heat dissipating system 3 includes an evaporator 31 and a heat pipe 33. The evaporator 31 is a flat plate-shaped housing 310, which is usually made of a metal alloy with good heat conductivity. It is used to withstand or contact with an external heat source 91 to withstand thermal energy. It includes a capillary structure (Wick Structure). 311, a steam inlet 313 and a compensation chamber 315, and after vacuuming, inject a liquid that is easily evaporated under a low pressure as a condensate 362; the steam approach 11 200829145 = a conduit for the Γ group 'It is distributed between the capillary structure 311 and the wall of the casing near the crucible' and extends between the capillary structure 311 to pass through the three-dimensional pipeline structure for collecting the condensate 362 after being heated. The heat pipe 33 is a tube-in-tube structure connected to the evaporator 31 and includes an inner portion 331, an outer tube 333 and a condensation region 335. The inner tube reads the steam 361; the condensation region 335 is associated with the The end of the inner tube τ is connected to 'and close to or contact with one of the outer fins, such as a heat sink, etc., vxieat Sink), so that steam 361 from one of the inner tubes can be released ^ 362. Following the 333 position around; ΓηΓί通The f junction region 335 and the evaporator 3 and the hair The fine structure 4 is a passage for the condensate, and the condensation zone 362 condensate 362 is returned to the evaporator 通过 through the outer tube 33, and is heated by the evaporator 31 to evaporate. For a steam turn, the 'Ji Wei Cap' from the balance of the gas and the gas phase continues to transfer the heat of the heat of the crotch (4) to the external heat sink 967 ^ 31 f 31f _ ^ for the heat of the different external heat source % The number of objects in the whole system is the same as the gas force and the best heat transfer efficiency. In the cycle described in the section, it relies on the capillary force of the thermal structure 311 provided by the external heat source 91 to drive the whole. System, ===The condensate 362 on the capillary structure 311 is evaporated by heat, and the capillary residue (4) pores will be pulled by the capillary force of the condensate 362 of the outer 333, so that it continuously enters the capillary structure. 12 200829145 311, and because the condensate 362 is heated and then steamed in the steamed road - 313 g, the steam 361 will be collected by the steam W 313 to the inner tube. 331 moves, =... the inner tube 331 arrives in the condensation zone 335 and is subjected to the external Heart 362 fine 31 _ (four) lies in _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In order to increase the flow of the system = this structure can effectively block: the chapter and the diagnosis are more advanced, because the flow of the flow is blocked, the smaller the diameter, the more effective, the system can be effectively increased: This pore half
