200829116 九、發明說明 【發明所屬之技術領域】 本發明是有關多層印刷配線板及其製造方法，特別是 具有可撓性電纜部的薄型多層可撓性印刷配線板及其製造 方法。 【先前技術】 近年來受到零件數的削減或小型化、薄型化的要求， 使組裝各種電子零件的組裝基板部及可撓性電纜部一體化 的多層可撓性印刷配線板，將以行動電話等的小型電子機 器用途爲中心廣泛地普及（參照專利文獻1 )。而且，最 近對於該多層可撓性印刷配線板的薄型化的要求更日益提 高，有時4層形成3 ΟΟμπι程度的厚度。 然而，在上述薄型的多層可撓性印刷配線板進行電子 零件的高密度表面組裝時，因爲配線板本身的剛性低，所 以必須在零件組裝工程、亦即焊漿印刷工程、零件搭載工 程、回流焊工程中固定於各製品的專用回流焊治具之厚度 2mm程度的鋁等金屬板，組裝工程的繁雜度、治具成本會 造成問題（參照專利文獻2 )。 並且，在4〜6層程度的多層可撓性印刷配線板中， 亦有在其兩面組裝被要求平坦度的 CSP ( Chip Size Package ;晶片尺寸封裝）之情況，在單面組裝CSP時的 回流焊（reflow)等的熱履歷下配線板容易彎曲，無法確 保相反面的平坦度，導致組裝工程的良品率降低。這即使 -4- 200829116 利用回流焊治具，也會因爲配線板本身的剛性不足，難以 使用以往的方法解決。 基於該等的情事，期望出現可對薄型的多層可撓性印 刷配線板簡便地組裝電子零件的方法。 圖3是表示以往的多層印刷配線板的製造方法的槪念 剖面構成的工程圖，首先如圖3 ( 1 )所示，準備··在聚醯 亞胺等的可撓性絕緣基材1的兩面具有配線圖案2，3，藉 由以塡孔電鍍（via filling plating)充塡後的有底微孔4 來層間連接的兩面可撓性印刷配線板。 更在其兩面貼合所謂表護層7，該表護層7是例如在 12 μπι厚的聚醯亞胺薄膜5上具有厚度15 μπι的丙烯酸環氧 (aery 1 · epoxy )等的接著材6，以目前爲止的工程來取得 多層印刷配線板的電纜部及形成核心配線板之具有塡孔構 造的兩面核心配線板8。 其次，如圖3 ( 2 )所示，準備所謂單面覆銅積層板 11，該單面覆銅積層板11是在聚醯亞胺等的絕緣基材9 的單面具有厚度12μιη的銅箔1〇。 預先模製用以使增層（buildup)層的單面覆銅積層板 1 1增層於兩面核心配線板8的接著材1 2及單面覆銅積層 板1 1，然後進行對位，經由接著材1 2來使單面覆銅積層 板U與兩面核心配線板8以真空壓機（Vacuum Press) 等積層。以到目前爲止的工程來取得多層配線基材1 3 ° 其次，如圖3(3)所示’在單面覆銅積層板11的銅 箔10面，藉由通常的光學製造（Photo Fabrication)手法 200829116 來形成雷射加工時的共型光罩（c ο n f o r m a 1 m a s k )，利用 彼來進行雷射加工，形成直徑100〜150μπι程度的導通用 孔。更進行去膠渣（de smear )處理、導電化處理，作爲 用以藉由電解電鍍來取得層間連接的前處理。 接著，在具有導通用孔的多層配線基材進行i 5〜 2 5 μπι程度的電解電鍍，形成微孔1 9，取得層間導通。以 目前爲止的工程來取得層間導通完了的多層配線基材。 其次，藉由光學製造手法來形成包含搭載CSP等的表 面組裝零件的微孔接端面19a之配線等。其次，形成阻焊 劑（Solder Resist)層17。因應所需，在配線端子部表面 實施錫焊、鍍鎳、鍍金等的表面處理，利用銀膏（paste ) 、遮蔽薄膜等來形成往電纜部的外層側之遮蔽層。然後， 進行外形加工，而取得具有電纜部的多層可撓性印刷配線 板20。 就此例那樣的基板厚度3 00μπι程度的薄型多層可撓性 印刷配線板的兩面組裝CSP時，在單面組裝CSP時的回 流焊等的熱履歷下配線板容易彎曲，無法確保相反面的平 坦度，導致組裝工程的良品率降低。這即使利用回流焊治 具，也會因爲配線板本身的剛性不足，難以使用以往的方 法解決。 對於此類課題的組裝方法，有抑止多層印刷配線板的 回流焊時的熱變形之方法（參照專利文獻3 )。其係越靠 多層印刷配線板的外側層越增厚絕緣樹脂層，使多層印刷 配線板的剛性提高，而可防止熱變形。然而，違背了多層 -6- 200829116 可撓性印刷配線板所被要求的薄型化，因此未解決問題。 〔專利文獻1〕特開2004-200260號公報 〔專利文獻2〕特公平7 - 6 0 9 3 4號公報 〔專利文獻3〕特許第3 7 5 0 8 3 2號公報 【發明內容】 (發明所欲解決的課題） 在上述薄型的多層可撓性印刷配線板進行高密度表面 組裝時，此種的多層可撓性印刷配線板因爲配線板本身的 剛性低，所以必須在零件組裝工程、亦即焊漿印刷印刷（ cream solder printer)工程、零件搭載工程、回流焊工程 中固定於各製品的專用回流焊治具之厚度2mm程度的鋁 等金屬板，組裝工程的繁雜度、治具成本會造成問題。 並且，在4〜6層程度的多層可撓性印刷配線板中， 亦有在其兩面組裝被要求平坦度的CSP (晶片尺寸封裝） 之情況，在單面組裝CSP時的回流焊等的熱履歷下配線板 容易彎曲，無法確保相反面的平坦度，導致組裝工程的良 品率降低。這即使利用回流焊治具，也會因爲配線板本身 的剛性不足，難以使用以往的方法解決。 本發明是有鑑於上述點而硏發者’其目的是在於提供 一種可在兩面組裝被要求平坦度的CSP之薄型的多層可撓 性印刷配線板、及價格便宜且安定地製造該配線板的方法 200829116 (用以解決課題的手段） 爲了達成上述目的，本案係提供其次的各發明。 第1發明之多層印刷配線板，係於可撓性絕緣基材的 至少一面複數積層具有配線圖案的可撓性印刷配線板之多 層印刷配線板，其特徵爲： 在包含位於上述多層印刷配線板的最外層的零件組裝 用的接端面之配線圖案間具備補強圖案。 又，第2發明之多層印刷配線板的製造方法的特徵係 具備： a )在可撓性絕緣基材的至少一面製造具有配線圖案 的内層的核心配線板之工程； b )將外層增層層用的可撓性覆銅積層板經由接著材 來積層於上述内層核心配線板之工程； c) 在上述多層配線基材的導通用孔形成部位形成導 通用孔之工程； d) 利用上述導通用孔來進行層間連接之工程； e )在上述多層配線基材的最外層形成包含零件組裝 用的接端面的配線圖案、及配置於該配線圖案之間的補強 圖案之工程；及 f)在上述補強圖案形成阻焊劑層之工程。 〔發明的效果〕 根據該等的特徴，本發明可發揮其次的效果。 亦即，在多層印刷配線板中，因爲具有與多層印刷配 -8 - 200829116 線板的最外層的零件組裝用的接端面電性獨立的金屬製的 補強圖案，所以在構成多層印刷配線板的材料中，賦予彎 曲彈性最高的銅等的金屬較厚，配置於構造上形成配線板 全體的彎曲彈性最高的配線板的最外層的零件組裝部之微 孔接端面的周圍，藉此即使在薄型的多層可撓性印刷配線 板中也可確保剛性。因此，即使在CSP的兩面組裝工程中 在單面組裝CSP時的回流焊等的熱履歷下配線板也不會彎 曲，可確保相反面的平坦度，而能夠構築安定的組裝工程 其結果，若根據本發明，則可價格便宜且安定地製造 一種可在兩面組裝被要求平坦度的CSP之薄型的多層可撓 性印刷配線板。 【實施方式】 以下，參照圖1A-圖1D及圖2來說明本發明的實施BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board and a method of manufacturing the same, and, in particular, to a thin multilayer flexible printed wiring board having a flexible cable portion and a method of manufacturing the same. [Prior Art] In recent years, the number of parts has been reduced, the size of the components has been reduced, and the thickness of the components has been reduced. The multi-layer flexible printed wiring board in which the assembled substrate portion and the flexible cable portion of the various electronic components are integrated is used as a mobile phone. The use of such small electronic devices is widely spread (see Patent Document 1). Further, recently, the demand for thinning of the multilayer flexible printed wiring board has been increasing, and the thickness of 3 layers is sometimes formed to a thickness of about 3 μm. However, when the thin multilayer