等之餘結構，t祕4-如CPU 管，再傳至埶、、尤金屬塊轉接來將熱能傳導至熱導 直接設計為二平板上2，而本發明中該蒸發器31則可 傳導的熱阻。同時，傳统平面熱源’而減少中間金屬. 導管内緣，當外部埶^ =¥官的毛細結構是分佈於整個熱 内侧，當埶ϋ 1、於該療發131時蒸發是發生於 負何過大^毛細結構内產生之氣泡非常容易造 13 200829145 崎響熱料之效料轉致_導的中止π 本發明在該洛發H 内分布有墓 雨 構3U之間，鮮可以不引逼313延伸於毛細結 311 ' b 而k過毛細結構即可將該毛細έ士槿 311达緣的該冷凝物362轉換為蒸汽充卜 、、。構 另外對於該熱導管33而言，由於1真一其 在空間 物通道是_環_ _道响管外 =任何方向皆方便於冷凝物淑依靠其本身之重量而匯华 /瓜出，而降低該冷凝物362回培蒸汽通道的可性，= 了熱導管的正常運作與效能發揮。 厂而確保 M ^ 明案之蒸發器31内設置有延伸散佈的蒸汽 引逞313，熱能不需通過毛細結構，就能產生蒸汽36卜而 可有效，降轉統齡在熱負·场_下，其毛細結構 產生過夕的氣泡而導致的乾化（Dry 〇ut)現象。而基發哭 31設計為平板狀，财直接_如電子晶鱗平面熱源，而 無需轉接金屬來連接’而減少傳統熱管應用時整體散讎組 的熱阻0 · 請參考第四圖’其為本案散熱系統之第二實施例的示意 圖。在第四圖中’―散熱系統4包括-蒸發器41與-熱導 管33，該瘵發器41包括一毛細結構411、一蒸汽引道413 與-補償室心該熱導管33則包括一作為統通道之内管 33卜一環繞該内管331而作為冷凝物通道之外管扭及一 凝結區域335 〇 本實施例與第施例之主要差別在於該蒸汽引道413 的結構’其鮮官33之結構補由蒸汽與冷凝物雙相導熱 14 200829145 的運作方式則皆與散熱系統3相同。在本實施例中，該蒸汽 引道413包括有一組平行直線排列之第一蒸汽引道Μ)卜一 連通該組第一蒸汽引道4131的第二蒸汽引道41% 接該第二蒸汽引道4133與該内管331之第三蒸汽引道 4135，其中該第二蒸汽引道4133可由該毛細結構與蒸發器 41外殼間的弧狀槽室構成。 經由此-巧妙排列可有效的匯集並導出該毛細結構411 邊緣的冷凝物受到外部熱源所產生之蒸汽。 • : 考第五圖’其為本案散熱系統之第三實施例的示意 厂牡第五圖中，-散熱緒5包括—蒸發器' 51與一熱導 管33，該蒸發器51包括一毛細結構511、一蒸汽引道513 /、補彳貝至515 ’该熱導管33則包括一作為蒸汽通道之内管 331、一環繞該内管331而作為冷凝物通道之外管333及一 凝結區域335。 本實施例與第-實施例之主要差別在於該蒸汽引道513 的結構，其鱗管33之結構與藉由蒸汽與冷凝物雙相導熱 _ 的，作方式則皆與散熱系統3相同。在本實施例中，該蒸汽 巧513包括有一組環型排列之第一蒸汽引道·、一垂直 3並連通該組第-航引道5131的第二蒸汽引道51心 、曾-連接該第二蒸汽引道5133與該内管331之第三蒸汽引 ’其中該第—第—蒸汽引道5131係可由該蒸發器51 導緣之凹槽所形成，經由此一巧妙排列可有效的匯集並 汽。耗細結構S11邊緣的冷凝物受到外部熱源所產生之蒸 si考第/、圖，其為本案散熱系統之第四實施例的示意 15 200829145 圖。在第六圖中’ -散熱系統6包括—平板式蒸發器6i與 -熱導管33 ’該蒸發器61包括—毛細結構6ii、一墓汽引 逼613與-補償室仍，該熱導管33則包括一作為塞汽通道 之内管331、-環繞該内管331 _為冷凝物通道之外管撕 及一凝結區域335 〇 〇 ^本實關與第三實闕之主要朗在於辭板式蒸發 益61的結構，其熱導管33之結構與藉由蒸汽與冷凝物雙相 ，熱的運作方摘賴散齡統5相同。在本實施例中，該 療汽引道613包括有兩組第一蒸汽引道6131和6132，其分 別分佈於該平板式蒸發H 61的上下_，縣兩組第= Η引道6133及6134分別穿過並連通平板上部之第一基^ =、咖及平板下部之第-細丨道㈣，並有—第^汽 引逼6135 ’用以連通該第二蒸汽引道6133及6134及該内管 331 ’經由該蒸汽引道犯的巧妙安排，該蒸發器61的上下 兩’可以同時承受來自兩側的外部熱源，在有_裝置空間 下達到更有效的熱能消散與傳導效果。 廿门，合以上描述’本案確實提供一實用可行之散熱系統， 亚冋~具有提升散熱效能與增進空間利用性等諸般優點，兼 具產業之實祕，實屬難能之鑛紗，深具鮮價彳， 依法提出申請。 f 、本案得由熟悉技藝之人任施匠思而為諸修飾，然 脫如附申請範圍所欲保護者。 ^ 16 200829145 【圖式簡單說明】 第一圖:習用之一傳統熱導管裝置的示意圖。 第二圖：習用之一環路型熱導管裝置的示意圖。 第三圖：本案散熱系統第一實施例的示意圖。 第四圖：散熱系統第二實施例的示意圖。 第五圖：散熱系統第三實施例的示意圖。 第六圖：散熱系統第四實施例的示意圖。 【主要元件符號說明】 1 :一傳統熱導管 2 : —習甩之環路型熱導管 3:本案第一實施例之散熱系統 4:本案第二實施例之散熱系統 5 :本案第三實施例之散熱系統 6 :本案第四實施例之散熱系統 11 :管殼 151 :蒸發端 181 :低沸點液體 33 :熱導管 13 :端蓋 152 :冷凝端 182:蒸汽 21、31、41、51、61 :蒸發器 12、311、411、511、611 :毛細結構 313、413、513、613 :蒸汽引道 315、415、515、615 :補償室 331 :内管 91 :外部熱源 333 ：外管 93 :外部熱沈（Heat Sink) 17 200829145 335 :凝結區域 261、361 :蒸汽 211 :主毛細結構 4131 、 5131 、 6131 、 4133 、 5133 、 6133 、 4135 、 5135 、 6135 : 310 :平板狀殼槽 262、362 :冷凝物 212 :次毛細結構 6132 :第一蒸汽引道 6134 :第二蒸汽引道 第三蒸汽引道The structure of the remainder, such as the CPU tube, is transferred to the crucible, and the special metal block is transferred to transfer the thermal energy to the thermal conduction directly to the two flat plates 2, and in the present invention, the evaporator 31 can conduct Thermal resistance. At the same time, the traditional planar heat source 'reduced the intermediate metal. The inner edge of the duct, when the external 埶 ^ = ¥ officer's capillary structure is distributed inside the entire heat, when 埶ϋ 1, in the treatment 131, evaporation occurs in the negative and too large ^The bubble generated in the capillary structure is very easy to make 13 200829145 The effect of the sizzling hot material is transferred to the _ conduction stop π. The invention is distributed between the 3U of the tomb and rain in the Luofa H, and the 313 extension is not allowed. The condensate 362 of the capillary 槿 311 is converted into a vapor filling by the capillary 311 ′ b and k over the capillary structure. In addition, for the heat pipe 33, since the space is _ ring__ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The condensate 362 returns to the steam channel, and the normal operation and performance of the heat pipe. The factory ensures that the evaporator 31 of the M^ case is provided with a steam 313 which is extended and dispersed. The heat energy can generate steam 36 without passing through the capillary structure, and can be effective, and the temperature is reduced under the thermal field. The capillary structure causes the phenomenon of dry (Dry 〇ut) caused by the bubbles of the New Year's Eve. The base hair crying 31 is designed as a flat plate, and the financial direct _ such as the electronic scaly plane heat source without the need for a transfer metal to connect 'and reduce the thermal resistance of the overall heat dissipation group when the conventional heat pipe application is 0. Please refer to the fourth figure' A schematic diagram of a second embodiment of the heat dissipation system of the present invention. In the fourth figure, the heat dissipating system 4 includes an evaporator 41 and a heat pipe 33. The hair damper 41 includes a capillary structure 411, a steam channel 413 and a compensation chamber. The heat pipe 33 includes a The inner tube 33 of the channel is surrounded by the inner tube 331 as a condensate channel and a condensation region 335. The main difference between the embodiment and the embodiment is that the structure of the steam channel 413 is The structure of 33 supplements the two-phase heat conduction between steam and condensate. 14 200829145 operates in the same way as the heat dissipation system 3. In the present embodiment, the steam channel 413 includes a first steam channel arranged in a parallel line, and a second steam channel connecting the first steam channel 4131 is 41% connected to the second steam channel. The track 4133 and the third steam channel 4135 of the inner tube 331, wherein the second steam channel 4133 can be formed by the arc-shaped groove chamber between the capillary structure and the outer casing of the evaporator 41. By this, the ingenious arrangement can effectively collect and derive the condensate from the edge of the capillary structure 411 by the steam generated by the external heat source. • In the fifth diagram of the fifth embodiment of the heat dissipation system of the present invention, the heat dissipation system 5 includes an evaporator '51 and a heat pipe 33, and the evaporator 51 includes a capillary structure. 511, a steam inlet 513 /, fill the mussel to 515 'the heat pipe 33 includes an inner tube 331 as a steam passage, a tube 333 surrounding the inner tube 331 as a condensate passage, and a condensation region 335 . The main difference between this embodiment and the first embodiment is the structure of the steam channel 513. The structure of the scale tube 33 and the two-phase heat conduction by steam and condensate are the same as those of the heat dissipation system 3. In the present embodiment, the steam 513 includes a set of first steam channels arranged in a ring shape, a vertical 3, and a second steam channel 51 connected to the set of first navigation path 5131. The second steam channel 5133 and the third steam channel of the inner tube 331, wherein the first steam channel 5131 can be formed by the groove of the leading edge of the evaporator 51, can be effectively collected through this ingenious arrangement. And steam. The condensate at the edge of the fine structure S11 is subjected to steaming by an external heat source, and is a schematic view of the fourth embodiment of the heat dissipation system of the present invention. In the sixth diagram, the heat dissipating system 6 includes a flat evaporator 6i and a heat pipe 33. The