flexible printed wiring board is assembled on a high-density surface of an electronic component, since the rigidity of the wiring board itself is low, it is necessary to perform assembly engineering, that is, a solder printing process, a component mounting process, and a reflow. In the case of a metal plate such as aluminum having a thickness of 2 mm, which is fixed to a dedicated reflow soldering jig for each product in the welding process, the complexity of the assembly process and the cost of the jig are problematic (see Patent Document 2). In addition, in a multilayer flexible printed wiring board having a thickness of 4 to 6 layers, a CSP (Chip Size Package) having a required flatness is applied to both surfaces thereof, and reflow is performed when CSP is assembled on one side. The wiring board under the heat history such as reflow is easily bent, and the flatness of the opposite surface cannot be ensured, resulting in a decrease in the yield of the assembly work. Even if -4- 200829116 uses a reflow soldering jig, it is difficult to use the conventional method because the rigidity of the wiring board itself is insufficient. Based on such circumstances, it is desirable to have a method of easily assembling an electronic component to a thin multilayer flexible printed wiring board. 3 is a view showing a configuration of a commemorative cross-sectional structure of a method for manufacturing a conventional multilayer printed wiring board. First, as shown in FIG. 3 (1), a flexible insulating substrate 1 such as polyimide or polyimide is prepared. The two sides have the wiring patterns 2, 3, and the double-sided flexible printed wiring board which is connected by the bottomed micropores 4 which are filled by via filling plating. Further, a so-called surface layer 7 is attached to both surfaces thereof, and the surface layer 7 is, for example, a laminate material having an acrylic epoxide (aery 1 · epoxy) having a thickness of 15 μm on a polyimide film 5 having a thickness of 12 μm. The cable portion of the multilayer printed wiring board and the double-sided core wiring board 8 having the pupil structure forming the core wiring board have been obtained by the conventional work. Next, as shown in Fig. 3 (2), a so-called single-sided copper-clad laminate 11 having a thickness of 12 μm on one side of an insulating substrate 9 such as polyimide or the like is prepared. 1〇. A single-sided copper clad laminate 1 1 for pre-molding a buildup layer is laminated on the backing material 1 2 and the single-sided copper clad laminate 1 1 of the double-sided core wiring board 8 and then aligned, via Next, the single-sided copper clad laminate U and the double-sided core wiring board 8 are laminated by a vacuum press or the like. The multilayer wiring substrate was obtained at a level of 1 3 ° so far, and as shown in Fig. 3 (3), the surface of the copper foil 10 of the single-sided copper-clad laminate 11 was formed by usual optical fabrication (Photo Fabrication). The technique 200829116 is used to form a common mask (c ο nforma 1 mask) for laser processing, and laser processing is performed by using the same to form a conductive hole having a diameter of about 100 to 150 μm. Further, de smear treatment and conductivity treatment are carried out as pretreatment for obtaining interlayer connection by electrolytic plating. Next, electrolytic etching is performed on the multilayer wiring substrate having the conductive holes at a degree of i 5 to 25 μm to form micropores 19, and interlayer conduction is obtained. The multilayer wiring substrate in which the interlayer conduction is completed has been obtained by the current work. Next, wirings including the micropore end faces 19a on which surface mount components such as CSPs are mounted are formed by an optical manufacturing method. Next, a layer of solder resist (Solder Resist) 17 is formed. A surface treatment such as soldering, nickel plating, or gold plating is applied to the surface of the wiring terminal portion as needed, and a shielding layer toward the outer layer side of the cable portion is formed by a paste or a mask film. Then, the outer shape processing is performed to obtain the multilayer flexible printed wiring board 20 having the cable portion. When the CSP is assembled on both sides of the thin multilayer flexible printed wiring board having a substrate thickness of about 30,000 μm as in this example, the wiring board is easily bent under the heat history such as reflow soldering when the CSP is assembled on one side, and the flatness of the opposite surface cannot be ensured. , resulting in a lower yield of assembly engineering. Even if the reflow soldering tool is used, it is difficult to use the conventional method because the rigidity of the wiring board itself is insufficient. In the method of assembling such a problem, there is a method of suppressing thermal deformation during reflow of a multilayer printed wiring board (see Patent Document 3). The thicker the insulating resin layer is on the outer layer of the multilayer printed wiring board, the rigidity of the multilayer printed wiring board is improved, and thermal deformation can be prevented. However, the thinning required for the multilayer printed wiring board of -6-200829116 is violated, so the problem is not solved. [Patent Document 1] JP-A-2004-200260 (Patent Document 2) Japanese Patent Publication No. Hei 7 - 6 0 9 3 4 (Patent Document 3) Patent No. 3,075,028 The problem to be solved is that when the thin multilayer flexible printed wiring board is assembled at a high-density surface, such a multilayer flexible printed wiring board has a low rigidity due to the wiring board itself, and therefore must be assembled in a part. That is, in the cream solder printer engineering, the parts mounting engineering, and the reflow soldering engineering, the special reflow soldering jig fixed to each product has a thickness of 2 mm and a metal plate such as aluminum. The complexity of the assembly process and the cost of the fixture will be Causes problems. In addition, in a multilayer flexible printed wiring board having a thickness of 4 to 6 layers, a CSP (wafer size package) requiring flatness is applied to both surfaces thereof, and heat such as reflow soldering when CSP is assembled on one side is also included. The wiring board under the history is easily bent, and the flatness of the opposite surface cannot be ensured, resulting in a decrease in the yield of the assembly work. Even if the reflow soldering jig is used, the rigidity of the wiring board itself is insufficient, and it is difficult to solve the problem by the conventional method. The present invention has been made in view of the above circumstances, and an object thereof is to provide a thin multilayer flexible printed wiring board capable of assembling a CSP having a required flatness on both sides, and inexpensively and stably manufacturing the wiring board. Method 200829116 (Means for Solving the Problem) In order to achieve the above object, the present invention provides the next inventions. The multilayer printed wiring board according to the first aspect of the invention is a multilayer printed wiring board in which a flexible printed wiring board having a wiring pattern is laminated on at least one surface of a flexible insulating substrate, and is characterized in that the multilayer printed wiring board is provided on the multilayer printed wiring board. A reinforcing pattern is provided between the wiring patterns of the end faces for assembly of the outermost parts. Moreover, the method for producing a multilayer printed wiring board according to the second aspect of the invention includes: a) a process of manufacturing a core wiring board having an inner layer having a wiring pattern on at least one surface of the flexible insulating substrate; b) adding a layer of the outer layer The flexible copper clad laminate used for laminating the inner core wiring board through