evaporator 61 includes a capillary structure 6ii, a tomb attracting 613 and a compensation chamber still, and the heat pipe 33 is Including an inner tube 331 as a plug passage, surrounding the inner tube 331 _ is a condensate passage outside the pipe tearing and a condensation zone 335 〇〇 ^ The actual and the third real 阙 主要 在于 在于 第三 第三 第三The structure of 61, the structure of the heat pipe 33 and the two phases by steam and condensate, the heat operation is the same as that of the age class 5. In the present embodiment, the steam treatment channel 613 includes two sets of first steam channels 6131 and 6132, which are respectively distributed on the upper and lower sides of the plate evaporation H 61 , and the two groups in the county group = 6133 and 6134 Passing through and communicating with the first base of the upper part of the flat plate, the first and the lower part of the lower part of the flat plate, and having the first steam guide 6135' for connecting the second steam guides 6133 and 6134 and Through the ingenious arrangement of the inner tube 331', the upper and lower '' of the evaporator 61 can simultaneously receive external heat sources from both sides, and achieve more effective heat dissipation and conduction effects in the device space. Tuen Mun, combined with the above description 'this case does provide a practical and feasible cooling system, Aachen ~ has the advantages of improving heat dissipation efficiency and improving space utilization, and has the real secret of the industry, it is a difficult mineral yarn, deep Fresh price, apply in accordance with the law. f. This case has been modified by the people who are familiar with the craftsmanship, but it is removed as attached to the scope of application. ^ 16 200829145 [Simple description of the diagram] The first picture: a schematic diagram of one of the conventional heat pipe devices. Figure 2: Schematic diagram of one of the loop type heat pipe devices. Third figure: Schematic diagram of the first embodiment of the heat dissipation system of the present case. Fourth Figure: Schematic diagram of a second embodiment of a heat dissipation system. Fifth Figure: Schematic diagram of a third embodiment of a heat dissipation system. Figure 6: Schematic diagram of a fourth embodiment of a heat dissipation system. [Main component symbol description] 1 : A conventional heat pipe 2: - a loop type heat pipe 3 of the same type: the heat dissipation system 4 of the first embodiment of the present invention: the heat dissipation system 5 of the second embodiment of the present invention: the third embodiment of the present case Heat dissipation system 6: heat dissipation system 11 of the fourth embodiment of the present invention: tube casing 151: evaporation end 181: low boiling point liquid 33: heat pipe 13: end cover 152: condensation end 182: steam 21, 31, 41, 51, 61 : evaporators 12, 311, 411, 511, 611: capillary structures 313, 413, 513, 613: steam channels 315, 415, 515, 615: compensation chamber 331: inner tube 91: external heat source 333: outer tube 93: External heat sink (Heat Sink) 17 200829145 335: Condensation zone 261, 361: Steam 211: main capillary structure 4131, 5131, 6131, 4133, 5133, 6133, 4135, 5135, 6135: 310: flat shell groove 262, 362 : Condensate 212: Secondary capillary structure 6132: First steam approach 6134: Second steam approach third steam approach
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