the bonding material; c) forming a conductive hole in the common hole forming portion of the multilayer wiring substrate; d) using the above-mentioned general a hole for performing interlayer connection; e) forming a wiring pattern including a joint end surface for assembling the component and a reinforcing pattern disposed between the holes in the outermost layer of the multilayer wiring substrate; and f) The reinforcement pattern forms the work of the solder resist layer. [Effects of the Invention] According to these features, the present invention can exert the next effect. In other words, in the multilayer printed wiring board, since it has a metal reinforcing pattern which is electrically independent of the end surface for assembling the outermost layer of the multilayer printed wiring -8 - 200829116, it is a multilayer printed wiring board. In the material, the metal such as copper having the highest bending elasticity is thick, and is disposed around the micropore end surface of the component assembly portion of the outermost layer of the wiring board having the highest bending elasticity of the entire wiring board, thereby being thin. The rigidity is also ensured in the multilayer flexible printed wiring board. Therefore, even if the wiring board is not bent under the heat history such as reflow soldering when the CSP is assembled on one side in the CSP double-sided assembly process, the flatness of the opposite surface can be ensured, and the result of the stable assembly process can be constructed. According to the present invention, it is possible to inexpensively and stably manufacture a thin multilayer flexible printed wiring board which can assemble a CSP which is required to have flatness on both sides. [Embodiment] Hereinafter, the implementation of the present invention will be described with reference to Figs. 1A - 1D and Fig. 2
例。 〔實施例1〕 圖1A〜圖1C是表示本發明之多層印刷配線板的製造 方法的槪念剖面構成的工程圖，首先，如圖1A(1)所示 ，準備：在聚醯亞胺等的可撓性絕緣基材1的兩面具有配 線圖案2，3，藉由以塡孔電鍍所充塡後的有底微孔4來層 間連接的兩面可撓性印刷配線板。 更在其兩面貼合所謂表護層7，該表護層7是例如在 -9 - 200829116 12μπι厚的聚醯亞胺薄膜5上具有厚度15μπι的丙烯酸環氧 (acryl · epoxy )等的接著材6，以目前爲止的工程來取得 多層印刷配線板的電纜部及形成核心配線板之具有塡孔構 造的兩面核心配線板8。 如該實施例1般，在適用塡孔電鍍的兩面核心配線板 時，不必像通常的微孔電鍍那樣在配線層增厚電鍍，可使 核心配線板的配線層厚度形成較薄，因此配線的微細化可 能。 又，有關之後使用於與增層層的接著之接著材，因爲 可用厚度薄者來充塡，所以流出量會變少，或與增層層的 層間連接距離本身會變短，因此在增層層的電鍍厚相同的 情況時，亦具有相對提高連接可靠度的效果。 塡孔構造的形成法，並非限於本實施例所示的塡孔電 鍍，利用藉由電鍍法或蝕刻加工所形成的金屬製的導電性 突起、印刷導電性膏·油墨（paste · ink )等而形成的導電 性突起等者亦可適用。 再加上，核心配線板爲具有塡孔構造，在以之後的工 程來增層時，可取堆疊於塡孔上的構造，有利於高密度化 。又，亦可期待使高速信號傳送時的連接部的反射低減的 效果。 其次，如圖1A(2)所示，準備··在聚醯亞胺等的可 撓性絕緣基材9的單面具有厚度1 2μηι的銅箔1 〇之所謂單 面可撓性覆銅積層板1 1。絕緣基材9的材質並非限於聚醯 亞胺，可按照用途來分別使用。 -10- 200829116 又’低線熱膨脹材料，可利用使矽石（silica)等的 塡料（filler)含有3〇重量％程度的環氧樹脂材、或必須 使筒速信號傳送時的介電體損失低減，在應用中，作爲低 介電正接材料，以液晶聚合物等爲基礎之單面覆銅積層板 。又’亦可將單面可撓性覆銅積層板變更成兩面可撓性覆 銅積層板。 其次、預先模製用以使增層（buildup )層的單面可撓 性覆銅積層板1 1增層於兩面核心配線板8的接著材1 2及 單面可撓性覆銅積層板u，然後對位，經由接著材12來 使單面可撓性覆銅積層板1 1及兩面核心配線板8以真空 壓機等積層。 接者材12最好爲低流型（Low Flow)的接合片等的 流出少者。接著材1 2的厚度，即使考量充塡性及平坦性 ’還是可選擇15〜20μπι的薄者。以到目前爲止的工程來 取得多層配線基材1 3。 在此’取代單面可撓性覆銅積層板，而以兩面可撓性 覆銅積層板作爲增層層來積層時，是預先藉由利用通常的 光學製造手法之蝕刻手法來使對向於核心配線板的面形成 配線圖案後，模製後進行對位，經由接著材來使兩面可撓 性覆銅積層板與兩面核心配線板以真空壓機等積層。 其次，如圖1 A ( 3 )所示，在單面可撓性覆銅積層板 11的銅箔10面，藉由通常的光學製造手法來形成雷射加 工時的共型光罩，使用彼來進行雷射加工，形成直徑1 〇〇 〜150μπι程度的導通用孔14。 -11 - 200829116 更，藉由電解電鍍來進行用以取層間連接的去膠渣處 理、導電化處理。利用該一連串的處理，對銅箔10及位 於導通用孔底部的銅面進行約2 μπι程度鈾刻處理。藉此， 處理後的銅箔10的厚度約成ΙΟμπι。 其次，如圖1Β(4)所示，在具有導通用孔14的多 層配線基材13進行40〜5 Ομπι程度的電解電鍍，形成微孔 1 5而取得層間導通。以目前爲止的工程來取得層間導通完 了的多層配線基材。其次，藉由利用通常的光學製造手法 之蝕刻手法來形成微孔接端面1 5 a及外層的補強圖案基部 1 6。此時，若有析出於表護膜5上的電鍍層，則此亦同時 除去。 圖1B(5)是圖1B(4)的平面圖，圖1B(5)的A-A’剖面相當於圖1A(4)。如圖1B(5)所示，成爲零件 組裝部的微孔接端面15a的周圍的補強圖案基部16a會形 成電性或物理性皆被分離的狀態。 其次，如圖1 C ( 6 )所示，在補強圖案基部1 6a更增 厚電鍍來提高補強效果。此實施例1是對微孔接端面1 5a 上等的補強圖案不要之處，形成厚度40μιη程度的電鍍阻 絕層，在補強圖案基部16a實施約30μιη厚的電解銅電鍍 ，選擇性地進行增厚，形成補強圖案基部1 6b。藉此，在 零件組裝部的微孔接端面1 5 a周圍，連續性地配置銅厚度 約80〜90 μπι程度的外層的補強圖案16。 另外，存在補強圖案1 6之處的配線板的厚度雖比無 補強圖案之處更厚，但補強圖案存在之處基本上爲零件搭 -12- 200829116 載處，要比被組裝的零件高度更薄，因此不會有產生零件 組裝後的實質厚度増加的情況。另外，在組裝CSP時， CSP的錫焊球徑要比補強圖案厚度大，因此不會有組裝上 的障礙情況。 圖1C(7)是圖ic(6)的平面圖，圖ic(7)的B-B ’剖面是相當於圖1 C ( 6 )。在構成此配線板的材料中， 賦予彎曲彈性最高的銅較厚，配置於構造上亦形成多層印 刷配線板全體的彎曲彈性最高的多層印刷配線板的最外層 的零件組裝部之微孔接端面的周圍，藉此即使在薄型的多 層可撓性印刷配線板中還是可確保剛性。 另外，依微孔的間距及銅厚度，有時難以使用上述飩 刻手法來形成圖1 B ( 4 )所示的工程之微孔及微孔接端面 。該情況，可採用半加成手法（semi-additive process)、 部份電鍍手法等，此時因爲銅箔10是形成下種層（seed lay，所以最好是預先使用薄的銅箔，或藉由電鍍的前 處理等的蝕刻來事先使薄薄地形成5μιη以下。 此外，就別的方法而言，可在進行利用通常的光學製 造手法之飩刻手法後，對銅蝕刻不足之處，組合利用UV-YAG雷射等的修理（repair)、修整（trimming)等的工 程。在單獨或組合使用該等的手法之下，即使是微孔的間 距窄，微孔接端面與補強圖案的間隙變窄時，照樣可以對 應。 其次，如圖1D ( 8 )所示，形成阻焊劑層。以連續形 成於零件組裝面的補強圖案1 6作爲電附著引導，藉此可 -13- 200829116 適用電附著聚醯亞胺等的電附著樹脂，在使用彼 焊劑層1 7可在不位置偏離下形成。 因應所需，在零件組裝用接端面或連接器等 面，實施錫焊、鍍鎳、鍍金等的表面處理，使用 蔽薄膜等來形成往電纜的外層側之遮蔽層。然後 形加工，而取得具有電纜部的多層可撓性印刷配; 圖1D(9)是圖1D(8)的平面圖，圖1D( C’剖面是相當於圖ID ( 8 )。對於0.5mm間距以 距CSP搭載部等之阻焊劑層的位置精度嚴苛之處 ，不會被配線板的伸縮不均等所左右，亦具有使 的形成工程的良品率安定的效果。亦可使光阻劑 阻絕層組合，此情況只要考量雙方的阻絕層的加 度等，決定製程順序即可。 本發明在厚度爲300 μιη程度的薄型多層可撓 線板的兩面組裝CSP時，在構成配線板的材料中 曲彈性最高的銅等的金屬較厚，配置於構造上亦 板全體的彎曲彈性最高的配線板的最外層的零件 微孔接端面的周圍，藉此可確保配線板的剛性。 使在CSP的兩面組裝工程中在單面組裝CSP時 等的熱履歷下配線板也不會彎曲，可確保相反面 ，而能夠構築安定的組裝工程。 圖2是本發明的別的實施例的槪念平面圖及 圖，在圖1是補強圖案基部16a與補強圖案高部 同形，相對的，在圖2是在補強圖案基部16a上 之下，阻 的端子表 銀膏、遮 ，進行外 康板1 8。 9)的 C-下的窄間 特別有效 阻焊劑層 與電附著 工處理溫 性印刷配 ，賦予彎 形成配線 組裝部之 因此，即 的回流焊 的平坦度 剖面構成 1 6 b大致 部份地形 •14- 200829116 成補強圖案高部16b。 只在配線圖案部被覆電鍍阻絕層時，有時在補強圖案 的側面也會有電鍍附著，其對策爲必要。例如以半加成手 法來形成微細圖案等圖案間隙爲狹窄時，想要不在補強圖 案側面附著電鍍時，可被覆電鍍阻絕層，而能夠在補強圖 案基部與配線圖案之間的間隙形成帳幕覆蓋（tenting process )’因此適於零件組裝部的配線微細化時。並且， 爲了高精度地形成阻焊劑層1 7，使用電附著聚醯亞胺等的 電附著手法來形成更合適。 【圖式簡單說明】 Μ 1 A是表示本發明的實施例1之多層印刷配線板的 製造方法的槪念剖面構成的工程圖。 圖1B是表示本發明的實施例1之多層印刷配線板的 製造方法的槪念剖面構成的工程圖。 圖1 C是表示本發明的實施例1之多層印刷配線板的 製造方法的槪念剖面構成的工程圖。 ® 1 D是表示本發明的實施例1之多層印刷配線板的 製造方法的槪念剖面構成的工程圖。 圖2是本發明的實施例2之多層印刷配線板的槪念剖 面構成圖及平面圖。 圖3是表示以往工法之多層印刷配線板的製造方法的 槪念剖面構成的工程圖。 -15- 200829116 【主要元件符號說明】 1 :可撓性絕緣基材 2，3 :配線圖案 4:以塡孔電鍍充塡後的有底微孔 5 :聚醯亞胺薄膜 6 :接著材 7 :表護層 _ 8 :兩面核心配線板 9 :絕緣基材 1 〇 :銅箔 1 1 :單面可撓性覆銅積層板 1 2 :接著材 1 3 :多層配線基材 1 4 :導通用孔 1 5 :微孔 _ 15a :微孔接端面 1 6 :補強圖案 _ 16a :補強圖案基部 16b :補強圖案高部： 1 7 :阻焊劑層 1 8 :利用本發明的多層可撓性印刷配線板 1 9 :微孔 19a :微孔接端面 20 :利用以往工法的多層可撓性印刷配線板 -16-example. [Embodiment 1] Fig. 1A to Fig. 1C are views showing a configuration of a commemorative cross-sectional structure of a method for producing a multilayer printed wiring board according to the present invention. First, as shown in Fig. 1A (1), preparation is made for polyimine or the like. The flexible insulating substrate 1 has wiring patterns 2, 3 on both sides thereof, and a double-sided flexible printed wiring board which is laminated by laminating the filled bottomed micropores 4 by boring. Further, a so-called surface layer 7 is bonded to both surfaces thereof, and the surface layer 7 is, for example, an acryl-epoxy having a thickness of 15 μm on a polyimide film 5 having a thickness of -9 - 200829116 12 μm thick. 6. The cable portion of the multilayer printed wiring board and the double-sided core wiring board 8 having the pupil structure forming the core wiring board have been obtained by the conventional work. As in the first embodiment, when the two-sided core wiring board for the pupil plating is applied, it is not necessary to thicken the plating layer in the wiring layer as in the case of the usual microporous plating, and the thickness of the wiring layer of the core wiring board can be made thin, so that the wiring is Micro-refinement is possible. Moreover, after the subsequent use of the bonding material with the build-up layer, since the thickness can be filled, the outflow amount becomes small, or the interlayer connection distance with the buildup layer itself becomes shorter, so the build-up layer is added. When the plating thickness of the layers is the same, the connection reliability is also relatively improved. The formation method of the pupil structure is not limited to the pupil plating shown in the present embodiment, and is performed by a conductive projection made of metal by a plating method or an etching process, a conductive paste/ink, or the like. The formed conductive protrusions and the like can also be applied. In addition, the core wiring board has a pupil structure, and when it is layered by a later process, it is preferable to have a structure stacked on the pupil to facilitate high density. Further, it is also expected to reduce the reflection of the connection portion when the high-speed signal is transmitted. Next, as shown in Fig. 1A (2), a so-called one-sided flexible copper-clad laminate having a copper foil 1 having a thickness of 1 2 μm on one surface of a flexible insulating substrate 9 such as polyimide or the like is prepared. Board 1 1. The material of the insulating base material 9 is not limited to polyimine, and can be used depending on the application. -10- 200829116 In addition, the 'low-line thermal expansion material can be used to make a filler such as silica containing an epoxy resin material of about 3% by weight or a dielectric body when a tube speed signal must be transmitted. The loss is reduced, and in application, as a low dielectric positive connection material, a single-sided copper-clad laminate based on a liquid crystal polymer or the like. Further, the single-sided flexible copper clad laminate can be changed to a double-sided flexible copper clad laminate. Next, a single-sided flexible copper clad laminate 1 1 for pre-molding a buildup layer is laminated on the backing material 1 2 of the double-sided core wiring board 8 and a single-sided flexible copper clad laminate u Then, the single-sided flexible copper-clad laminate 1 1 and the double-sided core wiring board 8 are laminated by a vacuum press or the like via the bonding material 12. The material 12 is preferably a low flow of a low flow type joining sheet or the like. Next, the thickness of the material 12 can be selected from 15 to 20 μm even if the chargeability and flatness are considered. The multilayer wiring substrate 13 was obtained by the engineering so far. Here, when a single-sided flexible copper-clad laminate is used and a double-sided flexible copper-clad laminate is used as a build-up layer, it is preliminarily etched by an ordinary optical manufacturing method. After forming a wiring pattern on the surface of the core wiring board, it is aligned after molding, and the double-sided flexible copper-clad laminate and the double-sided core wiring board are laminated by a vacuum press or the like via a bonding material. Next, as shown in FIG. 1A (3), a common mask is formed on the surface of the copper foil 10 of the single-sided flexible copper clad laminate 11 by a conventional optical manufacturing method, and the same is used. Laser processing is performed to form a conductive hole 14 having a diameter of 1 150 150 150 μm. -11 - 200829116 Further, the desmear treatment and the conductive treatment for taking the interlayer connection are performed by electrolytic plating. By this series of processes, the copper foil 10 and the copper surface at the bottom of the conductive hole are subjected to uranium engraving treatment at a level of about 2 μm. Thereby, the thickness of the treated copper foil 10 is approximately ΙΟμπι. Next, as shown in Fig. 1 (4), the multi-layer wiring substrate 13 having the conductive holes 14 is subjected to electrolytic plating of about 40 to 5 μm to form micropores 15 to achieve interlayer conduction. The multilayer wiring substrate in which the interlayer conduction is completed has been obtained by the current work. Next, the micro-hole end face 1 5 a and the reinforcing pattern base portion 16 of the outer layer are formed by an etching method using a usual optical manufacturing method. At this time, if there is a plating layer deposited on the surface protective film 5, this is also removed at the same time. Fig. 1B (5) is a plan view of Fig. 1B (4), and the A-A' cross section of Fig. 1B (5) corresponds to Fig. 1A (4). As shown in Fig. 1B (5), the reinforcing pattern base portion 16a around the micropore end surface 15a of the component assembling portion is in a state in which electrical or physical properties are separated. Next, as shown in Fig. 1 C (6), the reinforcing pattern base portion 16a is further thickened to improve the reinforcing effect. In the first embodiment, the reinforcing pattern of the microporous end face 15a is not required, and a plating resist layer having a thickness of about 40 μm is formed, and electrolytic copper plating of about 30 μm thick is applied to the reinforcing pattern base portion 16a to selectively thicken. Forming a reinforcing pattern base 16b. Thereby, the outer layer reinforcing pattern 16 having a copper thickness of about 80 to 90 μm is continuously disposed around the micropore end surface 15 5 a of the component assembling portion. In addition, the thickness of the wiring board where the reinforcing pattern 16 is present is thicker than that of the non-reinforcing pattern, but the reinforcing pattern is basically present at the location of the part -12-200829116, which is higher than the height of the assembled part. It is thin, so there is no case where the substantial thickness of the parts after assembly is increased. In addition, when assembling the CSP, the solder ball diameter of the CSP is larger than the thickness of the reinforcing pattern, so there is no obstacle in assembly. Fig. 1C (7) is a plan view of Fig. ic (6), and the B-B ' cross section of Fig. ic (7) corresponds to Fig. 1 C (6). Among the materials constituting the wiring board, the copper having the highest bending elasticity is thick, and the microporous end face of the outermost component assembly portion of the multilayer printed wiring board having the highest bending elasticity of the multilayer printed wiring board is formed in the structure. By this, it is possible to ensure rigidity even in a thin multilayer flexible printed wiring board. Further, depending on the pitch of the micropores and the thickness of the copper, it may be difficult to form the micropores and the microporous end faces of the project shown in Fig. 1B(4) by the above-described nicking method. In this case, a semi-additive process, a partial plating method, or the like may be employed. At this time, since the copper foil 10 is formed as a seed layer, it is preferable to use a thin copper foil in advance, or borrow In the etching by pre-treatment such as electroplating, 5 μm or less is formed in a thin manner. Further, in another method, after the etching method using a general optical manufacturing method, the copper etching is insufficiently combined. Repair of repair, trimming, etc. of UV-YAG laser, etc. Under the use of these methods alone or in combination, even if the pitch of the micropores is narrow, the gap between the microporous end face and the reinforcing pattern becomes When it is narrow, it can be correspondingly. Next, as shown in Fig. 1D (8), a solder resist layer is formed. The reinforcing pattern 16 continuously formed on the component assembly surface is used as an electrical adhesion guide, whereby the electrical adhesion can be applied to -13-200829116. The electro-adhesive resin such as polyimide may be formed by using the solder layer 1 7 without any positional deviation. If necessary, soldering, nickel plating, gold plating, etc. may be performed on the surface of the component assembly end surface or the connector. s surface Processing, using a mask film or the like to form a shielding layer toward the outer layer side of the cable, and then processing to obtain a multilayer flexible printing package having a cable portion; Fig. 1D (9) is a plan view of Fig. 1D (8), Fig. 1D (C' section is equivalent to the figure ID (8). The positional accuracy of the solder resist layer such as the CSP mounting portion is 0.5 mm pitch, and it is not affected by the unevenness of the expansion and contraction of the wiring board. The formation rate of the project is stable and stable. It is also possible to combine the photoresist barrier layers. In this case, the process sequence can be determined by considering the degree of addition of the barrier layers, etc. The present invention is a thin multilayer having a thickness of about 300 μm. When the CSP is assembled on both sides of the flexible board, the metal such as copper having the highest flexural elasticity among the materials constituting the wiring board is thick, and the micro-holes of the outermost layer of the wiring board having the highest bending elasticity of the entire board are also disposed. In the vicinity of the end surface, the rigidity of the wiring board can be ensured. The wiring board is not bent under the heat history when the CSP is assembled on one side in the CSP assembly process, and the opposite surface can be secured, and the stable assembly can be constructed. work Figure 2 is a view and a plan view of another embodiment of the present invention. In Figure 1, the reinforcing pattern base portion 16a is identical to the high portion of the reinforcing pattern, and oppositely, in Figure 2, below the reinforcing pattern base portion 16a. The resistance of the terminal table silver paste, cover, for the outer Kang board 18. 8) C-low narrow special effective solder resist layer and electrical adhesion processing temperature printing, giving the bend to form the wiring assembly, that is, Flatness profile of reflow soldering is 1 6 b. Partial topography • 14- 200829116 Reinforced pattern high part 16b. When the wiring pattern is covered with a plating resist layer, plating may be applied to the side surface of the reinforcing pattern. The countermeasures are necessary. For example, when a pattern gap such as a fine pattern is formed by a semi-additive method is narrow, when plating is not applied to the side surface of the reinforcing pattern, a plating resist layer can be coated, and a tenter covering can be formed in a gap between the reinforcing pattern base portion and the wiring pattern ( Tenting process ) ' Therefore, it is suitable for the wiring of the component assembly portion to be fine. Further, in order to form the solder resist layer 17 with high precision, it is more suitable to form by using an electrical adhesion method such as electrically attaching polyimide. [Brief Description of the Drawings] A 1 A is a structural view showing a commemorative cross-sectional structure of a method of manufacturing a multilayer printed wiring board according to the first embodiment of the present invention. Fig. 1B is a view showing a configuration of a commemorative cross-sectional structure of a method of manufacturing a multilayer printed wiring board according to a first embodiment of the present invention. Fig. 1C is a view showing a configuration of a commemorative cross-sectional structure of a method of manufacturing a multilayer printed wiring board according to a first embodiment of the present invention. ® 1 D is a construction drawing showing a commemorative cross-sectional structure of the method for manufacturing the multilayer printed wiring board according to the first embodiment of the present invention. Fig. 2 is a view showing a configuration and a plan view of a multilayer printed wiring board according to a second embodiment of the present invention. Fig. 3 is a view showing a configuration of a commemorative cross-sectional structure of a method of manufacturing a multilayer printed wiring board according to a conventional method. -15- 200829116 [Explanation of main components] 1 : Flexible insulating substrate 2, 3 : Wiring pattern 4: Bottom micropores filled with boring and plating 5: Polyimine film 6 : Substrate 7 : cover layer _ 8 : double-sided core wiring board 9 : insulating base material 1 〇 : copper foil 1 1 : single-sided flexible copper-clad laminate 1 2 : adhesive material 1 3 : multilayer wiring substrate 1 4 : general purpose Hole 15: Microhole_15a: Micropore end face 16: Reinforcement pattern_16a: Reinforcement pattern base 16b: Reinforcement pattern high part: 1 7 : Solder resist layer 18: Multilayer flexible printed wiring using the present invention Plate 19: Microporous 19a: Microporous end face 20: Multilayer flexible printed wiring board-16- using conventional methods